CN206674061U - Wiring board and molding photosensory assembly and camera module and electronic equipment - Google Patents

Abstract

The utility model provides a wiring board and molding photosensory assembly and camera module and electronic equipment; wherein described wiring board includes a substrate and is formed at an at least circuit portion for the substrate; the photo-sensitive cell and the circuit portion connect switched only; the circuit portion forms a loop circuit in the fringe region of the substrate; the loop circuit is centered around around the photo-sensitive cell; so that in moulding technology, the photo-sensitive cell is protected by the loop circuit.

Description

Wiring board and molding photosensory assembly and camera module and electronic equipment

Technical field

It the utility model is related to optical imaging field, more particularly to a wiring board and molding photosensory assembly and camera module And electronic equipment.

Background technology

In recent years, electronic product, smart machine have increasingly been towards lightening and high-performance direction and developed, and this is to as electronics Product, smart machine one of standard configuration camera module volume and image quality be proposed harsher requirement.

In order to reduce the volume of camera module and improve the image quality of camera module, have more for camera module configuration While the photo-sensitive cell and more volume, greater number of passive electronic component of big photosensitive area, change camera module Packaged type also ever more important.Traditional camera module uses COB (Chip On Board) packaging technology, and it will be separately made Chip and each electronic component mount respectively in the circuit board, then using glue by microscope base mount in the circuit board, will Optical filter is mounted on microscope base and then the lens barrel for being assembled with optical lens or motor is mounted on microscope base, so that optical frames Head is maintained at the photosensitive path of chip, and this packaged type causes that the volume of camera module is big, yield is low.It is above-mentioned in order to overcome Problem, moulding technology is introduced in the encapsulation process of camera module now, specifically, by chip and each electronic component It is mounted on respectively after wiring board, wiring board is put into mould, the stitching surface of wherein mould applies pressure to circuit The surface of plate, the moulding material of flow-like is then added, to be formed and wiring board base joined integrally after moulding material consolidates Seat, has many advantages, such as small volume, process are short, yield is high by camera module made of moulding technology, so that molding work Skill is by process mostly important in the encapsulation process as camera module.Lacked nevertheless, present moulding technology is also a lot Fall into.

Fig. 1 shows the wiring board of camera module, wherein wiring board by substrate surface by plating or printing Mode forms circuit, and this causes circuit to protrude from substrate surface, because COB packaging technologies are the mirrors that will be molded by glue Seat is mounted on wiring board, so as to which the flatness of wiring board is not the emphasis that traditional COB packaging technologies consider.But in mould Mould in technique, the stitching surface of mould directly applies pressure to the surface of wiring board, and because circuit protrudes from substrate surface, this causes Many gaps can be produced between the stitching surface and substrate surface of mould, when the moulding material of flow-like is added into After mould, the moulding material of flow-like be easy to via these gaps from the outside of wiring board enter wiring board middle part and Photo-sensitive cell is polluted, and then causes the product yield of camera module to reduce.

Utility model content

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the wiring board includes a substrate and a circuit portion, wherein fringe region shape of the circuit portion in the substrate Into a loop circuit, the loop circuit is centered around around photo-sensitive cell, to protect the photo-sensitive cell.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein when carrying out moulding technology, the loop circuit prevents the moulding material of flow-like from the side of the substrate Region described in edge field flow orientation where photo-sensitive cell, so as to prevent the moulding material because entering where the photo-sensitive cell Region and pollute the photo-sensitive cell, to avoid the occurrence of the bad phenomenons such as dirty bad point.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the loop circuit prevents the moulding material from contacting the photo-sensitive cell, with avoid temperature it is higher it is described into Section bar material by temperature conduction to the photo-sensitive cell, and the bad phenomenon for causing the photo-sensitive cell to be deformed because heated.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the loop circuit is away from the photo-sensitive cell, i.e. reserved between the loop circuit and the photo-sensitive cell Safe distance, by such mode, it can further prevent the higher moulding material of temperature by temperature conduction to described Photo-sensitive cell.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein when carrying out moulding technology, the stitching surface of mould applies pressure to the loop circuit, to prevent the forming material Material is described photosensitive via being flowed between the stitching surface of the loop circuit and the mould from the fringe region of the substrate Region where element.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the loop circuit can form a complete annular, institute is applied pressure to the stitching surface in the mould When stating loop circuit, it can prevent to produce gap between the stitching surface of the loop circuit and the mould.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the loop circuit includes at least one first circuit unit and an at least second circuit unit, first circuit Unit extends in a ring around the photo-sensitive cell, but unclosed, and the second circuit unit is arranged on first circuit The unclosed position of unit, to increase the moulding material being somebody's turn to do in first circuit unit by the second circuit unit The resistance of unclosed position, and then prevent the moulding material from entering from the fringe region of the substrate where the photo-sensitive cell Region.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the moulding material enter first circuit unit the unclosed position when, the second circuit unit Fluid ability of the moulding material in the unclosed position can be made rapidly to decline.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the second circuit unit is arranged on the unclosed position of first circuit unit in fan, so that The moulding material changes in the flow direction of the unclosed position, so that the inclined flowing side of the moulding material To the perpendicular flow distance for limiting the moulding material.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein forming an at least gap between first circuit unit and the second circuit unit, the gap is in narrow Elongated, in such manner, it is possible to prevent the moulding material from entering the photosensitive member from the fringe region of the substrate via these gaps Region where part.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein first circuit unit and the second circuit unit can form stop projection, to reduce the gap Size, so as to prevent the moulding material from entering via these gaps from the fringe region of the substrate where the photo-sensitive cell Region.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein by edge side of the part for first circuit unit and the second circuit unit along the mould To widening, to form the stop projection, the sense is flowed to so as to increase the fringe region of the moulding material from the substrate The resistance in the region where optical element, while the moulding material is also limited in the smaller gap, and then reduce institute Distance and amount that moulding material enters the gap are stated, to prevent the moulding material into the area where the photo-sensitive cell Domain.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the wiring board includes at least one set of wiring board connector, the wiring board connector can nearby with the ring Shape circuit electrically connects, and so as to save the cost of cabling, and ensures reliability when signal transmits.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the opening of the fringe region of the direction in the gap substrate corresponds to the wiring board connector, with by The wiring board connector prevents the moulding material from being directly entered the gap.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the wiring board connector can electrically connect with the loop circuit nearby, so as to make signal quickly fast Pass, pass through such mode, it is possible to increase the response speed of the camera module.

A purpose of the present utility model is to provide a wiring board and molding photosensory assembly and camera module and electronics Equipment, wherein the loop circuit is centered around around the photo-sensitive cell, so that the photo-sensitive cell is in a magnetic field and sealed Closed loop border, so as to avoid Electromagnetic Interference of the photo-sensitive cell by the external world, and the photo-sensitive cell can be reduced and produced Electromagnetic wave to the external world interference, i.e. the loop circuit can form an electromagnetic-field-shielded portion, to ensure the shooting mould Reliability of the group in imaging.According to one side of the present utility model, the utility model provides a wiring board, wherein one photosensitive yuan Part and the wiring board are connected switched only, wherein the wiring board includes：

One substrate, wherein the substrate has a fringe region；With

One circuit portion, wherein the circuit portion is formed at the substrate, the photo-sensitive cell and the circuit portion are switched on Ground connects, wherein the circuit portion forms a loop circuit in the fringe region of the substrate, the loop circuit surrounds Around the photo-sensitive cell.

According to one embodiment of the present utility model, the substrate has a chip attachment region, the fringe region and The chip attachment region is integrally formed, wherein the photo-sensitive cell is mounted on the chip attachment region, so that described Loop circuit is centered around around the photo-sensitive cell.

According to one embodiment of the present utility model, the substrate has a receiving space, and the fringe region is centered around Around the receiving space, wherein the photo-sensitive cell is housed inside the receiving space, so that the loop circuit surrounds Around the photo-sensitive cell.

According to one embodiment of the present utility model, the fringe region of the substrate has a substrate inside portion and one Substrate outside portion, and the substrate inside portion and the substrate outside portion are respectively positioned at the inner side of the loop circuit and outer Side.

According to one embodiment of the present utility model, the wiring board further comprises one group of wiring board connector, wherein The wiring board connector is arranged at the substrate, wherein the circuit portion includes one group of connection circuit, the connection circuit It is connected to the loop circuit and the wiring board connector.

According to one embodiment of the present utility model, the span of the outside dimension of the wiring board connector is 0.005mm~0.8mm.

According to one embodiment of the present utility model, the span of the outside dimension of the wiring board connector is 0.1mm~0.5mm.

According to one embodiment of the present utility model, the spans of the width dimensions in the circuit portion be 0.001mm~ 0.5mm。

According to one embodiment of the present utility model, the span of the width dimensions of the connection circuit is 0.001mm ~0.5mm.

According to one embodiment of the present utility model, the span of the width dimensions of the loop circuit is 0.001mm ~0.5mm.

According to one embodiment of the present utility model, the spans of the width dimensions in the circuit portion be 0.02mm~ 0.1mm。

According to one embodiment of the present utility model, it is described connection circuit width dimensions span be 0.02mm~ 0.1mm。

According to one embodiment of the present utility model, the spans of the width dimensions of the loop circuit be 0.02mm~ 0.1mm。

According to one embodiment of the present utility model, the span of the spacing in the adjacent circuit portion be 0.001mm~ 0.5mm。

According to one embodiment of the present utility model, the span of the spacing of the adjacent connection circuit is 0.001mm ~0.5mm.

According to one embodiment of the present utility model, the span of the spacing of the adjacent loop circuit is 0.001mm ~0.5mm.

According to one embodiment of the present utility model, the span of the spacing in the adjacent circuit portion be 0.02mm~ 0.1mm。

According to one embodiment of the present utility model, it is adjacent it is described connection circuit spacing span be 0.02mm~ 0.1mm。

According to one embodiment of the present utility model, the span of the spacing of the adjacent loop circuit be 0.02mm~ 0.1mm。

According to one embodiment of the present utility model, the loop circuit protrudes from the surface of the substrate.

According to one embodiment of the present utility model, the circuit portion is formed described by way of plating or printing The surface of substrate, so that the loop circuit that the circuit portion is formed protrudes from the surface of the substrate.

According to one embodiment of the present utility model, the loop circuit includes one first circuit unit, wherein described One circuit unit is in complete annular, so that first circuit unit is centered around around the photo-sensitive cell.

According to one embodiment of the present utility model, the loop circuit includes at least one first circuit unit and at least one Second circuit unit, wherein first circuit unit extends in a ring around the photo-sensitive cell, and described One circuit unit forms at least one opening, and the second circuit unit is formed in the opening, with first circuit unit An at least gap is formed between the second circuit unit.

According to one embodiment of the present utility model, the gap is in sleeve configuration, and the gap is from the substrate Interior extends.

According to one embodiment of the present utility model, the end of first circuit unit forms one and stops circuit, described Second circuit unit includes an at least extension circuit, wherein the extension of the bearing of trend and the extension circuit for stopping circuit Direction is roughly the same, to be formed between the stop circuit and the extension circuit and between the adjacent extension circuit The gap.

According to one embodiment of the present utility model, at least one of extension circuit extends deviously, so that shape Prolong deviously into the gap between the stop circuit and the extension circuit and between the adjacent extension circuit Stretch.

According to one embodiment of the present utility model, in first circuit unit and the second circuit unit at least One circuit unit forms at least one and stops projection, and the stop projection extends to the gap, to reduce the chi in the gap It is very little.

According to other side of the present utility model, the utility model further provides for a molding photosensory assembly, and it includes：

One molded base, wherein the molded base has an optical window；

One photo-sensitive cell；And

One wiring board, wherein the wiring board further comprises：

One substrate, wherein the substrate has a fringe region；With

One circuit portion, wherein the circuit portion is formed at the substrate, the photo-sensitive cell and the circuit portion are switched on Ground connects, wherein the circuit portion forms a loop circuit in the fringe region of the substrate, the loop circuit surrounds Around the photo-sensitive cell, wherein the one of the part and the loop circuit of the molded base and the fringe region Part is joined integrally, and the photosensitive region of the photo-sensitive cell corresponds to the optical window.

According to one embodiment of the present utility model, the fringe region of the substrate has a substrate inside portion and one Substrate outside portion, and the substrate inside portion and the substrate outside portion are respectively positioned at the inner side of the loop circuit and outer Side, wherein the molded base and the outside portion of the substrate outside portion and the loop circuit are joined integrally.

According to one embodiment of the present utility model, the molding photosensory assembly further comprises an at least electronics member device Part, wherein the wiring board includes an at least wiring board connector, the wiring board connector is arranged on the outside of the substrate Portion, wherein the circuit portion includes at least one connection circuit, the connection circuit connects the wiring board connector and the ring Shape circuit, the electronic component are mounted on the wiring board connector, wherein the molded base coats at least one institute State electronic component.

According to one embodiment of the present utility model, the loop circuit includes one first circuit unit, wherein described One circuit unit is in complete annular, so that first circuit unit is centered around around the photo-sensitive cell.

According to one embodiment of the present utility model, the loop circuit includes at least one first circuit unit and at least one Second circuit unit, wherein first circuit unit extends in a ring around the photo-sensitive cell, and described One circuit unit forms at least one opening, and the second circuit unit is formed in the opening, with first circuit unit An at least gap is formed between the second circuit unit.

According to one embodiment of the present utility model, the gap is in sleeve configuration, and the gap is from the substrate Sidepiece extends to the substrate outside portion.

According to one embodiment of the present utility model, the end of first circuit unit forms one and stops circuit, described Second circuit unit includes an at least extension circuit, wherein the extension of the bearing of trend and the extension circuit for stopping circuit Direction is roughly the same, to be formed between the stop circuit and the extension circuit and between the adjacent extension circuit The gap.

According to one embodiment of the present utility model, at least one of extension circuit extends deviously, so that shape Prolong deviously into the gap between the stop circuit and the extension circuit and between the adjacent extension circuit Stretch.

According to one embodiment of the present utility model, in first circuit unit and the second circuit unit at least One circuit unit forms at least one and stops projection, and the stop projection extends to the gap, to reduce the chi in the gap It is very little.

According to one embodiment of the present utility model, opening of the gap in the substrate outside portion corresponds to described Wiring board connector.

According to other side of the present utility model, the utility model further provides for a camera module, and it includes：

One optical lens；

One photo-sensitive cell；

The blocking part of one annular；And

One wiring board, wherein the photo-sensitive cell and the wiring board connect switched only, the blocking part is formed at institute Wiring board is stated, and the blocking part is centered around around the photo-sensitive cell, and the optical lens is arranged at described photosensitive The photosensitive path of element.

According to one embodiment of the present utility model, the camera module further comprises a molded base, wherein described Molded base has an optical window, wherein the blocking part is prevented for forming the moulding material of the molded base from the circuit The region that the fringe region of plate enters where the photo-sensitive cell, to be formed at the wiring board after moulding material consolidation A part for the fringe region and a part of molded base joined integrally of the blocking part, wherein described photosensitive Element corresponds to the optical window, to provide a passage of light as the photo-sensitive cell and the optical lens by the optical window.

According to one embodiment of the present utility model, the wiring board includes a substrate and is formed at an electricity of the substrate Road portion, wherein the circuit portion forms a loop circuit, wherein institute in the fringe region of the substrate of the wiring board State loop circuit and form the blocking part.

According to one embodiment of the present utility model, the wiring board includes a substrate and is formed at an electricity of the substrate Road portion, wherein the circuit portion forms the electromagnetic-field-shielded of an annular in the fringe region of the substrate of the wiring board Portion, to prevent external electromagnetic power from disturbing the photo-sensitive cell, wherein the electromagnetic-field-shielded portion forms the blocking part.

According to one embodiment of the present utility model, the fringe region of the substrate has a substrate inside portion and one Substrate outside portion, the substrate inside portion and the substrate outside portion are located at the both sides of the loop circuit respectively, wherein described Molded base and the outside portion of the substrate outside portion and the loop circuit are joined integrally.

According to one embodiment of the present utility model, the camera module further comprises an at least electronic component, its Described in electronic component be arranged at the substrate outside portion, the molded base coats the electronic component.

According to one embodiment of the present utility model, the camera module further comprises a driver, wherein the light Learn camera lens and be assembled in the driver, the driver is assembled in the top surface of the molded base, with by the drive Dynamic device makes the optical lens be maintained at the photosensitive path of the photo-sensitive cell.

According to one embodiment of the present utility model, the camera module further comprises a lens barrel, wherein the optics Camera lens is arranged at the lens barrel, and the lens barrel is assembled in the top surface of the molded base, to make institute by the lens barrel State the photosensitive path that optical lens is maintained at the photo-sensitive cell.

According to one embodiment of the present utility model, the camera module further comprises a lens barrel, wherein the optics Camera lens is arranged at the lens barrel, and the lens barrel integratedly extends the top surface of the molded base, with by the lens barrel The optical lens is set to be maintained at the photosensitive path of the photo-sensitive cell.

According to one embodiment of the present utility model, the camera module further comprises a filter element, wherein described Filter element is maintained between the optical lens and the photo-sensitive cell.

According to one embodiment of the present utility model, the filter element is assembled in the top surface of the molded base, So that the filter element is maintained between the optical lens and the photo-sensitive cell.

According to one embodiment of the present utility model, the top surface of the molded base has an inner surface and an outside Surface, the filter element are assembled in the inner surface, and the driver is assembled in the outer surface.

According to one embodiment of the present utility model, the inner surface and the outer surface have difference in height, with shape Into a groove of the molded base, wherein the groove is communicated in the optical window, the filter element is assembled in described recessed Groove.

According to other side of the present utility model, the utility model further provides for an electronic equipment, and it includes：

One electronic equipment body；With

An at least camera module, wherein the camera module is arranged at the electronic equipment body, scheme for obtaining Picture, wherein the camera module further comprises：

One optical lens；

One photo-sensitive cell；

The blocking part of one annular；And

One wiring board, wherein the photo-sensitive cell and the wiring board connect switched only, the blocking part is formed at institute Wiring board is stated, and the blocking part is centered around around the photo-sensitive cell, and the optical lens is arranged at described photosensitive The photosensitive path of element.

Brief description of the drawings

Fig. 1 is the schematic top plan view of the wiring board of prior art.

Fig. 2A is the schematic top plan view according to a wiring board of a preferred embodiment of the present utility model.

Fig. 2 B are the schematic top plan views according to a wiring board of another preferred embodiment of the present utility model.

Fig. 3 is close-up schematic views of Fig. 2 B in location A.

Fig. 4 is close-up schematic views of Fig. 2 B in B location.

Fig. 5 is the section view signal according to one of the manufacturing step of a camera module of a preferred embodiment of the present utility model Figure.

Fig. 6 is shown according to two section view of the manufacturing step of the camera module of above-mentioned preferred embodiment of the present utility model It is intended to.

Fig. 7 is shown according to three section view of the manufacturing step of the camera module of above-mentioned preferred embodiment of the present utility model It is intended to.

Fig. 8 is shown according to four section view of the manufacturing step of the camera module of above-mentioned preferred embodiment of the present utility model It is intended to.

Fig. 9 is shown according to five section view of the manufacturing step of the camera module of above-mentioned preferred embodiment of the present utility model It is intended to.

Figure 10 is six section view according to the manufacturing step of the camera module of above-mentioned preferred embodiment of the present utility model Schematic diagram.

Figure 11 A are a realities according to one of the manufacturing step of a camera module of another preferred embodiment of the present utility model Apply the sectional view of mode.

Figure 11 B be according to one of the manufacturing step of a camera module of another preferred embodiment of the present utility model another The sectional view of embodiment.

Figure 11 C be according to one of the manufacturing step of a camera module of another preferred embodiment of the present utility model another The sectional view of embodiment.

Figure 12 is two sectional view according to the manufacturing step of a camera module of another preferred embodiment of the present utility model.

Figure 13 is three sectional view according to the manufacturing step of a camera module of another preferred embodiment of the present utility model.

Figure 14 is four sectional view according to the manufacturing step of a camera module of another preferred embodiment of the present utility model.

Figure 15 is five sectional view according to the manufacturing step of a camera module of another preferred embodiment of the present utility model.

Figure 16 is six section view according to the manufacturing step of a camera module of another preferred embodiment of the present utility model Figure.

Figure 17 is first variant embodiment according to the camera module of above-mentioned preferred embodiment of the present utility model Schematic cross-sectional view.

Figure 18 is second variant embodiment according to the camera module of above-mentioned preferred embodiment of the present utility model Schematic cross-sectional view.

Figure 19 is the schematic diagram of an electronic equipment.

Embodiment

Describe to be used to disclose the utility model so that those skilled in the art can realize the utility model below.Retouch below Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Retouched following The general principle of the present utility model defined in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang Case and the other technologies scheme without departing from spirit and scope of the present utility model.

It will be understood by those skilled in the art that in exposure of the present utility model, term " longitudinal direction ", " transverse direction ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the orientation of the instruction such as " outer " or position close System is to be based on orientation shown in the drawings or position relationship, and it is for only for ease of description the utility model and simplified and describes, without It is instruction or implies that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore on Term is stated it is not intended that to limitation of the present utility model.

It is understood that term " one " be interpreted as " at least one " or " one or more ", i.e., in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no It is understood that as the limitation to quantity.

With reference to Fig. 2 to Figure 10 of Figure of description of the present utility model, according to the one of a preferred embodiment of the present utility model Camera module 1 is elucidated with, wherein the camera module 1 includes an optical lens 10, a photo-sensitive cell 20 and a wiring board 30.

Referring to figs. 2A to Fig. 4, the wiring board 30 includes a substrate 31 and a circuit portion 32, wherein the substrate 31 has There is a fringe region 311, the circuit portion 32 forms a loop circuit 321 in the fringe region 311 of the substrate 31, its Described in photo-sensitive cell 20 and the circuit portion 32 be switched on, and the loop circuit 321 is centered around the photo-sensitive cell 20 Around, so that in follow-up moulding technology, the loop circuit 321 can protect the photo-sensitive cell 20 not to be contaminated.Institute Optical lens 10 is stated to be arranged on the photosensitive path of the photo-sensitive cell 20.The light being reflected by the object is from the optical lens 10 enter the inside of the camera module, subsequently to receive and carry out photoelectric conversion by the photo-sensitive cell 20, so as to obtain The image associated with object.

In this illustration, the substrate 31 further comprises a smooth chip attachment region 312, wherein the edge Region 311 and the chip attachment region 312 are integrally formed, and the fringe region 311 is located at the chip attachment area The outside in domain 312, wherein the photo-sensitive cell 20 is mounted on the chip attachment region 312 of the substrate 31 respectively, and And the photo-sensitive cell 20 and the circuit portion 32 are switched on.It is understood that the chip attachment region 312 can be located at The middle part of the substrate 31.

Further, the photo-sensitive cell 20 and the circuit portion 32 of the wiring board 30 are led by one group of lead 40 Logical, wherein each lead 40 each extends over, and the both ends of each lead 32 are bent to be connected to the sense respectively The circuit portion 32 of optical element 20 and the wiring board 30.

It will be appreciated by those skilled in the art that turn on the photo-sensitive cell 20 and the line using the lead 40 The technique in the circuit portion 32 of road plate 30 can be routing technique, i.e. by routing technique in the photo-sensitive cell 20 and institute State and form the lead 40 between the circuit portion 32 of wiring board 30, to turn on the photo-sensitive cell 20 by the lead 40 With the wiring board 30.It is noted that the routing direction of the lead 40 can be with unrestricted, such as in an example In, the routing direction of the lead 40 can be from the photo-sensitive cell 20 to the wiring board 30, and in another example, The routing direction of the lead 40 can also be from the wiring board 30 to the photo-sensitive cell 20.In addition, the lead 40 can To be that gold thread or silver wire, copper cash etc. are any electric signal can be realized in the photo-sensitive cell 20 and the wiring board 22 Between the material that transmits.

Furthermore it is possible on the substrate 31 of the non-photo-sensing region of the photo-sensitive cell 20 and the wiring board 30 respectively One group of connector is set, and the connector being provided with the substrate 31 is electrically connected to the circuit portion 32, the lead 40 Both ends are connected to the connector of the photo-sensitive cell 20 and the connector of the wiring board 30, pass through such mode, energy Enough turn on the photo-sensitive cell 20 and the wiring board 30.It is noted that it is arranged on the non-photo-sensing of the photo-sensitive cell 20 The type of connector on the substrate 31 of region and the wiring board 30 can be with unrestricted, such as is arranged on described photosensitive Connector on the non-photo-sensing region of element 20 and the substrate 31 of the wiring board 30 can be terminal pad etc..

