CN109585464A - Camera module and its photosensory assembly and manufacturing method - Google Patents
Camera module and its photosensory assembly and manufacturing method Download PDFInfo
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- CN109585464A CN109585464A CN201710895910.4A CN201710895910A CN109585464A CN 109585464 A CN109585464 A CN 109585464A CN 201710895910 A CN201710895910 A CN 201710895910A CN 109585464 A CN109585464 A CN 109585464A
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- photosensitive element
- circuit board
- molded base
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- photosensory assembly
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
One camera module and its photosensory assembly and manufacturing method, the photosensory assembly include: circuit board, photosensitive element and molded base, and wherein molded base is integrally formed in circuit board and photosensitive element and forms optical window；Wherein corresponding to molded base has adjacent to the first end side of flexible region towards the first side surface of optical window, first side surface includes the first part surface of neighbouring photosensitive element setting and the second part surface that is connected with first part surface, and the first angle of optical axis of the first part surface relative to camera module is greater than second angle of the second part surface relative to optical axis；Have far from the second opposite end side of flexible region towards the second side surface of optical window corresponding to molded base, second side surface includes the neighbouring photosensitive element Part III surface being arranged and the Part IV surface being connected with Part III surface, and the Part III surface is greater than fourth angle of the Part IV surface relative to optical axis relative to the third angle of optical axis.
Description
Technical field
The present invention relates to camera module fields, further, are related to photosensory assembly and its manufacturer of moulding technology production
Method and camera module with the photosensory assembly.
Background technique
The molded packages technology of camera module is the emerging a kind of encapsulation skill to grow up on the basis of traditional COB encapsulation
Art.It is the wiring board using the encapsulation of existing integral packaging technology as shown in Figure 1A to Fig. 1 C.In this configuration, by an encapsulation
Portion 1 is packaged in a wiring board 2 and a sensitive chip 3 by way of integral packaging, to form integral packaging component, and seals
Dress portion 1 coats the multiple electronic components 201 and the electrical connection sensitive chip 3 and the wiring board 2 of the wiring board 2
A series of leads 202, enable the length and width dimensions of camera module and thickness to reduce, and assembling tolerance is reduced, one
Camera lens or lens assembly above package assembling can be entirely mounted, and solve the dust shadow adhered on electronic component
The problem of ringing the image quality of camera module.
More specifically, as shown in Figures 1 A and 1 B 1, in order to improve the production efficiency, by the way of generally being produced using jigsaw come
The integral packaging component is produced, i.e., disposably produces multiple integral packaging components.More specifically, Figure 1A and 1B are shown
By molding die carry out jigsaw produce the integral packaging component in the way of.Wherein the molding die includes a upper mold 101
With a lower die 102, one of wiring board jigsaw is placed into the lower die 102 of molding die, and the wiring board jigsaw includes more
Column circuits plate, each column wiring board include multiple wiring boards 2, and each wiring board 2 can place of working be connected with sensitive chip 3.On
Mould 101 and the molding of lower die 102 form a forming cavity, so that upper mold 101 is pressed together on the wiring board jigsaw, correspond to every alignment
Two end sides of the sensitive chip 3 on the plate of road, the upper mold is interior to form two runners 103 and 104, and upper mold 101 has
Multiple convex blocks 105 form an intermediate flow channel 106 between the convex block 105 of adjacent two, and intermediate flow channels 106 multiple in this way are prolonged
It is stretched outside between two runners 103 and 104.
In moulding technology, the encapsulating material 4 of flow-like is filled extremely along two flow forwards of runner 103 and 104
Intermediate flow channel 106 between two neighboring convex block 105, the region between the sensitive chip 3 two neighboring so are also filled
The encapsulating material 4, thus the encapsulating material 4 after hardening can be in corresponding each wiring board 2 and each institute
It states and forms the encapsulation part 1 on sensitive chip 3, and formed in the position of each convex block 105 of correspondence and be located at the encapsulation
Optical window among portion 1, and these encapsulation parts 1 are integrally formed and form conjoined structure, as is shown in fig. 1C.
With reference to shown in Fig. 1 E, the heat cured encapsulating material 4 has a curing time T in moulding technology, with
The passage of time, viscosity are first decreased to minimum point, then gradually rise up to highest point again and be fully cured.Ideal situation
It is that when the encapsulating material 4 is in viscosity smaller value, the runner 103,104 and 106 is full of by the encapsulating material 4, and
In the encapsulating material 4 in the larger still flow forward of viscosity, between the wiring board 2 and the sensitive chip 3
The lead 202 rub it is larger, so that the deformation and damage of the lead 202 can be easy to cause.
In above-mentioned moulding technology, the encapsulating material 4 is thermosetting material, and two 103 Hes of runner are entered after fusing
104, and solidify under heating condition effect.However find in actual production, encapsulating material 4 is along two in moulding technology
When a runner 103 and 104 flow forward, if the width of two runners 103 and 104 is smaller, problem may cause.
More specifically, because the encapsulating material 4 is the fluid with predetermined viscosity, the size of two runners 103 and 104
All relatively small and such as runner 103 is relatively narrow runner, and the flow in runner 103 is relatively small, and runner 103 is interior
Influence of the wall to the friction of the generation of the encapsulating material 4 of the flow-like in it to its flow velocity is relatively large, so in runner 103
The encapsulating material 4 flow velocity it is relatively slow.In this way, in the curing time T of the encapsulating material 4, in the runner 103
The encapsulating material 4 its end may cannot be flow to from its feed end in the curing time T, so as to cause runner 103
Local location cannot be full of, region S as shown in Figure 1 D, so that cannot be formed between upper mold 101 and lower die 102 has
A series of conjoined structure of the encapsulation part 1 of overall shapes, the position of corresponding region S, the encapsulation part 1 form notch,
To which the optical window of all round closure cannot be formed.Also, if the narrower width of runner 104, such as scheming may also occur in runner 104
Situation shown in 1D.
In addition, if the 4 flow forward speed of the encapsulating material in such as runner 103 is excessively slow, and cause viscosity larger
When, the flow forward still in runner 103 then causes the frictional force to the lead 202 flowed through larger, to make described draw
Line 202 deflects to larger degree of convergence forward, so that the lead 202 is easy to cause to deform and damage, and is easy to take off from pad
It falls.
It as shown in fig. 1F, is the camera module encapsulated using existing integral packaging technology comprising an encapsulation part 1, a line
Road plate 2, a sensitive chip 3, an optical filter 5, a lens assembly 6.In this configuration, which passes through integral packaging
Mode is packaged in the wiring board 2 and the sensitive chip 3, to form integral packaging component, and the encapsulation part 1 coats the route
A series of electronic components 201 of plate 2 and a series of leads 202 for being electrically connected the sensitive chip 3 He the wiring board 2, so that
Camera module length and width dimensions and thickness can reduce, and assembling tolerance is reduced, the camera lens above integral packaging component
Component 6 can be entirely mounted, and solve the dust adhered on the electronic component 201 influence camera module at image quality
The problem of amount.
In addition, for convenience of demoulding, the inner surface for the encapsulation part 1 being usually formed integrally is tilted from the sensitive chip 3
Ground extends, and the area that will lead to the top surface of the encapsulation part 1 in this way reduces, and 1 top side of encapsulation part needs to be used to install this and take the photograph
As components such as example above-mentioned lens assembly 6 of the top optical device of mould group or additional microscope bases.However, the encapsulation part 1 is smaller
The top surface of area may not be able to provide enough mounting surfaces to the top optical device of the camera module, make these top optics
Device can not be firmly installed and mounting surface is made to be easy to happen excessive glue.
The manufacturing process of integral component as shown in Figure 1B, the circuit board 201 for being connected with the sensitive chip 3 are placed in one
In mold, a convex block 105 is pressed on the sensitive chip 3 as pressure head, and the substantial shape of runner 103,104 and 106 in mold
At the slot 107 for surrounding the convex block 105, it is populated into the slot 107 in an encapsulating material 4 of fluid state, after cured
The encapsulation part 1 is formed, the position of corresponding convex block 105 forms a through-hole of the encapsulation part 1.The convex block 105 is inclined outer with one
Surface 1051, to form the inner surface of the encapsulation part 1 integrally extended.
However in integral packaging technique, the encapsulating material of flow-like may enter the sensitive chip 3 and the convex block
Between 105 bottom surface, the photosensitive region of the sensitive chip 3 is reached so as to cause the encapsulating material, is formed " overlap ", thus shadow
Ring the photosensitive effect of the sensitive chip 3.And between the sensitive chip 3 and the inclined outer surface 1051 of the convex block 105
107 bottom side of slot is formed with a filling slot 1071, and in the integral packaging technique, which enters the filling slot 1071,
And the inclined outer surface 1051 of the convex block 105 of inclination extension is intended to guide the encapsulating material into the filling slot
1071, cause the filling slot 1071 that there is biggish volume, and the encapsulating material of flow-like generates biggish pressure and pressure
By force, to increase the encapsulating material into the probability between the sensitive chip 3 and the bottom surface of the convex block 105, the in this way envelope
Package material is easy to generate pollution to the photosensitive region of the sensitive chip 3, and influences the photosensitive property of the sensitive chip 3.Moreover, such as
Fruit increases the pressure that the convex block 105 is pressed together on the sensitive chip 3, then may cause this again to reduce the generation of " overlap "
The damage of sensitive chip 3.
Summary of the invention
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein photosensitive one
In the manufacturing method of one jigsaw of component, in moulding technology moulding material can full of a molding tool in a pedestal jigsaw at
Type guide groove avoids the generation of photosensory assembly defective products.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein in molding work
In skill, the moulding material can form a disjunctor molded base, and the disjunctor molded base on a multiple-printed-panel for circuit board
An optical window of all round closure can be formed in the position of each photosensitive element of correspondence, thus in the photosensory assembly for the disjunctor that will be formed
After jigsaw cutting, the molded base with the optical window is formed on each circuit board and the corresponding photosensitive element, is prevented
The molded base being partially formed the outside for being open and be connected to the optical window molded base.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the pedestal
Jigsaw profiled guide slot on a column circuits plate for forming the disjunctor molded base, two diversion trenches with two sides, with
And the multiple filling slots being laterally extended between two diversion trenches, the moulding material is in the diversion trench and the filling
It flows and solidifies in slot, the sidewall design of two of them diversion trench is so that the volume of diversion trench increases, to make the molding
Material can be from the feed end flow forwards of two diversion trenches and the institute full of the entire pedestal jigsaw profiled guide slot
State diversion trench and the filling slot.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the pedestal
Jigsaw profiled guide slot is used to form the disjunctor molded base on the adjacent circuit board of rigid region two column joined integrally,
Two the first diversion trenches with two sides, the second intermediate diversion trench, and it is located at two the first diversion trenches and described
Multiple filling slots between two diversion trenches, the moulding material flow and solidify in the diversion trench and the filling slot,
In two first diversion trenches and the second diversion trench sidewall design be so that the volume of diversion trench increases, to make described
Moulding material can be from the feed end flow forwards of two diversion trenches and full of the entire pedestal jigsaw profiled guide slot
The diversion trench and the filling slot.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein leading described
The size of chute it is smaller be used to formed miniaturization the photosensory assembly when, by be arranged diversion trench sidewall shape be designed as
So that the volume of diversion trench increases, so that the diversion trench of small size such as above-mentioned first diversion trench bottom end width is less than 1 millimeter
When, the entire pedestal jigsaw profiled guide slot is filled up still in moulding technology.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein in the mould
Before the viscosity of moulding material reaches high value and solidifies, the moulding material can fill out the pedestal jigsaw profiled guide slot
It is full, to prevent the connecting line between the circuit board and the photosensitive element by the higher moulding material of the viscosity of flow forward
Damage.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the water conservancy diversion
The sidewall design of slot is to enable the moulding material described in moulding technology from each described so that the volume of diversion trench increases
The feed end of diversion trench reaches its end, prevents the moulding material in a certain diversion trench from flowing to another diversion trench and hindering this
Moulding material flow forward described in another diversion trench.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the molding
Technique can disposably form the disjunctor molding base on the column circuits plate and a column photosensitive element with multiple circuit boards
Seat, to make to form the multiple photosensory assemblies of a column by board-splicing process, the photosensory assembly as described in preferred 2-12.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein described photosensitive
Component includes the molded base for being integrally molded in a photosensitive element and a circuit board, wherein forming institute in integrated moulding technology
During stating molded base, the moulding material that molding forms the molded base is not easily accessed the photosensitive element and one
" overlap " is formed between the bottom surface of one optical window forming part of molding die, to reduce a photosensitive area of the photosensitive element
Contaminated possibility.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein passing through reduction
The volume of a filling slot between the photosensitive element and the outer surface of the optical window forming part reduces and enters the filling slot
The pressure and pressure that the moulding material generates, thus reduce the moulding material into the photosensitive element and the optical window at
A possibility that forming " overlap " between the bottom surface in type portion.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the optical window
The outer surface that there are different directions to extend for the outer surface of forming part, between the outer surface of top side and the optical axis of the photosensory assembly
Angle be less than bottom side outer surface and optical axis between angle, to reduce the bottom side outer surface of the optical window forming part
The volume of the filling slot formed between the photosensitive element, thus a possibility that reducing the generation of " overlap ".
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the optical window
The outer surface of top side described in forming part is extended with the direction of angle smaller between optical axis, to slow down entrance to a certain extent
The flow velocity of the moulding material of the filling slot reduces the pressure that the moulding material enters the filling slot and generates, from
And a possibility that reducing the generation of " overlap ".
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein because one
Moulding material described in body moulding technology is not easily formed " overlap ", so that the optical window forming part is not needed with biggish pressure
It is pressed on the photosensitive element, so that the photosensitive element be avoided to be subject to crushing.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the molding
Two angles are formed between the optical window forming part outer surface of mold and optical axis, wherein bottom side outer surface has an inclination angle
Degree, and it is 0.05 millimeter or more that the bottom side outer surface for tilting extension, which has height, to prevent from being covered on the optical window forming part
On elastic overlay film be not easy to be punctured in molding procedure.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the molding
Pedestal has multiple inner surfaces for integrally extending, and between the inner surface and optical axis of its top side relative to bottom side inner surface and
There is lesser angle between optical axis, extend with making the molded base inner surface turnover, the inner surface of bottom side and the sense
The moulding material with a smaller size between optical element, so that the moulding material is not easy the shape on the photosensitive element
At " overlap ".
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the molding
Pedestal includes the photosensitive element engaging portion integrally extended and a top side extension, and inner surface has different extension angle,
Wherein there is smaller angle, to increase the face of the top surface of the top side extension between the top side extension and optical axis
Product, thus for above the camera module camera lens or filter element bracket or lens assembly greater area of mounting surface is provided,
For being firmly installed the camera lens, the filter element bracket or the lens assembly.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the molding
The inner surface of the photosensitive element engaging portion of pedestal obliquely extends to facilitate stripping operation in moulding technology and be reduced to
Up to the stray light of the photosensitive element, and the inner surface of the top side extension is from the inner surface one of the photosensitive element engaging portion
Extend with transferring to body to which the photosensitive element engaging portion and the top side extension match, in the feelings for reducing stray light
Increase the area of the top surface of the molded base under condition as far as possible.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the top side
The inner surface of extension integrally transfers ground from photosensitive element engaging portion extension, to avoid a molding in moulding technology
One optical window forming part of tool is pressed on the connecting line that the photosensitive element is connected with the circuit board, causes the connecting line
Damage.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the top side
There is smaller angle, so as to reduce the area of the filter element between extension and optical axis.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the camera shooting
One filter element main body of one filter element of the photosensory assembly of mould group is provided with a light shield layer, to make the optical filtering
The middle section of element body forms an effective transmission region, to reduce the stray light reached inside a molded base.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein in some realities
It applies in example, the bottom side of the filter element main body is arranged in the light shield layer, is incident in the top side extension with reducing
The light on surface, to prevent the inner surface for being incident to the top side extension from being reached the photosensitive element by reflection and being formed
Stray light and the image quality for influencing the camera module.
To reach the above at least goal of the invention, the present invention provides the manufacturing method of the photosensory assembly of a camera module,
Include the following steps:
(a) one second mold that a multiple-printed-panel for circuit board has in a molding is fixed, wherein the multiple-printed-panel for circuit board includes one
Column or multiple row circuit board, each column circuit board include one or more circuit boards being arranged side by side, and each circuit board includes phase
In conjunction with a rigid region and a flexible region, and each circuit board can place of working be connected with a photosensitive element；
(b) second mold and one first mold are molded, fills the moulding material of fusing in the molding die
In one pedestal jigsaw profiled guide slot, wherein the position for corresponding to an at least optical window forming part is prevented from filling the moulding material；
And
(c) solidify the moulding material in the pedestal jigsaw profiled guide slot to correspond to the pedestal jigsaw at
The position of type guide groove forms disjunctor molded base, wherein the disjunctor molded base is shaped in the one or more columns per page corresponded to
Photosensitive element described in the circuit board and one or more columns per page is to form photosensory assembly jigsaw and correspond to the optical window forming part
Position be formed as each photosensitive element the optical window of passage of light be provided, wherein the pedestal jigsaw profiled guide slot has pair
Disjunctor molded base described in Ying Yu is adjacent to the first diversion trench of the first end side of the flexible region and corresponding to the disjunctor mould
Mould second diversion trench of the pedestal far from the flexible region, and extend in first diversion trench and second diversion trench it
Between multiple filling slots, wherein first diversion trench has towards the first side surface of the optical window, second diversion trench
With towards the second side surface of the optical window, wherein first side surface includes the first of neighbouring photosensitive element setting
Part of the surface and the second part surface being connected with first part surface, second side surface have the neighbouring photosensitive member
The Part III surface of part setting and the Part IV surface being connected with Part III surface, wherein the first part surface
The first angle of optical axis relative to camera module is greater than second angle of the second part surface relative to the optical axis, and
The Part III surface is greater than the Part IV surface relative to the optical axis relative to the third angle of the optical axis
Fourth angle.
The photosensory assembly jigsaw is for manufacturing multiple photosensory assemblies, wherein the method also includes steps: also wrapping
It includes step: cutting the photosensory assembly jigsaw to obtain multiple photosensory assemblies, wherein each photosensory assembly includes the electricity
Road plate, the photosensitive element and the molded base, wherein the molded base is integrally formed in the circuit board and described
Photosensitive element and the optical window that the photosensitive element offer passage of light is provided.
According to a further aspect of the invention, the present invention provides the photosensory assembly of a camera module comprising:
One circuit board comprising the rigid region and a flexible region combined；
One photosensitive element；And
One molded base in the circuit board and the photosensitive element and is formed wherein the molded base is integrally formed
An optical window of passage of light is provided for the photosensitive element；Wherein correspond to the molded base adjacent to the of the flexible region
One end has towards the first side surface of optical window, and first side surface includes first of neighbouring photosensitive element setting
Point surface and the second part surface being connected with first part surface, and the first part surface is relative to the camera shooting mould
The first angle of the optical axis of group is greater than second angle of the second part surface relative to the optical axis；Corresponding to the molding
Pedestal has far from the second opposite end side of the flexible region towards the second side surface of optical window, the second side surface packet
The Part IV surface for including the Part III surface of neighbouring photosensitive element setting and being connected with Part III surface, and institute
It states Part III surface and is greater than the of the Part IV surface relative to the optical axis relative to the third angle of the optical axis
Four angles.
According to a further aspect of the invention, the present invention also provides the photosensory assembly jigsaw of a camera module comprising:
One or more columns per page circuit board, each column circuit board include one or more circuit boards being arranged side by side, each electricity
Road plate includes the rigid region and flexible region combined；
One or more columns per page photosensitive element；And
One or more disjunctor molded bases, each disjunctor molded base are integrally formed in the column circuit board
It arranges the photosensitive element with one and is formed as each photosensitive element and the optical window of passage of light is provided；Wherein correspond to the company
Body molded base has adjacent to the first end side of the flexible region towards the first side surface of optical window, the first side surface packet
The second part surface for including the first part surface of neighbouring photosensitive element setting and being connected with first part surface, and institute
It states first part surface and is greater than the second part surface relative to institute relative to the first angle of the optical axis of the camera module
State the second angle of optical axis；There is court far from the second opposite end side of the flexible region corresponding to the disjunctor molded base
To the second side surface of optical window, second side surface includes the Part III surface of neighbouring photosensitive element setting and with the
The Part IV surface that three parts surface is connected, and the Part III surface is greater than relative to the third angle of the optical axis
Fourth angle of the Part IV surface relative to the optical axis.
According to a further aspect of the invention, the present invention also provides the photosensory assembly jigsaw of a camera module comprising:
Multiple row circuit board, each column circuit board include one or more circuit boards being arranged side by side, each circuit board packet
Include the rigid region and a flexible region combined；
Multiple row photosensitive element；And
One or more disjunctor molded bases, each disjunctor molded base are integrally formed in adjacent described of two column
Circuit board and two arranges the adjacent photosensitive element and is formed as an optical window of each photosensitive element offer passage of light, and
And the adjacent circuit board layout of two column at its flexible region away from each other and its rigid region is mutually adjacently, make each
The disjunctor molded base has two end sides of the neighbouring flexible region；It is neighbouring wherein to correspond to the disjunctor molded base
First end side of the flexible region has towards the first side surface of optical window, and first side surface includes neighbouring described photosensitive
The first part surface of element setting and the second part surface being connected with first part surface, and the first part surface
The first angle of optical axis relative to the camera module is greater than second jiao of the second part surface relative to the optical axis
Degree；The second end side that the disjunctor molded base extends between the adjacent photosensitive element of two column has direction
Second side surface of optical window, second side surface include Part III surface and and the third of neighbouring photosensitive element setting
The Part IV surface that part of the surface is connected, and the Part III surface is greater than institute relative to the third angle of the optical axis
State fourth angle of the Part IV surface relative to the optical axis.
