CN113363170B - Camera module chip packaging base combination and manufacturing method thereof - Google Patents

Camera module chip packaging base combination and manufacturing method thereof Download PDF

Info

Publication number
CN113363170B
CN113363170B CN202110833806.9A CN202110833806A CN113363170B CN 113363170 B CN113363170 B CN 113363170B CN 202110833806 A CN202110833806 A CN 202110833806A CN 113363170 B CN113363170 B CN 113363170B
Authority
CN
China
Prior art keywords
optical filter
camera module
module chip
chip package
package base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110833806.9A
Other languages
Chinese (zh)
Other versions
CN113363170A (en
Inventor
高强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Yunzhong Electronic Technology Co ltd
Original Assignee
Suzhou Yunzhong Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Yunzhong Electronic Technology Co ltd filed Critical Suzhou Yunzhong Electronic Technology Co ltd
Priority to CN202110833806.9A priority Critical patent/CN113363170B/en
Publication of CN113363170A publication Critical patent/CN113363170A/en
Application granted granted Critical
Publication of CN113363170B publication Critical patent/CN113363170B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates

Abstract

The invention relates to a camera module chip packaging base combination and a manufacturing method thereof, wherein the camera module chip packaging base combination comprises a packaging base and an optical filter, the packaging base comprises a plastic base, the plastic base is provided with a light transmission part penetrating up and down, the optical filter is correspondingly fixed at the position of the light transmission part, the optical filter is provided with an upper surface, a lower surface and a periphery, the plastic base comprises a body and a hard supporting part, the body is made of soft materials by integral injection molding, the body at least covers the periphery of the optical filter, and the hard supporting part is arranged in the plastic base. The camera module chip packaging base combination is formed on the periphery and the lower surface of the optical filter through one-time injection molding of the soft material, so that the fracture risk of the optical filter under the conditions of assembly, test, drop and the like is effectively prevented. The thermoplastic elastomer material is injection molded on the periphery of the optical filter at one time to form the body, so that the molded optical filter is combined with the base more firmly and reliably, and the performance is stable.

