CN101872054B - Lens module and camera module applying same - Google Patents
Lens module and camera module applying same Download PDFInfo
- Publication number
- CN101872054B CN101872054B CN 200910301895 CN200910301895A CN101872054B CN 101872054 B CN101872054 B CN 101872054B CN 200910301895 CN200910301895 CN 200910301895 CN 200910301895 A CN200910301895 A CN 200910301895A CN 101872054 B CN101872054 B CN 101872054B
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- China
- Prior art keywords
- microscope base
- lens
- cis
- lens barrel
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Lens Barrels (AREA)
- Studio Devices (AREA)
Abstract
A lens module comprises a lens barrel, a lens base, a battery of lens and colloid, wherein the lens barrel comprises an inner side wall and an outer side wall opposite to the inner side wall; the battery of lens is fixedly arranged in the inner side wall; the lens base is provided with a top and a bottom; at least a flange layer surrounding the outer side wall extends from the outer side wall of the lens barrel along the radial direction; at least three bumps are uniformly distributed on the flange layer; the inner side wall at the top of the lens base is a continuous smooth curve; and the lens barrel is stuck on the inner side wall at the top of the lens base by the bumps and is fixed in the inner side wall of the lens base by the colloid coated between the bumps and the inner side wall of the lens base. The invention also relates to a camera module applying the lens module.
Description
Technical field
The present invention relates to a kind of camera lens module, relate in particular to a kind of have the camera lens module of dust reduction capability and the camera module of application thereof.
Background technology
Along with Development of Multimedia Technology, digital camera, video camera and the mobile phone that has a camera function more and more receive consumers in general's favor, and people are also increasingly high for the image quality of this kind equipment.Yet in the processing procedure process, there is the problem of dust in regular meeting, causes take pictures quality and stability of product to be affected, and therefore, reduces the pollution of dust to the camera module, will help improving the quality of taking pictures of camera module.
Existing camera module generally comprises the camera lens module that is used to form images and is arranged at the CIS in this camera lens module.This camera lens module comprises the lens barrel and the microscope base of a said lens barrel through being threaded that are used to accommodate eyeglass.Because through being threaded, in processing procedure and transportation, have dust and fall into and conceal in the middle of thread pitch between lens barrel and microscope base.And when the rotation lens barrel with adjustment eyeglass and CIS apart from the time, can make and conceal the foreign matter that produces in the dust between screw thread or screw thread friction and drop on the sensing area of CIS, and cause the reduction of filmed image quality.
Summary of the invention
In view of this, the present invention provides a kind of dust reduction capability that has, and can improve the camera lens module of shooting quality and the camera module of application thereof.
A kind of camera lens module, it comprises a lens barrel, a microscope base, a lens combination and colloid.Said lens barrel comprises a madial wall and one and said madial wall opposite external side wall.Said lens combination is fixedly arranged in the said madial wall.Said microscope base has a microscope base top and microscope base bottom.It radially is extended with at least one deck around the flange layer of said lateral wall the lateral wall upper edge of said lens barrel.Be distributed with at least three projections on the said flange layer equably.The madial wall at said microscope base top is a continuous smooth curve.Said lens barrel is fastened on the madial wall at said microscope base top through said projection, and is installed in the madial wall of microscope base through the said colloid between the madial wall that is coated on said projection and microscope base.
A kind of camera module, it comprises: a CIS, a substrate and a camera lens module.Said CIS is arranged on the said substrate, and electrically connects with said substrate.Said camera lens module aligns mutually and is installed on the said substrate with said CIS.It comprises a lens barrel, a microscope base, a lens combination and colloid said camera lens module.Said lens barrel comprises a madial wall and one and said madial wall opposite external side wall.Said lens combination is fixedly arranged in the said madial wall.Said microscope base has a microscope base top and microscope base bottom.It radially is extended with at least one deck around the flange layer of said lateral wall the lateral wall upper edge of said lens barrel.Be distributed with at least three projections on the said flange layer equably.The madial wall at said microscope base top is a continuous smooth curve.Said lens barrel is fastened on the madial wall at said microscope base top through said projection, and is installed in the madial wall of microscope base through the said colloid between the madial wall that is coated on said projection and microscope base.
