WO2023045679A1

WO2023045679A1 - Camera module and electronic device

Info

Publication number: WO2023045679A1
Application number: PCT/CN2022/114335
Authority: WO
Inventors: 于男军; 曹毅; 张为波
Original assignee: 荣耀终端有限公司
Priority date: 2021-09-26
Filing date: 2022-08-23
Publication date: 2023-03-30
Also published as: CN115022491A; CN115022491B

Abstract

A camera module and an electronic device, relating to the technical field of electronic products. The camera module can reduce the size of the camera module while ensuring an imaging effect of the camera module, thereby facilitating reducing a frame width of the electronic device and improving a screen-to-body ratio of the electronic device. The camera module comprises a lens and a photosensitive chip, the photosensitive chip is located on a light emitting side of the lens, a surface of one side of the photosensitive chip facing the lens comprises a first photosensitive region, an effective photosensitive region is provided in the first photosensitive region, and the area of the effective photosensitive region is less than that of the first photosensitive region; a projection range of light passing through the lens on the surface of one side of the photosensitive chip facing the lens forms an imaging region, the effective photosensitive region is located in the imaging region, and a part of the first photosensitive region is located outside the imaging region.

Description

Camera modules and electronics

This application claims the priority of the Chinese patent application with the application number 202111130259.4 and the title of the invention "camera module and electronic equipment" submitted to the State Intellectual Property Office on September 26, 2021, and submitted to the State Intellectual Property Office on November 25, 2021. Intellectual Property Office, the priority of the Chinese patent application with application number 202111416232.1 and the title of the invention "camera module and electronic equipment", the entire content of which is incorporated in this application by reference.

technical field

The present application relates to the technical field of electronic products, in particular to a camera module and electronic equipment.

Background technique

With the development of science and technology, the demand for telecommuting is becoming stronger and stronger, and users have higher and higher requirements for imaging effects of camera modules in electronic devices such as personal computers (personal computers, PCs). However, the better the imaging effect of the camera module, the larger the size of the camera module, which is not conducive to reducing the frame width of the electronic device, and is not conducive to increasing the screen-to-body ratio of the electronic device.

Contents of the invention

The present application provides a camera module and an electronic device, which can reduce the size of the camera module while ensuring the imaging effect of the camera module, which is beneficial to reducing the frame width of the electronic device and increasing the screen ratio of the electronic device.

In order to achieve the above object, the embodiments of the present application adopt the following technical solutions:

In a first aspect, the present application provides a camera module, the camera module includes: a lens and a photosensitive chip, the photosensitive chip is located on the light emitting side of the lens, and the surface of the photosensitive chip facing the lens includes a first photosensitive area, the first photosensitive area There is an effective photosensitive area inside, the area of the effective photosensitive area is smaller than the area of the first photosensitive area, the projection range of the light passing through the lens on the surface of the photosensitive chip facing the lens forms an imaging area, and the effective photosensitive area is located in the imaging area, and A portion of the first photosensitive area is outside the imaging area. In this way, it can be ensured that the effective photosensitive area on the photosensitive chip can be covered by the imaging area of the lens on the surface of the photosensitive chip facing the lens, which can reduce the redundant size of the lens while ensuring the shooting effect of the camera module. Furthermore, the width of the camera module can be reduced, which is beneficial to reduce the width of the frame and increase the screen-to-body ratio.

In a possible design manner of the first aspect, the imaging area is circular, and the effective photosensitive area is inscribed on the outer contour of the imaging area. At this time, the radius of the imaging area of the lens is equal to 1/2 of the diagonal of the effective photosensitive area. That is to say, the projection area of the light passing through the lens on the photosensitive chip is covered according to the area of the effective photosensitive area. In this way, the redundancy of the size of the lens can be effectively eliminated, and the size of the lens can be further reduced, thereby further reducing the width of the camera module, which is beneficial to further reducing the width of the frame and increasing the screen-to-body ratio.

In a possible design manner of the first aspect, the geometric center of the effective photosensitive area coincides with the geometric center of the first photosensitive area.

In a possible design mode of the first aspect, the first photosensitive area and the effective photosensitive area are both rectangular, the long side of the effective photosensitive area is parallel to the long side of the first photosensitive area, and the wide side of the effective photosensitive area is parallel to the long side of the second photosensitive area. The wide sides of a photosensitive area are parallel. In this way, the area of the effective photosensitive region can be increased, the utilization rate of the first photosensitive region can be improved, and the imaging effect can be improved.

In a possible design manner of the first aspect, the aspect ratio of the effective photosensitive area is 16:9. In this way, the aspect ratio of the effective photosensitive area can be adapted to the aspect ratio of the video output mode supported by the third-party application program.

In a possible design of the first aspect, the aspect ratio of the first photosensitive area is 4:3, and the aspect ratio of the effective photosensitive area is 16:9. In this way, the aspect ratio of the effective photosensitive area can be adapted to the aspect ratio of the video output mode supported by the third-party application program. Compared with customizing photosensitive chips of corresponding specifications and models, it can reduce production costs and shorten the production cycle. At the same time, image quality is guaranteed.

In a possible design manner of the first aspect, the resolution of the effective photosensitive area is 2560*1440. Thus, the imaging effect of the camera module can be improved, so that the electronic equipment with the camera module can support high-definition video calls and improve call quality.

In a possible design manner of the first aspect, the resolution of the first photosensitive area is 2592*1944, and the resolution of the effective photosensitive area is 2560*1440. In this way, the photosensitive units in the first photosensitive area can be fully utilized, the imaging pixels of the lens can be increased to the greatest extent, and the imaging quality can be improved. Compared with the camera module supporting the same video image resolution, the camera module in this embodiment The small size can realize the miniaturization design of the camera module.

In a possible design manner of the first aspect, the resolution of the first photosensitive area is 4160*3120, and the resolution of the effective photosensitive area is 3840*2160.

In a possible design manner of the first aspect, the resolution of the first photosensitive area is 4160*3120, and the width of the camera module is less than or equal to 4.1mm. As a result, the width of the camera module is reduced, which is beneficial to reducing the frame width of the electronic device and increasing the screen-to-body ratio of the electronic device.

In a possible design manner of the first aspect, the width of the camera module is less than or equal to 3.85mm.

In a possible design manner of the first aspect, the width of the camera module is 3.8mm, 3.75mm or 3.7mm.

In a possible design manner of the first aspect, the height of the camera module is less than or equal to 3.2mm. As a result, the thickness of the frame can be reduced, and further the thickness of the display can be reduced, which is beneficial to realize the light and thin design of the electronic equipment.

In a possible design manner of the first aspect, the height of the camera module is less than or equal to 3.5mm. As a result, the thickness of the frame can be further reduced, and the thickness of the display can be further reduced, which is beneficial to realize the light and thin design of the electronic device.

In a possible design manner of the first aspect, the height of the camera module is less than or equal to 3.2mm. As a result, the thickness of the frame can be further reduced, and the thickness of the display can be further reduced, which is beneficial to realize the light and thin design of the electronic device.

In a possible design manner of the first aspect, the height of the camera module is 3.5mm, 3.4mm, 3.3mm, 3.15mm, 3.1mm, 3.08mm, 3.05mm, 3.02mm or 3.0mm.

In a possible design of the first aspect, there are a plurality of photosensitive units arranged in an array in the first photosensitive area, and each photosensitive unit can be turned on and off independently. In this way, when the camera module is working, it can control the photosensitive units in the effective sensing area to be turned on, and the photosensitive units outside the effective sensing area to be turned off. Thus, the adjustment and control of the photosensitive area of the photosensitive chip can be realized conveniently, and the reliability of the photosensitive chip can be improved.

