CN108012066A - A kind of high pixel modular structure and production technology - Google Patents
A kind of high pixel modular structure and production technology Download PDFInfo
- Publication number
- CN108012066A CN108012066A CN201810021410.2A CN201810021410A CN108012066A CN 108012066 A CN108012066 A CN 108012066A CN 201810021410 A CN201810021410 A CN 201810021410A CN 108012066 A CN108012066 A CN 108012066A
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- China
- Prior art keywords
- seal modules
- microscope base
- hole
- camera lens
- high pixel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title description 12
- 238000005516 engineering process Methods 0.000 title description 7
- 230000003287 optical effect Effects 0.000 claims abstract description 21
- 241000218202 Coptis Species 0.000 claims abstract description 12
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 12
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 241000416536 Euproctis pseudoconspersa Species 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 9
- 239000000463 material Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
A kind of high pixel modular structure, including wiring board, sensitive chip, capacity cell, gold thread, optical filter, camera lens and microscope base, camera lens and microscope base are integrally formed；For mould filling formed with seal modules, seal modules are rectangular configuration in the circuit board.Non-photo-sensing region, capacity cell and the gold thread of sensitive chip are filled sealing by seal modules；Microscope base bottom is adhesive in seal modules upper surface, and gluing thickness is 0.1mm.It is located at the middle part of seal modules formed with through hole, the photosensitive region of sensitive chip in the through hole of seal modules, the axis of microscope base and the axis of through hole coincide.The inner surface of through hole is provided with annular brace platform, optical filter is installed on annular brace platform.Lens barrel and microscope base unitary design, exempt from screw thread focusing, have also evaded the dust at screw thread and drop to above optical filter being formed dirty, influenced image quality.
Description
Technical field
The present invention relates to camera manufacturing field, and in particular to a kind of high pixel modular structure and production technology.
Background technology
Tradition focus module there are the defects of：Firstth, mobile telephone image module, wrapped camera lens, microscope base, chip, optical filter, electricity
The components such as appearance, connector, plank form.
Secondth, high pixel lens characteristics, short focus (module can do short), large aperture (light-inletting quantity is more, and image quality is good), mirror
Piece quantity is more (image quality is apparent), then results in camera lens production cost height, yield is low.
3rd, high pixel chip feature, it is desirable to which image size is done greatly, and structure size requirement is done small, and thickness does thin, then
Pixel size will accomplish very little, and Pixel size are small, management and control requirement plus tight, otherwise easily imaging to dust, therefore core
The manufacture difficulty lifting of piece.
4th, high pixel plank feature, flatness management and control, because wanting cabling inside plank, line has more and lacks, is coarse and fine,
But definitely to ensure flatness, then the increase of technique manufacture difficulty.
5th, the module feature of high pixel, camera module group lens are optical articles, to material, design, technique, environment, light
Road requires all very strictly, to need to be cleaned by particular process sequence when making, for example pure water cleaning, medicament cleaning, ion wind
Purging etc..Chip needs special preservation, moisture-proof damp proof dust-proof.Plank needs to clean, and removes rosin, tin cream, also wants moisture-proof damp proof
It is anti-oxidation.These have all been made proper arrangements, then chip is beaten on plank by technological process and (is led to above plank in plate factory
SMT is crossed to play on plank the devices such as capacitance, connector), then the pad of chip is bridged with the pad of plank with gold thread
Turn on together.Camera lens is paid lens barrel lock inside microscope base by locking machine again, it is inner that optical filter has also been fitted in microscope base (6)
Face) it is assembled in by board on plank, these are formed one with circuit communication, the module camera of optical imagery.
