CN101521166A - Method and structure for packaging digital image acquisition module - Google Patents
Method and structure for packaging digital image acquisition module Download PDFInfo
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- CN101521166A CN101521166A CN200810165939.8A CN200810165939A CN101521166A CN 101521166 A CN101521166 A CN 101521166A CN 200810165939 A CN200810165939 A CN 200810165939A CN 101521166 A CN101521166 A CN 101521166A
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- circuit board
- printed circuit
- pcb
- image acquisition
- digital image
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 230000003287 optical effect Effects 0.000 claims abstract description 49
- 239000004033 plastic Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 21
- 239000004568 cement Substances 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 11
- 238000012856 packing Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000010061 rubber shaping Methods 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
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Images
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Abstract
The invention discloses a method and a structure for packaging a digital image acquisition module. The method comprises the following steps that: a plurality of chips are arranged on a printed circuit board in advance and optical lens units for acquiring images are configured for the chips; a layer of optical adhesive is coated on the surface of each chip or an optical mixed plastic body is used to seal and cure the surface of each chip; and the printed circuit board are divided into independent printed circuit board units comprising the chips and the independent printed circuit board units are cut uniformly. The structure comprises the printed circuit board and chips arranged on the printed circuit board, wherein the printed circuit board and the chips form the independent printed circuit board units, the surfaces of the chips are coated with the layer of optical adhesive or sealed by and cured with the optical mixed plastic body. Through the implementation of the method and the device, the chips are isolated from the air to facilitate the uniform cutting of the printed circuit board, so the packaging speed is greatly improved, as well as the material and cost are saved.
Description
Technical field
The present invention relates to a kind of encapsulation technology of electronic installation, particularly relate to a kind of method for packing and encapsulating structure of digital camera device.
Background technology
Digital image acquisition module is a kind of important spare part of digital camera or the electronic equipment that possesses camera function (as mobile phone, various image survey meters etc.).Its main member comprises has bound the printed circuit board (PCB) with image sensing functional chip, optical lens and pedestal, aerial lug (FPC splicing ear or wireless transmission circuit).Usually, optical lens is placed on the pedestal, and pedestal refills and fits on the printed circuit board (PCB), and connector then can directly or by FPC (flexible circuit board) be welded on the printed circuit board (PCB); Outside scene focuses on functional chip (SENSOR) surface by optical lens and forms optical image, and functional chip detects scanning to optical image and handles back output image signal, transfers to storage by connector and shows or print device.
When the above-mentioned digital image acquisition module of assembling, when generally binding the sensing function chip, there are any dust subordinate list or a bit damage of chip surface all can cause module to be scrapped, therefore require high to the production environment cleanliness factor, assembly technology is very strict, must be with environment lower seal (generally being that camera lens is installed immediately) after the chip binding.
Yet, in above-mentioned assembling process, because the environment cleanliness requirement is high, cutting printing circuit board can produce a large amount of dusts under this environment, therefore must in advance printed circuit board (PCB) be divided into essentially independent unit, lower the utilance of printed circuit board (PCB) greatly, improve cost; And use chemical glue during the sealing chip, can produce volatile matter or dust during curing, cause the finished product yields to descend.
The lens system of installing in above-mentioned production process generally is made up of lens barrel and the pedestal of having assembled optics convex lens and IR (infrared ray) filter.
Summary of the invention
Technical problem to be solved by this invention is that a kind of method for packing and encapsulating structure that can greatly improve package speed, reduction difficulty of processing, improve a kind of digital image acquisition module of production capacity is provided.
For solving above technical problem, the technical scheme of the inventive method is: a kind of method for packing of digital image acquisition module, comprise and in advance the plurality of chips unification is arranged on the optical lens element that is used to absorb image on the printed circuit board (PCB), for described chip configuration, key is also to comprise the steps:
A, at surface-coated one deck optical cement of described chip or with optics mixed plastic body sealing and curing;
B, described printed circuit board (PCB) is divided into some printed circuit board (PCB) separate units that comprise described chip after, be that unit unifies cutting with described printed circuit board (PCB) separate unit.
As improvement of the present invention, after the cutting of described printed circuit board (PCB) finished, the side carried out being used to absorb for described chip configuration the step of the optical lens element of image.