Description

Camera module chip packaging base combination and manufacturing method thereof
The present application is a divisional application of an invention patent application with application number 202110510092.8, which has application name of a camera module chip package base combination and a manufacturing method thereof, and has application date 2021, 5 and 11.
Technical Field
The present disclosure relates to electronic devices, and particularly to a camera module chip package base assembly and a method for manufacturing the same.
Background
The camera module chip packaging base combination in the mobile phone camera module is a component on the mobile phone camera module and is used between an electronic component and a voice coil motor on a PCB. The current technology for attaching the infrared filter in the mobile phone camera module comprises the following steps: and (3) injection molding the pure plastic part, and combining and pasting the infrared filter and a camera module chip packaging base in the optical camera module together by using specific glue in an IR mode by a patch factory to form the H/R assembly. The combination of the chip packaging base of the camera module in the optical camera module mainly comprises the following components: AF-HOLDER base (for optical camera). At present, as the mobile phone is thinner, the requirements on the thickness of the base combination of the chip package of the camera module in the mobile phone camera module are thinner, the available space for the mobile phone camera module is smaller, and as the electronic components on the PCB are more and more, the requirements on the base combination space of the chip package of the camera module in the mobile phone camera module are higher and higher. With the improvement of the pixels of the camera module, the optical filter has the trend of larger and thinner size and thinner thickness, and the IR (infrared) optical filter is easier to break in performance test.
The traditional camera module chip packaging base combination forms the mode to have three kinds, and one of them is, the camera module chip packaging base combination of injection moulding pure plastic spare structure, and the IR mill forms H/R subassembly through pasting together infrared ray light filter with camera module chip packaging base combination with specific glue, and in the in-process that the cell-phone falls, the light filter still can collide with voice coil motor's frame, and the edge of light filter has cracked risk.
In the invention patent with publication number CN105655301B, the camera module chip package base assembly is formed by injection molding a plastic base on a metal piece, and after the camera module chip package base assembly is shipped, an IR factory adheres the optical filter to the camera module chip package base assembly by glue to form an H/R assembly. The UV glue and the thermosetting glue used in the existing paster process are high in hardness of the glue layer formed after solidification, glue with the same hardness between the optical filter and the base is filled, so that the mobile phone cannot buffer the oscillating force in the falling process, and the risk of cracking of the optical filter is increased. In the invention patent application with publication number of CN107591421A, the camera module chip package base assembly is formed by bonding a metal piece and an optical filter to form an optical filter assembly, then placing the optical filter assembly into a plastic mold cavity integrally, and demolding after injection molding, thus finally obtaining the camera module chip package base assembly. The optical filter combined by the camera module chip packaging base of the structure still contacts with the surrounding hard plastic frame, and the edge of the optical filter is at risk of fragmentation.
Therefore, it is necessary to provide a new base assembly of a camera module chip package with buffering effect and a manufacturing method thereof, so as to overcome the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to provide a camera module chip packaging base combination capable of effectively preventing the edge of an optical filter from being broken due to collision and a manufacturing method thereof.
The aim of the invention is achieved by the following technical scheme: the utility model provides a camera module chip package base combination, includes package base and light filter, package base includes the plastic base, the plastic base has the printing opacity portion that runs through from top to bottom, the light filter corresponds the setting and is in the position of printing opacity portion, the light filter has upper surface, lower surface and the connection that set up relatively the upper surface with the periphery of lower surface, the plastic base includes body and stereoplasm supporting part, the body is soft material integral injection moulding, the body covers at least the periphery of light filter, stereoplasm supporting part set up in the plastic base.
Further, four hard supporting parts are arranged in the plastic base, and the four hard supporting parts are respectively fixed at four corners of the body.
Further, the soft material is a thermoplastic elastomer formed by one-time injection molding, and the thermoplastic elastomer is a composite material with rubber characteristics and processing characteristics of plastic.
Further, the body further covers the lower surface of the optical filter.
Further, the lower surface of the optical filter and the body are bonded together by glue so as to fix the optical filter to the body.
Further, the glue is soft glue with elasticity after being solidified.
Further, the body comprises a first buffer part covering the periphery and upwards exceeding the upper surface and a second buffer part downwards exceeding the lower surface from the outer side of the top of the first buffer part, and the first buffer part and the second buffer part are integrally arranged or separately arranged.
Further, the package base further comprises a metal piece which is embedded and molded in the body to bear the optical filter, the metal piece is provided with a frame opening which is arranged corresponding to the light-transmitting part, and the metal piece comprises an attaching part which is arranged corresponding to the lower surface of the optical filter.
Further, the metal piece further comprises a frame portion located above the attachment portion and arranged corresponding to the periphery of the optical filter, and the frame portion and the bottom side face of the attachment portion of the metal piece are at least partially covered by the body.
Further, soft glue is formed between the lower surface of the optical filter and the attachment portion of the metal piece in a dispensing mode to form a bottom side buffer portion so as to fix the optical filter on the top side face of the attachment portion of the metal piece.
Further, a gap is provided between the peripheral edge of the filter and an inner wall provided in the frame portion of the metal member, and the gap is filled with the body.
Further, the metal piece is provided with insulation and adhesiveness by a surface treatment mode.
The purpose of the invention is realized by the following technical scheme II: a manufacturing method of a camera module chip packaging base combination comprises the following steps:
providing a light filter, wherein the light filter is provided with an upper surface, a lower surface and a periphery connecting the upper surface and the lower surface, wherein the upper surface and the lower surface are oppositely arranged;
providing a thermoplastic elastomer, forming a body with a first buffer part covering the periphery and a second buffer part extending downwards beyond the lower surface by injection molding the thermoplastic elastomer at the periphery of the optical filter or at the outer side of the periphery and the lower surface of the optical filter at one time;
An engineering plastic is provided, a hard supporting part for supporting the body is formed in the body, and then a plastic base for fixing the optical filter is formed.
Further, the hard support portions are formed at four corner positions of the body and are provided separately.
Further, the method comprises the steps of providing a metal piece which is embedded and molded in the body, wherein the metal piece is provided with a frame opening which is arranged corresponding to the light transmission part, and the metal piece comprises an attachment part which is arranged corresponding to the lower surface of the optical filter; and providing glue, and adhering the attaching part and the lower surface of the optical filter together through the glue so as to fix the optical filter on the metal piece.
Further, the glue is soft glue with elasticity after being solidified.
Further, the method also comprises the following steps: glue is provided, and the optical filter and the body are bonded together through the glue so as to fix the optical filter on the body.
The camera module chip packaging base combination is formed on the periphery of the optical filter and the lower surface of the optical filter through one-time injection molding of soft materials, so that the fracture risk of the optical filter under the conditions of assembly, test, falling and the like is effectively prevented. Simultaneously, the thermoplastic elastomer material is injection molded on the periphery of the optical filter at one time to form the body, so that the molded optical filter is combined with the base more firmly and reliably, and the performance is stable.
Drawings
Fig. 1 is an exploded perspective view of a camera module according to the present invention.
Fig. 2 is a schematic perspective view of a first series of camera module chip package base assemblies according to the present invention.
Fig. 3 is a view of fig. 2 from another direction.
Fig. 4 is an exploded perspective view of a first series of camera module chip package base assemblies according to the present invention.
Fig. 5 is a flowchart of molding a first series of camera module chip package base assemblies according to the present invention.
Fig. 6 is a cross-sectional view of a first series of camera module chip package base assemblies of the present invention.
Fig. 7 is an enlarged view of a portion of fig. 6.
Fig. 8 is a schematic perspective view of a camera module chip package base assembly according to a first embodiment of the second series of the present invention.
Fig. 9 is a view of fig. 8 from another direction.
Fig. 10 is a partially exploded perspective view of a camera module chip package base assembly according to a first embodiment of the second series of the present invention.
Fig. 11 is a further exploded perspective view of fig. 10.
Fig. 12 is a view of fig. 10 from another direction.
Fig. 13 is a view from another direction in fig. 11.
Fig. 14 is a cross-sectional view taken along line A-A in fig. 9.
Fig. 15 is a partially enlarged view of fig. 14.
Fig. 16 is a cross-sectional view of a camera module chip package base assembly according to a second embodiment of the second series of the present invention.
Fig. 17 is a partially enlarged view of fig. 16.
Fig. 18 is a cross-sectional view of a camera module chip package base assembly in a third embodiment of the second series of the present invention.
Fig. 19 is an enlarged view of a portion of fig. 18.
Fig. 20 is a cross-sectional view of a camera module chip package base assembly in a fourth embodiment of the second series of the present invention.
Fig. 21 is a partially enlarged view of fig. 20.
Fig. 22 is a cross-sectional view of a camera module chip package base assembly in a fifth embodiment of the second series of the present invention.
Fig. 23 is a partially enlarged view of fig. 22.
Fig. 24 is a cross-sectional view of a camera module chip package base assembly in a sixth embodiment in a second series of the present invention.
Fig. 25 is a partially enlarged view of fig. 24.
Fig. 26 is a cross-sectional view of a camera module chip package base assembly in a seventh embodiment in a second series of the present invention.
Fig. 27 is a partially enlarged view of fig. 26.
Fig. 28 is a top view of a camera module chip package base assembly according to an eighth embodiment of the second series of the present invention.
Fig. 29 is a schematic perspective view of a camera module chip package base assembly according to a first embodiment of the third series of the present invention.
Fig. 30 is an exploded perspective view of a camera module chip package base assembly according to a first embodiment of the third series of the present invention.
Fig. 31 is a view looking in the other direction of fig. 30.
Fig. 32 is a schematic perspective view of a base in a first embodiment of a third series of the present invention.
Fig. 33 is an exploded perspective view of the base of fig. 32.
Fig. 34 is a sectional view taken along line B-B of fig. 29.
Fig. 35 is an enlarged view of a portion of fig. 34.
Fig. 36 is a cross-sectional view of a camera module chip package base assembly according to a second embodiment of the third series of the present invention.
Fig. 37 is an enlarged view of a portion of fig. 36.
Fig. 38 is a cross-sectional view of a third embodiment of a camera module chip package base assembly in a third series of the present invention.
Fig. 39 is an enlarged view of a portion of fig. 38.
Fig. 40 is a cross-sectional view of a fourth embodiment of a camera module chip package base assembly in a third series of the present invention.
Fig. 41 is an enlarged view of a portion of fig. 40.
Description of the main reference signs
Please refer to the following reference numerals for description of the first series of the present invention:
the camera module 1000, the lens 1001, the printed circuit board 1003, the image sensor 1004, the voice coil motor 1005, the camera module chip package base assembly 100, the optical filter 1, the upper surface 11, the lower surface 12, the peripheral edge 13, the metal piece 2, the top surface 21, the through hole 22, the first through hole 221, the second through hole 222, the concave part 23, the frame opening 24, the first arm 25, the second arm 26, the soft glue 3, the body 4, the groove 41, the through hole 42, the first buffer part 43, the second buffer part 44, the plastic base 5, the bump 51, the light transmitting part 52, the top wall 53, the side wall 54, the accommodating cavity 55, the first semi-finished product S1, and the second semi-finished product S2.
The reference numerals in the second series of the invention illustrate:
the camera module chip package base assembly 100'/100a '/100b '/100c '/100d '/100e '/100f '/100g ', the filter 1', the upper surface 11', the lower surface 12', the peripheral edge 13', the metal member 2', the frame body portion 21', the top surface 211', the bottom surface 212', the first arm 213', the second arm 214', the inner wall 215', the attaching portion 22', the upper wall 221', the gap portion 23', the frame opening 24', the first distance d1', the tape joint 25', the soft glue 3'/3a '/3b '/3c '/3d '/3e ', the body 4'/4a '/4b '/4c '/4d '/4e ', the second buffer portion 41'/3a2'/4a2'/3c2'/4b2'/4c2'/4d2', the through hole 42'/3a3'/4a3'/3c3'/4b3'/4c3'/4d3', the first buffer portion 43'/3a1'/4a1'/3c1'/4b1'/4c1'/4d1', the bottom buffer portion 3a4'/3c4'/4 d4', the plastic base 5', the lower extension portion 51', the light transmitting portion 52', the plate portion 53', the receiving cavity 54', the upper extension portion 55'.
The reference numerals in the third series of the invention illustrate:
the camera module chip package base combination 100"/100a"/100b "/100c", the filter 1", the upper surface 11", the lower surface 12", the peripheral edge 13", the metal piece 2", the frame body portion 21", the first arm 211", the second arm 212", the inner wall 213", the attaching portion 22", the first attaching portion 221", the second attaching portion 222", the frame opening 23", the tape connecting portion 24", the soft glue 3"/3a", the body 5"/5a"/5b "/5c", the first buffer portion 51"/5a1"/5b1"/5c1"/3e 1", the second buffer portion 53"/5a2"/5b2"/5c2", the plate portion 54"/5a4"/5b4"/5c4", the bottom side buffer portion 5a5", the light transmitting portion 52", and the hard support portion 6".
The invention will be further illustrated by the following specific examples in conjunction with the above-described figures.
Detailed Description
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The camera module is an important component of electronic equipment with a camera shooting function, such as a mobile phone, a tablet personal computer and the like. The camera module 1000 generally includes a Printed Circuit Board (PCB) 1003, an image sensor 1004 located on the PCB 1003, a voice coil motor 1005, and a lens 1001. The voice coil motor 1005 is provided with a receiving hole (not numbered), and the lens 1001 is disposed in the receiving hole of the voice coil motor 1005 so as to be disposed opposite to the image sensor 1004. In order to obtain a better image display effect, a camera module chip packaging base combination 11 with an optical filter 1 is further required to be arranged between the image sensor 1004 and the lens 1001, so that not only can the image sensor 1004 be packaged and protected, but also the optical filter 1 can be supported and protected. In the present invention, the camera module chip package base assembly 100 includes an optical filter 1. The camera module chip package base assembly 100 is a component of the camera module 1000, and is used between the electronic components and the voice coil motor 1005 on the printed circuit board 1003. The camera module chip packaging base combination in the field mainly refers to an AF Holder base (applicable to an optical camera), and after an IR (infrared) filter is stuck on the AF Holder base, the camera module chip packaging base combination is formed and also becomes an H/R component. In the prior art, as the mobile phone is thinner, the requirements on the thickness of the base combination of the chip package of the camera module in the mobile phone camera module are thinner, the available space of the mobile phone camera module is smaller, and as the electronic components on the printed circuit board are more and more, the requirements on the base combination space of the chip package of the camera module in the mobile phone camera module are higher and higher. In the conventional technology, the camera module chip package base combination with the pure plastic part structure is usually injection molded, and the IR factory forms the H/R assembly by bonding the IR filter with the camera module chip package base combination by using specific glue, and in this case, the filter still can be in impact contact with the inner wall surface of the H/R assembly or the hard glue, so that the edge of the filter still has the risk of cracking. In the invention, the outer periphery (comprising the lower surface 12 and the periphery 13) of the optical filter 1 is coated with soft materials, so that the edge of the optical filter 1 cannot be broken under the conditions of collision, collision or falling and the like of the outer periphery of the optical filter 1. Meanwhile, a large amount of equipment is required to be input into the jig of the camera module chip packaging base assembly 100, and the continuous characteristic of the metal piece 2 can be utilized to realize automatic production, so that the problem of high input cost of a chip mounting process in the camera module 1000 can be solved, and the process is simplified. In the invention, the package base comprises the plastic base 5 and the metal piece 2 injection molded in the plastic base 5.
