CN114257714A

CN114257714A - Photosensitive assembly, camera module and preparation method of photosensitive assembly

Info

Publication number: CN114257714A
Application number: CN202011022563.2A
Authority: CN
Inventors: 黄桢; 栾仲禹; 许晨祥; 陈卓
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2022-03-29

Abstract

A photosensitive assembly, a camera module and a preparation method of the photosensitive assembly are disclosed. This photosensitive assembly includes: a circuit board assembly including a circuit board main body having a slot formed on an upper surface thereof; the photosensitive chip is arranged in the groove and electrically connected with the circuit board main body, wherein the groove has a preset size larger than that of the photosensitive chip so as to form an accommodating space between the side part of the photosensitive chip and the circuit board main body when the photosensitive chip is arranged in the groove; and the adhesive is arranged in the accommodating space, so that the photosensitive chip is combined with the circuit board main body through the adhesive. Like this, the sensitization chip is connected through setting up between the adhesive of its lateral part and the circuit board main part, through such mode, changes the atress mode of sensitization chip in order to reduce the sensitization chip is in the solidification the deformation degree that takes place during the adhesive to reduce the chip field curvature.

Description

Photosensitive assembly, camera module and preparation method of photosensitive assembly

Technical Field

The application relates to the field of camera modules, in particular to a photosensitive assembly, a camera module and a preparation method of the photosensitive assembly.

Background

With the popularization of mobile electronic devices, technologies related to camera modules applied to mobile electronic devices for helping users to obtain images (such as videos or images) have been rapidly developed and advanced. Especially along with the development of smart mobile phone, the pursuit of consumer to shooting function is more and more diversified, also is higher and higher to the requirement of formation of image quality, and this has provided more challenges to the module of making a video recording.

Fig. 1 illustrates a schematic diagram of a conventional camera module. As shown in fig. 1, in the conventional camera module, a photosensitive chip 1P is attached to an upper surface of a circuit board 2P by glue 3P and electrically connected to the circuit board 2P by gold wire bonding. However, as the requirement for the imaging quality of the camera module is higher, the size of the photosensitive chip 1P becomes larger, which causes many problems in the existing packaging structure of the camera module.

First, because the thermal expansion coefficients of the circuit board and the photosensitive chip are different, when the glue between the photosensitive chip and the circuit board is cured, the photosensitive chip expands or contracts, which causes the field curvature of the chip. This phenomenon is not obvious when the size of the photosensitive chip is small, but as the size of the photosensitive chip is increased, the problem of the curvature of field of the chip seriously affects the imaging quality of the camera module.

Secondly, in current module of making a video recording, the direct superpose of sensitization chip is on the circuit board, and this kind of packaging mode can lead to the whole height-increasing of module of making a video recording, does not conform to the development direction of light-dutyization and slimming of electronic equipment.

In addition, because the photosensitive chip is directly superposed on the circuit board, when the lens base is attached to the circuit board, the photosensitive chip, the circuit board and the lens base are required to be measured for too many height and measurement times, which easily causes errors.

Therefore, an optimized camera module solution is needed to solve the above technical problems.

Disclosure of Invention

An advantage of the present application lies in providing a photosensitive component, module and photosensitive component's preparation method of making a video recording, wherein, the sensitization chip is connected through setting up between the adhesive of its lateral part and circuit board main part, and through such mode, the atress mode that changes the sensitization chip is in order to reduce the sensitization chip is solidifying the deformation degree that takes place during the adhesive to reduce the chip field curvature. That is, in the present application, the adhesive agent provided between the lower surface of the photosensitive chip and the upper surface of the wiring board is eliminated, and the position where the adhesive agent is provided is adjusted to the side portion of the photosensitive chip.

Another advantage of the present application is to provide a photosensitive assembly, a camera module, and a method for manufacturing the photosensitive assembly, wherein the adhesive is disposed on a side of the photosensitive chip to provide an effect of a buffer layer, so as to reduce an influence of an external impact on the photosensitive chip.

Another advantage of the present application is to provide a photosensitive assembly, a camera module and a method for manufacturing the photosensitive assembly, wherein the adhesive is uniformly and circumferentially formed on the four sides of the photosensitive chip to more uniformly adjust the stress of the photosensitive chip in each direction, so as to reduce the bending degree of the photosensitive chip.

Another advantage of the present application is to provide a photosensitive component, a camera module and a method for manufacturing the photosensitive component, wherein, the adhesive disposed on the side of the photosensitive chip can also play a role of isolating and protecting at least a photosensitive area of the photosensitive chip in a molding process, that is, the adhesive also serves as an isolation layer.

Another advantage of the present application lies in providing a photosensitive component, a camera module and a method for preparing the photosensitive component, wherein, the circuit board main body has a slot formed on the upper surface thereof, the photosensitive chip is disposed in the slot, so that the upper surface of the photosensitive chip can be opposite to the upper surface of the circuit board main body, which is more sunken, to reduce the overall height dimension of the camera module.

Another advantage of the present application is to provide a photosensitive component, a camera module, and a method for manufacturing a photosensitive component, wherein the upper surface of the photosensitive chip is flush with the upper surface of the circuit board main body, that is, the installation reference surface set by the upper surface of the circuit board main body is consistent with the upper surface of the photosensitive chip, so that other components are installed in the process of the circuit board, the phase position relationship between the component and the photosensitive chip can also be determined synchronously, thereby reducing the number of times of measurement, reducing the tolerance chain, and improving the installation accuracy.

Another advantage of the present application is to provide a photosensitive assembly, a camera module, and a method for manufacturing the photosensitive assembly, wherein, in some examples of the present application, an electrical connection medium for electrically connecting a photosensitive chip and a circuit board main body is formed on an upper surface of the photosensitive chip and an upper surface of the circuit board main body by stacking through processes such as spraying and electroplating, so as to reduce a height dimension reserved in a gold wire bonding process, and further reduce a height dimension of the camera module.

Another advantage of the present application is to provide a photosensitive assembly, a camera module and a method for manufacturing the photosensitive assembly, wherein the substrate of the photosensitive chip is partially removed or not removed, so that the photosensitive chip has relatively higher structural strength compared to the conventional photosensitive chip with a completely polished substrate, thereby relatively reducing the degree of bending deformation of the photosensitive chip.

Another advantage of the present application is to provide a photosensitive assembly, a camera module and a method for manufacturing the photosensitive assembly, wherein the photosensitive assembly further includes a bonding portion disposed on the lower surface of the circuit board main body and used for supporting the photosensitive chip, so as to further strengthen the structural strength of the photosensitive chip through the bonding portion, so as to relatively weaken the bending deformation degree of the photosensitive chip.

Other advantages and features of the present application will become apparent from the following description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

To achieve at least one of the above advantages, the present application provides a photosensitive assembly, comprising:

a circuit board assembly including a circuit board main body having a slot formed on an upper surface thereof;

the photosensitive chip is arranged in the groove and electrically connected with the circuit board main body, wherein the groove has a preset size larger than that of the photosensitive chip so as to form an accommodating space between the side part of the photosensitive chip and the circuit board main body when the photosensitive chip is arranged in the groove; and

and the adhesive is arranged in the accommodating space so as to combine the photosensitive chip with the circuit board main body through the adhesive.

In a photosensitive assembly according to the present application, the photosensitive chip includes a substrate and at least one photosensitive unit formed on the substrate.

In a photosensitive assembly according to the present application, the substrate has a thickness ranging from 0.1mm to 0.7 mm.

In a photosensitive assembly according to the present application, the thickness of the photosensitive chip ranges from 0.1mm to 0.9 mm.

In the photosensitive assembly according to the application, the upper surface of the photosensitive chip is flush with the upper surface of the circuit board main body.

In the photosensitive assembly according to the application, the thickness dimension of circuit board main part is greater than the thickness dimension of sensitization chip, the fluting for forming with caving in the recess of circuit main part upper surface, grooved depth dimension with the thickness dimension of sensitization chip is unanimous.

In the sensitization subassembly according to this application, the thickness dimension less than or equal to of circuit board main part the thickness dimension of sensitization chip, the fluting for forming through the ground in the logical groove between the upper surface of circuit board main part and its lower surface, the depth dimension less than or equal to of logical groove the thickness dimension of sensitization chip, circuit board subassembly further including set up in the lower surface of circuit board main part just is used for supporting the joint portion of sensitization chip.

In a photosensitive assembly according to the present application, a thickness dimension of the wiring board main body is 0.15mm to 0.5 mm.

In the photosensitive assembly according to the present application, the bonding portion is integrally formed on the lower surface of the circuit board main body and covers the lower surface of the photosensitive chip, so as to support the photosensitive chip thereon.

In the photosensitive assembly according to the present application, the bonding portion is integrally formed on the lower surface of the circuit board main body and covers the lower surface of the photosensitive chip and at least a portion of the side surface thereof, and the photosensitive chip is supported thereon in such a manner.

In the photosensitive module according to the present application, the bonding portion is a reinforcing plate attached to a lower surface of the circuit board main body, and a lower surface of the photosensitive chip is attached to the reinforcing plate in such a manner as to support the photosensitive chip thereon.

In the photosensitive assembly according to the present application, the reinforcing plate is made of a metal material.

In the photosensitive assembly according to the present application, the photosensitive assembly further includes an electrical connection medium extending between the circuit board main body and the photosensitive chip, so that the photosensitive chip is electrically connected to the circuit board main body through the electrical connection medium.

In the photosensitive assembly according to the present application, the electrical connection medium is formed on the upper surface of the photosensitive chip, the upper surface of the circuit board main body, and the upper surface of the adhesive in a superposed manner.

In the photosensitive assembly according to the application, the upper surface of adhesive with the upper surface of sensitization chip with the upper surface of circuit board main part flushes, makes the upper surface of adhesive the upper surface of sensitization chip with the upper surface of circuit board main part forms level and smooth surface.

In the photosensitive assembly according to the present application, the shape of the groove is consistent with the shape of the photosensitive chip, wherein when the photosensitive chip is disposed in the groove to form the accommodating space, the width dimension of the accommodating space is consistent along the circumferential direction set by the photosensitive chip.

In the photosensitive assembly according to the present application, the photosensitive assembly further includes a sealing portion provided on an upper surface of the circuit board main body.

According to another aspect of the present application, there is also provided a camera module, which includes the photosensitive assembly as described above.

According to another aspect of the present application, there is also provided a method of manufacturing a photosensitive assembly, including:

providing a carrier plate, a circuit board main body and a photosensitive chip, wherein the circuit board main body is provided with a slot which is penetratingly formed in the circuit board main body, and the slot has a preset size which is larger than or equal to that of the photosensitive chip;

arranging the upper surface of the circuit board main body on the carrier, and arranging the photosensitive chip in the groove in a manner that the upper surface of the photosensitive chip faces the carrier plate, so as to form an accommodating space among the circuit board main body, the side part of the photosensitive chip and the carrier plate;

applying an adhesive in the accommodating space;

integrally forming a combining part on the lower surface of the circuit board main body through a molding process, wherein the combining part at least covers the lower surface of the photosensitive chip;

removing the carrier plate; and

and forming an electric connection medium between the circuit board main body and the photosensitive chip so as to electrically connect the photosensitive chip to the circuit board main body through the electric connection medium.

In the manufacturing method according to the present application, the adhesive provided in the accommodating space prevents the molding material from flowing to the upper surface of the photosensitive chip in the process of integrally forming a bonding portion on the lower surface of the circuit board main body by a molding process.

In the manufacturing method according to the present application, an upper surface of the wiring board main body is flush with an upper surface of the photosensitive chip.

In a manufacturing method according to the present application, forming an electrical connection medium between the wiring board main body and the photosensitive chip includes: the electrical connection medium is formed on the upper surface of the circuit board main body, the upper surface of the adhesive, and the upper surface of the photosensitive chip in a superposed manner.

In the manufacturing method according to the present application, an upper surface of the adhesive is flush with an upper surface of the wiring board main body and an upper surface of the photosensitive chip.

In the manufacturing method according to the application, the photosensitive chip comprises a substrate and at least one photosensitive unit formed on the substrate, wherein the thickness of the photosensitive chip ranges from 0.1mm to 0.9 mm.

In the manufacturing method according to the present application, the thickness of the wiring board main body ranges from 0.15mm to 0.5 mm.

In the manufacturing method according to the present application, a shape of the groove is identical to a shape of the photosensitive chip, wherein when the photosensitive chip is disposed in the groove to form the accommodating space, a width dimension of the accommodating space is identical along a circumferential direction set by the photosensitive chip

Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 illustrates a schematic diagram of a conventional camera module.

Fig. 2 illustrates a schematic diagram of a camera module according to an embodiment of the present application. (lens is directly supported on the upper surface of the circuit board main body)

Fig. 3 illustrates a schematic view (under surface projection + molding) of a photosensitive assembly according to an embodiment of the present application.

FIG. 4 illustrates a schematic diagram of a sensor chip in the sensor package according to an embodiment of the present application.

FIG. 5 illustrates a schematic diagram of a variant implementation of the photosensitive assembly according to an embodiment of the present application (lower surface flush + molding).

FIG. 6 illustrates a schematic diagram of another variant implementation of a photosensitive assembly (lower surface level + metal sheet) according to an embodiment of the present application.

Fig. 7 illustrates a schematic diagram of yet another variant implementation of a photosensitive assembly according to an embodiment of the present application (groove + upper surface flush).

Fig. 8 illustrates a schematic diagram (gold wire bonding) of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 9 illustrates a schematic diagram of yet another variant implementation of a photosensitive assembly according to an embodiment of the present application. (Plastic support)

FIG. 10 illustrates a schematic diagram of yet another variant implementation of a photosensitive assembly according to an embodiment of the present application. (molded stent).

FIG. 11 illustrates a schematic diagram of yet another variant implementation of a photosensitive assembly according to an embodiment of the present application. (electronic components under)

Fig. 12 illustrates a schematic view of a manufacturing process of a photosensitive assembly according to an embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and that the present application is not limited by the example embodiments described herein.

Exemplary camera module and photosensitive assembly thereof

Fig. 2 illustrates a schematic diagram of a camera module according to an embodiment of the present application. As shown in fig. 2, the camera module according to the embodiment of the present application includes: a photosensitive assembly 10 and a lens assembly 20 held in a photosensitive path of the photosensitive assembly 10. For example, the lens assembly 20 is attached to the photosensitive assembly 10 by an adhesive to be held on the photosensitive path of the photosensitive assembly 10.

As shown in fig. 2, the lens assembly 20 includes a lens carrier 21 and an optical lens 22, wherein the lens carrier 21 is mounted on the photosensitive assembly 10 (for example, the lens carrier 21 is attached to the photosensitive assembly 10 by an adhesive), and the optical lens 22 is carried in the lens carrier 21. Here, in the camera module as illustrated in fig. 3, the lens carrier 21 is implemented as a lens holder, that is, the camera module is implemented as a fixed focus camera module, and the relative positional relationship between the optical lens 22 and the photosensitive member 10 is kept constant.

Of course, in other examples of the present application, the camera module may also be implemented as other types of camera modules. For example, the camera module may be implemented as a moving focus camera module, i.e., the lens carrier 21 is implemented as a driving element capable of carrying and driving the optical lens 22 to move along a photosensitive path to change the relative positional relationship between the optical lens 22 and the photosensitive assembly 10. As another example, the camera module may also be implemented as an anti-shake camera module, i.e., the lens carrier 21 is implemented as an anti-shake motor to realize an anti-shake function through the anti-shake motor. For another example, the camera module may further include a prism and other components to form a periscopic camera module.

Fig. 3 illustrates a schematic view of a photosensitive assembly of the camera module according to an embodiment of the present application. As shown in fig. 3, the photosensitive assembly 10 according to the embodiment of the present application includes: the circuit board assembly 11 and the photosensitive chip 12 electrically connected to the circuit board assembly 11, wherein the photosensitive chip 12 is a photosensitive portion of the photosensitive assembly 10 and is configured to receive imaging light from the outside and perform imaging.

As shown in fig. 3, in the embodiment of the present application, the circuit board assembly 11 includes a circuit board main body 111, the circuit board main body 111 has an upper surface, a lower surface opposite to the upper surface, and a slot 110 formed on the upper surface, wherein the photosensitive chip 12 is disposed in the slot 110, in such a way that the overall height of the photosensitive assembly 10 is reduced.

More specifically, as described above, in the related art, the photosensitive chip is attached to the upper surface of the circuit board (the circuit board in the related art is opposite to the circuit board main body 111 in the embodiment of the present application) by glue, and such a structural configuration results in a large overall height dimension of the existing image pickup module. In order to reduce the overall height dimension, in the prior art, the base of the photosensitive chip is usually selected to be ground flat so that the height dimension of the photosensitive chip 12 is reduced to about 0.15 mm. However, as the market demands the imaging quality of the camera module to be higher and higher, the size of the photosensitive chip becomes larger and larger, and this makes the influence of the grinding of the photosensitive chip more prominent: the thinner the photosensitive chip is, the lower the overall strength of the photosensitive chip is, and the larger the degree of bending of the photosensitive chip is caused under the same external force, that is, the more serious the field curvature phenomenon of the photosensitive chip 12 is, and the imaging quality of the camera module is affected.

Accordingly, in the embodiment of the present application, since the photosensitive chip 12 is disposed in the slot 110 of the circuit board main body 111, that is, the photosensitive chip 12 and the circuit board main body 111 are at least partially overlapped in the height direction, so that the overall height dimension of the photosensitive chip 12 and the circuit board main body 111 is reduced, in the embodiment of the present application, the photosensitive chip 12 may not be subjected to the grinding process or only partially ground. That is, in the embodiment of the present application, the photosensitive chip 12 has a relatively large thickness dimension, so that it has relatively large strength, thereby being capable of reducing the degree of field curvature occurring therein and improving the imaging quality.

More specifically, in the embodiment of the present application, as shown in fig. 4, the photosensitive chip 12 includes a substrate 121 and at least one photosensitive unit 122 formed on the substrate 121, wherein the substrate 121 has a thickness ranging from 0.1mm to 0.7mm, and the photosensitive chip 12 has a thickness ranging from 0.1mm to 0.9 mm. The thickness of the circuit board main body 111 is 0.15mm-0.5 mm.

Further, as shown in fig. 3, in the embodiment of the present application, the slot 110 has a preset size larger than the photosensitive chip 12, so as to form an accommodating space 112 between the side portion of the photosensitive chip 12 and the circuit board main body 111 when the photosensitive chip 12 is disposed in the slot 110. That is, in the embodiment of the present application, the width and length of the photosensitive chip 12 are smaller than those of the slot 110, so that when the photosensitive chip 12 is accommodated in the slot 110, a gap exists between the peripheral edge of the photosensitive chip 12 and the circuit board main body 111 to form the accommodating space 112.

Accordingly, as shown in fig. 3, in the embodiment of the present application, the photosensitive assembly 10 further includes an adhesive 13 disposed in the accommodating space 112, so that the photosensitive chip 12 is bonded to the circuit board main body 111 through the adhesive 13. That is, in the embodiment of the present application, the photosensitive chip 12 is attached to the wiring board main body 111 by the adhesive 13 provided on the side portion thereof.

As described above, in the prior art, the photosensitive chip is attached to the upper surface of the circuit board by the glue, and due to the large thermal expansion coefficient of the glue, when the ambient temperature changes, the glue is likely to shrink or expand unevenly, which causes the problem of field curvature of the photosensitive chip disposed above the glue. Accordingly, in the embodiment of the present application, the adhesive disposed between the lower surface of the photosensitive chip and the upper surface of the circuit board is eliminated, and the disposition position of the adhesive 13 is adjusted to the side portion of the photosensitive chip 12, in this way, on one hand, the contact area between the adhesive 13 and the photosensitive chip 12 can be reduced, so that the influence of the deformation of the adhesive 13 on the photosensitive chip 12 is reduced; on the other hand, since the adhesive 13 is disposed on the side of the photo sensor 12, the direction of the force applied by the adhesive 13 due to its own deformation is substantially aligned with the length and width directions of the photo sensor 12, that is, the component of the force applied by the adhesive 13 to the photo sensor 12 in the height direction of the photo sensor 12 is small, so that the bending degree of the photo sensor 12 can be reduced. That is, in the embodiment of the present application, the photosensitive chip 12 is connected to the circuit board main body 111 through the adhesive 13 disposed on the side portion thereof, in such a manner that the force pattern and the force magnitude of the photosensitive chip 12 are changed to reduce the bending degree of the photosensitive chip 12.

In addition, the adhesive 13 disposed on the side of the photo chip 12 provides a buffer effect to reduce the influence of external impact on the photo chip 12.

Preferably, in the embodiment of the present application, the shape of the slot 110 is consistent with the shape of the photosensitive chip 12, and when the photosensitive chip 12 is disposed in the slot 110 to form the accommodating space 112, the width dimension of the accommodating space 112 is consistent along the circumferential direction set by the photosensitive chip 12, that is, the adhesive 13 has a consistent width dimension along the axial direction set by the photosensitive chip 12.

For example, in one specific example, the photosensitive chip 12 is rectangular in shape, the slot 110 is also rectangular in shape, and when the photosensitive chip 12 is disposed in the slot 110 to form the accommodating space 112, the center of the photosensitive chip 12 is substantially aligned with the center set by the slot 110 so that the width dimension of the accommodating space 112 is consistent along the circumferential direction set by the photosensitive chip 12.

Further, as shown in fig. 3, in the embodiment of the present application, the thickness of the circuit board main body 111 is smaller than the thickness of the photosensitive chip 12, and the slot 110 is a through slot penetratingly formed between the upper surface and the lower surface of the circuit board main body 111, so that when the photosensitive chip 12 is placed in the slot 110, the relative position relationship between the photosensitive chip 12 and the circuit board main body 111, that is, the relative position relationship between the upper surface of the photosensitive chip 12 and the circuit board main body can be adjusted.

Preferably, in the embodiment of the present application, as shown in fig. 3, when the photosensitive chip 12 is accommodated in the slot 110, the upper surface of the photosensitive chip 12 is flush with the upper surface of the circuit board main body 111, that is, the upper surface of the photosensitive chip 12 and the upper surface of the circuit board main body 111 are in the same plane. Thus, the mounting reference surface set on the upper surface of the circuit board main body 111 is consistent with the upper surface of the photosensitive chip 12, so that the phase position relationship between other components and the photosensitive chip 12 can be synchronously determined in the process of mounting the other components on the circuit board main body 111, thereby reducing the measurement times, reducing the tolerance chain and improving the mounting precision. For example, in the embodiment illustrated in fig. 3, the optical lens 22 is mounted on the upper surface of the circuit board main body 111 through the lens carrier 21, and accordingly, when the relative positional relationship between the optical lens 22 and the circuit board main body 111 is determined, the relative positional relationship between the optical lens 22 and the photosensitive chip 12 can also be determined synchronously, and therefore, the number of measurements can be reduced, the tolerance chain can be reduced, and the mounting accuracy can be improved.

It should be noted that, because the thickness of the circuit board main body 111 is smaller than the thickness of the photosensitive chip 12, when the photosensitive chip 12 is placed in the slot 110, the lower surface of the photosensitive chip 12 is suspended and protruded out of the lower surface of the circuit board main body 111. Accordingly, as shown in fig. 3, in the embodiment of the present application, the circuit board assembly 11 further includes a bonding portion 113 disposed on the lower surface of the circuit board main body 111 and used for supporting the photosensitive chip 12. That is, in the embodiment of the present application, the lower surface of the photosensitive chip 12 is supported by the bonding portion 113, and preferably, the thermal expansion coefficients of the bonding portion 113 and the photosensitive chip 12 are matched to reduce the stress generated between the two due to the change of the ambient temperature.

As shown in fig. 3, in the embodiment of the present application, the bonding portion 113 is integrally formed on the lower surface of the circuit board main body 111 and covers the lower surface of the photosensitive chip 12 and at least a portion of the side surface thereof, so as to support the photosensitive chip 12 thereon. For example, in a specific example of the present application, the bonding portion 113 is integrally formed on the lower surface of the circuit board main body 111 by a molding process and covers the lower surface of the photosensitive chip 12 and at least a portion of the side surface thereof, that is, the bonding portion 113 is a molded body. Of course, the combining portion 113 may also be formed on the lower surface of the circuit board main body 111 by other integral molding processes, such as a molding process, and the like, which is not limited in this application.

It should be noted that, when the bonding portion 113 is a molded body, the adhesive 13 disposed on the side portion of the photosensitive chip 12 can also prevent a molding material from contaminating a photosensitive region of the photosensitive chip 12 (the photosensitive region is formed on the upper surface of the photosensitive chip 12) in the process of performing the molding process to form the bonding portion 113.

Further, as shown in fig. 3, in the embodiment of the present application, the photosensitive assembly 10 further includes an electrical connection medium 14 extending between the circuit board main body 111 and the photosensitive chip 12, so that the photosensitive chip 12 is electrically connected to the circuit board main body 111 through the electrical connection medium 14. In particular, in the embodiment of the present application, the upper surface of the photosensitive chip 12 is flush with the upper surface of the circuit board main body 111, that is, there is no height difference between the upper surface of the photosensitive chip 12 and the upper surface of the circuit board main body 111, and this positional relationship provides other possibilities for the configuration of the electrical connection medium 14.

More specifically, as shown in fig. 3, in the embodiment of the present application, the electrical connection medium 14 is formed on the upper surface of the photosensitive chip 12 and the upper surface of the wiring board main body 111 in a stacked manner by a process such as plating or spraying. That is, in the embodiment of the present application, the electrical connection medium 14 is a thin metal layer or an alloy layer stacked on the photosensitive chip 12 and the circuit board main body 111. More preferably, in the embodiment of the present application, the upper surface of the adhesive 13 is flush with the upper surfaces of the photosensitive chip 12 and the circuit board main body 111, so that the upper surfaces of the adhesive 13, the photosensitive chip 12 and the circuit board main body 111 form a flat surface.

It should be appreciated that compared to the conventional electrical connection method of gold wire (either forward or reverse gold wire), the electrical connection medium 14 formed by a thin metal or alloy can reduce the space reserved above the gold wire to reduce the back focus margin, so that the overall height of the photosensitive device 10 can be reduced. Of course, the photosensitive assembly 10 according to the embodiment of the present application can also use the existing gold wire to implement the electrical connection between the photosensitive chip 12 and the circuit board main body 111, for example, in the example illustrated in fig. 8, the photosensitive chip 12 and the circuit board main body 111 still conduct through using the lead as the electrical connection medium 14.

Further, as shown in fig. 3, in the embodiment of the present application, the photosensitive assembly 10 further includes at least one electronic component 15 formed on the upper surface of the circuit board main body 111, where the at least one electronic component 15 includes, but is not limited to, a capacitor, an inductor, a resistor, and the like. For example, in a specific example of the present application, the at least one electronic component 15 may be formed on the upper Surface of the circuit board main body 111 by Surface Mount Technology (SMT).

Further, as shown in fig. 3, in the embodiment of the present application, the photosensitive assembly 10 further includes a filter element 16 disposed in the optical lens and held on the photosensitive path of the photosensitive chip 12, so as to filter the imaging light entering the photosensitive chip 12 through the filter element 16, so as to improve the imaging quality.

FIG. 7 is a schematic diagram illustrating a modified implementation of the photosensitive assembly 10 according to an embodiment of the present application. As shown in fig. 7, in this modified embodiment, the thickness dimension of the wiring board main body 111 is equal to the thickness dimension of the photosensitive chip 12, and the groove 110 is a through groove penetratingly formed between the upper surface and the lower surface of the wiring board main body 111. Accordingly, when the upper surface of the wiring board main body 111 is flush with the upper surface of the photosensitive chip 12, the lower surface of the wiring board main body 111 is also flush with the lower surface of the photosensitive chip 12.

Further, as shown in fig. 7, in this modified embodiment, the circuit board assembly 11 further includes a bonding portion 113 disposed on the lower surface of the circuit board main body 111 and supporting the photosensitive chip 12. More specifically, in the modified embodiment as illustrated in fig. 7, the bonding portion 113 is integrally formed on the lower surface of the circuit board main body 111 and covers the lower surface of the photosensitive chip 12, so as to support the photosensitive chip 12 thereon. For example, in a specific example of the present application, the bonding portion 113 is integrally formed on the lower surface of the circuit board main body 111 by a molding process and covers the lower surface of the photosensitive chip 12, that is, the bonding portion 113 is a molded body. Of course, the combining portion 113 may also be formed on the lower surface of the circuit board main body 111 by other integral molding processes, such as a molding process, and the like, which is not limited in this application.

That is, compared to the photosensitive assembly 10 illustrated in fig. 3, in the example illustrated in fig. 7, the dimensional relationship between the photosensitive chip 12 and the wiring board main body 111 changes.

FIG. 7 illustrates a schematic diagram of another variant implementation of the photosensitive assembly 10 according to an embodiment of the present application. As shown in fig. 7, in this modified embodiment, the thickness dimension of the wiring board main body 111 is equal to the thickness dimension of the photosensitive chip 12, and the groove 110 is a through groove penetratingly formed between the upper surface and the lower surface of the wiring board main body 111. Accordingly, when the upper surface of the wiring board main body 111 is flush with the upper surface of the photosensitive chip 12, the lower surface of the wiring board main body 111 is also flush with the lower surface of the photosensitive chip 12.

Further, as shown in fig. 7, in this modified embodiment, the bonding portion 113 is a reinforcing plate attached to the lower surface of the wiring board main body 111, and the lower surface of the photosensitive chip 12 is attached to the reinforcing plate, so that the photosensitive chip 12 is supported thereon. For example, in one particular example of the present application, the stiffening plate is implemented as a metal plate. It is worth mentioning that the heat dissipation performance of the photosensitive chip 12 can be enhanced by the reinforcing plate made of a metal material.

That is, compared to the photosensitive assembly 10 illustrated in fig. 3, in the example illustrated in fig. 7, the dimensional relationship between the photosensitive chip 12 and the circuit board main body 111 is changed, and the embodiment of the bonding portion 113 is adjusted.

FIG. 7 illustrates a schematic diagram of yet another alternate implementation of the photosensitive assembly 10 according to an embodiment of the present application. As shown in fig. 7, in this modified embodiment, the thickness dimension of the circuit board main body 111 is larger than the thickness dimension of the photosensitive chip 12, the slot 110 is a groove concavely formed on the upper surface of the circuit main body, and the depth dimension of the slot 110 is consistent with the thickness dimension of the photosensitive chip 12. Preferably, in this modified embodiment, the depth dimension of the photosensitive chip 12 is consistent with the depth dimension of the slot 110, so that when the photosensitive chip 12 is disposed in the slot 110 through the adhesive 13, the upper surface of the photosensitive chip 12 is flush with the upper surface of the circuit board main body 111.

It should be noted that in this modified embodiment, the photosensitive chip 12 is held on the bottom surface of the recess, that is, the wiring board main body 111 provides a support surface for holding the photosensitive chip 12, so that in this modified embodiment, the configuration of the bonding portion 113 can be eliminated. Of course, it should be understood that the bonding portion 113 may be also disposed on the lower surface of the board body 111 in order to reinforce the overall strength of the board body 111.

FIG. 9 illustrates a schematic diagram of yet another alternate implementation of the photosensitive assembly 10 according to an embodiment of the present application. As shown in fig. 9, in this modified embodiment, the photosensitive assembly 10 further includes an encapsulating portion 17 provided on the upper surface of the wiring board main body 111, and the encapsulating portion 17 provides a mounting platform for mounting the filter element 16.

In particular, in the example illustrated in fig. 9, the encapsulation 17 is implemented as a pre-molded bracket, for example, a plastic bracket, which is attached to the upper surface of the circuit board main body 111.

FIG. 10 illustrates a schematic diagram of yet another alternate implementation of the photosensitive assembly 10 according to an embodiment of the present application. As shown in fig. 10, in this modified embodiment, the photosensitive assembly 10 further includes an encapsulating portion 17 provided on the upper surface of the wiring board main body 111, and the encapsulating portion 17 provides a mounting platform for mounting the filter element 16.

In particular, in the example illustrated in fig. 10, the encapsulating portion 17 is integrally formed on the upper surface of the wiring board main body 111. For example, the encapsulating portion 17 is integrally formed on the upper surface of the circuit Board main body 111 by an moc (Molding on chip) process or an MOB (Molding on Board) process, and covers at least a portion of the upper surface of the circuit Board main body 111 and at least a portion of the at least one electronic component 15 formed on the upper surface of the circuit Board main body 111, or at least a portion of the upper surface of the circuit Board main body 111, at least a portion of the at least one electronic component 15 formed on the upper surface of the circuit Board main body 111, and at least a portion of the non-photosensitive region of the photosensitive chip 12.

FIG. 11 illustrates a schematic diagram of yet another alternate implementation of the photosensitive assembly 10 according to an embodiment of the present application. In the modified embodiment as illustrated in fig. 11, a part of the at least one electronic component 15 is disposed on the lower surface of the circuit board main body 111 and is covered by the combining portion 113 integrally formed on the lower surface of the circuit board main body 111. It should be understood that by adjusting the position of a part of the at least one electronic component 15 to the lower surface of the circuit board main body 111, the number of the electronic components 15 arranged on the upper surface of the circuit board main body 111 can be relatively reduced, and thus the length and width dimensions of the circuit board main body 111 can be reduced.

In summary, the image pickup module and the photosensitive assembly 10 thereof according to the embodiment of the present application are illustrated, wherein the photosensitive chip 12 is connected to the circuit board main body 111 through the adhesive 13 disposed on the side portion thereof, so as to change the stress mode and the stress magnitude of the photosensitive chip 12, thereby reducing the field curvature of the chip.

Also, the adhesive 13 disposed on the side of the photo chip 12 provides a buffer effect to reduce the influence of external impact on the photo chip 12. Preferably, in the embodiment of the present application, the adhesive 13 is uniformly and circumferentially formed on the peripheral side of the photo sensor 12, so as to more uniformly adjust the stress of the photo sensor 12 in each direction, and reduce the bending degree thereof.

Also, the adhesive 13 provided at the side of the photo chip 12 can also play a role of isolating and protecting at least the photo-sensing area of the photo chip 12 in the molding process, that is, the adhesive 13 also plays a role of an isolation layer.

In addition, the circuit board main body 111 has a slot 110 formed on the upper surface thereof, and the photosensitive chip 12 is disposed in the slot 110, so that the upper surface of the photosensitive chip 12 can sink more relative to the upper surface of the circuit board main body 111, thereby reducing the overall height of the camera module.

Furthermore, the upper surface of the photosensitive chip 12 is flush with the upper surface of the circuit board main body 111, that is, the mounting reference surface set on the upper surface of the circuit board main body 111 is consistent with the upper surface of the photosensitive chip 12, so that the phase position relationship between the component and the photosensitive chip 12 can be synchronously determined in the process of mounting other components on the circuit board, thereby reducing the number of times of measurement, reducing the tolerance chain and improving the mounting accuracy.

Also, an electrical connection medium 14 for electrically connecting the photosensitive chip 12 and the wiring board main body 111 is formed on the upper surface of the photosensitive chip 12 and the upper surface of the wiring board main body 111 by stacking by a process such as spraying, plating, or the like, to reduce the height dimension reserved when gold wires are bonded, so as to further reduce the height dimension of the camera module.

And, the substrate 121 of the photo chip 12 is partially removed or not removed, so that the photo chip 12 has relatively higher structural strength than the photo chip 12 in which the substrate 121 is completely ground flat, thereby relatively reducing the degree of bending deformation of the photo chip 12.

Method of making an exemplary photosensitive assembly 10

According to another aspect of the present application, a method of manufacturing the photosensitive assembly 10 is also provided.

Fig. 12 illustrates a schematic view of a manufacturing process of the photosensitive assembly 10 according to an embodiment of the present application. As shown in fig. 12, the process of manufacturing the photosensitive assembly 10 according to the embodiment of the present application includes the following steps.

Firstly, providing a carrier 100, a circuit board main body 111 and a photosensitive chip 12, wherein the circuit board main body 111 has a slot 110 formed therein in a penetrating manner, and the slot 110 has a preset size larger than or equal to that of the photosensitive chip 12;

then, the upper surface of the circuit board main body 111 is disposed on the carrier, and the photosensitive chip 12 is disposed in the slot 110 with the upper surface facing the carrier 100, so as to form an accommodating space 112 between the circuit board main body 111, the side of the photosensitive chip 12 and the carrier 100;

then, applying an adhesive 13 in the accommodating space 112;

then, a combining part 113 is integrally formed on the lower surface of the circuit board main body 111 through a molding process, and the combining part 113 at least covers the lower surface of the photosensitive chip 12;

then, the carrier board 100 is removed;

then, an electrical connection medium 14 is formed between the circuit board main body 111 and the photosensitive chip 12 to electrically connect the photosensitive chip 12 to the circuit board main body 111 through the electrical connection medium 14;

in one example, in the manufacturing method according to the present application, the adhesive 13 disposed in the accommodating space 112 prevents the molding material from flowing toward the upper surface of the photosensitive chip 12 in the process of integrally forming a bonding portion 113 on the lower surface of the circuit board main body 111 by a molding process.

In one example, in the manufacturing method according to the present application, the upper surface of the wiring board main body 111 is flush with the upper surface of the photosensitive chip 12.

In one example, in a manufacturing method according to the present application, forming an electrical connection medium 14 between the wiring board main body 111 and the photosensitive chip 12 includes: the electrical connection medium 14 is formed on the upper surface of the wiring board main body 111, the upper surface of the adhesive 13, and the upper surface of the photosensitive chip 12 in a superposed manner.

In one example, in the manufacturing method according to the present application, the upper surface of the adhesive 13 is flush with the upper surface of the wiring board main body 111 and the upper surface of the photosensitive chip 12.

In one example, in a manufacturing method according to the present application, the photosensitive chip 12 includes a substrate 121 and at least one photosensitive unit 122 formed on the substrate 121, wherein the photosensitive chip 12 has a thickness ranging from 0.1mm to 0.9 mm.

In one example, in the manufacturing method according to the present application, the thickness of the wiring board main body 111 ranges from 0.15mm to 0.5mm

In one example, in the manufacturing method according to the present application, the shape of the slot 110 is consistent with the shape of the photosensitive chip 12, wherein when the photosensitive chip 12 is disposed in the slot 110 to form the accommodating space 112, the width dimension of the accommodating space 112 is consistent along the circumferential direction set by the photosensitive chip 12.

In summary, a method for manufacturing the photosensitive assembly 10 according to the embodiment of the present application is illustrated, which is used for manufacturing the photosensitive assembly 10 as described above. It should be noted that the manufacturing method illustrated in fig. 12 is exemplified by manufacturing the photosensitive assembly 10 illustrated in fig. 3, and of course, if a modified implementation or an equivalent implementation of manufacturing the photosensitive assembly 10 is to be performed, slight adjustments may be made based on the manufacturing concept illustrated in fig. 12, and details thereof are not repeated.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A photosensitive assembly, comprising:

2. The photosensitive assembly of claim 1, wherein the photosensitive chip comprises a substrate and at least one photosensitive unit formed on the substrate.

3. The photosensitive assembly of claim 2 wherein the substrate has a thickness in the range of 0.1mm to 0.7 mm.

4. The photosensitive assembly of claim 2 wherein the thickness of the photosensitive chip ranges from 0.1mm to 0.9 mm.

5. The photosensitive assembly of claim 4, wherein the upper surface of the photosensitive chip is flush with the upper surface of the circuit board body.

6. The photosensitive assembly according to claim 4, wherein the thickness dimension of the circuit board main body is larger than the thickness dimension of the photosensitive chip, the slot is a groove concavely formed on the upper surface of the circuit main body, and the depth dimension of the slot is consistent with the thickness dimension of the photosensitive chip.

7. The photosensitive assembly according to claim 4, wherein the thickness dimension of the circuit board main body is equal to or less than the thickness dimension of the photosensitive chip, the groove is a through groove penetratingly formed between the upper surface and the lower surface of the circuit board main body, the depth dimension of the through groove is equal to or less than the thickness dimension of the photosensitive chip, and the circuit board assembly further includes a bonding portion disposed on the lower surface of the circuit board main body and configured to support the photosensitive chip.

8. The photosensitive assembly of claim 7, wherein the thickness dimension of the circuit board body is 0.15mm-0.5 mm.

9. The photosensitive assembly of claim 7, wherein the bonding portion is integrally formed on the lower surface of the circuit board main body and covers the lower surface of the photosensitive chip, in such a way as to support the photosensitive chip thereon.

10. The photosensitive assembly according to claim 7, wherein the bonding portion is integrally formed on the lower surface of the circuit board main body and covers the lower surface of the photosensitive chip and at least a portion of the side surface thereof, in such a manner as to support the photosensitive chip thereon.

11. The photosensitive assembly according to claim 7, wherein the bonding portion is a reinforcing plate attached to a lower surface of the circuit board main body, and a lower surface of the photosensitive chip is attached to the reinforcing plate in such a manner as to support the photosensitive chip thereon.

12. The photosensitive assembly of claim 11 wherein the stiffener is made of a metallic material.

13. The photosensitive assembly of claim 5, further comprising an electrical connection medium extending between the circuit board body and the photosensitive chip, such that the photosensitive chip is electrically connected to the circuit board body through the electrical connection medium.

14. The photosensitive chip according to claim 13, wherein the electrical connection medium is formed on an upper surface of the photosensitive chip, an upper surface of the wiring board main body, and an upper surface of the adhesive in a stacked manner.

15. The photosensitive assembly of claim 12, wherein the upper surface of the adhesive is flush with the upper surfaces of the photosensitive chip and the circuit board body, such that the upper surface of the adhesive, the upper surface of the photosensitive chip and the upper surface of the circuit board body form a flat surface.

16. The photosensitive assembly according to claim 1, wherein the shape of the slot corresponds to the shape of the photosensitive chip, wherein when the photosensitive chip is disposed in the slot to form the accommodating space, the width dimension of the accommodating space corresponds to the circumferential direction set by the photosensitive chip.

17. The photosensitive assembly according to claim 5, further comprising a packaging portion provided to an upper surface of the circuit board main body.

18. A camera module comprising a photosensitive assembly according to any one of claims 1 to 17.

19. A method for manufacturing a photosensitive assembly, comprising:

applying an adhesive in the accommodating space;

removing the carrier plate; and

20. The manufacturing method according to claim 19, wherein the adhesive provided in the accommodating space prevents the molding material from flowing to the upper surface of the photosensitive chip in a process of integrally forming a bonding portion on the lower surface of the circuit board main body by a molding process.

21. The manufacturing method according to claim 19, wherein an upper surface of the wiring board main body is flush with an upper surface of the photosensitive chip.

22. The manufacturing method according to claim 21, wherein forming an electrical connection medium between the wiring board main body and the photosensitive chip includes:

the electrical connection medium is formed on the upper surface of the circuit board main body, the upper surface of the adhesive, and the upper surface of the photosensitive chip in a superposed manner.

23. The manufacturing method according to claim 22, wherein an upper surface of the adhesive is flush with an upper surface of the wiring board main body and an upper surface of the photosensitive chip.

24. A manufacturing method according to claim 19, wherein the photosensitive chip includes a substrate and at least one photosensitive unit formed on the substrate, wherein a thickness of the photosensitive chip ranges from 0.1mm to 0.9 mm.

25. The manufacturing method according to claim 24, wherein the thickness of the wiring board main body ranges from 0.15mm to 0.5 mm.

26. A producing method according to claim 19, wherein a shape of said groove is conformed to a shape of said photosensitive chip, wherein a width dimension of said accommodating space is conformed along a circumferential direction in which said photosensitive chip is set when said photosensitive chip is set in said groove to form said accommodating space.