Further improve its preferred version one as the present invention:
Described optical lens element is finished encapsulation by following steps: optical lens is placed on the pedestal, described pedestal is assemblied on the described printed circuit board (PCB) separate unit, described optical lens comprises lens barrel and the convex lens that is arranged in order; Described digital image acquisition module is realized one of in the following manner the filtering infrared function:
A, described pedestal, lens barrel and/or convex lens are by plastic rubber shaping, and described lens barrel and/or convex lens are made by optics mixing plastic material, and described optics mixing plastic material can reflect and/or the scattered infrared light line effectively; Perhaps,
B, before surface-coated one deck optical cement of described chip, increase a step: add plating one deck infrared ray filter coating on the surface of described chip; Perhaps,
C, in described optical lens, add infrared filter.
Further improve as the present invention, its preferred version two: described optical lens element is finished encapsulation by following steps: optical lens directly is assemblied on the described printed circuit board (PCB) separate unit, described optical lens comprises convex lens, described convex lens is made by plastic rubber shaping technology, and the junction of described convex lens and described printed circuit board (PCB) separate unit seals by shading glue; Described digital image acquisition module is realized one of in the following manner the filtering infrared function:
A, described convex lens are made by optics mixing plastic material, and described optics mixing plastic material can reflect and/or the scattered infrared light line effectively; Perhaps,
B, before surface-coated one deck optical cement of described chip, increase a step: add plating one deck infrared ray filter coating on the surface of described chip.
The technical scheme of product of the present invention is: a kind of encapsulating structure of digital image acquisition module, comprise printed circuit board (PCB) and the chip that is arranged on the described printed circuit board (PCB), described printed circuit board (PCB) and described chip constitute the printed circuit board (PCB) separate unit jointly, and key is: surface-coated one deck optical cement of described chip or with optics mixed plastic body sealing and curing together.
As improvement of the present invention, it comprises following three preferred versions:
Scheme one is:
Described printed circuit board (PCB) separate unit is provided with optical lens element, described optical lens element comprises the pedestal that is assemblied on the described printed circuit board (PCB) separate unit, is placed in the optical lens on the described pedestal, and described optical lens comprises lens barrel, convex lens and the infrared filter that is arranged in order.
Scheme two is:
Be provided with one deck infrared ray filter coating between described chip and the described optical cement, described infrared ray filter coating is plated in the surface of described chip.
Scheme three is:
Described printed circuit board (PCB) separate unit is provided with convex lens, and the junction of described convex lens and described printed circuit board (PCB) separate unit seals by shading glue.
The present invention passes through at surface-coated one deck optical cement of described chip or uses the plastic body sealing and curing, make chip and air insulated, thereby make follow-up cutting processing procedure can not pollute light path, these characteristics are for being that unit unifies cutting and created condition with described printed circuit board (PCB) separate unit.Owing to can unify cutting to described printed circuit board (PCB), therefore before being bundled on the described printed circuit board (PCB), described chip described printed circuit board (PCB) need not be divided into essentially independent unit, thereby save the pre-segmentation step of the preceding described printed circuit board (PCB) of chip binding, add the method for the unified cutting of following adopted, greatly improved package speed, and improved the utilance of described printed circuit board (PCB), saved material and cost.
In addition, adopt plastic rubber shaping method to make the mounting process that to save with upper-part described pedestal, lens barrel, convex lens, filter; Adopt the optics mixing plastic material of energy usable reflection and/or scattered infrared light line or on described chip, plate one deck infrared ray filter coating and can save infrared filter; Be provided with convex lens on described printed circuit board (PCB) separate unit, lens barrel and pedestal can be save by the sealing of shading glue in the junction of described convex lens and described printed circuit board (PCB) separate unit.Above method technological process both further provided cost savings, and had save relevant assembly technology again, and had further improved package speed.
Description of drawings
The present invention will be further described in detail below in conjunction with Figure of description, wherein:
Fig. 1 is a conventional package method schematic diagram;
Fig. 2 is a method for packing schematic diagram of the present invention;
Fig. 3 is the conventional package structural representation;
Fig. 4 is an encapsulating structure schematic diagram of the present invention;
Fig. 5 is the simple and easy encapsulating structure schematic diagram of the present invention.
Embodiment
As Fig. 1, shown in Figure 3, because at binding chip 1 (is the digitized video sensor chip, for example the electric charge lotus root is closed CCD or complementary metal oxide semiconductors (CMOS) CMOS SENSOR) time, there are any dust subordinate list or a bit damage of chip surface all can cause module to be scrapped, therefore described chip 1 is before being tied on the described printed circuit board (PCB) 2, described printed circuit board (PCB) 2 should be divided into essentially independent unit in advance, but each unit is not separated from from former monoblock circuit board fully, but is keeping faint connection by thinner dowel 10 with former monoblock printed circuit board (PCB).After described chip 1 is tied on the described printed circuit board (PCB) 2, just can with comparalive ease described printed circuit board (PCB) 2 be taken off so that carry out next packaging process from former monoblock printed circuit board (PCB), and bring dust or cause damage can for described chip 1.
In ensuing operation, the optical lens of being made up of lens barrel 6, convex lens 7, infrared light filter 8 is arranged on the described pedestal 5, and described pedestal 5 covers are enclosed in just can finish whole encapsulation flow process on the described chip 1.Obviously, traditional process need be carried out pre-segmentation to described printed circuit board (PCB) 2, has both wasted printed circuit board material, has increased operation again, causes production capacity low.
As Fig. 2, shown in Figure 4, for overcoming the defective of conventional package method, can directly save the pre-segmentation step of described printed circuit board (PCB) 2, described chip 1 is tied on the former monoblock printed circuit board (PCB) in order successively, after finishing, binding unifies cutting.Will inevitably produce dust in cutting process, therefore be easy to cause polluting the light path of described chip 1, in view of this, the present invention is before implementing cutting technique, and to surface-coated one deck optical cement 3 of described chip 1, after cutting finished, directly the air blast drifting dust got final product.Because save the pre-segmentation step of described printed circuit board (PCB) 2, and the gap that need not on former monoblock printed circuit board (PCB), establish dowel 10, therefore improve operating efficiency greatly, and saved material, reduced cost.
As shown in Figure 5, requiring at some imaging effects is not under the too high situation, can adopt optics mixing plastic material that described convex lens 7 is made by plastic rubber shaping technology.This convex lens 7 can be directly arranged on the described printed circuit board (PCB) separate unit, thereby has save pedestal 5; Adopt described shading glue 9 sealings at described convex lens 7 with the part that contacts of described printed circuit board (PCB) separate unit.Described shading glue 9 suitably cooperates with described convex lens 7 warps, can save lens barrel.
In addition, be the elimination Infrared, both can consider to plate one deck infrared ray filter coating, and also can consider in the optics mixing plastic material of described convex lens 7, to add suitable element, described convex lens 7 can be reflected and/or the scattered infrared light line on the surface of described chip 1.No matter adopt which kind of mode, all can save infrared filter.
Must be pointed out that some indefinitenesses that the foregoing description is just made the present invention illustrate.But person of skill in the art will appreciate that, do not departing under aim of the present invention and the scope that can make modification to the present invention, replace and change, these modifications, replacement and change still belong to protection scope of the present invention.
Claims (10)
1, a kind of method for packing of digital image acquisition module comprises in advance the unified printed circuit board (PCB) (2) that is arranged on of plurality of chips (1) is gone up, is the optical lens element (4) that described chip (1) configuration is used to absorb image, it is characterized in that, also comprises the steps:
A, at surface-coated one deck optical cement (3) of described chip (1) or with optics mixed plastic body sealing and curing;
B, described printed circuit board (PCB) (2) is divided into some printed circuit board (PCB) separate units that comprise described chip (1) after, be that unit unifies cutting with described printed circuit board (PCB) separate unit.
2, the method for packing of a kind of digital image acquisition module according to claim 1 is characterized in that: after described printed circuit board (PCB) (2) cutting was finished, the side carried out disposing for described chip (1) step of the optical lens element (4) that is used to absorb image.
3, according to the method for packing of claim 1 or 2 described a kind of digital image acquisition modules, it is characterized in that: described optical lens element (4) is finished encapsulation by following steps: optical lens is placed on the pedestal (5), described pedestal (5) is assemblied on the described printed circuit board (PCB) separate unit, and described optical lens comprises lens barrel (6) and the convex lens (7) that is arranged in order.
4, the method for packing of a kind of digital image acquisition module according to claim 3 is characterized in that: described digital image acquisition module is realized one of in the following manner the filtering infrared function:
A, described pedestal (5), lens barrel (6) and/or convex lens (7) are by plastic rubber shaping, and described lens barrel (6) and/or convex lens (7) are made by optics mixing plastic material, and described optics mixing plastic material can reflect and/or the scattered infrared light line effectively; Perhaps,
B, increase a step before: add plating one deck infrared ray filter coating on the surface of described chip (1) at surface-coated one deck optical cement (3) of described chip (1); Perhaps,
C, in described optical lens, add infrared filter.
5, according to the method for packing of claim 1 or 2 described a kind of digital image acquisition modules, it is characterized in that: described optical lens element (4) is finished encapsulation by following steps: optical lens directly is assemblied on the described printed circuit board (PCB) separate unit, described optical lens comprises convex lens (7), described convex lens (7) is made by plastic rubber shaping technology, and described convex lens (7) seals by shading glue (9) with the junction of described printed circuit board (PCB) separate unit.
6, the method for packing of a kind of digital image acquisition module according to claim 5 is characterized in that, described digital image acquisition module is realized one of in the following manner the filtering infrared function:
A, described convex lens (7) are made by optics mixing plastic material, and described optics mixing plastic material can reflect and/or the scattered infrared light line effectively; Perhaps,
B, increase a step before: add plating one deck infrared ray filter coating on the surface of described chip (1) at surface-coated one deck optical cement (3) of described chip (1).
7, a kind of encapsulating structure of digital image acquisition module, comprise printed circuit board (PCB) (2) and be arranged on chip (1) on the described printed circuit board (PCB) (2), described printed circuit board (PCB) (2) and described chip (1) constitute the printed circuit board (PCB) separate unit jointly, it is characterized in that: surface-coated one deck optical cement (3) of described chip (1) or described chip (1) and optics mixed plastic body sealing and curing are together.
8, the encapsulating structure of a kind of digital image acquisition module according to claim 7, it is characterized in that: described printed circuit board (PCB) separate unit is provided with optical lens element (4), described optical lens element (4) comprises the pedestal (5) that is assemblied on the described printed circuit board (PCB) separate unit, is placed in the optical lens on the described pedestal (5), and described optical lens comprises lens barrel (6), convex lens (7) and the infrared filter (8) that is arranged in order.
9, the encapsulating structure of a kind of digital image acquisition module according to claim 7 is characterized in that: be provided with one deck infrared ray filter coating between described chip (1) and the described optical cement (3), described infrared ray filter coating is plated in the surface of described chip (1).
10, the encapsulating structure of a kind of digital image acquisition module according to claim 7, it is characterized in that: described printed circuit board (PCB) separate unit is provided with convex lens (7), and described convex lens (7) seals by shading glue (9) with the junction of described printed circuit board (PCB) separate unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810165939.8A CN101521166A (en) | 2008-09-10 | 2008-09-25 | Method and structure for packaging digital image acquisition module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810141886 | 2008-09-10 | ||
| CN200810141886.6 | 2008-09-10 | ||
| CN200810165939.8A CN101521166A (en) | 2008-09-10 | 2008-09-25 | Method and structure for packaging digital image acquisition module |
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| CN101521166A true CN101521166A (en) | 2009-09-02 |
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| CN200810165939.8A Pending CN101521166A (en) | 2008-09-10 | 2008-09-25 | Method and structure for packaging digital image acquisition module |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104517985A (en) * | 2013-09-26 | 2015-04-15 | 上海澳华光电内窥镜有限公司 | Cutting encapsulation method of imaging device used for endoscope and imaging device used for endoscope |
| CN106226884A (en) * | 2016-08-23 | 2016-12-14 | 深圳市比亚迪电子部品件有限公司 | The processing technique of camera lens module |
| CN110213473A (en) * | 2019-07-08 | 2019-09-06 | Oppo（重庆）智能科技有限公司 | The production method of camera module, electronic device and camera module |
| CN112492235A (en) * | 2020-12-15 | 2021-03-12 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113910515A (en) * | 2021-10-29 | 2022-01-11 | 西安微电子技术研究所 | Device and method for reinforcing radiating gasket inside power module |
-
2008
- 2008-09-25 CN CN200810165939.8A patent/CN101521166A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104517985A (en) * | 2013-09-26 | 2015-04-15 | 上海澳华光电内窥镜有限公司 | Cutting encapsulation method of imaging device used for endoscope and imaging device used for endoscope |
| CN106226884A (en) * | 2016-08-23 | 2016-12-14 | 深圳市比亚迪电子部品件有限公司 | The processing technique of camera lens module |
| CN110213473A (en) * | 2019-07-08 | 2019-09-06 | Oppo（重庆）智能科技有限公司 | The production method of camera module, electronic device and camera module |
| CN110213473B (en) * | 2019-07-08 | 2021-02-23 | Oppo（重庆）智能科技有限公司 | Camera module, electronic device and manufacturing method of camera module |
| CN112492235A (en) * | 2020-12-15 | 2021-03-12 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113910515A (en) * | 2021-10-29 | 2022-01-11 | 西安微电子技术研究所 | Device and method for reinforcing radiating gasket inside power module |
| CN113910515B (en) * | 2021-10-29 | 2024-04-26 | 西安微电子技术研究所 | Device and method for reinforcing heat dissipation gasket in power module |
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Application publication date: 20090902 |