In the present invention, the soft material includes a soft glue and a thermoplastic elastomer material. The soft glue is glue with elasticity after curing such as silica gel glue or white latex. The thermoplastic elastomer (Thermoplastic Elastomer, TPE for short) is an environment-friendly low-carbon composite material with rubber characteristics and plastic processing characteristics. The rubber characteristics refer to high elasticity, compression set, and the like. The processing characteristics of the plastic refer to simple process. Materials such as TPR, TPU, TPV, TPEE, TPO, TPAE fall within the scope of thermoplastic elastomer materials.
In the present invention, the material of the metal member is at least one of superalloy, stainless steel, copper, and the like, and the metal member is surface-treated to obtain the characteristics of high insulation and adhesion. The thickness of the metal piece ranges from 0.05mm to 0.15mm.
Before providing a metal piece, firstly, punching a metal alloy sheet with the thickness of 0.05mm to 0.15mm into a shape with quantitative forming through a precision punching die, and coiling and packaging; and then, the metal alloy product punched into the preset shape is subjected to special surface treatment to obtain the characteristic of strong insulation and adhesion, and is coiled and packaged to obtain the preset metal product.
When the body is molded, as the metal piece is connected with the material belt, products with the optical filter and the metal piece are continuously implanted into a prepared plastic mold cavity in a material belt mode, a proper injection molding machine (not shown) is selected to be molten with the thermoplastic elastomer material, the products with the material belt connected with vibration are injected into the plastic mold cavity (not shown) through an injection molding process (insert-molding), and then the products with the material belt connected with vibration can be obtained through cooling, ejection and demolding.
When the packaging base is formed, products connected with the material belt are continuously implanted into a prepared plastic mould cavity (not shown) for the second time in a material belt mode, a proper injection molding machine (not shown) and engineering plastics (not shown) are selected to be melted, the products are injected into the plastic mould cavity through an injection molding process, and then the packaging base combination of a plurality of camera module chip packaging bases connected with the material belt can be obtained through cooling, ejection and demoulding.
Finally, cutting the plurality of camera module chip packaging base combinations connected with the material belts through a special cutting machine (not shown) to form a plurality of separated camera module chip packaging base combinations. The cutting machine has the functions of cutting material belts and dividing multiple holes.
In the manufacturing method for manufacturing the camera module chip packaging base assembly 100, the automatic machine pulls the material belt, so that full-automatic production can be realized.
In the present invention, the filter is an infrared filter, and the filter may be white glass or blue glass, such as plexiglas.
The present invention relates to three series of embodiments, wherein in the first series, a soft material such as soft glue is used to adhere the optical filter 1 to the metal part 2 of the packaging base, and meanwhile, the soft material such as thermoplastic elastomer is used to package the periphery of the optical filter 1 and exceeds the optical filter 1 in the up-down direction, so that a buffer layer can be effectively formed, and the risk of cracking of the optical filter in the situations of assembly, test, drop and the like can be effectively prevented.
The first series of embodiments is set forth below.
Referring to fig. 1 to 7, the camera module chip package base assembly 100 includes a package base and an optical filter 1. The package base comprises a plastic base 5. The plastic base 5 has a light-transmitting portion 52 penetrating from top to bottom, and the optical filter 1 is correspondingly disposed at the position of the light-transmitting portion 52 of the plastic base 5. The plastic base 5 further comprises a top wall 53 and side walls 54 extending downwards from the periphery of the top wall 53. The light-transmitting portion 52 penetrates the top wall 53. The plastic base 5 further includes a receiving cavity 55 surrounded by the side wall 54. The light-transmitting portion 52 communicates with the housing chamber 55. The accommodating chamber 55 is used for accommodating the image sensor 1004. The filter 1 has an upper surface 11 and the lower surface 12 which are disposed opposite to each other, and the peripheral edge 13 connecting the upper surface 11 and the lower surface 12. At least the peripheral edge 13 and a portion of the lower surface 12 of the optical filter 1 corresponding to the peripheral edge 13 are coated with a soft material (not numbered) so that the optical filter 1 is not in contact with the plastic base 5. That is, the portion where the optical filter 1 may contact with the periphery is provided with the buffer layer formed by the soft material, and the optical filter 1 may not be directly contacted with the plastic base 5 or other external structures in the process of transporting, dropping or testing the camera module chip packaging base assembly 100, so that the edge of the optical filter 1 is protected from being broken, and the function of the camera module chip packaging base assembly 100 is ensured. In the present invention, the shape of the filter 1 is approximately rectangular, but may be various shapes such as a circle and a triangle, and the present invention is not limited to the shape of the filter 1, and may be rectangular.
In the present invention, the soft material includes a body 4 made of the thermoplastic elastomer material, which is wrapped around the peripheral edge 13 of the optical filter 1 and is accommodated in the light-transmitting portion 52. The soft material further comprises soft glue 3 covering a part of the lower surface 12 of the optical filter 1. The soft glue 3 adheres and fixes the optical filter 1 and the metal piece 2 below.
The package base further includes a metal member 2 having a frame opening 24 corresponding to the light-transmitting portion 52. In this embodiment, the metal piece 2 has a planar structure, but the metal piece 2 of the present invention may also have various three-dimensional shapes, and is not limited to the planar structure, and the metal piece 2 has the advantages that: the edge of the frame opening 24 is formed by surrounding the metal piece 2, so that the hardness is higher, and the thickness of the frame opening 24 of the camera module chip packaging base, which is attached to the optical filter 1, is reduced under the condition that the strength requirement of the mobile phone camera module chip packaging base is met. The filter 1 is held by the soft glue 3 and the metal piece 2 and partially exposed from the frame opening 24 by arranging the soft glue on the lower surface 12. The soft glue 3 may keep the optical filter 1 and the metal part 2 connected and not separated. The metal part 2 and the soft glue 3 together with the optical filter 1 form a first semi-finished product S1 (refer to fig. 5).
The metal piece 2 further includes a top surface 21 opposite to the lower surface 12 of the optical filter 1 for adhering the soft glue 3. The metal piece 2 is provided with a plurality of through holes 22 penetrating up and down, in this embodiment, the through holes 22 are unevenly disposed, and the through holes 22 include a first through hole 221 near the inner side of the frame opening 24 and a second through hole 222 located outside the first through hole 221 and disposed outside the frame opening 24. The metal member 2 includes a pair of first arms 25 disposed opposite to each other and a pair of second arms 26 connected to the pair of first arms 25. The first through holes 221 and the second through holes 222 are distributed on the first arm 25 and the second arm 26. The pair of first arms 25 and the pair of second arms 26 are mutually surrounded to form the hollow frame opening 24. The metal part 2 further includes a recess 23 concavely provided outside the first arm 25 and the second arm 26. The metal pieces 2 are arranged at intervals and connected, and a connecting wall (not shown in the figure) is arranged between each two adjacent metal pieces 2. The metal pieces 2 are formed by stamping a metal sheet and are connected with each other by a material strip, and the material strip is cut after injection molding the plastic base 5 to form a plurality of separated camera module chip package base combinations 100.
The camera module chip package base assembly 100 is formed by injection molding the thermoplastic elastomer material on the outer sides of the optical filter 1 and the metal piece 2 at one time to form the body 4. The camera module chip package base assembly 100 is formed by injection molding the plastic base 5 around the body 4. Specifically, the camera module chip package base assembly 100 forms the body 4 by injection molding the thermoplastic elastomer material at the peripheral edge 13 of the optical filter 1 of the first semi-finished product S1 at a time to form a second semi-finished product S2. The body 4 can resist external impact and plays a role of buffering. In the present invention, the body 4 includes a first buffer portion 43 located above the metal member 2 and a second buffer portion 44 located below the optical filter 1. The first buffer portion 43 covers the peripheral edge 13 of the filter 1 and a portion of the upper surface 11. The second cushioning portion 44 extends into the bezel 24 and wraps around a portion of the lower surface 12. The body 4 is coated on the upper and lower sides of the metal piece 2 and is combined with the first through hole 221, and the plastic base 5 is coated on the upper and lower sides of the metal piece 2 and is combined with the second through hole 222. The body 4 and the plastic base 5 both protrude upwards from the upper surface 11 of the optical filter 1, and the body 4 is flush with the upper surface of the plastic base 5. At this time, that is, the body 4 may cover the circumference of the optical filter 1 such that the optical filter 1 has no portion in contact with the outside in the horizontal direction. The first buffer portion 43 and the second buffer portion 44 are used for blocking the impact of the peripheral edge 13 of the optical filter 1 in the horizontal direction and the impact in the vertical direction, so that the impact received by the peripheral edge 13 of the optical filter 1 is greatly reduced, and the risk of the peripheral edge 13 and the upper surface 11 and the lower surface 12 of the optical filter 1 being broken due to the impact or the impact is alleviated. The body 4 is rectangular, and is provided with a plurality of grooves 41 and through holes 42 located at the center and corresponding to the frame opening 24 and the light-transmitting portion 52 at the outer edge thereof. The thickness of the body 4 in the vertical direction perpendicular to the horizontal direction is greater than the thickness of the optical filter 1, so that the body 4 can well cover the periphery of the optical filter 1 and form a buffer layer of the optical filter 1.
The camera module chip package base assembly 100 forms the plastic base 5 by secondary injection molding around the body 4 of the second semi-finished product S2. The plastic base 5 is further provided with a projection 51 which interacts with the recess 41 to achieve positioning. Of course, the positions of the bump 51 and the groove 41 can be changed to each other, so as to achieve positioning therebetween. I.e. the edge of one of the body 4 and the plastic base 5 is provided with a groove 41, and the other is provided with a protrusion 51 which is matched with the groove 41. The plurality of unevenly distributed through holes 22 on the metal piece 2 are used for positioning the thermoplastic elastomer material and the plastic in a circulating way, so that the reliability is higher. The first through hole 221 interacts with the body 4 to realize the relative positioning of the metal piece 2 and the body 4. The second through hole 222 interacts with the plastic base 5 to realize the relative positioning of the metal piece 2 and the plastic base 5.
A method for manufacturing the camera module chip package base assembly 100, comprising the steps of:
providing a filter 1 such that the filter 1 has an upper surface 11 and a lower surface 12 arranged opposite to each other and a peripheral edge 13 connecting the upper surface 11 and the lower surface 12;
Providing a metal piece 2 with a frame opening 24;
providing a soft glue 3, adhering and fixing the lower surface 12 of the optical filter 1 and the metal piece 2, so that the optical filter 1 is partially exposed out of the frame opening 24, and forming a first semi-finished product S1;
providing a thermoplastic elastomer material, injection-molding the thermoplastic elastomer material at one time at the peripheral edge 13 of the optical filter 1 of the first semi-finished product S1 to form a body 4, and forming a second semi-finished product S2;
and (3) secondarily injection molding a plastic base 5 with a light-transmitting part 52 corresponding to the frame 24 around the body 4 of the second semi-finished product S2, and forming the camera module chip packaging base combination 100.
In the present invention, the optical filter 1 is adhered to the metal member 2 by using the soft glue 3, the periphery of the optical filter 1 is encapsulated by using the thermoplastic elastomer material, the body 4 having the first buffer portion 43 and the second buffer portion 44 protruding upward from the upper surface 11 of the optical filter 1 and protruding downward from the lower surface 12 of the optical filter 1 is formed, so that a buffer layer capable of resisting external impact can be effectively formed around the optical filter 1, and the fracture risk of the optical filter 1 in the situations of assembly, test, transportation, drop and the like can be effectively prevented. Meanwhile, the body 4 and the plastic base 5 are respectively formed in a secondary injection molding mode, and after molding, the optical filter 1 is combined with the body 4 and the plastic base 5 more firmly and reliably, so that the performance is stable. In addition, since the metal piece 2 is disposed on the outer edge of the optical filter 1, the rigidity of the outer edge of the optical filter 1 can be increased, so that the plastic base 5 in the voice coil motor 1005 with the camera module chip package base combination 100 is not easy to crack, the quality of products is ensured, and the yield of the products is improved. In the manufacturing method of the camera module chip package base assembly 100, the metal piece 2 and the optical filter 1 are integrally implanted into the plastic mold cavity in the form of an assembly (the first semi-finished product S1), so that the material belt can be pulled in an automatic mode, and full-automatic production is realized.
The second series of embodiments of the present invention is to use at least one of soft materials including soft glue or thermoplastic elastomer materials to provide a buffer layer capable of effectively resisting external impact at the periphery 13' of the optical filter 1' and a portion of the lower surface 12' adjacent to the periphery 13', so as to effectively prevent the risk of breakage of the optical filter 1' in the case of assembly, testing, transportation, dropping, etc. Meanwhile, the invention forms the body 4'/4a'/4b '/4c'/4d '/4e' made of thermoplastic elastomer material and the plastic base 5 'of the packaging base respectively through a two-shot molding mode, and the combination between the optical filter 1' and the body 4'/4a'/4b '/4c'/4d '/4e' and the packaging base after molding is reliable, and the performance is stable.
The second series of embodiments is set forth below.
In the invention, the lower surface 12' and the peripheral edge 13' of the optical filter 1' are coated with soft materials, so that the edge of the optical filter 1' cannot be broken under the conditions of collision, collision or falling and the like of the peripheral edge of the optical filter 1 '. Meanwhile, a large amount of equipment is needed to be put into the jig of the camera module chip packaging base combination 100'/100a'/100b '/100c'/100d '/100e'/100f '/100g', and the like.
The second series of the present invention relates to eight embodiments in total, in which fig. 8 to 15 are the first embodiment, fig. 16 to 17 are the second embodiment, fig. 18 to 19 are the third embodiment, fig. 20 to 21 are the fourth embodiment, fig. 22 to 23 are the fifth embodiment, fig. 24 to 25 are the sixth embodiment, fig. 26 to 27 are the seventh embodiment, and fig. 28 is the eighth embodiment. Reference numerals referring to the same elements, such as the filter 1 'and the plastic base 5', remain identical in each embodiment. Referring to fig. 8 to 28, the following description will be given with reference to the common structure in the eight embodiments.
