CN117156032A - Insert molding, center, electronic device, and insert molding method - Google Patents
Insert molding, center, electronic device, and insert molding method Download PDFInfo
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- CN117156032A CN117156032A CN202310915642.3A CN202310915642A CN117156032A CN 117156032 A CN117156032 A CN 117156032A CN 202310915642 A CN202310915642 A CN 202310915642A CN 117156032 A CN117156032 A CN 117156032A
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- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 229920006324 polyoxymethylene Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3456—Antennas, e.g. radomes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Signal Processing (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
技术领域Technical field
本申请涉及嵌件成型品的技术领域,并且更具体地,涉及一种嵌件成型品、中框、电子设备以及嵌件成型方法。The present application relates to the technical field of insert molded products, and more specifically, to an insert molded product, a middle frame, an electronic device, and an insert molding method.
背景技术Background technique
手机等电子设备中通常采用嵌件成型(Insert Molding)工艺将中框与天线制作为一体化结构,由此可以降低天线和中框的整体尺寸,同时还使后续的手机组装工序更加容易。目前,业界将天线嵌入中框的技术路线是直接在中框的成型模具内装入预先加工好的金属天线,之后注入熔融的液态塑胶,待模具内的塑胶冷却和固化后与天线紧密地接合在一起,便制成了一体化的天线和中框的嵌件成型品。In electronic devices such as mobile phones, the insert molding process is usually used to make the middle frame and antenna into an integrated structure. This can reduce the overall size of the antenna and middle frame, and also makes the subsequent mobile phone assembly process easier. At present, the industry's technical route for embedding antennas into the mid-frame is to directly install pre-processed metal antennas into the molding mold of the mid-frame, and then inject molten liquid plastic. After the plastic in the mold cools and solidifies, it is tightly joined to the antenna. At the same time, an integrated antenna and mid-frame insert molding is made.
塑胶在冷却过程中会自然收缩,中框上塑胶较厚的部位与塑胶较薄的部位会因为收缩率不同而产生不均匀地向内塌陷,由此在中框的表面就会出现一些内凹的痕迹,该现象被称为缩水现象,该痕迹被称为缩印或者缩痕。为了降低缩印或者缩痕对于中框外观的影响,相关技术中通过增加模具的保压压力来改善该问题,其原理就是提高塑胶的致密度,减少塑胶收缩过程中向内塌陷的程度。Plastic will naturally shrink during the cooling process. The thicker plastic parts and thinner plastic parts on the middle frame will collapse inward unevenly due to different shrinkage rates. As a result, some concavities will appear on the surface of the middle frame. This phenomenon is called shrinkage phenomenon, and this mark is called shrinkage mark or shrinkage mark. In order to reduce the impact of shrinkage or sink marks on the appearance of the middle frame, related technologies improve this problem by increasing the holding pressure of the mold. The principle is to increase the density of the plastic and reduce the degree of inward collapse of the plastic during shrinkage.
然而,目前的手机天线通常由多个间隔设置的天线辐射枝节组成,由于天线辐射枝节之间的缝隙内只有塑胶不具有金属,使得缝隙内的塑胶厚度相比较两侧的塑胶厚度较大,再加上塑胶与金属的线膨胀系数不同,导致缝隙处的塑胶缩水情况更严重,中框上的缩印或者缩痕会特别明显,通过常规的增加模具的保压压力也无法较好地改善该问题。However, current mobile phone antennas usually consist of multiple antenna radiating branches arranged at intervals. Since the gaps between the antenna radiating branches only contain plastic and no metal, the thickness of the plastic in the gap is larger than the thickness of the plastic on both sides. In addition, the linear expansion coefficients of plastic and metal are different, causing the plastic to shrink more seriously at the gap. The shrinkage or shrinkage marks on the middle frame will be particularly obvious. This problem cannot be improved by conventionally increasing the holding pressure of the mold. .
发明内容Contents of the invention
本申请的目的在于提供了一种嵌件成型品、中框、电子设备以及嵌件成型方法,通过在嵌入件之间的缝隙内设置填充件,由该填充件对缝隙进行占位,之后再在其外部包裹设置塑胶基体,由此提高嵌件成型品上塑胶基体的分布均匀性,使嵌件成型品上的各处塑胶基体能够以大致相同的收缩率均匀收缩,进而改善嵌件成型品的表面具有缩痕缺陷的问题。The purpose of this application is to provide an insert molded product, a middle frame, an electronic device, and an insert molding method. By arranging a filler in the gap between the inserts, the filler occupies the gap, and then the filler is used to occupy the gap. A plastic matrix is wrapped around the insert molded product, thereby improving the uniformity of the plastic matrix distribution on the insert molded product, allowing the plastic matrix everywhere on the insert molded product to shrink evenly at approximately the same shrinkage rate, thereby improving the insert molded product. The surface has sink mark defects.
第一方面,本申请提供了一种嵌件成型品,包括嵌入件、填充件以及塑胶基体。In a first aspect, the present application provides an insert molded product, including an insert, a filler and a plastic matrix.
所述嵌入件的数量为多个,多个所述嵌入件间隔设置,相邻两个所述嵌入件之间具有缝隙。The number of the embedded parts is multiple, and the plurality of embedded parts are arranged at intervals, and there is a gap between two adjacent embedded parts.
所述填充件设置于所述缝隙内。The filling piece is arranged in the gap.
所述塑胶基体包裹在所述嵌入件和所述填充件的外部。The plastic matrix is wrapped around the outside of the embedded part and the filling part.
本申请提供的嵌件成型品,通过在嵌入件之间的缝隙内设置填充件,由该填充件对缝隙进行填充,之后再在嵌入件和填充件的外部包裹设置塑胶基体。由于填充件对缝隙内的空间进行了占位,避免出现缝隙内进入大量塑胶基体而导致塑胶基体有较大范围的厚度落差,由此提高了嵌件成型品上塑胶基体的分布均匀性,从而使嵌件成型品上的各处塑胶基体能够以大致相同的收缩率进行向内收缩,进而改善了嵌件成型品表面的缩痕缺陷问题。In the insert molded product provided by this application, a filler is provided in the gap between the inserts, and the gap is filled with the filler, and then a plastic matrix is wrapped around the insert and the filler. Since the filling piece occupies the space in the gap, it avoids a large amount of plastic matrix entering the gap and causing a large range of thickness differences in the plastic matrix, thus improving the uniformity of the distribution of the plastic matrix on the insert molded product. This allows the plastic matrix everywhere on the insert molded product to shrink inward at approximately the same shrinkage rate, thus improving the sink mark defect problem on the surface of the insert molded product.
在一种可能的设计中,所述填充件的两端分别与相邻两个所述嵌入件相抵。In a possible design, two ends of the filling piece respectively offset two adjacent embedded pieces.
在一种可能的设计中,所述填充件的两端分别与相邻两个所述嵌入件连接。In a possible design, two ends of the filling piece are respectively connected to two adjacent embedded pieces.
在一种可能的设计中,所述填充件的两端设置有连接部,所述填充件通过所述连接部与所述嵌入件连接。In a possible design, the filling piece is provided with connecting parts at both ends, and the filling piece is connected to the embedded piece through the connecting parts.
在一种可能的设计中,所述连接部开设有供所述嵌入件插入的插槽,所述嵌入件通过所述插槽与所述填充件插接。In a possible design, the connecting portion is provided with a slot for the insert to be inserted, and the insert is inserted into the filler through the slot.
在一种可能的设计中,所述连接部与所述嵌入件还通过限位结构连接。In a possible design, the connecting part and the insert are also connected through a limiting structure.
在一种可能的设计中,所述限位结构包括通孔和凸柱,所述连接部和所述嵌入件中的一者设置所述通孔,另一者设置所述凸柱。In a possible design, the limiting structure includes a through hole and a protruding column, one of the connecting part and the insert is provided with the through hole, and the other is provided with the protruding column.
在一种可能的设计中,所述嵌入件邻近所述缝隙的端部为扁尾状结构,所述通孔开设于所述扁尾状结构上,所述凸柱设置于所述插槽内。In one possible design, the end of the insert adjacent to the gap has a flat tail-shaped structure, the through hole is opened in the flat tail-shaped structure, and the protruding pillar is arranged in the slot. .
在一种可能的设计中,所述限位结构包括凹槽和凸块,所述连接部和所述嵌入件中的一者设置所述凹槽,另一者设置所述凸块。In a possible design, the limiting structure includes a groove and a convex block, one of the connecting part and the insert is provided with the groove, and the other is provided with the convex block.
在一种可能的设计中,所述凹槽为设置于所述嵌入件外周的环形通槽,所述凸块呈环圈状且设置于所述插槽的槽壁。In one possible design, the groove is an annular through groove provided on the outer periphery of the insert, and the protrusion is annular and provided on a groove wall of the slot.
在一种可能的设计中,所述填充件可拆卸地设置于所述缝隙内,所述塑胶基体开设有可将所述填充件漏出的开口,以使得所述填充件可从所述开口内移出。In one possible design, the filling piece is detachably disposed in the gap, and the plastic base is provided with an opening through which the filling piece can leak out, so that the filling piece can pass through the opening. Move out.
在一种可能的设计中,所述嵌入件的表面设置滚花结构、凹点或者凸点。In one possible design, the surface of the insert is provided with knurled structures, concave points or convex points.
在一种可能的设计中,所述填充件的横截面大于或者等于所述嵌入件的横截面。In a possible design, the cross section of the filling piece is larger than or equal to the cross section of the insert piece.
在一种可能的设计中,所述塑胶基体的材质包括聚碳酸酯、聚丙烯、聚氯乙烯、聚甲醛、聚氨酯、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、乙烯-醋酸乙烯共聚物中一种或者多种。In a possible design, the plastic matrix is made of polycarbonate, polypropylene, polyvinyl chloride, polyformaldehyde, polyurethane, polyethylene terephthalate, and polybutylene terephthalate. , one or more of ethylene-vinyl acetate copolymers.
第二方面,本申请提供了一种中框,包括上述的嵌件成型品,所述嵌入件包括天线辐射枝节。In a second aspect, the present application provides a middle frame, including the above-mentioned insert molding, where the insert includes an antenna radiation branch.
本申请提供的中框,通过在天线辐射枝节之间的枝节缝隙内设置填充件,由该填充件对枝节缝隙进行填充,之后再在天线辐射枝节和填充件的外部包裹设置塑胶基体。由于填充件对枝节缝隙内的空间进行了占位,避免出现枝节缝隙内进入大量塑胶基体而导致塑胶基体有较大范围的厚度落差,由此提高了中框上塑胶基体的分布均匀性,从而使中框上的各处塑胶基体能够以大致相同的收缩率进行向内收缩,进而改善了中框表面的缩痕缺陷问题。In the middle frame provided by this application, a filling piece is provided in the branch gap between the antenna radiating branches, and the branch gap is filled with the filling piece, and then a plastic matrix is wrapped around the antenna radiating branches and the filling piece. Since the filling piece occupies the space in the branch gaps, it avoids a large amount of plastic matrix entering into the branch gaps and causing a large range of thickness differences in the plastic matrix. This improves the uniformity of the distribution of the plastic matrix on the middle frame. This allows the plastic matrix everywhere on the middle frame to shrink inward at approximately the same shrinkage rate, thereby improving the problem of sink mark defects on the surface of the middle frame.