In a possible design manner of the first aspect, it also includes: an acquisition module and a first processing module, the acquisition module is used to acquire the original image collected by the camera module; the first processing module is electrically connected to the acquisition module, and is used for The original image acquired by the acquisition module is processed to obtain a first processed image, and the resolution of the first processed image is greater than that of the original image. In this way, the original image can be processed by the first processing module, the resolution of the captured image can be improved, and the shooting effect of the camera module can be improved.

In a possible design of the first aspect, the acquisition module includes an image signal processing unit, a digital signal processing unit, and a reading unit. The image signal processing unit is electrically connected to the photosensitive chip, the digital signal processing unit is electrically connected to the image signal processing unit, and the reading unit is electrically connected to the digital signal processing unit.

In a possible design manner of the first aspect, the resolution of the first processed image is equal to the resolution of the first photosensitive area.

In a possible design of the first aspect, the camera module further includes: an acquisition module, an identification module, an extraction module and a second processing module, the acquisition module is used to acquire the original image collected by the camera module; The modules are electrically connected, and the identification module is used to identify preset features in the original image; the extraction module is electrically connected to the identification module, and the extraction module is used to extract the preset features identified by the identification module; the second processing module is electrically connected to the extraction module, and the second The processing module processes the preset features extracted by the extraction module to obtain a second processed image, and the definition of the second processed image is greater than that of the original image. In this way, the clarity of the captured image can be improved, and the shooting effect of the camera module can be improved.

In a possible design manner of the first aspect, the preset feature is a human face feature.

In a possible design of the first aspect, the camera module further includes a third processing module, the third processing module is electrically connected to the second processing module, and the third processing module is used to process the second processed image to obtain A third processed image, the resolution of the third processed image is higher than the resolution of the second processed image. In this way, the definition of the captured image can be improved through the second processing module, and the resolution of the image can be improved through the third processing module, thereby further improving the shooting effect of the camera module.

In a possible design manner of the first aspect, the resolution of the third processed image is equal to the resolution of the first photosensitive area.

In a second aspect, the present application provides an electronic device, including: a display and a camera module, the display has a display area and a non-display area; the camera module is the camera module described in any one of the above-mentioned first aspects , the camera module is located in the non-display area.

In a possible design of the second aspect, the display includes: a screen; a frame, the frame is arranged around the edge of the screen, and a mounting hole is provided on the frame, and the light incident surface of the camera module is opposite to the mounting hole.

In a possible design manner of the second aspect, the width of the frame is less than or equal to 8.75mm.

In a possible design manner of the second aspect, the width of the frame is less than or equal to 8.5mm.

In a possible design manner of the second aspect, the electronic device further includes a keyboard host, and the keyboard host is rotatably connected to the display.

It can be understood that, for the beneficial effects achieved by the electronic device of the second aspect provided above, reference may be made to the beneficial effects in the first aspect and any possible design manner thereof, which will not be repeated here.

In the third aspect, the present application provides an image processing method for processing the original image acquired by the camera module in any of the above technical solutions, including: processing the original image to obtain the target image, the resolution of the target image is greater than The resolution of the original image. In this way, the resolution of the original image can be increased, and the shooting effect of the camera module can be improved.

In a possible design of the third aspect, the original image includes preset features, and processing the original image includes: extracting preset features, processing the preset features to obtain a first image, and the preset features in the first image It is assumed that the definition of the feature is greater than the definition of the preset feature in the original image; the first image is processed to obtain the target image.

In a possible design manner of the third aspect, the preset feature is a human face feature.

In a possible design manner of the third aspect, a face AI model is used to process the face features in the original image.

In a possible design of the third aspect, the resolution of the original image is equal to the resolution of the effective photosensitive area, and the resolution of the target image is equal to the resolution of the first photosensitive area.

In a fourth aspect, the present application provides an electronic device, including: one or more processors; a memory; wherein, one or more computer programs are stored in the memory, and the one or more computer programs include instructions. When the instructions are executed by the electronic device When executed, the electronic device is made to execute the image processing method described in any one of the above third aspects.

In the fifth aspect, there is provided a computer-readable storage medium, the computer-readable storage medium stores instructions, and when it is run on a computer, the computer can perform the image processing described in any one of the above-mentioned third aspects method.

A sixth aspect provides a computer program product containing instructions, which when run on a computer enables the computer to execute the image processing method described in any one of the above third aspects.

It can be understood that the computer storage medium described in the fourth aspect, the computer program product described in the fifth aspect, and the computer program product described in the sixth aspect provided above are all used to execute the corresponding method provided above, Therefore, the beneficial effects that it can achieve can refer to the beneficial effects in the corresponding method provided above, and will not be repeated here.

Description of drawings

FIG. 1 is a schematic structural diagram of an electronic device provided by some embodiments of the present application;

FIG. 2 is a schematic structural diagram of a display of the electronic device shown in FIG. 1;

Figure 3 is an exploded view of the display shown in Figure 2;

Fig. 4 is a sectional view along the P-P line of the structural schematic diagram shown in Fig. 2;

FIG. 5 is a perspective view of the keyboard host of the electronic device shown in FIG. 1;

Fig. 6 is a sectional view along the line A-A of the perspective view shown in Fig. 5;

7 is a perspective view of a camera module provided by some embodiments of the present application;

Figure 8 is an exploded view of the camera module shown in Figure 7;

Fig. 9 is a top view of the camera module shown in Fig. 7;

Fig. 10 is a sectional view along the B-B line of the top view shown in Fig. 9;

Fig. 11 is a sectional view along the C-C line of the top view shown in Fig. 9;

Figure 12 is a schematic diagram of the arrangement of photosensitive units in a photosensitive chip provided by some embodiments of the present application;

Fig. 13 is a schematic structural view of the imaging area of the lens and the first photosensitive area of the photosensitive chip in some embodiments of the present application;

Fig. 14 is a schematic structural diagram of the imaging area of the lens and the first photosensitive area of the photosensitive chip in other embodiments of the present application;

Fig. 15a is a schematic diagram of the module structure of the camera module provided by some embodiments of the present application;

Fig. 15b is a working flowchart of the camera module shown in Fig. 15a;

Fig. 16a is a schematic diagram of the module structure of the camera module provided by other embodiments of the present application;

Fig. 16b is a working flowchart of the camera module shown in Fig. 16a;

Fig. 17a is a schematic diagram of the module structure of the camera module provided by some other embodiments of the present application;

Fig. 17b is a working flowchart of the camera module shown in Fig. 17a;

FIG. 18 is a schematic flowchart of an image processing method provided by some embodiments of the present application;

FIG. 19 is a schematic flow chart of an image processing method provided by other embodiments of the present application.

100. Electronic equipment;

1. Display; 11. Display area; 12. Non-display area; 13. Border; 131. Mounting hole; 14. Screen; 141. Transparent cover; 142. Display; 15. Back case; 151. Back cover; 152, side frame;

2. Keyboard host;

21. Shell; 21a, accommodation space; 211, C shell; 211a, second avoidance opening; 212, D shell; 2121, first wall plate; 213, raised part; ; 213a1, the inner bottom wall; 213a2, the inner side wall; 213b, the first cooling hole; 214, the anti-skid structure; 215, the air inlet; 2151, the air inlet; 216, the second cooling hole;

22. The middle plate; 22a. The first avoidance;

23, keyboard; 231, fixed plate; 232, button;

24. Main board;

3. Camera module;

31. Mounting seat; 311. Light transmission hole; 32. Lens; 32a, light-incoming surface; 32b, light-emitting surface; 321. lens barrel; 322. lens; 33. optical filter; 34. photosensitive chip; 341. first Photosensitive area; 341a, photosensitive unit; 342, effective photosensitive area; 35, circuit board; 351, first surface; 352, second surface; 36, viscose;

301. Acquisition module; 301a, image signal processing unit; 301b, digital signal processing unit; 301c, reading unit;

302. The first processing module;

303. The second processing module;

304. Identification module;

305. Extract module;

306. A third processing module.

Detailed ways

In this embodiment of the application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance or implicitly indicating the indicated The number of technical characteristics. Thus, a feature defined as "first", "second", "third" and "fourth" may expressly or implicitly include one or more of such features.

