CN115022491B

CN115022491B - Camera module and electronic equipment

Info

Publication number: CN115022491B
Application number: CN202111416232.1A
Authority: CN
Inventors: 于男军; 曹毅; 张为波
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2021-09-26
Filing date: 2021-11-25
Publication date: 2023-10-10
Anticipated expiration: 2041-11-25
Also published as: WO2023045679A1; CN115022491A

Abstract

The application discloses a camera module and electronic equipment, and relates to the technical field of electronic products. The camera module comprises a lens and a photosensitive chip, wherein the photosensitive chip is positioned on the light-emitting side of the lens, one side surface of the photosensitive chip, facing the lens, comprises a first photosensitive area, an effective photosensitive area is arranged in the first photosensitive area, the area of the effective photosensitive area is smaller than that of the first photosensitive area, the projection range of light rays passing through the lens on the side surface of the photosensitive chip, facing the lens, forms an imaging area, the effective photosensitive area is positioned in the imaging area, and a part of the first photosensitive area is positioned outside the imaging area.

Description

Camera module and electronic equipment

The present application claims priority from the national intellectual property agency, application number 202111130259.4, chinese patent application entitled "camera module and electronics," filed on 26, 9, 2021, the entire contents of which are incorporated herein by reference.

Technical Field

The present application relates to the field of electronic products, and in particular, to a camera module and an electronic device.

Background

With the development of technology, the demand for remote office is increasing, and the requirement for imaging effect of camera modules in electronic devices such as personal computers (personal computer, PCs) is also increasing. However, the better the imaging effect of the camera module, the larger the size of the camera module is, which is unfavorable for reducing the frame width of the electronic device and improving the screen occupation ratio of the electronic device.

Disclosure of Invention

The application provides a camera module and electronic equipment, which can reduce the size of the camera module while ensuring the imaging effect of the camera module, and is beneficial to reducing the frame width of the electronic equipment and improving the screen occupation ratio of the electronic equipment.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical scheme:

in a first aspect, the present application provides a camera module, the camera module comprising: the lens and the sensitization chip, the sensitization chip is located the light-emitting side of lens, and the sensitization chip is towards one side surface of lens including first sensitization district, has effective sensitization district in the first sensitization district, and effective sensitization district's area is less than the area of first sensitization district, and the light that passes the lens forms the formation of image area at the projection scope on the sensitization chip side surface towards the lens, and effective sensitization district is located the formation of image area, and a part of first sensitization district is located outside the formation of image area. Like this, can guarantee that the effective sensitization district on the sensitization chip homoenergetic is covered by the camera lens in sensitization chip one side surface of camera lens upper imaging area, when guaranteeing the shooting effect of camera module, can reduce the redundant size of camera module, and then can reduce the width dimension of camera module, be favorable to reducing the width dimension of frame, improve the screen ratio.

In one possible design manner of the first aspect, the imaging area is circular, and the effective photosensitive area is inscribed in an outer contour of the imaging area. The radius of the imaging area of the lens is equal to one half of the diagonal of the effective photosensitive area. That is, the projection area of the light passing through the lens on the photosensitive chip is covered according to the area of the effective photosensitive area. Therefore, the redundancy of the lens size can be effectively eliminated, the size of the lens is further reduced, the width size of the camera module can be further reduced, the width size of the frame is further reduced, and the screen duty ratio is improved.

In one possible design of the first aspect, the geometric center of the effective photosensitive area coincides with the geometric center of the first photosensitive area.

In one possible design manner of the first aspect, the first photosensitive area and the effective photosensitive area are both rectangular, the long side of the effective photosensitive area is parallel to the long side of the first photosensitive area, and the broad side of the effective photosensitive area is parallel to the broad side of the first photosensitive area. Thus, the area of the effective photosensitive area can be increased, the utilization rate of the first photosensitive area is improved, and the imaging effect is improved.

In one possible design of the first aspect, the aspect ratio of the effective photosensitive area is 16:9. In this way, the aspect ratio of the active photosensitive area can be adapted to the aspect ratio of the video output mode supported by the third party application.

In one possible design manner of the first aspect, the aspect ratio of the first photosensitive region is 4:3, and the aspect ratio of the effective photosensitive region is 16:9. Therefore, the length-width ratio of the effective photosensitive area is matched with the length-width ratio of the video output mode supported by the third-party application program, and compared with customizing the photosensitive chip with the corresponding specification and model, the imaging quality can be ensured while the production cost and the production period are reduced.

In one possible design of the first aspect, the resolution of the effective photosensitive area is 2560×1440. Therefore, the imaging effect of the camera module can be improved, so that the electronic equipment with the camera module can support high-definition video call, and the call quality is improved.

In one possible design of the first aspect, the resolution of the first photosensitive region is 2592×1944, and the resolution of the effective photosensitive region is 2560×1440. Therefore, the photosensitive units in the first photosensitive area can be fully utilized, imaging pixels of the lens are increased to the greatest extent, imaging quality is improved, and compared with a camera module supporting the same video picture resolution, the camera module in the embodiment has smaller size, and the miniaturized design of the camera module can be realized.

In one possible design of the first aspect, the resolution of the first photosensitive region is 4160×3120, and the resolution of the effective photosensitive region is 3840×2160.

In one possible design manner of the first aspect, the resolution of the first photosensitive area is 4160×3120, and the width of the camera module is less than or equal to 4.1mm. Therefore, the width dimension of the camera module is reduced, the frame width of the electronic equipment is reduced, and the screen occupation ratio of the electronic equipment is improved.

In one possible design of the first aspect, the width of the camera module is less than or equal to 3.85mm.

In one possible design of the first aspect, the width of the camera module is 3.8mm, 3.75mm or 3.7mm.

In one possible design of the first aspect, the height of the camera module is less than or equal to 3.2mm. Therefore, the thickness of the frame can be reduced, and the thickness of the display can be reduced, so that the light and thin design of the electronic equipment is facilitated.

In one possible design of the first aspect, the height of the camera module is less than or equal to 3.5mm. Therefore, the thickness of the frame can be further reduced, the thickness of the display can be further reduced, and the light and thin design of the electronic equipment is facilitated.

In one possible design of the first aspect, the height of the camera module is less than or equal to 3.2mm. Therefore, the thickness of the frame can be further reduced, the thickness of the display can be further reduced, and the light and thin design of the electronic equipment is facilitated.

In one possible embodiment of the first aspect, the height of the camera module is 3.5mm, 3.4mm, 3.3mm, 3.15mm, 3.1mm, 3.08mm, 3.05mm, 3.02mm or 3.0mm.

In one possible design manner of the first aspect, the first photosensitive area has a plurality of photosensitive units arranged in an array, and each photosensitive unit can be independently controlled to be turned on and off. Thus, when the camera module works, the photosensitive units in the effective sensing area can be controlled to be opened, and the photosensitive units outside the effective sensing area are controlled to be closed. Therefore, the adjustment and control of the photosensitive area of the photosensitive chip can be conveniently realized, and the reliability of the photosensitive chip can be improved.

In one possible design manner of the first aspect, the method further includes: the acquisition module is used for acquiring an original image acquired by the camera module; the first processing module is electrically connected with the acquisition module and is used for processing the original image acquired by the acquisition module to obtain a first processed image, and the resolution of the first processed image is larger than that of the original image. Like this, can handle original image through first processing module, promote the resolution ratio of shooting image, can improve the shooting effect of camera module.

In one possible implementation manner of the first aspect, the acquisition module includes an image signal processing unit, a digital signal processing unit, and a reading unit. The image signal processing unit is electrically connected with the photosensitive chip, the digital signal processing unit is electrically connected with the image signal processing unit, and the reading unit is electrically connected with the digital signal processing unit.

In one possible design of the first aspect, the resolution of the first processed image is equal to the resolution of the first photosensitive region.

In one possible design manner of the first aspect, the camera module further includes: the device comprises an acquisition module, an identification module, an extraction module and a second processing module, wherein the acquisition module is used for acquiring an original image acquired by the camera module; the identification module is electrically connected with the acquisition module and is used for identifying preset features in the original image; the extraction module is electrically connected with the identification module and is used for extracting preset features identified by the identification module; the second processing module is electrically connected with the extraction module and processes the preset features extracted by the extraction module to obtain a second processed image, and the definition of the second processed image is larger than that of the original image. Therefore, the definition of the shot image can be improved, and the shooting effect of the camera module can be improved.

In one possible design of the first aspect, the preset feature is a face feature.

In one possible design manner of the first aspect, the camera module further includes a third processing module, and the third processing module is electrically connected to the second processing module, and the third processing module is configured to process the second processed image to obtain a third processed image, where a resolution of the third processed image is higher than a resolution of the second processed image. Therefore, the definition of the shot image can be improved through the second processing module, the resolution ratio of the image is improved through the third processing module, and the shooting effect of the camera module is further improved.

In one possible design of the first aspect, the resolution of the third processed image is equal to the resolution of the first photosensitive region.

In a second aspect, the present application provides an electronic device, including: the display is provided with a display area and a non-display area; the camera module is any one of the above first aspects, and the camera module is disposed in the non-display area.

In one possible design of the second aspect, the display includes: a screen; the frame is arranged around the periphery of the screen, the frame is provided with a mounting hole, and the light incident surface of the camera module is opposite to the mounting hole.

In one possible design of the second aspect, the width of the rim is less than or equal to 8.75mm.

In one possible design of the second aspect, the width of the rim is less than or equal to 8.5mm.

In a possible design manner of the second aspect, the electronic device further includes a keyboard host, and the keyboard host is rotatably connected to the display.

It may be appreciated that the above-mentioned advantages achieved by the electronic device according to the second aspect may refer to the advantages as in the first aspect and any of the possible design manners thereof, which are not described herein.

In a third aspect, the present application provides an image processing method, configured to process an original image acquired by a camera module in any one of the foregoing aspects, including: and processing the original image to obtain a target image, wherein the resolution of the target image is larger than that of the original image. Therefore, the resolution ratio of the original image can be improved, and the shooting effect of the camera module can be improved.

In one possible design manner of the third aspect, the original image includes a preset feature, and the processing the original image includes: extracting preset features, and processing the preset features to obtain a first image, wherein the definition of the preset features in the first image is greater than that of the preset features in the original image; and processing the first image to obtain a target image.

In one possible design of the third aspect, the preset feature is a face feature.

In one possible design manner of the third aspect, a face AI model is used to process face features in an original image.

In one possible design of the third aspect, the resolution of the original image is equal to the resolution of the effective photosensitive area, and the resolution of the target image is equal to the resolution of the first photosensitive area.

In a fourth aspect, the present application provides an electronic device comprising: one or more processors; a memory; wherein the memory stores one or more computer programs, the one or more computer programs comprising instructions that, when executed by the electronic device, cause the electronic device to perform the image processing method of any of the third aspects above.

In a fifth aspect, there is provided a computer readable storage medium having instructions stored therein which, when run on a computer, cause the computer to perform the image processing method of any one of the third aspects above.

In a sixth aspect, there is provided a computer program product comprising instructions which, when run on a computer, cause the computer to perform the image processing method of any of the third aspects above.

It will be appreciated that the computer storage medium according to the fourth aspect, the computer program product according to the fifth aspect and the computer program product according to the sixth aspect provided above are all configured to perform the corresponding methods provided above, and therefore, the advantages achieved by the method are referred to the advantages in the corresponding methods provided above, and are not repeated herein.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present application;

FIG. 2 is a schematic diagram of a display of the electronic device shown in FIG. 1;

FIG. 3 is an exploded view of the display of FIG. 2;

FIG. 4 is a cross-sectional view taken along line P-P of the schematic structural diagram shown in FIG. 2;

FIG. 5 is a perspective view of a keyboard host of the electronic device shown in FIG. 1;

FIG. 6 is a cross-sectional view taken along line A-A of the perspective view shown in FIG. 5;

fig. 7 is a perspective view of a camera module according to some embodiments of the present application;

FIG. 8 is an exploded view of the camera module shown in FIG. 7;

FIG. 9 is a top view of the camera module shown in FIG. 7;

FIG. 10 is a cross-sectional view taken along line B-B of the top view shown in FIG. 9;

FIG. 11 is a cross-sectional view taken along line C-C of the top view shown in FIG. 9;

FIG. 12 is a schematic diagram illustrating an arrangement of photosensitive units in a photosensitive chip according to some embodiments of the present application;

FIG. 13 is a schematic diagram illustrating the structure of an imaging area of a lens and a first photosensitive area of a photosensitive chip according to some embodiments of the present application;

FIG. 14 is a schematic view of the structure of the imaging area of the lens and the first photosensitive area of the photosensitive chip according to another embodiment of the application;

fig. 15a is a schematic block diagram of a camera module according to some embodiments of the present application;

FIG. 15b is a flowchart illustrating operation of the camera module of FIG. 15 a;

fig. 16a is a schematic block diagram of a camera module according to another embodiment of the application;

FIG. 16b is a flowchart illustrating operation of the camera module of FIG. 16 a;

fig. 17a is a schematic block diagram of a camera module according to still other embodiments of the present application;

FIG. 17b is a flowchart illustrating operation of the camera module of FIG. 17 a;

FIG. 18 is a flowchart illustrating an image processing method according to some embodiments of the present application;

fig. 19 is a flowchart of an image processing method according to another embodiment of the application.

100. An electronic device;

1. a display; 11. a display area; 12. a non-display area; 13. a frame; 131. a mounting hole; 14. a screen; 141. a light-transmitting cover plate; 142. a display screen; 15. a back shell; 151. a back cover; 152. a side frame;

2. A keyboard host;

21. a housing; 21a, an accommodation space; 211. a C shell; 211a, a second avoidance port; 212. d, shell; 2121. a first wall plate; 213. a boss; 213a, a receiving groove; 213a0, inner wall surface; 213a1, an inner bottom wall; 213a2, inner side walls; 213b, first heat dissipation holes; 214. an anti-slip structure; 215. an air inlet; 2151. an air inlet hole; 216. a second heat radiation hole;

22. a middle plate; 22a, a first avoidance port;

23. a keyboard; 231. a fixing plate; 232. a key;

24. a main board;

3. a camera module;

31. a mounting base; 311. a light hole; 32. a lens; 32a, a light incident surface; 32b, a light-emitting surface; 321. a lens barrel; 322. a lens; 33. a light filter; 34. a photosensitive chip; 341. a first photosensitive region; 341a, a photosensitive unit; 342. an effective photosensitive area; 35. a circuit board; 351. a first surface; 352. a second surface; 36. and (3) sticking glue;

301. an acquisition module; 301a, an image signal processing unit; 301b, a digital signal processing unit; 301c, a reading unit;

302. a first processing module;

303. a second processing module;

304. an identification module;

305. an extraction module;

306. and a third processing module.

Detailed Description

In embodiments of the present application, the terms "first," "second," "third," "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", "a third" and a fourth "may explicitly or implicitly include one or more such feature.

In embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In the embodiment of the present application, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

The application provides electronic equipment, which is a type of electronic equipment with a camera module. Specifically, the electronic device includes, but is not limited to, electronic devices such as notebook computers (notebook), tablet computers (tablet personal computer), laptop computers (laptop computers), personal digital assistants (personal digital assistant, PDA), personal computers (personal computer, PC), vehicle-mounted devices, mobile phones, and wearable devices.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 100 according to some embodiments of the application. In the present embodiment, the electronic device 100 is a notebook computer. Specifically, the electronic device 100 includes a display 1 and a keyboard host 2.

