CN210297880U

CN210297880U - Camera module and electronic equipment

Info

Publication number: CN210297880U
Application number: CN201921896129.XU
Authority: CN
Inventors: 姚坤
Original assignee: Realme Chongqing Mobile Communications Co Ltd
Current assignee: Realme Chongqing Mobile Communications Co Ltd
Priority date: 2019-11-05
Filing date: 2019-11-05
Publication date: 2020-04-10
Anticipated expiration: 2029-11-05

Abstract

The application provides a module and electronic equipment make a video recording, the module of making a video recording include the support, install in camera lens module in the support, locate the image side of camera lens module sensitization chip, support the circuit board of sensitization chip and the filtering structure who is used for filtering the infrared light, sensitization chip with the circuit board electricity is connected, the circuit board with the support links to each other, the filtering structure includes the filter membrane, the filter membrane is located the object side of camera lens module. The camera module that this application embodiment provided sets up the filter coating through the thing side at the camera lens module to before external light gets into the camera lens module, most infrared light can directly be filtered in the reflection of filter coating, and then reduces infrared light and gets into the camera lens module, can reduce or avoid infrared light at the inside reflection of camera lens module, thereby avoids infrared light to produce red light of dazzling on photosensitive chip.

Description

Camera module and electronic equipment

Technical Field

The application belongs to the technical field of cameras, and more specifically relates to a camera module and electronic equipment.

Background

Because the imaging light entering the camera has both visible light and infrared light, and the infrared light irradiates the photosensitive chip, the color difference between the image shot by the camera and the scenery seen by human eyes is large. To solve this problem, an infrared filter is generally disposed in front of a photosensitive chip in the camera. The infrared filter is used for reflecting infrared light entering the camera, so that the infrared light is prevented from entering the photosensitive chip to cause interference. However, the infrared filter can only reflect most of the infrared light and transmit a small portion of the infrared light and visible light, i.e., the infrared filter cannot completely filter the infrared light. Therefore, infrared light reflected by the infrared filter inside the camera is reflected between the infrared filter and the lens generally, but the reflected infrared light can be partially reflected and refracted again on the filter, and then enters the photosensitive chip, so that red dazzling light is caused.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a camera module to there is red problem of dazzling light in the camera that exists in the solution correlation technique.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions: the utility model provides a camera module, including the support, install in lens module in the support, locate the photosensitive chip of the image side of lens module, support photosensitive chip's circuit board and the filtering structure who is used for filtering the infrared light, photosensitive chip with the circuit board electricity is connected, the circuit board with the support links to each other, filtering structure includes the filter coating, the filter coating is located the object side of lens module.

In an embodiment, the light filtering structure further includes a light transmissive plate disposed on an object side of the lens module, and the light transmissive plate is provided with the filter.

In one embodiment, the light filter is disposed on a surface of the light-transmitting plate adjacent to the lens module;

or the side, away from the lens module, of the light-transmitting plate is provided with the light-filtering film;

or the two surfaces of the light-transmitting plate are respectively provided with the light filtering film.

In one embodiment, the light filtering structure further includes a light-transmitting cover plate covering the lens module, and the light-transmitting cover plate is provided with the light filtering film.

In one embodiment, the light filter film is arranged on one surface of the light-transmitting cover plate, which is close to the photosensitive chip;

or the light filter film is arranged on one surface of the light-transmitting cover plate, which is far away from the lens module;

or the two surfaces of the light-transmitting cover plate are respectively provided with the light filtering films.

In one embodiment, the light filtering structure further includes a light filter, and the light filter is disposed between the lens module and the photosensitive chip.

In one embodiment, the filter is mounted on the support; or, the optical filter is attached to the photosensitive chip.

In one embodiment, an antireflection film is arranged on the optical filter.

In one embodiment, the lens module comprises a lens barrel connected with the bracket and a plurality of lenses installed in the lens barrel.

In one embodiment, of the lenses: the lens far away from the photosensitive chip is provided with the filter film.

Another object of the embodiments of the present application is to provide an electronic device, which includes the camera module according to any of the embodiments.