In the embodiments of the present application, the term "comprising", "comprising" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements, but also includes Including other elements not expressly listed, or also including elements inherent in such process, method, article or apparatus. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element.

In the embodiment of this application, "and/or" is just a kind of relationship describing the relationship between related objects, which means that there may be three kinds of relationships, for example, A and/or B, which can mean that A exists alone, and A and B exist at the same time. B, there are three situations of B alone. In addition, the character "/" in this article generally indicates that the contextual objects are an "or" relationship.

The present application provides an electronic device, which is a type of electronic device with a camera module. Specifically, the electronic device includes, but is not limited to, a notebook computer (notebook), a tablet computer (tablet personal computer), a laptop computer (laptop computer), a personal digital assistant (personal digital assistant, PDA), a personal computer (personal computer, PC), automotive equipment, mobile phones and wearable devices and other electronic devices.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of an electronic device 100 provided by some embodiments of the present application. In this embodiment, the electronic device 100 is a notebook computer. Specifically, the electronic device 100 includes a display 1 and a keyboard host 2 .

The display 1 is used to display images, videos and the like. The keyboard host 2 is rotatably connected to the display 1 . The keyboard host 2 is used to input instructions and data, and controls the display 1 to display images and videos according to the input instructions and data. Meanwhile, the keyboard host 2 is also used to play voice or music.

The electronic device 100 is switchable between an open state and a closed state. When the electronic device 100 is in an open state, the display 1 and the keyboard host 2 form an angle greater than 0° and less than 180°. When the electronic device 100 is in a closed state, the display 1 is covered on the main keyboard 2 , and the display surface of the display 1 is opposite to the keyboard 23 of the main keyboard 2 .

In order to facilitate the description of the following embodiments, an XYZ coordinate system is established for the display 1 . Specifically, define the extension direction of the rotation axes of the keyboard host 2 and the display 1 as the X-axis direction, the thickness direction of the display 1 as the Z-axis direction, and the direction perpendicular to both the X-axis direction and the Z-axis direction as the Y-axis direction. It can be understood that the setting of the coordinate system of the display 1 can be flexibly set according to actual needs, which is not specifically limited here.

Please refer to FIGS. 2-3 , FIG. 2 is a perspective view of the display 1 of the electronic device 100 shown in FIG. 1 , and FIG. 3 is an exploded view of the display 1 shown in FIG. 2 . It should be noted that FIGS. 2-3 only schematically show some components included in the display 1, and the actual shape, actual size, actual position and actual structure of these components are not affected by FIGS. 2 and 3 and the following drawings. limited.

In this embodiment, please refer to FIG. 3-FIG. 4. FIG. 4 is a cross-sectional view along the line P-P of the structural schematic diagram shown in FIG. 2 . The display 1 includes a frame 13 , a screen 14 and a back shell 15 . The frame 13 is formed as a rectangular frame structure. The length direction of the frame 13 is parallel to the X-axis direction, the width direction of the frame 13 is parallel to the Y-axis direction, and the thickness direction of the frame 13 is parallel to the Z-axis direction. Please refer to Fig. 4, the frame 13 has a first side wall 13b and a second side wall 13a opposite in the direction of the Y axis, the first side wall 13b is rotatably connected with the keyboard host 2, and the second side wall 13a is provided with Mounting hole 131 .

The screen 14 is used to display images, videos, documents, web pages and the like. The screen 14 can be fixedly connected to the frame 13 by glue. The area of the screen 14 exposed to the frame 13 forms the display area 11 of the display 1 , and the frame structure of the frame 13 constitutes the non-display area 12 of the display 1 .

Referring to FIG. 4 , the screen 14 includes a transparent cover 141 and a display screen 142 (English name: panel, also called a display panel). The transparent cover 141 and the display screen 142 are stacked. The transparent cover 141 is mainly used for protecting and dustproofing the display screen 142 . The material of the transparent cover 141 includes but not limited to glass. The display screen 142 may be a flexible display screen or a rigid display screen. For example, the display screen 142 can be an organic light-emitting diode (organic light-emitting diode, OLED) display, an active matrix organic light-emitting diode or an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode, AMOLED) Display, mini organic light-emitting diode display, micro organic light-emitting diode display, micro organic light-emitting diode display, quantum dot light-emitting diode (quantum dot light emitting diodes, QLED) display, liquid crystal display (liquid crystal display, LCD).

The back case 15 is used to protect internal electronic components of the electronic device 100 . The back shell 15 includes a back cover 151 and a side frame 152 . The back cover 151 is located on the side of the display screen 142 away from the transparent cover 141 , and is stacked with the transparent cover 141 and the display screen 142 . The side frame 152 is located between the back cover 151 and the frame 13 , and the side frame 152 is fixed on the back cover 151 . Exemplarily, the side frame 152 may be fixedly connected to the back cover 151 by glue. The side frame 152 can also be integrally formed with the back cover 151 , that is, the side frame 152 and the back cover 151 form an integral structure. The frame 13 is fixed on the side frame 152 . In some embodiments, the frame 13 can be fixed on the side frame 152 by glue. The frame 13 , the back cover 151 and the side frame 152 enclose the internal storage space of the display 1 .

The camera module 3 is used to collect photos/videos. Please refer to Fig. 4, the camera module 3 is arranged on the peripheral side of the screen 14, specifically, the camera module 3 is fixed in the mounting hole 131 on the frame 13 on the peripheral side of the screen 14, and the light incident surface of the camera module 3 is connected to the The display surface of the screen 14 faces the same side. Exemplarily, the camera module 3 can be fixed in the installation hole 131 by means of threaded connection, clamping, welding, magnetic attraction and the like. It can be understood that, in some other embodiments, the camera module 3 can also be arranged on the back side of the screen 14, the light incident surface of the camera module 3 is opposite to the screen 14, and the light incident surface of the camera module 3 on the screen 14 A light-transmitting window is set in the area opposite to each other, thereby forming an under-screen camera.

Please refer to FIG. 5 . FIG. 5 is a perspective view of the keyboard main body 2 of the electronic device 100 shown in FIG. 1 , and FIG. 6 is a cross-sectional view along line A-A of the perspective view shown in FIG. 5 . In this embodiment, the keyboard host 2 includes a housing 21 , a middle board 22 , a keyboard 23 and a main board 24 . It should be noted that FIGS. 5-6 only schematically show some components included in the keyboard main unit 2, and the actual shape, actual size, actual position and actual structure of these components are not affected by FIGS. Figure limited.

The casing 21 is used to protect the internal structure of the keyboard host 2 . The housing 21 can be a structural whole, or can be formed by assembling a plurality of parts. In some embodiments, referring to FIGS. 5-6 , the shell 21 includes a C shell 211 and a D shell 212 . The C shell 211 is combined with the D shell 212 to enclose the inner accommodation space 21 a of the housing 21 . The C shell 211 and the D shell 212 can be fixed by clamping, can also be fixed by glue, and can also be fixed by screw connection, which is not specifically limited here.

The middle plate 22 is located in the inner accommodation space 21 a of the casing 21 . The middle plate 22 is fixed on the inner surface of the C shell 211 by means of gluing, clamping, screwing, riveting and the like. In other embodiments, the middle board 22 may also be fixed on the inner surface of the D shell 212 . The material of the middle board 22 includes but not limited to plastic and metal. The middle board 22 is used as a supporting "skeleton" for the electronic components in the main keyboard 2 . The keyboard 23 and the cooling module 25 are directly or indirectly fixed on the middle board 22 .

