WO2022127658A1

WO2022127658A1 - Photographic module, and electronic device

Info

Publication number: WO2022127658A1
Application number: PCT/CN2021/136278
Authority: WO
Inventors: 范敦贵
Original assignee: 维沃移动通信有限公司
Priority date: 2020-12-15
Filing date: 2021-12-08
Publication date: 2022-06-23
Also published as: CN112492235A

Abstract

Disclosed are a photographic module and an electronic device. The photographic module comprises a camera assembly, a sensor and a circuit board, wherein the camera assembly comprises a photographic structure; the sensor comprises a photosensitive chip and an infrared radiation optical structure arranged on a surface of the photosensitive chip; and the sensor is electrically connected to the circuit board.

Description

A camera module and electronic equipment

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Chinese Patent Application No. 202011500822.8 filed on December 15, 2020, entitled "A Camera Module and Electronic Equipment", the entire contents of which are incorporated herein by reference.

technical field

The present application belongs to the technical field of mobile terminals, and in particular relates to a camera module and an electronic device.

Background technique

With the rapid development of electronic technology, more and more electronic devices have entered people's lives, such as smartphones, tablet computers, notebook computers and smart wearable devices. Nowadays, electronic devices have more and more functions. Electronic devices usually have a camera function, so as to meet the shooting needs of users. The shooting function of the electronic device is usually completed by the camera module set on it.

In the related art, the structure of a traditional camera module usually includes a camera lens, a driving motor, a photosensitive device, an infrared radiation (Infrared Radiation, IR) filter and other devices. In the process of assembling the camera module, it is found that the IR filter is easily broken, which brings difficulties to the assembly of the camera module. Moreover, the IR filter also affects the transmittance of light to a certain extent, which in turn affects the photosensitive function of the photosensitive device, which will eventually affect the shooting effect, which will reduce the user's experience. In addition, each device included in the camera module itself has a certain height. When these devices are combined, they will occupy a large space in height, which will lead to a larger structure size of the formed camera module. , especially with larger dimensions in the height direction. As users have more and more functional requirements for camera modules, this will also lead to larger and larger structure sizes of camera modules, which is not conducive to the assembly of camera modules on electronic devices, and cannot meet users' requirements for thin and light electronic devices. ization needs.

SUMMARY OF THE INVENTION

The present application aims to provide a camera module and an electronic device, which at least solve the problems of the existing camera module that the low light transmittance affects the shooting effect and the structure size is relatively large.

The embodiment of the present application proposes a camera module, and the camera module includes:

a camera assembly, the camera assembly includes a camera structure;

a sensor, the sensor includes a photosensitive chip and an infrared optical structure disposed on the surface of the photosensitive chip; and,

A circuit board, the sensor is electrically connected to the circuit board.

In the embodiment of the present application, by disposing an infrared optical structure on the surface of the photosensitive chip, the device of disposing an IR filter in the camera module can be eliminated, which can effectively avoid the IR filter in the process of assembling the camera module. If the film is accidentally broken, the assembly difficulty of the camera module can be reduced. On the basis of eliminating the structure of the IR filter, space can be saved, which can appropriately reduce the structural size of the camera module, especially the size of the camera module in the height direction, which is conducive to the assembly of the camera module on electronic equipment . In this application, an infrared optical structure is arranged on the surface of the photosensitive chip. This design is also conducive to the transmission of light, which can greatly improve the photosensitive effect of the photosensitive chip, thereby improving the shooting effect of the camera module, and finally improving the user experience. user experience.

Additional aspects and advantages of the present application will be set forth, in part, from the following description, and in part will become apparent from the following description, or may be learned by practice of the present application.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:

Fig. 1 is the structural exploded schematic diagram of the camera module of the related art;

Fig. 2 is the working principle schematic diagram of the camera module of the related art;

3 is a schematic exploded view of the structure of a camera module according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a working principle of a camera module according to an embodiment of the present application.

Reference number:

1-Camera assembly, 101-Camera structure, 102-Protection structure, 2-Sensor, 201-Infrared optical structure, 202-Photosensitive chip, 3-Circuit board, 4-Drive device, 5-Drive chip, 6-Capacitor, 7 -Memory, 8-Connector, 9-IR Filter, 10-Support.

Detailed ways

The following will describe in detail the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as a limitation on the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

The features of the terms "first" and "second" in the description and claims of this application may expressly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "multiple" The meaning of "a" is two or more. In addition, "and/or" in the description and claims represents at least one of the connected objects, and the character "/" generally indicates that the associated object is a kind of "or" Relationship.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Rear, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Counterclockwise, Axial, The orientations or positional relationships indicated by "radial direction", "circumferential direction", etc. are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying the indicated devices or elements. It must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present application.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in specific situations.

