CN107404606B - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- CN107404606B CN107404606B CN201710314639.0A CN201710314639A CN107404606B CN 107404606 B CN107404606 B CN 107404606B CN 201710314639 A CN201710314639 A CN 201710314639A CN 107404606 B CN107404606 B CN 107404606B
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- CN
- China
- Prior art keywords
- circuit board
- packaging body
- integral type
- mirror holder
- camera module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The present invention relates to a kind of camera modules.The camera module includes photosensory assembly and lens assembly, photosensory assembly includes circuit board, sensitive chip and packaging body, and sensitive chip is located on circuit board, and and circuit board electrical connection, packaging body is the hollow structure of both ends open, is set on circuit board and around sensitive chip；Lens assembly includes integral type mirror holder, and integrated glasses are set up on the end face of the one end of packaging body far from circuit board, and along the direction of circuit board to packaging body, the outer diameter of integral type mirror holder is gradually reduced.Along the direction of circuit board to packaging body, the outer diameter of integral type mirror holder is gradually reduced.Pass through the outer diameter for changing integral type mirror holder so that integral type mirror holder minimizes, and realizes that integral type mirror holder is small and accounts for screen ratio namely above-mentioned camera module size is smaller.
Description
Technical field
The present invention relates to camera technology fields, more particularly to a kind of camera module.
Background technology
As shown in Figure 1, traditional camera module 10 generally includes lens assembly and photosensory assembly, lens assembly includes socket
Pedestal (holder) 11, lens barrel (Barrel) 12 and the eyeglass 13 in lens barrel 12.Photosensory assembly include circuit board 14,
The sensitive chip 15 being pasted on circuit board 14 and the optical filter 13 being pasted in the one end of pedestal 11 far from lens barrel 12.Pedestal
11 one end far from lens barrel 12 are pasted on circuit board 14, and sensitive chip 15 is located in pedestal 11.
And in recent years, for the electronic products such as mobile phone, tablet gradually towards lightening development, electronic product is thinner, is used for cloth
The space of other components of office is opposite will be smaller, and this requires the camera modules being assembled in electronic product accordingly to minimize,
To reduce occupied space, convenient for being laid out other components.And traditional camera module 10 is relatively large sized.
Invention content
Based on this, it is necessary to provide a kind of camera module that size is smaller.
A kind of camera module, including：Photosensory assembly, including circuit board, sensitive chip and packaging body, the sensitive chip position
In on the circuit board, and with the circuit board electrical connection, the packaging body is the hollow structure of both ends open, is set to the electricity
On the plate of road and around the sensitive chip；And
Lens assembly, including integral type mirror holder, the integrated glasses are set up in the packaging body far from the circuit board
On the end face of one end, along the circuit board to the direction of the packaging body, the outer diameter of the integral type mirror holder is gradually reduced.
Along the direction of circuit board to packaging body, the outer diameter of integral type mirror holder is gradually reduced.By changing integrated glasses
The outer diameter of frame so that integral type mirror holder minimize, realize integral type mirror holder it is small account for screen ratio namely above-mentioned camera module size compared with
It is small.
The outer wall of the integral type mirror holder is multi-step structure or platform body structure in one of the embodiments,.
In one of the embodiments, along the circuit board to the direction of the packaging body, the integral type mirror holder
Internal diameter taper into.
The inner wall of the integral type mirror holder is multi-step structure or platform body structure in one of the embodiments,.
The packaging body takes shape on the circuit board in one of the embodiments, and the sensitive chip is fixed
In the circuit board.
The photosensory assembly further includes conductor wire in one of the embodiments, the both ends of the conductor wire respectively with institute
It states circuit board and sensitive chip connection, the conductor wire is closed in the packaging body.
The photosensory assembly further includes electronic component in one of the embodiments, and the electronic component is located at the electricity
On the plate of road, and with the circuit board electrical connection, the electronic component is closed in the packaging body.