The keyboard 23 is used to input instructions and data. The keyboard 23 includes a fixed board 231 and a plurality of keys 232 connected to the fixed board 231 . Please refer to FIG. 6 , the fixing plate 231 is fixed on the middle plate 22 . The middle plate 22 is provided with a first escape opening 22a. The position corresponding to each key 232 on the C shell 211 is provided with a second avoidance opening 211a. The button 232 protrudes out of the C-shell 211 through the first avoidance opening 22a and the second avoidance opening 211a corresponding to the button 232 .

The main board 24 is used for integrating the control chip. The control chip can include a central processing unit (central processing unit, CPU), a graphics processing unit (graphics processing unit, GPU), an application processor (application processor, AP), double data rate synchronous dynamic random access memory (double data rate , DDR) and universal flash storage (universal flash storage, UFS), etc.

The main board 24 may be a rigid circuit board, may also be a flexible circuit board, and may also be a flexible and rigid circuit board. The main board 24 may be an FR-4 dielectric board, or a Rogers (Rogers) dielectric board, or a mixed media board of FR-4 and Rogers, and so on. Here, FR-4 is a code name of a flame-resistant material grade, and Rogers dielectric board is a high-frequency board. The main board 24 can be electrically connected with the display screen 142 and the camera module 3 to store and process the image information acquired by the camera module 3 , and can send the image information to the screen 14 for display.

Please refer to FIGS. 7-8 . FIG. 7 is a perspective view of the camera module 3 provided by some embodiments of the present application, and FIG. 8 is an exploded view of the perspective view shown in FIG. 7 . At least part of the camera module 3 is disposed in the mounting hole 131 on the frame 13 . The light incident surface 32 a of the camera module 3 is opposite to the installation hole 131 . In this embodiment, the camera module 3 includes a mount 31 , a lens 32 , a filter 33 , a photosensitive chip 34 and a circuit board 35 .

It should be noted that FIGS. 7-8 only schematically show some components included in the camera module 3, and the actual shape, actual size, actual position and actual configuration of these components are not affected by FIGS. Drawings are limited. In addition, the coordinate system in FIGS. 7-8 is represented as the same coordinate system as the coordinate system in FIG. 1 . That is to say, the azimuth relationship of each component in the camera module 3 shown in FIG. 7-8 in the coordinate system shown in FIG. The orientation relationship of each component in the coordinate system shown in Fig. 1 is the same. The coordinate system in the drawings of the various components in the camera module 3 described later is also represented as the same coordinate system as the coordinate system in the camera module 3 shown in Figures 7-8, and the "same coordinate system" is the same as above The coordinate system should be understood in the same way, and will not be described in detail later.

In addition, the "top" used to describe the components in the camera module 3 below means that when the camera module 3 is applied to the electronic device 100 shown in FIG. ” means that when the camera module 3 is applied to the electronic device 100 shown in FIG. Specific orientation configurations and operations, therefore, are not to be construed as limitations on the application.

The mount 31 is used to fix the lens 32 , the filter 33 and the circuit board 35 . Please refer to Figures 9-11, Figure 9 is a top view of the camera module 3 shown in Figure 7, Figure 10 is a cross-sectional view along line B-B in Figure 9, Figure 11 is a cross-sectional view along line C-C in Figure 9. The mounting base 31 is formed as a cuboid cover structure. Referring to FIGS. 10-11 , the bottom of the mounting base 31 is open, and a light-transmitting hole 311 is formed on the top wall of the mounting base 31 . The length direction of the mounting base 31 is parallel to the X-axis direction, the width direction of the mounting base 31 is parallel to the Y-axis direction, and the height direction of the mounting base 31 is parallel to the Z-axis direction. In some other embodiments, the mounting base 31 may also be in the shape of a cube, a cylinder, or the like.

Referring to FIGS. 10-11 , the lens 32 includes a lens barrel 321 and a lens 322 . The lens barrel 321 is used to fix and protect the lens 322 . The lens barrel 321 has a cylindrical structure. That is, both ends of the lens barrel 321 in the optical axis direction are open. The lens 322 is installed in the lens barrel 321 , and the lens 322 can be fixed on the inner wall of the lens barrel 321 by bonding, clamping and other methods. There can be one or more lenses 322 (ie two or more). When there are multiple lenses 322 , the multiple lenses 322 are stacked along the optical axis of the lens 32 . By designing the structural composition of the lenses 322 and the shape and size of each lens 322 , lenses 32 with different characteristics such as standard, wide-angle, and telephoto can be obtained. Wherein, the optical axis direction of the lens 32 is parallel to the Z-axis direction.

Please continue to refer to FIGS. 10-11 , the lens 32 has a light incident surface 32 a and a light exit surface 32 b opposite to each other. The scene light enters the lens 32 through the light incident surface 32 a and exits through the light exit surface 32 b. The lens 32 is installed on the top wall of the mount 31 . Specifically, the lens barrel 321 surrounds the periphery of the light transmission hole, the lens 322 is opposite to the light transmission hole 311 , and the optical axis direction of the lens 32 is consistent with the axial direction of the light transmission hole 311 .

In some embodiments, the lens barrel 321 and the mount 31 are integrally structured. That is, the lens barrel 321 and the mount 31 are integrally formed. In this way, the assembly steps of the camera module 3 can be simplified, and the connection strength between the lens barrel 321 and the mounting seat 31 can be improved.

The circuit board 35 is used for electrical connection with the main board. The circuit board 35 can be a rigid circuit board or a flexible circuit board, and can also be a rigid-flex circuit board. When the circuit board 35 is a flexible circuit board or a rigid-flex circuit board, a hard reinforcement board can be provided to increase the strength of the circuit board 35 . Referring to FIGS. 10-11 , the circuit board 35 has a first surface 351 and a second surface 352 opposite to each other, and the end of the mount 31 away from the lens 32 is fixed on the first surface 351 .

Please continue to refer to FIG. 10-FIG. 11 , the photosensitive chip 34 is used to collect the imaging light beam after being imaged by the lens 32 , and convert the image information carried by the imaging light beam into electrical signals. The photosensitive chip 34 may also be called an image sensor, or may also be called a photosensitive element. The photosensitive chip 34 is located on one side of the lens 32 . Specifically, the photosensitive chip 34 is arranged on the first surface 351 of the circuit board 35, and the side surface of the photosensitive chip 34 away from the first surface 351 includes a first photosensitive area 341, and the first photosensitive area 341 is provided with a plurality of arrays. photosensitive unit 341a.

Please refer to FIG. 12 , which is a schematic diagram of the layout of the photosensitive units 341 a of the photosensitive chip 34 shown in FIG. 11 . In this embodiment, the photosensitive area of each photosensitive unit 341 a of the photosensitive chip 34 is the same. Optionally, each photosensitive unit 341a has the same shape and size. Thus, the structure of the photosensitive chip 34 is simple, easy to process and low in manufacturing cost. It can be understood that, in other embodiments, the photosensitive area of each photosensitive unit 341a may also be different.

Please continue to refer to FIGS. 10-11 , the optical filter 33 is located on the side of the photosensitive chip 34 away from the circuit board 35 , and the optical filter 33 is fixed on the inner peripheral surface of the mounting seat 31 . Specifically, the optical filter 33 is fixed on the inner peripheral surface of the mounting seat 31 by means of gluing, clamping, screwing and the like. In other embodiments, the optical filter 33 can also be fixed on the inner peripheral surface of the mounting base 31 by means of a bracket, and the optical filter 33 can be fixed on the bracket by means of gluing, clamping, screwing, and the like.

The optical filter 33 can be used to filter the stray light in the imaging light beam after being imaged by the lens 32, so as to ensure that the image captured by the camera module 3 has better clarity. The filter 33 includes, but is not limited to, a blue glass filter. For example, the filter 33 can also be a reflective infrared filter, or a double-pass filter. Wherein, the double-pass filter 33 can transmit visible light and infrared light in the imaging beam at the same time, or allow visible light in the imaging beam and light of other specific wavelengths (such as ultraviolet light) to pass through at the same time, or allow infrared light and other light rays to pass through simultaneously. Specific wavelengths of light (such as ultraviolet light) are transmitted simultaneously. In some other embodiments, the camera module 3 may not be provided with the filter 33 .

