CN205961266U - Pick -up module - Google Patents
Pick -up module Download PDFInfo
- Publication number
- CN205961266U CN205961266U CN201620373323.XU CN201620373323U CN205961266U CN 205961266 U CN205961266 U CN 205961266U CN 201620373323 U CN201620373323 U CN 201620373323U CN 205961266 U CN205961266 U CN 205961266U
- Authority
- CN
- China
- Prior art keywords
- sensitive chip
- bearer bar
- camera module
- filter element
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Landscapes
- Lens Barrels (AREA)
Abstract
The utility model provides a pick -up module, wherein pick -up module includes an at least circuit board, an at least optical lens, an at least bearer bar, at least one sense optical chip and at least one integrative packaging support the bearer bar set up protrudingly in feel optical chip's photosensitive region 's periphery side to prevent to be used for the parcel the circuit board with feel optical chip's non - photosensitive region integrative packaging support is used for forming at fashioned in -process integrative packaging support's material flow is arrived feel optical chip's photosensitive region and damage feel optical chip.
Description
Technical field
This utility model is related to field of photography, particularly to a camera module.
Background technology
In recent years, electronic equipment increasingly presents lightening development trend, and this is for the standard as electronic equipment
The size of the camera module of one of configuration, the height dimension especially for camera module proposes more stringent requirement.Separately
Outward, user is for the requirement also more and more higher of the image quality of camera module.Therefore, how to reduce camera module size and
The image quality improving camera module is the technical problem that camera module industry purports to solve in recent years.
At present, MOC (the Molding On Chip) packaging technology being applied to camera module industry is developed, and MOC seals
Dress technique is during camera module is packed by sensitive chip together with circuit package, is taken the photograph with farthest improving
As module structural strength, reduce the size of camera module and reduce the bad situation of dust and occur.Specifically, adopting
During MOC packaging technology manufactures camera module, first sensitive chip is mounted on wiring board, and will be described by gold thread
Sensitive chip and described wiring board are conducted, and then put into described wiring board in mould, and make described sensitive chip
Photosensitive region towards mould, form support by way of inserting moulding material in described mould, wherein institute
Stating support makes described sensitive chip and described wiring board joined integrally.The mode of even now is improving the knot of described camera module
The size aspect of structure intensity and the described camera module of reduction serves positive effect, but, this system of described camera module
The process of making yet suffers from problems.
First it is generally the case that described sensitive chip by the lenticule that mates one by one with each pixel to improve
State the photoperceptivity of sensitive chip, described lenticule is usually micron level, this make the described lenticule easily damaged or
Person is scraped off, and especially under high-temperature high-pressure state, described lenticule is damaged or probability that be scraped off is bigger, and general institute
State any one the described lenticule in sensitive chip to be destroyed or be scraped off, then necessity leads to the imaging of described camera module
Quality is affected.Secondly, there is tolerance in the attachment of described sensitive chip and described wiring board, this leads to apply pressure in mould
After the non-photo-sensing region of described sensitive chip, can there is gap between described sensitive chip and mould, when shaping material
After material is received in mould, moulding material can be flowed into the gap being formed between described sensitive chip and mould, and
The described support that moulding material is formed is led to there is the situation of " overlap ", on the one hand because the temperature of moulding material is higher, one
Denier moulding material flow to the photosensitive region of described sensitive chip, then necessity can be to the photosensitive region being located at described sensitive chip
Described lenticule cause damage, " overlap " that be on the other hand formed at described support may sensitive chip described in partial occlusion
Photosensitive region and cause product bad.
Utility model content
A purpose of the present utility model is to provide a camera module, and wherein said camera module provides a bearer bar,
Described bearer bar is arranged at the outer circumferential side of the photosensitive region of sensitive chip, with an one package support molding, described guarantor
Shield frame stops the photosensitive region damaging described sensitive chip for the moulding material forming described integral packaging support.
A purpose of the present utility model is to provide a camera module, wherein in described integral packaging rack forming,
Described bearer bar stops the situation " overlap " in the inner side of described integral packaging support.
A purpose of the present utility model is to provide a camera module, and wherein said bearer bar is arranged at filter element
Outer circumferential side, in described integral packaging rack forming, described bearer bar stops and occurs in the inner side of described integral packaging support
The situation of " overlap ".
A purpose of the present utility model is to provide a camera module, and wherein said bearer bar is arranged at institute by raised
State the outer circumferential side of the photosensitive region of sensitive chip, the mould for integral packaging support described in molding applies pressure to described protection
Frame, to stop described mould from directly contacting with described sensitive chip by described bearer bar, thus avoid described photosensitive core
The photosensitive region of piece is pressurized and damaged or is scraped off.
A purpose of the present utility model is to provide a camera module, and it is slow to provide that wherein said bearer bar has elasticity
Rush ability, can be fully contacted with described mould after described bearer bar is pressurized, isolated with playing sealing function described
The photosensitive region of sensitive chip and external environment condition, thus avoid the sense of described sensitive chip in described integral packaging rack forming
Light region is impaired.
A purpose of the present utility model is to provide a camera module, and it is slow to provide that wherein said bearer bar has elasticity
Rush ability, such that it is able to reduce the requirement of the flatness to described camera module, and each mechanism reducing described camera module
Matching requirements.
A purpose of the present utility model is to provide a camera module, and wherein said bearer bar is after shaping by overlappingly
It is arranged at described sensitive chip, to improve the manufacture efficiency of described camera module.
A purpose of the present utility model is to provide a camera module, the mould upstream surface of wherein said mould
It is provided with least one coverlay, when the mould upstream of described mould presses, described coverlay can also be to described photosensitive core
Piece provides and protects further, in addition, described coverlay can also increase demoulding difficulty and increase sealing, to prevent " overlap ".
A purpose of the present utility model is to provide a camera module, and wherein said mould corresponds to described photosensitive
The photosensitive region of chip can be designed with indent, so that having peace between the photosensitive region of described sensitive chip and described mould
Full distance, thus allow the impact reducing further to described sensitive chip.
A purpose of the present utility model is to provide a camera module, and wherein said bearer bar is capped one layer of protection
Film, in order to described bearer bar is arranged at described sensitive chip, in addition, described protecting film can also isolate described sensitive chip
Photosensitive region and external environment condition.
According to this utility model, it is capable of above-mentioned purpose and advantage and the camera module of other advantages includes：
At least one wiring board；
At least one optical lens；
At least one bearer bar；
At least one sensitive chip, wherein said bearer bar is outer by raised the photosensitive region being arranged at described sensitive chip
The week side of boss；And
At least one one package support, wherein said integral packaging support is set parcel described wiring board and described photosensitive
The non-photo-sensing region of chip, so that described integral packaging support, described wiring board and described sensitive chip are combined as a whole, wherein
Described optical lens are arranged at the photosensitive path of described sensitive chip, and wherein said sensitive chip is switched on described wiring board
Connect.
According to a preferred embodiment of the present utility model, the size of the inner side edge of described bearer bar is more than or equal to described
The size of the photosensitive region of sensitive chip.
According to a preferred embodiment of the present utility model, being smaller in size than or the be equal to described of outer side edges of described bearer bar
The size of sensitive chip.
According to a preferred embodiment of the present utility model, described bearer bar has elasticity.
According to a preferred embodiment of the present utility model, described camera module further includes a cementing layer, wherein said
Cementing layer is arranged between described bearer bar and the outer circumferential side of photosensitive region of described sensitive chip, with by described cementing layer
Connect the outer circumferential side of the photosensitive region of described bearer bar and described sensitive chip.
According to a preferred embodiment of the present utility model, described integral packaging support is set the described protection of parcel further
The lateral surface of frame.
According to a preferred embodiment of the present utility model, described camera module further includes a camera lens supporter, wherein
Described camera lens supporter is arranged at described integral packaging support, and described optical lens are arranged at described camera lens supporter.
According to a preferred embodiment of the present utility model, described camera lens supporter and described integral packaging support one landform
Become.
According to a preferred embodiment of the present utility model, described camera lens supporter is a motor, and described motor and institute
State wiring board and be switched on and connect.
According to a preferred embodiment of the present utility model, described camera module further includes a filter element, wherein institute
State the top that filter element is arranged at described integral packaging support, so that described filter element is located at described sensitive chip and institute
State between optical lens.
According to one side of the present utility model, this utility model provides a camera module, and it includes：
At least one wiring board；
At least one optical lens；
At least one bearer bar；
At least one sensitive chip；
At least one filter element, wherein said filter element is overlappingly arranged at described sensitive chip, described bearer bar
It is arranged at the outer circumferential side of described filter element；And
At least one one package support, wherein said integral packaging support is set the outer circumferential side coating described filter element
With described wiring board, so that described integral packaging support, described filter element, described sensitive chip and described wiring board are combined into
Integrally, wherein said optical lens are arranged at the photosensitive path of described sensitive chip, described sensitive chip and described wiring board
Conducting connects.
According to a preferred embodiment of the present utility model, the size of the inner side edge of described bearer bar is more than or equal to described
The size of the photosensitive region of sensitive chip, so that described bearer bar will not block the photosensitive region of described sensitive chip.
According to a preferred embodiment of the present utility model, described bearer bar has elasticity.
According to a preferred embodiment of the present utility model, described camera module further includes a cementing layer, wherein said
Cementing layer is arranged between described bearer bar and described filter element, to connect described bearer bar and institute by described cementing layer
State the outer circumferential side of filter element.
According to a preferred embodiment of the present utility model, described integral packaging support is set the described protection of parcel further
The lateral surface of frame.
According to a preferred embodiment of the present utility model, described camera module further includes a camera lens supporter, wherein
Described camera lens supporter is arranged at described integral packaging support, and described optical lens are arranged at described camera lens supporter.
According to a preferred embodiment of the present utility model, described camera lens supporter and described integral packaging support one landform
Become.
According to one side of the present utility model, this utility model also provides the manufacture method of a camera module, wherein institute
State manufacture method to comprise the steps：
A () will at least one sensitive chip and the conducting connection of at least one wiring board；
B () provides at least one bearer bar, wherein said bearer bar is arranged at the outer of the photosensitive region of described sensitive chip
The week side of boss；
The inner surface of c mould upstream that () is had by a molding applies pressure to described bearer bar, to isolate described photosensitive core
The photosensitive region of piece and non-photo-sensing region；
D () wraps up the non-sense of described wiring board and described sensitive chip by the moulding material being added into described mould
Light region, is sealed with the one forming joined integrally with described sensitive chip and described wiring board after the solidification of described moulding material
Dress support；And
E () provides at least one optical lens, wherein said optical lens are arranged at the photosensitive path of described sensitive chip,
To make described camera module.
According to a preferred embodiment of the present utility model, in described step (b), arrange one on the top of described bearer bar
Protecting film, so that described protecting film corresponds to the photosensitive region of described sensitive chip, and after described step (d), by institute
State protecting film to remove from described bearer bar.
According to a preferred embodiment of the present utility model, in the above-mentioned methods, on the described mould of described mould
The position of the corresponding described photosensitive region in portion arranges a groove, with described step (c), make the inner surface of described mould upstream with
The photosensitive region of described sensitive chip keeps safe distance.
According to a preferred embodiment of the present utility model, in the inner surface setting of the described mould upstream of described mould
One coverlay.
According to a preferred embodiment of the present utility model, in described step (d), described moulding material wraps up institute further
State the lateral surface of bearer bar, to be formed and described sensitive chip, described wiring board and described guarantor after the solidification of described moulding material
Shield frame described integral packaging support joined integrally.
According to a preferred embodiment of the present utility model, before described step (e), further include step：
At least one filter element is mounted on the top of described integral packaging support, and so that described filter element is maintained at
Between described sensitive chip and described optical lens.
According to a preferred embodiment of the present utility model, in described step (b), in the photosensitive region of described sensitive chip
Outer circumferential side and described bearer bar between form a cementing layer, to connect described bearer bar and described photosensitive by described cementing layer
The outer circumferential side of chip.
According to a preferred embodiment of the present utility model, in the above-mentioned methods, in described bearer bar and/or described photosensitive core
The outer circumferential side application glue of the photosensitive region of piece, to form described cementing layer after described glue curing.
According to a preferred embodiment of the present utility model, in the above-mentioned methods, described glue passes through heat cure or UV light
According to solidification.
According to one side of the present utility model, this utility model also puies forward the manufacture method of a camera module, wherein said
Manufacture method comprises the steps：
(A) will at least one sensitive chip and the conducting connection of at least one wiring board；
(B) filter element is superimposed on described sensitive chip；
(C) provide at least one bearer bar, wherein said bearer bar is arranged at the outer circumferential side of described filter element；
(D) inner surface of the mould upstream being had by a molding applies pressure to described bearer bar, to isolate the described unit that filters
The interior zone of part and outer circumferential side；
(E) periphery of described wiring board and described filter element is wrapped up by the moulding material being added into described mould
Side, joined integrally with described filter element, described sensitive chip and described wiring board to be formed after the solidification of described moulding material
An one package support；And
(F) at least one optical lens are provided, wherein said optical lens are arranged at the photosensitive path of described sensitive chip,
To make described camera module.
According to a preferred embodiment of the present utility model, in described step (E), described moulding material further includes institute
State the lateral surface of bearer bar, to be formed and described sensitive chip, described wiring board, described optical filtering after the solidification of described moulding material
Element and described bearer bar described integral packaging support joined integrally.
According to a preferred embodiment of the present utility model, in the above-mentioned methods, described moulding material be flowing material or
Granular material.
Brief description
Fig. 1 is the internal junction after being cut open along centre position according to the camera module of a preferred embodiment of the present utility model
Structure schematic diagram.
Fig. 2 is wiring board, sensitive chip and the bearer bar of the camera module of the above preferred embodiment according to utility model
Structural relation schematic perspective view.
Fig. 3 A is cuing open of the step one of a manufacture process of the camera module according to above preferred embodiment of the present utility model
Depending on schematic diagram.
Fig. 3 B is the step 2 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 3 C is the step 3 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 3 D is the step 4 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 3 E is the step 5 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 3 F is the step 6 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 4 A is the step 3 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
The cross-sectional schematic of variant embodiment.
Fig. 4 B is the step 4 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
The cross-sectional schematic of variant embodiment.
Fig. 5 is the another of the step 4 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
The cross-sectional schematic of one variant embodiment.
Fig. 6 A is the step one of another manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 6 B is the step 2 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 6 C is the step 3 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 6 D is the step 4 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 6 E is the step 5 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 6 F is the step 6 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 6 G is the step 7 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 7 is the inside after being cut open along centre position according to the camera module of another preferred embodiment of the present utility model
Structural representation.
Fig. 8 be the wiring board of the camera module of the above preferred embodiment according to utility model, sensitive chip, filter element and
The structural relation schematic perspective view of bearer bar.
Fig. 9 A is cuing open of the step one of a manufacture process of the camera module according to above preferred embodiment of the present utility model
Depending on schematic diagram.
Fig. 9 B is the step 2 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 9 C is the step 3 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 9 D is the step 4 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 9 E is the step 5 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Fig. 9 F is the step 6 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Cross-sectional schematic.
Specific embodiment
Hereinafter describe for disclosing this utility model so that those skilled in the art are capable of this utility model.Hereinafter retouch
Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Retouch following
The ultimate principle of the present utility model defining in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang
Case and the other technologies scheme without departing from spirit and scope of the present utility model.
Fig. 1 to Fig. 3 F of reference explanation book accompanying drawing, according to the camera module of a preferred embodiment of the present utility model and described
The manufacture method of camera module is elucidated with.Described camera module includes at least one optical lens 10, at least one sensitive chip 20, extremely
A few bearer bar 30, at least one wiring board 40 and at least one one package support 50.
It is noted that the manufacture in the structure with regard to described camera module of the present utility model and described camera module
In the description of method using to term " " should be understood " at least one " or " one or more ", that is, in an embodiment
In, the quantity of an element can be one, and in a further embodiment, the quantity of this element can be multiple, therefore, art
Language " one " is it is not intended that restriction to quantity.
Similarly, disclosing and illustrating the structure of described camera module of the present utility model and the manufacture of described camera module
Using the term of any direction arriving during method, such as " longitudinal ", " horizontal ", " on ", D score, "front", "rear", " left ",
The orientation of instruction such as " right ", " vertical ", " level ", " top ", " bottom " " interior ", " outward " or position relationship are based on side shown in the drawings
Position or position relationship, it is for only for ease of description this utility model and simplifies description, rather than the dress of instruction or hint indication
Put or element must have specific orientation, with specific azimuth configuration and operation, therefore above-mentioned term it is not intended that to this
The restriction of utility model.
It will be further appreciated that, described camera module of the present utility model can be to focus camera module or change
Burnt camera module.In other words, whether described camera module of the present utility model to allow focusing to be not intended to limit of the present utility model interior
Hold and scope.
It will be further appreciated that, described camera module of the present utility model can be single-lens camera module or
Many camera lenses camera module, such as, in a specific example, described camera module may be implemented as array camera module.Change
Yan Zhi, the quantity of the described optical lens 10 of described camera module of the present utility model be not intended to limit content of the present utility model and
Scope.
Specifically, in described camera module of the present utility model, described bearer bar 30 by raised be arranged at described
The outer circumferential side of the photosensitive region of sensitive chip 20, described sensitive chip 20 is switched on described wiring board 40 and is connected, described one
Package support 50 is set the non-photo-sensing region wrapping up described wiring board 40 and described sensitive chip 20, so that described integral packaging
Support 50, described sensitive chip 20 and described wiring board 40 are combined as a whole, and described optical lens 10 are arranged at described photosensitive
The photosensitive path of chip 20.The light being reflected by the object can be accumulated described camera module by described optical lens 10
Inside, to be received by described sensitive chip 20 further and to carry out photoelectric conversion and generate the image related to object.
In a specific example of described camera module of the present utility model, described sensitive chip 20 is mounted on institute
State wiring board 40, and described sensitive chip 20 is switched on described wiring board 40 by routing technique and is connected.For example described
Beat gold thread between the non-photo-sensing region of sensitive chip 20 and described wiring board 40, connect described sensitive chip to turn on by gold thread
20 and described wiring board 40, as shown in Figure 1.
In another specific example of described camera module of the present utility model, described sensitive chip 20 is being mounted
The described wiring board 40 of connection switched on while described wiring board 40, the non-photo-sensing region of for example described sensitive chip 20 is provided with
Chip bonding pad, described wiring board 40 is provided with circuit pads, when described sensitive chip 20 is mounted on described wiring board 40, makes
The circuit pads of the chip bonding pad of described sensitive chip 20 and described wiring board 40 are switched on and connect.
Described bearer bar 30 is hollow structure, so that described bearer bar 30 can be located on the sense of described sensitive chip 20
The outer circumferential side in light region.Preferably, the size of the inner side edge of described bearer bar 30 is more than or equal to described sensitive chip 20
The size of photosensitive region, thus when described bearer bar 30 by raised be arranged at described sensitive chip 20 when, described bearer bar 30
The outer circumferential side of the photosensitive region of described sensitive chip 20 can be maintained at so that described bearer bar 30 will not block described photosensitive
The photosensitive region of chip 20.
Preferably, the size being smaller in size than described sensitive chip 20 of the outer side edges of described bearer bar 30, thus when described
Bearer bar 30 by raised be arranged at described sensitive chip 20 when, permissible in the outside in the non-photo-sensing region of described sensitive chip 20
By the technique of routing, described sensitive chip 20 and described wiring board 40 are turned on.Even so, those skilled in the art can
To be understood by, when described sensitive chip 20 and described wiring board 40 pass through chip bonding pad and circuit pads connection switched on
When, the size of the outer side edges of described bearer bar 30 can be with the consistent size of described sensitive chip 20.
Described integral packaging support 50 wraps up the non-photo-sensing area of described wiring board 40 and described sensitive chip 20 after shaping
Domain, so that described integral packaging support 50, described wiring board 40 and described sensitive chip 20 are combined as a whole, by such
Mode, by increasing capacitance it is possible to increase the structural stability of described camera module and the volume reducing described camera module, so that described shooting mould
Group can be applied to pursue lightening electronic equipment.
Further, described integral packaging support 50 is set the outer circumferential side wrapping up described bearer bar 30, so that described one
Body package support 50, described wiring board 40, described bearer bar 30 and described sensitive chip 20 are combined as a whole.
Further, as shown in figure 1, described camera module includes at least one camera lens supporter 60, wherein said camera lens props up
Support body 60 is arranged at the top of described integral packaging support 50, and described optical lens 10 are arranged at described camera lens supporter
60, to make described optical lens 10 be maintained at the photosensitive path of described sensitive chip 20 by described camera lens supporter 60.
In a specific example of described camera module of the present utility model, described camera lens supporter 60 is after shaping
It is arranged at the top of described integral packaging support 50.Another specific example in described camera module of the present utility model
In, described camera lens supporter 60 can be integrally formed with described integral packaging support 50, by such mode, can reduce
The encapsulation error of described camera module, to be conducive to improving the image quality of described camera module.
Preferably, described camera lens supporter 60 may be implemented as a motor that is to say, that described optical lens 10 are by can
It is operatively disposed in described camera lens supporter 60, so that described optical lens 10 are driven along described by described camera lens supporter 60
The photosensitive path of sensitive chip 20 moves back and forth, thus by changing between described optical lens 10 and described sensitive chip 20
Position is adjusting the focal length of described camera module.It is noted that described camera lens supporter 60 can be various drivers, with
For drive described optical lens 10 move back and forth along the photosensitive path of described sensitive chip 20, for example of the present utility model this
In individual preferred embodiment, described camera lens supporter 60 may be implemented as voice coil motor.
It will be appreciated by those skilled in the art that, when described camera lens supporter 60 is implemented as motor, described mirror
Head supporter 60 is switched on described wiring board 40 and is connected.
Further, as shown in figure 1, described camera module includes a filter element 70, wherein said filter element 70 quilt
It is arranged between described optical lens 10 and described sensitive chip 20, when the light being reflected by the object is from described optical lens 10 quilt
Converge to described camera module inside when, light is received by described sensitive chip 20 via after the filtration of described filter element 70
With carry out photoelectric conversion, to improve the image quality of described camera module.In other words, described filter element 70 can play noise reduction
Effect, to improve the image quality of described camera module.
It is noted that the type of described filter element 70 can be unrestricted, such as of the present utility model described
In the specific example of of camera module, described filter element 70 may be implemented as cutoff filter, with by institute
State the infrared part that filter element 70 filters in light, and another in described camera module of the present utility model is specific
In example, described filter element 70 is implemented as full impregnated spectral filter.
Described integral packaging support 50 forms at least one attachment platform 51, for being mounted described filter element 70, for example
Described attachment platform 51 can be formed at the mounting groove on described integral packaging support 50 top or described attachment platform 51 can
To be formed at the plane on described integral packaging support 50 top.In other words, described filter element 70 can be directly mounted on
The top of described integral packaging support 50.
If Fig. 3 A to Fig. 3 F is the schematic diagram of the manufacture process according to described camera module of the present utility model, wherein in figure
In 3A to Fig. 3 F, for convenience of explanation, in the way of sectional view, all represent described optical lens 10, the institute of described camera module
State the structural relation of the elements such as sensitive chip 20, described bearer bar 30, described wiring board 40 and described integral packaging support 50.
Shown in Fig. 3 A the step in, described sensitive chip 20 is turned on described wiring board 40.The technology of this area
Personnel it is understood that shown in Fig. 3 A the step in, described sensitive chip 20 is being mounted on described wiring board 40
Afterwards, then by routing technique described sensitive chip 20 and described wiring board 30 are turned on connected mode, only the retouching of illustrative
State, this by described sensitive chip 20 and described wiring board 40 turn on connected mode do not constitute to content of the present utility model and
The restriction of scope.In another example of described camera module of the present utility model, described sensitive chip 20 and described circuit
Plate 40 can also directly be turned on connection by chip bonding pad and circuit pads.
Shown in Fig. 3 B the step in, described bearer bar 30 projection is arranged at the photosensitive of described sensitive chip 20
The outer circumferential side in region.Specifically, in the manufacture process of described camera module of the present utility model, in described bearer bar 30 quilt
After offer, by described bearer bar 30 projection be arranged at described sensitive chip 20 photosensitive region outer circumferential side.Preferably, in institute
State and between bearer bar 30 and the outer circumferential side of photosensitive region of described sensitive chip 20, form a cementing layer 80, described cementing layer 80 is used
Outer circumferential side in the photosensitive region connecting described bearer bar 30 and described sensitive chip 20.
For example in an example of described camera module of the present utility model, glue is arranged on described bearer bar 30
And/or the outer circumferential side of the photosensitive region of described sensitive chip 20, with the sense in described bearer bar 30 and/or described sensitive chip 20
The outer circumferential side in light region forms described cementing layer 80.That is, the photosensitive area of described bearer bar 30 and described sensitive chip 20
The surface of at least one of the outer circumferential side in domain forms described cementing layer 80.Follow-up, described cementing layer 80 is used for described guarantor
The outer circumferential side of the photosensitive region of shield frame 30 and described sensitive chip 20 links together.
Preferably, when glue be arranged on the photosensitive region of described bearer bar 30 and described sensitive chip 20 outer circumferential side it
Afterwards, glue can be made by way of heat cure or UV illumination curing to be rapidly formed for connecting described bearer bar 30 and institute
State the described cementing layer 80 of the outer circumferential side of the photosensitive region of sensitive chip 20.And it is another in described camera module of the present utility model
In one example, described bearer bar 30 can carry described cementing layer 80, thus during encapsulating described camera module, can
Directly described bearer bar 30 to be arranged on the outer circumferential side of the photosensitive region of described sensitive chip 20.
In addition, described bearer bar 30 can be formed by Shooting Technique or Sheet Metal Forming Technology, for example described bearer bar
30 can be the working of plastics being formed by Shooting Technique.
As described in Figure 2, described bearer bar 30 is hollow structure, so that described bearer bar 30 can be arranged by raised
In the outer circumferential side of the photosensitive region of described sensitive chip 20, for isolating photosensitive region and the external rings of described sensitive chip 20
Border, thus during the described camera module of follow-up encapsulation, it is described photosensitive that described bearer bar 30 is prevented from pollutant entrance
The photosensitive region of chip 20 and cause dirty bad point bad.
Shown in Fig. 3 C the step in, by a molding tool 100 during described camera module is packed
Form described integral packaging support 50, wherein said mould 100 includes a mould upstream 101, described mould upstream 101
Inner surface applies pressure to described bearer bar 30, to isolate photosensitive region and the external environment condition of described sensitive chip 20.
It will be appreciated by those skilled in the art that, described bearer bar 30 is arranged at described sensitive chip 20 by raised
Photosensitive region outer circumferential side, thus when the inner surface of described mould upstream 101 applies pressure to described bearer bar 30, described protection
Frame 30 can stop the inner surface of described mould upstream 101 from contacting with the photosensitive region of described sensitive chip 20, thus described guarantor
Shield frame 30 can stop the damage in inner surface of described mould upstream 101 or the photosensitive region of sensitive chip 20 described in scratch.
Further, a modified example of the manufacture process of described camera module with reference to shown in Fig. 5, wherein said mould
The position of the photosensitive region that the inner surface on tool top 101 corresponds to described sensitive chip 20 forms a groove by way of indent
102, thus during by integral packaging support 50 described in the molding of described mould 100, described groove 102 can make
The photosensitive region of described sensitive chip 20 has safety clearance, thus reducing further with the inner surface of described mould upstream 101
The impact to described sensitive chip 20 for the described mould upstream 101, to prevent described sensitive chip 20 by described mould upstream 101
Damage in inner surface or scratch.
Preferably, described bearer bar 30 has elasticity, thus when the inner surface of described mould upstream 101 applies pressure to described guarantor
During shield frame 30, described bearer bar 30 can play cushioning effect, to prevent described in the pressure damage that described mould upstream 101 produces
Sensitive chip 20.In addition, being limited to the manufacturing process of described sensitive chip 20 and the manufacturing process of described wiring board 40 and institute
State the restriction of the attachment process of sensitive chip 20 and described wiring board 40, be mounted on described wiring board in described sensitive chip 20
May there is attachment after 40 to tilt, now, when the inner surface of described mould upstream 101 applies pressure to described bearer bar 30,
Described bearer bar 30 can be deformed, so that the photosensitive region of described sensitive chip 20 and external environment condition are isolated, to prevent
Moulding material for forming described integral packaging support 50 enters the photosensitive region of described sensitive chip 20.
Shown in Fig. 3 D the step in, described moulding material is added in described mould upstream 101, in described one-tenth
Form described integral packaging support 50, wherein said integral packaging support 50 wraps up described wiring board 40 and institute after shape material solidification
State the non-photo-sensing region of sensitive chip 20, so that described integral packaging support 50, described wiring board 40 and described sensitive chip 20
It is combined as a whole.Preferably, described integral packaging support 50 wraps up the outer circumferential side of described bearer bar 30 further, so that described one
Body package support 50, described wiring board 40, described bearer bar 30 and described sensitive chip 20 are combined as a whole.It is worth mentioning
It is that described moulding material is liquid or graininess.After described mould 100 is moved apart, Fig. 3 E such as can be obtained and show
Described integral packaging support 50 joined integrally, described wiring board 40, described bearer bar 30 and the described sensitive chip 20 going out.
It will be appreciated by those skilled in the art that, the photosensitive region of described sensitive chip 20 and external environment condition by every
From thus after described moulding material is added into described mould upstream 101, described moulding material will not flow to described photosensitive
The photosensitive region of chip 20, thus described bearer bar 30 can stop described moulding material from damaging the photosensitive of described sensitive chip 20
Region.In addition, described bearer bar 30 has elasticity, so that described bearer bar 30 and the described mould of described bearer bar 30 of applying pressure to
There is no gap, therefore, during the described moulding material solidification being added into described mould upstream 101 not between top 101
The phenomenon of " overlap " occurs, to ensure the image quality of described camera module.
Further, a modified example of the manufacture process of described camera module with reference to shown in Fig. 4 A and Fig. 4 B, its
Described in the inner surface of mould upstream 101 be provided with a coverlay 103, when the inner surface of described mould upstream 101 applies pressure to institute
When stating bearer bar 30, it is located at the described coverlay 103 of described mould upstream 101 and described bearer bar 30 directly contact, thus
There is provided further protection by described coverlay 103 to described sensitive chip 20.Further it will be understood that described covering
Film 103 can increase demoulding difficulty and increase sealing, thus preventing described moulding material described one during solidification
The phenomenon of " overlap " in the inner side of body package support 50.
Shown in Fig. 3 F the step in, described filter element 70 and described optical lens 10 are respectively arranged at described
The photosensitive path of sensitive chip 20, to be obtained described camera module.Preferably, described filter element 70 is mounted on described one
Package support 50, described optical lens 10 are protected by being arranged at the described camera lens supporter 60 of described integral packaging support 50
Hold the photosensitive path in described sensitive chip 20.
If Fig. 6 A to Fig. 6 G is the schematic diagram of another manufacture process according to described camera module of the present utility model.In Fig. 6 A
Illustrate the step in, described sensitive chip 20 is turned on described wiring board 40.
Shown in Fig. 6 B the step in, described bearer bar 30 projection is arranged at the photosensitive of described sensitive chip 20
The outer circumferential side in region.Preferably, the top of described bearer bar 30 is provided with a protecting film 90, in order to by the side of vac sorb
Formula is drawn described bearer bar 30 and described bearer bar 30 is mounted on the outer circumferential side of the photosensitive region of described sensitive chip 20.Ability
The technical staff in domain is it is understood that when described bearer bar 30 is arranged at the periphery of the photosensitive region of described sensitive chip 20
After side, described protecting film 90 is accordingly covered in the top of the photosensitive region of described sensitive chip 20, with by described protection
Film 90 and described bearer bar 30 isolate photosensitive region and the external environment condition of described sensitive chip 20, thus subsequently preventing described one-tenth
Shape material flow to the photosensitive region of described sensitive chip 20.
Shown in Fig. 6 C the step in, applied by the inner surface of the described mould upstream 101 of described mould 100
It is pressed on described bearer bar 30, to isolate photosensitive region and the external environment condition of described sensitive chip 20 further.
Shown in Fig. 6 D the step in, by described moulding material add described mould 101 in, in described shaping
Form described integral packaging support 60, wherein said integral packaging support 50 wraps up described wiring board 40 and described after material solidification
The non-photo-sensing region of sensitive chip 20, so that described integral packaging support 50, described wiring board 40 and described sensitive chip 20 are tied
It is integrated.Preferably, described integral packaging support 50 wraps up the outer circumferential side of described bearer bar 30 further, so that described one
Package support 50, described wiring board 40, described bearer bar 30 and described sensitive chip 20 are combined as a whole.By described shaping mould
After tool 100 moves apart, integral packaging support 50 joined integrally as shown in Fig. 6 E, described wiring board 40, described can be obtained
Bearer bar 30 and described sensitive chip 20, wherein said protecting film 90 is still arranged at described bearer bar 30.
Shown in Fig. 6 F the step in, described protecting film 90 is removed from described bearer bar 30, with obtain one
In conjunction with integral packaging support 50, described wiring board 40, described bearer bar 30 and described sensitive chip 20.
Shown in Fig. 6 G the step in, described filter element 70 and described optical lens 10 are respectively arranged at institute
State the photosensitive path of sensitive chip 20, so that described camera module is obtained.
According to Fig. 7 to Fig. 9 G of Figure of description, according to the described camera module of another preferred embodiment of the present utility model
It is elucidated with, wherein said camera module includes at least one optical lens 10A, at least one sensitive chip 20A, at least one bearer bar
30A, at least one wiring board 40A, at least one one package support 50A and at least one filter element 70A, wherein said photosensitive core
Piece 20A and described wiring board 40A is switched on and connects, and described filter element 70A is overlappingly arranged at described sensitive chip 20A,
Described bearer bar 30A is arranged at the neighboring of described filter element 70A, so that described bearer bar 30A does not block described sense
The photosensitive region of optical chip 20A, described integral packaging support 50A is set the described wiring board 40A of parcel and described filter element
The neighboring of 70A, so that described integral packaging support 50A, described filter element 70A, described sensitive chip 20A and described circuit
Plate 40A is joined integrally, and wherein said optical lens 10A is arranged at the photosensitive path of described sensitive chip 20A.It is reflected by the object
Light be accumulated the inside of described camera module by described optical lens 10A, with further by described sensitive chip 20A
Receive and carry out photoelectric conversion and generate the image related to object.
Preferably, described integral packaging support 50A wraps up described wiring board 40A and described filter element 70A in molding
Neighboring so that described integral packaging support 50A, described filter element 70A, described sensitive chip 20A and described wiring board
40A is joined integrally.
It is highly preferred that described integral packaging support 50A wraps up the outer side edges of described bearer bar 30A further, so that described
Integral packaging support 50A, described filter element 70A, described sensitive chip 20A, described wiring board 40A and described bearer bar 30A
Joined integrally.
Described bearer bar 30A by raised the neighboring being arranged at described filter element 70A, thus subsequently when a molding
The inner surface of the mould upstream 101A of mould 100A apply pressure to described bearer bar 30A when, the inner surface of described mould upstream 101A
Will not contact with the surface of described filter element 70A, thus preventing damage in inner surface or the scratch of described mould upstream 101A
Described filter element 70A.That is, the described bearer bar by raised the neighboring being arranged at described filter element 70A
30A, makes the surface of described filter element 70A form safe distance with the inner surface of described mould upstream 101A, described to prevent
Filter element 70A described in the damage in inner surface of mould upstream 101A or scratch.
Further, described camera module includes at least one camera lens supporter 60A, wherein said camera lens supporter 60A quilt
It is arranged at the top of described integral packaging support 50A, described optical lens 10A is arranged at described camera lens supporter 60A, with mat
The photosensitive path that described optical lens 10A is maintained at described sensitive chip 20A is made by described camera lens supporter 60A.
In a specific example of described camera module of the present utility model, described camera lens supporter 60A is in molding
It is arranged at the top of described integral packaging support 50A afterwards.Another in described camera module of the present utility model is specific
In example, described camera lens supporter 60A can be integrally formed with described integral packaging support 50A, by such mode, energy
Enough reduce the encapsulation error of described camera module, to be conducive to improving the image quality of described camera module.
Preferably, described camera lens supporter 60A may be implemented as a motor that is to say, that described optical lens 10A quilt
It is operably disposed in described camera lens supporter 60A, so that described optical lens 10A edge is driven by described camera lens supporter 60A
The photosensitive path described sensitive chip 20A moves back and forth, thus by changing described optical lens 10A and described sensitive chip
Position between 20A is adjusting the focal length of described camera module.It is noted that described camera lens supporter 60A can be each
Plant driver, for driving described optical lens 10A to move back and forth along the photosensitive path of described sensitive chip 20A, for example, exist
In this preferred embodiment of the present utility model, described camera lens supporter 60A may be implemented as voice coil motor.
It will be appreciated by those skilled in the art that, when described camera lens supporter 60A is implemented as motor, described mirror
Head supporter 60A is switched on described wiring board 40A and is connected.
It is the schematic diagram of a manufacture process of described camera module of the present utility model as shown in Fig. 9 A to Fig. 9 G.In Fig. 9 A
Illustrate the step in, described sensitive chip 20A be switched on connect described wiring board 40A, above-mentioned excellent with of the present utility model
Embodiment is selected to want to die, the mode that described sensitive chip 20A and described wiring board 40A is switched on connection is unrestricted.
Shown in Fig. 9 B the step in, described filter element 70A is overlappingly arranged at described sensitive chip 20A.
It will be appreciated by those skilled in the art that, the mode that described filter element 70A and described sensitive chip 20A is overlapped
Rear Jiao's focal length of described camera module can be reduced, thus being conducive to the miniaturization of described camera module, in order to take the photograph described in making
As module is applied to pursue lightening electronic equipment.
Shown in step 9C the step in, described bearer bar 30A is positioned over the periphery of described filter element 70A
Side, wherein said bearer bar 30A will not block the photosensitive region of described sensitive chip 20A.Those skilled in the art can manage
Described bearer bar 30A, after described bearer bar 30A is provided, can be arranged at described filter by a cementing layer 80A by solution
The neighboring of optical element 70A.That is, the described glue being arranged between described bearer bar 30A and described filter element 70A
Close layer 80A to be used for connecting described bearer bar 30A and described filter element 70A.
Shown in Fig. 9 D the step in, described bearer bar is applied pressure to by the inner surface of described mould upstream 101A
30A, to isolate interior zone and the neighboring of described filter element 70A, the chi of the interior zone of wherein said filter element 70A
The very little photosensitive region more than or equal to described sensitive chip 20A, to prevent described bearer bar 30A from blocking described sensitive chip
The photosensitive region of 20A.It will be appreciated by those skilled in the art that, described bearer bar 30A is arranged at described filter by raised
The neighboring of optical element 70A, thus when the inner surface of described mould upstream 101A applies pressure to described bearer bar 30A, described guarantor
Shield frame 30A can stop the inner surface of described mould upstream 101A from contacting with the photosensitive region of described filter element 70A, thus institute
State bearer bar 30A and can stop the damage in inner surface of described mould upstream 101A or the inside of filter element 70A described in scratch
Region.
Preferably, described bearer bar 30A has elasticity, thus described in applying pressure to when the inner surface of described mould upstream 101A
During bearer bar 30A, described bearer bar 30A can play cushioning effect, is damaged with the pressure preventing described mould upstream 101A from producing
Bad described filter element 70A.
Shown in Fig. 9 E the step in, described moulding material is added in described mould upstream 101A, described
Form the described integral packaging support 50A of institute, wherein said integral packaging support 50A wraps up described wiring board after moulding material solidification
40A and the neighboring of described filter element 70A, so that described integral packaging support 50A, described wiring board 40A, described photosensitive core
Piece 20A and described filter element 70A is combined as a whole.Preferably, described integral packaging support 50A wraps up described protection further
The outer circumferential side of frame 30A, so that described integral packaging support 50A, described wiring board 40A, described bearer bar 30A, described photosensitive core
Piece 20A and described filter element 70A is combined as a whole.It is noted that described moulding material is liquid or graininess.?
After described mould 100A is moved apart, can obtain described integral packaging support 50A joined integrally as shown in Fig. 9 F,
Described wiring board 40A, described bearer bar 30A, described sensitive chip 20A and described filter element 70A.
It will be appreciated by those skilled in the art that, the interior zone of described filter element 70A and neighboring are isolated,
Thus after described moulding material is added into described mould upstream 101A, described moulding material will not flow to the described unit that filters
The interior zone of part 70A, thus described bearer bar 30A can stop described moulding material from damaging the interior of described filter element 70A
Portion region.In addition, described bearer bar 30A has elasticity, so that described bearer bar 30A and apply pressure to the institute of described bearer bar 30A
State and between mould upstream 101A, there is no gap, therefore, in the described moulding material solidification being added into described mould upstream 101A
During be not in " overlap " phenomenon, to ensure the image quality of described camera module.
Shown in Fig. 9 G the step in, described filter element 70A and described optical lens 10A is respectively arranged at institute
State the photosensitive path of sensitive chip 20A, so that described camera module is obtained.
It will be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as lifting
Example and be not intended to limit this utility model.
The purpose of this utility model is completely and be effectively realized.Function of the present utility model and structural principle are in reality
Apply and show in example and illustrate, without departing under described principle, embodiment of the present utility model can have and any deform or repair
Change.
Claims (18)
1. a camera module is it is characterised in that include：
At least one wiring board；
At least one optical lens；
At least one bearer bar；
One cementing layer；
At least one sensitive chip, wherein said bearer bar is by the periphery of raised the photosensitive region being arranged at described sensitive chip
Side；And
At least one one package support, wherein said integral packaging support is set the described wiring board of parcel and described sensitive chip
Non-photo-sensing region so that described integral packaging support, described wiring board and described sensitive chip are combined as a whole, wherein said
Optical lens are arranged at the photosensitive path of described sensitive chip, and wherein said sensitive chip is switched on even with described wiring board
Connect, wherein said cementing layer is arranged between described bearer bar and the outer circumferential side of photosensitive region of described sensitive chip, with mat
Connect the outer circumferential side of described bearer bar and described photosensitive region by described cementing layer.
2. camera module according to claim 1, the size of the inner side edge of wherein said bearer bar is more than or equal to institute
State the size of the photosensitive region of sensitive chip.
3. camera module according to claim 2, the outer side edges of wherein said bearer bar be smaller in size than or be equal to institute
State the size of sensitive chip.
4. camera module according to claim 1, wherein said bearer bar has elasticity.
5. camera module according to claim 1, wherein said integral packaging support is set the described guarantor of parcel further
The lateral surface of shield frame.
6., according to described camera module arbitrary in claim 1-5, further include a camera lens supporter, wherein said camera lens
Supporter is arranged at described integral packaging support, and described optical lens are arranged at described camera lens supporter.
7. camera module according to claim 6, wherein said camera lens supporter is with described integral packaging support integratedly
Formed.
8. camera module according to claim 6, wherein said camera lens supporter is a motor, and described motor and institute
State wiring board and be switched on and connect.
9., according to described camera module arbitrary in claim 1-5, further include a filter element, wherein said optical filtering unit
Part is arranged at the top of described integral packaging support, so that described filter element is located at described sensitive chip and described optical frames
Between head.
10. camera module according to claim 6, further includes a filter element, and wherein said filter element is set
Be placed in the top of described integral packaging support so that described filter element be located at described sensitive chip and described optical lens it
Between.
11. 1 camera modules are it is characterised in that include：At least one wiring board；
At least one optical lens；
At least one bearer bar；
At least one sensitive chip；
At least one filter element, wherein said filter element is overlappingly arranged at described sensitive chip, and described bearer bar is set
It is placed in the outer circumferential side of described filter element；And
At least one one package support, wherein said integral packaging support is set the outer circumferential side coating described filter element and institute
State wiring board, so that described integral packaging support, described filter element, described sensitive chip and described wiring board are combined into one
Body, wherein said optical lens are arranged at the photosensitive path of described sensitive chip, and described sensitive chip is led with described wiring board
Lead to and connect.
12. camera modules according to claim 11, the size of the inner side edge of wherein said bearer bar is more than or equal to
The size of the photosensitive region of described sensitive chip, so that described bearer bar will not block the photosensitive region of described sensitive chip.
13. camera modules according to claim 12, wherein said bearer bar has elasticity.
14. camera modules according to claim 13, further include a cementing layer, and wherein said cementing layer is arranged at
Between described bearer bar and described filter element, to connect the outer of described bearer bar and described filter element by described cementing layer
The week side of boss.
15. are set further according to described camera module arbitrary in claim 11-14, wherein said integral packaging support
Wrap up the lateral surface of described bearer bar.
16. according to described camera module arbitrary in claim 11-14, further includes a camera lens supporter, wherein said
Camera lens supporter is arranged at described integral packaging support, and described optical lens are arranged at described camera lens supporter.
17. camera modules according to claim 15, further include a camera lens supporter, wherein said camera lens supporter
It is arranged at described integral packaging support, described optical lens are arranged at described camera lens supporter.
18. camera modules according to claim 17, wherein said camera lens supporter and described integral packaging support one
Ground is formed.
Priority Applications (35)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620373323.XU CN205961266U (en) | 2016-04-28 | 2016-04-28 | Pick -up module |
| US16/088,435 US11289521B2 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| EP23176877.1A EP4231653A3 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| PCT/CN2016/103247 WO2017166798A1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| JP2018550699A JP7025345B2 (en) | 2016-03-28 | 2016-10-25 | Camera modules and molded photosensitive assemblies and their manufacturing methods, and electronic devices |
| KR1020187031125A KR102152516B1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly, manufacturing method thereof, and electronic device |
| EP16896568.9A EP3468165B1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| KR1020217005352A KR102360319B1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| EP17765753.3A EP3429183A4 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| KR1020187029304A KR20180132684A (en) | 2016-03-12 | 2017-03-09 | Camera module, its photosensitive part and method of manufacturing the same |
| JP2018548099A JP7071926B2 (en) | 2016-03-12 | 2017-03-09 | Camera module and its photosensitive parts and their manufacturing method |
| US16/082,533 US20190148429A1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| KR1020217005344A KR102294537B1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| PCT/CN2017/076041 WO2017157211A1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW106108217A TWI754632B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135671A TWI769403B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135674D TWI758645B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135672A TWI742441B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135670D TWI758644B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135670A TW202017356A (en) | 2016-03-12 | 2017-03-13 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW106203507U TWM559558U (en) | 2016-03-12 | 2017-03-13 | Camera module and light-sensing component |
| TW108135674A TW202019155A (en) | 2016-03-12 | 2017-03-13 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW108117229A TWI706213B (en) | 2016-03-28 | 2017-03-25 | Camera module and its molded photosensitive component |
| TW106110048A TWI661258B (en) | 2016-03-28 | 2017-03-25 | Camera module and its molded photosensitive component |
| TW108117228A TWI706212B (en) | 2016-03-28 | 2017-03-25 | Camera module and manufacturing method of moulded photosensitive component |
| TW106204228U TWM555960U (en) | 2016-03-28 | 2017-03-26 | Photographing module and its molded photosensitive component and electronic equipment |
| KR1020187034256A KR102147896B1 (en) | 2016-04-28 | 2017-04-26 | Photographic module and molding photosensitive assembly thereof, semi-finished product of molding photosensitive assembly and manufacturing method and electronic device |
| EP17788772.6A EP3481046A4 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| PCT/CN2017/082000 WO2017186120A2 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| JP2018556877A JP6865232B2 (en) | 2016-04-28 | 2017-04-26 | Imaging modules, their molding photosensitive assemblies, semi-finished products of molding photosensitive assemblies, their manufacturing methods, and electronic devices. |
| KR1020207019834A KR102281383B1 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| KR1020217022035A KR20210091363A (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| JP2021060338A JP7344924B2 (en) | 2016-04-28 | 2021-03-31 | Imaging module manufacturing method |
| US17/678,347 US11824071B2 (en) | 2016-03-28 | 2022-02-23 | Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device |
| US17/847,569 US12021097B2 (en) | 2016-03-12 | 2022-06-23 | Camera module, and photosensitive component thereof and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620373323.XU CN205961266U (en) | 2016-04-28 | 2016-04-28 | Pick -up module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205961266U true CN205961266U (en) | 2017-02-15 |
Family
ID=57967300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620373323.XU Withdrawn - After Issue CN205961266U (en) | 2016-03-12 | 2016-04-28 | Pick -up module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205961266U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017157211A1 (en) * | 2016-03-12 | 2017-09-21 | 宁波舜宇光电信息有限公司 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| CN107580170A (en) * | 2017-11-02 | 2018-01-12 | 信利光电股份有限公司 | A kind of camera module and its method for packing |
| CN108807430A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its combined type photosensory assembly |
| TWI728764B (en) * | 2019-04-02 | 2021-05-21 | 大陸商寧波舜宇光電信息有限公司 | Photographic module, resistive photosensitive component, manufacturing method thereof and electronic equipment |
-
2016
- 2016-04-28 CN CN201620373323.XU patent/CN205961266U/en not_active Withdrawn - After Issue
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017157211A1 (en) * | 2016-03-12 | 2017-09-21 | 宁波舜宇光电信息有限公司 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| US12021097B2 (en) | 2016-03-12 | 2024-06-25 | Ningbo Sunny Opotech Co., Ltd. | Camera module, and photosensitive component thereof and manufacturing method therefor |
| CN108807430A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its combined type photosensory assembly |
| CN107580170A (en) * | 2017-11-02 | 2018-01-12 | 信利光电股份有限公司 | A kind of camera module and its method for packing |
| CN107580170B (en) * | 2017-11-02 | 2020-11-13 | 信利光电股份有限公司 | Camera module and packaging method thereof |
| TWI728764B (en) * | 2019-04-02 | 2021-05-21 | 大陸商寧波舜宇光電信息有限公司 | Photographic module, resistive photosensitive component, manufacturing method thereof and electronic equipment |
| US11871100B2 (en) | 2019-04-02 | 2024-01-09 | Ningbo Sunny Opotech Co., Ltd. | Camera module and blocking-type photosensitive assembly, manufacturing method thereof, and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205883378U (en) | Photosensitive assembly of module makes a video recording | |
| CN105827916A (en) | Image picking up module and manufacturing method thereof | |
| CN205961266U (en) | Pick -up module | |
| US10958816B2 (en) | Camera module and manufacturing method thereof | |
| CN208572211U (en) | Camera module and its molding photosensory assembly and electronic equipment | |
| CN206210795U (en) | Camera module and its molding photosensory assembly and electronic equipment | |
| JP7071926B2 (en) | Camera module and its photosensitive parts and their manufacturing method | |
| US10827103B2 (en) | Fixed-focus camera module and manufacturing method therefor | |
| CN205959984U (en) | Module of making a video recording and photosensitive assembly and electronic equipment are moulded to mould thereof | |
| CN206422826U (en) | Array camera module and its molding photosensory assembly and the electronic equipment with array camera module | |
| CN113485054B (en) | Camera module for reducing stray light and photosensitive assembly thereof | |
| JP6829259B2 (en) | Integrated packaging process-based camera module, its integrated base parts, and how to manufacture them | |
| CN207764526U (en) | Camera module and its photosensory assembly and electronic equipment | |
| CN115134490A (en) | Sinking type camera module, sinking type photosensitive assembly and manufacturing method thereof | |
| TWI706180B (en) | Camera module for reducing stray light, photosensitive component thereof and electronic device | |
| CN113823653B (en) | Photosensitive assembly and camera module | |
| CN107734216A (en) | Array camera module and its molding photosensory assembly and manufacture method and the electronic equipment with array camera module | |
| CN107734215A (en) | Camera module and its molding photosensory assembly and manufacture method and electronic equipment | |
| CN209982562U (en) | Photosensitive assembly, camera module and electronic equipment with camera module | |
| CN208581278U (en) | Camera module and its filtering assembly, circuit board assemblies and filtering assembly semi-finished product | |
| CN206313866U (en) | Array camera module and its molding photosensory assembly and the electronic equipment with array camera module | |
| CN206674061U (en) | Wiring board and molding photosensory assembly and camera module and electronic equipment | |
| CN209692889U (en) | Camera module | |
| CN107547777A (en) | Focus camera module and its manufacture method | |
| CN209299381U (en) | A kind of camera module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170215 Effective date of abandoning: 20200724 |