CN206922900U - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- CN206922900U CN206922900U CN201720721844.4U CN201720721844U CN206922900U CN 206922900 U CN206922900 U CN 206922900U CN 201720721844 U CN201720721844 U CN 201720721844U CN 206922900 U CN206922900 U CN 206922900U
- Authority
- CN
- China
- Prior art keywords
- support
- packaging body
- camera module
- optical filter
- sensitive chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
A kind of camera module is the utility model is related to, including：Circuit board；Sensitive chip, set on circuit boards；Packaging body, set on circuit boards and encapsulate at least part structure of sensitive chip；Optical filter, it is arranged on the packaging body；Support, it is arranged on packaging body and positioned at the periphery of optical filter；And lens, including connecting portion and optical effect portion, the connecting portion be fixedly connected on support, the sensitive chip is between optical effect portion and circuit board.Optical filter is arranged on packaging body by above-mentioned camera module, support is set to be used to connect lens on packaging body again, safe distance can be kept between support and optical filter, support is avoided to produce interference with optical filter, the top surface of support can provide the sufficient space for fixing and adjusting the lens degree of balance simultaneously, on the premise of meeting to minimize, the imaging function of camera module can be also ensured.
Description
This application claims Application No. 201710326790.6, the utility model submitted on May 10th, 2017 are entitled
The priority of the Chinese patent application of " camera module ".
Technical field
Camera technology field is the utility model is related to, more particularly to a kind of camera module.
Background technology
In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image
Car field, medical domain etc., such as camera module have become the portable electric appts such as smart mobile phone, tablet personal computer
One of standard fitting.Image can not only be obtained by being applied to the camera module of portable electric appts, but also can be helped
Portable electric appts realize the functions such as instant video call.With the increasingly lightening development trend of portable electric appts and
User requires more and more higher, the imaging to the overall dimensions and camera module of camera module for the image quality of camera module
Ability is proposed harsher requirement.That is, the development trend of portable electric appts requires that camera module is subtracting
Further improved on the basis of few size and strengthen imaging capability.
Utility model content
The utility model, which aims to provide one kind, can obtain smaller size of camera module.
A kind of camera module, including：
Circuit board；
Sensitive chip, set on circuit boards；
Packaging body, set on circuit boards and encapsulate at least part structure of sensitive chip；
Optical filter, it is arranged on the packaging body；
Support, it is arranged on packaging body and positioned at the periphery of optical filter；And
Lens, including connecting portion and optical effect portion, the connecting portion are fixedly connected on support, the sensitive chip position
Between optical effect portion and circuit board.
In one of the embodiments, the outside wall surface of the packaging body and the outside wall surface of the support are substantially aligned.Encapsulation
The outside wall surface of body is alignd with the outside wall surface of support, and both can be avoided to occupy more spaces, beneficial to the miniaturization of camera module.
In one of the embodiments, the outward flange of the connecting portion and the outside wall surface of support are substantially aligned.The company of lens
The outward flange of socket part is alignd with the outside wall surface of support, thus support will not occupy the space outside lens contour, that is to say, that branch
The setting of frame will not increase the size of camera module in the vertical direction of the optical axis of sensitive chip.
In one of the embodiments, the connecting portion is directly bonded on the top surface of support by colloid.The company of lens
Between socket part and support in addition to the colloid for forming connection, without other physical features, it is thus possible to benefit the small of camera module
Type.
In one of the embodiments, the width for being used to form colloid on the top surface of the support is 0.28-0.53mm.On
Mounted lens can be consolidated by stating width, while be beneficial to the miniaturization for realizing camera module again.
In one of the embodiments, the width of the bottom surface of the support is 0.35-0.4mm.Above-mentioned width design can be simultaneous
Care for installation steadiness of the support on packaging body, and installation convenience of the optical filter on packaging body.
In one of the embodiments, any one part of the support the lens connecting portion lower section.
Any one part of support lens connecting portion lower section, namely support do not occupy and is in sustained height side with lens
Upward space, thus set support not cause size of the camera module in the vertical direction of the optical axis in optical effect portion
Increase.
In one of the embodiments, there is spacing between the optical filter and the support.Optical filter is kept with support
Spacing, it can ensure and be independent of each other in the setting up procedure of optical filter and support, be installed in optical filter and support on packaging body
On the premise of remain to each play corresponding function, while support provide again set and regulation lens space.
In one of the embodiments, it is more than institute at least one opening position of support, the width of the top surface of the support
State the width of the bottom surface of support.The width of the top surface of support is more than the width of the bottom surface of support, can have top surface bigger
Area is used for the colloid for setting bonding lens.
In one of the embodiments, the optical filter is be bonded by colloid with the top surface of the packaging body, the optical filtering
The top surface of piece and the packaging body glue width be 0.24-0.5mm.Above-mentioned glue width can consolidate installation optical filter, simultaneously
The installation of support is not influenceed, will not be produced excessive glue yet and be avoided polluting other elements.
In one of the embodiments, the marginal portion of the surrounding of the sensitive chip is encapsulated in circuit by the packaging body
On plate.Encapsulation of the packaging body to the marginal portion of sensitive chip can ensure the connection reliability of sensitive chip and circuit board, avoid
Link causes the destruction and damage that sensitive chip is connected with circuit board between in production.
In one of the embodiments, the center section of the sensitive chip forms photosensitive area, the inwall of the packaging body
The distance between the bottom in face and the edge of photosensitive area of the sensitive chip are 0.16~0.18mm.The setting of above-mentioned distance makes
Obtain camera module and obtain preferable balance between the two in miniaturization and image quality.
In one of the embodiments, the height of the packaging body is 0.36-0.46mm.Above-mentioned height design can be simultaneously
Meet encapsulation requirement and Miniaturization Design.
In one of the embodiments, the width of the top surface of the packaging body is 0.69-1.74mm.The width of above-mentioned top surface
Design can both meet the needs of center rest, and take into account the Miniaturization Design of camera module simultaneously.
In one of the embodiments, the sensitive chip is electrically connected with by wire and circuit board, and the wire is by institute
State packaging body parcel.
A kind of camera module, including：
Circuit board, there is circuit and electronic component on the circuit board；
Packaging body, the electronic component is wrapped up, cavity is set in the packaging body；
Sensitive chip, it is electrically connected with the circuit, the marginal portion of the sensitive chip is wrapped up by the packaging body, institute
The center section for stating sensitive chip is placed in the cavity；
Optical filter, it is arranged on the packaging body and closes the cavity；
Support, it is arranged on the packaging body and is located at the optical filter periphery；And
Lens, are directly anchored on the top surface of the support and any part of lens is respectively positioned on the top of the support.
Optical filter is arranged on packaging body by above-mentioned camera module, then sets support to be used to connect lens on packaging body,
Safe distance can be kept between support and optical filter, avoids support from producing interference with optical filter, while the top surface of support can carry
For the sufficient space for fixing and calibrating lens axis, on the premise of meeting to minimize, can also ensure camera module into
As function.
Brief description of the drawings
Fig. 1 is the schematic cross-sectional view for the camera module that the embodiment of the utility model one provides；
Fig. 2 is the schematic cross-sectional view of the other direction of structure shown in Fig. 1.
Embodiment
As depicted in figs. 1 and 2, a kind of camera module that the embodiment of the utility model one provides, including it is circuit board 10, photosensitive
Chip 20, packaging body 30, lens 40, optical filter 50 and support 60.
Circuit board 10 can be printed circuit board (PCB), and in some embodiments, circuit board 10 can be flexible PCB, or portion
Subregion is flexible bendable.Circuit, and the electronics applied by these circuits and camera module are formed on circuit board 10
Miscellaneous part in equipment (such as the mobile terminal such as mobile phone), which is formed, to be electrically connected.As shown in Fig. 2 in some embodiments, circuit board
10 include two substrates 101,102 and connect the flexible piece 103 of two substrates 101,102, and substrate 101,102 has than flexibility
The bigger rigidity of part 103.The elements such as sensitive chip 20, packaging body 30, lens 40, support 60 and optical filter 50 are disposed therein one
On individual substrate 101.Also settable electronic component 104 on another substrate 102, electronic component 104 can be resistance, electric capacity, two
Pole pipe, triode, potentiometer, relay or driver.It is appreciated that as shown in figure 1, electronics member is may also set up on substrate 101
Part 104, electronic component 104 can be resistance, electric capacity, diode, triode, potentiometer, relay or driver.Flexible piece
103 with the junction of substrate 101 is also settable strengthens glue 105, for strengthening the structural strength of flexible piece 103, prevent flexible piece
103 with the connection of substrate 101 fracture or losing.
Sensitive chip 20 is set on the circuit board 10.Sensitive chip 20 is electrically connected with the circuit on circuit board 10.
The upper surface of sensitive chip 20 deviates from circuit board 10, and lower surface is bonded with circuit board 10, and upper surface has positioned at center section
For photosensitive area 201 to receive optical signal, sensitive chip 20 converts optical signals to electric signal, and is transmitted through circuit board 10 to outside
Image processing apparatus or image memory device.Upper surface also has positioned at the non-photo-sensing area 203 of marginal portion.Sensitive chip 20 is logical
Cross wire 202 to be electrically connected with circuit board 10, specifically, one end of wire 202 and touching on the marginal portion of sensitive chip 20
Point connection, the other end of wire 202 are connected with the corresponding contacts on circuit board 10.In some other embodiments, sensitive chip
20 also can be directly electrically connected with without by wire 202 by welding with the contact on circuit board 10.
Packaging body 30 is set on the circuit board 10 and by least part construction packages of sensitive chip 20 on the circuit board 10.
Packaging body 30 is used to protect sensitive chip 20 not invaded and harassed by the external world with being connected in manufacture, intermediate links for circuit board 10, to protect
Hinder the connection reliability of sensitive chip 20 and circuit board 10.In one embodiment, the packaging body 30 is by the sensitive chip 20
The marginal portion encapsulation of surrounding is on the circuit board 10.It is first fixed on large stretch of circuit board 10 to connect in batch making production process
Sensitive chip 20 is connect, re-forms packaging body 30, independent unit then is formed to the segmentation of large stretch of circuit board 10, due to packaging body 30
Protection, the electric connection of sensitive chip 20 and circuit board 10 can be avoided to be destroyed in cutting procedure.
Formed with wire 202 in the embodiment to electrically conduct between sensitive chip 20 and circuit board 10, the wire
202 can be wrapped up by the packaging body 30.
The electronic component 104 set on the circuit board 10 can also be wrapped up by the packaging body 30.
The packaging body 30 is annular in shape, has outside wall surface 301, top surface 302 and the internal face 303, Ke Yili being sequentially connected
It is annular in shape to solve outside wall surface 301, top surface 302 and internal face 303.In one embodiment, packaging body 30 has quadra structure,
Outside wall surface 301, top surface 302 and internal face 303 include four parts of head and the tail connection successively.The outside wall surface 301 it is each
And horizontal plane part is substantially in vertical state, i.e.,.Except corresponding with substrate 102 in four parts of the outside wall surface 301
Outside that part, other three parts are substantially flush with the respective side walls of substrate 101 respectively, thus can make packaging body 30 and circuit
Plate 10 takes up space miniaturization.
The top surface 302 substantially is used to carry optical filter 50 and support 60 with plane-parallel, the top surface 302.Some
In embodiment, the width of the top surface 302 is more than the cross-sectional width of the support 60 so that the top surface 302, which removes, can carry branch
Outside frame 60, optical filter 50 can be also carried.
The internal face 303, which encloses, to be set to form a cavity 304.The center section of the sensitive chip 20 is placed in the cavity
In 304, and 201 part formed between of photosensitive area, thus in cavity 304, with the optical signal outside reception.The sense
Wrapped up by the packaging body 30 marginal portion of optical chip 20.The internal face 303 is from the direction of circuit board 20 towards top surface 302
Direction tilted to outside wall surface 301, make cavity 304 that there is up big and down small structure.
The optical filter 50 is arranged on the packaging body 30.For example, can be by gluing mode by optical filter 50
Bottom edge region is bonded on the top surface 302 of packaging body 30.Optical filter 50 closes the cavity 304.The optical filter 50
Part light, such as infrared light are filtered out in the optical signal that can be passed through from lens 40.Optical signal after filtering is again by sensitive chip 20
Receive.
Support 60 is arranged on the packaging body 30 and is located at the periphery of optical filter 50.Between support 60 and optical filter 50
With spacing.This spacing can ensure that the shaping of optical filter 50 and support 60 is independent of each other.In process of production, can be first in packaging body
Optical filter 50 is fixed on 30, then support 60 is set again.Optical filter 50, support 60 can be by adhesion means and packaging body 30
Top surface 302 forms connection.Support 60 is kept spacing with optical filter 50, be able to will not be caused for example during fixed support 60
Excessive glue and the influence for covering the grade of optical filter 50.
The profile of support 60 is similar to the profile of packaging body 30, on the whole also structure annular in shape.In one embodiment, can be with
For quadra structure.The cross sectional shape of support 60 can be rectangle, or approximate rectangle, and support 60 has bottom surface 601, top
Face 602, outside wall surface 603 and internal face 604.Bottom surface 601 is oppositely arranged with top surface 602, and outside wall surface 603 and internal face 604 are relative
Set, bottom surface 601 connects the bottom of outside wall surface 603 and the bottom of internal face 604.Top surface 602 connect outside wall surface 603 top and
The top of internal face 604.
In one embodiment, the outside wall surface 603 of the support 60 and the outside wall surface 301 of the packaging body 30 are substantially aligned, because
And support 60 will not spatially occupy excessive volume, be advantageous to the miniaturization of camera module.The internal face of the support 60
604 are arranged on the intermediate region of the top surface 302 of packaging body 30, and thus the top surface 302 of packaging body 30 still has carrying optical filter
50 space.
Lens 40 are directly fixedly connected on the top surface 602 of the support 60.The focusing that external optical signal passes through lens 40
And received by sensitive chip 20.In one embodiment, lens 40 include integrally formed connecting portion 41 and optical effect portion 42, wherein
The connecting portion 41 is fixedly connected on support 60.In one embodiment, the connecting portion 41 is directly viscous by colloid 401
It is connected on the top surface 602 of support 60.Because optical filter 50 is arranged on packaging body 30, if lens 40 are also directly connected to packaging body
On 30, then it must need to provide bigger packaging body 30 to meet the connection area of lens 40, this is unfavorable for the small of camera module
Type.Therefore, by setting support 60 in addition, and the top surface 602 in support 60 forms joint face with lens 40, one because
Stagger in short transverse with optical filter 50, do not interfere with optical filter 50 during fixed lens 40, two come the top of support 60
Face 602 can provide more free installation space to calibrate the optical axis of lens 40, ensure that 20 more preferable optics of image sensitive chip connects
Produce effects fruit.Such as the optical effect portion 42 focuses to optical signal, the optical effect portion 42 has an optical axis I, described
Optical axis I and the sensitive chip 20 center alignment., may be solid in order to ensure optical axis I and sensitive chip 20 center alignment
Need to adjust the dosage of colloid 401 during fixed connection, and glue amount ratio is adjusted on the top surface 602 of support 60 in packaging body 30
Top surface 302 on regulation glue measurer have smaller risk because the top surface 302 of packaging body 30 is also associated with optical filter 50, regulation
Need to avoid causing the influence to optical filter 50 during glue amount.
In one embodiment, as shown in Fig. 2 support 60 at least one opening position, the top surface 602 of the support 60
Width is more than the width of the bottom surface 601 of the support 60, thus can make the top surface 602 of support 60 that there is bigger colloid to place sky
Between, available for the setting orientation of adjustment balance lens 40, the optical effect of guarantee lens 40.
In some embodiments, the connecting portion 41 of lens 40 and optical effect portion 42 can also split shaping, such as connecting portion
41 can be made up of non-transparent material, and connecting portion 41 is cylindrical in shape, and inside sets optical path passage.Optical effect portion 42 is then with transparent
Material is made, such as may include one or more eyeglasses.After connecting portion 41 is made, optical effect portion 42 is loaded to connecting portion again
In the 41 optical path passages formed.
Further, the outward flange of the connecting portion 41 and the outside wall surface 603 of support 60 are substantially aligned, thus reduce support
60th, the volume occupied by lens 40.
The optical effect portion 42 is by forming gap 43 between connecting portion 41 and support 60.The gap 43 and packaging body 30
The cavity 304 of formation connects.
In one embodiment, any part of the lens 40 is respectively positioned on the top of the support 60.In other words, the support
60 any one part the lens 40 connecting portion 41 lower section.The setting of support 60 will not increase camera module and hang down
Directly in the size on the optical axis direction in optical effect portion.
During making above-mentioned camera module, multiple sensitive chips 20 are fixed on large stretch of circuit board 10 before this, are formed
Multiple packaging bodies 30, then optical filter 50 and support 60 are set on each packaging body 30, next large stretch of circuit board 10 entered
Lens 40, to form independent unit, are finally fixed on the support 60 of separate unit by row cutting, and this production process can be by
Optical filter 50 is formed to sensitive chip 20 and protected, and avoids sensitive chip 20 contaminated.
In one embodiment, the width W1 of the top surface 302 of the packaging body 30 is 0.69-1.74mm, preferably 1.65mm.
The width W1 of the top surface 302 refers to the top surface 302 and the edge that outside wall surface 301 is connected to the top surface 302 and internal face
The distance at the edge of 303 connections.The top surface 302 is used for bearing support 60, although the width W1 increases of top surface 302 can make to hold
The contact surface increase of support 60 is carried, so as to the installation stable degree of lifting bracket 60, but width W1 crosses senior general and increases camera module
Overall volume, Miniaturization Design can not be realized.The width W1 designs of above-mentioned top surface 302 can both meet the need of center rest 60
Ask, and taken into account the Miniaturization Design of camera module simultaneously.
In one embodiment, the height H1 of the packaging body 30 is 0.36-0.46mm, preferably 0.41mm.The encapsulation
The height H1 of body 30 refers to that the lateral surface 301 is connected with the edge that circuit board 10 is connected to the lateral surface 301 with top surface 302
Edge vertical range.The height H1 of the packaging body 30 should consider can at least part structure of sensitive chip 20 with
And other electronic components on circuit board 10 form encapsulation, consider that the volume of camera module will not be increased in optical axis I directions again.
Above-mentioned height H1 designs can meet encapsulation requirement and Miniaturization Design simultaneously.
The photosensitive area 201 of the sensitive chip 20 is all in cavity 304.In one embodiment, the packaging body 30
The distance between the edge of photosensitive area 201 of bottom and sensitive chip 20 of internal face 303 L1 be 0.16-0.18mm, preferably
For 0.17mm.If the bottom of internal face 303 of packaging body 30 is too small to the distance L1 of the photosensitive area 201 of sensitive chip 20, encapsulation
During the risk increase that falls on the photosensitive area 201 of sensitive chip 20 of the foreign matter such as potting resin, and on photosensitive area 201
Foreign matter receives the effect of incident light by photosensitive area 201 is influenceed, and then influences image quality.If the bottom of internal face 303 of packaging body 30
Hold the distance L1 to the photosensitive area 201 of sensitive chip 20 excessive, on the one hand cause the volume increase of camera module, be unfavorable for small-sized
Change, on the other hand can also make it that the veiling glare of non-photo-sensing area 203 on sensitive chip 20 is more and influences image quality.Above-mentioned distance
L1 setting causes camera module to obtain preferable balance between the two in miniaturization and image quality.
In one embodiment, the external diameter of a circle d that the point where the outermost of the lens 40 is formed is 7.5mm.Such as Fig. 1
Shown in, the point where the outermost of the lens 40 is located at the outermost of the connecting portion 41.The height H2 of the lens 40
For 7.25mm.The height H2 of the lens 40 refers to the horizontal plane and the optical effect portion where the lowermost end of connecting portion 41
The distance between horizontal plane where 42 tops.
The width W2 for being used to form colloid 401 in one embodiment, on the top surface 602 of the support 60 is 0.28-0.53mm.
If the width W2 for being used to be formed colloid 401 on the top surface 602 of support 60 is too small, colloid 401 can not consolidate to lens 40.
And if the width W2 for being used to be formed colloid 401 on the top surface 602 of support 60 is excessive, the overall volume for causing camera module is increased
Add, be unfavorable for minimizing.Above-mentioned width W2 can consolidate mounted lens 40, while be beneficial to the miniaturization for realizing camera module again.One
In a little embodiments, above-mentioned width W2 is identical with the width of top surface 602, and in some other embodiments, above-mentioned width W2 is less than
The width of top surface 602.Such as width is inconsistent everywhere for the connecting portion 41 of lens 40, thus correspond on the top surface 602 of support 60
Need to be formed that the width of colloid 401 is also different, now the width of the portion of top surface 602, which can be more than, forms colloid 401
Width W2.
The width W3 of the bottom surface 601 of the support 60 is 0.35-0.4mm.The width W3 of bottom surface 601 is used to enable support 60
It is firm to be arranged on packaging body 30.Too small width W3 will influence support 60 mounting stability, and if width W3 is excessive, by shadow
Ring the installation of other elements, such as installation of the optical filter 50 on packaging body 30.Above-mentioned width W3 designs can take into account support 60 and exist
Installation steadiness on packaging body 30, and installation convenience of the optical filter 50 on packaging body 30.
The height H3 of the support 60, in an embodiment namely between the bottom surface 601 of the support 60 and the top surface 602
Distance, be 0.41mm.There is support 60 certain height H3 the installation of optical filter 50 and lens 40 can be made to be arranged on optical axis I
Stagger on direction, namely the short transverse of camera module, avoid both from installation process interfering, can not if height H3 is too small
Embody an effect, and if height H3 is excessive, it is compact in size on optical axis I directions to be unfavorable for camera module.Above-mentioned height
Degree H3 sets the non-interfering installation requirements that can meet optical filter 50 and lens 40, and camera module can be made to reach miniaturization again and set
Put.
In one embodiment, the thickness T of the optical filter 50 is 0.3mm.The above-mentioned thickness T of optical filter 50, which is set, can meet light
The requirement of line transmitance.The top surface 302 of the optical filter 50 and the packaging body 30 glue width W4 be 0.24-0.5mm, it is excellent
Choosing for 0.4mm.If it is too small glue width W4, it may be difficult to firm installation optical filter 50, if glue width W4 it is excessive, branch will be influenceed
Installation of the frame 60 on packaging body 30, in addition, glue width W4 it is excessive, it would be possible to the side of support 60 or sensitive chip 20 1
Side excessive glue, support 60 or sensitive chip 20 is caused to be contaminated.Above-mentioned glue width W4 can consolidate installation optical filter 50, while not
The installation of support 60 is influenceed, excessive glue will not be also produced and avoid polluting other elements.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (16)
- A kind of 1. camera module, it is characterised in that including：Circuit board；Sensitive chip, set on circuit boards；Packaging body, set on circuit boards and encapsulate at least part structure of sensitive chip；Optical filter, it is arranged on the packaging body；Support, it is arranged on packaging body and positioned at the periphery of optical filter；AndLens, including connecting portion and optical effect portion, the connecting portion are fixedly connected on support, and the sensitive chip is located at light Learn between service portion and circuit board.
- 2. camera module according to claim 1, it is characterised in that the outside wall surface of the packaging body is outer with the support Wall is substantially aligned.
- 3. camera module according to claim 1, it is characterised in that the outward flange of the connecting portion and the outside wall surface of support It is substantially aligned.
- 4. camera module according to claim 1, it is characterised in that the connecting portion is directly bonded in support by colloid Top surface on.
- 5. camera module according to claim 4, it is characterised in that be used for the width for forming colloid on the top surface of the support Spend for 0.28-0.53mm.
- 6. camera module according to claim 1, it is characterised in that the width of the bottom surface of the support is 0.35- 0.4mm。
- 7. camera module according to claim 1, it is characterised in that any one part of the support is described The lower section of the connecting portion of mirror.
- 8. camera module according to claim 1, it is characterised in that at least one opening position of support, the support Top surface width be more than the support bottom surface width.
- 9. camera module according to claim 1, it is characterised in that between having between the optical filter and the support Away from.
- 10. camera module according to claim 1, it is characterised in that the top surface of the optical filter and the packaging body leads to Cross colloid bonding, the top surface of the optical filter and the packaging body glue width be 0.24-0.5mm.
- 11. camera module according to claim 1, it is characterised in that the packaging body is by the surrounding of the sensitive chip Marginal portion encapsulation on circuit boards.
- 12. camera module according to claim 11, it is characterised in that the center section of the sensitive chip forms photosensitive The distance between area, edge of photosensitive area of the bottom of the internal face of the packaging body and the sensitive chip for 0.16~ 0.18mm。
- 13. camera module according to claim 1, it is characterised in that the height of the packaging body is 0.36-0.46mm.
- 14. camera module according to claim 1, it is characterised in that the width of the top surface of the packaging body is 0.69- 1.74mm。
- 15. camera module according to claim 1, it is characterised in that the sensitive chip passes through wire and circuit board electricity Property connection, the wire wrapped up by the packaging body.
- A kind of 16. camera module, it is characterised in that including：Circuit board, there is circuit and electronic component on the circuit board；Packaging body, the electronic component is wrapped up, cavity is set in the packaging body；Sensitive chip, it is electrically connected with the circuit, the marginal portion of the sensitive chip is wrapped up by the packaging body, the sense The center section of optical chip is placed in the cavity；Optical filter, it is arranged on the packaging body and closes the cavity；Support, it is arranged on the packaging body and is located at the optical filter periphery；AndLens, are directly anchored on the top surface of the support and any part of lens is respectively positioned on the top of the support.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2017103267906 | 2017-05-10 | ||
| CN201710326790 | 2017-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206922900U true CN206922900U (en) | 2018-01-23 |
Family
ID=61322332
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710470647.4A Pending CN108881675A (en) | 2017-05-10 | 2017-06-20 | Camera module |
| CN201720721844.4U Active CN206922900U (en) | 2017-05-10 | 2017-06-20 | Camera module |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710470647.4A Pending CN108881675A (en) | 2017-05-10 | 2017-06-20 | Camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN108881675A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108881675A (en) * | 2017-05-10 | 2018-11-23 | 南昌欧菲光电技术有限公司 | Camera module |
| CN109743482A (en) * | 2019-01-21 | 2019-05-10 | 宁波舜宇光电信息有限公司 | The assemble method and electronic equipment of camera module, camera module |
| WO2020151481A1 (en) * | 2019-01-21 | 2020-07-30 | 宁波舜宇光电信息有限公司 | Image capturing module, assembly method for image capturing module, and electronic apparatus |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005268963A (en) * | 2004-03-16 | 2005-09-29 | Citizen Electronics Co Ltd | Imaging module, method for mounting the same to mother board, and method for manufacturing the same |
| CN100531310C (en) * | 2006-01-14 | 2009-08-19 | 鸿富锦精密工业（深圳）有限公司 | Digital camera module |
| JP2008148253A (en) * | 2006-12-13 | 2008-06-26 | Hitachi Maxell Ltd | Camera module, and imaging apparatus and assembling method thereof |
| WO2016180378A2 (en) * | 2015-05-14 | 2016-11-17 | 宁波舜宇光电信息有限公司 | Image capturing module and assembly method therefor |
| CN105898120B (en) * | 2016-04-21 | 2019-11-29 | 宁波舜宇光电信息有限公司 | Camera module based on moulding technology |
| CN111193852B (en) * | 2016-03-28 | 2021-10-15 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
| CN206136071U (en) * | 2016-07-03 | 2017-04-26 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and module of making a video recording |
| CN108881675A (en) * | 2017-05-10 | 2018-11-23 | 南昌欧菲光电技术有限公司 | Camera module |
-
2017
- 2017-06-20 CN CN201710470647.4A patent/CN108881675A/en active Pending
- 2017-06-20 CN CN201720721844.4U patent/CN206922900U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108881675A (en) * | 2017-05-10 | 2018-11-23 | 南昌欧菲光电技术有限公司 | Camera module |
| CN109743482A (en) * | 2019-01-21 | 2019-05-10 | 宁波舜宇光电信息有限公司 | The assemble method and electronic equipment of camera module, camera module |
| WO2020151481A1 (en) * | 2019-01-21 | 2020-07-30 | 宁波舜宇光电信息有限公司 | Image capturing module, assembly method for image capturing module, and electronic apparatus |
| CN109743482B (en) * | 2019-01-21 | 2024-06-14 | 宁波舜宇光电信息有限公司 | Image pickup module, assembly method of image pickup module and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108881675A (en) | 2018-11-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109510932B (en) | Camera module based on molding process, molded circuit board assembly of camera module and manufacturing method of camera module | |
| US10008533B2 (en) | Semiconductor package | |
| US10708481B2 (en) | Camera module and photosensitive assembly thereof | |
| WO2017166798A1 (en) | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device | |
| US7916212B2 (en) | Image sensor package and camera module utilizing the same | |
| CN105847645A (en) | Shooting module based on integrated packaging technology, and integrated pedestal assembly and manufacturing method thereof | |
| US10750072B2 (en) | Camera module and photosensitive assembly thereof | |
| US8248514B1 (en) | Camera module having image sensing module with passive components | |
| CN206922900U (en) | Camera module | |
| CN206977550U (en) | Camera module and its photosensory assembly | |
| CN205792880U (en) | The integral base assembly of camera module based on integral packaging technique | |
| US20070210246A1 (en) | Stacked image sensor optical module and fabrication method | |
| US20060016973A1 (en) | Multi-chip image sensor package module | |
| CN101285921A (en) | Image-forming module group | |
| KR20110001659A (en) | Camera module | |
| CN109461748B (en) | Packaging structure and packaging method of optical element | |
| CN206865597U (en) | Camera module and its photosensory assembly | |
| US20040041938A1 (en) | Embedded type camera module | |
| CN206865583U (en) | Camera module | |
| CN206865598U (en) | Camera module | |
| CN206865578U (en) | Camera module and its photosensory assembly | |
| CN206865584U (en) | Camera module | |
| CN206865599U (en) | Camera module and its photosensory assembly | |
| US8049809B2 (en) | Solid-state image pickup device and electronic instruments | |
| CN211604129U (en) | Sensor module and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |