KR102320910B1 - Camera module, photosensitive assembly, photosensitive assembly alignment plate, forming die and manufacturing method thereof - Google Patents

Abstract

The present invention provides a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the photosensitive assembly includes a circuit board, a photosensitive element and a molding base, wherein the molding base is integrally molded with the circuit board and the photosensitive element to form an optical window wherein a first end side corresponding to the flexible region adjacent to the molding base has a first side surface facing the optical window, the first side surface having a first partial surface provided adjacent the photosensitive element and a first side surface a second partial surface connected to the partial surface, wherein a first angle of the first partial surface with respect to the optical axis of the camera module is greater than a second angle of the second partial surface with respect to the optical axis of the second partial surface in the flexible region remote from the molding base A corresponding opposite second end side has a second side surface facing the optical window, the second side surface comprising a third partial surface disposed adjacent the photosensitive element and a fourth partial surface connected to the third partial surface; A third angle with respect to the optical axis of the third partial surface is greater than a fourth angle with respect to the optical axis of the fourth partial surface.

Description

Camera module, photosensitive assembly, photosensitive assembly alignment plate, forming die and manufacturing method thereof

The present invention relates to the field of camera modules, and more particularly, to a photosensitive assembly manufactured by a molding process, a photosensitive assembly fitting plate, a manufacturing method thereof, and a camera module including the photosensitive assembly.

The molding packaging technology of the camera module is a newly developed packaging technology based on the existing COB packaging. 1A to 1C, it is a track board packaged using a conventional integrated packaging technology. In the case of this structure, the packaging unit 1 is packaged in the track plate 2 and the photosensitive chip 3 by an integrated packaging method to form an integrated packaging assembly, and the packaging unit 1 is the A plurality of electronic components 201 and a series of conductive wires 202 electrically connected to the photosensitive chip 3 and the track plate 2 are wrapped, thereby reducing the length, width, and thickness of the camera module and reducing assembly errors. and the lens or the lens assembly above the integrated packaging assembly can be installed flat, so that the dust attached to the electronic component affects the image quality of the camera module.

More specifically, as shown in FIGS. 1A and 1B , in order to improve production efficiency, the integrated packaging assembly is generally produced by a custom plate production method, that is, a plurality of the integrated packaging assemblies are produced at a time. More specifically, Figures 1A and 1B illustrate the production of the integral packaging assembly from a custom plate using a forming die. wherein the forming die includes an upper die 101 and a lower die 102, wherein the track plate fit plate is placed in the lower die 102 of the forming die, and the track plate fit plate holds a plurality of rows of circuit boards. Each of the line boards includes a plurality of line boards 2 , and the photosensitive chips 3 are connected to each line board 2 to be able to work. The upper die 101 and the lower die 102 are joined together to form a forming cavity, through which the upper die 101 is pressed onto the track plate fitting plate and joined, and the photosensitive chips ( 3), two flow channels 103 and 104 are formed in the upper die, and the upper die 101 has a plurality of bumps 105, and the two adjacent bumps are adjacent to each other. An intermediate flow channel 106 is formed between the 105 and the plurality of intermediate flow channels 106 extend between the two flow channels 103 and 104 .

In the molding process, the flowable packaging material 4 flows forward along the two flow channels 103 and 104 and fills up to the intermediate flow channel 106 between the two bumps 105 adjacent to each other. Since the area between the two photosensitive chips 3 is also filled with the packaging material 4 , the packaging material 4 is then cured on the corresponding each of the track board 2 and each of the photosensitive chips 3 after curing. The packaging unit 1 may be formed, and an optical window positioned in the middle of the packaging unit 1 is formed at a position corresponding to each of the bumps 105 , and the packaging unit 1 is integrally molded to form a connection type. A structure is formed, as shown in Figure 1C.

Referring to FIG. 1E , the thermosetting packaging material 4 has a curing time T in the molding process, and as time passes, its viscosity first decreases to the lowest point, and then gradually rises to the highest point to be completely cured. An ideal situation is that the packaging material 4 fills the flow channels 103 and 104 when the viscosity value of the packaging material 4 is relatively small, but the viscosity value of the packaging material 4 is relatively large and still forward. In the case of flow, the friction between the track plate 2 and the photosensitive chip 3 with respect to the conductive wire 202 becomes relatively large, which can easily cause deformation and damage to the conductive wire 202 .

In the molding process, the packaging material 4 is a thermosetting material and enters the two flow channels 103 and 104 after melting and is hardened under the action of heating conditions. However, it has been found that, in actual production, when the packaging material 4 flows forward along the two flow channels 103 and 104 during the molding process, the relatively small width of the two flow channels 103 and 104 can cause problems. lost.

More specifically, since the packaging material 4 is a fluid having a predetermined viscosity, both flow channels 103 and 104 are relatively small in size, for example, the flow channel 103 is a relatively narrow flow channel. Since the flow rate in the flow channel 103 is relatively small, and the friction caused by the inner wall of the flow channel 103 on the packaging material 4 of its inner flow type has a relatively large influence on the flow rate, the flow The flow rate of the packaging material 4 in the channel 103 is relatively low. In this way, during the curing time T of the packaging material 4, the packaging material 4 in the flow channel 103 cannot flow from its material supply end to its end within the curing time T The local location of the flow channel 103 may not be filled, and the packaging portion 1 in its complete form is between the upper die 101 and the lower die 102 as in the region S shown in FIG. 1D . It is not possible to form a connection structure having a notch, and the packaging unit 1 may form a notch corresponding to the position of the region S to form an optical window with a closed periphery. In addition, when the width of the flow channel 104 is relatively narrow, the flow channel 104 may also appear in the situation shown in FIG. 1D.

Also, for example, when the velocity at which the packaging material 4 in the flow channel 103 flows forward is too slow and the viscosity is relatively high, the conductive wire ( As the frictional force against the 202 is relatively large, and the conductor 202 is deflected toward the front by a relatively large width, the conductor 202 is easily deformed and damaged and is easily detached from the pad.

As shown in FIG. 1F , this is a camera module packaged using a conventional integrated packaging technology, which includes a packaging unit 1 , a track board 2 , a photosensitive chip 3 , an optical filter 5 and a lens. An assembly 6 is included. In this structure, the packaging unit 1 is packaged in the line board 2 and the photosensitive chip 3 through an integrated packaging method to form an integrated packaging assembly, and the packaging unit 1 is the line A series of electronic components 201 of the plate 2 and a series of conductive wires 202 electrically connected to the photosensitive chip 3 and the line board 2 are wrapped, and the length, width and thickness of the camera module through this It reduces the size and reduces assembly errors, and the lens assembly 6 above the integrated packaging assembly can be installed flat, so that the dust attached to the electronic component 201 affects the image quality of the camera module. solve it

Also, in order to easily peel off the film, the inner surface of the packaging part 1 which is usually formed is integrally and obliquely extended from the photosensitive chip 3, and in this way, the top surface of the packaging part 1 is formed. To reduce the area of , the top of the packaging unit 1 is used to mount an upper optical element of the camera module, for example, a lens assembly 6 or a component such as an additional lens holder. However, the top surface with a relatively small area of the packaging unit 1 may not provide a sufficient surface for mounting the upper optical element of the camera module, and it may not be possible to stably mount the upper optical element of the camera module, and the upper optical element cannot be stably mounted on the mounting surface. This can make it easier for the adhesive to overflow.

In the manufacturing process of the integrated assembly shown in FIG. 1B, the circuit board 201 to which the photosensitive chip 3 is connected is mounted on a die, and a bump 105 is a pressure terminal on the photosensitive chip 3 as a pressure terminal. The flow channels 103, 104 and 106 in the die form a groove 107 substantially surrounding the bump 105, and the packaging material 4 in a fluid state enters the groove 107. After filling and curing, the packaging part 1 is formed, and a through hole of the packaging part 1 is formed at a position corresponding to the bump 105 . The bump 105 has an inclined outer surface 1051 to form the inner surface on which the packaging part 1 integrally extends.

However, in the integrated packaging process, the packaging material in a fluid state enters between the bottom surface of the photosensitive chip 3 and the bump 105 so that the packaging material reaches the photosensitive area of the photosensitive chip 3 and "flashes" it. may be formed, which may affect the photosensitive effect of the photosensitive chip 3 . In addition, a filling groove 1071 is formed on the bottom surface of the groove 107 between the photosensitive chip 3 and the inclined outer surface 1051 of the bump 105, and in the integrated packaging process, the packaging material is The inclined outer surface 1051 of the bump 105 entering the filling groove 1071 and extending at an angle tends to guide the packaging material to enter the filling groove 1071, so that the filling groove 1071 has a relatively large volume, and the packaging material in the fluid form generates a relatively large pressure and compressive strength so that the packaging material is between the photosensitive chip 3 and the bottom surface of the bump 105 . The probability of entering is increased, which may cause the packaging material to contaminate the photosensitive region of the photosensitive chip 3 , thereby affecting the photosensitive performance of the photosensitive chip 3 . Also, if the bumper 105 increases the pressure on the photosensitive chip 3 to reduce the occurrence of "flash", the photosensitive chip 3 may be damaged.

It is an object of the present invention to provide a camera module, a photosensitive assembly thereof, and a manufacturing method thereof, wherein, in the method for manufacturing a custom plate for a photosensitive assembly, a molding material during a molding process fills a guide groove for forming a base fit plate in a forming die to prevent defective products of the photosensitive assembly can be prevented from occurring.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a camera module and a photosensitive assembly and manufacturing method thereof, wherein in a molding process, the molding material may form a connected molding base on a circuit board alignment plate, and the connected molding base is each It is possible to form an optical window closed on all sides at a position corresponding to the photosensitive element, and after shearing the formed connection type photosensitive element fitting plate, a molding base having the optical window is formed on the photosensitive element corresponding to each circuit board. and, thereby, an opening is formed in a part of the molding base to prevent the optical window from communicating to the outside of the molding base.

It is an object of the present invention to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the base fitting plate forming guide groove is used to form the connecting molded base on a circuit board in one row, and two flows on both sides a guide groove and a plurality of filling grooves positioned between the two flow guide grooves and extending in the transverse direction, wherein the molding material flows and hardens in the flow guide groove and the filling groove, wherein the two flow guide grooves The side wall of the guide groove is designed to increase the volume of the flow guide groove, through which the molding material flows forward from the material supply ends of the two flow guide grooves, and the flow guide groove of the entire base fitting plate forming guide groove and The charging groove may be filled.

It is an object of the present invention to provide a camera module, a photosensitive assembly thereof, and a manufacturing method thereof, wherein the base fitting plate forming guide groove forms the connecting molding base on two rows of adjacent circuit boards integrally coupled to a rigid region. and two first flow guide grooves on both sides, a second flow guide groove in the middle, and a plurality of filling grooves respectively positioned between the two first flow guide grooves and the second flow guide groove, The molding material flows and hardens in the flow guide groove and the filling groove, wherein the two side walls of the first flow guide groove and the second flow guide groove are designed to increase the volume of the flow guide groove, Through this, the molding material flows forward from the material supply ends of the two flow guide grooves and fills the flow guide groove and the filling groove of the entire base fitting plate forming guide groove.

It is an object of the present invention to provide a camera module, a photosensitive assembly thereof, and a manufacturing method thereof, wherein, in order to form a miniaturized photosensitive assembly, when the size of the flow guide groove is relatively small, the shape of the sidewall of the flow guide groove is formed in the flow guide groove By designing to increase the volume of the small size of the flow guide groove as described above, even if the width of the bottom end of the first flow guide groove is smaller than 1 mm, the entire base fitting plate forming guide groove is still filled in the molding process.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof and a manufacturing method thereof, wherein the molding material fills the guide groove for forming the base fitting plate before the viscosity of the molding material reaches a relatively high value and hardens. Thus, the connection line between the circuit board and the photosensitive element is prevented from being damaged by a molding material having a relatively high viscosity that flows forward.

An object of the present invention is to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the sidewall of the flow guide groove is designed to increase the volume of the flow guide groove, so that in the molding process, the molding material is each flow guide It can be made to reach from the material feed end of the groove to its end, so that the molding material in a specific flow guide groove is prevented from flowing into another specific flow guide groove to block the forward flow of the molding material in the other specific flow guide groove. .

It is an object of the present invention to provide a camera module and a photosensitive assembly and a manufacturing method thereof, wherein the molding process is one-time to form the connection-type molding base on a first-row circuit board having a plurality of circuit boards and a single-row photosensitive element. Therefore, a plurality of photosensitive assemblies in one row, preferably 2 to 12 photosensitive assemblies, are fabricated and formed through a custom plate process.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the photosensitive assembly comprises a photosensitive element and a molding base integrally molded to a circuit board, wherein the molding base is an integral molding process In the process of forming, since the molding material formed by molding the molding base does not easily enter between the photosensitive element and the bottom surface of the optical window forming part of the molding die to form a "flash", the photosensitive area of the photosensitive element This reduces the chance of contamination.

It is an object of the present invention to provide a camera module and a photosensitive assembly and a manufacturing method thereof, wherein the molding material entering the filling groove by reducing the volume of the filling groove between the photosensitive element and the outer surface of the optical window molding part By lowering the pressure and compressive strength generated by the , the possibility that the molding material will enter between the photosensitive element and the bottom surface of the optical window forming part and form a "flash" is reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the outer surface of the optical window forming part has an outer surface extending in different directions, the outer surface of the top side and the photosensitive assembly Since the narrow angle between the optical axis of the bottom side is smaller than the narrow angle between the bottom side outer surface and the optical axis, the volume of the filling groove formed between the bottom side outer surface of the optical window molding part and the photosensitive element is reduced to generate "flash" less likely

It is an object of the present invention to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the outer surface of the top side of the optical window molding part extends in a direction with a relatively small angle between the optical axis and the filling groove. The flow rate of the entering molding material is moderated to some extent, and the pressure generated by the molding material entering the filling groove is reduced, thereby reducing the possibility of "flash" formation.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a camera module and a photosensitive assembly and manufacturing method thereof, wherein in the integral molding process, the molding material does not easily form a "flash", so that the optical window molding part can achieve the photosensitivity with a relatively large pressure. There is no need to press the element, thereby preventing the photosensitive element from being damaged by pressure.

It is an object of the present invention to provide a camera module and a photosensitive assembly and manufacturing method thereof, wherein two angles are formed between the optical axis and the outer surface of the optical window forming part of the forming die, wherein the bottom outer surface is Since the bottom-side outer surface having an inclination angle and extending obliquely has a height of 0.05 mm or more, the elastic coating film covering the optical window molding part is prevented from being easily perforated in the molding process.

It is an object of the present invention to provide a camera module, a photosensitive assembly thereof, and a manufacturing method thereof, wherein the molding base has a plurality of integrally extending inner surfaces, and between the inner surface of the top side and the optical axis is the inner surface of the bottom side. Since the inner surface of the molding base is bent and extended because it has a relatively smaller narrow angle than between the surface and the optical axis, the molding material of a relatively small size is provided between the inner surface of the bottom side and the photosensitive element, so that the molding material is It does not easily form a "flash" on the photosensitive element.

It is an object of the present invention to provide a camera module and a photosensitive assembly thereof and a manufacturing method thereof, wherein the molding base comprises a photosensitive element coupling portion and a top extension portion extending integrally, the inner surface of which has different extension angles, , wherein the top surface of the top extension has a relatively small narrow angle between the top extension and the optical axis, so that the area of the top surface of the top extension is increased to mount a larger area to the lens or optical filter element holder or lens assembly above the camera module. It is used to stably mount the lens, the optical filter element holder or the lens assembly by providing a surface.

It is an object of the present invention to provide a camera module and a photosensitive assembly and manufacturing method thereof, wherein the inner surface of the photosensitive element coupling portion of the molding base extends obliquely to facilitate the demolding operation during the molding process and to reach the photosensitive element stray light is reduced, and the inner surface of the top extension part is integrally bent from the inner surface of the photosensitive element coupling part to match the photosensitive element coupling part and the top extension part, and the stray light is reduced. The top surface area of the molding base is increased as much as possible.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a camera module and a photosensitive assembly thereof and a manufacturing method thereof, wherein the inner surface of the top extension portion is integrally bent and extended from the photosensitive element coupling portion, thereby forming an optical window of a molding die during a molding process. The molding part is pressed on the connecting line through which the photosensitive element and the circuit board are connected to each other to prevent the connecting line from being damaged.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a camera module and a photosensitive assembly and manufacturing method thereof, wherein the area between the top extension and the optical axis is relatively small, so that the area of the optical filter element can be reduced.

An object of the present invention is to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein a light blocking layer is provided on the optical filter element body of the optical filter element of the photosensitive assembly of the camera module, Forming an effective light transmitting area in the central area reduces stray light reaching the inside of the molding base.

It is an object of the present invention to provide a camera module and a photosensitive assembly and manufacturing method thereof, wherein in some embodiments, the light blocking layer is provided on the bottom side of the optical filter element body to the inner surface of the top extension part By reducing the incident light beam, it is prevented from being incident to the inner surface of the top extension part and being reflected to reach the photosensitive element and form stray light, thereby affecting the image quality of the camera module.

In order to achieve one or more of the above objects of the present invention, the present invention provides a method for manufacturing a photosensitive assembly of a camera module comprising the following steps.

(a) Fixing the circuit board dowel plate to the second die of the forming die. wherein the circuit board alignment plate includes one or more rows of circuit boards, each row of circuit boards includes one or more parallelly arranged circuit boards, and each of the circuit boards includes a rigid region and a flexible region coupled to each other and each of the circuit boards is operatively connected to the photosensitive element.

(b) The second die and the first die are combined, and the molten molding material is filled into the forming guide groove of the base alignment plate in the forming die. Here, positions corresponding to the one or more optical window moldings are prevented from being filled with the molding material.

(c) hardening the molding material in the base fitting plate forming guide groove to form a connecting molding base at a position corresponding to the base fitting plate forming guide groove. Here, the connection-type molding base is integrally molded with the corresponding one or more rows of the circuit board and the one or more rows of the photosensitive elements to form a photosensitive assembly fitting plate, and at a position corresponding to the optical window molding part, each photosensitive element forming an optical window providing an optical path, wherein the base fitting plate forming guide groove includes a first flow guide groove corresponding to the first end side of the adjacent flexible area of the connected molding base and in the connected molding base a second flow guide groove corresponding to the distant flexible region and a plurality of filling grooves extending between the first flow guide groove and the second flow guide groove, wherein the first flow guide groove is the optical window and wherein the second flow passage groove has a second side surface facing the optical window, wherein the first side surface includes a first partial surface disposed adjacent to the photosensitive element; a second partial surface connected to the first partial surface, wherein the second side surface includes a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein the second partial surface comprises: A first angle with respect to the optical axis of the camera module of the first partial surface is greater than a second angle of the second partial surface with respect to the optical axis, and a third angle of the third partial surface with respect to the optical axis of the fourth partial surface is greater than the fourth angle with respect to the optical axis.

The photosensitive assembly alignment plate is used to manufacture a plurality of the photosensitive assemblies, wherein the method further comprises cutting the photosensitive element alignment plate to obtain a plurality of photosensitive assemblies, wherein each of the photosensitive assemblies comprises: said circuit board, said photosensitive element and said molding base, wherein said molding base is integrally molded with said circuit board and said photosensitive element to form said optical window providing an optical path to said photosensitive element.

According to another aspect of the present invention, the photosensitive assembly of the camera module provided in the present invention,

a circuit board including a rigid region and a flexible region coupled to each other;

photosensitive element; and

comprising a molding base,

wherein the molding base is integrally molded with the circuit board and the photosensitive element to form an optical window that provides an optical path to the photosensitive element, wherein a first end corresponding to the adjacent flexible region of the molding base The side has a first side surface facing the optical window, the first side surface comprising a first partial surface disposed adjacent to the photosensitive element and a second partial surface connected to the first partial surface, the first partial surface the first angle with respect to the optical axis of the camera module is greater than a second angle with respect to the optical axis of the second partial surface, and an opposite second end side corresponding to the flexible region remote from the molding base has an optical window and a second side surface facing the second side surface, the second side surface comprising a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, the third partial surface being disposed on the optical axis of the third partial surface. The third angle with respect to the fourth angle is greater than the fourth angle with respect to the optical axis of the fourth partial surface.

According to another aspect of the present invention, the photosensitive assembly fitting plate of the camera module further provided in the present invention,

one or more rows of circuit boards;

one or more rows of photosensitive elements; and

one or more connected molding bases,

wherein each row of circuit boards includes one or more parallelly arranged circuit boards, each of said circuit boards includes a rigid region and a flexible region coupled to each other, and each said connected molding base comprises one row of said circuit boards and one an optical window integrally formed with said photosensitive elements in a row to provide an optical path to each said photosensitive element, wherein a first end side corresponding to the adjacent said flexible region of said connected molding base is a first facing optical window a side surface, wherein the first side surface includes a first partial surface provided adjacent to the photosensitive element and a second partial surface connected to the first partial surface, the first partial surface on the optical axis of the camera module a first angle to the second partial surface is greater than a second angle to the optical axis of the second partial surface, and an opposite second end side corresponding to the flexible region remote from the articulated molding base has a second side surface facing the optical window and the second side surface includes a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a third angle of the third partial surface with respect to the optical axis is the second greater than the fourth angle with respect to the optical axis of the four-part surface.

According to another aspect of the present invention, the photosensitive assembly fitting plate of the camera module further provided in the present invention,

a plurality of rows of circuit boards;

a plurality of rows of photosensitive elements; and

one or more connected molding bases,

wherein each row of circuit boards comprises one or more parallelly arranged circuit boards, each of said circuit boards comprising a rigid region and a flexible region coupled to each other, and each said connected molding base comprises two rows of adjacent said circuit boards. and an optical window formed integrally with the photosensitive elements adjacent to each other in two rows to provide an optical path to each of the photosensitive elements, and the circuit boards adjacent to each other in the two rows have their flexible regions far from each other and their rigid regions from each other disposed adjacently, such that each of the articulated molding bases has two end sides adjacent to the flexible area, wherein a first end side corresponding to the adjacent flexible area of the articulated molding base is a first end side facing the optical window. and a first side surface, wherein the first side surface includes a first partial surface provided adjacent to the photosensitive element and a second partial surface connected to the first partial surface, the optical axis of the camera module on the first partial surface a first angle to the second partial surface is greater than a second angle to the optical axis of the second partial surface, and the connected molding base extends to a second end side positioned between the photosensitive elements adjacent to each other in the two rows and faces the optical window. a second side surface, wherein the second side surface includes a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, the third partial surface with respect to the optical axis The third angle is greater than a fourth angle of the fourth partial surface with respect to the optical axis.

According to another aspect of the present invention, the camera module further provided in the present invention,

lens;

circuit board;

photosensitive element; and

comprising a molding base,

wherein the circuit board includes a rigid region and a flexible region coupled to each other, and the molding base is integrally molded with the circuit board and the photosensitive element to form an optical window that provides an optical path to the photosensitive element, The lens is positioned in the photosensitive path of the photosensitive element, wherein a first end side corresponding to the adjacent flexible region of the molding base has a first side surface facing the optical window, the first side surface being the photosensitive a first partial surface provided adjacent to the element and a second partial surface connected to the first partial surface, wherein the first angle of the first partial surface with respect to the optical axis of the camera module is the optical axis of the second partial surface an opposite second end side corresponding to the flexible region that is greater than a second angle to and away from the molding base has a second side surface facing the optical window, the second side surface being adjacent to the photosensitive element a third partial surface provided and a fourth partial surface connected to the third partial surface, wherein a third angle of the third partial surface with respect to the optical axis is greater than a fourth angle of the fourth partial surface with respect to the optical axis.

According to another aspect of the present invention, the forming die further provided by the present invention is manufactured for application to a photosensitive assembly fitting plate of a camera module, wherein a first die and a second die suitable for separating from each other and closely contacting each other are provided. wherein the first die and the second die form a forming cavity when in close contact with each other, the forming die having one or more optical window forming portions within the forming cavity and a base fitting plate formed around the optical window forming portion. A molding guide groove is mounted inside the molding cavity suitable for fixing a circuit board alignment plate, wherein the circuit board alignment plate comprises one or more rows of circuit boards, each row of circuit boards having one or more parallel arrangement a circuit board, each of said circuit boards comprising a rigid region and a flexible region coupled to each other, each said circuit board operatively connected to a photosensitive element, said base alignment plate forming guide grooves comprising said molding material and is suitable for forming a connecting-type molding base at a position corresponding to the base fitting plate forming guide groove, wherein the connecting-type molding base is integrally molded with the circuit board in each corresponding row and the photosensitive element in each row to form the photosensitive forming an assembly fitting plate and forming an optical window providing an optical path to each of the photosensitive elements at a position corresponding to the optical window forming part, wherein the base fitting plate forming guide groove is adjacent to the flexible molded base of the connecting type molding base A first flow guide groove corresponding to the first end side of the flexible area and a second flow guide groove corresponding to the flexible area farther away from the connection-type molding base, and between the first flow guide groove and the second flow guide groove and a plurality of filling grooves extending up to, wherein each said optical window forming portion is positioned between two said filling grooves adjacent to each other, wherein said first flow guide groove has a first side surface facing said optical window. and wherein the second flow guide groove has a second side surface facing the optical window, wherein the first side surface is adjacent to the photosensitive element. a first partial surface provided and a second partial surface connected to the first partial surface, wherein the second side surface includes a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface wherein a first angle of the first partial surface with respect to the optical axis is greater than a second angle of the second partial surface with respect to the optical axis, and a third angle of the third partial surface with respect to the optical axis is the second angle greater than the fourth angle with respect to the optical axis of the four-part surface.

According to another aspect of the present invention, the forming die further provided by the present invention is manufactured for application to a photosensitive assembly fitting plate of a camera module, wherein a first die and a second die suitable for separating from each other and closely contacting each other are provided. wherein the first die and the second die form a forming cavity when in close contact with each other, wherein the forming die guides forming an optical window forming part in the forming cavity and a base fitting plate formed around the optical window forming part A groove is mounted inside the molding cavity suitable for securing a circuit board fit plate, wherein the circuit board fit plate comprises a plurality of rows of circuit boards, each row of circuit boards holding one or more parallelly arranged circuit boards. wherein each of the circuit boards includes a rigid region and a flexible region coupled to each other, each of the circuit boards being operatively connected to a photosensitive element, wherein the base alignment plate forming guide groove is filled with a molding material and the It is suitable for forming a connection-type molding base at a position corresponding to a guide groove for forming a base alignment plate, wherein the connection-type molding base is integrally molded with the circuit boards in two rows adjacent to each other and the photosensitive elements in two rows adjacent to each other to form the photosensitive forming an assembly alignment plate and forming an optical window providing an optical path to each of the photosensitive elements at a position corresponding to the optical window forming portion, wherein the two rows of adjacent circuit boards have their flexible areas far from each other; The rigid regions thereof are disposed adjacent to each other, wherein the base fitting plate forming guide grooves are the two first flow guide grooves corresponding to the two end sides of the adjacent flexible regions of the connecting-type molding base and the two rows of each other. a second flow guide groove corresponding to an area between the adjacent photosensitive elements, and a plurality of filling grooves extending between the two first flow guide grooves and the second flow guide groove, wherein each of the optical windows The forming part is located between two said filling grooves adjacent to each other, wherein said first flow guide groove has a first side surface facing said optical window. wherein the second flow channel groove has a second side surface facing the optical window, wherein the first side surface includes a first partial surface provided adjacent to the photosensitive element and a first partial surface connected to the first partial surface. a second partial surface, wherein the second side surface includes a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein the optical axis of the first partial surface is a first angle with respect to the second partial surface is greater than a second angle with respect to the optical axis of the second partial surface, and a third angle of the third partial surface with respect to the optical axis is greater than a fourth angle of the fourth partial surface with respect to the optical axis. .

The photosensitive assembly further provided in the present invention,

circuit board;

photosensitive element; and

comprising a molding base,

wherein the photosensitive element is operatively connected to the circuit board, and the molding base is integrally coupled to the circuit board and the photosensitive element to form an optical window, wherein the molding base is one adjacent to the photosensitive element. at least a first partial inner surface and at least one second partial inner surface remote from the photosensitive element and coupled to the first partial inner surface, wherein the included angle between the first partial inner surface and the optical axis of the photosensitive assembly is α , the angle between the inner surface of the second portion and the optical axis of the photosensitive assembly is β, where β<α.

According to another aspect of the present invention, the camera module further provided in the present invention,

lens;

circuit board;

photosensitive element; and

comprising a molding base,

wherein the photosensitive element is operatively connected to the circuit board, the lens is positioned in a photosensitive path of the photosensitive element, and the molding base is integrally coupled to the circuit board and the photosensitive element to form an optical window; wherein the molding base has a first partial inner surface adjacent the photosensitive element and a second partial inner surface remote from the photosensitive element and connected to the first partial inner surface, wherein the first partial inner surface and the camera The included angle between the optical axis of the module is α, and the included angle between the inner surface of the second part and the optical axis of the camera module is β, where β<α.

According to another aspect of the present invention, the forming die further provided by the present invention is fabricated for application to at least one photosensitive assembly of a camera module, the photosensitive assembly comprising a circuit board, a photosensitive element and a molding base, wherein the molding A base is integrally molded with said circuit board and said photosensitive element to form an optical window, said forming dies comprising first and second dies suitable for separating from and closely contacting each other, at least one optical window forming section and a base molding guide groove formed around the optical window molding part is built-in, the circuit board to which the photosensitive element is connected is mounted inside the molding die, and when the first and second dies are in close contact, molten molding After the material is filled and cured into the base molding guide groove, the molding base is formed, and the optical window is formed at a position corresponding to the optical window molding part, wherein the optical window molding part is directed from the bottom side to the top side. and at least one first part outer surface and one or more second part outer surfaces toward to form a narrow angle α and β, respectively, between the optical axis of the photosensitive element and α>β.

According to another aspect of the present invention, the electronic device further provided by the present invention includes one or more of the camera modules described above. The electronic device includes, but is not limited to, a mobile phone, a computer, a television, a smart wearable device, a means of transportation, a camera, and a monitoring device.

1A is a structural diagram of a forming die of a photosensitive assembly packaged by a conventional integrated packaging process.
1B is a molding process diagram of an integrated packaging assembly formed by a conventional integrated packaging process.
1C is an enlarged structural diagram in which a packaging material flows forward along two flow channels in a conventional integrated packaging process.
1D is an enlarged structural diagram in which the packaging material is not partially filled in the conventional integrated packaging process.
1E is a diagram of the viscosity change of a molding material during curing time.
1F is a structural diagram of a camera module manufactured by a photosensitive assembly packaged by a conventional integrated packaging process.
2 is a block diagram of an apparatus for manufacturing a photosensitive assembly alignment plate of a camera module according to a first preferred embodiment of the present invention.
3A is a structural diagram of a forming die of an apparatus for manufacturing a photosensitive assembly alignment plate of a camera module according to the above-described first preferred embodiment of the present invention.
3B is an enlarged structural diagram of a partial region A of the first die of the forming die of the apparatus for manufacturing the photosensitive assembly fitting plate of the camera module according to the above-described first preferred embodiment of the present invention.
4 is a structural diagram of the photosensitive assembly fitting plate of the camera module according to the first preferred embodiment of the present invention.
5A is an enlarged structural diagram of a photosensitive assembly of a camera module according to the first preferred embodiment of the present invention.
5B is a bird's eye view of the structure of the photosensitive assembly of the camera module according to the first preferred embodiment of the present invention.
6A is a cross-sectional view taken along line CC in FIG. 5 of the photosensitive assembly of the camera module according to the first preferred embodiment of the present invention.
6B is a cross-sectional view after further shearing the second end side of the photosensitive assembly of the camera module according to the first preferred embodiment of the present invention.
Fig. 7A is a cross-sectional view when a molten molding material among the forming die of the photosensitive assembly alignment plate according to the above-described first preferred embodiment of the present invention is put into a base alignment plate forming guide groove, wherein the cross-sectional view is Fig. 4; It is a cross-sectional view corresponding to the direction of line AA shown in FIG.
FIG. 7B is an enlarged view of part B in FIG. 7A.
Fig. 8 is a cross-sectional view when a molten molding material among the forming die of the photosensitive assembly according to the above-described first preferred embodiment of the present invention is filled into a base alignment plate forming guide groove, wherein the cross-sectional view is shown in Fig. 4; It is a cross-sectional view corresponding to the direction of line AA.
9 is a cross-sectional view when a molten molding material of the forming die of the photosensitive assembly according to the above-described first preferred embodiment of the present invention is filled into a base alignment plate forming guide groove, wherein the cross-sectional view is shown in FIG. It is a cross-sectional view corresponding to the BB line direction.
FIG. 10 is a cross-sectional view taken along line AA in FIG. 4 to form a connected molding base by performing a demolding step among the molding die of the photosensitive assembly alignment plate according to the first preferred embodiment of the present invention.
11 is a three-dimensional structural diagram of a camera module according to the first preferred embodiment of the present invention.
12 is an exploded structural diagram of the camera module according to the first preferred embodiment of the present invention.
13A is a cross-sectional view taken along line DD in FIG. 12 of the camera module according to the first preferred embodiment of the present invention.
13B is a cross-sectional view taken along line EE in FIG. 12 of the camera module according to the first preferred embodiment of the present invention.
14 is a cross-sectional view of a modified embodiment of the camera module according to the first preferred embodiment of the present invention.
15 is a cross-sectional view of a camera module according to another modified embodiment of the camera module according to the first preferred embodiment of the present invention.
16 is a cross-sectional view of a camera module according to another modified embodiment of the camera module according to the first preferred embodiment of the present invention.
17A is a block diagram of a forming die of an apparatus for manufacturing a photosensitive assembly alignment plate of a camera module according to a second preferred embodiment of the present invention.
17B is an enlarged structural diagram of a part C of the first die of the forming die of the apparatus for manufacturing the photosensitive assembly alignment plate of the camera module according to the above-described second preferred embodiment of the present invention.
18 is a structural diagram of a photosensitive assembly fitting plate of a camera module according to the second preferred embodiment of the present invention.
19A is an enlarged structural diagram of the point D of the photosensitive assembly fitting plate of the camera module according to the above-described second preferred embodiment of the present invention.
19B is an enlarged structural aerial view of two photosensitive assemblies adjacent to each other of the photosensitive assembly alignment plate of the camera module according to the above-described second preferred embodiment of the present invention;
20A is a cross-sectional view taken along line HH in FIG. 19A of the photosensitive assembly fitting plate of the camera module according to the second preferred embodiment of the present invention.
20B is a structural diagram of two photosensitive assemblies obtained by shearing the photosensitive assembly alignment plate of the camera module according to the above-described second preferred embodiment of the present invention.
Fig. 21A is a cross-sectional view when a molten molding material among the forming die of the photosensitive assembly alignment plate according to the above-described second preferred embodiment of the present invention is put into a base alignment plate forming guide groove, wherein the cross-sectional view is Fig. 18; It is a cross-sectional view corresponding to the direction of line FF shown in Fig.
Fig. 21B is an enlarged view of part E in Fig. 21A;
22 is a cross-sectional view when a molten molding material among the forming die of the photosensitive assembly fitting plate according to the above-described second preferred embodiment of the present invention is filled into a base fitting plate forming guide groove, wherein the cross-sectional view is shown in FIG. 18 It is a cross-sectional view corresponding to the direction of line FF shown in Fig.
23 is a cross-sectional view when a molten molding material among the forming die of the photosensitive assembly fitting plate according to the above-described second preferred embodiment of the present invention is filled into a base fitting plate forming guide groove, wherein the cross-sectional view is shown in FIG. 18 It is a cross-sectional view corresponding to the GG line direction shown in Fig.
24 is a cross-sectional view taken along the line FF in FIG. 18 to form a connected molding base by performing a demolding step among the molding die of the photosensitive assembly alignment plate according to the second preferred embodiment of the present invention.
25A to 25C are cross-sectional views of a photosensitive assembly alignment plate according to a modified embodiment of the above-described first and second preferred embodiments of the present invention and enlarged structural diagrams of the photosensitive assembly obtained by shearing;
26A is a structural diagram of a photosensitive assembly alignment plate according to another modified embodiment of the above-described second preferred embodiment of the present invention.
26B is an enlarged structural diagram of a photosensitive assembly according to another modified embodiment of the above-described second preferred embodiment of the present invention.
27 is a cross-sectional view taken along line II in FIG. 26 of a photosensitive assembly according to another modified embodiment of the above-described second preferred embodiment of the present invention.
28 is a perspective exploded view of a camera module according to a third preferred embodiment of the present invention.
29A is a structural diagram of a camera module according to a third preferred embodiment of the present invention.
29B is an enlarged structural diagram of a point J in FIG. 29A.
30 is a schematic diagram of effectively reducing stray light reflected by a photosensitive element by attaching a light blocking layer to the bottom side of the photosensitive assembly of the camera module according to the third preferred embodiment of the present invention.
31A is a cross-sectional view when a molding material melted in a molding die is put into a base molding guide groove in a molding process according to the above-described third preferred embodiment of the present invention;
Fig. 31B is a cross-sectional view when filling a base forming guide groove with a molten molding material according to the above-mentioned third preferred embodiment of the present invention;
31C is a cross-sectional view of forming a molding base by performing a demolding step according to the above-described third preferred embodiment of the present invention.
32A is a schematic diagram for effectively reducing stray light by attaching light blocking layers to both sides of a photosensitive element according to a modified example of the above-described third preferred embodiment of the present invention.
32B is a cross-sectional view of a camera module according to another modified embodiment of the above-described third preferred embodiment of the present invention.
33 is a cross-sectional view of a camera module according to another modified embodiment of the above-described third preferred embodiment of the present invention.
34 is a cross-sectional view of a camera module according to another modified embodiment of the above-described third preferred embodiment of the present invention.
35 is a perspective exploded view of a camera module according to a fourth preferred embodiment of the present invention.
36A is a cross-sectional view taken along the line KK in FIG. 35 of the camera module according to the fourth preferred embodiment of the present invention.
Fig. 36B is an enlarged view of a point L in Fig. 36A.
37 is a schematic diagram for effectively reducing stray light reflected from a photosensitive element by attaching a light blocking layer to the bottom side of the photosensitive assembly of the camera module according to the fourth preferred embodiment of the present invention.
38 is a cross-sectional view of a camera module according to a modified embodiment of the above-described fourth preferred embodiment of the present invention.
39 is a perspective exploded view of a camera module according to a fifth preferred embodiment of the present invention.
40 is a cross-sectional view taken along line MM in FIG. 39 of the camera module according to the above-described fifth exemplary embodiment of the present invention.
41 is a schematic diagram for effectively reducing stray light reflected by a photosensitive element by attaching a light blocking layer to the bottom side of the photosensitive assembly of the camera module according to the above-described fifth exemplary embodiment of the present invention.
42 is a cross-sectional view of a camera module according to a modified embodiment of the above-described fifth preferred embodiment of the present invention.
43 is a cross-sectional view of a camera module according to another modified embodiment of the above-described fifth embodiment of the present invention.
44 is a structural diagram in which the above-described camera module of the present invention is applied to a smart electronic device.

The following description is used to disclose the present invention to enable those skilled in the art to implement the present invention. Preferred embodiments in the following description are merely examples, and those skilled in the art to which the present invention pertains may consider other obvious modifications. The basic principles of the present invention defined in the following description can be applied to other implementations, modifications, improvements, equivalents, and other technical solutions without departing from the spirit and scope of the present invention.

Those of ordinary skill in the art to which the present invention pertains in the present disclosure refer to "longitudinal", "transverse", "top", "term", "before", "after", "left", "right", "vertical" ", "horizontal, "top", "bottom", "in", "outside", etc. orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, which is to briefly describe the present invention It is understood that the present invention is not intended to be construed as limiting the present invention, and does not necessarily mean or imply that the device or element must have a particular orientation and be constructed and operated in a particular orientation.

The term “a” is to be understood as “at least one” or “one or more”. That is, in one embodiment, the quantity of one element may be one, but in another embodiment, the quantity of the element may be plural, so the term “one” should not be construed as a limitation on the quantity.

2 to 14 show the camera module 100 and the photosensitive assembly 10 and a manufacturing method thereof according to the first preferred embodiment of the present invention. The camera module 100 may be applied to various electronic devices 300 , and the electronic device 300 includes a device body 301 and one or more camera modules 100 mounted on the device body 301 . 44, the electronic device 300 is selected from the group consisting of, for example, a smartphone, a wearable device, a computer, a television, a means of transportation, a camera, and a monitoring device, but is not limited thereto, The camera module is mounted on the electronic device to implement image collection and reproduction of a target object.

More specifically, the drawing shows the photosensitive assembly 10 of the camera module 100 and the manufacturing apparatus 200 thereof. The photosensitive assembly 10 includes a circuit board 11 , a molding base 12 and a photosensitive element 13 , and the molding base 12 is integrated with the circuit board 11 and the photosensitive element 13 . to form an optical window 122 providing an optical path to the photosensitive element 13 . Here, the molding base 12 of the present invention is integrally molded to the circuit board 11 and the photosensitive element 13 through a molding process, more specifically, a conventional molding process through the manufacturing apparatus 200. Since the molding base 12 can replace the lens base or holder of the conventional camera module, there is no need to attach the lens base or holder to the circuit board 11 with an adhesive as in the conventional packaging process.

2 to 4 and 7A to 10 , the present invention provides a photosensitive assembly fitting plate 1000 through a manufacturing apparatus 200, that is, a plurality of photosensitive assemblies 10 through a fitting plate process. The photosensitive assembly alignment plate 1000 is manufactured. The photosensitive assembly alignment plate 1000 includes a circuit board alignment plate 1100 and one or more connected molding bases 1200 . The circuit board alignment plate 1100 includes a plurality of rows of circuit boards like the four-row circuit board shown in FIG. 4 , and each row circuit board includes a plurality of circuit boards 11 like 2 to 12 circuit boards 11 . ), and shown in the drawing are six of the circuit boards 11 , each of which is operatively connected to the photosensitive element 13 . Each of the connection-type molding bases 1200 is formed on the circuit board in one row and integrally formed in at least some non-photosensitive regions 132 of each of the photosensitive elements 13 of the photosensitive elements 13 in one row to form the photosensitive elements The photosensitive region 131 of (13) is exposed. Each of the connection-type molding bases 1200 has a plurality of optical windows 122 , and the positions of each of the optical windows 122 correspond to each of the photosensitive elements 13 . Used to provide a path.

Here, the apparatus 200 for manufacturing the photosensitive assembly fitting plate 1000 of the camera module 100 includes a molding die 210 , a molding material supply mechanism 220 , a die fixing device 230 , and a temperature control device 250 . ) and a controller 260 , wherein the molding material supply mechanism 220 is configured to provide the molding material 14 to the base alignment plate forming guide groove 215 . The die holding device 230 is configured to control opening and closing of the forming die 210 , the temperature control device 250 is configured to heat the thermosetting molding material 14 , and the controller 260 is configured to: and automatically control the operation of the molding material supply mechanism 220 , the die holding device 230 , and the temperature control device 250 in the molding process.

The forming die 210 includes a first die 211 and a second die 212 that can be opened and closed under the action of the die holding device 230 . That is, the die fixing device 230 may open and close the first die 211 and the second die 212 to form a molding cavity 213 , and the circuit board alignment plate 1100 is closed when closed. Fixed in the molding cavity 213 , the molding material 14 in a fluid state enters the molding cavity 213 on the circuit board 11 in each row and the photosensitive elements 13 in each row corresponding to it. The connection-type molding base 1200 which is integrally molded and molded integrally on the circuit board 11 of each row and the photosensitive element 13 of each row is formed after curing.

More specifically, the forming die 210 further includes one or more base fitting plate forming guide grooves 215 and a plurality of optical window forming portions 214 positioned in the base fitting plate forming guide groove 215 . When the first and second dies 211 and 212 are closed, the optical window forming part 214 and the base fitting plate forming guide groove 215 extend into the forming cavity 213, and are in a fluid state. Since the molding material 14 is filled in the base fitting plate forming guide groove 215 and the position corresponding to the optical window forming part 214 cannot be filled with the molding material 14 in a fluid state, the base After the molding material 14 in a fluid state is cured at a position corresponding to the alignment plate forming guide groove 215 , the connected molding base 1200 may be formed, in which the photosensitive assembly 10 of each An annular molding body 121 corresponding to the molding base 12 may be included, and the optical window 122 of the molding base 12 may be formed at a position corresponding to the optical window molding unit 214 . have. The molding material 14 may be selected from nylon, liquid crystal polymer (LCP), polypropylene (PP, polypropylene), epoxy resin, and the like, but is not limited thereto.

The first and second dies 211 and 212 may create two relatively moving dies, for example one of the two dies being fixed and the other movable, or both dies may be movable. and the present invention is not limited thereto. In the example of this embodiment of the present invention, the first die 211 is specifically implemented as a fixed upper die and the second die 212 is implemented as a movable lower die. The fixed upper die and the movable lower die are installed coaxially, for example, the movable lower die can slide upward along a plurality of positioning axes, and the forming cavity is closely closed when the fixed upper die is closed. 213) can be formed.

The second die 212 , that is, the lower die may have a circuit board positioning groove 2121 , and is formed in a concave groove shape or a positioning pillar to mount and fix the circuit board 11 . The optical window forming part 214 and the base alignment plate forming guide groove 215 may be formed in the first die 211, that is, the upper die, and the first and second dies 211 , 212 forms the forming cavity 213 when closed. Also, the molding material 14 in the form of a fluid is injected into the base alignment plate forming guide groove 215 on the top side of the circuit board alignment plate 1100, so that the circuit board 11 in each row and the photosensitivity of each row The connection-type molding base 1200 is formed on the top side of the element 13 .

The circuit board positioning groove 2121 may also be installed on the first die 211 , that is, the upper die to mount and fix the circuit board alignment plate 1100 , and the optical window forming part 214 . ) and the base fitting plate forming guide groove 215 may be formed in the second die 211, and the forming cavity 213 is formed when the first die and the second die 212 are closed. I can understand. The circuit board alignment plate 1100 may be disposed face up in the upper die, and the molding material 14 in a fluid state is aligned with the base of the bottom side of the circuit board alignment plate 1100 inverted. It is injected into the plate forming guide groove 215 to form the connection-type molding base 1200 on the bottom side of the overturned circuit board alignment plate 1100 .

More specifically, when the first and second dies 211 and 212 are closed and the molding step is performed, the optical window forming part 214 overlaps the top surface of the photosensitive element 13 and is closely bonded. , preventing the molding material 14 in a fluid form from entering the photosensitive region 1311 of the top surface 131 of the photosensitive element 13 on the circuit board 11, and finally the optical window molding part The optical window 122 of the connection-type molding base 1200 may be formed at a position corresponding to 214 . It can be seen that the optical window molding unit 214 may have a solid structure, and may have a structure having a concave groove shape therein as shown in the drawings.

The first die 211 has a flat surface for forming the guide groove 215 for forming the base fitting plate and may be positioned on the same plane, through which the molding base 12 is cured and molded. In this case, the top surface of the molding base 12 is relatively flat, so that optical components such as drivers, lenses, and fixed lens barrels above the photosensitive assembly 10 of the camera module 100 can be mounted flatly. and it can be seen that the inclination error of the camera module 100 is reduced after assembly.

It should be noted that the base alignment plate forming guide groove 215 and the optical window forming part 214 may be integrally formed with the first die 211 . In addition, the first die 211 may further include a separable molding structure, in which the base alignment plate molding guide groove 215 and the optical window molding unit 214 are formed. In this way, the base fitting plate forming guide groove 215 and the optical window forming part ( 214) can be designed. Thus, by simply replacing different molding structures, the manufacturing apparatus can be made suitable for application to the photosensitive assembly 10 of different specification requirements. Correspondingly, by including a separable fixing block in the second die 212 to provide the grooves 2121 of different shapes and sizes, the circuit board 11 suitable for different shapes and sizes can be easily replaced. It can be seen that there is

It can be seen that the molding material 14 is a thermosetting material, and can be transformed into the molding material 14 in a fluid state by melting the thermosetting material in a solid state. In the molding process, the thermosetting molding material 14 may be cured through an additional heating process, and then melted again after curing to form the connection-type molding base 1200 .

In the molding process of the present invention, the molding material 14 may be in a block type, granular type, or powder type, and after being heated, it is transformed into a fluid in the molding die 210 and then cured again to make the connection type. It can be seen that the molding base 1200 is formed.

More specifically, each of the base fitting plate forming guide grooves 215 of the present invention are substantially parallel to a first flow guide groove 2151 and a second flow guide groove 2152, and the first flow guide groove 2151. ) and a plurality of filling grooves 2153 extending between the second flow guide grooves 2152, wherein the filling grooves 2153 are formed between the two optical window molding parts 214 adjacent to each other, and , as shown in the figure, the base fitting plate molding guide groove is provided with seven filling grooves 2153, and the six optical window molding parts 214 are two filling grooves 2153 adjacent to each other, respectively. located between The molding material 14 flows along the first flow guide groove 2151 and the second flow guide groove 2152 from its material supply end 215A toward its end 215B, and the molding material ( 14) may fill each of the filling grooves 2153, and after the molding material 14 is hardened, the connected molding base 1200 is formed.

7A to 10 show a manufacturing process of the photosensitive assembly fitting plate 1000 of the camera module 100 according to a preferred embodiment of the present invention, and as shown in FIG. 7A, the forming die 210 is in a closed state, the circuit board fitting plate 1100 to be molded and the molding material 14 in a solid state are prepared in place, the molding material 14 in a solid state is heated, and the molding material 14 ) is melted in a fluid state or semi-solid semi-fluid state and transferred to the base fitting plate forming guide groove 215, and flows forward along the first flow guide groove 2151 and the second flow guide groove 2152 The filling groove 2153 between the two adjacent optical window forming parts 214 is filled.

As shown in FIGS. 8 and 9 , when the inside of the mold guide groove 215 for forming the base fitting plate is completely filled with the molding material 14 in a fluid state, the molding material 14 in a fluid state goes through a curing process again. ) is cured and molded into a connection-type molding base 1200 integrally formed with the circuit board 11 of each row and the photosensitive element 13 of each row.

As shown in FIG. 10 , after the molding material 14 is cured to form the connection-type molding base 1200 , the demolding process of the present invention is performed. That is, the first and second dies 211 and 212 are spaced apart from each other by the die fixing device 230 , and through this, the optical window forming part 214 is separated from the connected molding base 1200 to separate the connected molding base 1200 . The optical window 122 corresponding to each of the photosensitive elements 13 is formed in the base 1200 .

4 to 6 , the manufactured photosensitive assembly alignment plate 1000 may be further cut to manufacture the single photosensitive assembly 10 . Each said photosensitive assembly (10) comprises one or more of said circuit board (11), one or more said photosensitive elements (13) and said molding base (12) integrally molded to circuit board (11) and photosensitive element (13). do. Each of the circuit boards 11 includes a rigid region 111 and a flexible region 112 coupled to each other, that is, each of the circuit boards 11 may be implemented as a rigid composite substrate in an embodiment of the present invention. can Here, the molding base 12 is integrally formed with at least a part of the rigid region 111 of the circuit board 11 and the non-photosensitive region 132 of the photosensitive element 13, and the photosensitive element 13 ) to form the optical window 122 providing an optical path to the photosensitive region 131 .

It is noteworthy that the manufacturing method of the photosensitive assembly alignment plate 1000 of the present invention is suitable for manufacturing the photosensitive assembly 10 in a small size. Therefore, in the molding process, the volumes of the first flow guide groove 2151 and the second flow guide groove 2152 are relatively small. 7A to 10, the cross-sections of the first flow guide groove 2151 and the second flow guide groove 2152 are substantially trapezoidal. Here, the width of the bottom end of the first flow guide groove 2151 and the second flow guide groove 2152 is limited in size and cannot be expanded.

Accordingly, according to the embodiment of the present invention, with respect to the inner surface facing the optical window 122 of the connected molding base 1200, that is, the first side surface 1201 of the first flow passage groove 2151 and the second flow passage The second side surface 1202 of the groove 2152 is installed in a double-ended structure.

Specifically, as shown in FIGS. 6A and 6B , the first side surface 1201 has a first partial surface 1203 installed adjacent to the photosensitive element 13 and a second portion connected to the first partial surface. a surface 1204 , wherein a first angle of the first partial surface 1203 with respect to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 with respect to the optical axis. That is, as shown in Figs. 6A and 6B, the first partial surface 1203 and the second partial surface 1204 extend from the bottom to the top, and the inclination of the first partial surface 1203 is the second partial surface. greater than the slope of the surface 1204 . In this way, since the second partial surface 1204 is inclined with respect to the first partial surface 1203 toward the optical window direction, the cross-sectional area of the first flow passage groove 2151 is increased to increase the first flow passage groove 2151. ) increases in volume.

Similarly, the second side surface 1202 includes a third partial surface 1205 provided adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface, the third portion A third angle of the surface 1205 with respect to the optical axis of the camera module is greater than a fourth angle of the fourth partial surface 1206 with respect to the optical axis. That is, as shown in FIGS. 6A and 6B , the third partial surface 1205 and the fourth partial surface 1206 extend from the bottom to the top, and the inclination of the third partial surface 1205 is the fourth part. greater than the slope of the surface 1206 . In this way, since the fourth subsurface 1206 is inclined toward the optical window direction with respect to the third subsurface 1205, the cross-sectional area of the second subsurface groove 2152 increases to increase the second subsurface groove 2152. ) increases in volume.

Preferably, in the embodiment of the present invention, the cross-sectional design of the first flow guide groove 2151 and the second flow guide groove 2152 is symmetrical, that is, the first angle of the first partial surface 1203 is The third angle of the third subsurface 1205 is equal to the third angle and the second angle of the second subsurface 1204 is equal to the fourth angle of the fourth subsurface 1206 .

In consideration of the influence of stray light on the camera module, the first angle and the third angle are set to 3° to 80°. In addition, the second and third angles are set to 0° to 20° in consideration of other factors of the module process and the molding base structure and material properties of the camera module.

Here, it should be noted that, in the embodiment of the present invention, the second angle and the fourth angle are preferably set to 0 degrees. That is, the second partial surface 1204 and the fourth partial surface 1206 extend vertically upward with respect to the surface of the photosensitive element 13, so that, on the one hand, the cross-sectional area of the flow guide groove can be maximally increased, and on the other hand, may not affect the light rays incident on the photosensitive chip of the camera module.

Those skilled in the art to which the present invention pertains can understand that the cross-sectional shape of the flow guide groove can affect the flow of the molding material on the one hand and directly determine the cross-sectional shape of the molded base to be produced on the other hand. .

Through the two-level design of the first side surface 1201 and the second side surface 1202 , that is, the slope of the second partial surface 1204 is smaller than the first partial surface 1203 and the third partial surface 1205 . The upper surface area of the molding base is further increased through the smaller inclination of the fourth partial surface 1206 to facilitate supporting other components of the camera module, such as the lens base.

Therefore, in the embodiment of the present invention, not only the effect of the specific shape size factor on the cross-sectional shape of the flow guide groove should be considered, but also the influence of the shape size factor on the shape of the molding base should be considered.

Specifically, since the molding base should cover the connecting line 15 , the heights of the first side surface 1201 and the second side surface 1202 should be further defined in a direction perpendicular to the surface of the photosensitive element 13 .

Preferably, in the embodiment of the present invention, the first height and the third height in the direction perpendicular to the surface of the photosensitive element 13 of the first partial surface 1203 and the third partial surface 1205 are 0.05, respectively. mm to 0.7 mm. In this way, it can be ensured that the formed molding base can cover the connecting line 15 well. Also taking into account the function of covering the entire connecting line 15 of the molding base and the additional structural elements supporting the lens base, the direction perpendicular to the surface of the photosensitive element 13 of the second partial surface 1204 and the fourth partial surface 1206 is The second height and the fourth height are 0.02 mm to 0.6 mm, respectively.

The height of the molding base is further increased through the second partial surface 1204 and the fourth partial surface 1206 so that the connecting line 15 is pressed when mounting other components of the camera module, for example, the lens base, so that the camera module can be prevented from affecting the performance of

By installing the side surfaces of the flow guide grooves in a two-step shape in this way, it is possible to ensure that the molding material as a fluid flows smoothly in the flow guide grooves, and specifically, the molding material 14 in a fluid state is the first flow It flows forward along the guide groove 2151 and the second flow guide groove 2152 and can fill the entire base fitting plate forming guide groove 215 with the molding material 14 before the molding material 14 is cured. have.

Correspondingly, the photosensitive assembly alignment plate 1000 obtained in the molding process of the present invention includes one or more rows of circuit boards 11 , one or more rows of photosensitive elements 13 , and one or more of the connected molding bases 1200 . include Each row of circuit boards 11 includes one or more of the circuit boards 11 arranged in parallel, each of the circuit boards 11 comprising a rigid region 111 and a flexible region 112 coupled to each other. . Each of the connection-type molding bases 1200 is integrally formed with the circuit board 11 in one row and the photosensitive elements 13 in one row to provide an optical path to each photosensitive element 13. An optical window 122. to form wherein a portion 1200A of the connected molding base 1200 corresponding to a first end side adjacent the flexible region 112 in the connected molding base 1200 has a first side surface 1201 and the first The side surface 1201 includes a first partial surface 1203 provided adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface, A first angle with respect to the optical axis of the camera module is greater than a second angle with respect to the optical axis of the second partial surface 1204 , and a second angle opposite from the flexible area 112 in the connected molding base 1200 . A portion 1200B of the connected molding base corresponding to the second end side has a second side surface 1202 , and the second side surface 1202 is a third partial surface provided adjacent to the photosensitive element 13 . and a fourth subsurface (1206) connected to (1205) and a third subsurface (1206), wherein a third angle of the third subsurface (1205) with respect to the optical axis of the camera module is that of the fourth subsurface (1206). greater than the fourth angle with respect to the optical axis. Here, the first end side of the connection-type molding base 1200 is a coupling side of the rigid region 111 and the flexible region 112 of the circuit board 11 , that is, close to the flexible region 112 . Corresponds to the proximal end, and the second end of the connected molding base 1200 corresponds to the distal end of the circuit board 11 away from the flexible region 112 .

After the photosensitive assembly alignment plate 1000 is cut, a single photosensitive assembly 10 can be obtained, wherein the first end side and the second end side in the connected molding base 1200 during the cutting step. The molding base 12 may be obtained by cutting except for the two wing sides of , and the corresponding portion 1200B of the molding base on the second end side may not be cut. In this way, the photosensitive assembly 10 with the portion 1200B of the connecting molding base on the side of a pair of opposite wings is obtained.

As shown in FIG. 6A , the photosensitive assembly 10 includes the circuit board 11 , the photosensitive element 13 and the molding base 12 . Here, the circuit board 11 includes the rigid region 111 and the flexible region 112 coupled to each other. The molding base 12 is integrally molded with the circuit board 11 and the photosensitive element 13 and forms the optical window 122 that provides an optical path to the photosensitive element 13 . The circuit board 11 and the photosensitive element 13 are connected to each other through a series of connecting lines 15 . A portion 12A of the molding base corresponding to a first end side adjacent the flexible region 112 of the molding base 12 has a first side surface 1201 , the first side surface 1201 ) includes a first partial surface 1203 installed adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface, wherein the camera module of the first partial surface 1203 is The first angle to the optical axis is greater than the second angle to the optical axis of the second partial surface 1204 . A portion 12B of the molding base corresponding to a second end side distal to the flexible region 112 of the molding base 12 has a second side surface 1202 , the second side surface 1202 ) includes a third partial surface 1205 installed adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface, wherein the camera module of the third partial surface 1205 is The third angle with respect to the optical axis is greater than the fourth angle with respect to the optical axis of the fourth partial surface 1206 .

As shown in FIG. 6B , correspondingly, in order to further reduce the size of the photosensitive assembly 10 , the side of the second end opposite from the flexible region 112 of the molding base 12 is said It is suitable to remove at least a portion of the photosensitive assembly 10, for example by cutting or grinding with a knife. Here, a person skilled in the art to which the present invention pertains can understand that the installation of the side surface is the same as that shown in FIG. 6A, so it will not be repeated herein.

By allowing the molding material 14 to flow smoothly within the flow guide groove, the molding material 14 can form the connecting molding base 1200 on the circuit board alignment plate 1100 in the molding process, and the Since the connection-type molding base 1200 can form the optical window 122 closed in all directions at positions corresponding to the photosensitive elements 13, the formed connection-type photosensitive assembly fitting plate 1200 is cut. Then, a molding base 12 having the optical window 122 is formed on the photosensitive assembly 13 corresponding to each circuit board 11, so that an opening similar to that of FIG. 1C is formed in a part of the molding base. to prevent the optical window 122 from communicating with the outside of the molding base 12 .

That is, the molding material 14 of the present invention flows forward from the material supply ends 215A of the two flow guide grooves 2151 and 2152 to guide the flow of the entire base fitting plate forming guide groove 215 . The grooves 2151 and 2152 and the charging groove 2153 may be filled. The molding material 14 may flow from its material supply end 215A to its end 215B along the two flow guide grooves 2151 and 2152 before curing. Also, before the viscosity of the molding material 14 reaches a high value and hardens, the molding material 14 may fill the base alignment plate forming guide groove 215 so that the circuit board 11 and the photosensitive element ( 13) to prevent the connecting line 15 between them from being damaged by the high-viscosity molding material 14 flowing forward. In addition, through the symmetrical design of the two flow guide grooves 2151 and 2152, the fluid in the two flow guide grooves 2151 and 2152 basically flows forward with the same stride, and the two fluids are basically the filling By making them merge in the groove 2153, the molding material 14 in one flow guide groove flows into the other flow guide groove so that the molding material 14 in the other flow guide groove moves forward. prevent it from moving In addition, the connecting line 15 connecting the circuit board 11 and the photosensitive element 13 is irregularly shaken, so that eddy currents or turbulence that cause deformation and damage do not occur.

Correspondingly, since a material having a relatively high viscosity range may be selected for the molding material 14 of the present invention, when a material having a relatively low viscosity range is used, the molding material 14 may be used in the photosensitive element 13 during the molding process. ) to enter the photosensitive region 131 to avoid flash formation.

Also noteworthy, as shown in FIG. 7B , in order to facilitate demolding and pressing against the rigid region 111 of the circuit board 11, the first die 211 has a plurality of pressing It further comprises a block (216), wherein the outer edge (1201) of the molding base (12) and the outer edge of the rigid region (111) of the circuit board (11) may form a pressing edge (1111), That is, it is suitable for a region where the pressing block 216 is pressed on the rigid region 111 of the circuit board 11 in the molding process. The pressing block 216 is further pressed above the flexible regions 112 of the circuit board 11 in each row to prevent the molding material 14 from flowing into the flexible regions 112 . Also, the rigid regions 111 of the circuit boards 11 in each row are integrally molded to form the entire rigid region fitting plate 110, so that the first die presses the circuit boards 11 in each row. make it easy 7A, since the width W of the bottom end of the first flow guide groove 2151 on one side adjacent to the flexible region 112 is 0.2 mm to 1 mm, the photosensitive assembly 10 having a small size is manufactured. suitable for doing Correspondingly, in the manufactured photosensitive assembly 10, the distance W between the inner edge and the outer edge of the portion 12A of the molding base on one side adjacent to the flexible region 112 is 0.2 mm to 1 mm. do.

Correspondingly, the manufacturing method of the photosensitive assembly 12 of the camera module 100 provided in the present invention,

fixing the circuit board alignment plate (1100) to the second die (212) of the forming die (210);

The second die 212 and the first die 211 are joined through the die holding device 213 and the molten molding material 14 is fed into the forming die 210 in the base alignment plate forming guide groove ( 215) filling in;

hardening the molding material (14) in the base fitting plate forming guide groove (215) to form the connection-type molding base (1200) at a position corresponding to the base fitting plate forming guide groove (215); and

and cutting the photosensitive assembly alignment plate 1000 to obtain a plurality of the photosensitive assemblies 10 .

wherein the circuit board alignment plate 1100 includes one or more rows of circuit boards, each row of circuit boards includes one or more parallelly arranged circuit boards 11, and each of the circuit boards 11 is coupled to each other. and a rigid region 111 and a flexible region 112 , each of which is operably connected to the photosensitive element 13 . It also prevents the position corresponding to the optical window forming portion 214 from being filled with the molding material 14 . In addition, the connected molding base 1200 is integrally molded with the circuit board 11 of each row and the photosensitive element 13 of each row to form a photosensitive assembly alignment plate 1000, and the optical window molding part 214 ) to form the optical window 122 for providing an optical path to each of the photosensitive elements 13 at a position corresponding to the A first flow guide groove 2151 corresponding to the first end side adjacent to the flexible area 112 and a second flow guide groove 2151 corresponding to a portion distant from the flexible area 112 in the connected molding base 1200 . Between the two photosensitive elements 13 adjacent to each other among the photosensitive elements 13 in each row extending between the groove 2152 and the first flow guide groove 2151 and the second flow guide groove 2152, and a filling groove (2153) positioned between two adjacent optical window forming portions (214) for filling a molding material (14), wherein the first flow guide groove (2151) faces the optical window. A first side surface (1201), the second flow guide groove (2152) has a second side surface (1202) facing the optical window, wherein the first side surface is the photosensitive element (13) ), comprising a first partial surface (1203) provided adjacent to the first partial surface (1203) and a second partial surface (1204) connected to the first partial surface (1203), the second side surface (1202) being adjacent to the photosensitive element (13) a third partial surface (1205) configured to be configured such that a fourth partial surface (1206) connected to the third partial surface (1205), wherein the first partial surface (1203) is at a first angle with respect to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 with respect to the optical axis, and a third angle of the third partial surface 1205 with respect to the optical axis is greater than a third angle of the fourth partial surface 1206 with respect to the optical axis. Since it is larger than the fourth angle, the cross-sectional shapes of the first flow guide groove 2151 and the second flow guide groove 2152 are the first In the molding process in which the first flow guide groove 2151 and the second flow guide groove 2152 form the connected molding base 1200, the molding material 14 fills the base alignment plate forming guide groove 215. and the molding material 14 is transferred from the material supply end 215A of the first flow guide groove 2151 and the second flow guide groove 2152 to the first flow guide groove 2151 and the second flow guide groove 2151. Each of the guide grooves 2152 can reach the ends 215B. Each of the photosensitive assemblies 10 also includes the circuit board 11 , the photosensitive element 13 and the molding base 12 , wherein the molding base 12 comprises the circuit board 11 and the The optical window 122 is integrally molded with the photosensitive element 13 to provide an optical path to the photosensitive element 13 .

The method also includes a portion of the photosensitive assembly corresponding to the opposite second end side distal from the flexible region 112 of the molding base 12, ie a portion of the portion 12B of the molding base and the circuit board ( 11) may further include cutting a portion so that the molding base 12B has a cut surface 125 on an opposite second end side away from the flexible region 112 .

5A to 6B, the circuit board 11 includes a plurality of electronic components 113 assembled and formed in the rigid region 111 by a process such as SMT, and the electronic components 113 ) includes, but is not limited to, resistors, capacitors, drivers, and the like. In the embodiment of the present invention, the molding base 12 integrally surrounds the electronic component 113, and dust and impurities are attached to the electronic component 113 like a conventional camera module, and the photosensitive element 13 ) to prevent it from affecting the image effect. Also preferably, the plurality of electronic components 113 are adjacent to the flexible region 112 and are disposed in a first portion of the rigid region 111 excluding the circuit board 11 that is far from the flexible region 112 . It is provided on the end side 11A and the second end side, at least one wing side 11C located on both sides of the photosensitive element 11 on the rigid region 111, wherein the molding base 12 is the electron The parts 113 are integrally embedded.

That is, referring to FIGS. 8 and 9 , the electronic component 113 is not included in the corresponding first flow guide groove 2151 and the second flow guide groove 2152 , and the electronic component 113 is not included. can be intensively installed in the filling groove 2153, so that there is no blockage in the first flow guide groove 2151 and the second flow guide groove 2152 during the molding process, and the molding material 14 ) does not affect the forward flow along the first flow guide groove 2151 and the second flow guide groove 2152, so that the molding material 14 can be delivered to its material supply end 215A in the shortest time. ) to its end 215B.

The connecting line 15 may be installed on four side surfaces of the photosensitive element 13 , and may be intensively installed on the two wing sides 11C of the rigid region 111 of the circuit board 11 . Therefore, even in the molding process, it is intensively located in the filling groove 2153 so that the molding material 14 flows forward along the first flow guide groove 2151 and the second flow guide groove 2152. It can be seen that there is no effect

11 to 14 , the photosensitive assembly 10 of the present invention is applied to manufacturing the camera module 100 . The camera module includes a photosensitive assembly 10 , a lens 20 , and an optical filter assembly 30 . The photosensitive assembly 10 includes the circuit board 11 , the molding base 12 , and the photosensitive element 13 . The lens 20 includes a structural member 21 and one or more mirrors 22 received within the structural member 21 . The optical filter assembly 30 includes an optical filter element lens base 31 and an optical filter element 32, wherein the optical filter element lens base 31 is assembled on the top side of the molding base 12, The lens 20 is directly assembled on the top side of the optical filter element lens base 20 to form a focusing camera module. In this embodiment, the top side of the molding base 12 is flat, the optical filter element lens base 31 is assembled to the flat top surface of the molding base 12, and the optical filter element 32 is It serves to filter the light rays passing through the lens 20 , and may be implemented as, for example, an optical filter that filters infrared rays, which is located between the lens 20 and the photosensitive element 13 . In this way, the light beam passing through the lens 30 may pass through the optical filter element 32 and reach the photosensitive element 13 through the optical window 122, after undergoing a photoelectric conversion action. It allows the camera module 100 to provide an optical image.

13A, in the photosensitive assembly 10 of the camera module 100, the molding base corresponding to the first end side adjacent the flexible region 112 of the molding base 12 A portion 12A of the molding base has a first side surface 1201 facing the optical window and corresponds to an opposite second end side distal to the flexible region 112 of the molding base 12 . A portion 12B of the portion has a second side surface 1202 facing the optical window, wherein the first side surface comprises a first partial surface 1203 and a first side surface 1203 provided adjacent to the photosensitive element 13 . a second partial surface 1204 connected to the partial surface 1203, the second side surface 1202 having a third partial surface 1205 and a third partial surface provided adjacent the photosensitive element 13; a fourth subsurface (1206) connected to 1205), wherein the first angle of the first subsurface (1203) with respect to the optical axis of the camera module is the second angle of the second subsurface (1204) with respect to the optical axis The photosensitive assembly 10 of the small size is greater than 2 degrees, and the third angle of the third partial surface 1205 with respect to the optical axis is greater than the fourth angle of the fourth partial surface 1206 with respect to the optical axis. ) can be obtained, so that the size of the entire camera module 100 is further reduced. The second end side opposite from the flexible region 112 of the molding base 12 may be further cut so that the remaining portion after the molding base 12 is cut has the cut surface 125 . It can be understood that this is as shown in FIG. 14 . Also, as shown in FIG. 13B , the electronic component 113 may be centrally installed on at least one side of the two wing sides of the photosensitive assembly 10, for example, it may be concentrated on the two wing sides. can be known

In another variant embodiment, the optical filter element lens base 31 may not be provided, the optical filter element 32 is directly assembled to the molding base 12, or the optical filter element 32 is It may be assembled to the lens 20 , or the optical filter element 32 may be assembled to a support member such as a driver of the lens 20 or a fixed lens barrel.

As shown in FIG. 15 , the camera module 100 may include a support member 40 such as a driver or a fixed lens barrel. A camera module is formed, and the lens 20 is mounted on the driver. The top side of the molding base 12 has a concave groove 123 so that it can be used to mount the optical filter element lens base 31 , and the driver can be directly mounted on the top side of the molding base 12 . have. In another variant embodiment, the support member 40 is mounted on the optical filter element lens base 31 , or a part is mounted on the optical filter element lens base 31 and another part is mounted on the molding base. It can be mounted on (12).

As shown in FIG. 16 , in the embodiment and drawing of the present invention, the camera module 100 may include a support member 40 , which is a fixed lens barrel, and the lens 20 is the It is mounted on a fixed lens barrel. The top side of the molding base 12 is provided with a concave groove 123 so that it can be used to mount the optical filter element lens base 31 , and the fixed lens barrel is mounted on the top side of the molding base 12 . .

17A to 24 show the photosensitive assembly 10 of the camera module 100 and a manufacturing process thereof according to a second preferred embodiment of the present invention. In the present embodiment, similarly, the photosensitive assembly fitting plate 1000 is manufactured through a fitting plate operation method and then cut to obtain the photosensitive assembly 10 . Here, in the embodiment shown in Figs. 2 to 16, in a plurality of rows of circuit boards, the rigid region 111 of a circuit board in one row is arranged in such a way that the flexible region 112 of the circuit board in another row is adjacent. do. In the present embodiment, the rigid regions 111 may be disposed adjacent to each other in two rows of circuit boards adjacent to each other, and the corresponding flexible regions 112 may be spaced apart from each other. More preferably, the rigid regions 111 of the two-row circuit board adjacent to each other are integrally formed to form the entire rigid region in the middle of the two-row circuit board adjacent to each other.

Correspondingly, more specifically, forming a forming cavity 213 when the forming die 210 is closed, providing a plurality of optical window forming portions 214 and one or more base fitting plate forming guide grooves 215, , Each of the base fitting plate forming guide grooves 215 are located at both ends and are located in the middle of the first flow guide groove 2151, which is generally parallel and arranged along the longitudinal direction, and the two first flow guide grooves 2151 a second flow guide groove 2152, and a plurality of filling grooves 2153 extending in the transverse direction and extending between the two first flow guide grooves 2151 and the second flow guide groove 2152, Here, the filling grooves 2153 in the second row extend between the two first flow guide grooves 2151 and the second flow guide grooves 2152, respectively.

For example, in this embodiment, the circuit board alignment plate 1100 includes four rows of the circuit boards 11 , and two rows of the circuit boards 11 as one group, and each group of the circuit boards 11 . The rigid region 111 of the circuit board 11 in the two rows of (11) is located in the middle and is integrally formed, for example, the circuit board 11 in each row is provided with the six circuit boards and the The rigid region 111 is integrally molded. The forming die 210 is provided with two of the base fitting plate forming guide grooves 215, and each of the base fitting plate forming guide grooves 215 is the first flow guide groove 2151 and the second flow guide groove 2151, respectively. The seven filling grooves 2153 are provided between the guide grooves 2152 , the filling groove 2153 is provided between two optical window molding parts 214 adjacent to each other, and each of the optical window molding parts 214 . ) is located between the two adjacent charging grooves 2153. The molding material 14 flows along the two first flow guide grooves 2151 and the middle second flow guide groove 2152 from its material supply end 215A toward its end 215B; Adopt a two-stage design on the side surfaces facing the optical window of the first flow guide groove 2151 and the second flow guide groove 2152, and the molding material 14 fills each of the filling grooves 2153. and the molding material 14 forms the connected molding base 1200 after curing.

In this embodiment of the present invention, the connection-type molding base 1200 is integrally formed with the circuit boards 11 in two adjacent rows and the photosensitive elements 13 in two adjacent rows to form a photosensitive assembly alignment plate 1000. and an optical window 122 providing an optical path to the photosensitive element 13 is formed at a position corresponding to the optical window forming part 214 .

21A to 24 show a manufacturing process of the photosensitive assembly fitting plate 1000 of the camera module 100 according to a preferred embodiment of the present invention, and as shown in FIG. 21A, the forming die 210 is in a closed state, the circuit board 11 to be molded and the molding material 14 in a solid state are prepared in place, the molding material 14 in a solid state is heated, and the molding material 14 is It is melted in a fluid state or semi-solid state and transferred to the guide groove 215 for forming the base fitting plate, and flows forward along the first flow guide groove 2151 and the second flow guide groove 2152 and are adjacent to each other. The filling groove 2153 between the two optical window forming parts 214 is filled.

22 and 23 , the two first flow guide grooves 2151 , the second flow guide groove 2152 and the filling groove 2153 of the base fitting plate forming guide groove 215 . When all of the molding material 14 in a fluid state is filled in, the molding material 14 in a fluid state is cured through a curing process, and the circuit board 11 in two adjacent rows and the photosensitive elements 13 in two rows are adjacent to each other. to mold the connection-type molding base 1200 integrally formed with the .

As shown in FIG. 24 , after the molding material 14 is cured to form the connection-type molding base 1200 , the demolding process of the present invention is performed. That is, the first and second dies 211 and 212 are spaced apart from each other by the die fixing device 230 , and through this, the optical window molding unit 214 is separated from the connected molding base 1200 to separate the connected molding base 1200 . Two rows of the optical windows 122 corresponding to each of the photosensitive elements 13 are formed in the base 1200 .

As shown in FIG. 20B , the manufactured photosensitive assembly alignment plate 1000 may be further cut to manufacture the single photosensitive assembly 10 . Each of the photosensitive assemblies 10 includes one or more of the circuit board 11 , one or more of the photosensitive elements 13 and the molding base 12 integrally formed with the circuit board 11 and the photosensitive element 13 . includes 19A to 20B, the rigid regions 111 integrally formed between the two adjacent rows of the circuit boards 11 are separated, and the rigid regions to which the respective circuit boards 11 are coupled to each other are separated. 111 and the flexible region 112 are included. The molding base 12 integrally molds the rigid region 111 of the circuit board 11 and at least a partial non-photosensitive region 132 of the flexible region 13, and It is formed with the optical window 122 providing an optical path to the photosensitive region 131 .

It is notable that, when each single photosensitive assembly 10 manufactured by cutting the photosensitive assembly fitting plate 1000 is used to manufacture an autofocus camera module, the molding die 210 is formed by a plurality of driver pin slot molding blocks. 218 is further provided, and each of the driver pin slot forming blocks 218 extends into the filling groove 2153 of the base fitting plate forming guide groove 215 and enters the three flow guide grooves 2151 and 2152 , 2153) does not affect the flow of the molding material 14, and during the molding process, the molding material 14 in a fluid state does not fill the position corresponding to each of the driver pin slot forming blocks 218. After the curing step, a plurality of the optical windows 122 and a plurality of driver pin slots 124 are formed on the connection-type molding base 1200 of the photosensitive assembly alignment plate 1000, and a single angle manufactured by cutting The driving pin slot 124 is mounted on the molding base 12 of the photosensitive assembly 10 so that when the auto focus camera module 100 is manufactured, the pin of the driver is welded or conductively bonded to the photosensitive assembly 10 . It is connected to the circuit board 11 of the assembly 10 .

It is noteworthy that the method for manufacturing the photosensitive assembly alignment plate 1000 of the present invention is suitable for manufacturing the photosensitive assembly 10 having a small size. In the molding process, each of the first flow guide grooves 2151 has a first side surface 1201 facing the optical window, and the second flow guide groove 2152 has a second side facing the optical window. a surface (1202), wherein the first side surface is a first partial surface (1203) provided adjacent to the photosensitive element (13) and a second partial surface (1204) connected to the first partial surface (1203) wherein the second side surface (1202) includes a third partial surface (1205) installed adjacent to the photosensitive element (13) and a fourth partial surface (1206) connected to the third partial surface (1205); , wherein a first angle of the first partial surface 1203 with respect to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 with respect to the optical axis of the third partial surface 1205 A third angle with respect to the optical axis is greater than a fourth angle with respect to the optical axis of the fourth partial surface 1206 . In this way, the molding material 14 in a fluid state flows forward along the outer two first flow guide grooves 2151 and the middle second flow guide groove 2152 and the molding material 14 flows forward. The entire molding guide groove 215 of the base fitting plate is filled with the molding material 14 before the mold is cured.

Correspondingly, the photosensitive assembly alignment plate 1000 obtained in the molding process of the present invention includes one or more rows of the circuit boards 11 , one or more rows of the photosensitive elements 13 , and one or more of the connected molding bases 1200 . ) is included. The circuit boards 11 in each row comprise one or more of the circuit boards 11 arranged in parallel, each of the circuit boards 11 comprising a rigid region 111 and a flexible region 112 coupled to each other. do. Each of the connected molding bases 1200 is integrally formed with the circuit board 11 adjacent to each other in two rows and the photosensitive elements 13 adjacent to each other in two rows, and an optical window providing an optical path to each of the photosensitive elements 13 Forming a 122, the two rows of adjacent circuit boards 11 are arranged so that their flexible regions 112 are far from each other and their rigid regions 11 are adjacent to each other, so that each of the connected molding bases 1200 is has two end sides adjacent the flexible area 112 , wherein a portion of the connected molding base 1200 corresponding to each end side adjacent the flexible area 112 of the connected molding base 1200 . A 1200A has a first side surface 1201 facing the optical window, and a portion 1200B in which the connected molding base 1200 extends to the photosensitive elements 13 adjacent to each other in the two rows is the optical axis. a second side surface (1202) facing, wherein said first side surface (120) has a first partial surface (1203) provided adjacent said photosensitive element (13) and a second portion connected to said first partial surface (1203) a surface 1204, the second side surface 1202 having a third partial surface 1205 installed adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205 ), wherein a first angle of the first partial surface (1203) with respect to the optical axis of the camera module is greater than a second angle of the second partial surface (1204) with respect to the optical axis, and the third partial surface (1203) A third angle with respect to the optical axis of 1205 is greater than a fourth angle with respect to the optical axis of the fourth partial surface 1206 . Here, each of the end sides of the connection-type molding base 1200 is a coupling side of the rigid region 111 and the flexible region 112 of the circuit board 11 , that is, a close proximity to the flexible region 112 . Corresponding to the short side, the connection-type molding base 1200 extends between the photosensitive elements 3 adjacent to each other in two rows corresponding to the distal side far from the flexible region 112 of the circuit board 11 .

After the photosensitive assembly alignment plate 1000 is cut, a single photosensitive assembly 10 can be obtained, and in the cutting step, the connected molding base 1200 is formed on the other side except for the end portion 1200A. The molding base 12 may be obtained by cutting, wherein a portion 1200B of the molding base between the corresponding two adjacent rows of the photosensitive elements 13 is also cut.

Correspondingly, as shown in FIG. 20B , the photosensitive assembly 10 obtained after cutting includes the circuit board 11 , the photosensitive element 13 and the molding base 12 . Here, the circuit board 11 includes the rigid region 111 and the flexible region 112 coupled to each other. The molding base 12 is integrally molded with the circuit board 11 and the photosensitive element 13 and forms the optical window 122 that provides an optical path to the photosensitive element 13 . The circuit board 11 and the photosensitive element 13 are connected to each other through a series of connecting lines 15 . After cutting the photosensitive assembly alignment plate 1000, each photosensitive assembly 10 has an uncut first end side and a cut second end side similar to the above embodiment. A portion (12A) of the molding base (12A) corresponding to a first end side adjacent the flexible region (112) of the molding base (12) has a first side surface (1201) facing the optical window, A portion 12B of the molding base corresponding to the opposite second end side distal to the flexible region 112 of the base 12 has a second side surface 1202 facing the optical window, wherein The first side surface includes a first partial surface 1203 installed adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, the second side surface ( 1202 includes a third partial surface 1205 provided adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein the first partial surface 1203 ), a first angle with respect to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 with respect to the optical axis, and a third angle of the third partial surface 1205 with respect to the optical axis is the second angle with respect to the optical axis. greater than a fourth angle with respect to the optical axis of the four-part surface 1206 . In this way, by setting the shape of the cross section so that the molding material 14 can fill the guide groove 215 for forming the base alignment plate in the molding process, it is possible to prevent a defective photosensitive assembly from occurring.

That is, in this embodiment of the present invention, the molding material 14 flows forward from the material supply end 215A of the three flow guide grooves 2151 and 2152 to form the entire base fitting plate forming guide groove ( The flow guide grooves 2151 and 2152 of 215 and the filling groove 2153 may be filled. The molding material 14 may flow from its material supply end 215A to its end 215B along the three flow guide grooves 2151 and 2152 before curing. Also, before the viscosity of the molding material 14 reaches a high value and hardens, the molding material 14 may fill the base alignment plate forming guide groove 215 so that the circuit board 11 and the photosensitive element are formed. The connecting line 15 between (13) is prevented from being damaged by the high-viscosity molding material (14) flowing forward. In addition, by allowing the fluid in the three flow guide grooves 2151 and 2152 to flow forward with basically the same stride, the molding material 14 in one flow guide groove flows into the other flow guide groove. The molding material 14 in the other flow guide groove is prevented from flowing forward. In addition, the connecting line 15 connecting the circuit board 11 and the photosensitive element 13 is irregularly shaken, so that eddy currents or turbulence that cause deformation and damage do not occur.

As shown in FIG. 21B , in order to facilitate demolding and pressing against the rigid region 111 of the circuit board 11 , the first die 211 further includes a plurality of pressing blocks 216 . wherein the outer edge 1201 of the molding base 12 and the outer edge of the rigid region 111 of the circuit board 11 may form a pressing edge 1111, that is, in the molding process Two of the pressing blocks 216 are respectively pressed against the regions on the rigid region 111 of the circuit board 11 in two rows. The two pressing blocks 216 are pressed above the flexible regions 112 of each group of the circuit boards 11 in two rows adjacent to each other so that the molding material 14 flows into the flexible regions 112 . prevent doing In addition, the rigid regions 111 of the two adjacent rows of the circuit board 11 are integrally molded to form the entire rigid region alignment plate 110, so that the two pressing blocks 216 are aligned with the entire rigid region. Each of the two end sides of the plate 110 is pressed, so that the first die 211 can easily press the two adjacent rows of the circuit boards 11 . In addition, since the width W of the bottom end of the first flow guide groove 2151 is 0.2 mm to 1 mm, it is suitable for manufacturing a photosensitive assembly having a small size. Correspondingly, in the manufactured photosensitive assembly 10, the distance W between the inner edge and the outer edge of the portion 12A of the molding base on one side adjacent to the flexible region 112 is 0.2 mm to 1 mm. do.

Correspondingly, the manufacturing method of the photosensitive assembly 12 of the camera module 100 provided in this embodiment of the present invention,

fixing the circuit board alignment plate (1100) to the second die (212) of the forming die (210);

The second die 212 and the first die 211 are joined through the die holding device 213 and the molten molding material 14 is fed into the forming die 210 in the base alignment plate forming guide groove ( 215) filling in;

hardening the molding material (14) in the base fitting plate forming guide groove (215) to form a connection-type molding base (1200) at a position corresponding to the base fitting plate forming guide groove (215); and

and cutting the photosensitive assembly alignment plate 1000 to obtain a plurality of the photosensitive assemblies 10 .

wherein the circuit board alignment plate 1100 includes one or more rows of circuit boards, each row of circuit boards includes one or more parallelly arranged circuit boards 11, and each of the circuit boards 11 is coupled to each other. and a rigid region 111 and a flexible region 112 , each of which is operably connected to the photosensitive element 13 . It also prevents the position corresponding to the optical window forming portion 214 from being filled with the molding material 14 . In addition, the connection-type molding base 1200 is integrally molded with the circuit boards 11 in two adjacent rows and the photosensitive elements 13 in two adjacent rows to form a photosensitive assembly alignment plate 1000, and the optical window forming part An optical window 122 providing an optical path to each of the photosensitive elements 13 is formed at a position corresponding to 214 , wherein the circuit board 12 adjacent to each other in the two rows comprises the flexible region 112 . ) are far from each other and their rigid regions 11 are adjacent to each other, wherein the base fitting plate forming guide groove 215 is two ends adjacent to the flexible region 112 in the connected molding base 1200 . a first flow guide groove 2151 corresponding to the side, a second flow guide groove 2152 corresponding to an area between the photosensitive elements 13 adjacent to each other in the two rows, and two first flow guide grooves 2151 ) and the second flow guide groove 2152 to fill the molding material 14 between the two photosensitive elements 13 adjacent to each other of the photosensitive elements 13 in each row, and two adjacent optical elements 13 to each other. and a filling groove (2153) positioned between the window forming parts (214), wherein the first flow guide groove (2151) has a first side surface (1201) facing the optical window, and the second The flow guide groove 2152 has a second side surface 1202 facing the optical window, wherein the first side surface includes a first partial surface 1203 and a second surface 1203 installed adjacent to the photosensitive element 13 . a second partial surface (1204) connected to a first partial surface (1203), the second side surface (1202) having a third partial surface (1205) and a third partial surface (1205) installed adjacent to the photosensitive element (13) a fourth subsurface (1206) connected to (1205), wherein a first angle of the first subsurface (1203) with respect to the optical axis of the camera module is relative to the optical axis of the second subsurface (1204) greater than the second angle, and a third angle of the third partial surface 1205 with respect to the optical axis is the fourth partial surface 12 06) is greater than the fourth angle with respect to the optical axis. Each of the photosensitive assemblies 10 also includes the circuit board 11 , the photosensitive element 13 and the molding base 12 , wherein the molding base 12 comprises the circuit board 11 and the The optical window 122 is integrally molded with the photosensitive element 13 to provide an optical path to the photosensitive element 13 .

The method also includes cutting the portion of the photosensitive assembly 10 positioned between the two adjacent rows of the photosensitive assemblies 13 to the opposite end side away from the flexible region 112 of the molding base 12 . The method may further include obtaining a portion 12B of the molding base corresponding to . That is, it is suitable for cutting from the rigid region 111 of the circuit board 11 and the molding base 12 of the photosensitive assembly 10 between the two adjacent rows of the photosensitive elements 13 and adjacent to each other. The distal side far from the flexible region 112 of the photosensitive elements 13 of the two rows is the cut side, respectively, and each of the photosensitive elements 13 forms a cut surface 125 .

The circuit board 11 includes a plurality of electronic components 113 assembled and formed in the rigid region 111 by a process such as SMT, and includes two corresponding first flow-guided grooves 2151 and the second Since the electronic component 113 is not included in the two-flow groove 2152 and the electronic component 113 can be intensively installed in the charging groove 2153, during the molding process, the two There is no blockage within the groove 2151 and the second flow channel groove 2152 , and the molding material 14 is separated from the two first flow guide groove 2151 and the second flow guide groove 2152 . Since it does not affect the forward flow along

In the step of manufacturing the single photosensitive assembly 10 , a plurality of independent photosensitive assemblies 10 may be obtained by cutting the photosensitive assembly alignment plate 1000 and used in manufacturing a single camera module. Two or more photosensitive assemblies 10 integrally connected may be divided from the photosensitive assembly alignment plate 1000 and used to manufacture a separate type array camera module. That is, each of the camera modules of the array camera module has the independent photosensitive assembly 10, wherein two or more of the photosensitive assemblies 10 may each be connected to the control main board of the same electronic device, In this way, the array camera module manufactured by the two or more photosensitive assemblies 10 may transmit images photographed by the plurality of camera modules to the control main board to perform image information processing.

As shown in Fig. 25A, the photosensitive assembly fitting plate 1000 according to another modified embodiment based on the first embodiment of the present invention includes the photosensitive assembly fitting plate 1000 obtained by the molding process of the present invention, This includes one or more rows of the circuit board 11 , one or more rows of the photosensitive elements 13 , one or more rows of protective frames 16 , and one or more of the connected molding bases 1200 . The circuit boards 11 in each row include one or more of the circuit boards 11 arranged in parallel, each of the circuit boards 11 having the rigid region 111 and the flexible region 112 coupled to each other. includes Each of the protective frames 16 is formed on the photosensitive element 13 and is located outside the non-photosensitive region 132 of the photosensitive element 13, that is, the photosensitive region 131, and each of the connected molding bases ( The optical window 1200 is integrally formed on the circuit board 11 in one row, the photosensitive elements 13 in one row and the protective frame 16 in one row to provide an optical path to each of the photosensitive elements 13. (122) is formed.

That is, before molding the connected molding base 1200, the protective frame 16 is first formed on each of the photosensitive elements 13, which may be formed of a material different from the molding material 14. , for example, an adhesive that coats the non-photosensitive region 132 of the photosensitive element 13, or it may be a rigid frame and adhere to the non-photosensitive region 132 of the photosensitive element 13 by an adhesive. can be attached. Therefore, in the process of molding the connection-type molding base 1200, the optical window molding part 214 presses the protective frame 16 having a predetermined hardness, and the molding material 14 in a fluid state is When entering the base fitting plate forming guide groove 215, the molding material 14 in a fluid state flows into the photosensitive region 131 of the photosensitive element 13 to prevent the molding flash from being formed. . For example, in a specific example, the protective frame 16 is formed of an adhesive having a predetermined elasticity and hardness, and has a viscosity after being cured to remove dust particles in the photosensitive assembly 10 of the manufactured camera module. It can be implemented to be used for bonding. More specifically, in some embodiments, the shore hardness range of the protective frame 16 is A50 to A80, and the elastic modulus range is 0.1 Gpa to 1 Gpa.

Similarly, the portion 1200A of the articulated molding base corresponding to the first end side adjacent the flexible region 112 of the articulated molding base 1200 has a first side surface 1201 facing the optical window. and a portion (1200B) of the articulated molding base (1200), corresponding to an opposite second end side distal from the flexible region (112) of the articulated molding base (1200), has a second side surface (1200B) facing the optical window ( 1202) are provided. wherein the first side surface includes a first partial surface 1203 installed adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, the second side surface Surface 1202 includes a third partial surface 1205 provided adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein the first partial surface A first angle with respect to the optical axis of the camera module of 1203 is greater than a second angle with respect to the optical axis of the second partial surface 1204, and a third angle of the third partial surface 1205 with respect to the optical axis is greater than a fourth angle of the fourth partial surface 1206 with respect to the optical axis. Here, the first end side of the connection-type molding base 1200 is a coupling side of the rigid region 111 and the flexible region 112 of the circuit board 11 , that is, close to the flexible region 112 . Corresponds to the proximal end, and the second end of the connected molding base 1200 corresponds to the distal end of the circuit board 11 away from the flexible region 112 .

After the photosensitive assembly alignment plate 1000 is cut, a single photosensitive assembly 10 can be obtained, and as shown in FIG. 25C , here, during the cutting step, the first The molding base 12 may be obtained by cutting except for the end side and the two wing sides of the second end side, and the corresponding portion 1200B of the molding base on the second end side may not be cut. In this way, the photosensitive assembly 10 with the portion 1200B of the connecting molding base on the side of a pair of opposite wings is obtained.

Correspondingly, the photosensitive assembly 10 includes the circuit board 11 , the photosensitive element 13 , the protection frame 16 , and the molding base 12 . Here, the circuit board 11 includes the rigid region 111 and the flexible region 112 coupled to each other. The molding base 12 is integrally formed with the circuit board 11 , the photosensitive element 13 and the protective frame 16 , and the optical window 122 provides an optical path to the photosensitive element 13 . to form The circuit board 11 and the photosensitive element 13 are connected to each other through a series of connecting lines 15 . The protective frame 16 may be located inside the connecting line 15 or may cover at least a portion of the connecting line 15 . A portion 12A of the molding base corresponding to the first end side adjacent the flexible region 112 of the molding base 12 has a first side surface 1201, A portion 12B of the molding base, which corresponds to an opposite second end side distal to the flexible area 112 , has a second side surface 1202 . wherein the first side surface includes a first partial surface 1203 installed adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, the second side surface Surface 1202 includes a third partial surface 1205 provided adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein the first partial surface A first angle with respect to the optical axis of the camera module of 1203 is greater than a second angle with respect to the optical axis of the second partial surface 1204, and a third angle of the third partial surface 1205 with respect to the optical axis is greater than a fourth angle of the fourth partial surface 1206 with respect to the optical axis.

25C , correspondingly, in order to further reduce the size of the photosensitive assembly 10 , the second end side opposite from the flexible region 112 of the molding base 12 . It is suitable to remove at least a portion of the photosensitive assembly 10 , forming a cut surface 125 .

As shown in Fig. 25B, the photosensitive assembly alignment plate 1000 obtained by the molding process according to the modified implementation method of the second embodiment of the present invention has one or more rows of the circuit boards 11 and one or more rows of the photosensitive assembly plates. an element 13 , one or more rows of protective frames 16 , and one or more of the connected molding bases 1200 , each of the protective frames 16 being formed on the corresponding photosensitive element 13 . The circuit boards 11 in each row include one or more of the circuit boards 11 arranged in parallel, each of the circuit boards 11 having the rigid region 111 and the flexible region 112 coupled to each other. includes Each of the connection-type molding bases 1200 is integrally formed on the circuit board 11 adjacent to each other in two rows, the photosensitive elements 13 in two rows, and the protective frame 16 adjacent to each other in two rows, so that each photosensitive element An optical window 122 providing an optical path to 13 is formed, and the circuit boards 11 adjacent to each other in the two rows are arranged so that their flexible regions 112 are far from each other and their rigid regions 11 are adjacent to each other. arranged such that each of the articulated molding bases 1200 has two end sides adjacent the flexible region 112 , wherein each adjacent the flexible region 112 of the articulated molding base 1200 is disposed. A portion 1200A of the connected molding base corresponding to the end side has a first side surface 1201, and the portion in which the connected molding base 1200 extends between the two rows of mutually adjacent photosensitive elements 13 1200B has a second side surface 1202 . wherein the first side surface includes a first partial surface 1203 provided adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, the second side surface The surface 1202 includes a third partial surface 1205 provided adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein the first partial surface A first angle with respect to the optical axis of the camera module of 1203 is greater than a second angle with respect to the optical axis of the second partial surface 1204, and a third angle of the third partial surface 1205 with respect to the optical axis is greater than a fourth angle of the fourth partial surface 1206 with respect to the optical axis. Here, each of the end sides of the connection-type molding base 1200 is a coupling side of the rigid region 111 and the flexible region 112 of the circuit board 11 , that is, a close proximity to the flexible region 112 . Corresponding to the short side, the connection-type molding base 1200 extends between the photosensitive elements 3 adjacent to each other in two rows corresponding to the distal side far from the flexible region 112 of the circuit board 11 .

After the photosensitive assembly alignment plate 1000 is cut, a single photosensitive assembly 10 can be obtained, wherein, during the cutting step, the connected molding base 1200 except for the end-side portion 1200A. The sides are cut to obtain the molding base 12 , wherein the correspondingly adjacent two rows of parts 1200B of the molding base are also cut, in this way the parts of the connecting molding base on the pair of opposite wing sides Obtain the photosensitive assembly 10 with 1200C. A portion 12A of the molding base corresponding to the first end side adjacent the flexible region 112 of the molding base 12 has a first side surface 1201, A portion 12B of the molding base, which corresponds to an opposite second end side distal to the flexible area 112 , has a second side surface 1202 . wherein the first side surface includes a first partial surface 1203 installed adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, the second side surface Surface 1202 includes a third partial surface 1205 provided adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein the first partial surface A first angle with respect to the optical axis of the camera module of 1203 is greater than a second angle with respect to the optical axis of the second partial surface 1204, and a third angle of the third partial surface 1205 with respect to the optical axis is The fourth partial surface 1206 is greater than a fourth angle with respect to the optical axis as shown in FIG. 25C.

26A-27, the molding process of the fitting plate operation may also be used to fabricate a photosensitive assembly 10 having two or more of the optical windows 122, wherein the photosensitive assembly (10) can be used to manufacture an array camera module of a common substrate. That is, taking the fabrication of the photosensitive assembly 10 of the dual camera module as an example, in the molding process of each circuit board 11 of the circuit board alignment plate 1100 , the circuit board 111 has two optical The window forming part 214 is installed correspondingly, and after the molding process and cutting is completed in this way, each said circuit board 11 is provided with two said optical windows 122 sharing said circuit board 11 . One molding base 12 is formed, and the two photosensitive elements 13 and the two lenses 30 are mounted correspondingly. In addition, the circuit board 11 may be connected to the control main board of the electronic device. In this way, the array camera module manufactured in this embodiment transmits images captured by a plurality of camera modules to the control main board to process image information. can be performed.

28 to 31C show its photosensitive assembly 410 of a camera module 100 according to a third preferred embodiment of the present invention. The camera module 400 may be applied to various electronic devices 300 , and as shown in FIG. 44 , the electronic device 300 includes a device body 301 and one mounted on the device body 301 . The above camera module is included, and the electronic device 300 is, for example, a smartphone, a wearable device, a computer, a television, a means of transportation, a camera, a monitoring device, etc., but is not limited thereto, and the camera module is installed in the electronic device. It is mounted to realize image acquisition and reproduction of the target object.

More specifically, the camera module 400 illustrated in the drawings includes the photosensitive assembly 410 and the lens 430 . The photosensitive assembly 410 includes a circuit board 411, a molding base 412, a photosensitive element 413, and an optical filter element 414, the molding base 412 includes a base body 4121, , which is integrally molded with the circuit board 411 and the photosensitive element 413 to form an optical window 4122 , the optical window 4122 is a closed space, and an optical path to the photosensitive element 413 . provides Here, since the molding base 412 of the present invention is integrally molded with the circuit board 411 and the photosensitive element 413 through a molding process, for example, a conventional molding process, the molding base 412 is formed. ) can replace the lens base or holder of the conventional camera module, so there is no need to attach the lens base or holder to the circuit board 11 with an adhesive as in the conventional packaging process. The optical filter element 414 may be, for example, an infrared optical filter element, assembled on the top of the molding base 412 , and positioned between the photosensitive element 413 and the lens 430 , and the lens Infrared rays passing through (431) are filtered.

The circuit board 411 may be a rigid substrate, a flexible substrate, a rigid composite substrate, a ceramic substrate, or the like. In this embodiment, the circuit board 11 is a rigid composite board, which includes a board 4111 and a plurality of electronic components 4112 assembled and formed on the board 4111 by a process such as SMT. , the electronic component 4112 includes, but is not limited to, a resistor, a capacitor, a driver, and the like. In the embodiment of the present invention, the molding base 412 integrally surrounds the electronic component 4112, and dust and impurities are attached to the electronic component 4112 like a conventional camera module, and the photosensitive element 413 ) to prevent it from affecting the image effect. The electronic component 4112 may be absent from the circuit board 411 , and the electronic component 4112 is mounted on the top surface of the board 4111 , the bottom surface of the board 4111 , or the board may be embedded in 4111 . When installed on the top surface of the substrate 4111 , the electronic component 4112 may be installed around the photosensitive element 413 , and located on a plurality of side surfaces of the photosensitive element 413 , for example, the The electronic component 4112 may be installed on opposite sides of the two pairs of the photosensitive element 413 , or may be installed on opposite sides of the pair of electronic components 4112 .

The circuit board 411 and the photosensitive element 413 are operably connected to each other, and as shown in the figure, the circuit board 411 and the photosensitive element 413 are electrically connected to the surfaces of the circuit board 411 and the photosensitive element 413 like a pad. are each, and both are connected through one or more groups of connecting lines 415 , and the molding base 412 embeds the connecting lines 415 integrally.

In this preferred embodiment of the present invention, the camera module 400 includes the photosensitive assembly 410 , the lens 430 , and a lens support member 440 . The lens 430 is assembled to the lens support member 440 to form a lens assembly. The lens support member 440 may be a driver or a fixed lens barrel. In this embodiment, the lens support member is a driver, and the driver is implemented with a voice coil motor, a piezoelectric motor, a thermodynamic driver, a microelectronic driver, etc. to implement an autofocus function, thereby forming an autofocus camera module. It can be seen that in another embodiment, the lens 430 may be directly assembled to the molding base 412 of the photosensitive assembly 410 .

The optical filter element 414 includes an optical filter element body 4141 and a light blocking layer 4142, the light blocking layer 4142 is located on the bottom side of the optical filter element body 4141 and the optical filter element body It is located between 4141 and the molding base 412, and the light blocking layer 4142 is a light absorbing material, which means that the optical filter element body 4141 has an effective light transmitting area 41411 in the middle and a peripheral area 41412 ), and the light rays passing through the lens 430 can reach the inside of the molding base 412 only through the effective light-transmitting area 41411, and the optical filter element body 4141 material has an IR film (infrared blocking film), AR film (anti-reflective coating film), white glass, blue glass, resin material, coating composite material, crystal, and the like may be included. The light blocking layer 4142 has an annular structure and has an open window in the middle. That is, the light blocking layer 4142 forms an optical path 41420 through which light rays enter the optical window 4122 and continuously reach the photosensitive element 413, and stray light reaching the photosensitive element 413 is blocked. Reduce.

The photosensitive element 413 has an intermediate photosensitive region 4131 and a non-photosensitive region 4132 positioned around the photosensitive region 4113, and the light blocking layer 4142 has an inner edge 41421 and an outer edge. (41422) is provided. The distance between the inner edge 41421 of the light blocking layer 4142 and the optical axis X is equal to or slightly shorter than the distance between the outer edge 41311 of the photosensitive region 4131 and the optical axis X.

The outer edge 41422 of the light blocking layer 4142 is located outside the inner edge 41241 of the top surface 4124 of the molding base 412 . That is, a light-transmitting region is not formed between the inner edge 41241 of the top surface 4124 of the molding base 412 and the outer edge 41422 of the light blocking layer 4142 .

In this embodiment of the present invention, the inner surface of the base body 4121 of the molding base 412 has an inner surface of a plurality of sections along the surrounding direction, for example, it may be an inner surface of 4 sections, , the inner surface of each section has a plurality of parts extending in different directions, for example, the base body 4121 of the molding base 412 has three parts, namely, around the optical window 4122 shown in Fig. 29A. The photosensitive element coupling part 41211 and the top extension part 41212 positioned around the photosensitive element 413 are integrally coupled to the outer peripheral surface of the photosensitive element 413 and the top surface of the circuit board 411 . and a circuit board coupling part 41213, the three parts being integrally extended to form an overall structure. The photosensitive element coupling part 41211 has an inner surface integrally extending from the photosensitive element 413, wherein the inner surface of at least one section extending integrally from the photosensitive element 413 and enclosing the inner surface is Defined by the first portion inner surface 41231 of the molding base 412 , the top extension portion 41212 has an inner surface integrally extending from the photosensitive element coupling portion 41211 , which is the molding base 412 . It forms a second partial inner surface 41232 of the base 412 , the second partial inner surface 41232 extending integrally with the first partial inner surface 41231 . Each of the first inner surface 41231 and the second inner surface 41232 is an inner surface of any one section surrounding the inner surface of the base body 4121, or the inner surface of a plurality of sections has the same structure. It will be understood that it has a first partial inner surface 41231 and the second partial inner surface 41232 , or that all inner surfaces have the first partial inner surface 41231 and the second partial inner surface 41232 . can

The inner surfaces 41231 and 41232 of each of the photosensitive element coupling portion 41211 and the top extension portion 41212 respectively extend at different inclinations, and the inner surface 41232 of the second portion of the top extension portion 11212 , respectively. ) of the photosensitive element coupling portion 41211 extends upward at a larger inclination than the inner surface 41231 of the first portion, or the inner surface 41232 of the second portion of the top extension 41212 is substantially It extends upwardly without an inclination, ie, the inner surface 41232 of the second portion of the top extension 41212 extends essentially perpendicular to the top surface of the photosensitive element 413, the top extension 41212 may be a vertical extension to make the area of the top surface of the top extension 41212 relatively large. That is, the top surface of the top extension 41212 determines the area of the top surface 4124 of the molding base 412 , and the photosensitive element coupling part 41211 and the top extension part 41212 are formed. Such an elongated structure may increase the area of the top surface 4124 of the molding base 412, thereby providing a larger mounting area for a lens or lens assembly above the photosensitive assembly 410, and thus The lens or lens assembly may be more stably mounted and the area of the optical filter element 414 may be reduced.

That is, in order to facilitate demolding in the molding process and prevent stray light, the structure formed by the photosensitive element coupling part 41211 has a relatively small inclination ratio of the inner surface 41231 of the first portion defined by the inner surface thereof. The second partial inner surface 41232 obliquely extending upwardly from the photosensitive element 413 and defined by the inner surface of the top side extension 41212 is bent from the first partial inner surface 41231 It extends integrally and extends upwards with or without a relatively large inclination rate. That is, an included angle is formed between the inner surface 41232 of the second portion and the inner surface 41231 of the first portion of the molding base 412, and it extends obliquely upward at a relatively fixed inclination ratio, so that the molding base It is possible to effectively increase the size of the area of the top extension 4124 of the 412 .

As shown in FIG. 29B, the included angle between the first partial inner surface 41231 defined by the inner surface of the photosensitive element coupling part 41211 and the optical axis X of the camera module 400 is α, An included angle between the second partial inner surface 41232 defined by the inner surface of the top extension 41212 and the optical axis X of the camera module 400 is β, where the value range of α is 3 ° to 80° and the value range of β is 0° to 10° and α>β. For example, in a specific embodiment, the value of α is 3° and the value of β is 0°. In a specific embodiment, the value of α is 30° and the value of β is 0°. In a specific embodiment, the value of α is 60° and the value of β is 0°. In a specific embodiment, the value of α is 45° and the value of β is 5°. In a specific embodiment, the value of α is 80° and the value of β is 10°.

That is, the included angle β between the second part inner surface 41232 defined by the inner surface of the top extension 41212 and the optical axis X of the camera module 400 is the photosensitive element coupling portion ( Since the inner surface of the 41211 is smaller than the included angle α between the first partial inner surface 41231 and the optical axis X of the camera module 400, the second portion of the top extension 41212 is The two-part inner surface 41232 is made to extend upward at a greater inclination rate or in a direction perpendicular to the photosensitive element 413 to increase the area of the top surface 4124 of the molding base 412 .

As shown in FIG. 29B, in this preferred embodiment of the present invention, the thickness H1 of the photosensitive element coupling portion 41211 preferably ranges from 0.05 mm to 0.7 mm, and the top extension portion ( 41212) thickness (H2) values range from 0.02 mm to 0.6 mm. For example, in a specific embodiment, the value range of the thickness H1 of the photosensitive element coupling part 41211 is 0.08 mm, and the value range of the thickness H2 of the top extension part 41212 is 0.5 mm. In a specific embodiment, the value range of the thickness H1 of the photosensitive element coupling part 41211 is 0.4 mm, and the value range of the thickness H2 of the top extension part 41212 is 0.3 mm. In a specific embodiment, the value range of the thickness H1 of the photosensitive element coupling part 41211 is 0.5 mm, and the value range of the thickness H2 of the top extension part 42012 is 0.1 mm.

The second portion inner surface 41232 of the top extension portion 41212 is bent from the first portion inner surface 41231 and extends in a direction having a smaller included angle with the optical axis X, in the molding process By avoiding the connection line 415 between the circuit board 411 and the photosensitive element 413 by the pressure terminal pressed to the photosensitive element 413, it is possible to prevent the connection line 415 from being pressed and damaged. It can be seen that there is That is, in some circumstances, when the molding base 412 to be formed is extended with a relatively relatively small fixed inclination rate, for example, when the angle between the inner surface and the optical axis X is 45° to 80°, in the molding process A pressure terminal pressed to the photosensitive element 413 may collide with the connection line 415 , and the connection line 415 may be damaged.

As shown in FIG. 30 , the included angle α between the first part inner surface 41231 defined by the inner surface of the photosensitive element coupling part 41211 and the optical axis X of the camera module 400 is It may be relatively large, and in this way, the light beam L12 incident on the inner surface 41231 of the first portion is directly reflected on the photosensitive element 413 and does not form stray light. That is, the photosensitive element coupling part 41211 and the top extension part 41212 are matched with each other, and the structure of the photosensitive element coupling part 41211 facilitates demolding and reduces stray light, and the top extension part 41212 is used to increase the area of the top surface 4124 of the molding base 412, and this structure of the top extension 41212 is such that the connecting line 415 is connected by a pressure terminal in the molding process. Prevents damage from being pressurized.

That is, preferably, as shown in FIG. 29B, a position 41230 where the first partial inner surface 41231 and the second partial inner surface 41232 are connected is the outer edge of the photosensitive element 413 ( 41321), that is, the distance D1 between the position 41230 where the first inner surface 41231 and the second inner surface 41232 are connected and the optical axis X is equal to the distance D1 of the photosensitive element Since the distance D2 between the outer edge 41321 of the non-photosensitive region 4132 of 413 and the optical axis X is shorter than the distance D2 of the non-photosensitive region 4132, the portion between the photosensitive element coupling portion 41211 and the photosensitive element 413 is The relatively small size reduces the likelihood that the molding material 416 will create a “flash” in the molding process.

More preferably, a position 41230 where the first inner surface 41231 and the second inner surface 41232 are connected is located inside the connecting line 415 , and the first inner surface 41231 is located inside the connecting line 415 . The distance D3 between the position 41230 where the inner surface 41232 is connected to the optical axis X is shorter than the distance D3 between the connecting line 415 and the optical axis X. The transition point between the photosensitive element coupling part 41211 and the top extension part 41112 does not exceed the position where the connection line 415 is located, that is, the photosensitive element coupling part 41211 is located at the position of the connection line 415 . Since the transition to the photosensitive element 41212 is completed before being extended to , the connection line 415 is prevented from being damaged by being pressed by the pressure terminal in the molding process. For example, when the top extension 41212 is a vertical extension, the position of the inner edge 41241 of the top surface 4124 of the molding base 412 and the optical axis X of the camera module 400 ) is not shorter than the distance between the connecting line 415 and the optical axis X of the camera module, so that the top extension 41212 is the area of the top surface 4124 of the molding base 412 . , and the connecting line 415 is integrally buried to prevent the connecting line 415 from being damaged.

The inner surface 41231 of the photosensitive element coupling portion 41211 of the molding base 412 extends obliquely to facilitate demolding in the molding process and reduce stray light reaching the photosensitive element 413, and the top The inner surface 41232 of the side extension portion 11212 is integrally bent and extended from the inner surface 41231 of the photosensitive element coupling portion 41211 so that the photosensitive element coupling portion 41211 and the top extension portion 41212 are formed. ), it can be seen that the area of the top surface of the molding base 412 is maximally increased in a situation in which stray light is reduced.

In addition, when the light blocking layer 4142 is provided on the bottom side of the optical filter element 414 , as shown in FIG. 30 , the upper surface of the optical filter element body 4141 of the optical filter element 414 . Some of the stray light L11 incident on the light filter element body 4141 is reflected by the upper surface of the optical filter element body 4141 and does not enter the optical window 4122 of the molding base 412, and is located above the light blocking layer 4142. When the light-transmitting area 41111 is refracted and entered into the peripheral area 41412 , it is absorbed by the light-blocking layer 4142 and cannot enter the optical window 4122 inside the molding base 412 . The purpose of blocking stray light is achieved.

When some stray light L12 passes through the effective light-transmitting area 41411 of the optical filter element body 4141 and is incident to the first inner surface 41231 , the second inclined light of the molding base 412 is It is reflected up to the light blocking layer 4142 by the first inner surface 41231 or is further reflected to the light blocking layer 4142 by the second inner surface 41232 to be absorbed by the light blocking layer 4142 . Therefore, even the photosensitive element 413 is further reflected, so that the image quality of the camera module 400 cannot be affected.

Correspondingly, the light blocking layer 4142 and the inner surface 41232 of the second portion of the molding base 412 are adjacent to each other, and the inner surface 41232 of the second portion of the molding base 412 is the Extending downward from the light blocking layer 4142, the outer portion of the optical window 4122 between the light blocking layer 4142, the first partial inner surface 41231 and the second partial inner surface 41232 is light suppressing. A groove 41221 is formed, and the light suppression groove 41221 is a space for suppressing emission of stray light. More specifically, as shown in FIG. 30 , the stray light L12 enters the light suppression groove 41221 and cannot be emitted from the light suppression groove 41221 .

Since the light blocking layer 4142 and the inner surface 41232 of the second portion of the molding base 412 are adjacent to each other, the light blocking layer 4142 passes through the optical filter element body 4141 to allow the second Effectively reduce the light rays reaching the partial inner surface 41232 so that the light rays incident on the second partial inner surface 41232 are reflected by the second partial inner surface 41232 and reach the photosensitive element 413 This prevents stray light from being formed and affecting the image quality of the camera module 400 . As shown in FIG. 30 , the second partial inner surface 41232 extends downward from the light blocking layer 4142 , and the light blocking layer 4142 extends from the second partial inner surface 41232 in a horizontal direction. The light-suppressing groove 41221 forming this structure is extended, and an included angle γ is formed between the light blocking layer 4142 and the inner surface 41232 of the second part, and the included angle γ is an acute angle or a right angle. ) prevents the light rays incident on the inner surface 4123 from being reflected toward the photosensitive element 413 to form stray light.

The optical filter element 4141 may be adhered to the top surface 4124 of the molding base 412, for example, may be bonded to the top surface 4124 of the molding base 412 by an adhesive. have. The light blocking layer 4142 is a black light absorbing opaque material, and is formed on the bottom surface of the optical filter element body 4141 in various ways, for example, bonded to the bottom surface of the optical filter element body 4141 or , the light blocking layer 4142 is formed on the bottom surface of the optical filter element body 4141 by adopting a yellow light process or a silk screen printing process.

31A to 31C are diagrams illustrating a manufacturing process of the integrated assembly of the circuit board 411, the molding base 412, and the photosensitive element 413 integrally formed of the photosensitive assembly 410 according to the present invention. The manufacturing device 4200 includes a forming die 4210, and the forming die 4210 includes an openable and openable first die 4211 and a second die 4212, that is, the die fixing device is the first The die 4211 and the second die 4212 may be opened and closed to form a molding cavity 4213 , and when closed, the circuit board 411 of the photosensitive element 413 is fixed in the molding cavity 4213 . and the molding material 416 in a fluid state enters the molding cavity 4213 to be integrally formed on the circuit board 411 and the photosensitive element 413, and after curing, the circuit board 411 and The molding base 412 integrally formed on the photosensitive element 413 is formed. It can be seen that in a production process, the integral assembly is usually produced by a custom plate method, that is, a connecting molding base is formed on a circuit board custom plate, but the integral assembly of the present invention is formed through cutting. 31A to 31C, a process of forming the integrated assembly will be described as an example.

More specifically, the forming die 4210 further includes a base forming guide groove 4215 and an optical window forming part 4214 positioned in the base forming guide groove 4215 . When the first and second dies 4211 and 4212 are closed, the optical window molding part 4214 and the base molding guide groove 4215 extend into the molding cavity 4213, and the molding in a fluid state Since the material 416 is filled in the base molding guide groove 4215, and the position corresponding to the optical window molding 4214 cannot be filled with the molding material 416 in a fluid state, the base molding guide groove After the molding material 416 in a fluid state is cured at a position corresponding to 4215 , the molding base 412 may be formed, which includes the molding base 412 of each photosensitive assembly 410 . A corresponding annular molding base body 4121 may be included, and the optical window 4122 of the molding base 412 may be formed at a position corresponding to the optical window forming part 4214 . The molding material 416 may be selected from nylon, liquid crystal polymer (LCP), polypropylene (PP, polypropylene), epoxy resin, and the like, but is not limited thereto.

More specifically, when the first and second dies 4211 and 4212 are closed and the molding step is performed, the optical window forming part 4214 overlaps the top surface of the photosensitive element 413 and is closely bonded. , preventing the molding material 416 in a fluid shape from entering the photosensitive region 4131 of the photosensitive element 413 on the circuit board 411, and finally corresponding to the optical window molding part 4214 The optical window 4122 of the molding base 412 may be formed at a position where It can be seen that the optical window forming part 4214 may have a solid structure, and may have a structure having a concave groove shape therein as shown in the drawings. In another modification, it can be understood that by further installing the elastic film 4217 on the bottom side of the first die 4211, the demolding process after the molding process can be alleviated and convenience can be improved.

31A to 31C, the optical window molding portion 4214 is pressed against the photosensitive element 413, and the photosensitive element coupling portion 41211 of the molding base 412 and the top extend. In order to form the corresponding portion 41212, the optical window forming portion 4214 has a bottom side forming portion 42141 and a top side forming portion 42142, and the bottom side forming portion 42141 is tapered. structure, and the inner diameter gradually increases from the bottom side toward the top side. Here, an included angle α is formed between the outer surface 421411 of the bottom molded part 42141 and the optical axis X (vertical direction shown in the figure) perpendicular to the photosensitive element 413, and the top side An included angle β is formed between the outer surface 421421 of the molding portion 42142 and the optical axis X perpendicular to the photosensitive element 413 . Correspondingly, α values range from 3° to 80°, β values range from 0° to 10°, and α>β. The top molded part 42142 is forwardly extended from the bottom molded part 42141 , and presses the connecting wire 415 in the molding process so as not to damage the connecting wire 415 . The outer surface 411411 of the bottom molding part 42141 does not directly form a sharp right angle by extending obliquely, and since the height is 0.05 mm or more, the elastic film 4217 is prevented from being perforated in the molding process.

The optical window forming part 4214 has a first partial outer surface 421411 and a second partial outer surface 421421 in a direction from the bottom side to the top side, which has an optical axis X perpendicular to the photosensitive element 413 . ) and forming an enclosed angle (α and β), respectively, the value of α ranges from 3° to 80° and the value range for β is from 0° to 10°, and α>β. Therefore, after the molding process, the molding base 412 forms the photosensitive element coupling part 41211 and the top extension part 41212, and the structure formed by the photosensitive element coupling part 41211 is therein. The first portion inner surface 41231 defined by the surface extends upward from the photosensitive element 413 obliquely at a relatively small inclination rate, and the second portion defined by the inner surface of the top extension portion 41212 An inner surface 41232 is bent and integrally extended from the first partial inner surface 41231 and extends upward with a relatively large inclination rate or no inclination rate. That is, the included angle between the first partial inner surface 41231 defined by the inner surface of the photosensitive element coupling portion 41211 and the optical axis X of the camera module 400 is α, and the top extension portion ( The included angle between the second partial inner surface 41232 defined by the inner surface of 41212 and the optical axis X of the camera module 400 is β, where the value of α ranges from 3° to 80° and β The value range of is 0° to 10° and α>β. The bent and extended structure of the optical window molding unit 4214 includes the non-photosensitive region 4132 of the photosensitive element 413 and the outer surface of the first portion of the optical window molding unit 4214 in the molding process. It is possible to reduce the molding material 416 entering the space 41251 of the bottom side portion of the base molding guide groove 4215 of 421411, and the volume of the molding material 416 in the space is relatively small. It can be seen that since the generated pressure and compressive strength are relatively weak, it is impossible to easily enter the photosensitive region 4131 of the photosensitive element 413 , thereby preventing the generation of “flash”.

In this molding process of the present invention, on the bottom side of the base molding guide groove 4215, a portion located between the photosensitive element 413 and the first portion outer surface 421411 of the molding base 412 A charging groove 42151 is formed. Since the molding material 416 forming the molding base 412 is not easy to enter between the photosensitive element 413 and the bottom surface of the optical window molding 4214 to form a "flash", The possibility of contamination of the photosensitive region 4131 of the photosensitive element 413 is reduced. More specifically, by reducing the volume of the charging groove 42151 between the photosensitive element 413 and the first portion outer surface 421411 of the optical window molding part 4214, the filling groove 42151 enters. The pressure and compressive strength generated by the molding material 416 is reduced so that the molding material 416 enters between the photosensitive element 413 and the bottom surface of the optical window molding 4214 to "flash" it. reduces the likelihood of forming

In this preferred embodiment of the present invention, the outer surface of the optical window forming portion 4214 has an outer surface extending in different directions, and the outer surface of the top side thereof, that is, the second portion outer surface 421421 and Since the angle between the optical axis X of the photosensitive assembly is smaller than the angle between the outer surface of the bottom side, that is, the first part outer surface 421411 and the optical axis X, the second angle of the optical window forming part 4214 is The volume of the charging groove 42151 formed between the one-part outer surface 421411 and the photosensitive element 413 is reduced, so that the possibility of "flash" is reduced.

In addition, since the outer surface of the second portion 421421 on the top side of the optical window forming part extends in a direction in which the angle between it and the optical axis X is relatively small, the packaging material is different from the inclined outer surface shown in FIG. 1B. It is convenient to guide them to enter the charging home. In this embodiment of the present invention, the outer surface of the second portion 421421 on the top side of the optical window molding part may exhibit a blocking effect to a certain extent. That is, since the first portion is bent from the outer surface 421411 and extended integrally, the molding material 416 entering the filling groove 42151 is different from the guide surface structure extending with a linear inclination shown in FIG. 1B . ) to some extent, and by reducing the pressure generated by the molding material 416 entering the filling groove 42151, the possibility of "flash" occurring is reduced. In addition, since the molding material 416 does not easily form “flash” in the integral molding process, the optical window molding part 4214 does not need to be pressed on the photosensitive element 413 with a relatively large pressure, so that the It prevents the photosensitive element 413 from being damaged by being pressed. As shown in Fig. 32A, in the modified implementation method according to the above-described third preferred embodiment of the present invention, the top light blocking layer 4143 is further provided on the top surface of the optical filter element body 4141. , the top light blocking layer 4143 and the light blocking layer 4142 are matched to enhance the stray light reduction effect. More specifically, the light beam L21 incident on the top light blocking layer 4143 is absorbed by the top light blocking layer 4143 , and the light beam L22 is absorbed by the light blocking layer 1422 . In the three preferred embodiments described above, the light blocking layer 4143 on the top side may be provided.

32B, in the modified implementation method according to the above-described third preferred embodiment of the present invention, the camera module 400 includes the photosensitive assembly 410, the lens 430, and a lens support member ( 440). The lens 430 is assembled to the lens support member 440 to form a lens assembly. The lens support member 440 may be a fixed lens barrel, thereby forming a focusing camera module.

Correspondingly, the photosensitive assembly 410 includes a circuit board 411 , a molding base 412 , a photosensitive element 413 , and an optical filter element 414 , and the molding base 412 includes a base body 4121 . ), which is integrally molded with the circuit board 411 and the photosensitive element 413 to form an optical window 4122, wherein the optical window 4122 is a closed space and the photosensitive element 413 provides an optical path to The optical filter element 414 includes an optical filter element body 4141 and a light blocking layer 4142 , and the light blocking layer 4142 is a light absorption opaque material, which is a bottom of the optical filter element body 4141 . It is located on the side and is located between the optical filter element body 4141 and the molding base 412 .

Here, the molding base 412 has a top concave groove 4125 on its top side, and the top concave groove 4125 is used to assemble the optical filter element 414 . That is, in this embodiment of the present invention, the top surface 4124 of the molding base 412 may be a multi-step stepped surface, and the top surface 4124 is a first part top surface 4124a and a second part top. It is divided into a top surface of several parts that do not share a plane, such as surface 4124b, wherein the first part top surface 4124a is oriented relative to the second part top surface 4124b. and, in this way, forming the top recess 4125 on the top side of the top surface 4124a of the first part, and the optical filter element 414 is assembled into the top recess 4125. do.

The top extension portion 41212 of the molding base 412 has two steps correspondingly, and the top concave groove 4125 is formed on the top side thereof. The inner surface 4123 of the molding base 412 corresponds to the inner surface 41231 of the first portion of the photosensitive element coupling portion 41211 and the second portion formed by the top extension portion 41212. a surface 41232 and a third portion inner surface 41233, wherein the light blocking layer 4142 and the inner surface 41232 of the second portion of the molding base 412 are adjacent to each other, and within the first portion The light suppression groove 41221 is formed between the surface 41231 and the inner surface 41232 of the second portion to form a space for suppressing stray light emission. That is, the light beam incident on the first inner surface 41231 is directly reflected to the light blocking layer 4142 or is further reflected to the light blocking layer 4142 by the second inner surface 41232 to the light blocking layer stray light is reduced as it is absorbed by (4142). The light blocking layer 4143 on the top side may also be provided on the top side of the optical filter element 414 to enhance the stray light cancellation effect.

28 to 33 , the wiring direction of the connecting line 415 is from the photosensitive element 413 to the circuit board 411 , that is, on the photosensitive element 413 . Install the photosensitive element connection plate, first form the first end of the connection line 415 connected to the photosensitive element connection plate on the top end of the photosensitive element connection plate with a routing tool, and then lift it to a predetermined position The second end of the connecting line 415 connected to the circuit board connecting plate is formed at the top end of the circuit board connecting plate by moving it toward the circuit board connecting plate on the board and descending again.

As shown in FIG. 33 , in another modified implementation method according to the above-described third preferred embodiment of the present invention, the electronic circuit board 411 of the photosensitive assembly 410 of the camera module 400 is A component 4112 is attached to its bottom side, and correspondingly the photosensitive assembly 410 further includes one or more bottom side moldings 419 , which integrally embed the electronic component 4112 . That is, the electronic component 4112 is not attached to the top side of the circuit board 411 , and the electronic component 4112 is installed at the bottom side of the circuit board 411 , and the bottom molding part 419 . passing through, it may be a plurality of independent parts, and may form a single overall molding base to embed the electronic component 4112 and form a support surface with a flat bottom side. The bottom molding part 419 and the molding base 412 may be formed independently, and may be formed by a single molding process, for example, the circuit board 411 may have a through hole, , the molding material 416 may reach both sides of the circuit board 411 in a molding process.

Since the space on the bottom side of the circuit board 411 under the photosensitive element 413 can also be used for arranging the electronic component 4112, unlike the embodiment, the electronic component 4112 is mounted on the photosensitive element 413. There is no need to dispose around it, and the area size of the circuit board 411 in this embodiment is remarkably reduced.

Correspondingly, the molding base 412 includes the photosensitive element coupling part 41211 and the top extension part 41212, so that in a situation where the size of the photosensitive assembly 410 is further reduced, the top side As the extension portion 41212 is bent and extended, the area of the top surface 4124 of the molding base 412 is increased, thereby providing a larger installation area for the lens support member 440 and the optical filter element 414 . to provide. The optical filter element 414 includes a light blocking layer 4142 provided on the bottom side of both sides of the optical filter element body 4141 and a light blocking layer 4143 on the top side, so that the stray light canceling effect is enhanced.

34 , a wiring connection method between the photosensitive element 413 and the circuit board 411 is from the circuit board 411 to the photosensitive element 413 . That is, the circuit board connection board is installed on the circuit board 411 , and the second end of the connection line 415 connected to the circuit board connection board is formed on the top end of the circuit board connection board first with a routing tool. After that, the first end opposite to the connecting line 415 connected to the photosensitive element connecting plate is formed at the top end of the photosensitive element connecting plate by lifting it to a predetermined position and moving it toward the circuit board connecting plate, , the connecting line 415 is extended in a curved shape in this way, and the height h2 of the top end of the connecting line 415 is the height h1 of the top end of the connecting line, taking FIG. ), so that in the molding process, the optical window molding part 4214 of the molding die 4210 avoids the space of the connecting line 415 from becoming smaller, and the height of the top extension part 41212 can be higher. have.

35 to 37 show a camera module 400 according to a fourth preferred embodiment of the present invention, wherein the camera module 400 includes a photosensitive assembly 410 and a lens 430 . The lens 430 is assembled to the photosensitive assembly to form a focusing camera module. In another modified embodiment, the lens may be installed in a driver or a fixed lens barrel to form a lens assembly, wherein the lens assembly is assembled to the photosensitive assembly.

Correspondingly, the photosensitive assembly 410 includes a circuit board 411 , a molding base 412 , a photosensitive element 413 , an optical filter element 414 , and an optical filter element holder 417 , the molding base 412 includes a base body 4121, which is integrally molded with the circuit board 411 and the photosensitive element 413 to form an optical window 4122, wherein the optical window 4122 is closed space and provides an optical path to the photosensitive element 413 .

The optical filter element holder 417 is assembled to the molding base 412 and has an open window 4171 on the bottom side and a mounting groove 4172 on the top side, and the optical filter element 414 is on the top side. Assembled in the mounting groove 4172 , assembling the optical filter element 417 to the optical filter element holder 417 is less likely to be damaged than assembling it directly to the molding base 412 .

The optical filter element 414 includes an optical filter element body 4141 , a bottom light blocking layer 4142 , and a top light blocking layer 4143 , and the light blocking layer 4142 is the optical filter element body 4141 . ) and located between the inner top surface of the optical filter element body 4141 and the optical filter element holder 417, the light blocking layer 4142 is a light absorbing material, which is the optical filter element body 4141 ) form an intermediate effective light transmitting area 41411 and a peripheral area 41412 , and the light rays passing through the lens 430 reach the inside of the molding base 412 only through the effective light transmitting area 41411 . can do. The light blocking layer 4142 has an annular structure and has an open window in the middle. That is, the light blocking layer 4142 forms an optical path 41420 for allowing light rays to enter the optical window 4122 , reduces stray light reaching the photosensitive element 413 , and the top light blocking layer 4143 . ) enhances the stray light reduction effect.

The photosensitive element 413 has an intermediate photosensitive region 4131 and a non-photosensitive region 4132 positioned around the photosensitive region 4113, and the light blocking layer 4142 has an inner edge 41421 and an outer edge. (41422) is provided. The distance between the inner edge 41421 of the light blocking layer 4142 and the optical axis X is equal to or slightly shorter than the distance between the outer edge 41311 of the photosensitive region 4131 and the optical axis X.

The outer edge 41422 of the light blocking layer 4142 is located outside the inner edge 41701 of the top surface of the optical filter element holder 417 . That is, a light-transmitting region is not formed between the inner edge of the top surface of the optical filter element holder 417 and the outer edge 41422 of the light blocking layer 4142 .

In this embodiment of the present invention, the base body 4121 of the molding base 412 includes an inner surface of a plurality of sections along the enclosing direction, and the inner surface of each section has a plurality of parts extending in different directions. , for example, the base body 4121 of the molding base 412 has three parts, namely, the photosensitive element coupling portion 41211 positioned around the optical window 4122 shown in FIGS. 36A and 36B and the top side. It includes an extension part 41212 and a circuit board coupling part 41213 on the bottom side of the photosensitive element coupling part 41211 . The photosensitive element coupling portion 41211 has an inner surface integrally extending from the photosensitive element 413, wherein the inner surface of at least one section integrally extending from the photosensitive element 413 is the molding base ( is defined as the inner surface 41231 of the first portion 412, the top extension portion 41212 has an inner surface integrally extending from the photosensitive element coupling portion 41211, and A second partial inner surface 41232 is formed, the second partial inner surface 41232 extending integrally with the first partial inner surface 41231 . Each of the first inner surface 41231 and the second inner surface 41232 is an inner surface of any one section surrounding the inner surface of the base body 4121, or the inner surface of a plurality of sections has the same structure. It will be understood that it has a first partial inner surface 41231 and the second partial inner surface 41232 , or that all inner surfaces have the first partial inner surface 41231 and the second partial inner surface 41232 . can

The inner surfaces 41231 and 41232 of each of the photosensitive element coupling part 41211 and the top extension part 41212 respectively extend at different inclinations, and the inner surface 41232 of the second part of the top extension part 41212 , respectively. ) of the photosensitive element coupling portion 41211 extends upward at a larger inclination than the inner surface 41231 of the first portion, or the inner surface 41232 of the second portion of the top extension 41212 is substantially It extends upwardly without an inclination, ie, the inner surface 41232 of the second portion of the top extension 41212 extends essentially perpendicular to the top surface of the photosensitive element 413 so that the top extension ( 41212) can make the area of the top surface relatively large. That is, the top surface of the top extension 41212 determines the area of the top surface 4124 of the molding base 412 , and the photosensitive element coupling part 41211 and the top extension part 41212 are formed. Such an elongated structure may increase the area of the top surface 4124 of the molding base 412 , such that a lens or lens assembly above the photosensitive assembly 410 or a larger mounting to the optical filter element holder 417 . area, for example, in this embodiment, the top surface 4124 of the molding base 412 mounts the photosensitive element holder 417 above it more stably. In addition, this structure can reduce the area of the optical filter element 414 .

That is, in order to facilitate demolding in the molding process and prevent stray light, the structure formed by the photosensitive element coupling part 41211 has a relatively small inclination ratio of the inner surface 41231 of the first portion defined by the inner surface thereof. The second partial inner surface 41232 obliquely extending upwardly from the photosensitive element 413 and defined by the inner surface of the top side extension 41212 is bent from the first partial inner surface 41231 It extends integrally and extends upwards with or without a relatively large inclination rate. That is, an included angle is formed between the inner surface 41232 of the second portion and the inner surface 41231 of the first portion of the molding base 412, and it extends obliquely upward at a relatively fixed inclination ratio, so that the molding base It is possible to effectively increase the size of the area of the top extension 4124 of the 412 . An inner surface extending in the enclosing direction of the molding base 412 may both have the first partial inner surface 41231 and the second partial inner surface 41232, and this first partial inner surface 41231 may be provided. may have the same or different included angle α. The inner surface 41232 of the second portion may have the same or different angle β.

As shown in FIG. 36B, the included angle between the first partial inner surface 41231 defined by the inner surface of the photosensitive element coupling part 41211 and the optical axis X of the camera module 400 is α, An included angle between the second partial inner surface 41232 defined by the inner surface of the top extension 41212 and the optical axis X of the camera module 400 is β, where the value range of α is 3 ° to 80° and the value range of β is from 0° to 10° and α>β.

That is, the included angle β between the second part inner surface 41232 defined by the inner surface of the top extension 41212 and the optical axis X of the camera module 400 is the photosensitive element coupling portion ( Since the inner surface of the 41211 is smaller than the included angle α between the first partial inner surface 41231 and the optical axis X of the camera module 400, the second portion of the top extension 41212 is increasing the area of the top surface 4124 of the molding base 412 by making the two-part inner surface 41232 extend upward at a greater inclination rate or in a direction perpendicular to the photosensitive element 413; It reduces the area of the optical filter element and reduces the likelihood that the molding material 416 will "flash" in the molding process.

As shown in FIG. 36B, in this preferred embodiment of the present invention, the thickness H1 of the photosensitive element coupling portion 41211 preferably ranges from 0.05 mm to 0.7 mm, and the top extension portion ( 41212) thickness (H2) values range from 0.02 mm to 0.6 mm.

In addition, the light blocking layer 4142 and the top light blocking layer 4143 are provided on the optical filter element 414, and as shown in FIG. 37, the optical filter element body of the optical filter element 414 ( 4141) A part of the stray light L31 incident on the upper surface is absorbed by the light blocking layer 4143 on the top side to block some of the stray light.

When some stray light L32 passes through the effective light-transmitting area 41411 of the optical filter element body 4141 and is incident to the first partial inner surface 41231, the inclined second of the molding base 412 It is reflected up to the light blocking layer 4142 by the first inner surface 41231 or is further reflected to the light blocking layer 4142 by the second inner surface 41232 to be absorbed by the light blocking layer 4142 . Therefore, even the photosensitive element 413 is further reflected, so that the image quality of the camera module 400 cannot be affected.

Correspondingly, the light blocking layer 4142 and the inner surface 41702 located below the optical filter element of the optical filter element holder 417 are adjacent to each other, and the optical filter element of the optical filter element holder 417 is adjacent to each other. The lower inner surface 41702 extends downward from the light blocking layer 4142 , and the inner surface 41702 located below the light blocking layer 4142 and the optical filter element holder 417 of the optical filter element holder 417 . ), an outer portion of the optical window 4122 between the first inner surface 41231 and the second inner surface 41232 forms a light suppressing groove 41221, and the light suppressing groove 41221 is It is a space to suppress the emission of stray light. More specifically, as shown in FIG. 37 , the stray light L32 enters the light suppression groove 41221 and cannot be emitted from the light suppression groove 41221 .

38, in the modified implementation method according to the above-described fourth preferred embodiment of the present invention, a top concave groove 4125 is formed on the top side of the molding base 412, and the optical filter element holder Reference numeral 417 is assembled into the concave groove 4125 on the top side so that the position thereof is moved downward, and the lens 430 may be assembled on the top side of the molding base 412 . That is, the molding base 412 is used to assemble the optical filter element holder 417 and the lens 430 through the top surface 4124 enlarged through multi-step extension.

39 to 41 show a camera module 400 according to a fifth preferred embodiment of the present invention, the structure of which is similar to the above-described fourth embodiment, wherein the camera module 400 includes a photosensitive assembly 410 and It includes a lens 430 . The lens 430 is assembled to the photosensitive assembly to form a focusing camera module. In another modified embodiment, the lens may be installed in a driver or a fixed lens barrel to form a lens assembly, wherein the lens assembly is assembled to the photosensitive assembly.

Correspondingly, the photosensitive assembly 410 includes a circuit board 411 , a molding base 412 , a photosensitive element 413 , an optical filter element 414 , and an optical filter element holder 417 , the molding base 412 includes a base body 4121, which is integrally molded with the circuit board 411 and the photosensitive element 413 to form an optical window 4122, wherein the optical window 4122 is closed space and provides an optical path to the photosensitive element 413 . The molding base 412 includes a photosensitive element coupling portion 41211 and a top extension portion 41212 positioned around the optical window 4122 , which extend in a multi-step form, and have inner surfaces 41231 and 41232 . These each extend in different directions and are used to reduce stray light and increase the area of the top surface 4124 of the molding base 412 .

The optical filter element holder 417 is assembled to the molding base 412, and has an open window 4171 on the top side and a mounting groove 4173 on the bottom side, and the optical filter element 414 is attached upside down. It is assembled to the bottom side mounting groove 4173 in this way. The optical filter element 414 includes an optical filter element body 4141 and a light blocking layer 4142 , and the light blocking layer 4142 is provided on the bottom side of the optical filter element body 4141 . Accordingly, similarly, the light blocking layer 4142 may serve to reduce stray light reaching the photosensitive element 413 .

The lens 430 also includes a support member 431 and one or more mirrors 432 assembled to the support member 431 , wherein the optical filter element 414 includes the optical filter element holder 417 . is assembled upside down, so that the optical filter element 414 does not protrude from the upper surface of the optical filter element holder 417, and the bottommost mirror among the one or more mirrors 432 of the lens 430 has a relative position. Since the distance to the photosensitive element 413 can be reduced, the rear focal length of the camera module 400 can be reduced.

When the light blocking layer 4142 is installed on the bottom side of the optical filter element 414, as shown in FIG. 41, some stray light L41 incident on the upper surface of the optical filter element holder 417 is reflected. and does not enter the optical window 4122 of the molding base 412 to achieve the purpose of blocking some stray light.

When a portion of the stray light L42 passes through the effective light-transmitting area 41411 of the optical filter element body 4141 and is incident to the first inner surface 41231, the second inclined light of the molding base 412 is It is reflected up to the light blocking layer 4142 by the first inner surface 41231 or is further reflected to the light blocking layer 4142 by the second inner surface 41232 to be absorbed by the light blocking layer 4142 . Therefore, even the photosensitive element 413 is further reflected, so that the image quality of the camera module 400 cannot be affected.

Correspondingly, the light blocking layer 4142 and the inner surface 41232 of the second portion of the molding base 412 are adjacent to each other, and the inner surface 41232 of the second portion of the molding base 412 is the Extending downward from the light blocking layer 4142, the outer portion of the optical window 4122 between the light blocking layer 4142, the first partial inner surface 41231 and the second partial inner surface 41232 is light suppressing. A groove 41221 is formed, and the light suppression groove 41221 is a space for suppressing emission of stray light. More specifically, as shown in FIG. 41 , the stray light L42 enters the light suppression groove 41221 and cannot be emitted from the light suppression groove 41221 .

In addition, since the light blocking layer 4142 and the inner surface 41232 of the second portion of the molding base 412 are adjacent to each other, the light blocking layer 4142 passes through the optical filter element body 4141 and passes through the second part inner surface 41232. The light rays reaching the two-part inner surface 41232 are effectively reduced, so that the light rays incident on the second inner surface 41232 are reflected and reach the photosensitive element 413 to form stray light, and the camera module 400 ) from affecting the image quality.

42, in another modified implementation method according to the above-described fifth embodiment of the present invention, the wiring direction of the connecting line 415 is from the circuit board 411 to the photosensitive element 413, , during the molding process, the avoidance space provided by the optical window forming part 4214 to the connection line 415 is not required as much as possible, and the height of the top extension part 41212 is relatively high. The area of the top surface 4124 is increased.

In addition, the top side of the optical filter element holder 417 forms an open window 4171, and the length of the top portion 4174 of the optical filter element holder 417 extending inward is the length of the light blocking layer 4142 inward. may be longer than the extended length, and in this way the area of the opening window 4171 may be larger than the area of the light path 41420, so that the top surface of the optical filter element holder 417 receives some stray light L51 Because the blocking effect is exhibited, it is not necessary to provide the top light blocking layer 4143 on the top side of the optical filter element 414 . The stray light L52 may be absorbed by the light blocking layer 4142 .

As shown in FIG. 43 , in another modified implementation method according to the above-described fifth embodiment of the present invention, the photosensitive assembly 410 includes a circuit board 411 , a molding base 412 , and a photosensitive element 413 . , an optical filter element 414 , an optical filter element holder 417 , and a blocking frame 418 . The molding base 412 and the circuit board, the photosensitive element 413 and the blocking frame 418 are integrally coupled, the photosensitive element 414 is assembled to the optical filter element holder 417, and the An optical filter element holder 417 is assembled on the top side of the molding base 412 . The light blocking layer 1422 of the optical filter element 414 may serve to reduce stray light by being installed on the bottom side of the optical filter element body 142, similarly to the third preferred embodiment described above.

The annular blocking frame 418 is installed on the photosensitive element 413 and presses the optical window molding part 4214 to the blocking frame 418 in a molding process, so that the molding material 416 of the fluid is ) is used to prevent inflow into the photosensitive region 4131 of the photosensitive element 413 , wherein the molding base 412 includes the circuit board, the photosensitive element 413 and the blocking frame 418 . In a preferred embodiment, the blocking frame 418 may be an adhesive, and may have a predetermined elasticity, for example, the elastic modulus ranges from 0.1 Gpa to 1 Gpa.

The base body 4121 of the molding base 412 includes a photosensitive element coupling part 41211 positioned around the optical window 4122, a top extension part 41212, and a bottom side of the photosensitive element coupling part 41211. and a circuit board coupling part 41213 around the photosensitive element 413 and on the top side of the circuit board 411 . The photosensitive element coupling part 41211 is integrally coupled to the circuit board 411 , the photosensitive element 413 , and the blocking frame 418 , and an inner surface of a first portion extending obliquely from the blocking frame 418 . (41231) and the top extension portion (41212) has a second partial inner surface (41232) extending forwardly from the first partial inner surface (41231), such that the structure is such that the inclined first The reflective action of the partial inner surface 41231 reduces stray light, and the diverting and extending second partial surface 1232 allows the top surface of the top extension 41212 to have a larger installation area, so that the photosensitive element It reduces the area of 414 and prevents the molding material 416 from forming a "flash" in the molding process, and the angle of confinement between the inner surface of the two parts and the optical axis X is similar to the embodiment described above. It can be understood that the blocking frame 418 of the present embodiment may be applied to other embodiments of the present invention.

Those skilled in the art to which the present invention pertains should understand that the embodiments of the present invention shown in the above description and accompanying drawings are illustrative only and do not limit the present invention. The object of the present invention has been completely and effectively achieved. The functional and structural principles of the present invention have been shown and described in the embodiments, and any changes or modifications may be made to the embodiments of the present invention without departing from the above principles.

Claims (55)

A method for manufacturing a photosensitive assembly of a camera module, the method comprising:
fixing the circuit board dowel plate to a second die of the forming die;
joining the second die and the first die and filling a molten molding material into a base alignment plate forming guide groove in the forming die; and
Forming a connection-type molding base at a position corresponding to the base alignment plate molding guide groove by curing the molding material in the base alignment plate molding guide groove,
wherein the circuit board alignment plate comprises one or more rows of circuit boards, each row of circuit boards comprising one or more parallelly arranged circuit boards, each of the circuit boards comprising a rigid region and a flexible region coupled to each other; each said circuit board is operatively connected to a photosensitive element;
prevent positions corresponding to one or more optical window moldings from being filled with the molding material;
The connection-type molding base is integrally molded with a corresponding one or more rows of the circuit board and one or more rows of the photosensitive elements to form a photosensitive assembly fitting plate, and a light path is provided to each photosensitive element at a position corresponding to the optical window molding part. forming an optical window for providing, wherein the base fitting plate forming guide groove includes a first flow guide groove corresponding to a first end side adjacent to the flexible area in the connected molding base and the flexible in the connected molding base a second flow guide groove corresponding to a portion remote from the region and a plurality of filling grooves extending between the first flow guide groove and the second flow guide groove, wherein the first flow guide groove comprises the optical window and a first side surface facing, the second flow passage groove having a second side surface facing the optical window, wherein the first side surface comprises a first partial surface provided adjacent to the photosensitive element and a second side surface facing the photosensitive element. a second partial surface connected to the first partial surface, the second side surface comprising a third partial surface disposed adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein the first a first angle of the partial surface with respect to the optical axis of the camera module is greater than a second angle of the second partial surface with respect to the optical axis, and a third angle of the third partial surface with respect to the optical axis of the fourth partial surface is A manufacturing method greater than the fourth angle with respect to the optical axis. According to claim 1,
cutting the photosensitive element alignment plate to obtain a plurality of photosensitive assemblies, wherein each photosensitive assembly comprises the circuit board, the photosensitive element and the molding base, wherein the molding base comprises the A manufacturing method for forming the optical window integrally formed with a circuit board and the photosensitive element to provide an optical path to the photosensitive element. According to claim 1,
The first angle and the third angle are 3° to 80°. According to claim 1,
The second angle and the fourth angle are 0° to 20°. According to claim 1,
a first height and a third height in a direction in which the first partial surface and the third partial surface are perpendicular to the surface of the photosensitive element are 0.05 mm to 0.7 mm, respectively. According to claim 1,
a second height and a fourth height in a direction in which the second partial surface and the fourth partial surface are perpendicular to the surface of the photosensitive element are 0.02 mm to 0.6 mm, respectively. According to claim 1,
A manufacturing method wherein the width of the bottom end of the first flow guide groove is 0.2 mm to 1 mm. According to claim 1,
The connection-type molding base is integrally formed with the circuit board in one row and the photosensitive element in one row, or the connection-type molding base is integrally formed in the circuit board in two adjacent rows and the photosensitive element in two adjacent rows, wherein the two wherein the adjacent circuit boards in a row are arranged such that their flexible regions are distant from each other and their rigid regions are adjacent to each other. A photosensitive assembly comprising:
a circuit board, a photosensitive element, and a molding base;
wherein the photosensitive element is operatively connected to the circuit board, and the molding base is integrally coupled to the circuit board and the photosensitive element to form an optical window, wherein the molding base is one adjacent to the photosensitive element. at least a first partial inner surface and at least one second partial inner surface remote from the photosensitive element and coupled to the first partial inner surface, wherein the included angle between the first partial inner surface and the optical axis of the photosensitive assembly is α , an angle between the inner surface of the second portion and the optical axis of the photosensitive assembly is β, wherein β<α. 10. The method of claim 9,
A photosensitive assembly having an α value ranging from 3° to 80° and a β value ranging from 0° to 20°. 10. The method of claim 9,
The molding base includes a photosensitive element coupling portion and a top extension portion positioned around the optical window, wherein an inner surface of the photosensitive element coupling portion integrally extending from the photosensitive element is defined as the first portion inner surface, the top The surface of which the side extensions integrally extend into the photosensitive element coupling portion is defined as the second partial inner surface, the second partial inner surface integrally extending into the first partial inner surface. 12. The method of claim 11,
A photosensitive assembly having a β value of 0° and correspondingly said photosensitive element coupling portion being a vertical extension. 12. The method of claim 11,
The thickness of the top extension portion is 0.02 mm to 0.6 mm, and the thickness of the photosensitive element coupling portion is 0.05 mm to 0.7 mm. 12. The method of claim 11,
The molding base further includes a circuit board coupling part, the photosensitive element coupling part extending integrally from the circuit board coupling part and positioned between the top extension part and the circuit board coupling part, and the circuit board coupling part being the circuit board coupling part A photosensitive assembly integrally coupled to and positioned around the photosensitive element. 10. The method of claim 9,
A distance between a position where the inner surface of the first portion and the inner surface of the second portion are integrally connected and an optical axis of the photosensitive assembly is smaller than a distance between an outer edge of the photosensitive element and an optical axis of the photosensitive assembly. In the photosensitive assembly fitting plate of the camera module,
Comprising one or more rows of circuit boards, one or more rows of photosensitive elements, and one or more connection-type molding bases,
wherein each row of circuit boards includes one or more parallelly arranged circuit boards, each of said circuit boards includes a rigid region and a flexible region coupled to each other, and each said connected molding base comprises one row of said circuit boards and one an optical window integrally formed with said photosensitive elements in a row to provide an optical path to each said photosensitive element, wherein a first end side corresponding to the adjacent said flexible region of said connected molding base is a first facing optical window a side surface, wherein the first side surface includes a first partial surface provided adjacent to the photosensitive element and a second partial surface connected to the first partial surface, the first partial surface on the optical axis of the camera module a first angle to the second partial surface is greater than a second angle to the optical axis of the second partial surface, and an opposite second end side corresponding to the flexible region remote from the articulated molding base has a second side surface facing the optical window and the second side surface includes a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a third angle of the third partial surface with respect to the optical axis is the second and a fourth angle with respect to the optical axis of the four-part surface. In the photosensitive assembly fitting plate of the camera module,
A plurality of rows of circuit boards, a plurality of rows of photosensitive elements, and one or more connected molding bases,
wherein each row of circuit boards comprises one or more parallelly arranged circuit boards, each of said circuit boards comprising a rigid region and a flexible region coupled to each other, and each said connected molding base comprises two rows of adjacent said circuit boards. and an optical window formed integrally with the photosensitive elements adjacent to each other in two rows to provide an optical path for each of the photosensitive elements, wherein the circuit boards adjacent to each other in the two rows have flexible regions far from each other and their rigid regions from each other disposed adjacently, such that each of the articulated molding bases has two end sides adjacent to the flexible area, wherein a first end side corresponding to the adjacent flexible area of the articulated molding base is a first end side facing the optical window. and a first side surface, wherein the first side surface includes a first partial surface provided adjacent to the photosensitive element and a second partial surface connected to the first partial surface, the optical axis of the camera module on the first partial surface a first angle to the second part surface is greater than a second angle to the optical axis of the second partial surface, and the connected molding base extends to a second end side positioned between the photosensitive elements adjacent to each other in the two rows and faces the optical axis and a second side surface, the second side surface comprising a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein the third partial surface has a second position with respect to the optical axis and a third angle is greater than a fourth angle of the fourth partial surface with respect to the optical axis. delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete

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