The display 1 is used for displaying images, videos, etc. The keyboard host 2 is rotatably connected with the display 1. The keyboard host 2 is used for inputting instructions and data and controlling the display 1 to display images and videos according to the input instructions and data. Meanwhile, the keyboard host 2 is also used for playing voice or music.

The electronic device 100 is switchable between an open state and a closed state. When the electronic device 100 is in the open state, the display 1 forms an included angle with the keyboard host 2 of more than 0 ° and less than 180 °. When the electronic device 100 is in the closed state, the display 1 covers the keyboard host 2, and the display surface of the display 1 is opposite to the keyboard 23 surface of the keyboard host 2.

For convenience of description of the embodiments below, an XYZ coordinate system is established for the display 1. Specifically, the extending direction of the rotation axes of the keyboard host 2 and the display 1 is defined as the X-axis direction, the thickness direction of the display 1 is defined as the Z-axis direction, and the directions perpendicular to both the X-axis direction and the Z-axis direction are defined as the Y-axis direction. It will be appreciated that the coordinate system of the display 1 may be flexibly set according to actual needs, which is not specifically limited herein.

Referring to fig. 2-3, fig. 2 is a perspective view of the display 1 of the electronic device 100 shown in fig. 1, and fig. 3 is an exploded view of the display 1 shown in fig. 2. It should be noted that fig. 2-3 only schematically illustrate some components included in the display 1, and the actual shape, actual size, actual position and actual configuration of these components are not limited by fig. 2 and 3 and the following drawings.

In this embodiment, referring to fig. 3-4, fig. 4 is a cross-sectional view taken along the line P-P of the schematic structural diagram shown in fig. 2. The display 1 comprises a bezel 13, a screen 14 and a back shell 15. The frame 13 is formed as a rectangular ring frame structure. The longitudinal direction of the frame 13 is parallel to the X-axis direction, the width direction of the frame 13 is parallel to the Y-axis direction, and the thickness direction of the frame 13 is parallel to the Z-axis direction. Referring to fig. 4, the frame 13 has a first side wall 13b and a second side wall 13a opposite to each other in the Y-axis direction, the first side wall 13b is rotatably connected to the keyboard main unit 2, and the second side wall 13a is provided with a mounting hole 131.

The screen 14 is used to display images, videos, documents, web pages, and the like. The screen 14 may be fixedly attached to the frame 13 by means of glue. The area of the screen 14 exposed out of the frame 13 forms the display area 11 of the display 1, and the frame body structure of the frame 13 forms the non-display area 12 of the display 1.

Referring to fig. 4, the screen 14 includes a light-transmitting cover 141 and a display screen 142 (english name: panel, also referred to as display panel). The light-transmitting cover 141 is laminated with the display screen 142. The light-transmitting cover plate 141 is mainly used for protecting the display screen 142 and preventing dust. The material of the transparent cover plate 141 includes, but is not limited to, glass. The display 142 may be a flexible display or a rigid display. For example, the display screen 142 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini-led (mini organic light-emitting diode) display screen, a micro-led (micro organic light-emitting diode) display screen, a micro-organic led (micro organic light-emitting diode) display screen, a quantum dot led (quantum dot light emitting diodes, QLED) display screen, a liquid crystal display screen (liquid crystal display, LCD).

The back case 15 serves to protect the internal electronics of the electronic device 100. The back case 15 includes a back cover 151 and a side frame 152. The back cover 151 is located at a side of the display screen 142 away from the transparent cover 141, and is stacked with the transparent cover 141 and the display screen 142. The side frame 152 is located between the back cover 151 and the frame 13, and the side frame 152 is fixed on the back cover 151. The side frame 152 may be fixedly coupled to the back cover 151 by an adhesive, for example. The side frame 152 may be integrally formed with the back cover 151, i.e., the side frame 152 and the back cover 151 may be integrally formed. The frame 13 is fixed to the side frame 152. In some embodiments, the frame 13 may be glued to the side frame 152. The frame 13, the back cover 151 and the side frame 152 enclose an internal accommodating space of the display 1.

The camera module 3 is used for collecting photos/videos. Referring to fig. 4, the camera module 3 is disposed on the peripheral side of the screen 14, specifically, the camera module 3 is fixed in the mounting hole 131 on the frame 13 on the peripheral side of the screen 14, and the light incident surface of the camera module 3 faces the same side as the display surface of the screen 14. Illustratively, the camera module 3 may be fixed in the mounting hole 131 by screwing, clamping, welding, magnetic attraction, or the like. It will be appreciated that in other embodiments, the camera module 3 may be disposed on the back side of the screen 14, where the light incident surface of the camera module 3 is opposite to the screen 14, and a light transmitting window is disposed on a region of the screen 14 opposite to the light incident surface of the camera module 3, so as to form an under-screen camera.

Referring to fig. 5, fig. 5 is a perspective view of the keyboard main unit 2 of the electronic device 100 shown in fig. 1, and fig. 6 is a cross-sectional view taken along line A-A of the perspective view shown in fig. 5. In the present embodiment, the keyboard main unit 2 includes a housing 21, a middle board 22, a keyboard 23, and a main board 24. It should be noted that fig. 5 to 6 only schematically illustrate some components included in the keyboard host 2, and the actual shape, the actual size, the actual position, and the actual configuration of these components are not limited by fig. 2 and 3 and the following drawings.

The housing 21 serves to protect the internal structure of the keyboard main unit 2. The housing 21 may be a single structural unit or may be assembled from multiple parts. In some embodiments, referring to fig. 5-6, the housing 21 includes a C-housing 211 and a D-housing 212. The C-case 211 and the D-case 212 are combined to enclose an internal accommodating space 21a of the case 21. The C-case 211 and the D-case 212 may be fixed by a snap fit, may be fixed by an adhesive, or may be fixed by a screw connection, which is not particularly limited herein.

The middle plate 22 is located in the inner accommodation space 21a of the housing 21. The middle plate 22 is fixed to the inner surface of the C-housing 211 by means of gluing, clamping, screwing, riveting, or the like. In other embodiments, midplane 22 may also be secured to the inner surface of D-shell 212. The material of midplane 22 includes, but is not limited to, plastic and metal. The middle plate 22 serves as a supporting "skeleton" for the electronic components within the keyboard host 2. The keyboard 23 and the heat dissipation module 25 are fixed to the middle plate 22 by direct or indirect means.

The keyboard 23 is used for inputting instructions and data. The keyboard 23 includes a fixed plate 231 and a plurality of keys 232 connected to the fixed plate 231. Referring to fig. 6, the fixing plate 231 is fixed on the middle plate 22. The middle plate 22 is provided with a first avoiding opening 22a. The C-shell 211 is provided with a second avoiding opening 211a corresponding to each key 232. The key 232 passes through the first avoiding opening 22a and the second avoiding opening 211a corresponding to the key 232 to extend out of the C-shaped housing 211.

The motherboard 24 is used for integrating control chips. The control chip may include a central processing unit (central processing unit, CPU), a graphics processor (graphics processing unit, GPU), an application processor (application processor, AP), a double data rate synchronous dynamic random access memory (DDR), a universal memory (universal flash storage, UFS), and the like.

The motherboard 24 may be a hard circuit board, a flexible circuit board, or a combination of hard and soft circuit boards. The main board 24 may be an FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, or the like. Here, FR-4 is a code of a flame resistant material grade, and the Rogers dielectric board is a high frequency board. The main board 24 may be electrically connected to the display screen 142 and the camera module 3, so as to store and process the image information acquired by the camera module 3, and send the image information to the screen 14 for display.

Referring to fig. 7-8, fig. 7 is a perspective view of a camera module 3 according to some embodiments of the present application, and fig. 8 is an exploded view of the perspective view shown in fig. 7. At least part of the camera module 3 is arranged in the mounting hole 131 on the frame 13. The light incident surface 32a of the camera module 3 is opposite to the mounting hole 131. In the present embodiment, the camera module 3 includes a mount 31, a lens 32, an optical filter 33, a photosensitive chip 34, and a circuit board 35.