The camera module has optical axis in one of the embodiments, and the inner wall of the packaging body is relative to the light
Axis is obliquely installed, and on the circuit board to the direction of the packaging body, and the internal diameter of the packaging body gradually increases.
The photosensory assembly further includes optical filter in one of the embodiments, and the packaging body is far from the circuit board
One end be equipped with first step portion, the optical filter be set to the first step portion on.
Description of the drawings
Fig. 1 is the structural schematic diagram of traditional camera module；
Fig. 2 is the structural schematic diagram of the camera module of an embodiment；
Fig. 3 is the structural schematic diagram of the camera module of another embodiment.
Specific implementation mode
Below in conjunction with the accompanying drawings and camera module is further described in specific embodiment.
As shown in Fig. 2, the camera module 20 of an embodiment, including circuit board 100, sensitive chip 200, packaging body 300,
Integral type mirror holder 400, conductor wire 500, electronic component 600, optical filter 700 and eyeglass 800, wherein circuit board 100, photosensitive core
Piece 200, packaging body 300, conductor wire 500, electronic component 600 and optical filter 700 are divided into the photosensory assembly of camera module 20, and one
Body formula mirror holder 400 and eyeglass 800 are divided into the lens assembly of camera module 20.Wherein, camera module 20 has optical axis Z.
Sensitive chip 200 is located on circuit board 100, and is electrically connected with circuit board 100.Packaging body 300 is both ends open
Hollow structure is set on circuit board 100 and around sensitive chip 200.Integral type mirror holder 400 is set to packaging body 300 far from circuit
On the end face of one end of plate 100, and the edge and packaging body of the end face of one end that integral type mirror holder 400 is bonded with packaging body 300
The coincident namely integral type mirror holder 400 of the end face of 300 one end far from circuit board 100 are outside one end of packaging body 300
Outer diameter of the diameter with packaging body 300 close to one end of integral type mirror holder 400 is identical.
When integral type mirror holder 400 is close to the outer diameter (lens barrel 12 of one end outer diameter and the lens barrel 12 in Fig. 1 of packaging body 300
Outer diameter in one end in pedestal 11) it is identical when, pedestal is omitted relative to traditional camera module 10 in above-mentioned camera module 20
11 thickness has relatively small size namely the size phase of above-mentioned camera module 20 in the X-axis direction and in Y direction
To smaller.Specifically, camera module 10 shown in FIG. 1, the size in the X-axis direction and in Y direction be respectively 7.0mm and
6.5mm, and size of the camera module shown in Fig. 2 20 in the X-axis direction and in Y direction is respectively 6.5mm and 6.0mm.
Further, in the present embodiment, packaging body 300 takes shape on circuit board 100, and sensitive chip 200 is fixed
In circuit board 100.As shown in Figure 1, in traditional camera module 10, usually first made by the way of gluing circuit board 14 with
Sensitive chip 15 is fixedly connected, then by the way of gluing on circuit board 14 firm banking 11.And in above-mentioned camera module 20
In, when forming packaging body 300, that is, complete sensitive chip 200 and circuit board 100 be fixedly connected and packaging body 300 with
Circuit board 100 is fixedly connected, and is highly convenient for assembling.
Further, in the present embodiment, the both ends of conductor wire 500 connect with circuit board 100 and sensitive chip 200 respectively
It connects, namely in the present embodiment, circuit board 100 is electrically connected with sensitive chip 200 by conductor wire 500, it will be understood that at it
In his embodiment, circuit board 100 and sensitive chip 200 can also be using being electrically connected contact and by the way of the contact that is electrically connected is in direct contact
Realize electrical connection.Conductor wire 500 is closed in packaging body 300, namely when forming packaging body 300, you can fixed conductor wire
500, the case where so as to effectively avoid conductor wire 500 from loosening, namely be not in circuit board 100 and sensitive chip
The situation of 200 open circuits.Specifically, conductor wire 500 is gold thread.