The camera module chip package base assembly 100 'comprises a package base and an optical filter 1'. The package base includes a plastic base 5 'having a light-transmitting portion 52' penetrating up and down. The optical filter 1' is correspondingly arranged at the position of the light-transmitting part 52' of the plastic base 5'. The filter 1 'has an upper surface 11' and a lower surface 12 'disposed opposite to each other, and a peripheral edge 13' connecting the upper surface 11 'and the lower surface 12'. In the present invention, the shape of the filter 1 'is rectangular, and the present invention is not limited to the shape of the filter 1' which is rectangular. Correspondingly, the cross section of the packaging base in the horizontal direction is rectangular. The plastic base 5 'comprises a plate portion 53' arranged corresponding to the optical filter 1 'and a lower extending portion 51' which is arranged to extend downwards from the plate portion 53 'and has a U-shaped cross section opening downwards along the vertical direction formed by the plate portion 53'. The lower extension portion 51' extends downward beyond the lower surface 12' of the optical filter 1', the plate portion 53' and the lower extension portion 51' enclose a housing cavity 54', and the housing cavity 54' is used for housing the image sensor 1004 on the printed circuit board 1003. The plastic base 5' further includes an upper extension 55' extending upward from the plate 53' and having a U-shaped cross-section opening upward from the plate 53', and the upper end of the upper extension 55' also extends beyond the upper surface 11' of the optical filter 1'. The peripheral edge 13' of the filter 1' and the lower surface 12' adjacent to the peripheral edge 13' are partially covered with a soft material (not numbered) so that the filter 1' is not in contact with the package base. The upper surface 11' of the filter 1' is partially covered by the soft material at a position adjacent to the peripheral edge 13'. The lower surface 12' of the filter 1' is covered with the soft material at a position adjacent to the peripheral edge 13' so that the filter 1' is spaced apart from the plate portion 53 '. In the present invention, the package base includes the plastic base 5 'or the plastic base 5' and the metal part 2 'injection molded in the plastic base 5'.
The soft material includes a first buffer portion 43' extending upward from the lower surface 12' of the filter 1' and covering the peripheral edge 13' of the filter 1', a second buffer portion 41' extending downward from the lower surface 12' of the filter 1', and a bottom buffer portion located between the lower surface 12' of the filter 1' and the plate portion 53 '. The first buffer portion 43 'and the second buffer portion 41' are integrally formed and formed in one piece. When the camera module chip package base assembly includes the metal member 2', the second buffer portion 41' extends downward beyond the bottom surface (not numbered) of the metal member 2'.
In the present invention, the soft material is soft glue 3'/3' a/3b '/3c'/3d '/3e' or body 4'/4a'/4b '/4c'/4d '/4e' made of a thermoplastic elastomer material.
In the present invention, the materials of the first buffer portion 43 'and the second buffer portion 41' are divided into two types, and in one case, the first buffer portion 43 'and the second buffer portion 41' are both made of the thermoplastic elastomer material; alternatively, the first buffer portion 43 'and the second buffer portion 41' are both made of the soft glue. When the first buffer portion 43' and the second buffer portion 41' are both made of the thermoplastic elastomer material, the bottom of the body 4' made of the thermoplastic elastomer material extends beyond the lower surface 12' of the filter 1 '; when the first buffer portion 43 'and the second buffer portion 41' are both made of the soft glue 3', the bottom of the soft glue 3' extends beyond the lower surface 12 'of the optical filter 1'. The second buffer portion 41 'extends downward beyond the lower surface 12' of the optical filter 1', firstly, when the second buffer portion 41' is made of thermoplastic elastomer material, the second buffer portion 41 'can be better combined with the soft glue 3' to increase the holding force between the body 4 'and the soft glue 3', and secondly, the second buffer portion 41 'extends beyond the bottom surface (not numbered) of the metal piece 2' to be better held with the package base. The specific case will be described in detail in the detailed description.
In a second series of the eight embodiments of the example of the invention, the features described above are substantially identical. Eight embodiments will be described in detail below. The applicant further classifies these eight embodiments into two categories, the first category of embodiments is that the camera module chip package base combination is directly made of the optical filter 1', the soft glue or thermoplastic elastomer material and the plastic base 5'.
The second type of implementation manner is that the optical filter 1', a metal piece 2' with a U-shaped section, the soft glue or thermoplastic elastomer material and the plastic base 5' are made into the camera module chip packaging base combination.
The first category of embodiments relates to the third embodiment shown in fig. 18 and 19, the fourth embodiment shown in fig. 20 and 21, the seventh embodiment shown in fig. 26 and 27, and the eighth embodiment shown in fig. 28. The second category of embodiments relates to the first embodiment shown in fig. 8 to 15, the second embodiment shown in fig. 16 and 17, the fifth embodiment shown in fig. 22 and 23, and the sixth embodiment shown in fig. 24 and 25. The respective embodiments will be described in order below. In a first class of embodiments, the package base comprises the plastic base 5', and in a second class of embodiments, the package base comprises the plastic base 5' and a metal piece 2 'injection molded within the plastic base 5'.
Referring to fig. 18 and 19, in a third embodiment of the present invention, the camera module chip package base assembly 100b 'includes a bottom buffer portion (i.e. soft glue 3 b') formed by dispensing the soft glue 3b 'once on the lower surface 12' of the optical filter 1 'and holding the optical filter 1' and the plate portion 53 'of the optical filter 5' by injection molding the plastic base 5 'with a U-shaped cross section, and a second buffer portion 4a2' formed by injection molding the thermoplastic elastomer material twice on the peripheral edge 13 'of the optical filter 1' and formed by injection molding the thermoplastic elastomer material twice on the peripheral edge 13 'of the optical filter 1', wherein the body 4a 'includes a first buffer portion 4a1' extending upward from the lower surface 12 'of the optical filter 1' and covering the peripheral edge 13 'of the optical filter 1'. The soft glue 3b 'is fixed to the plate portion 53'. In the present embodiment, the soft glue 3b 'covering the peripheral edge 13' of the optical filter 1 'and the body 4a' made of the thermoplastic elastomer material covering the lower surface 12 'of the optical filter 1' are formed by separate molding. The body 4a 'is rectangular in the horizontal direction and has a through hole 4a3' provided with the light transmitting portion 52 'partially exposing the filter 1'. The first buffer portion 4a1 'is surrounded by the through hole 4a3'. The first buffer portion 4a1 'and the second buffer portion 4a2' are each made of a thermoplastic elastomer material. At this time, the peripheral edge 13' of the optical filter 1' is protected by the body 4a ' and the soft glue 3b ' to prevent the peripheral edge of the optical filter 1' from being broken due to external impact.
A method for manufacturing the camera module chip package base assembly 100b' in the third embodiment, comprising the steps of: a filter 1' is provided, wherein the filter 1' is provided with an upper surface 11' and a lower surface 12' which are oppositely arranged, and a peripheral edge 13' which connects the upper surface 11' and the lower surface 12 '; an engineering plastic is provided, and a plastic base 5' with a downward cross-section opening is formed by one-step injection molding, wherein the plastic base 5' comprises a light-transmitting part 52', a plate part 53' arranged corresponding to the optical filter 1', a lower extension part 51' which is arranged to extend downwards from the plate part 53' and forms a U-shaped cross section with the plate part 53', and an upper extension part 55' which is arranged to extend upwards from the plate part 53' and forms a U-shaped cross section with the plate part 53 '. The plate portion 53 'is rectangular, and opposite sides of the plate portion 53' constitute the light-transmitting portion 52 'exposing the filter 1'; providing a soft glue 3b ', dispensing the soft glue 3b ' on the plate 53' at one time to fix the optical filter 1' and the plastic base 5 '; thermoplastic elastomer material is injection molded at the periphery 13 'of the optical filter 1' to form the body 4a 'having the first buffer portion 4a1' and the second buffer portion 4a2', thereby forming the camera module chip package base assembly 100b'.
Referring to fig. 20 and 21, a fourth embodiment of the present invention is shown. The fourth embodiment is different from the third embodiment in that: in the third embodiment, the optical filter 1 'is adhered to the plastic base 5' by soft glue 3b ', and then thermoplastic elastomer material is secondarily injected on the periphery 13' of the optical filter 1 'to form a body 4a' with a first buffer portion 4a1 'and a second buffer portion 4a 2'; in the fourth embodiment, the optical filter 1' is adhered to the plate portion 53' of the plastic base 5' by a soft glue 3c ', and the soft glue 3c ' is secondarily dispensed between the periphery 13' of the optical filter 1' and the plastic base 5' to form a first buffer portion 3c1' formed by the soft glue 3c ' extending upward from the lower surface 12' of the optical filter 1' and covering the periphery 13' of the optical filter 1', and a second buffer portion 3c2' formed by extending downward from the lower surface 12' of the optical filter 1 '. In this embodiment, the soft glue 3c 'acts as a bottom buffer between the lower surface 12' of the filter 1 'and the plate portion 53'. Specifically, the camera module chip package base assembly l00c 'includes the plastic base 5' having a U-shaped cross section formed by one-time injection molding, the soft glue 3c 'is dispensed once on the plate portion 53' to form a bottom buffer portion 3c4 'for holding the optical filter 1' and the plastic base 5', and the first buffer portion 3c1' and the second buffer portion 3c2 'formed by secondarily dispensing the soft glue 3c' on the peripheral edge 13 'of the optical filter 1'. The first buffer portion 3c1' formed by the soft glue 3c ' is rectangular in the horizontal direction, and is surrounded by a through hole 3c3' which exposes the optical filter 1' and is disposed corresponding to the light-transmitting portion 52 '. At this time, the peripheral edge 13 'of the optical filter 1' is protected by the soft glue 3c 'to prevent the peripheral edge of the optical filter 1' from being broken due to external impact.
A method for manufacturing the camera module chip package base assembly 100c' according to the fourth embodiment includes the steps of: a filter 1' is provided, wherein the filter 1' is provided with an upper surface 11' and a lower surface 12' which are oppositely arranged, and a peripheral edge 13' which connects the upper surface 11' and the lower surface 12 '; an engineering plastic is provided, and a plastic base 5' with a downward cross-section opening is formed by one-step injection molding, wherein the plastic base 5' comprises a light-transmitting part 52', a plate part 53' arranged corresponding to the optical filter 1', a lower extension part 51' which is arranged to extend downwards from the plate part 53' and forms a U-shaped cross section with the plate part 53', and an upper extension part 55' which is arranged to extend upwards from the plate part 53' and forms a U-shaped cross section with the plate part 53 '. The plate portion 53 'is rectangular, and opposite sides of the plate portion 53' constitute the light-transmitting portion 52 'exposing the filter 1'; providing a soft glue 3c ', dispensing the soft glue 3c ' on the plate 53' once to fix the optical filter 1' and the plate 53' of the plastic base 5' and partially expose the light-transmitting portion 52'; the soft glue 3c 'is secondarily dispensed on the periphery 13' of the optical filter 1 'to form the first buffer portion 3c1' and the second buffer portion 3c2', thereby forming the camera module chip package base assembly 100c'.
Referring to fig. 26 and 27, a seventh embodiment is shown. The seventh embodiment is different from the third embodiment in that: in the seventh embodiment, the camera module chip package base assembly 100f ' does not need soft glue, and the optical filter 1' is formed by two-shot molding a body 4d ' made of a thermoplastic elastomer material and the plastic base 5', or the plastic base 5' is formed by first injection molding and then by two-shot molding the thermoplastic elastomer material to form the body 4d ' and position the plastic base 5'. Specifically, the camera module chip package base assembly 100f ' includes the plastic base 5' having a U-shaped cross section formed by one-shot injection molding, and the body 4d ' having a bottom buffer portion 4d4' located between the plate portion 53' and the optical filter 1' and a first buffer portion 4d1' extending upward from the lower surface 12' of the optical filter 1' and covering the peripheral edge 13' of the optical filter 1' and a second buffer portion 4d2' extending downward from the lower surface 12' of the optical filter 1' formed by two-shot injection molding the thermoplastic elastomer material on the lower surface 12' and the peripheral edge 13' of the optical filter 1 '. The first buffer portion 4dl 'is rectangular in the horizontal direction, and is surrounded by a through hole 4d3' provided corresponding to the light transmitting portion 52 'so as to expose the optical filter 1'.
A manufacturing method for manufacturing the camera module chip package base assembly 100f 'in the seventh embodiment is different from the manufacturing method for manufacturing the camera module chip package base assembly 100b' in the third embodiment in that: in the seventh embodiment, the filter 1 'is not attached by soft glue, but the body 4d' having the first buffer portion 4d1 'and the second buffer portion 4d2' and the bottom buffer portion 4d4 'located between the lower surface 12' of the filter 1 'and the plate portion 53' is molded by a thermoplastic elastomer material. Specifically, a filter 1' is provided, wherein the filter 1' has an upper surface 11' and a lower surface 12' which are oppositely disposed, and a peripheral edge 13' connecting the upper surface 11' and the lower surface 12 '; an engineering plastic is provided, and a plastic base 5' with a downward cross-section opening is formed by one-step injection molding, wherein the plastic base 5' comprises a light-transmitting part 52', a plate part 53' arranged corresponding to the optical filter 1', a lower extension part 51' which is arranged to extend downwards from the plate part 53' and forms a U-shaped cross section with the plate part 53', and an upper extension part 55' which is arranged to extend upwards from the plate part 53' and forms a U-shaped cross section with the plate part 53 '. The plate portion 53 'is rectangular, and opposite sides of the plate portion 53' constitute the light-transmitting portion 52 'exposing the filter 1'; a thermoplastic elastomer material is provided, and the thermoplastic elastomer material is formed by two-shot molding on the peripheral edge 13' and the lower surface 12' of the optical filter 1' to form a body 4d ' with the first buffer portion 4d1' and the second buffer portion 4d2', so as to form the camera module chip package base assembly 100f '.
Fig. 28 is a schematic diagram showing an eighth embodiment of the present invention. The eighth embodiment is different from the third embodiment in that: in the eighth embodiment, the camera module chip package base assembly 100g ' is provided with a body 4e ' made of thermoplastic elastomer material and a soft glue 3e ' disposed between the bodies 4e ' at intervals on the periphery of the optical filter 1' as seen in a top view, and the soft glue 3e ' may form a first buffer portion 3e1' covering the periphery 13' of the optical filter 1' beyond the upper surface 11' and a second buffer portion (not shown) beyond the lower surface 12 '. In the eighth embodiment, the soft material covering the lower surface 12 'of the optical filter 1' and the soft material covering at least part of the peripheral edge 13 'of the optical filter 1' are molded by one-shot injection molding. Specifically, the camera module chip package base assembly 100g ' includes the plastic base 5' with a U-shaped cross section formed by one-time injection molding, the thermoplastic elastomer material is disposed on the plate portion 53' of the plastic base 5' at intervals to form a body 4e ', then the optical filter 1' is clamped and positioned in an installation space (not labeled) between the bodies 4e ', and finally the soft glue 3e ' is dispensed around the plastic base 5' and the body 4e ' at one time to fill the gap between the bodies 4e '. The gaps between the bodies 4e 'arranged at intervals are used for facilitating clamping, positioning and mounting of an external jig on the optical filter 1', and the dispensing soft glue 3e 'is used for better bonding and fixing the optical filter 1'.
A manufacturing method for manufacturing the camera module chip package base assembly 100g 'in the eighth embodiment is different from the manufacturing method for manufacturing the camera module chip package base assembly 100b' in the third embodiment in that: the body 4e ' is formed by using a thermoplastic elastomer material to realize coarse positioning of the optical filter 1' on the plastic base 5', and then the first buffer portion 3e1' and the second buffer portion (not shown) are formed by dispensing the soft glue 3e ' once to protect the peripheral edge 13' of the optical filter 1' from being broken by impact force. Specifically, a filter 1' is provided, wherein the filter 1' has an upper surface 11' and a lower surface 12' which are oppositely disposed, and a peripheral edge 13' connecting the upper surface 11' and the lower surface 12 '; providing an engineering plastic, forming a plastic base 5' by one-step injection molding, wherein the plastic base 5' comprises a light-transmitting part 52', a plate part 53' arranged corresponding to the optical filter 1', a lower extension part 51' which is arranged to extend downwards from the plate part 53' and forms a U-shaped cross section with the plate part 53', and an upper extension part 55' which is arranged to extend upwards from the plate part 53' and forms a U-shaped cross section with the plate part 53', the lower extension part 51' extends downwards beyond the lower surface 12', and the upper extension part 55' extends upwards beyond the upper surface 11'; providing a thermoplastic elastomer material, and forming a body 4e ' by two-shot molding the thermoplastic elastomer material arranged at intervals on the plate part 53' of the plastic base 5 '; clamping and positioning the optical filter 1 'in the installation space between the bodies 4e'; providing a soft glue 3e ', and dispensing the soft glue 3e ' between the plastic base 5' and the body 4e ' at a time to form the first buffer portion and the second buffer portion, so as to form the camera module chip package base assembly 100g '.