It should be noted that fig. 7 to 8 only schematically illustrate some components included in the camera module 3, and the actual shape, the actual size, the actual position, and the actual configuration of these components are not limited by fig. 7 and 8 and the following drawings. In addition, the coordinate system in fig. 7 to 8 is represented as the same coordinate system as that in fig. 1. That is, the positional relationship of each component in the camera module 3 in fig. 7 to 8 in the coordinate system shown in fig. 1 is the same as the positional relationship of each component in the camera module 3 in the coordinate system shown in fig. 1 when the camera module 3 is applied to the electronic device 100 shown in fig. 1. The coordinate system in the drawings of each component in the camera module 3 described below and the coordinate system in the camera module 3 shown in fig. 7 to 8 are also denoted as the same coordinate system, and the "same coordinate system" should be understood as the same coordinate system described above, and will not be described in detail below.

In addition, the description below of the "top" employed by the components in the camera module 3 refers to the side of the described components that are close to the object along the optical path when the camera module 3 is applied to the electronic apparatus 100 shown in fig. 1, and the "bottom" refers to the side of the described components that are far from the object along the optical path when the camera module 3 is applied to the electronic apparatus 100 shown in fig. 1, rather than indicating or implying that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

The mount 31 is used to fix the lens 32, the filter 33, and the circuit board 35. Referring to fig. 9-11, fig. 9 is a top view of the camera module 3 shown in fig. 7, fig. 10 is a cross-sectional view taken along line B-B of fig. 9, and fig. 11 is a cross-sectional view taken along line C-C of fig. 9. The mount 31 is formed in a rectangular parallelepiped cover structure. Referring to fig. 10-11, the bottom of the mounting seat 31 is opened, and a light hole 311 is formed in the top wall of the mounting seat 31. The length direction of the mount 31 is parallel to the X-axis direction, the width direction of the mount 31 is parallel to the Y-axis direction, and the height direction of the mount 31 is parallel to the Z-axis direction. In other embodiments, the mounting seat 31 may also be square, cylindrical, etc.

Referring to fig. 10 to 11, the lens 32 includes a barrel 321 and a lens 322. The lens barrel 321 is used to fix and protect the lens 322. The lens barrel 321 has a cylindrical structure. That is, both ends of the lens barrel 321 in the optical axis direction are open. The lens 322 is mounted in the lens barrel 321, and the lens 322 may be fixed to an inner wall surface of the lens barrel 321 by adhesion, clipping, or the like. The lenses 322 may be one or more (i.e., two or more). When the number of lenses 322 is plural, the plural lenses 322 are stacked in the optical axis direction of the lens 32. By designing the structural composition of the lenses 322 and the shape and size of each lens 322, lenses 32 having different characteristics of standard, wide angle, tele, etc. can be obtained. Wherein the optical axis direction of the lens 32 is parallel to the Z-axis direction.

With continued reference to fig. 10-11, the lens 32 has an incident surface 32a and an emergent surface 32b opposite to each other. The light of the scene is incident into the lens 32 through the light incident surface 32a and is emitted out through the light emergent surface 32b. The lens 32 is mounted on the top wall of the mount 31. Specifically, the lens barrel 321 surrounds the periphery of the light hole, the lens 322 is opposite to the light hole 311, and the optical axis direction of the lens 32 is consistent with the axial direction of the light hole 311.

In some embodiments, the lens barrel 321 is of unitary construction with the mount 31. That is, the lens barrel 321 and the mount 31 are integrally formed. In this way, the assembling steps of the camera module 3 can be simplified, and the connection strength between the lens barrel 321 and the mount 31 can be improved.

The circuit board 35 is for electrical connection with the motherboard. The circuit board 35 may be a hard circuit board or a flexible circuit board, or may be a soft-hard combined circuit board. When the circuit board 35 is a flexible circuit board or a soft and hard combined circuit board, a rigid reinforcing plate may be provided to increase the strength of the circuit board 35. Referring to fig. 10-11, the circuit board 35 has a first surface 351 and a second surface 352 opposite to each other, and one end of the mount 31 away from the lens 32 is fixed on the first surface 351.

With continued reference to fig. 10-11, the photosensitive chip 34 is configured to collect the imaging beam imaged by the lens 32 and convert the image information carried by the imaging beam into an electrical signal. The photosensitive chip 34 may also be referred to as an image sensor, or may also be referred to as a photosensitive element. The photosensitive chip 34 is located on one side of the lens 32. Specifically, the photosensitive chip 34 is disposed on the first surface 351 of the circuit board 35, and a side surface of the photosensitive chip 34 facing away from the first surface 351 includes a first photosensitive area 341, where a plurality of photosensitive units 341a arranged in an array are disposed on the first photosensitive area 341.

Referring to fig. 12, fig. 12 is a schematic layout diagram of the photosensitive cells 341a of the photosensitive chip 34 shown in fig. 11. In this embodiment, the photosensitive area of each photosensitive cell 341a of the photosensitive chip 34 is the same. Alternatively, each of the photosensitive cells 341a is identical in shape and size. Thus, the photosensitive chip 34 has simple structure, convenient processing and low manufacturing cost. It is understood that in other embodiments, the photosensitive area of each photosensitive cell 341a may also be different.

With continued reference to fig. 10-11, the optical filter 33 is located on a side of the photosensitive chip 34 away from the circuit board 35, and the optical filter 33 is fixed on the inner peripheral surface of the mounting base 31. Specifically, the filter 33 is fixed to the inner peripheral surface of the mount 31 by means of adhesion, engagement, screw connection, or the like. In other embodiments, the optical filter 33 may be fixed to the inner peripheral surface of the mounting base 31 by a bracket, and the optical filter 33 may be fixed to the bracket by gluing, clamping, screwing, or the like.

The optical filter 33 can be used for filtering stray light in the imaging light beam imaged by the lens 32, so as to ensure that the image shot by the camera module 3 has better definition. The filter 33 includes, but is not limited to, a blue glass filter. For example, the filter 33 may be a reflective infrared filter, or a two-pass filter. The dual-pass filter 33 may transmit the visible light and the infrared light in the imaging beam simultaneously, or transmit the visible light and the light of other specific wavelength (for example, ultraviolet light) in the imaging beam simultaneously, or transmit the infrared light and the light of other specific wavelength (for example, ultraviolet light) simultaneously. In other embodiments, the camera module 3 may not be provided with the optical filter 33.

Referring to fig. 11 in combination with fig. 9, the width w1 of the camera module 3 is determined by the larger one of the radial dimension D of the lens 32 and the width w2 of the mount 31. The width w2 of the mount 31 is determined by the width w3 of the photosensitive chip 34, and the radial dimension D of the lens 32 is determined by the maximum imaging circle of the lens 32.

In some embodiments, referring to fig. 13, fig. 13 is a schematic structural diagram of an imaging area 32c1 of the lens 32 on a side surface of the photosensitive chip 34 facing the lens 32 and a first photosensitive area 341 of the photosensitive chip 34 in some embodiments. The imaging area 32c1 of the lens 32 on the surface of the photosensitive chip 34 facing the lens 32 refers to the orthographic projection of the maximum imaging circle of the lens 32 on the surface of the photosensitive chip 34 facing the lens 32, that is, the projection range of the light passing through the lens 32 on the plane of the photosensitive chip 34. The shape of the imaging region 32c1 is the same as that of the lens 32. In this embodiment, the imaging region 32c1 is circular. In other embodiments, the imaging region 32c1 of the lens 32 may also be rectangular, square, oval, etc. For convenience of description, hereinafter, the "imaging region 32c1 of the lens 32 on the side surface of the photosensitive chip 34 facing the lens 32" will be simply referred to as "imaging region 32c1 of the lens 32".