The circuit portion 32 forms the loop circuit 321 in the fringe region 311 of the substrate 31, so as to by institute State loop circuit 321 fringe region 311 of the substrate 31 is divided on the outside of a substrate inside portion 3111 and a substrate Portion 3112, wherein the substrate inside portion 3111 and the substrate outside portion 3112 are located at the two of the loop circuit 321 respectively Side, it is provided with the substrate inside portion 3111 that the connector on the substrate 31 is located at the substrate 31, i.e. described Loop circuit 321 is located at the outside of the lead 40, so that when subsequently carrying out moulding technology, the loop circuit 321 can not only The photo-sensitive cell 20 is enough protected, and the loop circuit 321 can also protect the lead 40.

It will be appreciated by those skilled in the art that the circuit portion 32 is formed by way of plating or printing in institute The surface of substrate 31 is stated, so as to be formed in the circuit portion 32 after the surface of the substrate 31, the circuit portion 32 protrudes In the surface of the substrate 31, and then the loop circuit 321 also protrudes from the surface of the substrate 31, so as to form an annular Blocking part 322.That is, the circuit portion 32 can form annular in the fringe region 311 of the substrate 31 The blocking part 322, wherein the blocking part 322 is centered around around the photo-sensitive cell 20, with when carrying out moulding technology, The blocking part 322 can protect the photo-sensitive cell 20.Preferably, the blocking part 322 is located at the outside of the lead 40, So that when carrying out moulding technology, the blocking part 322 can protect the lead 40.That is, the blocking part 322 also may be used So that the fringe region 311 of the substrate 31 is divided into the substrate inside portion 3111 and the substrate outside portion 3112.

Those skilled in the art will also be appreciated that when the loop circuit 321 in the circuit portion 32 is energized When can form an annular electromagnetic-field-shielded portion 323, wherein the electromagnetic-field-shielded portion 323 is centered around the photo-sensitive cell Around 20, so that the photo-sensitive cell 20 is in a magnetic field enclosed environment, so as to avoid the photo-sensitive cell 20 by outer The Electromagnetic Interference on boundary, and interference of the electromagnetic wave caused by the photo-sensitive cell 20 to the external world can be reduced, so as to ensure State reliability of the camera module 1 in imaging.

The wiring board 30 further comprises at least one set of wiring board connector 33, and each wiring board connector 33 divides The fringe region 311 of the substrate 31 it is not arranged on spaced reciprocally, such as each wiring board connector 33 can To be located at but be not limited to the substrate outside portion 3112 of the substrate 31.The wiring board connector 33 is used for connection and formed The circuit of the multilager base plate of the wiring board 30.Preferably, the section of the wiring board connector 33 may be implemented as but not It is limited to circle.The circuit portion 32 further comprises at least one set of connection circuit 324, and the connection circuit 324 is by can be conductively It is connected to the wiring board connector 33 and the loop circuit 321.

It is understood that relative to traditional wiring board, the loop circuit 321 of the wiring board 33 of the invention In a ring and it is centered around around the photo-sensitive cell 20, so as to which the wiring board connector 33 each using identical definition can To be turned on regard to near-earth by the connection circuit 324 and the loop circuit 321, by such mode, electric signal can be made Quickly transmit, and effectively improve the response speed of the camera module 1.

In the example of the present invention, the outside dimension of the wiring board connector 33 is more than the loop circuit 321 Width dimensions.Nevertheless, in some specific examples, the outside dimension of the wiring board connector 33 is less than the annular The width dimensions of circuit 321 are also possible that.If the parameter of the outside dimension of the wiring board connector 33 is a, if described The parameter of the width dimensions of loop circuit 321 is b, if the parameter of the spacing between the adjacent circuit of the loop circuit 321 is C, wherein parameter a scope are 0.005mm~0.8mm, preferably 0.1mm~0.5mm, and wherein parameter b scope is 0.001mm ~0.5mm, preferably 0.02mm~0.1mm, wherein parameter c scope are 0.001mm~0.5mm, preferably 0.02mm~ 0.1mm.Correspondingly, the width dimensions of the connection circuit 324 are also parameter b.Preferably, the connection circuit 324 is adjacent Spacing between circuit is also parameter c.It will be appreciated by those skilled in the art that the width dimensions in the circuit portion 32 are Parameter b, the spacing of the adjacent circuit in the circuit portion 32 is also parameter c.

In addition, the camera module 1 includes a molded base 50, wherein the molded base 50 has an optical window 51, and And the fringe region 311 of the molded base 50 and the wiring board 30 a part and the loop circuit 321 one Part is joined integrally, and to form a molding photosensory assembly 200, and the photosensitive region of the photo-sensitive cell 20 corresponds to the light Window 51, to be that the optical lens 10 and the photo-sensitive cell 20 provide a passage of light by the optical window 51.Preferably, institute The substrate outside portion 3112 of molded base 50 and the wiring board 30 and the outside portion of the loop circuit 321 is stated integrally to tie Close.

That is, the molding photosensory assembly 200 includes an and of wiring board 30 of photo-sensitive cell 20, one One molded base 50, wherein the photo-sensitive cell 20 is mounted on the wiring board 30, the molded base 50 and institute The part for stating wiring board 30 integratedly combines, to coat a part for the wiring board 30 by the molded base 50, and And the photosensitive region of the photo-sensitive cell 20 corresponds to the optical window 51 of the molded base 50.It is understood that can be with The photo-sensitive cell 20 is first mounted on the wiring board 30, then makes the one of the molded base 50 and the wiring board 30 again Part is joined integrally, can also first make a part of joined integrally of the molded base 50 and the wiring board 30, then again will The photo-sensitive cell 20 is mounted on the wiring board 30, and the utility model is unrestricted in this regard.

The camera module 1 further comprises one group of electronic component 60, wherein the electronic component 60 can pass through Surface mount process (Surface Mount Technology, SMT) is mounted on the fringe region of the wiring board 30 311, and after the electronic component 60 is mounted on the fringe region 311 of the wiring board 30, the electronics Component 60 and the wiring board connector 33 are switched on.Preferably, the electronic component 60 can be by directly against loaded on institute Wiring board connector 33 is stated, to turn on the electronic component 60 and the wiring board connector 33.

It is noted that the electronic component 60 and the photo-sensitive cell 20 can be located at the same of the wiring board 30 Side or opposite side, in this embodiment, the electronic component 60 and the photo-sensitive cell 20 are located at the wiring board 30 the same side, so that after the molded base 50 shaping, the molded base 50 at least coats an electronic component 60.Preferably, the molded base 50 coats each electronic component 60, to isolate every phase by the molded base 50 The adjacent electronic component 60 and the isolation electronic component 60 and the photo-sensitive cell 20, so as to even adjacent institute State electronic component 60 it is closer to the distance when, the molded base 50 can also avoid the adjacent phase mutual connection of the electronic component 60 Touch or interference, and the molded base 50 coats the mode of the electronic component 60 and can also avoid resulting from the electricity The photosensitive region of photo-sensitive cell 20 described in the contaminants on the surface of sub- component 60.In addition, the molded base 50 coats The mode of the electronic component 50 can also enable the wiring board 30 of small area by the more electronics members of attachment Device 60, to improve the image quality of the camera module 1.It is noted that the type of the electronic component 60 can be with Including but not limited to resistance, electric capacity, driver etc..

The camera module 1 further comprises a filter element 70, wherein the filter element 70 is arranged on the light Learn between camera lens 10 and the photo-sensitive cell 20, to be filtered by the filter element 70 from described in the optical lens 10 entrance The light of camera module 1, then received and be imaged by the photo-sensitive cell 20 again.The filter element 70 can be assembled in institute The top surface of molded base 50 is stated, so that the filter element 70 is maintained at the photo-sensitive cell 20 and the optical lens 10 Between.

It is noted that the filter element 70 can by direct-assembling in the top surface of the module pedestal 50, The filter element 70 first can be assembled in a supporter, the supporter is then assembled in the molded base 50 Top surface, by such mode, the area of the filter element 70 can be reduced, to reduce the making of the camera module 1 Cost.

It will be appreciated by those skilled in the art that in the different examples of the camera module 1, the filter element 70 can be implemented as different types, such as the filter element 70 can be implemented as cutoff filter, full impregnated light The combination of spectrum filter piece and other optical filters or multiple optical filters, for example, the filter element 70 can be implemented as it is red The combination of outer edge filter and full impregnated spectral filter, i.e., described cutoff filter and the full impregnated spectral filter energy Enough it is switched to be optionally situated on the photosensitive path of the photo-sensitive cell 20, such as in the more sufficient ring of the light such as daytime When the camera module 1 is used under border, the cutoff filter can be switched to the photosensitive road of the photo-sensitive cell 20 Footpath, it is infrared in the light being reflected by the object for entering the camera module 1 to be filtered by the cutoff filter Line, when using the camera module 1 in the environment of the darks such as night, the full impregnated spectral filter can be switched to The photosensitive path of the photo-sensitive cell 20, to allow access into the infrared ray in the light being reflected by the object of the camera module 1 Part passes through.

The camera module 1 can be one and focus camera module or a zoom camera module.It is appreciated that , when the camera module 1 is implemented as a zoom camera module 1, the camera module 1 further comprises a driving Device 80, wherein the optical lens 10 is assembled in the institute to be assembled in the driver after 80s, then by the driver 80 The top surface of module pedestal 50 is stated, so that the optical lens 10 is maintained at into the photo-sensitive cell 20 by the driver 80 Photosensitive path, wherein the driver 80 can drive photosensitive path of the optical lens 10 along the photo-sensitive cell 20 to move It is dynamic, to adjust the focal length of the camera module 1.That is, the optical lens 10 is driveably arranged at the driving Device 80.

It is noted that the type of the driver 80 is unrestricted in the camera module 1 of the present utility model, Such as in a specific example, the driver 80 may be implemented as that voice coil motor etc. is any can to drive the light The driver that photosensitive path of the camera lens 10 along the photo-sensitive cell 20 produces displacement is learned, wherein the driver 80 can receive Electric energy and control signal are with running order.

Accompanying drawing 5 shows the manufacturing process of the camera module 1 to Figure 10.

Specifically, refer to the attached drawing 5, the photo-sensitive cell 20 is mounted on to the institute of the substrate 31 of the wiring board 30 Chip attachment region 312 is stated, and makes the circuit of the photo-sensitive cell 20 and the wiring board 30 by the lead 40 Portion 32 turns on, and the electronic component 60 is mounted on to the wiring board connector 33 of the wiring board 30, with by described Circuit portion 32 turns on the electronic component 60 and the photo-sensitive cell 20.

Refer to the attached drawing 6, the wiring board 30 for being pasted with the photo-sensitive cell 20 and the electronic component 60 is placed In a molding tool 100, the part with the fringe region 311 of the wiring board 30 is formed to carry out moulding technology With a part of molded base 60 joined integrally of the loop circuit 321, and then be made the molding photosensory assembly 200。

Specifically, the mould 100 includes a mold 101 and once mould 102, wherein the mold 101 and the lower mould 102 at least one mould can be moved so that the mold 101 and the lower mould 102 It can be operated by carry out matched moulds or withdrawing pattern, and pedestal shaping is formed between the mold 101 and the lower mould 102 103 and one space 104 against pressure of space.The mold 101 has a pedestal forming tank 1011, an anti-ring of indent 1012 and one The nip portion 1013 of shape, wherein the nip portion 1013 integratedly extends from the side of the mold 101, with by described Nip portion 1013 separates the pedestal forming tank 1011 and the anti-indent 1012, when the mold 101 and the lower mould 102 by after carry out die closing operation and matched moulds, and the lower mould 102 closes the pedestal forming tank 1011 and the anti-indent 1012 Opening so that the pedestal forming tank 1011 forms the pedestal molding space 103, the anti-indent 1012 forms described anti- Press space 103.

It is noted that in one embodiment, the lower mould 102 can be fixed, and the mold 101 can Do moving relative to the lower mould 102 along guide pillar, with the mold 101 towards the direction of the lower mould 102 By matched moulds during movement, and the withdrawing pattern when the mold 101 moves away from the lower mould 102, when the mold 101 and institute When stating lower mould 102 by carry out die closing operation, the base is formed respectively between the mold 101 and the lower mould 102 Seat molding space 103 and the space against pressure 104.

In another embodiment, the mold 101 can be fixed, and the lower mould 102 can be along guide pillar The movement relative to the mold 101 is done, during being moved in the direction of lower mould 102 towards the mold 101 Matched moulds, and the withdrawing pattern when the lower mould 102 moves away from the lower mould 101.

In addition, the mould 100 further comprises a cover layer 105, wherein the cover layer 105 is overlappingly set In the inner surface of the mold 101, to be closed in the mold 101 of the mould 100 and the lower mould 102 During mould, strengthen the sealing between the mould 100 and the wiring board 30, and it is convenient de- after moulding technology terminates Mould.

The wiring board 30 for being pasted with the photo-sensitive cell 20 and the electronic component 60 is placed on the upper mould After tool 101 and/or the lower mould 102, operate the mold 101 and the lower mould 102 carries out matched moulds, so as to be pasted with The wiring board 30 of the photo-sensitive cell 20 and the electronic component 60 is located at the mold 101 and the lower mould Between 102, wherein the stitching surface of the nip portion 1013 applies pressure to the loop circuit 321, the photo-sensitive cell 20 and described The substrate inside portion 3111 of wiring board 30 is positioned at formation described between the mold 101 and the lower mould 102 Space 104 against pressure, the substrate outside portion 3112 of the wiring board 30, which is located at, to be formed in the mold 101 and the lower mould The pedestal molding space 103 between tool 102, and be mounted on the substrate outside portion 3112 of the wiring board 30 The electronic component 60 is located at the pedestal molding space 103.

It is noted that because the substrate inside portion 3111 of the photo-sensitive cell 20 and the wiring board 30 is located at In the space against pressure 104, so as to prevent the inner surface of the mold 101 from directly being contacted with the lead 40, with The bad phenomenon such as avoid the stress of lead 40 during moulding technology and occur deforming, so as to ensure the good of the lead 40 It is good electrical, to further ensure that the image quality of the camera module 1.

The cover layer 105 is located at the stitching surface of the nip portion 1013 and the loop circuit of the wiring board 30 Between 321, to increase the sealing between the nip portion 1013 and the loop circuit 321 of the wiring board 30, so as to When subsequently carrying out moulding technology, the moulding material can be prevented via the nip portion 1013 and the institute of the wiring board 30 State and flow to the space against pressure 104 from the pedestal molding space 103 and pollute the photo-sensitive cell between loop circuit 321 20.Preferably, the cover layer 105 be overlappingly arranged on the mold 101 be used for form the pedestal forming tank 1011 Inner surface, after forming the molded base 50 to terminate in moulding technology, facilitate withdrawing pattern.In addition, the cover layer 105 is also The nip portion 1013 can be absorbed when the mold 101 and the lower mould 102 are by carry out die closing operation to the line Impulsive force caused by the loop circuit 321 of road plate 30, so as to avoid the loop circuit 321 in the mould 100 It is damaged during by carry out matched moulds.

Refer to the attached drawing 7 and Fig. 8, the moulding material of flow-like is added into the pedestal molding space 103, wherein described Loop circuit 321 can prevent the moulding material between the nip portion 1013 and the loop circuit 321 described in Pedestal molding space 103 flows to the space against pressure 104, and makes the moulding material solid in the pedestal molding space 103 Form type and form the molded base 50, wherein position corresponding to the nip portion 1013 and the space against pressure 104 is formed The optical window 51 of the molded base 50.It is understood that after the molded base 50 is molded, the molded base 50 Coat the substrate outside portion 3112 of the wiring board 30, the outside portion of the loop circuit 321 and the electronic component 50, the photosensitive region of the photo-sensitive cell 20 corresponds to the optical window 51.

It is noted that the moulding material for the flow-like that the utility model is related to can be fluent material or consolidate Body granular materials or liquid and solid particle mixing material, it is to be understood that no matter the moulding material is implemented as liquid Body material is also implemented as solid particulate materials or is implemented as liquid and solid particle mixing material, and it is being added into After the pedestal molding space 103 for stating mould 100, it can consolidate to form the molded base 50.Such as at this In this specific example of utility model, the moulding material of flow-like is implemented as the thermoplastic of such as liquid, its Described in moulding material consolidated after the pedestal molding space 103 of the mould 100 is added into form the mould Mould pedestal 50.It is noted that when the moulding material of flow-like be added into the pedestal of the mould 100 into Behind type space 103, the consolidation style of the moulding material of flow-like does not limit content and scope of the present utility model.

In addition, the top surface of the molded base 50 can have an inner surface 52 and an outer surface 53.At one In example, the inner surface 52 and the outer surface 53 of the molded base 50 are in approximately the same plane, with rear It is continuous, the filter element 70 is assembled in the inner surface 52 of the molded base 50, and the optical frames will be assembled with First 10 driver 80 is assembled in the outer surface 53 of the molded base 50.

In another example, described the inner surface 52 of the molded base 50 is less than the outer surface 53, with Make difference in height between the inner surface 52 and the outer surface 53 to be present and form a groove 54 of the molded base 50, Wherein described groove 54 is communicated in the optical window 51.It is noted that the groove 54 of the molded base 50 with it is described The optical window 51 of molded base 50 is synchronous to be formed.

Refer to the attached drawing 9 and Figure 10, the filter element 70 is assembled in the inner surface 52 of the molded base 50, With the outer surface 53 that the driver 80 for being assembled with the optical lens 10 is assembled in the module pedestal 50 so that institute State optical lens 10 and be maintained at the photosensitive path of the photo-sensitive cell 20, and the filter element 70 is maintained at the light Learn between camera lens 10 and the photo-sensitive cell 20, so as to be worth the camera module 1.

In addition, the wiring board 30 shown in refer to the attached drawing 2A, the loop circuit 321 of the wiring board 30 can be with shape Into a complete annular, the annular electro is applied pressure to the stitching surface in the nip portion 1013 of the mould 100 During road 321, it can prevent to produce gap between the loop circuit 321 and the stitching surface of the nip portion 1013, so that When carrying out moulding technology, the moulding material that can prevent to be added into the pedestal molding space 103 is via the annular Enter the space 104 against pressure from the pedestal molding space 103 between circuit 321 and the stitching surface of the nip portion 1013, To protect the photo-sensitive cell 20 not contaminated and protect the lead 40 not to be destroyed, so as to prevent dirty bad point etc. bad The appearance of phenomenon and ensure the lead 40 it is good electrically, further to improve the product yield of the camera module 1.

The wiring board 30 shown in refer to the attached drawing 2B, the loop circuit 321 of the wiring board 30 further comprise At least one first circuit unit 3211 and at least a second circuit unit 3212.First circuit unit 3211 is in the substrate 31 fringe region 311 extends in a ring around the photo-sensitive cell 20, but unclosed, i.e. the first circuit list Member 3211 forms at least one opening 32110, wherein the second circuit unit 3212 is arranged on first circuit unit 3211 opening 32110.That is, the second circuit unit 3212 is arranged on first circuit unit 3211 Unclosed position, when carrying out moulding technology, to increase the moulding material in institute by the second circuit unit 3212 State the opening 32110 of the first circuit unit 3211 from the pedestal molding space 103 enter the protective zone 104 when Resistance, so as to prevent the moulding material from entering the space 104 against pressure, by such mode, it can protect described photosensitive Element 20 is not contaminated and destroys.

Specifically, after the moulding material of flow-like is added into pedestal molding space 103, the shaping Material has via described in the opening 32110 from the pedestal molding space 103 entrance of first circuit unit 3211 The trend in space 104 against pressure, the second circuit unit 3212 can make the moulding material in the position of the opening 32110 Flow velocity rapidly decline, with prevent the moulding material via first circuit unit 3211 the opening 32110 from The pedestal molding space 103 enters the space 104 against pressure.

Preferably, refer to the attached drawing 2B and Fig. 3, the second circuit unit 3212 are arranged on first electricity in fan The opening 32110 of road unit 3211, so that flow direction of the moulding material in the position of the opening 32110 changes Become, so that the inclined flow direction of the moulding material limits the perpendicular flow distance of the moulding material.In addition, institute State and an at least gap 3213 is formed between the first circuit unit 3211 and the second circuit unit 3212, wherein the gap 3213 be in sleeve configuration, in such manner, it is possible to further prevent the moulding material via gap these described 3213 from the pedestal into Type space 103 flows to the space against pressure 104.

More specifically, the second circuit unit 3212 includes an at least extension circuit 32121, wherein prolonging described in each It is substantially vertical with the bearing of trend of first circuit unit 3211 to stretch the bearing of trend of circuit 32121, with each extension The both ends of circuit 32121 and first circuit unit 3211 form a gap 3213 respectively.Preferably, described first The end of circuit unit 3211 forms one after substantially turning to 90 degree and stops circuit 32111, wherein described stop prolonging for circuit 32111 It is roughly the same to stretch the bearing of trend in direction and the extension circuit 32121, with the receipt for rent circuit 32111 and the extension The long and narrow gap 3213 is formed between circuit 32121, so as to prevent the moulding material via gap 3213 these described The space against pressure 104 is flowed to from the pedestal molding space 103.

In accompanying drawing 2B and Fig. 3, the second circuit unit 3213 is implemented as including three extension circuits 32121, wherein the outboard end positioned at the extension circuit 32121 of both sides is located at the middle extension circuit to principle 32121 direction obliquely extends, so as to be formed in the extension circuit 32121 and the institute stopped between circuit 32111 State gap 3213 to bend, so as to increase the resistance being molded over described in flow-like in the gap 3213, to prevent the shaping Material flows to the space against pressure 104 via gap these described 3213 from the pedestal molding space 103.

In addition, the wiring board connector 33 is arranged on the fringe region 311 of the substrate 31, and these institutes State gap 3213 and correspond to the wiring board connector 33, so as to be mounted on the wiring board in the electronic component 60 Behind the position of connector 33, the electronic component 60 can prevent these described gaps 3213 from directly connecting the substrate 31 The substrate inside portion 3111 and the substrate outside portion 3112, so as to the electronic component 60 can prevent to be added into it is described The moulding material of pedestal molding space 103 is directly entered these gaps 3213, to prevent the moulding material from entering The space against pressure 104, so as to improve the product yield of the camera module 1.

Refer to the attached drawing 2B and Fig. 4, at least one in first circuit unit 3211 and the second circuit unit 3212 It is individual to form a stop projection 3214, to reduce the size in the gap 3213, so as to prevent the moulding material via this A little gaps 3213 enter the space 104 against pressure from the pedestal molding space 103.That is, first circuit An at least one part in unit 3211 and the second circuit unit 3212 press against the edge side of the nip portion 1013 To widening, to form the stop projection 3214, institute is flowed to from the pedestal molding space 103 so as to increase the moulding material The resistance in space 104 against pressure is stated, meanwhile, the moulding material is also limited in the smaller gap 3213, and then is reduced The moulding material enters the distance and amount in the gap 3213, to prevent the moulding material from entering the space 104 against pressure.

It is noted that after the completion of the camera module 1 is produced, the photo-sensitive cell 20 is located at by the annular The middle part in the electromagnetic-field-shielded portion 323 that circuit 321 is formed, to prevent the shooting by the electromagnetic-field-shielded portion 323 The external electromagnetic power of module 1 disturbs the photo-sensitive cell 20, while prevents electromagnetic force interference caused by the photo-sensitive cell 20 outer Boundary's environment, to improve the image quality of the camera module 1.

Accompanying drawing 11A to Figure 16 shows another manufacturing process of the camera module 1.

Specifically, refer to the attached drawing 11A to accompanying drawing 11C, the electronic component 60 is being mounted on the wiring board 30 The wiring board connector 33 after, the wiring board 30 with the electronic component 60 is positioned over the mould In 100.It is understood that when the mold 101 of the mould 100 and the lower mould 102 are by carry out matched moulds During operation, the outward flange of the nip portion 1013 of the mold 101 applies pressure to the loop circuit of the wiring board 30 321 at least a portion.Such as in this example shown in accompanying drawing 11A, the nip portion 1013 of the mold 101 Outward flange can be pressed together on whole positions of the top surface of the loop circuit 321, and the nip portion 1013 does not protrude from The lateral surface of the loop circuit 321；In this example shown in accompanying drawing 11B, the nip portion of the mold 101 1013 outward flange can be pressed together on whole positions of the top surface of the loop circuit 321, and the nip portion 1013 protrudes In the lateral surface of the loop circuit 321；In this example shown in accompanying drawing 11C, the nip portion of the mold 101 1013 outward flange apply pressure to the loop circuit 321 top surface a part.

It will be understood by those of skill in the art that when the mold 101 and the lower mould 102 are by carry out die closing operation After matched moulds, the lower mould 102 closes the pedestal forming tank 1011 of the mold 101, so that the pedestal is molded Groove 1011 forms the pedestal molding space 103, wherein the marginal position of the wiring board 30 can correspond to the pedestal into Type space 103, so that in follow-up moulding technology, the molded base 50 is formed in the marginal position of the wiring board 30. In another preferable examples, the medium position of the wiring board 30 can correspond to the pedestal molding space 103, with rear During continuous moulding technology, one of the pedestal molding space 103 can also be formed in the medium position of the wiring board 30 Point.It is noted that after the pedestal molding space 103, at least one electronic component 60 can be located at described In pedestal molding space 103.Preferably, whole electronic components 60 can be located in the pedestal molding space 103, So that when subsequently progress moulding technology forms the molded base 50, the molded base 50 coats whole electronics members Device 60 and the adjacent electronic component 60 of isolation.

It is understood that after the mold 101 and the lower mould 102 are by carry out die closing operation, by overlappingly The cover layer 105 for being arranged at the inner surface of the mold 101 is located at the inner surface of the mold 101 and the annular Between circuit 321, to strengthen the sealing between the mould 100 and the wiring board 30, and in moulding technology knot It is conveniently stripped after beam.

The cover layer 105 is located at the stitching surface of the nip portion 1013 and the loop circuit of the wiring board 30 Between 321, to strengthen the sealing between the nip portion 1013 and the loop circuit 321 of the wiring board 30, so as to When subsequently carrying out moulding technology, the moulding material can be prevented via the nip portion 1013 and the institute of the wiring board 30 State and flow to the chip attachment region 312 from the fringe region 311 of the wiring board 30 between loop circuit 321, to protect The planarization in the chip attachment region 312 is demonstrate,proved, so as to be easy to mount the photo-sensitive cell 20 subsequently.

The cover layer 105 be overlappingly arranged on the mold 101 be used for form the pedestal forming tank 1011 Inner surface, after forming the molded base 50 to be received in moulding technology, facilitate withdrawing pattern.In addition, the cover layer 105 can also The nip portion 1013 is enough absorbed when the mold 101 and the lower mould 102 are by carry out Mould operation to the circuit Impulsive force caused by the loop circuit 321 of plate 30, so as to avoid the loop circuit 321 in the quilt of mould 100 Be damaged during matched moulds.

Refer to the attached drawing 12 and Figure 13, the moulding material of flow-like is added into the pedestal molding space 103, wherein institute Stating loop circuit 321 can prevent the moulding material between the nip portion 1013 and the loop circuit 321 from institute The fringe region 311 for stating pedestal 31 flows to the chip attachment region 312, to ensure the chip attachment region 312 Flatness, and moulding material consolidation in the pedestal molding space 103 is molded and is formed the molded base 50, wherein position corresponding to the nip portion 1013 forms the optical window 51 of the molded base 50.It is understood that work as After the molded base 50 is molded, the molded base 50 coats the substrate outside portion 3112, described of the wiring board 30 The outside portion of loop circuit 321 and the electronic component 50.

In the step of accompanying drawing 14 is shown, the photo-sensitive cell 20 is mounted on to the chip attachment of the wiring board 30 Region 312, and turned on the photo-sensitive cell 20 and the wiring board 30 by the lead 40, to form a molding sense Optical element.

In addition, in accompanying drawing 15, the top surface of the molded base 50 can have at least outside an inner surface 52 and one Side surface 53.In one example, the inner surface 52 of the molded base 50 and the outer surface 53 are in same In individual plane, so that the filter element 70 follow-up, to be assembled in the inner surface 52 of the molded base 50, and by group The driver 80 equipped with the optical lens 10 is assembled in the outer surface 53 of the molded base 50.

In another example, described the inner surface 52 of the molded base 50 is less than the outer surface 53, with Make difference in height between the inner surface 52 and the outer surface 53 to be present and form a groove 54 of the molded base 50, Wherein described groove 54 is communicated in the optical window 51.It is noted that the groove 54 of the molded base 50 with it is described The optical window 51 of molded base 50 is synchronous to be formed.

Refer to the attached drawing 16, the filter element 70 is assembled in the inner surface 52 of the molded base 50, and will The driver 80 for being assembled with the optical lens 10 is assembled in the outer surface 53 of the module pedestal 50, so that the light Learn camera lens 10 and be maintained at the photosensitive path of the photo-sensitive cell 20, and the filter element 70 is maintained at the optical frames Between first 10 and the photo-sensitive cell 20, and in the installing space that the driver 80 is installed on to the support 400 After 401, glue is filled between the inwall of the support 400 and the outer wall of the driver 80, so as to be worth the shooting mould Group 1.

Accompanying drawing 17 shows first variant embodiment of the camera module 1, different from the embodiment described above, The camera module 1 includes a lens barrel 90, wherein the optical lens 10 is assembled in the lens barrel 90, the lens barrel 90 is by group Top surface loaded on the module pedestal 50, to make the optical lens 10 be maintained at the photosensitive member by the lens barrel 90 The photosensitive path of part 20.It is understood that although the lens barrel 90 shown in Figure 17 is non-threaded lens barrel, at other Example in, the lens barrel 90 can also be threaded lens barrel, assemble the optical lens 20 in a manner of by being spirally connected In the lens barrel 90.

Accompanying drawing 18 shows second variant embodiment of the camera module, wherein the lens barrel 90 integratedly extends In the top surface of the molded base 50, i.e. when carrying out moulding technology, the lens barrel 90 and the one of the molded base 50 Ground is molded.

Figure 19 shows an electronic equipment, wherein the electronic equipment includes at least a camera module 1 and an electronic equipment Body 2, wherein the camera module 1 is arranged at the electronic equipment body 2, for obtaining image, wherein the electronics The type of apparatus body 2 can be with unrestricted, such as the electronic equipment body 2 can be smart mobile phone, tablet personal computer, individual Digital assistants, MP3/4/5, e-book etc..

It will be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as lifting Example and be not intended to limit the utility model.

The purpose of this utility model completely and effectively realizes.Function of the present utility model and structural principle are in reality Apply and show and illustrate in example, under without departing from the principle, embodiment of the present utility model there can be any deformation or repair Change.

Claims (45)

1. a wiring board, wherein a photo-sensitive cell and the wiring board are connected switched only, it is characterised in that the wiring board bag Include：

One substrate, wherein the substrate has a fringe region；With

One circuit portion, wherein the circuit portion is formed at the substrate, the photo-sensitive cell and the circuit portion connect switched only Connect, wherein the circuit portion forms a loop circuit in the fringe region of the substrate, the loop circuit is centered around institute State around photo-sensitive cell.

2. wiring board according to claim 1, wherein the substrate has a chip attachment region, the fringe region and The chip attachment region is integrally formed, wherein the photo-sensitive cell is mounted on the chip attachment region, so that described Loop circuit is centered around around the photo-sensitive cell.

3. wiring board according to claim 1, wherein the substrate has a receiving space, the fringe region is centered around Around the receiving space, wherein the photo-sensitive cell is housed inside the receiving space, so that the loop circuit surrounds Around the photo-sensitive cell.

4. wiring board according to claim 1, wherein the fringe region of the substrate have a substrate inside portion and One substrate outside portion, and the substrate inside portion and the substrate outside portion are respectively positioned at the inner side of the loop circuit and outer Side.

5. wiring board according to claim 1, further comprise one group of wiring board connector, wherein the wiring board connects Part is arranged at the substrate, wherein the circuit portion includes one group of connection circuit, the connection circuit is connected to the annular Circuit and the wiring board connector.

6. wiring board according to claim 5, wherein the span of the outside dimension of the wiring board connector is 0.005mm~0.8mm.

7. wiring board according to claim 6, wherein the span of the outside dimension of the wiring board connector is 0.1mm~0.5mm.

8. according to any described wiring board in claim 5 to 7, wherein the span of the width dimensions in the circuit portion is 0.001mm~0.5mm.

9. wiring board according to claim 8, wherein the span of the width dimensions in the circuit portion be 0.02mm~ 0.1mm。

10. according to any described wiring board in claim 5 to 7, wherein the span of the spacing in the adjacent circuit portion It is 0.001mm~0.5mm.

11. wiring board according to claim 9, wherein the span of the spacing in the adjacent circuit portion is 0.001mm ~0.5mm.

12. wiring board according to claim 11, wherein the span of the spacing in the adjacent circuit portion is 0.02mm ~0.1mm.

13. wiring board according to claim 1, wherein the loop circuit protrudes from the surface of the substrate.

14. wiring board according to claim 13, wherein the circuit portion is formed by way of plating or printing in institute The surface of substrate is stated, so that the loop circuit that the circuit portion is formed protrudes from the surface of the substrate.

15. according to any described wiring board in claim 1 to 7,13 and 14, wherein the loop circuit includes one first electricity Road unit, wherein first circuit unit is in complete annular, so that first circuit unit is centered around the photosensitive member Around part.

16. according to any described wiring board in claim 1 to 7,13 and 14, wherein the loop circuit includes at least 1 the One circuit unit and at least a second circuit unit, wherein first circuit unit around the photo-sensitive cell in a ring Ground extends, and first circuit unit forms at least one opening, and the second circuit unit is formed in the opening, with An at least gap is formed between first circuit unit and the second circuit unit.

17. wiring board according to claim 16, wherein the gap is in sleeve configuration, and the gap is from the substrate Interior extension.

18. wiring board according to claim 16, wherein the end of first circuit unit, which forms one, stops circuit, institute Stating second circuit unit includes an at least extension circuit, wherein the stop bearing of trend of circuit and prolonging for the extension circuit It is roughly the same to stretch direction, with it is described stop circuit and the extension circuit between and the shape between the adjacent extension circuit Into the gap.

19. wiring board according to claim 18, wherein at least a part of extension circuit extend deviously, so that Form the gap between the stop circuit and the extension circuit and between the adjacent extension circuit deviously Extension.

20. wiring board according to claim 16, wherein in first circuit unit and the second circuit unit At least one circuit unit forms at least one and stops projection, and the stop projection extends to the gap, to reduce the gap Size.

A 21. molding photosensory assembly, it is characterised in that including：

One molded base, wherein the molded base has an optical window；

One photo-sensitive cell；And

One wiring board, wherein the wiring board further comprises：

One substrate, wherein the substrate has a fringe region；With

One circuit portion, wherein the circuit portion is formed at the substrate, the photo-sensitive cell and the circuit portion connect switched only Connect, wherein the circuit portion forms a loop circuit in the fringe region of the substrate, the loop circuit is centered around institute State around photo-sensitive cell, wherein the molded base and a part for the fringe region and a part for the loop circuit It is joined integrally, and the photosensitive region of the photo-sensitive cell corresponds to the optical window.

22. molding photosensory assembly according to claim 21, wherein the fringe region of the substrate has a substrate Inside portion and a substrate outside portion, and the substrate inside portion and the substrate outside portion are respectively positioned at the loop circuit Inner side and outer side, wherein the molded base and the outside portion of the substrate outside portion and the loop circuit are joined integrally.

23. molding photosensory assembly according to claim 22, further comprise an at least electronic component, wherein the line Road plate includes an at least wiring board connector, and the wiring board connector is arranged on the substrate outside portion, wherein the electricity Road portion includes at least one connection circuit, and the connection circuit connects the wiring board connector and the loop circuit, the electricity Sub- component is mounted on the wiring board connector, wherein the molded base coats at least one electronic component.

24. molding photosensory assembly according to claim 23, wherein the loop circuit includes one first circuit unit, its Described in the first circuit unit in complete annular so that first circuit unit is centered around around the photo-sensitive cell.

25. molding photosensory assembly according to claim 23, wherein the loop circuit includes at least one first circuit list Member and an at least second circuit unit, wherein first circuit unit extends in a ring around the photo-sensitive cell, And first circuit unit forms at least one opening, the second circuit unit is formed in the opening, with described the An at least gap is formed between one circuit unit and the second circuit unit.

26. molding photosensory assembly according to claim 25, wherein the gap is in sleeve configuration, and the gap is from institute Substrate inside portion is stated to the substrate outside portion to extend.

27. molding photosensory assembly according to claim 26, stop wherein the end of first circuit unit forms one Circuit, the second circuit unit include an at least extension circuit, wherein the bearing of trend for stopping circuit and the extension The bearing of trend of circuit is roughly the same, between the stop circuit and the extension circuit and in the adjacent extension electricity The gap is formed between road.

28. molding photosensory assembly according to claim 27, wherein at least a part of extension circuit prolong deviously Stretch, so as to form the gap between the stop circuit and the extension circuit and between the adjacent extension circuit Extend deviously.

29. molding photosensory assembly according to claim 25, wherein first circuit unit and the second circuit list At least one circuit unit in member forms at least one and stops projection, and the stop projection extends to the gap, to reduce State the size in gap.

30. according to any described molding photosensory assembly in claim 25 to 29, wherein the gap is on the outside of the substrate The opening in portion corresponds to the wiring board connector.

A 31. camera module, it is characterised in that including：

One optical lens；

One photo-sensitive cell；

The blocking part of one annular；And

One wiring board, wherein the photo-sensitive cell and the wiring board connect switched only, the blocking part is formed at the line Road plate, and the blocking part is centered around around the photo-sensitive cell, and the optical lens is arranged at the photo-sensitive cell Photosensitive path.

32. camera module according to claim 31, further comprise a molded base, wherein the molded base has One optical window, wherein the blocking part is prevented for forming the moulding material of the molded base from the fringe region of the wiring board Region into where the photo-sensitive cell, to be formed at the marginal zone of the wiring board after moulding material consolidation A part of molded base joined integrally of the part in domain and the blocking part, wherein the photo-sensitive cell corresponds to institute Optical window is stated, to provide a passage of light as the photo-sensitive cell and the optical lens by the optical window.

33. camera module according to claim 32, wherein the wiring board includes a substrate and is formed at the substrate A circuit portion, wherein the circuit portion the substrate of the wiring board the fringe region formed a loop circuit, Wherein described loop circuit forms the blocking part.

34. camera module according to claim 32, wherein the wiring board includes a substrate and is formed at the substrate A circuit portion, wherein the circuit portion the substrate of the wiring board the fringe region formed one annular electromagnetism Field shield portion, to prevent external electromagnetic power from disturbing the photo-sensitive cell, wherein the electromagnetic-field-shielded portion forms the blocking part.

35. camera module according to claim 33, wherein the fringe region of the substrate has on the inside of a substrate Portion and a substrate outside portion, the substrate inside portion and the substrate outside portion are located at the both sides of the loop circuit respectively, its Described in molded base and the outside portion of the substrate outside portion and the loop circuit it is joined integrally.

36. camera module according to claim 35, further comprise an at least electronic component, wherein the electronics is first Device is arranged at the substrate outside portion, and the molded base coats the electronic component.

37. according to any described camera module in claim 32 to 36, further comprise a driver, wherein the optics Camera lens is assembled in the driver, and the driver is assembled in the top surface of the molded base, with by the driving Device makes the optical lens be maintained at the photosensitive path of the photo-sensitive cell.

38. according to any described camera module in claim 32 to 36, further comprise a lens barrel, wherein the optical frames Head is arranged at the lens barrel, and the lens barrel is assembled in the top surface of the molded base, described to make by the lens barrel Optical lens is maintained at the photosensitive path of the photo-sensitive cell.

39. according to any described camera module in claim 32 to 36, further comprise a lens barrel, wherein the optical frames Head is arranged at the lens barrel, and the lens barrel integratedly extends the top surface of the molded base, to make by the lens barrel The optical lens is maintained at the photosensitive path of the photo-sensitive cell.

40. according to any described camera module in claim 32 to 36, further comprise a filter element, wherein the filter Optical element is maintained between the optical lens and the photo-sensitive cell.

41. the camera module according to claim 37, further comprise a filter element, wherein the filter element is protected Hold between the optical lens and the photo-sensitive cell.

42. camera module according to claim 41, wherein the filter element is assembled in the top of the molded base Surface, so that the filter element is maintained between the optical lens and the photo-sensitive cell.

43. camera module according to claim 42, wherein the top surface of the molded base have an inner surface and One outer surface, the filter element are assembled in the inner surface, and the driver is assembled in the outer surface.

44. camera module according to claim 43, wherein the inner surface and the outer surface have difference in height, To form a groove of the molded base, wherein the groove is communicated in the optical window, the filter element is assembled in institute State groove.

A 45. electronic equipment, it is characterised in that including：

One electronic equipment body；With

According to any described at least one camera module in claim 31 to 44, wherein the camera module is set In the electronic equipment body, for obtaining image.