CN205883378U - Photosensitive assembly of module makes a video recording - Google Patents
Photosensitive assembly of module makes a video recording Download PDFInfo
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- CN205883378U CN205883378U CN201620246631.6U CN201620246631U CN205883378U CN 205883378 U CN205883378 U CN 205883378U CN 201620246631 U CN201620246631 U CN 201620246631U CN 205883378 U CN205883378 U CN 205883378U
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- camera module
- sensitive chip
- wiring board
- integral packaging
- packaging support
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Abstract
The utility model provides a photosensitive assembly of module makes a video recording, wherein photosensitive assembly of module makes a video recording includes circuit board, separation component, feels optical chip and integrative packaging support. The separation component set up in feel the periphery in optical chip's sense light zone territory and incline, in order to prevent in the integrative packaging support forming process forming die with it damages to feel the optical chip contact feel optical chip and prevent that flow stopping body material flows extremely feel optical chip's sense light zone territory.
Description
Technical field
This utility model relates to field of photography, particularly to a camera module and photosensory assembly thereof.
Background technology
The camera module of prior art is will to be packaged after being respectively prepared by each element again.Specifically, existing
The camera module of technology includes a wiring board, a sensitive chip, a support, one group of capacitance resistance ware, an optical lens, wherein this line
After road plate, this sensitive chip, this support, this capacitance resistance ware and this optical lens are made into respectively, by this sensitive chip, this capacitance-resistance
Device and this support are mounted on the homonymy of this wiring board the most at intervals, and wherein this sensitive chip is by the technique beating gold thread
Being turned on this wiring board at the edge of this sensitive chip, this optical lens is arranged on the photosensitive path of this sensitive chip.Existing
There is the horizontal direction of this camera module of technology, between this capacitance resistance ware and this gold thread and this capacitance resistance ware and this support all
Need reserved safe distance, in the short transverse of this camera module of prior art, need between this capacitance resistance ware and this support
Safe distance to be reserved, this way of this camera module of prior art, cause height dimension and the length and width of this camera module
Size is the biggest, thus causes the size of this camera module cannot meet the lightening Developing Tendency of electronic equipment in recent years
Gesture.
In order to solve this problem, camera module based on MOC (Molding On Chip) packaging technology is developed, its
This support is formed after this sensitive chip and this capacitance resistance ware are mounted on this wiring board respectively, so that this support, this sense
Optical chip, this capacitance resistance ware and this wiring board are joined integrally, owing to need not reserved peace between this support and this capacitance resistance ware
Full distance such that it is able to reduce height dimension and the length and width size of this camera module, it addition, this camera module uses this photosensitive core
Sheet, this capacitance resistance ware, this wiring board and this support mode joined integrally can strengthen this take the photograph by strengthening this wiring board
Intensity as module.Specifically, after this sensitive chip and this capacitance resistance ware are mounted on this wiring board respectively, by this circuit
Plate is placed in mould, and now, the upper part of mould directly applies pressure to the edge of this sensitive chip, with by this sensitive chip
Non-photo-sensing region and photosensitive region isolation, by injection molding material in this mould so that this moulding material consolidation
The non-photo-sensing region of whole and this sensitive chip of rear this capacitance resistance ware of parcel so that this sensitive chip, this capacitance resistance ware, should
Wiring board and this support are joined integrally.This manufacture process of this camera module and structure also exist some problems.
First, under normal conditions, in order to improve the photoperceptivity of this sensitive chip, in each pixel of this sensitive chip
Point is designed with the lenticule of a micron level, and as a example by a sensitive chip with 13,000,000 pixels, it is provided with 1300
Ten thousand these lenticulees mate one by one with each pixel, and the matching relationship of this lenticule and pixel includes size, position and knot
Coupling on structure.Owing to this lenticule is the lens of micron level, cause this lenticule the most destroyed, especially in this molding
Under high-temperature high-pressure state in mould, to this lenticular destruction also main damage at lenticule itself, deform or shift
Etc., once any one this lenticule of this sensitive chip is damaged, necessarily affect the image quality of this camera module.
Secondly as this sensitive chip, this wiring board and the existence one when this sensitive chip being mounted on this wiring board
Fixed tolerance, thus inclination can be there is after this sensitive chip is mounted on this wiring board, when this mould applies pressure to this
During the outward flange of sensitive chip, gap can be there is between this mould and outward flange of this sensitive chip, when this shaping material
Material is received in this mould and is formed and this wiring board, this sensitive chip and this capacitance resistance ware one knot by this moulding material
During this support closed, this moulding material can be flowed out by the gap being formed between this mould and this sensitive chip, flows out
This moulding material can form the situation of " overlap " at the edge of this support and block the photosensitive path of this sensitive chip, to such an extent as to
Affect the image quality of this camera module.It addition, this moulding material by be formed at this mould and this sensitive chip it
Between gap flow out time be fluid state, its temperature is higher, and once this moulding material flow to the photosensitive area of this sensitive chip
Territory, then this moulding material of high temperature will necessarily damage the photosensitive region of this sensitive chip and be arranged on the photosensitive of this sensitive chip
The lenticule in region.
Summary of the invention
A purpose of the present utility model is to provide a camera module and photosensory assembly thereof, wherein said camera module bag
Including at least one sensitive chip, at least one barrier element, a wiring board and an one package support, described barrier element is set
In the outer circumferential side of the photosensitive region of each described sensitive chip, wherein said integral packaging support wraps up described circuit after shaping
The non-photo-sensing region of plate and described sensitive chip, to stop for forming described integral packaging support by described barrier element
Moulding material flows to the photosensitive region of described sensitive chip during described integral packaging rack forming.
A purpose of the present utility model is to provide a camera module and photosensory assembly thereof, and wherein said barrier element is dashed forward
For described sensitive chip, so that the basal surface of the mould upstream of mould contacts with described barrier element, in other words, described
Barrier element can provide cushioning effect and stop the bottom surface of mould upstream of described mould direct with described sensitive chip
Contact, to protect the photosensitive region of described sensitive chip not damaged when pressure by the mould upstream of described mould.
