CN206743385U - Camera module - Google Patents
Camera module Download PDFInfo
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- CN206743385U CN206743385U CN201720495910.0U CN201720495910U CN206743385U CN 206743385 U CN206743385 U CN 206743385U CN 201720495910 U CN201720495910 U CN 201720495910U CN 206743385 U CN206743385 U CN 206743385U
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- packaging body
- circuit board
- encapsulation part
- electronic component
- camera module
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Abstract
It the utility model is related to a kind of camera module.The camera module includes circuit board, electronic component and packaging body.Electronic component is located on circuit board, and and circuit board electrical connection；Packaging body, which takes shape in circuit board, to be had on the surface of electronic component, and sealing electronic parts；Wherein, packaging body is the hollow structure of both ends open, and packaging body includes the end to end encapsulation part of polylith, and the encapsulation part for being closed with electronic component is the first encapsulation part, the encapsulation part for not having sealing electronic parts is the second encapsulation part, and the thickness of the second encapsulation part is less than the thickness of the first encapsulation part.In above-mentioned camera module, the thickness of the encapsulation part by reducing no sealing electronic parts, so as to reduce the overall dimensions of packaging body.Therefore, above-mentioned camera module has less size.
Description
Technical field
Camera technology field is the utility model is related to, more particularly to a kind of camera module.
Background technology
In recent years, for the electronic product such as mobile phone, flat board progressively towards lightening development, electronic product is thinner, and it is used to be laid out
The space of other components is relative will be smaller, and this camera module for requiring to be assembled in electronic product accordingly minimizes, with
Space-consuming is reduced, is easy to be laid out other components.
Utility model content
Based on this, it is necessary to provide a kind of size less camera module.
A kind of camera module, including：
Circuit board；
Electronic component, on the circuit board, and with the circuit board electrical connection；And
Packaging body, taking shape in the circuit board has on the surface of the electronic component, and closes the electronic component；
Wherein, the packaging body is the hollow structure of both ends open, and the packaging body includes the end to end encapsulation of polylith
Portion, the encapsulation part for being closed with the electronic component is the first encapsulation part, and the encapsulation part for not closing the electronic component is second
Encapsulation part, the thickness of second encapsulation part are less than the thickness of first encapsulation part.
In traditional camera module, packaging body includes the end to end encapsulation part of polylith (when packaging body is in cuboid
When, packaging body includes four pieces of encapsulation parts), some encapsulation part inner sealings have electronic component, and without closing electricity in some encapsulation parts
Subcomponent.In traditional camera module, the thickness of all encapsulation parts of packaging body is roughly the same, and this results in the whole of packaging body
Body size is larger.And in above-mentioned camera module, the thickness of the encapsulation part by reducing no sealing electronic parts, so as to
Reduce the overall dimensions of packaging body.Illustrated with packaging body in cuboid, when three pieces of encapsulation parts in four pieces of encapsulation parts
Inner sealing has electronic component, does not have sealing electronic parts in one piece of encapsulation part, reduces the encapsulation part of no sealing electronic parts
Thickness, the size of size or reduction packaging body in the Y-axis direction of packaging body in the X-axis direction can be reduced.And when four pieces
Adjacent two pieces of encapsulation part inner sealings in encapsulation part have electronic component, do not have sealing electronic parts in two pieces of encapsulation parts in addition, drop
The thickness of the low encapsulation part without sealing electronic parts, packaging body size in the X-axis direction and encapsulation can be reduced simultaneously
The size of body in the Y-axis direction.Therefore, above-mentioned camera module has less size.
In one of the embodiments, the packaging body is in cuboid, and the packaging body includes at least one piece described the
Two encapsulation parts.
In one of the embodiments, in addition to sensitive chip, the sensitive chip are located at the circuit board with described
On the surface of electronic component, and with the circuit board electrical connection, the electronic component is located at the periphery of the sensitive chip, described
The sensitive chip is fixed on the circuit board by packaging body, and the sensitive chip and the electronic component are separated,
The sensitive chip closes the packaging body close to one end of the circuit board.
In one of the embodiments, in addition to conductor wire, the both ends of the conductor wire respectively with the circuit board and institute
Sensitive chip connection is stated, the conductor wire is closed in the packaging body.
In one of the embodiments, the packaging body has an optical axis, the line between the packaging body both ends relative to
The inclined light shaft is set, and on the optical axis, along the circuit board to the direction of the packaging body, the packaging body
Internal diameter becomes larger.
In one of the embodiments, in addition to optical filter, the one end of the packaging body away from the circuit board is provided with the
One stage portion, in the first step portion, the first step portion is located in first encapsulation part optical filter
Loading end is the first loading end, and the loading end that the first step portion is located in second encapsulation part is the second loading end, institute
The width for stating the first loading end is more than the width of second loading end.