One or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

the camera module that this application embodiment provided sets up the filter coating through the thing side at the camera lens module to before external light gets into the camera lens module, most infrared light can directly be filtered in the reflection of filter coating, and then reduces infrared light and gets into the camera lens module, can reduce or avoid infrared light at the inside reflection of camera lens module, thereby avoids infrared light to produce red light of dazzling on photosensitive chip.

The electronic equipment that this application embodiment provided has used above-mentioned module of making a video recording, can avoid producing red dazzle light, and the image quality is high.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic cross-sectional structure diagram of a camera module according to an embodiment of the present application.

Fig. 2 is a schematic cross-sectional structure view of a camera module according to a second embodiment of the present application.

Fig. 3 is a schematic cross-sectional structure view of a camera module according to a third embodiment of the present application.

Fig. 4 is a schematic cross-sectional structure view of a camera module according to a fourth embodiment of the present application.

Fig. 5 is a schematic cross-sectional structure view of a camera module according to a fifth embodiment of the present application.

Fig. 6 is a schematic cross-sectional structure view of a camera module according to a sixth embodiment of the present application.

Fig. 7 is a schematic cross-sectional structure view of a camera module according to a seventh embodiment of the present application.

Fig. 8 is a schematic cross-sectional structure diagram of a camera module according to an eighth embodiment of the present application.

Fig. 9 is a schematic cross-sectional structure view of a camera module according to a ninth embodiment of the present application.

Fig. 10 is a schematic cross-sectional structure diagram of a camera module provided in this embodiment.

Fig. 11 is a schematic cross-sectional structure diagram of a camera module according to an eleventh embodiment of the present application.

Fig. 12 is a schematic cross-sectional structure view of a camera module according to a twelfth embodiment of the present application.

Fig. 13 is a schematic cross-sectional structure view of a camera module according to a thirteenth embodiment of the present application.

Fig. 14 is a schematic cross-sectional structure diagram of a camera module according to a fourteenth embodiment of the present application.

Fig. 15 is a schematic cross-sectional structure diagram of a camera module according to a fifteenth embodiment of the present application.

Fig. 16 is a schematic cross-sectional structure diagram of a camera module according to a sixteenth embodiment of the present application.

Wherein, in the drawings, the reference numerals are mainly as follows:

10-a camera module; 11-a scaffold; 12-a lens module; 121-a lens barrel; 122-a lens; 13-a circuit board; 14-a photosensitive chip; 15-antireflection coating; 20-a light filtering structure; 21-a light filter film; 22-a light-transmitting plate; 23-a light-transmissive cover plate; 24-optical filter.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present application, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Referring to fig. 1, a camera module 10 provided in the present application will now be described. The camera module 10 includes a bracket 11, a lens module 12, a photosensitive chip 14, a circuit board 13 and a filtering structure 20. The photosensitive chip 14 is used for sensing light imaging. The lens module 12 is mounted in the holder 11, and the lens module 12 is supported by the holder 11. The photo sensor 14 is disposed on the image side of the lens module 12, so that the lens module 12 focuses light onto the photo sensor 14. The photosensitive chip 14 is mounted on the circuit board 13, the photosensitive chip 14 is electrically connected to the circuit board 13, the photosensitive chip 14 is supported by the circuit board 13, and the photosensitive chip 14 is controlled by the circuit board 13. The circuit board 13 is connected to the bracket 11 to support the circuit board 13 by the bracket 11. The filter structure 20 is used for filtering infrared light to reduce the influence of the infrared light on the photosensitive chip 14, thereby improving the imaging quality. The filtering structure 20 includes a filter 21 for filtering infrared light through the filter 21, the filter 21 is disposed at an object side of the lens module 12, so that the external light is filtered by the filter 21 before entering the lens module 12, and then the infrared light entering the lens module 12 is reduced, thereby reducing or avoiding reflection of the infrared light inside the lens module 12, and avoiding the infrared light from generating red glare on the photosensitive chip 14.

The camera module 10 provided in the embodiment of the present application sets up the filter 21 on the object side of the lens module 12, so that before external light enters the lens module 12, the filter 21 can directly reflect and filter most of infrared light, and then reduce the infrared light entering the lens module 12, and can reduce or avoid the reflection of infrared light inside the lens module 12, thereby avoiding the infrared light from producing red glare on the photosensitive chip 14.

In one embodiment, referring to fig. 1, the lens module 12 includes a lens barrel 121 and a plurality of lenses 122, the lens barrel 121 is connected to the frame 11, the lens barrel 121 is supported by the frame 11, and the plurality of lenses 122 are installed in the lens barrel 121, and each lens 122 is supported by the lens barrel 121.

In an embodiment, referring to fig. 1, the filter structure 20 further includes a transparent plate 22, the transparent plate 22 is disposed on an object side of the lens module 12, and the transparent plate 22 is capable of allowing light to pass through so that the light can enter the lens module 12. The transparent plate 22 is provided with the filter 21, so that the filter 21 is supported by the transparent plate 22.

In one embodiment, referring to fig. 1, the filter 21 may be formed by a filter coating or a filter 21.

In one embodiment, referring to fig. 1, the transparent plate 22 can be a protective cover of the apparatus using the camera module 10, i.e. the filter 21 can be disposed on the protective cover using the camera module 10.

In one embodiment, referring to fig. 1, a filter 21 is disposed on a surface of the transparent plate 22 close to the lens module 12, so that the filter 21 can be protected by the transparent plate 22 to prevent external impurities from wearing the filter 21.

In an embodiment, referring to fig. 2, a surface of the transparent plate 22 away from the lens module 12 is provided with a filter 21, so that external light is filtered by the filter 21 and then enters the transparent plate 22, and infrared light reflected by the transparent plate 22 can be reduced, thereby further reducing infrared light entering the lens module 12.

In one embodiment, referring to fig. 3, the two sides of the transparent plate 22 are respectively provided with the filter 21, and the two sides of the transparent plate 22 are respectively provided with the filter 21, so as to better filter the infrared light and reduce the infrared light from entering the lens module 12.

In an embodiment, referring to fig. 2, the filtering structure 20 further includes a filter 24, the filter 24 is disposed between the lens module 12 and the photosensitive chip 14, and the filter 24 filters infrared light, and the filter 24 and the filter 21 are disposed at the same time, so that the infrared light can be further filtered through the filter 24, so as to reduce the infrared light entering the photosensitive chip 14, and improve the imaging quality of the photosensitive chip 14.

In one embodiment, referring to fig. 2, the filter 24 is mounted on the bracket 11, and the filter 24 is supported by the bracket 11 to facilitate the mounting and fixing of the filter 24.

In one embodiment, referring to fig. 4, the filter 24 is attached to the photo sensor chip 14 to support the filter 24 by the photo sensor chip 14, and the structure can shorten the distance between the filter 24 and the photo sensor chip 14, thereby reducing the length of the camera module 10.

In one embodiment, referring to fig. 3, the light filter 24 is provided with an antireflection film 15, which can reduce the reflection loss of light and enhance the projection intensity of light, so that more light enters the light sensing chip 14 to improve the imaging quality.

In one embodiment, referring to fig. 5, among the lenses 122 of the lens module 12: the lens 122 far away from the photo sensor 14 is provided with the filter 21, that is, the lens 122 near the object side is provided with the filter 21, so as to reduce the infrared light entering the photo sensor 14, and prevent the infrared light reflected by the filter 21 from being reflected back by the lens 122.

In one embodiment, referring to fig. 5, a light-incident side of one lens 122 close to the object side is provided with a filter 21, so that the infrared light is filtered before the light enters the lens 122 of the lens module 12.

In an embodiment, referring to fig. 6, the light filtering structure 20 includes a transparent plate 22, the transparent plate 22 is disposed on an object side of the lens module 12, and the transparent plate 22 is disposed with a filter 21. Meanwhile, a filter 21 is disposed on one lens 122 close to the object side, so that infrared light can be filtered through the multiple layers of filter 21, and infrared light entering the photosensitive chip 14 is reduced, thereby improving the imaging quality of the photosensitive chip 14.

In an embodiment, referring to fig. 6, the light filtering structure 20 includes a transparent plate 22 and a filter 24, the transparent plate 22 is disposed on an object side of the lens module 12, the filter 21 is disposed on the transparent plate 22, and the filter 24 is disposed between the lens module 12 and the photo sensor chip 14. Meanwhile, a filter 21 is disposed on one lens 122 close to the object side, so that infrared light can be filtered through the multiple layers of filter 21, and infrared light entering the photosensitive chip 14 is reduced, thereby improving the imaging quality of the photosensitive chip 14. Meanwhile, the optical filter 24 and the optical filter film 21 are arranged, so that infrared light can be further filtered through the optical filter 24, the infrared light is prevented from entering the photosensitive chip 14, and the imaging quality of the photosensitive chip 14 is improved.

In one embodiment, referring to fig. 7, the filter structure 20 further includes a transparent cover plate 23, the transparent cover plate 23 covers the lens module 12, so as to protect the lens module 12 through the transparent cover plate 23, and the transparent cover plate 23 covers the lens module 12, i.e. the transparent cover plate 23 and the lens module 12 are assembled into a whole, so as to be convenient for installation and use; the light-transmitting cover 23 is provided with the filter 21, so that the filter 21 is supported by the light-transmitting cover 23.

In one embodiment, referring to fig. 7, a filter 21 is disposed on a surface of the transparent cover plate 23 away from the lens module 12, such that external light is filtered by the filter 21 and then enters the transparent cover plate 23, thereby reducing infrared light reflected by the transparent cover plate 23 and further reducing infrared light entering the lens module 12.

In one embodiment, referring to fig. 8, a filter 21 is disposed on a surface of the transparent cover plate 23 close to the lens module 12, so that the filter 21 can be protected by the transparent cover plate 23 to prevent the filter 21 from being worn by external impurities.

In one embodiment, referring to fig. 9, the two sides of the transparent cover 23 are respectively provided with the filter films 21, and the two sides of the transparent cover 23 are respectively provided with the filter films 21, so that the infrared light can be better filtered, and the infrared light entering the lens module 12 is reduced.

In one embodiment, referring to fig. 10, the filter structure 20 further includes a transparent cover 23 and a filter 24, the transparent cover 23 covers the lens module 12, and the filter 21 is disposed on the transparent cover 23, so that the filter 21 is supported by the transparent cover 23. The optical filter 24 is disposed between the lens module 12 and the photosensitive chip 14, and the optical filter 24 and the filter film 21 are disposed at the same time, so that the infrared light can be further filtered through the optical filter 24, thereby reducing the infrared light entering the photosensitive chip 14 and improving the imaging quality of the photosensitive chip 14.

In an embodiment, referring to fig. 11, the light filtering structure 20 includes a transparent plate 22 and a transparent cover 23, the transparent plate 22 is disposed on an object side of the lens module 12, and the transparent plate 22 is disposed with a filter 21. The transparent cover 23 covers the lens module 12, and the transparent cover 23 is provided with a filter 21. Therefore, infrared rays can be filtered by the multilayer filter film 21, so that the infrared rays are prevented from entering the photosensitive chip 14, and the imaging quality of the photosensitive chip 14 is improved.

In an embodiment, referring to fig. 12, the light filtering structure 20 includes a transparent plate 22, a transparent cover 23 and a filter 24, the transparent plate 22 is disposed on an object side of the lens module 12, and the transparent plate 22 is disposed with a filter 21. The transparent cover 23 covers the lens module 12, and the transparent cover 23 is provided with a filter 21. The optical filter 24 is disposed between the lens module 12 and the photo sensor chip 14, so that infrared light can be filtered by the multi-layer filter film 21 and the optical filter 24, so as to reduce the infrared light entering the photo sensor chip 14, and improve the imaging quality of the photo sensor chip 14.

In an embodiment, referring to fig. 13, the filtering structure 20 includes a transparent cover 23, the transparent cover 23 is disposed on an object side of the lens module 12, and the transparent cover 23 is disposed with a filter 21. Meanwhile, a filter 21 is disposed on one lens 122 close to the object side, so that infrared light can be filtered through the multiple layers of filter 21, and infrared light entering the photosensitive chip 14 is reduced, thereby improving the imaging quality of the photosensitive chip 14.

In an embodiment, referring to fig. 14, the filtering structure 20 includes a transparent cover 23 and a filter 24, the transparent cover 23 is disposed on an object side of the lens module 12, the transparent cover 23 is disposed with the filter 21, and the filter 24 is disposed between the lens module 12 and the photo sensor chip 14. Meanwhile, a filter 21 is disposed on one lens 122 close to the object side, and the optical filter 24 and the multi-layer filter 21 are disposed at the same time, so that infrared light can be further filtered, the infrared light is prevented from entering the photosensitive chip 14, and the imaging quality of the photosensitive chip 14 is improved.

In an embodiment, referring to fig. 15, the light filtering structure 20 includes a transparent plate 22 and a transparent cover 23, the transparent plate 22 is disposed on an object side of the lens module 12, and the transparent plate 22 is disposed with a filter 21. The transparent cover 23 covers the lens module 12, and the transparent cover 23 is provided with a filter 21. Meanwhile, a filter 21 is disposed on one lens 122 close to the object side, so that infrared light can be filtered through the multiple layers of filter 21, and infrared light entering the photosensitive chip 14 is reduced, thereby improving the imaging quality of the photosensitive chip 14.

In an embodiment, referring to fig. 16, the light filtering structure 20 includes a transparent plate 22, a transparent cover 23 and a filter 24, the transparent plate 22 is disposed on the object side of the lens module 12, and the transparent plate 22 is disposed with a filter 21. The transparent cover 23 covers the lens module 12, and the transparent cover 23 is provided with a filter 21. The filter 24 is disposed between the lens module 12 and the photo sensor chip 14. Meanwhile, a filter 21 is disposed on one lens 122 close to the object side, so that infrared light can be filtered by the cooperation of the multiple layers of filter 21 and the optical filter 24, and the infrared light is prevented from entering the photosensitive chip 14, thereby improving the imaging quality of the photosensitive chip 14.

The camera module 10 of the embodiment of the application can be applied to electronic equipment such as mobile phones and cameras, can avoid the red light dazzling effect, and improves the imaging quality.

The embodiment of the application also discloses the electronic equipment. Referring to fig. 1, the electronic device includes the camera module 10 according to any of the embodiments. This electronic equipment has used above-mentioned module 10 of making a video recording, can avoid producing red dazzling light, and the image quality is high.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. The camera shooting module comprises a support, a lens module arranged in the support, a photosensitive chip arranged on the image side of the lens module, a circuit board supporting the photosensitive chip and a filtering structure used for filtering infrared light, wherein the photosensitive chip is electrically connected with the circuit board, and the circuit board is connected with the support, and is characterized in that: the filtering structure comprises a filter film, and the filter film is arranged at the object side of the lens module.

2. The camera module of claim 1, wherein: the light filtering structure further comprises a light transmitting plate, the light transmitting plate is arranged on the object side of the lens module, and the light transmitting plate is provided with the light filtering film.

3. The camera module of claim 2, wherein: the light filtering film is arranged on one surface of the light transmitting plate close to the lens module;

4. The camera module of claim 1, wherein: the light filtering structure further comprises a light-transmitting cover plate, the light-transmitting cover plate covers the lens module, and the light-transmitting cover plate is provided with the light filtering film.

5. The camera module of claim 4, wherein: the light filtering film is arranged on one surface of the light-transmitting cover plate, which is close to the photosensitive chip;

6. A camera module according to any of claims 1-5, characterized in that: the light filtering structure further comprises a light filter, and the light filter is arranged between the lens module and the photosensitive chip.

7. The camera module of claim 6, wherein: the optical filter is arranged on the bracket; or, the optical filter is attached to the photosensitive chip.

8. The camera module of claim 6, wherein: and an antireflection film is arranged on the optical filter.

9. A camera module according to any of claims 1-5, characterized in that: the lens module comprises a lens barrel connected with the support and a plurality of lenses arranged in the lens barrel.

10. The camera module of claim 9, wherein, of the plurality of lenses: the lens far away from the photosensitive chip is provided with the filter film.

11. An electronic device, characterized in that: comprising a camera module according to any one of claims 1-10.