CN109743482A - The assemble method and electronic equipment of camera module, camera module - Google Patents
The assemble method and electronic equipment of camera module, camera module Download PDFInfo
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- CN109743482A CN109743482A CN201910053978.7A CN201910053978A CN109743482A CN 109743482 A CN109743482 A CN 109743482A CN 201910053978 A CN201910053978 A CN 201910053978A CN 109743482 A CN109743482 A CN 109743482A
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- mounting wall
- assembling parts
- camera module
- pedestal
- support portion
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Abstract
The present invention relates to camera modules, the installation method and electronic equipment of camera module.Wherein camera module includes the first assembling parts, second assembling parts, sensitive chip and the camera lens on sensitive chip entering light path, camera lens is installed on the first assembling parts, sensitive chip is set to the second assembling parts, the edge of first assembling parts has the support portion extended to the second assembling parts direction, support portion includes the first mounting wall and the second mounting wall, support portion is set on the second assembling parts, second mounting wall is connect with the second assembling parts by bonding agent, it is sealed between first mounting wall and the second assembling parts, connection width of the connection width of first mounting wall and the second assembling parts less than the second mounting wall and the second assembling parts.When camera module provided by the invention is applied to electronic equipment, the area of the non-display area of its occupancy is advantageously reduced, provides selection for the bigger display area of the front setting of electronic equipment.
Description
Technical field
The present invention relates to camera modules, the assemble method and electronic equipment of camera module.
Background technique
Camera module is the important component of intelligent electronic device, and the screen of intelligent electronic device increasingly tends to " full frameization ",
Therefore the non-display area of panel is greatly compressed in front of electronic equipment, therefore how to be built at smaller and smaller " forehead "
Camera module becomes industry pressing issue.
Fig. 1 shows that camera module A in the prior art, camera module A include wiring board A1, sensitive chip A2, camera lens
A3 and microscope base A4, sensitive chip A2 are arranged on assist side A1, and camera lens A3 is mounted on microscope base A4, and microscope base A4 passes through glue C
It is Nian Jie with wiring board A1.When microscope base A4 is Nian Jie with wiring board A1, glue C is arranged in the surrounding of assist side A1 first, such as Fig. 2 institute
Show, then make the bottom surface of microscope base A4 be aligned with glue C place assist side A1 on, then make glue C solidify, thus microscope base A4 with
Wiring board A1 connection.In this way when connection microscope base A4 and wiring board A1, there is certain want to the adhesion width of microscope base A4
It asks namely microscope base A4 needs has certain thickness to meet the requirement to its adhesion width.
Fig. 3 A shows that the schematic diagram of the electronic equipment B with camera module A, Fig. 3 B are the partial enlarged view of Fig. 3 A.
The front of electronic equipment B has display area B1 and non-display area B2, and camera module A setting is non-in non-display area B2
Display area B2 is in the positive edge electronic equipment B.The width for reducing non-display area B2 can start in terms of two, and one
Aspect reduces the overall dimensions of camera module A, is on the other hand the edge that camera module A is positioned as close to electronic equipment B
Setting.The prior art is limited to the thickness of microscope base A4, and overall dimensions are difficult to further reduce, and the wall thickness of microscope base A4 also limits
Edge of the camera lens further towards electronic equipment B.
Summary of the invention
For overcome the deficiencies in the prior art, it the purpose of the present invention is to provide a kind of camera module, is set applied to electronics
When standby, be conducive to that electronic equipment is made to obtain higher display accounting.
It is another object of the present invention to provide a kind of assemble methods of above-mentioned camera module.
It is another object of the present invention to provide a kind of electronic equipments including above-mentioned camera module.
According to an aspect of the present invention, a kind of camera module is provided, including the first assembling parts, the second assembling parts,
Sensitive chip and the camera lens on sensitive chip entering light path, the camera lens are installed on first assembling parts,
The sensitive chip is set to second assembling parts, and the edge of first assembling parts has to second assembling
The support portion that component direction extends, the support portion include the first mounting wall and the second mounting wall, and the support portion is set to
On second assembling parts, second mounting wall is connect with second assembling parts by bonding agent, first peace
It is sealed between dress wall and second assembling parts, the connection width of first mounting wall and second assembling parts is small
In the connection width of second mounting wall and second assembling parts.
Further, second mounting wall is in U-shape, and first mounting wall is in linear type, first mounting wall
It is surrounded with second mounting wall and forms the support portion.
Further, described close by sealing glue sealing between first mounting wall and second assembling parts
Sealing water extends to the side wall of second assembling parts.
Further, the camera module further includes optical filter, first assembling parts or second assembling parts
It is equipped with the platform for installing the optical filter, the optical filter is maintained at the camera lens and the photosensitive core by the platform
Between piece, the platform has light hole, and the optical filter is opposite with the light hole.
Further, the camera lens includes at least one lens with free form surface, the lens with free form surface
So that geometric center axle offset of the imaging region of the camera lens relative to the camera lens, to make the imaging region of the camera lens
It is corresponding with the sensitive chip.
It further, is free form surface near the image side surface of a lens of the sensitive chip on the camera lens.
According on one side, the thickness of first mounting wall is less than the thickness of second mounting wall；Alternatively, described
One mounting wall is incompletely set on second assembling parts so that the side of the camera module formed it is step-like.