In one of the embodiments, the lap width of the optical filter and first loading end is more than the optical filter
With the lap width of second loading end.
In one of the embodiments, the one end of the packaging body away from the circuit board is additionally provided with second step portion, institute
Second step portion is stated between the first step portion and the circuit board.
Brief description of the drawings
Fig. 1 is the structural representation of the circuit board of camera module of an embodiment, electronic component and packaging body；
Fig. 2 is the structural representation of the camera module of an embodiment；
Fig. 3 is the top view of the camera module of an embodiment；
Fig. 4 is that Fig. 2 removes the structural representation after optical filter.
Embodiment
Below in conjunction with the accompanying drawings and camera module is further described specific embodiment.
As shown in Figures 1 and 2, the camera module 10 of an embodiment includes circuit board 100, electronic component 200, packaging body
300th, sensitive chip 400, conductor wire 500 and optical filter 600.
Electronic component 200 is located on circuit board 100, and electrically connected with circuit board 100.Specifically, in the present embodiment,
Electronic component 200 is the devices such as resistance, electric capacity.
Packaging body 300 is taken shape on surface of the circuit board 100 with electronic component 200, and sealing electronic parts 200.Its
In, packaging body 300 is the hollow structure of both ends open.Packaging body 300 includes the end to end encapsulation part of polylith, is closed with electronics
The encapsulation part of element 200 is the first encapsulation part 310, and the encapsulation part without sealing electronic parts 200 is the second encapsulation part 320, the
The thickness of two encapsulation parts 320 is less than the thickness of the first encapsulation part 310.
In traditional camera module, packaging body includes the end to end encapsulation part of polylith (when packaging body is in cuboid
When, packaging body includes four pieces of encapsulation parts), some encapsulation part inner sealings have electronic component, and without closing electricity in some encapsulation parts
Subcomponent.In traditional camera module, the thickness of all encapsulation parts of packaging body is roughly the same, and this results in the whole of packaging body
Body size is larger.And in above-mentioned camera module 10, the thickness of the encapsulation part by reducing no sealing electronic parts, so as to
To reduce the overall dimensions of packaging body 300.Illustrated with packaging body 300 in cuboid, three in four pieces of encapsulation parts
Block encapsulation part inner sealing has electronic component 200, does not have sealing electronic parts 200 in one piece of encapsulation part, reduces without closing electronics
The thickness of the encapsulation part of element, the size in the X-axis direction of packaging body 300 can be reduced or reduce packaging body 300 in Y-axis side
Upward size.And adjacent two pieces of encapsulation part inner sealings in four pieces of encapsulation parts have electronic component 200, two pieces of encapsulation parts in addition
It is interior there is no sealing electronic parts 200, the thickness of the encapsulation part of no sealing electronic parts is reduced, packaging body can be reduced simultaneously
300 size of size and packaging body 300 in the Y-axis direction in the X-axis direction.Therefore, above-mentioned camera module 10 have compared with
Small size.
Specifically, as shown in figure 3, in the present embodiment, when packaging body 300 is in cuboid, packaging body 300 includes four
Block encapsulation part, wherein three pieces are the first encapsulation part 310, one piece is the second encapsulation part 320 in addition.Portion in Fig. 3 marked as 300a
Point, the size that as above-mentioned camera module 10 reduces relative to traditional camera module, the size reduced in the X-axis direction.
Further, in the present embodiment, sensitive chip 400 is located at the surface that circuit board 100 has electronic component 200
On, and electrically connected with circuit board 100.Electronic component 200 is located at the periphery of sensitive chip 400.Packaging body 300 is by sensitive chip
400 are fixed on circuit board 100, and sensitive chip 400 and electronic component 200 are separated.Sensitive chip 400 closes packaging body
300 close to one end of circuit board 100.Specifically, when making, electronic component 200 and photosensitive core are first placed on circuit board 100
Piece 400 simultaneously causes electronic component 200 and sensitive chip 400 to be electrically connected respectively with circuit board 100, then is formed on circuit board 100
Packaging body 300.
In traditional camera module, the gluing mode of generally use causes circuit board to be fixedly connected with sensitive chip, then
Support (equivalent to packaging body 300) is set on circuit boards by the way of gluing, and electronic component is located at the support of hollow structure
Interior intracavitary, do not closed by support.And in above-mentioned camera module 100, when forming packaging body 300, you can fixed electronics
Element 200, electronic component 200 can be effectively avoided situation about releasing occur.And electronic component 200 is closed in packaging body 300,
Contaminants electronic component 200 can also be avoided.When forming packaging body 300, that is, complete sensitive chip 400 and circuit board
100 are fixedly connected, and packaging body 300 and circuit board 100 are fixedly connected, and are highly convenient for assembling.
Further, in the present embodiment, the both ends of conductor wire 500 connect with circuit board 100 and sensitive chip 400 respectively
Connect, namely in the present embodiment, circuit board 100 is electrically connected with sensitive chip 400 by conductor wire 500, it will be understood that at it
In his embodiment, circuit board 100 can also be by the way of the contact that is electrically connected directly contacts with the contact that is electrically connected with sensitive chip 400
Realize electrical connection.Conductor wire 500 is closed in packaging body 300, namely when forming packaging body 300, you can fixed conductor wire
500, so as to effectively avoid conductor wire 500 from situation about releasing occur, namely be not in circuit board 100 and sensitive chip
The situation of 400 open circuits.Specifically, conductor wire 500 is gold thread.Conductor wire 500 be located at electronic component 200 and sensitive chip 400 it
Between.
Packaging body 300 has optical axis Z.Further, in the present embodiment, the line between the both ends of packaging body 300 is relative
It is obliquely installed in optical axis Z, and on the optical axis Z of packaging body 300, along circuit board 100 to the direction of packaging body 300, packaging body
300 internal diameter becomes larger.So as to be effectively increased luminous flux, be easy to the demoulding (need using mould formed packaging body 300,
Formed after packaging body 300, it is necessary to be stripped) and it is easy to cleaning fluid centrifugation to throw away (after formation packaging body 300, it is necessary to using cleaning
Liquid cleans packaging body 300, avoids the impurity of packaging body 300 from polluting sensitive chip 400, in cleaning, it is necessary in advance in photosensitive core
Pasting protective film on piece 400).In addition, the internal diameter of packaging body 300 becomes larger, the materials to form packaging body 300 can be saved, from
And the material cost of packaging body 300 can be reduced and reduce the weight of packaging body 300.
Further, in the present embodiment, between the line between the both ends of packaging body 300 and the optical axis Z of packaging body 300
Angle is 15~45 °.Further, the angle between the line between the both ends of packaging body 300 and the optical axis Z of packaging body 300 is 15
~30 °.Preferably, the angle between the line between the both ends of packaging body 300 and the optical axis Z of packaging body 300 is 30 °.So as to
Being effectively increased luminous flux, being easy to be stripped and being easy to cleaning fluid centrifugation to throw away.
Further, it is shown as shown in Figure 2, Figure 3 and Figure 4, in the present embodiment, the one end of packaging body 300 away from circuit board 100
Provided with first step portion 330.Optical filter 600 is in first step portion 330, and optical filter 600 closes packaging body 300 away from electricity
One end of road plate 100.So as to which optical filter 600, sensitive chip 400 and packaging body 300 cooperatively form annular seal space, so as to have
Effect avoids sensitive chip 400 contaminated and influences image quality.
Further, in the present embodiment, the loading end that first step portion 330 is located in the first encapsulation part 310 is first
Loading end 332, the loading end that first step portion 330 is located in the second encapsulation part 320 are the second loading end 334, the first loading end
332 width is more than the width of the second loading end 334.The lap width of the loading end 332 of optical filter 600 and first is more than optical filter
600 and second loading end 334 lap width.
Specifically, when setting optical filter 600, first glue-line is set on the first loading end 332, then optical filter 600 is put
It is placed on glue-line, then passes through mode for dispensing glue so that optical filter 600 is connected with the second loading end 334.In the present embodiment,
The width of first loading end 332 is 0.43 centimetre, and the width of the second loading end 334 is 0.23 centimetre.Optical filter 600 is held with first
The lap width of section 332 is 0.32 centimetre, and the lap width of the loading end 334 of optical filter 600 and second is 0.12 centimetre.
Further, in the present embodiment, the lap width of the loading end 334 of optical filter 600 and second meets, during dispensing,
Glue will not be dropped on sensitive chip 400, so that the minimizing thickness of the second encapsulation part 320.
First step portion 330 also includes the first inclined-plane 336, the folder between the first inclined-plane 336 and the optical axis Z of packaging body 300
Angle is 15~45 °.First loading end 332 is vertically arranged with optical axis Z of second loading end 334 respectively with packaging body 300.First is oblique
Face 336 can increase luminous flux, is easy to be stripped and be easy to cleaning fluid centrifugation to throw away, and can also reduce the material of packaging body 300
Cost and the weight for reducing packaging body 300.
The one end of packaging body 300 away from circuit board 100 is additionally provided with second step portion 340, and second step portion 340 is located at first
Between stage portion 330 and sensitive chip 400.Second step portion 340 can increase luminous flux, reduce packaging body 300 material into
Sheet and the weight for reducing packaging body 300.