Four of the second class of embodiments will be described below. In the second embodiment, the package base further comprises a metal piece 2 'which is insert-molded on the plastic base 5' and has a U-shaped cross section with an upward opening. The metal piece has a frame opening 24' corresponding to the light-transmitting portion 52', the cross section of the metal piece 2' has an upward-opening U-shaped structure, the metal piece 2' includes a frame portion 21' disposed around the peripheral edge 13' of the optical filter 1', and an attachment portion 22' disposed below the frame portion 21' and corresponding to the lower surface 12', and the attachment portion 22' is covered with the soft material. The metal piece 2 'is insert molded or embedded molded in the plastic base 5', the cross sections of the frame body 21 'and the attaching portion 22' in the vertical direction are U-shaped, and the optical filter 1 'is positioned and attached above the attaching portion 22'. In the present invention, the cross section of the metal member 2 'in the horizontal direction is rectangular, corresponding to the shape of the optical filter 1'. Referring to fig. 10 to 13, the frame 21 'is also rectangular and has a pair of first arms 213' disposed opposite to each other and a second arm 214 'connected to the pair of first arms 213'. The frame 21 'is further provided with a top surface 211' corresponding to the lower surface 12 'of the filter 1' and a bottom surface 212 'opposite to the top surface 211'. The first arm 213' and the second arm 214' are surrounded to form the frame opening 24'. The attachment portion 22 'is provided with four and is located below the inside of the frame opening 24' of the frame portion 21', and the connection portions are vertically transited to each other to form a U-shaped cross section with the frame portion 21' in the vertical direction. The frame portion 21' is further provided with an inner wall 215' located within the frame opening 24'. The attaching portion 22' is further provided with an upper wall surface 221' provided corresponding to the lower surface 12'. The metal piece 2' is also provided with a material belt connecting part 25' positioned at the outer edge of the frame body part 21'. A first distance d1 'is provided between the periphery 13' of the filter 1 'and the inner wall 215' of the frame 21 'of the metal member 2' for filling with the soft material. The metal member 2 'further includes gap portions 23' provided at four corners of the frame portion 21 'at intervals from the attaching portions 22'. In the four embodiments of the second portion, the first buffer portion 43 'has a frame shape with a rectangular structure, the second buffer portion 41' has a corner shape filling the gap portion 23', the first buffer portion 43' equalizes the stress of the upper surface 11 'and the peripheral edge 13', the second buffer portion 41 'equalizes the stress of the lower surface 12', and the specific number of the second buffer portions 41 'is four to keep the stress balance of the lower surface 12'. The first buffer portion 43' is rectangular and surrounds a through hole 42' corresponding to the light-transmitting portion 52 '.
Referring to fig. 8 to 15, in a first embodiment of the invention, the camera module chip package base assembly 100 'includes a bottom buffer portion (i.e. the soft glue 3') formed by dispensing the soft glue 3 'on the lower surface 12' of the optical filter 1 'and held by the upper wall 221' of the attaching portion 22 'of the metal part 2', a first buffer portion 43 'formed by injection molding the thermoplastic elastomer material on the peripheral edge 13' of the optical filter 1 'and extending upward from the lower surface 12' of the optical filter 1 'and covering the peripheral edge 13' of the optical filter 1', a second buffer portion 41' formed by extending downward from the lower surface 12 'of the optical filter 1', and a plastic base 5 'formed by injection molding around the body 4'.
A method for manufacturing the camera module chip package base assembly 100' in the first embodiment, comprising the steps of: a filter 1' is provided, wherein the filter 1' is provided with an upper surface 11' and a lower surface 12' which are oppositely arranged, and a peripheral edge 13' which connects the upper surface 11' and the lower surface 12 '; providing a metal piece 2 'with a frame opening 24' and a U-shaped cross section, wherein the metal piece 2 'is connected with a material belt at a material belt connecting position 25', the metal piece 2 'comprises a frame body part 21' arranged corresponding to the peripheral edge 13 'and an attaching part 22' arranged below the frame body part 21 'and corresponding to the lower surface 12', and the cross section of the frame body part 21 'and the attaching part 22' in the vertical direction is U-shaped; providing a soft glue 3', dispensing the soft glue 3' once on an upper wall 221' provided on the attachment portion 22' of the metal piece 2' to fix the optical filter 1' and the metal piece 2' and expose a part of the optical filter 1' from the frame opening 24'; providing a thermoplastic elastomer material by injection molding the thermoplastic elastomer material at one time at the peripheral edge 13 'of the optical filter 1' to form a body 4 'having a first buffer portion 43' covering the peripheral edge 13 'and extending upwardly beyond the upper surface 11' and a second buffer portion 41 'extending from the lower surface 12', the second buffer portion 41 'extending downwardly beyond the bottom surface (not numbered) of the metal member 2'; an engineering plastic is provided, wherein a plastic base 5 'with a U-shaped cross section is secondarily injection molded around the body 4' and the metal part 2', so that the metal part 2' is embedded or embedded in the plastic base 5', and a plurality of camera module chip package base combinations 100' connected with a material belt are formed.
Referring to fig. 16 and 17, a second embodiment is shown. The second embodiment differs from the first embodiment in that: the base assembly 100a ' of the camera module chip package does not use thermoplastic elastomer material, and the lower surface 12' and the periphery 13' of the optical filter 1' both use soft glue 3a '. Specifically, the camera module chip package base assembly 100a 'includes a first buffer portion 3a1' formed by dispensing the soft glue 3a 'on the lower surface 12' of the optical filter 1 'once to form a bottom buffer portion 3a4' for holding the optical filter 1 'and the attaching portion 22' of the metal part 2', a second buffer portion 3a' formed by dispensing the soft glue 3a 'on the peripheral edge 13' of the optical filter 1 'twice to form a first buffer portion 3a1' extending upwards from the lower surface 12 'of the optical filter 1' and covering the peripheral edge 13 'of the optical filter 1', a second buffer portion 3a2 'formed by extending downwards from the lower surface 12' of the optical filter 1', and a plastic base 5' formed by injection molding around the first buffer portion 3al 'and the second buffer portion 3a 2'. The first buffer portion 3a1' is rectangular and surrounds a through hole 3a3' corresponding to the light-transmitting portion 52 '.
The manufacturing method for manufacturing the camera module chip package base assembly 100a 'in the second embodiment is different from the camera module chip package base assembly 100' in the first embodiment in that: a filter 1' is provided, wherein the filter 1' is provided with an upper surface 11' and a lower surface 12' which are oppositely arranged, and a peripheral edge 13' which connects the upper surface 11' and the lower surface 12 '; providing a metal piece 2 'with a frame 24' and a U-shaped cross section, wherein the metal piece 2 'is connected with a material belt at a material belt connecting position 25', the metal piece 2 'comprises a frame body 21' arranged corresponding to the peripheral edge 13 'and an attaching part 22' arranged below the frame body 21 'and corresponding to the lower surface 12', and the cross section of the frame body 21 'and the attaching part 22' in the vertical direction is U-shaped; providing a soft glue 3a ', dispensing the soft glue 3a ' on the upper wall 221' of the attachment portion 22' of the metal piece 2' at a time to fix the optical filter 1' and the metal piece 2' and expose a part of the optical filter 1' from the frame opening 24'; forming the first buffer portion 3a1' and the second buffer portion 3a2' by secondarily dispensing the soft glue 3a ' on the peripheral edge 13' of the optical filter 1 '; an engineering plastic is provided, wherein a plastic base 5 'with a U-shaped section is secondarily injection molded around the first buffer part 3a1' and the second buffer part 3a2', and a plurality of camera module chip package base combinations 100a' connected with a material belt are formed.
Referring to fig. 22 and 23, a fifth embodiment is shown. The fifth embodiment is different from the first embodiment in that: the camera module chip packaging base combination 100d 'does not adopt soft glue, and the lower surface 12' and the periphery 13 'of the optical filter 1' adopt thermoplastic elastomer materials for injection molding, mounting and positioning. Specifically, the camera module chip package base assembly 100d 'includes a body 4b' having a bottom buffer portion 4b4 'located between the lower surface 12' and the attachment portion 22 'and formed by injection molding the thermoplastic elastomer material at one time on the lower surface 12' and the peripheral edge 13 'of the optical filter 1', a first buffer portion 4b1 'extending upward from the lower surface 12' of the optical filter 1 'and covering the peripheral edge 13' of the optical filter 1', a second buffer portion 4b2' extending downward from the lower surface 12 'of the optical filter 1', and the plastic base 5 'injection molded around the body 4 b'. The first buffer portion 4b1' is rectangular and surrounds a through hole 4b3' corresponding to the light-transmitting portion 52 '.
A manufacturing method for manufacturing the camera module chip package base assembly 100d 'in the fifth embodiment is different from the camera module chip package base assembly 100' in the first embodiment in that: the camera module chip package base assembly 100d 'does not adopt soft glue, and the lower surface 12' and the periphery 13 'of the optical filter 1' are both made of thermoplastic elastomer materials. Specifically, a filter 1' is provided, wherein the filter 1' has an upper surface 11' and a lower surface 12' which are oppositely disposed, and a peripheral edge 13' connecting the upper surface 11' and the lower surface 12 '; providing a metal piece 2 'with a frame opening 24' and a U-shaped cross section, wherein the metal piece 2 'is connected with a material belt at a material belt connecting position 25', the metal piece 2 'comprises a frame body part 21' arranged corresponding to the peripheral edge 13 'and an attaching part 22' arranged below the frame body part 21 'and corresponding to the lower surface 12', and the cross section of the frame body part 21 'and the attaching part 22' in the vertical direction is U-shaped; providing a thermoplastic elastomer material by injection molding the thermoplastic elastomer material at one time between the lower surface 12' and the peripheral edge 13' of the optical filter 1' to form a body 4b ' having a bottom side buffer portion 4b4' and the first buffer portion 4b1' and the second buffer portion 4b2' between the lower surface 12' and the attaching portion 22', such that the lower surface 12' of the optical filter 1' and the metal member 2' are held by the body 4b '; an engineering plastic is provided, wherein a plastic base 5' with a U-shaped section is formed around the body 4b ' by secondary injection molding, and a plurality of camera module chip package base combinations 100d ' connected with a material belt are formed. The first buffer portion 4b1' is rectangular and surrounds a through hole 4b3' corresponding to the light-transmitting portion 52 '.
Referring to fig. 24 and 25, a sixth embodiment is shown. The sixth embodiment is different from the first embodiment in that: glue is dispensed on the top side of the bottom buffer portion 4c4 'to adhere the optical filter 1', specifically, a body 4c 'made of thermoplastic elastomer material and a plastic base 5' are formed on the periphery of the metal piece 2 'through two-shot molding, and the optical filter 1' is adhered on the body 4c 'through hard glue or soft glue 3 d'. Specifically, the camera module chip package base assembly 100e ' includes a body 4c ' having the bottom buffer portion 4c4' formed by injection molding the thermoplastic elastomer material around the attachment portion 22' and the frame portion 21' of the metal member 2', a first buffer portion 4c1' extending upward from the lower surface 12' of the optical filter 1' and covering the peripheral edge 13' of the optical filter 1', and a second buffer portion 4c2' extending downward from the lower surface 12' of the optical filter 1', a plastic base 5' formed by injection molding around the body 4c ' and the metal member 2', and the soft glue 3d ' (or hard glue) for fixing the optical filter 1' and the body 4c ' by dispensing at a time on the top side of the bottom buffer portion 4c4 '. The first buffer portion 4c1' is rectangular and surrounds a through hole 4c3' corresponding to the light-transmitting portion 52 '.
The manufacturing method for manufacturing the camera module chip package base assembly 100e 'in the sixth embodiment is different from the camera module chip package base assembly 100' in the first embodiment in that: the metal part 2' is fixed on the plastic base 5' by using a thermoplastic elastomer material, and the optical filter 1' is fixed on the body 4c ' made of the thermoplastic elastomer material by dispensing the soft glue 3d ' (hard glue) once. Specifically, a filter 1' is provided, wherein the filter 1' has an upper surface 11' and a lower surface 12' which are oppositely disposed, and a peripheral edge 13' connecting the upper surface 11' and the lower surface 12 '; providing a metal piece 2 'with a frame opening 24' and a U-shaped cross section, wherein the metal piece 2 'is connected with a material belt at a material belt connecting position 25', the metal piece 2 'comprises a frame body part 21' arranged corresponding to the peripheral edge 13 'and an attaching part 22' arranged below the frame body part 21 'and corresponding to the lower surface 12', and the cross section of the frame body part 21 'and the attaching part 22' in the vertical direction is U-shaped; providing a thermoplastic elastomer material, and forming a body 4c ' having the first buffer portion 4c1', the second buffer portion 4c2', and the bottom buffer portion 4c4' by injection molding the thermoplastic elastomer material around the attachment portion 22' and the frame portion 21' of the metal member 2' at one time; providing engineering plastic, and secondarily injection-molding plastic bases 5' with U-shaped cross sections around the body 4c ' and the metal piece 2 '; a soft glue 3d '(or hard glue) is provided, and the soft glue 3d' (or hard glue) is dispensed on the bottom buffer portion 4c4 'at a time to fix the optical filter 1' and the body 4c ', and form a plurality of camera module chip package base assemblies 100e' connected with a material tape.
In the invention, by using at least one of soft glue or thermoplastic elastomer material to form the soft material, the first buffer part and the second buffer part at the periphery 13 'of the optical filter 1', the upper surface 11 'adjacent to the periphery 13' and the lower surface 12 'adjacent to the periphery 13' can effectively form the buffer layer capable of resisting external impact around the optical filter 1', and the fracture risk of the optical filter 1' under the conditions of assembly, test, transportation, drop and the like can be effectively prevented. Meanwhile, the invention forms the body 4'/4a'/4b '/4c'/4d '/4e' made of thermoplastic elastomer material and the plastic base 5 'of the packaging base respectively through a two-shot molding mode, and the combination between the optical filter 1' and the body 4'/4a'/4b '/4c'/4d '/4e' and the packaging base after molding is reliable, and the performance is stable. In addition, since the camera module chip package base assembly with the metal member 2 'is disposed at the outer edge of the optical filter 1' during manufacturing, the metal member 2 'has higher hardness, and the thickness reduction of the window opening of the camera module chip package base assembly 100'/100a '/100b'/100c '/100d'/100e '/100f'/100g 'is realized under the condition of meeting the strength requirement of the camera module chip package base assembly 100'/100a '/100b'/100c '/100d'/100e '/100f'/100g 'with the mobile phone camera module chip package base assembly 100'/100 b '/100c'/100d '/100 e'. In the manufacturing method of the camera module chip packaging base combination with the metal piece 2', the metal piece 2' and the optical filter 1' are integrally implanted into the plastic mold cavity in the form of an assembly, and full-automatic production can be realized by automatically pulling the material belt.
According to the third series of embodiments of the invention, the thermoplastic elastomer material is used for one-time injection molding and packaging around the optical filter, so that a buffer layer can be effectively formed, and the fracture risk of the optical filter under the conditions of assembly, test, drop and the like can be effectively prevented.
The third series of embodiments is set forth below.
In the present invention, the body 5 "is formed by injection molding one thermoplastic elastomer material at a time on the lower surface 12" and the peripheral edge 13 "of the optical filter 1", the optical filter 1 "is fixed by injection molding while the body 5" is molded or the optical filter 1 "is adhered to the package base molded by the thermoplastic elastomer material by dispensing in a packaging factory, the camera module chip package base assembly 100″ of the present invention is formed such that a buffer portion (not labeled) is formed on the periphery of the optical filter 1″ which may collide with the outside, so that the edge of the optical filter 1″ will not be broken when the periphery of the optical filter 1″ collides or falls. Because the camera module chip package base assembly 100 "is mounted on the bottom side of the voice coil motor 1005, and if the package base is only made of a body made of a thermoplastic elastomer material, the body is made of a soft material, so that the voice coil motor 1005 is not easy to be stably supported, the body 5" is provided with the hard support portion 6 "which is formed by injection molding of engineering plastics to support the camera module chip package base assembly 100", so as to provide strength support for the camera module chip package base assembly, and improve the overall accuracy and strength stability of the camera module.