此外,在相关技术中,为了避免中框上对应枝节缝隙的部位出现缩痕问题,会对枝节缝隙的宽度进行严格的限制,通常枝节缝隙的宽度不能大于0.8mm。由于枝节缝隙的尺寸可以用来调节天线的谐振频率和带宽,而受到尺寸约束的枝节缝隙会对天线性能调试和天线结构优化产生限制。而本申请中是通过在枝节缝隙内设置填充件以解决缩痕问题的,因此可以避免对枝节缝隙的尺寸造成约束和限制,进而使天线性能调试更灵活,结构优化更方便。In addition, in related technologies, in order to avoid shrinkage problems in the parts of the middle frame corresponding to the branch gaps, the width of the branch gaps is strictly limited. Usually, the width of the branch gaps cannot be greater than 0.8mm. Since the size of the branch gap can be used to adjust the resonant frequency and bandwidth of the antenna, the size-constrained branch gap will impose restrictions on antenna performance debugging and antenna structure optimization. In this application, the sink mark problem is solved by arranging fillers in the branch gaps. Therefore, constraints and restrictions on the size of the branch gaps can be avoided, thereby making the antenna performance debugging more flexible and the structure optimization more convenient.
第三方面,本申请提供了一种电子设备,包括上述的中框。In a third aspect, this application provides an electronic device, including the above-mentioned middle frame.
本申请提供的电子设备,包括上述的中框,该中框的天线辐射枝节之间的枝节缝隙内设置填充件,通过填充件对枝节缝隙进行占位,避免枝节缝隙内进入大量塑胶基体,提高了中框上塑胶基体的分布均匀性,使得中框上的各处塑胶基体能够以大致相同的收缩率进行向内收缩,进而改善了中框表面的缩痕缺陷问题。此外,本申请中是通过在枝节缝隙内设置填充件以解决缩痕问题的,因此可以避免对枝节缝隙的尺寸造成约束和限制,进而使天线性能调试更灵活,结构优化更方便。The electronic equipment provided by this application includes the above-mentioned middle frame. Fillers are provided in the branch gaps between the antenna radiation branches of the middle frame. The fillers occupy the branch gaps to prevent a large amount of plastic matrix from entering the branch gaps and improve the efficiency of the middle frame. This improves the uniformity of the distribution of the plastic matrix on the middle frame, allowing the plastic matrix everywhere on the middle frame to shrink inward at approximately the same shrinkage rate, thus improving the problem of sink mark defects on the surface of the middle frame. In addition, in this application, fillers are provided in the branch gaps to solve the sink mark problem. Therefore, constraints and restrictions on the size of the branch gaps can be avoided, thereby making antenna performance debugging more flexible and structural optimization more convenient.
第四方面,本申请提供了一种嵌件成型方法,包括:In the fourth aspect, this application provides an insert molding method, including:
提供嵌入件,所述嵌入件的数量为多个,多个所述嵌入件间隔设置,相邻两个所述嵌入件之间具有缝隙;Provide embedded parts, the number of the embedded parts is multiple, the plurality of embedded parts are arranged at intervals, and there is a gap between two adjacent embedded parts;
将填充件设置于所述缝隙内;Arrange the filling piece in the gap;
将所述嵌入件和所述填充件放入第一模具内;Place the insert and the filling piece into the first mold;
将第一塑胶材料注入所述第一模具内,以形成与所述嵌入件和所述填充件接合的塑胶基体;Injecting a first plastic material into the first mold to form a plastic matrix joined to the insert and the filler;
待所述塑胶基体冷却固化后,脱模得到嵌件成型品。After the plastic matrix is cooled and solidified, the mold is demoulded to obtain an insert molded product.
本申请提供的嵌件成型方法,通过在嵌入件之间的缝隙内设置填充件,避免出现缝隙内进入大量塑胶基体而导致塑胶基体有较大范围的厚度落差,由此提高了嵌件成型品上塑胶基体的分布均匀性,从而使嵌件成型品上的各处塑胶基体能够以大致相同的收缩率进行向内收缩,进而改善了嵌件成型品表面的缩痕缺陷问题。The insert molding method provided by this application prevents a large amount of plastic matrix from entering the gap and causing a large thickness difference in the plastic matrix by arranging fillers in the gaps between the insert parts, thus improving the quality of the insert molded products. The uniform distribution of the plastic matrix on the insert molded product allows the plastic matrix everywhere on the insert molded product to shrink inward at approximately the same shrinkage rate, thereby improving the sink mark defect problem on the surface of the insert molded product.
在一种可能的设计中,所述将填充件设置于所述缝隙内的步骤中包括:In a possible design, the step of arranging a filling piece in the gap includes:
将邻近所述缝隙的部分所述嵌入件放入第二模具内;Place the portion of the insert adjacent to the gap into the second mold;
将第二塑胶材料注入所述第二模具内,以形成与所述嵌入件接合并将所述缝隙填充的所述填充件。A second plastic material is injected into the second mold to form the filling piece that engages the insert and fills the gap.
在一种可能的设计中,所述将邻近所述缝隙的部分所述嵌入件放入第二模具内的步骤之前还包括:In one possible design, the step of placing the part of the insert adjacent to the gap into the second mold also includes:
在邻近所述缝隙的部分所述嵌入件上制作拉胶结构。A rubberized structure is made on the part of the insert adjacent to the gap.
在一种可能的设计中,所述将填充件设置于所述缝隙内的步骤中包括:In a possible design, the step of arranging a filling piece in the gap includes:
提供填充件;Provide filler pieces;
将所述填充件放置在所述缝隙内并与所述嵌入件固定连接。The filling piece is placed in the gap and fixedly connected with the embedded piece.
附图说明Description of the drawings
图1是相关技术中的中框的示意图;Figure 1 is a schematic diagram of a middle frame in the related art;
图2是图1中A-A的剖视图;Figure 2 is a cross-sectional view along A-A in Figure 1;
图3是图2中B处的放大图;Figure 3 is an enlarged view of B in Figure 2;
图4是图2中C处的放大图;Figure 4 is an enlarged view of C in Figure 2;
图5是本申请实施例提供的智能手机的示意图;Figure 5 is a schematic diagram of a smart phone provided by an embodiment of the present application;
图6是本申请实施例提供的中框的示意图;Figure 6 is a schematic diagram of a middle frame provided by an embodiment of the present application;
图7是图6中的中框的爆炸图;Figure 7 is an exploded view of the middle frame in Figure 6;
图8是图6中D-D的剖视图;Figure 8 is a cross-sectional view along D-D in Figure 6;
图9是图8中E处的一例的放大图;Figure 9 is an enlarged view of an example at E in Figure 8;
图10是图8中E处的另一例的放大图;Figure 10 is an enlarged view of another example at E in Figure 8;
图11是图8中E处的另一例的放大图;Figure 11 is an enlarged view of another example at E in Figure 8;
图12是本申请实施例提供的嵌入件和填充件的一例的示意图;Figure 12 is a schematic diagram of an example of the insert and filler provided by the embodiment of the present application;
图13是图8中E处的另一例的放大图;Figure 13 is an enlarged view of another example at E in Figure 8;
图14是本申请实施例提供的嵌入件和填充件的另一例的示意图;Figure 14 is a schematic diagram of another example of the insert and filler provided by the embodiment of the present application;
图15是图8中E处的另一例的放大图;Figure 15 is an enlarged view of another example at E in Figure 8;
图16是本申请实施例提供的嵌入件和填充件的另一例的示意图;Figure 16 is a schematic diagram of another example of the insert and filler provided by the embodiment of the present application;
图17是图16中的嵌入件和填充件连接后的示意图;Figure 17 is a schematic diagram of the insert and filler in Figure 16 after they are connected;
图18是本申请实施例提供的嵌入件和填充件的另一例的示意图;Figure 18 is a schematic diagram of another example of the insert and filler provided by the embodiment of the present application;
图19是图8中E处的另一例的放大图;Figure 19 is an enlarged view of another example at E in Figure 8;
图20是本申请实施例提供的嵌入件和填充件的另一例的示意图;Figure 20 is a schematic diagram of another example of the insert and filler provided by the embodiment of the present application;
图21是图20中的嵌入件和填充件连接后的示意图;Figure 21 is a schematic diagram of the insert and filler in Figure 20 after they are connected;
图22是本申请实施例提供的嵌入件和填充件的另一例的示意图;Figure 22 is a schematic diagram of another example of the insert and filler provided by the embodiment of the present application;
图23是本申请实施例提供的中框的局部示意图;Figure 23 is a partial schematic diagram of the middle frame provided by the embodiment of the present application;
图24是本申请实施例提供的嵌件成型方法的一例的流程图;Figure 24 is a flow chart of an example of the insert molding method provided by the embodiment of the present application;
图25是本申请实施例提供的嵌件成型方法的另一例的流程图;Figure 25 is a flow chart of another example of the insert molding method provided by the embodiment of the present application;
图26是本申请实施例提供的嵌件成型方法的一例的示意图;Figure 26 is a schematic diagram of an example of the insert molding method provided by the embodiment of the present application;
图27是本申请实施例提供的嵌件成型方法的另一例的流程图;Figure 27 is a flow chart of another example of the insert molding method provided by the embodiment of the present application;
图28是本申请实施例提供的嵌件成型方法的另一例的示意图;Figure 28 is a schematic diagram of another example of the insert molding method provided by the embodiment of the present application;
图29是本申请实施例提供的嵌件成型方法的另一例的流程图;Figure 29 is a flow chart of another example of the insert molding method provided by the embodiment of the present application;
图30是本申请实施例提供的嵌件成型方法的另一例的示意图。Figure 30 is a schematic diagram of another example of the insert molding method provided by the embodiment of the present application.
附图标记:Reference signs:
10、嵌入件;11、缝隙;12、扁尾状结构;10. Embedded parts; 11. Gap; 12. Flat tail structure;
20、填充件;21、连接部;211、插槽;20. Filling piece; 21. Connection part; 211. Slot;
30、塑胶基体;31、开口;30. Plastic matrix; 31. Opening;
40、限位结构;41、凹槽;42、凸块;43、通孔;44、凸柱;40. Limiting structure; 41. Groove; 42. Bump; 43. Through hole; 44. Projecting column;
50、胶黏剂;60、第一模具;70、第二模具;50. Adhesive; 60. First mold; 70. Second mold;
100、中框;200、天线辐射枝节;201、枝节缝隙;300、缩痕;400、显示屏。100. Middle frame; 200. Antenna radiation branches; 201. Gaps in branches; 300. Sink marks; 400. Display screen.
具体实施方式Detailed ways
下面示例性介绍本申请实施例可能涉及的相关内容。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。The following is an exemplary introduction to relevant content that may be involved in the embodiments of this application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments.
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Connection, or integral connection; it can be mechanical connection, electrical connection or mutual communication; it can be direct connection, or indirect connection through an intermediary, it can be internal connection of two elements or interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
在本申请的描述中,需要理解的是,术语“上”、“下”、“侧”、“内”、“外”、“顶”、“底”等指示的方位或位置关系为基于安装的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。In the description of this application, it should be understood that the terms "upper", "lower", "side", "inner", "outer", "top", "bottom", etc. indicate an orientation or positional relationship based on the installation The orientation or positional relationship is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. .