Electronic component 600 is located on circuit board 100, and is electrically connected with circuit board 100.Electronic component 600 is closed in encapsulation
In body 300, namely when forming packaging body 300, you can fixed electronic component 600 can effectively avoid electronic component 600 from pine occur
De- situation.And electronic component 600 is closed in packaging body 300, can also avoid contaminants electronic component 600.Tool
Body, in the present embodiment, conductor wire 500 is between electronic component 600 and sensitive chip 200, and 600, electronic component
In the periphery of sensitive chip 200.Electronic component 600 is the devices such as resistance, capacitance.
Further, in the present embodiment, the inner wall of packaging body 300 is obliquely installed relative to optical axis Z, and in circuit board
100 on the direction of packaging body 300, and the internal diameter of packaging body 300 gradually increases.So as to be effectively increased luminous flux, convenient for de-
Mould (need using mold formed packaging body 300, formed packaging body 300 after, need to demould) and convenient for cleaning solution centrifugation throw away
It (after forming packaging body 300, needs to clean packaging body 300 using cleaning solution, the impurity of packaging body 300 is avoided to pollute sensitive chip
200, in cleaning, need the pasting protective film on sensitive chip 200 in advance).Further, since integral type mirror holder 400 is located at encapsulation
On the end face of body 300, the thickness of the side wall of packaging body 300 is larger, and the internal diameter of packaging body 300 becomes larger, and can save to be formed
The materials of packaging body 300, so as to reduce the material cost of packaging body 300 and reduce the weight of packaging body 300.
Further, in the present embodiment, the inner wall of packaging body 300 is 15~45 ° relative to the slanted angle of optical axis Z.
Further, the inner wall of packaging body 300 is preferably 15~30 ° relative to the slanted angle of optical axis Z.Further, packaging body 300 is interior
Wall is preferably 30 ° relative to the slanted angle of optical axis Z.So as to be effectively increased luminous flux, convenient for demoulding and convenient for cleaning
Liquid centrifugation is thrown away.
Further, in the present embodiment, the one end of packaging body 300 far from circuit board 100 is equipped with first step portion 310,
Optical filter 700 is set in first step portion 310.Optical filter 700 is set on packaging body 300 and is set to one relative to optical filter 700
On formula mirror holder 400, the distance between optical filter 700 and sensitive chip 200 can be reduced, reduce light through optical filter 700 and sense
The number that optical chip 200 reflects avoids multiple reflections from generating hot spot phenomenon.First step portion 310 can increase luminous flux, reduce
The material cost of packaging body 300 and the weight for reducing packaging body 300.
Further, in the present embodiment, optical filter 700 and sensitive chip 200 close off the both ends of packaging body 300,
Namely optical filter 700, sensitive chip 200 and packaging body 300 cooperatively form seal chamber, so as to effectively avoid sensitive chip
200 is contaminated, influences image quality.
Further, in the present embodiment, first step portion 310 includes that the first connected load plane 312 and first is oblique
Wall 314, the first load plane 312 are vertically arranged with optical axis Z, the first skew wall 314 relative to optical axis Z slanted angle be 15~
45°.First load plane 312 can make 700 smooth installation of optical filter, the first skew wall 314 that can increase luminous flux, convenient for de-
Mould and convenient for cleaning solution centrifugation throw away, can also reduce packaging body 300 material cost and reduce packaging body 300 weight
Amount.Specifically, glue-line namely the carrying of sensitive chip 200 and first are arranged between sensitive chip 200 and the first load plane 312
Plane 312 is connected by the way of gluing.
Further, in the present embodiment, the one end of packaging body 300 far from circuit board 100 is additionally provided with second step portion 320
Second step portion 320 is between first step portion 310 and sensitive chip 200.Second step portion 320 can increase luminous flux,
It reduces the material cost of packaging body 300 and reduces the weight of packaging body 300.
Further, in the present embodiment, second step portion 320 includes that the second connected load plane 322 and second is oblique
Wall 324, the second load plane 322 are vertically arranged with optical axis Z, the second skew wall 324 relative to optical axis Z slanted angle be 15~
45°.By the way of gluing when optical filter 700 is arranged in first step portion 310, the second load plane 322 can be with preventing
Glue overflows.Second skew wall 324 can increase luminous flux, convenient for demoulding and being thrown away convenient for cleaning solution centrifugation, can also reduce encapsulation
The material cost of body 300 and the weight for reducing packaging body 300.
Further, in the present embodiment, the first skew wall 314 is more than the second skew wall 324 relative to the slanted angle of optical axis Z
Slanted angle relative to optical axis Z.
Further, in the present embodiment, the second skew wall 324 is leaned on relative to the slanted angle of optical axis Z more than packaging body 300
Slanted angle of the inner wall of one end of nearly circuit board 100 relative to optical axis Z.
Eyeglass 800 is set in integral type mirror holder 400.In the present embodiment, the edge of eyeglass 800 is by way of gluing
It is connect with 400 inner wall of integral type mirror holder.The number of eyeglass 800 is polylith, and polylith eyeglass 800 is intervally arranged in integral type mirror holder
In 400.
Further, in the present embodiment, along circuit board 100 to the direction of packaging body 300, integral type mirror holder 400
Outer diameter be gradually reduced.By the outer diameter for changing integral type mirror holder 400 so that integral type mirror holder 400 minimizes, and realizes integral type
Mirror holder 400 is small to account for screen ratio.
It should be noted that the outer diameter of integral type mirror holder 400 is gradually reduced including two kinds of situations, one is as shown in Figure 2
Discontinuity be gradually reduced, integrated glasses frame 400 is also divided into multistage, in each section, the outer diameter of integral type mirror holder 400
It remains unchanged, there are differences for the outer diameter of adjacent two sections of integral type mirror holder 400；Another kind is that continuity as shown in Figure 3 is gradual
Reduce.
When the outer diameter discontinuity of integral type mirror holder 400 is gradually reduced, the outer wall of integral type mirror holder 400 can be multi-step
Structure.When the outer diameter continuity of integral type mirror holder 400 is gradually reduced, the outer wall of integral type mirror holder 400 can be platform body structure,
Such as frustum cone structure, terrace with edge structure (e.g., end face is rectangular truncated rectangular pyramids) etc..
Further, in the present embodiment, along circuit board 100 to the direction of packaging body 300, integral type mirror holder 400
Internal diameter be gradually reduced.
It should be noted that the internal diameter of integral type mirror holder 400 is gradually reduced and is also gradually reduced including discontinuity and continuity
It is gradually reduced two kinds of situations.Along circuit board 100 to the direction of packaging body 300, the internal diameter of integral type mirror holder 400 gradually subtracts
It is small, and the internal diameter of packaging body 300 becomes larger, the minor diameter fit of the internal diameter and packaging body 300 of integral type mirror holder 400, convenient for carrying
High image quality.
Specifically, in the present embodiment, the internal diameter discontinuity of integral type mirror holder 400 is gradually reduced, integral type mirror holder 400
Inner wall can be multi-step structure.It is appreciated that in other embodiments, the internal diameter of integral type mirror holder 400 can also connect
Continuous property is gradually reduced, and the inner wall of integral type mirror holder 400 can be platform body structure.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. a kind of camera module, which is characterized in that including：
Photosensory assembly, including circuit board, sensitive chip and packaging body, the sensitive chip are located on the circuit board, and with institute
Circuit board electrical connection is stated, the packaging body is the hollow structure of both ends open, is set on the circuit board and around described photosensitive
Chip；
Lens assembly, including integral type mirror holder, the integrated glasses are set up in the one end of the packaging body far from the circuit board
End face on, along the circuit board to the direction of the packaging body, the outer diameter of the integral type mirror holder is gradually reduced；
The one end of the packaging body far from the circuit board is equipped with first step portion connected up and down and second step portion, and described the
One stage portion includes the first load plane and the first skew wall, and the second step portion includes the second load plane and the second skew wall,
First load plane is arranged with second load plane interval；
The photosensory assembly further includes optical filter, and the optical filter is set on the first load plane in the first step portion.
2. camera module according to claim 1, which is characterized in that the outer wall of the integral type mirror holder is multi-step structure
Or platform body structure.
3. camera module according to claim 2, which is characterized in that along the circuit board to the direction of the packaging body
On, the internal diameter of the integral type mirror holder tapers into.
4. camera module according to claim 3, which is characterized in that the inner wall of the integral type mirror holder is multi-step structure
Or platform body structure.
5. camera module according to claim 1, which is characterized in that the packaging body takes shape on the circuit board, and
The sensitive chip is fixed on the circuit board.
6. camera module according to claim 5, which is characterized in that the photosensory assembly further includes conductor wire, described to lead
The both ends of electric wire are connect with the circuit board and the sensitive chip respectively, and the conductor wire is closed in the packaging body.
7. camera module according to claim 5, which is characterized in that the photosensory assembly further includes electronic component, described
Electronic component is located on the circuit board, and with the circuit board electrical connection, the electronic component is closed in the packaging body.
8. camera module according to claim 1, which is characterized in that the camera module has optical axis, the packaging body
Inner wall be arranged relative to the inclined light shaft, and on the circuit board to the direction of the packaging body, the packaging body
Internal diameter gradually increases.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710314639.0A CN107404606B (en) | 2017-05-06 | 2017-05-06 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710314639.0A CN107404606B (en) | 2017-05-06 | 2017-05-06 | Camera module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107404606A CN107404606A (en) | 2017-11-28 |
| CN107404606B true CN107404606B (en) | 2018-09-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710314639.0A Active CN107404606B (en) | 2017-05-06 | 2017-05-06 | Camera module |
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| Country | Link |
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| CN (1) | CN107404606B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108322632B (en) * | 2018-02-28 | 2020-09-08 | Oppo广东移动通信有限公司 | Camera module, electronic device and camera module manufacturing method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4641203B2 (en) * | 2005-03-07 | 2011-03-02 | 株式会社リコー | Lens barrel, camera using the lens barrel, and portable information terminal device |
| CN101644811A (en) * | 2008-08-08 | 2010-02-10 | 鸿富锦精密工业（深圳）有限公司 | Imaging device |
| CN103149656B (en) * | 2011-12-07 | 2017-08-25 | 赛恩倍吉科技顾问（深圳）有限公司 | Camera lens module |
| CN203313284U (en) * | 2013-06-03 | 2013-11-27 | 南昌欧菲光电技术有限公司 | Camera module |
| CN103279001A (en) * | 2013-06-05 | 2013-09-04 | 南昌欧菲光电技术有限公司 | Support structure and camera shooting module with support structure |
| CN205792880U (en) * | 2016-05-11 | 2016-12-07 | 宁波舜宇光电信息有限公司 | The integral base assembly of camera module based on integral packaging technique |
| CN105704354B (en) * | 2016-03-12 | 2019-07-05 | 宁波舜宇光电信息有限公司 | Camera module and its photosensory assembly and manufacturing method |
| TWM531602U (en) * | 2016-06-30 | 2016-11-01 | 大立光電股份有限公司 | Plastic barrel, imaging lens module and electronic device |
| CN206136093U (en) * | 2016-10-28 | 2017-04-26 | 宁波舜宇光电信息有限公司 | A optical filter assembly and module and terminal equipment of making a video recording for making a video recording on module |
| CN206743383U (en) * | 2017-05-06 | 2017-12-12 | 南昌欧菲光电技术有限公司 | Camera module |
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- 2017-05-06 CN CN201710314639.0A patent/CN107404606B/en active Active
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| CN107404606A (en) | 2017-11-28 |
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