Referring to FIG. 11 in conjunction with FIG. 9 , the width dimension w1 of the camera module 3 is determined by the larger one of the radial dimension D of the lens 32 and the width dimension w2 of the mount 31 . Wherein, the width dimension w2 of the mount 31 is determined by the width dimension w3 of the photosensitive chip 34 , and the radial dimension D of the lens 32 is determined by the size of the maximum imaging circle of the lens 32 .

In some embodiments, please refer to FIG. 13 . FIG. 13 is a structural diagram of the imaging region 32c1 of the lens 32 on the surface of the photosensitive chip 34 facing the lens 32 and the first photosensitive region 341 of the photosensitive chip 34 in some embodiments. Wherein, the imaging area 32c1 of the lens 32 on the surface of the photosensitive chip 34 facing the lens 32 refers to the orthographic projection of the maximum imaging circle of the lens 32 on the surface of the photosensitive chip 34 facing the lens 32, that is, through The projection range of the light passing through the lens 32 on the plane where the photosensitive chip 34 is located. The imaging area 32c1 has the same shape as the lens 32 . In this embodiment, the imaging area 32c1 is circular. In other embodiments, the imaging area 32c1 of the lens 32 may also be in the shape of a rectangle, a square, an ellipse, or the like. For convenience of description, "the imaging area 32c1 of the lens 32 on the surface of the photosensitive chip 34 facing the lens 32" is referred to as "the imaging area 32c1 of the lens 32" hereinafter.

In order to make full use of the first photosensitive area 341 of the photosensitive chip 34 and improve the imaging quality, the entire area of the first photosensitive area 341 needs to be covered by the imaging area 32c1 of the lens 32 . For example, in the embodiment shown in FIG. 13 , the radius r0 of the imaging area 32c1 of the lens 32 is designed to be equal to half of the diagonal line d0 of the first photosensitive area 341 . The first photosensitive area 341 is inscribed on the outer contour of the imaging area 32c1 of the lens 32 . In this way, all the photosensitive units 341a on the first photosensitive area 341 can be covered by the imaging area 32c1 of the lens 32, which is beneficial to improve the imaging quality.

Under the conditions of the current manufacturing process, since it is necessary to ensure that the imaging area 32c1 of the lens 32 can cover all the photosensitive areas on the photosensitive chip 34 , the width dimension w1 of the camera module 3 is determined by the radial dimension D of the lens 32 .

However, in practical applications, it may occur that the aspect ratio of the video output mode and image display mode supported by the third-party application program on the electronic device 100 does not match the aspect ratio of the first photosensitive region 341 of the photosensitive chip 34 Condition. That is, the aspect ratio of the video output mode and image display mode supported by the third-party application program is different from the aspect ratio of the first photosensitive area 341 of the photosensitive chip 34 . At this time, when the camera module 3 actually forms an image, it will cut out an image that matches the aspect ratio of the video output mode and image display mode supported by the third-party application program from the area covered by the imaging area 32c1 of the lens 32. area to be imaged. Wherein, please refer to FIG. 13 , the cut out area is the effective photosensitive area 342 of the photosensitive chip 34 . The photosensitive chip 34 outputs an image according to the signal value of the effective photosensitive area 342 . At this time, part of the area covered by the imaging area 32c1 of the lens 32 is an invalid imaging area 343 (ie, the area indicated by the shaded part in FIG. 13 ), which causes redundancy in the structure of the lens 32 .

Specifically, in a notebook computer, the aspect ratio of the video output mode supported by a third-party application program (such as skype, Tencent meeting, welink meeting, etc.) that supports video calling (or video display) is usually 16:9, and the resolution The photosensitive chip 34 with an aspect ratio of 16:9, due to the small demand, high production cost, and incomplete models, in practical applications, it may not be possible to find videos with the same aspect ratio and resolution as third-party applications. The output mode matches the photosensitive chip 34 .

Exemplary, there is no photosensitive chip 34 with an aspect ratio of 16:9 and a resolution of 5M (500W pixels) in the industry. Therefore, if the video image with an aspect ratio of 16:9 is to be output, the aspect ratio is usually selected. A photosensitive chip 34 with a resolution of 4:3 and a resolution of 5M. In this way, compared with customizing the photosensitive chip 34 of corresponding specifications and models, the production cost can be greatly reduced, and the production cycle can be shortened.

However, as mentioned above, in this case, if the entire area of the first photosensitive area 341 is covered by the imaging area 32c1 of the lens 32, a part of the area covered by the imaging area 32c1 of the lens 32 is the invalid imaging area 343 , resulting in redundancy in the structure of the lens 32 , which will increase the width dimension w1 of the camera module 3 . Please refer back to FIG. 4, the width dimension w1 of the camera module 3 directly affects the width dimension w4 of the frame 13, therefore, increasing the width dimension w4 of the frame 13 is not conducive to increasing the screen ratio of the electronic device 100 and affects the electronic device. 100 display effects.

Exemplarily, the aspect ratio of the video output mode supported by the third-party application program is 16:9, and when the camera module 3 adopts a photosensitive chip 34 with an aspect ratio of 4:3 and a resolution of 5M, when the output When the resolution of the video image reaches 2560*1440, the width dimension w1 of the camera module 3 needs to be 5 mm or more, and the size of the camera module 3 is relatively large.

In order to solve the above technical problems, please refer to FIG. 14, which shows the structure of the imaging area 32c2 of the lens 32 and the first photosensitive area 341 and the effective photosensitive area 342 of the photosensitive chip 34 in the camera module 3 provided by other embodiments of the present application. schematic diagram.

Please refer to FIG. 14 , the effective photosensitive region 342 is located in the first photosensitive region 341 , and the area of the effective photosensitive region 342 is smaller than that of the first photosensitive region 341 . The effective photosensitive area 342 may be the largest effective photosensitive area cut out according to the aspect ratio of the video output mode supported by the third-party application. In some embodiments, the geometric center of the effective photosensitive region 342 may coincide with the geometric center of the first photosensitive region 341 . In other embodiments, the geometric center of the effective photosensitive region 342 may not coincide with the geometric center of the first photosensitive region 341 .

Specifically, the effective photosensitive area 342 is located within the imaging area 32c2 of the lens 32 , and a part of the first photosensitive area 341 is located outside the imaging area 32c2 of the lens 32 . In this way, it can be ensured that the effective photosensitive area 342 can be covered by the imaging area 32c2 of the lens 32, and while ensuring the shooting effect of the camera module 3, the redundant size of the lens 32 can be reduced, thereby reducing the size of the camera module 3. The width dimension w1 is beneficial to reduce the width dimension w4 of the frame and increase the screen ratio.

In some embodiments, the effective photosensitive area 342 is inscribed on the outer contour of the imaging area 32c2 of the lens 32 . At this time, the radius r of the imaging area 32c2 of the lens 32 is equal to half of the diagonal line d of the effective photosensitive area 342 . That is, the projection area of the light passing through the lens 32 on the photosensitive chip 34 is covered according to the area of the effective photosensitive area. In this way, please refer to FIG. 14, the radius of the imaging area 32c2 of the lens 32 can be reduced from r0 to r, which can effectively eliminate the redundancy of the size of the lens 32, further reduce the size of the lens 32, and further reduce the camera module 3 The width dimension w1 is conducive to further reducing the width dimension w4 of the border and increasing the screen-to-body ratio.

In the camera module 3 provided by this application, the imaging area 32c2 of the lens 32 is designed according to the size of the effective photosensitive area 342, thus, the ratio between the aspect ratio of the photosensitive chip 34 and the aspect ratio of the video output mode supported by the third-party application program When the ratio does not match, the effective photosensitive area 342 can be set according to the aspect ratio of the video output mode supported by the third-party application program, so that the size of the lens 32 can be reduced while ensuring the imaging effect of the video image, which is conducive to reducing the frame The width size of 13 increases the screen-to-body ratio.