According on the other hand, first assembling parts are microscope base, and second assembling parts are wiring board, the branch
Support part extends from the edge of the microscope base to the wiring board, and the support portion is opposite with the upper surface of the wiring board,
The thickness of first mounting wall is less than the thickness of second mounting wall.
Further, the geometrical central axis of the camera lens is axial relative to the geometric center of the first assembling parts outline border
The first mounting wall offset.
Further, for the wiring board in the region except the sensitive chip, the width of side is less than other three sides
Width, be not provided with electronic component in the smallest side of route board width, or in the route board width minimum one
Quantity of the quantity of electronic component on side less than the electronic component of other every sides.
Further, geometrical central axis of the geometrical central axis of the light hole relative to the first assembling parts outline border
It is deviated to first mounting wall, so that the offset of the transmission region of the sensitive chip and the offset of the camera lens are mutually fitted
It answers；Alternatively, the optical filter is equipped with eccentric light shield layer, the geometrical central axis of the transmission region within the light shield layer is opposite
In geometric center axially the first mounting wall offset of the optical filter, so that the offset of the sensitive chip transmission region
Offset with the camera lens is adapted.
According on the other hand, first assembling parts be microscope base, second assembling parts include wiring board and
Pedestal on the wiring board, the sensitive chip are set to the wiring board, surrounding of the support portion from the microscope base
Edge extends to the pedestal, and first mounting wall is incompletely set on the pedestal, thus the side of the camera module
Face forms step-like.
Further, for the wiring board in the region except the sensitive chip, the width of side is less than other three sides
Width, be not provided with electronic component in the smallest side of route board width, or in the route board width minimum one
Quantity of the quantity of electronic component on side less than the electronic component of other every sides.
Further, the edge of the pedestal has the pedestal support portion extended to the wiring board direction, described
Pedestal support portion includes the second mounting wall of the first mounting wall of pedestal and pedestal, first mounting wall of pedestal and the wiring board
Connection width be less than the connection width of second mounting wall of pedestal and the wiring board, second mounting wall of pedestal and institute
It states wiring board to connect by bonding agent, the gap between first mounting wall of pedestal and the wiring board is sealed.
Further, first mounting wall and first mounting wall of pedestal are in the same side of the camera module.
Further, second mounting wall of pedestal is in U-shape, and first mounting wall of pedestal is in linear type, the bottom
The second mounting wall of seat and first mounting wall of pedestal, which surround, forms the pedestal support portion.
According to another aspect of the present invention, a kind of electronic equipment is provided, including above-mentioned camera module of the invention.
Further, the electronic equipment further includes frame, and first mounting wall is arranged close to the frame.
Further, the side of the frame is arc-shaped, arcuate flanks of first mounting wall close to the frame.
According to another aspect of the present invention, the assemble method of above-mentioned camera module is also provided, comprising the following steps:
S1. bonding agent is set in three sides on one surface of the second assembling parts；
S2. the second mounting wall of the support portion of first assembling parts is arranged in described in second assembling parts
On bonding agent, first mounting wall is corresponding with the side of the not set binder of the second assembling parts；
S3. solidify the bonding agent, so that first assembling parts are connect with second assembling parts；
S4. the gap between first mounting wall and second assembling parts is sealed.
Further, in the step S4, first mounting wall and described second is sealed using mode for dispensing glue is tilted
Gap between assembling parts.
Compared with prior art: the smaller or of the invention camera module application of the overall dimensions of camera module of the invention
Camera lens can be made further towards the edge of electronic equipment when electronic equipment, to be conducive to reduce the non-display of camera module
The size in region makes electronic equipment obtain higher display accounting.
Detailed description of the invention
Fig. 1 is the schematic diagram of a camera module of the prior art；
Fig. 2 is shown in the prior art, when the wiring board of camera module is connect with microscope base, the setting of glue in the circuit board
Mode；
Fig. 3 A is the schematic diagram of an electronic equipment of the prior art；
Fig. 3 B is the partial enlarged view of Fig. 3 A, it is shown that the camera module on electronic equipment in the prior art；
Fig. 4 is the schematic diagram of one embodiment of camera module of the invention；
Fig. 5 is the partial schematic diagram of one embodiment of electronic equipment of the invention；
Fig. 6 is the partial schematic diagram of another embodiment of electronic equipment of the invention；
Fig. 7 is the partial schematic diagram of another embodiment of electronic equipment of the invention；
Fig. 8 is the schematic diagram of second embodiment of camera module of the invention；
Fig. 9 is the schematic diagram of the third embodiment of camera module of the invention；
Figure 10 shows a preferred embodiment of camera lens of the invention；
Figure 11 shows another preferred embodiment of camera lens of the invention；
When Figure 12 shows that the first assembling parts of camera module of the invention are connect with the second assembling parts, bonding agent exists
Set-up mode on second assembling parts；
Figure 13 show the second mounting wall of camera module of the invention and the second assembling parts by bonding agent it is Nian Jie after
Schematic diagram；
In figure: 1 (including 1a, 1b, 1c), camera module；100, the first assembling parts；110, support portion；111, the first peace
Fill wall；112, the second mounting wall；101, microscope base；200, the second assembling parts；201, wiring board；202, pedestal；212, pedestal branch
Support part；2121, the first mounting wall of pedestal；2122, the second mounting wall of pedestal；300, sensitive chip；400, camera lens；500, it filters
Piece；501, platform；8, bonding agent；9, frame.