A purpose of the present utility model is to provide a camera module and photosensory assembly thereof, wherein said barrier element energy
Enough stop the described moulding material non-photo-sensing field flow orientation photosensitive region from described sensitive chip, prop up at described integral packaging and put up
After type, barrier element described in integral packaging support is it can be avoided that described integral packaging support is in the side towards described sensitive chip
The situation of " overlap " occurs, to improve the product yield of described camera module.
An integral packaging support integral packaging support purpose of the present utility model is to provide a camera module and sense thereof
Optical assembly, wherein said barrier element can also have elasticity, so that described barrier element can be according to being formed at described molding
Gap between mould upstream and the described sensitive chip of mould is deformed, thus isolates described sense by described barrier element
The photosensitive region of optical chip and external environment condition, and then during described moulding material forms described integral packaging support, institute
State moulding material and will not enter described photosensitive with the gap of described sensitive chip from the mould upstream being formed at described mould
The photosensitive region of chip, to ensure the described camera module reliability when being manufactured.
A purpose of the present utility model is to provide a camera module and photosensory assembly thereof, and wherein said barrier element has
Toughness, for adhering to the pollutant such as such as dust, thus by reducing the dirty bad point of the photosensitive region of described sensitive chip
And improve the image quality of described camera module.
A purpose of the present utility model is to provide a camera module and photosensory assembly thereof, wherein said camera module bag
Include at least one filter element, described barrier element is arranged at described filter element, and wherein said integral packaging support is after shaping
Wrap up described wiring board and the perimeter of described filter element, so that described integral packaging support, described filter element, described
Sensitive chip and described wiring board are joined integrally, and described barrier element prevents moulding material from entering the interior of described filter element
Effective working region in portion, and prevent it damaged when molding.
A purpose of the present utility model is to provide a camera module and photosensory assembly thereof, wherein said mould
Mould upstream surface is provided with at least one coverlay, and when the mould upstream of described mould presses, described coverlay can also
Described sensitive chip is provided protection further, it is also possible to increase demoulding difficulty and increase sealing, preventing " overlap ".
An integral packaging support purpose of the present utility model is to provide a camera module and photosensory assembly thereof, Qi Zhongsuo
The photosensitive region stating the corresponding described sensitive chip of mould with recessed meter, thus can reduce described photosensitive core further
The impact of sheet.
According to this utility model, it is possible to realize the photosensory assembly of the camera module of above-mentioned purpose and advantage and other advantages,
Including:
At least one wiring board；
At least one barrier element；
At least one sensitive chip, wherein said barrier element is by protruding the photosensitive region being arranged at described sensitive chip
Outer circumferential side；And
At least one one package support, it is coated on the non-photo-sensing district of described wiring board and described sensitive chip integratedly
Territory, described integral packaging support, described sensitive chip and described wiring board be combined as a whole, described sensitive chip and described circuit
Plate conducting connects.
In one embodiment, it farther includes a camera lens supporter, and the most each described camera lens supporter is set
In described integral packaging support, at least one optical lens of described camera module is arranged at described camera lens supporter.
In one embodiment, its described integral packaging support extends to form described camera lens supporter integratedly.
In one embodiment, it farther includes at least one motor, and described motor is arranged at described integral packaging and props up
Frame and with described wiring board conducting be connected, described optical lens is arranged at described motor.
In one embodiment, it farther includes at least one filter element, and described filter element is arranged at described one
The top of body package support.
In one embodiment, it farther includes one group of capacitance resistance ware, and described capacitance resistance ware is mounted on described respectively
Wiring board, described integral packaging support wraps up described capacitance resistance ware.
In one embodiment, its described barrier element is formed by glue curing.
In one embodiment, the glue forming described barrier element has viscosity the most further, thus
It is used for the dust adhered within described camera module.Certainly, in other embodiments, described glue can also not have
Toughness, this utility model is not so limited, and the most described glue the most also has viscosity.
In one embodiment, the described barrier element wherein formed after glue curing has elasticity
In one embodiment, its described integral packaging support is coated on the outer peripheral face of described barrier element.
According to still further aspect of the present utility model, this utility model provides the photosensory assembly of a camera module, comprising:
At least one wiring board；
At least one barrier element；
At least one sensitive chip；
At least one filter element, wherein said filter element is overlapped in described sensitive chip, wherein said barrier element
It is arranged at the outward flange of described filter element；And
One one package support, wherein said integral packaging support wraps up the perimeter of described filter element and described line
Road plate, with after described integral packaging rack forming, described integral packaging support, described filter element, described sensitive chip and
Described wiring board is joined integrally, and described sensitive chip is connected with the conducting of described wiring board.
According to still further aspect of the present utility model, this utility model also provides for the manufacture method of a camera module, wherein
Described manufacture method comprises the steps:
A at least one sensitive chip is connected by () with at least one wiring board conducting；
B described wiring board and described sensitive chip are positioned over a molding tool by ()；
C () provides a barrier element between the basal surface and described sensitive chip of the mould upstream of described mould,
Wherein said barrier element is positioned at the outer circumferential side of the photosensitive region of described sensitive chip；
D () wraps up described wiring board and the non-sense of described sensitive chip by the moulding material being added into described mould
Light region, to form an one envelope joined integrally with described sensitive chip and described wiring board after described moulding material solidifies
Dress support；And
E () provides at least one optical lens, wherein said optical lens is arranged at the photosensitive path of described sensitive chip,
To manufacture described camera module.
In one embodiment, the region at the corresponding described sensitive chip of mould upstream of described mould is provided with one
Inner groovy.
In one embodiment, the basal surface at the mould upstream of described mould arranges a coverlay.
In one embodiment, in described step (d), described moulding material is coated with described wiring board.