In some embodiments, please refer to FIG. 14 , both the effective photosensitive region 342 and the first photosensitive region 341 are rectangular. The long side of the effective photosensitive region 342 is parallel to the long side of the first photosensitive region 341 , and the short side of the effective photosensitive region 342 is parallel to the short side of the first photosensitive region 341 . In this way, the area of the effective photosensitive region 342 can be increased, the utilization rate of the first photosensitive region 341 can be improved, and the imaging effect can be improved.

In some embodiments, the aspect ratio of the effective photosensitive area 342 covered by the lens 32 is 16:9. In this way, the aspect ratio of the effective photosensitive area 342 can be adapted to the aspect ratio of the video output mode supported by the third-party application program.

Further, in some embodiments, the aspect ratio of the first photosensitive region 341 is 4:3, and the aspect ratio of the effective photosensitive region 342 that the lens 32 can cover is 16:9. In this way, the aspect ratio of the effective photosensitive area 342 can be adapted to the aspect ratio of the video output mode supported by the third-party application program, and the photosensitive chip 34 with a lower cost can be selected. The photosensitive chip 34 can ensure the imaging quality while reducing the production cost and shortening the production cycle.

Exemplarily, the resolution of the first photosensitive area 341 is 2592*1944, and the resolution of the effective photosensitive area 342 is 2560*1440. That is, the photosensitive chip 34 has 5 million pixels, and the lens 32 has 3.7 million imaging pixels. In this way, the photosensitive unit 341a in the first photosensitive area 341 can be fully utilized to maximize the imaging pixels of the lens 32 and improve the imaging quality. Compared with the camera module 3 supporting the same video image resolution, the The size of the camera module 3 is small, which can realize the miniaturization design of the camera module 3 .

In some embodiments, the camera module 3 can support 2560*1440 high-definition video, and the width dimension w1 of the camera module 3 can be less than or equal to 4.1mm. Further, the width dimension w1 of the camera module 3 may be less than or equal to 3.85mm. Exemplarily, the width dimension w1 of the camera module 3 may be 3.85mm, 3.8mm, 3.75mm and so on. Thus, the width of the camera module 3 is reduced, which is beneficial to reducing the frame width of the electronic device 100 and increasing the screen-to-body ratio of the electronic device 100 .

Based on the above embodiments, the width w4 of the frame 13 may be less than or equal to 8.75mm. Further, the width w4 of the frame 13 may be less than or equal to 8.5mm. Exemplarily, the width w4 of the frame 13 may be 8.5mm, 8.45mm, 8.4mm, 8.35mm and so on.

It can be understood that, in other embodiments, the resolution of the first photosensitive area 341 may also be 4160*3120, and in this case, the resolution of the effective photosensitive area 342 may be 3840*2160. That is, the photosensitive chip 34 has 13 million pixels, and the lens 32 has 8.3 million imaging pixels. In this way, compared with the camera module 3 supporting the same video image resolution, the camera module 3 in this embodiment can also achieve a miniaturized design.

Referring back to FIG. 11 , the height dimension h of the camera module 3 is related to the distance TTL on the optical axis from the incident surface 32 a of the lens 32 to the imaging surface. Wherein, the imaging surface of the lens 32 is the surface of the photosensitive chip 34 facing the lens 32 . Specifically, the height dimension h of the camera module 3 = the distance TTL from the incident surface 32a of the lens 32 to the imaging surface on the optical axis + the thickness dimension t1 of the photosensitive chip 34 + the thickness of the glue 36 between the photosensitive chip 34 and the circuit board 35 Dimension t2 + thickness dimension t3 of circuit board 35 . Since the sizes of t1, t2 and t3 are relatively fixed, the height h of the camera module 3 is mainly affected by the size of the TTL. The ratio range of the TTL to the radius of the maximum imaging circle of the lens 32 affects the processing difficulty of the lens 32 . The larger the ratio of TTL to the radius of the maximum imaging circle of the lens 32 , the less difficult the processing of the lens 32 is; the smaller the ratio of TTL to the radius of the maximum imaging circle of the lens 32 , the more difficult the processing of the lens 32 is. In some embodiments of the present application, since the effective photosensitive area 342 to be covered by the imaging area 32c1 of the lens 32 is relatively small, the radius of the maximum imaging circle of the lens 32 is also relatively small, and the TTL can be reduced under the same processing difficulty factor. size, which in turn helps to reduce the height dimension h of the camera module 3 .

In some embodiments, the camera module 3 can support 2560*1440 high-definition video, and the height dimension h of the camera module 3 can be less than or equal to 3.5 mm. Exemplarily, the height dimension h of the camera module 3 may be 3.5mm, 3.4mm, 3.3mm, 3.2mm, 3.1mm, 3.05mm, 3.02mm, 3mm and so on. Thus, the thickness of the frame 13 can be reduced, and further the thickness of the display 1 can be reduced, which is beneficial to realize the light and thin design of the electronic device 100 .

In some embodiments, the first photosensitive area 341 has a plurality of photosensitive units 341a arranged in an array, and each photosensitive unit 341a can be turned on and off independently. In this way, when the camera module 3 is working, the photosensitive unit 341a in the effective sensing area 342 can be controlled to be turned on, and the photosensitive unit 341a outside the effective sensing area 342 is turned off. Thus, the adjustment and control of the photosensitive area of the photosensitive chip 34 can be realized conveniently, and the reliability of the photosensitive chip 34 can be improved.

In some embodiments, the camera module 3 further includes an acquisition module 301 and a first processing module 302 . Please refer to FIG. 15a, which is a schematic diagram of the module structure of the camera module 3 provided by some embodiments of the present application. The acquisition module 301 is used to acquire the original image collected by the camera module 3 , the first processing module 302 is electrically connected to the acquisition module 301 , and the first processing module 302 is used to process the original image to obtain the target image. Wherein, the resolution of the target image is greater than the resolution of the original image. In some embodiments, the resolution of the original image is the same as that of the effective photosensitive area, and the resolution of the target image is the same as that of the first photosensitive area.

In some embodiments, please refer to FIG. 15 a , which is a schematic diagram of the module structure of the camera module 3 in some embodiments provided by the present application. The acquisition module 301 includes an image signal processing unit 301a (image signal processor, ISP), a digital signal processing unit 301b (digital signal process, DSP) and a reading unit 301c. The ISP is electrically connected to the photosensitive chip 34 . The ISP is used to convert the electrical signal of the photosensitive chip 34 into a digital image signal, and the ISP can also optimize parameters such as exposure and color temperature of the shooting scene by the image signal processing unit 301a. The DSP is electrically connected to the ISP. DSP is used to convert digital image signals into standard RGB, YUV and other image signals. The reading unit 301c is used to read the image signal generated by the digital signal processing unit 301b to obtain an original image. Optionally, the reading unit 301c may be a Device MFT.

In some embodiments, the resolution of the target image processed by the first processing module 302 is equal to the resolution of the photosensitive chip 34 . That is, the resolution of the target image processed by the first processing module 302 is equal to the resolution of the first photosensitive area 341 . Exemplarily, the resolution of the original image is 2560*1440, and the resolution of the first processed image may be 2592*1944. In this way, the original image can be processed by the first processing module 302 to improve the resolution of the captured image and improve the shooting effect of the camera module 3 .

Specifically, the workflow of the camera module 3 shown in FIG. 15 a is described by taking the resolution of the first photosensitive area 341 of the photosensitive chip 34 as 2592*1944 and the resolution of the effective photosensitive area 342 as 2560*1440 as an example. Please refer to FIG. 15b. FIG. 15b is a working flowchart of the camera module 3 shown in FIG. 15a.