Specific embodiment
In the following, being described further in conjunction with specific embodiment to the present invention, it should be noted that is do not collided
Under the premise of, new embodiment can be formed between various embodiments described below or between each technical characteristic in any combination.
In the description of the present invention, it should be noted that " transverse direction ", " vertical if any term " center " for the noun of locality
To ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top",
The indicating positions such as "bottom", "inner", "outside", " clockwise ", " counterclockwise " and positional relationship are orientation based on the figure or position
Relationship is set, the narration present invention is merely for convenience of and simplifies description, rather than the device or element of indication or suggestion meaning are necessary
It constructs and operates with specific orientation, with particular orientation, should not be understood as limiting specific protection scope of the invention.
It should be noted that the term " first ", " second " etc. in the description and claims of this application are to be used for
Similar object is distinguished, without being used to describe a particular order or precedence order.It should be understood that the data used in this way are suitable
It can be interchanged in the case of, so as to embodiments herein described herein.In addition, term " includes " and " having " and they
Any deformation, it is intended that cover it is non-exclusive include, for example, containing the process, method of a series of steps or units, being
System, product or equipment those of are not necessarily limited to be clearly listed step or unit, but may include be not clearly listed or
For the intrinsic other step or units of these process, methods, product or equipment.
As shown in Fig. 4 or Fig. 8 or Fig. 9, the present invention provides a kind of camera module 1 (including 1a, 1b, 1c), and camera module 1 wraps
It includes on the first assembling parts 100, the second assembling parts 200, sensitive chip 300 and entering light path in sensitive chip 300
Camera lens 400, camera lens 400 is installed on the first assembling parts 100, and sensitive chip 300 is installed on the second assembling parts 200, wherein
The edge of first assembling parts 100 has the support portion 110 extended to 200 direction of the second assembling parts, and support portion 110 wraps
The first mounting wall 111 and the second mounting wall 112 are included, support portion 110 is set on the second assembling parts 200, the second mounting wall
112 are connect with the second assembling parts 200 by bonding agent, are sealed between the first mounting wall 111 and the second assembling parts 200,
The connection width L1 of first mounting wall 111 and the second assembling parts 200 is less than the second mounting wall 112 and the second assembling parts 200
Connection width L2.
It will be appreciated by those skilled in the art that the first assembling parts 100 can be microscope base, it is also possible to include mirror
The bracket of seat；Second assembling parts 200 can be wiring board, be also possible to include wiring board bracket.About the first assembled portion
The specific embodiment of part 100 and the second assembling parts 200 has a more specific description below, but the first assembling parts
100 and second assembling parts 200 be not limited to the several embodiments enumerated listed by the present invention.
" connection width " described in the present invention refers to the first mounting wall 111 or the second mounting wall 112 out of camera module 1
The width divided in portion to external direction with 200 opposing connections of the second assembling parts.For example, in the embodiment shown in fig. 4,
The connection width and the first mounting wall 111 or the second of first mounting wall 111 or the second mounting wall 112 and the second assembling parts 200
112 thickness of mounting wall is identical；In Fig. 8 or embodiment shown in Fig. 9, the company of the first mounting wall 111 and the second assembling parts 200
Connect the width that width is 200 opposite segments of the first mounting wall 111 and the second assembling parts, the second mounting wall 112 and the second assembling
The connection width of component 200 is identical as the thickness of the second mounting wall 112.
Second mounting wall 112 is connect with the second assembling parts 200 by bonding agent, and bonding agent needs to be set in advance in second
On assembling parts 200, pre-set bonding agent needs to reserve certain width, therefore the second mounting wall 112 and the second assembling
The connection width of component 200 is not less than minimum adhesion width.It can be used between first mounting wall 111 and the second assembling parts 200
The techniques such as dispensing are sealed, therefore can not consider the problems of adhesion width, the first mounting wall 111 can also be done it is narrow,
The connection width of the first mounting wall 111 and the second assembling parts 200 is set to be less than minimum adhesion width.Those skilled in the art can
With understanding, " minimum adhesion width " described in the present invention refers to: for specific bonding agent, realizing that two components are stably connected with
Required most narrow connection width.
It is noted that glue for be bonded the second mounting wall 112 and the second assembling parts 200 be used for sealing the
The sealing glue in gap can be the same or different between one mounting wall 111 and the second assembling parts 200.Preferably, it is used for
The sealant water in gap between the first mounting wall 111 and the second assembling parts 200 glue poor using mobility is sealed, to keep away
Exempt from sealant water and flows to inside configuration pollution internal components.
When using the gap between glue sealing the first mounting wall 111 and the second assembling parts 200 is sealed, glue is sealed
The side wall of the second assembling parts 200 is extended to improve sealing effect, as the partial enlarged view of Fig. 8 or the part of Fig. 9 are put
Shown in big figure, the side wall that sealing glue extends to the second assembling parts 200 is also beneficial to improve the first assembling to a certain extent
Adhesive strength between component 100 and the second assembling parts 200.