还需说明的是,本申请实施例中以同一附图标记表示同一组成部分或同一部件,对于本申请实施例中相同的部件,图中可能仅以其中一个零件或部件为例标注了附图标记,应理解的是,对于其他相同的零件或部件,附图标记同样适用。It should also be noted that in the embodiments of the present application, the same reference numerals refer to the same components or components. For the same components in the embodiments of the present application, only one of the parts or components may be labeled as an example in the figure. mark, it should be understood that the same reference marks apply to other identical parts or components.
在本申请的描述中,需要说明的是,术语“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。In the description of this application, it should be noted that the term "and/or" is only an association relationship describing associated objects, indicating that there can be three relationships, for example, A and/or B, which can mean: existing alone A, A and B exist at the same time, and B alone exists.
为方便理解,下面先对本申请所涉及的技术术语进行解释和描述。To facilitate understanding, the technical terms involved in this application are first explained and described below.
线膨胀系数,有时也称为线弹性系数(linear expansivity),表示材料膨胀或收缩的程度。具体定义为,固体物质的温度每升高1℃时,其单位长度的伸长量。The coefficient of linear expansion, sometimes called linear expansivity, indicates the extent to which a material expands or contracts. It is specifically defined as the elongation per unit length of a solid material when its temperature increases by 1°C.
手机等电子设备中通常采用嵌件成型工艺将中框与天线制作为一体化结构,由此可以降低天线和中框的整体尺寸,同时还使后续的手机组装工序更加容易。其中,常规的嵌件成型工艺是在模具打开的状态下将嵌件安装在型腔中,然后合模进行注塑成型的成型方法。In electronic devices such as mobile phones, the insert molding process is usually used to make the middle frame and antenna into an integrated structure, which can reduce the overall size of the antenna and middle frame, and also make the subsequent mobile phone assembly process easier. Among them, the conventional insert molding process is to install the insert in the cavity with the mold open, and then close the mold for injection molding.
目前,业界将天线嵌入中框的技术路线是直接在中框的成型模具内装入预先加工好的金属天线,之后注入熔融的液态塑胶,待模具内的塑胶冷却和固化后便与天线紧密地接合在一起,由此便制作成了一体化的天线和中框的嵌件成型品。At present, the industry's technical route for embedding antennas into the mid-frame is to directly install pre-processed metal antennas into the molding mold of the mid-frame, and then inject molten liquid plastic. After the plastic in the mold cools and solidifies, it is tightly joined to the antenna. Together, an integrated antenna and mid-frame insert molding is produced.
塑胶在冷却过程中会自然收缩,中框上塑胶较厚的部位与塑胶较薄的部位会因为收缩率不同而产生不均匀地向内塌陷,由此在中框的表面就会出现一些内凹的痕迹,该现象被称为缩水现象,该痕迹被称为缩印或者缩痕。为了降低缩印或者缩痕对于中框外观的影响,相关技术中通过增加模具的保压压力来改善该问题,其原理就是提高塑胶的致密度,减少塑胶收缩过程中向内塌陷的程度。Plastic will naturally shrink during the cooling process. The thicker plastic parts and thinner plastic parts on the middle frame will collapse inward unevenly due to different shrinkage rates. As a result, some concavities will appear on the surface of the middle frame. This phenomenon is called shrinkage phenomenon, and this mark is called shrinkage mark or shrinkage mark. In order to reduce the impact of shrinkage or sink marks on the appearance of the middle frame, related technologies improve this problem by increasing the holding pressure of the mold. The principle is to increase the density of the plastic and reduce the degree of inward collapse of the plastic during shrinkage.
图1是相关技术中的中框100的示意图。图2是图1中A-A的剖视图。FIG. 1 is a schematic diagram of a middle frame 100 in the related art. FIG. 2 is a cross-sectional view along line A-A in FIG. 1 .
如图1和图2所示,目前的手机天线通常由多个间隔设置的天线辐射枝节200以及与天线辐射枝节200电连接的馈电点和接地点(图中未绘制)组成,相邻的天线辐射枝节200之间具有枝节缝隙201,通过改变该枝节缝隙201的尺寸可以用来调节天线的谐振频率和带宽。手机天线被塑胶材质的基体30所包裹,由于天线辐射枝节200之间的枝节缝隙201内只有塑胶,不具有金属,使得枝节缝隙201内的塑胶厚度相比较其他具有金属部位的塑胶厚度更大,再加上塑胶与金属的线膨胀系数不同,导致枝节缝隙201内的塑胶在冷却过程中产生很明显的缩水现象,塌陷程度更大,会在中框100的表面形成很深的缩印或者缩痕300,通过常规的增加模具的保压压力也无法较好地改善该问题。As shown in Figures 1 and 2, current mobile phone antennas usually consist of multiple antenna radiating branches 200 arranged at intervals, and feed points and grounding points (not shown in the figure) that are electrically connected to the antenna radiating branches 200. Adjacent There is a branch gap 201 between the antenna radiating branches 200. By changing the size of the branch gap 201, the resonant frequency and bandwidth of the antenna can be adjusted. The mobile phone antenna is wrapped by a plastic base 30. Since the branch gaps 201 between the antenna radiation branches 200 only have plastic and no metal, the thickness of the plastic in the branch gaps 201 is greater than that of other plastic parts with metal. In addition, the linear expansion coefficients of plastic and metal are different, causing the plastic in the branch gap 201 to significantly shrink during the cooling process, resulting in a greater degree of collapse, which will form deep shrinkage or sink marks on the surface of the middle frame 100 300, this problem cannot be improved by conventionally increasing the holding pressure of the mold.
图3是图2中B处的放大图。图4是图2中C处的放大图。Figure 3 is an enlarged view of point B in Figure 2. Figure 4 is an enlarged view of point C in Figure 2.
如图3所示,两个天线辐射枝节200之间的枝节缝隙201内,只有塑胶基体30,因此该部位的塑胶厚度相较于两侧的塑胶厚度更大。在注塑后塑胶冷却过程中,枝节缝隙201内的塑胶缩水情况较严重,由此在中框100的外侧会产生很明显的塌陷,缩痕300很深。As shown in FIG. 3 , there is only a plastic matrix 30 in the branch gap 201 between the two antenna radiation branches 200 , so the plastic thickness in this part is greater than the plastic thickness on both sides. During the cooling process of the plastic after injection molding, the plastic in the branch gaps 201 shrinks severely, resulting in obvious collapse on the outside of the middle frame 100, and the shrink marks 300 are very deep.
与之对比的,如图4所示,在没有枝节缝隙201的部位,由于天线辐射枝节200表面的塑胶厚度大致相同,没有较大的塑胶厚度落差,因此通过增加模具的保压压力可以确保塑胶能够均匀收缩,在中框100的外侧不会产生很明显的塌陷。In contrast, as shown in Figure 4, in areas without branch gaps 201, since the plastic thickness on the surface of the antenna radiation branches 200 is approximately the same, there is no large difference in plastic thickness. Therefore, by increasing the holding pressure of the mold, the plastic thickness can be ensured. It can shrink evenly without obvious collapse on the outside of the middle frame 100 .
可见,相关技术中的嵌件成型品,在针对类似天线辐射枝节200之间的枝节缝隙201处所产生的缩痕300时,并没有较好的解决方案。It can be seen that the insert molding products in the related art do not have a good solution to the sink marks 300 generated at the branch gaps 201 between the antenna radiation branches 200 .
有鉴于此,为了解决上述技术问题,本申请提供了一种嵌件成型品、中框100、电子设备以及嵌件成型方法,通过在嵌入件之间的缝隙内设置填充件,由该填充件对缝隙进行占位,之后再在其外部包裹设置塑胶基体30,由此提高嵌件成型品各处的塑胶基体30均匀性,使嵌件成型品上的各处塑胶基体30能够以大致相同的收缩率均匀收缩,进而改善嵌件成型品的表面具有缩痕300缺陷的问题。In view of this, in order to solve the above technical problems, the present application provides an insert molded product, a middle frame 100, an electronic device, and an insert molding method. By arranging a filler in the gap between the inserts, the filler The gap is occupied, and then the plastic matrix 30 is wrapped around the gap, thereby improving the uniformity of the plastic matrix 30 everywhere on the insert-molded product, so that the plastic matrix 30 everywhere on the insert-molded product can be arranged in approximately the same manner. The shrinkage rate is uniform, thereby improving the problem of sink mark 300 defects on the surface of insert molded products.
本申请实施例首先提供了一种电子设备,该电子设备也可以被称为移动设备、终端设备移动终端或者终端。该电子设备包括但不限于手持设备、车载设备、可穿戴设备、计算设备或连接到无线调制解调器的其它处理设备。例如,电子设备可以包括智能手表(smart watch)、智能手环(smart wristband)、耳机(earphone)、个人数字助理(personaldigital assistant,PDA)电脑、平板型电脑、膝上型电脑(laptop computer)、车载电脑、智能眼镜(smart glasses)、计步器(pedometer)、对讲机(two way radio)以及其他具有中框100和天线且需要进行二者嵌件成型为一体结构的电子设备。Embodiments of the present application first provide an electronic device, which may also be called a mobile device, a terminal device, a mobile terminal, or a terminal. This electronic device includes, but is not limited to, a handheld device, a vehicle-mounted device, a wearable device, a computing device, or other processing device connected to a wireless modem. For example, electronic devices may include smart watches, smart wristbands, earphones, personal digital assistant (PDA) computers, tablet computers, laptop computers, Vehicle-mounted computers, smart glasses, pedometers, two-way radios, and other electronic devices that have a middle frame 100 and an antenna and require insert molding of the two into an integrated structure.
为了更加方便的阐述本申请实施例提供的电子设备,作为示例而非限定,下文将以电子设备是智能手机为例来详细阐述本申请的技术方案。图5是本申请实施例提供的智能手机的示意图。In order to more conveniently explain the electronic device provided by the embodiments of the present application, as an example rather than a limitation, the technical solution of the present application will be explained in detail below by taking the electronic device as a smartphone as an example. Figure 5 is a schematic diagram of a smart phone provided by an embodiment of the present application.
如图5所示,本申请实施例提供的智能手机包括显示屏400和壳体,壳体又包括中框100和后盖。中框100呈中空的环圈状结构,中框100的前端面固定设有显示屏400,中框100的后端面固定设有后盖。显示屏400、中框100以及后盖共同限定出智能手机的容置空间,该容置空间用于安装智能手机的各个功能元件,例如后述实施例中的扬声器模组、电池、麦克风、处理器等其他功能元件。As shown in FIG. 5 , the smart phone provided by the embodiment of the present application includes a display screen 400 and a casing. The casing further includes a middle frame 100 and a back cover. The middle frame 100 has a hollow ring-shaped structure. The display screen 400 is fixed on the front end of the middle frame 100 , and the back cover is fixed on the rear end of the middle frame 100 . The display screen 400, the middle frame 100 and the back cover jointly define an accommodation space for the smartphone. This accommodation space is used to install various functional components of the smartphone, such as the speaker module, battery, microphone, and processor in the embodiments described below. device and other functional components.
在本申请实施例中,中框100的截面形状(对应于显示屏400和后盖的形状)为矩形、方形、跑道形或者椭圆形等。中框100为智能手机的整体提供机械支撑与保护,中框100由具有足够硬度的塑胶基体30构成,例如聚碳酸酯、聚丙烯等,更详细的描述请参见后述实施例。In the embodiment of the present application, the cross-sectional shape of the middle frame 100 (corresponding to the shape of the display screen 400 and the back cover) is a rectangle, a square, a track shape, an ellipse, etc. The middle frame 100 provides mechanical support and protection for the entire smartphone. The middle frame 100 is made of a plastic matrix 30 with sufficient hardness, such as polycarbonate, polypropylene, etc. For more detailed description, please refer to the embodiments described later.
后盖盖合于中框100的后端面,后盖可以为不锈钢、钛合金、玻璃、陶瓷、铝合金、铜合金、塑料等材质制造而成。The back cover covers the rear end surface of the middle frame 100 and can be made of stainless steel, titanium alloy, glass, ceramics, aluminum alloy, copper alloy, plastic and other materials.
可选地,后盖可以通过螺接、卡接、粘接等方式盖合于中框100之上,后盖与中框100之间可以设置密封环,以提高后盖与中框100接合处的密封防水效果。该密封环可由硅胶或者橡胶等高弹性材料构成。Optionally, the back cover can be covered on the middle frame 100 by screwing, snapping, bonding, etc., and a sealing ring can be provided between the back cover and the middle frame 100 to improve the joint between the back cover and the middle frame 100 Sealing and waterproofing effect. The sealing ring can be made of highly elastic materials such as silicone or rubber.
此外,智能手机还可以包括:处理器、通用串行总线(universal serial bus,USB)接口、充电管理模块、电源管理模块、电池、麦克风、移动通信模块、天线、无线通信模块、音频模块、耳机接口、传感器模块、按键、摄像头以及用户标识模块(subscriberidentificationmodule,SIM)卡接口等功能元件。In addition, the smartphone can also include: a processor, a universal serial bus (USB) interface, a charging management module, a power management module, a battery, a microphone, a mobile communication module, an antenna, a wireless communication module, an audio module, and a headset. Functional components such as interfaces, sensor modules, buttons, cameras, and subscriber identification module (SIM) card interfaces.
这些功能元件可以根据用户需要进行更改,可以理解的是,上文所介绍的具体实施例仅仅是本申请的一种具体实施方式,其他可以实现本申请方案的方式同样是本申请所要保护的范围,在此不做赘述。These functional elements can be changed according to user needs. It can be understood that the specific embodiment introduced above is only a specific implementation mode of the present application, and other ways to implement the solution of the present application are also within the scope of protection of the present application. , will not be described in detail here.
现结合附图详细描述本申请提供的嵌件成型品、中框100、电子设备以及嵌件成型方法。The insert molded product, the middle frame 100, the electronic device and the insert molding method provided by the present application will now be described in detail with reference to the accompanying drawings.
为了更加方便的阐述本申请实施例提供的嵌件成型品,作为示例而非限定,下文将以嵌件成型品是智能手机的中框100为例来详细阐述本申请的技术方案。In order to more conveniently explain the insert molded product provided by the embodiment of the present application, as an example rather than a limitation, the technical solution of the present application will be explained in detail below by taking the insert molded product being the middle frame 100 of a smartphone as an example.
当然,在其他实施例中,该嵌件成型品还可以是智能手环的中框、耳机的壳体、个人数字助理电脑的中框、平板型电脑的中框、膝上型电脑的中框、车载电脑的中框、智能眼镜的壳体、计步器的中框、对讲机的壳体等。Of course, in other embodiments, the insert molded product can also be the middle frame of a smart bracelet, the casing of an earphone, the middle frame of a personal digital assistant computer, the middle frame of a tablet computer, or the middle frame of a laptop computer. , the middle frame of car computers, the casing of smart glasses, the middle frame of pedometers, the casing of walkie-talkies, etc.
此外,在其他实施例中,该嵌件成型品还可以是其他需要将嵌入件10和塑胶基体30嵌件成型为一体结构的部件。例如,该嵌件成型品是电脑主机壳,嵌入件10是间隔设置的螺母、扣槽等,螺母、扣槽用来组装主机壳,主机壳的外侧为了避免出现缩痕300,也可以采用本申请提供的嵌件成型方法进行制造。In addition, in other embodiments, the insert-molded product may also be other components that require the insert 10 and the plastic base 30 to be insert-molded into an integrated structure. For example, the insert molded product is a computer main case, and the insert 10 is a nut, a buckle groove, etc. arranged at intervals. The nuts and buckle grooves are used to assemble the main case. In order to avoid sink marks 300 on the outside of the main case, this invention can also be used. Apply the provided insert molding method for manufacturing.
图6是本申请实施例提供的中框100的示意图。图7是图6中的中框100的爆炸图。图8是图6中D-D的剖视图。图9是图8中E处的一例的放大图。FIG. 6 is a schematic diagram of the middle frame 100 provided by the embodiment of the present application. FIG. 7 is an exploded view of the middle frame 100 in FIG. 6 . FIG. 8 is a cross-sectional view along D-D in FIG. 6 . FIG. 9 is an enlarged view of an example at E in FIG. 8 .
如图6-图9所示,本申请实施例提供的一种中框100,包括嵌入件10、填充件20以及塑胶基体30。As shown in FIGS. 6 to 9 , an intermediate frame 100 provided by an embodiment of the present application includes an insert 10 , a filler 20 and a plastic matrix 30 .
嵌入件10的数量为多个,多个嵌入件10间隔设置,相邻两个嵌入件10之间具有缝隙11。其中,该嵌入件10即为天线辐射枝节200,该缝隙11即为枝节缝隙201。The number of embedded parts 10 is multiple. The plurality of embedded parts 10 are arranged at intervals, and there is a gap 11 between two adjacent embedded parts 10 . The embedded component 10 is the antenna radiation branch 200 , and the gap 11 is the branch gap 201 .
填充件20设置于缝隙11内。The filling piece 20 is disposed in the gap 11 .
塑胶基体30包裹在嵌入件10和填充件20的外部。The plastic matrix 30 is wrapped around the insert 10 and the filler 20 .
本申请实施例提供的中框100,通过在天线辐射枝节200之间的枝节缝隙201内设置填充件20,由该填充件20对枝节缝隙201进行填充,之后再在天线辐射枝节200和填充件20的外部包裹设置塑胶基体30。由于填充件20对枝节缝隙201内的空间进行了占位,避免出现枝节缝隙201内进入大量塑胶基体30而导致塑胶基体30有较大范围的厚度落差,由此提高了中框100上塑胶基体30的分布均匀性,从而使中框100上的各处塑胶基体30能够以大致相同的收缩率进行向内收缩,进而改善了中框100表面的缩痕300缺陷问题。The middle frame 100 provided in the embodiment of the present application is provided with a filler 20 in the branch gap 201 between the antenna radiating branches 200. The filler 20 fills the branch gap 201, and then the antenna radiating branch 200 and the filler are filled. The outer package 20 is provided with a plastic matrix 30 . Since the filling piece 20 occupies the space in the branch gap 201, it avoids a large amount of plastic matrix 30 entering into the branch gap 201 and causing a large range of thickness difference in the plastic matrix 30, thereby improving the thickness of the plastic matrix on the middle frame 100. 30 is distributed uniformly, so that the plastic matrix 30 on the middle frame 100 can shrink inward at approximately the same shrinkage rate, thereby improving the problem of sink marks 300 defects on the surface of the middle frame 100 .
此外,在相关技术中,为了避免中框100上对应枝节缝隙201的部位出现缩痕300问题,会对枝节缝隙201的宽度进行严格的限制,通常枝节缝隙201的宽度不能大于0.8mm。如前所述的,枝节缝隙201的尺寸可以用来调节天线的谐振频率和带宽,而受到尺寸约束的枝节缝隙201会对天线性能调试和天线结构优化产生限制。而本申请中是通过在枝节缝隙201内设置填充件20以解决缩痕300问题的,因此可以避免对枝节缝隙201的尺寸造成约束和限制,进而使天线性能调试更灵活,结构优化更方便。In addition, in the related technology, in order to avoid the sink mark 300 problem in the part corresponding to the branch gap 201 on the middle frame 100, the width of the branch gap 201 will be strictly limited. Usually, the width of the branch gap 201 cannot be greater than 0.8 mm. As mentioned above, the size of the branch gap 201 can be used to adjust the resonant frequency and bandwidth of the antenna, but the size constrained branch gap 201 will impose restrictions on antenna performance debugging and antenna structure optimization. In this application, the problem of sink marks 300 is solved by arranging the filler 20 in the branch gap 201. Therefore, constraints and restrictions on the size of the branch gap 201 can be avoided, thereby making the antenna performance debugging more flexible and the structure optimization more convenient.
另外,填充件20材质可以与塑胶基体30的材质设置为不同,因此可以通过对填充件20的材料选型以达到介电常数的变化,从而有利于电线的性能调试。In addition, the material of the filler 20 can be different from the material of the plastic matrix 30. Therefore, the dielectric constant can be changed by selecting the material of the filler 20, which is beneficial to the performance debugging of the wire.
可选地,在本申请提供的其他实施例中,该嵌入件10还可以是间隔设置、埋设在塑胶基体30内的螺母,通过螺钉可将后盖紧固在中框100上,多个螺母之间的缝隙11内具有填充件20以避免中框100上出现缩痕300;或者,该嵌入件10还可以是间隔设置、埋设在塑胶基体30内的金属扣槽,可与设置在后盖上的插扣相扣合,进而实现中框100与后盖的快速安装,多个金属扣槽之间的缝隙11内具有填充件20以避免中框100上出现缩痕300;亦或者,该嵌入件10还可以是天线辐射枝节200与螺母或者与扣槽的组合,天线辐射枝节200与螺母或扣槽之间的缝隙11内具有填充件20以避免中框100上出现缩痕300。Optionally, in other embodiments provided in this application, the insert 10 can also be nuts arranged at intervals and embedded in the plastic base 30. The back cover can be fastened to the middle frame 100 through screws. Multiple nuts There is a filling piece 20 in the gap 11 to prevent the sink mark 300 from appearing on the middle frame 100; alternatively, the insert piece 10 can also be a metal buckle groove arranged at intervals and embedded in the plastic base 30, and can be arranged with the back cover. The buckles on the middle frame 100 are engaged with each other to realize quick installation of the middle frame 100 and the back cover. There are fillers 20 in the gaps 11 between the plurality of metal buckle grooves to avoid sink marks 300 on the middle frame 100; or, the The insert 10 can also be a combination of the antenna radiating branch 200 and a nut or a buckle groove. There is a filler 20 in the gap 11 between the antenna radiating branch 200 and the nut or the buckle groove to avoid sink marks 300 on the middle frame 100 .
可选地,填充件20可以不用将缝隙11完全填满,只是将缝隙11内的大部分空间填满,例如,如图8所示,填充件20的两侧还具有少量缝隙11,该少量缝隙11的宽度小于0.8mm即可。由于大部分的缝隙11空间已经被填充件20占位,已经能够较好地改善缝隙11内塑胶基体30不均匀塌陷所导致的缩痕300缺陷问题。Optionally, the filling member 20 does not need to completely fill the gap 11, but only fills most of the space in the gap 11. For example, as shown in FIG. 8, there are a small number of gaps 11 on both sides of the filling member 20. This small amount The width of the gap 11 is less than 0.8mm. Since most of the space in the gap 11 has been occupied by the filler 20, the defect problem of the sink mark 300 caused by the uneven collapse of the plastic matrix 30 in the gap 11 can be better improved.
可选地,由于填充件20并没有固定连接在嵌入件10上,因此在后续注塑设置塑胶基体30时,可通过模具对填充件20进行定位使其保持在缝隙11内。Optionally, since the filling piece 20 is not fixedly connected to the insert 10 , when the plastic base 30 is subsequently injection molded, the filling piece 20 can be positioned through the mold to keep it in the gap 11 .
可选地,填充件20也可以只贴靠在缝隙11内的一侧嵌入件10上,另一侧的嵌入件10与填充件20可以具有少量缝隙11。Alternatively, the filling piece 20 may only abut one side of the embedded piece 10 in the gap 11 , and the other side of the embedded piece 10 and the filling piece 20 may have a small amount of gap 11 .
可选地,填充件20可以是预制好的零部件,直接放置在缝隙11内。Alternatively, the filling piece 20 can be a prefabricated component directly placed in the gap 11 .
可选地,嵌入件10即天线辐射枝节200由金属材料制成,金属材料制成的天线辐射枝节200可以是板状结构,也可以是线状结构,也可以是根据电子设备内部的堆叠结构而设计的任意结构,在此不作具体限定。Optionally, the embedded component 10 , that is, the antenna radiating branch 200 is made of metal material. The antenna radiating branch 200 made of metal material can be a plate-like structure, a linear structure, or a stacked structure inside the electronic device. The arbitrary structure of the design is not specifically limited here.
可选地,嵌入件10即天线辐射枝节200由铜制成,但并不仅限于此,只要导电性能良好、电阻率低的金属材料,如银或铝等均可作为天线辐射枝节200的材质。Optionally, the insert 10 , that is, the antenna radiating branch 200 is made of copper, but it is not limited thereto. Any metal material with good electrical conductivity and low resistivity, such as silver or aluminum, can be used as the material of the antenna radiating branch 200 .
图10是图8中E处的另一例的放大图。FIG. 10 is an enlarged view of another example at E in FIG. 8 .
如图10所示,在本申请提供的一种实施例中,填充件20的两端分别与相邻两个嵌入件10相抵。As shown in FIG. 10 , in an embodiment provided by this application, both ends of the filling piece 20 offset two adjacent embedded pieces 10 respectively.
本实施例中,填充件20的两端分别与相邻两个嵌入件10相抵,使填充件20可以将缝隙11空间完全填满,使得塑胶基体30在嵌入件10和填充件20上能够形成连续均匀的厚度,以将缩痕300问题彻底改善。In this embodiment, the two ends of the filling piece 20 offset the two adjacent embedded pieces 10 respectively, so that the filling piece 20 can completely fill the gap 11 space, so that the plastic matrix 30 can be formed on the embedded piece 10 and the filling piece 20 Continuous and uniform thickness to completely improve the problem of sink mark 300.
此外,填充件20的两端分别与相邻两个嵌入件10相抵,使得填充件20能够被嵌入件10夹紧限位在缝隙11内,由此可以省去嵌入件10与填充件10之间的连接结构。此外,由于填充件20被嵌入件10夹紧定位了,也就可以省去模具上的相应定位结构。In addition, the two ends of the filling piece 20 are respectively offset against the two adjacent embedded pieces 10, so that the filling piece 20 can be clamped and limited by the embedded pieces 10 in the gap 11, thereby eliminating the need for a connection between the inserting piece 10 and the filling piece 10. connection structure between. In addition, since the filling piece 20 is clamped and positioned by the insert 10, the corresponding positioning structure on the mold can be omitted.
图11是图8中E处的另一例的放大图。FIG. 11 is an enlarged view of another example at E in FIG. 8 .
如图11所示,在本申请提供的一种实施例中,填充件20的两端分别与相邻两个嵌入件10连接。As shown in FIG. 11 , in an embodiment provided by this application, both ends of the filling piece 20 are respectively connected to two adjacent embedded pieces 10 .
本实施例中,将填充件20的两端与缝隙11两侧的嵌入件10连接,使得填充件20能够固定在缝隙11内,从而提高了填充件20的抗震效果,在将填充件20和嵌入件10转场至注塑塑胶基体30的工位时,能够有效防止填充件20从缝隙11内脱落。In this embodiment, the two ends of the filling piece 20 are connected to the embedded pieces 10 on both sides of the gap 11, so that the filling piece 20 can be fixed in the gap 11, thus improving the anti-seismic effect of the filling piece 20. After connecting the filling piece 20 and When the embedded part 10 is transferred to the injection molding station of the plastic base 30 , the filling part 20 can be effectively prevented from falling off from the gap 11 .
此外,填充件20连接在两个嵌入件10之间,可以使嵌入件10具有一定的稳定性,能够避免由于注入塑胶基体30的过程中对嵌入件10形成冲击,防止嵌入件10偏位,避免缝隙11的形态产生变化。In addition, the filling piece 20 is connected between the two embedded pieces 10, which can provide a certain stability to the embedded piece 10, avoid impact on the embedded piece 10 during the injection of the plastic matrix 30, and prevent the embedded piece 10 from being displaced. Avoid changes in the shape of gap 11.
例如,当嵌入件10是天线辐射枝节200时,天线辐射枝节200的末端,即邻近缝隙11的部位,其自身的支撑力较弱、稳定性较差,在向模具内注入塑胶基体30时,流动的塑胶基体30会对天线辐射枝节200的末端形成冲击而导致天线辐射枝节200偏位,同时还会造成缝隙11尺寸改变导致天线的谐振频率和带宽出现异常。而通过填充件20将与相邻两个天线辐射枝节200相连之后,能够同时增加两个天线辐射枝节200的张紧力,使两个天线辐射枝节200都具有一定的硬度以对抗塑胶基体30的冲击,从而确保天线辐射枝节200在塑胶基体30内部的定位准确,以及确保缝隙11的形状和尺寸准确。For example, when the embedded part 10 is an antenna radiating branch 200, the end of the antenna radiating branch 200, that is, the part adjacent to the gap 11, has weak supporting force and poor stability. When the plastic matrix 30 is injected into the mold, The flowing plastic matrix 30 will impact the end of the antenna radiating branch 200 and cause the antenna radiating branch 200 to deviate. At the same time, it will also cause the size of the gap 11 to change, resulting in abnormalities in the resonant frequency and bandwidth of the antenna. After the two adjacent antenna radiating branches 200 are connected through the filler 20, the tension of the two antenna radiating branches 200 can be increased at the same time, so that the two antenna radiating branches 200 have a certain hardness to resist the force of the plastic matrix 30. impact, thereby ensuring the accurate positioning of the antenna radiation branch 200 inside the plastic matrix 30 and ensuring the accurate shape and size of the gap 11 .
另外,填充件20的两端分别与相邻两个嵌入件10连接,即填充件20将多个断开的天线辐射枝节200连接为一个整体,不再存在断点,进而使多个天线辐射枝节200组成为一体形态而增强了中框100的强度。试想,若没有嵌入件10,多个天线辐射枝节200之间具有断点(即枝节缝隙201),当中框100弯折时该断点处极易出现应力集中,而导致得中框100从该断点处变形或者折断。In addition, both ends of the filling piece 20 are respectively connected to two adjacent embedded pieces 10 , that is, the filling piece 20 connects multiple disconnected antenna radiation branches 200 into a whole, without any breakpoints, thereby allowing multiple antennas to radiate. The branches 200 form an integrated form to enhance the strength of the middle frame 100 . Just imagine, if there is no embedded component 10, there will be break points (ie, branch gaps 201) between the multiple antenna radiating branches 200. When the middle frame 100 is bent, stress concentration will easily occur at the break points, causing the middle frame 100 to be separated from the middle frame 100. Deformed or broken at the break point.
可选地,填充件20可以直接与相邻两个嵌入件10连接,例如,如图11所示,填充件20的两端与嵌入件10通过胶黏剂50粘接;或者,填充件20还可以通过中间部件间接地与相邻两个嵌入件10连接,例如,后述实施例中的连接部21作为中间部件,更详细的描述可参见后述实施例。Alternatively, the filling piece 20 can be directly connected to two adjacent embedded pieces 10. For example, as shown in Figure 11, the two ends of the filling piece 20 and the embedded pieces 10 are bonded through adhesive 50; or, the filling piece 20 It can also be indirectly connected to two adjacent embedded parts 10 through an intermediate component. For example, the connecting portion 21 in the embodiment to be described later serves as an intermediate component. For more detailed description, please refer to the embodiment to be described later.
图12是本申请实施例提供的嵌入件10和填充件20的一例的示意图。FIG. 12 is a schematic diagram of an example of the insert 10 and the filler 20 provided by the embodiment of the present application.
如图12所示,在本申请提供的一种实施例中,填充件20的两端设置有连接部21,填充件20通过连接部21与嵌入件10连接。As shown in FIG. 12 , in an embodiment provided by this application, connecting parts 21 are provided at both ends of the filling piece 20 , and the filling piece 20 is connected to the embedded piece 10 through the connecting parts 21 .
前述实施例中,填充件20的两端直接与相邻两个嵌入件10连接,二者的连接面积只有填充件20和嵌入件10的端面重叠区域,因此连接强度受到限制。而本实施例中,通过在填充件20的两端设置有连接部21,由连接部21与嵌入件10进行连接,可以不受连接面的限制,可通过增加连接部21与嵌入件10的重叠面,进而提高填充件20与嵌入件10的连接强度。In the aforementioned embodiment, both ends of the filling piece 20 are directly connected to two adjacent embedded pieces 10, and the connection area between the two is only the overlapping area of the end faces of the filling piece 20 and the embedded pieces 10, so the connection strength is limited. In this embodiment, by providing connecting portions 21 at both ends of the filling piece 20, the connecting portions 21 are connected to the insert 10, and are not limited by the connection surface. By increasing the distance between the connecting portion 21 and the insert 10, The overlapping surface further improves the connection strength between the filling piece 20 and the embedded piece 10 .
可选地,连接部21的边缘,也就是靠近嵌入件10表面的转角处开设倒角斜面,使得连接部21与嵌入件10能够平顺地过渡衔接,进而避免该处在包裹塑胶基体30后出现较明显的厚度落差,进一步排除缩痕300的出现。Optionally, a chamfered bevel is provided on the edge of the connecting part 21 , that is, at the corner close to the surface of the embedded part 10 , so that the connecting part 21 and the embedded part 10 can be smoothly transitioned, thereby preventing the occurrence of the problem after wrapping the plastic matrix 30 The obvious thickness difference further rules out the occurrence of sink marks 300.
可选地,填充件20可以是预制好的零部件,连接部21与嵌入件10通过胶黏剂50、承插结构、限位结构40等连接,以将填充件20固定安装在嵌入件10上,之后再在嵌入件10和填充件20的外部设置塑胶基体30。Alternatively, the filling piece 20 can be a prefabricated component, and the connecting portion 21 is connected to the embedded piece 10 through adhesive 50, a socket structure, a limiting structure 40, etc., so as to fix the filling piece 20 on the embedded piece 10. on the insert part 10 and the filling part 20, and then a plastic matrix 30 is provided outside the insert part 10 and the filling part 20.
具体地,如图12所示,连接部21朝向嵌入件10的一侧涂覆胶黏剂50,将填充件20插入缝隙11内后,连接部21顺势与嵌入件10粘接固定。Specifically, as shown in FIG. 12 , adhesive 50 is applied to the side of the connecting part 21 facing the embedded part 10 . After the filling part 20 is inserted into the gap 11 , the connecting part 21 is bonded and fixed with the embedded part 10 .
或者,还可以在连接部21上设置有销柱,嵌入件10开设有销孔,将填充件20插入缝隙11内后,销柱也顺势插入销孔内,使得连接部21与嵌入件10安装固定。Alternatively, the connecting part 21 may also be provided with pins, and the insert 10 may be provided with pin holes. After inserting the filler 20 into the gap 11, the pins may also be inserted into the pin holes, so that the connecting part 21 and the insert 10 are installed. fixed.
亦或者,连接部21和嵌入件10还可以通过紧固件或者卡扣结构固定连接。Alternatively, the connecting portion 21 and the insert 10 can also be fixedly connected through fasteners or buckle structures.
可选地,填充件20还可以是通过嵌件成型工艺形成在嵌入件10上,待连接部21与嵌入件10接合为一体结构之后,再在嵌入件10和填充件20的外部设置塑胶基体30。Optionally, the filler 20 can also be formed on the insert 10 through an insert molding process. After the connecting portion 21 and the insert 10 are joined into an integrated structure, a plastic matrix is provided outside the insert 10 and the filler 20 30.
其中,为了使连接部21与嵌入件10能够更好的接合,可以将嵌入件10的表面制作为粗糙面,使得连接部21的塑胶基材能够与嵌入件10有更大的接触面积,以提高连接部21和嵌入件10接合强度。即,在本申请提供的一种实施例中,嵌入件10的表面设置菱形滚花结构、凹点或者凸点。Among them, in order to enable better connection between the connecting part 21 and the embedded part 10, the surface of the embedded part 10 can be made into a rough surface, so that the plastic base material of the connecting part 21 can have a larger contact area with the embedded part 10. The joint strength between the connecting part 21 and the insert 10 is improved. That is, in an embodiment provided by this application, the surface of the insert 10 is provided with a rhombus knurl structure, concave points or convex points.
图13是图8中E处的另一例的放大图。图14是本申请实施例提供的嵌入件10和填充件20的另一例的示意图。FIG. 13 is an enlarged view of another example at E in FIG. 8 . FIG. 14 is a schematic diagram of another example of the insert 10 and the filler 20 provided by the embodiment of the present application.
如前所是,连接部21与嵌入件10还可以通过承插结构相连,也就是如本申请提供的一种实施例中,如图13和图14所示,连接部21开设有供嵌入件10插入的插槽211,嵌入件10通过插槽211与填充件20插接。As mentioned above, the connecting part 21 and the embedded part 10 can also be connected through a socket structure. That is, in an embodiment provided by this application, as shown in Figures 13 and 14, the connecting part 21 is provided with a hole for the embedded part. 10 is inserted into the slot 211, and the insert 10 is plugged into the filler 20 through the slot 211.
本实施例中连接部21与嵌入件10通过承插结构相连,具有安装便捷的优点,可以方便地将填充件20与嵌入件10进行安装固定。In this embodiment, the connecting part 21 and the embedded part 10 are connected through a socket structure, which has the advantage of convenient installation. The filling part 20 and the embedded part 10 can be easily installed and fixed.
可选地,连接部21上的插槽211为贯通连接部21外壁的通槽,这样能够方便将嵌入件10滑入插槽211内。Optionally, the slot 211 on the connecting part 21 is a through-slot penetrating the outer wall of the connecting part 21 , so that the insert 10 can be easily slid into the slot 211 .
可选地,为了提高嵌入件10与连接部21的插接强度,嵌入件10的尺寸略大于插槽211的尺寸,由此使嵌入件10与插槽211形成过盈配合,进而使嵌入件10可以牢固地插接在连接部21内。从而确保在将填充件20和嵌入件10转场至注塑塑胶基体30的工位时,能够防止填充件20从缝隙11内脱落。以及,可以使嵌入件10具有一定的稳定性,能够避免由于注入塑胶基体30的过程中对嵌入件10形成冲击,防止嵌入件10偏位,避免缝隙11的形状发生变化。Optionally, in order to improve the insertion strength of the insert 10 and the connecting part 21, the size of the insert 10 is slightly larger than the size of the slot 211, so that the insert 10 and the slot 211 form an interference fit, thereby making the insert 10 can be firmly plugged into the connecting part 21. This ensures that when the filling piece 20 and the insert piece 10 are transferred to the work station for injection molding the plastic base 30, the filling piece 20 can be prevented from falling off from the gap 11. In addition, the embedded part 10 can be made to have a certain stability, which can avoid impact on the embedded part 10 during the process of injecting the plastic matrix 30, prevent the embedded part 10 from being displaced, and prevent the shape of the gap 11 from changing.
在本申请提供的另一种实施例中,图13中的填充件20和连接部21还可以通过嵌件成型工艺直接形成在嵌入件10上。In another embodiment provided by this application, the filling piece 20 and the connecting portion 21 in FIG. 13 can also be directly formed on the insert 10 through an insert molding process.
在承插结构的基础上,为了进一步提高连接部21与嵌入件10的连接强度,在本申请提供的一种实施例中,连接部21与嵌入件10还通过限位结构40连接。On the basis of the socket structure, in order to further improve the connection strength between the connecting part 21 and the embedded part 10 , in an embodiment provided by this application, the connecting part 21 and the embedded part 10 are also connected through a limiting structure 40 .
可选地,限位结构40可以由通孔43和凸柱44组成;或者,限位结构40还可以由凹槽41和凸块42组成。Alternatively, the limiting structure 40 may be composed of a through hole 43 and a protruding post 44; or, the limiting structure 40 may also be composed of a groove 41 and a protruding block 42.
在本申请提供的一种实施例中,限位结构40包括通孔43和凸柱44,连接部21开设有通孔43,嵌入件10设置凸柱44。In an embodiment provided by this application, the limiting structure 40 includes a through hole 43 and a protruding post 44. The connecting part 21 is provided with a through hole 43, and the insert 10 is provided with a protruding post 44.
当然,当然还可以将通孔43和凸柱44的设置基体进行互换,也就是在本申请提供的另一种实施例中,嵌入件10开设有通孔43,连接部21设置凸柱44。Of course, the base bodies of the through holes 43 and the protruding posts 44 can also be interchanged. That is, in another embodiment provided by this application, the insert 10 is provided with the through holes 43 and the connecting portion 21 is provided with the protruding posts 44 .
图15是图8中E处的另一例的放大图。图16是本申请实施例提供的嵌入件10和填充件20的另一例的示意图。图17是图16中的嵌入件10和填充件20连接后的示意图。FIG. 15 is an enlarged view of another example at E in FIG. 8 . Figure 16 is a schematic diagram of another example of the insert 10 and the filler 20 provided by the embodiment of the present application. FIG. 17 is a schematic diagram of the insert 10 and the filler 20 in FIG. 16 after they are connected.
如图15-图17所示,在本申请提供的一种实施例中,嵌入件10邻近缝隙11的端部为扁尾状结构12,通孔43开设于扁尾状结构12上,凸柱44设置于插槽211内。As shown in Figures 15 to 17, in an embodiment provided by the present application, the end of the insert 10 adjacent to the gap 11 is a flat tail-shaped structure 12, the through hole 43 is opened on the flat tail-shaped structure 12, and the protruding pillar 44 is provided in the slot 211.
本实施例中,嵌入件10的端部为扁尾状结构12且开设有通孔43,使得扁尾状结构12和通孔43形成较好的拉胶效果,在通过嵌件成型工艺在嵌入件10上成型填充件20时,塑胶包裹在扁尾状结构12的外部固化后,可以提高连接部21与嵌入件10的连接强度,塑胶进入通孔43内后固化便形成了凸柱44,该凸柱44和通孔43相互配合进而提高了连接部21与嵌入件10的连接强度。因此,扁尾状结构12和通孔43能够使嵌入件10与填充件20的塑胶基材紧密地接合在一起,实现可靠的连接关系。In this embodiment, the end of the insert 10 is a flat tail-shaped structure 12 and is provided with a through hole 43, so that the flat tail-shaped structure 12 and the through hole 43 form a better glue drawing effect. When the filler 20 is formed on the component 10, after the plastic is wrapped around the outside of the flat tail structure 12 and solidified, the connection strength between the connecting part 21 and the embedded component 10 can be improved. The plastic enters the through hole 43 and solidifies to form the protruding pillar 44. The protruding posts 44 and the through holes 43 cooperate with each other to improve the connection strength between the connecting portion 21 and the insert 10 . Therefore, the flat tail-shaped structure 12 and the through hole 43 can tightly join the plastic base materials of the insert 10 and the filler 20 together to achieve a reliable connection relationship.
图18是本申请实施例提供的嵌入件10和填充件20的另一例的示意图。Figure 18 is a schematic diagram of another example of the insert 10 and the filler 20 provided by the embodiment of the present application.
若不采用嵌件成型工艺在嵌入件10上成型填充件20,可以提前预制好填充件20,以通过组装方式将填充件20安装在嵌入件10上。为了方便组装,如图18所示,在本申请提供的一种实施例中,填充件20为相互拼接的两部分,每一部分都有半个凸柱44,两部分填充件20分别从嵌入件10的左右两侧组装在嵌入件10上。If the insert molding process is not used to form the filler 20 on the insert 10 , the filler 20 can be prefabricated in advance, and the filler 20 can be installed on the insert 10 through assembly. In order to facilitate assembly, as shown in Figure 18, in an embodiment provided by this application, the filling piece 20 is two parts spliced to each other, each part has a half boss 44, and the two parts of the filling piece 20 are respectively formed from the embedded part. The left and right sides of 10 are assembled on the insert 10 .
在本申请提供的一种实施例中,限位结构40包括凹槽41和凸块42,连接部21设置凹槽41,嵌入件10设置凸块42。In an embodiment provided by this application, the limiting structure 40 includes a groove 41 and a protrusion 42, the connecting part 21 is provided with the groove 41, and the insert 10 is provided with the protrusion 42.
当然,还可以将凹槽41和凸块42的设置基体进行互换,也就是在本申请提供的另一种实施例中,嵌入件10设置凹槽41,连接部21设置凸块42。Of course, the bases on which the grooves 41 and the bumps 42 are provided can also be interchanged. That is, in another embodiment provided by this application, the insert 10 is provided with the grooves 41 and the connecting portion 21 is provided with the bumps 42 .
图19是图8中E处的另一例的放大图。图20是本申请实施例提供的嵌入件10和填充件20的另一例的示意图。图21是图20中的嵌入件10和填充件20连接后的示意图。FIG. 19 is an enlarged view of another example at E in FIG. 8 . Figure 20 is a schematic diagram of another example of the insert 10 and the filler 20 provided by the embodiment of the present application. FIG. 21 is a schematic diagram of the insert 10 and the filler 20 in FIG. 20 after they are connected.
如图19-图20所示,在本申请提供的一种实施例中,凹槽41为设置于嵌入件10外周的环形通槽,凸块42呈环圈状地设置于插槽211的槽壁。As shown in FIGS. 19 and 20 , in an embodiment provided by the present application, the groove 41 is an annular through groove provided on the periphery of the insert 10 , and the protrusions 42 are provided in an annular shape in the groove of the slot 211 wall.
本实施例中,嵌入件10的端部为环形通槽,使得嵌入件10可以形成较好的拉胶效果,通过嵌件成型工艺在嵌入件10上形成连接部21时,塑胶进入凹槽41内后固化便形成了凸块42,该凹槽41和凸块42相互配合进而提高了连接部21与嵌入件10的连接强度,能够使嵌入件10与填充件20的塑胶基材紧密地接合在一起,实现可靠的连接关系。In this embodiment, the end of the insert 10 is an annular through groove, so that the insert 10 can form a better glue pulling effect. When the connecting portion 21 is formed on the insert 10 through the insert molding process, the plastic enters the groove 41 After internal curing, the bumps 42 are formed. The grooves 41 and the bumps 42 cooperate with each other to improve the connection strength between the connecting part 21 and the insert 10, and enable the insert 10 and the plastic base material of the filler 20 to be tightly joined. Together, we achieve a reliable connection.
图22是本申请实施例提供的嵌入件10和填充件20的另一例的示意图。Figure 22 is a schematic diagram of another example of the insert 10 and the filler 20 provided by the embodiment of the present application.
若不采用嵌件成型工艺在嵌入件10上成型填充件20,可以提前预制好填充件20,以通过组装方式将填充件20安装在嵌入件10上。为了方便组装,如图22所示,在本申请提供的一种实施例中,填充件20为相互拼接的两部分,每一部分的插槽211内都有半圈凸块42,两部分填充件20分别从嵌入件10的上下方组装在嵌入件10上。If the insert molding process is not used to form the filler 20 on the insert 10 , the filler 20 can be prefabricated in advance, and the filler 20 can be installed on the insert 10 through assembly. In order to facilitate assembly, as shown in Figure 22, in an embodiment provided by the present application, the filler 20 is two parts spliced to each other. Each part has a half-circle bump 42 in the slot 211. The two parts of the filler 20 are 20 are respectively assembled on the insert 10 from the upper and lower sides of the insert 10 .
图23是本申请实施例提供的中框100的局部示意图。Figure 23 is a partial schematic diagram of the middle frame 100 provided by the embodiment of the present application.
如图23所示,在本申请提供的一种实施例中,填充件20可拆卸地设置于缝隙11内,塑胶基体30开设有可将填充件20漏出的开口31,以使得填充件20可从开口31内移出。As shown in Figure 23, in an embodiment provided by this application, the filling piece 20 is detachably disposed in the gap 11, and the plastic base 30 is provided with an opening 31 through which the filling piece 20 can leak out, so that the filling piece 20 can be Remove from opening 31.
只要在塑胶基体30完成冷却固化之前,填充件20始终位于缝隙11内,这样可以确保塑胶基体30免受不均匀缩水的影响,从而有效防止缩痕300出现。待塑胶基体30完成冷却固化之后,对于特殊情况下,也可以移除填充件20,这样可以降低嵌件成型品的整体重量,或者在一些必须存在空气缝隙11的情况下,移除填充件20可以使嵌入件10之间的缝隙11内完全不具有异物。As long as the filler 20 is always located in the gap 11 before the plastic matrix 30 completes cooling and solidification, this can ensure that the plastic matrix 30 is protected from uneven shrinkage, thereby effectively preventing the occurrence of sink marks 300 . After the plastic matrix 30 completes cooling and solidification, the filler 20 can also be removed under special circumstances, which can reduce the overall weight of the insert molded product, or in some cases where the air gap 11 must exist, the filler 20 can be removed The gaps 11 between the inserts 10 can be completely free of foreign matter.
此外,移出填充件20还有利于中框100产品的报废和回收。在不具有填充件20的中框100进行报废和回收时,只需要将塑胶基体30和嵌入件10两种材料进行分离即可,若增加了填充件20,则需要将塑胶基体30、嵌入件10、填充件20三种材料进行分离,其难度相对较大,分离工序也较多。In addition, removing the filler 20 also facilitates the scrapping and recycling of the middle frame 100 product. When the middle frame 100 without the filler 20 is scrapped and recycled, only the plastic base 30 and the insert 10 need to be separated. If the filler 20 is added, the plastic base 30 and the insert 10 need to be separated. 10. Separating the three materials of the filling piece 20 is relatively difficult and requires many separation processes.
在本申请提供的一种实施例中,填充件20的横截面大于或者等于嵌入件10的横截面。In an embodiment provided in this application, the cross-section of the filling piece 20 is larger than or equal to the cross-section of the insert 10 .
需要说明的是,本申请中的横截面是指沿着填充件20或者嵌入件10的宽度方向裁切后得到的截面。It should be noted that the cross section in this application refers to the cross section cut along the width direction of the filler 20 or the insert 10 .
本实施例中,填充件20的横截面大于或者等于嵌入件10的横截面,可使填充件20将缝隙11完全填满,以将缩痕300问题彻底改善。In this embodiment, the cross-section of the filler 20 is larger than or equal to the cross-section of the insert 10 , so that the filler 20 can completely fill the gap 11 , thereby completely improving the sink mark 300 problem.
在本申请提供的一些实施例中,塑胶基体30的材质包括但不限于是聚碳酸酯(polycarbonate,PC)、聚丙烯(polypropylene,PP)、聚氯乙烯(polyvinyl chloride,PVC)、聚甲醛(paraformaldehyde,POM)、聚氨酯(polyurethane,PU)、聚对苯二甲酸乙二醇酯(polyethylene glycol terephthalate,PET)、聚对苯二甲酸丁二醇酯(polybutyleneterephthalate,PBT)、乙烯-醋酸乙烯共聚物(ethylene-vinyl acetate copolymer,EVA)中一种或者多种。In some embodiments provided in this application, the material of the plastic matrix 30 includes, but is not limited to, polycarbonate (PC), polypropylene (PP), polyvinyl chloride (PVC), polyformaldehyde ( paraformaldehyde (POM), polyurethane (PU), polyethylene glycol terephthalate (PET), polybutylene terephthalate (polybutyleneterephthalate, PBT), ethylene-vinyl acetate copolymer (ethylene-vinyl acetate copolymer, EVA) one or more.
此外,填充件20的材质选择也比较重要,其选择的基本原则就是填充件20用材料的膨胀系数与所选用塑胶基体30材料的线膨胀系数应尽可能接近。如果填充件20材质与塑胶基体30材质的线膨胀系数差异太大,两者冷却时收缩率不同,在填充件20周围应力集中,可能导致成型困难并产生辐射状的裂缝。In addition, the material selection of the filling piece 20 is also important. The basic principle of the selection is that the expansion coefficient of the material of the filling piece 20 should be as close as possible to the linear expansion coefficient of the selected plastic matrix 30 material. If the linear expansion coefficients of the materials of the filling piece 20 and the plastic matrix 30 are too different, and the shrinkage rates of the two materials are different when they are cooled, stress will be concentrated around the filling piece 20, which may cause difficulty in molding and produce radial cracks.
基于上述原则,在本申请提供的一些实施例中,填充件20的材质可以与塑胶基体30的材质相同,包括上述的聚碳酸酯、聚丙烯、聚氯乙烯、聚甲醛、聚氨酯、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、乙烯-醋酸乙烯共聚物中一种或者多种。Based on the above principles, in some embodiments provided by this application, the material of the filler 20 can be the same as the material of the plastic matrix 30 , including the above-mentioned polycarbonate, polypropylene, polyvinyl chloride, polyformaldehyde, polyurethane, and polyparaphenylene. One or more of ethylene diformate, polybutylene terephthalate, and ethylene-vinyl acetate copolymer.
在本申请提供的另一些实施例中,填充件20的材质还可以包括但不限于是硅胶、热塑性弹性体(thermoplastic elastomers,TPE)、热塑性聚氨酯弹性体(thermoplasticurethane,TPU)中一种或者多种。其中,硅胶、热塑性弹性体、热塑性聚氨酯弹性体的线膨胀系数与上述塑胶基体30的材质相差不大。In other embodiments provided in this application, the material of the filler 20 may also include, but is not limited to, one or more of silicone, thermoplastic elastomers (TPE), and thermoplastic polyurethane (TPU). . Among them, the linear expansion coefficient of silicone, thermoplastic elastomer, and thermoplastic polyurethane elastomer is not much different from the material of the above-mentioned plastic matrix 30 .
图24是本申请实施例提供的嵌件成型方法的一例的流程图。FIG. 24 is a flow chart of an example of the insert molding method provided by the embodiment of the present application.
如图24所示,本申请实施例还提供了一种嵌件成型方法,该方法包括如下步骤。As shown in Figure 24, the embodiment of the present application also provides an insert molding method, which includes the following steps.
步骤101,提供嵌入件10,嵌入件10的数量为多个,多个嵌入件10间隔设置,相邻两个嵌入件10之间具有缝隙11。Step 101: Provide the embedded parts 10. The number of the embedded parts 10 is multiple. The multiple embedded parts 10 are arranged at intervals, and there is a gap 11 between two adjacent embedded parts 10.
步骤102,将填充件20设置于缝隙11内。Step 102: dispose the filling member 20 in the gap 11.
步骤103,将嵌入件10和填充件20放入第一模具60内。Step 103: Put the insert part 10 and the filling part 20 into the first mold 60.
步骤104,将第一塑胶材料注入第一模具60内,以形成与嵌入件10和填充件20接合的塑胶基体30。Step 104: Inject the first plastic material into the first mold 60 to form the plastic base 30 joined with the insert 10 and the filler 20.
步骤105,待塑胶基体30冷却固化后,脱模得到嵌件成型品。Step 105: After the plastic matrix 30 is cooled and solidified, the mold is demoulded to obtain an insert molded product.
本申请实施例提供的嵌件成型方法,通过在嵌入件10之间的缝隙11内设置填充件20,由该填充件20对缝隙11进行填充,之后再在嵌入件10和填充件20的外部包裹设置塑胶基体30。由于填充件20对缝隙11内的空间进行了占位,避免出现缝隙11内进入大量塑胶基体30而导致塑胶基体30有较大范围的厚度落差,由此提高了嵌件成型品上塑胶基体30的分布均匀性,从而使嵌件成型品上的各处塑胶基体30能够以大致相同的收缩率进行向内收缩,进而改善了嵌件成型品表面的缩痕300缺陷问题。In the insert molding method provided by the embodiment of the present application, a filler 20 is provided in the gap 11 between the inserts 10, and the gap 11 is filled with the filler 20, and then the filler 20 is placed outside the insert 10 and the filler 20. The plastic matrix 30 is wrapped. Since the filler 20 occupies the space in the gap 11, it is avoided that a large amount of plastic matrix 30 enters the gap 11 and causes a large range of thickness difference in the plastic matrix 30, thereby improving the thickness of the plastic matrix 30 on the insert molded product. The distribution uniformity allows the plastic matrix 30 everywhere on the insert molded product to shrink inward at approximately the same shrinkage rate, thereby improving the problem of sink marks 300 defects on the surface of the insert molded product.
图25是本申请实施例提供的嵌件成型方法的另一例的流程图。Figure 25 is a flow chart of another example of the insert molding method provided by the embodiment of the present application.
图26是本申请实施例提供的嵌件成型方法的一例的示意图。其中,图26中的(a)是嵌入件10的示意图;图26中的(b)是嵌入件10放入第二模具70的示意图;图26中的(c)是嵌入件10和填充件20放入第一模具60的示意图;图26中的(d)是塑胶基体30包裹在嵌入件10和填充件20外部的示意图。Figure 26 is a schematic diagram of an example of the insert molding method provided by the embodiment of the present application. Among them, (a) in Figure 26 is a schematic diagram of the insert 10; (b) in Figure 26 is a schematic diagram of the insert 10 being placed in the second mold 70; (c) in Figure 26 is the insert 10 and the filler 20 is placed into the first mold 60; (d) in FIG. 26 is a schematic diagram of the plastic matrix 30 wrapped outside the insert 10 and the filler 20.