Due to these features of high pixel, cause camera lens, chip, plank production cost is expensive, and module cost of manufacture is high, good
The very difficult to govern control of rate, inefficiency.Because chip needs to be assembled in inside a closed space, need to use when assembling camera lens
Glue is fixed, and then carries out focusing test, is rotated in focusing stage thread, since lens barrel and microscope base are all plastic parts, is being focused
Frictional force can be produced during rotation, so that the molecules such as chip, dust can be produced, these molecules drop in chip top meeting
Imaging, as described above, because chip Pixelsize is small, it is especially sensitive to minute dusts, it is particularly easy to be imaged, seriously affects module
Imaging effect.In addition for making the chip that can be imaged after module and dust, it is necessary to clear up the inside by doing over again and repairing
Chip and dust, in general, cost is too high for the cost scrapped from time cost, human cost and heavy industry etc..It is another to be difficult to
Management and control is exactly to focus, and mentions camera lens above and is transferred up and down by screw thread with microscope base to focus, then means that camera lens
Relation with microscope base just secures, it is impossible to gradient is adjusted for the optical axis of chip, along with plank out-of-flatness, chipset
When inclination is also had after dress, then assembling camera lens equipment can only straight up and down, all around, and cannot 360 ° of rotations, therefore just fix
The effect of module group assembling, problem are just come, and it is large aperture to mention camera lens above, the required precision to assembling is very high, such as
Fruit still continues to use existing design method and industry, and module parsing center certainly will will occurs and occur with the non-uniform phenomenon in corner,
Yield certainly will be seriously affected, and when camera module for having thread is focused after assembling need to spend substantial amounts of skilled manpower and
Time focuses up and down, tests repeatedly.
Molding designs are original to be generally used in the majority on structure materials and parts, and electronics materials and parts are also designed to now
Molding products, then the requirement to molding adds at least more than 3 times, because to consider some of electronics materials and parts
Electrical requirements, particularly chip, because the environment of molding is completed under the filling of vacuum quick high-pressure, then to chip
Anti-pressure ability, influence of the quick washing to gold thread, gold wire thickness 0.08um, to high temperature requirement of sensitive electron materials and parts etc. all
Need to design new material and industry, the quick high-pressure filling temp of Molding is about 230 ° or so.
The content of the invention
In view of the deficiencies of the prior art, the present invention proposes a kind of high pixel modular structure and production technology, wherein, Yi Zhonggao
Pixel modular structure concrete technical scheme is as follows：A kind of high pixel modular structure, it is characterised in that：Including wiring board (1), photosensitive
Chip (2), capacity cell (3), gold thread, optical filter (4), camera lens (5) and microscope base (6), the camera lens (5) are installed on the microscope base
(6) on；
For mould filling formed with seal modules (7), the seal modules (7) will be described photosensitive on the wiring board (1)
Non-photo-sensing region, the capacity cell (3) and the gold thread of chip (2) are filled sealing；
Microscope base (6) bottom is adhesive in the seal modules (7) upper surface；
It is located at institute formed with through hole (9), the photosensitive region of the sensitive chip (2) at the middle part of the seal modules (7)
In the through hole (9) for stating seal modules (7)；
The inner surface of the through hole (9) is provided with annular brace platform (8), the optical filter (4) is installed on the annular
In supporting table (8).
To better implement the present invention, may further be：The seal modules (7) are rectangular configuration.
It is further：The camera lens (5) and the microscope base (6) are integrally formed.
Further：The axis of the axis and the through hole (9) of the microscope base (6) coincides.
Further：The gluing thickness is 0.1mm.
A kind of high pixel module production technology particular technique is：A kind of high pixel module production technology, it is characterised in that：Bag
Include following steps：
Step 1：By Molding Shooting Techniques by the non-photo-sensing region of the sensitive chip, the capacity cell and institute
State after gold thread is filled sealing, form the seal modules with through hole；
Step 2：Optical filter is installed in the through hole of seal modules；
Step 3：Microscope base is placed on seal modules, to camera lens while against parsing standard drawing, and is carried out at the same time focusing,
The resolution for adjusting optical center and camera lens corner can be with 360 degree of rotations to setting value, adjustment mode；
Step 4：The gluing distance of reserved 0.1mm, after the completion of focusing, microscope base and be adhesive on the seal modules into
Type.