In addition it is also possible to by fitting closely the first mounting wall 111 and the end face of the second assembling parts 200, to realize
Sealing between first mounting wall 111 and the second assembling parts 200, in this case without considering the problems of adhesion width.
To improve the stability that the first assembling parts 100 are connect with the second assembling parts 200, it is preferable that the second mounting wall
112 are in U-shape, and the first mounting wall 111 is in linear type, and the second mounting wall 112 and the first mounting wall 111, which surround, forms support portion
110.For example, when the cross section of support portion 110 is in quadrangle, in order to improve the first assembling parts 100 and the second assembling parts
200 connective stability, three side walls of support portion 110 constitute the second mounting wall 112, and the one side wall of support portion 110 constitutes first
Mounting wall 111.Certainly, the shape of 110 cross section of support portion is not limited to the quadrangle that the present invention enumerates, and it is polygon to be also possible to other
Shape.
Camera module 1 further includes optical filter 500, is provided with peace on the first assembling parts 100 or the second assembling parts 200
The platform 501 of optical filter 500 is filled, optical filter 500 is maintained between camera lens 400 and sensitive chip 300 by platform 501.Platform 501
With light hole, optical filter 500 is opposite with the light hole.Optical filter 500 is used to filter the infrared light in light, and blocking portion
The stray light of interference image quality is divided to enter sensitive chip 300.
Can be accomplished in several ways " the connection width of the first mounting wall 111 and the second assembling parts 200 less than second peace
Fill the connection width of wall 112 and the second assembling parts 200 ".
One of embodiment are as follows: support portion 110 is opposite with the upper surface of the second assembling parts 200, by reducing the
The wall thickness of one mounting wall 111 reduces the connection width of the first mounting wall 111 and the second assembling parts 200.Do not changing camera lens
Under the premise of 400 sizes, by reducing the wall thickness of 100 side of the first assembling parts (namely first mounting wall 111), it may be implemented
Reduction to 100 overall dimensions of the first assembling parts, to be conducive to the reduction of camera module overall dimensions.
As shown in figure 4, the first assembling parts 100 of camera module 1a are microscope base 101, the second assembling parts 200 are route
Plate 201, camera lens 400 are arranged in microscope base 101, and sensitive chip 300 is arranged in assist side 201, and support portion 110 is from microscope base 101
Edge extend to wiring board 201, and support sector 110 is opposite with the upper surface of wiring board 201, the second of support portion 110
Mounting wall 112 is connect with wiring board 201 by bonding agent, between the first mounting wall 111 and wiring board 201 of support portion 110
Gap is sealed.Wherein, thickness of the thickness of the first mounting wall 111 less than the second mounting wall 112.
The geometrical central axis a of camera lens 400 is installed relative to the geometrical central axis b of 100 outline border of the first assembling parts to first
Wall 111 deviates.The geometrical central axis a of camera lens 400 refers to central axis of the camera lens 400 on geometry；First assembling parts 100
The central axis that it is boundary on geometry using 100 lateral surface of the first assembling parts that the geometrical central axis b of outline border, which refers to,.
Further, the platform 501 for installing optical filter 500 is set in microscope base 101.
It is noted that in the present invention, the first assembling parts 100 may be implemented as integrated glasses with camera lens 400
Head, such as camera lens 400 are assembled in microscope base 101 and form integral type camera lens, then are assembled in the second assembling parts 200, further,
Optical filter 500 can also be fixed on microscope base 101 in advance.It should be noted that mould group is implemented as automatic focusing camera module
When, the integral type camera lens further includes an actuator, to realize that lens focusing, the actuator can be implemented as voice coil motor
Deng.
Another embodiment are as follows: the first mounting wall 111 of support portion 110 is not exclusively arranged in the second assembling parts 200
Surface, thus the side of camera module 1 formed it is step-like.That is, the case where not increasing by the first 100 size of assembling parts
Under, the first assembling parts 100 are integrally offseted to one side relative to the second assembling parts 200.The camera module 1 is especially suitable
In the arc-shaped electronic equipment of side frame, the step-like side of camera module 1 can preferably coincide the frame of arc, improve
The space utilization rate of electronic equipment frame, while being conducive to camera lens 400 closer to the edge of electronic equipment.
In the embodiment shown in Fig. 8 or 9, camera module 1 is arranged within electronic equipment, and electronic equipment has side
Arc-shaped frame 9, camera module 1 are arranged close to frame 9.First assembling parts 100 of camera module 1 be microscope base 101, second
Assembling parts 200 include wiring board 201 and the pedestal 202 on wiring board 201, and assist side is arranged in sensitive chip 300
On 201, camera lens 400 is arranged in microscope base 101.Support portion 110 extends from the edge of microscope base 101 to pedestal 202, support portion
110 the second mounting wall 112 is connect with pedestal 202 by bonding agent, the first mounting wall 111 and pedestal 202 of support portion 110 it
Between gap sealed.First mounting wall 111 is incompletely set on pedestal 202, so that the first mounting wall 111 and pedestal 202
Connection width less than the connection width of the second mounting wall 112 and pedestal 202, the side of camera module 1b forms step-like.
Further, the edge of pedestal 202 has the pedestal support portion 212 extended to 201 direction of wiring board, pedestal
Support portion 212 includes the first mounting wall of pedestal 2121 and the second mounting wall of pedestal 2122, the first mounting wall of pedestal 2121 and line
The connection width of road plate 201 is less than the connection width of the second mounting wall of pedestal 2122 and wiring board 201, the second mounting wall of pedestal
2122 are connect with wiring board 201 by bonding agent, and the gap between the first mounting wall of pedestal 2121 and wiring board 201 is sealed.
Realize that the connection width of the first mounting wall of pedestal 2121 and wiring board 201 is less than the second mounting wall of pedestal 2122 and line
Road plate 201 connection width mode also there are many.One way in which are as follows: pedestal support portion 212 is provided entirely in wiring board
On 201 surfaces, reduce the first mounting wall of pedestal 2121 and wiring board 201 by reducing the wall thickness of the first mounting wall of pedestal 2121
Connection width, be conducive in this way reduce pedestal 202 size.Another way are as follows: as shown in figure 9, pedestal support portion 212
The surface of the not exclusively setting assist side 201 of the first mounting wall of pedestal 2121, so that the side of the second assembling parts 200 forms platform
When scalariform, in this way the advantages of design are that camera module is applied to side frame arc-shaped electronic equipment, the side of camera module 1
Face can preferably coincide the frame of arc, improve the space utilization rate of frame, while being conducive to camera lens 400 and setting closer to electronics
Standby edge.
Preferably, the first mounting wall 111 of microscope base 101 and the first mounting wall of pedestal 2121 of pedestal 202 are in camera shooting mould
The same side of group 1.
In some embodiments, the second mounting wall of pedestal 2122 is in U-shape, and the first mounting wall of pedestal 2121 is in linear type,
The second mounting wall of pedestal 2122 and the first mounting wall of pedestal 2121, which surround, forms pedestal support portion 212.
In some embodiments, the platform 501 for installing optical filter 500 is set on pedestal 202.
In another embodiment, the first assembling parts 100 of camera module 1 include pedestal and are arranged on the base
Microscope base, the second assembling parts 200 include wiring board, and sensitive chip 300 is arranged on the wiring board, and camera lens 400 is arranged in institute
It states in microscope base.Support portion 110 extends from the edge of the pedestal to the wiring board, the second mounting wall of support portion 110
112 are connect with the wiring board by bonding agent, the gap between the first mounting wall 111 of support portion 110 and the wiring board
It is sealed.First mounting wall 111 incompletely be set to the wiring board on, thus the side of camera module 1 formed it is step-like.This
The technical staff in field is it is understood that wherein can also be to a lateral deviation between the microscope base and pedestal of the first assembling parts 100
Setting is moved, so that it is step-like to form the side of the first assembling parts 100.
It is noted that may result in line when the first assembling parts 100 are incompletely arranged in the circuit board
The side of road plate narrows, that is, the width of the side in the region on wiring board except sensitive chip 300 is less than other three sides
Width is not provided in the smallest side of the width or electronic component is arranged less, " electronic component is arranged less " herein and refers to
Quantity of the quantity of the electronic component of the smallest side of the width less than the electronic component of other sides.
Another embodiment are as follows: the surface of the first mounting wall 111 of support portion 110 and the second assembling parts 200 not phase
Right namely the first assembling parts 100 are greater than the thickness of the first mounting wall 111 relative to the offset of the second assembling parts 200.This
The technical staff in field can be sealed between the first mounting wall 111 and the second assembling parts 200 using dispensing or other modes
Gap.
" the connection width of the first mounting wall 111 and the second assembling parts 200 is less than the second mounting wall for realization listed above
112 with the connection width of the second assembling parts 200 " mode be not it is exhausted enumerate, art technology be readily apparent that other
Mode is within the scope of the present invention.
In several embodiments provided above, when changing 110 side wall thickness of support portion or the first assembling parts
100 relative to the second 200 eccentric setting of assembling parts when, camera lens 400 and the relative position of sensitive chip 300 may change
Become, if sensitive chip 300 is arranged in the position still according to the prior art on the second assembling parts 200, camera lens may be made
400 optical axis be not overlapped with the optical axis of sensitive chip 300 namely the photosensitive area of sensitive chip 300 can not all with camera lens 400
Imaging region is corresponding, causes a part of photosensitive area of sensitive chip 300 that can not receive light.
In some embodiments, directly by changing sensitive chip 300 on the wiring board 201 of the second assembling parts 200
Installation site, guarantee sensitive chip 300 photosensitive region it is completely corresponding with the imaging region of camera lens 400, shown in Figure 10.When
When the position change in the circuit board of sensitive chip 300, the side that may result in wiring board narrows, that is, feeling on wiring board
The width of the side in region except optical chip 300 is less than the width of other three sides, is not provided in the smallest side of the width
Or electronic component is set less.Herein " electronic component is set " less and refers to the electronic component in the smallest side of the width
Quantity of the quantity less than the electronic component of other sides.
In further embodiments, in the case where not changing 300 installation site of sensitive chip, by making camera lens 400
Optical axis shifts relative to its geometrical central axis, to compensate 400 geometrical central axis a of camera lens relative to the offset of sensitive chip 300,
As shown in figure 11, it the advantage is that, it is possible to reduce the redesign to camera module structure.In the embodiment, camera lens 400 includes
At least a free-form surface lens 401, free-form surface lens 401 make the imaging region of camera lens 400 relative to the geometry of camera lens 400
Distortion, to ensure that the photosensitive region of sensitive chip 300 is completely corresponding with the imaging region of camera lens 400.Ability
The technical staff in domain can make mirror it is understood that pass through the diopter of 401 different zones of optical design free-form surface lens
First 400 imaging region at image planes height is offset to corresponding with sensitive chip 300.
An at least surface for free-form surface lens 401 is that free form surface namely free-form surface lens 401 can be image side table
Face is free form surface, and being also possible to object side surface is free form surface, can also be image side surface and object side surface is free song
Face.
Camera lens 400 can only include a free-form surface lens 401, also may include multiple free-form surface lens 401.When
When camera lens 400 includes multiple free-form surface lens 401, each free-form surface lens 401 can be disposed adjacent, and can also be set with compartment of terrain
It sets, and each free-form surface lens 401 can be identical or not identical.
To ensure that free-form surface lens 401 have maximum adjustment effect, in some preferred embodiments, mirror to optical system
On first 400 near the image side surface of a lens of sensitive chip 300 be free form surface.
When camera module further includes optical filter 500, the transmission region of optical filter 500 is also required to the imaging with camera lens 400
The position of the photosensitive area of region or sensitive chip 300 is corresponding.Therefore, in some embodiments, it is also desirable to which correspondingly adjustment filters
The position of the transmission region of piece 500.
In some embodiments, change platform 501 on light hole position, make the transmission region of optical filter 500 with it is photosensitive
The offset of chip 300 and camera lens 400 is adapted, and width of the platform 501 at the first mounting wall 111 can be made to be less than platform
501 width at the second mounting wall 112, so that the geometrical central axis of the light hole is relative to the first assembling parts
Axial first mounting wall, the 111 side offset of the geometric center of 100 outline borders.
In further embodiments, in the case where light passing hole site on not changing platform 501, change on optical filter 500
The application place of light shield layer forms eccentric transmission region, so that the transmission region of optical filter 500 and sense on optical filter 500
The offset of optical chip 300 and camera lens 400 is adapted, that is, light shield layer is coated on optical filter 500, in one embodiment, institute
It states light shield layer and the optical filter 500 is set to by eccentric, so that the geometric center of the transmission region within the light shield layer
Geometric center axial first mounting wall 111 side offset of the axis relative to optical filter 500.
It is noted that light shield layer usually is arranged at the edge of optical filter 500 in the prior art, light shield layer does not allow light
Line passes through, and the purpose that light shield layer is arranged is that reducing stray light enters sensitive chip 300, therefore can be by changing light shield layer
Be arranged position, come adjust optical filter 500 transmission region position.
The present invention also provides a kind of electronic equipment, and as shown in Fig. 5 or 6 or 7, which includes aforementioned camera module 1
And frame 9, camera module 1 are arranged close to frame 9.
It is arranged by making camera module 1 be positioned as close to frame 9, bigger show is arranged in the front for being conducive to electronic equipment
Show region.It in some embodiments, is the thickness by reducing the first assembling parts 100 of camera module 1 such as Fig. 5 or Fig. 6,
The reduction for realizing 1 overall dimensions of camera module, to make the front of electronic equipment that bigger display area can be set.Another
In a little embodiments, as shown in fig. 7, be it is step-like by forming camera module 1 in the side close to 9 arcuate flanks of frame, make
Camera module 1 can more be bonded the setting of 9 edge of frame, to be conducive to reduce the size of non-display area on electronic equipment.That is,
The design of the mould group can make the mould group closer to the electronic equipment edge, so that electronic equipment screen accounting is higher.
In the embodiment shown in fig. 5, the front of electronic equipment has display area D1 and non-display area F1, images mould
The camera lens 400 of group 1 is opposite with non-display area F1.First mounting wall 111 of the first assembling parts 100 of camera module 1 is close
The upper side edge or lower side of frame 9 are arranged.Since the thickness of the first mounting wall 111 can be set to be less than minimum bonding width,
Namely compared with prior art, the distance between camera lens 400 and the upper side edge of frame 9 or lower side can be smaller, thus favorably
In the edge of reduction display area D1 to the distance between 9 upper side edge of frame or lower side.
In the embodiment shown in fig. 6, the front of electronic equipment has display area D2 and non-display area F2, images mould
The camera lens 400 of group 1 is opposite with non-display area F2.First mounting wall 111 of the first assembling parts 100 of camera module 1 is close
The left side or right edge of frame 9 are arranged.Since the thickness of the first mounting wall 111 can be set to be less than minimum bonding width,
Namely compared with prior art, the distance between camera lens 400 and the left side of frame 9 or right edge can be smaller, thus favorably
In the edge of reduction display area D2 to the distance between 9 left side of frame or right edge.
In further embodiments, as shown in Figure 7,8, the side of the frame 9 of electronic equipment is arc-shaped, and electronic equipment is just
Face has display area D3 and non-display area F3, and the camera lens 400 of camera module 1 is opposite with non-display area F3.Such as Fig. 8 institute
Show, the first mounting wall 111 of the support portion 110 of the first assembling parts 100 of camera module 1 is incompletely set to the second assembled portion
On part 200, so that the side shape of camera module 1 is step-like, the first mounting wall 111 is arranged close to the arcuate flanks of frame 9, takes the photograph
As the step-like side of mould group 1 preferably coincide with the frame of arc 9.Compared with the existing technology, the first assembling parts 100 can be with
Can be smaller closer to frame 9 namely the distance between camera lens 400 and frame 9, to be conducive to reduce the side of display area D3
Edge is the distance between to frame 9.
In further embodiments, the frame 9 of electronic equipment is arc-shaped, and the front of electronic equipment has display area and non-
The camera lens 400 of display area, camera module 1 is opposite with non-display area, and wherein camera module is as shown in Figure 9.Camera module 1
First mounting wall 111 of the support portion 110 of the first assembling parts 100 is incompletely set on the second assembling parts 200, thus the
The side shape of one assembling parts 100 and the second assembling parts is step-like.The pedestal branch of the pedestal 202 of second assembling parts 200
The first mounting wall of pedestal 2121 of support part 212 is incompletely set on wiring board 201, the side of the second assembling parts 200 also shape
Stepped.First mounting wall 111 and the first mounting wall of pedestal 2121 are arranged close to frame 9, thus 1 double layers table of camera module
The side of scalariform preferably coincide with the frame of arc 9.Compared with the existing technology, the first assembling parts 100 can be closer to side
Frame 9 namely the distance between camera lens 400 and frame 9 can be smaller, to be conducive to reduce the edge of display area D3 to frame
The distance between 9.
The present invention also provides the assemble methods of above-mentioned camera module 1 (including 1a, 1b, 1c), comprising the following steps:
Bonding agent 8 is arranged in three sides on 200 1 surface of the second assembling parts, as shown in figure 12 in S1；
The second assembling parts 200 are arranged in second mounting wall 112 of the support portion 110 of the first assembling parts 100 by S2
On bonding agent 8, the first mounting wall 111 is corresponding with the side of the not set binder of the second assembling parts 200；
S3 solidifies bonding agent 8, so that the first assembling parts 100 are connect with the second assembling parts 200, first group at this time
Filling has gap between the first mounting wall 111 and the second assembling parts 200 of the support portion 110 of component 100, as shown in figure 13；
S4 seals the gap between the first mounting wall 111 and the second assembling parts 200.
When connecting the first assembling parts 100 and the second assembling parts 200, in such a way that glue is drawn in three faces, first by second
Three sides of assembling parts 200 are connect to fix the first assembling parts and the second assembling by binder with the first assembling parts 100
Component, then the gap of the other side seals by other means, avoids being contaminated inside camera module 1, wide to connection when sealing
No requirement (NR) is spent, so that the thickness of the first mounting wall 111 of the first assembling parts 100 is less than minimum adhesion width.
In some embodiments, step S4 seals the first mounting wall 111 and the second assembled portion using mode for dispensing glue is tilted
Gap between part 200.
In some embodiments, in step S4 using can be thermally cured or the first mounting wall of resin seal 111 of ultra-violet curing
With the gap between the second assembling parts 200.The resin that sealing off gap uses in step S4 can be identical as bonding agent 8, can also
With difference.
In some embodiments, the bonding agent in step S1 is that can be thermally cured or the resin of ultra-violet curing.When in step S1
Bonding agent when being heat-setting resin, in step S3, solidify bonding agent by way of heated baking, at this point, first
Gap between mounting wall 111 and the second assembling parts 200 can be used as venthole when heating.In the prior art, microscope base and line
When road plate connects, the surrounding of wiring board is respectively provided with bonding agent, and when microscope base is placed in the circuit board, surrounding is contacted with bonding agent,
Therefore there is no gap that can ventilate between microscope base and wiring board, in order to avoid air expansion when heated baking inside camera module
Device is had an impact, needs that venthole is arranged on microscope base.That is, also helping simplified mirror using assemble method of the invention
The structure of seat.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (21)
1. a kind of camera module, including the first assembling parts, the second assembling parts, sensitive chip and it is in the sensitive chip
Camera lens on entering light path, the camera lens are installed on first assembling parts, and the sensitive chip is set to second assembling
Component, which is characterized in that
The edge of first assembling parts has the support portion extended to second assembling parts direction, the support
Portion includes the first mounting wall and the second mounting wall, and the support portion is set on second assembling parts, second peace
Dress wall is connect with second assembling parts by bonding agent, close between first mounting wall and second assembling parts
The connection width of envelope, first mounting wall and second assembling parts is less than second mounting wall and second assembling
The connection width of component.
2. camera module according to claim 1, which is characterized in that second mounting wall is in U-shape, first installation
Wall is in linear type, and first mounting wall and second mounting wall, which surround, forms the support portion.
3. camera module according to claim 1, which is characterized in that first mounting wall and second assembling parts
Between by sealing glue sealing, the sealing glue extends to the side walls of second assembling parts.
4. camera module according to claim 1, which is characterized in that the camera module further includes optical filter, and described
One assembling parts or second assembling parts are equipped with the platform for installing the optical filter, and the platform is by the optical filtering
Piece is maintained between the camera lens and the sensitive chip, and the platform has light hole, the optical filter and the light hole
Relatively.
5. camera module according to claim 1, which is characterized in that the camera lens includes at least one with free form surface
Lens, the lens with free form surface make the imaging region of the camera lens inclined relative to the geometrical central axis of the camera lens
It moves, to keep the imaging region of the camera lens corresponding with the sensitive chip.
6. camera module according to claim 5, which is characterized in that near the one of the sensitive chip on the camera lens
The image side surface of lens is free form surface.
7. -6 any camera module according to claim 1, which is characterized in that
The thickness of first mounting wall is less than the thickness of second mounting wall；
Alternatively, first mounting wall is incompletely set on second assembling parts, so that the side of the camera module
It is formed step-like.
8. -6 any camera module according to claim 1, which is characterized in that first assembling parts are microscope base, institute
Stating the second assembling parts is wiring board, and the support portion extends from the edge of the microscope base to the wiring board, the branch
Support part is opposite with the upper surface of the wiring board, and the thickness of first mounting wall is less than the thickness of second mounting wall.
9. camera module according to claim 8, which is characterized in that the geometrical central axis of the camera lens is relative to described
Axially the first mounting wall offset of the geometric center of one assembling parts outline border.
10. camera module according to claim 9, which is characterized in that the wiring board is except the sensitive chip
In region, the width of side is less than the width of other three sides, is not provided with electronics member device in the smallest side of route board width
Part, or the electronic component on the route board width minimum side quantity less than other sides electronic component number
Amount.
11. camera module according to claim 9, which is characterized in that the geometrical central axis of the light hole is relative to institute
State geometric center axially the first mounting wall offset of the first assembling parts outline border；Alternatively, the optical filter is equipped with bias
Light shield layer, geometric center axial direction institute of the geometrical central axis of the transmission region within the light shield layer relative to the optical filter
State the offset of the first mounting wall.
12. -6 any camera module according to claim 1, which is characterized in that first assembling parts are microscope base, institute
Stating the second assembling parts includes wiring board and the pedestal on the wiring board, and the sensitive chip is set to the route
Plate, the support portion extend from the edge of the microscope base to the pedestal, and first mounting wall is incompletely set to institute
State on pedestal, thus the side of the camera module formed it is step-like.
13. camera module according to claim 12, which is characterized in that the wiring board is except the sensitive chip
In region, the width of side is less than the width of other three sides, is not provided with electronics member device in the smallest side of route board width
Part, or the electronic component on the route board width minimum side quantity less than other sides electronic component number
Amount.
14. camera module according to claim 12, which is characterized in that the edge of the pedestal has to the line
The pedestal support portion that road plate direction extends, the pedestal support portion includes the second mounting wall of the first mounting wall of pedestal and pedestal,
The connection width of first mounting wall of pedestal and the wiring board is less than second mounting wall of pedestal and the wiring board
Width is connected, second mounting wall of pedestal is connect with the wiring board by bonding agent, first mounting wall of pedestal and institute
The gap stated between wiring board is sealed.
15. camera module according to claim 14, which is characterized in that first mounting wall and the pedestal first are pacified
Dress wall is in the same side of the camera module.
16. camera module according to claim 14, which is characterized in that second mounting wall of pedestal is in U-shape, the bottom
The first mounting wall of seat is in linear type, and second mounting wall of pedestal and first mounting wall of pedestal, which surround, forms the pedestal
Support portion.
17. a kind of electronic equipment, which is characterized in that including the camera module as described in claim 1-16 is any.
18. electronic equipment according to claim 17, which is characterized in that the electronic equipment further includes frame, and described
One mounting wall is arranged close to the frame.
19. electronic equipment according to claim 18, which is characterized in that the side of the frame is arc-shaped, and described first
Arcuate flanks of the mounting wall close to the frame.
20. a kind of assemble method of the camera module as described in claim 1-16 is any, which is characterized in that including following step
It is rapid:
S1. bonding agent is set in three sides on one surface of the second assembling parts；
S2., second mounting wall of the support portion of first assembling parts is arranged in the bonding of second assembling parts
In agent, first mounting wall is corresponding with the side of the not set binder of the second assembling parts；
S3. solidify the bonding agent, so that first assembling parts are connect with second assembling parts；
S4. the gap between first mounting wall and second assembling parts is sealed.
21. assemble method according to claim 20, which is characterized in that in the step S4, using inclination side for dispensing glue
Formula seals the gap between first mounting wall and second assembling parts.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910053978.7A CN109743482A (en) | 2019-01-21 | 2019-01-21 | The assemble method and electronic equipment of camera module, camera module |
| PCT/CN2020/070335 WO2020151481A1 (en) | 2019-01-21 | 2020-01-03 | Image capturing module, assembly method for image capturing module, and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910053978.7A CN109743482A (en) | 2019-01-21 | 2019-01-21 | The assemble method and electronic equipment of camera module, camera module |
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| CN109743482A true CN109743482A (en) | 2019-05-10 |
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| CN201910053978.7A Pending CN109743482A (en) | 2019-01-21 | 2019-01-21 | The assemble method and electronic equipment of camera module, camera module |
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| CN110868530A (en) * | 2019-11-25 | 2020-03-06 | 维沃移动通信有限公司 | Camera module and electronic equipment |
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