In one embodiment, the non-photo-sensing region of the described sensitive chip outside described barrier element, and described resistance
Outer peripheral face every element.
In one embodiment, in the above-mentioned methods, along the outward flange applying glue of described sensitive chip, with in glue curing
After form described barrier element at the outward flange of described sensitive chip.
In one embodiment, described applying glue step uses picture glue or glue spraying.
In one embodiment, described integral packaging support uses injection or mould pressing process to make.
In one embodiment, described glue passes through heat cure or UV illumination curing.
In one embodiment, described camera module is to focus camera module or zoom camera module.
According to still further aspect of the present utility model, this utility model provides the manufacture method of a camera module, Qi Zhongsuo
State manufacture method to comprise the steps:
(A) at least one sensitive chip is connected with at least one wiring board conducting；
(B) filter element is superimposed on described sensitive chip；
(C) described wiring board, described sensitive chip and described filter element are positioned over a molding tool；
(D) between basal surface and the described optical filter of the mould upstream of described mould, a barrier element is provided, its
Described in barrier element be positioned at the outward flange of described optical filter；
(E) described wiring board and the outside of described filter element are wrapped up by the moulding material being added into described mould
Edge, joined integrally with described filter element, described sensitive chip and described wiring board to be formed after described moulding material solidifies
One one package support；And
(F) providing at least one optical lens, wherein said optical lens is arranged at the photosensitive path of described sensitive chip,
To manufacture described camera module.
Accompanying drawing explanation
Fig. 1 is the camera module according to a preferred embodiment of the present utility model by the internal junction after cutting open along centre position
Structure schematic diagram.
Fig. 2 is the camera module according to another preferred embodiment of the present utility model by the inside after cutting open along centre position
Structural representation.
Fig. 3 is the Fig. 2 close-up schematic view at S location.
Fig. 4 be after the camera module according to another preferred embodiment of the present utility model is cut open along centre position in
Portion's structural representation.
Fig. 5 is the Fig. 3 close-up schematic view in S ' position.
Fig. 6 is the signal of the step one of a manufacture process of the camera module according to above preferred embodiment of the present utility model
Figure.
Fig. 7 is showing of the step 2 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
It is intended to.
Fig. 8 is showing of the step 3 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
It is intended to.
Fig. 9 is showing of the step one of another manufacture process of the camera module according to above preferred embodiment of the present utility model
It is intended to.
Figure 10 is the step 2 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Schematic diagram.
Figure 11 is the step 3 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Schematic diagram.
Figure 12 is the step one of another manufacture process of the camera module according to above preferred embodiment of the present utility model
Schematic diagram.
Figure 13 is the step 2 of the above-mentioned manufacture process of the camera module according to above preferred embodiment of the present utility model
Schematic diagram.
Figure 14 is that another of the manufacture process of the camera module according to above preferred embodiment of the present utility model is preferable to carry out
The structural representation of example.
Detailed description of the invention
Hereinafter describe and be used for disclosing this utility model so that those skilled in the art are capable of this utility model.Hereinafter retouch
Preferred embodiment in stating is only used as citing, it may occur to persons skilled in the art that other obvious modification.Retouch following
The ultimate principle of the present utility model defined in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang
Case and the other technologies scheme without departing from spirit and scope of the present utility model.
With reference to Fig. 1 to Fig. 2 of accompanying drawing, this utility model relates to manufacture method and a camera module of a camera module, its
Described in camera module be available for being configured in an electronic equipment, for gather described electronic equipment surrounding image or
The data such as person's image.
It is noted that the type of described electronic equipment is unrestricted, the most described electronic equipment can be such as intelligence
Can the consumer electronic device such as mobile phone, panel computer, media player, notebook computer, personal digital assistant, remote controller or all
The electronic equipment of array camera module as described in the medical electronic apparatuses such as endoscope or other field any can be configured.
In the description of the structure about described camera module of the present utility model and the manufacture method of described camera module
The term " one " used should be understood " at least one " or " one or more ", the most in one embodiment, an element
Quantity can be one, and in a further embodiment, the quantity of this element can be multiple, and therefore, term " one " can not manage
Solve as logarithm quantitative limitation.
Similarly, in structure and the manufacture of described camera module disclosing and illustrating described camera module of the present utility model
The term of any directivity used during method, such as " longitudinally ", " laterally ", " on ", D score, "front", "rear", " left ",
Orientation or the position relationship of the instruction such as " right ", " vertically ", " level ", " top ", " end " " interior ", " outward " are based on side shown in the drawings
Position or position relationship, it is for only for ease of and describes this utility model and simplify description rather than instruction or the dress of hint indication
Put or element must have specific orientation, with specific azimuth configuration and operation, the most above-mentioned term is it is not intended that to this
The restriction of utility model.
Figure 1 illustrates described camera module of the present utility model and may be implemented as focusing the example of module, wherein
Described camera module includes at least one optical lens 10 and a photosensory assembly, and it includes at least one sensitive chip 20, at least
Barrier element 30, one wiring board 40 and an one package support 50, the conducting of described sensitive chip 20 is connected to described wiring board
40, described barrier element 30 is arranged at the outer circumferential side of the photosensitive region of described sensitive chip 20, it is to be understood that it is ring
Shape, and it is positioned at the non-photo-sensing region of described sensitive chip, described integral packaging support 50 wraps up described wiring board 40 and each institute
Stating the non-photo-sensing region of sensitive chip 20 and the outer peripheral face 301 of described barrier element 30, wherein said optical lens 10 is set
It is placed in the photosensitive path of described sensitive chip 20.The light being reflected by the object enters described camera module from described optical lens 10
Inside, to generate the image relevant to object follow-up received by described sensitive chip 20 with carrying out photoelectric conversion.
Ringwise, the most described barrier element 30 may be implemented as annular or square frame-shaped to described barrier element 30,
It is to say, the middle part of described barrier element 30 is hollow out, thus described barrier element 30 is avoided to block described sensitive chip
The photosensitive region of 20.
Although it is noted that showing that described camera module of the present utility model only includes described in one in FIG
Optical lens 10 and the example of a described sensitive chip 20, it will be appreciated by those skilled in the art that, this utility model
Described camera module can include two or more described optical lens 10 and two or more institute
State sensitive chip 20, so that described camera module forms an array camera module.Therefore, of the present utility model shown in Fig. 1
The description of a described camera module only illustrative, and described optical lens 10 the most of the present utility model and described sense
The quantity of optical chip 20 and type are not intended that the content to described camera module of the present utility model and the restriction of scope.
It addition, the described sensitive chip 20 of the of the present utility model described camera module that figure 1 illustrates is to be mounted on institute
State wiring board 40, then make each described sensitive chip 20 and described wiring board by beating gold thread or the technique such as silver wire, copper cash
40 are conducted.While it is true, it will be appreciated by those skilled in the art that, described wiring board 40 can be provided with wiring board weldering
Dish, described sensitive chip 20 can be provided with chip bonding pad, so that the chip bonding pad of described sensitive chip 20 and described wiring board
Described sensitive chip 20 is mounted on described wiring board 40, meanwhile, described sensitive chip by the circuit pads of 40 correspondingly
20 are connected switched only with described wiring board 40.It addition, described sensitive chip 20 can also not be mounted on described circuit
Plate 40, and be only that described sensitive chip 20 is connected with described wiring board 40 with being conducted, so, described sensitive chip 20
Flatness can be not only restricted to the flatness of described wiring board 40, such as in this utility model, and putting down of described sensitive chip 20
Whole degree can ensure by described integral packaging support 50.
Further, described camera module includes at least one camera lens supporter 60, the most each described camera lens supporter 60
Laying respectively at the top of described integral packaging support 50, described optical lens 10 is arranged at described camera lens supporter 60, with mat
By described camera lens supporter 60, described optical lens 10 is maintained at the photosensitive path of described sensitive chip 20.It is worth mentioning
Be, one of described camera module of the present utility model preferred embodiment in, described camera lens supporter 60 can be with coverlet
Solely make, more described camera lens supporter 60 is mounted on described integral packaging support 50.Of the present utility model described
Camera module another preferred embodiment in, described integral packaging support 50 can extend to form described mirror integratedly
Head supporter 60.It is to say, what described camera lens supporter 60 and described integral packaging support 50 can be integrally formed, logical
Cross such mode, it is possible to eliminate and produce when the described camera lens supporter 60 independently formed is mounted on described integral packaging support 50
Raw error, thus tilt to improve the image quality of described camera module by reducing the encapsulation of described camera module.
Show that described camera module of the present utility model may be implemented as the example of zoom module in figs. 2 and 3,
It can be according to the specifically used focal length needing to change described camera module of user, to improve the environment of described camera module
Adaptation ability.Specifically, described camera module of the present utility model includes at least one motor, and it can be various similar driving
Dynamic device, as it can be a voice coil motor 70 in this embodiment, the most each described voice coil motor 70 is arranged at respectively
Described integral packaging support 50 and quilt can be conductively connected to described wiring board 40, and described optical lens 10 is driveably arranged
In described voice coil motor 70, to make described optical lens 10 be maintained at described sensitive chip 20 by described voice coil motor 70
On photosensitive path, and described voice coil motor 70 can drive described optical lens 10 along the photosensitive road of described sensitive chip 20
Footpath moves back and forth, to adjust the focal length of described camera module.
It will be appreciated by those skilled in the art that, the described voice coil motor 70 of described camera module of the present utility model
Can be conducted with described wiring board 40 in several ways and be connected.The most in one embodiment, described integral packaging support
50 can be buried lead-in wire by interior while molding, and wherein an end of this lead-in wire is connected to described wiring board 40, described lead-in wire
Another end form another end of a pad or described lead-in wire on the surface of described integral packaging support 50 even
It is connected to be located at the pad on the surface of described integral packaging support 50, when described voice coil motor 70 is mounted on described integral packaging
During support 50, the pad of described voice coil motor 70 turns on institute together with the pad solder on described integral packaging support 50 surface
State voice coil motor 70 and described wiring board 40.Such as in another one example, can be by described integral packaging support 50
The mode of electroplating surface conductive layer turn on described voice coil motor 70 and described wiring board 40.
Further, described camera module of the present utility model includes at least one filter element 80, described filter element 80
Being arranged between described optical lens 10 and described sensitive chip 20, the light being reflected by the object enters from described optical lens 10
After entering the inside of described camera module and being filtered by described filter element 80, then received by described sensitive chip 20 and carry out follow-up
Photoelectric conversion.Described filter element 80 can play the effect of noise reduction to improve the image quality that described shooting is not organized.
It is noted that the type of described filter element 80 is unrestricted, such as in described shooting of the present utility model
One of module preferred embodiment in, described filter element 80 may be implemented as cutoff filter, with by institute
State the infrared part that filter element 80 filters in light, and preferred at another of described camera module of the present utility model
In embodiment, described filter element 80 may be implemented as full impregnated spectral filter.
Described integral packaging support 50 forms at least one attachment platform for being mounted described filter element 80, as being
Mounting groove is formed on top, it is also possible to is that top is fitted without groove, and directly fits for described filter element 80.At this utility model
Described camera module when being implemented as described array camera module, the quantity of described filter element 80 may be implemented as one
Individual, thus each described optical lens 10 and each described sensitive chip 20 are set respectively corresponding to described filter element 80
Different parts.While it is true, the quantity of described filter element 80 of the present utility model be preferably and described sensitive chip 20 and
The quantity of described optical lens 10 is consistent, so that described filter element 80, described optical lens 10 and described sensitive chip 20
One_to_one corresponding.
