CN107682591A - Camera module and its molding photosensory assembly and manufacture method - Google Patents

Camera module and its molding photosensory assembly and manufacture method Download PDF

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Publication number
CN107682591A
CN107682591A CN201610622330.3A CN201610622330A CN107682591A CN 107682591 A CN107682591 A CN 107682591A CN 201610622330 A CN201610622330 A CN 201610622330A CN 107682591 A CN107682591 A CN 107682591A
Authority
CN
China
Prior art keywords
camera module
photo
molded base
circuit board
sensitive cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610622330.3A
Other languages
Chinese (zh)
Other versions
CN107682591B (en
Inventor
王明珠
陈振宇
郭楠
田中武彦
赵波杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201710711359.3A priority Critical patent/CN107682596B/en
Priority to CN201910811126.XA priority patent/CN110650273B/en
Priority to CN201610622330.3A priority patent/CN107682591B/en
Priority to PCT/CN2016/103248 priority patent/WO2018023887A1/en
Priority to JP2019503667A priority patent/JP7048573B2/en
Priority to EP23165641.4A priority patent/EP4224876A3/en
Priority to KR1020197005566A priority patent/KR102199508B1/en
Priority to EP16911482.4A priority patent/EP3493517B1/en
Priority to CN201680088072.3A priority patent/CN109716745B/en
Priority to KR1020207036542A priority patent/KR102352901B1/en
Priority to US15/439,909 priority patent/US10051167B2/en
Priority to US15/461,409 priority patent/US10498942B2/en
Priority to US15/461,402 priority patent/US10171716B2/en
Priority to TW106208437U priority patent/TWM557833U/en
Priority to TW106119407A priority patent/TWI698125B/en
Priority to US15/679,151 priority patent/US10136041B2/en
Priority to US15/679,153 priority patent/US10129451B2/en
Priority to US15/679,154 priority patent/US10230879B2/en
Priority to US15/785,374 priority patent/US10742859B2/en
Publication of CN107682591A publication Critical patent/CN107682591A/en
Priority to US16/028,367 priority patent/US10708480B2/en
Priority to US16/157,061 priority patent/US10666847B2/en
Priority to US16/569,601 priority patent/US10986258B2/en
Application granted granted Critical
Publication of CN107682591B publication Critical patent/CN107682591B/en
Priority to US17/203,673 priority patent/US11363184B2/en
Priority to JP2021055045A priority patent/JP7269273B2/en
Priority to US17/824,415 priority patent/US11575816B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention provides a camera module and its molding photosensory assembly and manufacture method, the molding photosensory assembly includes circuit board, photo-sensitive cell and molded base, wherein molded base is joined integrally by moulding technology and circuit board and photo-sensitive cell, wherein molded base forms optical window, optical window and photo-sensitive cell position correspondence, and optical window cross-sectional configuration is into gradually big trapezoidal or multistage trapezoidal from the bottom to top, with it is conveniently stripped, prevent damage to molded base, avoid veiling glare and prevent damage in moulding technology to connection photo-sensitive cell and the lead of circuit board.

Description

Camera module and its molding photosensory assembly and manufacture method
Technical field
The present invention relates to camera module field, further, is related to the camera module and its shaping mould of moulding technology making Tool and manufacture method.
Background technology
Camera module is that intelligent electronic device can not obtain one of scarce part, citing ground but is not limited to smart mobile phone, phase Mechanical, electrical brain equipment, wearable device etc..And with the continuous development and popularization of various smart machines, the requirement to camera module Also more and more higher.
In recent years, intelligent electronic device produced the development advanced by leaps and bounds, and increasingly tended to lightening, and camera module will adapt to It develops, and also increasingly requires multifunction, lightening, miniaturization, with the more and more thinner for alloing electronic equipment to do, and it is full Imaging requirements of the sufficient equipment for camera module.Therefore camera module production firm is persistently directed to designing, manufactures satisfaction The camera module of these requirements.
Molded packages technology is the emerging a kind of encapsulation technology to grow up on the basis of traditional COB encapsulation.Such as according to Figure 1A It is shown, it is the wiring board using the encapsulation of existing integral packaging technology.In this configuration, encapsulation part 1 is passed through into integral packaging Mode is packaged in wiring board 2 and sensitive chip 3, and coats the electronic component on wiring board and electrical connection chip and circuit The lead of plate, so as to reduce the space that the electronic component of camera module independently takes so that the size of camera module can subtract It is small, and the dust for solving the problems, such as to adhere on electronic component influences the image quality of camera module.
Relative to traditional support rack type COB encapsulation technologies, this encapsulation technology in theory, has more excellent Gesture, but for a period of time, this encapsulation technology only stays in the theoretical or manual experimental stage, and does not obtain very well Implementation, do not put into reality production in carry out quantization production, to find out its cause, having following aspects.
First, though integral packaging technology is one in other large scale industry fields knows technology, but in camera module Field is new application, and different industries need the object that is produced by way of molding different, in face of the problem of it is also different.With Exemplified by smart mobile phone, body is more and more lightening, so thickness is fewer and fewer, therefore it is required that camera module will also reach such Thickness, it will not just increase the integral thickness of mobile phone, well imagine, the part in camera module is all in less size etc. What level was processed, therefore the ideal structure designed can not but be produced by way of conventional.In said structure, it usually needs Through hole is formed by the encapsulation part 1, is that the sensitive chip 3 on wiring board 2 provides passage of light, this through hole is commonly designed For vertical flat column, this structure does not have king-sized defect for basic theories in structure, but does not consider real The problem of existing during the volume production production of border.That is, this technology only rests on the manual test stage, actual life can not be but put into Production.More specifically, packaging technology is required for mould, reference picture 1B and Fig. 1 C, when the forming blocks 4 of the upper mould of mould are During vertical flat column, in moulding process, in the position that upper mould and the encapsulation part formed are in contact, in mould separating mold member During material, because upper mould bottom is sharp prismatic so that mould can influence the shape for the encapsulation part 1 that molding is formed in the process of extraction Shape, it is produced deformation, for example produce overlap, in addition when upper mould is pulled out and departs from encapsulation part, the outside of upper die forming block 4 Face can produce larger frictional force therebetween with encapsulation part 1 always, this to influence so as to may also damage encapsulation part 1 Large scale industry field be able to may be ignored, but in the fine-grained production field of this small size of camera module, but as one Individual vital influence factor, so the through hole theoretical construct of vertical flat column is feasible, unsuitable volume production is implemented.
Secondly, camera module is a kind of optical electron device, and light is an important factor for determining image quality.Reference picture 1D, in conventional stent assembling mode, the support 5 being installed on wiring board needs the installing space 6 of reserved electronic component, because This formed in concave space, the presence in this space improves the size of camera module, but after light incidence, seldom direct irradiation in Rack inner wall, therefore the reflection light of rack inner wall is less, does not interfere with the image quality of camera module.And when support is replaced For existing flat column encapsulation part 1 when, reference picture 1E, compared to supporting structure, after the light incidence camera lens of identical incidence angle, The light of reflection will not be produced in supporting structure, and the inwall of encapsulation part 1 can be acted in the structure of integral packaging, and Reflection light is accessible to sensitive chip 3, so as to increase stray light so that and the image quality of camera module reduces, because This from quality of optical imaging for, the structure of the through hole of the side's of being formationed shape post is simultaneously not suitable for input and applied in encapsulation part 1.
Finally, the installation part such as camera lens or motor is usually required when being assembled into camera module, in encapsulation part 1, therefore is sealed Dress portion 1 needs to meet certain structural strength, therefore, it is necessary to which luminous flux, structural strength, light is anti-during setting 1 shape of encapsulation part Penetrate rate, conveniently stripped and prevent that being stripped numerous aspects such as damage to encapsulation part 1 takes into consideration to design, and existing encapsulation part 1 structure is not obviously taken these factors into consideration.
The content of the invention
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein described Camera module includes the molding photosensory assembly formed by moulding technology, wherein the molding photosensory assembly can pass through shaping mould Has molded Process Planning modelling volume production experiment.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein described Molding photosensory assembly includes a circuit board, a photo-sensitive cell and is shaped in the one of the circuit board and the photo-sensitive cell Molded base, the molded base form an optical window, wherein the optical window is not flat column of the prior art, so made In technique, reduce damage of the optical window forming blocks of a molding tool to the molded base, and be easy to optical window forming blocks Extract.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein described Being formed between at least a portion and optical axis direction that molded base integrally extends from the photo-sensitive cell has convenience at an acute angle One first inclination angle of the demoulding, after moulding technology forms the molded base, the optical window forming blocks smooth can be extracted, and be subtracted The small and friction of the molded base, to enable the molded base to maintain the original state as far as possible, reduce the optical window shaping The influence that block is brought when extracting.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein described At least a portion medial surface and optical axis for the molded base that the top surface of molded base from the photo-sensitive cell integrally extends Angle be defined as first inclination angle so that the light for being incident to the medial surface is not easy to reach the photo-sensitive cell, Reduce influence of the veiling glare to image quality.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein described The angle at least direction of a lateral surface and optical axis is that conveniently stripped at an acute angle one second tilts in the lateral surface of molded base Angle, when being manufactured by the mould, the spacing block of the mould subtracts in the outside extraction of the molded base Friction between on the outside of the spacing block of the small mould and the molded base, so that the molded base The lateral surface is maintained the original state as far as possible, and the spacing block of the mould is easily extracted.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein described There is the inclined Part I medial surface from photo-sensitive cell extension successively on the inside of molded base, extend described first One Part II medial surface of portion of medial side, and obliquely extend the Part III inner side of the Part II medial surface Face, the angle of the Part III medial surface and optical axis are defined as one the 3rd conveniently stripped inclination angle, so as in the shaping When the optical window forming blocks of mould are pulled out, reduce between the base portion of the optical window forming blocks and the inner side on the molded base top Friction, the Part II medial surface for obtaining the molded base maintains the original state as far as possible, and the mould is described Mould is easily extracted.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein described First inclination angle is within a predetermined range, convenient to extract and do not damage the lead for connecting the photo-sensitive cell and the circuit board.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein being molded Mould bottom side is usually provided with one layer of layers of elastomeric film, these inclination angle on-right angles, so as to prevent that the film layer is punctured.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein described Molded base has a top side face, the angular dimension at first, second, and third inclination angle within a predetermined range, it is convenient described in The extraction of optical window forming blocks and the spacing block, be unlikely to make the size of the top side face too small again and can not be to driver or mirror Head provides firm installation region.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein described The angular dimension at first, second, and third inclination angle within a predetermined range, facilitates the extraction of the optical window forming blocks, it is convenient described in The extraction of optical window forming blocks, and can is enough to provide firm installation region to optical filter or optical filter microscope base.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein described Molded base forms the visual field and angle incidence range for gradient optical window, increasing light flux, meeting the photo-sensitive cell Requirement.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method, wherein each institute State draft angle and be equipped with predetermined angular range, ensure structural strength, light reflectance and the reduction demoulding of the molding Friction.
In order to realize at least one goal of the invention of the above, an aspect of of the present present invention provides a molding photosensory assembly, molding sense Optical assembly, applied to a camera module, it includes an at least circuit board, at least a photo-sensitive cell, and an at least molded base, institute It is joined integrally by moulding technology and the circuit board and the photo-sensitive cell to state molded base, wherein the molded base is formed An at least optical window, the optical window and the photo-sensitive cell position correspondence, and the molded base is integral from the photo-sensitive cell At least a portion medial surface of extension obliquely extends.
In certain embodiments, the optical axis of at least a portion medial surface of the molded base and the camera module Corner dimension between straight line is 10 °~80 °.
In certain embodiments, the molded base has from a non-photo-sensing area one of a top surface of the photo-sensitive cell The medial surface that body extends linearly, obliquely extend so as to whole medial surfaces of the molded base, the molding base There is an inclination angle that is conveniently stripped and avoiding veiling glare between the medial surface of seat and the optical axis straight line of the camera module α, wherein α magnitude range are 10 °~80 °.Such as it is selected from 10 °~30 °, 30 °~45 °, 45 °~55 ° or 55 °~80 °.
In certain embodiments, by one group of lead conducting connection between the photo-sensitive cell and the circuit board, wherein When the routing connected mode of the lead is from the photo-sensitive cell towards the circuit board, α numerical value is selected from 10 °~55 °.
In certain embodiments, by one group of lead conducting connection between the photo-sensitive cell and the circuit board, wherein When the routing connected mode of the lead is from the circuit board towards the photo-sensitive cell, α numerical value is selected from 10 °~88 °.
In certain embodiments, the molded base has the lateral surface integratedly extended linearly from the circuit board, There is a conveniently stripped inclination angle γ between the lateral surface of wherein described molded base and the optical axis straight line of the camera module, Wherein γ magnitude range is 3 °~45 °.Such as selected from 3 °~15 °, 15 °~30 °, or 30 °~45 °.
In certain embodiments, the molded base has a top side groove on top, and the molded base has bending One medial surface of extension, it includes the Part I medial surface integratedly extended successively, a Part II medial surface and one the Three parts medial surface, the Part I medial surface integrally obliquely extend a non-sense of a top surface of the photo-sensitive cell Light area, the Part III medial surface integrally obliquely extends the Part II medial surface, wherein in the Part II Side and the Part III medial surface define to form the top side groove.
In certain embodiments, it is convenient to have between the Part I medial surface and the optical axis straight line of the camera module An inclined angle alpha of veiling glare is stripped and avoids, wherein α magnitude range is 10 °~80 °, the Part III medial surface and institute Stating between the optical axis straight line of camera module has an angle of inclination beta that is conveniently stripped and avoiding veiling glare, and wherein β magnitude range is 3 °~30 °.
In certain embodiments, α numerical value be selected from 10 °~30 °, 30 °~45 °, 45 °~55 ° or 55 °~80 °, wherein β Numerical value be selected from 3 °~15 °, 15 °~20 ° or 20 °~30 °.
In certain embodiments, the Part II medial surface is based on parallel with the top surface of the photo-sensitive cell.
In certain embodiments, the molding photosensory assembly also has one or more driver pin grooves, wherein defining Have conveniently stripped one between the pin trough wall surface of each driver pin groove and the optical axis straight line of the camera module Inclination angle δ, wherein δ magnitude range are 3 °~30 °.
In certain embodiments, the molding photosensory assembly also includes an at least optical filter, the optical filter and the sense Optical element is superimposed, and the molded base is integratedly in package shape in the optical filter, the photo-sensitive cell and the circuit board.
In certain embodiments, the outside of at least outer peripheral face in the lateral surface of the molded base, it is described The substrate of circuit board leaves the pressing distance W for being easy to pressing at least spacing block that a molding has in moulding technology, and it is counted Value scope is 0.1~0.6mm.
In certain embodiments, reflectivity of the material surface of the molded base in range of light wavelengths 435-660nm Less than 5%.
The optical window cross-sectional configuration of the present invention into gradually big trapezoidal or multistage trapezoidal from the bottom to top, with it is conveniently stripped, The damage to molded base is prevented, veiling glare is avoided and prevents in moulding technology to connecting the photo-sensitive cell and the circuit The damage of the lead of plate.
The present invention also provides a camera module, and it includes an at least camera lens and above-mentioned at least one molding photosensory assembly, institute Stating molding photosensory assembly includes an at least circuit board, at least a photo-sensitive cell, and an at least molded base, the molded base and leads to Cross moulding technology and the circuit board and the photo-sensitive cell are joined integrally, wherein the molded base forms an at least optical window, The optical window is that the photo-sensitive cell and the camera lens mention a passage of light, and the molded base is from the photo-sensitive cell At least a portion medial surface integrally extended obliquely extends.
In certain embodiments, the molding photosensory assembly also includes an at least optical filter, the optical filter and the sense Optical element is superimposed, and the molded base is integratedly in package shape in the optical filter, the photo-sensitive cell and the circuit.
In certain embodiments, it also includes an at least optical filter, and the optical filter is installed on the top of the molded base End.
In certain embodiments, it also includes an at least optical filter, and the optical filter is installed on the institute of the molded base State top side groove.
In certain embodiments, it also includes at least an optical filter microscope base and at least an optical filter, the optical filter installation In the optical filter microscope base, the optical filter microscope base is installed on the top of the molded base.
In certain embodiments, it also includes an at least driver, and the driver is installed on the top of the molded base Side so that the molded base supports the driver, wherein the camera lens be installed in the driver it is automatic right to realize It is burnt.
In certain embodiments, it also includes an at least barrier element in a ring, to prevent mould in the moulding technology Moulding material reaches a photosensitive area of the photo-sensitive cell.
In certain embodiments, multiple camera modules are assembled into an array camera module.
In certain embodiments, the molding photosensory assembly includes multiple photo-sensitive cells and has multiple light Window, so as to form an array camera module with multiple camera lenses.
The present invention also provides an electronic equipment, and it includes above-mentioned one or more camera modules.The electronics is set Standby including but not limited to mobile phone, computer, television set, intelligence can screw on equipment, the vehicles, camera and supervising device.
The present invention also provides a molding tool, and photosensory assembly is molded applied to make an at least camera module at least one, It includes mutually separating or mutually closely sealed one first mould and one second mould, wherein first and second mould is mutually close An at least forming cavity is formed during conjunction, and the mould is configured with least an optical window forming blocks and position in the forming cavity A pedestal profiled guide slot around the optical window forming blocks, wherein being connected with least one photosensitive yuan when being installed in the forming cavity An at least circuit board for part, it is filled into the moulding material in the pedestal profiled guide slot and undergoes liquid extremely under temperature control function The conversion process of solid-state and curing molding, form a molded base in the position of the corresponding pedestal profiled guide slot, in corresponding institute The position for stating optical window forming blocks forms an optical window of the molded base, wherein the molded base is shaped in the circuit At least a portion non-photo-sensing area of plate and the photo-sensitive cell is to form the molding photosensory assembly of the camera module.
In certain embodiments, the optical window forming blocks along its periphery there is a base interior side surface for tilting extension to be molded Face, for forming the medial surface of the molded base integrated linear extension.
In certain embodiments, there is side between the base interior side surface forming surface of the optical window forming blocks and vertical curve Just the inclination angle being stripped, wherein α magnitude range are 10 °~80 °.
In certain embodiments, the optical window forming blocks include a pressure head portion and integratedly extend the one of the pressure head portion Groove shape, the groove shape has larger internal diameter than the pressure head portion, on the top of the molded base Side forms a top side groove.
In certain embodiments, the pressure head portion is conveniently stripped and keep away along having between the lateral surface and vertical curve of its periphery Exempt from an inclined angle alpha of veiling glare, wherein α magnitude range is 10 °~80 °, lateral surface of the groove shape along its periphery There is an angle of inclination beta between vertical curve, wherein β magnitude range is 3 °~30 °.The photo-sensitive cell and the circuit board it Between by the conducting connection of one group of lead, wherein the routing connected mode of the lead is from the photo-sensitive cell towards the circuit During plate, α numerical value is selected from 10 °~55 °；The routing connected mode of wherein described lead is from the circuit board towards described photosensitive During element, α numerical value is selected from 10 °~88.
In certain embodiments, first mould also includes an at least spacing block, and the spacing block has outside a pedestal Side forming surface, it has a conveniently stripped inclination angle γ between vertical curve, and γ numerical value is selected from 3 °~45 °.
Brief description of the drawings
The structural representation of the photosensory assembly of Figure 1A existing process encapsulation.
Figure 1B is the forming process schematic diagram of existing photosensory assembly.
Fig. 1 C are the knockout course schematic diagrames of photosensory assembly in existing integral packaging technique
The camera module light path schematic diagram that Fig. 1 D tradition COB modes encapsulate.
The camera module light path schematic diagram of the existing integral packaging modes of Fig. 1 E.
Fig. 2 is the manufacturing equipment according to the molding photosensory assembly of the camera module of first preferred embodiment of the present invention Block diagram representation.
Fig. 3 A are the perspective exploded views according to the camera module of first preferred embodiment of the present invention.
Fig. 3 B are the section views along its length according to the camera module of above-mentioned first preferred embodiment of the present invention Figure.
Fig. 4 is shown according to the solid of the molding photosensory assembly of the camera module of above-mentioned first preferred embodiment of the present invention It is intended to.
Fig. 5 is the molding photosensory assembly according to the camera module of above-mentioned first preferred embodiment of the present invention along Fig. 4 The schematic cross-sectional view of line A-A.
Fig. 6 is side of the signal according to the molding photosensory assembly of the camera module of above-mentioned first preferred embodiment of the present invention The close-up schematic view at the inclination angle being just stripped.
Fig. 7 is illustrated according to the effect for avoiding veiling glare of the camera module of above-mentioned first preferred embodiment of the present invention Figure.
Fig. 8 A illustrate the shaping of the molding photosensory assembly of above-mentioned first preferred embodiment according to the present invention Sectional view during liquid molding material propulsion pedestal profiled guide slot, the wherein sectional view are corresponded in Fig. 4 illustrate in mould Line A-A direction sectional view.
Fig. 8 B illustrate the manufacture of the molding photosensory assembly of above-mentioned first preferred embodiment according to the present invention Cut open in the line A-A direction in Fig. 4 that corresponds to in the mould of equipment performing molded step and forming molded base View.
Fig. 8 C are the molding photosensory assemblies for above-mentioned first preferred embodiment invented according to this hair molded Later knockout course schematic diagram.
Fig. 9 signals are real according to another deformation of the molding photosensory assembly of above-mentioned first preferred embodiment of the present invention Apply the structural representation of mode.
Figure 10 is the perspective exploded view according to the camera module of second preferred embodiment of the present invention.
Figure 11 is the section view along its length according to the camera module of above-mentioned second preferred embodiment of the present invention Figure.
Figure 12 is a variant embodiment according to the camera module of above-mentioned second preferred embodiment of the present invention Sectional view.
Figure 13 is the solid according to the molding photosensory assembly of the camera module of above-mentioned second preferred embodiment of the present invention Schematic diagram.
Figure 14 is the molding photosensory assembly according to the camera module of above-mentioned second preferred embodiment of the present invention along Figure 13 The schematic cross-sectional view of middle line C-C.
Figure 15 is molding photosensory assembly of the signal according to the camera module of above-mentioned second preferred embodiment of the present invention The close-up schematic view at conveniently stripped inclination angle.
Figure 16 illustrates the shaping of the molding photosensory assembly of above-mentioned second preferred embodiment according to the present invention Sectional view during liquid molding material propulsion pedestal jigsaw profiled guide slot, the wherein sectional view are corresponded in Figure 13 in mould The sectional view in the line C-C direction of signal.
Figure 17 illustrates the shaping of the molding photosensory assembly of above-mentioned second preferred embodiment according to the present invention Sectional view during liquid molding material propulsion pedestal jigsaw profiled guide slot, the wherein sectional view are corresponded in Figure 13 in mould The sectional view in the line C-C direction of signal.
Figure 18 illustrates the shaping of the molding photosensory assembly of above-mentioned second preferred embodiment according to the present invention Molded step is performed in mould and forms the sectional view for corresponding to E-E lines direction in Figure 13 of molded base jigsaw.
Figure 19 be according to the present invention above-mentioned second preferred embodiment the molding photosensory assembly it is molded with Knockout course schematic diagram afterwards.
Figure 20 is that the molding photosensory assembly made according to the moulding technology of above-mentioned second embodiment of the present invention is spelled The dimensional structure diagram of plate.
Figure 21 is that the molding photosensory assembly made according to the moulding technology of above-mentioned second embodiment of the present invention is spelled The structural representation of the cleaved obtained monomer molding photosensory assembly of plate.
Figure 22 be according to the present invention above-mentioned second embodiment other variant embodiment the molding it is photosensitive The sectional view of component.
Figure 23 is the section view according to the camera module of the other variant embodiment of second preferred embodiment of the present invention Schematic diagram.
Figure 24 is the section view according to the camera module of the other variant embodiment of second preferred embodiment of the present invention Schematic diagram.
Figure 25 is the structural representation for being applied to mobile phone according to the above-mentioned camera module of the present invention.
Figure 26 is photosensitive group of the molding that signal makes according to the moulding technology of above-mentioned second embodiment of the present invention The close-up schematic view at the conveniently stripped inclination angle of first example of part.
Figure 27 is photosensitive group of the molding that signal makes according to the moulding technology of above-mentioned second embodiment of the present invention The close-up schematic view at the conveniently stripped inclination angle of second example of part.
Figure 28 is photosensitive group of the molding that signal makes according to the moulding technology of above-mentioned second embodiment of the present invention The close-up schematic view at the conveniently stripped inclination angle of the 3rd example of part.
Figure 29 is photosensitive group of the molding that signal makes according to the moulding technology of above-mentioned second embodiment of the present invention The close-up schematic view at the conveniently stripped inclination angle of the 4th example of part.
Figure 30 is photosensitive group of the molding that signal makes according to the moulding technology of above-mentioned second embodiment of the present invention The close-up schematic view at the conveniently stripped inclination angle of the 5th example of part.
Figure 31 is photosensitive group of the molding that signal makes according to the moulding technology of above-mentioned second embodiment of the present invention The close-up schematic view at the conveniently stripped inclination angle of the 6th example of part.
Figure 32 is photosensitive group of the molding that signal makes according to the moulding technology of above-mentioned second embodiment of the present invention The close-up schematic view at the conveniently stripped inclination angle of the 7th example of part.
Embodiment
Describe to be used to disclose the present invention below so that those skilled in the art can realize the present invention.It is excellent in describing below Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Define in the following description General principle of the invention can apply to other embodiments, deformation program, improvement project, equivalent and do not carry on the back From the other technologies scheme of the spirit and scope of the present invention.
It will be understood by those skilled in the art that the present invention exposure in, term " longitudinal direction ", " transverse direction ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the orientation of the instruction such as " outer " or position close System is to be based on orientation shown in the drawings or position relationship, and it is for only for ease of the description present invention and simplifies description, without referring to Show or imply that the device of meaning or element there must be specific orientation, with specific azimuth configuration and operation, therefore above-mentioned art Language is not considered as limiting the invention.
It is understood that term " one " be interpreted as " at least one " or " one or more ", i.e., in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no It is understood that as the limitation to quantity.
It is the camera module according to first preferred embodiment of the present invention as shown in Fig. 1 to Fig. 8 C.The camera module It can be applied to various electronic equipments, citing ground but be not limited to smart mobile phone, wearable device, computer equipment, television set, friendship Logical instrument, camera, supervising device etc., the camera module coordinates the electronic equipment to realize the IMAQ to destination object And reproduction.
More specifically, the molding photosensory assembly 10 and its manufacturing equipment 200 of the camera module 100.The molding sense Optical assembly 10 includes a circuit board 11, a molded base 12 and a photo-sensitive cell 13.The wherein molded base 12 of the invention By the unitary packed of manufacturing equipment 200 on the circuit board 11 and the photo-sensitive cell 13, so as to the molding Pedestal 12 can replace the microscope base or support of traditional camera module, and need not be needed in similar conventional package technique by microscope base Or support is attached at circuit board by glue.
The camera module 100 further includes a camera lens 30.Wherein described molded base 12 includes an annular and molded Main body 121 and it is middle there is an optical window 122, with to the camera lens 30 and the photo-sensitive cell 13 one passage of light of offer.Institute State photo-sensitive cell 13 and be operatively connected to the circuit board 11, will such as by way of COB (Chip On Board) plays lead The photo-sensitive cell 13 is connected to the circuit board 11 and positioned at the top side of the circuit board 11.The photo-sensitive cell 13 and described Camera lens 30 is assembled in the both sides of the molded base 12 respectively, and optical alignment arrange, make the light through the camera lens 30 Line can reach the photo-sensitive cell via the optical window 122, so as to make the shooting mould after photoelectric conversion acts on Group 100 is able to provide optical imagery.
As shown in Figure 3 A and Figure 3 B, the camera module 100 can have a driver 40 such as voice coil motor, piezoelectricity horse Up to the dynamic burnt camera module waited, the camera lens 30 is installed on the driver 40.The molded base 12 can be used for supporting institute State driver 40.The top side of the molded base 12 is also provided with an optical filter 50, for being filtered through the camera lens 30 light, such as can be cutoff filter.In this embodiment in accordance with the invention and in accompanying drawing, with dynamic burnt shooting mould Exemplified by group, illustrate a kind of mode that the present invention can be carried out, but be not limitation, in other embodiments of the invention, The camera lens 30 can be installed in the molding photosensory assembly 10, without the driver 40, that is to say, that form one Focus module, those skilled in the art it should be appreciated that the type of the camera module be not the present invention limitation, institute It can focus camera module to state camera module 100, or moves burnt camera module.
The circuit board 11 includes a substrate 111, and be formed at the substrate 111 such as mounted by SMT techniques it is more Individual electronic component 112, the electronic component 112 include but is not limited to resistance, electric capacity, driving element etc..The present invention's In this embodiment, the molded base 12 is integratedly coated on the electronic component 112, so as to prevent similar tradition shooting Dust, debris are adhered on the electronic component 112 in module, and further pollute the photo-sensitive cell 13, so as to Influence imaging effect.It is understood that in other variant embodiment, it is also possible to buried in the electronic component 112 In the substrate 111, i.e., described electronic component 112 can be not exposed to outer.The substrate 111 of the circuit board 111 can be PCB hardboards, PCB soft boards, Rigid Flex, ceramic substrate etc..It is noted that in this preferred embodiment of the present invention In, because the molded base 12 can coat these electronic components 112 completely, electronic component 112 can not be interior The substrate 111 is embedded in, the substrate 111 is only used for forming conducting circuit, so that the final obtained molding is photosensitive It is smaller that component 10 is able to thickness.
In this preferred embodiment of the present invention, it is described that the photo-sensitive cell 13 is superimposed on being located at for the circuit board 11 The smooth congruent region of the inner side of electronic component 112, and molded technique will be in the circuit board 11 and the photosensitive member The molded base 12 is integrally formed on part 13, i.e., described molded base 11 and the circuit board 11 and the photo-sensitive cell 13 integratedly combine.The photo-sensitive cell 13 has a top surface 131, and the top surface 131 has the photosensitive region in center 1311 and around the non-photo-sensing region 1312 of the photosensitive region 1311.The molded base 12 is integratedly coated at least one Divide the non-photo-sensing region 1312 and the circuit board 11.
Further, as shown in Fig. 2 the manufacturing equipment 200 of the molding photosensory assembly 10 of the camera module 100 Including a molding tool 210, a moulding material feeding machanism 220, a die fixture 230, a temperature control device 250 and a control Device 260 processed, the moulding material feeding machanism 220 are used to provide the moulding material 14 to the pedestal profiled guide slot 215.Institute Die sinking and matched moulds that die fixture 230 is used to control the mould 210 are stated, the temperature control device 250 is used for institute State moulding material 14 to be heated or cooled, the controller 260 is used to automatically control the moulding material in moulding technology Feeding machanism 220, the die fixture 230, and the operation of the temperature control device 250.
The mould 210 is included in can mold in the presence of the die fixture 230 with matched moulds one One mould 211 and one second mould 212, i.e., described die fixture 230 can be by first mould 211 and described second The phase of mould 212 separates forms a forming cavity 213 with mutually closely sealed, and in matched moulds, the circuit board 11 is fixed on the forming cavity 213 The interior and liquid moulding material 14 enters the forming cavity 213, so as to be shaped on the circuit board 11, And the molded base 12 being shaped on the circuit board 11 and the photo-sensitive cell 13 is formed after cured.
More specifically, the shaping module 210 further includes an optical window forming blocks 214 and with formation described A pedestal profiled guide slot 215 around optical window forming blocks 214, it is described in first and second mould 211 and 212 matched moulds Optical window forming blocks 214 and the pedestal profiled guide slot 215 are extended in the forming cavity 213, and the liquid molding Material 14 is populated into the pedestal profiled guide slot 215, and the position of the corresponding optical window forming blocks 214 is unable to liquid filling body The moulding material 14 of shape, so as in the position of the corresponding pedestal profiled guide slot 215, the liquid moulding material 14 The annular molded body 121 of the molded base 12 can be formed after cured, and in the corresponding optical window forming blocks 214 Position can form the optical window 122 of the molded base 12.The moulding material 14 can select but be not limited to nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene), asphalt mixtures modified by epoxy resin Fat etc..
First and second mould 211 and 212 can produce two moulds of relative movement, in two moulds It is one of fixed, another is removable；Or two moulds are all removable, the present invention is not so limited in this respect. In the example of this embodiment of the present invention, first mould 211 is tangibly embodied as mould in a fixation, and described second Mould 212 is embodied as a removable lower mould.Mould and the removable lower mould are coaxially set in the fixation, such as described removable Lower mould can along multiple locating shaft upward slidings, with can be formed during the fixed Ccope closing machine tight closure it is described into Die cavity 213.
Second mould 212 is that the lower mould can have a circuit board locating slot 2121, its can in groove-like or Formed by locating dowel, for installing and fixing the circuit board 11, and the optical window forming blocks 214 and pedestal shaping are led Groove 215 can be formed in first mould 211, that is, forms the mould on described, when first and second mould 211 and 212 During matched moulds, the forming cavity 213 is formed.And the liquid moulding material 14 is injected into the top side of the circuit board 11 The pedestal profiled guide slot 215, so as to form the molded base in the top side of the circuit board 11 and the photo-sensitive cell 13 12。
It is understood that the circuit board locating slot 2121 can also be arranged at first mould 211 it is i.e. described on Mould, for installing and fixing the circuit board 11, and the optical window forming blocks 214 and the pedestal profiled guide slot 215 can be with shapes Into in second mould 211, when first and second mould 211 and 212 matched moulds, the forming cavity 213 is formed.It is described Circuit board 11 on described in mould can just facing to ground arrange, and the liquid moulding material 14 be injected into it is inverted The pedestal profiled guide slot 215 of the bottom side of the circuit board 11, so as to form institute in the bottom side of the inverted circuit board 11 State molded base 12.
More specifically, in the matched moulds of the first and second mould 211 and 212 and when performing molding step, the optical window into Type block 214 is superimposed on the photosensitive region 1311 of the top surface 131 of the photo-sensitive cell 13 and is brought into close contact, so as to liquid institute State the photosensitive region of the top surface 131 for the photo-sensitive cell 13 that moulding material 14 is prevented from entering on the circuit board 11 1311, so as to which the optical window of the molded base 12 can be ultimately formed in the position of the corresponding optical window forming blocks 214 122。
It is understood that the forming surface that first mould 211 forms the pedestal profiled guide slot 215 can be configured to Burnishing surface, and it is in same plane, so when 12 curing molding of molded base, the top table of the molded base 12 Face is more smooth, so as to be the driver 40, the smooth peace of other load bearing components offer of the camera lens 30 or the camera lens Dress condition, reduce the heeling error of the camera module 100 after assembling.
It is noted that the pedestal profiled guide slot 215 and the optical window forming blocks 214 can be with integrally formed in institute State the first mould 211.Can also be that first mould 211 further includes dismountable molding structure, the shaping knot It has been configured to the pedestal profiled guide slot 215 and the optical window forming blocks 214.So, according to photosensitive group different of the moldings The diameter and thickness of molded base, can design the described of different shape and size described in the shape and size requirement such as of part 10 Pedestal profiled guide slot 215 and the optical window forming blocks 214.So, it is only necessary to replace different molding structures, you can so that described Manufacturing equipment is suitably applied the molding photosensory assembly 10 of different size requirement.It is understood that second mould 212 can also correspondingly include dismountable fixed block, to provide the groove 2121 of different shape and size, so as to convenient Change the circuit board 11 for adapting to different shape and size.
It is understood that the moulding material 14 can be heat-fusible materials such as thermoplastic material, by described Heat-fusible materials heating fusing in solid-state is become the liquid moulding material 14 by temperature control device 250.In the molding During shaping, the moulding material 14 of hot melt is able to curing molding by the process of cooling.The moulding material 14 can also be thermosets, by the way that the thermosets heating fusing in solid-state is become into the liquid moulding material 14.It is described it is molded during, the heat cured moulding material 14 solidifies by further heating process, and And can no longer melt after hardening, so as to form the molded base 12.
It is understood that in the moulding technology of the present invention, the moulding material 14 can be block, particle Shape or powdered, becomes liquid after its heated effect in the mould 210, then again it is cured so as to Form the molded base 12.
It is understood that in this embodiment, illustrate the moulding technology of a circuit board 11, in the application, Moulding technology can also be carried out to multiple independent circuit boards 11 simultaneously.Or hereinafter second reality can also be used Apply the jigsaw operation mentioned in example.
It is the mould according to the camera module 100 of this preferred embodiment of the present invention as shown in Fig. 8 A to Fig. 8 C The manufacturing process schematic diagram of photosensory assembly 10 is moulded, as shown in Figure 8 A, the mould 210 is in matched moulds state, to be molded The circuit board 11 and the moulding material 14 of solid-state are secured in position, and the moulding material 14 of solid-state is heated, so that will The moulding material 14 is admitted to the pedestal profiled guide slot 215 when being molten into liquid condition or semi-solid state, and reaches institute State around optical window forming blocks 214.
As shown in Figure 8 B, when being stuffed entirely with the liquid moulding material 14 in the pedestal profiled guide slot 215, The liquid curing molding of the moulding material 14 is set to be formed in one in the circuit board 11 and described by solidification process again The molded base 12 of photo-sensitive cell 13.So that the moulding material 14 is thermosets as an example, it is heated fusing and is in liquid The moulding material 14 of body shape passes through heating process again, so as to curing molding.
As shown in Figure 8 C, after the moulding material 14 is formed by curing the molded base 12, the demoulding of the present invention is performed Journey, i.e., described die fixture 230 are located remotely from each other first and second mould 211 and 212, so described optical window shaping Block 214 leaves the molded base 12, makes to form the optical window 122 in the molded base 12.
In the prior art, as shown in Figure 1B, the bottom of forming blocks 4 of flat column has sharp rib, during withdrawing pattern, Sharp rib can produce larger friction with the medial surface of encapsulation part 1, so as to damage the medial surface of encapsulation part 1.And in this hair In bright, the structure of the optical window forming blocks 214 of the invention, it will not cause to damage the molded base 12.
More specifically, in this embodiment of the present invention, as shown in Fig. 8 A to Fig. 8 C, the optical window forming blocks 214 are cut Face is tapered, i.e., described optical window forming blocks 214 are cone-shaped such as frustum, is solid inside it, it is also possible to hollow, i.e. class Like a hollow cap, it can be located on the photo-sensitive cell 13 to facilitate follow-up moulding technology.
In this example of the present invention, it is solid construction, and the optical window forming blocks 214 have a pressure of bottom side Conjunction face 2141, and the periphery forming surface extended linearly around direction extension, to be used as a base interior side surface forming surface 2142.Angle between base interior side surface forming surface 2142 and vertical curve is the first inclined angle alpha, and it is not of the prior art 0 The angle of degree, but acute angle.More specifically, the magnitude range of first angle α is preferably 10 °~80 °, it is highly preferred that 30 ° ~55 °.
It is understood that as shown in Figure 5 and Figure 6, in the molding sense of this camera module 100 of the present invention The molded body 121 of the molded base 12 of optical assembly 10 has the medial surface 124 extended linearly, the medial surface 124 and it is described molding photosensory assembly 10 the photo-sensitive cell 13 optical axis Y rectilinear direction between there is an equal amount of institute State the first inclined angle alpha.
The size of the numerical value of first angle α is not to be the bigger the better, as shown in fig. 6, the photo-sensitive cell 13 passes through One group of electric connection structure is connected with the circuit board 11.More specifically, the electric connection structure includes being located at the photosensitive member The one photo-sensitive cell terminal pad 132 in the non-photo-sensing area 1312 of part 13, located at the one of the substrate 111 of the circuit board 11 Circuit board terminal pad 113, and the lead extended between photo-sensitive cell terminal pad 132 and the circuit board terminal pad 113 15, so as to realize that the conducting of the photo-sensitive cell 13 and the circuit board 11 connects.The lead 15 citing ground but it is not limited to gold Line, silver wire, copper cash and aluminum steel etc..The shape of the photo-sensitive cell terminal pad 132 and the circuit board terminal pad 113 can be lifted Example ground but it is not limited to box-shaped, it is spherical etc..In order to which in molding process planning, the optical window forming blocks 214 are pressed on the sense During optical element, the optical window forming blocks 214 are unlikely to damage the lead 15 by pressure and cause the fracture of the lead 15, the optical window The base interior side surface forming surface 2142 of forming blocks 214 must not exceed the peak of the lead 15.And according to routing The difference of mode, the greatest measure of first angle α are also had any different, will also be further specific in specific example below Analysis.
As shown in Figure 8 A, the section of the optical window forming blocks 214 is trapezoidal in gradually increasing from the bottom to top, correspondingly, shape Into the section of the optical window 122 of the molded base 12 gradually increase trapezoidal, the molded base in being open from the bottom to top 12 medial surface 124 not with and the preferred scope of first angle α be 10 °~80 °, it is highly preferred that 30 °~ 55 °, thus it is conveniently stripped, the lead 15 will not be damaged again.And the molded base 12 of the trapezoidal shape in section is described Optical window 122 can save material, and can proof strength.
It is noted that the selection of the magnitude range of the first angle α of the present invention, additionally it is possible to be effectively prevented from spuious Light.In the camera module of existing molded packages, reference picture 1E, light is incident by camera lens, and some light reaches described photosensitive Chip carries out the vertical inwall that photosensitization, another part light, such as Fig. 1 D light L are projected to the encapsulation part 1, The sensitive chip 3 is reached after being easy to the inwall reflection by the encapsulation part 1, is participated in the light of the sensitive chip 3 Among electric conversion process, so as to have impact on the image quality of the camera module.And according to an embodiment of the invention, reference picture 7, Light is incident by the camera lens, and some light reaches the photo-sensitive cell 13, another part light, such as the light in same direction M is projected to the medial surface 124 of the inclined molded base 12, anti-by the medial surface 124 of the molded base 12 Penetrate, so that the reflection light, without reaching the photo-sensitive cell 13, participates in the sense away from the photo-sensitive cell 13 The photosensitization of optical element 13, therefore reduce influence of the reflection veiling glare to the image quality of the camera module.
It is noted that in the present invention, the material surface of the molded base 12 is in range of light wavelengths 435- 660nm reflectivity is less than 5%.That is, the light on most of surface for being incident to the molded base 12 can not be anti- The interference veiling glare for reaching the photo-sensitive cell 13 is penetrated and is formed, so as to significantly decrease the influence of reflection veiling glare.
In addition, as shown in FIG., the molded base 12 has the medial surface 124 along its interior circumferential direction, along its periphery side To lateral surface 125 and annular top side face 126.The medial surface 124 integratedly extends the top table of the photo-sensitive cell 13 Face 131, the lateral surface 125 integratedly extend the top surface 1111 of the substrate 111 of the circuit board 11.The shaping First mould 211 of mould 210 is further provided with one or more spacing blocks 216, for the shape in moulding technology Into the lateral surface 125 of the molded base 12.More specifically, the spacing block 216 has a pedestal lateral surface forming surface 2161, to determine the lateral surface for the molded base 12 for being solidified to form the moulding material 14 in moulding technology 125 location and shape.There is a top side face forming surface 217 between the spacing block 216 and the optical window forming blocks 214, with Determine the position of the top side face 126 for the molded base 12 for being solidified to form the moulding material 14 in moulding technology Put and shape.In the prior art, the lateral surface of encapsulation part 1 is also vertical with wiring board, i.e., outside the pedestal of the spacing block of mould Vertically, so as to during demoulding, the pedestal lateral surface forming surface of mould is outer with encapsulation part 1 always for side forming surface Side rubs, and so as to inconvenient stripping operation, and also easily damages the lateral surface of the encapsulation part 1 formed.
And in the present invention, the pedestal lateral surface forming surface 2161 has one second inclination angle γ with vertical direction, institute Stating has an equal amount of second inclination angle γ, i.e. institute between the lateral surface 125 of molded base 12 and optical axis Y-direction State molded base 12 it is horizontally disposed when, between the lateral surface 125 and vertical curve of the molded base 12 have described second Inclination angle γ.Described to be stripped for convenience, the angle is acute angle, and in order that the top side face of the molded base 12 126 have enough sizes, and to facilitate the completion of the follow-up camera lens 30 or the driver 40, the second inclination angle γ is not Can be too big.If that is, the second inclination angle γ is too big, and the medial surface 124 of the molded base 12 and institute State that lateral surface 125 is all inclined, the length of its top side face 126 can be caused too small, it is impossible to be firmly installed the camera lens 30 Or the driver 40.In addition in this embodiment, the bottom of the driver 40 has binding face, and it fits in the mould Mould the top side face 126 of pedestal 12, when the size of the top side face 126 of the molded base 12 is too small, such as less than described patch During conjunction face, may result in the driver 40 is inconvenient to align installation, and is installed on the mould in the driver 40 Mould pedestal 12 the top side face 126, may rock and built on the sand, it is impossible to shatter-resistant anticollision.Therefore, in the present invention, it is described The numerical value maximum of second inclination angle γ angle is preferably no more than 45 °.In addition, its minimum value is conveniently being capable of moulding technology Stripping operation and can facilitates the processing and fabricating of the mould 210, therefore, in the present invention, the angle of the second inclination angle γ The numerical value minimum value of degree is preferably not less than 3 °.Therefore, the second inclination angle γ of the invention optimum range is 3 °~45 °, More preferably 3 °~15 °.It is noted that as shown in figure 5, for convenience of the demoulding and the base to the circuit board 11 The pressing of plate 111, the substrate 111 of the lateral surface 125 of the molded base 12 after shaping and the circuit board 11 Outer edge can form a pressing distance W, i.e., in mould the first day of the lunar month technique, be adapted to the spacing block 216 be pressed together on the circuit board 11 The substrate 111 on region, it is the lateral surface 125 of the molded base 12 from the base of the circuit board 11 The position that plate 111 integrally extends and the distance of the outer edge of the substrate 111 of the circuit board 11, such as this pressing distance W can be 0.1~0.6mm, and such as in a specific example, this pressing distance W can be 0.2mm.
It is understood that due to first inclined angle alpha of above range and the second inclination angle γ, i.e. institute be present The medial surface 124 and the lateral surface 125 for stating molded base 12 have gradient, so that in the demoulding, with described first Frictional force between mould 211 reduces, and easily extracts, so that the molded base 12 obtains preferable completed state.More specifically Ground, as seen in fig. 8 c, after moulding technology forms the molded base 12 of solidification, when starting stripping operation, the optical window Forming blocks 214 and the spacing block 216 start to move straight up, the base interior side surfaces of the optical window forming blocks 214 into The pedestal lateral surface forming surface 2161 of type face 2142 and the spacing block 216 is described interior with the molded base 12 respectively Side 124 and the lateral surface 125 separate, so as to the He of base interior side surface forming surface 2142 of the optical window forming blocks 214 The pedestal lateral surface forming surface 2161 of the spacing block 216 respectively will not be with the medial surface of the molded base 12 124 and the phase CONTACT WITH FRICTION of the lateral surface 125 and damage the medial surface 124 of the molded base 12 and the lateral surface 125, while and can facilitates it smoothly to extract.
Meanwhile the mould 210 forms the shape of the pedestal profiled guide slot 215, does not have rectangular dead angle, properly The gradient so that flow-like the moulding material 14 enter the pedestal profiled guide slot 215, mobility is more preferable.Also, It is acute angle in first inclined angle alpha and the second inclination angle γ, rather than right angle of the prior art, so as to the molding The folder of the top surface 131 of the photo-sensitive cell 13 of photosensory assembly 10 and the medial surface 124 of the molded base 12 Angle becomes more mellow and full obtuse angle, and the optical window forming blocks 214 and the spacing block 216 will not form sharp corner angle and scratch The medial surface 124 and the lateral surface 125 of the molded base 12.Moreover, the setting of the scope of first inclined angle alpha The molded base 12 is enabled to avoid the image quality of camera module 100 described in stray light.
As shown in figure 9, according to other variant embodiment, the filter element 50 can be folded with the photo-sensitive cell 13 Close, then formed again by the moulding technology of the present invention and be integrated in the filter element 50, the photo-sensitive cell 13 and institute State the molded base 12 of circuit board 11.
It is the molding sense according to the camera module 100 of second embodiment of the present invention as shown in Figure 10 to 21 Optical assembly 10 and its manufacturing process.In this embodiment, a molding photosensory assembly jigsaw is made by way of jigsaw operation 1000, then cutting obtains the molding photosensory assembly 10.
Correspondingly, more specifically, the mould 210 forms a forming cavity 213 in matched moulds, and multiple light are provided Window forming blocks 214 and one or more pedestal jigsaw profiled guide slots 2150, its equivalent to provide multiple pedestals for being connected into Type guide groove 215, these pedestal profiled guide slots 215 form the guide groove of an entirety.
Before moulding technology, a multiple-printed-panel for circuit board 1100 is first made, it includes the circuit board 11 of multiple integrally connecteds, and And each circuit board 11 can be connected to the photo-sensitive cell 13 by way of routing connection.
When the multiple-printed-panel for circuit board 1100 for being connected with multiple photo-sensitive cells 13 is placed into the forming cavity 213, And when the mould 210 is in matched moulds state, the moulding material 14 of solid-state, which is heated, melts and is admitted to institute Pedestal jigsaw profiled guide slot 2150 is stated, so as to be filled in around each optical window forming blocks 214.Finally, liquid institute State moulding material 14 and pass through a solidification process, make the liquid mould in the pedestal jigsaw profiled guide slot 2150 Moulding material 14 solidifies and hardened integrally is molded into each circuit board 11 of the multiple-printed-panel for circuit board 1100 and described so as to be formed The molded base 12 on photo-sensitive cell 13, the integral molded base jigsaw 1200 of these shapes of molded base 12.
Be brought into close contact for forming surface and the circuit board 11 and the photo-sensitive cell 13 of first mould 211 and Conveniently stripped, the forming surface of first mould 211 is additionally provided with an elasticity with the circuit board 11 and the photo-sensitive cell 13 Film layer 219.
It is noted that the 1000 cleaved each mould for making obtained monomer of molding photosensory assembly jigsaw Modeling photosensory assembly 10 be used for make dynamic burnt camera module i.e. automatic focusing camera module when, the mould 210 is further Multiple driver pin Slot shaping blocks 218 are provided with, each driver pin Slot shaping block 218 extends into the pedestal Jigsaw profiled guide slot 2150, so as to which in molding process, the liquid moulding material 14 will not fill corresponding each The position of the driver pin Slot shaping block 218, so that after the curing step, photosensory assembly jigsaw 1000 is molded described The molded base jigsaw 1200 in form multiple optical windows 122 and multiple driver pin grooves 127, cleaved making The molded base 12 of each molding photosensory assembly 10 of obtained monomer is able to be configured with the driver pin groove 127, so as to which when making the dynamic burnt camera module 100, the pin 41 of the driver 40 is able to by welding or conducting resinl The modes such as attaching are connected to the circuit board 11 of the molding photosensory assembly 10.
It is understood that the manufacture craft of the molding photosensory assembly 10 relative to the monomer of above-mentioned one embodiment, In jigsaw operation, for formed adjacent two of the two molded bases 12 pedestal profiled guide slot 215 equivalent to Integrally cross together, and multiple optical window forming blocks 214 are set apart from one another by ground, so that the moulding material 14 is final It is able to form an integrally-built molded base jigsaw 1200.
In the step of making molding photosensory assembly 10 of monomer：Can be by the molding photosensory assembly jigsaw 1000 Cutting is to obtain multiple independent molding photosensory assemblies 10, for making the camera module of monomer.Can also be by one Two or more molding photosensory assemblies 10 of connection cut separation from the molding photosensory assembly jigsaw 1000, for system Make split type array camera module, i.e., each camera module of described array camera module each has independent described Photosensory assembly 10 is molded, two of which or multiple molding photosensory assemblies 10 can be connected to the control of same electronic equipment respectively Mainboard processed, two such or multiple molding photosensory assemblies 10 make obtained array camera module can be by multiple shooting moulds The image of group shooting is sent to the control mainboard and carries out Image Information Processing.
As shown in figure 22, the moulding technology of the jigsaw operation, which may also be used for making, has two or more optical windows 122 molding photosensory assembly 10, wherein the array that such molding photosensory assembly 10 can be used for making common substrate is taken the photograph As module.That is, by make it is double take the photograph the molding photosensory assembly 10 of module exemplified by, the multiple-printed-panel for circuit board 1100 it is each For individual circuit board 11 in molding process planning, a circuit board substrate 111 is correspondingly provided with two optical window shapings Block 214, two apart from one another by the optical window forming blocks 214 around be two pedestal integrally connected profiled guide slots 215, this For sample after moulding technology completion, each shared circuit board substrate 111 of the formation of circuit board 11 has two The disjunctor molded base of the optical window 122, it is corresponding that two photo-sensitive cells 13 and two camera lenses 30 are installed.It is and described The substrate 111 of circuit board 11 can be connected to the control mainboard of an electronic equipment, so make and obtain in this embodiment Array camera module the image that multiple camera modules are shot can be sent to the control mainboard carry out Image Information Processing.
As shown in figure 23, according to a variant embodiment, the molded base 12 of moulding technology of the invention can also Further integratedly extend to form a camera lens installation portion 16, have through hole 161 in it, suitable for installing the camera lens 30.It is worth One is mentioned that, the optical window forming blocks 214 and the spacing block 216 are in the position of corner angle only curved chamfered transition, Ke Yili Solve, in above-described embodiment, the optical window forming blocks 214 and the spacing block 216 can also construct in the position of corner angle Into curved chamfered transition, in order to avoid the damage to the molded base 12 of formation is caused during the demoulding.
As shown in figure 24, according to other variant embodiment, before moulding technology, can be set on the photo-sensitive cell 13 The barrier element 17 of an annular is equipped with, it mounts or be applied to the non-photo-sensing of the top surface 131 of the photo-sensitive cell 13 Area 1312, and it is flexible, so as to which in moulding technology, the optical window forming blocks 214 are pressed on the barrier element 17, with Prevent that the moulding material 14 from entering the photosensitive area 1311 of the photo-sensitive cell 13, and the optical window forming blocks 214 The stitching surface 2141 and the photo-sensitive cell 13 separately, so as to the optical window forming blocks 214 the stitching surface 2141 not The photosensitive area 1311 of the photo-sensitive cell 13 can be damaged.In a specific example, the barrier element 17 is in square ring-type, And step glue is embodied as, i.e., is coated with or draws in the non-photo-sensing area 1312 of the top surface 131 of the photo-sensitive cell 13 The mode of glue applies glue, and the barrier element 17 is then formed after glue curing.
Shown in reference picture 11- Figure 15, to further illustrate the camera module of second embodiment of the present invention 100 structure, the camera module 100 include a molding photosensory assembly 10.The molding photosensory assembly 10 includes a circuit board 11, a molded base 12 and a photo-sensitive cell 13.The camera module 100 further includes a camera lens 30.Wherein described mould Modeling pedestal 12 include an annular molded body 121 and it is middle there is an optical window 122, with to the camera lens 30 with it is described photosensitive Element 13 provides a passage of light.The photo-sensitive cell 13 is operatively connected to the circuit board 11, such as plays lead by COB Mode by the photo-sensitive cell 13 be connected to the circuit board 11 and positioned at the circuit board 11 top side.The photo-sensitive cell 13 and the camera lens 30 be assembled in the both sides of the molded base 12 respectively, and optical alignment arrange, make through the mirror The light of light 30 can reach the photo-sensitive cell via the optical window 122, so as to make institute after photoelectric conversion acts on Camera module 100 is stated to be able to provide optical imagery.As shown in figure 25 for the camera module 100 in an intelligent electronic device 300 In application, camera module 100 is applied to a mobile phone as described above, and sets along its thickness direction, and front and rear each may be used With the one or more camera modules 100 of configuration.
It is distinguished with above-mentioned one embodiment, and the top side of the molded base 12 forms a top side groove 123, For installing the optical filter 50.It is described or the top side groove 123 is used for one extra optical filter microscope base 60 of convenient support Optical filter microscope base 60 is used to install the optical filter 50, as shown in Figure 12.
Correspondingly, the circuit board 11 includes a substrate 111, and is formed at the substrate 111 and is such as pasted by SMT techniques Multiple electronic components 112 of dress.The photo-sensitive cell 13 has a top surface 131, the photosensitive area 1311 altogether with a center It is integrally formed in the circuit board 11 and the photo-sensitive cell 13 with outer peripheral non-photo-sensing area 1312, the molded base 12 At least a portion non-photo-sensing area 1312, and the electronic component 112 is coated.
The molded base 12 has a medial surface 124, a lateral surface 125 and a top side face 126, i.e., along its inner circumferential side To the medial surface 124, along its peripheral direction the lateral surface 125 and annular the top side face 126 define the ring The shape of shape molded body 121.
In this embodiment, the flat interior surface of the 124 non-linear extension of the medial surface of the molded base 12, and It is the inner surface of bending extension, more specifically, it further includes the Part I medial surface 1241 that integrally extends, one the Two portion of medial side 1242 and a Part III medial surface 1243.As shown in FIG., with the vertical direction of camera module 100 Arrangement explanation, the Part I medial surface 1241 integratedly obliquely extend the non-photo-sensing area of the photo-sensitive cell 13 1312, the Part II medial surface 1242 extends the Part I medial surface 1241 in the horizontal direction substantially, described Part III medial surface 1243 integratedly obliquely extends the Part II medial surface 1242.The ring of the molded base 12 The molded body 121 of shape is correspondingly formed an abutment portion 121a of bottom side, and integratedly extends the abutment portion A 121a stage portion 121b.The stage portion 121b can form integral ring-shaped a step or multisection type, and such as three Segmentation, and certain one side of the molded base is without the step of projection.The stage portion 121b is relative to the abutment portion 121a has larger internal diameter.The inner surface of the abutment portion 121a is the institute of the medial surface 124 of the molded base 12 Part I medial surface 1241 is stated, the top surface of the abutment portion 121a is the medial surface 124 of the molded base 12 The Part II medial surface 1242, the inner surface of the stage portion 121b are the medial surface 124 of the molded base 12 The Part III medial surface 1243, the top surface of the stage portion 121b is the top side face of the molded base 12 126。
It is understood that the rectilinear direction of the Part I medial surface 1241 and the optical axis Y of the camera module 100 Between there is one first inclined angle alpha, i.e., when the vertical direction of camera module 100 arranges, the Part I medial surface There is first inclined angle alpha between 1241 and vertical curve.The bearing of trend of the Part II medial surface 1242 is substantially vertical In the optical axis Y of the camera module 100 rectilinear direction.The Part III medial surface 1243 and the camera module 100 There is one the 3rd angle of inclination beta between optical axis Y rectilinear direction, i.e., when the vertical direction of camera module 100 arranges, described There is the 3rd angle of inclination beta between three parts medial surface 1243 and vertical curve.
The outside of the top surface 1111 of the substrate 111 for extending the circuit board 11 of the molded base 12 Face 125 can include one or more outer peripheral faces 1251, wherein in the second embodiment of the present invention, because can be made into one The molding photosensory assembly jigsaw 1000 of connection, finally cutting obtains the molding photosensory assembly 10 of monomer, wherein the molding Some outer peripheral faces 1251 of the lateral surface 125 of the peripheral direction of the molded base 12 of photosensory assembly 10 are cleaved obtain Arrive, so as to be vertical burnishing surface, and at least an outer peripheral face 1251 passes through the mould 210 in moulding technology The pedestal lateral surface forming surface 2161 of the spacing block 216 defines to be formed, and shown in Figure 21, cuts the obtained molding sense The pedestal lateral surface that the preceding outer peripheral face 1251 of optical assembly 10 passes through the spacing block 216 corresponding to the mould 210 Forming surface 2161 is formed, and has one the between the optical axis Y of the preceding outer peripheral face 1251 and the camera module 100 rectilinear direction Two inclination angle γ, i.e., when the vertical direction of camera module 100 arranges, have between the preceding outer peripheral face 1251 and vertical curve The second inclination angle γ.In addition, the molded base 12 is also formed with one or more driver pin grooves 127, its is each With pin trough wall surface 1271, have between the optical axis Y of the pin trough wall surface 1271 and the camera module 100 rectilinear direction There is one the 4th inclination angle δ, i.e., when the vertical direction of camera module 100 arranges, the pin groove side face 1271 and vertical curve Between there is the 4th inclination angle δ.
It is noted that similar above-described embodiment, as shown in figure 14, for convenience of the demoulding and to the circuit board 11 The pressing of the substrate 111, the substrate 111 1 of the lateral surface 125 of the molded base 12 from the circuit board 11 The position of body extension and the pressing distance of the outer edge of the substrate 111 of the circuit board 11 are W, and this pressing distance W can To be 0.1~0.6mm, such as this pressing distance W can be 0.2mm.
In this embodiment in accordance with the invention, the first inclined angle alpha scope is 10 °~80 °, in some specific embodiments In, it can be 10 °~30 °, or 30 °~45 °, or 45 °~55 °, or 55 °~80 °.The second inclination angle γ scopes are 3 ° ~45 °, in certain embodiments, it can be 3 °~15 °, or 15 °~30 °, or 30 °~45 °.3rd inclination angle β scopes are 3 °~30 °, and in certain embodiments, it can be 3 °~15 °, or 15 °~20 °, or 20 °~30 °.It is described 4th inclination angle δ scopes are 3 °~45 °, and in certain embodiments, it can be 3 °~15 °, or 15 °~30 °, or 30 ° ~45 °.
The optical window forming blocks 214 and the spacing block 216 are in frustum, the linear property transition of its corner angle or It is curvedly more roundedly excessive, but the angular range of each face extension is substantially in above-mentioned specific scope.
Accordingly, the global formation face of first mould 211 configuration of the mould 210, it is above-mentioned for being formed The molded base 12 of structure.More specifically, as shown in FIG., the optical window forming blocks 214 include the pressure head portion of a bottom side The 214a and groove shape 214b of a top side.The pressure head portion 214a and the groove shape 214b are provided commonly for being formed The optical window 122 of the molded base 12, the groove shape 214b are used to be formed in the top side of the molded base 12 The top side groove 123.
It is understood that the optical window forming blocks 214 include a stitching surface 2141 of bottom side, and the base of peripheral direction Seat medial surface forming surface 2142.Further, in this embodiment, the base interior side surface of the optical window forming blocks 214 Forming surface 2142 includes the Part I forming surface 21421 that integrally extends, a Part II forming surface 21422 and one the 3rd Divide forming surface 21423.To be respectively correspondingly used to form the Part I integrally extended of the inner side of molded base 12 Medial surface 1241, the Part II medial surface 1242 and the Part III medial surface 1243.
In this embodiment in accordance with the invention, as shown in FIG., the camera module 100 is placed vertically, the shooting mould The optical axis Y of the photo-sensitive cell 13 of group 100 rectilinear direction is parallel with vertical curve.Accordingly, the Part I shaping There is first inclined angle alpha, its magnitude range is 10 °~88 °, the Part III shaping between face 21421 and vertical curve There is the 3rd angle of inclination beta, its magnitude range is 3 °~30 ° between face 21423 and vertical curve.
Correspondingly, the bottom side of the pressure head portion 214a forms the stitching surface 2141 of the optical window forming blocks 214, institute The lateral surface for stating pressure head portion 214a forms the Part I forming surface 21421 of the optical window forming blocks 214, the groove into Type portion 214b bottom side forms the Part II forming surface 21422 of the optical window forming blocks 214, the groove shape 214b lateral surface forms the Part III forming surface 21423 of the optical window forming blocks 214, the pressure head portion 214a and institute State groove shape 214b and be configured to be in frustum.The pressure head portion 214a and the groove shape 214b sections are trapezoidal, So as to prevent the damage to the elastic film layer 219.More specifically, by taking the groove shape 214b as an example, in existing skill Forming blocks in art have sharp corner angle, during demoulding, easily in the Part II forming surface 21422 and described The position that three parts forming surface 21423 connects, puncture the elastic film layer 219.And the groove shape 214b is in bottom side Between the Part II forming surface 21422 that has respectively of outer circumferential side and the Part III forming surface 21423 in obtuse angle, So as to facilitate the demoulding of the groove shape 214b.
A wherein at least outer peripheral face 1251 for the lateral surface 125 of the corresponding molding photosensory assembly 10, the separation Block 216 has a pedestal lateral surface forming surface 2161, and it has the second inclination angle γ between vertical curve, and it is suitable Magnitude range is 3 °~45 °.
Multiple driver pin Slot shaping blocks 218 that the mould 210 further provides have a pin Groove side forming surface 2181, it has a 4th inclination angle δ between vertical curve, and its suitable magnitude range is 3 °~ 30°。
Correspondingly, the above-mentioned construction of first mould 211 of the mould 210 of the invention and the molding Pedestal has following advantages.
In a first aspect, facilitate optical window forming blocks 214 that first mould 211 configures and the spacing block 216 Stripping operation.I.e. due to providing conveniently stripped first inclined angle alpha at an acute angle, the second inclination angle γ is described 3rd angle of inclination beta and the 4th inclination angle δ, the optical window forming blocks 214 and the spacing block 216 and the molded base 12 Between friction reduce, easily extract, the molded base 12 can obtain preferable completed state.As shown in figure 19, as long as The optical window forming blocks 214 and the spacing block 216 it is mutually remote with the molded base 12 and occur above and below relative displacement, institute State optical window forming blocks 214 and the spacing block 216 and no longer produce friction, i.e., described optical window forming blocks with the molded base 12 The 214 base interior side surface forming surface 21421,21422 and 21423 and the medial surface 1241 of the molded base 12, 1242 and 1243 are separated, the pedestal lateral surface forming surface 2161 of the spacing block 216 and the institute of the molded base 12 State lateral surface 125 to be separated, so described optical window forming blocks 214 and the spacing block 216 and the molded base 12 can be compared with Swimmingly extract, so as to reduce the completed state influence on the molded base 12.
Second aspect, the mould 210 form the shape of the pedestal jigsaw profiled guide slot 2150, not had rectangular Dead angle, the suitable gradient so that when the moulding material 14 of flow-like is entering the pedestal jigsaw profiled guide slot 215, Mobility is more preferable.That is, the moulding material 14 during molded be typically fluid state, it is necessary to described Flowed in forming cavity 213, and the size of flow region influences the effect of filling.The pedestal jigsaw profiled guide slot of the present invention 2150 structure can increase flowing velocity, so as to be molded within the shorter time, be more conducive to the molded base 12 shaping
The third aspect, first inclined angle alpha at an acute angle, the second inclination angle γ, the 3rd angle of inclination beta and institute The 4th inclination angle δ is stated, unlike right angle of the prior art, the optical window forming blocks 214 and the spacing block 216 will not form point Sharp corner angle and scratch the medial surface 124 and the lateral surface 125 of the molded base 12.
Fourth aspect, first inclined angle alpha of acute angle, the second inclination angle γ, the 3rd angle of inclination beta and described 4th inclination angle δ setting so that the medial surface 124 of the molded base 12, at least a portion He of lateral surface 125 The pin trough wall surface 1271 is inclined so that the volume of the molded base 12 is relatively small, overall to need what is filled The moulding material 14 reduces
5th aspect, the setting of the scope of first inclined angle alpha and the 3rd angle of inclination beta of acute angle cause the molding base Seat 12 can avoid the image quality of camera module 100 described in stray light.More specifically, it, which reduces spurious rays, reaches institute State the possibility of photo-sensitive cell 13.That is, when the veiling glare in the camera module 100 is incident to the molded base 12 Bending extension the medial surface 124 when, on the inside of the skewed Part I medial surface 1241 and the Part III Face 1243, and the Part II medial surface 1242 of horizontal direction extension reflex to the veiling glare of incidence away from the sense Optical element 13, so as to which veiling glare is not easily accessible to the photo-sensitive cell 13 and is produced to the image quality of the camera module 100 Influence.
In addition, first inclined angle alpha, the second inclination angle γ, the span of the 3rd angle of inclination beta also for The molded base 12 is set preferably to perform the function of its support, the top side face 126 as described in ensureing has enough sizes, To facilitate the completion of the follow-up camera lens 30 or the driver 40, ensure that the Part II medial surface 1242 has enough Size, the optical filter 50 or the optical filter microscope base 60 are installed to facilitate.I.e. described first inclined angle alpha, described second tilts Angle γ, the value of the 3rd angle of inclination beta can not be too big, causes the length such as its top side face 126 too small, it is impossible to the camera lens 30 or described drivers 40 provide firm installation site.And first inclined angle alpha also needs to consideration can not the optical window Forming blocks 214 can not be pressed onto the lead 15, and cause the lead 15 to be broken.
Below, first inclination angle is illustrated with seven examples of Figure 26 to Figure 32 second embodiment α, the second inclination angle γ, the span of the 3rd angle of inclination beta.In this seven examples, the molded base 12 There is first inclined angle alpha, the molded base 12 is circumferentially between the Part I medial surface 1241 and vertical curve In the lateral surface 125 in direction there is the second inclination angle γ at least between an outer peripheral face 1251 and vertical curve, Have the described 3rd between the Part III medial surface 1243 and vertical curve of the medial surface 124 of the molded base 12 Angle of inclination beta.The Part I medial surface 1241 of the molded base 12 is connected position and institute with the photo-sensitive cell 13 It is L1 to state the distance between the position that is connected with the Part II medial surface 1242 of Part I medial surface 1241, described first Portion of medial side 1241 is connected position and the top side face 126 and the Part III with the Part II medial surface 1242 The distance between the position that is connected of medial surface 1243 is L2, and the length of the top side face 126 of the molded base 12 is L3, The distance between the top side face 126 of the molded base 12 and top surface of the substrate 111 of the circuit board 11 are The distance between H1, top surface of the substrate 111 of the Part II medial surface 1242 and the circuit board 11 is H2, institute It is H3 to state the distance between the peak of lead 15 and the photo-sensitive cell 13.
As shown in Figure 26 to Figure 28, in these three examples, beating between the photo-sensitive cell 13 and the circuit board 11 Line connected mode is from the photo-sensitive cell 13 to the circuit board 11.I.e. by setting the sense on the photo-sensitive cell 13 Optical element terminal pad 132, routing tool are first connected to described photosensitive in the top routing formation of the photo-sensitive cell terminal pad 132 One first end 151 of the lead 15 of element terminal pad 132, then can raise predeterminated position, then be connected towards circuit board The direction of disk 113 is moved and declined again is connected to the circuit board terminal pad to be formed on the top of the circuit board terminal pad 113 One second end 152 of 113 lead 15, so described lead 15 extends in bending, and causes the lead 15 Top can not be in moulding technology by the Part I base interior side surface forming surface 21421 of the optical window forming blocks 214 Damage by pressure, have threshold limit value so as to the size of first inclined angle alpha.
As shown in Figure 29 to Figure 32, in this four examples, beating between the photo-sensitive cell 13 and the circuit board 11 Line connected mode is from the circuit board 11 to the photo-sensitive cell 13.Pass through the upper setting electricity in the circuit board 11 Road plate terminal pad 113, routing tool first form in the top routing of the circuit board terminal pad 113 and are connected to the circuit board company The second end 152 of the lead 15 of disk 113 is connect, then can raise predeterminated position, then towards the direction of circuit board terminal pad 113 Translate and formed on the top of the inductance optical element terminal pad 132 lead 15 for being connected to photo-sensitive cell terminal pad 132 Opposite first end 151, so described lead 15 extends in bending, and causes the top of the lead 15 can not be Damaged by pressure during moulding technology by the Part I base interior side surface forming surface 21421 of the optical window forming blocks 214, so as to described The size of first inclined angle alpha has threshold limit value.In addition, in order that the Part II medial surface 1242 and the top side face 126 There are enough sizes, the second inclination angle γ and the 3rd angle of inclination beta also should not be excessive.I.e. described second inclination angle γ and Restricting relation be present between the span and above-mentioned parameter L1, L2, L3, H1, H2 and H3 of 3rd angle of inclination beta.
As shown in Figure 26, α angles size is 10 °, and β angles size is 3 °, and γ angles size is 3 °.Wherein L1 numerical value is 0.23mm, L2 numerical value are 1.09mm, and L3 numerical value is 0.99mm, and H1 numerical value is 1.30mm, and H2 numerical value is 0.93mm, and H3 numerical value is 0.17mm.First inclined angle alpha, the second inclination angle γ, the 3rd angle of inclination beta obtain suitable minimum value.
As shown in Figure 27, α angles size is 30 °, and β angles size is 20 °, and γ angles size is 30 °.Wherein L1 numerical value is 0.38mm, L2 numerical value are 1.25mm, and L3 numerical value is 0.21mm, and H1 numerical value is 1.34mm, and H2 numerical value is 0.93mm, and H3 numerical value is 0.17mm。
As shown in Figure 28, α angles size is 55 °, and β angles size is 30 °, and γ angles size is 45 °.Wherein L1 numerical value is 0.54mm, L2 numerical value are 0.39mm, and L3 numerical value is 0.42mm, and H1 numerical value is 0.86mm, and H2 numerical value is 0.38mm, and H3 numerical value is 0.17mm.Routing connected mode wherein between the photo-sensitive cell 13 and the circuit board 11 is from the photo-sensitive cell 13 During to the circuit board 11, it is 55 ° that first inclined angle alpha, which obtains maximum,.
More specifically, as shown in Figure 29, α angles size is 10 °, β angles size is 30 °, and γ angles size is 45 °.Wherein L1 Numerical value is 0.23mm, and L2 numerical value is 1.28mm, and L3 numerical value is 0.82mm, and H1 numerical value is 1.30mm, and H2 numerical value is 0.93mm, H3 numbers It is worth for 0.13mm.The size of first inclined angle alpha is suitable minimum value, and the second inclination angle γ and the described 3rd is tilted The size of angle beta is suitable maximum.
As shown in Figure 30, α angles size is 30 °, and β angles size is 20 °, and γ angles size is 30 °.Wherein L1 numerical value is 0.38mm, L2 numerical value are 1.24mm, and L3 numerical value is 0.21mm, and H1 numerical value is 1.34mm, and H2 numerical value is 0.93mm, and H3 numerical value is 0.13mm。
As shown in Figure 31, α angles size is 45 °, and β angles size is 15 °, and γ angles size is 15 °.Wherein L1 numerical value is 0.73mm, L2 numerical value are 0.65mm, and L3 numerical value is 1.88mm, and H1 numerical value is 1.33mm, and H2 numerical value is 1.00mm, and H3 numerical value is 0.13mm。
As shown in Figure 32, α angles size is 80 °, and β angles size is 3 °, and γ angles size is 3 °.Wherein L1 numerical value is 1.57mm, L2 numerical value are 0.15mm, and L3 numerical value is 2.19mm, and H1 numerical value is 1.45mm, and H2 numerical value is 0.54mm, and H3 numerical value is 0.13mm.Routing connected mode wherein between the photo-sensitive cell 13 and the circuit board 11 be from the circuit board 11 to During the photo-sensitive cell 13, because the lead will not need to raise lead to the routing mode in Figure 26-Figure 28, cause institute Stating the peak position of lead 51 reduces, and it is 80 ° that first inclined angle alpha, which obtains maximum,.It is and in this illustration, described The size of second inclination angle γ and the 3rd angle of inclination beta is suitable minimum value.
It is understood that above-mentioned parameter L1, L2, L3, H1, H2 and H3 concrete numerical value are only used as illustrating and being not intended to limit The present invention, in actual applications, according to the camera module 100 and it is described molding photosensory assembly 10 specification requirement difference, It can change.
According to this embodiment of the invention, the data of example as an example can be shown more than, described the The optimum range of one inclined angle alpha is 10 °~80 °, and the optimum range of the second inclination angle γ is 3 °~45 °, and the described 3rd inclines Oblique angle β optimum range is 3 °~30 °.
It should be understood by those skilled in the art that the embodiments of the invention shown in foregoing description and accompanying drawing are only used as illustrating And it is not intended to limit the present invention.The purpose of the present invention completely and effectively realizes.The function and structural principle of the present invention exists Show and illustrate in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.

Claims (53)

  1. A 1. molding photosensory assembly, applied to a camera module, it is characterised in that photosensitive including an at least circuit board, at least one Element, and an at least molded base, the molded base pass through moulding technology and the circuit board and the photo-sensitive cell one With reference to wherein the molded base forms an at least optical window, the optical window and the photo-sensitive cell position correspondence, and the mould At least a portion medial surface that modeling pedestal integrally extends from the photo-sensitive cell obliquely extends.
  2. 2. molding photosensory assembly according to claim 1, wherein at least a portion medial surface of the molded base Corner dimension between the optical axis straight line of the camera module is 10 °~80 °.
  3. 3. molding photosensory assembly according to claim 1, wherein the molded base has from the one of the photo-sensitive cell The medial surface that one non-photo-sensing area of top surface integratedly linearly extends, so as to which whole medial surfaces of the molded base are in incline Ramp-like extension, have conveniently stripped between the medial surface of the molded base and the optical axis straight line of the camera module and keep away Exempt from an inclined angle alpha of veiling glare, wherein α magnitude range is 10 °~80 °.
  4. 4. molding photosensory assembly according to claim 3, wherein the numerical value of the inclined angle alpha be selected from 10 °~30 °, 30 °~ 45 °, 45 °~55 ° or 55 °~80 °.
  5. 5. molding photosensory assembly according to claim 3, wherein passing through one between the photo-sensitive cell and the circuit board Group lead conducting connection, wherein when the routing connected mode of the lead is from the photo-sensitive cell towards the circuit board, α's Numerical value is selected from 10 °~55 °.
  6. 6. molding photosensory assembly according to claim 3, wherein passing through one between the photo-sensitive cell and the circuit board Group lead conducting connection, wherein when the routing connected mode of the lead is from the circuit board towards the photo-sensitive cell, α's Numerical value is selected from 10 °~88 °.
  7. 7. molding photosensory assembly according to claim 1, wherein the molded base has from the circuit board integratedly The lateral surface extended linearly, wherein having side between the lateral surface of the molded base and the optical axis straight line of the camera module Just the inclination angle γ being stripped, wherein γ magnitude range are 3 °~45 °.
  8. 8. molding photosensory assembly according to claim 3, wherein the molded base has from the circuit board integratedly The lateral surface extended linearly, wherein having side between the lateral surface of the molded base and the optical axis straight line of the camera module Just the inclination angle γ being stripped, wherein γ magnitude range are 3 °~45 °.
  9. 9. molding photosensory assembly according to claim 8, wherein γ numerical value are selected from 3 °~15 °, 15 °~30 °, or 30 ° ~45 °.
  10. 10. molding photosensory assembly according to claim 1, wherein the molded base has a top side groove on top, The molded base has a medial surface of bending extension, and it includes the Part I medial surface integratedly extended successively, and one Part II medial surface and a Part III medial surface, the Part I medial surface integrally obliquely extend the photosensitive member One non-photo-sensing area of one top surface of part, the Part III medial surface are integrally obliquely extended on the inside of the Part II Face, wherein the Part II medial surface and the Part III medial surface define to form the top side groove.
  11. 11. molding photosensory assembly according to claim 10, wherein the Part I medial surface and the camera module Optical axis straight line between have conveniently stripped and avoid an inclined angle alpha of veiling glare, wherein α magnitude range is 10 °~80 °, Have conveniently stripped and avoiding veiling glare one to incline between the Part III medial surface and the optical axis straight line of the camera module Oblique angle β, wherein β magnitude range are 3 °~30 °.
  12. 12. molding photosensory assembly according to claim 11, wherein α numerical value are selected from 10 °~30 °, 30 °~45 °, 45 ° ~55 ° or 55 °~80 °, wherein β numerical value is selected from 3 °~15 °, 15 °~20 ° or 20 °~30 °.
  13. 13. molding photosensory assembly according to claim 11, wherein passing through between the photo-sensitive cell and the circuit board One group of lead conducting connection, wherein when the routing connected mode of the lead is from the photo-sensitive cell towards the circuit board, α Numerical value be selected from 10 °~55 °.
  14. 14. molding photosensory assembly according to claim 11, wherein passing through between the photo-sensitive cell and the circuit board One group of lead conducting connection, wherein when the routing connected mode of the lead is from the circuit board towards the photo-sensitive cell, α Numerical value be selected from 10 °~88 °.
  15. 15. molding photosensory assembly according to claim 11, wherein the Part II medial surface be based on it is described photosensitive The top surface of element is parallel.
  16. 16. molding photosensory assembly according to claim 11, wherein the molded base has from circuit board one One lateral surface of linear extension, wherein the lateral surface of the molded base includes arranging multiple outer peripheral faces along around direction, its In there is a conveniently stripped inclination angle γ between at least one outer peripheral face and the optical axis straight line of the camera module, wherein γ magnitude range is 3 °~45 °.
  17. 17. molding photosensory assembly according to claim 16, wherein γ numerical value be selected from 3 °~15 °, 15 °~30 °, or 30 °~45 °.
  18. 18. according to any described molding photosensory assembly in claim 1 to 17, wherein the molding photosensory assembly also has one Individual or multiple driver pin grooves, wherein defining the pin trough wall surface of each driver pin groove and the camera module There is a conveniently stripped inclination angle δ, wherein δ magnitude range is 3 °~30 ° between optical axis straight line.
  19. 19. according to any described molding photosensory assembly in claim 1 to 17, wherein the molding photosensory assembly is also included extremely A few optical filter, the optical filter are superimposed with the photo-sensitive cell, and the molded base is integratedly in package shape in the filter Mating plate, the photo-sensitive cell and the circuit board.
  20. 20. according to any described molding photosensory assembly in claim 7 and 16 to 17, wherein described in the molded base The outside of an at least outer peripheral face in lateral surface, the substrate of the circuit board leave a molding has in moulding technology at least one The pressing distance W for being easy to pressing of spacing block, its number range is 0.1~0.6mm.
  21. 21. according to any described molding photosensory assembly in claim 1 to 17, wherein the material surface of the molded base exists Range of light wavelengths 435-660nm reflectivity is less than 5%.
  22. A 22. camera module, it is characterised in that photosensitive including an at least camera lens and at least one molding photosensory assembly, the molding Component includes an at least circuit board, at least a photo-sensitive cell, and an at least molded base, the molded base and passes through moulding technology Joined integrally with the circuit board and the photo-sensitive cell, wherein the molded base forms an at least optical window, the optical window is The photo-sensitive cell and the camera lens provides a passage of light, and the molded base integrally extends from the photo-sensitive cell At least a portion medial surface obliquely extends.
  23. 23. camera module according to claim 22, at least a portion medial surface of the molded base with it is described Corner dimension between the optical axis straight line of camera module is 10 °~80 °.
  24. 24. camera module according to claim 22, wherein the molded base, which has from the photo-sensitive cell one, pushes up table The medial surface that the one non-photo-sensing area in face integratedly linearly extends, it is oblique so as to whole medial surfaces of the molded base Extension, have conveniently stripped between the medial surface of the molded base and the optical axis straight line of the camera module and avoid miscellaneous One inclined angle alpha of astigmatism, wherein α magnitude range are 10 °~80 °, more specifically selected from 10 °~30 °, 30 °~45 °, 45 °~ 55 ° or 55 °~80 °.
  25. 25. camera module according to claim 24, wherein passing through one group between the photo-sensitive cell and the circuit board Lead conducting connection, wherein when the routing connected mode of the lead is from the photo-sensitive cell towards the circuit board, α number Value is selected from 10 °~55 °；When the routing connected mode of wherein described lead is from the circuit board towards the photo-sensitive cell, α's Numerical value is selected from 10 °~88 °.
  26. 26. camera module according to claim 25, wherein the molded base has from the circuit board one ground wire Property extension a lateral surface, wherein have between the lateral surface of the molded base and the optical axis straight line of the camera module it is convenient One inclination angle γ of the demoulding, wherein γ magnitude range is 3 °~45 °, more specifically selected from 3 °~15 °, 15 °~30 °, or 30 ° ~45 °.
  27. 27. camera module according to claim 22, the molded base has a top side groove, the molding on top Pedestal has a medial surface of bending extension, and it includes the Part I medial surface integratedly extended successively, a Part II Medial surface and a Part III medial surface, the Part I medial surface integrally obliquely extend a top of the photo-sensitive cell The one non-photo-sensing area on surface, the Part III medial surface integrally obliquely extend the Part II medial surface, wherein institute State Part II medial surface and the Part III medial surface defines to form the top side groove.
  28. 28. camera module according to claim 27, wherein the light of the Part I medial surface and the camera module There is an inclined angle alpha that is conveniently stripped and avoiding veiling glare, wherein α magnitude range is 10 °~80 °, described between axle straight line There is an inclination angle that is conveniently stripped and avoiding veiling glare between Part III medial surface and the optical axis straight line of the camera module β, wherein β magnitude range are 3 °~30 °.
  29. 29. according to the camera module described in claim 28, wherein α numerical value be selected from 10 °~30 °, 30 °~45 °, 45 °~55 ° or 55 °~80 °, wherein β numerical value is selected from 3 °~15 °, 15 °~20 ° or 20 °~30 °.
  30. 30. camera module according to claim 28, wherein passing through one group between the photo-sensitive cell and the circuit board Lead conducting connection, wherein when the routing connected mode of the lead is from the photo-sensitive cell towards the circuit board, α number Value is selected from 10 °~55 °；When the routing connected mode of wherein described lead is from the circuit board towards the photo-sensitive cell, α's Numerical value is selected from 10 °~88 °.
  31. 31. camera module according to claim 28, wherein the Part II medial surface is based on and the photo-sensitive cell The top surface it is parallel.
  32. 32. camera module according to claim 22, wherein the molded base has from the circuit board one ground wire Property extension a lateral surface, wherein the lateral surface of the molded base is included along multiple outer peripheral faces are arranged around direction, wherein extremely There is a conveniently stripped inclination angle γ between a few outer peripheral face and the optical axis straight line of the camera module, wherein γ's Magnitude range is 3 °~45 °, more specifically selected from 3 °~15 °, 15 °~30 °, or 30 °~45 °.
  33. 33. camera module according to claim 28, wherein the molded base has from the circuit board one ground wire Property extension a lateral surface, wherein the lateral surface of the molded base is included along multiple outer peripheral faces are arranged around direction, wherein extremely There is a conveniently stripped inclination angle γ between a few outer peripheral face and the optical axis straight line of the camera module, wherein γ's Magnitude range is 3 °~45 °, more specifically selected from 3 °~15 °, 15 °~30 °, or 30 °~45 °.
  34. 34. according to any described camera module in claim 22 to 33, wherein the molding photosensory assembly also has one Or multiple driver pin grooves, wherein defining the pin trough wall surface of each driver pin groove and the light of the camera module There is a conveniently stripped inclination angle δ, wherein δ magnitude range is 3 °~30 ° between axle straight line.
  35. 35. according to any described camera module in claim 22 to 33, wherein the molding photosensory assembly is also included at least One optical filter, the optical filter are superimposed with the photo-sensitive cell, and the molded base is integratedly in package shape in the optical filtering Piece, the photo-sensitive cell and the circuit.
  36. 36. according to any described camera module in claim 22 to 33, wherein also including an at least optical filter, the optical filtering Piece is installed on the top of the molded base.
  37. 37. according to any described camera module in claim 27-31 and 33, wherein also including an at least optical filter, institute State the top side groove that optical filter is installed on the molded base.
  38. 38. according to any described camera module in claim 22 to 33, wherein also including an at least optical filter microscope base and extremely A few optical filter, the optical filter are installed on the optical filter microscope base, and the optical filter microscope base is installed on the molded base Top.
  39. 39. according to any described camera module in claim 22 to 33, wherein also including an at least driver, the driving Device is installed on the top side of the molded base so that the molded base supports the driver, wherein the camera lens is installed on institute State in driver to realize auto-focusing.
  40. 40. camera module according to claim 22, wherein also including an at least barrier element in a ring, to prevent State the photosensitive area that moulding material in moulding technology reaches the photo-sensitive cell.
  41. 41. it is assembled into for a moment according to any described camera module, the plurality of camera module in claim 22 to 33 Row camera module.
  42. 42. according to any described camera module in claim 22 to 33, wherein the molding photosensory assembly includes multiple institutes State photo-sensitive cell and there are multiple optical windows, so as to form an array camera module with multiple camera lenses.
  43. 43. according to any described camera module in claim 26 and 32 to 33, wherein in the described outer of the molded base The outside of an at least outer peripheral face in side, the substrate of the circuit board leave at least one point that a molding has in moulding technology The pressing distance W for being easy to pressing of spacer block, its number range is 0.1~0.6mm.
  44. 44. according to any described camera module in claim 22 to 33, wherein the material surface of the molded base is in light Line wave-length coverage 435-660nm reflectivity is less than 5%.
  45. A 45. electronic equipment, it is characterised in that including one or more according to any described shooting in claim 22-44 Module.
  46. 46. electronic equipment according to claim 45, it is characterised in that the electronic equipment is selected from mobile phone, computer, TV Machine, intelligence can screw on equipment, the vehicles, camera and supervising device.
  47. 47. a molding has, applied at least one molding photosensory assembly for making an at least camera module, it is characterised in that its Including can mutually separate or mutually closely sealed one first mould and one second mould, wherein first and second mould is mutually closely sealed When form an at least forming cavity, and the mould is configured with an at least optical window forming blocks and is located in the forming cavity A pedestal profiled guide slot around the optical window forming blocks, wherein being connected with an at least photo-sensitive cell when being installed in the forming cavity An at least circuit board, be filled into the moulding material in the pedestal profiled guide slot and liquid undergone under temperature control function to solid The conversion process of state and curing molding, form a molded base, described in correspondence in the position of the corresponding pedestal profiled guide slot The position of optical window forming blocks forms an optical window of the molded base, wherein the molded base is shaped in the circuit board With at least a portion non-photo-sensing area of the photo-sensitive cell to form the molding photosensory assembly of the camera module.
  48. 48. mould according to claim 47, extend wherein the optical window forming blocks have one to tilt along its periphery Base interior side surface forming surface, for forming the medial surface of molded base integrated linear extension.
  49. 49. mould according to claim 48, wherein the base interior side surface forming surface of the optical window forming blocks There is a conveniently stripped inclination angle between vertical curve, wherein α magnitude range is 10 °~80 °.
  50. 50. mould according to claim 47, wherein the optical window forming blocks include a pressure head portion and integratedly prolonged A groove shape in the pressure head portion is stretched in, the groove shape has larger internal diameter than the pressure head portion, for A top side groove is formed in the top side of the molded base.
  51. 51. mould according to claim 50, wherein lateral surface of the pressure head portion along its periphery and vertical curve it Between have conveniently stripped and avoid an inclined angle alpha of veiling glare, wherein α magnitude range is 10 °~80 °, the groove shaping Along having an angle of inclination beta between the lateral surface and vertical curve of its periphery, wherein β magnitude range is 3 °~30 ° in portion.
  52. 52. mould according to claim 51, wherein passing through one group between the photo-sensitive cell and the circuit board Lead conducting connection, wherein when the routing connected mode of the lead is from the photo-sensitive cell towards the circuit board, α number Value is selected from 10 °~55 °；When the routing connected mode of wherein described lead is from the circuit board towards the photo-sensitive cell, α's Numerical value is selected from 10 °~88.
  53. 53. according to any described mould in claim 47 to 52, wherein first mould also includes at least one point Spacer block, the spacing block have a pedestal lateral surface forming surface, and it has a conveniently stripped inclination angle between vertical curve γ, γ numerical value are selected from 3 °~45 °.
CN201610622330.3A 2016-08-01 2016-08-01 Camera module, molded photosensitive assembly thereof and manufacturing method Active CN107682591B (en)

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CN201710711359.3A CN107682596B (en) 2016-08-01 2016-08-01 Molded photosensitive component, jointed board thereof and manufacturing method
CN201910811126.XA CN110650273B (en) 2016-08-01 2016-08-01 Image pickup module and molded photosensitive assembly and manufacturing method thereof
CN201610622330.3A CN107682591B (en) 2016-08-01 2016-08-01 Camera module, molded photosensitive assembly thereof and manufacturing method
PCT/CN2016/103248 WO2018023887A1 (en) 2016-08-01 2016-10-25 Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods
JP2019503667A JP7048573B2 (en) 2016-08-01 2016-10-25 Camera module and its molded circuit board assembly and molded photosensitive assembly and manufacturing method
EP23165641.4A EP4224876A3 (en) 2016-08-01 2016-10-25 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
KR1020197005566A KR102199508B1 (en) 2016-08-01 2016-10-25 Photographic module, molded circuit board component, molded photosensitive component, and manufacturing method
EP16911482.4A EP3493517B1 (en) 2016-08-01 2016-10-25 Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods
CN201680088072.3A CN109716745B (en) 2016-08-01 2016-10-25 Camera module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing method
KR1020207036542A KR102352901B1 (en) 2016-08-01 2016-10-25 Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods
US15/439,909 US10051167B2 (en) 2016-08-01 2017-02-22 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US15/461,402 US10171716B2 (en) 2016-08-01 2017-03-16 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US15/461,409 US10498942B2 (en) 2016-08-01 2017-03-16 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
TW106208437U TWM557833U (en) 2016-08-01 2017-06-12 Camera module, molded photosensitive element, molding die, and its electronic equipment
TW106119407A TWI698125B (en) 2016-08-01 2017-06-12 Camera module and its molded photosensitive element and manufacturing method
US15/679,151 US10136041B2 (en) 2016-08-01 2017-08-16 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US15/679,153 US10129451B2 (en) 2016-08-01 2017-08-17 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US15/679,154 US10230879B2 (en) 2016-08-01 2017-08-17 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US15/785,374 US10742859B2 (en) 2016-08-01 2017-10-16 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US16/028,367 US10708480B2 (en) 2016-08-01 2018-07-05 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US16/157,061 US10666847B2 (en) 2016-08-01 2018-10-10 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US16/569,601 US10986258B2 (en) 2016-08-01 2019-09-12 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US17/203,673 US11363184B2 (en) 2016-08-01 2021-03-16 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
JP2021055045A JP7269273B2 (en) 2016-08-01 2021-03-29 Camera module and its molded circuit board assembly, molded photosensitive assembly and manufacturing method
US17/824,415 US11575816B2 (en) 2016-08-01 2022-05-25 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

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CN107682591B (en) 2020-07-24

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