如图25和图26所示,在本申请提供的一种实施例中,该方法包括如下步骤。As shown in Figures 25 and 26, in an embodiment provided by this application, the method includes the following steps.
步骤201,如图26中的(a)所示,提供嵌入件10,嵌入件10的数量为多个,多个嵌入件10间隔设置,相邻两个嵌入件10之间具有缝隙11。Step 201, as shown in (a) of Figure 26, an insert 10 is provided. The number of the inserts 10 is multiple. The plurality of inserts 10 are arranged at intervals, and there is a gap 11 between two adjacent inserts 10.
步骤202,如图26中的(b)所示,将邻近缝隙11的部分嵌入件10放入第二模具70内。Step 202, as shown in (b) of FIG. 26, place the part of the insert 10 adjacent to the gap 11 into the second mold 70.
步骤203,将第二塑胶材料注入第二模具70内,以形成与嵌入件10接合并将缝隙11填充的填充件20。Step 203 , inject the second plastic material into the second mold 70 to form the filling piece 20 that is joined to the insert 10 and fills the gap 11 .
步骤204,待填充件20冷却固化后脱模,如图26中的(c)所示,将嵌入件10和填充件20放入第一模具60内。Step 204 , after the filling piece 20 is cooled and solidified, it is demoulded. As shown in (c) in FIG. 26 , the insert piece 10 and the filling piece 20 are placed into the first mold 60 .
步骤205,将第一塑胶材料注入第一模具60内,以形成与嵌入件10和填充件20接合的塑胶基体30。Step 205: Inject the first plastic material into the first mold 60 to form the plastic matrix 30 joined with the insert 10 and the filler 20.
步骤206,如图26中的(d)所示,待塑胶基体30冷却固化后,脱模得到嵌件成型品。Step 206, as shown in (d) in Figure 26, after the plastic matrix 30 is cooled and solidified, the mold is demoulded to obtain an insert molded product.
本实施例中,填充件20通过嵌件成型工艺形成在嵌入件10上,可以使嵌入件10和填充件20紧密地接合,使二者具有较大的连接强度,可以确保嵌入件10有足够强的张紧力以对抗注入塑胶材料时的冲击,能够有效防止嵌入件10偏位以及缝隙11变形。In this embodiment, the filler 20 is formed on the insert 10 through an insert molding process, so that the insert 10 and the filler 20 can be closely joined, so that the two have greater connection strength, which can ensure that the insert 10 has sufficient The strong tension force can resist the impact when the plastic material is injected, and can effectively prevent the embedded part 10 from being displaced and the gap 11 from being deformed.
其中,第一塑胶材料即为上文中所提到的塑胶基体30可选用的材料。第二塑胶材料即为上文中所提到的填充件20可选用的材料。Among them, the first plastic material is the optional material for the plastic matrix 30 mentioned above. The second plastic material is the optional material for the filling member 20 mentioned above.
图27是本申请实施例提供的嵌件成型方法的另一例的流程图。Figure 27 is a flow chart of another example of the insert molding method provided by the embodiment of the present application.
图28是本申请实施例提供的嵌件成型方法的另一例的示意图。其中,图28中的(a)是嵌入件10的示意图;图28中的(b)是嵌入件10上的拉胶结构的示意图;图28中的(c)是嵌入件10放入第二模具70的示意图;图28中的(d)是嵌入件10和填充件20放入第一模具60的示意图;图28中的(e)是塑胶基体30包裹在嵌入件10和填充件20外部的示意图。Figure 28 is a schematic diagram of another example of the insert molding method provided by the embodiment of the present application. Among them, (a) in Figure 28 is a schematic diagram of the embedded part 10; (b) in Figure 28 is a schematic diagram of the rubber structure on the embedded part 10; (c) in Figure 28 is the embedded part 10 placed in the second Schematic diagram of the mold 70; (d) in Figure 28 is a schematic diagram of the insert 10 and the filler 20 being placed into the first mold 60; (e) in Figure 28 is the plastic matrix 30 wrapped outside the insert 10 and the filler 20 schematic diagram.
在本申请提供的一些实施例中,该方法包括如下步骤。In some embodiments provided in this application, the method includes the following steps.
步骤301,如图28中的(a)所示,提供嵌入件10,嵌入件10的数量为多个,多个嵌入件10间隔设置,相邻两个嵌入件10之间具有缝隙11。Step 301, as shown in (a) of Figure 28, an insert 10 is provided. The number of the inserts 10 is multiple. The plurality of inserts 10 are spaced apart, and there is a gap 11 between two adjacent inserts 10.
步骤302,如图28中的(b)所示,在邻近缝隙11的部分嵌入件10上制作拉胶结构。其中,拉胶结构包括但不限于是滚花、凹点、凸点、凹槽41、通孔43、凸柱44、凸块42、扁尾状结构12中的一种或者多种。Step 302, as shown in (b) of FIG. 28, make a rubber structure on part of the embedded part 10 adjacent to the gap 11. The rubber-drawing structure includes, but is not limited to, one or more of knurling, concave points, raised points, grooves 41, through holes 43, protrusions 44, bumps 42, and flat tail structures 12.
步骤303,如图28中的(c)所示,将邻近缝隙11的部分嵌入件10放入第二模具70内。Step 303, as shown in (c) in FIG. 28, place the part of the embedded part 10 adjacent to the gap 11 into the second mold 70.
步骤304,将塑胶材料注入第二模具70内,以形成与嵌入件10接合并将缝隙11填充的填充件20。Step 304: Inject the plastic material into the second mold 70 to form the filling piece 20 that is joined to the insert 10 and fills the gap 11.
步骤305,待填充件20冷却固化后脱模,如图28中的(d)所示,将嵌入件10和填充件20放入第一模具60内。Step 305 , after the filling piece 20 is cooled and solidified, it is demoulded. As shown in (d) in FIG. 28 , the insert piece 10 and the filling piece 20 are placed into the first mold 60 .
步骤306,将塑胶材料注入第一模具60内,以形成与嵌入件10和填充件20接合的塑胶基体30。Step 306: Inject the plastic material into the first mold 60 to form the plastic matrix 30 joined with the insert 10 and the filler 20.
步骤307,如图28中的(e)所示,待塑胶基体30冷却固化后,脱模得到嵌件成型品。Step 307, as shown in (e) in Figure 28, after the plastic matrix 30 is cooled and solidified, the mold is demoulded to obtain an insert molded product.
本实施例中,嵌入件10上制作拉胶结构,可以进一步提高嵌入件10和填充件20的接合强度。In this embodiment, a rubberized structure is formed on the insert 10, which can further improve the joint strength of the insert 10 and the filler 20.
图29是本申请实施例提供的嵌件成型方法的另一例的流程图。Figure 29 is a flow chart of another example of the insert molding method provided by the embodiment of the present application.
图30是本申请实施例提供的嵌件成型方法的另一例的示意图。其中,图30中的(a)是嵌入件10的示意图;图30中的(b)是填充件20的示意图;图30中的(c)是嵌入件10和填充件20相连后的示意图;图30中的(d)是嵌入件10和填充件20放入第一模具60的示意图;图30中的(e)是塑胶基体30包裹在嵌入件10和填充件20外部的示意图。Figure 30 is a schematic diagram of another example of the insert molding method provided by the embodiment of the present application. Among them, (a) in Figure 30 is a schematic diagram of the insert 10; (b) in Figure 30 is a schematic diagram of the filler 20; (c) in Figure 30 is a schematic diagram after the insert 10 and the filler 20 are connected; Figure 30 (d) is a schematic diagram of the insert 10 and the filler 20 being placed into the first mold 60; Figure 30 (e) is a schematic diagram of the plastic matrix 30 wrapped outside the insert 10 and the filler 20.
在本申请提供的一些实施例中,将填充件20设置于缝隙11内的步骤中包括:In some embodiments provided in this application, the step of arranging the filling member 20 in the gap 11 includes:
步骤401,如图30中的(a)所示,提供嵌入件10,嵌入件10的数量为多个,多个嵌入件10间隔设置,相邻两个嵌入件10之间具有缝隙11。Step 401, as shown in (a) of Figure 30, an insert 10 is provided. The number of inserts 10 is multiple. The plurality of inserts 10 are arranged at intervals, and there is a gap 11 between two adjacent inserts 10.
步骤402,如图30中的(b)所示,提供填充件20。Step 402, as shown in (b) of FIG. 30 , the filling member 20 is provided.
步骤403,如图30中的(c)所示,将填充件20放置在缝隙11内并与嵌入件10固定连接。Step 403, as shown in (c) in Figure 30, place the filling piece 20 in the gap 11 and firmly connect it to the embedded piece 10.
步骤404,如图30中的(d)所示,将嵌入件10和填充件20放入第一模具60内。Step 404, as shown in (d) in FIG. 30 , place the insert 10 and the filling member 20 into the first mold 60 .
步骤405,将第一塑胶材料注入第一模具60内,以形成与嵌入件10和填充件20接合的塑胶基体30。Step 405: Inject the first plastic material into the first mold 60 to form the plastic matrix 30 joined with the insert 10 and the filler 20.
步骤406,如图30中的(e)所示,待塑胶基体30冷却固化后,脱模得到嵌件成型品。Step 406, as shown in (e) in Figure 30, after the plastic matrix 30 is cooled and solidified, the mold is demoulded to obtain an insert molded product.
可选地,填充件20与嵌入件10进行固定连接的方式,可以通过胶黏剂50粘接,或者通过承插结构插接,亦或者通过限位结构40固定连接,亦或者通过卡扣结构固定连接,亦或者通过紧固件固定连接。Optionally, the filling piece 20 and the embedded piece 10 can be fixedly connected through the adhesive 50 , or through the socket structure, or through the limiting structure 40 , or through the buckle structure. Fixed connection, or fixed connection through fasteners.
可选地,将填充件20放置在缝隙11内并与嵌入件10固定连接,可以通过人工放置;或者,采用机械手进行自动化放置,有利于减少人工失误、提高效率、缩短嵌件成型周期和提高产品的可靠性。Optionally, the filling piece 20 is placed in the gap 11 and fixedly connected to the insert 10, which can be placed manually; or, a robot can be used for automatic placement, which is beneficial to reducing manual errors, improving efficiency, shortening the insert molding cycle and improving Product reliability.
可选地,在步骤406之后还包括如下步骤:Optionally, the following steps are also included after step 406:
步骤407,嵌件成型品开设有将填充件20漏出的开口31,并将填充件20可从开口31内移出。Step 407: The insert molded product is provided with an opening 31 for leaking the filling piece 20, and the filling piece 20 can be removed from the opening 31.
移出填充件20还有利于嵌件成型品的报废和回收。在不具有填充件20的嵌件成型品进行报废和回收时,只需要将塑胶基体30和嵌入件10两种材料进行分离即可,其难度相对较小,分离工序也较少。Removing the filler 20 also facilitates scrapping and recycling of the insert molded article. When the insert-molded product without the filler 20 is scrapped and recycled, only the plastic matrix 30 and the insert 10 need to be separated, which is relatively less difficult and involves fewer separation processes.
最后应说明的是:以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何在本申请揭露的技术范围内的变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以所述权利要求的保护范围为准。Finally, it should be noted that the above are only specific implementation modes of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application shall be covered by this application. within the scope of protection applied for. Therefore, the protection scope of this application should be subject to the protection scope of the claims.
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