In order to fully utilize the first photosensitive region 341 of the photosensitive chip 34 to improve the imaging quality, the entire area of the first photosensitive region 341 needs to be covered by the imaging region 32c1 of the lens 32. For example, in the embodiment shown in fig. 13, the radius r0 of the imaging region 32c1 of the lens 32 is designed to be equal to one half of the diagonal d0 of the first photosensitive region 341. The first photosensitive region 341 is inscribed in the outer contour of the imaging region 32c1 of the lens 32. In this way, all the photosensitive cells 341a on the first photosensitive region 341 can be covered by the imaging region 32c1 of the lens 32, which is beneficial to improving imaging quality.

Under the condition of the current manufacturing process, since it is required to ensure that the imaging area 32c1 of the lens 32 can cover all the photosensitive areas on the photosensitive chip 34, the width dimension w1 of the camera module 3 is determined by the radial dimension D of the lens 32.

However, in practical applications, there may be a case where the aspect ratio of the video output mode and the image display mode supported by the third party application on the electronic device 100 does not match the aspect ratio of the first photosensitive area 341 of the photosensitive chip 34. That is, the aspect ratio of the video output mode and the image display mode supported by the third party application is different from that of the first photosensitive region 341 of the photosensitive chip 34. At this time, when the camera module 3 actually forms an image, an area matching the aspect ratio of the video output mode and the image display mode supported by the third party application is cut out from the area covered by the imaging area 32c1 of the lens 32 to form an image. Referring to fig. 13, the cut area is an effective photosensitive area 342 of the photosensitive chip 34. The photo chip 34 outputs an image according to the signal value of the effective photo area 342. At this time, a part of the area covered by the imaging area 32c1 of the lens 32 is the ineffective imaging area 343 (i.e., the area shown by the hatched portion in fig. 13), resulting in redundancy in the structure of the lens 32.

Specifically, in a notebook computer, the aspect ratio of a video output mode supported by a third party application program (such as skype, tech conference, welink conference, etc.) supporting a video call (or video display) is typically 16:9, and the resolution of the photosensitive chip 34 with the aspect ratio of 16:9, because of the small required amount, the production cost is high, the model is not complete, and in practical application, the photosensitive chip 34 with the aspect ratio and the resolution that are adapted to the video output mode of the third party application program may not be found.

For example, industry does not have a 16:9 aspect ratio, 5M (500W pixels) resolution photosensitive chip 34, and therefore a 4:3 aspect ratio, 5M resolution photosensitive chip 34 is typically used to output a 16:9 aspect ratio video image. Thus, the production cost can be greatly reduced and the production cycle can be shortened as compared with customizing the photosensitive chip 34 of the corresponding specification type.

However, as described above, in this case, if the entire area of the first photosensitive region 341 is covered by the imaging region 32c1 of the lens 32, a part of the area covered by the imaging region 32c1 of the lens 32 is the ineffective imaging region 343, which causes redundancy in the structure of the lens 32, and thus increases the width dimension w1 of the camera module 3. Referring back to fig. 4, the width w1 of the camera module 3 directly affects the width w4 of the frame 13, so that the width w4 of the frame 13 is increased, which is not beneficial to increasing the screen duty ratio of the electronic device 100 and affecting the display effect of the electronic device 100.

For example, when the aspect ratio of the video output mode supported by the third party application is 16:9 and the camera module 3 employs the photosensitive chip 34 with the aspect ratio of 4:3 and the resolution of 5M, when the resolution of the output video frame reaches 2560×1440, the width dimension w1 of the camera module 3 needs to be 5mm or more, and the dimension of the camera module 3 is larger.

In order to solve the above-mentioned problems, referring to fig. 14, fig. 14 is a schematic structural diagram of an imaging area 32c2 of a lens 32, a first photosensitive area 341 of a photosensitive chip 34, and an effective photosensitive area 342 in a camera module 3 according to another embodiment of the application.

Referring to fig. 14, the effective photosensitive region 342 is located in the first photosensitive region 341, and the area of the effective photosensitive region 342 is smaller than that of the first photosensitive region 341. The active photosensitive area 342 may be the largest active photosensitive area cropped according to the aspect ratio of the video output mode supported by the third party application. In some embodiments, the geometric center of the effective photosensitive region 342 may coincide with the geometric center of the first photosensitive region 341. In other embodiments, the geometric center of the effective photosensitive region 342 may not coincide with the geometric center of the first photosensitive region 341.

Specifically, the effective photosensitive area 342 is located within the imaging area 32c2 of the lens 32, and a portion of the first photosensitive area 341 is located outside the imaging area 32c2 of the lens 32. Like this, can guarantee that effective sensitization district 342 all can be covered by the imaging region 32c2 of camera lens 32, when guaranteeing the shooting effect of camera module 3, can reduce the redundant size of camera lens 32, and then can reduce the width dimension w1 of camera module 3, be favorable to reducing the width dimension w4 of frame, improve the screen ratio.

In some embodiments, the effective photosensitive area 342 is inscribed within the outer contour of the imaging area 32c2 of the lens 32. The radius r of the imaging area 32c2 of the lens 32 at this time is equal to one half of the diagonal d of the effective photosensitive area 342. That is, the projection area of the light passing through the lens 32 on the photosensitive chip 34 is covered in accordance with the area of the effective photosensitive area. Thus, referring to fig. 14, the radius of the imaging area 32c2 of the lens 32 can be reduced from r0 to r, which can effectively eliminate redundancy of the size of the lens 32, further reduce the width w1 of the camera module 3, and facilitate further reducing the width w4 of the frame and improving the screen ratio.

According to the camera module 3 provided by the application, the imaging area 32c2 of the lens 32 is designed according to the size of the effective photosensitive area 342, so that when the aspect ratio of the photosensitive chip 34 is not matched with the aspect ratio of the video output mode supported by the third-party application program, the effective photosensitive area 342 can be arranged according to the aspect ratio of the video output mode supported by the third-party application program, thereby ensuring the imaging effect of video images, reducing the size of the lens 32, being beneficial to reducing the width size of the frame 13 and improving the screen occupation ratio.

In some embodiments, referring to fig. 14, the effective photosensitive area 342 and the first photosensitive area 341 are rectangular. The long side of the effective photosensitive area 342 is parallel to the long side of the first photosensitive area 341, and the short side of the effective photosensitive area 342 is parallel to the short side of the first photosensitive area 341. Thus, the area of the effective photosensitive region 342 can be increased, the utilization rate of the first photosensitive region 341 can be improved, and the image forming effect can be improved.

In some embodiments, the aspect ratio of the effective photosensitive area 342 that the lens 32 can cover is 16:9. In this way, the aspect ratio of the active photosensitive area 342 can be adapted to the aspect ratio of the video output mode supported by the third party application.

Further, in some embodiments, the aspect ratio of the first photosensitive region 341 is 4:3, and the aspect ratio of the effective photosensitive region 342 that the lens 32 can cover is 16:9. In this way, the aspect ratio of the effective photosensitive area 342 can be adapted to the aspect ratio of the video output mode supported by the third party application program, and the photosensitive chip 34 with lower cost can be selected, compared with the photosensitive chip 34 with customized corresponding specification and model, the imaging quality can be ensured while the production cost is reduced and the production period is shortened.

Illustratively, the resolution of the first photosensitive region 341 is 2592×1944, and the resolution of the effective photosensitive region 342 is 2560×1440. I.e., 500 tens of thousands of pixels of the photosensitive chip 34, and 370 tens of thousands of imaging pixels of the lens 32. In this way, the photosensitive unit 341a in the first photosensitive area 341 can be fully utilized, the imaging pixels of the lens 32 can be maximized, the imaging quality can be improved, and compared with the camera module 3 supporting the same video picture resolution, the size of the camera module 3 in the embodiment is smaller, so that the miniaturization design of the camera module 3 can be realized.

In some embodiments, the camera module 3 can support 2560×1440 high definition video, and the width dimension w1 of the camera module 3 may be less than or equal to 4.1mm. Further, the width w1 of the camera module 3 may be less than or equal to 3.85mm. Illustratively, the width dimension w1 of the camera module 3 may be 3.85mm, 3.8mm, 3.75mm, etc. Therefore, the width dimension of the camera module 3 is reduced, the frame width of the electronic device 100 is reduced, and the screen occupation ratio of the electronic device 100 is improved.

On the basis of the above embodiment, the width w4 of the bezel 13 may be less than or equal to 8.75mm. Further, the width w4 of the frame 13 may be less than or equal to 8.5mm. Illustratively, the width w4 of the bezel 13 may be 8.5mm, 8.45mm, 8.4mm, 8.35mm, etc.

It is understood that in other embodiments, the resolution of the first photosensitive region 341 may be 4160×3120, and the resolution of the effective photosensitive region 342 may be 3840×2160. I.e., 1300 tens of thousands of pixels of the photosensitive chip 34 and 830 tens of thousands of imaging pixels of the lens 32. Thus, the camera module 3 in the present embodiment can be designed to be miniaturized as well with respect to the camera module 3 supporting the same video image resolution.

Referring back to fig. 11, the height h of the camera module 3 is related to the distance TTL between the light incident surface 32a of the lens 32 and the imaging surface on the optical axis. The imaging surface of the lens 32 is a surface of the photosensitive chip 34 facing the lens 32. Specifically, the height dimension h of the camera module 3=the distance TTL between the light incident surface 32a of the lens 32 and the imaging surface on the optical axis+the thickness dimension t1 of the photosensitive chip 34+the thickness dimension t2 of the adhesive 36 between the photosensitive chip 34 and the circuit board 35+the thickness dimension t3 of the circuit board 35. Since the dimensions of t1, t2 and t3 are relatively fixed, the height h of the camera module 3 is mainly affected by the dimension of TTL. And the ratio of TTL to the radius of the largest imaging circle of the lens 32 affects the difficulty of machining the lens 32. The larger the ratio of TTL to the radius of the largest imaging circle of the lens 32, the smaller the processing difficulty of the lens 32; the smaller the ratio of TTL to the radius of the largest imaging circle of the lens 32, the greater the difficulty of machining the lens 32. In some embodiments of the present application, since the effective photosensitive area 342 to be covered by the imaging area 32c1 of the lens 32 is smaller, the radius of the largest imaging circle of the lens 32 is smaller, and the TTL size can be reduced under the same processing difficulty coefficient, which is further beneficial to reducing the height h of the camera module 3.

In some embodiments, the camera module 3 can support 2560×1440 high definition video, and the height h of the camera module 3 may be less than or equal to 3.5mm. By way of example, the height dimension h of the camera module 3 may be 3.5mm, 3.4mm, 3.3mm, 3.2mm, 3.1mm, 3.05mm, 3.02mm, 3mm, etc. Therefore, the thickness of the frame 13 can be reduced, and the thickness of the display 1 can be reduced, which is beneficial to the realization of the light and thin design of the electronic device 100.

In some embodiments, the first photosensitive region 341 has a plurality of photosensitive cells 341a arranged in an array, and each of the photosensitive cells 341a can be independently controlled to be turned on and off. Thus, when the camera module 3 works, the photosensitive unit 341a in the effective sensing area 342 can be controlled to be turned on, and the photosensitive unit 341a outside the effective sensing area 342 is controlled to be turned off. Thus, the photosensitive area of the photosensitive chip 34 can be adjusted and controlled conveniently, and the reliability of the photosensitive chip 34 can be improved.

In some embodiments, the camera module 3 further comprises an acquisition module 301 and a first processing module 302. Referring to fig. 15a, fig. 15a is a schematic block diagram of a camera module 3 according to some embodiments of the present application. The acquisition module 301 is configured to acquire an original image acquired by the camera module 3, the first processing module 302 is electrically connected to the acquisition module 301, and the first processing module 302 is configured to process the original image to obtain a target image. Wherein the resolution of the target image is greater than the resolution of the original image. In some embodiments, the resolution of the original image is the same as the resolution of the active photosensitive area and the resolution of the target image is the same as the resolution of the first photosensitive area.

In some embodiments, referring to fig. 15a, fig. 15a is a schematic block diagram of a camera module 3 according to some embodiments of the present application. The acquisition module 301 includes an image signal processing unit 301a (image signal processor, ISP), a digital signal processing unit 301b (digital signal process, DSP), and a reading unit 301c. ISP is electrically connected to photosensitive chip 34. The ISP is used to convert the electrical signal of the photosensitive chip 34 into a digital image signal, and the ISP may also optimize parameters such as exposure, color temperature, etc. of the photographed scene by the image signal processing unit 301 a. The DSP is electrically connected to the ISP. The DSP is used to convert digital image signals into standard RGB, YUV, etc. format image signals. The reading unit 301c is configured to read the image signal generated by the digital signal processing unit 301b to obtain an original image. Alternatively, the reading unit 301c may be a Device MFT.

In some embodiments, the resolution of the target image processed by first processing module 302 is equal to the resolution of photoreceptor chip 34. That is, the resolution of the target image processed by the first processing module 302 is equal to the resolution of the first photosensitive region 341. Illustratively, the resolution of the original image is 2560×1440, and the resolution of the first processed image may be 2592×1944. In this way, the first processing module 302 can process the original image, so as to improve the resolution of the shot image and improve the shooting effect of the camera module 3.

Specifically, the operation of the camera module 3 shown in fig. 15a is described by taking the example that the resolution of the first photosensitive region 341 of the photosensitive chip 34 is 2592×1944 and the resolution of the effective photosensitive region 342 is 2560×1440. Referring to fig. 15b, fig. 15b is a flowchart illustrating the operation of the camera module 3 shown in fig. 15 a.

When the camera module 3 works, light is transmitted to the photosensitive chip 34 through the lens 32, the photosensitive chip 34 converts an optical signal (resolution 2560×1440) into an electrical signal (resolution 2560×1440), and transmits the electrical signal (resolution 2560×1440) to the ISP to convert the electrical signal into a digital image signal (resolution 2560×1440), and the ISP outputs the digital image signal (resolution 2560×1440) to the DSP for processing. The DSP converts a digital image signal (resolution 2560×1440) into an image signal (resolution 2560×1440) in a standard format of RGB, YUV, or the like. The reading unit 301c reads the image signal (with a resolution of 2560×1440) to obtain an original image (with a resolution of 2560×1440), and transmits the image signal to the first processing module 302 for processing. The first processing module 302 may process the image signal (with a resolution of 2560×1440) by using a super-resolution algorithm, a difference algorithm, or the like to obtain a target image (with a resolution of 2592×1944), so as to improve the resolution of the original image.

In other embodiments, referring to fig. 16a, fig. 16a is a schematic block diagram of a camera module 3 according to other embodiments of the present application. In this embodiment, the camera module 3 includes an acquisition module 301, an identification module 304, an extraction module 305, and a second processing module 303. The configuration and function of the acquisition module 301 in this embodiment may be the same as those of the acquisition module 301 in the embodiment shown in fig. 15a, and will not be described here.

The identification module 304 is electrically connected to the acquisition module 301, and the identification module 304 is configured to identify a preset feature in the original image. The preset feature may be a face feature, for example. The extraction module 305 is electrically connected to the identification module 304, and the extraction module 305 is configured to extract the preset features. The second processing module 303 is electrically connected to the extracting module 305, and the second processing module 303 performs sharpness enhancement processing on the preset features extracted by the extracting module 305 to obtain a first image. The definition of the preset features in the first image is greater than the definition of the preset features in the original image. In this way, the definition of preset features in the photographed image can be improved, and the photographing effect of the camera module 3 can be improved. The term "sharpness" as used herein refers to the sharpness of each fine image and its boundary on the image.

In some embodiments, the recognition module 304 is configured to recognize the face feature, the extraction module 305 is configured to extract the face feature, and the second processing module 303 improves the sharpness through the face AI model.

It will be appreciated that in other embodiments, the preset feature may also be a landscape feature, a background feature of the image, etc.

Specifically, the operation of the camera module 3 shown in fig. 16a is described by taking the example that the resolution of the first photosensitive region 341 of the photosensitive chip 34 is 2592×1944 and the resolution of the effective photosensitive region 342 is 2560×1440 as an example. Referring to fig. 16b, fig. 16b is a flowchart illustrating the operation of the camera module 3 shown in fig. 16 a.

When the camera module 3 works, light is transmitted to the photosensitive chip 34 through the lens 32, the photosensitive chip 34 converts an optical signal (resolution 2560×1440) into an electrical signal (resolution 2560×1440), and transmits the electrical signal (resolution 2560×1440) to the ISP to convert the electrical signal into a digital image signal (resolution 2560×1440), and the ISP outputs the digital image signal (resolution 2560×1440) to the DSP for processing. The DSP converts a digital image signal (resolution 2560×1440) into an image signal (resolution 2560×1440) in a standard format of RGB, YUV, or the like. The reading unit 301c reads the image signal (with a resolution of 2560×1440), obtains an original image (with a resolution of 2560×1440), transmits the image signal (with a resolution of 2560×1440) to the recognition module 304 for face detection, extracts the face features through the extraction module 305, and the second processing module 303 improves the face definition through the face AI model to obtain a first image, so that the definition of the face features in the first image is higher than that in the original image. Thus, the definition of portrait shooting can be improved, and the shooting effect of the camera module 3 can be improved.

Further, referring to fig. 17a, fig. 17a is a schematic block diagram of a camera module 3 according to still another embodiment of the present application. In this embodiment, the camera module 3 comprises a third processing module 306 in addition to the acquisition module 301, the identification module 304, the extraction module 305, the second processing module 303 in the embodiment shown in fig. 16 a. The third processing module 306 is electrically connected to the second processing module 303, and the third processing module 306 is configured to process the first image to obtain a target image, where a resolution of the target image is higher than a resolution of the original image.

The third processing module 306 may process the image signal by a super-resolution algorithm, a difference algorithm, or the like to improve the resolution of the original image. In some embodiments, the resolution of the target image processed by third processing module 306 is equal to the resolution of photoreceptor chip 34. That is, the resolution of the target image processed by the third processing module 306 is equal to the resolution of the first photosensitive region 341. Illustratively, the resolution of the target image may be 2592×1944.

In this way, the third processing module 306 can process the image, so as to improve the resolution of the shot image and improve the shooting effect of the camera module 3.

Specifically, the operation of the camera module 3 shown in fig. 17a is described by taking the example that the resolution of the first photosensitive region 341 of the photosensitive chip 34 is 2592×1944 and the resolution of the effective photosensitive region 342 is 2560×1440. Referring to fig. 17b, fig. 17b is a flowchart illustrating the operation of the camera module 3 shown in fig. 17 a.

When the camera module 3 works, light is transmitted to the photosensitive chip 34 through the lens 32, the photosensitive chip 34 converts an optical signal (resolution 2560×1440) into an electrical signal (resolution 2560×1440), and transmits the electrical signal (resolution 2560×1440) to the ISP to convert the electrical signal into a digital image signal (resolution 2560×1440), and the ISP outputs the digital image signal (resolution 2560×1440) to the DSP for processing. The DSP converts a digital image signal (resolution 2560×1440) into an image signal (resolution 2560×1440) in a standard format of RGB, YUV, or the like. The reading unit 301c reads the image signal (with a resolution of 2560×1440) to obtain an original image (with a resolution of 2560×1440), and transmits the image signal (with a resolution of 2560×1440) to the recognition module 304 for face detection, and extracts the face features through the extraction module 305, and the second processing module 303 improves the face definition through the face AI model to obtain a second processed image (with a resolution of 2560×1440). The third processing module 306 processes the second processed image (with a resolution of 2560×1440) by using a super-resolution algorithm, a difference algorithm, and the like, to obtain a third processed image (with a resolution of 2592×1944).

In some embodiments, the camera module 3 can support 2560×1440 resolution of high-definition video and 2592×1944 resolution of photographing under the condition that the width dimension of the camera module 3 is 3.85mm, and can improve the definition of a face, and can give consideration to high-definition video display, high-definition photographing and miniaturization design of the camera module.

The embodiment of the application also provides an electronic device 100, where the electronic device 100 includes the camera module 3 in any of the above-mentioned technical solutions, and since the electronic device 100 provided in the embodiment of the application includes the speaker module 3 described in the above-mentioned embodiment, the two can solve the same technical problems and achieve the same effects.

The application also provides an image processing method which is used for the electronic equipment to process the original image acquired by the camera module. Referring to fig. 18, fig. 18 is a flowchart illustrating an image processing method according to an embodiment of the application. The image processing method may include the steps of:

step 1801, processing the original image to obtain a target image, where the resolution of the target image is greater than that of the original image. The original image is an unprocessed image acquired by the camera module. In some embodiments, the resolution of the original image is the same as the resolution of the active photosensitive area and the resolution of the target image is the same as the resolution of the first photosensitive area.

Optionally, the electronic device may acquire the original image through the acquiring module, and process the original image through the first processing module. The first processing module is electrically connected with the acquisition module. In some embodiments, the acquisition module includes an image signal processing unit (image signal processor, ISP), a digital signal processing unit (digital signal process, DSP), and a reading unit. The ISP is electrically connected with the photosensitive chip. The DSP is electrically connected to the ISP. The reading unit is used for reading the image signal generated by the digital signal processing unit to obtain an original image.

Illustratively, light is transmitted through a lens onto a light-sensing chip, which converts the light signal into an electrical signal and transmits the electrical signal to an ISP, which converts the electrical signal into a digital image signal, which outputs the digital image signal to a DSP process. The DSP converts the digital image signal into an image signal in a standard RGB, YUV, or the like format. The reading unit reads the image signal to obtain an original image.

The first processing module can process the image signals through a super-resolution algorithm, a difference algorithm and the like to obtain a target image so as to improve the resolution of an original image.

In some embodiments, the reading unit may directly transfer the image signal of the original image to the first processing module for processing to obtain the target image.

In other embodiments, referring to fig. 19, fig. 19 is a flowchart of an image processing method according to other embodiments of the present application. Processing the original image may further comprise the step of, wherein the original image comprises preset features:

step 1901, extracting preset features, and processing the preset features to obtain a first image, so that the definition of the preset features in the first image is greater than that of the preset features in the original image;

in step 1902, the first image is processed to obtain a target image.

Optionally, the electronic device may identify the preset features in the original image through the identification module, extract the preset features through the extraction module, and perform sharpness enhancement processing on the preset features extracted by the extraction module through the second processing module, so as to obtain a first image, so that sharpness of the preset features in the first image is greater than sharpness of the preset features in the original image. And then, the first image is processed through a first processing module to obtain a target image. Therefore, the definition of preset features in the shot image can be improved, the resolution of the original image is improved, and the shooting effect of the camera module can be further improved.

In this embodiment, the preset feature may be a face feature. The second processing module can improve the definition of the face features through the face AI model. In other embodiments, the preset features may also be scenic features, background features of the image, etc.

The embodiment of the application also provides electronic equipment which comprises one or more processors and one or more memories. The one or more memories are coupled to the one or more processors, the one or more memories being configured to store computer program code comprising computer instructions that, when executed by the one or more processors, cause the electronic device to perform the relevant method steps described above to implement the image processing methods of the embodiments described above.

Embodiments of the present application also provide a computer-readable storage medium having stored therein computer instructions which, when executed on an electronic device, cause the electronic device to perform the above-described related method steps to implement the image processing method in the above-described embodiments.

Embodiments of the present application also provide a computer program product comprising computer instructions which, when run on an electronic device, cause the electronic device to perform the above-described related method steps to implement the image processing method of the above-described embodiments.