It is further：It is described it is gluing for AA it is gluing.
Beneficial effects of the present invention are：First, lens barrel and microscope base unitary design, exempt from screw thread focusing, have also evaded screw thread
The dust at place, which is dropped to above optical filter, to be formed dirty, influences image quality.
Second, by Molding Shooting Techniques component all outside chip non-inductive area it is closed fall (plank, chip,
Capacitance, gold thread pass through mould filling), chip and dust between capacitance component would not be fallen on chip, reduce dust
Source, lifted yield.
3rd, module length and width dimensions are done small, the breasting face size of microscope base are reduced with Molding techniques, camera lens need not be with
Plank directly contacts, can be with direct-assembling on Molding.Namely a part of mirror is replaced with the height after MOlding
The height dimension of seat.
4th, automatic focusing assembles after camera lens side is assembled in Molding by (AA) (can 360 ° rotation) to focus side automatically
Above, the parsing uniformity of optical center and corner can be taken into account, can be with management and control very for the camera lens susceptibility of large aperture
Precisely, after image shaping, as soon as then apply a layer AA glue, form one and not only exempted from screw thread and focus, but also module size can be reduced, can also subtract
The high-end camera module of few dust.Maximum characteristic using AA glue is exactly that stability is very good, and liquid becomes solid deflection
Probably only 0.1% or so above-mentioned advantage make it that the application range of the present invention is wider, easy to the utilization and extention of the present invention.
Brief description of the drawings
Fig. 1 is the structure diagram of the present invention.
Embodiment
Presently preferred embodiments of the present invention is described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
As shown in Figure 1：A kind of high pixel modular structure, including wiring board 1, sensitive chip 2, capacity cell 3, gold thread, filter
Mating plate 4, camera lens 5 and microscope base 6, camera lens 5 and microscope base 6 are integrally formed, it can in addition contain which camera lens 5 and microscope base 6 are arranged to removable
Formula is unloaded, camera lens 5 and microscope base 6 form zoom module；
Mould filling is rectangular configuration formed with 7 seal modules 7 of seal modules in assist side 1.Seal modules 7 will be photosensitive
Non-photo-sensing region, capacity cell 3 and the gold thread of chip 2 are filled sealing；
6 bottom of microscope base is adhesive in 7 upper surface of seal modules, and gluing thickness is 0.1mm, and it is that AA is gluing that this is gluing, the AA
For the abbreviation of active alignment.
At the middle part of seal modules 7 formed with through hole 9, the photosensitive region of sensitive chip 2 is located at the through hole 9 of seal modules 7
Interior, the axis of the axis and through hole 9 of microscope base 6 coincides.
The inner surface of through hole 9 is provided with annular brace platform 8, optical filter 4 is installed on annular brace platform 8.
A kind of high pixel modular structure, it is characterised in that：Include the following steps：
Step 1：Non-photo-sensing region, capacity cell and the gold thread of sensitive chip are filled out by Molding Shooting Techniques
After filling sealing, the seal modules with through hole are formed；
Step 2：Optical filter is installed in the through hole of seal modules；
Step 3：Microscope base is placed on seal modules, to camera lens while against parsing standard drawing, and is carried out at the same time focusing,
The resolution for adjusting optical center and camera lens corner can be with 360 degree of rotations to setting value, adjustment mode；
Step 4：The gluing distance of reserved 0.1mm, after the completion of focusing, microscope base is molded with being adhesive on seal modules.
Claims (6)
- A kind of 1. high pixel modular structure, it is characterised in that：Including wiring board (1), sensitive chip (2), capacity cell (3), gold Line, optical filter (4), camera lens (5) and microscope base (6), the camera lens (5) are installed on the microscope base (6)；Mould filling is formed with seal modules (7) on the wiring board (1), and the seal modules (7) are by the sensitive chip (2) non-photo-sensing region, the capacity cell (3) and the gold thread is filled sealing；Microscope base (6) bottom is adhesive in the seal modules (7) upper surface；At the middle part of the seal modules (7) formed with through hole (9), the photosensitive region of the sensitive chip (2) is positioned at described close Seal in the through hole (9) of module (7)；The inner surface of the through hole (9) is provided with annular brace platform (8), the optical filter (4) is installed on the annular brace On platform (8).