Show another preferred embodiment of described camera module of the present utility model in figures 4 and 5, wherein said
Barrier element 30 is not provided at the outward flange of described sensitive chip 20.Specifically, real at this shown in Fig. 4 and Fig. 5
Executing in example, described sensitive chip 20 is connected with described wiring board 40 with being conducted, and described filter element 80 is arranged at overlappingly
Described sensitive chip 20, wherein said barrier element 30 is arranged at the outward flange of described filter element 80 with by described obstruct
Interior zone and the perimeter of described filter element 80 distinguished by element 30, and wherein said integral packaging support 50 wraps after shaping
Wrap up in described wiring board 40 and the perimeter of described filter element 80, so that described integral packaging support 50, described filter element
80, described sensitive chip 20 and described wiring board 40 are joined integrally.
By forming described integral packaging support 50 after described filter element 80 is overlapped in described sensitive chip 20 again
Mode, it is possible to avoid the moulding material for forming described integral packaging support 50 damage or pollute described sensitive chip 20
Photosensitive region, so that it is guaranteed that the reliability of described sensitive chip 20.
It is noted that described filter element 80 is defined corresponding to the position of the photosensitive region of described sensitive chip 20
For the interior zone of described filter element 80, described filter element 80 is corresponding to the portion in the non-photo-sensing region of described sensitive chip 20
Position is located in the perimeter of described filter element 80, be arranged at the described barrier element 30 of described filter element 80 for
Distinguish interior zone and the perimeter of described filter element 80.Described integral packaging after the molding of described integral packaging support 50
Support 50 is wrapped in the perimeter of described filter element 80, corresponding described photosensitive to prevent described integral packaging support 50 from blocking
The interior zone of the described filter element 80 that the photosensitive region of chip 20 is corresponding.It is understood that at described sensitive chip 20
With the photosensitive region outer circumferential side of described sensitive chip 20 can also apply glue further and formed between described filter element 80
Barrier structure.
It addition, by described filter element 80 and described sense in this embodiment of described camera module of the present utility model
Optical chip 20 directly overlaps, it is possible to reduce the back focal length of described camera module, by such mode, advantageously reduces
The height dimension of described camera module is so that described camera module is suitable to be applied to pursuing lightening electronic equipment.
It it is the schematic diagram of a manufacturing step of described camera module of the present utility model with reference to Fig. 6, Fig. 7 and Fig. 8.Figure
The 6 concrete examples showing the step that described camera module of the present utility model manufactured, wherein said photosensitive core
Sheet 20 is mounted on described wiring board 40, and described sensitive chip 20 is led with described wiring board 40 phase by the technique beating gold thread
Logical, described barrier element 30 is arranged at the outer circumferential side of the photosensitive region of described sensitive chip 20.
Selectively, in other concrete example of described camera module, described sensitive chip 20 and described wiring board
40 can be connected by mutual conduction by the way of pad solder, therefore, and turning on by the way of beating gold thread shown in Fig. 6
The mode of described sensitive chip 20 and described wiring board 40 is only a concrete example.
Furthermore it is possible to first described sensitive chip 20 is turned on described wiring board 40, the most again at described sensitive chip 20
On described barrier element 30 is set, it is also possible to first described barrier element 30 is set on described sensitive chip 20, the most again by institute
State sensitive chip 20 to be conducted with described wiring board 40 and be connected.
Such as in a concrete example of the present utility model, turn on described wiring board 40 at described sensitive chip 20
After connection, the outward flange at described sensitive chip 20 arranges glue by the way of drawing glue or glue spraying, and described glue is solid
Described barrier element 30 is formed after change.It is noted that owing to described glue is directed through the mode of picture glue or glue spraying
It is arranged on described sensitive chip 20, thus the described barrier element 30 formed after described glue curing protrudes from described sensitive chip
20.It will be appreciated by those skilled in the art that, at the outward flange of described sensitive chip 20 by drawing glue or the side of glue spraying
When formula arranges described glue, should ensure that described glue has certain height, also to prevent described glue from flowing to described sense
The photosensitive region of optical chip 20, to ensure that the photosensitive region of described sensitive chip 20 is not polluted by described glue.
Further, by the way of drawing glue or spraying, the outward flange of described sensitive chip 20 it is arranged at when this glue
Time, described glue curing can be made to be formed on described sensitive chip 20 by the way of baking or UV light (ultraviolet light) are irradiated
Described barrier element 30.While it is true, it will be appreciated by those skilled in the art that, described glue can also pass through other
Mode solidifies or solidifies under field conditions (factors), and therefore, the mode of baking or UV illumination can accelerate the solidification of described glue
Process, and it is not the unique conditional making described glue curing.It is noted that when glue can not have after curing
Viscosity, but in certain embodiments, it also can also have viscosity further, thus is used for adhering dust, thus reduces described
The stain stain of camera module is bad.
Fig. 7 shows the concrete example of another step in the manufacture process of described camera module of the present utility model,
Wherein said wiring board 40, described sensitive chip 20 and described barrier element 30 are placed in a molding tool, and pass through institute
State the mould upstream pressure of mould.It is understood that owing to described barrier element 30 protrudes from described sensitive chip 20,
Thus the mould upstream of described mould is merely able to contact with described barrier element 30 and avoid the mould of described mould
Top directly contacts with described sensitive chip 20, thus ensures that described sensitive chip 20 is not by the mould upstream of described mould
The pressure damage provided.
It is noted that there is elasticity by the described barrier element 30 formed after described glue curing, thus work as institute
When stating sensitive chip 20 and described wiring board 40 attachment existence inclination, it can be compensated by described barrier element 30.The most just
Being to say, described barrier element 30 can produce deformation, to isolate photosensitive region and the external environment condition of described sensitive chip 20, the most in fact
When existing opposing seal is to prevent molding, fluent material flows to the photosensitive region of described sensitive chip 20.
Fig. 8 shows the step that the described integral packaging support 50 in the manufacture process of described camera module is formed, wherein
Described moulding material is filled in described mould, as being injection or dusting be thermally formed fluent material, so
After formed after described integral packaging support 50 in consolidation by described moulding material, described integral packaging support 50 wraps up described
The non-photo-sensing region of wiring board 40 and described sensitive chip 20, so that described integral packaging support 50, described wiring board 40 and institute
State sensitive chip 20 joined integrally.
It will be appreciated that described integral packaging support 50 can also wrap up the outer peripheral face 301 of described barrier element 30, so that
Described integral packaging support 50, described wiring board 40, described barrier element 30 and described sensitive chip 20 are joined integrally.
It is understood that owing to described barrier element 30 isolates photosensitive region and the external rings of described sensitive chip 20
Border, the described moulding material being added in described mould will not flow to the photosensitive region of described sensitive chip 20.It addition,
Due to the stop of described barrier element 30, will not be from described sense for forming the described moulding material of described integral packaging support 50
The non-photo-sensing field flow orientation photosensitive region of optical chip 20, to avoid at described integral packaging support 50 towards described sensitive chip 20
Photosensitive region side occur " overlap " situation, with ensure described camera module image quality and improve described shooting mould
The product yield of group.
It is noted that described integral packaging support 50, described wiring board 40 and described sensitive chip 20 are joined integrally,
Thus described integral packaging support 50 can increase the intensity of described wiring board 40.It addition, the flatness of described sensitive chip 20
It is no longer limited by the flatness of described wiring board 40, but keeps described sensitive chip 20 by described integral packaging support 50
Flatness, thus described wiring board 40 can select the flexible circuit board that thickness is thinner, by such mode, it is possible to enter
One step reduces the height of described camera module, so that described camera module is applicable to lightening described electronic equipment.
It is noted that described camera module of the present utility model farther includes one group of capacitance resistance ware 90, Qi Zhongsuo
Stating capacitance resistance ware 90 and be mounted on described wiring board 40, described moulding material automatically flows into and fills adjacent described capacitance resistance ware
Between 90, so that the described integral packaging support 50 that described moulding material is formed after consolidation wraps up described capacitance resistance ware 90, logical
Crossing such mode, described integral packaging support 50 can not only isolate described capacitance resistance ware 90 and described sensitive chip 20, energy
Enough described integral packaging supports 50 spatially can be overlapped with described capacitance resistance ware 90, thus takes the photograph described in advantageously reducing
Height dimension and length and width size as module.
Described moulding material is insulant, and the most described moulding material can be resin or plastic cement, these material shapes
The described integral packaging support 50 become not only has good intensity and insulating properties, and described integral packaging support 50 also has
Good heat-sinking capability, so that the heat that described sensitive chip 20 operationally produces is conducted, those skilled in the art
It is understood that this characteristic of described integral packaging support 50 is for being implemented as the described shooting mould of array camera module
The raising of the performance of group is the most effective.
It is noted that the described barrier element 30 formed by described glue can also have viscosity in solidification, from
And for being bonded in the pollutant such as dust that described camera module produced during manufacturing, to stop the pollutant such as dust dirty
Contaminate the photosensitive region of described sensitive chip 20, thus the situations such as dirty bad point are improved described by preventing described camera module from occurring
The image quality of camera module.
Follow-up, described optical lens 10 is arranged on the photosensitive path of described sensitive chip 20, to make described shooting
Module.When described camera module is used, the light being reflected by the object enters described camera module from described optical lens 10
Received by described sensitive chip 20 and carry out photoelectric conversion after being filtered by described filter element 80, relevant to object to generate
Image.
In a concrete example of described camera module of the present utility model, described optical lens 10 is by being set
It is maintained in described integral packaging support 50 or described camera lens supporter 60 integrated with described integral packaging support 50
The photosensitive path of described sensitive chip 20.In another concrete example of described camera module of the present utility model, described
Optical lens 10 is maintained at described sensitive chip 20 by being arranged at the described voice coil motor 70 of described integral packaging support 50
Photosensitive path.
It it is the signal of another manufacturing step of described camera module of the present utility model with reference to Fig. 9, Figure 10 and Figure 11
Figure.Fig. 9 shows a concrete example of the step that described camera module manufactured, and wherein said sensitive chip 20 is pasted
Being loaded on and be conducted with described wiring board 40 and be connected, described filter element 80 is arranged at described sensitive chip 20 overlappingly, with
The interior zone making described filter element 80 corresponds to the photosensitive region of described sensitive chip 20 and makes described filter element 80
Perimeter is corresponding to the non-photo-sensing region of described sensitive chip 20.By drawing glue or glue spraying on described filter element 80
Mode arranges glue to form described barrier element 30 after this glue consolidates.
Figure 10 shows a concrete example of another step of the manufacture process of described camera module, wherein said line
Road plate 40, described sensitive chip 20, described filter element 80 and described barrier element 30 are placed in described mould, and
And pressed by the described mould upstream of described mould.It is understood that owing to described barrier element 30 protrudes from institute
State filter element 80, thus the mould upstream of described mould is merely able to contact with described barrier element 30 and avoid described one-tenth
The mould upstream of mould contacts with described filter element 80, thus ensures that described filter element 80 is not by described mould
The pressure damage that mould upstream provides.
It is noted that by the described barrier element 30 formed after glue curing, there is elasticity, thus when described sense
When optical chip 20 and described wiring board 40 attachment exist to tilt, it can be compensated by described barrier element 30.It is to say,
Described barrier element 30 isolates interior zone and the miscellaneous part of described filter element 80, thus prevents fluid moulding material from flowing to
The interior zone of described filter element 80.
Figure 11 shows the step formed by the described integral packaging support 50 in manufacture process of described camera module, its
Middle described moulding material is joined in mould, prop up forming described integral packaging after consolidation by described moulding material
After frame 50, described integral packaging support 50 wraps up described wiring board 40 and the perimeter of described filter element 80, so that institute
State integral packaging support 50, described filter element 80, described sensitive chip 20 and described wiring board 40 joined integrally.
It is understood that owing to described barrier element 30 isolates interior zone and the outside area of described filter element 80
Territory, the described moulding material being added in described mould will not flow to the interior zone of described filter element 80, to keep away
Exempt from described integral packaging support 50 towards the interior zone of described filter element 80 side occur " overlap " situation, with protect
Demonstrate,prove the image quality of described camera module and improve the product yield of described camera module.
Follow-up, described optical lens 10 is arranged on the photosensitive path of described sensitive chip 20, to make described shooting
Module.When described camera module is used, the light being reflected by the object enters described camera module from described optical lens 10
Received by described sensitive chip 20 and carry out photoelectric conversion after being filtered by described filter element 80, relevant to object to generate
Image.
Figure 12 and Figure 13 is the schematic diagram of another manufacturing step of the present utility model.Figure 12 shows described camera module
Sensitive chip 20 be conducted with described wiring board 40, described barrier element 30 is arranged at described sensitive chip 20 to distinguish institute
State photosensitive region and the non-photo-sensing region of sensitive chip 20.When described wiring board 40, described sensitive chip 20 and described obstruct unit
After part 30 is placed on described mould, it is located at a coverlay 100 of the basal surface of the mould upstream of described mould
Interact with described barrier element 30.It is to say, described coverlay 100 contacts to avoid described with described barrier element 30
The mould upstream of mould directly presses described sensitive chip 20.
Although it is noted that figure 12 illustrates described sensitive chip 20 of the present utility model described resistance is set
Every element 30 and by described barrier element 30 and the example of described coverlay 100 interaction, the i.e. upper mold of mould 110
Mold pressing surface described coverlay 100 is set, on the one hand increase demoulding difficulty, on the other hand can be via described coverlay 100 He
Engaging and cushioning effect of described barrier element 30, strengthens sealing.
Figure 13 shows the step after described integral packaging support 50 formation in the manufacture process of described camera module, its
Middle described moulding material is joined in described mould, to form described one envelope after consolidation by described mould
Dress support 50, wherein said integral packaging support 50 wrap up described wiring board 40 and described sensitive chip 20 non-photo-sensing region and
The outer peripheral face of described barrier element 30, so that described integral packaging support 50, described sensitive chip 20 and described wiring board 40 1
Body combines.
Follow-up, described optical lens 10 is arranged on the photosensitive path of described sensitive chip 20, to make described shooting
Module.When described camera module is used, the light being reflected by the object enters described camera module from described optical lens 10
Received by described sensitive chip 20 and carry out photoelectric conversion after being filtered by described filter element 80, relevant to object to generate
Image.
As shown in Figure 14, described mould 110 forms inner groovy at the photosensitive region of corresponding described sensitive chip 20
111, so that the basal surface of described sensitive chip 20 and described mould 110 has safety clearance, thus drop further
The low impact on described sensitive chip 20, prevents it from damaging and scratches.It is understood that this programme can also be retouched further
Stating the scheme in the embodiment of Figure 12 and 13, i.e. described in this embodiment, mould basal surface can also be arranged further
There is described coverlay 100.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as
Illustrate and be not limiting as this utility model.The purpose of this utility model is completely and be effectively realized.Merit of the present utility model
Can and structural principle show the most in an embodiment and illustrate, without departing under described principle, embodiment of the present utility model
Can there be any deformation or amendment.
Claims (14)
1. the photosensory assembly of a camera module, it is characterised in that including:
At least one wiring board；
At least one barrier element；
At least one sensitive chip, wherein said barrier element is by the periphery of protruding the photosensitive region being arranged at described sensitive chip
Side；And
At least one one package support, it is coated on the non-photo-sensing region of described wiring board and described sensitive chip, institute integratedly
Stating integral packaging support, described sensitive chip and described wiring board to be combined as a whole, described sensitive chip is led with described wiring board
Lead to connect.
The photosensory assembly of camera module the most according to claim 1, farther includes a camera lens supporter, the most each institute
Stating camera lens supporter and be arranged at described integral packaging support, at least one optical lens of described camera module is arranged at described
Camera lens supporter.
The photosensory assembly of camera module the most according to claim 2, wherein said integral packaging support extend integratedly with
Form described camera lens supporter.
The photosensory assembly of camera module the most according to claim 1, farther includes at least one motor, and described motor is set
Being placed in described integral packaging support and be connected with the conducting of described wiring board, described optical lens is arranged at described motor.
5., according to the photosensory assembly of described camera module arbitrary in Claims 1-4, farther include at least one optical filtering unit
Part, described filter element is arranged at the top of described integral packaging support.
6., according to the photosensory assembly of described camera module arbitrary in Claims 1-4, farther include one group of capacitance resistance ware,
Described capacitance resistance ware is mounted on described wiring board respectively, and described integral packaging support wraps up described capacitance resistance ware.
7., according to the photosensory assembly of described camera module arbitrary in Claims 1-4, wherein said barrier element is by glue
It solidify to form.
The photosensory assembly of camera module the most according to claim 7, wherein forms the glue of described barrier element in solidification
There is viscosity later further, thus be used for the dust adhered within described camera module.
The photosensory assembly of camera module the most according to claim 7, the described obstruct unit wherein formed after glue curing
Part has elasticity.
The photosensory assembly of camera module the most according to claim 7, wherein said integral packaging support is coated on described resistance
Outer peripheral face every element.
The photosensory assembly of 11. 1 camera modules, it is characterised in that including:
At least one wiring board；
At least one barrier element；
At least one sensitive chip；
At least one filter element, wherein said filter element is overlapped in described sensitive chip, and wherein said barrier element is set
It is placed in the outward flange of described filter element；And
One one package support, wherein said integral packaging support wraps up the perimeter of described filter element and described circuit
Plate, with after described integral packaging rack forming, described integral packaging support, described filter element, described sensitive chip and institute
Stating wiring board joined integrally, described sensitive chip is connected with the conducting of described wiring board.
The photosensory assembly of 12. camera modules according to claim 11, farther includes a camera lens supporter, wherein said
Camera lens supporter is arranged at described integral packaging support, and at least one optical lens of described camera module is arranged at described mirror
Head supporter.
The photosensory assembly of 13. camera modules according to claim 11, farther includes at least one motor, described motor quilt
Being arranged at described integral packaging support and be connected with the conducting of described wiring board, described optical lens is arranged at described motor.
14. according to the photosensory assembly of described camera module arbitrary in claim 11 to 13, and wherein said filter element is red
Outer edge filter or full impregnated spectral filter.
Priority Applications (13)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620246631.6U CN205883378U (en) | 2016-03-28 | 2016-03-28 | Photosensitive assembly of module makes a video recording |
| CN201621353544.7U CN206596090U (en) | 2016-03-28 | 2016-03-28 | Electronic equipment and camera module |
| EP23176877.1A EP4231653A3 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| JP2018550699A JP7025345B2 (en) | 2016-03-28 | 2016-10-25 | Camera modules and molded photosensitive assemblies and their manufacturing methods, and electronic devices |
| US16/088,435 US11289521B2 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| PCT/CN2016/103247 WO2017166798A1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| EP16896568.9A EP3468165B1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| KR1020187031125A KR102152516B1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly, manufacturing method thereof, and electronic device |
| TW106110048A TWI661258B (en) | 2016-03-28 | 2017-03-25 | Camera module and its molded photosensitive component |
| TW108117229A TWI706213B (en) | 2016-03-28 | 2017-03-25 | Camera module and its molded photosensitive component |
| TW108117228A TWI706212B (en) | 2016-03-28 | 2017-03-25 | Camera module and manufacturing method of moulded photosensitive component |
| TW106204228U TWM555960U (en) | 2016-03-28 | 2017-03-26 | Photographing module and its molded photosensitive component and electronic equipment |
| US17/678,347 US11824071B2 (en) | 2016-03-28 | 2022-02-23 | Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620246631.6U CN205883378U (en) | 2016-03-28 | 2016-03-28 | Photosensitive assembly of module makes a video recording |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621353544.7U Division CN206596090U (en) | 2016-03-28 | 2016-03-28 | Electronic equipment and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205883378U true CN205883378U (en) | 2017-01-11 |
Family
ID=57686452
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620246631.6U Active CN205883378U (en) | 2016-03-28 | 2016-03-28 | Photosensitive assembly of module makes a video recording |
| CN201621353544.7U Active CN206596090U (en) | 2016-03-28 | 2016-03-28 | Electronic equipment and camera module |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621353544.7U Active CN206596090U (en) | 2016-03-28 | 2016-03-28 | Electronic equipment and camera module |
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| CN (2) | CN205883378U (en) |
Cited By (6)
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| CN109246348A (en) * | 2018-11-05 | 2019-01-18 | 中芯集成电路（宁波）有限公司 | Lens module and its packaging method, electronic equipment |
| WO2019120055A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Lens assembly of camera, camera having same, and electronic device |
| WO2019120061A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Chip component of camera, camera and electronic device |
| WO2020041942A1 (en) * | 2018-08-27 | 2020-03-05 | 华为技术有限公司 | Photosensitive chip packaging structure, camera module, and mobile terminal |
| CN111345021A (en) * | 2017-10-20 | 2020-06-26 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and camera module based on metal support |
| WO2023206974A1 (en) * | 2022-04-26 | 2023-11-02 | 上海禾赛科技有限公司 | Packaging structure and packaging method therefor, photoelectric apparatus, receiving unit and laser radar |
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| CN109936680B (en) * | 2017-12-15 | 2021-05-04 | 宁波舜宇光电信息有限公司 | Systematized packaging camera module with expanded wiring layer, photosensitive assembly, electronic equipment and preparation method thereof |
| CN108111720A (en) * | 2017-12-19 | 2018-06-01 | 广东欧珀移动通信有限公司 | The camera of electronic equipment and with its electronic equipment |
| CN107872610B (en) * | 2017-12-19 | 2020-05-08 | Oppo广东移动通信有限公司 | Lens assembly of camera, camera with lens assembly and electronic equipment with lens assembly |
| EP3952270A4 (en) * | 2019-04-02 | 2022-05-25 | Ningbo Sunny Opotech Co., Ltd. | Camera module and resistance-type photosensitive component and manufacturing method therefor, and electronic device |
| CN111835943A (en) * | 2019-04-23 | 2020-10-27 | 富泰华工业（深圳）有限公司 | Image sensor package structure, lens module and electronic device |
| CN113079291B (en) * | 2021-03-29 | 2023-04-07 | 南昌欧菲光电技术有限公司 | Chip packaging structure, processing method, camera module and electronic equipment |
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2016
- 2016-03-28 CN CN201620246631.6U patent/CN205883378U/en active Active
- 2016-03-28 CN CN201621353544.7U patent/CN206596090U/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111345021A (en) * | 2017-10-20 | 2020-06-26 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and camera module based on metal support |
| WO2019120055A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Lens assembly of camera, camera having same, and electronic device |
| WO2019120061A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Chip component of camera, camera and electronic device |
| WO2020041942A1 (en) * | 2018-08-27 | 2020-03-05 | 华为技术有限公司 | Photosensitive chip packaging structure, camera module, and mobile terminal |
| US11869908B2 (en) | 2018-08-27 | 2024-01-09 | Honor Device Co., Ltd. | Photosensitive chip package structure, camera module, and mobile terminal |
| CN109246348A (en) * | 2018-11-05 | 2019-01-18 | 中芯集成电路（宁波）有限公司 | Lens module and its packaging method, electronic equipment |
| WO2023206974A1 (en) * | 2022-04-26 | 2023-11-02 | 上海禾赛科技有限公司 | Packaging structure and packaging method therefor, photoelectric apparatus, receiving unit and laser radar |
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| CN206596090U (en) | 2017-10-27 |
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