CN111371975A - Camera module packaging structure - Google Patents
Camera module packaging structure Download PDFInfo
- Publication number
- CN111371975A CN111371975A CN202010163297.9A CN202010163297A CN111371975A CN 111371975 A CN111371975 A CN 111371975A CN 202010163297 A CN202010163297 A CN 202010163297A CN 111371975 A CN111371975 A CN 111371975A
- Authority
- CN
- China
- Prior art keywords
- camera module
- substrate
- module package
- photosensitive element
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000003466 welding Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 12
- 238000007731 hot pressing Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The invention provides a camera module packaging structure, comprising a photosensitive element, a substrate and a camera element, wherein the photosensitive element is provided with a plurality of first welding spots, the substrate is provided with a containing part and a plurality of second welding spots arranged at the periphery of the containing part, the photosensitive element is arranged in the containing part, the first welding spots and the second welding spots correspond to each other and are electrically connected through a plurality of wires, a gap is arranged between the photosensitive element and the inner wall surface of the periphery of the containing part for filling a rubber material, and the camera element is fixedly combined on the substrate corresponding to the containing part; the total height of the camera module can be reduced, and the image effect of the camera module can be increased.
Description
Technical Field
The present invention relates to a package structure, and more particularly, to a camera module package structure.
Background
At present, the following three packaging processes are available in the field of camera module manufacturing, respectively: CSP (chip Scale ePack) process; 2, Flip Chip process; COB (chip On Board) process.
The CSP process adds a glass protective layer on a bare wafer, but the light passing through the glass protective layer causes slight refraction, reflection and energy loss, resulting in poor image quality. The Flip Chip process is complex and has high cost, so that most manufacturers have difficulty in adopting the process. COB technology is popular because of the low price and mature technology of the photosensitive elements. The post-process of the COB packaging process has two attaching processes which are respectively as follows: hot Bar (solder paste Hot pressing), 2 ACF (anisotropic conductive paste Hot pressing)/ACP (anisotropic conductive paste Hot pressing).
However, Hot Bar has been largely unamployed due to its low reliability; and 2.ACF/ACP needs additional procurement equipment, so that the cost rises suddenly, and the height of the camera module cannot be further reduced by the conventional COB process.
In addition, the photosensitive element is embedded in the substrate in a close-fitting manner, but the fixing manner depends on friction, the fixing effect is not good, and debris and dust are generated in the mounting process, the debris and the dust can not only pollute the surface of the photosensitive element and cause poor image effect, but also can cause short circuit of the substrate, and the substrate or the welding spot of the photosensitive element can be damaged in the process of mounting the photosensitive element.
Therefore, for the current electronic equipment to be more and more light, thin, short and small, how to improve the current camera module packaging process, the total height of the camera module is reduced, the risk of contamination of the bare chip is reduced so as to facilitate program control, the yield is improved, the image effect of the camera module is increased, and the camera module has a good fixing effect, and is the direction of efforts of researchers in the field.
Disclosure of Invention
One object of the present invention is: the total height of the camera module is reduced.
Another object of the invention is: the glue material can not remain on the surface of the photosensitive element or the substrate, and the image effect of the camera module can be improved.
Yet another object of the present invention is: the stability of camera module combination is improved.
To achieve the above object, the present invention provides a camera module package structure, comprising:
a photosensitive element having a plurality of first solder points;
a substrate having a containing portion and a plurality of second solder points, wherein the plurality of second solder points are disposed around the containing portion, the photosensitive element is disposed in the containing portion, the plurality of first solder points and the plurality of second solder points are corresponding to each other and electrically connected through a plurality of wires, a gap is formed between the photosensitive element and the inner wall surface of the containing portion, and the gap is used for filling a glue material; and
and the image pickup element is fixedly combined on the substrate corresponding to the accommodating part.
The camera module packaging structure is characterized in that the rubber material is filled into the gap to fix the photosensitive element.
The camera module packaging structure is characterized in that a plurality of glue inlets are formed in the periphery of the accommodating part and communicated with the gap, and the glue material is filled into the gap from the glue inlets.
The camera module packaging structure is characterized in that the periphery of the accommodating part is provided with a windowing area, a solder mask layer is arranged on the outer surface of the substrate and does not cover the accommodating part and the area where the windowing area is arranged, and the plurality of second welding spots are arranged in the windowing area.
In the camera module packaging structure, the surface of the windowing area is lower than the surface of the solder mask layer.
The camera module packaging structure is characterized in that the accommodating part is any one of a groove and a through hole, the groove is inwards recessed from the substrate, and the through hole penetrates through the substrate.
In the camera module packaging structure, the substrate is any one of a printed circuit board and a flexible circuit board.
The camera module packaging structure also comprises a filter which is arranged on one side of the camera element opposite to the photosensitive element.
In the camera module packaging structure, the optical filter is any one of an infrared filter and a visible light filter.
The camera module packaging structure also comprises a back glue layer which is arranged on one surface of the substrate opposite to the camera element.
By means of the design of the invention, the total height of the camera module can be reduced, the fixing effect is better, the glue material can not remain on the surface of the photosensitive element or the substrate, and the image effect of the camera module can be improved.
Drawings
Fig. 1 is an exploded perspective view of an embodiment of a camera module package structure according to the present invention;
fig. 2 is a perspective assembly view of an embodiment of the camera module package structure of the present invention;
fig. 3 is a top view of a receiving portion of an embodiment of a camera module package structure according to the invention;
fig. 4 is a sectional view taken along line a-a of fig. 2 of the camera module package structure of the present invention;
FIG. 5 is a schematic diagram of a camera module package according to the present invention;
fig. 6 is a cross-sectional view of an alternate embodiment of the camera module package structure of the present invention.
Description of reference numerals: a photosensitive element 1; a wire 4; a first solder joint 11; an optical filter 5; a substrate 2; a back glue layer 6; a receptacle 21; inner wall surface 211; the gap 212; a glue inlet 213; a sizing 214; a second solder joint 22; a windowing region 23; a solder resist layer 24; and an image pickup element 3.
Detailed Description
The above objects, together with the structural and functional features thereof, are accomplished by the preferred embodiments according to the accompanying drawings.
Referring to fig. 1 to 5, an exploded perspective view, an assembled perspective view, a top view of a receiving portion, a cross-sectional view of a line a-a, and a schematic view of a filling material of an embodiment of a camera module package structure according to the present invention are shown.
The photosensitive element 1 has a plurality of first pads 11, and the photosensitive element 1 is selected from a Charge-Coupled device (CCD) and a complementary metal-Oxide-Semiconductor Active pixel sensor (CMOS).
The substrate 2 has a receiving portion 21, a plurality of second pads 22, a window 23 and a solder mask 24. The substrate 2 is a printed circuit board, but not limited thereto, and in other embodiments, the substrate 2 may also be a flexible circuit board.
The photosensitive element 1 is disposed in the accommodating portion 21, and the photosensitive element 1 can be fixed in the accommodating portion 21 by dispensing or double-sided adhesive tape. The accommodating portion 21 is a groove recessed from the substrate 2, but not limited thereto, and in other embodiments, the accommodating portion 21 may be a through hole penetrating through the substrate 2 (as shown in fig. 6).
The plurality of second pads 22 are disposed around the accommodating portion 21, the plurality of first pads 11 and the plurality of second pads 22 are corresponding to each other and electrically connected by a plurality of wires 4, the plurality of wires 4 are gold wires, but not limited thereto, and the plurality of wires 4 may also be wires made of other materials in other embodiments.
A gap 212 is formed between the photosensitive element 1 and the inner wall surface 211 of the accommodating portion 21, and a plurality of glue inlets 213 are formed around the accommodating portion 21 and communicated with the gap 212. The width of the periphery of the gap 212 is equal, and the gap 212 is filled with a glue material 214, the glue material 214 is Epoxy resin (Epoxy) or the like, the glue material 214 is filled into the gap 212 from the plurality of glue inlets 213, and the glue material 214 is baked and cured to fix the photosensitive element 1 after being uniformly filled into the gap 212, the plurality of glue inlets 213 are six glue inlets 213 in the present embodiment, and any two or more glue inlets 213 may be provided in other embodiments. In addition, the glue 214 can be distributed more uniformly by filling the glue inlets 213 simultaneously.
The window 23 is disposed around the receiving portion 21, and the plurality of second welding points 22 are disposed on the window 23.
The solder mask layer 24 is disposed on the outer surface of the substrate 2 and does not cover the area where the accommodating portion 21 and the opening region 23 are disposed, the plurality of second solder joints 22 are exposed from the opening region 23, the surface of the opening region 23 is lower than the surface of the solder mask layer 24, and the solder mask layer 24 is an insulating solder-resist ink.
The image pickup device 3 is fixed on the substrate 1 corresponding to the accommodating portion 21, and in fact, the image pickup device 3 can be suspended by a machine and aligned with the accommodating portion 21 and the photosensitive device 1 through an Active Alignment (Active Alignment) process, and after the Alignment, the image pickup device 3 is fixed between the substrate 2 and the image pickup device 3 by adhesive dispensing, and the image pickup device 3 is an integrated lens.
In one embodiment, the camera module package further includes a filter 5 disposed on a side of the camera device 3 opposite to the light-sensing device 1, the filter 5 is selected from an infrared filter and a visible light filter, and in an alternative embodiment, the filter 5 may be omitted.
In another embodiment, the camera module package further includes a backside adhesive layer 6 disposed on a side of the substrate 2 opposite to the camera device 3, and in an alternative embodiment, the backside adhesive layer 6 may be omitted.
With this configuration of the present invention, since the photosensitive element 1 is disposed in the accommodating portion 21, the total height of the camera module can be reduced. In addition, since the gap 212 between the photosensitive element 1 and the accommodating portion 21 can be filled with the adhesive 214 uniformly to fix the photosensitive element 1, the adhesive 214 does not remain on the surface of the photosensitive element 1 or the substrate 2, thereby increasing the image effect of the camera module.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A camera module package structure, comprising:
a photosensitive element having a plurality of first solder points;
a substrate having a containing portion and a plurality of second solder points, wherein the plurality of second solder points are disposed around the containing portion, the photosensitive element is disposed in the containing portion, the plurality of first solder points and the plurality of second solder points are corresponding to each other and electrically connected through a plurality of wires, a gap is formed between the photosensitive element and the inner wall surface of the containing portion, and the gap is used for filling a glue material; and
and the image pickup element is fixedly combined on the substrate corresponding to the accommodating part.
2. The camera module package of claim 1, wherein the adhesive fills the gap to fix the photosensitive element.
3. The camera module package according to claim 2, wherein the receiving portion has a plurality of glue inlets formed at a periphery thereof to communicate with the gap, and the glue is filled into the gap from the plurality of glue inlets.
4. The camera module package structure of claim 1, wherein the receiving portion has a window area at a periphery thereof, a solder mask layer is disposed on an outer surface of the substrate and does not cover the receiving portion and an area where the window area is disposed, and the plurality of second solder bumps are disposed in the window area.
5. The camera module package of claim 4, wherein the surface of the windowed area is lower than the surface of the solder mask layer.
6. The camera module package of claim 1, wherein the accommodating portion is one of a groove and a through hole, the groove is recessed from the substrate, and the through hole penetrates through the substrate.
7. The camera module package of claim 1, wherein the substrate is any one of a printed circuit board and a flexible circuit board.
8. The camera module package of claim 1, further comprising a filter disposed on a side of the camera element opposite to the light-sensing element.
9. The camera module package of claim 8, wherein the filter is any one of an infrared filter and a visible light filter.
10. The camera module package of claim 1, further comprising a backside adhesive layer disposed on a side of the substrate opposite the camera element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010163297.9A CN111371975A (en) | 2020-03-10 | 2020-03-10 | Camera module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010163297.9A CN111371975A (en) | 2020-03-10 | 2020-03-10 | Camera module packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111371975A true CN111371975A (en) | 2020-07-03 |
Family
ID=71212475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010163297.9A Pending CN111371975A (en) | 2020-03-10 | 2020-03-10 | Camera module packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111371975A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114257714A (en) * | 2020-09-25 | 2022-03-29 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and preparation method of photosensitive assembly |
| TWI762093B (en) * | 2020-12-18 | 2022-04-21 | 海華科技股份有限公司 | Portable electronic device and customized image capturing module thereof |
-
2020
- 2020-03-10 CN CN202010163297.9A patent/CN111371975A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114257714A (en) * | 2020-09-25 | 2022-03-29 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and preparation method of photosensitive assembly |
| TWI762093B (en) * | 2020-12-18 | 2022-04-21 | 海華科技股份有限公司 | Portable electronic device and customized image capturing module thereof |
| US11647273B2 (en) | 2020-12-18 | 2023-05-09 | Azurewave Technologies, Inc. | Customized image-capturing module partially disposed inside receiving space of circuit substrate, and portable electronic device using the same |
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