The camera module according to the embodiment of the present application is further described below with reference to FIGS. 1 to 4 .

The camera module can be applied to a variety of different types of electronic devices such as smart phones, tablet computers, notebook computers, and smart wearable devices, so that the electronic devices can have good camera functions, and can well meet the needs of users for shooting. The demand for higher-quality pictures and videos has greatly enriched the functionality of electronic devices.

According to the camera module provided by the embodiment of the present application, as shown in FIG. 3 and FIG. 4 , the camera module may include: a camera assembly 1 , a sensor 2 , and a circuit board 3 . Its structure is simple and easy to assemble.

The camera assembly 1 includes a camera structure 101 . Specifically, the imaging structure 101 is, for example, an imaging lens. The camera assembly 1 is mainly used for capturing images, so as to realize image capturing functions such as capturing pictures and videos. The imaging structure 101 can be used to refract and transmit incident light, so that the incident light can be transmitted to the sensor 2 .

Wherein, the sensor 2 is, for example, a photosensitive sensor. Referring to FIG. 3 and FIG. 4 , the sensor 2 includes a photosensitive chip 202 and an infrared optical structure 201 disposed on the surface of the photosensitive chip 202 . When the camera assembly 1 is in a normal working state, the sensor 2 is configured to receive the light signal emitted by the camera structure 101 and convert the light signal into an electrical signal, that is, light can be converted into electrical energy. In the embodiment of the present application, by directly disposing the infrared optical structure 201 on the surface of the photosensitive chip 202, the IR filter can be omitted, and the low light transmittance caused by the existence of the IR filter can be avoided. The photosensitive effect of the photosensitive chip 202 is affected.

Actually, the photosensitive chip 202 is a multi-layer structure. Specifically, the photosensitive chip includes, for example, a photodiode layer (Photodiode), a metal layer (Metal Opque layer) disposed on the photodiode layer, a color filter (Color filter) disposed on the metal layer, An infrared optical structure arranged on the color filter and a micro lens (Micro lens) arranged on the infrared optical structure. That is to say, the micro lens is located on the uppermost layer of the photosensitive chip 202 . The infrared optical structure 201 is disposed on the micro lens.

Moreover, the sensor 2 is electrically connected to the circuit board 3 . Specifically, the circuit board 3 has a power supply line inside, which can play the role of electrical conduction. The circuit board 3 can be used to carry a number of electrical components. In addition, the circuit board 3 may be a rigid circuit board or a flexible circuit board, which can be flexibly selected by those skilled in the art as required, which is not limited in this application.

The structure of the camera module provided by the embodiment of the present application is different from the structure of the camera module in the related art. Specifically, the structure of the related art camera module is shown in FIG. 1 and FIG. 2 , which includes an IR filter 9 , and the IR filter 9 is fixedly disposed on the support base 10 . On the basis of this structure, the IR filter 9 together with the support base 10 will occupy the space of the camera module in the height direction, thereby causing the problem that the structure size of the camera module is relatively large. It can be seen that it is difficult for the camera module in the related art to meet the requirement of miniaturization. In addition, because it contains the IR filter 9, it will also bring two main problems: on the one hand, the IR filter 9 is easy to be broken and difficult to assemble, which brings certain difficulties to the assembly of the camera module. This complicates the assembly process of the camera module; on the other hand, the current structural design of the IR filter 9 has field curvature, which in turn leads to a decrease in the transmittance (incidence) of the incident light, which will affect the photosensitive chip 202 Photosensitive effect. It can be seen that the camera module of the related art has many defects.

In the embodiment of the present application, by arranging the infrared optical structure 201 on the surface of the photosensitive chip 201, the IR filter can be eliminated in the camera module, which can effectively avoid the need for assembling the camera module. The IR filter is accidentally broken during the process, thereby reducing the difficulty of assembling the camera module and making the assembling process of the camera module simpler. On the basis of eliminating the structure of the IR filter, a certain amount of space can also be saved, which can appropriately reduce the structural size of the camera module, especially the size of the camera module in the height direction, which is conducive to realizing the miniaturization of the camera module. It also facilitates its assembly on electronic equipment. In the embodiment of the present application, the infrared optical structure 202 is arranged on the photosensitive chip 202. This design is also conducive to the transmission of incident light, which can greatly improve the photosensitive effect of the photosensitive chip 202, thereby improving the shooting effect of the camera module. , which can ultimately improve the user experience with the camera module.

In the embodiment of the present application, as shown in FIG. 4 , the infrared optical structure 201 is at least one infrared optical film layer directly formed on the surface of the photosensitive chip 202 (ie, on the microlens), wherein the The photosensitive chip 202 can maintain electrical conduction with the circuit board 3 . That is to say, the infrared optical structure 201 is actually an infrared optical film with a preset thickness. Those skilled in the art can reasonably adjust the specific thickness dimension of the infrared optical film according to specific needs, which is not limited in this application.

Specifically, for the camera module of the related art, as shown in FIG. 2, when the camera module is in a normal working state, the incident light will first enter the camera module through the camera structure 101, and then pass through the built-in The IR filter 10 can then be incident on the surface of the photosensitive chip 202 (ie, on the microlens) to convert light energy into electrical energy. However, for the camera module of the related art, when the light passing through the camera structure 101 enters the IR filter 10, most of the infrared rays are absorbed or reflected by the IR filter 10, and a part of the light is transmitted through the IR filter 10. When it passes through the IR filter 10, it is refracted again. In this case, the amount of incoming light will be relatively low, and then the amount of light incident on the photosensitive chip 202 will be small, so that the photosensitive performance of the photosensitive chip 202 is not good, and eventually lead to Imaging is poor.

However, the camera module of the embodiment of the present application is completely different from the camera module of the related art. Referring to FIG. 4 , the IR filter 10 in the related art is not arranged inside the camera module, that is, the IR filter is omitted. Instead of using the light sheet 10 , the infrared optical film layer is directly formed on the surface of the photosensitive chip 202 . This design enables the conventional photosensitive chip 202 to form a photosensitive chip with an infrared optical microstructure. The infrared optical film layer can transmit incident light to the maximum extent, that is, the amount of incoming light can be significantly increased, so that the incident light passing through the imaging structure 101 can be incident on the photosensitive chip 202 on the lower side as much as possible. . In this way, the photosensitive chip 202 can be better photosensitive, and the received light signal can be converted into an electrical signal.

In the embodiment of the present application, the infrared optical structure 201 (ie, the infrared optical film layer) can be formed on the surface of the photosensitive chip 202 in various ways. For example, the infrared optical structure 201 can be attached to the surface of the photosensitive chip 202 by spraying or electroplating. This molding method is simple, does not require adhesives or any other form of connection, and has good fastness. That is, the infrared optical structure 201 can be directly attached to the photosensitive chip 202 and is not easy to fall off.

It should be noted that the infrared optical structure 201 can also be combined on the surface of the photosensitive chip 202 by other means known to those skilled in the art, such as bonding, etc. Those skilled in the art can flexibly choose according to their needs. There is no restriction on this.

In the embodiment of the present application, as shown in FIG. 3 , the photosensitive chip 202 is disposed on the circuit board 3 and is electrically connected to the circuit board 3 . That is to say, in the embodiment of the present application, the photosensitive chip 202 is combined with the circuit board 3, and the circuit board 3 can be used to support the photosensitive chip 202 and maintain electrical continuity with the photosensitive chip 202, To ensure that the camera module can work properly.

Specifically, the photosensitive chip 202 can be fixed on the circuit board 3 by, for example, conductive adhesive. Of course, other connection manners can also be used, which are not limited in this application.

In an optional example of the present application, the camera assembly 1 includes a camera structure 101, wherein the camera structure 101 is a fixed-focus camera. In this way, there is no need to provide a driving mechanism for the imaging structure 101 . This design can make the structure size of the camera module smaller.

Of course, the camera structure 101 is not limited to a fixed-focus camera. In this case, a related driving mechanism needs to be provided for the imaging structure 101 to realize the automatic focusing function of the imaging structure 101 .

In an optional example of the present application, as shown in FIG. 3 , the camera module further includes a drive assembly, for example, the drive assembly includes a bearing structure and a driving device 4 disposed on the bearing structure, the camera head The assembly 1 is electrically connected to the driving device 4 , and the driving device 4 is electrically connected to the circuit board 3 . When the circuit is turned on, the driving device 4 can drive the camera structure 101 in the camera module 1 to move accordingly, for example, drive the camera structure 101 to move up and down, so as to realize the focusing function. This ensures that the captured images have good clarity. Of course, for the above-mentioned fixed-focus camera, it is not necessary to provide the driving component.

Moreover, when the camera module includes the driving component, a driving chip 5 is also correspondingly disposed on the circuit board 3 , and the driving device 4 is electrically connected to the driving chip 5 . The driving chip 5 can be used to control the output current. Specifically, the driving device 4 is, for example, a motor, and the driving chip 5 is, for example, a motor driving chip.

In addition, it should be noted that, in the embodiments of the present application, a plurality of the camera structures 101 may be provided as required, but not limited to one, and those skilled in the art may adjust as required.

In the embodiment of the present application, as shown in FIG. 3 , the camera module further includes a capacitor 6 and a memory 7, and both the capacitor 6 and the memory 7 are arranged on the circuit board 3 and are connected with the The circuit board 3 is electrically connected. Wherein, the capacitor 6 can be used for filtering and noise reduction, which is beneficial to improve the texture and clarity of the captured picture, that is, to improve the quality of the captured picture or video. The memory 7 is an electrically erasable read-only memory (EEPROM), and when the camera module is working, data is generated when the one-time programmable memory (One Time Programable, OTP) is calibrated, and these generated data can be stored in the In the memory 7, it is read from the memory 7 during use.

It should be noted that the specific arrangement positions of the capacitor 6 and the memory 7 on the circuit board 3 can be reasonably adjusted according to the shape of the circuit board 3 . In addition, one or more of the capacitors 6 and the memory 7 may be provided as required, which is not limited in this application.

In an optional example of the present application, as shown in FIG. 3 , in addition to the camera structure 101 , the camera assembly 1 further includes a bracket and a protection structure 102 . Wherein, the camera structure 101 is disposed on the bracket, that is, the bracket can be used to carry the camera structure 101, and also facilitates the assembly of the camera structure 101 in the camera module. The protection structure 102 is detachably disposed on the camera structure 101 and can be used to protect the camera structure 101 .

Specifically, the protection structure 102 can be, for example, a protection film, which mainly functions to protect the camera structure 101 . It should be noted that, the protection structure 102 can be set or not set according to needs, and those skilled in the art can flexibly adjust according to needs, which is not limited in this application.

On the other hand, an electronic device provided by an embodiment of the present application includes:

a casing, a main board is arranged in the casing;

Camera module, the camera module is the camera module described in any of the above embodiments, the circuit board 3 of the camera module is connected with a connector 8, as shown in FIG. 3, the circuit board 3 can pass The connector 8 is electrically connected to the motherboard. The electrical signal of the camera module and the electrical signal of the electronic device can be interconnected through the connector 8 .

The mainboard is one of the core components in the electronic device and can be used to carry many electronic components in the electronic device. It can be a rigid circuit board or a flexible circuit board, which is not limited in this application.

The electronic device may be, for example, various types of electronic products such as a smart phone, a tablet computer, a notebook computer, and a smart wearable device, which is not limited in this application.

The electronic device according to the embodiment of the present application uses the camera module as described above. Since the camera module can be miniaturized, it is beneficial to make the electronic device lighter and thinner. Since the electronic device uses a camera module, the electronic device has a camera function, thereby meeting the shooting requirements of users and enriching the functionality of the electronic device.

Other components of the electronic device according to the embodiments of the present application, such as a display module, and operations are known to those of ordinary skill in the art, and will not be described in detail here.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc., is meant to incorporate the embodiments A particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the present application, The scope of the application is defined by the claims and their equivalents.

Claims

A camera module, comprising:

A camera assembly (1), the camera assembly (1) comprising a camera structure (101);

a sensor (2), the sensor (2) comprising a photosensitive chip (202) and an infrared optical structure (201) disposed on the surface of the photosensitive chip (202); and,

A circuit board (3), the sensor (2) is electrically connected with the circuit board (3).
The camera module according to claim 1, wherein the infrared optical structure (201) is at least one infrared optical film layer disposed on the surface (202) of the photosensitive chip.
The camera module according to any one of claims 1-2, wherein the infrared optical structure (201) is attached to the surface of the photosensitive chip (202) by spraying or electroplating.
The camera module according to any one of claims 1-3, wherein the photosensitive chip (202) is disposed on the circuit board (3) and is electrically connected to the circuit board (3).
The camera module according to any one of claims 1-4, wherein the camera structure (101) is a fixed-focus camera.
The camera module according to any one of claims 1-5, further comprising:

A drive assembly comprising a bearing structure and a driving device (4) arranged on the bearing structure, the camera assembly (1) is electrically connected with the driving device (4), and the driving device (4) ) is electrically connected to the circuit board (3).
The camera module according to claim 6, wherein a driving chip (5) is provided on the circuit board (3), and the driving device (4) is electrically connected to the driving chip (5).
The camera module according to any one of claims 1-7, further comprising:

A capacitor (6) and a memory (7) are provided on the circuit board (3) and are electrically connected to the circuit board (3).
The camera module according to any one of claims 1-8, wherein the camera assembly (1) further comprises:

a bracket, the camera structure (101) is arranged on the bracket; and,

A protection structure (102) is provided on the camera structure (101) detachably.
An electronic device comprising:

a casing, wherein a main board is arranged in the casing;

Camera module, the camera module is the camera module according to any one of claims 1-9, and the circuit board (3) of the camera module is electrically connected to the main board through a connector (8). connect.