The third series in the present invention relates to four embodiments in total, wherein fig. 29 to 35 are the first embodiment, fig. 36 to 37 are the second embodiment, fig. 38 to 39 are the third embodiment, and fig. 40 to 41 are the fourth embodiment. Reference numerals referring to the same elements therein, such as the filter 1 "and the metal piece 2", remain identical in each embodiment. In the present invention, the package base includes the body 5″ and a hard support portion 6″ supporting the body 5″ or the body 5", the metal member 2 injection molded in the body 5″ and the hard support portion 6″ supporting the body 5″. The applicant further classifies the four embodiments into two categories, wherein the metal piece is arranged in the camera module chip packaging base combination in the first category, and the metal piece is not arranged in the camera module chip packaging base combination in the second category. In a first class of embodiments, the package base comprises the body 5", a metal piece 2" injection molded within the body 5 "and a hard support 6" supporting the body 5", and in a second class of embodiments, the package base comprises the body 5" and a hard support 6 "supporting the body 5". The first category relates to the first embodiment and the second embodiment, and the second category relates to the third embodiment and the fourth embodiment. The respective embodiments will be described in order below.
Referring to fig. 29 to 41, the following description will be given with reference to the common structure in the four embodiments. The camera module chip package base assembly 100 "comprises a light filter 1", wherein the light filter 1 "has an upper surface 11" and a lower surface 12 "which are oppositely arranged, and a peripheral edge 13" connecting the upper surface 11 "and the lower surface 12". In the present invention, the shape of the filter 1 "is rectangular, but the shape of the filter 1" is not limited to rectangular in the present embodiment, and may be various shapes such as circular, triangular, and the like. The camera module chip package base assembly 100″ of the present invention further includes a rectangular body 5″ having a light-transmitting portion 52″ and the optical filter 1″ fixed on the body 5″ and disposed opposite to the light-transmitting portion 52″. The body 5 "covers at least the peripheral edge 13" of the filter 1". The body 5 "further covers the lower surface 12" of the filter 1". Specifically, the package base is composed of a rectangular body 5 "formed by injection molding thermoplastic elastomer material at one time on the peripheral edge 13" of the optical filter 1", a portion adjacent to the upper surface 11" of the peripheral edge 13 "and a portion adjacent to the lower surface 12" of the peripheral edge 13", and the hard support portions 6" held at four corner positions of the body 5 ".
Wherein in the first category of embodiments a metal part 2 "is provided. The package base further comprises a metal part 2 "embedded and formed in the body 5". The metal member 2 "has a frame opening 23" provided corresponding to the light-transmitting portion 52 ". The metal member 2 "includes a frame portion 21" provided corresponding to the peripheral edge 13 "and an attaching portion 22" provided corresponding to the lower surface 12 "below the frame portion 21". The frame 21 "of the metal member 2" is disposed in a U-shape along a vertical plane, and bottom surfaces of the frame 21 "and the attachment portion 22" of the metal member 2 "are at least partially covered by the body 5". The frame 21 "and the attaching portion 22" are provided in a substantially U-shaped cross section. The filter 1 "is located above the attaching portion 22". In the present invention, the frame 21 "is rectangular and has a pair of first arms 211" disposed opposite to each other and a second arm 212 "connecting the pair of first arms 211". The frame 21 "further includes an inner wall 213" located inside the first arm 211 "and the second arm 212". The attaching portion 22 "is folded and extended from the inner wall 213" toward the inside of the frame 21 ". The attaching portion 22 "includes a pair of first attaching portions 221" disposed opposite to each other and a pair of second attaching portions 222 "connecting the pair of first attaching portions 221". The first attachment portion 221 "is disposed corresponding to the first arm 211", and the second attachment portion 222 "is disposed corresponding to the second arm 212". The first attachment portion 221 "and the second attachment portion 222" are surrounded to form the frame opening 23". The metal piece 2″ further includes a material strip connection portion 24 "(see fig. 29 to 31) disposed outside the frame portion 21″ for connecting material strips. When the filter 1 "is placed on the top side of the attachment portion 22" of the metal member 2", a first distance (not shown) is formed between the filter 1" and the inner wall 213 "in the horizontal direction (the lateral direction and the longitudinal direction). The first distance is filled by the body. Since the metal member 2 "is disposed on the outer edge of the optical filter 1", the rigidity of the outer edge of the optical filter 1 "can be increased to prevent the optical filter 1" from being broken.
Fig. 29 to 35 are diagrams showing a first embodiment of the present invention. The camera module chip package base assembly 100 "includes the metal part 2", the optical filter 1", a bottom buffer portion (i.e. soft glue 3) that is formed by dispensing a soft glue 3" once at the attachment portion 22 "of the metal part 2" to hold the optical filter 1 "on the top side of the attachment portion 22" of the metal part 2", the body 5" and the hard support portion 6 formed by injection molding the thermoplastic elastomer material once at the peripheral edge 13 "of the optical filter 1" and having a first buffer portion 51 "covering the peripheral edge 13" and extending upward beyond the upper surface 11 "and a second buffer portion 53" extending downward from the top outer side of the first buffer portion 51 "beyond the lower surface 12". The first buffer portion 51″ and the second buffer portion 53″ are integrally provided. The package base includes the main body 5", the metal member 2" injection molded on the main body 5", and the hard support portions 6" located on the bottom surfaces of four corners of the main body 5 ". Four of the hard support portions 6 "are respectively held at four corner positions of the body 5". The body 5 "further comprises a plate portion 54" for carrying the frame portion 21 "of the metal piece 2". The soft glue 3 "and the main body 5" cover at least part of the bottom surfaces of the frame portion 21 "and the attachment portion 22" of the metal member 2 ". At this time, the portion of the attachment portion 22 "of the metal member 2" corresponding to the lower surface 12 "is covered and protected by the soft glue 3", and the peripheral edge 13 "is covered and protected by the first buffer portion 51". The side of the frame 21 "of the metal member 2" opposite to the lower surface 12 "is covered and protected by a portion of the second buffer 53". The peripheral edge 13 "of the optical filter 1" is wrapped by the body 5", the first buffer portion 51" overflows upwards from the upper surface 11 "of the optical filter 1", and the peripheral edge 13 "of the optical filter 1" is covered with the first buffer portion 51", so that buffer layers (not numbered) are arranged at positions where the optical filter 1" may be impacted by external impact, and the peripheral edge 13 "of the optical filter 1" is prevented from being impacted and broken.
A method of manufacturing the camera module chip package base assembly 100″ of the first embodiment, comprising the steps of: providing a filter 1", wherein the filter 1" is provided with an upper surface 11 "and a lower surface 12" which are oppositely arranged, and a peripheral edge 13 "connecting the upper surface 11" and the lower surface 12 "; a metal member 2 "is provided, the metal member 2" has a frame opening 23 "corresponding to the light-transmitting portion 52", the metal member 2 "includes a frame portion 21" corresponding to the peripheral edge 13 "and an attaching portion 22" located below the frame portion 21 "and corresponding to the lower surface 12", the frame portion 21 "and the attaching portion 22" are provided in a U-shaped cross section in a vertical direction, and the optical filter 1 "is located above the attaching portion 22"; providing a soft glue 3", dispensing a soft glue 3" once on the attachment portion 22 "of the metal piece 2" to make the optical filter 1 "fixed on the top side of the attachment portion 22" of the metal piece 2 "and form a bottom buffer portion (i.e. soft glue 3"); providing a thermoplastic elastomer material, wherein the metal piece 2 "is embedded in the body 5", and the soft glue 3 "and the body 5" cover at least part of the bottom side surfaces of the frame body 21 "and the attachment portion 22" of the metal piece 2 "by one-time injection molding the thermoplastic elastomer material outside the peripheral edge 13" of the optical filter 1 "to form the body 5" with a first buffer portion 51 "covering the peripheral edge 13" and extending upwards beyond the upper surface 11 "and a second buffer portion 53" extending downwards beyond the lower surface 12 "from the top outer side of the first buffer portion 51", and the first distance is filled by the body 5 "; providing engineering plastic, forming a hard supporting part 6 'for supporting the body 5' around the bottom surface of the body 5 ', and forming a plurality of camera module chip packaging base assemblies 100' connected with a material belt. Cutting the material belt to form a plurality of independent camera module chip packaging base combinations 100".
Referring to fig. 36 and 37, a second embodiment is shown. The second embodiment is different from the first embodiment in that: instead of soft glue, thermoplastic elastomer material is injection molded once at the position of the soft glue for one-time dispensing in the first embodiment to form the body 5a ". Specifically, the body 5a "includes a bottom side buffer portion 5a5" between the lower surface 12 "and the attaching portion 22" that is injection molded at one time on the lower surface 12 "of the filter 1", a first buffer portion 5a1 "that is injection molded at one time on the peripheral edge 13" of the filter 1 "to form a structure having the peripheral edge 13" covered and extending upward beyond the upper surface 11", and a second buffer portion 5a2 that extends downward beyond the lower surface 12" from the top outer side of the first buffer portion 5a1 ". The body 5a "further comprises a plate portion 5a4" for carrying the frame portion 21 "of the metal piece 2". The metal piece 2 "is completely covered by the body 5a". At this time, the portion of the attachment portion 22 "of the metal 2" corresponding to the lower surface 12 "is covered and protected by the bottom buffer portion 5a5", and the outer portions of the frame portion 21 "and the attachment portion 22" of the metal 2 "are covered and protected by the first buffer portion 51" and the second buffer portion 53", respectively.
A manufacturing method for manufacturing the camera module chip package base assembly 100a″ of the second embodiment is different from that of the first embodiment in that: the optical filter 1 "and the metal piece 2" are formed by one-step injection molding of thermoplastic elastomer materials, and no glue adhesion is needed. Specifically, a filter 1″ is provided, the filter 1″ has an upper surface 11″ and a lower surface 12″ disposed opposite to each other, and a peripheral edge 13″ connecting the upper surface 11″ and the lower surface 12″; a metal member 2 "is provided, the metal member 2" has a frame opening 23 "corresponding to the light-transmitting portion 52", the metal member 2 "includes a frame portion 21" corresponding to the peripheral edge 13 "and an attaching portion 22" located below the frame portion 21 "and corresponding to the lower surface 12", the frame portion 21 "and the attaching portion 22" are provided in a U-shaped cross section in a vertical direction, and the optical filter 1 "is located above the attaching portion 22"; providing a thermoplastic elastomer material, injection molding the body 5a "between the lower surface 12" of the optical filter 1 "and the metal piece 2" to form a bottom side buffer portion 5a5", and simultaneously injection molding the thermoplastic elastomer material around the peripheral edge 13" of the optical filter 1 "and the metal piece 2" to form a body 5a "with the first buffer portion 5a1" and the second buffer portion 5a2", and forming a product connected with a material belt; an engineering plastic is provided, wherein a hard supporting part 6 'for supporting the body 5 a' is formed around the bottom surface of the body 5a ', and a plurality of camera module chip packaging base assemblies 100 a' connected with a material belt are formed. Cutting the material belt to form a plurality of independent camera module chip packaging base combinations 100 a).
The following describes a specific embodiment of a camera module chip package base assembly without the metal member 2 ". In this class of embodiments, the package base includes a body 5b "/5c" and a rigid support 6 "supported by the body 5b"/5c ". Referring to fig. 38 and 39, a third embodiment of the present invention is shown. The differences from the first embodiment are: in the third embodiment, there is no metal member. Specifically, the camera module chip package base assembly 100b "includes the body 5b" of the peripheral edge 13 "of the optical filter 1" and the bottom buffer portion (i.e. the soft glue 3a ") formed by dispensing one soft glue 3a" at a time on the plate portion 5b4 "and having a first buffer portion 5b1" covering the peripheral edge 13 "and extending upward beyond the upper surface 11", a second buffer portion 5b2 "extending downward beyond the lower surface 12" from the top outer side of the first buffer portion 5b1", and the plate portion 5b4" disposed corresponding to the optical filter 1", wherein the optical filter 1" is adhered to the bottom buffer portion (i.e. the soft glue 3a ") of the body 5 b". The plate portion 5b4″ serves to carry the bottom side buffer portion. In this embodiment, the soft glue 3a "may be replaced by a hard glue, where the hard glue is covered by the body 5b" to form a buffer layer (no reference numeral) for protecting the periphery 13 "of the filter 1".
A manufacturing method of the camera module chip package base combination 100b "in the third embodiment is different from the manufacturing method of the camera module chip package base combination 100" in the first embodiment in that: in the third embodiment, there is no metal part, and the optical filter 1 "is adhered to the body 5b" by hard glue or soft glue 3a ". Specifically, a filter 1″ is provided, the filter 1″ has an upper surface 11″ and a lower surface 12″ disposed opposite to each other, and a peripheral edge 13″ connecting the upper surface 11″ and the lower surface 12″; providing a thermoplastic elastomer material and an engineering plastic, and performing one-time injection molding on the thermoplastic elastomer material and one-time injection molding on the engineering plastic to form a rectangular packaging base; providing a soft glue 3a "or a hard glue, and dispensing the soft glue 3a" or the hard glue on the plate portion 5b4 "last time to fix the optical filter 1" on the body 5b ", and forming the camera module chip package base assembly 100b".
Referring to fig. 40 and 41, a fourth embodiment of the present invention is shown. The difference from the first embodiment is that: in the fourth embodiment, the filter 1″ is injection molded once from a thermoplastic elastomer material without soft glue and metal members. Specifically, the camera module chip package base assembly 100c "includes the body 5c" of the thermoplastic elastomer material having a first buffer portion 5c1 "covering the peripheral edge 13" and extending upward beyond the upper surface 11 "and a second buffer portion 5c2" extending downward beyond the lower surface 12 "from the top outer side of the first buffer portion 5c1" by one injection molding of the peripheral edge 13 "of the optical filter 1". The body 5c "further comprises a plate portion 5c4" for carrying the filter 1 ".
A manufacturing method of the camera module chip package base combination 100c "in the fourth embodiment is different from the manufacturing method of the camera module chip package base combination 100" in the first embodiment in that: the optical filter 1″ is injection molded once through a thermoplastic elastomer material without soft glue or a metal member. Specifically, a filter 1″ is provided, the filter 1″ having an upper surface 11″ and a lower surface 12″ disposed opposite to each other and a peripheral edge 13″ connecting the upper surface and the lower surface; providing a thermoplastic elastomer material, and performing one-time injection molding on the periphery 13 ' of the optical filter 1 ' to form a body 5c ' with the first buffer part 5c1 ' and the second buffer part 5c2 '; providing an engineering plastic, forming a hard supporting part 6 'for supporting the body 5 c' around the bottom surface of the body 5c ', and forming the camera module chip packaging base assembly 100 c'.
In the present invention, the thermoplastic elastomer material is used to mold the peripheral edge 13", the portion adjacent to the upper surface 11" and the portion adjacent to the lower surface 12 "of the peripheral edge 13" of the optical filter 1", and the first buffer portion 51"/5a1"/5b1"/5c1 "and the second buffer portion 53"/5a2"/5b2"/5c2 "are formed by one-step injection molding, so that a buffer layer capable of resisting external impact can be effectively formed around the optical filter 1", and the risk of breakage of the optical filter 1 "in the case of assembly, testing, transportation, dropping, etc. can be effectively prevented. Meanwhile, considering that the thermoplastic elastomer material may make the camera module chip package base assembly 100"/100a"/100b "/100c" not easily held in the voice coil motor 1005 as the body 5"/5a"/5b "/5c", four corner hard support portions 6 "are formed under the frame structure of the body 5"/5a "/5b"/5c "to hold the camera module chip package base assembly.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced with equivalents; such modifications and substitutions do not depart from the spirit of the technical solutions according to the embodiments of the present invention.
The foregoing is only some, but not all, embodiments of the present invention, and any equivalent modifications of the technical solution of the present invention will be covered by the claims of the present invention by a person of ordinary skill in the art from reading the present specification.