Compared to prior art, the madial wall at said microscope base top is a continuous smooth curve.Said lens barrel is fastened on the madial wall at said microscope base top through said projection, and is installed in the madial wall of microscope base through the said colloid between the madial wall that is coated on said projection and microscope base.Therefore, need not through threaded engagement between lens barrel and the microscope base, avoid concealing in the dust between screw thread or screw thread friction and the foreign matter that produces drops on the CIS, thereby the shooting quality of this camera module is improved.
Description of drawings
The diagrammatic cross-section of the camera module that Fig. 1 provides for first embodiment of the invention;
Fig. 2 is the synoptic diagram of the lens barrel of the camera module among Fig. 1;
The diagrammatic cross-section of the camera module that Fig. 3 provides for second embodiment of the invention.
Embodiment
See also Fig. 1, the camera module 100 that first embodiment of the invention provides, it comprises that it comprises CIS 10, substrate 20, colloid 30, many leads 35, camera lens module 40, and optical filter 50.
Said CIS 10 can be CCD (Charge Coupled Device; The Charged Coupled Device sensor) or CMOS (Complementary Metal Oxide Semiconductor; Complementary metal oxide sensor), it is used for light signal is converted into electric signal.This CIS 10 has a wafer top surface 11 and the wafer bottom surface 13 relative with wafer top surface 11.Said wafer top surface 11 is provided with a sensing area 12 and a non-sensing area 14 around sensing area 12.Said non-sensing area 14 is provided with a plurality of chip bonding pads 101.
Said substrate 20 can be made by materials such as spun glass, reinforced plastics or potteries, and said substrate 20 comprises a loading end 22.The wafer bottom surface 13 of said CIS 10 is installed on the said loading end 22 through said colloid 30.Loading end 22 corresponding said a plurality of chip bonding pads 101 of said substrate 20 are provided with a plurality of substrate weld pads 201.
Said a plurality of leads 35 is that, conduction good material anti-oxidant by gold etc. processed; The one of which end is fixedly connected with the chip bonding pads 101 of CIS 10; The other end then with substrate 20 on substrate weld pad 201 electrically connect so that the signal of CIS 22 is passed on the substrate 20 through a plurality of leads 35.
In the practical application, also can crystalline form, interior pin be fitted, carrier band is fitted, lost money instead of making money encapsulation or the hot pressing connected mode makes CIS 10 mechanicalnesses and is electrically connected at substrate 20 automatically with covering.Be not limited to this embodiment.
Said camera lens module 40 is arranged on the loading end 22 of said substrate 20 and with said CIS 20 and aligns setting.This camera lens module 40 comprises lens barrel 42, microscope base 44 and lens 46.Said lens 46 are fixedly arranged in the lens barrel 42.
Please consult Fig. 2 in the lump, said lens barrel 42 is a hollow cylindrical, comprises a madial wall 422 and one and said madial wall 422 opposite external side walls 423, and said lens 46 are installed in the madial wall 422 of said lens barrel 42.In this embodiment, it radially is extended with out the flange layer 424 of one deck around said lateral wall 423 to said lateral wall 423 away from CIS 10 1 end upper edges, is distributed with four projections 425 on this layer flange layer 424 equably.Said projection 425 is integrally formed with flange layer 424, and the radial thickness sum is between 0.05 millimeter to 0.1 millimeter.