- A kind of 2. high pixel modular structure according to claim 1, it is characterised in that：The seal modules (7) are rectangle knot Structure.
- A kind of 3. high pixel modular structure according to claim 1, it is characterised in that：The camera lens (5) and the microscope base (6) It is integrally formed.
- A kind of 4. high pixel modular structure according to claim 1, it is characterised in that：The axis of the microscope base (6) with it is described The axis of through hole (9) coincides.
- A kind of 5. high pixel module technique, it is characterised in that：Include the following steps：Step 1：By Molding Shooting Techniques by the non-photo-sensing region of the sensitive chip, the capacity cell and the gold After line is filled sealing, the seal modules with through hole are formed；Step 2：Optical filter is installed in the through hole of seal modules；Step 3：Microscope base is placed on seal modules, to camera lens while against parsing standard drawing, and focusing is carried out at the same time, adjusts The resolution of optical center and camera lens corner can be with 360 degree of rotations to setting value, adjustment mode；Step 4：The gluing distance of reserved 0.1mm, after the completion of focusing, microscope base is molded with being adhesive on the seal modules.
- A kind of 6. high pixel module technique according to claim 5, it is characterised in that：Include the following steps：It is described gluing to be AA is gluing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021410.2A CN108012066A (en) | 2018-01-10 | 2018-01-10 | A kind of high pixel modular structure and production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021410.2A CN108012066A (en) | 2018-01-10 | 2018-01-10 | A kind of high pixel modular structure and production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108012066A true CN108012066A (en) | 2018-05-08 |
Family
ID=62049961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810021410.2A Pending CN108012066A (en) | 2018-01-10 | 2018-01-10 | A kind of high pixel modular structure and production technology |
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| Country | Link |
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| CN (1) | CN108012066A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108632514A (en) * | 2018-06-08 | 2018-10-09 | 昆山丘钛微电子科技有限公司 | Camera module and mobile terminal |
| CN110554470A (en) * | 2018-05-30 | 2019-12-10 | 宁波舜宇光电信息有限公司 | optical lens, assembling method thereof and camera module |
| CN110661934A (en) * | 2018-06-29 | 2020-01-07 | 三赢科技（深圳）有限公司 | Lens module |
| CN111988507A (en) * | 2019-08-14 | 2020-11-24 | 立景创新有限公司 | Assembling method and assembling apparatus of image capturing device |
| CN114157783A (en) * | 2021-11-23 | 2022-03-08 | 信利光电股份有限公司 | Camera module with TLENS, manufacturing method and electronic equipment thereof |
| CN114500801A (en) * | 2022-01-19 | 2022-05-13 | 横店集团东磁有限公司 | Camera module and packaging method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110554470A (en) * | 2018-05-30 | 2019-12-10 | 宁波舜宇光电信息有限公司 | optical lens, assembling method thereof and camera module |
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| CN110661934B (en) * | 2018-06-29 | 2021-04-20 | 三赢科技（深圳）有限公司 | Lens module |
| CN111988507A (en) * | 2019-08-14 | 2020-11-24 | 立景创新有限公司 | Assembling method and assembling apparatus of image capturing device |
| CN111988507B (en) * | 2019-08-14 | 2021-10-15 | 立景创新有限公司 | Assembling method and assembling apparatus of image capturing device |
| CN114157783A (en) * | 2021-11-23 | 2022-03-08 | 信利光电股份有限公司 | Camera module with TLENS, manufacturing method and electronic equipment thereof |
| CN114500801A (en) * | 2022-01-19 | 2022-05-13 | 横店集团东磁有限公司 | Camera module and packaging method thereof |
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