Claims (17)

1. The utility model provides a camera module chip package base combination, includes package base and light filter, package base includes the plastic base, the plastic base has the printing opacity portion that runs through from top to bottom, the light filter corresponds the setting and is in the position of printing opacity portion, the light filter has upper surface, lower surface and the connection that set up relatively the upper surface with the periphery of lower surface, its characterized in that, the plastic base includes body and stereoplasm supporting part, the body is soft material integrative injection moulding, the body covers at least the periphery of light filter, the stereoplasm supporting part injection moulding form in on the body with support the body.
2. The camera module chip package base assembly of claim 1, wherein four of the rigid support portions are disposed in the plastic base, and the four rigid support portions are respectively fixed at four corners of the body.
3. The camera module chip package base assembly of claim 1, wherein the soft material is a thermoplastic elastomer formed by one-shot injection molding, and the thermoplastic elastomer is a composite material with rubber characteristics and plastic processing characteristics.
4. The camera module chip package base assembly of claim 1, wherein the body further covers the lower surface of the optical filter.
5. The camera module chip package base assembly of claim 4, wherein a lower surface of the optical filter and the body are bonded together by glue to hold the optical filter to the body.
6. The camera module chip package base assembly of claim 5, wherein the glue is a soft glue having elasticity after curing.
7. The camera module chip package base assembly of claim 1, wherein the body comprises a first buffer portion covering the periphery and extending upward beyond the upper surface and a second buffer portion extending downward beyond the lower surface from the top outer side of the first buffer portion, and the first buffer portion and the second buffer portion are integrally or separately arranged.
8. The camera module chip package base assembly of claim 1, further comprising a metal piece insert molded in the body to carry the optical filter, the metal piece having a frame opening corresponding to the light-transmitting portion, the metal piece comprising an attachment portion corresponding to a lower surface of the optical filter.
9. The camera module chip package base assembly of claim 8, wherein the metal piece further comprises a frame portion disposed above the attachment portion and corresponding to the periphery of the optical filter, and a bottom side of the frame portion and the attachment portion of the metal piece are at least partially covered by the body.
10. The camera module chip package base assembly of claim 8, wherein a soft glue is dispensed between the lower surface of the optical filter and the attachment portion of the metal piece to form a bottom buffer portion for holding the optical filter on a top side of the attachment portion of the metal piece.
11. The camera module chip package base assembly of claim 9, wherein a gap is provided between the peripheral edge of the optical filter and an inner wall of the frame portion of the metal member, the gap being filled by the body.
12. The camera module chip package base assembly of claim 8, wherein the metal piece is surface treated to provide insulation and adhesion to the metal piece.
13. The manufacturing method of the camera module chip packaging base combination is characterized by comprising the following steps:
providing a light filter, wherein the light filter is provided with an upper surface, a lower surface and a periphery connecting the upper surface and the lower surface, wherein the upper surface and the lower surface are oppositely arranged;
providing a thermoplastic elastomer, forming a body with a first buffer part covering the periphery and a second buffer part extending downwards beyond the lower surface by injection molding the thermoplastic elastomer at the periphery of the optical filter or at the outer side of the periphery and the lower surface of the optical filter at one time;
the engineering plastic is provided, a hard supporting part supporting the body is formed in the body in an injection molding mode to support the body, and then a plastic base for fixing the optical filter is formed, the plastic base is provided with a light transmission part penetrating through the plastic base up and down, and the optical filter is correspondingly arranged at the position of the light transmission part.
14. The method of claim 13, wherein the hard support portions are formed at four corner positions of the body and are provided separately.
15. The method of manufacturing a camera module chip package base assembly of claim 13, further comprising the steps of:
providing a metal piece which is embedded and molded in the body, wherein the metal piece is provided with a frame opening which is arranged corresponding to the light transmission part, and the metal piece comprises an attachment part which is arranged corresponding to the lower surface of the optical filter;
and providing glue, wherein the attaching part and the lower surface of the optical filter are bonded together through the glue, so that the optical filter is fixed on the metal piece.
16. The method of manufacturing a camera module chip package base assembly of claim 13, further comprising the steps of: glue is provided, and the optical filter and the body are bonded together through the glue so as to fix the optical filter on the body.
17. The method of claim 15 or 16, wherein the glue is a soft glue having elasticity after curing.
CN202110833806.9A 2021-05-11 2021-05-11 Camera module chip packaging base combination and manufacturing method thereof Active CN113363170B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110833806.9A CN113363170B (en) 2021-05-11 2021-05-11 Camera module chip packaging base combination and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110833806.9A CN113363170B (en) 2021-05-11 2021-05-11 Camera module chip packaging base combination and manufacturing method thereof
CN202110510092.8A CN112992702B (en) 2021-05-11 2021-05-11 Camera module chip packaging base combination and manufacturing method thereof