Said microscope base 44 has a microscope base top 441, microscope base bottom 442 and connects the lens seat shoulder 443 of microscope base top 441 and microscope base bottom 442.The madial wall 4412 at said microscope base top 441 is a continuous smooth curve.Said lens seat shoulder 443 comprises the lower surface 444 that a said CIS 10 is relative.In this embodiment, the interior electrical path length at said microscope base top 441 equals the outer electrical path length sum of the radial thickness and the said lens barrel 42 of the radial thickness of said this layer flange layer 424, projection 425.Said lens barrel 42 is fastened in the madial wall 4412 at said microscope base top 441 through the projection 425 on the said flange layer 424.It is understandable that; After said lens barrel 42 is fastened in the said microscope base top 441; The said colloid 30 of coating between the madial wall 4412 at said projection 425 and said microscope base top 441 is so that said lens barrel 42 is installed in the madial wall 4412 at said microscope base top 441 securely.
Said translucent element 50 is an infrared fileter, is used for light is filtered.Said translucent element 50 is fixedly arranged on the lower surface 444 of said lens seat shoulder 443 through said colloid 30.Said colloid 30 forms dustless sealed package with the sensing area 12 of 50 pairs of said CISs 10 of translucent element, is used to protect the sensing area 12 of said CIS 10.In the practical application, this translucent element 50 also can be glass or other light transmissive materials, and the bottom that it also can be arranged on said lens barrel 42 is not limited to this embodiment
It is understandable that three projections 425 that also can distribute equably on the said flange layer 424, or the projection more than four 425 are not limited to this embodiment.
See also Fig. 3, the camera module 200 of second embodiment of the invention.The structure of said camera module 200 is identical substantially with the structure of the said camera module 100 of first embodiment; Difference is: the number of plies of said flange layer is two layers; The lateral wall 621 of this lens barrel 62 is distributed with four projections 625 equably near also radially extending the flange layer (figure is mark not) of one deck around said lateral wall 623 along it on the end of said CIS 70 on said this layer flange layer.This projection 625 is used for preventing the process in assembling, and decentraction between lens barrel 62 and the microscope base top 641 and squinting is strengthened the concentricity between lens barrel 62 and the microscope base top 641, the adhesion between further simultaneously reinforcement lens barrel 62 and the microscope base top 641.
The madial wall at said microscope base top is a continuous smooth curve.Said lens barrel is fastened on the madial wall at said microscope base top through said projection, and is installed in the madial wall of microscope base through the said colloid between the madial wall that is coated on said projection and microscope base.Therefore, need not through threaded engagement between lens barrel and the microscope base, avoid concealing in the dust between screw thread or screw thread friction and the foreign matter that produces drops on the CIS, thereby the shooting quality of this camera module is improved.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (4)
1. camera module; It comprises: a CIS, a substrate; Said CIS is arranged on the said substrate; And electrically connect with said substrate, said camera module further comprises a camera lens module, this camera lens module aligns and is installed on the said substrate with said CIS mutually; Said camera lens module comprises a lens barrel, a microscope base, a lens combination and colloid; Said lens barrel comprises a madial wall and one and said madial wall opposite external side wall, and said lens combination is fixedly arranged in the said madial wall, and said microscope base has a microscope base top and microscope base bottom; It is characterized in that: on the end of the lateral wall of said lens barrel away from said CIS, radially extend first flange layer of one deck around the lateral wall of said lens barrel along it; Be distributed with at least three projections equably on said first flange layer, the madial wall at said microscope base top is a continuous smooth curve, and said lens barrel is fastened in the madial wall at said microscope base top through the projection on said first flange layer; And be installed in the madial wall of microscope base through the said colloid between the madial wall that is coated on said projection and microscope base; The lateral wall of said lens barrel is distributed with four projections equably and is used for preventing the process in assembling near on said CIS one end, radially extend second flange layer of one deck around the lateral wall of said lens barrel along it on this second flange layer, decentraction between said lens barrel and the microscope base top and squinting.
2. camera module as claimed in claim 1; It is characterized in that: said camera module further comprises a plurality of leads; The non-sensing area of said CIS is provided with a plurality of chip bonding pads; Corresponding a plurality of chip bonding pads are provided with a plurality of substrate weld pads around the bottom edge of said substrate, and said a plurality of chip bonding pads are passed through the corresponding electric connection of said a plurality of leads with a plurality of substrate weld pads.
3. camera module as claimed in claim 1; It is characterized in that: said CIS is to use surface mounting technology, covers crystalline form, interior pin is fitted, a kind of in encapsulation or the hot pressing connected mode fitted, lost money instead of making money to carrier band automatically, makes CIS be connected in substrate and electrically conducts mutually with said substrate.
4. camera module as claimed in claim 1; It is characterized in that: said camera module also further comprises a translucent element and another colloid; Said microscope base comprises that further one connects the lens seat shoulder of microscope base top and microscope base bottom; Said lens seat shoulder comprises a lower surface relative with said CIS, and said translucent element is fixedly arranged on the said lower surface through said another colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910301895 CN101872054B (en) | 2009-04-27 | 2009-04-27 | Lens module and camera module applying same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910301895 CN101872054B (en) | 2009-04-27 | 2009-04-27 | Lens module and camera module applying same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101872054A CN101872054A (en) | 2010-10-27 |
| CN101872054B true CN101872054B (en) | 2012-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910301895 Expired - Fee Related CN101872054B (en) | 2009-04-27 | 2009-04-27 | Lens module and camera module applying same |
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| Country | Link |
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| CN (1) | CN101872054B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102707547B (en) * | 2012-06-25 | 2015-02-04 | 东莞光阵显示器制品有限公司 | Method for manufacturing dustproof photography module and dustproof photography module device |
| CN103345035B (en) * | 2013-07-12 | 2016-08-10 | 南昌欧菲光电技术有限公司 | Image module |
| CN103592806B (en) * | 2013-11-15 | 2016-05-18 | 宁波舜宇光电信息有限公司 | A kind of automatic focusing module of exempting from focusing |
| CN104902146B (en) * | 2014-03-07 | 2018-10-16 | 南昌欧菲光电技术有限公司 | Camera module and photographic device |
| CN107167893B (en) * | 2016-03-08 | 2019-10-18 | 光宝电子(广州)有限公司 | Image focusing structure |
| CN110971794B (en) * | 2019-11-11 | 2021-03-23 | RealMe重庆移动通信有限公司 | Camera module and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2901350Y (en) * | 2006-05-09 | 2007-05-16 | 亚洲光学股份有限公司 | Integrated lens |
| CN200997010Y (en) * | 2006-11-20 | 2007-12-26 | 光耀科技股份有限公司 | Digital lens device |
| CN101409298A (en) * | 2007-10-11 | 2009-04-15 | 鸿富锦精密工业（深圳）有限公司 | Imaging apparatus and assembling method thereof |
-
2009
- 2009-04-27 CN CN 200910301895 patent/CN101872054B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2901350Y (en) * | 2006-05-09 | 2007-05-16 | 亚洲光学股份有限公司 | Integrated lens |
| CN200997010Y (en) * | 2006-11-20 | 2007-12-26 | 光耀科技股份有限公司 | Digital lens device |
| CN101409298A (en) * | 2007-10-11 | 2009-04-15 | 鸿富锦精密工业（深圳）有限公司 | Imaging apparatus and assembling method thereof |
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| Publication number | Publication date |
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| CN101872054A (en) | 2010-10-27 |
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Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY CO., LTD. Effective date: 20141104 Owner name: NANTONG LIDA CONTAINER FITTINGS CO., LTD. Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY (SHENZHEN) CO., LTD. Effective date: 20141104 |
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Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 226000 NANTONG, JIANGSU PROVINCE |
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Effective date of registration: 20141104 Address after: 226000 Jiangsu city of Nantong province Tongzhou District Pingchao Town Industrial Park (Shen Chuan Cun eleven, twelve group) Patentee after: Nantong Lida container fittings Co. Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee before: Hon Hai Precision Industry Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120328 Termination date: 20180427 |