According to a further aspect of the invention, the present invention also provides camera modules comprising:
One camera lens；
One circuit board comprising the rigid region and a flexible region combined；
One photosensitive element；And
One molded base in the circuit board and the photosensitive element and is formed wherein the molded base is integrally formed
An optical window of passage of light is provided for the photosensitive element, wherein the camera lens is located at the photosensitive path of the photosensitive element；Its
In correspond to the molded base and have adjacent to the first end side of the flexible region towards the first side surface of optical window, described the
One side surface includes the first part surface of neighbouring photosensitive element setting and be connected with first part surface second
Divide surface, and the first part surface is greater than the second part surface relative to institute relative to the first angle of the optical axis
State the second angle of optical axis；Have far from the second opposite end side of the flexible region towards light corresponding to the molded base
Second side surface of window, second side surface include neighbouring photosensitive element setting Part III surface and with third portion
The Part IV surface that point surface is connected, and the Part III surface be greater than relative to the third angle of the optical axis it is described
Fourth angle of the Part IV surface relative to the optical axis.
According to a further aspect of the invention, the present invention also provides a molding tools, are applied to camera module to make
Photosensory assembly jigsaw comprising suitable for mutually separate with mutually closely sealed one first mold and one second mold, wherein first He
Second mold forms a forming cavity when mutually closely sealed, and the molding die is configured with an at least optical window in the forming cavity
Forming part and formation, which are located in the pedestal jigsaw profiled guide slot around the optical window forming part and the forming cavity, to be suitable for admittedly
A fixed multiple-printed-panel for circuit board, wherein the multiple-printed-panel for circuit board includes one or more columns per page circuit board, and each column circuit board includes one or more
The circuit board being arranged side by side, each circuit board include the rigid region and a flexible region combined, and each electricity
Road plate can place of working be connected with a photosensitive element, the pedestal jigsaw profiled guide slot is suitable for filling the moulding material in correspondence
Disjunctor molded base is formed in the position of the pedestal jigsaw profiled guide slot, wherein the disjunctor molded base is shaped in correspondence
In each column circuit board and each column photosensitive element with formed the photosensory assembly jigsaw and correspond to the optical window forming part
Position be formed as each photosensitive element the optical window of passage of light be provided, corresponded to wherein the pedestal jigsaw profiled guide slot has
It is remote with the disjunctor molded base is corresponded in first diversion trench of the disjunctor molded base adjacent to the first end side of the flexible region
The second diversion trench from the flexible region, and extend between first diversion trench and second diversion trench multiple are filled out
Slot is filled, wherein each optical window forming part is between two adjacent filling slots, wherein first diversion trench has
There is the first side surface towards the optical window, second diversion trench has towards the second side surface of the optical window, wherein institute
The for stating first part surface that the first side surface includes neighbouring photosensitive element setting and being connected with first part surface
Two part of the surfaces, second side surface have neighbouring photosensitive element setting Part III surface and with Part III table
The Part IV surface that face is connected, wherein the first part surface is greater than described the relative to the first angle of the optical axis
Second angle of two part of the surfaces relative to the optical axis, and third angle of the Part III surface relative to the optical axis
Fourth angle greater than the Part IV surface relative to the optical axis.
According to a further aspect of the invention, the present invention also provides a molding tools, are applied to camera module to make
Photosensory assembly jigsaw comprising suitable for mutually separate with mutually closely sealed one first mold and one second mold, wherein first He
Second mold forms a forming cavity when mutually closely sealed, and the molding die is configured with optical window forming part in the forming cavity
And it is formed and is suitable for fixing a circuit in the pedestal jigsaw profiled guide slot being located at around the optical window forming part and the forming cavity
Plate jigsaw, wherein the multiple-printed-panel for circuit board includes multiple row circuit board, and each column circuit board includes one or more circuits being arranged side by side
Plate, each circuit board be include the rigid region and a flexible region combined, and each circuit board can place of working
It is connected with a photosensitive element, wherein the pedestal jigsaw profiled guide slot is suitable for filling moulding material to correspond to the pedestal
The position of jigsaw profiled guide slot forms disjunctor molded base, and wherein the disjunctor molded base is shaped in adjacent two and arranges the electricity
Road plate and adjacent two arranges the photosensitive element to form the photosensory assembly jigsaw and in the position for corresponding to the optical window forming part
Be formed as each photosensitive element and the optical window of passage of light is provided, wherein the adjacent circuit board layout of two column is at its flex region
Domain away from each other and its rigid region is mutually adjacently, wherein the pedestal jigsaw profiled guide slot have correspond to the disjunctor mold base
Between two the first diversion trenches of two end sides of the neighbouring flexible region of seat and the photosensitive element adjacent corresponding to two column
Region the second diversion trench, and extend in multiple fillings between two first diversion trenches and second diversion trench
Slot, wherein each optical window forming part is between two adjacent filling slots, wherein first diversion trench has
Towards the first side surface of the optical window, second diversion trench has towards the second side surface of the optical window, wherein described
First side surface include the first part surface of neighbouring photosensitive element setting and be connected with first part surface second
Part of the surface, second side surface have neighbouring photosensitive element setting Part III surface and with Part III surface
The Part IV surface being connected, wherein the first part surface is greater than described second relative to the first angle of the optical axis
Second angle of the part of the surface relative to the optical axis, and the Part III surface is big relative to the third angle of the optical axis
In fourth angle of the Part IV surface relative to the optical axis.
The present invention also provides a photosensory assemblies comprising:
One circuit board；
One photosensitive element, the photosensitive element are operatively connected to the circuit board；With
One molded base, the molded base are integrally incorporated into the circuit board and the photosensitive element and form a light
Window, wherein the molded base has one or more first part's inner surfaces of the neighbouring photosensitive element and far from the sense
The one or more second part inner surfaces for being connected to first part's inner surface of optical element, wherein in the first part
There is angle α, the optical axis of the second part inner surface and the photosensory assembly between surface and the optical axis of the photosensory assembly
Between there is angle β, wherein β < α.
According to a further aspect of the invention, the present invention also provides a camera module, spy includes:
One camera lens；
One circuit board；
One photosensitive element, the photosensitive element are operatively connected to the circuit board, and the camera lens is located at described photosensitive
The photosensitive path of element；With
One molded base, the molded base are integrally incorporated into the circuit board and the photosensitive element and form light
Window, wherein the molded base has first part's inner surface of the neighbouring photosensitive element and the company far from the photosensitive element
It is connected to the second part inner surface of first part's inner surface, wherein first part's inner surface and the camera module
Optical axis between have angle α, between the second part inner surface and the optical axis of the camera module have angle β,
Middle β < α.
According to a further aspect of the invention, the present invention also provides a molding tools, are applied to camera module to make
An at least photosensory assembly, the photosensory assembly includes a circuit board, a photosensitive element and a molded base, wherein the molding base
Seat it is integrally formed in the circuit board and the photosensitive element and formed an optical window, wherein the molding die include be suitable for phase
Separate and mutually closely sealed the first mold and the second mold, and it is interior configured with an at least optical window forming part and formation positioned at the light
A pedestal profiled guide slot around window forming part, the circuit board for being connected with the photosensitive element are placed in the molding die
And when first and second mold is mutually closely sealed, the moulding material of a fusing is filled into the pedestal profiled guide slot and is passed through
Form the molded base after solidification, the position of the corresponding optical window forming part forms the optical window, wherein the optical window forming part from
Bottom side towards top side direction have an at least first part outer surface and an at least second part outer surface, respectively with perpendicular to
Angle α and β, and α > β are formed between the optical axis of the photosensitive element.
According to a further aspect of the invention, the present invention also provides an electronic equipments comprising above-mentioned one or more
The camera module.The electronic equipment includes but is not limited to mobile phone, computer, television set, can intelligently screw on equipment, traffic work
Tool, camera and monitoring device.
Detailed description of the invention
Figure 1A is that existing integral packaging technique encapsulates to obtain the structural schematic diagram of the molding die of photosensory assembly.
Figure 1B is the forming process schematic diagram that existing integral packaging technique forms integral packaging component.
Fig. 1 C be in the existing integral packaging technique of signal encapsulating material along the enlarged structure of two runner flow forwards
Schematic diagram.
Fig. 1 D is the enlarged structure schematic diagram of local underfill encapsulating material in the existing integral packaging technique of signal.
The variation tendency schematic diagram of Fig. 1 E moulding material viscosity within curing time.
The structural schematic diagram of camera module made of the photosensory assembly that Fig. 1 F illustrates existing integral packaging technique to encapsulate.
Fig. 2 is the manufacturing equipment of the photosensory assembly jigsaw of the camera module of first preferred embodiment according to the present invention
Block diagram representation.
Fig. 3 A is the manufacture of the photosensory assembly jigsaw of the camera module of above-mentioned first preferred embodiment according to the present invention
The structural schematic diagram of the molding die of equipment.
Fig. 3 B is the manufacture of the photosensory assembly jigsaw of the camera module of above-mentioned first preferred embodiment according to the present invention
The enlarged structure schematic diagram of the regional area A of first mold of the molding die of equipment.
Fig. 4 is that the structure of the photosensory assembly jigsaw of the camera module of above-mentioned first preferred embodiment according to the present invention is shown
It is intended to.
Fig. 5 A is the enlarged structure of the photosensory assembly of the camera module of above-mentioned first preferred embodiment according to the present invention
Schematic diagram.
Fig. 5 B is the attached view of amplification of the photosensory assembly of the camera module of above-mentioned first preferred embodiment according to the present invention
Structural schematic diagram.
Fig. 6 A is the C- along Fig. 5 of the photosensory assembly of the camera module of above-mentioned first preferred embodiment according to the present invention
The cross-sectional view of C line.
Fig. 6 B is the second end side of the photosensory assembly of the camera module of above-mentioned first preferred embodiment according to the present invention
Cross-sectional view after further being cut.
Fig. 7 A illustrates the molding of the photosensory assembly jigsaw of above-mentioned first preferred embodiment according to the present invention
Cross-sectional view when in mold by the moulding material propulsion pedestal jigsaw profiled guide slot of fusing, wherein the cross-sectional view corresponds to Fig. 4
The cross-sectional view in the line A-A direction of middle signal.
Fig. 7 B is the partial enlargement diagram in Fig. 7 A at B.
Fig. 8 illustrates the shaping mould of the photosensory assembly jigsaw of above-mentioned first preferred embodiment according to the present invention
In tool by the moulding material of fusing be full of pedestal jigsaw profiled guide slot when cross-sectional view, wherein the cross-sectional view corresponds in Fig. 4
The cross-sectional view in the line A-A direction of signal.
Fig. 9 illustrates the shaping mould of the photosensory assembly jigsaw of above-mentioned first preferred embodiment according to the present invention
In tool by the moulding material of fusing be full of pedestal jigsaw profiled guide slot when cross-sectional view, wherein the cross-sectional view corresponds in Fig. 4
The cross-sectional view in the line B-B direction of signal
Figure 10 illustrates the molding of the photosensory assembly jigsaw of above-mentioned first preferred embodiment according to the present invention
In mold execute demoulding step and formed disjunctor molded base correspond to Fig. 4 in line A-A direction cross-sectional view.
Figure 11 illustrates the schematic perspective view of the camera module of above-mentioned first preferred embodiment according to the present invention.
Figure 12 illustrates the decomposition texture schematic diagram of the camera module of above-mentioned first preferred embodiment according to the present invention.
Figure 13 A illustrates the line D-D along Figure 12 of the camera module of above-mentioned first preferred embodiment according to the present invention
Cross-sectional view.
Figure 13 B illustrates the E-E line along Figure 12 of the camera module of above-mentioned first preferred embodiment according to the present invention
Cross-sectional view.
Figure 14 illustrates one variant embodiment of camera module of above-mentioned first preferred embodiment according to the present invention
Cross-sectional view.
Figure 15 illustrates another variant embodiment of the camera module of above-mentioned first preferred embodiment according to the present invention
Camera module cross-sectional view.
Figure 16 illustrates another variant embodiment of the camera module of above-mentioned first preferred embodiment according to the present invention
Camera module cross-sectional view.
Figure 17 A is the manufacturing equipment of the photosensory assembly jigsaw of the camera module of second preferred embodiment according to the present invention
Molding die structural schematic diagram.
Figure 17 B is the manufacture of the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention
Enlarged structure schematic diagram at the Local C of first mold of the molding die of equipment.
Figure 18 is the structure of the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention
Schematic diagram.
Figure 19 A is at the D of the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention
Enlarged structure schematic diagram.
Figure 19 B is the adjacent of the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention
The attached view structural schematic diagram of the amplification of two photosensory assemblies.
Figure 20 A is the edge figure of the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention
The cross-sectional view of H-H line in 19A.
Figure 20 B is that the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention is cut
Obtain the structural schematic diagram of two photosensory assemblies.
Figure 21 A illustrates the molding of the photosensory assembly jigsaw of above-mentioned second preferred embodiment according to the present invention
Cross-sectional view when in mold by the moulding material propulsion pedestal jigsaw profiled guide slot of fusing, wherein the cross-sectional view corresponds to Figure 18
The cross-sectional view in the F-F line direction of middle signal.
Figure 21 B is the partial enlargement diagram in Figure 21 A at E.
Figure 22 illustrates the molding of the photosensory assembly jigsaw of above-mentioned second preferred embodiment according to the present invention
In mold by the moulding material of fusing be full of pedestal jigsaw profiled guide slot when cross-sectional view, wherein the cross-sectional view corresponds to Figure 18
The cross-sectional view in the F-F line direction of middle signal.
Figure 23 illustrates the molding of the photosensory assembly jigsaw of above-mentioned second preferred embodiment according to the present invention
In mold by the moulding material of fusing be full of pedestal jigsaw profiled guide slot when cross-sectional view, wherein the cross-sectional view corresponds to Figure 18
The cross-sectional view in the G-G line direction of middle signal.
Figure 24 illustrates the molding of the photosensory assembly jigsaw of above-mentioned second preferred embodiment according to the present invention
In mold execute demoulding step and formed disjunctor molded base correspond to Figure 18 in F-F line direction cross-sectional view.
Figure 25 A to 25C is to illustrate one of above-mentioned first and second preferred embodiment according to the present invention to become respectively
The enlarged structure schematic diagram for the photosensory assembly that the photosensory assembly jigsaw cross-sectional view of shape embodiment and cutting obtain.
Figure 26 A be illustrate above-mentioned second preferred embodiment according to the present invention another variant embodiment it is photosensitive
The structural schematic diagram of component jigsaw.
Figure 26 B is photosensitive group of another variant embodiment for illustrating above-mentioned second preferred embodiment according to the present invention
The enlarged structure schematic diagram of part.
Figure 27 is photosensitive group of another variant embodiment for illustrating above-mentioned second preferred embodiment according to the present invention
The cross-sectional view of part I-I line along Figure 26.
Figure 28 is the perspective exploded view of the camera module of third preferred embodiment according to the present invention.
Figure 29 A is the structural schematic diagram of the camera module of third preferred embodiment according to the present invention.
Figure 29 B is the enlarged structure schematic diagram in Figure 29 A at J.
Figure 30 is that the photosensory assembly bottom side of the camera module of above-mentioned third preferred embodiment according to the present invention is illustrated to paste
Light shield layer effectively reduces the schematic diagram for reflexing to the stray light of photosensitive element.
Figure 31 A will be melted in molding die in the moulding technology for illustrate above-mentioned third preferred embodiment according to the present invention
The moulding material of change promotes cross-sectional view when pedestal profiled guide slot.
Figure 31 B illustrate in above-mentioned third preferred embodiment according to the present invention by the moulding material of fusing full of pedestal at
Cross-sectional view when type guide groove.
Figure 31 C illustrates the execution demoulding step of above-mentioned third preferred embodiment according to the present invention and forms molded base
Cross-sectional view.
Figure 32 A is the photosensory assembly for illustrating a variant embodiment of above-mentioned third preferred embodiment according to the present invention
Two sides patch light shield layer is to effectively reduce the schematic diagram of stray light.
Figure 32 B illustrates the camera shooting mould of another variant embodiment of above-mentioned third preferred embodiment according to the present invention
The cross-sectional view of group.
Figure 33 is the camera shooting mould for illustrating another variant embodiment of above-mentioned third preferred embodiment according to the present invention
The cross-sectional view of group.
Figure 34 illustrates the camera shooting mould of another variant embodiment of above-mentioned third preferred embodiment according to the present invention
The cross-sectional view of group.
Figure 35 is the perspective exploded view for illustrating the camera module of the 4th preferred embodiment according to the present invention.
Figure 36 A be above-mentioned 4th preferred embodiment according to the present invention camera module along Figure 35 K-K line direction
Cross-sectional view.
Figure 36 B is the enlarged diagram in Figure 36 A at L.
Figure 37 is that the photosensory assembly bottom side of the camera module of above-mentioned 4th preferred embodiment according to the present invention is illustrated to paste
Light shield layer effectively reduces the schematic diagram for reflexing to the stray light of photosensitive element.
Figure 38 is the camera module of a variant embodiment of above-mentioned 4th preferred embodiment according to the present invention
Cross-sectional view.
Figure 39 is the perspective exploded view of the camera module of the 5th preferred embodiment according to the present invention.
Figure 40 is the M-M line direction along Figure 39 of the camera module of above-mentioned 5th preferred embodiment according to the present invention
Cross-sectional view.
Figure 41 is that the photosensory assembly bottom side of the camera module of above-mentioned 5th preferred embodiment according to the present invention is illustrated to paste
Light shield layer effectively reduces the schematic diagram for reflexing to the stray light of photosensitive element.
Figure 42 is a variant embodiment camera module for illustrating above-mentioned 5th preferred embodiment according to the present invention
Cross-sectional view.
Figure 43 is that another variant embodiment of above-mentioned 5th preferred embodiment according to the present invention is illustrated to image mould
The cross-sectional view of group.
Figure 44 is the structural schematic diagram that above-mentioned camera module according to the present invention is applied to intelligent electronic device.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description
Basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back
Other technologies scheme from the spirit and scope of the present invention.
It will be understood by those skilled in the art that in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper",
The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed
System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without referring to
Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore above-mentioned art
Language is not considered as limiting the invention.
It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment,
The quantity of one element can be one, and in a further embodiment, the quantity of the element can be it is multiple, term " one " is no
It can be interpreted as the limitation to quantity.
It is the camera module 100 and photosensory assembly of first preferred embodiment according to the present invention as shown in Fig. 2 to Figure 14
10 and its manufacturing method.The camera module 100 can be applied to various electronic equipments 300, and the electronic equipment 300 includes
Equipment body 301 and the one or more institute's camera modules 100 for being installed on the equipment body 301, as shown in figure 44, the electricity
Sub- equipment 30 citing ground but it is not limited to smart phone, wearable device, computer equipment, television set, the vehicles, camera, prison
Device etc. is controlled, the camera module cooperates the electronic equipment to realize Image Acquisition and reproduction to target object.
More specifically, illustrating the photosensory assembly 10 and its manufacturing equipment 200 of the camera module 100 in figure.It is described
Photosensory assembly 10 includes a circuit board 11, a molded base 12 and a photosensitive element 13, and the molded base 12 is integrally formed
In the circuit board 11 and the photosensitive element 13 and formed to the optical window 122 of the photosensitive element 13 offer passage of light.Its
The middle molded base 12 of the invention is by the manufacturing equipment 200 via moulding technology, more specifically transfer modling work
Skill is integrally molded to the circuit board 11 and the photosensitive element 13, so that the molded base 12 can replace tradition
The microscope base or bracket of camera module, and do not need to need to attach microscope base or bracket by glue in similar traditional packaging process
In the circuit board 11.
Further, with reference to Fig. 2-4 and 7A to 10, the present invention manufactures a photosensory assembly by the manufacturing equipment 200
Jigsaw 1000 has the photosensory assembly jigsaw 1000 of multiple photosensory assemblies 10 by board-splicing process production.It is described photosensitive
Component jigsaw 1000 includes a multiple-printed-panel for circuit board 1100 and one or more disjunctor molded bases 1200.The multiple-printed-panel for circuit board
1100 include multiple row circuit board, and such as the 4 column circuits plates illustrated in Fig. 4, each column circuit board includes multiple circuit boards 11, and such as 2-12
The circuit board 11, is illustrated as 6 circuit boards 11 in figure, each circuit board 11 can place of working connect a photosensitive element
13.Each disjunctor molded base 1200 is formed in the column circuit board and integrally formed in a column photosensitive member
At least part non-photo-sensing area 132 of each of part 13 photosensitive element 13 and the photosensitive area for exposing the photosensitive element 13
131.Each disjunctor molded base 1200 has multiple optical windows 122, and the position of each optical window 122 corresponds to each institute
Photosensitive element 13 is stated, for providing passage of light for the corresponding photosensitive element 13.
Wherein the manufacturing equipment 200 of the photosensory assembly jigsaw 1000 of the camera module 100 has including a molding
210, a moulding material feeding machanism 220, a die fixture 230, a temperature control device 250 and a controller 260, the mould
Moulding material feeding machanism 220 is used to provide a moulding material 14 to a pedestal jigsaw profiled guide slot 215.The die fixture
230 for controlling the die sinking and molding of the molding die 210, and the temperature control device 250 is used for the heat cured molding
Material 14 is heated, and the controller 260 is used to automatically control the moulding material feeding machanism 220 in moulding technology,
The operation of the die fixture 230 and the temperature control device 250.
The molding die 210 includes one that can be opened and mold under the action of die fixture 230
One mold 211 and one second mold 212, i.e., the described die fixture 230 can be by first mold 211 and described second
212 phase of mold separate and one forming cavity 213 of mutually closely sealed formation, mold when, the multiple-printed-panel for circuit board 1100 be fixed on it is described at
In type chamber 213, and the moulding material 14 of flow-like enters the forming cavity 213, to be shaped in described in each column
On photosensitive element 13 described in circuit board 11 and corresponding each column, and cured formed later is shaped in circuit described in each column
The disjunctor molded base 1200 on photosensitive element 13 described in plate 11 and each column.
More specifically, the shaping mould group 210 further has one or more pedestal jigsaw profiled guide slots 215 and packet
Include the multiple optical window forming parts 214 being located in the pedestal jigsaw profiled guide slot 215.In 211 He of the first and second molds
When 212 molding, the optical window forming part 214 and the pedestal jigsaw profiled guide slot 215 are extended in the forming cavity 213, and
And the moulding material 14 of flow-like is populated into the pedestal jigsaw profiled guide slot 215, and the corresponding optical window forms
The position in portion 214 cannot fill the moulding material 14 of flow-like, thus in the correspondence pedestal jigsaw profiled guide slot 215
Position can form the disjunctor molded base 1200 after the moulding material 14 of flow-like is cured comprising corresponding
The molded body 121 of the annular of the molded base 12 of each photosensory assembly 10, and in the correspondence optical window forming part
214 position will form the optical window 122 of the molded base 12.The moulding material 14 can choose but be not limited to Buddhist nun
Dragon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene), epoxy
Resin etc..
First and second mold 211 and 212, which can be, can generate two molds of relative movement, in two molds
It is one of fixed, another is removable；Or two molds are all removable, the present invention is not so limited in this respect.
In the example of this embodiment of the invention, first mold 211 is tangibly embodied as a fixed upper mold, and described second
Mold 212 is embodied as a removable lower die.The fixed upper mold and the removable lower die are coaxially arranged, such as described removable
Lower die can along multiple locating shaft upward slidings, be capable of forming when with the fixed Ccope closing machine tight closure it is described at
Type chamber 213.
Second mold 212 is that the lower die can have a circuit board locating slot 2121, can in groove-like or
Formed by positioning column, with for installing and fixing the circuit board 11, and the optical window forming part 214 and the pedestal jigsaw at
Type guide groove 215 can be formed in first mold 211, that is, be formed in the upper mold, when 211 He of the first and second molds
When 212 molding, the forming cavity 213 is formed.And the moulding material 14 of flow-like is injected into the multiple-printed-panel for circuit board
The pedestal jigsaw profiled guide slot 215 of 1100 top side, thus photosensitive element described in circuit board 11 and each column described in each column
13 top side forms the disjunctor molded base 1200.
It is understood that the circuit board locating slot 2121 also can be set on first mold 211 is i.e. described
Mould, for installing and fixing the multiple-printed-panel for circuit board 1100, and the optical window forming part 214 and the pedestal jigsaw profiled guide slot
215 can be formed in second mold 211, when first and second mold 211 and 212 molding, form the molding
Chamber 213.The multiple-printed-panel for circuit board 1100 can be arranged just facing towards ground in the upper mold, and the mold member of flow-like
Material 14 is injected into the pedestal jigsaw profiled guide slot 215 of the bottom side of the inverted multiple-printed-panel for circuit board 1100, thus being inverted
The bottom side of the multiple-printed-panel for circuit board 1100 form the disjunctor molded base 1200.
More specifically, being molded in first and second mold 211 and 212 and when executing molding step, the optical window at
Type portion 214 is superimposed on the top surface of the photosensitive element 13 and fits closely, so that the moulding material 14 of flow-like is hindered
The photosensitive region 1311 for only entering the top surface 131 of the photosensitive element 13 on the circuit board 11, thus described in the correspondence
The position of optical window forming part 214 can ultimately form the optical window 122 of the disjunctor molded base 1200.It can be understood that
The optical window forming part 214 can be solid construction, be also possible to the internal structure with groove shapes as illustrated in the drawing.
It is understood that the forming surface that first mold 211 forms the pedestal jigsaw profiled guide slot 215 can be with structure
Burnishing surface is caused, and is in same plane, in this way when 12 curing molding of molded base, the molded base 12
Top surface is more smooth, thus the optical component such as driver, mirror of 10 top of the photosensory assembly for the camera module 100
Head, fixed lens barrel provide smooth mounting condition, the heeling error of the camera module 100 after reducing assembling.
It is noted that the pedestal jigsaw profiled guide slot 215 and the optical window forming part 214 can be integrally formed
In first mold 211.Being also possible to first mold 211 further includes dismountable molding structure, it is described at
Type structure is formed with the pedestal jigsaw profiled guide slot 215 and the optical window forming part 214.In this way, according to the different senses
The shape and size of optical assembly 10 require the diameter and thickness of such as described molded base, can design different shape and size
The pedestal jigsaw profiled guide slot 215 and the optical window forming part 214.In this way, it is only necessary to replace different molding structures
So that the manufacturing equipment is suitably applied the photosensory assembly 10 of different specifications.It is understood that described second
Mold 212 correspondingly also may include dismountable fixed block, to provide the groove 2121 of different shape and size, thus
It is convenient for changing the circuit board 11 for adapting to different shape and size.
It is understood that the moulding material 14 is thermosetting material, by that will be in that solid thermosetting material heats
Fusing becomes the moulding material 14 of flow-like.During described molded, the heat cured moulding material 14
Solidify by further heating process, and can no longer melt after hardening, to form the disjunctor molded base
1200。
It is understood that the moulding material 14 can be bulk, particle in the moulding technology of the invention
Shape, is also possible to powdered, becomes fluid in the molding die 210 after heated effect, then again it is cured to
Form the disjunctor molded base 1200.
More specifically, each pedestal jigsaw profiled guide slot 215 of the invention has the first substantially parallel diversion trench
2151 and second diversion trench 2152, and extend in more between first diversion trench 2151 and second diversion trench 2152
A filling slot 2153, wherein the filling slot 2153 is formed between two adjacent optical window forming parts 214, as shown in figure
There are 7 filling slots, 2153,6 optical window forming parts 214 to be located at for meaning, the pedestal jigsaw profiled guide slot 215
Between the filling slot 2153 of adjacent two.The moulding material 14 is led along first diversion trench 2151 and described second
Chute 2152 is flowed from its feed end 215A towards its end 215B, and the moulding material 14 described can be filled out full of each
Slot 2153 is filled, to form the disjunctor molded base 1200 after the moulding material 14 solidification.
As shown in Fig. 7 A to Figure 10, shown is the camera module 100 of this preferred embodiment according to the present invention
The manufacturing process schematic diagram of the photosensory assembly jigsaw 1000, as shown in Figure 7 A, the molding die 210 are in molding state,
The multiple-printed-panel for circuit board 1100 to be molded and the solid moulding material 14 prepare in place, the solid moulding material 14
It is heated, the pedestal is admitted to when so that the moulding material 14 being molten into fluid state or semisolid semi-fluid condition and is spelled
Sheet metal forming guide groove 215 along first diversion trench 2151 and 2152 flow forward of the second diversion trench and is filled in adjacent
Two optical window forming parts 214 between filling slot 2153.
As shown in Figure 8 and Figure 9, when the molding for being stuffed entirely with flow-like in the pedestal jigsaw profiled guide slot 215
When material 14,14 curing molding of the moulding material of flow-like is set to be integrally formed the electricity described in each column using solidification process
The disjunctor molded base 1200 of photosensitive element 13 described in road plate 11 and each column.
As shown in Figure 10, it after the moulding material 14 is formed by curing the disjunctor molded base 1200, executes of the invention
Knockout course, i.e., the described die fixture 230 are located remotely from each other first and second mold 211 and 212, the light described in this way
Window forming part 214 leaves the disjunctor molded base 1200, makes to be formed in the disjunctor molded base 1200 corresponding each described
The optical window 122 of photosensitive element 13.
As shown in Figures 4 to 6, the photosensory assembly jigsaw 1000, which is made, further to be cut, to be made single
A photosensory assembly 10.Each photosensory assembly 10 includes at least one circuit board 11, at least one photosensitive member
Part 13 and the molded base 12 for being integrally molded to the circuit board 11 and the photosensitive element 13.Each circuit
Plate 11 includes the rigid region 111 and a flexible region 112 that combine, that is to say, that each circuit board 11 is in this hair
It may be embodied as Rigid Flex in this bright embodiment.The wherein integrally formed circuit board 11 of the molded base 12
The rigid region 111 and the photosensitive element 13 at least part non-photo-sensing area 132, and be formed as the photosensitive element
13 photosensitive area 131 provides the optical window 122 of passage of light.
It is noted that the manufacturing method of the photosensory assembly jigsaw 1000 of the invention is suitable for making small size
The photosensory assembly 10.Therefore, in moulding technology, the volume of first diversion trench 2151 and second diversion trench 2152
It is smaller.It can see from Fig. 7 A to Figure 10, the section of first diversion trench 2151 and second diversion trench 2152 is substantially
For trapezoidal shape.Wherein, the restricted width of the bottom end of first diversion trench 2151 and second diversion trench 2152 is in size,
It can not be widened.
Therefore, according to embodiments of the present invention, disjunctor molded base 1200 is led towards the inner surface of optical window 122, i.e., first
First side surface 1201 of chute 2151 and the second side surface 1202 of the second diversion trench 2152 are set as the structure of both ends formula.
Specifically, as shown in Figure 6 A and 6 B, first side surface 1201 includes that the neighbouring photosensitive element 13 is set
The first part surface 1203 set and the second part surface 1204 being connected with first part surface, and first part's table
Face 1203 is greater than 1204 surface of second part relative to the light relative to the first angle of the optical axis of the camera module
The second angle of axis.That is, from the point of view of Fig. 6 A and Fig. 6 B, first part surface 1203 and second part surface 1204 along from
Under direction up extend, and the inclined degree on first part surface 1203 is greater than the inclination journey on second part surface 1204
Degree.In this way, due to second part surface 1204 relative to first part surface 1203 towards optical window direction tilt so that first leads
The sectional area of chute 2151 increases, so that further such that the volume of the first diversion trench 2151 increases.
Equally, second side surface 1202 includes 1205 He of Part III surface of the neighbouring photosensitive element 13 setting
The Part IV surface 1206 being connected with Part III surface, and the Part III surface 1205 is relative to the camera shooting mould
The third angle of the optical axis of group is greater than fourth angle of the 4th surface portion 1206 relative to the optical axis.That is,
From the point of view of Fig. 6 A and Fig. 6 B, Part III surface 1205 and Part IV surface 1206 extend along direction from the bottom up, and the
The inclined degree on three parts surface 1205 is greater than the inclined degree on Part IV surface 1206.In this way, due to Part IV table
Face 1206 is tilted relative to Part III surface 1205 towards optical window direction, so that the sectional area of the second diversion trench 2152 increases,
To further such that the volume of the second diversion trench 2152 increases.
Preferably, in embodiments of the present invention, the section of the first diversion trench 2151 and the second diversion trench 2152 design has
Symmetry, that is, the first angle on the first part surface 1203 is equal to the third angle on the Part III surface 1205, and
The second angle on the second part surface 1204 is equal to the fourth angle on the Part IV surface 1206.
Consider the influence of the stray light of camera module, the first angle and the third angle are set as 3 °~80 °.And
And consider the structure and material characteristic of the other factors of mould group technique and the molded base of camera module, by second angle and
Fourth angle is set as 0 °~20 °.
Here it is to be noted that it the second angle and fourth angle in the embodiment of the present invention are further preferably arranged
It is 0 degree, that is, second part surface 1204 and Part IV surface 1206 are vertically prolonged upwards relative to the surface of photosensitive element 13
It stretches, on the one hand can farthest increase the sectional area of diversion trench, it on the other hand will not be photosensitive to being incident on for camera module
Light on chip impacts.
It will be understood by those skilled in the art that on the one hand the cross sectional shape of diversion trench can generate shadow to the flowing of moulding material
It rings, on the other hand also directly determines the cross sectional shape of the molded base of generation.
Pass through the two-piece design of the first side surface 1201 and the second side surface 1202, that is, pass through second part surface
The 1204 smaller inclination and Part IV surface 1206 relative to first part surface 1203 is relative to Part III surface
1205 smaller inclination, can further increase the area of the upper surface of molded base, consequently facilitating the camera shooting mould such as carrying microscope base
Other elements of group.
Therefore, in embodiments of the present invention, in addition to considering specific geomery factor for the cross sectional shape of diversion trench
Influence outside, it is also desirable to further consider the influence of the geomery factor for the shape of molded base.
Specifically, since molded base needs to cover connecting line 15, it is therefore desirable to further limit the first side surface
1201 and second height of the side surface 1202 on the direction on the surface perpendicular to photosensitive element 13.
Preferably, in embodiments of the present invention, first part surface 1203 and Part III surface 1205 are respectively vertical
In on the direction on the surface of photosensitive element 13 the first height and third height be 0.05 millimeter~0.7 millimeter.In this way, can protect
The molded base that card is formed can preferably cover connecting line 15.Further, it is contemplated that molded base covers connecting line 15 as a whole,
And the structural factor of microscope base is further carried, second part surface 1204 and Part IV surface 1206 are respectively perpendicular to sense
The second height and the 4th height on the direction on 13 surface of optical element are 0.02 millimeter~0.6 millimeter.
By second part surface 1204 and Part IV surface 1206, the height of mould group pedestal can be further increased,
Other elements in installation camera module are avoided, such as oppress connecting line 15 when microscope base, to influence the performance of camera module.
In this way, passing through the shape for setting the side surface of diversion trench to two-part, it is ensured that the mold member as fluid
Expect the smooth outflow in diversion trench, specifically, the moulding material 14 of flow-like can be along first diversion trench
2151 and 2152 flow forward of the second diversion trench and will the entire pedestal jigsaw before the moulding material 14 solidifies
Profiled guide slot 215 is full of the moulding material 14.
Correspondingly, moulding technology of the invention obtains the photosensory assembly jigsaw 1000 comprising: described in one or more columns per page
Photosensitive element 13 described in circuit board 11, one or more columns per page and one or more disjunctor molded bases 1200.Electricity described in each column
Road plate 11 includes one or more circuit boards 11 being arranged side by side, and each circuit board 11 is described rigid including what is combined
Property region 111 and the flexible region 112.Each disjunctor molded base 1200 is integrally formed in the column circuit board
11 and one arrange the photosensitive element 13 and are formed as the optical window 122 of each offer of the photosensitive element 13 passage of light.Its
In correspond to the disjunctor molded base 1200 adjacent to the disjunctor molded base of the first end side of the flexible region 112
Part 1200A, has the first side surface 1201, and first side surface 1201 includes that the neighbouring photosensitive element 13 is arranged
First part surface 1203 and the second part surface 1204 being connected with first part surface, and the first part surface
1203 relative to the optical axis of the camera module first angle be greater than 1204 surface of second part relative to the optical axis
Second angle；The institute of the second opposite end side corresponding to the disjunctor molded base 1200 far from the flexible region 112
The part 1200B for stating disjunctor molded base has the second side surface 1202, and second side surface 1202 includes the neighbouring sense
The Part III surface 1205 that optical element 13 is arranged and the Part IV surface 1206 being connected with Part III surface, and it is described
Part III surface 1205 is greater than 1206 phase of the 4th surface portion relative to the third angle of the optical axis of the camera module
For the fourth angle of the optical axis.Wherein first end side of the disjunctor molded base 1200 corresponds to the circuit board
11 rigid region 111 and the flexible region 112 combine side, the i.e. proximal lateral adjacent to the flexible region 112；
Second end side of the disjunctor molded base 1200 corresponds to distal end of the circuit board 11 far from the flexible region 112
Side.
The available single photosensory assembly 10 after the photosensory assembly jigsaw 1000 cutting, wherein cutting
It can be cut in the disjunctor molded base 1200 in addition to two flanks of first end side and second end side in step,
To obtain the molded base 12, and the part 1200B of the molded base of corresponding second end side is not cut, this
Sample obtains the photosensory assembly 10 for the part 1200C for having the disjunctor molded base in a pair of opposite flank.
As shown in Figure 6A, correspondingly, the photosensory assembly 10 includes the circuit board 11, the photosensitive element 13 and described
Molded base 12.Wherein the circuit board 11 includes the rigid region 111 and the flexible region 112 combined.It is described
Molded base 12 is integrally formed in the circuit board 11 and the photosensitive element 13 and to be formed as the photosensitive element 13 and provides
The optical window 122 of passage of light.The circuit board 11 is connected with the photosensitive element 13 by a series of connecting lines 15.It is right
Molded base 12 described in Ying Yu has adjacent to the part 12A of the molded base of the first end side of the flexible region 112
First side surface 1201, first side surface 1201 include the first part surface 1203 of the neighbouring photosensitive element 13 setting
The second part surface 1204 being connected with first part surface, and the first part surface 1203 is relative to the camera shooting
The first angle of the optical axis of mould group is greater than second angle of 1204 surface of second part relative to the optical axis；Corresponding to institute
The part 12B for stating the molded base of opposite second end side of the molded base 12 far from the flexible region 112, has
Second side surface 1202, second side surface 1202 include the Part III surface 1205 of the neighbouring photosensitive element 13 setting
The Part IV surface 1206 being connected with Part III surface, and the Part III surface 1205 is relative to the camera shooting
The third angle of the optical axis of mould group is greater than fourth angle of the 4th surface portion 1206 relative to the optical axis.
As shown in Figure 6B, correspondingly, in order to further reduce the size of the photosensory assembly 10, the molded base
At least part of the photosensory assembly 10 of 12 the second opposite end sides far from the flexible region 112 is suitable for being gone
It removes, is such as cut or be abraded with cutter.Here, it will be understood by those skilled in the art that its side surface is set to such as figure 6 above A
Shown in it is identical, just repeat no more here.
By smooth outflow of the moulding material 14 in diversion trench, in moulding technology, the moulding material 14 can be
The disjunctor molded base 1200 is formed on the multiple-printed-panel for circuit board 1100, and the disjunctor molded base 1200 is corresponding every
The position of a photosensitive element 13 can form the optical window 122 of all round closure, thus described in the disjunctor that will be formed
After photosensory assembly jigsaw 1200 is cut, being formed on each circuit board 11 and the corresponding photosensitive element 13 has the optical window
122 molded base 12 prevents the opening of the molded base being partially formed in similar Fig. 1 C and is connected to the optical window 122
To the outside of the molded base 12.
That is, the moulding material 14 of the invention can be from the feed end of two diversion trenches 2151 and 2152
It 215A flow forward and the diversion trench 2151 and 2152 full of the entire pedestal jigsaw profiled guide slot 215 and described fills out
Fill slot 2153.The moulding material 14 before curing can be along two diversion trenches 2151 and 2152 from its feed end
215A flow to end 215B.And before the viscosity of the moulding material 14 reaches high value and solidifies, the mold member
Material 14 can fill up the pedestal jigsaw profiled guide slot 215, thus prevent the circuit board 11 and the photosensitive element 13 it
Between the connecting line 15 damaged by the higher moulding material 14 of the viscosity of flow forward.Also, by being led described in two
The symmetric design of chute 2151 and 2152, fluid in described two diversion trenches 2151 and 2152 substantially with identical step it is radial before
Flowing, two fluids are converged in the filling slot 2153 substantially, and the moulding material 14 in a certain diversion trench is avoided to flow to
Another diversion trench and hinder 14 flow forward of moulding material described in another diversion trench.Nor it can generate turbulent and random
Stream, cause the connecting line 15 for connecting the circuit board 11 and the photosensitive element 13 it is irregular swing and cause deformation and
Damage.
Correspondingly, the moulding material 14 of the invention is also able to can choose the relatively high material of range of viscosities, from
And when avoiding the selection lesser material of range of viscosities, the moulding material 14 is easily accessible the photosensitive element in moulding technology
13 photosensitive region 131 and form overlap.
In addition, it is noted that as shown in Figure 7 B, for convenience of demoulding and to the rigid region of the circuit board 11
The pressing in domain 111, first mold 211 further one include multiple pressing blocks 216, the outside of the molded base 12
The outer edge of the rigid region 111 of edge 1201 and the circuit board 11 will form a pressing side 1111, i.e., in mould the first day of the lunar month technique
In, it is suitble to the pressing block 216 to be pressed together on the region on the rigid region 111 of the circuit board 11.The pressing block 216
It is further pressed together on the top of the flexible region 112 of circuit board 11 described in each column, prevents moulding material 14 from flowing to described
Flexible region 112.In addition, the rigid region 111 of circuit board 11 described in each column is integrally formed and forms whole rigid region
Domain jigsaw 110, to facilitate the pressing of the first mold circuit board 11 described in each column.As shown in Figure 7A, in neighbouring institute
That side of flexible region 112 is stated, the 2151 bottom end width W of the first diversion trench is 0.2 millimeter to 1 millimeter, to be suitable for
Manufacture the photosensory assembly 10 of small size.Correspondingly, the prepared photosensory assembly 10, in the neighbouring flex region
The part 12A of the molded base of the side in domain 112, distance W is 0.2 millimeter to 1 millimeter between inner edges and outer edge.
Correspondingly, the present invention provides the manufacturing methods of the photosensory assembly 12 of the camera module 100 comprising such as
Lower step:
The multiple-printed-panel for circuit board 1100 is fixed on to second mold 212 of the molding die 210, wherein the electricity
Road plate jigsaw 1100 includes one or more columns per page circuit board, and each column circuit board includes one or more circuit boards 11 being arranged side by side,
Each circuit board 11 includes the rigid region 111 and flexible region 112 combined, and each circuit board 111 can
Place of working is connected with the photosensitive element 13；
Second mold 212 and first mold 211 are molded by the die fixture 213, filling is molten
The moulding material 14 changed is in the pedestal jigsaw profiled guide slot 215 in the molding die 210, wherein corresponding to institute
The position for stating optical window forming part 214 is prevented from filling the moulding material 14；
The moulding material 14 in the pedestal jigsaw profiled guide slot 215 undergoes solidification process to corresponding to described
The position of pedestal jigsaw profiled guide slot 215 forms the disjunctor molded base 1200, wherein the disjunctor molded base 1,200 1
Photosensitive element 13 described in the body formed circuit board 11 described in each column corresponded to and each column is to form photosensory assembly jigsaw 1000 simultaneously
Be formed as each photosensitive element 13 in the position for corresponding to the optical window forming part 214 and the optical window of passage of light is provided
122, wherein the pedestal jigsaw profiled guide slot 215, which has, corresponds to the disjunctor molded base 1200 adjacent to the flexible region
First diversion trench 2151 of 112 the first end side and correspond to the disjunctor molded base 1200 far from the flexible region 112
The second diversion trench 2152, and extend between first diversion trench 2151 and second diversion trench 2152 for every
Arrange filled between the photosensitive element 13 of adjacent in the photosensitive element 13 two moulding material 14 be located at adjacent two
Filling slot 2153 between a optical window forming part 214, wherein first diversion trench 2151 has towards the optical window
First side surface 1201, second diversion trench 2152 have towards the second side surface 1202 of the optical window, wherein described the
One side surface includes the first part surface 1203 of the neighbouring photosensitive element 13 setting and is connected with first part surface 1203
The second part surface 1204 connect, second side surface 1202 have the Part III table of the neighbouring photosensitive element 13 setting
Face 1205 and the Part IV surface 1206 being connected with Part III surface 1205, wherein 1203 phase of first part surface
Second angle of the second part surface 1204 relative to the optical axis is greater than for the first angle of the optical axis of camera module,
And the Part III surface 1205 relative to the optical axis third angle be greater than the Part IV surface 1206 relative to
The fourth angle of the optical axis, thus the cross sectional shape of first diversion trench 2151 and second diversion trench 2152 make it is described
First diversion trench 2151 and second diversion trench 2152 are described in the moulding technology for forming the disjunctor molded base 1200
Moulding material 14 can be full of the pedestal jigsaw profiled guide slot 215 and the moulding material 14 is from first diversion trench
The 2151 and feed end 215A of second diversion trench 2152 can arrive separately at first diversion trench 2151 and described second
The end 215B of diversion trench 2152；
The photosensory assembly jigsaw 1000 is cut to obtain multiple photosensory assemblies 10, wherein each photosensory assembly
10 include the circuit board 11, the photosensitive element 13 and the molded base 12, wherein the molded base 12 integrally at
Type is in the circuit board 11 and the photosensitive element 13 and is formed as the photosensitive element 13 and provides the optical window of passage of light
122。
Also, the method may further comprise the step of: cutting and correspond to the molded base 12 far from the flexible region 112
The second opposite end side the photosensory assembly part, i.e. a part of the part 12B of molded base and the circuit board
11 a part, so that the molded base 12B has cut surface in the second opposite end side far from the flexible region 112
125。
As shown in Fig. 5 A to Fig. 6 B, the circuit board 11 includes being formed in the rigid region 111 as pasted by SMT technique
Multiple electronic components 113 of dress, the electronic component 113 include but is not limited to resistance, capacitor, driving element etc..At this
In this embodiment of invention, the molded base 12 is integrally coated on the electronic component 113, to prevent similar biography
Dust, sundries are adhered on the electronic component 113, and further pollute the photosensitive element in system camera module
13, to influence imaging effect.Furthermore it is preferred that the multiple setting of electronic component 113 is in addition to the neighbouring flex region
The first end side 11A and second of the rigid region 111 of domain 112 and the circuit board 11 far from the flexible region 112
At least flank 11C positioned at 11 two sides of photosensitive element on end side 11B, the rigid region 111, wherein the molding
Pedestal 12 integrally embeds the electronic component 113.
That is, referring to shown in Fig. 8 and Fig. 9, in correspondence first diversion trench 2151 and second diversion trench
In 2152, without the electronic component 113, the electronic component 113 can with concentrated setting in the filling slot 2153,
To not have any blocking in first diversion trench 2151 and second diversion trench 2152 in moulding technology, thus
The moulding material 14 be will not influence along first diversion trench 2151 and 2152 flow forward of the second diversion trench, thus
The moulding material 14 is set to flow to its end 215B from its feed end 215A within a short period of time as far as possible.
It is understood that the connecting line 15 can be set in four sides of the photosensitive element 13, it can also concentrate and set
The two flank 11C in the rigid region 111 of the circuit board 11 are set, to also be centrally located at described fill out in moulding technology
It fills in slot 2153, to not influence the moulding material 14 along first diversion trench 2151 and second diversion trench 2152
Flow forward.
If Figure 11 to Figure 14 is the camera module 100 that the photosensory assembly 10 of the invention is applied to production.It is described
Camera module includes a photosensory assembly 10, a camera lens 20 and a filtering assembly 30.The photosensory assembly 10 includes the electricity
Road plate 11, the molded base 12 and the photosensitive element 13.The camera lens 20 includes a structural member 21 and is contained in the knot
One or more eyeglasses 22 in component 21.The filtering assembly 30 includes a filter element microscope base 31 and a filter element 32,
The filter element microscope base 31 is assembled in the top side of the molded base 12, and 20 direct-assembling of camera lens is in the filter element
The top side of microscope base 31 is to form a fixed-focus camera module.Wherein in this embodiment, 12 top side of molded base is one flat
Face, the filter element microscope base 31 are assembled in the top surface that the molded base 12 is in plane, and the filter element 32 played
The effect for filtering the light across the camera lens 20 such as may be embodied as the optical filter of filtering infrared ray, be located at the camera lens 20
Between the photosensitive element 13.In this way, pass through the camera lens 30 light can pass through the filter element 32, and via
The optical window 122 reaches the photosensitive element 13, to can enable the camera module 100 after photoelectric conversion acts on
Optical imagery is provided.
As shown in FIG. 13A, in the photosensory assembly 10 of the camera module 100, correspond to the molded base 12
The part 12A of the molded base of first end side of the neighbouring flexible region 112 has towards the first side of the optical window
Surface 1201, the molding base of the second opposite end side corresponding to the molded base 12 far from the flexible region 112
The part 12B of seat has towards the second side surface 1202 of the optical window, wherein first side surface includes the neighbouring sense
The first part surface 1203 that optical element 13 is arranged and the second part surface 1204 being connected with first part surface 1203, institute
State the second side surface 1202 have the neighbouring photosensitive element 13 setting Part III surface 1205 and with Part III surface
The 1205 Part IV surfaces 1206 being connected, wherein the first part surface 1203 relative to camera module optical axis
One angle is greater than second angle of the second part surface 1204 relative to the optical axis, and the Part III surface 1205
Third angle relative to the optical axis is greater than fourth angle of the Part IV surface 1206 relative to the optical axis, thus
The photosensory assembly 10 of small size can be obtained, so that the size of the entire camera module 100 also further reduces.It can
With understanding, opposite second end side of the molded base 12 far from the flexible region 112 can be further into cutting
Side is cut, so that the remainder after cutting the molded base 12 has cut surface 125, as shown in Figure 14.In addition, such as
Shown in Figure 13 B, it can be seen that the electronic component 113 can concentrated setting in two flanks of the photosensory assembly 10
At least side such as can be and concentrate on two flanks.
It is understood that in other variant embodiment, it can also be without the filter element microscope base 31, the filter
Optical element 32 can with direct-assembling in the molded base 12 perhaps the filter element 32 be assembled in the camera lens 20 or
The filter element 32 is assembled in the load-bearing part such as driver or fixed lens barrel of the camera lens 20.
As shown in figure 15, the camera module 100 may include a load-bearing part 40, be a driver or a fixed mirror
Cylinder, signal in this drawing is a driver, such as voice coil motor, piezo-electric motor, to form a dynamic burnt camera module, the mirror
First 20 are installed on the driver.12 top side of molded base has groove 123, can be used for installing the filter element mirror
Seat 31, the driver can directly be loaded on the top side of the molded base 12.It is understood that in other deformation implementation
In mode, the load-bearing part 40 can also be on the filter element microscope base 31, or a part is mounted in the filter element
Microscope base 31, another part is on the molded base 12.
As shown in Figure 16, in this embodiment in accordance with the invention and in attached drawing, the camera module 100 may include
One load-bearing part 40 is a fixed lens barrel, and the camera lens 20 is installed on the fixed lens barrel.12 top side of molded base has
Groove 123, can be used for installing the filter element microscope base 31, and the fixed lens barrel is installed on the top of the molded base 12
Side.
It is the sense of the camera module 100 of second embodiment according to the present invention as shown in Figure 17 A to Figure 24
Optical assembly 10 and its manufacturing process.In this embodiment, a photosensory assembly jigsaw is equally made by way of jigsaw operation
1000, then cutting obtains the photosensory assembly 10.Wherein in the embodiment shown in Fig. 2 to Figure 16, in multiple row circuit board,
The rigid region 111 of one column circuits plate is arranged adjacent to the mode of the flexible region 112 of another column circuits plate.And at this
In a embodiment, two adjacent column circuits plates can be such that the rigid region 111 neighboringly arranges, and make the corresponding flexibility
Region 112 is mutually separate.It is highly preferred that the rigid region 111 of two adjacent column circuits plates is integrally formed to adjacent two
The intermediate of column circuits plate forms whole rigid region.
Correspondingly, more specifically, the molding die 210 forms a forming cavity 213 in molding, and multiple light are provided
Window forming part 214 and one or more pedestal jigsaw profiled guide slots 215, each pedestal jigsaw profiled guide slot 215 include position
In substantially parallel first diversion trench 2151 arranged along the longitudinal direction at both ends, in two first diversion trenches 2151
Between the second diversion trench 2152, and extend between two first diversion trenches 2151 and second diversion trench 2152
Transversely arranged multiple filling slots 2153, wherein the two column filling slots 2153 are each extended in two first diversion trenches
Between 2151 and second diversion trench 2152.
Such as in this embodiment, the multiple-printed-panel for circuit board 1100 includes the 4 column circuit boards 11, and described in two column
Circuit board 11 is used as one group, and the rigid region 111 of the two column circuit boards 11 of circuit board 11 described in every group is located at centre
And be integrally formed, the circuit board 11 as described in each column has 6 circuit boards, and rigid region 111 is integrally formed.The molding
The tool of mold 210 is there are two the pedestal jigsaw profiled guide slot 215, and each pedestal jigsaw profiled guide slot 215 is each described
There is 7 filling slots 2153, two neighboring optical window molding between first diversion trench 2151 and second diversion trench 2152
There is the filling slot 2153, each optical window forming part 214 is located at two adjacent filling slots 2153 between portion 214
Between.The moulding material 14 along two first diversion trenches 2151 and intermediate second diversion trench 2152 from its into
Expect that end 215A is flowed towards its end 215B, and first diversion trench 2151 and second diversion trench 2152 towards
The side surface of optical window uses two-piece design, and the moulding material 14 can be full of each filling slot 2153, thus in institute
It states after moulding material 14 solidifies and forms the disjunctor molded base 1200.
In this embodiment in accordance with the invention, the disjunctor molded base 1200 is shaped in the two adjacent column electricity
Road plate 11 and the two adjacent column photosensitive elements 13 are to form photosensory assembly jigsaw 1000 and form corresponding to the optical window
The position in portion 214 is formed as each photosensitive element 13 and provides the optical window 122 of passage of light.
As shown in Figure 21 A to Figure 24, shown is the camera module 100 of this preferred embodiment according to the present invention
The manufacturing process schematic diagram of the photosensory assembly jigsaw 1000, as illustrated in fig. 21, the molding die 210 are in molding state,
The circuit board 11 to be molded and the solid moulding material 14 prepare in place, and the solid moulding material 14 is added
Heat, be admitted to when so that the moulding material 14 being molten into fluid state or semisolid semi-fluid condition the pedestal jigsaw at
Type guide groove 215 along first diversion trench 2151 and 2152 flow forward of the second diversion trench and is filled in adjacent two
The filling slot 2153 between a optical window forming part 214.In addition, forming surface and institute for first mold 211
It states circuit board 11 and the photosensitive element 13 fits closely and conveniently stripped,.
As shown in Figure 22 and Figure 23, when two first diversion trenches 2151, institutes of the pedestal jigsaw profiled guide slot 215
It states when being stuffed entirely with the moulding material 14 of flow-like in the second diversion trench 2152 and the filling slot 2153, using solid
Change process makes 14 curing molding of the moulding material of flow-like be integrally formed in the two adjacent column circuit boards 11 and two
Arrange the disjunctor molded base 1200 of the photosensitive element 13.
As shown in figure 24, it after the moulding material 14 is formed by curing the disjunctor molded base 1200, executes of the invention
Knockout course, i.e., the described die fixture 230 are located remotely from each other first and second mold 211 and 212, the light described in this way
Window forming part 214 leaves the disjunctor molded base 1200, makes to be formed in the disjunctor molded base 1200 corresponding each described
The two column optical windows 122 of photosensitive element 13.
As shown in fig. 20b, the photosensory assembly jigsaw 1000, which is made, further to be cut, to be made individually
The photosensory assembly 10.Each photosensory assembly 10 includes at least one circuit board 11, at least one photosensitive element 13
Integrally it is molded to the molded base 12 of the circuit board 11 and the photosensitive element 13.In Figure 19 A to Figure 20 B
Shown, integrally formed rigid region 111 is separated between the two adjacent column circuit boards 11, makes each circuit board 11
Including the rigid region 111 and the flexible region 112 combined.The integrally formed circuit of molded base 12
The rigid region 111 of plate 11 and at least part non-photo-sensing area 132 of the photosensitive element 13, and be formed as described photosensitive
The photosensitive area 131 of element 13 provides the optical window 122 of passage of light.
It is noted that the photosensory assembly jigsaw 1000 is through cutting each described photosensitive group of prepared monomer
Part 10 for make dynamic burnt camera module i.e. automatic focusing camera mould group when, the molding die 210 is further provided with more
A driver pin Slot shaping block 218, each driver pin Slot shaping block 218 extend into the pedestal jigsaw molding
The filling slot 2153 of guide groove 215, to not influence the mold member in three diversion trenches 2151,2152 and 2153
The flowing of material 14, and in molding process, the moulding material 14 of flow-like will not fill corresponding each drive
The position of dynamic device pin Slot shaping block 218, thus after the curing step, in the disjunctor of the photosensory assembly jigsaw 1000
Multiple optical windows 122 and multiple driver pin slots 124 are formed in molded base 1200, through cutting prepared monomer
The molded base 12 of each photosensory assembly 10 be able to configured with the driver pin slot 124, thus making
When the dynamic burnt camera module 100, the pin of driver is able to be connected to the sense by the modes such as welding or conducting resinl attaching
The circuit board 11 of optical assembly 10.
It is noted that the manufacturing method of the photosensory assembly jigsaw 1000 of the invention is suitable for making small size
The photosensory assembly 10.In moulding technology, each first diversion trench 2151 has the first side table towards the optical window
Face 1201, second diversion trench 2152 have towards the second side surface 1202 of the optical window, wherein first side surface
First part surface 1203 including the neighbouring photosensitive element 13 setting and be connected with first part surface 1203 second
Part of the surface 1204, second side surface 1202 have 1205 He of Part III surface of the neighbouring photosensitive element 13 setting
The Part IV surface 1206 being connected with Part III surface 1205, wherein the first part surface 1203 is relative to camera shooting
The first angle of the optical axis of mould group is greater than second angle of the second part surface 1204 relative to the optical axis, and described the
Three parts surface 1205 is greater than the Part IV surface 1206 relative to the optical axis relative to the third angle of the optical axis
Fourth angle.In this way, the moulding material 14 of flow-like can be along two 2151 Hes of the first diversion trench in outside
2152 flow forward of the second diversion trench of centre and the entire pedestal jigsaw of general before the moulding material 14 solidifies
Profiled guide slot 215 is full of the moulding material 14.
Correspondingly, moulding technology of the invention obtains the photosensory assembly jigsaw 1000 comprising: described in one or more columns per page
Photosensitive element 13 described in circuit board 11, one or more columns per page and one or more disjunctor molded bases 1200.Electricity described in each column
Road plate 11 includes one or more circuit boards 11 being arranged side by side, and each circuit board 11 is described rigid including what is combined
Property region 111 and the flexible region 112.Each disjunctor molded base 1200 is integrally formed in adjacent described of two column
Circuit board 11 and two arranges the adjacent photosensitive element 13 and is formed as the light of each offer of the photosensitive element 13 passage of light
Window 122, and the adjacent circuit board 11 of two column is arranged to its flexible region 112 its rigid region 11 away from each other
It is mutually adjacently, makes each disjunctor molded base 1200 that there are two end sides of the neighbouring flexible region 112；Wherein correspond to
In the disjunctor molded base 1200 adjacent to the part of the disjunctor molded base of each end side of the flexible region 112
1200A has towards the first side surface 1201 of the optical window, and the disjunctor molded base 1200 is extended to positioned at described two
The part 1200B between the adjacent photosensitive element 13 is arranged, is had towards the second side surface 1202 of the optical window, wherein
First side surface include the neighbouring photosensitive element 13 setting first part surface 1203 and with first part surface
The 1203 second part surfaces 1204 being connected, second side surface 1202 have the of the neighbouring photosensitive element 13 setting
Three parts surface 1205 and the Part IV surface 1206 being connected with Part III surface 1205, wherein first part's table
Face 1203 is greater than the second part surface 1204 relative to the optical axis relative to the first angle of the optical axis of camera module
Second angle, and the Part III surface 1205 is greater than the Part IV surface relative to the third angle of the optical axis
1206 fourth angle relative to the optical axis.Wherein each end side of the disjunctor molded base 1200 corresponds to described
The rigid region 111 of circuit board 11 and the flexible region 112 combine side, i.e., adjacent to the flexible region 112
Proximal lateral；The disjunctor molded base 1200 corresponds to the circuit board 11 and extends far from the distal side of the flexible region 112
Between the adjacent photosensitive element 13 of two column.
The available single photosensory assembly 10 after the photosensory assembly jigsaw 1000 cutting, wherein cutting
It can be cut in the disjunctor molded base 1200 in addition to other lateral incisions of the part 1200A of the end side in step, to obtain
The molded base 12, wherein corresponding to the part 1200B of the molded base between the adjacent two column photosensitive element 13
It is cut.
Correspondingly, as shown in fig. 20b, the photosensory assembly 10 obtained after cutting comprising the circuit board 11, it is described
Photosensitive element 13 and the molded base 12.Wherein the circuit board 11 includes the rigid region 111 that combines and described
Flexible region 112.The molded base 12 is integrally formed in the circuit board 11 and the photosensitive element 13 and to be formed as institute
It states photosensitive element 13 and the optical window 122 of passage of light is provided.The circuit board 11 and the photosensitive element 13 pass through a series of
Connecting line 15 is connected.After cutting the photosensory assembly jigsaw 1000, make each photosensory assembly 10 similar to above-mentioned implementation
The second end side that there is the first end side that do not cut and cutting to obtain on example ground.Corresponding to the molded base 12 adjacent to described soft
Property region 112 the first end side the molded base part 12A, have towards the first side surface of the optical window
1201, the molded base of the second opposite end side corresponding to the molded base 12 far from the flexible region 112
Part 12B has towards the second side surface 1202 of the optical window, wherein first side surface includes neighbouring described photosensitive
The first part surface 1203 that element 13 is arranged and the second part surface 1204 being connected with first part surface 1203, it is described
Second side surface 1202 have the neighbouring photosensitive element 13 setting Part III surface 1205 and with Part III surface
The 1205 Part IV surfaces 1206 being connected, wherein the first part surface 1203 relative to camera module optical axis
One angle is greater than second angle of the second part surface 1204 relative to the optical axis, and the Part III surface 1205
Third angle relative to the optical axis is greater than fourth angle of the Part IV surface 1206 relative to the optical axis.This
The shape setting of sample, section enables moulding material 14 described in moulding technology to be full of the pedestal jigsaw profiled guide slot 215,
Avoid the generation of photosensory assembly defective products.
That is, the moulding material 14 can be from three diversion trenches 2151 in this embodiment of the invention
Feed end 215A flow forward with 2152 and the diversion trench 2151 full of the entire pedestal jigsaw profiled guide slot 215
With 2152 and the filling slot 2153.The moulding material 14 before curing can be along three 2151 Hes of diversion trench
2152 flow to end 215B from its feed end 215A.And reaches high value in the viscosity of the moulding material 14 and solidify it
Before, the moulding material 14 can fill up the pedestal jigsaw profiled guide slot 215, to prevent the circuit board 11 and described
The connecting line 15 between photosensitive element 13 is damaged by the higher moulding material 14 of the viscosity of flow forward.And three
Fluid in the diversion trench 2151 and 2152 avoids the mould in a certain diversion trench substantially with identical step spoke flow forward
Moulding material 14 flow to another diversion trench and hinders 14 flow forward of moulding material described in another diversion trench.Nor it can produce
Raw turbulent flow and sinuous flow, lead to the irregular swing of the connecting line 15 for connecting the circuit board 11 and the photosensitive element 13 and
Cause to deform and damage.
As illustrated in fig. 21b, described for convenience of demoulding and the pressing of the rigid region 111 to the circuit board 11
First mold 211 further one includes multiple pressing blocks 216, the outer edge 1201 and the circuit of the molded base 12
The outer edge of the rigid region 111 of plate 11 will form a pressing side 1111, i.e., in mould the first day of the lunar month technique, two pressing blocks
216 are pressed together on the region on the rigid region 111 of the two column circuit board 11 respectively.Two pressing blocks 216 press
The top of the flexible region 112 described in each group of the adjacent two column circuit board 11, prevents moulding material 14 from flowing to the flexibility
Region 112.In addition, the rigid region 111 of the adjacent two column circuit board 11 is integrally formed and forms whole rigid region
Domain jigsaw 110, two pressing blocks 216 are pressed together on two end sides of whole rigid region jigsaw 110 respectively, thus convenient
Pressing of first mold 211 to the adjacent two column circuit board 11.In addition, the 2151 bottom end width W of the first diversion trench
It is 0.2 millimeter to 1 millimeter, to be suitable for manufacturing the photosensory assembly of small size.Correspondingly, prepared described photosensitive
Component 10, in the part 12A of the molded base of the side of the neighbouring flexible region 112, inner edges and outer edge
Between distance W be 0.2 millimeter to 1 millimeter.
It is correspondingly, of the invention that this embodiment provides for the manufactures of the photosensory assembly 12 of the camera module 100
Method comprising following steps:
The multiple-printed-panel for circuit board 1100 is fixed on to second mold 212 of the molding die 210, wherein the electricity
Road plate jigsaw 1100 includes one or more columns per page circuit board, and each column circuit board includes one or more circuit boards 11 being arranged side by side,
Each circuit board 11 includes the rigid region 111 and flexible region 112 combined, and each circuit board 111 can
Place of working is connected with the photosensitive element 13；
Second mold 212 and first mold 211 are molded by the die fixture 213, filling is molten
The moulding material 14 changed is in the pedestal jigsaw profiled guide slot 215 in the molding die 210, wherein corresponding to institute
The position for stating optical window forming part 214 is prevented from filling the moulding material 14；
Solidify the moulding material 14 in the pedestal jigsaw profiled guide slot 215 to correspond to the pedestal jigsaw
The position of profiled guide slot 215 forms disjunctor molded base 1200, wherein the disjunctor molded base 1200 be shaped in it is adjacent
The two column circuit boards 11 and the two adjacent column photosensitive elements 13 to form photosensory assembly jigsaw 1000 and correspond to
The position of the optical window forming part 214 is formed as each photosensitive element 13 and provides the optical window 122 of passage of light, wherein described
The adjacent circuit board 12 of two column is arranged to its flexible region 112 away from each other and its rigid region 11 is mutually adjacently, wherein
The pedestal jigsaw profiled guide slot 215, which has, corresponds to the disjunctor molded base 1200 adjacent to the two of the flexible region 112
Two the first diversion trenches 2151 of a end side and corresponding to the of the region between the adjacent photosensitive element 13 of two column
Two diversion trenches 2152, and extend between two first diversion trenches 2151 and second diversion trench 2152 and be used for every
It arranges and fills the moulding material 14 between adjacent two photosensitive element 13 of the photosensitive element 13 and be located at adjacent two
Filling slot 2153 between a optical window forming part 214, wherein first diversion trench 2151 has towards the optical window
First side surface 1201, second diversion trench 2152 have towards the second side surface 1202 of the optical window, wherein described the
One side surface includes the first part surface 1203 of the neighbouring photosensitive element 13 setting and is connected with first part surface 1203
The second part surface 1204 connect, second side surface 1202 have the Part III table of the neighbouring photosensitive element 13 setting
Face 1205 and the Part IV surface 1206 being connected with Part III surface 1205, wherein 1203 phase of first part surface
Second angle of the second part surface 1204 relative to the optical axis is greater than for the first angle of the optical axis of camera module,
And the Part III surface 1205 relative to the optical axis third angle be greater than the Part IV surface 1206 relative to
The fourth angle of the optical axis.
The photosensory assembly jigsaw 1000 is cut to obtain multiple photosensory assemblies 10, wherein each photosensory assembly
10 include the circuit board 11, the photosensitive element 13 and the molded base 12, wherein the molded base 12 integrally at
Type is in the circuit board 11 and the photosensitive element 13 and is formed as the photosensitive element 13 and provides the optical window of passage of light
122。
Also, the method may further comprise the step of: cutting and be located between the two adjacent column photosensitive elements 13
The part of the photosensory assembly 10, to obtain corresponding to the molded base 12 far from the opposite another of the flexible region 112
The part 12B of the molded base of one end.I.e. from described photosensitive between the two adjacent column photosensitive elements 13
The molded base 12 of component 10 and the rigid region 111 of the circuit board 11 are suitable for being cut, so that adjacent two
Arranging distal side of the photosensory assembly 10 far from the flexible region 112 is cutting side respectively, and is respectively formed cut surface
125。
The circuit board 11 includes the multiple electronics member devices for being formed in the rigid region 111 and such as being mounted by SMT technique
Part 113, in corresponding two first diversion trenches 2151 and second diversion trench 2152, without the electronic component
113, the electronic component 113 can be with concentrated setting in the filling slot 2153, thus in moulding technology, described in two
Any blocking is not had in first diversion trench 2151 and second diversion trench 2152, to will not influence the moulding material 14
Along two first diversion trenches 2151 and 2152 flow forward of the second diversion trench, to keep the moulding material 14 most
Amount flow to its end 215B from its feed end 215A within the relatively short time.
In the step of making the photosensory assembly 10 of monomer: the photosensory assembly jigsaw 1000 can be cut to obtain
To multiple independent photosensory assemblies 10, with the camera module for making monomer.Can also by two of integrally connected or
Multiple photosensory assemblies 10 cut from the photosensory assembly jigsaw 1000 and separate, to image mould for making split type array
Each camera module of group, i.e., the described array camera module respectively has the independent photosensory assembly 10, two of them
Or multiple photosensory assemblies 10 are can connect respectively to the control mainboard of same electronic equipment, two such or multiple senses
The image that multiple camera modules are shot can be sent to the control mainboard by the prepared array camera module of optical assembly 10
Carry out Image Information Processing.
It is another variant embodiment according to the present invention based on one embodiment as shown in Figure 25 A
Photosensory assembly jigsaw 1000 comprising the moulding technology of invention obtains the photosensory assembly jigsaw 1000 comprising: a column or more
Arrange photosensitive element 13 described in the circuit board 11, one or more columns per page, one or more columns per page protecting frame 16 and one or more companies
Body molded base 1200.Circuit board 11 described in each column includes one or more circuit boards 11 being arranged side by side, each described
Circuit board 11 includes the rigid region 111 and the flexible region 112 combined.Each protecting frame 16 is formed in institute
It states photosensitive element 13 and is located at the non-photo-sensing area 132 of the photosensitive element 13, i.e., it is located at the outer of the photosensitive area 131
Side, each disjunctor molded base 1200 are integrally formed in the column circuit board 11, one and arrange 13 and of photosensitive element
The one column protecting frame 16 and the optical window 122 that each offer of the photosensitive element 13 passage of light is provided.
That is, before molding forms the disjunctor molded base 1200, on each photosensitive element 13 in advance
The protecting frame 16 is formed, the other material that can be different from the moulding material 14 is formed, and such as be can be and is coated on
The glue in the non-photo-sensing area 132 of the photosensitive element 13, or can be rigid frame, and institute is mounted on by glue
State the non-photo-sensing area 132 of photosensitive element 13.It is described to be formed in the technique of the disjunctor molded base 1200 in molding
Optical window forming part 214 is pressed on the protecting frame 16 with predetermined hardness, described in the moulding material 14 of flow-like enters
When pedestal jigsaw profiled guide slot 215, it can prevent the moulding material 14 of flow-like from flowing into the described photosensitive of the photosensitive element 13
Area 131, to form molding overlap.Such as in a specific example, the protecting frame 16 is formed by glue, is had predetermined
Elasticity and hardness, and can be further embodied as that still there is viscosity after solidification, it is prepared for adhering to
Grit in the photosensory assembly 10 of camera module.More specifically, in some embodiments, the shore hardness of the protecting frame 16
Range be A50-A80, elasticity modulus range be 0.1Gpa-1Gpa.
Similarly, corresponding to the disjunctor molded base 1200 adjacent to described in the first end side of the flexible region 112
The part 1200A of disjunctor molded base has towards the first side surface 1201 of the optical window；Base is molded corresponding to the disjunctor
The part 1200B of the disjunctor molded base of opposite second end side of the seat 1200 far from the flexible region 112 has court
To the second side surface 1202 of the optical window.Wherein first side surface includes the first of the neighbouring photosensitive element 13 setting
Part of the surface 1203 and the second part surface 1204 being connected with first part surface 1203, second side surface 1202 have
The 4th for having the Part III surface 1205 of the neighbouring photosensitive element 13 setting and being connected with Part III surface 1205
Divide surface 1206, wherein the first angle of optical axis of the first part surface 1203 relative to camera module is greater than described second
Second angle of the part of the surface 1204 relative to the optical axis, and the Part III surface 1205 relative to the optical axis
Three angles are greater than fourth angle of the Part IV surface 1206 relative to the optical axis.The wherein disjunctor molded base
1200 first end side corresponds to the rigid region 111 of the circuit board 11 and the mutually knot of the flexible region 112
Close side, the i.e. proximal lateral adjacent to the flexible region 112；Second end side of the disjunctor molded base 1200 corresponds to institute
State distal side of the circuit board 11 far from the flexible region 112.
The available single photosensory assembly 10 after the photosensory assembly jigsaw 1000 cutting, in Figure 25 C
It is shown, wherein can be in the disjunctor molded base 1200 in addition to first end side and second end side in cutting step
The cutting of two flanks, to obtain the molded base 12, and the portion of the molded base of corresponding second end side
Divide 1200B not cut, obtains the sense for the part 1200C that there is the disjunctor molded base in a pair of opposite flank in this way
Optical assembly 10.
Correspondingly, the photosensory assembly 10 includes the circuit board 11, the photosensitive element 13, the protecting frame 16 and institute
State molded base 12.Wherein the circuit board 11 includes the rigid region 111 and the flexible region 112 combined.Institute
State that molded base 12 is integrally formed in the circuit board 11, the photosensitive element 13 and the protecting frame 16 and to be formed as described
The optical window 122 of the offer passage of light of photosensitive element 13.The circuit board 11 and the photosensitive element 13 pass through a series of companies
Wiring 15 is connected.The protecting frame 16 can be located at the inside of the connecting line 15, can also coat the connecting line 15
At least partially.It is described to correspond to the molded base 12 adjacent to the molding base of the first end side of the flexible region 112
The part 12A of seat has the first side surface 1201；Corresponding to the molded base 12 far from the opposite of the flexible region 112
The part 12B of the molded base of second end side has the second side surface 1202.Wherein first side surface includes neighbouring
First part surface 1203 that the photosensitive element 13 is arranged and the second part surface being connected with first part surface 1203
1204, second side surface 1202 have the neighbouring photosensitive element 13 setting Part III surface 1205 and with third portion
The Part IV surface 1206 that point surface 1205 is connected, wherein light of the first part surface 1203 relative to camera module
The first angle of axis is greater than second angle of the second part surface 1204 relative to the optical axis, and the Part III table
Face 1205 is greater than fourth angle of the Part IV surface 1206 relative to the optical axis relative to the third angle of the optical axis
Degree.
As shown in fig. 25 c, correspondingly, in order to further reduce the size of the photosensory assembly 10, the molding base
At least part of the photosensory assembly 10 of opposite second end side of the seat 12 far from the flexible region 112 is suitable for being gone
It removes, forms cut surface 125.
It as shown in Figure 25 B, is that the variant embodiment of above-mentioned second embodiment of the invention is obtained by moulding technology
The photosensory assembly jigsaw 1000 comprising: photosensitive element 13 described in circuit board 11, one or more columns per page described in one or more columns per page,
One or more columns per page protecting frame 16 and one or more disjunctor molded bases 1200, each protecting frame 16 are formed in correspondence
The photosensitive element 13 on.Circuit board 11 described in each column includes one or more circuit boards 11 being arranged side by side, each
The circuit board 11 includes the rigid region 111 and the flexible region 112 combined.Each disjunctor molded base
1200, which are integrally formed in the adjacent circuit board 11, two of two column, arranges the adjacent institute of the adjacent column of the photosensitive element 13, two
It states protecting frame 16 and is formed as each photosensitive element 13 and the optical window 122 of passage of light is provided, and two column are adjacent
The circuit board 11 is arranged to its flexible region 112 away from each other and its rigid region 11 is mutually adjacently, and makes each disjunctor
Molded base 1200 has two end sides of the neighbouring flexible region 112；Wherein correspond to the disjunctor molded base 1200
The part 1200A of the disjunctor molded base of each end side of the neighbouring flexible region 112, has the first side surface
1201；The disjunctor molded base 1200 extends between the adjacent photosensitive element 13 of two column and has the
Two side surfaces 1202.Wherein first side surface includes 1203 He of first part surface of the neighbouring photosensitive element 13 setting
The second part surface 1204 being connected with first part surface 1203, second side surface 1202 have neighbouring described photosensitive
The Part III surface 1205 that element 13 is arranged and the Part IV surface 1206 being connected with Part III surface 1205, wherein
The first angle of optical axis of the first part surface 1203 relative to camera module is greater than 1204 phase of second part surface
For the second angle of the optical axis, and the Part III surface 1205 be greater than relative to the third angle of the optical axis it is described
Fourth angle of the Part IV surface 1206 relative to the optical axis.Wherein each end of the disjunctor molded base 1200
Side corresponds to the rigid region 111 of the circuit board 11 and the flexible region 112 combines side, i.e., adjacent to described soft
The proximal lateral in property region 112；The disjunctor molded base 1200 corresponds to the circuit board 11 far from the flexible region 112
Distal side extends between the adjacent photosensitive element 13 of two column.
The available single photosensory assembly 10 after the photosensory assembly jigsaw 1000 cutting, wherein cutting
It can be cut in the disjunctor molded base 1200 in addition to other lateral incisions of the part 1200A of the end side in step, to obtain
The molded base 12, wherein corresponding to the part 1200B of the molded base between the adjacent two column photosensitive element 13
It is cut, obtains the photosensory assembly for the part 1200C that there is the disjunctor molded base in a pair of opposite flank in this way
10.Part 12A corresponding to the molded base 12 adjacent to the molded base of the first end side of the flexible region 112 has
There is the first side surface 1201；The institute of the second opposite end side corresponding to the molded base 12 far from the flexible region 112
The part 12B for stating molded base has the second side surface 1202.Wherein first side surface includes the neighbouring photosensitive element
The first part surfaces 1203 of 13 settings and the second part surface 1204 being connected with first part surface 1203, described second
Side surface 1202 have the neighbouring photosensitive element 13 setting Part III surface 1205 and with 1205 phase of Part III surface
The Part IV surface 1206 of connection, wherein the first angle of optical axis of the first part surface 1203 relative to camera module
Second angle greater than the second part surface 1204 relative to the optical axis, and the Part III surface 1205 relative to
The third angle of the optical axis is greater than fourth angle of the Part IV surface 1206 relative to the optical axis, in Figure 25 C
It is shown.
As shown in Figure 26 A to Figure 27, the moulding technology of the jigsaw operation can also be used to production with two or more
The photosensory assembly 10 of the optical window 122, wherein the array that such photosensory assembly 10 can be used to make common substrate is taken the photograph
As mould group.That is, by taking the photosensory assembly 10 of mould group is taken the photograph in production pair as an example, each electricity of the multiple-printed-panel for circuit board 1100
For road plate 11 in molding process planning, a circuit board substrate 111 is correspondingly provided with two optical window forming parts
214, in this way in moulding technology and after completing cutting, each circuit board 11 forms the tool for sharing a circuit board 11
There are two the molded base 12 of the optical window 122, two photosensitive elements 13 of corresponding installation and two camera lenses 30.And
The circuit board 11 can connect to the control mainboard of an electronic equipment, prepared array camera shooting in this way in this embodiment
The image that multiple camera modules are shot can be sent to the control mainboard and carry out Image Information Processing by mould group.
It is the camera module 100 of third preferred embodiment according to the present invention as shown in Figure 28 to Figure 31 C and its photosensitive
Component 410.The camera module 400 can be applied to various electronic equipments 300, as shown in Figure 44, the electronic equipment
300 include equipment body 301 and the one or more camera module for being installed on the equipment body 301, and the electronics is set
For 300 citing ground but it is not limited to smart phone, wearable device, computer equipment, television set, the vehicles, camera, monitoring dress
It sets, the camera module cooperates the electronic equipment to realize Image Acquisition and reproduction to target object.
More specifically, the camera module 400 illustrated in figure includes the photosensory assembly 410 and a camera lens 430.It is described
Photosensory assembly 410 includes a circuit board 411, a molded base 412, a photosensitive element 413 and a filter element 414, the mould
Moulding pedestal 412 includes a Base body 4121, integrally takes shape in the circuit board 411 and the photosensitive element 413 and shape
At an optical window 4122, the optical window 4122 is an enclosure space, and provides passage of light to the photosensitive element 413.Wherein
The molded base 412 of the invention is integrally molded to the circuit via moulding technology, e.g. transfer modling technique
Plate 411 and the photosensitive element 413, so that the molded base 412 can replace the microscope base or bracket of traditional camera module, and
And it does not need to need microscope base or bracket being attached at the circuit board 411 by glue in similar traditional packaging process.The filter
Optical element 414 such as can be infrared filtering element, be assembled in the top side of the molded base 412, be located at the photosensitive element
Between 413 and the camera lens 430, to pass through the infrared light filtering of the camera lens 430.
The circuit board 411 can be hardboard, soft, Rigid Flex, ceramic substrate etc..In this embodiment, institute
Stating circuit board 411 is Rigid Flex comprising substrate 4111 and is formed in the substrate 4111 as mounted by SMT technique
Multiple electronic components 4112, the electronic component 4112 include but is not limited to resistance, capacitor, driving element etc..In this hair
In this bright embodiment, the molded base 412 is integrally coated on the electronic component 4112, to prevent similar biography
Dust, sundries are adhered on the electronic component 4112 and further pollute the photosensitive element in system camera module
413, to influence imaging effect.It is understood that the circuit board 411 may also not have the electronic component 4112,
The electronic component 4112 can be mounted on 4111 top surface of substrate, it is also possible to be mounted on the bottom of the substrate 4111
It is buried in the substrate 4111 in surface, or possibility.When be arranged in 4111 top surface of substrate, the electronic component
4112 can be set around the photosensitive element 413, and be located at multiple sides of the photosensitive element 413, such as institute
Stating electronic component 4112 can be set two pairs of opposite sides in the photosensitive element 413, can also be in the electronic component
4112 a pair of of opposite sides.
The circuit board 411 and the photosensitive element 413 can place of working connect, as shown in the figure, 411 He of circuit board
413 surface of photosensitive element respectively has electrical connecting element, such as pad, and the two passes through one or more groups of connecting lines 415
It is connected, the molded base 412 integrally embeds the connecting line 415.
In this preferred embodiment of the invention, the camera module 400 includes the photosensory assembly 410, the mirror
First 430 and a camera lens load-carrying unit 440.The camera lens 430 is assembled in the camera lens load-carrying unit 440, to form a lens group
Part.The camera lens load-carrying unit 440 can be a driver or a fixed lens barrel.In this embodiment, the camera lens carrying
Element is a driver, and the driver may be embodied as voice coil motor, piezo-electric motor, thermodynamics driver, microcomputer electric drive
Device etc., to realize automatic focusing function, to form an automatic focusing camera mould group.It is understood that in other implementation
In example, the camera lens 430 can be with direct-assembling in the molded base 412 of the photosensory assembly 410.
The filter element 414 includes a filter element main body 4141 and a light shield layer 4142, the light shield layer 4142
In the filter element main body 4141 bottom side and be located at the filter element main body 4141 and the molded base 412 it
Between, the light shield layer 4142 is light absorbent, and the filter element main body 4141 is made to form intermediate effective light transmission region
41411 and peripheral region 41412, the light across the camera lens 430 can only could be arrived through the effective light transmission region 41411
Up to the inside of the molded base 412,141 material of filter element main body may include IR film (infrared cut coating), AR film
(antireflective plated film), white glass, smalt, resin material, coating combined type material, crystal etc..The light shield layer 4142 is
Ring structure, centre form windowing, that is to say, that the light shield layer 4142 formed for make light enter the optical window 4122 after
And it reaches the passage of light 41420 of the photosensitive element 413 and reduces the stray light for reaching the photosensitive element 413.
The photosensitive element 413 has intermediate a photosensitive area 4131 and the non-sense around the photosensitive area 4131
Light area 4132, the light shield layer 4142 have an inward flange 41421 and an outer edge 41422.The light shield layer 4142 it is described
The distance between inward flange 41421 and optical axis X are more than or equal to, or are slightly less than the outer edge 41311 and light of the photosensitive area 4131
The distance between axis X.
The outer edge 41422 of the light shield layer 4142 is located at the inward flange of the top surface 4124 of the molded base 412
41241 outside, i.e., the inward flange 41241 and the light shield layer of the top surface 4124 of the described molded base 412
It not will form transparent area between 4142 outer edge 41422.
In this embodiment in accordance with the invention, 4121 inner surface of the Base body of the molded base 412 is along its ring
There is multistage inner surface around direction, such as can be four sections of inner surfaces, every section of inner surface include extend in different directions it is multiple
Part, such as the Base body 4121 of the molded base 412 includes three parts, i.e. is located at shown in Figure 29 A described
A photosensitive element engaging portion 41211 and a top side extension 41212 around optical window 4122, and it is located at the photosensitive element
One circuit board of the top surface for being integrated in 413 outer peripheral surface of photosensitive element and the circuit board 411 around 413 combines
Portion 41213, this three parts integrally extend and form whole structure.The photosensitive element engaging portion 41211 and described photosensitive
Element engaging portion 41211 has the inner surface integrally extended from the photosensitive element 413, wherein from the photosensitive element 413 1
At least one section of inner surface in circular inner surface that body extends is defined as first part's inner surface of the molded base 412
41231, the top side extension 41212 has the inner surface of the extension from 41211 one of photosensitive element engaging portion, shape
At the second part inner surface 41232 of the molded base 412, the second part inner surface 41232 integrally extends institute
State first part's inner surface 41231.It is understood that each first part's inner surface 41231 and the second part
Inner surface 41232 is a certain section of inner surface of circular inner surface of the seat main body 4121；Or multistage inner surface all have it is identical
The first part's inner surface 41231 and the second part inner surface 41232 of construction；Or all inner surfaces all have institute
State first part's inner surface 41231 and the second part inner surface 41232.
The photosensitive element engaging portion 41211 and the respective inner surface 41231 and 41232 of the top side extension 41212
Extended respectively with Different Slope, the second part inner surface 41232 of the top side extension 41212 is relative to described photosensitive
First part's inner surface 41231 of element engaging portion 41211 is upwardly extended with bigger slope or the top side extends
The second part inner surface 41232 in portion 41212 is upwardly extended close to no slope, i.e., the described top side extension 41212
Top surface of the second part inner surface 41232 basically perpendicular to the photosensitive element 413 extend, the top side extends
Portion 41212 becomes a vertical stretch, to keep the area of 41212 top surface of top side extension relatively large, i.e.,
41212 top surface of top side extension determines the area of the top surface 4124 of the molded base 412, the photosensitive member
Extended structure as part engaging portion 41211 and the top side extension 41212, is capable of increasing the institute of the molded base 412
State the area of top surface 4124, so as to for 410 top of the photosensory assembly camera lens or lens assembly bigger peace is provided
Area is filled, more securely to install the camera lens or lens assembly of top, and the area of the filter element 414 can be reduced.
That is, for convenience of moulding technology demoulding and prevent stray light, 41211 shape of photosensitive element engaging portion
At structure be first part's inner surface 41231 for defining of its inner surface with relatively small slope inclination from described photosensitive
Element 413 upwardly extends, and the second part inner surface 41232 that the inner surface of the top side extension 41212 defines is from institute
It states the turnover of first part's inner surface 41231 ground integrally to extend, and with relatively large slope or without slope upwardly extends,
It is formd between the second part inner surface 41232 and first part's inner surface 41231 of the i.e. described molded base 412
Angle can effectively increase the top table of the molded base 412 to tilt upward extension relative to fixed slope
The area size in face 4124.
As shown in fig. 29b, first part's inner surface that the inner surface of the photosensitive element engaging portion 41211 defines
Angle between 41231 and the optical axis X of the camera module 400 is α, what the inner surface of the top side extension 41212 defined
Angle between the second part inner surface 41232 and the optical axis X of the camera module 400 is β, wherein the numberical range of α
It is 3 °~80 °, the numberical range of β is 0 °~10 °, and α > β.Such as in a specific embodiment, the numerical value of α is 3 °, β
Numerical value be 0 °；In a specific embodiment, the numerical value of α is 30 °, and the numerical value of β is 0 °；In a specific embodiment, α
Numerical value is 60 °, and the numerical value of β is 0 °；In a specific embodiment, the numerical value of α is 45 °, and the numerical value of β is 5 °；It is specific at one
In embodiment, the numerical value of α is 80 °, and the numerical value of β is 10 °.
That is, the second part inner surface 41232 that the inner surface of the top side extension 41212 defines and institute
State the institute that the angle β between the optical axis X of camera module 400 is defined relative to the inner surface of the photosensitive element engaging portion 41211
The angle α stated between first part's inner surface 41231 and the optical axis X of the camera module 400 has smaller angle, to make
The second part inner surface 41232 of the top side extension 41212 is obtained with bigger slope or along perpendicular to described photosensitive
It upwardly extends to the direction of element 413, to increase the area of the top surface 4124 of the molded base 412.
As shown in fig. 29b, in this preferred embodiment of the invention, it is preferable that the photosensitive element engaging portion 41211
Thickness H1 numberical range be 0.05 millimeter~0.7 millimeter, the thickness H2 numberical range of the top side extension 41212 is 0.02
Millimeter~0.6 millimeter.Such as in a specific embodiment, the thickness H1 numberical range of the photosensitive element engaging portion 41211
It is 0.08 millimeter, the thickness H2 numberical range of the top side extension 41212 is 0.5 millimeter；In a specific embodiment, institute
The thickness H1 numberical range for stating photosensitive element engaging portion 41211 is 0.4 millimeter, the thickness H2 number of the top side extension 41212
Being worth range is 0.3 millimeter；In a specific embodiment, the thickness H1 numberical range of the photosensitive element engaging portion 41211 is
0.5 millimeter, the thickness H2 numberical range of the top side extension 41212 is 0.1 millimeter.
It is understood that the second part inner surface 41232 of the top side extension 41212 is from described first
Divide the turnover of inner surface 41231 and extended with the direction of more low-angle between optical axis X, so that can make in moulding technology
The pressure head for being pressed on the photosensitive element 413 can avoid the company between the circuit board 411 and the photosensitive element 413
Wiring 415, to prevent from damaging by pressure the connecting line 415.That is, in some cases, if the mould to be formed
When moulding pedestal 412 with the extension of relatively small fixed slope, if angle is 45 °~80 ° between inner surface and optical axis X, molding
The pressure head that the photosensitive element 413 is pressed in technique may encounter the connecting line 415 and lead to the connecting line 415
Damage.
As shown in Figure 30, first part's inner surface that the inner surface of the photosensitive element engaging portion 41211 defines
Angle α between 41231 and the optical axis X of the camera module 400 can be relatively large, is incident in the first part in this way
The light L12 on surface 41231 just will not be directly mirrored to the photosensitive element 413 and form stray light.That is, described
Photosensitive element engaging portion 41211 and the top side extension 41212 are worked in coordination, the knot of the photosensitive element engaging portion 41211
Structure is conveniently stripped and reduces stray light, and the top side extension 41212 is used to increase the top surface of the molded base 412
Structure as 4124 area and the top side extension 41212 avoids connecting line 415 described in moulding technology from being damaged by pressure by pressure head.
I.e. preferably, as shown in Figure 29 B, first part's inner surface 41231 and the second part inner surface
41232 positions 41230 being connected are located at the inside of the outer edge 41321 of the photosensitive element 413, i.e., in the described first part
The distance between position 41230 that surface 41231 and the second part inner surface 41232 are connected and optical axis X D1 are less than institute
The distance between outer edge 41321 and the optical axis X in the non-photo-sensing area 4132 of photosensitive element 413 D2 is stated, so that described
The size of part between photosensitive element engaging portion 41211 and the photosensitive element 413 is smaller, to reduce in moulding technology
The moulding material 416 generates a possibility that " overlap ".
It is further preferred that first part's inner surface 41231 was connected with the second part inner surface 41232
Position 41230 is located at the inside of the connecting line 415, first part's inner surface 41231 and the second part inner surface
The distance between 41232 positions 41230 being connected and optical axis X D1 are less than the distance between the connecting line 415 and optical axis X
D3.Turning point between the photosensitive element engaging portion 41211 and the top side extension 41212 is no more than the connecting line
Position where 415, i.e., the described photosensitive element engaging portion 41211 are i.e. complete before the position for not extending to the connecting line 415 also
At the transition to the top side extension 41212, so that the connecting line 415 be avoided to be damaged by pressure in moulding technology by pressure head.Such as
When the top side extension 41212 is a vertical stretch, the inward flange of the top surface 4124 of the molded base 412
The distance between optical axis X of 41241 position and the camera module 400 is not less than the connecting line 415 and the camera shooting mould
The distance between the optical axis X of group, so that the top side extension 41212 be made to increase the top surface of the molded base 412
4124 area, and the connecting line 415 embedding is not integrally damaged into the connecting line 415.
It is understood that the inner surface 41231 of the photosensitive element engaging portion 41211 of the molded base 412 inclines
Tiltedly extend to facilitate stripping operation in moulding technology and reduces the stray light for reaching the photosensitive element 413, and the top
The inner surface 41232 of side extension 41212 integrally transfers ground from the inner surface 41231 of the photosensitive element engaging portion 41211
Extend to which the photosensitive element engaging portion 41211 and the top side extension 41212 match, in the feelings for reducing stray light
Increase the area of the top surface of the molded base 412 under condition as far as possible.
In addition, the filter element 414 as shown in Figure 30, is incident to when bottom side is provided with the light shield layer 4142
The part spurious rays L11 of 4141 upper surface of filter element main body of the filter element 414 is by the filter element master
The upper surface reflection of body 4141 is refracted into the screening without entering the optical window 4122 of the molded base 412
When the peripheral region 41412 in 41411 outside of the transmission region of the top of photosphere 4142, can be absorbed by the light shield layer 4142 and
The optical window 4122 inside the molded base 412 is not can enter, to play the purpose for stopping a part of stray light.
When another part stray light L12 pass through the filter element main body 4141 the effective light transmission region 41411 and
It, can be by inclined first part's inner surface of the molded base 412 when being incident to first part's inner surface 41231
41231 reflex to the light shield layer 4142 upwards or are further further reflexed to by the second part inner surface 41232
The light shield layer 4142, to be absorbed by the light shield layer 4142, so that the photosensitive member will not be reached further by reflection
Part 413 influences the image quality of the camera module 400.
Correspondingly, the second part inner surface 41232 of the light shield layer 4142 and the molded base 412 is adjacent
Closely, the second part inner surface 41232 of the molded base 412 is extended downwardly from the light shield layer 4142, and in institute
Light shield layer 4142 is stated, between first part's inner surface 41231 and second part inner surface 41232, the optical window 4122
Exterior portion forms a suppression light slot 41221, and the suppression light slot 41221 is the space for being used to restrain stray light injection.More
Body, as shown in figure 30, stray light L12 enters among the suppression light slot 41221, thus cannot be in the suppression light slot 41221
It projects.
It is understood that because the second part inner surface of the light shield layer 4142 and the molded base 412
41232 is adjoining, so that the light shield layer 4142, which is effectively reduced, reaches described across the filter element main body 4141
The light of two portion inner surfaces 41232, to avoid the light for being incident to the second part inner surface 41232 by described second
Portion inner surface 41232 reflects and reaches the photosensitive element 413 and form stray light and influence the imaging of the camera module 400
Quality.As shown in Figure 30, the second part inner surface 41232 is extended downwardly from the light shield layer 4142 extension, the screening
Photosphere 4142 extends from 41232 horizontal direction of second part inner surface, in the light shield layer 4142 and the second part
Angle γ is formed between surface 41232, angle γ is acute angle or right angle, thus the suppression light slot of this spline structure formed
41221 avoid the light for being incident to the inner surface 4123 from being reflected to the photosensitive element 413 and form stray light.
The filter element 4141 can be mounted on the top surface 4124 of the molded base 412, such as pass through glue
It is bonded in the top surface 4124 of the molded base 412.The light shield layer 4142 is black light-absorbing opaqueness material
Material, can be formed in the bottom surface of the filter element main body 4141, the filter element main body as described in fitting in various ways
4141 bottom surface, or the light shield layer 4142 is formed in by the filter element main body using yellow light process or silk screen printing process
4141 bottom surface.
Figure 31 A to Figure 31 C be photosensory assembly 410 according to the present invention it is integrally formed as described in circuit board 411,
The manufacturing process schematic diagram of the integral component of the molded base 412 and the photosensitive element 413.Its manufacturing equipment 4200 includes
A molding tool 4210, the molding die 4210 include one first mold 4211 and one second mold that can be opened and mold
4212, i.e. a die fixture can mutually separate first mold 4211 and mutually closely sealed shape with second mold 4212
At a forming cavity 4213, in molding, the circuit board 411 for being connected to the photosensitive element 413 is fixed on the forming cavity
In 4213, and the moulding material 416 of flow-like enters the forming cavity 4213, to be shaped in the circuit board
411 and the photosensitive element 413 on, and it is cured after formed be shaped in the circuit board 411 and the photosensitive member
The molded base 412 on part 413.It is understood that usually generating above-mentioned one in a manner of jigsaw in production technology
Body component forms disjunctor molded base that is, on multiple-printed-panel for circuit board, however forms the integral component of the invention through cutting.
In Figure 31 A to Figure 31 C, to illustrate for illustrating the forming process of an integral component.
More specifically, the molding die 4210 further has a pedestal profiled guide slot 4215 and including positioned at described
An optical window forming part 4214 in pedestal profiled guide slot 4215.In first and second mold 4211 and 4212 molding, institute
It states optical window forming part 4214 and the pedestal profiled guide slot 4215 extends in the forming cavity 4213, and flow-like is described
Moulding material 416 is populated into the pedestal profiled guide slot 4215, and the position of the corresponding optical window forming part 4214 cannot
The moulding material 416 for filling flow-like, thus in the position of the correspondence pedestal profiled guide slot 4215, flow-like it is described
The molded base 412 can be formed after moulding material 416 is cured comprising corresponding each photosensory assembly 410
The molded base main body 4121 of the annular of the molded base 412, and can shape in the position of the correspondence optical window forming part 4214
At the optical window 4122 of the molded base 412.The moulding material 416 can choose but be not limited to nylon, LCP
(Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene), epoxy resin
Deng.
More specifically, when first and second mold 4211 and 4212 molds and executes molding step, the optical window
Forming part 4214 is superimposed on the top surface of the photosensitive element 413 and fits closely, thus the moulding material 416 of flow-like
It is prevented from entering the photosensitive area 4131 of the photosensitive element 413 on the circuit board 411, thus in the correspondence optical window
The position of forming part 4214 can ultimately form the optical window 4122 of the molded base 412.It is understandable that the light
Window forming part 4214 can be solid construction, be also possible to the internal structure with groove shapes as illustrated in the drawing.It can manage
Solution, in other deformation, the also settable elastic membrane 4217 in 4211 bottom side of the first mold provides buffering and conveniently
It is demoulded after moulding technology.
As shown in Figure 31 A to Figure 31 C, the optical window forming part 4214 is pressed on the photosensitive element 413, for corresponding shape
The photosensitive element engaging portion 41211 and the top side extension 41212 at the molded base 412, the optical window molding
Portion 4214 has a bottom side forming part 42141 and a top side forming part 42142, and the bottom side forming part 42141 is taper type knot
Structure has gradually big internal diameter from bottom side towards top side direction.Wherein the outer surface 421411 of the bottom side forming part 42141 with
Angle α, top side forming part 42142 are formed perpendicular between the optical axis X (vertical direction illustrated in figure) of the photosensitive element 413
Outer surface 421421 and perpendicular between the optical axis X of the photosensitive element 413 formed angle β.Correspondingly, the numberical range of α
It is 3 °~80 °, the numberical range of β is 0 °~10 °, and α > β.The top side forming part 42142 is from the bottom side forming part
42141, which turn to ground, extends, and the connecting line 415 will not be pressed onto moulding technology and causes the damage of the connecting line 415.Institute
It states 42141 outer surface 411411 of bottom side forming part obliquely to extend, without being directly formed sharp right, height at least 0.05
Millimeter, to prevent elastic membrane 4217 to be punctured in moulding technology.
The optical window forming part 4214 has first part outer surface 421411 and second from bottom side towards top side direction
Exceptionally surface 421421 forms the numerical value model of angle α and β, α between the optical axis X perpendicular to the photosensitive element 413 respectively
Enclosing is 3 °~80 °, and the numberical range of β is 0 °~10 °, and α > β.To after the molding process, make the molded base
412 form the photosensitive element engaging portion 41211 and the top side extension 41212, and make the photosensitive element engaging portion
41211 structures that are formed be first part's inner surface 41231 for defining of its inner surface with relatively small slope inclination from
The photosensitive element 413 upwardly extends, the second part inner surface that the inner surface of the top side extension 41212 defines
41232 integrally extend from first part's inner surface 41231 turnover ground, and with relatively large slope or without slope
It upwardly extends.First part's inner surface 41231 that the inner surface of the i.e. described photosensitive element engaging portion 41211 defines with it is described
Angle between the optical axis X of camera module 400 is α, the second part that the inner surface of the top side extension 41212 defines
Angle between inner surface 41232 and the optical axis X of the camera module 400 is β, and wherein the numberical range of α is 3 °~80 °, β's
Numberical range is 0 °~10 °, and α > β.It is understood that the structure that the optical window forming part 4214 turnover in this way extends,
It can reduce the non-photo-sensing area 4132 into the photosensitive element 413 and the optical window forming part 4214 in moulding technology
The first part outer surface 421411 the pedestal profiled guide slot 4215 bottom side portion space 41251 the mould
Moulding material 416, thus in the space moulding material 416 small volume, the pressure and pressure of generation are smaller, to not allow
The photosensitive area 4131 for easily entering the photosensitive element 413, that is, avoid the generation of " overlap ".
In this moulding technology of the invention, the bottom side of the pedestal profiled guide slot 4215 is located at the photosensitive element
Part between 413 and the first part outer surface 421411 of the molded base 412 forms a filling slot 42151.Mould
Moulding is not easily accessed the photosensitive element 413 at the moulding material 416 of the molded base 412 and the optical window forms
" overlap " is formed between the bottom surface in portion 4214, so that the photosensitive area 4131 for reducing the photosensitive element 413 is contaminated
A possibility that.More specifically, passing through the first part outer surface for reducing the photosensitive element 413 and the optical window forming part 4214
The volume of the filling slot 42151 between 421411 reduces the production of the moulding material 416 for entering the filling slot 42151
Raw pressure and pressure, so that reducing the moulding material 416 enters the photosensitive element 413 and the optical window forming part 4214
Bottom surface between and a possibility that form " overlap ".
In this preferred embodiment of the invention, the outer surface of the optical window forming part 4214 extends with different directions
Outer surface, the angle between outer surface, that is, second part outer surface 421421 of top side and the optical axis X of the photosensory assembly
Less than outer surface, that is, angle between first part outer surface 421411 and optical axis X of bottom side, to reduce the optical window molding
The filling slot 42151 formed between the first part outer surface 421411 in portion 4214 and the photosensitive element 413
Volume, thus a possibility that reducing the generation of " overlap ".
In addition, the second part outer surface 421421 of top side described in the optical window forming part is with folder smaller between optical axis X
The direction at angle extends, and the inclined outer surface illustrated from rather than Figure 1B facilitates guiding encapsulating material to enter the filling slot, this hair
In this bright embodiment, the second part outer surface 421421 of top side described in the optical window forming part can be risen to a certain extent
Blocking effect that is, because it extends from the first part outer surface 421411 ground one of transferring be not similar Figure 1B middle line
Property the guiding face structure that extends of inclination, to slow down the moulding material into the filling slot 42151 to a certain extent
416 flow velocity reduces the pressure that the moulding material 416 enters the filling slot 42151 and generates, to reduce " overlap "
A possibility that generation.And because the moulding material 416 described in integrated moulding technology is not easily formed " overlap ", thus described
Optical window forming part 4214 does not need to be pressed on biggish pressure on the photosensitive element 413, to avoid the photosensitive element
413 are subject to crushing.As shown in fig. 32 a, a variant embodiment of above-mentioned third preferred embodiment according to the present invention, at this
In a embodiment, the top surface of the filter element main body 4141 is additionally provided with a top side light shield layer 4143, thus the top side
Light shield layer 4143 and the cooperation enhancing of the light shield layer 4142 reduce the effect of stray light.It is hidden more specifically, being incident to the top side
The light L21 of photosphere 4143 is absorbed by the top side light shield layer 4143, and light L22 can be absorbed by the light shield layer 4142.It can be with
Understand, the top side light shield layer 4143 has also can be set in above-mentioned third preferred embodiment.
As shown in fig. 32b, a variant embodiment of above-mentioned third preference according to the present invention, the camera shooting mould
Group 400 includes the photosensory assembly 410, the camera lens 430 and a camera lens load-carrying unit 440.The camera lens 430 is assembled in described
Camera lens load-carrying unit 440, to form a lens assembly.The camera lens load-carrying unit 440 can be a fixed lens barrel, to be formed
One fixed-focus camera module.
Accordingly, the photosensory assembly 410 includes a circuit board 411, a molded base 412, a photosensitive element 413 and one
Filter element 414, the molded base 412 include a Base body 4121, integrally take shape in the circuit board 411 and institute
It states photosensitive element 413 and forms an optical window 4122, the optical window 4122 is an enclosure space, and gives the photosensitive element 413
Passage of light is provided.The filter element 414 includes a filter element main body 4141 and a light shield layer 4142, the light shield layer
4142 be extinction light-proof material, is located at the bottom side of the filter element main body 4141 and is located at the filter element main body
Between 4141 and the molded base 412.
Wherein the molded base 412 has a top side groove 4125 in its top side, and the top side groove 4125 is used for group
Fill the filter element 414.That is, in this embodiment in accordance with the invention, the top surface 4124 of the molded base 412
It can be multi-stage stairs face, the top surface 4124 is divided into non-coplanar more portion top surfaces, such as first part's top surface
A 4124a and second part top surface 4124b, first part's top surface 4124a is relative to the second part top surface
4124b is recessed towards the direction of the photosensitive element 413, is formed in this way in the top side first part's top surface 4124a described
Top side groove 4125, the filter element 414 are assembled in the top side groove 4125.
The top side extension 41212 of the molded base 412 is correspondingly in two-part, and forms institute in its top side
State top side groove 4125.The inner surface 4123 of the molded base 412 accordingly includes the institute of the photosensitive element engaging portion 41211
State the second part inner surface 41232 and third portion that first part's inner surface 41231 and the top side extension 41212 are formed
The second part inner surface 41232 of point inner surface 41233, the light shield layer 4142 and the molded base 412 is adjoining,
And above-mentioned suppression light slot is formed between first part's inner surface 41231 and the second part inner surface 41232
41221, so that forming one restrains the space that stray light projects.It is incident to the light of first part's inner surface 41231
It is directly mirrored to the light shield layer 4142 or the light shield layer is further reflexed to by the second part inner surface 41232
4142 by the light shield layer 4142 to be absorbed, to reduce stray light.414 top side of filter element is also equipped with the top
The effect of stray light is eliminated in side light shield layer 4143, enhancing.
It is understood that the routing direction of the connecting line 415 is from described in the embodiment of above-mentioned Figure 28 to Figure 33
Photosensitive element 413 is to the circuit board 411, i.e., by the way that the photosensitive element terminal pad is arranged on the photosensitive element 413,
Routing jig is first connected to the company of the photosensitive element terminal pad in the top routing formation of the photosensitive element terminal pad
Then the first end of wiring 415 can raise predeterminated position, then mobile towards the circuit board terminal pad direction on circuit board and again
Decline is to form the second of the connecting line 415 for being connected to the circuit board terminal pad on the top of the circuit board terminal pad
End.
As shown in figure 33, another variant embodiment of above-mentioned third preference according to the present invention, the camera shooting
The electronic component 4112 of the circuit board 411 of the photosensory assembly 410 of mould group 400 is mounted on its bottom side, accordingly
The ground photosensory assembly 410 further includes one or more bottom side molded sections 419, integrally embeds the electronic component
4112.I.e. described 411 top side of circuit board does not mount the electronic component 4112, these electronic components 4112 are arranged on
The bottom side of the circuit board 411, and by the bottom side molded section 419, it can be multiple independent sectors, one can also be formed
The electronic component 4112 is embedded and forms bottom side flat support face by a Unitarily molded pedestal.The bottom side molded section 419
It can separately be formed with the molded base 412, it is also possible to be formed in a moulding technology, such as the circuit board
411 can have perforation, and the moulding material 416 can reach the two sides of the circuit board 411 in moulding technology.
It is understood that the space of 411 bottom side of the circuit board of 413 lower section of photosensitive element also can be used to cloth
The electronic component 4112 is set, the electronic component 4112 is needed to be arranged in the sense from rather than above-described embodiment
The surrounding of optical element 413, in this embodiment, the area size of the circuit board 411 is substantially reduced.
Correspondingly, the molded base 412 includes the photosensitive element engaging portion 41211 and the top side extension
41212, in this way when the size of the photosensory assembly 410 further decreases, transferred by the top side extension 41212
Ground extends, and increases the area of top surface 4124 described in the molded base 412, is held with the mounting surface for providing bigger to the camera lens
Carry element 440 and the filter element 414.And the filter element 414 includes being arranged in the filter element main body 4141
The bottom side light shield layer 4142 and top side light shield layer 4143 of two sides, to enhance the effect for eliminating stray light.
As shown in Figure 34, the routing connection type between the photosensitive element 413 and the circuit board 411 is from described
Circuit board 411 is to the photosensitive element 413.Pass through the upper setting circuit board terminal pad in the circuit board 411, routing
Jig is first connected to the connecting line 415 of the circuit board terminal pad in the top routing formation of the circuit board terminal pad
Then second end can raise predeterminated position, then translate towards circuit board terminal pad direction and connect in the inductance optical element
The top of disk forms the opposite first end for being connected to the connecting line 415 of photosensitive element terminal pad, the connecting line described in this way
415 extend in bending, and cause in the embodiment of tip height h2 ratio Figure 28 to Figure 33 of the connecting line 415, with
For in Figure 33, the height h1 on connecting line top is low, thus in moulding technology, the optical window of the molding die 4210 at
The space that type portion 4214 needs to avoid the connecting line 415 reduces, so that the height of top side extension 41212 can be with
It is higher.
It is the camera module 400 of the 4th preferred embodiment according to the present invention as shown in FIG. 35 to 37, wherein described
Camera module 400 includes a photosensory assembly 410 and a camera lens 430.The camera lens 430 is assembled in the photosensory assembly and is formed centainly
Burnt camera module.It is understood that in other variant embodiment, the camera lens also can be set in a driver or
One fixed lens barrel and form a lens assembly, the lens assembly is assembled in the photosensory assembly.
Accordingly, the photosensory assembly 410 include a circuit board 411, a molded base 412, a photosensitive element 413, one
Filter element 414 and a filter element bracket 417, the molded base 412 includes a Base body 4121, integrally formed
In the circuit board 411 and the photosensitive element 413 and an optical window 4122 is formed, the optical window 4122 is an enclosure space, and
And passage of light is provided to the photosensitive element 413.
The filter element bracket 417 is assembled in the molded base 412, and windowing 4171 and top side with bottom side
Mounting groove 4172, the filter element 414 is assembled in the top side mounting groove 4172, so that the filter element 414 is assembled in
The filter element bracket 417 is relative to direct-assembling in the more difficult damage of the molded base 412.
The filter element 414 includes a filter element main body 4141, the light shield layer 4142 of a bottom side and a top side shading
Layer 4143, the light shield layer 4142 are located at the bottom side of the filter element main body 4141 and are located at the filter element main body
Between 4141 and the inside top surface of the filter element bracket 417, the light shield layer 4142 is light absorbent, makes the filter
Optical element main body 4141 forms intermediate effective light transmission region 41411 and peripheral region 41412, across the light of the camera lens 430
Line can only get to the inside of the molded base 412 through the effective light transmission region 41411.The light shield layer 4142,
It is ring structure, and centre forms windowing, that is to say, that the light shield layer 4142 is formed for making light enter the optical window
4122 passage of light 41420 and the stray light for reaching the photosensitive element 413 is reduced, the top side light shield layer 4143 can increase
The strong effect for reducing stray light.
The photosensitive element 413 has intermediate a photosensitive area 4131 and the non-sense around the photosensitive area 4131
Light area 4132, the light shield layer 4142 have an inward flange 41421 and an outer edge 41422.The light shield layer 4142 it is described
The distance between inward flange 41421 and optical axis X are more than or equal to, or are slightly less than the outer edge 41311 and light of the photosensitive area 4131
The distance between axis X.
The outer edge 41422 of the light shield layer 4142 is located at the inward flange of the top surface of the filter element bracket 417
41701 outside, i.e., the inward flange of the top surface of the described filter element bracket 417 and the institute of the light shield layer 4142
Stating not will form transparent area between outer edge 41422.
In this embodiment in accordance with the invention, the Base body 4121 of the molded base 412 includes around direction
Multistage inner surface, every section of inner surface has a multiple portions extended in different directions, such as the molded base 412 is described
Base body 4121 includes three parts, the i.e. photosensitive element being located at around the optical window 4122 shown in Figure 36 A and Figure 36 B
Engaging portion 41211 and a top side extension 41212 and a circuit board of 41211 bottom side of photosensitive element engaging portion combine
Portion 41213.The photosensitive element engaging portion 41211 has the inner surface integrally extended from the photosensitive element 413, wherein at least
One section of first part's inner surface for being defined as the molded base 412 from the inner surface that the photosensitive element 413 integrally extends
41231, the top side extension 41212 has the inner surface of the extension from 41211 one of photosensitive element engaging portion, and shape
At the second part inner surface 41232 of the molded base 412, the second part inner surface 41232 integrally extends institute
State first part's inner surface 41231.It is understood that each first part's inner surface 41231 and the second part
Inner surface 41232 is a certain section of inner surface of circular inner surface of the seat main body 4121；Or multistage inner surface all have it is identical
The first part's inner surface 41231 and the second part inner surface 41232 of construction；Or all inner surfaces all have institute
State first part's inner surface 41231 and the second part inner surface 41232.
The photosensitive element engaging portion 41211 and the respective inner surface 41231 and 41232 of the top side extension 41212
Extended respectively with Different Slope, the second part inner surface 41232 of the top side extension 41212 is relative to described photosensitive
First part's inner surface 41231 of element engaging portion 41211 is upwardly extended with bigger slope or the top side extends
The second part inner surface 41232 in portion 41212 is upwardly extended close to no slope, i.e., the described top side extension 41212
The second part inner surface 41232 basically perpendicular to the photosensitive element 413 top surface extend, to make the top
The area of 41212 top surface of side extension can be relatively large, i.e., described 41212 top surface of top side extension determines the molding
The area of the top surface 4124 of pedestal 412, the photosensitive element engaging portion 41211 and the top side extension 41212 this
The extended structure of sample is capable of increasing the area of the top surface 4124 of the molded base 412, so as to be described photosensitive
The camera lens or lens assembly of 410 top of component or the filter element bracket 417 provide bigger mounting area, such as at this
In embodiment, the top surface 4124 of the molded base 412 is able to more securely install the filter element branch of top
Frame 417.And such structure can reduce the area of the filter element 414.
That is, for convenience of moulding technology demoulding and prevent stray light, 41211 shape of photosensitive element engaging portion
At structure be first part's inner surface 41231 for defining of its inner surface with relatively small slope inclination from described photosensitive
Element 413 upwardly extends, and the second part inner surface 41232 that the inner surface of the top side extension 41212 defines is from institute
It states the turnover of first part's inner surface 41231 ground integrally to extend, and with relatively large slope or without slope upwardly extends,
It is formd between the second part inner surface 41232 and first part's inner surface 41231 of the i.e. described molded base 412
Angle can effectively increase the top table of the molded base 412 to tilt upward extension relative to fixed slope
The area size in face 4124.It is understood that the inner surface that the circular direction of the molded base 412 extends can all have
Above-mentioned first part's inner surface 41231 and above-mentioned second part inner surface 41232, these first part's inner surfaces 41231 can be with
Angle α is identical, can also be different.These second part inner surfaces 41232 can be identical with angle β, can also be different.
As shown in figure 36b, first part's inner surface that the inner surface of the photosensitive element engaging portion 41211 defines
Angle between 41231 and the optical axis X of the camera module 400 is α, what the inner surface of the top side extension 41212 defined
Angle between the second part inner surface 41232 and the optical axis X of the camera module 400 is β, wherein the numberical range of α
It is 3 °~80 °, the numberical range of β is 0 °~10 °, and α > β.
That is, the second part inner surface 41232 that the inner surface of the top side extension 41212 defines and institute
State the institute that the angle β between the optical axis X of camera module 400 is defined relative to the inner surface of the photosensitive element engaging portion 41211
The angle α stated between first part's inner surface 41231 and the optical axis X of the camera module 400 has smaller angle, to make
The second part inner surface 41232 of the top side extension 41212 is obtained with bigger slope or along perpendicular to described photosensitive
It upwardly extends to the direction of element 413, to increase the area of the top surface 4124 of the molded base 412, reduces institute
The area of filter element is stated, and reduces a possibility that moulding material 416 generates " overlap " in moulding technology.
As shown in figure 36b, in this preferred embodiment of the invention, it is preferable that the photosensitive element engaging portion 41211
Thickness H1 numberical range be 0.05 millimeter~0.7 millimeter, the thickness H2 numberical range of the top side extension 41212 is 0.02
Millimeter~0.6 millimeter.
In addition, the filter element 414 is being provided with the light shield layer 4142 and the top side light shield layer 4143, such as Figure 37
Shown in, the part spurious rays L31 of 4141 upper surface of filter element main body of the filter element 414 is incident to by institute
The absorption of top side light shield layer 4143 is stated, to play the purpose for stopping a part of stray light.
When another part stray light L32 pass through the filter element main body 4141 the effective light transmission region 41411 and
It, can be by inclined first part's inner surface of the molded base 412 when being incident to first part's inner surface 41231
41231 reflex to the light shield layer 4142 upwards or are further further reflexed to by the second part inner surface 41232
The light shield layer 4142, to be absorbed by the light shield layer 4142, so that the photosensitive member will not be reached further by reflection
Part 413 influences the image quality of the camera module 400.
Correspondingly, the light shield layer 4142 and the filter element bracket 417 are located at the interior table below the filter element
Face 41702 is adjoining, and the filter element bracket 417 is located at the inner surface 41702 below the filter element from the shading
Layer 4142 extends downwardly, and in the light shield layer 4142, the filter element bracket 417 is located at below the filter element
Inner surface 41702, between first part's inner surface 41231 and second part inner surface 41232, the optical window 4122
Exterior portion forms a suppression light slot 41221, and the suppression light slot 41221 is the space for being used to restrain stray light injection.More
Body, as shown in figure 37, stray light L32 enters among the suppression light slot 41221, thus cannot be in the suppression light slot 41221
It projects.
As shown in Figure 38, a variant embodiment of above-mentioned 4th preferred embodiment according to the present invention, it is described
412 top side of molded base is formed with top side groove 4125, and the filter element bracket 417 is assembled in the top side groove 4125,
So that its position moves down, and the camera lens 430 can be assembled in 412 top side of molded base.The i.e. described molded base 412
Extend the top surface 4124 increased for assembling the filter element bracket 417 and the camera lens 430 by multisection type.
It is the camera module 400 of the 5th preferred embodiment according to the present invention, structure as shown in Figure 39 to Figure 41
Similar with above-mentioned 4th preferred embodiment, the camera module 400 includes a photosensory assembly 410 and a camera lens 430.The mirror
First 430, which are assembled in the photosensory assembly, forms a fixed-focus camera module.It is understood that in other variant embodiment
In, the camera lens, which also can be set, forms a lens assembly in a driver or a fixed lens barrel, the lens assembly assembling
In the photosensory assembly.
Accordingly, the photosensory assembly 410 include a circuit board 411, a molded base 412, a photosensitive element 413, one
Filter element 414 and a filter element bracket 417, the molded base 412 includes a Base body 4121, integrally formed
In the circuit board 411 and the photosensitive element 413 and an optical window 4122 is formed, the optical window 4122 is an enclosure space, and
And passage of light is provided to the photosensitive element 413.The molded base 412 includes the sense around the optical window 4122
Optical element engaging portion 41211 and a top side extension 41212 extend in multisection type, and inner surface 41231 and 41232 point
It does not extend in different directions, for reducing the area of stray light with the top surface 4124 for increasing the molded base 412.
The filter element bracket 417 is assembled in the molded base 412, and windowing 4171 and a bottom with top side
Side mounting groove 4173, the filter element 414 are assembled in the bottom side mounting groove 4173 in a manner of losing money instead of making money.The filter element
414 include a filter element main body 4141 and a light shield layer 4142, and the light shield layer 4142 is set to the filter element main body
4141 bottom side.Reduce the stray light for reaching the photosensitive element 413 to which similarly, the light shield layer 4142 can play
Effect.
In addition, the camera lens 430 includes load-bearing part 431 and the one or more eyeglasses for being assembled in the load-bearing part 431
432, wherein because of 414 upside-down mounting of filter element in the filter element bracket 417, so that the filter element 414 will not
It is raised in 417 upper surface of filter element bracket, most bottom side in one or more of eyeglasses 432 of the camera lens 430
Eyeglass can be moved down so that position is opposite, to reduce the distance between described photosensitive element 413, so as to reduce the camera shooting
The back focal length of mould group 400.
The filter element 414 is when bottom side is provided with the light shield layer 4142, as shown in Figure 41, is incident to the filter
The part spurious rays L41 of 417 upper surface of optical element bracket is reflected without the optical window into the molded base 412
4122, to play the purpose for stopping a part of stray light.
When another part stray light L42 pass through the filter element main body 4141 the effective light transmission region 41411 and
It, can be by inclined first part's inner surface of the molded base 412 when being incident to first part's inner surface 41231
41231 reflex to the light shield layer 4142 upwards or are further further reflexed to by the second part inner surface 41232
The light shield layer 4142, to be absorbed by the light shield layer 4142, so that the photosensitive member will not be reached further by reflection
Part 413 influences the image quality of the camera module 400.
Correspondingly, the second part inner surface 41232 of the light shield layer 4142 and the molded base 412 is adjacent
Closely, the second part inner surface 41232 of the molded base 412 is extended downwardly from the light shield layer 4142, and in institute
Light shield layer 4142 is stated, between first part's inner surface 41231 and second part inner surface 41232, the optical window 4122
Exterior portion forms a suppression light slot 41221, and the suppression light slot 41221 is the space for being used to restrain stray light injection.More
Body, as shown in figure 41, stray light L42 enters among the suppression light slot 41221, thus cannot be in the suppression light slot 41221
It projects.
And, it is understood that because in the second part of the light shield layer 4142 and the molded base 412
Surface 41232, so that the light shield layer 4142, which is effectively reduced, reaches described second across the filter element main body 4141
The light of portion inner surface 41232, so that the light for being incident to the second part inner surface 41232 be avoided to be reached by reflection
The photosensitive element 413 forms stray light and influences the image quality of the camera module 400.
As shown in figure 42, another variant embodiment of above-mentioned 5th embodiment according to the present invention, the company
415 routing direction of wiring be from the circuit board 411 to the photosensitive element 413, thus make optical window described in moulding technology at
Type portion 4214 does not need the avoiding space provided to the connecting line 415 as far as possible, and has the top side extension 41212
Compared with big height, to increase the area of the top surface 4124 of the molded base 412.
In addition, 417 top side of filter element bracket forms a windowing 4171,417 top side portion of filter element bracket
Divide 4174 length to extend internally that can be greater than or equal to the length that the light shield layer 4142 extends internally, in this way, the windowing
4171 area can be not more than the area of the passage of light 41420, and 417 top surface of filter element bracket described in this way plays
The effect for stopping a part of stray light L51, without the top side light shield layer is arranged in 414 top side of filter element
4143.Stray light L52 can be absorbed by the light shield layer 4142.
As shown in figure 43, another variant embodiment of above-mentioned 5th embodiment according to the present invention, the sense
Optical assembly 410 includes a circuit board 411, a molded base 412, a photosensitive element 413, a filter element 414, a filter element
Bracket 417 and a gear frame 418.The molded base 412 and the circuit board, the photosensitive element 413 and the gear frame 418 1
Body combines, and the filter element 414 is assembled in the filter element bracket 417, and the filter element bracket 417 is assembled in described
The top side of molded base 412.The light shield layer 4142 of the filter element 414, it is similar with above-mentioned third preferred embodiment,
It is set to the bottom side of its filter element main body 142, can play the role of reducing stray light.
The gear frame 418 of annular is arranged on the photosensitive element 413, for making the optical window in moulding technology
Forming part 4214 is pressed on the gear frame 418, prevents the moulding material 416 of fluid from flowing into the photosensitive element 413
The photosensitive area 4131, wherein the molded base 412 is shaped in the circuit board, the photosensitive element 413 and described
Frame 418 is kept off, the gear frame 418 can be glue in preferred embodiment, can have predetermined elasticity, as elasticity modulus range is
0.1Gpa-1Gpa。
One Base body 4121 of the molded base 412 includes the photosensitive element knot around the optical window 4122
Photosensitive element 413 weeks described in conjunction portion 41211 and a top side extension 41212 and 41211 bottom side of photosensitive element engaging portion
Enclose the circuit board engaging portion 41213 with 411 top side of circuit board.The photosensitive element engaging portion 41211 integrally combines
In the circuit board 411, the photosensitive element 413 and the gear frame 418, and have from the gear frame 418 inclination extension
First part's inner surface 41231, the top side extension 41212 has to be prolonged with turning to from first part's inner surface 41231
The second part inner surface 41232 stretched, so that such structure makes the reflective work of inclined first part's inner surface 41231
With stray light can be reduced, the top surface that the second part surface 1232 that ground extends makes the top side extension 41212 is turned to
With bigger mounting area, reduce the area of the filter element 414, and avoids the moulding material 416 in moulding technology
It is middle to form " overlap, and the angle between two parts inner surface and optical axis X is similar with previous embodiment.It is understood that this
The gear frame 418 of a embodiment can also be applied in the other embodiment of the present invention.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating
And it is not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention exists
It shows and illustrates in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (55)
1. the manufacturing method of the photosensory assembly of a camera module comprising following steps:
(a) fix one second mold that a multiple-printed-panel for circuit board has in a molding, wherein the multiple-printed-panel for circuit board include one column or
Multiple row circuit board, each column circuit board include one or more circuit boards being arranged side by side, and each circuit board includes combining
A rigid region and a flexible region, and each circuit board can place of working be connected with a photosensitive element；
(b) second mold and one first mold are molded, fills the moulding material of fusing in the base in the molding die
In seat jigsaw profiled guide slot, wherein the position for corresponding to an at least optical window forming part is prevented from filling the moulding material；And
(c) solidify the moulding material in the pedestal jigsaw profiled guide slot to lead corresponding to pedestal jigsaw molding
The position of slot forms disjunctor molded base, wherein the disjunctor molded base is shaped in described in the one or more columns per page corresponded to
Photosensitive element described in circuit board and one or more columns per page is to form photosensory assembly jigsaw and in the position for corresponding to the optical window forming part
The optical window that each photosensitive element offer passage of light is provided is set, is corresponded to wherein the pedestal jigsaw profiled guide slot has
The disjunctor molded base molds base adjacent to the first diversion trench of the first end side of the flexible region and corresponding to the disjunctor
Second diversion trench of the seat far from the flexible region, and extend between first diversion trench and second diversion trench
Multiple filling slots, wherein first diversion trench has towards the first side surface of the optical window, second diversion trench has
Towards the second side surface of the optical window, wherein first side surface includes the first part of neighbouring photosensitive element setting
There is the neighbouring photosensitive element to set for surface and the second part surface being connected with first part surface, second side surface
The Part III surface set and the Part IV surface being connected with Part III surface, wherein the first part surface is opposite
It is greater than second angle of the second part surface relative to the optical axis in the first angle of the optical axis of camera module, and described
Part III surface is greater than the 4th of the Part IV surface relative to the optical axis relative to the third angle of the optical axis
Angle.
2. according to the method described in claim 1, further comprising the steps of: the cutting photosensory assembly jigsaw to obtain multiple photosensitive groups
Part, wherein each photosensory assembly includes the circuit board, the photosensitive element and the molded base, wherein the molding
Pedestal is integrally formed in the circuit board and the photosensitive element and to be formed as the photosensitive element and provides the institute of passage of light
State optical window.
3. according to the method described in claim 1, wherein the first angle and the third angle are 3 °~80 °.
4. according to the method described in claim 1, wherein the second angle and fourth angle are 0 °~20 °.
5. according to claim 1 to any method in 4, wherein the first part surface and Part III surface point
The first height and third height not in the direction perpendicular to the photosensitive member surface are 0.05 millimeter~0.7 millimeter.
6. according to claim 1 to any method in 4, wherein the second part surface and Part IV surface difference
It is 0.02 millimeter~0.6 millimeter in second height in the direction perpendicular to the photosensitive member surface and the 4th height.
7. according to claim 1 to any method in 4, wherein first diversion trench bottom end width is 0.2 millimeter~1
Millimeter.
8. according to claim 1 to any method in 4, wherein the disjunctor molded base is integrally formed in a column institute
State circuit board and a column photosensitive element；Or the disjunctor molded base is shaped in the two adjacent column circuit boards
With the adjacent two column photosensitive elements, wherein the adjacent circuit board layout of two column at its flexible region away from each other
And its rigid region is mutually adjacently.
9. the photosensory assembly of a camera module characterized by comprising
One circuit board comprising the rigid region and a flexible region combined；
One photosensitive element；And
One molded base, wherein the molded base is integrally formed in the circuit board and the photosensitive element and to be formed as institute
It states photosensitive element and one optical window of passage of light is provided；Wherein correspond to the molded base adjacent to the first end of the flexible region
Side has towards the first side surface of optical window, and first side surface includes first part's table of neighbouring photosensitive element setting
Face and the second part surface being connected with first part surface, and the first part surface is relative to the camera module
The first angle of optical axis is greater than second angle of the second part surface relative to the optical axis；Corresponding to the molded base
The second opposite end side far from the flexible region has towards the second side surface of optical window, and second side surface includes neighbour
The Part III surface of the nearly photosensitive element setting and the Part IV surface being connected with Part III surface, and described the
Three parts surface is greater than fourth angle of the Part IV surface relative to the optical axis relative to the third angle of the optical axis
Degree.
10. photosensory assembly according to claim 9, wherein the first angle and the third angle are 3 °~80 °.
11. photosensory assembly according to claim 9, wherein the second angle and fourth angle are 0 °~20 °.
12. according to the photosensory assembly any in claim 9 to 11, wherein the first part surface and Part III table
First height and third height of the face respectively in the direction perpendicular to the photosensitive member surface are 0.05 millimeter~0.7 millimeter.
13. according to the photosensory assembly any in claim 9 to 11, wherein the second part surface and Part IV table
Face is respectively 0.02 millimeter~0.6 millimeter in second height in the direction perpendicular to the photosensitive member surface and the 4th height.
14. according to the photosensory assembly any in claim 9 to 11, the molded base adjacent to the flexible region the
The part of one end, the distance between inner edges and outer edge are 0.2 millimeter~1 millimeter.
15. the photosensory assembly jigsaw of a camera module characterized by comprising
One or more columns per page circuit board, each column circuit board include one or more circuit boards being arranged side by side, each circuit board
Including the rigid region and flexible region combined；
One or more columns per page photosensitive element；And
One or more disjunctor molded bases, each disjunctor molded base are integrally formed in the column circuit board and one
It arranges the photosensitive element and is formed as each photosensitive element and the optical window of passage of light is provided；Wherein correspond to the disjunctor mould
Moulding pedestal has adjacent to the first end side of the flexible region towards the first side surface of optical window, and first side surface includes neighbour
The first part surface of the nearly photosensitive element setting and the second part surface being connected with first part surface, and described the
A part of surface is greater than the second part surface relative to the light relative to the first angle of the optical axis of the camera module
The second angle of axis；Have far from the second opposite end side of the flexible region towards light corresponding to the disjunctor molded base
Second side surface of window, second side surface include neighbouring photosensitive element setting Part III surface and with third portion
The Part IV surface that point surface is connected, and the Part III surface be greater than relative to the third angle of the optical axis it is described
Fourth angle of the Part IV surface relative to the optical axis.
16. photosensory assembly jigsaw according to claim 15, wherein the first angle and the third angle be 3 °~
80°。
17. photosensory assembly jigsaw according to claim 15, wherein the second angle and fourth angle are 0 °~20 °.
18. any photosensory assembly jigsaw in 5 to 17 according to claim 1, wherein the first part surface and third
First height and third height of the part of the surface respectively in the direction perpendicular to the photosensitive member surface are 0.05 millimeter~0.7
Millimeter.
19. any photosensory assembly jigsaw in 5 to 17 according to claim 1, wherein the second part surface and the 4th
Part of the surface is respectively 0.02 millimeter~0.6 in second height in the direction perpendicular to the photosensitive member surface and the 4th height
Millimeter.
20. the photosensory assembly jigsaw of a camera module characterized by comprising
Multiple row circuit board, each column circuit board include one or more circuit boards being arranged side by side, and each circuit board includes phase
In conjunction with rigid region and flexible region；
Multiple row photosensitive element；And
One or more disjunctor molded bases, each disjunctor molded base are integrally formed in the adjacent circuit of two column
Plate and two arranges the adjacent photosensitive element and is formed as the optical window of each photosensitive element offer passage of light, and described
The two adjacent circuit board layouts of column at its flexible region away from each other and its rigid region is mutually adjacently, make each company
Body molded base has two end sides of the neighbouring flexible region；Wherein correspond to the disjunctor molded base adjacent to described soft
Property region the first end side have towards the first side surface of optical window, first side surface includes that the neighbouring photosensitive element is set
The first part surface set and the second part surface being connected with first part surface, and the first part surface relative to
The first angle of the optical axis of the camera module is greater than second angle of the second part surface relative to the optical axis；It is described
The second end side that disjunctor molded base extends between the adjacent photosensitive element of two column has towards optical window
Second side surface, second side surface include neighbouring photosensitive element setting Part III surface and with Part III table
The Part IV surface that face is connected, and the Part III surface is greater than the described 4th relative to the third angle of the optical axis
Fourth angle of the part of the surface relative to the optical axis.
21. photosensory assembly jigsaw according to claim 20, wherein the first angle and the third angle be 3 °~
80°。
22. photosensory assembly jigsaw according to claim 20, wherein the second angle and fourth angle are 0 °~20 °.
23. according to the photosensory assembly jigsaw any in claim 20 to 22, wherein the first part surface and third
First height and third height of the part of the surface respectively in the direction perpendicular to the photosensitive member surface are 0.05 millimeter~0.7
Millimeter.
24. according to the photosensory assembly jigsaw any in claim 20 to 22, wherein the second part surface and the 4th
Part of the surface is respectively 0.02 millimeter~0.6 in second height in the direction perpendicular to the photosensitive member surface and the 4th height
Millimeter.
25. a camera module characterized by comprising
One camera lens；
One circuit board comprising the rigid region and a flexible region combined；
One photosensitive element；And
One molded base, wherein the molded base is integrally formed in the circuit board and the photosensitive element and to be formed as institute
It states photosensitive element and one optical window of passage of light is provided, wherein the camera lens is located at the photosensitive path of the photosensitive element；It is wherein right
Molded base described in Ying Yu has adjacent to the first end side of the flexible region towards the first side surface of optical window, first side
Surface includes the first part surface of neighbouring photosensitive element setting and the second part table that is connected with first part surface
Face, and the first part surface is greater than the second part surface relative to the light relative to the first angle of the optical axis
The second angle of axis；Have far from the second opposite end side of the flexible region towards optical window corresponding to the molded base
Second side surface, second side surface include neighbouring photosensitive element setting Part III surface and with Part III table
The Part IV surface that face is connected, and the Part III surface is greater than the described 4th relative to the third angle of the optical axis
Fourth angle of the part of the surface relative to the optical axis.
26. camera module according to claim 25, wherein the first angle and the third angle are 3 °~80 °.
27. camera module according to claim 25, wherein the second angle and fourth angle are 0 °~20 °.
28. according to the camera module any in claim 25 to 27, wherein the first part surface and Part III
First height and third height of the surface respectively in the direction perpendicular to the photosensitive member surface are 0.05 millimeter -0.7 millimeter.
29. according to the camera module any in claim 25 to 27, wherein the second part surface and Part IV
Surface is respectively 0.02 millimeter~0.6 milli in second height in the direction perpendicular to the photosensitive member surface and the 4th height
Rice.
30. a molding have, with make be applied to camera module photosensory assembly jigsaw comprising be suitable for mutually separate and Xiang Mihe
One first mold and one second mold, wherein first and second mold forms a forming cavity, and institute when mutually closely sealed
Molding die is stated to be located at around the optical window forming part in the forming cavity configured with an at least optical window forming part and formation
It is suitable for fixing circuit board jigsaw in one pedestal jigsaw profiled guide slot and the forming cavity, wherein the multiple-printed-panel for circuit board includes a column
Or multiple row circuit board, each column circuit board include one or more circuit boards being arranged side by side, each circuit board includes combining
A rigid region and a flexible region, and each circuit board can place of working be connected with a photosensitive element, the pedestal is spelled
Sheet metal forming guide groove is suitable for filling the moulding material to form disjunctor mould in the position for corresponding to the pedestal jigsaw profiled guide slot
Pedestal is moulded, wherein the disjunctor molded base is shaped in each column circuit board corresponded to and each column photosensitive element to be formed
The photosensory assembly jigsaw is simultaneously formed as each photosensitive element offer passage of light in the position for corresponding to the optical window forming part
Optical window, wherein the pedestal jigsaw profiled guide slot have correspond to the disjunctor molded base adjacent to the flexible region first end
First diversion trench of side and the second diversion trench corresponding to the disjunctor molded base far from the flexible region, and extend in described
Multiple filling slots between first diversion trench and second diversion trench, wherein each optical window forming part is in adjacent two
Between a filling slot, wherein first diversion trench has towards the first side surface of the optical window, second water conservancy diversion
Slot has towards the second side surface of the optical window, wherein first side surface includes the of neighbouring photosensitive element setting
A part of surface and the second part surface being connected with first part surface, second side surface have neighbouring described photosensitive
The Part III surface of element setting and the Part IV surface being connected with Part III surface, wherein first part's table
Face is greater than second angle of the second part surface relative to the optical axis relative to the first angle of the optical axis, and described
Part III surface is greater than the 4th of the Part IV surface relative to the optical axis relative to the third angle of the optical axis
Angle.
31. a molding have, with make be applied to camera module photosensory assembly jigsaw comprising be suitable for mutually separate and Xiang Mihe
One first mold and one second mold, wherein first and second mold forms a forming cavity, and institute when mutually closely sealed
Molding die is stated to be located at around the optical window forming part in the forming cavity configured with an at least optical window forming part and formation
It is suitable for fixing circuit board jigsaw in one pedestal jigsaw profiled guide slot and the forming cavity, wherein the multiple-printed-panel for circuit board includes multiple row
Circuit board, each column circuit board include one or more circuit board being arranged side by side, each circuit board be include one combined
Rigid region and a flexible region, and each circuit board can place of working be connected with a photosensitive element, wherein the pedestal spell
Sheet metal forming guide groove is suitable for filling moulding material to form disjunctor molding in the position for corresponding to the pedestal jigsaw profiled guide slot
Pedestal, wherein the disjunctor molded base, which is shaped in adjacent two and arranges the circuit board and adjacent two, arranges the photosensitive element with shape
It is logical to be formed as each photosensitive element offer light at the photosensory assembly jigsaw and in the position for corresponding to the optical window forming part
The optical window on road, wherein the adjacent circuit board layout of two column at its flexible region away from each other and its rigid region is mutually adjacent
Closely, wherein the pedestal jigsaw profiled guide slot, which has, corresponds to the disjunctor molded base adjacent to two end sides of the flexible region
Second diversion trench in the region between two the first diversion trenches and the photosensitive element adjacent corresponding to two column, and extend in
Multiple filling slots between two first diversion trenches and second diversion trench, wherein each optical window forming part in
Between two adjacent filling slots, wherein first diversion trench has towards the first side surface of the optical window, it is described
Second diversion trench has towards the second side surface of the optical window, wherein first side surface includes the neighbouring photosensitive element
The first part surface of setting and the second part surface being connected with first part surface, second side surface have neighbouring
The Part III surface of photosensitive element setting and the Part IV surface being connected with Part III surface, wherein described the
A part of surface is greater than second jiao of the second part surface relative to the optical axis relative to the first angle of the optical axis
Degree, and the Part III surface is greater than the Part IV surface relative to the light relative to the third angle of the optical axis
The fourth angle of axis.
32. a photosensory assembly characterized by comprising
One circuit board；
One photosensitive element, the photosensitive element are operatively connected to the circuit board；With
One molded base, the molded base are integrally incorporated into the circuit board and the photosensitive element and form an optical window,
Wherein the molded base has one or more first part's inner surfaces of the neighbouring photosensitive element and far from described photosensitive
The one or more second part inner surfaces for being connected to first part's inner surface of element, wherein table in the first part
There is angle α between face and the optical axis of the photosensory assembly, the optical axis of the second part inner surface and the photosensory assembly it
Between there is angle β, wherein β < α.
33. photosensory assembly according to claim 32, wherein the numberical range of α is 3 °~80 °, the numerical value model of β is 0 °~
20°。
34. photosensory assembly according to claim 32, wherein molded base includes one photosensitive around the optical window
Element engaging portion and a top side extension, the inner surface definition that the photosensitive element engaging portion integrally extends from the photosensitive element
First part's inner surface, the top side extension integrally extend the photosensitive element engaging portion and its surface and define
The second part inner surface, the second part inner surface integrally extend first part's inner surface.
35. photosensory assembly according to claim 33, wherein the numberical range of α is 3 °~80 °, the numerical value of β is 0 °~
20°。
36. photosensory assembly according to claim 34, wherein the numerical value of β is 0 °, correspondingly the photosensitive element engaging portion
It is a vertical stretch.
37. photosensory assembly according to claim 34, wherein the top side extension thickness range is 0.02 millimeter~0.6
Millimeter, photosensitive element engaging portion thickness range are 0.05 millimeter~0.7 millimeter.
38. according to the photosensory assembly any in claim 34 to 37, wherein the molded base further includes a circuit board
Engaging portion, the photosensitive element engaging portion integrally from the circuit board engaging portion extend and be located at the top side extension and
Between the circuit board engaging portion, the circuit board engaging portion is integrated in the circuit board and is located at the photosensitive element
Around.
39. it further include a filter element according to the photosensory assembly any in claim 34 to 37, the filter element patch
Top side loaded on the molded base.
40. photosensory assembly according to claim 39, wherein the filter element includes a filter element main body and setting
An at least at least light shield layer for side in the top side and bottom side of the filter element main body.
41. further including a filter element and a filter element branch according to the photosensory assembly any in claim 32 to 37
Frame, the filter element are assembled in the filter element bracket, wherein the filter element bracket is mounted on the molded base
Top side.
42. photosensory assembly according to claim 41, wherein the filter element includes filter element main body and is set to
An at least at least light shield layer for side in the top side and bottom side of the filter element main body.
43. photosensory assembly according to claim 41, wherein the filter element bracket has a top side mounting groove, it is described
Filter element is assembled in the top side mounting groove of the filter element bracket；Or the filter element bracket has a bottom side
Mounting groove, the filter element are assembled in the bottom side mounting groove of the filter element bracket.
44. according to the photosensory assembly any in claim 32 to 37, wherein first part's inner surface and described the
The distance between the position of two portion inner surface integrally connecteds and the optical axis of the photosensory assembly are less than the one of the photosensitive element
The distance between the optical axis of outer edge and the photosensory assembly.
45. according to the photosensory assembly any in claim 32 to 37, wherein the circuit board further includes multiple electronics members
Device, the electronic component are located at at least side in the top side and bottom side of the circuit board.
46. according to the photosensory assembly any in claim 32 to 37, wherein the circuit board further includes being located at its bottom side
Multiple electronic components, the photosensory assembly includes the bottom side molded section positioned at the circuit board bottom side, described in embedding
Electronic component.
47. according to the photosensory assembly any in claim 32 to 37, wherein the circuit board and the photosensitive element are logical
It crosses a series of connecting lines to be connected, a series of connecting lines are embedded by the molded base, wherein the circuit board and described
The direction that routing connects between photosensitive element is from the circuit board to the photosensitive element；Or the circuit board and the sense
The direction that routing connects between optical element is from the photosensitive element to the circuit board.
48. photosensory assembly according to claim 47, wherein table in first part's inner surface and the second part
The position that face is connected is located at the inside of the connecting line.
49. a camera module, including a camera lens and according to the photosensory assembly any in claim 32 to 48.
50. an electronic equipment, electronic equipment, which is characterized in that including an equipment body and the root for being installed on the equipment body
According to the one or more camera module any in claim 25 to 29 and 49, wherein the electronic equipment is selected from hand
Mechanical, electrical brain, television set, intelligence can screw on one of equipment, the vehicles, camera and monitoring device.
51. a molding has, to make at least photosensory assembly for being applied to camera module, the photosensory assembly includes a circuit
Plate, a photosensitive element and a molded base, wherein the molded base is integrally formed in the circuit board and the photosensitive member
Part simultaneously forms an optical window, which is characterized in that the molding die includes being suitable for mutually separating and the first mutually closely sealed mold and second
Mold, and interior form configured with an at least optical window forming part and the pedestal formed around the optical window forming part is led
Slot, the circuit board for being connected with the photosensitive element is placed in the molding die and first and second mold is mutually close
When conjunction, by the moulding material of a fusing be filled into the pedestal profiled guide slot and it is cured after form the molded base, it is corresponding
The position of the optical window forming part forms the optical window, wherein the optical window forming part has at least one from bottom side towards top side direction
First part outer surface and at least a second part outer surface form folder between the optical axis perpendicular to the photosensitive element respectively
Angle α and β, and α > β.
52. molding die according to claim 51, wherein the numberical range of α is 3 °~80 °, the numberical range of β is 0 °
~20 °.
53. molding die according to claim 52, the optical window forming part has the bottom side forming part integrally extended
With a top side forming part, the inner surface of the bottom side forming part defines first part's inner surface, the top side forming part
Inner surface defines the second part inner surface.
54. molding die according to claim 53, wherein the bottom side forming part thickness range is 0.05 millimeter~0.7
Millimeter.
55. the plurality of pedestal profiled guide slot is integrally according to the molding die any in claim 51 to 54
It is connected, and there are multiple optical window forming parts in the molding die, by photosensitive for making this in a manner of jigsaw
Component.
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710895910.4A CN109585464B (en) | 2017-09-28 | 2017-09-28 | Image pickup module, photosensitive assembly thereof and manufacturing method |
| TW107132528A TWI734028B (en) | 2017-09-28 | 2018-09-14 | Camera module, photosensitive component, penalization of photosensitive component, mold of the penalization and manufacturing method |
| CN202111364368.2A CN113823653B (en) | 2017-09-28 | 2018-09-19 | Photosensitive assembly and camera module |
| EP23165371.8A EP4220724A3 (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive assembly, photosensitive assembly jointed panel, and molding die thereof and manufacturing method thereof |
| US16/651,455 US11315967B2 (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof |
| EP18861568.6A EP3691241B1 (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof |
| JP2020517882A JP7042335B2 (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive assembly, photosensitive assembly joint panel, and its molding mold and manufacturing method. |
| PCT/CN2018/106351 WO2019062609A1 (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof |
| KR1020207009642A KR102320910B1 (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive assembly, photosensitive assembly alignment plate, forming die and manufacturing method thereof |
| CN201880056738.6A CN111133742B (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive assembly splicing plate, forming mold and manufacturing method thereof |
| US17/707,051 US11664397B2 (en) | 2017-09-28 | 2022-03-29 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof |
| US18/136,604 US11881491B2 (en) | 2017-09-28 | 2023-04-19 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710895910.4A CN109585464B (en) | 2017-09-28 | 2017-09-28 | Image pickup module, photosensitive assembly thereof and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109585464A true CN109585464A (en) | 2019-04-05 |
| CN109585464B CN109585464B (en) | 2024-10-15 |
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| CN201710895910.4A Active CN109585464B (en) | 2017-09-28 | 2017-09-28 | Image pickup module, photosensitive assembly thereof and manufacturing method |
| CN201880056738.6A Active CN111133742B (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive assembly splicing plate, forming mold and manufacturing method thereof |
| CN202111364368.2A Active CN113823653B (en) | 2017-09-28 | 2018-09-19 | Photosensitive assembly and camera module |
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| CN201880056738.6A Active CN111133742B (en) | 2017-09-28 | 2018-09-19 | Camera module, photosensitive assembly splicing plate, forming mold and manufacturing method thereof |
| CN202111364368.2A Active CN113823653B (en) | 2017-09-28 | 2018-09-19 | Photosensitive assembly and camera module |
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Also Published As
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| CN109585464B (en) | 2024-10-15 |
| CN111133742A (en) | 2020-05-08 |
| CN113823653B (en) | 2024-06-14 |
| CN113823653A (en) | 2021-12-21 |
| CN111133742B (en) | 2021-10-19 |
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