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202110510092.8A Division CN112992702B (en) 2021-05-11 2021-05-11 Camera module chip packaging base combination and manufacturing method thereof

Publications (2)

Publication Number Publication Date
CN113363170A CN113363170A (en) 2021-09-07
CN113363170B true CN113363170B (en) 2024-01-19

Family

ID=76337498

Family Applications (4)

Application Number Title Priority Date Filing Date
CN202110833806.9A Active CN113363170B (en) 2021-05-11 2021-05-11 Camera module chip packaging base combination and manufacturing method thereof
CN202110833807.3A Active CN113363171B (en) 2021-05-11 2021-05-11 Camera module chip packaging base combination and manufacturing method thereof
CN202110510092.8A Active CN112992702B (en) 2021-05-11 2021-05-11 Camera module chip packaging base combination and manufacturing method thereof
CN202110828225.6A Active CN113327861B (en) 2021-05-11 2021-05-11 Camera module chip packaging base, base combination and manufacturing method thereof

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN202110833807.3A Active CN113363171B (en) 2021-05-11 2021-05-11 Camera module chip packaging base combination and manufacturing method thereof
CN202110510092.8A Active CN112992702B (en) 2021-05-11 2021-05-11 Camera module chip packaging base combination and manufacturing method thereof
CN202110828225.6A Active CN113327861B (en) 2021-05-11 2021-05-11 Camera module chip packaging base, base combination and manufacturing method thereof

Country Status (1)

Country Link
CN (4) CN113363170B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115706845A (en) * 2021-08-10 2023-02-17 晋城三赢精密电子有限公司 Lens module and electronic device
CN114643680A (en) * 2022-03-22 2022-06-21 河南皓泽电子股份有限公司 Lens driving device, frame thereof and manufacturing method of frame

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013020018A (en) * 2011-07-08 2013-01-31 Marumi Koki Kk Waterproof mechanism for filter frame in digital camera
CN106506929A (en) * 2016-12-23 2017-03-15 维沃移动通信有限公司 A kind of camera module and mobile terminal
CN107343126A (en) * 2017-08-15 2017-11-10 苏州昀冢电子科技有限公司 Camera module chip package base
CN107591421A (en) * 2017-08-15 2018-01-16 苏州昀冢电子科技有限公司 Optical filter combination, camera module chip package base assembly and preparation method thereof
CN109143737A (en) * 2018-10-24 2019-01-04 杭州日月光电技术有限公司 A kind of new structural linear double optical-filter switchers
CN109743482A (en) * 2019-01-21 2019-05-10 宁波舜宇光电信息有限公司 The assemble method and electronic equipment of camera module, camera module
CN112269234A (en) * 2019-07-08 2021-01-26 三赢科技（深圳）有限公司 Lens module and electronic device
CN112422778A (en) * 2019-08-22 2021-02-26 三赢科技（深圳）有限公司 Lens module and electronic device with same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044221A (en) * 1999-07-28 2001-02-16 Matsushita Electric Ind Co Ltd Ic position detector and sealant applying apparatus
JP2005028599A (en) * 2003-07-07 2005-02-03 Seiko Epson Corp Head cap and liquid drop ejector comprising it, electrooptic device, its manufacturing process and electronic apparatus
US6979902B2 (en) * 2004-03-10 2005-12-27 Micron Technology, Inc. Chip size image sensor camera module
JP4539235B2 (en) * 2004-08-27 2010-09-08 日亜化学工業株式会社 Semiconductor device and manufacturing method thereof
KR101512609B1 (en) * 2012-01-31 2015-04-15 마루미코키 카부시키가이샤 Filter frame for digital camera made from polymer elastic body
CN106027863B (en) * 2016-05-27 2019-10-18 维沃移动通信有限公司 A kind of camera base, camera and terminal
CN206136093U (en) * 2016-10-28 2017-04-26 宁波舜宇光电信息有限公司 A optical filter assembly and module and terminal equipment of making a video recording for making a video recording on module
CN106993123B (en) * 2017-04-11 2024-03-05 昆山丘钛微电子科技有限公司 Miniaturized camera device and manufacturing method thereof
CN207070179U (en) * 2017-08-15 2018-03-02 苏州昀冢电子科技有限公司 Optical filter combination, camera module chip package base assembly
CN109274876B (en) * 2018-11-05 2021-05-07 中芯集成电路（宁波）有限公司 Photosensitive assembly and packaging method thereof, lens module and electronic equipment
CN112015023A (en) * 2019-05-30 2020-12-01 昆山康龙电子科技有限公司 Light filtering component used in lens module
CN210075310U (en) * 2019-08-26 2020-02-14 昆山丘钛微电子科技有限公司 Camera module and mobile terminal
CN212086312U (en) * 2020-06-22 2020-12-04 湖南金康光电有限公司 Camera module and electronic equipment

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013020018A (en) * 2011-07-08 2013-01-31 Marumi Koki Kk Waterproof mechanism for filter frame in digital camera
CN106506929A (en) * 2016-12-23 2017-03-15 维沃移动通信有限公司 A kind of camera module and mobile terminal
CN107343126A (en) * 2017-08-15 2017-11-10 苏州昀冢电子科技有限公司 Camera module chip package base
CN107591421A (en) * 2017-08-15 2018-01-16 苏州昀冢电子科技有限公司 Optical filter combination, camera module chip package base assembly and preparation method thereof
CN109143737A (en) * 2018-10-24 2019-01-04 杭州日月光电技术有限公司 A kind of new structural linear double optical-filter switchers
CN109743482A (en) * 2019-01-21 2019-05-10 宁波舜宇光电信息有限公司 The assemble method and electronic equipment of camera module, camera module
CN112269234A (en) * 2019-07-08 2021-01-26 三赢科技（深圳）有限公司 Lens module and electronic device
CN112422778A (en) * 2019-08-22 2021-02-26 三赢科技（深圳）有限公司 Lens module and electronic device with same

Also Published As

Publication number Publication date
CN112992702A (en) 2021-06-18
CN112992702B (en) 2021-08-13
CN113363171A (en) 2021-09-07
CN113327861B (en) 2024-02-09
CN113327861A (en) 2021-08-31
CN113363170A (en) 2021-09-07
CN113363171B (en) 2023-06-16

Similar Documents

Publication Publication Date Title
CN113363170B (en) Camera module chip packaging base combination and manufacturing method thereof
KR100995874B1 (en) Semiconductor package, semiconductor module, method of producing the same, and electronic apparatus
KR100682970B1 (en) Solid-state imaging device and method for manufacturing the same
US7498610B2 (en) High power LED housing and fabrication method thereof
EP1976028A1 (en) Method of photoelement resin sealing/molding
US7719585B2 (en) Solid-state imaging device
CN107071252A (en) Direct attaching type miniaturization cam device of optical filter and preparation method thereof
US20070145387A1 (en) Led housing and fabrication method thereof
US5926380A (en) Lead frame lattice and integrated package fabrication method applied thereto
CN106973210A (en) Plastic packaging adds stent-type to minimize cam device and preparation method thereof
US7646429B2 (en) Digital camera module packaging method
US7595839B2 (en) Image sensor chip packaging method
US8077248B2 (en) Optical device and production method thereof
US8699305B2 (en) Solar cell electronic device
US7268016B2 (en) Method for manufacturing solid-state imaging devices
US7342215B2 (en) Digital camera module package fabrication method
JP3759064B2 (en) Optical semiconductor device and manufacturing method thereof
US7245834B2 (en) Optical device for optical semiconductor package and fabrication method
JP3602238B2 (en) Semiconductor pressure sensor and method of manufacturing the same
US7262493B2 (en) System and method for mounting electrical devices
JP2005235884A (en) Circuit arrangement
CN117156032A (en) Insert molding, center, electronic device, and insert molding method
JPH09138172A (en) Semiconductor pressure sensor and manufacture thereof
CN115985197A (en) Display module, display device, manufacturing method of display module and injection mold
JP2003318210A (en) Fabrication method for semiconductor device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant