CN206650737U - The manufacturing equipment of sunk type photosensory assembly - Google Patents

Abstract

The manufacturing equipment of one sunk type photosensory assembly, it includes：One peelable substrate and a molding tool；The peelable substrate is used for the circuit board main body and a photo-sensitive cell for strippingly supporting the sunk type photosensory assembly；The mould is used for the photo-sensitive cell of sunk type photosensory assembly described in integral packaging and the circuit board main body, and to form a Base body of the sunk type photosensory assembly with an optical window, the optical window provides passage of light for the photo-sensitive cell.

Description

The manufacturing equipment of sunk type photosensory assembly

Technical field

Camera module field is the utility model is related to, further, is related to the manufacturing equipment of a sunk type photosensory assembly.

Background technology

With the continuous development of intelligent electronic device, the requirement more and more higher to camera module.Intelligent electronic device, such as The more and more functionalization of smart mobile phone, lightening, correspondingly, camera module is also required to more excellent image quality and small-sized Change development.

By taking smart mobile phone as an example, it is well known that existing smart mobile phone thickness has been decreased to several millimeters, such as 6,7 Millimeter, mounted camera module require to be less than such size naturally, it is evident that what camera module had been miniaturized at one Dimensional structure.It will be appreciated that on the dimensional structure being so miniaturized, further reduce is carried out to camera module and is become extremely It is difficult.

With the high speed development of camera module in recent years, the various performances of module come into splendid level, and to reach To corresponding image quality, various building blocks and opposed configuration determine substantially.Reference picture 1, encapsulated by COB modes Camera module, the camera module generally include a wiring board 1P, a sensitive chip 2P, a microscope base 3P, a camera lens 4P and a horse Up to 5P.The sensitive chip 2P is mounted on the wiring board 1P, and the microscope base 3P is installed in the wiring board 1P, the mirror Head 4P is installed in the motor 5P, and causes the camera lens 4P to be located at the photosensitive path of the sensitive chip 2P, an optical filter 8P is installed in the microscope base 3P, positioned at the photosensitive path of the sensitive chip 2P.It is noted that on the wiring board 1P It is generally necessary to some capacitance resistance wares 6P is mounted with gold thread 7P, such as attachment resistance, electric capacity is beaten to coordinate the work of the wiring board 1P Make, the capacitance resistance ware 6P and gold thread 7P generally protrude from the wiring board 1P, and existing this structure has problems.

First, the microscope base 3P is bonded on the wiring board 1P by glue, due to the injustice of the microscope base 3P in itself Assembling that is whole and attaching tilts, and finally easily causes the inclination of module, optical axis it is inconsistent.

Secondly, the capacitance resistance ware 6P, gold thread 7P with the sensitive chip 2P in the same space connected, the capacitance-resistance Dust, the impurity remained on device 6P and gold thread 7P is easily transferred on the sensitive chip 2P, so as to influence the shooting mould The image quality of group so that occur the harmful effects such as stain, stain in the imaging of the camera module.

3rd, the microscope base 3P is adhered to the wiring board 1P by glue, and structural strength is poor, therefore it is required that the line Road plate 1P thickness is larger so that the thickness of the camera module is not easy to reduce.

4th, the camera module structure of existing COB encapsulation has reached higher degree of optimization, and each part is such as described Microscope base 3P, the wiring board 1P, the sensitive chip 2P, the camera lens 4P and the motor 5P relative position and structure Relation is relative to be determined, on this basis, the size of camera module is difficult further to reduce.

5th, the sensitive chip 2P is attached on the wiring board 1P, and the structural relation of lamination causes the shooting mould The height of group is larger.

6th, and it is important a bit, the sensitive chip 2P is attached at the line by way of glue bonding It is sealed in above road plate 1P, the sensitive chip 2P in the relative spaces of the camera lens 4P, lower section is hindered by the wiring board 1P Gear, therefore the integral heat sink effect of the sensitive chip 2P is poor, can only be radiated by the conduction of the wiring board 1P, And as a rule the radiating effect of wiring board is all poor.Further, when the sensitive chip 2P adstante febres, easily influence described in The service behaviour of camera module, for example influence image quality.

Utility model content

A purpose of the present utility model is the manufacturing equipment for providing a sunk type photosensory assembly, wherein the sunk type Photosensory assembly includes an integral encapsulation base, a circuit board and a photo-sensitive cell, and the photo-sensitive cell passes through the integral packaging Pedestal sinks ground, integral packaging in the circuit board, so as to reduce the size of the camera module.

A purpose of the present utility model is the manufacturing equipment for providing a sunk type photosensory assembly, wherein the integral base Seat integral packaging substitutes traditional microscope base and traditional chip attaches mode in the photo-sensitive cell and the circuit board.

A purpose of the present utility model is the manufacturing equipment for providing a sunk type photosensory assembly, wherein the circuit board Including a circuit board main body and there is a sinker area, the sinker area is arranged at the wiring board main body, the photosensitive core Piece is arranged at the sinker area, so as to reduce the relative altitude of the circuit board main body and the sensitive chip.

A purpose of the present utility model is the manufacturing equipment for providing a sunk type photosensory assembly, wherein the sinker area Connect the both sides of the circuit board main body so that the back side of the sensitive chip is revealed in outside, so as to improve the photosensitive core The heat dispersion of piece.

A purpose of the present utility model is the manufacturing equipment for providing a sunk type photosensory assembly, wherein the one envelope Dress pedestal includes a Base body, and the Base body includes one pedestals and secondary pedestal, described in successively fixing Photo-sensitive cell, the sinking one for completing the photo-sensitive cell encapsulate.

A purpose of the present utility model is the manufacturing equipment for providing a sunk type photosensory assembly, wherein the once base Seat includes an end liner and once encapsulates base, during fabrication, the end liner is first formed on the circuit board, then by manufacturing equipment Be supported in the end liner formed it is described once encapsulate base, so as to pre-fix the photo-sensitive cell, and prevent from manufacturing mould damage The photo-sensitive cell.

A purpose of the present utility model is the manufacturing equipment for providing a sunk type photosensory assembly, wherein the secondary base Seat includes an encapsulating base and a secondary encapsulation base, and the encapsulating base and the base that once encapsulates form a loop configuration, the bag Seal the electrical connecting element that base encapsulates the sensitive chip.

A purpose of the present utility model is the manufacturing equipment for providing a sunk type photosensory assembly, wherein in the mistake of manufacture Cheng Zhong, manufacturing equipment is supported in the loop configuration and forms the secondary encapsulation base, so as to by the loop configuration and described Secondary encapsulation base forms a mounting groove, reduces and turning is formed during one-shot forming, reduces the burr phenomena occurred in shaping, Improve profile pattern.

A purpose of the present utility model is the manufacturing equipment for providing a sunk type photosensory assembly, wherein the secondary envelope The electronic component that base coats the circuit board surface is filled, so as to reduce the space that electronic component device independently takes, reduces institute State the size of camera module.

A purpose of the present utility model is the manufacturing equipment for providing a sunk type photosensory assembly, wherein the shooting mould Group includes a filter element, and the filter element is covered on the photo-sensitive cell, so as to protect the photo-sensitive cell.

In order to realize at least one purpose of the above, one side of the present utility model provides the manufacture of a sunk type photosensory assembly Equipment, it includes：One peelable substrate and a molding tool；The peelable substrate is used to strippingly support the sunk type A circuit board main body and a photo-sensitive cell for photosensory assembly；The mould is used for sunk type photosensory assembly described in integral packaging The photo-sensitive cell and the circuit board main body, with formed with an optical window the sunk type photosensory assembly a pedestal master Body, the optical window provide passage of light for the photo-sensitive cell.

According to some embodiments, shaping mould described in the manufacturing equipment of described sunk type photosensory assembly have a pedestal into Type guide groove, suitable for Base body described in one-shot forming.

According to some embodiments, manufacturing equipment described in the manufacturing equipment of described sunk type photosensory assembly includes an optical window Forming blocks, it is arranged at the mould and forms the pedestal profiled guide slot.

According to some embodiments, mould described in the manufacturing equipment of described sunk type photosensory assembly includes one first Mould and one second mould, first mould has one pedestal profiled guide slots, in order to form one Base is once encapsulated, pre-fixes to one-shot forming the photo-sensitive cell and the circuit board main body, second mould has One or two pedestal profiled guide slots, in order to form a secondary encapsulation base on a pedestal and an encapsulating base, in order to shape Into the optical window.

According to some embodiments, a pedestal profiled guide slot is fitted described in the manufacturing equipment of described sunk type photosensory assembly It is not provided with electrically connecting the photo-sensitive cell and the circuit board main body in the corresponding photo-sensitive cell and the circuit board main body The position of one electrical connecting element, described base is once encapsulated in order to be formed.

According to some embodiments, manufacturing equipment described in the manufacturing equipment of described sunk type photosensory assembly includes one first Optical window forming blocks, the first optical window forming blocks are arranged at first mould, form the pedestal shaping and lead Groove, during shaping, moulding material enters a pedestal profiled guide slot, and base is once encapsulated described in formation, corresponding The position of the first optical window forming blocks forms the part optical window.

According to some embodiments, manufacturing equipment described in the manufacturing equipment of described sunk type photosensory assembly includes one second Optical window forming blocks, the second optical window forming blocks are arranged at second mould, form the secondary pedestal shaping and lead Groove, during shaping, moulding material enters the secondary pedestal profiled guide slot, forms the secondary encapsulation base, corresponding The position of the second optical window forming blocks forms optical window described in another part, so as to form the overall optical window.

According to some embodiments, a pedestal includes a bottom described in the manufacturing equipment of described sunk type photosensory assembly Lining, the end liner protrude from the photo-sensitive cell, and when once encapsulating base described in formation, the first optical window forming blocks are suitable to quilt End liner support and once encapsulate base described in being formed, in order to protect the photo-sensitive cell.

According to some embodiments, the secondary encapsulation base is being formed in the manufacturing equipment of described sunk type photosensory assembly When, the second optical window shaping is suitable to form the secondary encapsulation base by a pedestal and the encapsulating base support.

According to some embodiments, manufacturing equipment is covered including one described in the manufacturing equipment of described sunk type photosensory assembly Film, the overlay film is arranged on the inside of the mould, in order to protect the photo-sensitive cell.

According to some embodiments, strippable mode is selected from group described in the manufacturing equipment of described sunk type photosensory assembly Close：Peel off, expose, heating, etching, dissolving, one kind in grinding

According to some embodiments, peelable substrate described in the manufacturing equipment of described sunk type photosensory assembly is flat board Shape, make it that the back side of the photo-sensitive cell is consistent with the bottom surface of the circuit board main body.

According to some embodiments, peelable dose of substrate has extremely described in the manufacturing equipment of described sunk type photosensory assembly A few pillar, suitable for strippingly supporting the photo-sensitive cell, to cause the positive and described circuit board master of the photo-sensitive cell The top surface of body is consistent.

According to some embodiments, circuit board main body described in the manufacturing equipment of described sunk type photosensory assembly is provided with Heavy area, the circuit board main body is sunken under the photo-sensitive cell, during fabrication, the sinker area is sunken under the photo-sensitive cell It is interior, strippingly supported by the peelable substrate.

Brief description of the drawings

Fig. 1 is the camera module schematic diagram of traditional COB encapsulation.

Fig. 2A is the schematic perspective view according to the sunk type camera module of first preferred embodiment of the present utility model.

Fig. 2 B are Fig. 2A along line A-A schematic cross-sectional view.

Fig. 3 A are illustrated according to the forming process of the sunk type camera module of first preferred embodiment of the present utility model Figure.

Fig. 3 B are the schematic perspective views according to the sunk type photosensory assembly of first preferred embodiment of the present utility model.

Fig. 4 is another embodiment according to the sunk type camera module of first preferred embodiment of the present utility model.

Fig. 5 is the sunk type photosensory assembly according to second preferred embodiment of the present utility model.

Fig. 6 A are illustrated according to the forming process of the sunk type photosensory assembly of second preferred embodiment of the present utility model Figure.

Fig. 6 B are the schematic perspective views according to the sunk type formula photosensory assembly of second preferred embodiment of the present utility model.

Fig. 7 A and 7B are to be set according to the sunk type photosensory assembly of second preferred embodiment of the present utility model by manufacture Standby manufacturing process schematic diagram.

Fig. 8 is first deformation implementation according to the sunk type photosensory assembly of second preferred embodiment of the present utility model Mode.

Fig. 9 A and 9B are the deformation implementations according to the sunk type photosensory assembly of second preferred embodiment of the present utility model The manufacturing process schematic diagram by manufacturing equipment of mode.

Figure 10 is second deformation reality according to the sunk type photosensory assembly of second preferred embodiment of the present utility model Apply mode.

Figure 11 is the sunk type photosensory assembly according to the 3rd preferred embodiment of the present utility model.

Figure 12 A and 12B are the formation according to the sunk type photosensory assembly of the 3rd preferred embodiment of the present utility model Journey schematic diagram.

Figure 13 A, 13B and 13C are passed through according to the sunk type photosensory assembly of the 3rd preferred embodiment of the present utility model The manufacturing process of manufacturing equipment.

Figure 14 is the sunk type photosensory assembly according to the 4th preferred embodiment of the present utility model.

Figure 15 is the sunk type photosensory assembly according to the 5th preferred embodiment of the present utility model.

Figure 16 is the sunk type array camera module according to the 6th preferred embodiment of the present utility model.

Figure 17 is the application schematic diagram according to the sunk type camera module of above preferred embodiment of the present utility model.

Figure 18 is the manufacture method block diagram according to the sunk type photosensory assembly of above preferred embodiment of the present utility model.

Embodiment

Describe to be used to disclose the utility model so that those skilled in the art can realize the utility model below.Retouch below Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Retouched following The general principle of the present utility model defined in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang Case and the other technologies scheme without departing from spirit and scope of the present utility model.

It will be understood by those skilled in the art that in exposure of the present utility model, term " longitudinal direction ", " transverse direction ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the orientation of the instruction such as " outer " or position close System is to be based on orientation shown in the drawings or position relationship, and it is for only for ease of description the utility model and simplified and describes, without It is instruction or implies that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore on Term is stated it is not intended that to limitation of the present utility model.

Reference picture 2A to Fig. 3 B, according to the quilt of sunk type camera module 100 of first preferred embodiment of the present utility model Explaination.The sunk type camera module 100 includes a sunk type photosensory assembly 10 and a camera lens 20.

Further, the sunk type photosensory assembly 10 includes an integral encapsulation base 11, a sinking circuit board 12 and a sense Optical element 13.The sinking circuits plate 12 is sunken under the photo-sensitive cell 13, described in the integral packaging of integral packaging pedestal 11 Sinking circuits plate 12 and the photo-sensitive cell 13.The mode of the integral packaging, which is illustrated, ground but is not limited by the side of transfer modling Formula integral packaging.

It is noted that in traditional COB encapsulating structures, microscope base is generally formed by separately fabricated, for example is passed through The mode of injection is manufactured, and after the completion of separately fabricated, when being assembled, wiring board is adhered to by glue, therefore at this In kind assembling mode, and in the utility model, on the one hand, by being sunken to the sinking circuits plate 12 under the photo-sensitive cell 13 Mode, reduce the surface relative altitude of the photo-sensitive cell 13 and the sinking circuits plate 12, so that camera lens 20 can be with Closer to the sinking circuits plate 12, reduce the height of the sinking camera module.On the other hand, in the photo-sensitive cell 13 Under when being sunken to the sinking circuits plate 12, sinking circuits plate 12 described in the integral packaging of integral packaging pedestal 11 and described photosensitive Element 13, without providing support by wiring board for sensitive chip as traditional chip attachment process, that is, Say, in the utility model, no matter the photo-sensitive cell 13 whether by the sinking circuits plate 12 support, can lead to Cross the integral packaging pedestal 11 and fix the fixing relative position of the photo-sensitive cell 13 and the sinking circuits plate 12, this Point, it is difficult in traditional COB packaging technologies.Further, the integral packaging pedestal 11 passes through integral packaging Mode takes shape in the sinking circuits plate 12, substitutes traditional microscope base, obtains many advantages：First, integral packaging instead of biography The technical process for bonding of uniting, it is not necessary to the adjustment gap in reserved AA adjustment, reduce the height of camera module；Second, one envelope The assembling mode of dress can improve the planarization on surface by Making mold, so as to improve the assembly precision of camera module；The Three, integral packaging can strengthen the structural strength of the sinking circuits plate 12, so as to pass through fluting when the sinking circuits plate 12 Or the mode such as perforate so that when photo-sensitive cell 13 sinks, it can still meet structural strength demand, and traditional microscope base and circuit Plate bonding way is then difficult to reach such requirement；4th, the integral packaging pedestal 11 can integrally coat the sinking electricity Projecting member on road plate 12, such as the electronic component 123 subsequently proposed, so as to make full use of the sinking electricity Locus on road plate 12, reduces the size of the sunk type camera module 100, while prevents the electronic component 123 The dust of upper residual pollutes the photo-sensitive cell 13.In the utility model, design method that the photo-sensitive cell 13 sinks and Integral packaging be combined with each other, and reduces the size of the sinking camera module 100.

Reference picture 2B to Fig. 3 B, the integral packaging pedestal 11 include a Base body 112 and have an optical window 111, The optical window 111 is arranged at the Base body 112, and passage of light is provided for the photo-sensitive cell 13.In other words, it is described Base body 112 forms the optical window 111, and passage of light is provided for the photo-sensitive cell 13.In certain embodiments, it is described Base body 112 is in closed annular, so as to form the optical window 111 of a closing, in further embodiments, the pedestal master Body 112 can be connected the optical window 111 and outside, the utility model and be not intended to limit in this respect with jagged.The Base body 112 moulding material citing ground but it is not limited to nylon, LCP, PP, resin etc..Preferably, the forming material of the Base body 112 Expect for thermoset material.

Further, the sinking circuits plate 12 includes a circuit board main body 121 and has a sinker area 122, under described Heavy area 122 is arranged at the circuit board main body 121.The photo-sensitive cell 13 is arranged at the sinker area 122 so that described The position of the relatively described circuit board main body 121 of photo-sensitive cell 13 sinks.In certain embodiments, the sinker area 122 is set For a groove, the photo-sensitive cell 13 is housed inside the groove, so that the photo-sensitive cell 13 and the circuit board master The relative altitude of body 121 reduces.In further embodiments, the sinker area 122 is arranged to a through hole, is communicated in the electricity The both sides of road plate main body 121.The photo-sensitive cell 13 is housed inside the through hole, so that the photo-sensitive cell 13 and described The relative altitude of circuit board main body 121 reduces.In this embodiment of the present utility model and accompanying drawing, the sinker area 122 Illustrated by taking through hole as an example, but those skilled in the art is it should be appreciated that the utility model is in this respect and unlimited System.The circuit board main body 121 citing ground but be not limited to Rigid Flex, ceramic substrate (without soft board), PCB hardboards (without Soft board).

Circuit board main body 121 and the photo-sensitive cell 13 described in the integral packaging of Base body 112, described in fixed The relative position of circuit board main body 121 and the photo-sensitive cell 13.

The photo-sensitive cell 13 has a front 131 and a back side 132, described positive 131 with the direction phase of camera lens 20 Right, the back side 132 is opposite with the direction of camera lens 20.Described positive the 131 of the photo-sensitive cell 13 have a photosensitive area 1311 and a non-photo-sensing area 1312, the photosensitive area 1311 be used to carry out photosensitization, the non-photo-sensing area 1312 is surrounded on institute State photosensitive area 1311.The circuit board main body 121 has a top surface 1212 and a bottom surface 1211, the top surface 1212 and the mirror First 20 direction is relative, and the bottom surface 1211 is opposite with the direction of camera lens 20.

At least part top surface 1212 of circuit board main body 121 described in the integral packaging of Base body 112 and described At least part non-photo-sensing area 1312 of photo-sensitive cell 13, so as to the fixed sinking circuits plate 12 and the photo-sensitive cell 13 relative position.In other words, the photo-sensitive cell 13 is connected to by the circuit board main body by the Base body 112 121, it is that the photo-sensitive cell 13 provides a supporting role without the circuit board main body 121.And this sinking one envelope The mode of dress, it is difficult in traditional COB encapsulation, structural strength is not easy to reach, and is difficult to one admittedly by microscope base Determine wiring board and sensitive chip.

Further, in this embodiment of the present utility model and accompanying drawing, the sinker area 122 is through hole, in order to Wider adjustment space is provided for the photo-sensitive cell 13, for example causes the back side 132 and the institute of the photo-sensitive cell 13 It is consistent to state the bottom surface 1211 of wiring board main body, so that the bottom of the sunk type camera module 100 is smooth, is easy to pacify Dress and use, or cause the top surface 1,212 1 of described positive 131 and the circuit board main body 121 of the photo-sensitive cell 13 Cause, or cause the top surface 1212 of the positive 131 a little higher than circuit board main body 121 of the photo-sensitive cell 13, Or described positive the 131 of the photo-sensitive cell 13 is caused to be slightly less than the bottom surface 1211 of the circuit board main body 121, ability The technical staff in domain is it should be appreciated that the utility model is not intended to limit in this respect.

In this embodiment and accompanying drawing of utility model, illustrated so that the sinker area 122 is through hole as an example, It is noted that when the sinker area 122 is through hole, the back side 132 of the photo-sensitive cell 13 can directly appear In external environment condition, so as to improve the heat dispersion of the photo-sensitive cell 13.In traditional COB packaged types, sensitive chip is usual Lamination is attached at wiring board, and heat caused by sensitive chip needs to go to radiate by wiring board, therefore heat dispersion is poor, and works as When the temperature of sensitive chip is higher, the image quality of camera module may be influenceed.

Further, the photo-sensitive cell 13 is electrically connected to the circuit board main body by an at least electrical connecting element 133 121, in order to which electric signal is transferred into the circuit board main body 121, the citing of electrical connecting element 133 ground but it is not limited to gold Line, silver wire, copper cash, aluminum steel.The sinking circuits plate 12 includes an at least electronic component 123, the quilt of electronic component 123 It is arranged at the circuit board main body 121.The electronic component 123 citing ground but it is not limited to resistance, electric capacity, driving element etc.. In this embodiment of the present utility model, the electronic component 123 protrudes from the circuit board main body 121, and in this reality With in new other embodiments, can be not provided with the electronic component 123 or the electronic component 123 it is non-bulging in The circuit board main body 121, for example interior it is embedded in the circuit board main body 121.In one embodiment, the electronic component 123 by surface mount process, i.e. SMT (Surface Mounting Technology), are arranged at the circuit board main body 121。

Further, the Base body 112 coats the electrical connecting element 133 and the electronic component 123, so that Outside will not be directly exposed to by obtaining the electrical connecting element 133 and the electronic component 123, avoid the electrical connecting element 133 and the electronic component 123 on the dust that remains pollute the photo-sensitive cell 13, and filled out by the Base body 112 Fill around the electrical connecting element 133 and the electronic component 123, make full use of the electrical connecting element 133 and described Locus around electronic component 123 so that the size of the sunk type camera module 100 is reduced.

It is noted that the quantity of the electrical connecting element 133 and position can be arranged as required to, for example it is arranged at Side, both sides, three sides or four sides of the photo-sensitive cell 13, or coordinate the set location of the electronic component 123 to carry out Set.

Further, in this embodiment of the present utility model, the sunk type camera module 100 also includes a driver 30, such as voice coil motor, piezo-electric motor, the camera lens 20 are installed in the driver 30, in order to pass through the driver The 30 adjustment camera lenses 20, form one and move burnt camera module, i.e. AF (Auto Focus) camera module.The driver 30 can be with The circuit board main body 121 is electrically connected to by a pin 31.The embodiment of the pin 31 can be single pin, draw more Pin, single pin, multiple rows of pin etc..Certainly, in other embodiment of the present utility model, reference picture 4, the sunk type is taken the photograph Picture module 100 can not include the driver 30, and the camera lens 20 is directly mounted to the sunk type photosensory assembly 10, structure Camera module, i.e. FF (Fix Focus) camera module are focused into one.Those skilled in the art is it should be appreciated that under described The type of heavy formula camera module 100 is not limitation of the present utility model.The particular type of the driver 30, structure are not It is limitation of the present utility model.

The sunk type camera module 100 can also include a filter element 40, for being filtered through the camera lens 20 Light.The filter element 40 citing ground but it is not limited to cutoff filter, smalt optical filter, full impregnated piece, visible ray mistake Filter disc.In this embodiment of the present utility model, the filter element 40 is installed in the sunk type photosensory assembly 10 The integral packaging pedestal 11, positioned at the passage of light of the photo-sensitive cell 13.In other embodiments of the present utility model, The filter element 40 can also be installed in miscellaneous part, such as single support, described photo-sensitive cell 13 etc., and this practicality is new Type is not intended to limit in this respect.

Further, the Base body 112 of the integral packaging pedestal 11 has a mounting groove 113, is communicated in described Optical window 111.In this embodiment of the present utility model, the filter element 40 is installed in the mounting groove 113.More specifically Ground, the edge of the filter element 40 extends into the mounting groove 113, so that the filter element 40 is supported on institute State Base body 112.And in other embodiment of the present utility model, a support is installed in the mounting groove 113, institute State filter element 40 and be installed in the support.

Reference picture 3A and 3B, the one of which forming process of the sunk type photosensory assembly 10 can be：First, described Surface mount is carried out in circuit board main body 121, the electronic component 123 is mounted on the circuit board main body 121, the electricity The set location of sub- component 123 can be arranged as required to, for example be arranged on certain side or a few sides；Secondly, will be described photosensitive Element 13 is arranged at the sinker area 122 of the sinking circuits plate 12, wherein the sinker area 122 can be previously formed in institute Circuit board main body 121 is stated, for example perforate forms the circuit board main body 121 with the sinker area 122 on a circuit board, Or the circuit board main body 121 of the buying with the sinker area 122；Further, by the photo-sensitive cell 13 by described Electrical connecting element 133 is electrically connected to the circuit board main body 121, in order to realize the photo-sensitive cell 13 and the circuit board master The electric signal transmission of body 121, for example the photo-sensitive cell 13 and the circuit board main body are electrically connected by way of beating gold thread 121；Further, form circuit board main body 121 described in the integral packaging of Base body 112 and the photo-sensitive cell 13 forms institute Optical window 111 is stated, and the electronic component 123 and the electrical connecting element 133 are coated by the Base body 112, by This forms the sunk type photosensory assembly 10 that can be used for installing the filter element 40.

Further, after assembling obtains the sunk type photosensory assembly 10, continue that the driver 30 and/or institute are installed Camera lens 20 is stated, the sunk type camera module 100 focused is formed or moves the burnt sunk type camera module 100.

Reference picture 5 is explained to Fig. 7 B according to the sunk type photosensory assembly 10 of second preferred embodiment of the present utility model Release.The sunk type photosensory assembly 10 is manufactured by a manufacturing equipment 200.Different from above preferred embodiment, described one Body encapsulation base 11 includes a blank medium 114, and the blank medium 114 is interval in the Base body 112 and described photosensitive Element 13, in order to protect the photo-sensitive cell during the Base body 112 is formed by the manufacturing equipment 200 13, prevent the manufacturing equipment 200 from damaging the photo-sensitive cell 13, while stop integral packaging material overflow to it is described photosensitive The photosensitive area 1311 of element 13.

Preferably, in this embodiment of the present utility model, the blank medium 114 forms the raised step of an annular Consequently facilitating when forming Base body 112 by the manufacturing equipment 200, the manufacturing equipment 200 while stop one are supported Body encapsulating material, it is boundary with the blank medium 114, forms the Base body 112.The implementation of the blank medium 114 Mode illustrate ground but be not limited to be formed by coating glue in the circuit board main body 121, can also pass through be bonded elasticity member The mode of part is formed, and the utility model is not intended to limit in this respect.

Further, reference picture 6A and 6B, during the sunk type photosensory assembly 10 is manufactured, integral packaging is being carried out Before the photo-sensitive cell 13 and the circuit board main body 121, it is necessary between described in being formed in the precalculated position of photo-sensitive cell 13 Every medium 114, the photo-sensitive cell 13 and the circuit board main body 121 are then subjected to integral packaging.The blank medium 114 are arranged at the non-photo-sensing area 1312 of the photo-sensitive cell 13, and the periphery of photosensitive area 1311, specific set location can To determine as needed.More specifically, the blank medium 114 can be in electronic component described in surface mount 123 and described Formed after electrical connecting element 133, can also before the electronic component 123 and the electrical connecting element 133 are set shape Into the utility model is not intended to limit in this respect.

In this embodiment of the present utility model, the electrical connecting element is set in four sides of the photo-sensitive cell 13 133, correspondingly, the blank medium 114 is set in the 133 corresponding position of electrical connecting element, so as to pass through the interval Medium 114 protects the electrical connecting element 133, prevents the manufacturing equipment 200 from touching, damages the electrical connecting element 133.Institute State the position of blank medium 114, can highly be set according to the electrical connecting element 133.

Further, in some embodiments of the utility model, the photo-sensitive cell 13 and the circuit board main body 121 it Between there is a gap 14, the integral base extends into the gap 14, so as to more stably fix the photo-sensitive cell 13 with the relative position of the circuit board main body 121.More specifically, the gap 14 can be surrounded on the photo-sensitive cell 13, So that the Base body 112 can be filled in around the photo-sensitive cell 13 so that the photo-sensitive cell 13 is more steady Surely it is fixed.Certainly, in other embodiment of the present utility model, the gap 14 can not also be formed.Citing ground, when described When the size of sinker area 122 is more than the size of the photo-sensitive cell 13, the photo-sensitive cell 13 and the shape of circuit board main body 121 Into the gap 14, when the size of the sinker area 122 is consistent with the size of the photo-sensitive cell 13, the photo-sensitive cell 13 The gap 14 is not formed with the circuit board main body 121.

Reference picture 10, in another embodiment of the present utility model, the gap 14 can also pass through a filled media 15 fill.The filled media 15 citing ground but glue, stickum etc. are not limited to, in order to pass through the filled media 15 To pre-fix the photo-sensitive cell 13.That is, during the sunk type photosensory assembly 10 is manufactured, can be first in institute The filling filled media 15 in the gap 14 between photo-sensitive cell 13 and the circuit board main body 121 is stated, is stated by institute 5 Filled media 15 pre-fixes the relative position of the photo-sensitive cell 13 and the circuit board main body 121, then again to described photosensitive Element 13 and the circuit board main body 121 carry out integral packaging, are further more stably fixed by the Base body 112 The photo-sensitive cell 13 and the circuit board main body 121.

Reference picture 7A and 7B are the systems according to the sunk type photosensory assembly 10 of second preferred embodiment of the present utility model Manufacturing apparatus 200 and manufacturing process.The manufacturing equipment 200 includes a molding tool 202 and a peelable substrate 201.It is described The mould 202 and peelable substrate 201 can mold and matched moulds, in order to be molded in the circuit board main body 121 Obtain Base body 112.

The manufacturing equipment 200 includes an optical window forming blocks 203, for forming the optical window 111.Of the present utility model In this embodiment, the optical window forming blocks 203 are arranged at the mould 202, and the optical window forming blocks 203 are downward Extension, a pedestal profiled guide slot 2021 consistent with the shape of Base body 112 is formed with mould 202, in order to work as During matched moulds, liquid moulding material 300 enters the pedestal profiled guide slot 2021, and shaping obtains the pedestal of predetermined shape Main body 112.Preferably, the electronic component 123 and the electrical connecting element 133 are contained in the pedestal profiled guide slot In 2021, in order to which when being integrally formed, the electronic component 123 and the electrical connection element are coated by moulding material 300 Part 133, that is, the Base body 112 for coating the electronic component 123 and the electrical connecting element 133 is formed, and it is described Base body 112 has the mounting groove 113.

It is noted that in some embodiments, the mould 202 of the manufacturing equipment 200 and described The inner side of optical window forming blocks 203, that is, the side of the Base body 112 is formed, a film can be set, it is described in order to be formed Base body 112, and prevent the optical window forming blocks 203 from damaging the photo-sensitive cell 13, and it is conveniently stripped.

Further, in this embodiment of the present utility model, the peelable substrate 201 is an adhesive substrate, works as institute When stating circuit board main body 121 and being placed on the peelable substrate 201, the circuit board main body 121, the photo-sensitive cell 13 with The position of peelable substrate 201 is relative to be determined.It is noted that the photo-sensitive cell 13 and the circuit board main body 121 The plane peelable substrate 201 is all supported on, so that the bottom surface 1211 of the circuit board main body 121 and described The back side 132 of photo-sensitive cell 13 is consistent so that the bottom of the sunk type photosensory assembly 10 is smooth.Certainly, in this practicality In new other embodiment, the peelable substrate 201 can also be other forms, for example set groove to limit the electricity Road plate main body 121 and the photo-sensitive cell 13.

It is noted that in matched moulds, the optical window forming blocks 203 of the mould 202 are supported on described Blank medium 114, so that the optical window forming blocks 203 will not directly contact the photo-sensitive cell 13.

Further, the mould can also include one layer of overlay film, and the overlay film is arranged in mould 202 Side, in order to form the Base body 112, and the photo-sensitive cell 13 is protected, prevent the optical window forming blocks 203 from damaging The photo-sensitive cell 13.

The manufacturing process of the sunk type photosensory assembly 10 can be：By the circuit board with the sinker area 122 Main body 121 is arranged at the peelable substrate 201, and the electronic component can be pasted with the circuit board main body 121 123；Further, the photo-sensitive cell 13 is electrically connected to the circuit board main body 121 by the electrical connecting element 133；Enter One step, the blank medium 114 is set in the non-photo-sensing area 1312 of the photo-sensitive cell 13；Further, by the shaping Mould 202 and the matched moulds of peelable substrate 201 so that the mould 202 is by the blank medium 114 or film branch Support, so as to prevent the optical window forming blocks 203 from directly contacting the photo-sensitive cell 13；Further so that the moulding material 300 The Base body 112 is formed into the pedestal profiled guide slot 2021, photo-sensitive cell 13 described in integral packaging and the circuit Plate main body 121；Further so that the mould 202 and the peelable substrate 201 mold, and cause described peelable Depart from from substrate 201 and the photo-sensitive cell 13 and the circuit board main body 121, so as to obtain the sunk type photosensory assembly 10.The peelable substrate 201 and the circuit board main body 121 and the disengaging mode of the photo-sensitive cell 13 illustrate ground but The mode such as it is not limited to peel off, exposes, heats, etching, dissolving, being ground.

Reference picture 8 is according to the another of the sunk type photosensory assembly 10 of the second preferred embodiment of the present utility model to Fig. 9 B One variant embodiment and its manufacturing equipment 200 and manufacturing process.Different from above-mentioned embodiment, the photo-sensitive cell 13 Front 131 it is consistent with the top surface 1212 of the circuit board main body 121.The Base body 112 extends into the photosensitive member The gap 14 between part 13 and the circuit board main body 121, and coat the back side 132 of the photo-sensitive cell 13.

Further, the peelable substrate 201 of the manufacturing equipment 200 carries an at least pillar 204, the pillar 204 protrude from the peelable substrate 201, for supporting the photo-sensitive cell 13.The number and shape of the pillar 204 can To set as needed.

The manufacturing process of the sunk type photosensory assembly 10 can be：By the circuit board main body 121 be arranged at it is described can Peel off substrate 201 so that the circuit board main body 121 is supported on the peelable substrate 201, and the photo-sensitive cell 13 is set The sinker area 122 of the circuit board main body 121 is placed in, and is supported on the pillar 204.Preferably, in an embodiment party In formula, when the photo-sensitive cell 13 is supported on the pillar 204, the photo-sensitive cell 13 described positive 131 and it is described The top surface 1212 of circuit board main body 121 is consistent.Preferably, peelable substrate 201 and the pillar 204 surface is Viscosity, it can be peeled off with the part being in contact.Further, in matched moulds state so that the moulding material 300 enters the pedestal Profiled guide slot 2021, and extend into the gap 14, reach the photo-sensitive cell 13 the back side 132 and it is described can The space between substrate 201 is peeled off, so as to coat the back side 132 of the photo-sensitive cell 13；Further, in the pedestal After main body 112 is molded so that the mould 202 and the peelable substrate 201 mold, and cause peelable substrate 201 and/or the pillar 204 depart from the sunk type photosensory assembly 10.Certainly, in some embodiments, the pillar 204 The peelable substrate 201 can be separatably arranged at, so that when the peelable substrate 201 departs from, the pillar 204 Depart from the peelable substrate 201, without departing from the Base body 112.

Reference picture 11 to Figure 13 C, according to the sunk type photosensory assembly 10 of the 3rd preferred embodiment of the present utility model and Its manufacturing equipment 200 is illustrated.The sunk type photosensory assembly 10 is manufactured by the manufacturing equipment 200.Different from above-mentioned excellent Embodiment is selected, the Base body 112 includes one pedestals 1121 and one or two pedestals 1122, a pedestal 1121 and the secondary pedestal 1122 form the optical window 111, for the photo-sensitive cell 13 provide passage of light.

Reference picture 11, Figure 13 B and Figure 13 C, a pedestal 1121 once encapsulate base including an end liner 11211 and one 11212, the secondary pedestal 1122 includes an encapsulating secondary encapsulation base 11222 of base 11221 and one.The end liner 11211 is spaced It is described once to encapsulate base 11212 and the photo-sensitive cell 13, in order to described once seal being formed by the manufacturing equipment 200 The photo-sensitive cell 13 is protected during dress base 11212, prevents the manufacturing equipment 200 from damaging the photo-sensitive cell 13.Institute State encapsulating base 11221 and be spaced the secondary encapsulation base 11222 and the photo-sensitive cell 13, in order to pass through the manufacturing equipment The photo-sensitive cell 13 is protected during the 200 formation secondary encapsulation bases 11222, prevents the manufacturing equipment 200 from damaging The photo-sensitive cell 13.

Preferably, a pedestal 1121 is arranged at the side of no electrical connecting element 133 or a few side positions, The encapsulating base 11221 is arranged at the position provided with the electrical connecting element 133, and the encapsulating base 11221 coat it is described Electrical connecting element 133.

It is noted that with reference to 12A, 13B, in this fashion, pre-fixed by a pedestal 1121 described Photo-sensitive cell 13, and due to a pedestal 1121 can the one-shot forming by way of molding, can reach preferably pre- Fixed effect, so as to when forming secondary pedestal 1122, reduce the influence to the photo-sensitive cell 13.On the other hand, the bag When envelope base 11221 encapsulates the electrical connecting element 133, while the photo-sensitive cell 13 and the wiring board main body are connected to, from And cause the photo-sensitive cell 13 has preferably to pre-fix effect.

Reference picture 12B, Figure 13 C, the encapsulating base 11221 and a pedestal 1121 form a loop configuration 1123, The secondary encapsulation base 11222 and the loop configuration 1123 form a mounting groove 113.In other words, the secondary pedestal 1122 and a pedestal 1121 and it is described encapsulating base 11221 form the mounting groove 113.It can be seen that in this reality Apply in mode, the mounting groove 113 is combined by a pedestal 1121 and the secondary pedestal 1122 and formed, not It is one-shot forming and obtains, obvious turning is formed in forming process so as to reduce, reduces the generation of burr.It is new in this practicality In this embodiment of type, the mounting groove 113 is suitable to install the filter element 40.

Further, a pedestal 1121 and the encapsulating base 11221 extend into the photo-sensitive cell 13 and described The gap 14 between circuit board main body 121, so as to more stably fix the photo-sensitive cell 13 and the circuit board master Body 121.

Illustrated below in case of the side of the photo-sensitive cell 13 sets the electrical connecting element 133.

Reference picture 13A to 13C, the manufacturing equipment 200A include peelable substrate 201A and a molding a tool.It is described Peelable substrate 201A is used to support the circuit board main body 121 and the photo-sensitive cell 13, and the mould is used to be formed The Base body 112A.

Further, the mould includes one first mould 2021A and one second mould 2022A, described First mould 2021A is used to form a pedestal 1121, and the second mould 2022A is described for being formed Secondary pedestal 1122.

Further, the first mould 2021A has one pedestal profiled guide slot 2051A, with a base The shape of seat 1121 is corresponding.The second mould 2022A has one or two pedestal profiled guide slot 2052A, with described two The shape of secondary pedestal 1122 is corresponding.

The manufacturing equipment 200A includes two optical window forming blocks, respectively one first optical window forming blocks 2031A and one second Optical window forming blocks 2032A.The first optical window forming blocks 2031A is arranged at the first mould 2021A, with described A molding tool 2021A cooperatively forms the pedestal profiled guide slot 2051A, and the second optical window forming blocks 2032A is set The second mould 2022A is placed in, the secondary pedestal profiled guide slot is cooperatively formed with the second mould 2022A 2052A, a pedestal 1121 and the secondary pedestal 1122 cooperatively form the optical window 111.That is, it is molded twice During, a part for optical window 111 described in each self-forming.

Citing ground, reference picture 13A to 13C, with the feelings of the side setting electrical connecting element 133 of the photo-sensitive cell 13 Illustrated exemplified by condition, the manufacturing process of the sunk type photosensory assembly 10 is：The circuit board main body 121 is arranged at first The peelable substrate 201A, pre-fix the position of the circuit board main body 121；It will be further sunken under the photo-sensitive cell 13 The sinker area 122 of the circuit board main body 121, and supported by the peelable substrate 201A, pre-fix described photosensitive The position of element 13；Further, three side pre-determined bits of the electrical connecting element 133 need not be set on the photo-sensitive cell 13 The end liner 11211 is installed, for example the end liner 11211 is set in a manner of glue coating；Further, will be described the first one-tenth Pattern tool 2021A carries out matched moulds, is pressed on the front 131 of the photo-sensitive cell 13 and the top surface of the circuit board main body 121 1212, and cause the first mould 2021A to be supported on the end liner 11211, it is convenient in the outside of end liner 11211 A pedestal 1121 is formed, and in the inner side of end liner 11211 without encapsulation, and prevent first mould 2021A damages the photo-sensitive cell 13, for example bears the first mould 2021A by the end liner 11211 and be pressed downward The power of conjunction, and the photo-sensitive cell 13 can be by less or not by the downward pressing of the first mould 2021A Power；Further so that the moulding material 300 enters the pedestal profiled guide slot 2051A, circuit described in integral packaging The part top surface 1212 of plate main body 121 and the part described positive 131 of the photo-sensitive cell 13, are once encapsulated by described Base 11212 pre-fixes the photo-sensitive cell 13 and the circuit board main body 121；Further, first mould is removed After 2021A, the electrical connecting element is set in the position of the predetermined setting electrical connecting element 133 of the photo-sensitive cell 13 133, the photo-sensitive cell 13 is electrically connected to the circuit board main body 121；Further, it is corresponding in the electrical connecting element 133 Position form the encapsulating base 11221, coat the electrical connecting element 133, and cause the encapsulating base 11221 with it is described One time pedestal 1121 forms a loop configuration 1123；Further, the second mould 2022A is subjected to matched moulds, and caused The second mould 2022A is supported on the loop configuration 1123；Further so that the moulding material 300 enters The secondary pedestal profiled guide slot 2052A of the second mould 2022A, institute is formed on the basis of the loop configuration 1123 Secondary encapsulation base 11222 is stated, so as to obtain the sunk type photosensory assembly 10.

Reference picture 14, it is illustrated according to the sunk type photosensory assembly 10 of the 4th preferred embodiment of the present utility model.No Above-described embodiment is same as, the sunk type photosensory assembly 10 includes a filter element 40, and the filter element 40 is capped In the photo-sensitive cell 13, to protect the photo-sensitive cell 13.

Further, in this embodiment, the Base body 112B can be platform-like structure.It is that is, described Base body 112B does not have the mounting groove 113, so as to be miscellaneous part, such as the driver 30, the camera lens 20 provide bigger installation site.

Citing, can be in photo-sensitive cell 13 described in integral packaging in the manufacturing process of the sunk type photosensory assembly 10 Before the circuit board main body 121, the filter element 40 is covered on the photo-sensitive cell 13, then by described Manufacturing equipment 200 carries out integral packaging to the photo-sensitive cell 13 and the circuit board main body 121, so as to pass through the filter Optical element 40 protects the photo-sensitive cell 13, prevents manufacturing equipment from damaging the photo-sensitive cell 13, and stop the dust in environment The photo-sensitive cell 13 is reached, on the other hand, the sunk type camera module that the sunk type photosensory assembly 10 assembles can be reduced 100 back focal length, reduce the height of the sinking camera module.

In one embodiment, the filter element 40 is located on the inside of the Base body 112B, can not be by one Encapsulation, citing ground, the filter element 40 can be covered in the photo-sensitive cell 13 by way of bonding, can also pass through painting The mode of cloth is covered in the photo-sensitive cell 13.

In another embodiment, the filter element 40 can be by the integral packaging of Base body 112, so as to not Other modes are needed to fix the filter element 40.

Reference picture 15, it is illustrated according to the sunk type camera module 100 of the 5th preferred embodiment of the present utility model.Institute Stating the integral packaging pedestal 11C of sunk type photosensory assembly 10 includes camera lens part a 115C, the camera lens part 115C described in Base body 112C is integrally upwardly extended at least in part, suitable for installing a camera lens 20.

Further, the camera lens part 115C forms an another mounting groove 113C, for installing the camera lens 20.In other words Say, there is the integral packaging pedestal 11C two mounting groove 113C, one of them described mounting groove 113C to be used to install the filter Optical element 40, another described mounting groove 113C are used to install the camera lens 20, and camera module is focused so as to form one.

It is noted that the camera lens part 115C is formed by integrally formed mode, so as to accurately true The installation site of the fixed camera lens 20.By the position-limiting action of the camera lens part 115C, reduce the installation deviation of the camera lens 20, So that assembling is more prone to realize.

Adjustment space can be reserved between the camera lens part 115C and the camera lens 20, in order to assemble the camera lens 20 During, adjust the camera lens 20.Preferably, it is smooth inside the camera lens part 115C, suitable for described in one non-threaded of installation Camera lens 20.

Reference picture 16, explained according to the sunk type array camera module 1 of the 6th preferred embodiment of the present utility model Release.The sunk type array camera module 1 includes at least two sunk type camera modules 100, each sunk type shooting Module 100, which cooperates, realizes the collection of image.

It is noted that in this embodiment and accompanying drawing, formed with two sunk type camera modules 100 Double take the photograph exemplified by module illustrate, and in other embodiment of the present utility model, more sunk types can also be included Camera module 100, such as, three and more than three, the utility model is not intended to limit in this respect.

In a kind of mode, each sunk type camera module 100 is formed the sunk type array in a manner of splicing and taken the photograph As module 1.For example each circuit board main body 121 is each independent, each Base body 112 is each independent.

In a further mode of operation, each sunk type camera module 100 is formed the sunk type in a manner of integrally connected Array camera module 1.For example each circuit board main body 121 is integrally connected, each Base body 112 is integrally connected.

Those skilled in the art it should be appreciated that the quantity of each sunk type camera module 100, combination simultaneously It is not limitation of the present utility model.

Reference picture 17, the sunk type camera module 100 can be applied to an electronic equipment 300, the electronic equipment 300 citing ground but it is not limited to smart mobile phone, wearable device, computer equipment, television set, the vehicles, camera, supervising device Deng.The electronic equipment 300 can include an electronic device body 400, and the sunk type camera module 100 is installed in described Electronic device body 400, the electronic device body 400 is coordinated to complete the collection and reproduction of image.

To sum up, reference picture 18, the utility model provide the manufacture method 1000 of a sunk type photosensory assembly 10, methods described Comprise the following steps：

1100：A sinking circuit board 12 with a sinker area 122 is arranged at a peelable substrate 201；

1200：To be sunken to the sinker area 122 of the sinking circuits plate 12 under a photo-sensitive cell 13, and by it is described can Substrate 201 is peeled off to support；

1300：Photo-sensitive cell 13 described in integral packaging and the sinking circuits plate 12, which are formed, has an optical window 111 one by one Body encapsulation base 11；With

1400：The peelable substrate 201 is peeled off into the sunk type photosensory assembly 10.

Wherein, in the step 1100, the sinker area 122 can pass through the side of perforate or fluting on a circuit board Formula is formed.The peelable substrate 201 can be an adhesive substrate.

The sinking circuits plate 12 can include a circuit board main body 121 and an at least electronic component 123, the sinking Area 122 and the electronic component 123 are arranged at the circuit board main body 121.The electronic component 123 can be described Circuit board main body 121 is arranged at before the peelable substrate 201 and is arranged at the circuit board main body 121, can also be The circuit board main body 121 is arranged at the circuit board main body 121 after being arranged at the peelable substrate 201.Citing ground But it is not limited to, the electronic component 123 is arranged at the circuit board main body 121 by way of SMT.

Wherein, in a kind of mode, in the step 1200, the back side 132 of the photo-sensitive cell 13 and described The bottom surface 1211 of circuit board main body 121 is consistent.

Wherein, in a further mode of operation, in the step 1200, the peelable substrate 201 is with least one support Post, the photo-sensitive cell 13 are supported by the support column so that the front 131 of the photo-sensitive cell 13 and the circuit board master The front 131 of body 121 is consistent.

Wherein, step is also included in the step 1200：The photosensitive member is electrically connected by an at least electrical connecting element 133 Part 13 and the circuit board main body 121.

Wherein, in a kind of mode, step is included in the step 1300：Coated by the integral packaging pedestal 11 The electronic component 123 and the electrical connecting element 133.

Wherein, in the step 1300, can also include：The photo-sensitive cell 13 and the circuit board main body 121 it Between form a gap 14, the integral packaging pedestal 11 extends into the gap 14.

In the step 1300, it can also include：The shape between the photo-sensitive cell 13 and the circuit board main body 121 Into a gap 14, the gap 14 is filled by a filled media 15, pre-fixes the photo-sensitive cell 13 and the circuit board master Body 121.Citing ground but be not limited to, the filled media 15 can be glue.

Wherein, in the step 1300, can also include：In the photo-sensitive cell 13 and the circuit board main body 121 Between form a gap 14, the integral base extension is included in the gap 14, and coats the back side of the photo-sensitive cell 13 132。

Wherein, in the step 1300, can also include：Formed in the non-photo-sensing area 1312 of the photo-sensitive cell 13 One blank medium 114, it is boundary with the blank medium 114, forms a Base body 112.Preferably, the blank medium 114 For an annular protrusion.Citing ground, the blank medium 114 can by the photo-sensitive cell 13 glue coating formed.

Wherein, in the step 1300, step can also be included：

1301：An end liner 11211 is formed in the position for being not provided with the electrical connecting element 133 of the photo-sensitive cell 13；

1302：It is that boundary's formation one once encapsulates base 11212 with the end liner 11211, pre-fixes the He of photo-sensitive cell 13 The circuit board main body 121；

1303：Set the position of the electrical connecting element 133 to form an encapsulating base 11221 in the photo-sensitive cell 13, lead to Cross the encapsulating base 11221 and coat the electrical connecting element 133, and a ring junction is formed with the base 11212 that once encapsulates Structure 1123；With

1304：The secondary encapsulation base 11222 of one-shot forming one, forms the optical window based on the loop configuration 1123.

In the step 1304, the secondary encapsulation base 11222 can form an installation with the loop configuration 1123 Groove 113.

Further, in one embodiment, step can also be included before the step 1300：By a filter element 40 are covered in the photo-sensitive cell 13.

The step 1300 can also include step：Photo-sensitive cell 13, the and of sinking circuits plate 12 described in integral packaging The filter element 40.

In one embodiment, the end liner 11211, the encapsulating base 11221 can be by way of glue coatings Formed.Certain end liner 11211 and the encapsulating base 11221 can also be the elastic fluid of other materials.

Wherein, in the step 1400, the peelable substrate 201 peels off the mode of the sunk type photosensory assembly 10 Citing ground but the mode such as it is not limited to peel off, exposes, heats, etching, dissolving, being ground.

Preferably, the integral packaging mode is the mode of Transfer molding.

It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as Illustrate and be not intended to limit the utility model.The purpose of this utility model completely and effectively realizes.Work(of the present utility model Energy and structural principle show and illustrated in embodiment, under without departing from the principle, embodiment of the present utility model Can there are any deformation or modification.

Claims (14)

1. the manufacturing equipment of a sunk type photosensory assembly, it is characterised in that including：

One peelable substrate；With

A molding has；The peelable substrate is used for the circuit board main body for strippingly supporting the sunk type photosensory assembly With a photo-sensitive cell；The mould is used for the photo-sensitive cell of sunk type photosensory assembly described in integral packaging and the electricity Road plate main body, to form a Base body of the sunk type photosensory assembly with an optical window, the optical window is described photosensitive Element provides passage of light.

2. the manufacturing equipment of sunk type photosensory assembly according to claim 1, wherein the mould have a pedestal into Type guide groove, suitable for Base body described in one-shot forming.

3. the manufacturing equipment of sunk type photosensory assembly according to claim 2, wherein the manufacturing equipment includes an optical window Forming blocks, it is arranged at the mould and forms the pedestal profiled guide slot.

4. the manufacturing equipment of sunk type photosensory assembly according to claim 1, wherein the mould includes one first Mould and one second mould, first mould has one pedestal profiled guide slots, in order to form one Base is once encapsulated, pre-fixes to one-shot forming the photo-sensitive cell and the circuit board main body, second mould has One or two pedestal profiled guide slots, in order to form a secondary encapsulation base on a pedestal and an encapsulating base, in order to shape Into the optical window.

5. the manufacturing equipment of sunk type photosensory assembly according to claim 4, wherein the once pedestal profiled guide slot is fitted It is not provided with electrically connecting the photo-sensitive cell and the circuit board main body in the corresponding photo-sensitive cell and the circuit board main body The position of one electrical connecting element, described base is once encapsulated in order to be formed.

6. the manufacturing equipment of sunk type photosensory assembly according to claim 4, wherein the manufacturing equipment includes one first Optical window forming blocks, the first optical window forming blocks are arranged at first mould, form the pedestal shaping and lead Groove, during shaping, moulding material enters a pedestal profiled guide slot, and base is once encapsulated described in formation, corresponding The position of the first optical window forming blocks forms the part optical window.

7. the manufacturing equipment of sunk type photosensory assembly according to claim 6, wherein the manufacturing equipment includes one second Optical window forming blocks, the second optical window forming blocks are arranged at second mould, form the secondary pedestal shaping and lead Groove, during shaping, moulding material enters the secondary pedestal profiled guide slot, forms the secondary encapsulation base, corresponding The position of the second optical window forming blocks forms optical window described in another part, so as to form the overall optical window.

8. the manufacturing equipment of sunk type photosensory assembly according to claim 7, wherein the once pedestal includes an end liner, The end liner protrudes from the photo-sensitive cell, and when once encapsulating base described in formation, the first optical window forming blocks are suitable to by institute State end liner support and formed described in once encapsulate base, in order to protect the photo-sensitive cell.

9. the manufacturing equipment of sunk type photosensory assembly according to claim 8, wherein when forming the secondary encapsulation base, The second optical window shaping is suitable to form the secondary encapsulation base by a pedestal and the encapsulating base support.

10. the manufacturing equipment of sunk type photosensory assembly according to any one of claims 1 to 9, wherein the manufacturing equipment bag An overlay film is included, the overlay film is arranged on the inside of the mould, in order to protect the photo-sensitive cell.

11. the manufacturing equipment of sunk type photosensory assembly according to any one of claims 1 to 9, wherein the strippable side Formula is selected from combination：Peel off, expose, heating, etching, dissolving, one kind in grinding.

12. the manufacturing equipment of sunk type photosensory assembly according to any one of claims 1 to 9, wherein the peelable substrate For tabular, make it that the back side of the photo-sensitive cell is consistent with the bottom surface of the circuit board main body.

13. the manufacturing equipment of sunk type photosensory assembly according to any one of claims 1 to 9, wherein the peelable dose of base Plate has an at least pillar, suitable for strippingly supporting the photo-sensitive cell, to cause the positive and described of the photo-sensitive cell The top surface of circuit board main body is consistent.

14. the manufacturing equipment of sunk type photosensory assembly according to any one of claims 1 to 9, wherein the circuit board main body Provided with a sinker area, the circuit board main body is sunken under the photo-sensitive cell, during fabrication, is sunken under the photo-sensitive cell described In sinker area, strippingly supported by the peelable substrate.