When the camera module 3 works, the light is transmitted to the photosensitive chip 34 through the lens 32, and the photosensitive chip 34 converts the light signal (resolution is 2560*1440) into an electrical signal (resolution is 2560*1440), and converts the electrical signal The signal (with a resolution of 2560*1440) is transferred to the ISP for conversion into a digital image signal (with a resolution of 2560*1440), and the ISP outputs the digital image signal (with a resolution of 2560*1440) to the DSP for processing. DSP converts digital image signals (resolution 2560*1440) into image signals in standard RGB, YUV and other formats (resolution 2560*1440). The reading unit 301c reads the image signal (with a resolution of 2560*1440), obtains an original image (with a resolution of 2560*1440), and transmits the image signal to the first processing module 302 for processing. The first processing module 302 can process the image signal (with a resolution of 2560*1440) through a super-resolution algorithm, a difference algorithm, etc., to obtain a target image (with a resolution of 2592*1944), so as to increase the resolution of the original image.

In other embodiments, please refer to FIG. 16a , which is a schematic diagram of the module structure of the camera module 3 in other embodiments provided by the present application. In this embodiment, the camera module 3 includes an acquisition module 301 , an identification module 304 , an extraction module 305 and a second processing module 303 . The structure and function of the acquisition module 301 in this embodiment may be the same as that in the embodiment shown in FIG. 15 a , and will not be repeated here.

The identification module 304 is electrically connected to the acquisition module 301, and the identification module 304 is used to identify preset features in the original image. Exemplarily, the preset feature may be a face feature. The extraction module 305 is electrically connected to the recognition module 304, and the extraction module 305 is used to extract the aforementioned preset features. The second processing module 303 is electrically connected to the extraction module 305, and the second processing module 303 performs definition enhancement processing on the preset features extracted by the extraction module 305 to obtain the first image. The sharpness of the preset features in the first image is greater than the sharpness of the preset features in the original image. In this way, the definition of preset features in the captured image can be improved, and the shooting effect of the camera module 3 can be improved. It should be noted that the "sharpness" mentioned in this application refers to the clarity of each detail and its boundary on the image.

In some embodiments, the identification module 304 is used to identify facial features, the extraction module 305 is used to extract facial features, and the second processing module 303 improves clarity through a facial AI model.

It can be understood that, in other embodiments, the preset feature may also be a landscape feature, an image background feature, and the like.

Specifically, the workflow of the camera module 3 shown in FIG. 16a is described by taking the resolution of the first photosensitive area 341 of the photosensitive chip 34 as 2592*1944 and the resolution of the effective photosensitive area 342 as 2560*1440 as an example. Please refer to FIG. 16b. FIG. 16b is a working flowchart of the camera module 3 shown in FIG. 16a.

When the camera module 3 works, the light is transmitted to the photosensitive chip 34 through the lens 32, and the photosensitive chip 34 converts the light signal (resolution is 2560*1440) into an electrical signal (resolution is 2560*1440), and converts the electrical signal The signal (with a resolution of 2560*1440) is transferred to the ISP for conversion into a digital image signal (with a resolution of 2560*1440), and the ISP outputs the digital image signal (with a resolution of 2560*1440) to the DSP for processing. DSP converts digital image signals (resolution 2560*1440) into image signals in standard RGB, YUV and other formats (resolution 2560*1440). The reading unit 301c reads the image signal (with a resolution of 2560*1440), obtains the original image (with a resolution of 2560*1440), and transmits the image signal (with a resolution of 2560*1440) to the recognition module 304 for face detection , and extract the face features by the extraction module 305, the second processing module 303 improves the definition of the face through the face AI model, and obtains the first image, so that the definition of the face features in the first image is higher than that in the original image Sharpness of facial features. In this way, the definition of portrait shooting can be improved, and the shooting effect of the camera module 3 can be improved.

Further, please refer to FIG. 17a, which is a schematic diagram of the module structure of the camera module 3 in some other embodiments provided by the present application. In this embodiment, the camera module 3 includes a third processing module 306 in addition to the acquisition module 301 , identification module 304 , extraction module 305 , and second processing module 303 in the embodiment shown in FIG. 16 a . The third processing module 306 is electrically connected to the second processing module 303, and the third processing module 306 is configured to process the first image to obtain a target image, and the resolution of the target image is higher than that of the original image.

The third processing module 306 may process the image signal through a super-resolution algorithm, a difference algorithm, etc., so as to improve the resolution of the original image. In some embodiments, the resolution of the target image processed by the third processing module 306 is equal to the resolution of the photosensitive chip 34 . That is, the resolution of the target image obtained after being processed by the third processing module 306 is equal to the resolution of the first photosensitive area 341 . Exemplarily, the resolution of the target image may be 2592*1944.

In this way, the image can be processed by the third processing module 306 to improve the resolution of the captured image and improve the shooting effect of the camera module 3 .

Specifically, the workflow of the camera module 3 shown in FIG. 17 a is described by taking the resolution of the first photosensitive area 341 of the photosensitive chip 34 as 2592*1944 and the resolution of the effective photosensitive area 342 as 2560*1440 as an example. Please refer to FIG. 17b. FIG. 17b is a working flowchart of the camera module 3 shown in FIG. 17a.

When the camera module 3 works, the light is transmitted to the photosensitive chip 34 through the lens 32, and the photosensitive chip 34 converts the light signal (resolution is 2560*1440) into an electrical signal (resolution is 2560*1440), and converts the electrical signal The signal (with a resolution of 2560*1440) is transferred to the ISP for conversion into a digital image signal (with a resolution of 2560*1440), and the ISP outputs the digital image signal (with a resolution of 2560*1440) to the DSP for processing. DSP converts digital image signals (resolution 2560*1440) into image signals in standard RGB, YUV and other formats (resolution 2560*1440). The reading unit 301c reads the image signal (with a resolution of 2560*1440), obtains the original image (with a resolution of 2560*1440), and transmits the image signal (with a resolution of 2560*1440) to the recognition module 304 for face detection , and extract the face features through the extraction module 305, and the second processing module 303 improves the definition of the face through the face AI model to obtain the second processed image (with a resolution of 2560*1440). The third processing module 306 processes the second processed image (with a resolution of 2560*1440) through a super-resolution algorithm, a difference algorithm, etc., to obtain a third processed image (with a resolution of 2592*1944).

In some embodiments, the camera module 3 can support high-definition video with a resolution of 2560*1440 and take pictures with a resolution of 2592*1944 under the condition that the width of the camera module 3 is 3.85mm, and can improve human Face definition can take into account high-definition video display, high-definition camera and miniaturized design of camera module.

The embodiment of the present application also provides an electronic device 100, the electronic device 100 includes the camera module 3 in any of the above technical solutions, since the electronic device 100 provided in the embodiment of the present application includes the speaker module 3 as described in the above embodiment , so the two can solve the same technical problem and achieve the same effect.

The present application also proposes an image processing method, which is used in an electronic device to process the original image obtained by the above-mentioned camera module. Please refer to FIG. 18 . FIG. 18 is a schematic flowchart of an image processing method provided by an embodiment of the present application. The image processing method may include the following steps:

Step 1801, process the original image to obtain a target image, the resolution of the target image is greater than the resolution of the original image. The original image is an unprocessed image obtained by the camera module. In some embodiments, the resolution of the original image is the same as that of the effective photosensitive area, and the resolution of the target image is the same as that of the first photosensitive area.

Optionally, the electronic device may acquire the original image through the acquiring module, and process the original image through the first processing module. The first processing module is electrically connected to the acquisition module. In some embodiments, the acquiring module includes an image signal processing unit (image signal processor, ISP), a digital signal processing unit (digital signal process, DSP) and a reading unit. The ISP is electrically connected with the photosensitive chip. The DSP is electrically connected to the ISP. The reading unit is used for reading the image signal generated by the digital signal processing unit to obtain the original image.

Exemplarily, the light is transmitted to the photosensitive chip through the lens, the photosensitive chip converts the light signal into an electrical signal, and transmits the electrical signal to the ISP for conversion into a digital image signal, and the ISP outputs the digital image signal to the DSP for processing. DSP converts digital image signals into image signals in standard RGB, YUV and other formats. The reading unit reads the image signal to obtain the original image.

The first processing module can process the image signal through a super-resolution algorithm, a difference algorithm, etc. to obtain a target image, so as to improve the resolution of the original image.

In some embodiments, the reading unit may directly transmit the image signal of the original image to the first processing module for processing to obtain the target image.

In some other embodiments, please refer to FIG. 19 , which is a schematic flowchart of an image processing method provided in some other embodiments of the present application. Processing the original image may also include the following steps, wherein the original image includes preset features:

Step 1901, extract preset features, process the preset features, and obtain a first image, so that the definition of the preset features in the first image is greater than the definition of the preset features in the original image;

Step 1902, process the first image to obtain the target image.

Optionally, the electronic device may identify preset features in the original image through the recognition module, and extract the preset features through the extraction module, and then use the second processing module to improve the definition of the preset features extracted by the extraction module, The first image is obtained, so that the definition of the preset feature in the first image is greater than the definition of the preset feature in the original image. Afterwards, the first image is processed by the first processing module to obtain the target image. In this way, the definition of preset features in the captured image can be improved first, and then the resolution of the original image can be increased, which can further improve the shooting effect of the camera module.

In this embodiment, the preset feature may be a face feature. The second processing module can improve the definition of facial features through the facial AI model. In other embodiments, the preset features may also be landscape features, image background features, and the like.

The embodiment of the present application also provides an electronic device, including one or more processors and one or more memories. The one or more memories are coupled with one or more processors, the one or more memories are used to store computer program codes, the computer program codes include computer instructions, and when the one or more processors execute the computer instructions, the electronic device performs The above related method steps implement the image processing method in the above embodiment.

Embodiments of the present application also provide a computer-readable storage medium, where computer instructions are stored in the computer-readable storage medium, and when the computer instructions are run on the electronic device, the electronic device executes the above-mentioned relevant method steps to realize the above-mentioned embodiment Image processing methods in .

An embodiment of the present application also provides a computer program product, the computer program product includes computer instructions, and when the computer instructions are run on the electronic device, the electronic device executes the above-mentioned related method steps to implement the image processing method in the above-mentioned embodiment .

Wherein, the electronic device, computer-readable storage medium or computer program product provided in this embodiment is all used to execute the corresponding method provided above, therefore, the beneficial effects it can achieve can refer to the corresponding method provided above The beneficial effects in the method will not be repeated here.

Through the description of the above embodiments, those skilled in the art can clearly understand that for the convenience and brevity of the description, only the division of the above-mentioned functional modules is used as an example for illustration. In practical applications, the above-mentioned functions can be allocated according to needs It is completed by different functional modules, that is, the internal structure of the electronic device is divided into different functional modules to complete all or part of the functions described above.

In the several embodiments provided in this application, it should be understood that the disclosed electronic device and method can be implemented in other ways. For example, the above-described electronic device embodiments are only illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components May be incorporated or may be integrated into another electronic device, or some features may be omitted, or not implemented. In another point, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.

The unit described as a separate component may or may not be physically separated, and the component displayed as a unit may be one physical unit or multiple physical units, that is, it may be located in one place, or may be distributed to multiple different places . Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

Each functional unit in each embodiment of the embodiment of the present application may be integrated into one processing unit, or each unit may physically exist separately, or two or more units may be integrated into one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

If the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage The medium includes several instructions to enable a computer device (which may be a personal computer, server, or network device, etc.) or a processor to execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage medium includes: flash memory, removable hard disk, read-only memory, random access memory, magnetic disk or optical disk, and other various media capable of storing program codes.

In the description of this specification, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims

A camera module, characterized in that it comprises:

lens;

A photosensitive chip, the photosensitive chip is located on the light-emitting side of the lens, and the surface of the photosensitive chip facing the lens includes a first photosensitive area, and the first photosensitive area has an effective photosensitive area, and the effective photosensitive area The area is smaller than the area of the first photosensitive region,

The projection range of light passing through the lens on the surface of the photosensitive chip facing the lens forms an imaging area, the effective photosensitive area is located in the imaging area, and a part of the first photosensitive area is located in the outside the imaging area.
The camera module according to claim 1, wherein the imaging area is circular, and the effective photosensitive area is inscribed on the outer contour of the imaging area.
The camera module according to claim 1 or 2, wherein the first photosensitive area and the effective photosensitive area are rectangular, and the long side of the effective photosensitive area is in the same shape as the first photosensitive area. The long sides are parallel, and the wide sides of the effective photosensitive area are parallel to the wide sides of the first photosensitive area.
The camera module according to any one of claims 1-3, wherein the aspect ratio of the effective photosensitive area is 16:9.
The camera module according to claim 4, wherein the resolution of the effective photosensitive area is 2560*1440.
The camera module according to claim 5, wherein the width of the camera module is less than or equal to 4.1 mm.
The camera module according to claim 6, wherein the width of the camera module is less than or equal to 3.85 mm.
The camera module according to claim 6 or 7, wherein the height of the camera module is less than or equal to 3.5mm.
The camera module according to claim 8, wherein the height of the camera module is less than or equal to 3.02mm.
The camera module according to any one of claims 1-9, wherein there are a plurality of photosensitive units arranged in an array in the first photosensitive area, and each photosensitive unit can be independently controlled to be turned on and off .
An electronic device, characterized in that it comprises:

a display having a display area and a non-display area;

A camera module, the camera module is the camera module according to any one of claims 1-10, and the camera module is arranged in the non-display area.
The electronic device according to claim 11, wherein the display comprises:

Screen;

A frame, the frame is set around the edge of the screen, the frame is provided with a mounting hole, at least part of the camera module is set in the mounting hole, and the area of the screen exposed to the frame forms a In the display area of the display, the area where the frame is located forms the non-display area of the display.
The electronic device according to claim 12, wherein the width of the frame is less than or equal to 8.75mm.
The electronic device according to claim 13, wherein the width of the frame is less than or equal to 8.5 mm.
The electronic device according to any one of claims 11-14, further comprising a keyboard host, the keyboard host being rotatably connected to the display.
An image processing method for processing the original image obtained by the camera module according to any one of claims 1-10, characterized in that it comprises:

The original image is processed to obtain a target image, and the resolution of the target image is greater than the resolution of the original image.
The image processing method according to claim 16, wherein the original image includes preset features, and processing the original image includes:

extracting the preset features, and processing the preset features to obtain a first image, the definition of the preset features in the first image is greater than the clarity of the preset features in the original image;

Process the first image to obtain the target image.
The image processing method according to claim 17, wherein the preset feature is a face feature.
The image processing method according to claim 18, characterized in that, the human face features in the original image are processed using a human face AI model.
The image processing method according to any one of claims 16-19, wherein the resolution of the original image is equal to the resolution of the effective photosensitive area, and the resolution of the target image is equal to the resolution of the second The resolution of a photosensitive area is equal.
An electronic device, characterized in that it comprises:

one or more processors;

memory;

Wherein, one or more computer programs are stored in the memory, and the one or more computer programs include instructions, and when the instructions are executed by the electronic device, the electronic device executes the electronic device according to claims 16-20. The image processing method described in any one.
A computer-readable storage medium, wherein instructions are stored in the computer-readable storage medium, and it is characterized in that, when the instructions are run on the electronic device, the electronic device is made to execute any one of claims 16-20. The image processing method described in the item.
A computer program product, characterized in that the computer program product includes computer instructions, and when the computer instructions are run on an electronic device, the electronic device is made to execute the method described in any one of claims 16-20. image processing method.