Second step portion 340 includes the inclined-plane 344 of plane 342 and second, and plane 342 is vertical with the optical axis Z of packaging body 300 to be set
Put, the angle between the second inclined-plane 344 and the optical axis Z of packaging body 300 is 15~45 °.In first step by the way of gluing
When optical filter 600 is set in portion 330, plane 342 can be with preventing glue from overflowing.Second inclined-plane 344 can increase luminous flux, be easy to take off
Mould and be easy to cleaning fluid centrifugation throw away, can also reduce packaging body 300 material cost and reduce packaging body 300 weight
Amount.
Further, in the present embodiment, the angle between the first inclined-plane 336 and the optical axis Z of packaging body 300 is more than second
Angle between inclined-plane 344 and the optical axis Z of packaging body 300.
Further, in the present embodiment, the angle between the second inclined-plane 344 and the optical axis Z of packaging body 300 is more than encapsulation
Angle between the optical axis Z of line and packaging body 300 of the body 300 between one end of circuit board 100 and plane 342.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (8)
- A kind of 1. camera module, it is characterised in that including：Circuit board；Electronic component, on the circuit board, and with the circuit board electrical connection；AndPackaging body, taking shape in the circuit board has on the surface of the electronic component, and closes the electronic component；Wherein, the packaging body is the hollow structure of both ends open, and the packaging body includes the end to end encapsulation part of polylith, is sealed The encapsulation part for closing the electronic component is the first encapsulation part, and the encapsulation part for not closing the electronic component is the second encapsulation Portion, the thickness of second encapsulation part are less than the thickness of first encapsulation part.
- 2. camera module according to claim 1, it is characterised in that the packaging body is in cuboid, the packaging body Including at least one piece second encapsulation part.
- 3. camera module according to claim 1, it is characterised in that be also located at including sensitive chip, the sensitive chip The circuit board has on the surface of the electronic component, and is located at described with the circuit board electrical connection, the electronic component The sensitive chip is fixed on the circuit board by the periphery of sensitive chip, the packaging body, and by the sensitive chip with The electronic component separates, and the sensitive chip closes the packaging body close to one end of the circuit board.
- 4. camera module according to claim 3, it is characterised in that also including conductor wire, the both ends point of the conductor wire It is not connected with the circuit board and the sensitive chip, the conductor wire is closed in the packaging body.
- 5. camera module according to claim 1, it is characterised in that the packaging body has optical axis, the packaging body two Line between end is set relative to the inclined light shaft, and on the optical axis, along the circuit board to the packaging body On direction, the internal diameter of the packaging body becomes larger.
- 6. camera module according to claim 1, it is characterised in that also including optical filter, the packaging body is away from described One end of circuit board is provided with first step portion, and in the first step portion, the first step portion is located at the optical filter Loading end in first encapsulation part is the first loading end, and the first step portion is located at the carrying in second encapsulation part Face is the second loading end, and the width of first loading end is more than the width of second loading end.
- 7. camera module according to claim 6, it is characterised in that the overlap joint of the optical filter and first loading end Width is more than the lap width of the optical filter and second loading end.
- 8. camera module according to claim 6, it is characterised in that the one end of the packaging body away from the circuit board is also Provided with second step portion, the second step portion is between the first step portion and the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720495910.0U CN206743385U (en) | 2017-05-06 | 2017-05-06 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720495910.0U CN206743385U (en) | 2017-05-06 | 2017-05-06 | Camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206743385U true CN206743385U (en) | 2017-12-12 |
Family
ID=60563958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720495910.0U Active CN206743385U (en) | 2017-05-06 | 2017-05-06 | Camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206743385U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109743482A (en) * | 2019-01-21 | 2019-05-10 | 宁波舜宇光电信息有限公司 | The assemble method and electronic equipment of camera module, camera module |
| CN110557536A (en) * | 2019-09-12 | 2019-12-10 | Oppo广东移动通信有限公司 | camera assembly and electronic equipment |
| WO2020151481A1 (en) * | 2019-01-21 | 2020-07-30 | 宁波舜宇光电信息有限公司 | Image capturing module, assembly method for image capturing module, and electronic apparatus |
-
2017
- 2017-05-06 CN CN201720495910.0U patent/CN206743385U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109743482A (en) * | 2019-01-21 | 2019-05-10 | 宁波舜宇光电信息有限公司 | The assemble method and electronic equipment of camera module, camera module |
| WO2020151481A1 (en) * | 2019-01-21 | 2020-07-30 | 宁波舜宇光电信息有限公司 | Image capturing module, assembly method for image capturing module, and electronic apparatus |
| CN110557536A (en) * | 2019-09-12 | 2019-12-10 | Oppo广东移动通信有限公司 | camera assembly and electronic equipment |
| CN110557536B (en) * | 2019-09-12 | 2021-03-30 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
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