CN111133742B - Camera module, photosensitive assembly splicing plate, forming mold and manufacturing method thereof - Google Patents
Camera module, photosensitive assembly splicing plate, forming mold and manufacturing method thereof Download PDFInfo
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- CN111133742B CN111133742B CN201880056738.6A CN201880056738A CN111133742B CN 111133742 B CN111133742 B CN 111133742B CN 201880056738 A CN201880056738 A CN 201880056738A CN 111133742 B CN111133742 B CN 111133742B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Camera Bodies And Camera Details Or Accessories (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
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Abstract
A camera module and photosensitive assembly and manufacturing approach thereof, this photosensitive assembly includes: the light source comprises a circuit board, a photosensitive element and a molding base, wherein the molding base is integrally formed on the circuit board and the photosensitive element and forms a light window; the first end side corresponding to the molding base and adjacent to the flexible area is provided with a first side surface facing the optical window, the first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected with the first partial surface, and the first angle of the first partial surface relative to the optical axis of the camera module is larger than the second angle of the second partial surface relative to the optical axis; the opposite second end side of the molding base away from the flexible area has a second side surface facing the light window, the second side surface includes a third partial surface disposed adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, and a third angle of the third partial surface with respect to the optical axis is larger than a fourth angle of the fourth partial surface with respect to the optical axis.
Description
Technical Field
The invention relates to the field of camera modules, in particular to a photosensitive assembly manufactured by a molding process, a photosensitive assembly jointed board, a manufacturing method of the photosensitive assembly jointed board and a camera module with the photosensitive assembly.
Background
The molding packaging technology of the camera module is a newly developed packaging technology based on the traditional COB packaging technology. As shown in fig. 1A to 1C, the circuit board is packaged by using the conventional integrated packaging technology. In the structure, a packaging part 1 is packaged on a circuit board 2 and a photosensitive chip 3 in an integrated packaging mode, so that an integrated packaging assembly is formed, the packaging part 1 covers a plurality of electronic components 201 of the circuit board 2 and a series of leads 202 which are electrically connected with the photosensitive chip 3 and the circuit board 2, the length, width and thickness of the camera module can be reduced, the assembly tolerance can be reduced, a lens or a lens assembly above the integrated packaging assembly can be smoothly installed, and the problem that dust attached to the electronic components influences the imaging quality of the camera module is solved.
More specifically, as shown in fig. 1A and 1B, in order to improve the production efficiency, the integrated package assembly is generally produced by using a panel production method, that is, a plurality of integrated package assemblies are produced at one time. More specifically, fig. 1A and 1B illustrate the manner in which the integrated package assembly is produced using a forming mold for panel splicing. The forming die comprises an upper die 101 and a lower die 102, wherein one circuit board spliced plate is placed into the lower die 102 of the forming die, the circuit board spliced plate comprises a plurality of rows of circuit boards, each row of circuit boards comprises a plurality of circuit boards 2, and each circuit board 2 is operatively connected with a photosensitive chip 3. The upper die 101 and the lower die 102 are combined to form a forming cavity, so that the upper die 101 is pressed on the circuit board jointed board, two flow passages 103 and 104 are formed in the upper die corresponding to two end sides of the photosensitive chip 3 on each row of circuit boards, the upper die 101 is provided with a plurality of bumps 105, an intermediate flow passage 106 is formed between two adjacent bumps 105, and the plurality of intermediate flow passages 106 extend between the two flow passages 103 and 104.
In the molding process, the fluid-like encapsulating material 4 flows forward along the two runners 103 and 104 and is filled into the middle runner 106 between the two adjacent bumps 105, so that the region between the two adjacent photosensitive chips 3 is also filled with the encapsulating material 4, thereby the encapsulating parts 1 can be formed on the corresponding respective circuit boards 2 and the respective photosensitive chips 3 after the encapsulating material 4 is cured, the light windows located in the middle of the encapsulating parts 1 are formed at the positions corresponding to the respective bumps 105, and the encapsulating parts 1 are integrally molded to form a connected structure, as shown in fig. 1C.
Referring to fig. 1E, the thermosetting encapsulating material 4 has a curing time T during the molding process, and the viscosity thereof is reduced to the lowest point and then gradually increased to the highest point to be completely cured as time goes by. Ideally, when the viscosity of the encapsulating material 4 is low, the encapsulating material 4 fills the flow passages 103, 104 and 106, and when the viscosity of the encapsulating material 4 is high and the encapsulating material still flows forward, the friction of the encapsulating material 4 on the lead 202 between the circuit board 2 and the photosensitive chip 3 is high, so that the lead 202 is easily deformed and damaged.
In the molding process described above, the encapsulating material 4 is a thermosetting material, which is melted and enters the two runners 103 and 104, and is cured by heating. However, in actual production, it has been found that when the encapsulating material 4 flows forward along the two runners 103 and 104 in the molding process, a problem may be caused if the widths of the two runners 103 and 104 are small.
More specifically, since the potting material 4 is a fluid having a predetermined viscosity, the size of both the flow passages 103 and 104 is relatively small and, for example, the flow passage 103 is a narrow flow passage, the flow rate in the flow passage 103 is relatively small, and the influence of the friction generated by the inner wall of the flow passage 103 on the flow rate of the potting material 4 in the fluid state therein is relatively large, the flow rate of the potting material 4 in the flow passage 103 is relatively slow. Thus, during the curing time T of the encapsulating material 4, the encapsulating material 4 in the flow channel 103 may not flow from the feeding end to the end thereof during the curing time T, so that a local position of the flow channel 103 may not be filled, as shown by a region S in fig. 1D, so that a connected structure having a series of completely shaped encapsulating portions 1 cannot be formed between the upper mold 101 and the lower mold 102, and the encapsulating portions 1 form a gap corresponding to the position of the region S, so that a light window with a closed periphery cannot be formed. Also, if the width of the flow channel 104 is narrow, the flow channel 104 may also appear as shown in fig. 1D.
In addition, if the encapsulating material 4 in the flow path 103 flows forward at too low a speed to cause a high viscosity and still flows forward in the flow path 103, friction against the lead 202 flowing therethrough is caused to be large, so that the lead 202 is deflected forward with a large amplitude, thereby easily causing deformation and damage of the lead 202 and easy detachment from the pad.
As shown in fig. 1F, the camera module packaged by the conventional integrated packaging technology includes a packaging portion 1, a circuit board 2, a photosensitive chip 3, a filter 5, and a lens assembly 6. In this structure, the packaging part 1 is packaged in the circuit board 2 and the photosensitive chip 3 in an integrated packaging manner, so as to form an integrated packaging assembly, and the packaging part 1 covers a series of electronic components 201 of the circuit board 2 and a series of leads 202 electrically connecting the photosensitive chip 3 and the circuit board 2, so that the length, width and thickness of the camera module can be reduced, the assembly tolerance can be reduced, the lens assembly 6 above the integrated packaging assembly can be smoothly mounted, and the problem that dust attached to the electronic components 201 affects the imaging quality of the camera module is solved.
In addition, to facilitate demolding, the inner surface of the package portion 1 is generally formed to integrally extend obliquely from the photosensitive chip 3, which results in a reduction in the area of the top surface of the package portion 1, and the top side of the package portion 1 requires an upper optical device for mounting the camera module, such as the lens assembly 6, or an additional lens holder or the like. However, the small area of the top surface of the package 1 may not provide a sufficient mounting surface for the upper optics of the camera module, making the upper optics not able to be mounted securely and making the mounting surface susceptible to flash.
In the manufacturing process of the integrated assembly shown in fig. 1B, the circuit board 201 connected with the photo chip 3 is placed in a mold, a bump 105 is pressed on the photo chip 3 as a pressing head, and the channels 103, 104 and 106 in the mold substantially form a groove 107 surrounding the bump 105, an encapsulant 4 in a fluid state is filled into the groove 107, the encapsulant 1 is formed after curing, and a through hole of the encapsulant 1 is formed at a position corresponding to the bump 105. The projection 105 has an inclined outer surface 1051, thereby forming the integrally extending inner surface of the enclosure 1.
However, in the integrated packaging process, the fluid-like packaging material may enter between the photosensitive chip 3 and the bottom surface of the bump 105, thereby causing the packaging material to reach the photosensitive area of the photosensitive chip 3, forming a "flash" and affecting the photosensitive effect of the photosensitive chip 3. And a filling groove 1071 is formed between the photosensitive chip 3 and the inclined outer surface 1051 of the bump 105 at the bottom side of the groove 107, in the integrated packaging process, the packaging material enters the filling groove 1071, and the inclined outer surface 1051 of the bump 105 extending obliquely tends to guide the packaging material into the filling groove 1071, resulting in a larger volume of the filling groove 1071, and the fluid-like packaging material generates a larger pressure and pressure, thereby increasing the probability of the packaging material entering between the photosensitive chip 3 and the bottom surface of the bump 105, so that the packaging material is liable to contaminate the photosensitive area of the photosensitive chip 3, which affects the photosensitive performance of the photosensitive chip 3. Moreover, if the pressure with which the bump 105 is pressed against the photosensitive chip 3 is increased in order to reduce the generation of "flash", damage to the photosensitive chip 3 may be caused.
Disclosure of Invention
An object of the present invention is to provide a camera module, a photo sensor module and a method for manufacturing the same, wherein in the method for manufacturing a panel of the photo sensor module, a molding material in a molding process can fill a base panel forming guide groove in a forming mold, thereby preventing the photo sensor module from being defective.
The invention aims to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein in a molding process, a connected molding base can be formed on a circuit board jointed board by molding materials, and an optical window with the periphery closed can be formed on the connected molding base at the position corresponding to each photosensitive element, so that after the formed connected photosensitive component jointed board is cut, a molding base with the optical window is formed on each circuit board and the corresponding photosensitive element, and the optical window is prevented from being communicated to the outside of the molding base due to the fact that an opening is formed in the local part of the molding base.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the base panel forming guide groove is used for forming the connected molding base on a row of circuit boards, and has two guide grooves on two sides and a plurality of filling grooves extending transversely between the two guide grooves, the molding material flows and solidifies in the guide grooves and the filling grooves, wherein the side walls of the two guide grooves are designed to increase the volume of the guide grooves, so that the molding material can flow forward from the feeding ends of the two guide grooves and fill the guide grooves and the filling grooves of the base panel forming guide groove.
The invention aims to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein a base splicing plate forming guide groove is used for forming a connected molding base on two rows of adjacent circuit boards integrally combined in a rigid area, the connected molding base is provided with two first guide grooves on two sides, a second guide groove in the middle and a plurality of filling grooves respectively positioned between the two first guide grooves and the second guide groove, a molding material flows and solidifies in the guide grooves and the filling grooves, and the side walls of the two first guide grooves and the second guide grooves are designed to increase the volume of the guide grooves, so that the molding material can flow forwards from the feeding ends of the two guide grooves and fill the guide grooves and the filling grooves of the whole base splicing plate forming guide groove.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a method for manufacturing the same, wherein when the size of the guiding groove is smaller for forming a miniaturized photosensitive assembly, the shape of the sidewall of the guiding groove is designed to increase the volume of the guiding groove, so that when the width of the bottom end of the guiding groove is smaller than 1 mm, the whole guiding groove for forming the base splicing plate is still filled in the molding process.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a method for manufacturing the same, wherein the molding material fills the base panel forming guide groove before the viscosity of the molding material reaches a high value and is solidified, thereby preventing the connecting line between the circuit board and the photosensitive element from being damaged by the forward flowing molding material with high viscosity.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a method of manufacturing the same, in which sidewalls of the channels are designed such that the volume of the channels is increased to allow the molding material to reach the end of each channel from the feeding end thereof during a molding process, thereby preventing the molding material in one channel from flowing to another channel and preventing the molding material in the other channel from flowing forward.
The invention aims to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the molding process can form the conjoined molding base on a row of circuit boards and a row of photosensitive elements with a plurality of circuit boards at one time, so that a row of a plurality of photosensitive assemblies, such as preferably 2-12 photosensitive assemblies, are manufactured and formed through a plate splicing process.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a method for manufacturing the same, wherein the photosensitive assembly includes a molding base integrally molded with a photosensitive element and a circuit board, wherein during the process of forming the molding base by an integral molding process, a molding material molded to form the molding base is not easy to enter between the photosensitive element and a bottom surface of a light window forming portion of a molding die to form a 'flash', thereby reducing the possibility of contamination of a photosensitive area of the photosensitive element.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the volume of a filling groove between the photosensitive element and the outer surface of the optical window forming part is reduced, and the pressure and pressure generated by the molding material entering the filling groove are reduced, so that the possibility of forming 'flash' due to the molding material entering between the photosensitive element and the bottom surface of the optical window forming part is reduced.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the outer surface of the optical window forming portion has outer surfaces extending in different directions, and an included angle between the outer surface of the top side and the optical axis of the photosensitive assembly is smaller than an included angle between the outer surface of the bottom side and the optical axis, so as to reduce the volume of the filling groove formed between the outer surface of the bottom side of the optical window forming portion and the photosensitive element, thereby reducing the possibility of generation of 'flash'.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein an outer surface of the top side of the optical window forming portion extends in a direction having a small angle with an optical axis, so as to slow down a flow rate of the molding material entering the filling groove to some extent, reduce a pressure generated by the molding material entering the filling groove, and reduce a possibility of generation of "flash".
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the optical window forming portion does not need to be pressed onto the photosensitive element with a large pressure because the molding material is not easy to form 'flash' in an integral molding process, thereby preventing the photosensitive element from being crushed.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein two angles are formed between the outer surface of the optical window forming portion of the forming mold and the optical axis, wherein the outer surface of the bottom side has an inclined angle, and the height of the inclined outer surface of the bottom side is more than 0.05 mm, so as to prevent the elastic coating film covering the optical window forming portion from being easily punctured during the molding process.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the molding base has a plurality of inner surfaces extending integrally, and the inner surface of the top side and the optical axis have a smaller included angle relative to the inner surface of the bottom side and the optical axis, so that the inner surface of the molding base extends in a turning manner, and the inner surface of the bottom side and the photosensitive element have a smaller size of the molding material, so that the molding material is not easy to form 'flash' on the photosensitive element.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a method for manufacturing the same, wherein the mold base includes a photosensitive element coupling portion and a top side extension portion integrally extended, inner surfaces of which have different extension angles, wherein the top side extension portion has a smaller angle with an optical axis, thereby increasing an area of a top surface of the top side extension portion, thereby providing a larger area of a mounting surface for a lens or a filter holder or a lens assembly above the camera module for stably mounting the lens, the filter holder or the lens assembly.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a method of manufacturing the same, in which an inner surface of the photosensitive element bonding portion of the mold base extends obliquely to facilitate a mold releasing operation in a molding process and to reduce stray light reaching the photosensitive element, and an inner surface of the top-side extension portion integrally extends inflected from the inner surface of the photosensitive element bonding portion so that the photosensitive element bonding portion and the top-side extension portion cooperate to maximize an area of a top surface of the mold base with reduced stray light.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein an inner surface of the top side extension integrally extends from the photosensitive element combining portion in a turning manner, so as to prevent a light window forming portion of a forming die from pressing on a connecting wire connecting the photosensitive element and the circuit board in a molding process to damage the connecting wire.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the top side extension portion has a smaller included angle with an optical axis, so that the area of the filter element can be reduced.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a method for manufacturing the same, wherein a light shielding layer is disposed on a filter element body of a filter element of the photosensitive assembly of the camera module, so that an effective light transmission region is formed in a central region of the filter element body to reduce stray light reaching an interior of a mold base.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein in some embodiments, the light shielding layer is disposed on the bottom side of the filter element body to reduce light incident on the inner surface of the top-side extension portion, so as to prevent the light incident on the inner surface of the top-side extension portion from being reflected to reach the photosensitive element to form stray light, which affects the imaging quality of the camera module.
To achieve at least one of the above objects, the present invention provides a method for manufacturing a photosensitive assembly of a camera module, comprising the steps of:
(a) fixing a circuit board jointed board to a second mold of a forming mold, wherein the circuit board jointed board comprises one or more rows of circuit boards, each row of circuit boards comprises one or more circuit boards arranged side by side, each circuit board comprises a rigid area and a flexible area which are combined, and each circuit board can be operatively connected with a photosensitive element;
(b) closing the second mold and a first mold, and filling a molten molding material into a base panel forming guide groove in the forming mold, wherein a position corresponding to at least one optical window forming portion is prevented from being filled with the molding material; and
(c) curing the molding material in the base panel forming guide groove to form a conjoined molding base at a position corresponding to the base panel forming guide groove, wherein the conjoined molding base is integrally formed with one or more rows of the circuit boards and one or more rows of the photosensitive elements corresponding to the base panel forming guide groove to form a photosensitive assembly panel and form an optical window providing a light path for each photosensitive element at a position corresponding to the optical window forming part, wherein the base panel forming guide groove has a first guide groove corresponding to a first end side of the conjoined molding base adjacent to the flexible region, a second guide groove corresponding to the conjoined molding base away from the flexible region, and a plurality of filling grooves extending between the first guide groove and the second guide groove, wherein the first guide groove has a first side surface facing the optical window, the second diversion trench has a second side surface facing the optical window, wherein the first side surface includes a first partial surface disposed adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and the second side surface has a third partial surface disposed adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a first angle of the first partial surface with respect to an optical axis of the camera module is larger than a second angle of the second partial surface with respect to the optical axis, and a third angle of the third partial surface with respect to the optical axis is larger than a fourth angle of the fourth partial surface with respect to the optical axis.
The photosensitive assembly splicing plate is used for manufacturing a plurality of photosensitive assemblies, wherein the method further comprises the following steps: further comprising the steps of: cutting the photosensitive assembly jointed board to obtain a plurality of photosensitive assemblies, wherein each photosensitive assembly comprises the circuit board, the photosensitive element and the molding base, wherein the molding base is integrally formed on the circuit board and the photosensitive element and forms the optical window for providing a light path for the photosensitive element.
According to another aspect of the present invention, the present invention provides a photosensitive assembly of a camera module, comprising:
a circuit board comprising a rigid region and a flexible region in combination;
a photosensitive element; and
a molding base, wherein the molding base is integrally formed on the circuit board and the photosensitive element and forms an optical window for providing a light path for the photosensitive element; wherein a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the optical window, the first side surface includes a first partial surface disposed adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and a first angle of the first partial surface with respect to an optical axis of the camera module is larger than a second angle of the second partial surface with respect to the optical axis; the second side surface corresponding to the opposite second end side of the molding base away from the flexible region is provided with a second side surface facing the light window, the second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected with the third partial surface, and the third angle of the third partial surface relative to the optical axis is larger than the fourth angle of the fourth partial surface relative to the optical axis.
According to another aspect of the present invention, the present invention further provides a photo-sensing module jigsaw, which includes:
one or more columns of circuit boards, each column of circuit boards comprising one or more circuit boards arranged side-by-side, each of said circuit boards comprising a rigid region and a flexible region in combination;
one or more rows of photosensitive elements; and
one or more conjoined molded bases, each conjoined molded base being integrally formed on a row of the circuit board and a row of the photosensitive elements and forming an optical window for providing a light path for each photosensitive element; the side, corresponding to the first end of the connected molding base, of the flexible area is provided with a first side surface facing the light window, the first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected with the first partial surface, and the first angle of the first partial surface relative to the optical axis of the camera module is larger than the second angle of the second partial surface relative to the optical axis; and a second side surface facing the light window is arranged on the opposite second end side of the conjoined molding base away from the flexible region, the second side surface comprises a third part surface arranged adjacent to the photosensitive element and a fourth part surface connected with the third part surface, and the third angle of the third part surface relative to the optical axis is larger than the fourth angle of the fourth part surface relative to the optical axis.
According to another aspect of the present invention, the present invention further provides a photo-sensing module jigsaw, which includes:
a plurality of rows of circuit boards, each row of circuit boards comprising one or more circuit boards arranged side by side, each circuit board comprising a rigid region and a flexible region joined together;
a plurality of rows of photosensitive elements; and
one or more one-piece molded bases, each of which is integrally formed on two adjacent rows of the circuit boards and two adjacent rows of the photosensitive elements and forms an optical window for providing a light path for each of the photosensitive elements, and the two adjacent rows of the circuit boards are arranged such that flexible regions thereof are distant from each other and rigid regions thereof are adjacent to each other, so that each of the one-piece molded bases has both end sides adjacent to the flexible regions; the side, corresponding to the first end of the connected molding base, of the flexible area is provided with a first side surface facing the light window, the first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected with the first partial surface, and the first angle of the first partial surface relative to the optical axis of the camera module is larger than the second angle of the second partial surface relative to the optical axis; the conjoined molding base extends to a second end side between the two adjacent rows of photosensitive elements and is provided with a second side surface facing the optical window, the second side surface comprises a third part surface adjacent to the photosensitive elements and a fourth part surface connected with the third part surface, and the third angle of the third part surface relative to the optical axis is larger than the fourth angle of the fourth part surface relative to the optical axis.