The electronic device, the computer readable storage medium or the computer program product provided in this embodiment are configured to execute the corresponding method provided above, and therefore, the advantages achieved by the electronic device, the computer readable storage medium or the computer program product can refer to the advantages of the corresponding method provided above, which are not described herein.

From the foregoing description of the embodiments, it will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of functional modules is illustrated, and in practical application, the above-described functional allocation may be performed by different functional modules according to needs, i.e. the internal structure of the electronic device is divided into different functional modules to perform all or part of the functions described above.

In the several embodiments provided in the present application, it should be understood that the disclosed electronic device and method may be implemented in other manners. For example, the above-described embodiments of the electronic device are merely illustrative, e.g., the division of the modules or units is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another electronic device, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and the parts displayed as units may be one physical unit or a plurality of physical units, may be located in one place, or may be distributed in a plurality of different places. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

The functional units in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.

The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the embodiments of the present application may be essentially or a part contributing to the prior art or all or part of the technical solution may be embodied in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor to perform all or part of the steps of the method described in the embodiments of the present application. And the aforementioned storage medium includes: flash memory, removable hard disk, read-only memory, random access memory, magnetic or optical disk, and the like.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, comprising:

the camera module comprises a lens and a photosensitive chip; the light sensing chip is positioned on the light emitting side of the lens, one side surface of the light sensing chip facing the lens comprises a first light sensing area, a plurality of light sensing units arranged in an array are arranged on the first light sensing area, the first light sensing area comprises an effective light sensing area, the light sensing units in the effective light sensing area are opened, and the light sensing units outside the effective light sensing area are closed; the first photosensitive area and the effective photosensitive area are rectangular, and the length-width ratio of the first photosensitive area is 4:3, the aspect ratio of the effective photosensitive area is 16:9, the area of the effective photosensitive area is smaller than that of the first photosensitive area, the orthographic projection of the largest imaging circle of the lens on the surface of one side of the photosensitive chip facing the lens is an imaging area, the effective photosensitive area is inscribed in the outline of the imaging area, and a part of the first photosensitive area is positioned outside the imaging area;

The novel imaging device comprises a screen, and is characterized by further comprising the screen and a frame, wherein the frame is arranged around the periphery of the screen, a mounting hole is formed in the frame, a lens is arranged in the mounting hole, and the size of the lens is determined by the imaging area so as to limit the width of the frame.

2. The electronic device of claim 1, wherein the imaging area is circular.

3. The electronic device of claim 1 or 2, wherein a long side of the active photosensitive area is parallel to a long side of the first photosensitive area, and a broad side of the active photosensitive area is parallel to a broad side of the first photosensitive area.

4. The electronic device of claim 1 or 2, wherein the resolution of the active photosensitive area is 2560 x 1440.

5. The electronic device of claim 4, wherein the width of the camera module is less than or equal to 4.1mm.

6. The electronic device of claim 5, wherein the camera module has a width of less than or equal to 3.85mm.

7. The electronic device of claim 5 or 6, wherein the height of the camera module is less than or equal to 3.5mm.

8. The electronic device of claim 7, wherein the height of the camera module is less than or equal to 3.02mm.

9. The electronic device of any one of claims 1, 2, 5, 6 or 8, wherein each of the light sensing units is independently controllable to be turned on and off.

10. The electronic device of any one of claims 1, 2, 5, 6, or 8, comprising:

the display is provided with a display area and a non-display area, and the camera module is arranged in the non-display area.

11. The electronic device of claim 10, wherein the electronic device comprises a memory device,

at least part of the camera module is arranged in the mounting hole, the area of the screen exposed out of the frame forms the display area of the display, and the area of the frame forms the non-display area of the display.

12. The electronic device of claim 11, wherein the bezel has a width of less than or equal to 8.75mm.

13. The electronic device of claim 12, wherein the bezel has a width of less than or equal to 8.5mm.

14. The electronic device of any of claims 11-13, further comprising a keyboard host rotatably coupled to the display.

15. An electronic device, comprising:

The camera module comprises a lens and a photosensitive chip; the light sensing chip is positioned on the light emitting side of the lens, one side surface of the light sensing chip facing the lens comprises a first light sensing area, a plurality of light sensing units arranged in an array are arranged on the first light sensing area, the first light sensing area comprises an effective light sensing area, the light sensing units in the effective light sensing area are opened, and the light sensing units outside the effective light sensing area are closed; the first photosensitive area and the effective photosensitive area are rectangular, and the length-width ratio of the first photosensitive area is 4:3, the aspect ratio of the effective photosensitive area is 16:9, the area of the effective photosensitive area is smaller than that of the first photosensitive area; the width of the camera module is smaller than or equal to 4.1mm, and the height of the camera module is smaller than or equal to 3.5mm;

the display comprises a frame and a screen, the frame surrounds one circle of the screen, a first side wall of the frame is connected with the keyboard host in a rotating mode, a mounting hole is formed in a second side wall of the frame, the width of the second side wall of the frame is smaller than or equal to 8.5mm, and at least part of the camera module is arranged in the mounting hole.

16. The electronic device of claim 15, wherein the electronic device comprises a memory device,

the orthographic projection of the maximum imaging circle of the lens on the surface of one side of the photosensitive chip facing the lens is an imaging area, the imaging area is circular, and the effective photosensitive area is inscribed on the outer contour of the imaging area.

17. The electronic device of claim 15 or 16, wherein a long side of the active photosensitive area is parallel to a long side of the first photosensitive area, and a broad side of the active photosensitive area is parallel to a broad side of the first photosensitive area.

18. The electronic device of claim 15 or 16, wherein the resolution of the active photosensitive area is 2560 x 1440.

19. An electronic device according to claim 15 or 16, wherein each of the light sensing units is independently controllable to be turned on and off.

20. An image processing method is used for processing an original image acquired by a camera module and is characterized in that,

the camera module comprises a lens and a photosensitive chip;

the light sensing chip is positioned on the light emitting side of the lens, one side surface of the light sensing chip facing the lens comprises a first light sensing area, a plurality of light sensing units arranged in an array are arranged on the first light sensing area, the first light sensing area comprises an effective light sensing area, the light sensing units in the effective light sensing area are opened, and the light sensing units outside the effective light sensing area are closed; the first photosensitive area and the effective photosensitive area are rectangular, and the length-width ratio of the first photosensitive area is 4:3, the aspect ratio of the effective photosensitive area is 16:9, the area of the effective photosensitive area is smaller than that of the first photosensitive area;

The method comprises the following steps:

the lens receives light rays and transmits the light rays to the effective photosensitive area so as to obtain the original image;

processing the original image to obtain a target image; the resolution of the original image is equal to the resolution of the effective photosensitive area, and the resolution of the effective photosensitive area is equal to 16:9, the resolution of the target image is equal to the resolution of the first photosensitive area, and the resolution of the first photosensitive area is equal to 4: and 3 corresponds to.

21. The image processing method according to claim 20, wherein the original image includes a preset feature, and processing the original image includes:

extracting the preset features, and processing the preset features to obtain a first image, wherein the definition of the preset features in the first image is greater than that of the preset features in the original image;

and processing the first image to obtain the target image.

22. The image processing method according to claim 21, wherein the preset feature is a face feature.

23. The image processing method according to claim 22, characterized in that the face features in the original image are processed using a face AI model.

24. The image processing method according to any one of claims 20 to 23, wherein the resolution of the original image is equal to the resolution of the effective photosensitive area, and the resolution of the target image is equal to the resolution of the first photosensitive area.

25. An electronic device, comprising:

one or more processors;

a memory;

wherein the memory has stored therein one or more computer programs, the one or more computer programs comprising instructions, which when executed by the electronic device, cause the electronic device to perform the image processing method of any of claims 20-23.

26. A computer readable storage medium having instructions stored therein, which when run on an electronic device, cause the electronic device to perform the image processing method of any of claims 20-23.