KR101361359B1 - Camera Module - Google Patents

Camera Module Download PDF

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Publication number
KR101361359B1
KR101361359B1 KR1020070041823A KR20070041823A KR101361359B1 KR 101361359 B1 KR101361359 B1 KR 101361359B1 KR 1020070041823 A KR1020070041823 A KR 1020070041823A KR 20070041823 A KR20070041823 A KR 20070041823A KR 101361359 B1 KR101361359 B1 KR 101361359B1
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KR
South Korea
Prior art keywords
circuit board
printed circuit
camera housing
camera module
camera
Prior art date
Application number
KR1020070041823A
Other languages
Korean (ko)
Other versions
KR20080096918A (en
Inventor
고은옥
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020070041823A priority Critical patent/KR101361359B1/en
Publication of KR20080096918A publication Critical patent/KR20080096918A/en
Application granted granted Critical
Publication of KR101361359B1 publication Critical patent/KR101361359B1/en

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Abstract

The present invention relates to a camera module embedded in a mobile communication terminal, the outer surface of the printed circuit board is coupled in a manner that is inserted into the inner surface of the camera housing, it can be generated according to the uneven amount of epoxy coating on the printed circuit board Defocusing is prevented, and there is no need for a separate coupling groove drilling process for the printed circuit board, which prevents the breakage of the printed circuit board, the generation of foreign matters, and the assembly process. Provides a camera module.
Printed Circuit Board, Camera Housing, Epoxy, Seat

Description

Camera module {Camera Module}

1 is a view schematically showing the structure of a conventional camera module according to the prior art,

2 is a cross-sectional view showing the internal coupling structure of the camera module according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: printed circuit board 20: image sensor

30: camera housing 31: seating portion

40: lens unit 50: IR filter

60: epoxy

The present invention relates to a camera module embedded in a mobile communication terminal.

In general, various mobile communication terminals such as cellular phones, CDMA phones, PDAs, and the like have a network transmission and multimedia functions of daily information. In that regard, as image transmission becomes popular, photography has become increasingly part of mobile communication terminals. Palm-size devices with built-in camera modules, such as PDAs and cellular phones, can take pictures or send images at any time. Accordingly, the demand of the mobile communication terminal in which the camera module is mounted is greatly increased.

In general, a camera module mounted on various mobile communication terminals includes a lens unit 110, a camera housing 120, an IR filter 130, an image sensor 140, and a printed circuit board (shown in FIG. 1). 150 and the like to receive the optical image of the subject is received by the lens unit 110 to the IR filter 130, the IR filter 130 blocks the infrared rays from the received optical image to the image sensor 140 In this case, the image sensor 140 is configured to convert the irradiated optical image into an electrical signal and output the electrical signal.

At this time, the lens unit 110 is configured to perform a focusing (Focusing) operation to obtain the sharpest image by adjusting the focus through the distance with the image sensor 140.

A general camera module having such a structure is coupled in such a manner that the camera housing 120 is attached to the upper surface of the edge of the printed circuit board 150 to which the image sensor 140 is attached. In this case, the camera module 120 is coupled to the bottom surface of the camera housing 120. A protrusion 121 is formed, and correspondingly, a coupling groove 151 into which the coupling protrusion 121 can be inserted is formed at an edge of the printed circuit board 150. As the coupling protrusion 121 and the coupling groove 151 are bonded and fixed by an adhesive such as an epoxy 160 in the state in which the coupling protrusion 121 and the coupling groove 151 are coupled, the camera housing 120 and the printed circuit board 150 are hermetically coupled.

Looking at the bonding process of the printed circuit board 150, after applying the epoxy 160 to the printed circuit board 150, drilling the coupling groove 151, and then combined with the coupling protrusion 121 of the camera housing 120 do.

However, according to such a coupling method, there is a problem such that a crack occurs in the printed circuit board 150 or the printed circuit board 150 is broken in the process of drilling the coupling groove 151, and the camera according to the drilling process Foreign matter may be generated in the module itself, and thus there is a problem in that a defective rate increases when manufacturing a camera module. In addition, if the coating amount of the epoxy 160 is not uniform in the process of applying the epoxy 160 to the printed circuit board 150, defocusing due to the imbalance of the lens unit 110 and the image sensor 140 is There is a problem that can occur.

Therefore, the present invention has been invented to solve this problem, the defocusing that can occur due to the uneven amount of epoxy coating on the printed circuit board is prevented, and a separate coupling groove drilling process for the printed circuit board is unnecessary, printing It is an object of the present invention to provide a camera module in which breakage of a circuit board is prevented, foreign matters are prevented, an assembly process is easy, and thus a defective rate is significantly reduced and a yield is increased.

The present invention to achieve this object, the camera housing; A lens unit inserted into the camera housing to receive an optical image of a subject; An IR filter which blocks infrared rays included in the optical image incident on the lens unit; An image sensor converting an optical image from which infrared rays are blocked through the IR filter into an electrical signal; And a printed circuit board for digitally processing an image signal output by the image sensor, wherein an epoxy is coated on an outer surface of the printed circuit board, and an outer surface of the printed circuit board is provided at a lower end of an inner surface of the camera housing. It provides a camera module to be attached.

In this case, a seating portion on which the printed circuit board is mounted may be formed on an inner surface of the camera housing, and the seating portion may be formed in the form of a mounting protrusion protruding into the camera housing.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

2 is a cross-sectional view showing the internal coupling structure of the camera module according to an embodiment of the present invention.

As shown in FIG. 2, the camera module according to the present invention is installed in a structure in which the printed circuit board 10, the image sensor 20, and the lens unit 40 and the IR filter 50 are integrated therein from the lower side. It consists of a camera housing 30.

The printed circuit board 10 is provided with a predetermined electrical pattern and a plurality of electrodes (not shown), and serves to digitally process an image signal output from the image sensor 20. At this time, the image sensor 20 for converting the received optical image into an electrical signal inside the plurality of electrodes are bonded by an adhesive such as epoxy.

The image sensor 20 includes a pixel area (not shown) including a plurality of pixels, and a plurality of electrodes (not shown) that are input / output terminals of the pixel area. In this case, the plurality of electrodes are electrically connected to the electrodes of the printed circuit board 10 by using wire bonding equipment.

Camera housing 30 is a plastic injection molding, the lens unit 40 and the IR filter 50 is inserted therein. The lens unit 40 performs a function of receiving an optical image of a subject, and collects or diverges light to form an optical image, and the IR filter 50 is an infrared ray included in the optical image incident on the lens unit 40. It performs the function of blocking.

In more detail, since the image sensor 20, which is an image pickup device, can detect near-infrared wavelengths and infrared wavelength bands unlike human eyes, screen shades tend to be red-toned at the time of imaging, thereby blocking the wavelength range. In order to provide an IR cut off filter 50 between the lens unit 40 and the image sensor 20, the optical image collected through the lens unit 40 by the IR filter 50 is infrared. The image sensor 20 is imaged in the blocked state.

On the other hand, the combination of the camera housing 30 and the printed circuit board 10 is coupled in such a way that the printed circuit board 10 is inserted into the inner surface of the camera housing 30 according to an embodiment of the present invention.

That is, the epoxy 60 is applied to the outer surface of the printed circuit board 10 for adhesion and sealing, and the outer surface of the printed circuit board 10 is inserted into and attached to the lower end of the inner surface of the camera housing 30. To combine. At this time, it is preferable that the lower surface of the printed circuit board 10 and the lower surface of the camera housing 30 coincide with each other so that a step is not formed.

According to this coupling method different from the conventional art, the camera module according to the present invention does not need to apply the epoxy 60 only on the side of the printed circuit board 10 and the epoxy 60 on the upper surface. Defocusing due to the imbalance between the lens unit 40 and the image sensor 20 is prevented. In addition, since there is no need to drill a separate coupling hole for coupling with the camera housing 30 to the printed circuit board 10, damage to the printed circuit board 10 is prevented and the assembly process is simplified. .

At this time, according to a preferred embodiment of the present invention, a mounting portion 31 on which the printed circuit board 10 may be mounted is formed on the inner surface of the camera housing 30, wherein the mounting portion 31 is the camera housing. It is preferable to be formed in the form of a seating protrusion formed to protrude into the inner side of 30, but may be formed in the form of stepped grooves or grooves formed stepped. Therefore, according to this structure, the printed circuit board 10 is fixedly coupled by the seating portion 31 and is installed to be spaced apart from the lens portion 40 and the IR filter 50 by a predetermined distance.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

As described above, according to the present invention, the outer surface of the printed circuit board is coupled in such a manner as to be inserted into the inner surface of the camera housing, thereby preventing defocusing that may occur due to an uneven amount of epoxy coating on the printed circuit board. And, there is no need for a separate coupling groove drilling process for the printed circuit board to prevent breakage of the printed circuit board, to prevent foreign matters from occurring, to facilitate the assembly process, thereby significantly reducing the defective rate and increasing the yield.

Claims (3)

  1. A camera housing;
    A lens unit inserted into the camera housing;
    An IR filter to block infrared light incident on the lens unit;
    An image sensor converting an optical image into an electrical signal through the IR filter; And
    Printed circuit board on which the image sensor is mounted
    / RTI &gt;
    Epoxy is coated on the outer surface of the printed circuit board, the outer surface of the printed circuit board is attached to the lower end of the inner surface of the camera housing, the seating portion on which the printed circuit board may be mounted on the inner surface of the camera housing Camera module formed.
  2. delete
  3. The method of claim 1,
    The seating unit is a camera module formed in the form of a mounting protrusion protruding into the inside of the camera housing.
KR1020070041823A 2007-04-30 2007-04-30 Camera Module KR101361359B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070041823A KR101361359B1 (en) 2007-04-30 2007-04-30 Camera Module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070041823A KR101361359B1 (en) 2007-04-30 2007-04-30 Camera Module

Publications (2)

Publication Number Publication Date
KR20080096918A KR20080096918A (en) 2008-11-04
KR101361359B1 true KR101361359B1 (en) 2014-02-12

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US9961277B2 (en) 2011-06-10 2018-05-01 Flir Systems, Inc. Infrared focal plane array heat spreaders
US10169666B2 (en) 2011-06-10 2019-01-01 Flir Systems, Inc. Image-assisted remote control vehicle systems and methods
US9998697B2 (en) 2009-03-02 2018-06-12 Flir Systems, Inc. Systems and methods for monitoring vehicle occupants
US9235876B2 (en) 2009-03-02 2016-01-12 Flir Systems, Inc. Row and column noise reduction in thermal images
US9674458B2 (en) 2009-06-03 2017-06-06 Flir Systems, Inc. Smart surveillance camera systems and methods
US10051210B2 (en) 2011-06-10 2018-08-14 Flir Systems, Inc. Infrared detector array with selectable pixel binning systems and methods
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US9635285B2 (en) 2009-03-02 2017-04-25 Flir Systems, Inc. Infrared imaging enhancement with fusion
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US9208542B2 (en) 2009-03-02 2015-12-08 Flir Systems, Inc. Pixel-wise noise reduction in thermal images
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