According to another aspect of the present invention, the present invention further provides a camera module, including:
a lens;
a circuit board comprising a rigid region and a flexible region in combination;
a photosensitive element; and
a molding base, wherein the molding base is integrally formed on the circuit board and the photosensitive element and forms an optical window for providing a light path for the photosensitive element, and the lens is located in a photosensitive path of the photosensitive element; wherein a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window, the first side surface includes a first partial surface disposed adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and a first angle of the first partial surface with respect to the optical axis is larger than a second angle of the second partial surface with respect to the optical axis; the second side surface corresponding to the opposite second end side of the molding base away from the flexible region is provided with a second side surface facing the light window, the second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected with the third partial surface, and the third angle of the third partial surface relative to the optical axis is larger than the fourth angle of the fourth partial surface relative to the optical axis.
According to another aspect of the present invention, there is provided a molding die for manufacturing a panel of a photosensitive assembly for use in a camera module, comprising a first die and a second die adapted to be separated from and mated with each other, wherein the first and second dies form a molding cavity when mated with each other, and the molding die is configured with at least an optical window molding portion and a base panel molding guide groove formed around the optical window molding portion in the molding cavity and adapted to fix a circuit board panel in the molding cavity, wherein the circuit board panel comprises one or more rows of circuit boards, each row of circuit boards comprises one or more circuit boards arranged side by side, each circuit board comprises a rigid region and a flexible region joined together, and each circuit board is operatively connected with a photosensitive element, the base panel molding guide groove is adapted to be filled with a molding material to form a connected molding base at a position corresponding to the base molding guide groove of the panel A base, wherein the one-piece molding base is integrally formed with each row of the circuit board and each row of the photosensitive element corresponding to each row of the circuit board and each row of the photosensitive element to form the photosensitive assembly panel and an optical window providing a light path for each photosensitive element at a position corresponding to the optical window forming portion, wherein the base panel forming guide groove has a first guide groove corresponding to a first end side of the one-piece molding base adjacent to the flexible region and a second guide groove corresponding to the one-piece molding base away from the flexible region, and a plurality of filling grooves extending between the first guide groove and the second guide groove, wherein each optical window forming portion is located between two adjacent filling grooves, wherein the first guide groove has a first side surface facing the optical window, and the second guide groove has a second side surface facing the optical window, wherein the first side surface includes a first partial surface disposed adjacent to the photosensitive element and a second partial surface connected to the first partial surface A partial surface having a third partial surface disposed adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a first angle of the first partial surface with respect to the optical axis is larger than a second angle of the second partial surface with respect to the optical axis, and a third angle of the third partial surface with respect to the optical axis is larger than a fourth angle of the fourth partial surface with respect to the optical axis.
According to another aspect of the present invention, there is provided a molding mold for manufacturing a photo-sensing module panel for use in a camera module, comprising a first mold and a second mold adapted to be separated from and mated with each other, wherein the first and second molds form a molding cavity when mated with each other, and the molding mold is configured with an optical window molding portion and a base panel molding guide groove formed around the optical window molding portion in the molding cavity and adapted to fix a circuit board panel in the molding cavity, wherein the circuit board panel comprises a plurality of rows of circuit boards, each row of circuit boards comprising one or more circuit boards arranged side by side, each circuit board comprising a rigid region and a flexible region joined together, and each circuit board being operatively connected with a photo-sensing element, wherein the base panel molding guide groove is adapted to be filled with a molding material to form a one-piece molded base at a position corresponding to the base panel molding guide groove, wherein the conjoined molding base is integrally formed on two adjacent rows of the circuit boards and two adjacent rows of the photosensitive elements to form the photosensitive assembly jointed board and form an optical window for providing a light path for each photosensitive element at a position corresponding to the optical window forming part, wherein the two adjacent rows of the circuit boards are arranged such that the flexible regions thereof are far away from each other and the rigid regions thereof are adjacent to each other, wherein the base jointed board forming guide groove has two first guide grooves corresponding to two end sides of the conjoined molding base adjacent to the flexible regions and a second guide groove corresponding to a region between the two adjacent rows of the photosensitive elements, and a plurality of filling grooves extending between the two first guide grooves and the second guide groove, wherein each optical window forming part is located between the two adjacent filling grooves, wherein the first guide groove has a first side surface facing the optical window, the second guiding trench has a second side surface facing the optical window, wherein the first side surface comprises a first partial surface disposed adjacent to the light sensing element and a second partial surface connected to the first partial surface, and the second side surface comprises a third partial surface disposed adjacent to the light sensing element and a fourth partial surface connected to the third partial surface, wherein a first angle of the first partial surface with respect to the optical axis is larger than a second angle of the second partial surface with respect to the optical axis, and a third angle of the third partial surface with respect to the optical axis is larger than a fourth angle of the fourth partial surface with respect to the optical axis.
The present invention also provides a photosensitive assembly, comprising:
a circuit board;
a photosensitive element, said photosensitive element being operatively connected to said circuit board; and
a molding base, the molding base is integrally combined with the circuit board and the photosensitive element and forms an optical window, wherein the molding base has one or more first part inner surfaces adjacent to the photosensitive element and one or more second part inner surfaces far away from the photosensitive element and connected with the first part inner surfaces, an included angle alpha is formed between the first part inner surfaces and the optical axis of the photosensitive component, an included angle beta is formed between the second part inner surfaces and the optical axis of the photosensitive component, and beta is less than alpha.
According to another aspect of the present invention, the present invention further provides a camera module, including:
a lens;
a circuit board;
the photosensitive element is operatively connected to the circuit board, and the lens is positioned on a photosensitive path of the photosensitive element; and
and the molding base is integrally combined with the circuit board and the photosensitive element and forms an optical window, wherein the molding base is provided with a first part inner surface close to the photosensitive element and a second part inner surface far away from the photosensitive element and connected to the first part inner surface, an included angle alpha is formed between the first part inner surface and the optical axis of the camera module, and an included angle beta is formed between the second part inner surface and the optical axis of the camera module, wherein beta is less than alpha.
According to another aspect of the present invention, there is provided a molding die for manufacturing at least one photosensitive assembly applied to a camera module, the photosensitive assembly including a circuit board, a photosensitive element and a molding base, wherein the molding base is integrally molded with the circuit board and the photosensitive element and forms an optical window, wherein the molding die includes a first die and a second die adapted to be separated from and joined to each other, and at least one optical window molding portion and a base molding guide groove formed around the optical window molding portion are disposed therein, the circuit board connected with the photosensitive element is placed in the molding die and the first and second dies are joined to each other, a molten molding material is filled into the base molding guide groove and cured to form the molding base, the optical window is formed at a position corresponding to the optical window molding portion, the light window forming part is provided with at least one first partial outer surface and at least one second partial outer surface from the bottom side to the top side, included angles alpha and beta are formed between the first partial outer surface and the second partial outer surface respectively and perpendicular to an optical axis of the photosensitive element, and alpha is larger than beta.
According to another aspect of the present invention, the present invention further provides an electronic device, which includes one or more of the camera modules described above. Including, but not limited to, cell phones, computers, televisions, smart wearable devices, vehicles, cameras, and surveillance equipment.
Drawings
Fig. 1A is a schematic structural diagram of a forming mold for obtaining a photosensitive component by packaging in an integrated packaging process in the prior art.
Fig. 1B is a schematic diagram of a conventional integrated packaging process to form an integrated package assembly.
Fig. 1C is an enlarged structural view illustrating forward flow of the encapsulating material along two flow paths in the conventional integrated encapsulating process.
Fig. 1D is an enlarged structural diagram illustrating a partial underfill of an encapsulating material in a conventional integrated packaging process.
FIG. 1E is a graphical representation of the trend of the viscosity of the molding materials over the curing time.
Fig. 1F illustrates a schematic structural diagram of a camera module made of a photosensitive component packaged by a conventional integrated packaging process.
Fig. 2 is a block diagram schematically illustrating an apparatus for manufacturing a panel of a photosensitive member of a camera module according to a first preferred embodiment of the present invention.
Fig. 3A is a schematic structural diagram of a forming mold of an apparatus for manufacturing a jigsaw puzzle of a photosensitive element of a camera module according to the first preferred embodiment of the present invention.
Fig. 3B is an enlarged schematic structural view of a partial region a of the first mold of the forming mold of the manufacturing apparatus for the panels of the photosensitive elements of the camera module according to the first preferred embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a panel of a photosensitive element of the camera module according to the first preferred embodiment of the invention.
Fig. 5A is an enlarged schematic structural diagram of the photosensitive assembly of the camera module according to the first preferred embodiment of the invention.
Fig. 5B is an enlarged schematic view of the photosensitive assembly of the camera module according to the first preferred embodiment of the invention.
Fig. 6A is a cross-sectional view of the photosensitive member of the camera module according to the first preferred embodiment of the present invention taken along the line C-C in fig. 5.
Fig. 6B is a cross-sectional view of the second end side of the photosensitive member of the camera module according to the above-described first preferred embodiment of the present invention further cut.
Fig. 7A is a sectional view showing a case where a molten molding material is pushed into the base panel forming guide groove in the molding die of the photosensitive assembly panel according to the above-described first preferred embodiment of the present invention, wherein the sectional view is a sectional view corresponding to the direction of line a-a shown in fig. 4.
Fig. 7B is a partially enlarged schematic view at B in fig. 7A.
Fig. 8 is a sectional view showing the photosensitive assembly panel according to the first preferred embodiment of the present invention, when the molding groove of the base panel is filled with the molten molding material in the molding mold, wherein the sectional view is a sectional view corresponding to the direction of line a-a shown in fig. 4.
FIG. 9 is a sectional view showing the photosensitive member panel according to the first preferred embodiment of the present invention when the molding groove of the base panel is filled with the molten molding material in the molding die, wherein the sectional view is a sectional view corresponding to the direction of line B-B shown in FIG. 4
Fig. 10 is a cross-sectional view corresponding to the direction of line a-a in fig. 4 illustrating a step of demolding the mold for forming the jointed molded base of the photosensitive element panel according to the first preferred embodiment of the present invention.
Fig. 11 is a schematic perspective view of the camera module according to the first preferred embodiment of the present invention.
Fig. 12 is an exploded view of the camera module according to the first preferred embodiment of the present invention.
Fig. 13A illustrates a sectional view of the camera module according to the above first preferred embodiment of the present invention, taken along the line D-D in fig. 12.
Fig. 13B illustrates a sectional view of the camera module according to the above first preferred embodiment of the present invention, taken along the line E-E in fig. 12.
Fig. 14 shows a cross-sectional view of a variant of the camera module according to the above-described first preferred embodiment of the invention.
Fig. 15 illustrates a sectional view of a camera module according to another variant of the camera module according to the above-described first preferred embodiment of the present invention.
Fig. 16 illustrates a sectional view of a camera module according to another variant of the camera module according to the above-described first preferred embodiment of the present invention.
Fig. 17A is a schematic structural diagram of a forming mold of an apparatus for manufacturing a panel of a photosensitive element of a camera module according to a second preferred embodiment of the invention.
Fig. 17B is an enlarged structural view of a portion C of the first mold of the forming mold of the manufacturing apparatus for the panels of the photosensitive elements of the camera module according to the second preferred embodiment of the present invention.
Fig. 18 is a schematic structural diagram of a panel of a photosensitive element of the camera module according to the second preferred embodiment of the invention.
Fig. 19A is an enlarged schematic structural view of the panel D of the photosensitive element of the camera module according to the second preferred embodiment of the invention.
Fig. 19B is an enlarged structural view of two adjacent photosensitive elements of the panel of the photosensitive element of the camera module according to the second preferred embodiment of the present invention.
Fig. 20A is a sectional view of the panel of the photosensitive member of the camera module according to the second preferred embodiment of the present invention taken along the line H-H in fig. 19A.
Fig. 20B is a schematic structural view of the photo module panel of the camera module according to the second preferred embodiment of the present invention cut to obtain two photo modules.
Fig. 21A is a sectional view showing a molten molding material pushed into the base panel molding guide groove in the molding die of the photosensitive assembly panel according to the second preferred embodiment of the present invention, wherein the sectional view is a sectional view corresponding to the direction of line F-F shown in fig. 18.
Fig. 21B is a partially enlarged schematic view at E in fig. 21A.
Fig. 22 is a sectional view showing the photosensitive member panel according to the second preferred embodiment of the present invention, when the molding groove of the base panel is filled with the molten molding material in the molding die, wherein the sectional view is a sectional view corresponding to the direction of line F-F shown in fig. 18.
Fig. 23 is a sectional view showing the photosensitive assembly panel according to the second preferred embodiment of the present invention, when the molding groove of the base panel is filled with the molten molding material in the molding die, wherein the sectional view is a sectional view corresponding to the direction of line G-G shown in fig. 18.
Fig. 24 is a cross-sectional view corresponding to the direction of line F-F in fig. 18, illustrating a step of demolding the mold for forming the jointed molded base of the photosensitive element panel according to the second preferred embodiment of the present invention.
Fig. 25A to 25C are cross-sectional views illustrating a panel of the photosensitive member according to a modified embodiment of the above-described first and second preferred embodiments of the present invention, respectively, and enlarged structural views of the photosensitive member cut out therefrom.
Fig. 26A is a schematic structural view illustrating a panel of a photosensitive assembly according to another modified embodiment of the second preferred embodiment of the present invention.
Fig. 26B is an enlarged schematic structural view illustrating a photosensitive assembly according to another modified embodiment of the second preferred embodiment of the present invention.
Fig. 27 is a sectional view illustrating a photosensitive assembly according to another modified embodiment of the above-described second preferred embodiment of the present invention, taken along the line I-I in fig. 26.
Fig. 28 is a schematic exploded perspective view of a camera module according to a third preferred embodiment of the invention.
Fig. 29A is a schematic structural diagram of a camera module according to a third preferred embodiment of the invention.
Fig. 29B is an enlarged schematic view of J in fig. 29A.
Fig. 30 is a schematic diagram illustrating that the bottom side of the photosensitive element of the camera module is pasted with the light shielding layer to effectively reduce the stray light reflected to the photosensitive element according to the third preferred embodiment of the invention.
Fig. 31A is a sectional view illustrating the molten molding material pushed into the base forming guide groove in the molding die in the molding process according to the above-described third preferred embodiment of the present invention.
FIG. 31B is a sectional view showing the filling of the base forming guide groove with the molten molding material according to the above-described third preferred embodiment of the present invention.
Fig. 31C illustrates a cross-sectional view of the molded base formed by performing the demolding step according to the above-described third preferred embodiment of the present invention.
Fig. 32A is a schematic diagram illustrating that the light-shielding layers are attached to two sides of the photosensitive component according to a modified example of the third preferred embodiment of the present invention, so as to effectively reduce stray light.
Fig. 32B illustrates a cross-sectional view of a camera module according to another variation of the above-described third preferred embodiment of the present invention.
Fig. 33 is a sectional view illustrating a camera module according to another modified example of the above-described third preferred embodiment of the present invention.
Fig. 34 illustrates a cross-sectional view of a camera module according to another variation of the above-described third preferred embodiment of the present invention.
Fig. 35 is an exploded perspective view illustrating a camera module according to a fourth preferred embodiment of the present invention.
Fig. 36A is a sectional view of the camera module according to the fourth preferred embodiment of the present invention taken along the direction of line K-K in fig. 35.
Fig. 36B is an enlarged schematic view at L in fig. 36A.
Fig. 37 is a schematic diagram illustrating that the light-shielding layer is attached to the bottom side of the photosensitive element of the camera module according to the fourth preferred embodiment of the invention to effectively reduce the stray light reflected to the photosensitive element.
Fig. 38 is a sectional view of a camera module according to a modified embodiment of the fourth preferred embodiment of the present invention.
Fig. 39 is a schematic exploded perspective view of a camera module according to a fifth preferred embodiment of the present invention.
Fig. 40 is a sectional view of the camera module according to the fifth preferred embodiment of the present invention taken along the line M-M of fig. 39.
Fig. 41 is a schematic diagram illustrating that the light-shielding layer is attached to the bottom side of the photosensitive element of the camera module according to the fifth preferred embodiment of the invention to effectively reduce the stray light reflected to the photosensitive element.
Fig. 42 is a sectional view illustrating a camera module according to a variation of the above-described fifth preferred embodiment of the present invention.
Fig. 43 is a sectional view illustrating a camera module according to another modified embodiment of the above-described fifth preferred embodiment of the present invention.
Fig. 44 is a schematic structural diagram of the camera module applied to the intelligent electronic device according to the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
Fig. 2 to 14 show a camera module 100 and a photosensitive assembly 10 according to a first preferred embodiment of the present invention and a method for manufacturing the same. The camera module 100 can be applied to various electronic devices 300, the electronic device 300 includes a device body 301 and one or more camera modules 100 installed on the device body 301, as shown in fig. 44, the electronic device 30 is, for example and without limitation, a smart phone, a wearable device, a computer device, a television, a vehicle, a camera, a monitoring device, and the like, and the camera modules cooperate with the electronic device to capture and reproduce images of a target object.
More specifically, a photosensitive assembly 10 of the camera module 100 and a manufacturing apparatus 200 thereof are illustrated. The photosensitive assembly 10 includes a circuit board 11, a molding base 12 and a photosensitive element 13, wherein the molding base 12 is integrally formed on the circuit board 11 and the photosensitive element 13 and forms an optical window 122 for providing a light path to the photosensitive element 13. The mold base 12 of the present invention is integrally molded with the circuit board 11 and the photosensitive element 13 by the molding process, more specifically, the transfer molding process, through the manufacturing apparatus 200, so that the mold base 12 can replace a lens holder or a bracket of a conventional camera module, and does not need to attach the lens holder or the bracket to the circuit board 11 by glue, similar to the conventional packaging process.
Further, referring to fig. 2-4 and 7A to 10, the present invention manufactures a photosensitive assembly panel 1000 by the manufacturing apparatus 200, i.e., the photosensitive assembly panel 1000 having a plurality of photosensitive assemblies 10 is manufactured by a panel process. The photosensitive assembly panel 1000 includes a circuit board panel 1100 and one or more integrally molded bases 1200. The circuit board assembly 1100 includes a plurality of rows of circuit boards, such as the 4 rows illustrated in fig. 4, each row of circuit boards including a plurality of circuit boards 11, such as 2-12 of the circuit boards 11, illustrated as 6 of the circuit boards 11, each of the circuit boards 11 being operatively connected to a light sensing element 13. Each of the one-piece molding bases 1200 is formed on a row of the circuit boards and integrally formed on at least a portion of the non-photosensitive area 132 of each of the photosensitive elements 13 of a row of the photosensitive elements 13 and exposes the photosensitive area 131 of the photosensitive element 13. Each of the one-piece molding bases 1200 has a plurality of light windows 122, and the position of each of the light windows 122 corresponds to each of the light sensing elements 13, so as to provide a light path for the corresponding light sensing element 13.
The manufacturing apparatus 200 of the photo-sensing module panel 1000 of the camera module 100 includes a molding mold 210, a molding material feeding mechanism 220, a mold fixing device 230, a temperature control device 250 and a controller 260, wherein the molding material feeding mechanism 220 is used for supplying a molding material 14 to a base panel molding guide groove 215. The mold fixing device 230 is used for controlling opening and closing of the molding mold 210, the temperature control device 250 is used for heating the molding material 14 having thermosetting property, and the controller 260 is used for automatically controlling the operations of the molding material supply mechanism 220, the mold fixing device 230, and the temperature control device 250 in the molding process.
The forming mold 210 includes a first mold 211 and a second mold 212 capable of opening and closing under the action of the mold fixing device 230, that is, the mold fixing device 230 can separate and close the first mold 211 and the second mold 212 to form a forming cavity 213, when closing, the circuit board panels 1100 are fixed in the forming cavity 213, and the fluid molding material 14 enters the forming cavity 213, so as to be integrally formed on each row of the circuit boards 11 and each corresponding row of the photosensitive elements 13, and after curing, the one-piece molding base 1200 integrally formed on each row of the circuit boards 11 and each row of the photosensitive elements 13 is formed.
More specifically, molding module 210 further has one or more base panel molding channels 215 and includes a plurality of optical window molding sections 214 located within base panel molding channels 215. When the first and second molds 211 and 212 are closed, the optical window forming portion 214 and the base panel forming guide groove 215 extend into the forming cavity 213, and the fluid-shaped molding material 14 is filled into the base panel forming guide groove 215, and the position corresponding to the optical window forming portion 214 cannot be filled with the fluid-shaped molding material 14, so that the fluid-shaped molding material 14 is cured at the position corresponding to the base panel forming guide groove 215 to form the one-piece molding base 1200, which includes the annular molding main body 121 corresponding to the molding base 12 of each photosensitive assembly 10, and the optical window 122 of the molding base 12 is formed at the position corresponding to the optical window forming portion 214. The molding material 14 may be selected from, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, and the like.
The first and second molds 211 and 212 may be two molds capable of relative movement, e.g., one of the two molds may be fixed and the other movable; or both molds may be movable, the invention is not limited in this respect. In the example of this embodiment of the invention, the first mold 211 is embodied as a fixed upper mold, while the second mold 212 is embodied as a movable lower mold. The stationary upper mold and the movable lower mold are coaxially arranged, and as the movable lower mold is slidable in the upward direction along a plurality of positioning axes, the molding cavity 213 can be formed to be tightly closed when the upper mold is clamped.
The second mold 212, i.e., the lower mold, may have a circuit board positioning groove 2121, which may be recessed or formed with positioning posts, for mounting and fixing the circuit board 11, and the optical window forming part 214 and the base panel forming guide groove 215 may be formed in the first mold 211, i.e., the upper mold, to form the forming cavity 213 when the first and second molds 211 and 212 are closed. And the molding material 14 in fluid form is injected into the base panel forming guide groove 215 of the top side of the circuit board panel 1100, thereby forming the one-piece molded base 1200 on the top side of each row of the circuit boards 11 and each row of the photosensitive elements 13.
It is understood that the circuit board positioning groove 2121 may also be formed in the first mold 211, i.e. the upper mold, for mounting and fixing the circuit board panel 1100, and the optical window forming portion 214 and the base panel forming guide groove 215 may be formed in the second mold 211, so that the forming cavity 213 is formed when the first and second molds 211 and 212 are closed. The circuit board panels 1100 may be arranged in the upper mold in a front facing orientation and the molding material 14 in fluid form is injected into the base panel molding channels 215 at the bottom side of the inverted circuit board panels 1100, thereby forming the overmolded base 1200 at the bottom side of the inverted circuit board panels 1100.
More specifically, when the first and second molds 211 and 212 are closed and the molding step is performed, the optical window forming part 214 is overlapped and closely attached to the top surface of the photosensitive element 13, so that the fluid molding material 14 is prevented from entering the photosensitive area 1311 of the top surface 131 of the photosensitive element 13 on the circuit board 11, and the optical window 122 of the one-piece molding base 1200 can be finally formed at a position corresponding to the optical window forming part 214. It is understood that the light window forming part 214 may be a solid structure, or may be a structure having a groove shape inside as shown in the drawing.
It will be appreciated that the molding surface of the first mold 211 forming the base panel molding guide slot 215 may be configured to be flat and in the same plane, so that when the molding base 12 is cured, the top surface of the molding base 12 is flat, thereby providing a flat mounting condition for optical components above the photosensitive assembly 10 of the camera module 100, such as the driver, the lens and the fixed lens barrel, and reducing the tilt error of the camera module 100 after assembly.
It should be noted that the base panel forming guide groove 215 and the light window forming portion 214 may be integrally formed on the first mold 211. Alternatively, first mold 211 further comprises a detachable molding structure, which forms base panel molding guide groove 215 and optical window molding portion 214. Thus, different shapes and sizes of the base panel forming guide slots 215 and the light window forming portion 214 can be designed according to different shapes and sizes of the photosensitive assembly 10, such as the diameter and thickness of the molded base, and the like. In this way, only different molding structures need to be replaced, and the manufacturing equipment can be suitable for the photosensitive assemblies 10 with different specification requirements. It will be appreciated that the second mold 212 may also include a removable retaining block to provide the recess 2121 with different shapes and sizes to facilitate replacement of the circuit board 11 for different shapes and sizes.
It is to be understood that the molding material 14 is a thermosetting material, and the molding material 14 is changed into a fluid state by heating and melting the thermosetting material in a solid state. During the molding process, the thermosetting molding material 14 is cured by a further heating process and is no longer melted after being cured, thereby forming the one-piece molded base 1200.
It is understood that in the molding process of the present invention, the molding material 14 may be in the form of a block, a granule, or a powder, which is heated to become fluid in the forming mold 210 and then solidified to form the one-piece molded base 1200.
More specifically, each of the base tile forming guide grooves 215 of the present invention has a first guide groove 2151 and a second guide groove 2152 which are substantially parallel to each other, and a plurality of filling grooves 2153 extending between the first guide groove 2151 and the second guide groove 2152, wherein the filling grooves 2153 are formed between two adjacent optical window forming portions 214, as shown in the figure, the base tile forming guide groove 215 has 7 filling grooves 2153, and 6 optical window forming portions 214 are respectively located between two adjacent filling grooves 2153. The molding material 14 flows along the first and second channels 2151, 2152 from the feed end 215A thereof toward the end 215B thereof, and the molding material 14 is able to fill each of the fill channels 2153, thereby forming the one-piece molded base 1200 after the molding material 14 is cured.
Referring to fig. 7A to 10, which are schematic diagrams illustrating a manufacturing process of the photosensitive assembly panel 1000 of the camera module 100 according to the preferred embodiment of the present invention, as shown in fig. 7A, the forming mold 210 is in a mold clamping state, the circuit board panel 1100 to be molded and the solid molding material 14 are ready to be positioned, the solid molding material 14 is heated, so that the molding material 14 is fed into the base panel forming guide groove 215 while being melted into a fluid state or a semi-solid semi-fluid state, and flows forward along the first guide groove 2151 and the second guide groove 2152 to fill the filling groove 2153 between two adjacent optical window forming portions 214.
As shown in fig. 8 and 9, when the fluid molding material 14 is completely filled in the base panel forming guide groove 215, the fluid molding material 14 is cured and formed into the connected molding base 1200 integrally formed on each row of the circuit board 11 and each row of the photosensitive element 13 through a curing process.
As shown in fig. 10, after the molding material 14 is cured to form the one-piece molding base 1200, the demolding process of the present invention is performed, that is, the mold fixing device 230 moves the first and second molds 211 and 212 away from each other, so that the light window forming part 214 moves away from the one-piece molding base 1200, and the light windows 122 corresponding to the respective photosensitive elements 13 are formed in the one-piece molding base 1200.
As shown in fig. 4-6, the panel 1000 may be further cut to form individual photosensitive elements 10. Each photosensitive assembly 10 includes at least one circuit board 11, at least one photosensitive element 13, and the molding base 12 integrally molded with the circuit board 11 and the photosensitive element 13. Each of the circuit boards 11 includes a rigid region 111 and a flexible region 112 that are bonded, that is, each of the circuit boards 11 may be implemented as a rigid-flex board in this embodiment of the present invention. Wherein the molding base 12 integrally forms the rigid region 111 of the circuit board 11 and at least a portion of the non-photosensitive region 132 of the photosensitive element 13, and forms the optical window 122 providing a light path for the photosensitive region 131 of the photosensitive element 13.
It should be noted that the manufacturing method of the photo sensor assembly panel 1000 of the present invention is suitable for manufacturing the photo sensor assembly 10 with a small size. Therefore, the volumes of first and second channels 2151 and 2152 are small during the molding process. As can be seen from fig. 7A to 10, the first and second guide grooves 2151 and 2152 have a substantially trapezoidal shape in cross section. The widths of the bottom ends of the first guide groove 2151 and the second guide groove 2152 are limited by the size and cannot be widened.
Thus, according to an embodiment of the present invention, the inner surface of unitary molded base 1200 facing light window 122, i.e., first side surface 1201 of first channel 2151 and second side surface 1202 of second channel 2152, is configured in a two-ended configuration.
Specifically, as shown in fig. 6A and 6B, the first side surface 1201 includes a first partial surface 1203 disposed adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface, and a first angle of the first partial surface 1203 with respect to an optical axis of the image pickup module is larger than a second angle of the second partial surface 1204 with respect to the optical axis. That is, as seen from fig. 6A and 6B, the first partial surface 1203 and the second partial surface 1204 extend in a direction from bottom to top, and the inclination degree of the first partial surface 1203 is larger than that of the second partial surface 1204. Thus, as second portion surface 1204 is tilted toward the light window relative to first portion surface 1203, the cross-sectional area of first channel 2151 is increased, thereby further increasing the volume of first channel 2151.
Similarly, the second side surface 1202 includes a third partial surface 1205 disposed adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface, and a third angle of the third partial surface 1205 with respect to the optical axis of the camera module is larger than a fourth angle of the fourth partial surface 1206 with respect to the optical axis. That is, as viewed in fig. 6A and 6B, the third partial surface 1205 and the fourth partial surface 1206 extend in the direction from bottom to top, and the degree of inclination of the third partial surface 1205 is greater than that of the fourth partial surface 1206. Thus, as the fourth portion surface 1206 is inclined with respect to the third portion surface 1205 toward the light window, the cross-sectional area of the second guide groove 2152 is increased, thereby further increasing the volume of the second guide groove 2152.
Preferably, in the present embodiment, the cross-sectional design of the first and second guide grooves 2151 and 2152 has symmetry, i.e. the first angle of the first part surface 1203 is equal to the third angle of the third part surface 1205, and the second angle of the second part surface 1204 is equal to the fourth angle of the fourth part surface 1206.
Considering the influence of stray light of the camera module, the first angle and the third angle are set to be 3-80 degrees. And, the second angle and the fourth angle are set to 0 to 20 deg. in consideration of other factors of the module process and the structure and material characteristics of the mold base of the camera module.
Here, it should be noted that the second angle and the fourth angle in the embodiment of the present invention are further preferably set to 0 degree, that is, the second partial surface 1204 and the fourth partial surface 1206 extend vertically upward relative to the surface of the photosensitive element 13, so that on one hand, the sectional area of the guiding groove can be increased to the maximum extent, and on the other hand, the light of the camera module incident on the photosensitive chip is not affected.
It will be appreciated by those skilled in the art that the cross-sectional shape of the channels will, on the one hand, have an effect on the flow of the moulding material and, on the other hand, directly determine the cross-sectional shape of the resulting moulded base.
By the two-part design of the first side surface 1201 and the second side surface 1202, i.e. by the smaller inclination of the second part surface 1204 with respect to the first part surface 1203 and the smaller inclination of the fourth part surface 1206 with respect to the third part surface 1205, the area of the upper surface of the mold base can be further increased, facilitating the carrying of other components of the camera module, such as the lens holder.
Therefore, in the embodiment of the present invention, in addition to the influence of the specific shape and size factor on the cross-sectional shape of the guide groove, the influence of the shape and size factor on the shape of the mold base needs to be further considered.
Specifically, since the mold base needs to cover the connection line 15, the heights of the first side surface 1201 and the second side surface 1202 in the direction perpendicular to the surface of the photosensitive element 13 need to be further defined.
Preferably, in the embodiment of the present invention, the first height and the third height of the first partial surface 1203 and the third partial surface 1205 in the direction perpendicular to the surface of the photosensitive element 13 are 0.05 mm to 0.7 mm, respectively. In this way, it is ensured that the moulded base is formed so as to cover the connection line 15 well. Further, considering the structural factors that the mold base as a whole covers the connecting line 15, and further carries the lens holder, the second height and the fourth height of the second partial surface 1204 and the fourth partial surface 1206, respectively, in the direction perpendicular to the surface of the photosensitive element 13 are 0.02 mm to 0.6 mm.
The height of the base of the module can be further increased by the second part surface 1204 and the fourth part surface 1206, which avoids that the connecting wire 15 is pressed when other elements of the camera module, such as a lens holder, are mounted, thereby affecting the performance of the camera module.
In this way, by providing the side surfaces of the channels in a two-step shape, smooth flow of the molding material as a fluid in the channels can be ensured, and specifically, the molding material 14 in a fluid state can flow forward along the first and second channels 2151 and 2152 and fill the entire base panel forming guide 215 with the molding material 14 before the molding material 14 is cured.
Accordingly, the molding process of the present invention results in the described panel 1000 of photosensitive assemblies, which comprises: one or more columns of the circuit board 11, one or more columns of the photosensitive elements 13, and one or more of the one-piece molded base 1200. Each column of the circuit boards 11 includes one or more circuit boards 11 arranged side by side, and each of the circuit boards 11 includes the rigid region 111 and the flexible region 112 combined. Each of the one-piece mold bases 1200 is integrally formed with one row of the circuit boards 11 and one row of the photosensitive elements 13 and forms the optical window 122 providing a light path for each of the photosensitive elements 13. A portion 1200A of the one-piece molded base corresponding to the one-piece molded base 1200 adjacent to the first end side of the flexible region 112, the portion having a first side surface 1201, the first side surface 1201 including a first portion surface 1203 disposed adjacent to the photosensitive element 13 and a second portion surface 1204 connected to the first portion surface, and a first angle of the first portion surface 1203 relative to an optical axis of the camera module being larger than a second angle of the second portion surface 1204 relative to the optical axis; a portion 1200B of the one-piece molding base corresponding to an opposite second end side of the one-piece molding base 1200 away from the flexible region 112 has a second side surface 1202, the second side surface 1202 includes a third portion surface 1205 disposed adjacent to the photosensitive element 13 and a fourth portion surface 1206 connected to the third portion surface, and a third angle of the third portion surface 1205 with respect to the optical axis of the camera module is greater than a fourth angle of the fourth portion surface 1206 with respect to the optical axis. Wherein the first end side of the one-piece molded base 1200 corresponds to a combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, i.e., a proximal side adjacent to the flexible region 112; the second end side of the one-piece molded base 1200 corresponds to a distal end side of the circuit board 11 away from the flexible region 112.
After the cutting of the panel 1000 of photosensitive elements, a single photosensitive element 10 can be obtained, wherein in the cutting step, the two wings of the one-piece molded base 1200 excluding the first end side and the second end side can be cut, so as to obtain the molded base 12, while the corresponding portion 1200B of the molded base on the second end side is not cut, so as to obtain the photosensitive element 10 having the portion 1200C of the one-piece molded base on one pair of opposite wings.
As shown in fig. 6A, the photosensitive assembly 10 includes the circuit board 11, the photosensitive element 13, and the mold base 12, respectively. Wherein the circuit board 11 comprises the rigid region 111 and the flexible region 112 in combination. The mold base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms the optical window 122 for providing a light path for the photosensitive element 13. The circuit board 11 and the photosensitive element 13 are connected by a series of connecting wires 15. A portion 12A of the mold base corresponding to a first end side of the mold base 12 adjacent to the flexible region 112, having a first side surface 1201, the first side surface 1201 including a first part surface 1203 disposed adjacent to the photosensitive element 13 and a second part surface 1204 connected to the first part surface, and a first angle of the first part surface 1203 with respect to an optical axis of the camera module being larger than a second angle of the second part surface 1204 with respect to the optical axis; a portion 12B of the mold base corresponding to an opposite second end side of the mold base 12 remote from the flexible region 112 has a second side surface 1202, the second side surface 1202 includes a third portion surface 1205 disposed adjacent to the photosensitive element 13 and a fourth portion surface 1206 connected to the third portion surface, and a third angle of the third portion surface 1205 with respect to the optical axis of the camera module is larger than a fourth angle of the fourth portion surface 1206 with respect to the optical axis.
As shown in fig. 6B, accordingly, in order to further reduce the size of the photosensitive assembly 10, at least a portion of the photosensitive assembly 10 of the opposite second end side of the mold base 12 away from the flexible region 112 is adapted to be removed, such as cut with a knife, or abraded. Here, those skilled in the art can understand that the arrangement of the side surfaces is the same as that shown in fig. 6A, and thus the description thereof is omitted.
Through the smooth flowing of the molding material 14 in the diversion trench, in the molding process, the molding material 14 can form the connected molding base 1200 on the circuit board jointed board 1100, and the connected molding base 1200 can form the light window 122 with the periphery closed at the position corresponding to each photosensitive element 13, so that after the formed connected photosensitive element jointed board 1200 is cut, the molding base 12 with the light window 122 is formed on each circuit board 11 and the corresponding photosensitive element 13, and the molding base is prevented from partially forming an opening similar to that in fig. 1C to communicate the light window 122 to the outside of the molding base 12.
That is, the molding material 14 of the present invention can flow forward from the feed ends 215A of the two channels 2151 and 2152 and fill the channels 2151 and 2152 and the fill channel 2153 of the entire base panel forming channel 215. The molding material 14 is able to flow along the two channels 2151 and 2152 from its feed end 215A to its end 215B prior to curing. And before the viscosity of the molding material 14 reaches a high value and is solidified, the molding material 14 can fill the base panel forming guide groove 215, so that the connecting line 15 between the circuit board 11 and the photosensitive element 13 is prevented from being damaged by the molding material 14 flowing forward and having a high viscosity. And, by the symmetrical design of the two guide grooves 2151 and 2152, the flow in the two guide grooves 2151 and 2152 flows forward in substantially the same radial, and the two flows join substantially in the filling groove 2153, preventing the molding material 14 in one guide groove from flowing to the other guide groove and obstructing the forward flow of the molding material 14 in the other guide groove. And turbulence are not generated, resulting in irregular swinging of the connection line 15 connecting the circuit board 11 and the photosensitive element 13 to cause deformation and damage.
Accordingly, the molding material 14 of the present invention can also be selected from a material with a relatively high viscosity range, so as to avoid the flash formation of the molding material 14 entering the photosensitive region 131 of the photosensitive element 13 during the molding process when the material with a relatively low viscosity range is selected.
In addition, as shown in fig. 7B, to facilitate the demolding and the pressing of the rigid region 111 of the circuit board 11, the first mold 211 further includes a plurality of pressing blocks 216, and the outer edge 1201 of the molding base 12 and the outer edge of the rigid region 111 of the circuit board 11 form a pressing edge 1111, i.e., an area where the pressing blocks 216 are adapted to press on the rigid region 111 of the circuit board 11 in the molding process. The press-fit blocks 216 press-fit over the flexible regions 112 of each row of the circuit boards 11 to prevent the molding material 14 from flowing toward the flexible regions 112. In addition, the rigid region 111 of each row of the circuit board 11 is integrally formed to form an integral rigid region jointed board 110, so that the first mold can be used for conveniently pressing each row of the circuit board 11. As shown in fig. 7A, the width W of the bottom end of the first guide groove 2151 is 0.2 mm to 1 mm on the side adjacent to the flexible region 112, thereby being suitable for manufacturing the photosensitive assembly 10 in a small size. Accordingly, the photosensitive member 10 is fabricated such that the distance W between the inner edge and the outer edge of the portion 12A of the molded base adjacent to the side of the flexible region 112 is 0.2 mm to 1 mm.
Accordingly, the present invention provides a method for manufacturing the photosensitive assembly 12 of the camera module 100, which comprises the following steps:
securing the circuit board panel 1100 to the second mold 212 of the molding mold 210, wherein the circuit board panel 1100 comprises one or more rows of circuit boards, each row of circuit boards comprises one or more circuit boards 11 arranged side by side, each circuit board 11 comprises a rigid region 111 and a flexible region 112 that are joined, and each circuit board 111 is operatively connected to the photosensitive element 13;
clamping second mold 212 to first mold 211 by means of mold fixture 213, filling molten molding material 14 in base panel forming guide slots 215 in forming mold 210, wherein the location corresponding to optical window forming portion 214 is blocked from filling with molding material 14;
the molding material 14 in the base panel forming guide groove 215 undergoes a curing process to form the connected molding base 1200 at a position corresponding to the base panel forming guide groove 215, wherein the connected molding base 1200 is integrally formed with each row of the circuit boards 11 and each row of the photosensitive elements 13 corresponding to the circuit boards to form a photosensitive assembly panel 1000 and forms the optical window 122 providing a light path for each of the photosensitive elements 13 at a position corresponding to the optical window forming part 214, wherein the base panel forming guide groove 215 has a first guide groove 2151 corresponding to a first end side of the connected molding base 1200 adjacent to the flexible region 112 and a second guide groove 2152 corresponding to a side of the connected molding base 1200 away from the flexible region 112, and a phase-located guide groove 2152 extending between the first guide groove 2151 and the second guide groove 2152 for filling the molding material 14 between two adjacent photosensitive elements 13 in each row of the photosensitive elements 13A filling groove 2153 between two adjacent light window moldings 214, wherein the first guide groove 2151 has a first side surface 1201 facing the light window, the second guide groove 2152 has a second side surface 1202 facing the light window, wherein the first side surface comprises a first part surface 1203 arranged adjacent to the photosensitive element 13 and a second part surface 1204 connected to the first part surface 1203, the second side surface 1202 has a third part surface 1205 arranged adjacent to the photosensitive element 13 and a fourth part surface 1206 connected to the third part surface 1205, wherein a first angle of the first part surface 1203 with respect to an optical axis of the camera module is larger than a second angle of the second part surface 1204 with respect to the optical axis, and a third angle of the third part surface 1205 with respect to the optical axis is larger than a fourth angle of the fourth part surface 1206 with respect to the optical axis, such that the cross-sectional shape of first and second channels 2151, 2152 allows the molding material 14 to fill the base tile forming channels 215 during the molding process for forming the molded-in-one base 1200 and the molding material 14 from the feed ends 215A of the first and second channels 2151, 2152 to the ends 215B of the first and second channels 2151, 2152, respectively;
cutting the photo-sensing component panel 1000 to obtain a plurality of photo-sensing components 10, wherein each photo-sensing component 10 includes the circuit board 11, the photo-sensing element 13 and the molding base 12, wherein the molding base 12 is integrally formed on the circuit board 11 and the photo-sensing element 13 and forms the light window 122 for providing a light path for the photo-sensing element 13.
Also, the method may further include the steps of: a portion of the photosensitive member corresponding to the opposite second end side of the mold base 12 away from the flexible region 112, that is, a portion of the portion 12B of the mold base and a portion of the circuit board 11 are cut so that the mold base 12B has a cut surface 125 at the opposite second end side away from the flexible region 112.
As shown in fig. 5A to 6B, the circuit board 11 includes a plurality of electronic components 113 formed on the rigid region 111, for example, mounted by an SMT process, and the electronic components 113 include, but are not limited to, resistors, capacitors, driving devices, and the like. In this embodiment of the present invention, the mold base 12 integrally covers the electronic component 113, so as to prevent dust and impurities from adhering to the electronic component 113 and further contaminating the photosensitive element 13, which affects the imaging effect, like in a conventional camera module. In addition, it is preferable that the plurality of electronic components 113 are disposed on at least one wing side 11C on both sides of the photosensitive element 11 on the rigid region 111 except for the first end side 11A and the second end side 11B of the rigid region 111 of the circuit board 11 adjacent to the flexible region 112 and away from the flexible region 112, wherein the molding base 12 integrally embeds the electronic components 113.
That is, referring to fig. 8 and 9, in correspondence with first and second channels 2151, 2152, without electronic components 113, the electronic components 113 may be collectively disposed in the filling groove 2153, so that during the molding process, there is no obstruction in the first and second channels 2151, 2152, and thus no influence on the forward flow of the molding material 14 along the first and second channels 2151, 2152, so that the molding material 14 flows as much as possible from its feed end 215A to its end 215B in a short time.
It is understood that the connection lines 15 may be disposed on four sides of the photosensitive element 13, and may be concentrated on two sides 11C of the rigid region 111 of the circuit board 11, so as to be concentrated in the filling groove 2153 during the molding process, thereby not affecting the forward flow of the molding material 14 along the first and second guide grooves 2151 and 2152.
Fig. 11 to 14 show the camera module 100 manufactured by applying the photosensitive assembly 10 of the present invention. The camera module comprises the photosensitive assembly 10, a lens 20 and a filter assembly 30. The photosensitive assembly 10 includes the circuit board 11, the mold base 12, and the photosensitive element 13. The lens 20 includes a structural member 21 and one or more lenses 22 housed within the structural member 21. The filter assembly 30 includes a filter element mount 31 and a filter element 32, the filter element mount 31 is assembled on the top side of the mold base 12, and the lens 20 is directly assembled on the top side of the filter element mount 31 to form a fixed focus camera module. In this embodiment, the top side of the mold base 12 is a plane, the filter element holder 31 is assembled to the top plane of the mold base 12, and the filter element 32, which is located between the lens 20 and the light sensing element 13, functions to filter the light passing through the lens 20, such as a filter capable of filtering infrared rays. In this way, the light passing through the lens 30 can pass through the filter element 32 and reach the photosensitive element 13 via the light window 122, so that the image pickup module 100 can provide an optical image after photoelectric conversion.
As shown in fig. 13A, in the photosensitive assembly 10 of the camera module 100, a portion 12A of the mold base corresponding to a first end side of the mold base 12 adjacent to the flexible region 112 has a first side surface 1201 facing the optical window, a portion 12B of the mold base corresponding to an opposite second end side of the mold base 12 away from the flexible region 112 has a second side surface 1202 facing the optical window, wherein the first side surface includes a first portion surface 1203 disposed adjacent to the photosensitive element 13 and a second portion surface 1204 connected to the first portion surface 1203, the second side surface 1202 has a third portion surface 1205 disposed adjacent to the photosensitive element 13 and a fourth portion surface 1206 connected to the third portion surface 1205, wherein a first angle of the first portion surface 1203 with respect to an optical axis of the camera module is larger than a second angle of the second portion surface 1204 with respect to the optical axis, and the third angle of the third partial surface 1205 relative to the optical axis is greater than the fourth angle of the fourth partial surface 1206 relative to the optical axis, so that the photosensitive assembly 10 with a small size can be obtained, and the size of the whole camera module 100 can be further reduced. It will be appreciated that the side of the molded base 12 distal from the opposite second end side of the flexible region 112 may be further cut such that the remaining portion of the molded base 12 after cutting has a cut surface 125, as shown in fig. 14. In addition, as shown in fig. 13B, it can be seen that the electronic components 113 may be disposed at least on one of the two wing sides of the photosensitive assembly 10, such as may be disposed at the two wing sides.
It is understood that in another modified embodiment, the filter element holder 31 may be omitted, and the filter element 32 may be directly assembled to the mold base 12, or the filter element 32 may be assembled to the lens 20, or the filter element 32 may be assembled to a carrier of the lens 20, such as an actuator or a fixed lens barrel.
As shown in fig. 15, the camera module 100 may include a carrier 40, which is a driver or a fixed lens barrel, in this figure, a driver, such as a voice coil motor, a piezoelectric motor, etc., is illustrated to form a moving focus camera module, and the lens 20 is mounted to the driver. The top side of the mold base 12 has a recess 123 for mounting the filter element mount 31, and the driver can be mounted directly on the top side of the mold base 12. It will be appreciated that in alternative variations, the carrier 40 may be mounted to the filter element mount 31, or may be mounted in part to the filter element mount 31 and in part to the mold base 12.
As shown in fig. 16, in this embodiment of the present invention and in the drawings, the camera module 100 may include a carrier 40, which is a fixed lens barrel, to which the lens 20 is mounted. The top side of the mold base 12 has a groove 123 for mounting the filter element mount 31, and the fixed barrel is mounted on the top side of the mold base 12.
Fig. 17A to 24 show the photosensitive element 10 of the camera module 100 and the manufacturing process thereof according to the second embodiment of the present invention. In this embodiment, a photosensitive assembly panel 1000 is also fabricated by panel assembly and then cut to obtain the photosensitive assembly 10. Wherein in the embodiment shown in fig. 2-16, the rigid regions 111 of one row of circuit boards are arranged adjacent to the flexible regions 112 of another row of circuit boards in a plurality of rows of circuit boards. In this embodiment, two adjacent columns of circuit boards may have the rigid regions 111 arranged adjacently and the corresponding flexible regions 112 arranged farther apart. More preferably, the rigid regions 111 of two adjacent columns of circuit boards are integrally formed so that the middle of two adjacent columns of circuit boards forms an integral rigid region.
Accordingly, more specifically, the molding die 210 forms a molding cavity 213 when closed, and provides a plurality of optical window moldings 214 and one or more base panel molding guides 215, each of the base panel molding guides 215 including a first guide 2151 at both ends arranged in a substantially parallel longitudinal direction, a second guide 2152 at the middle of the two first guide 2151, and a plurality of filling grooves 2153 extending in a transverse direction between the two first and second guide 2151 and 2152, wherein two rows of the filling grooves 2153 extend between the two first and second guide 2151 and 2152, respectively.
For example, in this embodiment, the circuit board panel 1100 includes 4 rows of the circuit boards 11, and two rows of the circuit boards 11 are taken as a group, and the rigid regions 111 of the two rows of the circuit boards 11 of each group of the circuit boards 11 are located in the middle and integrally formed, for example, each row of the circuit boards 11 has 6 circuit boards, and the rigid regions 111 thereof are integrally formed. The forming mold 210 has two base panel forming guide grooves 215, each base panel forming guide groove 215 has 7 filling grooves 2153 between the first guide groove 2151 and the second guide groove 2152, the filling groove 2153 is provided between two adjacent optical window forming parts 214, and each optical window forming part 214 is located between two adjacent filling grooves 2153. The molding material 14 flows along the two first channels 2151 and the middle second channel 2152 from the feeding end 215A thereof to the end 215B thereof, and the two-step design is adopted on the side surfaces of the first and second channels 2151 and 2152 facing the light window, and the molding material 14 can fill each of the filling grooves 2153, thereby forming the one-piece molding base 1200 after the molding material 14 is cured.
In this embodiment of the present invention, the one-piece molding base 1200 is integrally formed on two adjacent rows of the circuit boards 11 and two adjacent rows of the light sensing elements 13 to form a light sensing assembly panel 1000 and form light windows 122 for providing light paths for the light sensing elements 13 at positions corresponding to the light window forming portions 214.
Fig. 21A to 24 are schematic diagrams illustrating a manufacturing process of the photosensitive member panel 1000 of the camera module 100 according to the preferred embodiment of the present invention, in which, as shown in fig. 21A, the forming mold 210 is in a mold clamping state, the circuit board 11 to be molded and the solid molding material 14 are ready to be positioned, and the solid molding material 14 is heated, so that the molding material 14 is fed into the base panel forming guide groove 215 while being melted into a fluid state or a semi-solid semi-fluid state, and flows forward along the first guide groove 2151 and the second guide groove 2152 to fill the filling groove 2153 between two adjacent optical window forming portions 214. In addition, the molding surface of the first mold 211 is closely attached to the circuit board 11 and the photosensitive element 13, and the demolding is facilitated.
As shown in fig. 22 and 23, when the two first guide grooves 2151, the second guide grooves 2152, and the filling grooves 2153 of the base jigsaw forming guide groove 215 are all filled with the fluid molding material 14, the fluid molding material 14 is cured and formed into the one-piece molding base 1200 integrally formed on two adjacent rows of the circuit boards 11 and two adjacent rows of the photosensitive elements 13 through a curing process.
As shown in fig. 24, after the molding material 14 is cured to form the one-piece molding base 1200, the demolding process of the present invention is performed, that is, the mold fixing device 230 moves the first and second molds 211 and 212 away from each other, so that the light window forming part 214 moves away from the one-piece molding base 1200, and two rows of the light windows 122 corresponding to the respective photosensitive elements 13 are formed in the one-piece molding base 1200.
As shown in fig. 20B, the panel 1000 may be further cut to form individual photosensitive elements 10. Each photosensitive assembly 10 includes at least one circuit board 11, at least one photosensitive element 13, and the molding base 12 integrally molded with the circuit board 11 and the photosensitive element 13. As shown in fig. 19A to 20B, the rigid regions 111 integrally formed between two adjacent rows of the circuit boards 11 are separated so that each of the circuit boards 11 includes the rigid region 111 and the flexible region 112 combined. The molding base 12 integrally forms the rigid region 111 of the circuit board 11 and at least a portion of the non-photosensitive region 132 of the photosensitive element 13, and forms the optical window 122 for providing a light path for the photosensitive region 131 of the photosensitive element 13.
It should be noted that, when each of the individual photosensitive assemblies 10 cut from the photosensitive assembly panel 1000 is used to manufacture a focus-enabled camera module, i.e. an auto-focus camera module, the forming mold 210 is further provided with a plurality of driver pin slot forming blocks 218, each of the driver pin slot forming blocks 218 extends into the filling slot 2153 of the base panel forming guide slot 215 so as not to affect the flow of the molding material 14 in the three guide slots 2151, 2152 and 2153, and during the molding process, the fluid molding material 14 does not fill the positions corresponding to the driver pin slot forming blocks 218, so that after the curing step, a plurality of the optical windows 122 and a plurality of driver pin slots 124 are formed in the connected molding base 1200 of the photosensitive assembly panel 1000, and the molding base 12 of each of the individual photosensitive assemblies 10 cut from the individual photosensitive assembly panel 1000 is configured with the driver pin slots 124 The groove 124 is formed so that when the moving focus camera module 100 is manufactured, the pins of the driver can be connected to the circuit board 11 of the photosensitive assembly 10 by soldering or conductive adhesive.
It should be noted that the manufacturing method of the photo sensor assembly panel 1000 of the present invention is suitable for manufacturing the photo sensor assembly 10 with a small size. In the molding process, each of the first guide grooves 2151 has a first side surface 1201 facing the light window, the second guide groove 2152 has a second side surface 1202 facing the light window, wherein the first side surface includes a first portion surface 1203 disposed adjacent to the photosensitive element 13 and a second portion surface 1204 connected to the first portion surface 1203, the second side surface 1202 has a third portion surface 1205 disposed adjacent to the photosensitive element 13 and a fourth portion surface 1206 connected to the third portion surface 1205, wherein a first angle of the first portion surface 1203 relative to the optical axis of the camera module is larger than a second angle of the second portion surface 1204 relative to the optical axis, and a third angle of the third portion surface 1205 relative to the optical axis is larger than a fourth angle of the fourth portion surface 1206 relative to the optical axis. In this way, the fluid molding material 14 can flow forward along the outer two first channels 2151 and the middle second channel 2152 and fill the entire base panel forming channel 215 with the molding material 14 before the molding material 14 is cured.
Accordingly, the molding process of the present invention results in the described panel 1000 of photosensitive assemblies, which comprises: one or more columns of the circuit board 11, one or more columns of the photosensitive elements 13, and one or more of the one-piece molded base 1200. Each column of the circuit boards 11 includes one or more circuit boards 11 arranged side by side, and each of the circuit boards 11 includes the rigid region 111 and the flexible region 112 combined. Each of the two adjacent rows of the circuit boards 11 and the two adjacent rows of the photosensitive elements 13 are integrally formed with the one-piece molding bases 1200 to form the optical windows 122 that provide light paths for the respective photosensitive elements 13, and the two adjacent rows of the circuit boards 11 are arranged with the flexible regions 112 thereof away from each other and the rigid regions 11 thereof adjacent to each other, so that each of the two-piece molding bases 1200 has both end sides adjacent to the flexible regions 112; wherein a portion 1200A of said one-piece molded base corresponding to said one-piece molded base 1200 adjacent to each end side of said flexible area 112 has a first side surface 1201 facing said light window, said one-piece molded base 1200 extends to a portion 1200B located between said two columns of adjacent said light sensitive elements 13 having a second side surface 1202 facing said light window, wherein said first side surface comprises a first part surface 1203 arranged adjacent to said light sensitive element 13 and a second part surface 1204 connected to said first part surface, said second side surface 1202 has a third part surface 1205 arranged adjacent to said light sensitive element 13 and a fourth part surface 1206 connected to said third part surface 1205, wherein a first angle of said first part surface 1203 with respect to an optical axis of the camera module is larger than a second angle of said second part surface 1204 with respect to said optical axis, and a third angle of the third partial surface 1205 with respect to the optical axis is larger than a fourth angle of the fourth partial surface 1206 with respect to the optical axis. Wherein each of the end sides of the one-piece molded base 1200 corresponds to a combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, i.e., a proximal side adjacent to the flexible region 112; the one-piece molding base 1200 extends between two adjacent columns of the photosensitive elements 13 corresponding to the distal side of the circuit board 11 away from the flexible region 112.
After the cutting of the light sensing assembly panel 1000, a single light sensing assembly 10 can be obtained, wherein in the cutting step, the cutting can be performed on the other side of the one-piece molded base 1200 except for the end side portion 1200A, so as to obtain the molded base 12, wherein the portion 1200B of the molded base corresponding to the space between two adjacent columns of the light sensing elements 13 is also cut.
Accordingly, as shown in fig. 20B, the photosensitive assembly 10 obtained after dicing includes the circuit board 11, the photosensitive element 13, and the mold base 12. Wherein the circuit board 11 comprises the rigid region 111 and the flexible region 112 in combination. The mold base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms the optical window 122 for providing a light path for the photosensitive element 13. The circuit board 11 and the photosensitive element 13 are connected by a series of connecting wires 15. After cutting the panel 1000, each of the photosensitive elements 10 has a first end side that is not cut and a second end side that is cut, similar to the above-described embodiment. A portion 12A of the mold base corresponding to a first end side of the mold base 12 adjacent to the flexible region 112, having a first side surface 1201 facing the light window, a portion 12B of the mold base corresponding to an opposite second end side of the mold base 12 remote from the flexible region 112, having a second side surface 1202 facing the light window, wherein the first side surface comprises a first portion surface 1203 arranged adjacent to the photosensitive element 13 and a second portion surface 1204 connected to the first portion surface 1203, the second side surface 1202 has a third portion surface 1205 arranged adjacent to the photosensitive element 13 and a fourth portion surface 1206 connected to the third portion surface 1205, wherein a first angle of the first portion surface 1203 with respect to an optical axis of the camera module is larger than a second angle of the second portion surface 1204 with respect to the optical axis, and a third angle of the third partial surface 1205 with respect to the optical axis is larger than a fourth angle of the fourth partial surface 1206 with respect to the optical axis. Thus, the shape of the cross section is set so that the molding material 14 can fill the base panel forming guide groove 215 during the molding process, thereby avoiding the generation of defective photosensitive components.
That is, in this embodiment of the invention, the molding material 14 is able to flow forward from the feed ends 215A of the three channels 2151 and 2152 and fill the channels 2151 and 2152 and the fill channel 2153 of the entire base tile forming channel 215. The molding material 14 is able to flow along the three channels 2151 and 2152 from its feed end 215A to its end 215B prior to curing. And before the viscosity of the molding material 14 reaches a high value and is solidified, the molding material 14 can fill the base panel forming guide groove 215, so that the connecting line 15 between the circuit board 11 and the photosensitive element 13 is prevented from being damaged by the molding material 14 flowing forward and having a high viscosity. And the fluid in the three channels 2151 and 2152 flows forward in substantially the same radial pattern to prevent the molding material 14 in one channel from flowing to the other channel and blocking the forward flow of the molding material 14 in the other channel. And turbulence are not generated, resulting in irregular swinging of the connection line 15 connecting the circuit board 11 and the photosensitive element 13 to cause deformation and damage.
As shown in fig. 21B, to facilitate demolding and pressing the rigid region 111 of the circuit board 11, the first mold 211 further includes a plurality of pressing blocks 216, and the outer edge 1201 of the mold base 12 and the outer edge of the rigid region 111 of the circuit board 11 form a pressing edge 1111, that is, in the molding process, two pressing blocks 216 are respectively pressed on two rows of regions on the rigid region 111 of the circuit board 11. The two pressing blocks 216 press over the sets of the flexible regions 112 of two adjacent columns of the circuit boards 11, so as to prevent the molding material 14 from flowing to the flexible regions 112. In addition, the rigid regions 111 of two adjacent columns of the circuit boards 11 are integrally formed to form an integral rigid region jointed board 110, and the two pressing blocks 216 are respectively pressed on two end sides of the integral rigid region jointed board 110, so that the first mold 211 can conveniently press two adjacent columns of the circuit boards 11. In addition, the width W of the bottom end of the first guide groove 2151 is 0.2 mm to 1 mm, thereby being suitable for manufacturing the photosensitive element having a small size. Accordingly, the photosensitive member 10 is fabricated such that the distance W between the inner edge and the outer edge of the portion 12A of the molded base adjacent to the side of the flexible region 112 is 0.2 mm to 1 mm.
Accordingly, this embodiment of the present invention provides a method for manufacturing the photosensitive assembly 12 of the camera module 100, which includes the following steps:
securing the circuit board panel 1100 to the second mold 212 of the molding mold 210, wherein the circuit board panel 1100 comprises one or more rows of circuit boards, each row of circuit boards comprises one or more circuit boards 11 arranged side by side, each circuit board 11 comprises a rigid region 111 and a flexible region 112 that are joined, and each circuit board 111 is operatively connected to the photosensitive element 13;
clamping second mold 212 to first mold 211 by means of mold fixture 213, filling molten molding material 14 in base panel forming guide slots 215 in forming mold 210, wherein the location corresponding to optical window forming portion 214 is blocked from filling with molding material 14;
curing the molding material 14 in the base panel forming guide groove 215 to form a connected molding base 1200 at a position corresponding to the base panel forming guide groove 215, wherein the connected molding base 1200 is integrally formed on two adjacent columns of the circuit boards 11 and two adjacent columns of the photosensitive elements 13 to form a photosensitive assembly panel 1000 and forms an optical window 122 providing a light path for each of the photosensitive elements 13 at a position corresponding to the optical window forming part 214, wherein the two adjacent columns of the circuit boards 12 are arranged with the flexible regions 112 thereof being away from each other and the rigid regions 11 thereof being adjacent to each other, wherein the base panel forming guide groove 215 has two first guide grooves 2151 corresponding to both end sides of the connected molding base 1200 adjacent to the flexible regions 112 and a second guide groove 2152 corresponding to a region between the two adjacent columns of the photosensitive elements 13, and a filling groove 2153 extending between the two first guide grooves 2151 and the second guide groove 2152 for filling the molding material 14 between two adjacent photosensitive elements 13 of each row of the photosensitive elements 13 and between two adjacent light window forming parts 214, wherein the first guide groove 2151 has a first side surface 1201 facing the light window, and the second guide groove 2152 has a second side surface 1202 facing the light window, wherein the first side surface includes a first part surface 1203 arranged adjacent to the photosensitive element 13 and a second part surface 1204 connected to the first part surface 1203, the second side surface 1202 has a third part surface 1205 arranged adjacent to the photosensitive element 13 and a fourth part surface 1206 connected to the third part surface 1205, wherein a first angle of the first part surface 1203 relative to an optical axis of the camera module is larger than a second angle of the second part surface 1204 relative to the optical axis, and a third angle of the third partial surface 1205 with respect to the optical axis is larger than a fourth angle of the fourth partial surface 1206 with respect to the optical axis.
Cutting the photo-sensing component panel 1000 to obtain a plurality of photo-sensing components 10, wherein each photo-sensing component 10 includes the circuit board 11, the photo-sensing element 13 and the molding base 12, wherein the molding base 12 is integrally formed on the circuit board 11 and the photo-sensing element 13 and forms the light window 122 for providing a light path for the photo-sensing element 13.
Also, the method may further include the steps of: the portion of the photosensitive assembly 10 located between the two adjacent columns of the photosensitive elements 13 is cut to obtain a portion 12B of the mold base corresponding to the opposite other end side of the mold base 12 from the flexible region 112. Namely, the mold base 12 of the photosensitive assembly 10 and the rigid region 111 of the circuit board 11 between the two adjacent columns of the photosensitive elements 13 are adapted to be cut, so that the distal ends of the photosensitive assemblies 10 away from the flexible region 112 are cut sides, respectively, and form cut surfaces 125, respectively.
The circuit board 11 includes a plurality of electronic components 113 formed in the rigid region 111, such as mounted by SMT, and no electronic component 113 is disposed in the corresponding two first channels 2151 and second channels 2152, and the electronic components 113 may be collectively disposed in the filling groove 2153, so that there is no obstruction in the two first channels 2151 and second channels 2152 during the molding process, and thus the forward flow of the molding material 14 along the two first channels 2151 and second channels 2152 is not affected, thereby maximizing the flow of the molding material 14 from the feeding end 215A to the end 215B thereof in a relatively short time.
In the step of manufacturing the photosensitive member 10 of a single body: the plate 1000 can be cut to obtain a plurality of independent photosensitive assemblies 10 for making a single camera module. Also can be with two or more of body coupling photosensitive assembly 10 follow photosensitive assembly makeup 1000 cutting separation to be used for making split type array module of making a video recording, promptly the array make a video recording each of the module make a video recording the module has independently respectively photosensitive assembly 10, wherein two or more photosensitive assembly 10 can be connected to same electronic equipment's control mainboard respectively, two or more like this the array that photosensitive assembly 10 made was obtained make a video recording the module can with a plurality of modules of making a video recording image transmission to control mainboard carries out image information processing.
As shown in fig. 25A, a photosensitive assembly panel 1000 according to another variant embodiment of the present invention based on the first embodiment comprises a photosensitive assembly panel 1000 obtained by the inventive molding process, which comprises: one or more columns of the circuit board 11, one or more columns of the photosensitive elements 13, one or more columns of the bezel 16, and one or more of the one-piece molded base 1200. Each column of the circuit boards 11 includes one or more circuit boards 11 arranged side by side, and each of the circuit boards 11 includes the rigid region 111 and the flexible region 112 combined. Each of the protection frames 16 is formed on the photosensitive element 13 and located in the non-photosensitive region 132 of the photosensitive element 13, that is, located outside the photosensitive region 131, and each of the one-piece molding bases 1200 is integrally formed on one row of the circuit boards 11, one row of the photosensitive elements 13, and one row of the protection frames 16 and forms the optical window 122 providing a light path for each of the photosensitive elements 13.
That is, before the one-piece molding base 1200 is molded, the protective frame 16 is formed on each of the photosensitive elements 13 in advance, and may be formed by another material different from the molding material 14, such as glue applied to the non-photosensitive area 132 of the photosensitive element 13, or may be a rigid frame and attached to the non-photosensitive area 132 of the photosensitive element 13 by the glue. Therefore, in the process of forming the one-piece molding base 1200 by molding, the light window forming part 214 is pressed on the protective frame 16 with a predetermined hardness, and when the fluid molding material 14 enters the base splicing plate forming guide groove 215, the fluid molding material 14 can be prevented from flowing into the light sensing area 131 of the light sensing element 13, so that molding flash is formed. For example, in one specific example, the bezel 16 is formed of glue having a predetermined elasticity and hardness, and may be further implemented to remain tacky after curing, thereby serving to adhere dust particles within the photosensitive element 10 of the resulting camera module. More specifically, in some embodiments, the protective frame 16 has a shore hardness in a range of a50-a80 and an elastic modulus in a range of 0.1Gpa to 1 Gpa.
Similarly, a portion 1200A of the unitary molded base corresponding to a first end side of the unitary molded base 1200 adjacent to the flexible region 112 has a first side surface 1201 facing the light window; the portion 1200B of the unitary molded base corresponding to the opposite second end side of the unitary molded base 1200 distal from the flexible region 112 has a second side surface 1202 facing the optical window. Wherein the first side surface comprises a first part surface 1203 arranged adjacent to the photosensitive element 13 and a second part surface 1204 connected to the first part surface 1203, the second side surface 1202 has a third part surface 1205 arranged adjacent to the photosensitive element 13 and a fourth part surface 1206 connected to the third part surface 1205, wherein a first angle of the first part surface 1203 with respect to an optical axis of the camera module is larger than a second angle of the second part surface 1204 with respect to the optical axis, and a third angle of the third part surface 1205 with respect to the optical axis is larger than a fourth angle of the fourth part surface 1206 with respect to the optical axis. Wherein the first end side of the one-piece molded base 1200 corresponds to a combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, i.e., a proximal side adjacent to the flexible region 112; the second end side of the one-piece molded base 1200 corresponds to a distal end side of the circuit board 11 away from the flexible region 112.
After the cutting of the panel 1000 of photosensitive elements, individual ones of the photosensitive elements 10 can be obtained, as shown in fig. 25C, wherein in the cutting step, the two wing sides of the one-piece molded base 1200 excluding the first end side and the second end side can be cut, thereby obtaining the molded base 12, while the corresponding portion 1200B of the molded base of the second end side is not cut, thereby obtaining the photosensitive elements 10 having the portions 1200C of the one-piece molded base at a pair of opposite wing sides.
Accordingly, the photosensitive assembly 10 includes the circuit board 11, the photosensitive element 13, the bezel 16, and the mold base 12. Wherein the circuit board 11 comprises the rigid region 111 and the flexible region 112 in combination. The mold base 12 is integrally formed on the circuit board 11, the light sensing element 13 and the protection frame 16, and forms the light window 122 for providing a light path for the light sensing element 13. The circuit board 11 and the photosensitive element 13 are connected by a series of connecting wires 15. The protective frame 16 may be located inside the connection line 15, or may cover at least a part of the connection line 15. The portion 12A of the mold base corresponding to the first end side of the mold base 12 adjacent to the flexible region 112 has a first side surface 1201; a portion 12B of the molding base corresponding to an opposite second end side of the molding base 12 remote from the flexible region 112 has a second side surface 1202. Wherein the first side surface comprises a first part surface 1203 arranged adjacent to the photosensitive element 13 and a second part surface 1204 connected to the first part surface 1203, the second side surface 1202 has a third part surface 1205 arranged adjacent to the photosensitive element 13 and a fourth part surface 1206 connected to the third part surface 1205, wherein a first angle of the first part surface 1203 with respect to an optical axis of the camera module is larger than a second angle of the second part surface 1204 with respect to the optical axis, and a third angle of the third part surface 1205 with respect to the optical axis is larger than a fourth angle of the fourth part surface 1206 with respect to the optical axis.
As shown in fig. 25C, accordingly, in order to further reduce the size of the photosensitive assembly 10, at least a portion of the photosensitive assembly 10 of the opposite second end side of the mold base 12 away from the flexible region 112 is adapted to be removed, forming a cut surface 125.
As shown in fig. 25B, the photosensitive assembly panel 1000 obtained by molding according to the above-mentioned second embodiment of the present invention includes: one or more columns of the circuit board 11, one or more columns of the photosensitive elements 13, one or more columns of the protective frames 16, and one or more of the connected mold bases 1200, where each of the protective frames 16 is formed on a corresponding photosensitive element 13. Each column of the circuit boards 11 includes one or more circuit boards 11 arranged side by side, and each of the circuit boards 11 includes the rigid region 111 and the flexible region 112 combined. Each of the two integrated molding bases 1200 is integrally formed on two adjacent rows of the circuit boards 11, two adjacent rows of the photosensitive elements 13, and two adjacent rows of the protective frames 16, and is formed as the optical window 122 providing a light path for each of the photosensitive elements 13, and the two adjacent rows of the circuit boards 11 are arranged such that the flexible regions 112 thereof are distant from each other and the rigid regions 11 thereof are adjacent to each other, so that each of the two integrated molding bases 1200 has both end sides adjacent to the flexible regions 112; wherein portions 1200A of the unitary molded base corresponding to respective end sides of the unitary molded base 1200 adjacent the flexible region 112 have first side surfaces 1201; the one-piece molding base 1200 extends to be located between the two adjacent columns of the photosensitive elements 13 and has a second side surface 1202. Wherein the first side surface comprises a first part surface 1203 arranged adjacent to the photosensitive element 13 and a second part surface 1204 connected to the first part surface 1203, the second side surface 1202 has a third part surface 1205 arranged adjacent to the photosensitive element 13 and a fourth part surface 1206 connected to the third part surface 1205, wherein a first angle of the first part surface 1203 with respect to an optical axis of the camera module is larger than a second angle of the second part surface 1204 with respect to the optical axis, and a third angle of the third part surface 1205 with respect to the optical axis is larger than a fourth angle of the fourth part surface 1206 with respect to the optical axis. Wherein each of the end sides of the one-piece molded base 1200 corresponds to a combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, i.e., a proximal side adjacent to the flexible region 112; the one-piece molding base 1200 extends between two adjacent columns of the photosensitive elements 13 corresponding to the distal side of the circuit board 11 away from the flexible region 112.
After the cutting of the photo-sensor assembly panel 1000, a single photo-sensor assembly 10 may be obtained, wherein in the cutting step, the cutting may be performed on the side of the one-piece molded base 1200 excluding the end side portion 1200A, thereby obtaining the molded base 12, wherein the portion 1200B of the molded base between two corresponding adjacent columns of the photo-sensor elements 13 is also cut, thereby obtaining the photo-sensor assembly 10 having the portion 1200C of the one-piece molded base on one pair of opposite wing sides. The portion 12A of the moulding base corresponding to the first end side of the moulding base 12 adjacent to the flexible zone 112 has a first side surface 1201; a portion 12B of the molding base corresponding to an opposite second end side of the molding base 12 remote from the flexible region 112 has a second side surface 1202. Wherein the first side surface comprises a first part surface 1203 arranged adjacent to the photosensitive element 13 and a second part surface 1204 connected to the first part surface 1203, the second side surface 1202 has a third part surface 1205 arranged adjacent to the photosensitive element 13 and a fourth part surface 1206 connected to the third part surface 1205, wherein a first angle of the first part surface 1203 with respect to an optical axis of the camera module is larger than a second angle of the second part surface 1204 with respect to the optical axis, and a third angle of the third part surface 1205 with respect to the optical axis is larger than a fourth angle of the fourth part surface 1206 with respect to the optical axis, as shown in fig. 25C.
As shown in fig. 26A to 27, the molding process of the panel assembly operation can also be used to fabricate a photosensitive element 10 having two or more of the optical windows 122, wherein such photosensitive elements 10 can be used to fabricate an array camera module of a common substrate. That is, taking the photosensitive assembly 10 for manufacturing a dual camera module as an example, in the molding process of each circuit board 11 of the circuit board assembly 1100, one of the circuit board substrates 111 is correspondingly provided with two of the optical window forming portions 214, so that after the molding process and the cutting are completed, each circuit board 11 forms a molding base 12 having two of the optical windows 122 and sharing one of the circuit boards 11, and two of the photosensitive elements 13 and two of the lenses 30 are correspondingly mounted. The circuit board 11 may be connected to a control motherboard of an electronic device, so that the array camera module manufactured in this embodiment may transmit images captured by a plurality of camera modules to the control motherboard for image information processing.
Fig. 28 to fig. 31C show a camera module 100 and a photosensitive assembly 410 thereof according to a third preferred embodiment of the present invention. The camera module 400 can be applied to various electronic devices 300, as shown in fig. 44, the electronic device 300 includes a device body 301 and one or more camera modules mounted on the device body 301, the electronic device 300 is, for example and without limitation, a smart phone, a wearable device, a computer device, a television, a vehicle, a camera, a monitoring device, and the like, and the camera modules cooperate with the electronic device to capture and reproduce images of a target object.
More specifically, the camera module 400 illustrated in the figure includes the photosensitive element 410 and a lens 430. The light sensing assembly 410 includes a circuit board 411, a mold base 412, a light sensing element 413 and a filter element 414, wherein the mold base 412 includes a base body 4121 integrally formed on the circuit board 411 and the light sensing element 413 and forming a light window 4122, and the light window 4122 is a closed space and provides a light path for the light sensing element 413. The mold base 412 of the present invention is integrally molded with the circuit board 411 and the photosensitive element 413 through a molding process, such as a transfer molding process, so that the mold base 412 can replace a lens holder or a bracket of a conventional camera module, and the lens holder or the bracket does not need to be attached to the circuit board 411 by glue, similar to the conventional packaging process. The filter element 414, which may be an infrared filter element, is assembled on the top side of the mold base 412 and located between the photosensitive element 413 and the lens 430 to filter infrared rays passing through the lens 430.
The circuit board 411 may be a hard board, a soft board, a rigid-flex board, a ceramic substrate, or the like. In this embodiment, the circuit board 411 is a rigid-flex board, which includes a substrate 4111 and a plurality of electronic components 4112 formed on the substrate 4111, such as a plurality of electronic components 4112 mounted by SMT, wherein the electronic components 4112 include, but are not limited to, resistors, capacitors, driving devices, and the like. In this embodiment of the present invention, the molding base 412 integrally covers the electronic component 4112, so as to prevent dust and impurities from adhering to the electronic component 4112 and further contaminating the photosensitive element 413, thereby affecting the imaging effect, similar to the conventional camera module. It is understood that the circuit board 411 may not have the electronic component 4112, and the electronic component 4112 may be mounted on the top surface of the substrate 4111, mounted on the bottom surface of the substrate 4111, or embedded in the substrate 4111. When disposed on the top surface of the substrate 4111, the electronic component 4112 may be disposed around the photosensitive element 413 and located on multiple sides of the photosensitive element 413, for example, the electronic component 4112 may be disposed on two opposite sides of the photosensitive element 413, or on one opposite side of the electronic component 4112.
The circuit board 411 and the photosensitive element 413 are operatively connected, and as shown in the figure, the circuit board 411 and the photosensitive element 413 have respective electrical connection elements, such as pads, on their surfaces, and are connected by one or more sets of connection wires 415, and the mold base 412 integrally embeds the connection wires 415.
In the preferred embodiment of the present invention, the camera module 400 includes the photosensitive element 410, the lens 430 and a lens carrying element 440. The lens 430 is assembled to the lens carrier 440 to form a lens assembly. The lens carrier 440 may be an actuator or a fixed barrel. In this embodiment, the lens bearing element is a driver, and the driver can be implemented as a voice coil motor, a piezoelectric motor, a thermodynamic driver, a micro-electromechanical driver, or the like, so as to realize an auto-focusing function, thereby forming an auto-focusing camera module. It is understood that in other embodiments, the lens 430 may be directly assembled to the molded base 412 of the photosensitive element 410.
The filter 414 includes a filter body 4141 and a light-shielding layer 4142, the light-shielding layer 4142 is located at the bottom side of the filter body 4141 and between the filter body 4141 and the mold base 412, the light-shielding layer 4142 is made of a light-absorbing material, which makes the filter body 4141 form a middle effective transparent region 41411 and a peripheral region 41412, the light passing through the lens 430 can reach the inside of the mold base 412 only by passing through the effective transparent region 41411, and the filter body 141 may include an IR film (infrared cut-off film), an AR film (anti-reflection coating film), white glass, blue glass, a resin material, a coating composite material, crystal, and the like. The light-shielding layer 4142, which is an annular structure with a window formed in the middle, that is, the light-shielding layer 4142 forms a light path 41420 for light to enter the light window 4122 and then reach the light-sensing element 413 and reduces stray light reaching the light-sensing element 413.
The photosensitive element 413 has a photosensitive region 4131 in the middle and a non-photosensitive region 4132 around the photosensitive region 4131, and the light shielding layer 4142 has an inner edge 41421 and an outer edge 41422. The distance between the inner edge 41421 of the light shielding layer 4142 and the optical axis X is greater than or equal to, or slightly less than, the distance between the outer edge 41311 of the photosensitive region 4131 and the optical axis X.
The outer edge 41422 of the light shielding layer 4142 is located outside the inner edge 41241 of the top surface 4124 of the mold base 412, i.e., no light transmitting region is formed between the inner edge 41241 of the top surface 4124 of the mold base 412 and the outer edge 41422 of the light shielding layer 4142.
In this embodiment of the present invention, the inner surface of the base body 4121 of the mold base 412 has a plurality of inner surfaces, for example, four inner surfaces, along its circumferential direction, each of which includes a plurality of portions extending in different directions, for example, the base body 4121 of the mold base 412 includes three portions, i.e., a photosensitive element bonding portion 41211 and a top side extension portion 41212 around the light window 4122 shown in fig. 29A, and a circuit board bonding portion 41213 integrally bonded to the outer circumferential surface of the photosensitive element 413 and the top surface of the circuit board 411 around the photosensitive element 413, which extend integrally to form an integral structure. The light sensing element engaging portion 41211 and the light sensing element engaging portion 41211 have inner surfaces integrally extending from the light sensing element 413, wherein at least one section of the surrounding inner surfaces integrally extending from the light sensing element 413 is defined as a first portion inner surface 41231 of the mold base 412, and the top side extension 41212 has an inner surface integrally extending from the light sensing element engaging portion 41211, which forms a second portion inner surface 41232 of the mold base 412, the second portion inner surface 41232 integrally extending from the first portion inner surface 41231. It is understood that each of the first portion inner surface 41231 and the second portion inner surface 41232 is a surrounding inner surface of the seat body 4121; or said first portion inner surface 41231 and said second portion inner surface 41232 all having the same configuration; or all of the inner surfaces have said first portion inner surface 41231 and said second portion inner surface 41232.
The inner surfaces 41231 and 41232 of the photosensitive element bonding part 41211 and the top side extension 41212 respectively extend with different slopes, the second part inner surface 41232 of the top side extension 41212 extends upward with a greater slope relative to the first part inner surface 41231 of the photosensitive element bonding part 41211, or the second part inner surface 41232 of the top side extension 41212 extends upward with nearly no slope, i.e., the second part inner surface 41232 of the top side extension 41212 extends substantially perpendicular to the top surface of the photosensitive element 413, the top side extension 41212 becomes a vertical extension, so that the area of the top surface of the top side extension 41212 can be relatively large, i.e., the top surface of the top side extension 41212 determines the area of the top surface 4124 of the mold base 412, the extension structure of the photosensitive element bonding part 41211 and the top side extension 41212, the area of the top surface 4124 of the mold base 412 can be increased, so that a larger mounting area can be provided for a lens or a lens assembly above the photosensitive assembly 410 to more firmly mount the above lens or lens assembly, and the area of the filter element 414 can be reduced.
That is, in order to facilitate the demolding of the molding process and to prevent stray light, the photosensitive element bonding portion 41211 is formed in a structure in which the first portion inner surface 41231 defined by its inner surface extends upward from the photosensitive element 413 with a relatively small slope, and the second portion inner surface 41232 defined by the inner surface of the top-side extension portion 41212 integrally extends turning back from the first portion inner surface 41231, and extends upward with a relatively large slope or no slope, i.e., an included angle is formed between the second portion inner surface 41232 of the mold base 412 and the first portion inner surface 41231, so that the area size of the top surface 4124 of the mold base 412 can be effectively increased with respect to the upward extension with a fixed slope.
As shown in fig. 29B, an included angle between the first part inner surface 41231 defined by the inner surface of the photosensitive element combining portion 41211 and the optical axis X of the image capturing module 400 is α, and an included angle between the second part inner surface 41232 defined by the inner surface of the top extension portion 41212 and the optical axis X of the image capturing module 400 is β, where α is in a range of 3 ° to 80 °, β is in a range of 0 ° to 10 °, and α > β. For example, in one embodiment, α has a value of 3 °, β has a value of 0 °; in one embodiment, α has a value of 30 °, β has a value of 0 °; in one embodiment, α has a value of 60 °, β has a value of 0 °; in one embodiment, α has a value of 45 °, β has a value of 5 °; in one embodiment, α has a value of 80 ° and β has a value of 10 °.
That is, the included angle β between the second portion inner surface 41232 defined by the inner surface of the top-side extension 41212 and the optical axis X of the camera module 400 is a smaller angle with respect to the included angle α between the first portion inner surface 41231 defined by the inner surface of the photosensitive element bonding part 41211 and the optical axis X of the camera module 400, so that the second portion inner surface 41232 of the top-side extension 41212 extends upward with a greater slope or in a direction perpendicular to the photosensitive element 413, thereby increasing the area of the top surface 4124 of the mold base 412.
As shown in fig. 29B, in this preferred embodiment of the present invention, preferably, the thickness H1 of the photosensitive element joining portion 41211 ranges from 0.05 mm to 0.7 mm, and the thickness H2 of the top side extension 41212 ranges from 0.02 mm to 0.6 mm. For example, in one embodiment, the thickness H1 of the light sensing element engaging portion 41211 is in the range of 0.08 millimeters and the thickness H2 of the top side extension 41212 is in the range of 0.5 millimeters; in one embodiment, the thickness H1 of the light sensing element engaging portion 41211 ranges in value from 0.4 millimeters and the thickness H2 of the top side extension 41212 ranges in value from 0.3 millimeters; in one embodiment, the thickness H1 of the light sensing element engaging portion 41211 ranges in value from 0.5 millimeters and the thickness H2 of the top side extension 41212 ranges in value from 0.1 millimeters.
It is understood that the second portion inner surface 41232 of the top extension 41212 is turned from the first portion inner surface 41231 to extend in a direction having a smaller angle with the optical axis X, so that the pressing head pressed on the photosensitive element 413 can avoid the connecting wire 415 between the circuit board 411 and the photosensitive element 413 in the molding process, thereby preventing the connecting wire 415 from being crushed. That is, in some cases, if the mold base 412 to be formed extends with a relatively small fixed slope, such as an angle of 45 ° to 80 ° between the inner surface and the optical axis X, a ram pressed against the photosensitive element 413 during the molding process may hit the connection line 415 to cause damage to the connection line 415.
As shown in fig. 30, an included angle α between the first portion inner surface 41231 defined by the inner surface of the light-sensing element joint portion 41211 and the optical axis X of the image capturing module 400 may be relatively large, so that the light L12 incident on the first portion inner surface 41231 is not directly reflected to the light-sensing element 413 to form stray light. That is, the light sensing element joint 41211 and the top side extension 41212 cooperate with each other, the structure of the light sensing element joint 41211 facilitates demolding and reduces stray light, and the top side extension 41212 serves to increase the area of the top surface 4124 of the molding base 412 and the structure of the top side extension 41212 to prevent the connecting wire 415 from being crushed by a ram during a molding process.
That is, as shown in fig. 29B, it is preferable that the position 41230 at which the first-part inner surface 41231 and the second-part inner surface 41232 are connected is located inside the outer edge 41321 of the photosensitive element 413, that is, the distance D1 between the position 41230 at which the first-part inner surface 41231 and the second-part inner surface 41232 are connected and the optical axis X is smaller than the distance D2 between the outer edge 41321 of the non-photosensitive region 4132 of the photosensitive element 413 and the optical axis X, so that the size of the portion between the photosensitive-element bonding portion 41211 and the photosensitive element 413 is smaller, thereby reducing the possibility of "flash" of the molding material 416 during the molding process.
Further preferably, a position 41230 at which the first part inner surface 41231 and the second part inner surface 41232 are connected is located inside the connecting line 415, and a distance D1 between the position 41230 at which the first part inner surface 41231 and the second part inner surface 41232 are connected and the optical axis X is smaller than a distance D3 between the connecting line 415 and the optical axis X. The turning point between the photosensitive element bonding part 41211 and the top side extension 41212 does not exceed the position of the connecting wire 415, i.e. the photosensitive element bonding part 41211 completes the transition to the top side extension 41212 before the photosensitive element bonding part is extended to the position of the connecting wire 415, so as to prevent the connecting wire 415 from being crushed by a pressing head in the molding process. For example, when the top extension 41212 is a vertical extension, the distance between the position of the inner edge 41241 of the top surface 4124 of the mold base 412 and the optical axis X of the camera module 400 is not less than the distance between the connecting wire 415 and the optical axis X of the camera module, so that the top extension 41212 increases the area of the top surface 4124 of the mold base 412, and integrally embeds the connecting wire 415 without damaging the connecting wire 415.
It is understood that the inner surface 41231 of the light sensing element engaging portion 41211 of the mold base 412 extends obliquely to facilitate demolding operations during the molding process and to reduce stray light reaching the light sensing element 413, and the inner surface 41232 of the top side extension 41212 extends integrally turned from the inner surface 41231 of the light sensing element engaging portion 41211 such that the light sensing element engaging portion 41211 and the top side extension 41212 cooperate to maximize the area of the top surface of the mold base 412 with reduced stray light.
In addition, when the light shielding layer 4142 is disposed on the bottom side of the filter element 414, as shown in fig. 30, a part of the stray light L11 incident on the upper surface of the filter element body 4141 of the filter element 414 is reflected by the upper surface of the filter element body 4141 and does not enter the light window 4122 of the mold base 412, and when refracted to enter the peripheral region 41412 outside the light transmitting region 41411 above the light shielding layer 4142, the stray light is absorbed by the light shielding layer 4142 and cannot enter the light window 4122 inside the mold base 412, thereby achieving the purpose of blocking a part of the stray light.
When another portion of the stray light L12 passes through the effective light-transmitting region 41411 of the filter element body 4141 and is incident on the first portion of the inner surface 41231, the other portion of the stray light L12 is reflected upward by the inclined first portion of the inner surface 41231 of the mold base 412 to the light-shielding layer 4142 or further reflected by the second portion of the inner surface 41232 to the light-shielding layer 4142, and is absorbed by the light-shielding layer 4142, so that the other portion of the stray light L is not further reflected to reach the photosensitive element 413, which affects the imaging quality of the camera module 400.
Accordingly, the light shielding layer 4142 is adjacent to the second portion inner surface 41232 of the mold base 412, the second portion inner surface 41232 of the mold base 412 extends downward from the light shielding layer 4142, and a light suppressing groove 41221 is formed at an outer portion of the light window 4122 between the light shielding layer 4142, the first portion inner surface 41231 and the second portion inner surface 41232, and the light suppressing groove 41221 is a space for suppressing the emission of stray light. More specifically, as shown in fig. 30, the stray light L12 enters the light suppressing groove 41221 and cannot exit the light suppressing groove 41221.
It can be understood that, because the light shielding layer 4142 is adjacent to the second portion inner surface 41232 of the mold base 412, the light shielding layer 4142 effectively reduces the light passing through the filter element body 4141 and reaching the second portion inner surface 41232, so as to prevent the light incident on the second portion inner surface 41232 from being reflected by the second portion inner surface 41232 and reaching the photosensitive element 413 to form stray light and affect the imaging quality of the camera module 400. As shown in fig. 30, the second portion inner surface 41232 extends downward from the light shielding layer 4142, the light shielding layer 4142 extends in the horizontal direction from the second portion inner surface 41232, and an included angle γ is formed between the light shielding layer 4142 and the second portion inner surface 41232, and the included angle γ is an acute angle or a right angle, so that the light suppressing groove 41221 formed in such a structure prevents the light incident on the inner surface 4123 from being reflected to the photosensitive element 413 to form stray light.
The filter element 4141 may be attached to the top surface 4124 of the mold base 412, such as by gluing to the top surface 4124 of the mold base 412. The light shielding layer 4142, which is a black light-absorbing and light-impermeable material, may be formed on the bottom surface of the filter element main body 4141 in various manners, such as being attached to the bottom surface of the filter element main body 4141, or the light shielding layer 4142 may be formed on the bottom surface of the filter element main body 4141 by using a yellow light process or a screen printing process.
Fig. 31A to 31C are schematic views illustrating a manufacturing process of an integrated assembly of the circuit board 411, the mold base 412 and the photosensitive element 413 of the photosensitive assembly 410 according to the present invention. The manufacturing apparatus 4200 includes a molding die 4210, the molding die 4210 includes a first die 4211 and a second die 4212 capable of opening and closing a mold, that is, a die fixing device capable of separating and closely fitting the first die 4211 and the second die 4212 to form a molding cavity 4213, when closing the mold, the circuit board 411 connected to the photosensitive element 413 is fixed in the molding cavity 4213, and the molding material 416 in a fluid state enters the molding cavity 4213, so as to be integrally molded on the circuit board 411 and the photosensitive element 413, and after being cured, the molding base 412 integrally molded on the circuit board 411 and the photosensitive element 413 is formed. It will be appreciated that the integral components described above are typically produced in the form of circuit boards during the manufacturing process, i.e., the integrally molded base is formed on the circuit board panel and then cut to form the integral components of the present invention. In fig. 31A to 31C, a process of forming one of the integrated components is illustrated as an example.
More specifically, the forming mold 4210 further has a base forming guide 4215 and includes a light window forming portion 4214 located in the base forming guide 4215. When the first and second molds 4211 and 4212 are closed, the light window forming portion 4214 and the base forming guide groove 4215 extend in the forming cavity 4213, and the molding material 416 in a fluid state is filled into the base forming guide groove 4215, and the molding material 416 in a fluid state cannot be filled at a position corresponding to the light window forming portion 4214, so that the molding base 412 including the annular molding base body 4121 corresponding to the molding base 412 of each of the photosensitive elements 410, which forms the light window 4122 of the molding base 412 at a position corresponding to the light window forming portion 4214, can be formed after the molding material 416 in a fluid state is cured at a position corresponding to the base forming guide groove 4215. The molding material 416 may be selected from, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy, and the like.
More specifically, when the first and second molds 4211 and 4212 are closed and a molding step is performed, the light window forming part 4214 is overlapped on the top surface of the photosensitive element 413 and closely attached, so that the molding material 416 in a fluid state is prevented from entering the photosensitive region 4131 of the photosensitive element 413 on the circuit board 411, thereby finally forming the light window 4122 of the mold base 412 at a position corresponding to the light window forming part 4214. It is understood that the light window forming part 4214 may be a solid structure, or may be a structure having a groove shape inside as shown in the drawing. It will be appreciated that in a further variation, the underside of the first mold 4211 may also be provided with an elastomeric membrane 4217 to provide cushioning and facilitate demolding after the molding process.
As shown in fig. 31A to 31C, the light window forming portion 4214 is press-fitted to the photosensitive element 413, and the light window forming portion 4214 has a bottom side forming portion 42141 and a top side forming portion 42142 for forming the photosensitive element bonding portion 41211 and the top side extending portion 41212 of the mold base 412, and the bottom side forming portion 42141 is a frustum-shaped structure having an inner diameter gradually increasing from the bottom side toward the top side. Wherein an angle α is formed between the outer surface 421411 of the bottom molding portion 42141 and an optical axis X (vertical direction in the drawing) perpendicular to the photosensitive element 413, and an angle β is formed between the outer surface 421421 of the top molding portion 42142 and the optical axis X perpendicular to the photosensitive element 413. Accordingly, α has a value ranging from 3 ° to 80 °, β has a value ranging from 0 ° to 10 °, and α > β. The top molding 42142 extends divergently from the bottom molding 42141 and does not press against the connecting wire 415 during the molding process to damage the connecting wire 415. The outer surface 411411 of the bottom side formation 42141 extends obliquely rather than directly as a sharp right angle, and has a height of at least 0.05 mm, thereby preventing the elastomeric membrane 4217 from being punctured during the molding process.
The light window forming part 4214 has a first partial outer surface 421411 and a second partial outer surface 421421 which form angles α and β, respectively, with an optical axis X perpendicular to the light sensing element 413 from the bottom side toward the top side, where α is in a range of 3 ° to 80 °, β is in a range of 0 ° to 10 °, and α > β. Thereby, after the molding process, the mold base 412 is formed with the photosensitive element bonding portion 41211 and the top-side extension portion 41212, and the photosensitive element bonding portion 41211 is formed with a structure in which the first portion inner surface 41231 defined by the inner surface thereof extends obliquely upward from the photosensitive element 413 with a relatively small slope, and the second portion inner surface 41232 defined by the inner surface of the top-side extension portion 41212 integrally extends turning from the first portion inner surface 41231 and extends upward with a relatively large slope or no slope. That is, an included angle between the first part inner surface 41231 defined by the inner surface of the photosensitive element combining portion 41211 and the optical axis X of the image capturing module 400 is α, and an included angle between the second part inner surface 41232 defined by the inner surface of the top extension portion 41212 and the optical axis X of the image capturing module 400 is β, where α is in a range of 3 ° to 80 °, β is in a range of 0 ° to 10 °, and α > β. It will be appreciated that the light window forming portion 4214 is constructed by being bent and extended such that the molding material 416 entering the non-photosensitive region 4132 of the photosensitive element 413 and the space 41251 of the bottom portion of the base forming guide groove 4215 of the first portion outer surface 421411 of the light window forming portion 4214 can be reduced during the molding process, so that the volume of the molding material 416 in the space is small and the pressure and pressure generated are small, thereby not easily entering the photosensitive region 4131 of the photosensitive element 413, i.e., preventing the generation of "flash".
In this molding process of the present invention, a portion of the bottom side of the base forming guide 4215 between the photosensitive element 413 and the first portion outer surface 421411 of the mold base 412 forms a filling groove 42151. The molding material 416 molded to form the molding base 412 is not easily inserted between the photosensitive element 413 and the bottom surface of the light window forming portion 4214 to form "flash", thereby reducing the possibility of contamination of the photosensitive region 4131 of the photosensitive element 413. More specifically, by reducing the volume of the fill groove 42151 between the photosensitive element 413 and the first portion outer surface 421411 of the light window shaping portion 4214, the pressure and pressure generated by the molding material 416 entering the fill groove 42151 are reduced, thereby reducing the likelihood of the molding material 416 entering between the photosensitive element 413 and the bottom surface of the light window shaping portion 4214 to form "flash".
In this preferred embodiment of the present invention, the outer surface of the light window molding portion 4214 has outer surfaces extending in different directions, and the included angle between the outer surface of the top side, i.e., the second portion outer surface 421421, and the optical axis X of the photosensitive assembly is smaller than the included angle between the outer surface of the bottom side, i.e., the first portion outer surface 421411, and the optical axis X, so that the volume of the filling groove 42151 formed between the first portion outer surface 421411 of the light window molding portion 4214 and the photosensitive element 413 is reduced, thereby reducing the possibility of the generation of "flash".
In addition, the second part outer surface 421421 of the top side of the optical window molding extends at a small angle with respect to the optical axis X, so that it is not convenient to guide the encapsulating material into the filling groove like the inclined outer surface illustrated in fig. 1B, but in this embodiment of the present invention, the second part outer surface 421421 of the top side of the optical window molding can play a certain blocking effect because it extends integrally and turns from the first part outer surface 421411, rather than a guide surface structure extending linearly and obliquely like in fig. 1B, so as to slow down the flow rate of the molding material 416 entering the filling groove 42151 to some extent, reduce the pressure generated when the molding material 416 enters the filling groove 42151, and thus reduce the possibility of the generation of "flash". Also, since the molding material 416 is not easily formed into "flash" in the integral molding process, the light window forming portion 4214 does not need to be pressed against the photosensitive element 413 with a large pressure, thereby preventing the photosensitive element 413 from being crushed. As shown in fig. 32A, according to a modified embodiment of the above-described third preferred embodiment of the present invention, in this embodiment, the top surface of the filter element body 4141 is further provided with a top-side light shielding layer 4143, so that the top-side light shielding layer 4143 and the light shielding layer 4142 cooperate to enhance the effect of reducing stray light. More specifically, the light L21 incident on the top-side light-shielding layer 4143 is absorbed by the top-side light-shielding layer 4143, and the light L22 is absorbed by the light-shielding layer 4142. It is to be understood that the above-described third preferred embodiment may also be provided with the topside light shielding layer 4143.
As shown in fig. 32B, according to a modified embodiment of the third preferred embodiment of the present invention, the image capturing module 400 includes the photosensitive element 410, the lens 430 and a lens holder 440. The lens 430 is assembled to the lens carrier 440 to form a lens assembly. The lens carrier 440 may be a fixed lens barrel, thereby forming a fixed focus camera module.
Correspondingly, the light sensing assembly 410 includes a circuit board 411, a mold base 412, a light sensing element 413 and a filter element 414, the mold base 412 includes a base body 4121 integrally formed on the circuit board 411 and the light sensing element 413 and forming a light window 4122, the light window 4122 is a closed space and provides a light path for the light sensing element 413. The filter 414 includes a filter body 4141 and a light-shielding layer 4142, and the light-shielding layer 4142 is made of light-absorbing and light-impermeable material and is located on the bottom side of the filter body 4141 and between the filter body 4141 and the mold base 412.
Wherein the mold base 412 has a top groove 4125 on its top side, the top groove 4125 being used to assemble the filter element 414. That is, in this embodiment of the present invention, the top surface 4124 of the mold base 412 may be a multi-step surface, the top surface 4124 is divided into a plurality of non-coplanar top surfaces, such as a first top portion 4124a and a second top portion 4124b, the first top portion 4124a is recessed relative to the second top portion 4124b in a direction toward the photosensitive element 413, such that the top groove 4125 is formed on the top side of the first top portion 4124a, and the filter element 414 is assembled to the top groove 4125.
The top side extension 41212 of the mold base 412 is correspondingly two-segmented and forms the top side groove 4125 at its top side. The inner surface 4123 of the mold base 412 includes the first portion inner surface 41231 of the photosensitive element bonding portion 41211 and the second portion inner surface 41232 and the third portion inner surface 41233 formed by the top extension portion 41212, respectively, the light shielding layer 4142 is adjacent to the second portion inner surface 41232 of the mold base 412, and the light suppressing groove 41221 is formed between the first portion inner surface 41231 and the second portion inner surface 41232, so as to form a space for suppressing the emission of stray light. That is, light incident on the first portion inner surface 41231 is directly reflected to the light shielding layer 4142 or is further reflected by the second portion inner surface 41232 to the light shielding layer 4142 to be absorbed by the light shielding layer 4142, thereby reducing stray light. The topside light shielding layer 4143 is also disposed on the topside of the filter element 414 to enhance the effect of eliminating stray light.
It can be understood that in the above embodiments of fig. 28 to 33, the bonding direction of the connecting wire 415 is from the photosensitive element 413 to the circuit board 411, that is, by disposing the photosensitive element land on the photosensitive element 413, the bonding jig first forms a first end of the connecting wire 415 connected to the photosensitive element land by bonding on the top end of the photosensitive element land, then raises a preset position, then moves toward the circuit board land on the circuit board and descends again to form a second end of the connecting wire 415 connected to the circuit board land on the top end of the circuit board land.
As shown in fig. 33, according to another modified embodiment of the third preferred embodiment of the present invention, the electronic component 4112 of the circuit board 411 of the photosensitive assembly 410 of the camera module 400 is mounted on the bottom side thereof, and accordingly, the photosensitive assembly 410 further includes one or more bottom side molding portions 419 that integrally embed the electronic component 4112. That is, the electronic component 4112 is not mounted on the top side of the circuit board 411, and these electronic components 4112 are disposed on the bottom side of the circuit board 411, and pass through the bottom side molding portion 419, which may be a plurality of independent portions, or may form an integrally molded base, so as to embed the electronic component 4112 and form a flat supporting surface on the bottom side. The bottom molding portion 419 and the molding base 412 may be formed separately from each other, or may be formed in a single molding process, for example, the circuit board 411 may have a through hole, and the molding material 416 may reach both sides of the circuit board 411 in the molding process.
It is understood that the space on the bottom side of the circuit board 411 under the photosensitive element 413 can also be used for arranging the electronic component 4112, so that the area size of the circuit board 411 is significantly reduced in this embodiment, unlike the above-mentioned embodiment in which the electronic component 4112 needs to be arranged around the photosensitive element 413.
Accordingly, the mold base 412 includes the photosensitive element engaging portion 41211 and the top-side extension 41212, so that when the size of the photosensitive assembly 410 is further reduced, the top-side extension 41212 extends in a turning manner to increase the area of the top surface 4124 of the mold base 412, thereby providing a larger mounting surface for the lens carrier 440 and the filter element 414. And the filter element 414 includes a bottom-side light-shielding layer 4142 and a top-side light-shielding layer 4143 provided on both sides of the filter element body 4141, thereby enhancing the effect of eliminating stray light.
As shown in fig. 34, the wire bonding connection between the photosensitive element 413 and the circuit board 411 is from the circuit board 411 to the photosensitive element 413. That is, by disposing the circuit board land on the circuit board 411, the wire bonding jig is first wire bonded to the top end of the circuit board land to form the second end of the connecting wire 415 connected to the circuit board land, then, the predetermined position is raised, and then, the substrate is translated toward the circuit board land and the opposite first end of the connection wire 415 connected to the photo-sensitive element land is formed at the top end of the photo-sensitive element land, so that the connection wire 415 is extended in a curved shape, and results in the height h2 of the top end of the connecting wire 415 being lower than that of the embodiment of fig. 28 to 33, for example, in fig. 33, the height h1 of the top end of the connecting wire, thus, in the molding process, the space required for the light window forming portion 4214 of the forming die 4210 to escape from the connecting line 415 is reduced, so that the height of the top side extension 41212 can be higher.
Referring to fig. 35 to 37, a camera module 400 according to a fourth preferred embodiment of the present invention is shown, wherein the camera module 400 includes a photosensitive element 410 and a lens 430. The lens 430 is assembled to the photosensitive element to form a fixed focus camera module. It is understood that, in another variant, the lens may also be disposed on a driver or a fixed lens barrel to form a lens assembly, and the lens assembly is assembled to the photosensitive assembly.
Correspondingly, the light sensing assembly 410 includes a circuit board 411, a mold base 412, a light sensing element 413, a filter element 414 and a filter element support 417, the mold base 412 includes a base body 4121 integrally formed on the circuit board 411 and the light sensing element 413 and forming a light window 4122, the light window 4122 is a closed space and provides a light path for the light sensing element 413.
The filter holder 417 is assembled to the mold base 412 and has a window 4171 on the bottom side and a top side mounting groove 4172, and the filter 414 is assembled to the top side mounting groove 4172, so that the filter 414 is assembled to the filter holder 417 and is less likely to be damaged than when it is directly assembled to the mold base 412.
The filter 414 includes a filter body 4141, a bottom light shielding layer 4142 and a top light shielding layer 4143, the light shielding layer 4142 is located at the bottom of the filter body 4141 and between the filter body 4141 and the inner top surface of the filter holder 417, the light shielding layer 4142 is made of light absorbing material, which makes the filter body 4141 form a middle effective light transmitting region 41411 and a peripheral region 41412, and the light passing through the lens 430 can reach the inside of the mold base 412 only through the effective light transmitting region 41411. The light-shielding layer 4142, which is an annular structure with a window formed in the middle, that is, the light-shielding layer 4142 forms a light path 41420 for allowing light to enter the light window 4122 and reduces stray light reaching the photosensitive element 413, and the top-side light-shielding layer 4143 can enhance the effect of reducing stray light.
The photosensitive element 413 has a photosensitive region 4131 in the middle and a non-photosensitive region 4132 around the photosensitive region 4131, and the light shielding layer 4142 has an inner edge 41421 and an outer edge 41422. The distance between the inner edge 41421 of the light shielding layer 4142 and the optical axis X is greater than or equal to, or slightly less than, the distance between the outer edge 41311 of the photosensitive region 4131 and the optical axis X.
The outer edge 41422 of the light shielding layer 4142 is located outside the inner edge 41701 of the top surface of the filter element support 417, i.e., a light transmitting region is not formed between the inner edge of the top surface of the filter element support 417 and the outer edge 41422 of the light shielding layer 4142.
In this embodiment of the present invention, the base body 4121 of the mold base 412 includes a plurality of inner surfaces of a circumferential direction, each having a plurality of portions extending in different directions, for example, the base body 4121 of the mold base 412 includes three portions, i.e., a photosensitive element bonding portion 41211 and a top side extension portion 41212 around the light window 4122 shown in fig. 36A and 36B, and a circuit board bonding portion 41213 at the bottom side of the photosensitive element bonding portion 41211. The light sensing element junction 41211 has an inner surface integrally extending from the light sensing element 413, wherein at least one section of the inner surface integrally extending from the light sensing element 413 is defined as a first portion inner surface 41231 of the molding base 412, the top side extension 41212 has an inner surface integrally extending from the light sensing element junction 41211 and forms a second portion inner surface 41232 of the molding base 412, and the second portion inner surface 41232 integrally extends from the first portion inner surface 41231. It is understood that each of the first portion inner surface 41231 and the second portion inner surface 41232 is a surrounding inner surface of the seat body 4121; or said first portion inner surface 41231 and said second portion inner surface 41232 all having the same configuration; or all of the inner surfaces have said first portion inner surface 41231 and said second portion inner surface 41232.
The inner surfaces 41231 and 41232 of the light sensing element bonding part 41211 and the top side extension 41212 respectively extend with different slopes, the second part inner surface 41232 of the top side extension 41212 extends upward with a greater slope relative to the first part inner surface 41231 of the light sensing element bonding part 41211, or the second part inner surface 41232 of the top side extension 41212 extends upward with nearly no slope, i.e., the second part inner surface 41232 of the top side extension 41212 extends substantially perpendicular to the top surface of the light sensing element 413, thereby enabling the area of the top surface of the top side extension 41212 to be relatively large, i.e., the top surface of the top side extension 41212 determines the area of the top surface 4124 of the mold base 412, and such extending structures of the light sensing element bonding part 41211 and the top side extension 41212 can increase the area of the top surface 4124 of the mold base 412, thereby providing a larger mounting area for the lens or lens assembly or the filter element support 417 above the photosensitive assembly 410. for example, in this embodiment, the top surface 4124 of the mold base 412 allows for a more secure mounting of the filter element support 417 above. And such a structure can reduce the area of the filter element 414.
That is, in order to facilitate the demolding of the molding process and to prevent stray light, the photosensitive element bonding portion 41211 is formed in a structure in which the first portion inner surface 41231 defined by its inner surface extends upward from the photosensitive element 413 with a relatively small slope, and the second portion inner surface 41232 defined by the inner surface of the top-side extension portion 41212 integrally extends turning back from the first portion inner surface 41231, and extends upward with a relatively large slope or no slope, i.e., an included angle is formed between the second portion inner surface 41232 of the mold base 412 and the first portion inner surface 41231, so that the area size of the top surface 4124 of the mold base 412 can be effectively increased with respect to the upward extension with a fixed slope. It is understood that the inner surfaces of the molded base 412 extending in the circumferential direction may have the first portion inner surface 41231 and the second portion inner surface 41232, and the first portion inner surfaces 41231 may have the same or different included angles α. These second portion inner surfaces 41232 may or may not have the same included angle β.
As shown in fig. 36B, an included angle between the first part inner surface 41231 defined by the inner surface of the photosensitive element combining portion 41211 and the optical axis X of the image capturing module 400 is α, and an included angle between the second part inner surface 41232 defined by the inner surface of the top extension portion 41212 and the optical axis X of the image capturing module 400 is β, where α is in a range of 3 ° to 80 °, β is in a range of 0 ° to 10 °, and α > β.
That is, the included angle β between the second portion inner surface 41232 defined by the inner surface of the top-side extension 41212 and the optical axis X of the camera module 400 is a smaller angle with respect to the included angle α between the first portion inner surface 41231 defined by the inner surface of the photosensitive element bonding part 41211 and the optical axis X of the camera module 400, so that the second portion inner surface 41232 of the top-side extension 41212 extends upward with a greater slope or in a direction perpendicular to the photosensitive element 413, thereby increasing the area of the top surface 4124 of the mold base 412, decreasing the area of the filter element, and reducing the possibility of "flash" of the molding material 416 during the molding process.
As shown in fig. 36B, in this preferred embodiment of the present invention, preferably, the thickness H1 of the photosensitive element combination portion 41211 ranges from 0.05 mm to 0.7 mm, and the thickness H2 of the top side extension 41212 ranges from 0.02 mm to 0.6 mm.
In addition, since the filter element 414 is provided with the light-shielding layer 4142 and the top-side light-shielding layer 4143, as shown in fig. 37, a part of stray light L31 incident on the upper surface of the filter element body 4141 of the filter element 414 is absorbed by the top-side light-shielding layer 4143, and this serves to block a part of stray light.
When another portion of the stray light L32 passes through the effective light-transmitting region 41411 of the filter element body 4141 and is incident on the first portion of the inner surface 41231, the other portion of the stray light L32 is reflected upward by the inclined first portion of the inner surface 41231 of the mold base 412 to the light-shielding layer 4142 or further reflected by the second portion of the inner surface 41232 to the light-shielding layer 4142, and is absorbed by the light-shielding layer 4142, so that the other portion of the stray light L is not further reflected to reach the photosensitive element 413, which affects the imaging quality of the camera module 400.
Accordingly, the light shielding layer 4142 and the filter element support 417 are located adjacent to each other on the inner surface 41702 under the filter element, the inner surface 41702 under the filter element of the filter element support 417 extends downward from the light shielding layer 4142, and between the first portion inner surface 41231 and the second portion inner surface 41232, the outer portion of the light window 4122 forms a light suppressing groove 41221 in the light shielding layer 4142, and the light suppressing groove 41221 is a space for suppressing the emission of stray light. More specifically, as shown in fig. 37, the stray light L32 enters the light suppressing groove 41221 and cannot exit the light suppressing groove 41221.
As shown in fig. 38, according to a modified embodiment of the above-described fourth preferred embodiment of the present invention, the mold base 412 is formed with a top groove 4125 at the top side, the filter holder 417 is assembled to the top groove 4125 to move down the position thereof, and the lens 430 may be assembled to the top side of the mold base 412. That is, the top surface 4124 enlarged by the multistage extension of the mold base 412 is used to assemble the filter element holder 417 and the lens 430.
Referring to fig. 39 to 41, a camera module 400 according to a fifth preferred embodiment of the present invention is shown, and the structure of the camera module 400 is similar to that of the fourth preferred embodiment, and the camera module 400 includes a photosensitive element 410 and a lens 430. The lens 430 is assembled to the photosensitive element to form a fixed focus camera module. It is understood that, in another variant, the lens may also be disposed on a driver or a fixed lens barrel to form a lens assembly, and the lens assembly is assembled to the photosensitive assembly.
Correspondingly, the light sensing assembly 410 includes a circuit board 411, a mold base 412, a light sensing element 413, a filter element 414 and a filter element support 417, the mold base 412 includes a base body 4121 integrally formed on the circuit board 411 and the light sensing element 413 and forming a light window 4122, the light window 4122 is a closed space and provides a light path for the light sensing element 413. The mold base 412 includes a light sensing element engaging portion 41211 and a top side extension 41212 located around the light window 4122 that extend in multiple segments with inner surfaces 41231 and 41232 extending in different directions, respectively, to reduce stray light and increase the area of the top surface 4124 of the mold base 412.
The filter holder 417 is assembled to the mold base 412 and has a top window 4171 and a bottom mounting groove 4173, and the filter 414 is assembled to the bottom mounting groove 4173 in a reverse manner. The filter element 414 includes a filter element body 4141 and a light shielding layer 4142, and the light shielding layer 4142 is disposed on the bottom side of the filter element body 4141. Thus, similarly, the light-shielding layer 4142 can function to reduce stray light reaching the photosensitive element 413.
In addition, the lens 430 includes a carrier 431 and one or more lenses 432 assembled to the carrier 431, wherein because the filter element 414 is inversely installed on the filter element support 417, so that the filter element 414 does not protrude from the upper surface of the filter element support 417, the bottommost lens among the one or more lenses 432 of the lens 430 can be moved relatively downward, thereby reducing the distance between the lens and the photosensitive element 413, and thus reducing the back focal length of the camera module 400.
When the filter element 414 is provided with the light shielding layer 4142 on the bottom side, as shown in fig. 41, part of the stray light L41 incident on the upper surface of the filter element support 417 is reflected without entering the light window 4122 of the mold base 412, thereby serving the purpose of blocking part of the stray light.
When another portion of the stray light L42 passes through the effective light-transmitting region 41411 of the filter element body 4141 and is incident on the first portion of the inner surface 41231, the other portion of the stray light L42 is reflected upward by the inclined first portion of the inner surface 41231 of the mold base 412 to the light-shielding layer 4142 or further reflected by the second portion of the inner surface 41232 to the light-shielding layer 4142, and is absorbed by the light-shielding layer 4142, so that the other portion of the stray light L is not further reflected to reach the photosensitive element 413, which affects the imaging quality of the camera module 400.
Accordingly, the light shielding layer 4142 is adjacent to the second portion inner surface 41232 of the mold base 412, the second portion inner surface 41232 of the mold base 412 extends downward from the light shielding layer 4142, and a light suppressing groove 41221 is formed at an outer portion of the light window 4122 between the light shielding layer 4142, the first portion inner surface 41231 and the second portion inner surface 41232, and the light suppressing groove 41221 is a space for suppressing the emission of stray light. More specifically, as shown in fig. 41, the stray light L42 enters the light suppressing groove 41221 and cannot exit the light suppressing groove 41221.
Moreover, it can be understood that, because the light shielding layer 4142 and the second portion inner surface 41232 of the mold base 412 are formed, the light shielding layer 4142 effectively reduces the light passing through the filter element body 4141 and reaching the second portion inner surface 41232, so as to prevent the light incident on the second portion inner surface 41232 from being reflected and reaching the photosensitive element 413 to form stray light and affect the imaging quality of the image capturing module 400.
As shown in fig. 42, according to another variant of the fifth embodiment of the present invention, the bonding wires 415 are wired from the circuit board 411 to the photosensitive element 413, so that the light window forming portion 4214 needs no space for providing the bonding wires 415 during the molding process, and the top extension 41212 has a larger height to increase the area of the top surface 4124 of the mold base 412.
In addition, a window 4171 is formed on the top side of the filter element support 417, and the length of the inwardly extending portion 4174 on the top side of the filter element support 417 may be greater than or equal to the length of the inwardly extending portion 4142 of the light shielding layer, so that the area of the window 4171 may not be greater than the area of the light path 41420, so that the top surface of the filter element support 417 functions to block a portion of the stray light L51, thereby eliminating the need to provide the top side light shielding layer 4143 on the top side of the filter element 414. The stray light L52 can be absorbed by the light-shielding layer 4142.
As shown in fig. 43, according to another modified embodiment of the fifth embodiment of the present invention, the photosensitive assembly 410 includes a circuit board 411, a mold base 412, a photosensitive element 413, a filter element 414, a filter element support 417 and a blocking frame 418. The mold base 412 is integrally combined with the circuit board, the photosensitive element 413 and the bezel 418, the filter element 414 is assembled to the filter element support 417, and the filter element support 417 is assembled to the top side of the mold base 412. The light-shielding layer 4142 of the filter element 414, similar to the third preferred embodiment, is disposed on the bottom side of the filter element body 142, and can reduce the stray light.
The annular bezel 418 is disposed on the photosensitive element 413, and is used for pressing the light window forming portion 4214 against the bezel 418 in a molding process to prevent the fluid molding material 416 from flowing into the photosensitive region 4131 of the photosensitive element 413, wherein the molding base 412 is integrally formed on the circuit board, the photosensitive element 413 and the bezel 418, and the bezel 418 may be a glue in a preferred embodiment, which may have a predetermined elasticity, such as an elastic modulus ranging from 0.1Gpa to 1 Gpa.
A base body 4121 of the mold base 412 includes a light sensing element joint portion 41211 and a top side extension portion 41212 around the light window 4122, and a circuit board joint portion 41213 around the light sensing element 413 and the top side of the circuit board 411 at the bottom side of the light sensing element joint portion 41211. The photosensitive-element combining portion 41211 is integrally combined with the circuit board 411, the photosensitive element 413 and the blocking frame 418, and has a first-part inner surface 41231 extending obliquely from the blocking frame 418, and the top-side extending portion 41212 has a second-part inner surface 41232 extending divergently from the first-part inner surface 41231, so that such a structure enables the light reflection action of the oblique first-part inner surface 41231 to reduce stray light, the divergently extending second-part surface 1232 enables the top surface of the top-side extending portion 41212 to have a larger mounting area, reduces the area of the filter element 414, and prevents the molding material 416 from forming "flash" in the molding process, and the included angle between the two-part inner surface and the optical axis X is similar to the previous embodiment. It is understood that the stop frame 418 of this embodiment can be applied to other embodiments of the present invention.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (54)
1. A method for manufacturing a photosensitive assembly of a camera module comprises the following steps:
(a) fixing a circuit board jointed board to a second mold of a forming mold, wherein the circuit board jointed board comprises one or more rows of circuit boards, each row of circuit boards comprises one or more circuit boards arranged side by side, each circuit board comprises a rigid area and a flexible area which are combined, and each circuit board can be operatively connected with a photosensitive element;
(b) closing the second mold and a first mold, and filling a molten molding material into a base panel forming guide groove in the forming mold, wherein a position corresponding to at least one optical window forming portion is prevented from being filled with the molding material; and
(c) curing the molding material in the base panel forming guide groove to form a conjoined molding base at a position corresponding to the base panel forming guide groove, wherein the conjoined molding base is integrally formed with one or more rows of the circuit boards and one or more rows of the photosensitive elements corresponding to the base panel forming guide groove to form a photosensitive assembly panel and form an optical window providing a light path for each photosensitive element at a position corresponding to the optical window forming part, wherein the base panel forming guide groove has a first guide groove corresponding to a first end side of the conjoined molding base adjacent to the flexible region, a second guide groove corresponding to the conjoined molding base away from the flexible region, and a plurality of filling grooves extending between the first guide groove and the second guide groove, wherein the first guide groove has a first side surface facing the optical window, the second diversion trench has a second side surface facing the optical window, wherein the first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected with the first partial surface, the second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected with the third partial surface, wherein a first angle of the first partial surface relative to an optical axis of the camera module is larger than a second angle of the second partial surface relative to the optical axis, and a third angle of the third partial surface relative to the optical axis is larger than a fourth angle of the fourth partial surface relative to the optical axis;
wherein the circuit board and the corresponding photosensitive element are connected by a series of connecting wires embedded by the molding base, the position where the first partial surface and the second partial surface are connected is located inside the connecting wires on the side, and the position where the third partial surface and the fourth partial surface are connected is located inside the connecting wires on the side.
2. The method of claim 1, further comprising the step of: cutting the photosensitive assembly jointed board to obtain a plurality of photosensitive assemblies, wherein each photosensitive assembly comprises the circuit board, the photosensitive element and the molding base, wherein the molding base is integrally formed on the circuit board and the photosensitive element and forms the optical window for providing a light path for the photosensitive element.
3. The method of claim 1, wherein the first angle and the third angle are between 3 ° and 80 °.
4. The method of claim 1, wherein the second and fourth angles are between 0 ° and 20 °.
5. The method according to any one of claims 1 to 4, wherein the first height and the third height of the first partial surface and the third partial surface, respectively, in a direction perpendicular to the surface of the photosensitive element are 0.05 mm to 0.7 mm.
6. The method according to any one of claims 1 to 4, wherein the second height and the fourth height of the second partial surface and the fourth partial surface, respectively, in a direction perpendicular to the surface of the photosensitive element are 0.02 mm to 0.6 mm.
7. The method of any of claims 1-4, wherein the first channel bottom end width is between 0.2 mm and 1 mm.
8. The method according to any one of claims 1 to 4, wherein said one-piece molded base is integrally formed with an array of said circuit boards and an array of said light-sensing elements; or the conjoined molding base is integrally formed on two adjacent rows of the circuit boards and two adjacent rows of the photosensitive elements, wherein the two adjacent rows of the circuit boards are arranged such that the flexible areas thereof are far away from each other and the rigid areas thereof are close to each other.
9. A sensitization subassembly of module of making a video recording, its characterized in that includes:
a circuit board comprising a rigid region and a flexible region in combination;
a photosensitive element; and
a molding base, wherein the molding base is integrally formed on the circuit board and the photosensitive element and forms an optical window for providing a light path for the photosensitive element; wherein a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the optical window, the first side surface includes a first partial surface disposed adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and a first angle of the first partial surface with respect to an optical axis of the camera module is larger than a second angle of the second partial surface with respect to the optical axis; a second side surface facing the light window corresponding to an opposite second end side of the molding base away from the flexible region, the second side surface including a third partial surface disposed adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, and a third angle of the third partial surface with respect to the optical axis being larger than a fourth angle of the fourth partial surface with respect to the optical axis;
the circuit board and the photosensitive element are connected through a series of connecting wires, the series of connecting wires are embedded by the molding base, the connecting position of the first part surface and the second part surface is located on the inner side of the connecting wires on the side, and the connecting position of the third part surface and the fourth part surface is located on the inner side of the connecting wires on the side.
10. The photosensitive assembly of claim 9 wherein said first angle and said third angle are between 3 ° and 80 °.
11. The photosensitive assembly of claim 9 wherein said second and fourth angles are between 0 ° and 20 °.
12. The photosensitive assembly according to any one of claims 9 to 11, wherein the first height and the third height of the first partial surface and the third partial surface in a direction perpendicular to the surface of the photosensitive element are 0.05 mm to 0.7 mm, respectively.
13. The photosensitive assembly according to any one of claims 9 to 11, wherein the second height and the fourth height of the second partial surface and the fourth partial surface in a direction perpendicular to the surface of the photosensitive element are 0.02 mm to 0.6 mm, respectively.
14. The photosensitive assembly according to any one of claims 9 to 11, a portion of the mold base adjacent to the first end side of the flexible region, an inner edge and an outer edge of which are spaced from each other by a distance of 0.2 mm to 1 mm.
15. A sensitization subassembly makeup of module of making a video recording, its characterized in that includes:
one or more columns of circuit boards, each column of circuit boards comprising one or more circuit boards arranged side-by-side, each of said circuit boards comprising a rigid region and a flexible region in combination;
one or more rows of photosensitive elements; and
one or more conjoined molded bases, each conjoined molded base being integrally formed on a row of the circuit board and a row of the photosensitive elements and forming an optical window for providing a light path for each photosensitive element; the side, corresponding to the first end of the connected molding base, of the flexible area is provided with a first side surface facing the light window, the first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected with the first partial surface, and the first angle of the first partial surface relative to the optical axis of the camera module is larger than the second angle of the second partial surface relative to the optical axis; a second side surface facing the light window is arranged on the opposite second end side, away from the flexible area, of the one-piece molding base, the second side surface comprises a third partial surface and a fourth partial surface, the third partial surface is arranged adjacent to the photosensitive element, the fourth partial surface is connected with the third partial surface, and the third angle of the third partial surface relative to the optical axis is larger than the fourth angle of the fourth partial surface relative to the optical axis;
wherein the circuit board and the corresponding photosensitive element are connected by a series of connecting wires embedded by the molding base, the position where the first partial surface and the second partial surface are connected is located inside the connecting wires on the side, and the position where the third partial surface and the fourth partial surface are connected is located inside the connecting wires on the side.
16. The photosensitive assembly panel of claim 15, wherein the first angle and the third angle are 3 ° to 80 °.
17. The photosensitive assembly panel of claim 15, wherein the second and fourth angles are 0 ° to 20 °.
18. The photosensitive assembly panel of any one of claims 15 to 17, wherein the first and third height of the first and third partial surfaces, respectively, in a direction perpendicular to the surface of the photosensitive element is 0.05 mm to 0.7 mm.
19. The photosensitive assembly panel of any one of claims 15 to 17, wherein the second and fourth partial surfaces have respective second and fourth heights in a direction perpendicular to the surface of the photosensitive element of 0.02 mm to 0.6 mm.
20. A sensitization subassembly makeup of module of making a video recording, its characterized in that includes:
a plurality of columns of circuit boards, each column of circuit boards comprising one or more circuit boards arranged side-by-side, each of said circuit boards comprising a rigid region and a flexible region in combination;
a plurality of rows of photosensitive elements; and
one or more one-piece molded bases, each of which is integrally formed on two adjacent rows of the circuit boards and two adjacent rows of the photosensitive elements and forms an optical window for providing a light path for each of the photosensitive elements, and the two adjacent rows of the circuit boards are arranged such that flexible regions thereof are distant from each other and rigid regions thereof are adjacent to each other, with each of the two-piece molded bases having both end sides adjacent to the flexible regions; the side, corresponding to the first end of the connected molding base, of the flexible area is provided with a first side surface facing the light window, the first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected with the first partial surface, and the first angle of the first partial surface relative to the optical axis of the camera module is larger than the second angle of the second partial surface relative to the optical axis; the conjoined molding base extends to a second end side between the two adjacent rows of photosensitive elements and is provided with a second side surface facing the optical window, the second side surface comprises a third part surface arranged adjacent to the photosensitive elements and a fourth part surface connected with the third part surface, and the third angle of the third part surface relative to the optical axis is larger than the fourth angle of the fourth part surface relative to the optical axis;
wherein the circuit board and the corresponding photosensitive element are connected by a series of connecting wires embedded by the molding base, the position where the first partial surface and the second partial surface are connected is located inside the connecting wires on the side, and the position where the third partial surface and the fourth partial surface are connected is located inside the connecting wires on the side.
21. The photosensitive assembly panel of claim 20, wherein the first angle and the third angle are 3 ° to 80 °.
22. The photosensitive assembly panel of claim 20, wherein the second and fourth angles are 0 ° to 20 °.
23. The photosensitive assembly panel of any one of claims 20 to 22, wherein the first and third height of the first and third partial surfaces, respectively, in a direction perpendicular to the surface of the photosensitive element is 0.05 mm to 0.7 mm.
24. The photosensitive assembly panel of any one of claims 20 to 22, wherein the second and fourth partial surfaces have respective second and fourth heights in a direction perpendicular to the surface of the photosensitive element of 0.02 mm to 0.6 mm.
25. A camera module, comprising:
a lens;
a circuit board comprising a rigid region and a flexible region in combination;
a photosensitive element; and
a molding base, wherein the molding base is integrally formed on the circuit board and the photosensitive element and forms an optical window for providing a light path for the photosensitive element, and the lens is located in a photosensitive path of the photosensitive element; wherein a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the optical window, the first side surface includes a first partial surface disposed adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and a first angle of the first partial surface with respect to an optical axis of the camera module is larger than a second angle of the second partial surface with respect to the optical axis; a second side surface facing the light window corresponding to an opposite second end side of the molding base away from the flexible region, the second side surface including a third partial surface disposed adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, and a third angle of the third partial surface with respect to the optical axis being larger than a fourth angle of the fourth partial surface with respect to the optical axis;
the circuit board and the photosensitive element are connected through a series of connecting wires, the series of connecting wires are embedded by the molding base, the connecting position of the first part surface and the second part surface is located on the inner side of the connecting wires on the side, and the connecting position of the third part surface and the fourth part surface is located on the inner side of the connecting wires on the side.
26. The camera module of claim 25, wherein the first and third angles are 3-80 °.
27. The camera module of claim 25, wherein the second and fourth angles are 0 ° to 20 °.
28. The camera module according to any one of claims 25 to 27, wherein a first height and a third height of the first partial surface and the third partial surface, respectively, in a direction perpendicular to the surface of the photosensitive element are 0.05 mm to 0.7 mm.
29. The camera module according to any one of claims 25 to 27, wherein a second height and a fourth height of the second partial surface and the fourth partial surface, respectively, in a direction perpendicular to the surface of the photosensitive element are 0.02 mm to 0.6 mm.
30. A forming mold for manufacturing a photosensitive assembly jointed board applied to a camera module, comprising a first mold and a second mold which are suitable for being separated and closed mutually, wherein the first mold and the second mold form a forming cavity when being closed mutually, and the forming mold is provided with at least one optical window forming part and a base jointed board forming guide groove which is positioned around the optical window forming part in the forming cavity and is suitable for fixing a circuit board jointed board in the forming cavity, wherein the circuit board jointed board comprises one or more rows of circuit boards, each row of circuit boards comprises one or more circuit boards which are arranged side by side, each circuit board comprises a rigid area and a flexible area which are combined, each circuit board is operatively connected with a photosensitive element, the base jointed board forming guide groove is suitable for being filled with at least one molding material so as to form a conjoined molding base at a position corresponding to the base jointed board forming guide groove, the conjoined molding base is integrally formed on each row of the circuit board and each row of the photosensitive elements corresponding to each row of the circuit board and each row of the photosensitive elements to form the photosensitive assembly jointed board and forms an optical window for providing a light path for each photosensitive element at a position corresponding to the optical window forming part, wherein the base jointed board forming guide groove is provided with a first guide groove corresponding to a first end side of the conjoined molding base adjacent to the flexible region, a second guide groove corresponding to the conjoined molding base far away from the flexible region, and a plurality of filling grooves extending between the first guide groove and the second guide groove, each optical window forming part is positioned between two adjacent filling grooves, the first guide groove is provided with a first side surface facing the optical window, the second guide groove is provided with a second side surface facing the optical window, and the first side surface comprises a first part surface arranged adjacent to the photosensitive element and a second part surface connected with the first part surface A surface having a third partial surface disposed adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a first angle of the first partial surface with respect to an optical axis of the image pickup module is larger than a second angle of the second partial surface with respect to the optical axis, and a third angle of the third partial surface with respect to the optical axis is larger than a fourth angle of the fourth partial surface with respect to the optical axis;
the circuit board is connected with the corresponding photosensitive element through a series of connecting lines, the connecting lines are embedded by the connected molding base, the connecting position of the first part surface and the second part surface is located on the inner side of the connecting lines, and the connecting position of the third part surface and the fourth part surface is located on the inner side of the connecting lines.
31. A forming mold for manufacturing a photosensitive assembly jointed board applied to a camera module, comprising a first mold and a second mold which are suitable for being separated and closed mutually, wherein the first mold and the second mold form a forming cavity when being closed mutually, and the forming mold is provided with at least one optical window forming part and a base jointed board forming guide groove which is positioned around the optical window forming part in the forming cavity and is suitable for fixing a circuit board jointed board in the forming cavity, wherein the circuit board jointed board comprises a plurality of rows of circuit boards, each row of circuit boards comprises one or a plurality of circuit boards which are arranged side by side, each circuit board comprises a rigid area and a flexible area which are combined together, and each circuit board is operatively connected with a photosensitive element, wherein the base jointed board forming guide groove is suitable for being filled with at least one molding material so as to form a conjoined molding base at a position corresponding to the base jointed board forming guide groove, wherein the conjoined molding base is integrally formed on two adjacent rows of the circuit boards and two adjacent rows of the photosensitive elements to form the photosensitive assembly jointed board and form an optical window for providing a light path for each photosensitive element at a position corresponding to the optical window forming part, wherein the two adjacent rows of the circuit boards are arranged such that the flexible regions thereof are far away from each other and the rigid regions thereof are adjacent to each other, wherein the base jointed board forming guide groove has two first guide grooves corresponding to two end sides of the conjoined molding base adjacent to the flexible regions and a second guide groove corresponding to a region between the two adjacent rows of the photosensitive elements, and a plurality of filling grooves extending between the two first guide grooves and the second guide groove, wherein each optical window forming part is located between the two adjacent filling grooves, wherein the first guide groove has a first side surface facing the optical window, the second diversion trench has a second side surface facing the optical window, wherein the first side surface includes a first partial surface disposed adjacent to the photosensitive element and a second partial surface connected to the first partial surface, the second side surface has a third partial surface disposed adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a first angle of the first partial surface with respect to an optical axis of the camera module is larger than a second angle of the second partial surface with respect to the optical axis, and a third angle of the third partial surface with respect to the optical axis is larger than a fourth angle of the fourth partial surface with respect to the optical axis;
the circuit board is connected with the corresponding photosensitive element through a series of connecting lines, the connecting lines are embedded by the connected molding base, the connecting position of the first part surface and the second part surface is located on the inner side of the connecting lines, and the connecting position of the third part surface and the fourth part surface is located on the inner side of the connecting lines.
32. A photosensitive assembly, comprising:
a circuit board;
a photosensitive element, said photosensitive element being operatively connected to said circuit board; and
a molding base integrally bonded to the circuit board and the photosensitive element and forming an optical window, wherein the molding base has one or more first portion inner surfaces adjacent to the photosensitive element and one or more second portion inner surfaces remote from the photosensitive element and connected to the first portion inner surfaces, wherein the first portion inner surfaces and an optical axis of the photosensitive assembly have an included angle α therebetween, and the second portion inner surfaces and the optical axis of the photosensitive assembly have an included angle β therebetween, where β < α;
wherein the circuit board and the photosensitive element are connected by a series of connecting lines embedded by the molding base, and a position where the inner surface of the first portion and the inner surface of the second portion are connected is located inside the connecting lines on the side.
33. The photosensitive assembly of claim 32 wherein α ranges from 3 ° to 80 ° and β ranges from 0 ° to 20 °.
34. A photosensitive assembly according to claim 32 wherein the mold base includes a photosensitive element engaging portion located around the light window, the photosensitive element engaging portion defining the first portion interior surface from an interior surface of the photosensitive element integrally extending, and a top side extension integrally extending from the photosensitive element engaging portion and defining the second portion interior surface with a surface thereof integrally extending from the first portion interior surface.
35. The photosensitive assembly of claim 33 wherein α has a value ranging from 3 ° to 80 ° and β has a value ranging from 0 ° to 20 °.
36. The photosensitive assembly of claim 34 wherein β has a value of 0 °, and accordingly the photosensitive element engaging portion is a vertical extension.
37. The photosensitive assembly of claim 34 wherein said top extension has a thickness in the range of 0.02 mm to 0.6 mm and said photosensitive element engaging portion has a thickness in the range of 0.05 mm to 0.7 mm.
38. The photosensitive assembly of any one of claims 34 to 37, wherein the mold base further comprises a circuit board bonding portion integrally extending from the circuit board bonding portion and located between the top side extension portion and the circuit board bonding portion, the circuit board bonding portion integrally bonded to the circuit board and located around the photosensitive element.
39. A photosensitive assembly according to any one of claims 34 to 37 further including a filter element, the filter element being attached to the top side of the moulded base.
40. The photosensitive assembly of claim 39, wherein the filter element includes a filter element body and at least one light blocking layer disposed on at least one of a top side and a bottom side of the filter element body.
41. A photosensitive assembly according to any one of claims 32 to 37 further comprising a filter element and a filter element holder, the filter element being assembled to the filter element holder, wherein the filter element holder is attached to the top side of the moulding base.
42. The photosensitive assembly of claim 41, wherein the filter element includes a filter element body and at least one light blocking layer disposed on at least one of a top side and a bottom side of the filter element body.
43. The photosensitive assembly of claim 41 wherein said filter element holder has a top side mounting slot, said filter element being assembled in said top side mounting slot of said filter element holder; or the filter element support is provided with a bottom side mounting groove, and the filter element is assembled in the bottom side mounting groove of the filter element support.
44. The photosensitive assembly of any one of claims 32 to 37, wherein a distance between a position where the first portion inner surface and the second portion inner surface are integrally connected and the optical axis of the photosensitive assembly is smaller than a distance between an outer edge of the photosensitive element and the optical axis of the photosensitive assembly.
45. The photosensitive assembly of any one of claims 32 to 37, wherein the circuit board further includes a plurality of electronic components located on at least one of a top side and a bottom side of the circuit board.
46. The photosensitive assembly of any one of claims 32 to 37, wherein said circuit board further includes a plurality of electronic components on a bottom side thereof, said photosensitive assembly including a bottom side molding on said circuit board bottom side embedding said electronic components.
47. The photosensitive assembly of any one of claims 32 to 37, wherein the direction of the wire bond connection between the circuit board and the photosensitive element is from the circuit board to the photosensitive element; or the routing connection direction between the circuit board and the photosensitive element is from the photosensitive element to the circuit board.
48. A camera module comprising a lens and a photosensitive assembly according to any one of claims 32 to 47.
49. An electronic device comprising a device body and one or more camera modules according to any one of claims 25 to 29 and 48 mounted to the device body, wherein the electronic device is selected from one of a mobile phone, a computer, a television, a smart wearable device, a vehicle, a camera, and a monitoring device.
50. A forming mold for manufacturing at least one photosensitive assembly applied to a camera module, wherein the photosensitive assembly comprises a circuit board, a photosensitive element and a molding base, the molding base is integrally formed on the circuit board and the photosensitive element and forms an optical window, the forming mold comprises a first mold and a second mold which are suitable for being separated and closed, at least one optical window forming part and a base forming guide groove which is formed around the optical window forming part are arranged in the forming mold, the circuit board connected with the photosensitive element is placed in the base forming guide groove and forms the molding base after being solidified when the first mold and the second mold are closed, and the optical window is formed corresponding to the position of the optical window forming part, wherein the optical window forming part is provided with at least one first part of outer surface and at least one second part of outer surface from the bottom side to the top side Included angles alpha and beta are respectively formed between the photosensitive element and an optical axis vertical to the photosensitive element, and alpha is larger than beta; wherein the circuit board and the corresponding photosensitive element are connected by a series of connecting wires embedded by the molding base, and the connecting position of the first part outer surface and the second part outer surface is located inside the connecting wires.
51. The molding die of claim 50, wherein α has a value ranging from 3 ° to 80 °, and β has a value ranging from 0 ° to 20 °.
52. The molding die of claim 51, said light window molding having a bottom molding and a top molding extending integrally, an inner surface of said bottom molding defining said first portion inner surface, and an inner surface of said top molding defining said second portion inner surface.
53. The molding die of claim 52, wherein the bottom-side molding portion has a thickness in a range of 0.05 millimeters to 0.7 millimeters.
54. The molding die of any one of claims 50 to 53, wherein a plurality of said base molding guide grooves are integrally communicated, and a plurality of said light window molding portions are provided in said molding die for plate-wise making the photosensitive member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111364368.2A CN113823653B (en) | 2017-09-28 | 2018-09-19 | Photosensitive assembly and camera module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2017108959104 | 2017-09-28 | ||
| CN201710895910.4A CN109585464B (en) | 2017-09-28 | 2017-09-28 | Image pickup module, photosensitive assembly thereof and manufacturing method |
| PCT/CN2018/106351 WO2019062609A1 (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof |
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| CN202111364368.2A Division CN113823653B (en) | 2017-09-28 | 2018-09-19 | Photosensitive assembly and camera module |
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| CN111133742A CN111133742A (en) | 2020-05-08 |
| CN111133742B true CN111133742B (en) | 2021-10-19 |
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| CN202111364368.2A Active CN113823653B (en) | 2017-09-28 | 2018-09-19 | Photosensitive assembly and camera module |
| CN201880056738.6A Active CN111133742B (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive assembly splicing plate, forming mold and manufacturing method thereof |
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| CN202111364368.2A Active CN113823653B (en) | 2017-09-28 | 2018-09-19 | Photosensitive assembly and camera module |
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| CN109585464B (en) * | 2017-09-28 | 2024-10-15 | 宁波舜宇光电信息有限公司 | Image pickup module, photosensitive assembly thereof and manufacturing method |
| CN110412540B (en) * | 2019-07-30 | 2022-05-13 | Oppo广东移动通信有限公司 | Light emitting module, time-of-flight camera and electronic device |
| TWI747017B (en) * | 2019-07-31 | 2021-11-21 | 廣州立景創新科技有限公司 | Camera device |
| CN110646875A (en) * | 2019-09-26 | 2020-01-03 | 东莞市微科光电科技有限公司 | Optical filter manufacturing method |
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| CN205961279U (en) * | 2016-08-01 | 2017-02-15 | 宁波舜宇光电信息有限公司 | Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof |
| CN206302476U (en) * | 2016-08-01 | 2017-07-04 | 宁波舜宇光电信息有限公司 | Camera module and its molded circuit board component and mould and electronic equipment |
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| JP2008219854A (en) * | 2007-02-05 | 2008-09-18 | Matsushita Electric Ind Co Ltd | Optical device, optical device wafer, method for manufacturing them, and camera module and endoscope module equipped with optical device |
| JP5930263B2 (en) * | 2011-02-18 | 2016-06-08 | ソニー株式会社 | Solid-state imaging device |
| JP6303287B2 (en) * | 2013-04-30 | 2018-04-04 | 株式会社ニコン | Imaging unit and imaging apparatus |
| JP2015099262A (en) * | 2013-11-19 | 2015-05-28 | ソニー株式会社 | Solid state image sensor, camera module and an electronic apparatus |
| US9258467B2 (en) * | 2013-11-19 | 2016-02-09 | Stmicroelectronics Pte Ltd. | Camera module |
| WO2016180378A2 (en) * | 2015-05-14 | 2016-11-17 | 宁波舜宇光电信息有限公司 | Image capturing module and assembly method therefor |
| US9955055B2 (en) * | 2016-02-18 | 2018-04-24 | Ningbo Sunny Opotech Co., Ltd. | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device |
| CN105681637B (en) * | 2016-03-15 | 2019-12-31 | 宁波舜宇光电信息有限公司 | Array camera module and photosensitive assembly and manufacturing method thereof |
| CN206210795U (en) * | 2016-08-12 | 2017-05-31 | 宁波舜宇光电信息有限公司 | Camera module and its molding photosensory assembly and electronic equipment |
| CN206060924U (en) * | 2016-04-19 | 2017-03-29 | 深圳市成像通科技有限公司 | A kind of anti-astigmatism camera module |
| CN207765446U (en) * | 2017-09-28 | 2018-08-24 | 宁波舜宇光电信息有限公司 | Camera module and its photosensory assembly and electronic equipment |
| CN109585464B (en) * | 2017-09-28 | 2024-10-15 | 宁波舜宇光电信息有限公司 | Image pickup module, photosensitive assembly thereof and manufacturing method |
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| CN205961279U (en) * | 2016-08-01 | 2017-02-15 | 宁波舜宇光电信息有限公司 | Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof |
| CN206302476U (en) * | 2016-08-01 | 2017-07-04 | 宁波舜宇光电信息有限公司 | Camera module and its molded circuit board component and mould and electronic equipment |
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| CN113823653A (en) | 2021-12-21 |
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