CN207652536U - Camera module and its molded circuit board component and the electronic equipment with camera module - Google Patents

Abstract

The utility model provides a camera module and its molded circuit board component and the electronic equipment with camera module, the wherein described camera module includes an at least optical lens, an at least back side molded section, an at least photosensitive element and at least a substrate, and the camera module has an at least sealing space, the photosensitive element is mounted on the substrate back of the substrate, the photosensitive region of the photosensitive element and the part in non-photo-sensing region correspond to the substrate channel of the substrate, the position of substrate channel of the wherein described camera module in the substrate forms the sealing space, so that the photosensitive region of the photosensitive element is located at the sealing space, the wherein described optical lens is maintained at the photosensitive path of the photosensitive element.

Description

Camera module and its molded circuit board component and the electronic equipment with camera module

Technical field

The utility model is related to optical imaging field, more particularly to a camera module and its molded circuit board component and carry The electronic equipment of camera module.

Background technology

Currently, portable electronic device thins down, this leads to the camera shooting mould for being configured in portable electronic device The camera end of group is forced to protrude from the surface of portable electronic device, such as postposition camera module, camera module Camera end is forced to protrude from the back side of portable electronic device, and the camera shooting mould with long-focus and big zooming range Group, camera end are protruded more apparent.Due to portable electronic devices such as smart mobile phone, tablet computer now be all made of it is flat Board-like design scheme, camera end protrude from the surface of portable electronic device, can not only influence the outer of portable electronic device It sees, and the camera end for also resulting in camera module is easy to touch, so that camera module is caused to be easy to be damaged.

Present camera module includes circuit board, is mounted on the circuit board photosensitive element and bearing and by institute The optical lens that bearing is maintained on the photosensitive path of the photosensitive element is stated, in addition, the camera module further includes being mounted In Passive components such as the resistance of the circuit board, capacitance, driver, relay, processor, memory, inductors.It is existing The camera module have more defect.

First, these described Passive components, the photosensitive element and the bearing are mounted on the circuit board The same side, and either in the horizontal direction or in short transverse, between the adjacent Passive components, the passive member Between device and the photosensitive element, between the photosensitive element and the bearing and the Passive components and the bearing Between be required to reserved safe distance, this cause camera module size in the horizontal direction and short transverse size all It can not be lowered.

Secondly, it after the photosensitive element is mounted on the circuit board, needs through routing technique described photosensitive At least side of element forms one group of gold thread, conductively to connect the photosensitive element and the circuit board, and in order to ensure The good of the gold thread is electrically also required to reserved safe distance between the Passive components and the gold thread, this is further Cause the length and width dimensions of the camera module that can not be reduced.

Third, these described Passive components and the photosensitive element are located at the same space, this leads to the passive member What the cast or the link position of the Passive components and the circuit board that the surface of device is generated by oxidation generated Cast is easily adhered the photosensitive region in the photosensitive element, or is adhered to and is maintained at the photosensitive of the photosensitive element On the filter element in path, and the bad phenomenon of dirty bad point is caused to generate.

4th, the bearing is mounted on described by the adhesive of the fluid states such as the glue that is applied in the circuit board On circuit board, in this process, the glue of fluid state may flow to the photosensitive region of the photosensitive element, and lead to institute The photosensitive region for stating photosensitive element is contaminated.

In addition, the present camera module is the surface that the photosensitive element is mounted on to the substrate, this leads to institute State the distance between photosensitive element and the optical lens and be limited in smaller range, the present camera module in order to The height dimension for reducing the camera module is merely able to by reducing the distance between the photosensitive element and the optical lens Mode realize that this causes the focal length of the camera module and zooming range reduced, so that severely impacted described The performance and development space of camera module.

Utility model content

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the photosensitive element of the camera module is mounted on the substrate back of substrate, and the photosensitive member The photosensitive region of part corresponds to the substrate channel of the substrate, in this way, can reduce the camera module While height dimension, make the camera module that there is smaller back focal length and big zooming range.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group can ensure wherein in such a way that the photosensitive element is mounted on the substrate back of the substrate While the focal length and zooming range of the camera module, the height dimension of the camera module is further decreased.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group in this way, has wherein the substrate front side of the substrate can be only applied to mount the bearing Conducive to reducing the length and width dimensions of the camera module so that the camera module be especially suitable for being applied to pursue it is lightening Electronic equipment.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould Group electronic equipment, wherein the electronic component of the camera module the substrate substrate back it is switched on be connected to institute State substrate.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, electronic component described in wherein at least one the substrate substrate front side it is switched on be connected to described in Substrate, in this way, being conducive to improve the flexibility of the layout of the electronic component.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein at least part in the non-photo-sensing region of the photosensitive element can correspond to the substrate At least part of at least one electronic component of substrate front side enables to the camera shooting in this way Each component layouts of module are more compact, to be conducive to further decrease the volume of the camera module, especially further subtract The length and width dimensions of the small camera module.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment organized wherein need not be switched on by routing technique between the photosensitive element and the substrate, but is being incited somebody to action While the photosensitive element is mounted on the substrate back of the substrate, it is conductively connected to the photosensitive element and the base Plate can not only reduce the manufacturing step of the camera module and reduce manufacturing cost, and be conducive in this way Reduce the volume of the camera module, especially reduces the length and width dimensions of the camera module.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the mounting position in the photosensitive element and the substrate is filled with filler, with by described Filler prevents to generate gap in the mounting position of the photosensitive element and the substrate, in moulding technology, avoid flowing The photosensitive region of photosensitive element described in body medium pollution.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the photosensitive region and at least part electronics member of the photosensitive element can be isolated in the substrate Device pollutes the photosensitive region of the photosensitive element to avoid the cast on the surface of the electronic component, and generates dirty bad The bad phenomenons such as point, to advantageously ensure that the product yield of the camera module.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the camera module provides a sealing space, the photosensitive region of the photosensitive element is positioned at described close It seals in space, to avoid the cast on the surface of the electronic component from polluting the photosensitive region of the photosensitive element.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein in moulding technology, the fluid media (medium) is prevented from entering the sealing space, dirty to avoid occurring Contaminate the bad phenomenon of the photosensitive region of the photosensitive element.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the back side molded section of the camera module is integrally incorporated into the substrate back of the substrate at least A part of region, and the back side molded section embeds at least part region of the photosensitive element, so that the back side mould Modeling portion, the substrate and the photosensitive element integrally combine.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the back side molded section embeds at least one of the mounting position of the photosensitive element and the substrate Point, to prevent the photosensitive element from falling off from the substrate back of the substrate.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the back side molded section embeds at least one of the mounting position of the photosensitive element and the substrate Point, it is aoxidized to avoid the chip contacts of the photosensitive element and the substrate connection part of the substrate, to ensure the sense The reliability of the conduction position of optical element and the substrate.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the back side molded section embeds at least one of the mounting position of the photosensitive element and the substrate Point, with by the flatness of the intensity of substrate described in the back side molded section reinforcement and the guarantee substrate.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the back side molded section embeds at least one of the mounting position of the photosensitive element and the substrate Point, to ensure the flatness of the photosensitive element by the back side molded section, so that the flatness of the photosensitive element is no longer It is limited to the substrate, so that the substrate can be selected thinner plank, and then further decreases the camera module Height dimension.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the electronics can be isolated by way of embedding the electronic component in the back side molded section The surface of component and external environment are aoxidized to avoid the surface of the electronic component, to ensure the electronics member device Part it is good electrically.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein by way of embedding the electronic component, the adjacent electronics is isolated in the back side molded section Component, to avoid the electronic component from the bad phenomenons such as occurring interfering with each other.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the adjacent electronic component is isolated in the back side molded section, this makes the adjacent electronics member device The distance between part can be decreased further, more and larger-sized in order to be mounted on limited attachment area The electronic component.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the module connecting side of the connecting plate of the camera module is connected to the substrate back of the substrate, The back side molded section can embed the module connecting side of the connecting plate, with by being integrally incorporated into the substrate and described The mode of connecting plate avoids the connecting plate from falling off from the substrate, to ensure the reliability of the camera module.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the back side molded section will not be deformed when heated, to advantageously ensure that the photosensitive element Flatness.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the back side molded section has good heat-sinking capability, the heat that the photosensitive element is generated It is rapidly radiated the external environment of the camera module, to ensure that the camera module is reliable when being used for a long time Property.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group needs not worry about the electronics wherein during assembling the camera module to the electronic equipment Component scratches the electronic component due to the collision of the build-up member of the electronic equipment, or leads to the electronics member device Part falls off from the substrate, to ensure the reliability of the camera module when in use.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the back side molded section covers the substrate back of the substrate, to avoid the substrate of the substrate The back side is exposed, during assembling the camera module to the electronic equipment, to prevent from scratching the substrate back of the body of the substrate Face, to ensure the electrical of the substrate.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the back side molded section has an at least assembly space, for accommodating the assembly of the electronic equipment Component, in this way, in the circumferential direction of the camera module, the camera module can be with the build-up member phase of the electronic equipment It is mutually corresponding.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein quantity, size and the position of the assembly space of the back side molded section being capable of quilts as needed It provides, to improve flexibility of the camera module when being assembled.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the back side molded section can embed the electronics member after the substrate back for being incorporated into the substrate Device, to when the camera module is accidentally shaken, the electronic component can prevent the back side molded section from The substrate back of the substrate falls off.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the molded base of the camera module can integrally be incorporated into the substrate front side of the substrate extremely Few a part of region, to which glue need not be applied between the molded base and the substrate front side of the substrate, to reduce The manufacturing step of the camera module and the height dimension for reducing the camera module.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the molded base can embed the non-photo-sensing region of the photosensitive element, so that the module base Seat is integrally combined with the substrate and the photosensitive element.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the molded base can embed the electronic component of the substrate front side positioned at the substrate, It in this way can to which safe distance need not be reserved between the electronic component and the molded base Further decrease the size of the camera module.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the molded base and the back side molded section are respectively in combination in the substrate front side of the substrate And substrate back.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould Group electronic equipment, wherein the molded base and the back side molded section by secondary moulding technology respectively in connection in the base The substrate front side and substrate back of plate.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the filter element of the camera module is mounted on the substrate front side of the substrate, in the filter The sealing space is formed between optical element, the substrate and the photosensitive element, and in subsequent moulding technology, prevent The fluid media (medium) enters the sealing space.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the transparent protection element of the camera module is overlappingly being set to the substrate of the substrate just Face, to form the sealing space between the protection element, the substrate and the photosensitive element, and in subsequent mould It moulds in technique, the fluid media (medium) is prevented to enter the sealing space.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the substrate front side and molding die of the substrate can be isolated in the protection element, to mold In technique, the protection element can avoid the substrate front side of the substrate from being scraped off, to ensure the product of the camera module Yield.

One of the utility model is designed to provide a camera module and its molded circuit board component and with camera shooting mould The electronic equipment of group, wherein the protection element has elasticity, to absorb the impact that the molding die is generated when being molded Power, and the impact force is avoided to directly act on the substrate, in this way, it can be further ensured that the camera module Product yield

According to the one side of the utility model, the utility model provides a camera module comprising：

An at least optical lens；

An at least molding unit, wherein the molding unit includes an at least back side molded section；

An at least photosensitive element, wherein the photosensitive element has a photosensitive region and is looped around the photosensitive region surrounding A non-photo-sensing region；And

One circuit board has wherein the circuit board includes an at least substrate and an at least electronic component, the substrate One substrate front side, a substrate back and an at least substrate channel, the substrate front side and the substrate back correspond, institute It states substrate channel and extends to the substrate back from the substrate front side, wherein the electronic component is connected to institute switched only Substrate is stated, wherein the part in the non-photo-sensing region of the photosensitive element is mounted on the substrate back of the body of the substrate Face, and the photosensitive element is connected to the substrate switched only, the photosensitive region of the photosensitive element and described non- Another part of photosensitive region corresponds to the substrate channel of the substrate, and the optical lens is maintained at the photosensitive member The photosensitive path of part, wherein the back side molded section is integrally incorporated at least part of the substrate back of the substrate Region.

One embodiment according to the present utility model, the camera module further comprise a filler, wherein described fill out It fills object to be maintained between the substrate back of the substrate and the non-photo-sensing region of the photosensitive element, to fill shape At the gap between the substrate back of the substrate and the non-photo-sensing region of the photosensitive element.

One embodiment according to the present utility model, the photosensitive element have a chip back, the back side molded section Further embed at least part region of the chip back of the photosensitive element.

One embodiment according to the present utility model, the substrate of at least one electronic component in the substrate The back side is connected to the substrate switched only, and the substrate back of the substrate it is switched on be connected to the substrate The electronic component protrude from the substrate back of the substrate.

One embodiment according to the present utility model, the back side molded section embedding protrude from the substrate of the substrate At least part of at least one electronic component at the back side.

One embodiment according to the present utility model, the molding unit further comprises an at least molded base, described Molded base has an at least optical window, wherein the molded base is integrally incorporated into the substrate front side of the substrate extremely Few a part of region, so that the molded base is looped around the surrounding of the photosensitive region of the photosensitive element, and it is described The part in the photosensitive region of photosensitive element and the non-photo-sensing region corresponds to the optical window of the molded base.

One embodiment according to the present utility model, the molded base further embed the described non-of the photosensitive element A part for photosensitive region.

One embodiment according to the present utility model, the camera module further comprise the bearing member of an at least frame shape Part, wherein the supporting member is arranged at the non-photo-sensing region of the photosensitive element or the supporting member is formed In the non-photo-sensing region of the photosensitive element, the molded base embeds at least part of the supporting member.

One embodiment according to the present utility model, the camera module further comprise a filter element and a frame shape Holder, wherein the filter element is mounted on the holder, the holder is mounted on the top surface of the molded base, with The filter element is set to be maintained between the optical lens and the photosensitive element.

One embodiment according to the present utility model, the camera module further comprise a filter element, wherein described Filter element is overlappingly set to the substrate front side of the substrate, in the filter element, the substrate and described A sealing space is formed in the corresponding position of the substrate channel of the substrate between photosensitive element, wherein the photosensitive element The photosensitive region and the part in the non-photo-sensing region be located at the sealing space.

One embodiment according to the present utility model, the molded base embed the outer edge of the filter element.

One embodiment according to the present utility model, the camera module further comprise the bearing member of an at least frame shape Part, wherein the supporting member is arranged at the outer edge of the filter element or the supporting member is formed in the filter The outer edge of optical element, the molded base embed at least part of the supporting member.

One embodiment according to the present utility model, the camera module further comprise the buffer part of an at least frame shape, At least part of the wherein described buffer part is maintained between the filter element and the substrate front side of the substrate.

The part of one embodiment according to the present utility model, the buffer part is maintained at the molded base and institute Between the substrate front side for stating substrate.

One embodiment according to the present utility model, the camera module further comprise a transparent protection element, Described in protection element be overlappingly set to the substrate front side of the substrate, in the protection element, the substrate A sealing space is formed in the corresponding position of the substrate channel of the substrate between the photosensitive element, wherein the sense The part in the photosensitive region of optical element and the non-photo-sensing region is located at the sealing space.

One embodiment according to the present utility model, the substrate of at least one electronic component in the substrate Front is connected to the substrate switched only, and the substrate front side of the substrate it is switched on be connected to the substrate The electronic component protrude from the substrate front side of the substrate.

One embodiment according to the present utility model, the molded base embedding are protruding from the substrate of the substrate just At least part of at least one electronic component in face.

One embodiment according to the present utility model, the camera module further comprise an at least bearing, wherein described Bearing has a light hole, wherein the bearing is mounted on the substrate front side of the substrate so that the seat rings around In the surrounding of the photosensitive region of the photosensitive element, and the photosensitive region of the photosensitive element and the non-photo-sensing The part in region corresponds to the light hole of the bearing.

One embodiment according to the present utility model, the camera module further comprise an at least driver, wherein institute It states optical lens and is driveably set to the driver, the driver is mounted on the top surface of the bearing；Or Further comprise an at least lens barrel, wherein the optical lens is assembled in the lens barrel, the lens barrel is mounted on the branch The top surface of seat；Or further comprise an at least lens barrel, wherein the optical lens is assembled in the lens barrel, the lens barrel Integrally extend the bearing；Or further comprise a lens barrel, wherein the lens barrel and the optical lens are pasted respectively Top surface loaded on the bearing, and the lens barrel is looped around the surrounding of the optical lens；Or further comprise at least One lens barrel, wherein the lens barrel integrally extends the bearing, the optical lens is mounted on the top surface of the bearing, And the lens barrel is looped around the surrounding of the optical lens；Or the optical lens is mounted on the surrounding of the bearing.

One embodiment according to the present utility model, the camera module further comprise an at least driver, wherein institute It states optical lens and is driveably set to the driver, the driver is mounted on the top surface of the molded base； Or further comprise an at least lens barrel, wherein the optical lens is assembled in the lens barrel, the lens barrel is mounted on institute State the top surface of molded base；Or further comprise an at least lens barrel, wherein the optical lens is assembled in the lens barrel, The lens barrel integrally extends the molded base；Or further comprise a lens barrel, wherein the lens barrel and the optics Camera lens is mounted on the top surface of the molded base respectively, and the lens barrel is looped around the surrounding of the optical lens；Or Person further comprises an at least lens barrel, wherein the lens barrel integrally extends the molded base, the optical lens is pasted Top surface loaded on the molded base, and the lens barrel is looped around the surrounding of the optical lens；Or the optical frames Head is mounted on the surrounding of the molded base.

The shape of one embodiment according to the present utility model, the back side molded section is in " mouth " font；Or the back of the body The shape of face molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or the back side molding The shape in portion is in " I " font；Or the shape of the back side molded section is in " II " font；Or the shape of the back side molded section In " III " font；Or the shape of the back side molded section is in " X " font；Or the shape of the back side molded section is in " L " Shape；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " font；Or The shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or the back of the body The shape of face molded section is in latticed；Or the shape of the back side molded section is square；Or the back side molded section Shape is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section is rounded；Or The shape of back side molded section described in person is oval.

One embodiment according to the present utility model, the circuit board includes a connecting plate, wherein the connecting plate has One module connecting side, the module connecting side are mounted on the substrate back of the substrate or the institute of the connecting plate It states module connecting side and is mounted on the substrate front side of the substrate or the module connecting side one of the connecting plate Ground extends the substrate.

The vertical view state of one embodiment according to the present utility model, the optical lens is rounded；Or the optics The vertical view state of camera lens is oval；Or the vertical view state of the optical lens is square.

One embodiment according to the present utility model, the optical lens have a planar side and a cambered surface side, wherein institute The both sides for stating planar side are connected with the both sides of the cambered surface side respectively；Or the optical lens have two planar sides and One cambered surface side, wherein a side of any one of planar side is connected with the side of the cambered surface side, another side It is connected with the side of planar side described in another；Or the optical lens has two planar sides and two cambered surface sides, wherein two A planar side is symmetrical, and two cambered surface sides are symmetrical, wherein the side difference of any one of planar side It is connected with the side of two cambered surface sides；Or the optical lens has four planar sides and four cambered surface sides, wherein every two A planar side is symmetrical, and cambered surface side described in each two is symmetrical, and the side section of any one of planar side Not be connected with the side of two cambered surface sides.

According to the other side of the utility model, the present invention further provides an electronic equipments comprising：

One apparatus body；With

An at least camera module, wherein the camera module is arranged at the apparatus body, wherein the camera module Further comprise：

An at least optical lens；

An at least molding unit, wherein the molding unit includes an at least back side molded section；

An at least photosensitive element, wherein the photosensitive element has a photosensitive region and is looped around the photosensitive region surrounding A non-photo-sensing region；And

One circuit board has wherein the circuit board includes an at least substrate and an at least electronic component, the substrate One substrate front side, a substrate back and an at least substrate channel, the substrate front side and the substrate back correspond, institute It states substrate channel and extends to the substrate back from the substrate front side, wherein the electronic component is connected to institute switched only Substrate is stated, wherein the part in the non-photo-sensing region of the photosensitive element is mounted on the substrate back of the body of the substrate Face, and the photosensitive element is connected to the substrate switched only, the photosensitive region of the photosensitive element and described non- Another part of photosensitive region corresponds to the substrate channel of the substrate, and the optical lens is maintained at the photosensitive member The photosensitive path of part, wherein the back side molded section is integrally incorporated at least part of the substrate back of the substrate Region.

According to the other side of the utility model, the utility model further provides for a molded circuit board component comprising：

An at least molding unit, wherein the molding unit includes a back side molded section；

An at least photosensitive element, wherein the photosensitive element has a photosensitive region and is looped around the photosensitive region surrounding A non-photo-sensing region；And

One circuit board has wherein the circuit board includes an at least substrate and an at least electronic component, the substrate One substrate front side, a substrate back and an at least substrate channel, the substrate front side and the substrate back correspond, institute It states substrate channel and extends to the substrate back from the substrate front side, wherein the electronic component is connected to institute switched only Substrate is stated, wherein the part in the non-photo-sensing region of the photosensitive element is mounted on the substrate back of the body of the substrate The another part in face, the photosensitive region of the photosensitive element and the non-photo-sensing region corresponds to the base of the substrate Board channel, wherein the back side molded section is integrally incorporated at least part region of the substrate back of the substrate.

One embodiment according to the present utility model, the molded circuit board component further comprise a filler, wherein The filler is maintained between the substrate back of the substrate and the non-photo-sensing region of the photosensitive element, with Filling is formed in the gap between the substrate back of the substrate and the non-photo-sensing region of the photosensitive element.

One embodiment according to the present utility model, the photosensitive element have a chip back, the back side molded section Further embed at least part region of the chip back of the photosensitive element.

One embodiment according to the present utility model, the substrate of at least one electronic component in the substrate The back side is connected to the substrate switched only, and the substrate back of the substrate it is switched on be connected to the substrate The electronic component protrude from the substrate back of the substrate.

One embodiment according to the present utility model, the back side molded section embedding protrude from the substrate of the substrate At least part of at least one electronic component at the back side.

One embodiment according to the present utility model, the molding unit further comprises an at least molded base, described Molded base has an at least optical window, wherein the molded base is integrally incorporated into the substrate front side of the substrate extremely Few a part of region, so that the molded base is looped around the surrounding of the photosensitive region of the photosensitive element, and it is described The part in the photosensitive region of photosensitive element and the non-photo-sensing region corresponds to the optical window of the molded base.

One embodiment according to the present utility model, the molded circuit board component further comprise the branch of an at least frame shape Element is held, wherein the supporting member is arranged at the non-photo-sensing region of the photosensitive element or the supporting member It is formed in the non-photo-sensing region of the photosensitive element, the molded base embeds at least part of the supporting member.

One embodiment according to the present utility model, the molded circuit board component further comprise a filter element, Described in filter element be overlappingly set to the substrate front side of the substrate, in the filter element, the substrate A sealing space is formed in the corresponding position of the substrate channel of the substrate between the photosensitive element, wherein the sense The part in the photosensitive region of optical element and the non-photo-sensing region is located at the sealing space.

One embodiment according to the present utility model, the molded base embed the outer edge of the filter element.

One embodiment according to the present utility model, the molded circuit board component further comprise the branch of an at least frame shape Element is held, wherein the supporting member is arranged at the outer edge of the filter element or the supporting member is formed in institute The outer edge of filter element is stated, the molded base embeds at least part of the supporting member.

One embodiment according to the present utility model, the molded circuit board component further comprise the slow of an at least frame shape Rush portion, wherein at least part of the buffer part be maintained at the filter element and the substrate the substrate front side it Between.

The part of one embodiment according to the present utility model, the buffer part is maintained at the molded base and institute Between the substrate front side for stating substrate.

One embodiment according to the present utility model, the molded circuit board component further comprise a transparent protection member Part, wherein the protection element is overlappingly set to the substrate front side of the substrate, in the protection element, described Between substrate and the photosensitive element sealing space, wherein institute are formed in the corresponding position of the substrate channel of the substrate A part for the photosensitive region and the non-photo-sensing region of stating photosensitive element is located at the sealing space.

One embodiment according to the present utility model, the substrate of at least one electronic component in the substrate Front is connected to the substrate switched only, and the substrate front side of the substrate it is switched on be connected to the substrate The electronic component protrude from the substrate front side of the substrate.

One embodiment according to the present utility model, the molded base embedding are protruding from the substrate of the substrate just At least part of at least one electronic component in face.

One embodiment according to the present utility model, the circuit board includes a connecting plate, wherein the connecting plate has One module connecting side, the module connecting side are mounted on the substrate back of the substrate or the institute of the connecting plate It states module connecting side and is mounted on the substrate front side of the substrate or the module connecting side one of the connecting plate Ground extends the substrate.

One embodiment according to the present utility model, the circuit board include a connecting plate, and the connecting plate has a mould Group connecting side, the module connecting side are mounted on the substrate back of the substrate, described in the back side molded section embedding The module connecting side of connecting plate.

One embodiment according to the present utility model, the circuit board include a connecting plate, and the connecting plate has a mould Group connecting side, the module connecting side are mounted on the substrate front side of the substrate, and the molded base embeds the company The module connecting side of fishplate bar.

The shape of one embodiment according to the present utility model, the back side molded section is in " mouth " font；Or the back of the body The shape of face molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or the back side molding The shape in portion is in " I " font；Or the shape of the back side molded section is in " II " font；Or the shape of the back side molded section In " III " font；Or the shape of the back side molded section is in " X " font；Or the shape of the back side molded section is in " L " Shape；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " font；Or The shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or the back of the body The shape of face molded section is in latticed；Or the shape of the back side molded section is square；Or the back side molded section Shape is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section is rounded；Or The shape of back side molded section described in person is oval.

Description of the drawings

Fig. 1 is illustrated according to the section view of one of the manufacturing step of a camera module of a preferred embodiment of the utility model Figure.

Fig. 2A and Fig. 2 B be according to the camera module of the above-mentioned preferred embodiment of the utility model manufacturing step two Schematic cross-sectional view.

Fig. 3 is shown according to three section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.

Fig. 4 is shown according to four section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.

Fig. 5 is shown according to five section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.

Fig. 6 is shown according to six section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.

Fig. 7 A and Fig. 7 B be according to the camera module of the above-mentioned preferred embodiment of the utility model manufacturing step seven Schematic cross-sectional view.

Fig. 8 is shown according to eight section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.

Fig. 9 is shown according to nine section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.

Figure 10 is ten section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.

Figure 11 is after being splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram.

Figure 12 is the stereoscopic schematic diagram according to the camera module of the above-mentioned preferred embodiment of the utility model.

Figure 13 is the application state schematic diagram according to the camera module of the above-mentioned preferred embodiment of the utility model.

Figure 14 is a variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.

Figure 15 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.

Figure 16 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.

Figure 17 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.

Figure 18 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.

Figure 19 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.

Figure 20 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.

Figure 21 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.

Figure 22 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.

Figure 23 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 24 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.)

Figure 25 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 26 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 27 A are splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 27 B are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention One of stereoscopic schematic diagram, which illustrate the processes that a protection element is overlappingly attached to a substrate.

Figure 27 C are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention One of stereoscopic schematic diagram, which illustrate the states that the protection element is overlappingly attached to the substrate.

Figure 27 D are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Two stereoscopic schematic diagram, which illustrate the processes that a photosensitive element is mounted on to the substrate.

Figure 27 E are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Two stereoscopic schematic diagram, which illustrate the states that the photosensitive element is mounted on to the substrate.

Figure 27 F are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Two schematic cross-sectional view.

Figure 27 G are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Three schematic cross-sectional view.

Figure 27 H are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Four schematic cross-sectional view.

Figure 27 I are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Five schematic cross-sectional view.

Figure 27 J are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Six schematic cross-sectional view.

Figure 27 K are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Seven schematic cross-sectional view.

Figure 27 L are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Eight schematic cross-sectional view.

Figure 27 M are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Nine schematic cross-sectional view.

Figure 27 N are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Ten schematic cross-sectional view.

Figure 28 is the section view according to one of the manufacturing step of the camera module of another preferred embodiment of the utility model Schematic diagram.

Figure 29 A and Figure 29 B be according to the camera module of the above-mentioned preferred embodiment of the utility model manufacturing step it Two schematic cross-sectional view.

Figure 30 is three section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.

Figure 31 is four section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.

Figure 32 is five section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.

Figure 33 is six section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.

Figure 34 A and Figure 34 B be according to the camera module of the above-mentioned preferred embodiment of the utility model manufacturing step it Seven schematic cross-sectional view.

Figure 35 is eight section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.

Figure 36 is nine section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.

Figure 37 is ten section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.

Figure 38 is after being splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram.

Figure 39 is the stereoscopic schematic diagram according to the camera module of the above-mentioned preferred embodiment of the utility model.

Figure 40 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 41 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 42 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 43 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 44 A are splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 44 B are splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 45 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 46 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 47 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 48 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 49 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 50 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 51 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 52 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 53 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 54 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 55 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 56 is splitted along centre position according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram afterwards.

Figure 57 is a reality according to an optical lens of the camera module of the above-mentioned preferred embodiment of the utility model Apply the schematic top plan view of mode.

Figure 58 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.

Figure 59 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.

Figure 60 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.

Figure 61 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.

Figure 62 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.

Figure 63 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.

Figure 64 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.

Specific implementation mode

It is described below for disclosing the utility model so that those skilled in the art can realize the utility model.It retouches below Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It is retouched following The basic principle of the utility model defined in stating can be applied to other embodiments, deformation scheme, improvement project, etc. Tongfangs The other technologies scheme of case and spirit and scope without departing from the utility model.

It will be understood by those skilled in the art that in the exposure of the utility model, term " longitudinal direction ", " transverse direction ", "upper", The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description, without It is instruction or implies that signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore on Term is stated to should not be understood as limiting the present invention.

It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no It can be interpreted as the limitation to quantity.

With reference to the utility model Figure of description attached drawing 1 to Figure 13, according to a preferred embodiment of the utility model The application of one camera module 100 and its camera module 100 is set forth in following description, described in wherein at least one Camera module 100 can be assemblied in an apparatus body 200, so that the camera module 100 and the apparatus body 200 can Form an electronic equipment, refer to the attached drawing 13.

In other words, the electronic equipment includes the apparatus body 200 and is arranged at the apparatus body 200 at least One camera module 100, wherein the camera module 100 can be used for obtaining image (such as video or image).

It is noted that although in the example of the electronic equipment shown in Figure 13, the camera module 100 It is arranged at the back side (side that facing away from the display screen of the apparatus body 200) of the apparatus body 200, it is possible to understand that , the camera module 100 can also be arranged at the positive side (display of the apparatus body 200 of the apparatus body 200 Side where screen) or at least one camera module 100 be arranged at the back side and extremely of the apparatus body 200 A few camera module 100 is arranged at the back side of the apparatus body 200, the i.e. back side in the apparatus body 200 It is equipped at least one camera module 100 with positive side.Nevertheless, it will be appreciated by those skilled in the art that, In other examples of the electronic equipment, one or more described camera module 100 is arranged in the apparatus body 200 Side is also possible that.

In addition, although the apparatus body 200 of the electronic equipment shown in Figure 13 is smart mobile phone, and In other examples, the apparatus body 200 can also be implemented as but be not limited to tablet computer, electric paper book, MP3/4/5, a Any electronic product that can be configured the camera module 100 such as personal digital assistant, camera, television set, washing machine, refrigerator.

Attached drawing 11 shows the schematic diagram of the internal structure after the camera module 100 is splitted along centre position, attached Figure 12 shows the stereoscopic-state of the camera module 100.Specifically, the camera module 100 includes an at least optical frames First 10, at least one photosensitive element 20 and a circuit board 30, wherein the photosensitive element 20 is connected to the circuit switched only Plate 30, the optical lens 10 are maintained at the photosensitive path of the photosensitive element 20.

The light being reflected by the object enters the inside of the camera module 100 from the optical lens 10, then described Photosensitive element 20 receives and carries out photoelectric conversion and be imaged, and the photosensitive element 20 carries out the shadow with object that photoelectric conversion obtains As relevant electric signal can be transmitted by the circuit board 30, for example, the circuit board 30 can will be related to the image of object The electric signal transmission to the apparatus body 200 for being connected to the circuit board 30.That is, the circuit board 30 The apparatus body 200 can be connected to switched only, the camera module 100 is assemblied in the apparatus body 200 and Form the electronic equipment.

Further, refer to the attached drawing 11, the circuit board 30 include an at least substrate 31 and an at least electronic component 32, Wherein each the electronic component 32 is connected to the substrate 31 respectively switched only.

Specifically, the substrate 31 has a substrate front side 311, a substrate back 312 and an at least substrate channel 310, wherein the substrate front side 311 and the substrate back 312 correspond, the substrate channel 310 is from the substrate 31 The substrate front side 311 extend to the substrate back 312.That is, the substrate channel 310 can be connected to the base The substrate front side 311 and the substrate back 312 of plate 31.In other words, the substrate channel 310 is a perforation, such as The substrate channel 310 can be but not limited to a central hole.

Under normal conditions, the substrate 31 is plate-like, and the substrate front side 311 of the substrate 31 and the substrate The back side 312 is mutually parallel, to the distance between the substrate front side 311 of the substrate 31 and the substrate back 312 energy It enough be used to define the thickness of the substrate 31.Nevertheless, it will be appreciated by those skilled in the art that, it is new in this practicality In other examples of the camera module 100 of type, the substrate front side 311 and the substrate back 312 of the substrate 31 At least one of can be equipped with bulge-structure or groove, the camera module 100 of the utility model in this respect not by Limitation.

In addition, the substrate channel 310 of the substrate 31 is typically to be square, such as square or rectangle, It will be understood by those skilled in the art that in other examples of the camera module 100, the institute of the substrate 31 Other any possible shapes, such as, but not limited to round, ellipse can also be had by stating substrate channel 310.Nevertheless, in order to Reduce the length and width dimensions of the camera module 100, the shape and size of the substrate channel 310 of the substrate 31 are arranged to It is corresponded with the shape and size of the photosensitive element 20.

It is noted that the type of the substrate 31 can not also in the camera module 100 of the utility model It is restricted, such as the substrate 31 can be selected but be not limited to hardboard, soft board, Rigid Flex, ceramic wafer etc..

In this example of the camera module 100 shown in attached drawing 11, at least one electronic component 32 exists The substrate front side 311 of the substrate 31 is connected to the substrate 31 switched only, and the electronic component 32 in addition exists The substrate back 312 of the substrate 31 is connected to the substrate 31 switched only, in this way, the electronics member The layout of device 32 can be more flexible.

It, can will be described in whole nevertheless, in another example of the camera module 100 shown in attached drawing 23 Electronic component 32 is conductively connected to the substrate 31 in the substrate front side 311 of the substrate 31, or in attached drawing 24 It, can also be by whole electronic components 32 in the substrate in another example of the camera module 100 shown 31 substrate back 312 is conductively connected to the substrate 31.

It is noted that the type of the electronic component 32 in the camera module 100 of the utility model not It is restricted, such as the electronic component 32 may be implemented as but be not limited to processor, relay, memory, driver, sense Answer device, resistance, capacitance etc..

Further, in a specific example of the camera module 100 of the utility model, the electronic component 32 can make institute by way of the substrate front side 311 and/or the substrate back 312 that are mounted on the substrate 31 State electronic component 32 the substrate 31 the substrate front side 311 and/or the substrate back 312 it is switched on be connected to The substrate 31.

In another specific example of the camera module 100 of the utility model, the electronic component 32 also may be used To be partly embedded to the substrate 31, and institute in the substrate front side 311 of the substrate 31 and/or the substrate back 312 It states electronic component 32 and is connected to the substrate 31 switched only, that is, a part for the electronic component 32 protrudes from described The substrate front side 311 and/or the substrate back 312 of substrate 31 can further decrease described in this way The height dimension of camera module 100.Optionally, the electronic component 32 can also be wholly embedded into the substrate 31 Portion.

With continued reference to attached drawing 11, the circuit board 30 further comprises a connecting plate 33, wherein the connecting plate 33 has One module connecting side 331 and an equipment connecting side 332, wherein the module connecting side 331 of the connecting plate 33 is connected to The substrate back 312 of the substrate 31, such as the module connecting side 331 of the connecting plate 33 can pass through a connection Portion 34 is connected to the substrate back 312 of the substrate 31 switched only, wherein the interconnecting piece 34 can be but not limited to Anisotropy conductiving glue water or anisotropy conductiving glue band.In addition, the equipment connecting side 332 of the connecting plate 33 can It is connected to the apparatus body 200, such as the equipment connecting side 332 of the connecting plate 33 can be provided with or be formed A connector 333 of the connecting plate 33, for being connected to the apparatus body 200.

Nevertheless, it will be appreciated by those skilled in the art that, in the other example of the camera module 100 In, the module connecting side 331 of the connecting plate 33 is conductively connected in the substrate front side 311 of the substrate 31 The substrate 31 is also possible that.In some other examples of the camera module 100, by the institute of the connecting plate 33 It states module connecting side 331 and is connected to the side of the substrate 31, or make 331 He of module connecting side of the connecting plate 33 The substrate 31, which is integrally formed, to be possible to.

It is noted that the connecting plate 33 is deformable, to which the connecting plate 33 can be delayed by way of deformation Rush the electronic equipment during by use due to vibrations and caused by the camera module 100 displacement, to ensure The reliability of the electronic equipment when in use.

Further, the substrate 31 has at least one set of substrate connection part 315, wherein the substrate of the substrate 31 Connector 315 is located at and protrudes from the substrate back 312 of the substrate 31.Preferably, the base of the substrate 31 Plate connector 315 is looped around the surrounding of the substrate channel 310.Optionally, the substrate connection part 315 of the substrate 31 can To be disposed in the side of the substrate channel 310 either both sides or three sides.For example, the substrate when the substrate 31 connects When fitting 315 is disposed in the both sides of the substrate channel 310, the substrate connection part 315 can be disposed in the substrate The adjacent both sides in channel 310, can also be disposed in the opposite sides of the substrate channel 310.

The photosensitive element 20 has at least one set of 21 and one photosensitive region 22 of chip contacts and is looped around the sense One non-photo-sensing region 23 of 22 surrounding of light region, wherein the chip contacts 21 are located at and protrude from the photosensitive element 20 The non-photo-sensing region 23.The chip contacts 21 of the photosensitive element 20 can be looped around the photosensitive region 22 Surrounding.Optionally, the chip contacts 21 of the photosensitive element 20 can by positioned at the side of the photosensitive region 22 or Person both sides or three sides.For example, the chip contacts 21 when the photosensitive element 20 are located at the two of the photosensitive region 22 When side, the chip contacts 21 can be located at the adjacent both sides of the photosensitive region 22, can also be located at the photosensitive region 22 opposite sides.

At least part in the non-photo-sensing region 23 of the photosensitive element 20 is mounted on the described of the substrate 31 Substrate back 312, so that the chip contacts 21 of the photosensitive element 20 are connected to the institute of the substrate 31 switched only Substrate connection part 315 is stated, and the substrate for making the photosensitive region 22 of the photosensitive element 20 correspond to the substrate 31 Channel 310.Preferably, the part in the non-photo-sensing region 23 of the photosensitive element 20 also corresponds to the institute of the substrate 31 State substrate channel 310.

It is noted that in the camera module 100 of the utility model, it is mounted on by the photosensitive element 20 While the substrate back 312 of the substrate 31, the chip contacts 21 of the photosensitive element 20 connect switched only The system of the camera module 100 can be reduced in this way by being connected to the substrate connection part 315 of the substrate 31 Step is made, to advantageously reduce the manufacturing cost of the camera module 100 and improve the production efficiency of the camera module 100. In addition, the photosensitive element 20 is mounted on the mode of the substrate back 312 of the substrate 31 by the utility model, be conducive to While controlling the height dimension of the camera module 100, make focal length and bigger of the camera module 100 with bigger Zooming range, or in the mode for the focal length and zooming range for controlling the camera module 100, make the camera module 100 Height dimension is lower.

It's also worth mentioning that the chip contacts 21 of the photosensitive element 20 shape and arrangement with it is described The shape and arrangement of the substrate connection part 315 of substrate 31 in the camera module 100 of the utility model not by Limitation.For example, the chip contacts 21 of the photosensitive element 20 can be disc-shaped, spherical etc., and correspondingly, the substrate 31 The substrate connection part 315 can also be disc-shaped, spherical etc..

Preferably, in the thickness direction of the substrate 31, it is located at least the one of the substrate front side 311 of the substrate 31 At least part of a electronic component 32 can correspond to the non-photo-sensing region 23 of the photosensitive element 20.Also It is to say, from the point of view of overlooking visual angle, is located at least one electronic component 32 of the substrate front side 311 of the substrate 31 At least part and the non-photo-sensing region 23 of the photosensitive element 20 can be overlapped, in this way, energy Enough reduce the length and width dimensions of the camera module 100.

It will be appreciated by those skilled in the art that the substrate connection part 315 of the substrate 31 protrude from it is described The chip contacts 21 of the substrate back 312 of substrate 31, the photosensitive element 20 protrude from the photosensitive element 20 The non-photo-sensing region 23, to when the part in the non-photo-sensing region 23 of the photosensitive element 20 be mounted on it is described The substrate back 312 of substrate 31, and it is described so that the chip contacts 21 of the photosensitive element 20 is conductively connected to After the substrate connection part 315 of substrate 31, in the non-photo-sensing region 23 of the photosensitive element 20 and the substrate 31 An at least gap 24 is formed between the substrate back 312.In the camera module 100 of the utility model, will be described A part for photosensitive element 20 is mounted on the substrate back 312 of the substrate 31, and makes the described of the photosensitive element 20 After chip contacts 21 are conductively connected to the substrate connection part 315 of the substrate 31, it is being formed in the photosensitive element A filler is filled in the 20 non-photo-sensing region 23 and the gap 24 of the substrate back 312 of the substrate 31 5000, to fill the gap 24.

Preferably, the filler 5000 is being filled in the non-photo-sensing region 23 for being formed in the photosensitive element 20 It is formed in the photosensitive element 20 with before the gap 24 of the substrate back 312 of the substrate 31 and being filled in The non-photo-sensing region 23 and the substrate 31 the substrate back 312 the gap 24 when be in fluid state, and The filler 500 is filled in described in the non-photo-sensing region 23 for being formed in the photosensitive element 20 and the substrate 31 Cure after the gap 24 of substrate back 312, to seal the gap 24.

It is noted that the material of the filler 5000 in the camera module 100 of the utility model not by Limitation, such as the filler 5000 may be implemented as but are not limited to glue or resin etc..

In the camera module 100 of the utility model, on the one hand, the filler 5000 can be used in described in connection Substrate 31 and the photosensitive element 20, so that the photosensitive element 20 is securely mounted on the substrate back of the substrate 31 312, on the other hand, the filler 5000 is by being maintained at the substrate back 312 of the substrate 31 and described photosensitive Mode between the non-photo-sensing region 23 of element 20, filling are formed in the substrate back 312 and the institute of the substrate 31 The gap 24 between the non-photo-sensing region 23 of photosensitive element 20 is stated, in another aspect, the filler 5000 can hinder Only the substrate connection part 32 of the chip contacts 21 of the photosensitive element 20 and the substrate 31 connects with external environment It touches, to by avoiding the chip contacts 21 of the photosensitive element 20 and the substrate connection part 31 of the substrate 31 The mode aoxidized ensures the chip contacts 21 of the photosensitive element 20 and the substrate connection part of the substrate 31 The reliability of 31 connection relation.The camera module 100 includes a molding unit 40, wherein the molding unit 40 includes one Back side molded section 41, wherein the back side molded section 41 is integrally incorporated into the substrate back 312 of the substrate 31 extremely Few a part of region.For example, in this preferable examples of the camera module 100 shown in attached drawing 11 and Figure 12, the back of the body Face molded section 41 is integrally incorporated at least part region of the substrate back 312 of the substrate 31, and the back of the body Face molded section 41 embeds the whole region of the chip back 25 of the photosensitive element 20, so that the back side molded section 41, described Photosensitive element 20 and the substrate 31 integrally combine, to form a molded circuit board component 2000.It will of course be understood that It is that in other examples of the camera module 100, the back side molded section 41 can also be only embedded the photosensitive element 20 At least part region of the chip back 25.

That is, according to the other side of the utility model, the utility model further provides for the molded circuit board Component 2000, wherein the molded circuit board component 2000 includes the substrate 31, the electronic component 32, the photosensitive member Part 20 and the back side molded section 41, wherein the electronic component 32 is connected to the substrate of the substrate 31 switched only Front 311 and/or the substrate back 312, wherein the photosensitive element 20 is connected to the described of the substrate 31 switched only Substrate back 312, and the part in the photosensitive region 22 of the photosensitive element 20 and the non-photo-sensing region 23 is corresponding In the substrate channel 310 of the substrate 31, wherein the back side molded section 41 is integrally incorporated into the institute of the substrate 31 It states at least part region of substrate back 312 and embeds at least part of the chip back 25 of the photosensitive element 20 Region.

In other words, the back side molded section 41 can embed the mounting position of the photosensitive element 20 and the substrate 31 At least partially, to prevent the photosensitive element 20 from falling off from the substrate 31, to ensure the camera module 100 can By property.Also, the back side molded section 41 is by embedding the mounting position of the photosensitive element 20 and the substrate 31 at least The mode of a part, additionally it is possible to be isolated described in the chip contacts 21 and external environment and the isolation of the photosensitive element 20 The substrate connection part 315 and external environment of substrate 31 and the isolation chip contacts 21 and the substrate connection part 315 link position and external environment, to avoid the chip contacts 21, the substrate connection part 315 and the chip The mode that the link position of connector 21 and the substrate connection part 315 is aoxidized, ensures the photosensitive element 20 and the base The reliability of the conduction position of plate 31.

It is understood that the chip contacts 21 of the photosensitive element 20 can be also isolated in the filler 5000 It is connected with external environment and the isolation chip with external environment and the substrate connection part 315 that the substrate 31 is isolated The link position and external environment of part 21 and the substrate connection part 315 connect to avoid the chip contacts 21, the substrate The link position of fitting 315 and the chip contacts 21 and the substrate connection part 315 is aoxidized, to ensure the sense The reliability of the conduction position of optical element 20 and the substrate 31.

In addition, the back side molded section 41 embeds at least the one of the mounting position of the photosensitive element 20 and the substrate 31 Part, additionally it is possible to by the intensity of substrate 31 described in 41 reinforcement of back side molded section and the flatness for ensureing the substrate 31. Preferably, by make the back side molded section 41 embed the photosensitive element 20 the chip back 25 it is at least part of Mode, additionally it is possible to ensure the flatness of the photosensitive element 20 by the back side molded section 41, so that the photosensitive member The flatness of part 20 is limited to the back side molded section 41, in this way, on the one hand can ensure the flatness of the photosensitive element 20, On the other hand, the substrate 31 can select thinner plank, to advantageously reduce the height dimension of the camera module 100.

The back side molded section 41 will not be deformed when heated, to when the camera module 100 is by for a long time In use, when the heat that the photosensitive element 20 generates acts on the back side molded section 41, the back side molded section 41 will not It is deformed, to advantageously ensure that the flatness of the photosensitive element 20.Preferably, the back side molded section 41 has good Heat-sinking capability, wherein the heat that the photosensitive element 20 generates can be rapidly radiated described take the photograph by the back side molded section 41 As the external environment of module 100, to ensure reliability of the camera module 100 when being used for a long time.

In addition, the back side molded section 41 is by being integrally incorporated into the side of the substrate back 312 of the substrate 31 Formula can avoid the substrate back 312 of the substrate 31 exposed, to described in being assemblied in the back side molded section 41 Apparatus body 200 and when forming the electronic equipment, other build-up members of the apparatus body 200 will not be because touching the base The substrate back 312 of plate 31 and scratch the substrate 31, to advantageously ensure that the substrate 31 it is good electrically.

With continued reference to attached drawing 11, the back side molded section 41 can embed the substrate back for protruding from the substrate 31 At least part of 312 at least one electronic component 32, in this way, on the one hand, the back side molding Surface and the external environment of the electronic component 32 can be isolated in portion 41, to pass through the surface for avoiding the electronic component 32 The mode aoxidized ensures the good electrical of the electronic component 32, and on the other hand, the back side molded section 41 can pass through The mode that the adjacent electronic component 32 is isolated prevents the adjacent electronic component 32 from the bad phenomenons such as occurring interfering with each other, Thus can be by attachment greater number and bigger ruler on the limited attachment area of the substrate back 312 of the substrate 31 The very little electronic component 32, to be conducive to improve the performance and image quality of the camera module 100, in another aspect, institute State back side molded section 41 avoids the electronic component 32 exposed by way of embedding the electronic component 32, thus will During the camera module 100 is assemblied in the apparatus body 200, need not worry about the electronic component 32 because with institute Other build-up members for stating apparatus body 200 touch and scratch the electronic component 32, or lead to the electronic component 32 fall off from the substrate 31, to ensure reliability of the camera module 100 when being assembled and being used, and it is described Electronic component 32 can also prevent the back side molded section 41 from falling off from the substrate back 312 of the substrate 31, to protect It demonstrate,proves the back side molded section 41 and is securely joined with the substrate back 312 in the substrate 31.

With further reference to attached drawing 11, in this preferable examples of the camera module 100 of the utility model, the back of the body The height that face molded section 41 protrudes from the substrate back 312 of the substrate 31 is more than or equal to the electronic component 32 Protrude from the height of the substrate back 312 of the substrate 31.Specifically, the back side molded section 41 has a free side Face 4111 and one combines side 4112, wherein the free side 4111 of the back side molded section 41 and the combination side 4112 correspond, and the combination side 4112 of the back side molded section 41 is integrally incorporated into the institute of the substrate 31 State at least part area at least part region of substrate back 312 and the chip back 25 of the photosensitive element 20 Domain.

If the height dimension parameter that the back side molded section 41 protrudes from the substrate back 312 of the substrate 31 is H, That is, the distance between the free side 4111 of the back side molded section 41 and the combination side 4112 parameter are H, if institute The height dimension parameter for stating the substrate back 312 that electronic component 32 protrudes from the substrate 31 is h, wherein parameter H's Numerical value is more than or equal to the numerical value of parameter h, in this way, when assembling the camera module 100 to the apparatus body 200, energy Enough prevent other build-up members of the apparatus body 200 from touching the electronic component 32, to ensure the camera module 100 reliability.

Attached drawing 25 shows that a variant embodiment of the camera module 100, the back side molded section 41 are further The module connecting side 331 of the connecting plate 33 is embedded, so that the back side molded section 41, the substrate 31, the electronics Component 32, the connecting plate 33 and the photosensitive element 20 integrally in conjunction with and form the molded circuit board component 2000. It is understood that in such a way that the back side molded section 41 embeds the module connecting side 331 of the connecting plate 33, energy The module connecting side 331 of the connecting plate 33 is enough avoided to fall off from the substrate back 312 of the substrate 31, to ensure The link position of the module connecting side 331 of the connecting plate 33 and the substrate back 312 of the substrate 31 it is reliable Property.

Attached drawing 14 shows the schematic cross-sectional view of a variant embodiment of the camera module 100, wherein the back of the body Face molded section 41 has an at least assembly space 410, wherein the module connecting side 331 of the connecting plate 33 is in the substrate 31 substrate back 312 is connected to the assembly that the back side molded section 41 can be housed inside after the substrate 31 Space 410 can avoid the module connecting side 331 of the connecting plate 33 from protruding, described in guarantee in this way The reliability of the link position of the module connecting side 331 of connecting plate 33 and the substrate back 312 of the substrate 31.

It is understood that the assembly space 410 of the back side molded section 41 can be in the back side molded section 41 Middle part, can also be in the surrounding of the back side molded section 41.

In some other feasible examples of the camera module 100, do not embedded by the back side molded section 41 The electronic component 32 can also be housed inside the assembly space 410 of the back side molded section 41, in this way Mode can avoid the electronic component 32 from being touched, to avoid when moving or assembling the camera module 100 The surface of the electronic component 32 or the electronic component 32 and the conduction position of the substrate 31 are destroyed, with into one Step ensures the reliability of the camera module 100.Optionally, a part of surface of the electronic component 32 can be exposed in institute State the assembly space 410 of back side molded section 41.

In addition, when the camera module 100 is assembled to the electronic equipment, the protrusion of the apparatus body 200 Build-up member can also be housed inside the assembly space 410 of the back side molded section 41, in this way, Neng Gouyou Effect ground utilizes the inner space of the apparatus body 200, to be conducive to the lightening of the electronic equipment and miniaturization.

It is noted that the quantity of the assembly space 410, size and position can be selected as needed, to carry Flexibility of the high camera module 100 when being assembled.

Attached drawing 15 shows another variant embodiment of the camera module 100, wherein the molding unit 40 The back side molded section 41 is integrally incorporated at least one side of the substrate back 312 of the substrate 31, that is, It says, the back side molded section 41 can be not bound in the middle part of the substrate back 312 of the substrate 31, such as in attached drawing In this specific example of the camera module 100 shown in 15, the back side molded section 41 can integrally be incorporated into described Four sides of the substrate back 312 of substrate 31, so that the back side molded section 41 is in " mouth " font.And show in attached drawing 16 In another variant embodiment of the camera module 100 gone out, the back side molded section 41 can integrally be incorporated into institute Three sides of the substrate back 312 of substrate 31 are stated, so that the back side molded section 41 is in " Π " font or is in " C " word Shape.And in another variant embodiment of the camera module 100 shown in attached drawing 17, the back side molded section 41 can be with Two sides of the substrate back 312 of the substrate 31 are integrally incorporated into, so that the back side molded section 41 is in " Γ " Font is in " L " font.And in another variant embodiment of the camera module 100 shown in attached drawing 18, it is described The quantity of back side molded section 41 can be two, and each back side molded section 41 is integrally incorporated into the substrate respectively One side of 31 substrate back 312, back side molded section 41 described in two of which is symmetrically or two back ofs the body Face molded section 41 is mutually parallel.For example, two back side molded sections 41 can be in " II " font.And in the institute shown in attached drawing 19 In another variant embodiment for stating camera module 100, the back side molded section 41 only can also integrally be incorporated into described One side of the substrate back 312 of substrate 31.For example, the back side molded section 41 can be in " I " font.

It is noted that it will be appreciated by those skilled in the art that, the back side molded section 41 can also be in it His shape, such as " X " font, or " well " font.

Attached drawing 20 shows another variant embodiment of the camera module 100, wherein the molding unit 40 The back side molded section 41 is only integrally incorporated into the middle part of the substrate back 312 of the substrate 31, at this point, the back side Molded section 41 and the photosensitive element 20 are maintained at the both sides of the substrate 31 with corresponding, on the one hand, the back side mould Modeling portion 41 can substrate 31 described in reinforcement the part of the pasting area 313 intensity, to ensure to be mounted on the substrate On the other hand the flatness of the photosensitive element 20 of 31 pasting area 313 can generate the photosensitive element 20 Heat be radiated outside environment, to help to radiate.

It is noted that the shape of the back side molded section 41 in the camera module 100 of the utility model not Be restricted, for example, the back side molded section 41 can square, rectangle, trapezoidal, round, oval and other are irregular Shape.

Attached drawing 21 shows another variant embodiment of the camera module 100, wherein the molding unit 40 The back side molded section 41 can be equipped with or be formed multiple assembly spaces 410, so that the back side molded section 41 is in net Either the back side molded section 41 is in sphere of movements for the elephants shape to trellis or the back side molded section 41 is in " well " font.

Attached drawing 22 shows another variant embodiment of the camera module 100, wherein the molding unit 40 The quantity of the back side molded section 41 can also be implemented as four, and each back side molded section 41 is integrally tied respectively Together in four corners of the substrate back 312 of the substrate 31.Nevertheless, each back side molded section 41 is distinguished It is integrally incorporated into the middle part of four sides of the substrate back 312 of the substrate 31 and is also possible that.In addition, ability The technical staff in domain is it is understood that the quantity of the back side molded section 41 can also be implemented as more or less, sheet The camera module 100 of utility model is unrestricted in this regard.

It is noted that it will be appreciated by those skilled in the art that, the back side mould of the molding unit 40 Modeling portion 41 can also have other any possible shapes, the utility model another citing in portion in following description.

Further refer to the attached drawing 11, the camera module 100 includes an at least bearing 4000, wherein the bearing 4000 With an at least light hole 4100, wherein the bearing 4000 is mounted on the substrate front side 311 of the substrate 31, so that The bearing 4000 is looped around the surrounding of the photosensitive region 22 of the photosensitive element 20, and the photosensitive element 20 The photosensitive region 22 correspond to the bearing 4000 the light hole 4100.The bearing 4000 be used to make the light The photosensitive path that camera lens 10 is maintained at the photosensitive element 20 is learned, institute is formed to the light hole 4100 of the bearing 4000 State the thang-kng path of optical lens 10 and the photosensitive element 20.

It is understood that in this example of the camera module 100 shown in attached drawing 11, it is located at the substrate 31 The substrate back 312 at least one electronic component 32 at least part can correspond to be mounted on it is described The bearing 4000 of the substrate front side 311 of substrate 31, that is to say, that from the point of view of overlooking visual angle, the bearing 4000 At least part positioned at least one electronic component 32 of the substrate back 312 of the substrate 31 can be mutual It overlaps, to be conducive to reduce the length and width dimensions of the camera module 100.

In this example of the camera module 100 shown in attached drawing 23, the substrate front side 311 of the substrate 31 Can be only applied to mount the bearing 4000, in this way, the length and width dimensions of the camera module 100 can by into One step reduces.

With further reference to attached drawing 11, the camera module 100 further comprises an at least filter element 50, wherein the filter Optical element 50 is mounted on the bearing 4000, to make the filter element 50 be maintained at the light by the bearing 4000 It learns between camera lens 10 and the photosensitive element 20, so as to enter the inside of the camera module 100 from the optical lens 10 Light is received by the photosensitive region 22 of the photosensitive element 20 again after the filter element 50, side in this way Formula can ensure the image quality of the camera module 100.

Specifically, the filter element 50, which can be filtered from the optical lens 10, enters the camera module 100 Veiling glare in internal light can improve the image quality of the camera module 100 in this way.It is worth mentioning , the type of the filter element 50 is unrestricted in the camera module 100 of the utility model, such as the optical filtering Element 50 can be but not limited to IR cut filter element, visible spectrum filter element etc..

With further reference to attached drawing 11, the camera module 100 includes an at least driver 60, wherein the optical lens 10 Driveably be set to the driver 60, the driver 60 is mounted on the top surface of the bearing 4000, with by The driver 60 makes the optical lens 10 be maintained at the photosensitive path of the photosensitive element 20.Also, the driver 60 can drive the optical lens 10 to be done relative to the photosensitive element 20 along the photosensitive path of the photosensitive element 20 Movement, to which the camera module 100 is by adjusting the side of the relative position of the optical lens 10 and the photosensitive element 20 Formula realizes auto-focusing and the autozoom of the camera module 100.

It is noted that the type of the driver 60 is unrestricted in the camera module 100 of the utility model System, as long as the optical lens 10 can be driven to be done relative to the photosensitive member along the photosensitive path of the photosensitive element 20 The relative motion of part 20, such as the driver 60 may be implemented as but unlimited in the specific example of the utility model In voice coil motor.

Preferably, the driver 60 has a driving pin 61, wherein the driving pin 61 is from the bearing 4000 Top surface extend to binding face, and the driving pin 61 of the driver 60 can be connected to the substrate switched only 31。

In another variant embodiment of the camera module 100 shown in attached drawing 26, the camera module 100 can To be a fixed-focus camera module, specifically, the camera module 100 includes an at least lens barrel 90, wherein the optical frames First 10 are arranged at the lens barrel 90, and the lens barrel 90 is mounted on the bearing 4000, described to make by the lens barrel 90 Optical lens 10 is maintained on the photosensitive path of the photosensitive element 20.And in the camera module 100 shown in attached drawing 27A Another variant embodiment in, the lens barrel 90 can also be integrally formed with the bearing 4000.

With reference to the utility model Figure of description attached drawing 1 to Figure 10, the manufacturing process of the camera module 100 is connecing It is set forth in the description got off.

In the stage shown in attached drawing 1, by least one electronic component 32 the substrate 31 the substrate just Face 311 is conductively connected to the substrate 31, and by the other electronic component 32 the substrate 31 the substrate The back side 312 is conductively connected to the substrate 31, and two of which or more than two substrates 31 are arranged to form a spelling Version unit 3000.It is noted that forming the arrangement mode of multiple substrates 31 of the layout unit 3000 in this reality With unrestricted in the novel camera module 100, selected as needed.

For example, in this specific example of the camera module 100 of the utility model, it is provided in the substrate 31 Or after being made into, at least one electronic component 32 can be mounted on the substrate 31 by way of attachment The substrate front side 311, so that these described electronic components 32 are led in the substrate front side 311 of the substrate 31 It is connected to the substrate 31 logically, the other electronic component 32 is mounted on the substrate 31 by way of attachment The substrate back 312 so that the substrate back 312 quilt of these described electronic components 32 in the substrate 31 Conductively it is connected to the substrate 31.

In addition, the electronic component 32 is mounted on the substrate front side 311 and the substrate back of the body of the substrate 31 The position in face 312 can not also be restricted, and be adjusted according to the concrete application of the camera module 100, such as in this practicality In the other example of the novel camera module 100, multiple electronic components 32 can be disposed in the base The substrate front side 311 of plate 31 and/or the whole region of the substrate back 312, and in the camera shooting of the utility model In the other example of module 100, multiple electronic components 32 can also be disposed in the base of the substrate 31 Plate front 311 and/or the specific region of the substrate back 312, such as corner either certain side or certain both sides etc..This practicality The novel camera module 100 is unrestricted in this regard.

It is noted that in the other example of the camera module 100 of the utility model, can also only by The electronic component 32 is conductively connected to the substrate 31 in the substrate front side 311 of the substrate 31, to hold The camera module 100 as shown in attached drawing 23 is obtained after row moulding technology and subsequent technique.Described in the utility model In the other example of camera module 100, can also only by the electronic component 32 the substrate 31 the substrate The back side 312 is conductively connected to the substrate 31, is shown to obtain attached drawing 24 such as after executing moulding technology and subsequent technique The camera module 100.

In addition, with continued reference to attached drawing 1, the substrate back 312 by the photosensitive element 20 in the substrate 31 mounts In the substrate 31, so as to be located at the chip contacts 21 in the non-photo-sensing region 23 of the photosensitive element 20 and be located at The substrate connection part 315 of the substrate back 312 of the substrate 31 is switched on, and makes the described of the photosensitive element 20 Photosensitive region 22 and 23 part of the non-photo-sensing region correspond to the substrate channel 310 of the substrate 31, so that The photosensitive element 20 is connected to the substrate 31 switched only.

It will be appreciated by those skilled in the art that one in the non-photo-sensing region 23 of the photosensitive element 20 Divide in the substrate back 312 for being mounted on the substrate 31, and makes the chip contacts 21 of the photosensitive element 20 After being switched on the substrate connection part 315 of the substrate 31, in 23 He of non-photo-sensing region of the photosensitive element 20 The gap 24 is formed between the substrate back 312 of the substrate 31.Then, it is filled in institute using the filler 5000 It states in gap 24, to prevent the photosensitive region 22 of the photosensitive element 20 and the substrate back 312 of the substrate 31 It is connected by the gap 24, to which in subsequent molding process, the filler 5000 can prevent a fluid media (medium) 400 enter the photosensitive area of the photosensitive element 20 from the substrate back 312 of the substrate 31 by the gap 24 Domain 22, it is contaminated to avoid the photosensitive region 22 of the photosensitive element 20.

It is understood that at least one electronic component 32 and the photosensitive element can be isolated in the substrate 31 20 photosensitive region 22, to avoid the cast and the electronic component 32 on the surface of the electronic component 32 and institute The cast for stating the link position of substrate 31 pollutes the photosensitive region 22 of the photosensitive element 20.For example, in the electronics Component 32 is all arranged in the example of the substrate back 312 of the substrate 31, and whole can be isolated in the substrate 31 The electronic component 32 and the photosensitive element 20 the photosensitive region 22, to manufacture the camera module 100 During, the cast and the electronic component 32 and the substrate 31 on the surface of the electronic component 32 can be avoided The cast of link position pollute the photosensitive region 22 of the photosensitive element 20.

It is noted that in some examples of the camera module 100 of the utility model, it can be first by the electricity Sub- component 32 is conductively connected to the substrate 31, and the photosensitive element 20 is conductively then connected to the substrate again 31.In other examples of the camera module 100 of the utility model, can also first by the photosensitive element 20 conductively It is connected to the substrate 31, the electronic component 32 is conductively then connected to the substrate 31 again.Nevertheless, ability The technical staff in domain, can also it is understood that in the other example of the camera module 100 of the utility model The electronic component 32 of the substrate back 312 positioned at the substrate 31 is conductively first connected to the substrate 31, It is conductively connected to the substrate 31 with by the photosensitive element 20, it then again will be positioned at the substrate front side of the substrate 31 311 electronic component 32 is conductively connected to the substrate 31, or first will be positioned at the substrate of the substrate 31 The electronic component 32 in front 311 is conductively connected to the substrate 31, then again will be positioned at described in the substrate 31 The electronic component 32 of substrate back 312 is conductively connected to the substrate 31, and conductively by the photosensitive element 20 It is connected to the substrate 31.The camera module 100 of the utility model is unrestricted in this regard.

In the stage shown in attached drawing 2A and Fig. 2 B, the layout unit 3000 is put into a molding tool 300, with by Moulding technology is executed by the molding die 300.

Specifically, the molding die 300 includes a upper mold 301 and once mold 302, wherein the upper mold At least one of 301 and the lower mold 302 mold can be operated so that the molding die 300 be performed molding and Draft operates.For example, in one example, can the layout unit 3000 be positioned over the lower mold 302, and to described After molding die 300 executes die closing operation, the shape between the lower mold 302 and the substrate back 312 of the substrate 31 At an at least molding space 303.

Preferably, when the quantity of the molding space 303 is two or more than two, in 302 He of lower mold An at least communicating passage 304 can also be formed between the substrate back 312 of the substrate 31, wherein the communicating passage 304 for being connected to the adjacent molding space 303, in this way, being added into the fluid media (medium) of a molding space 303 400 can fill full all molding spaces 303 by the communicating passage 304.

It is noted that the pressure surface of the upper mold 301 can be a plane, wherein in the molding die After 300 are performed die closing operation, the pressure surface of the upper mold 301 can directly apply pressure to the substrate 31 the substrate just Face 311.

Preferably, the upper mold 301 can be formed an at least safe space 30122 by way of indent and described The surrounding of molding space 30122 forms a upper mold pressure unit 30123, wherein when the molding die 300 is performed molding behaviour When making, the upper mold pressure unit 30123 of the upper mold 301 can apply pressure to the substrate front side of the substrate 31 311, for example, the upper mold 301 the upper mold pressure unit 30123 can apply pressure to the substrate 31 the substrate just The region of the not cabling in face 311 or the upper mold pressure unit 30123 of the upper mold 301 can apply pressure to described Layout unit 3000 is used for the region of substrate 31 or component described in support, so that the substrate front side of the substrate 31 311 routing region corresponds to the safe space 30122 of the upper mold 301, in such manner, it is possible to avoid the upper mold The 301 upper mold pressure unit 30123 scratches or damages by pressure the substrate 31, to ensure the good electrical of the substrate 31.

It will be appreciated by those skilled in the art that the upper mold 301 is by providing the safe space 30122 Mode is particularly advantageous to the electronic component 32 that protection protrudes from the substrate front side 311 of the substrate 31.Namely Say, when the molding die 300 is performed die closing operation, the substrate front side 311 of the substrate 31 it is switched on even The electronic component 32 for being connected to the substrate 31 is housed inside the safe space 30122 of the upper mold 301, to keep away Exempt from the electronic component 32 to be touched or pressed by the upper mold pressure unit 30123 of the upper mold 301, to ensure The reliability of the electronic component 32 and the electronic component 32 and the link position of the substrate 31.

With continued reference to attached drawing 2A and Fig. 2 B, the lower mold 302 further comprises being molded guide portion 3021 and at least One support portion 3022 and with being at least once molded guiding groove 3023, wherein the support portion 3022 integrally extend it is described It is molded guide portion 30221, is drawn with forming the lower molding between the support portion 3022 and the lower molding guide portion 3021 Guide groove 3023, or the lower molding guiding groove 3023 is formed between the adjacent support portion 3022.

When executing die closing operation to the molding die 300, in the lower molding guiding groove of the lower mold 302 3023 corresponding positions form the molding space 303.Also, lower 3021 energy of molding guide portion of the lower mold 302 It enough applies pressure to the substrate back 312 of the substrate 31 and the support portion 3022 of the lower mold 302 can apply pressure to The substrate back 312 of the substrate 31.

Preferably, it is convex to be more than the electronic component 32 for the height dimension of the support portion 3022 of the lower mold 302 For the height dimension of the substrate back 312 of the substrate 31, in this way, when the lower mold 302 presses When the substrate back 312 of the substrate 31, the inner surface on the surface of the electronic component 32 and the lower mold 302 Between there is safe distance, with by avoiding the surface of the electronic component 32 from contacting the inner surface of the lower mold 302 Mode protects the surface of the electronic component 32 not to be scraped off.In addition, by the surface of the electronic component 32 and institute State the mode with safe distance between the inner surface of lower mold 302, additionally it is possible to make integrally to be incorporated into the substrate subsequently The back side molded section 41 of 31 substrate back 312 embeds the electronic component 32.

Refer to the attached drawing 2A and Fig. 2 B, the molding die 300 further comprise an at least film layer 305, such as in this practicality In this novel specific example, the quantity of the film layer 305 may be implemented as two, one of them 305 quilt of the film layer It is overlappingly set to the inner surface of the upper mold 301, another described film layer 305 is overlappingly set to the lower mold 302 inner surface.For example, in a feasible example, it can be by the way that the film layer 305 be attached at the upper mold 301 Inner surface mode, so that the film layer 305 is overlappingly set to the inner surface of the upper mold 301, and by by the film Layer 305 is attached at the mode of the inner surface of the lower mold 302, and the film layer 305 is made overlappingly to be set to the lower mold 302 Inner surface.

It will be appreciated by those skilled in the art that when the molding die 300 is performed die closing operation, the film Layer 305 is maintained at the upper mold pressure unit 30123 of the upper mold 301 and the substrate front side of the substrate 31 Between 311, thus it is possible, on the one hand, the film layer 305 can absorb the molding die 300 in quilt by way of being deformed The impact force generated when molding directly acts on the substrate 31 to avoid the impact force, and on the other hand, the film layer 305 can also The upper mold pressure unit 30123 of the upper mold 301 and the substrate front side 311 of the substrate 31 is enough isolated, to keep away Exempt from the substrate front side 311 that the upper mold 301 scratches the substrate 31, to ensure the good electrical of the substrate 31. It is understood that the film layer 305 can also be isolated the inner surface of the upper mold 301 and positioned at described in the substrate 31 The electronic component 32 of substrate front side 311.

Correspondingly, after executing die closing operation to the molding die 300, the lower molding of the lower mold 302 is drawn Lead portion 3021 and the support portion 3022 apply pressure to respectively the substrate 31 the substrate back 312 different location, to Be maintained at it is described it is lower molding guide portion 3021 and the substrate back 312 of the substrate 31 between the film layer 305 with And it is maintained at the film layer 305 between the support portion 3022 and the substrate back 312 of the substrate 31, a side Face, can absorb the impact force that the molding die 300 is generated when being molded directly acted on to avoid the impact force it is described The substrate back 312 of substrate 31, on the other hand, lower 3021 He of molding guide portion can also be isolated in the film layer 305 The substrate back 312 of the substrate 31 and the substrate back of the isolation support portion 3022 and the substrate 31 312, ensure the good electrical of the substrate 31 to prevent the substrate back 312 of the substrate 31 to be scraped off.In addition, The film layer 305 can also prevent the institute in lower the molding guide portion 3021 and the substrate 31 by way of being deformed State the substrate back 312 for generating gap between substrate back 312 and preventing in the support portion 22 and the substrate 31 Between generate gap.

In this stage shown in attached drawing 3 and Fig. 4, it is empty that the fluid media (medium) 400 is added at least one molding Between in 303, since the adjacent molding space 303 is connected by the communicating passage 304, to the fluid media (medium) 400 Completely all molding spaces 303 can be filled.

It is noted that the fluid media (medium) 400 can be the mixture etc. of liquid, solid or liquid and solid, So that the fluid media (medium) 400 can flow.In addition, the fluid media (medium) 400 may be implemented as but be not limited to thermosetting material Material.Certainly, it will be appreciated by those skilled in the art that, in other possible examples, the fluid media (medium) 400 is carried out It is also possible that for light thermoset material or from thermoset material.

After the fluid media (medium) 400 fills the full molding space 303, the fluid can be made by way of heating The solidification in the molding space 303 of medium 400, and draft operation, refer to the attached drawing 5 can be executed to the molding die 300 The stage shown, wherein the cured fluid media (medium) 400 can form and integrally be incorporated into institute in the molding space 303 State the back side molded section 41 of the substrate back 312 of substrate 31.Also, the back side molded section 41 can embed protrusion In at least part of at least one electronic component 32 of the substrate back 312 of the substrate 31, the lower die The 3022 corresponding position of the support portion of tool 302 can form the assembly space 410 of the back side molded section 41.It is preferred that Ground, the back side molded section 41 can embed all electronics for the substrate back 312 for protruding from the substrate 31 Component 32.

In this stage shown in attached drawing 6, after executing draft operation to the molding die 300, can be formed described The semi-finished product of molded circuit board component 2000.It is understood that after executing draft operation to the molding die 300, it is more A molded circuit board component 2000 in the state being connected with each other, with formed the half of the molded circuit board component 2000 at Product.Then in this stage shown in attached drawing 7A and Fig. 7 B, the semi-finished product of the molded circuit board component 2000 can be divided, with Form the molded circuit board component 2000.The mode for dividing the semi-finished product of the molded circuit board component 2000 is new in this practicality It is unrestricted in the camera module 100 of type, such as the molded circuit board component can be divided by way of cutting 2000 semi-finished product can also lead to overetched mode and divide the molding circuit to form the molded circuit board component 2000 The semi-finished product of board group part 2000 are to form the molded circuit board component 2000.

In addition, in some examples of the camera module 100 of the utility model, such as attached drawing 7A, dividing the mould When moulding the semi-finished product of circuit board assemblies 2000, segmentation direction can be the side where the substrate front side 311 from institute's substrate 31 To the direction to 312 place of the substrate back.In other examples of the camera module 100 of the utility model, such as Attached drawing 7B, when dividing the semi-finished product of the molded circuit board component 2000, segmentation direction can also be from the substrate 31 The direction where direction to the substrate front side 311 where the substrate back 312.

In this stage shown in attached drawing 8, by the interconnecting piece 34 by the module connecting side of the connecting plate 33 331 are mounted on the substrate back 312 of the substrate 31, conductively to connect the connecting plate 33 and the substrate 31.It is excellent Selection of land, the module connecting side 331 of the connecting plate 33 are housed inside the assembly space 410 of the back side molded section 41 It is interior, it is protruded to avoid the module connecting side 331 of the connecting plate 33.It is understood that in the camera module 100 In other examples, the module connecting side 331 of the connecting plate 33 can also be mounted on institute by the interconnecting piece 34 State the substrate front side 311 of substrate 31.

Optionally, the stage shown in attached drawing 8 can also be before the stage shown in attached drawing 7A and Fig. 7 B, to pass through first The module connecting side 331 of the connecting plate 33 is mounted on the substrate back of the substrate 31 by the interconnecting piece 34 312, then divide the semi-finished product of the molded circuit board component 2000 again to form the molded circuit board component 2000.

Also optionally, the stage shown in attached drawing 8 can also be before the stage shown in attached drawing 2A and Fig. 2 B, to execute When moulding technology, the molding die 300 can apply pressure to the connecting plate 33 the module connecting side 331 and the substrate 31 link position, can with ensure the module connecting side 331 of the connecting plate 33 and the link position of the substrate 31 By property, or so that the module connecting side 331 of the connecting plate 33 and the link position of the substrate 31 is housed inside described In molding space 303, with after execution moulding technology forms the back side molded section 41, the back side molded section 41 can wrap The module connecting side 331 for burying the connecting plate 33, to form the camera module 100 shown in attached drawing 25.

In the stage shown in attached drawing 9, the bearing 4000 for being pasted with the filter element 50 is mounted on the base The substrate front side 311 of plate 31, and make the photosensitive region 22 and the non-photo-sensing region 23 of the photosensitive element 20 A part correspond to the light hole 4100 of the bearing 4000, and the filter element 50 is made to be located at the photosensitive element On 20 photosensitive path.Alternatively it is also possible to which the bearing 4000 to be first mounted on to the substrate front side of the substrate 31 311, the filter element 50 is then mounted on the bearing 4000 again.

Then, the driver 60 for being assembled with the optical lens 10 is mounted on the bearing 4000, so that described Optical lens 10 is maintained at the photosensitive path of the photosensitive element 20, and the filter element 50 is made to be maintained at the optics Between camera lens 10 and the photosensitive element 20, and the driving pin 61 and the substrate 31 of the driver 60 are connected Ground connects, to form the camera module 100.

Alternatively it is also possible to the lens barrel 90 for being assembled with the optical lens 10 is mounted on the bearing 4000, with Form the camera module 100 as shown in attached drawing 26.

Also optionally, the bearing 4000 and the lens barrel 90 can also be integrally formed, wherein first by the optical filtering Element 50 is mounted on the bearing 4000 and the optical lens 10 is assembled in the lens barrel 90, then again by the bearing 4000 are mounted on the substrate front side 311 of the substrate 31, or the bearing 4000 is mounted on the substrate 31 first The substrate front side 311, the filter element 50 is then mounted on the bearing 4000 again and by the optical lens 10 It is assembled in the lens barrel 90, to form the camera module 100 as shown in attached drawing 27.

With reference to the attached drawing 27B to Figure 27 N of the Figure of description of the present invention, another manufacturing process of the camera module 100 It is set forth in following description.

In the stage shown in attached drawing 27B and Figure 27 C, by least one electronic component 32 the substrate 31 institute It states substrate back 312 and is conductively connected to the substrate 31, two of which or more than two substrates 31 are arranged shape At a layout unit 3000.It is noted that forming the arrangement mode of multiple substrates 31 of the layout unit 3000 It is unrestricted in the camera module 100 of the present invention, it is selected as needed.

In addition, a protection element 9000 to be overlappingly attached to the substrate front side 311 of the substrate 31, so that described Protection element 9000 closes opening of the substrate channel 310 in the substrate front side 311 of the substrate 31.

It is noted that in the other example of the camera module 100 of the present invention, it can also be first in the base The substrate front side 311 of plate 31 overlappingly attaches the protection element 9000, then again in the substrate of the substrate 31 The back side 312 conductively connects at least one electronic component 32.

In addition, the type of the protection element 9000 is unrestricted, such as the protection element 9000 can be transparent member Part can also be opaque element, if it can be overlappingly attached at the substrate front side 311 of the substrate 31, and Close the substrate channel 310 the substrate front side 311 opening.Citing ground but be not limited to, the protection element 9000 may be implemented as high temperature gummed tape.

It is understood that being overlappingly attached at the substrate front side of the substrate 31 in the protection element 9000 After 311, the protection element 9000 can also form a part for the layout unit 3000.It is then possible to the spelling Version unit 3000 is cleaned, and is adhered on the layout unit 3000 to avoid pollutants such as dust, solid particles.

In the stage shown in attached drawing 27D, Figure 27 E and Figure 27 F, by the photosensitive element 20 the substrate 31 the base Back 312 is mounted on the substrate 31, so that the chip positioned at the non-photo-sensing region 23 of the photosensitive element 20 The substrate connection part 315 of connector 21 and the substrate back 312 positioned at the substrate 31 is switched on, and makes the sense The part in the photosensitive region 22 of optical element 20 and the non-photo-sensing region 23 corresponds to the substrate of the substrate 31 Channel 310, so that the photosensitive element 20 is connected to the substrate 31 switched only.

Specifically, ball can be planted to be formed in the non-photo-sensing region 23 of the photosensitive element 20 by planting ball technique The chip contacts 21 positioned at the non-photo-sensing region 23 of the photosensitive element 20, then again by the photosensitive element 20 It is mounted on the substrate back 312 of the substrate 31, so that positioned at the non-photo-sensing region of the photosensitive element 20 The substrate connection part 315 of 23 chip contacts 21 and the substrate back 312 positioned at the substrate 31 is led It is logical.It will be appreciated by those skilled in the art that the chip contacts 21 of the photosensitive element 20 can also have other Generation type, the camera module 100 of the invention is unrestricted in this regard.

In addition, after the photosensitive element 20 is mounted on the substrate back 312 of the substrate 31, it is described photosensitive Element 20 can close opening of the substrate channel 310 in the substrate back 312 of the substrate 31, in the sense A sealing space 8000 is formed between optical element 20, the substrate 31 and the protection element 9000, wherein the photosensitive element 20 photosensitive region 22 is located at the sealing space 8000 can avoid the photosensitive element 20 in this way The photosensitive region 22 by contaminants such as dust, solid particulate matters, the product to ensure the camera module 100 is good Rate.Preferably, the part in the non-photo-sensing region 23 of the photosensitive element 20 can also be located at the sealing space 8000 It is interior.

It will be appreciated by those skilled in the art that one in the non-photo-sensing region 23 of the photosensitive element 20 Divide in the substrate back 312 for being mounted on the substrate 31, and makes the chip contacts 21 of the photosensitive element 20 After being switched on the substrate connection part 315 of the substrate 31, in 23 He of non-photo-sensing region of the photosensitive element 20 The gap 24 is formed between the substrate back 312 of the substrate 31.Then, it is filled in institute using the filler 5000 It states in gap 24, to prevent the photosensitive region 22 of the photosensitive element 20 and the substrate back 312 of the substrate 31 It is connected by the gap 24, to which in subsequent molding process, the filler 5000 can prevent a fluid media (medium) 400 enter the sealing space 8000 from the substrate back 312 of the substrate 31 by the gap 24, to avoid quilt The photosensitive region 22 for being maintained at the photosensitive element 20 of the sealing space 8000 is contaminated, to avoid the camera shooting There are the bad phenomenons such as dirty bad point in module 100.

It is noted that after the photosensitive element 20 is mounted on the substrate back 312 of the substrate 31, The photosensitive element 20 can also form a part for the layout unit 3000.

Nevertheless, it will be appreciated by those skilled in the art that, the stage shown in attached drawing 27D to Figure 27 F can also Before the stage shown in attached drawing 27B and Figure 27 C, that is, the photosensitive element 20 is mounted on described in the substrate 31 first Then the protection element 9000 is attached at the substrate front side 311 of the substrate 31, to obtain by substrate back 312 again The layout unit 3000.It is then also possible to be cleaned to the layout unit 3000.The camera module of the present invention 100 is unrestricted in this regard.

In the stage shown in attached drawing 27G, Figure 27 H, Figure 27 I and Figure 27 J, the layout unit 3000 is put into described In molding die 300, to execute moulding technology by the molding die 300.After the completion of moulding technology, to the shaping mould Tool 300 executes draft technique, to obtain the semi-finished product of the molded circuit board component 2000 shown in attached drawing 27K.It is appreciated that , after executing draft operation to the molding die 300, multiple molded circuit board components 2000 are in interconnection State, to form the semi-finished product of the molded circuit board component 2000.It is noted that in moulding technology, the protection The upper mold 301 of the molding die 300 and the substrate front side of the substrate 31 can also be isolated in element 9000 311, to avoid the substrate front side 311 of the substrate 31 from being scratched by the upper mold 301, to protect the substrate 31 It is good electrical.Preferably, the protection element 9000 can also be deformable, in the upper mold of the molding die 300 When tool 301 and the lower mold 302 mold, the protection element 9000 can be absorbed described by way of generating flexible deformation Upper mold 301 acts on the impact force of the substrate 31, is damaged to avoid the substrate 31.

In the stage shown in attached drawing 27L and Figure 27 M, the semi-finished product of the molded circuit board component 2000 can be divided It cuts, the mode of segmentation is unrestricted in the camera module 100 of the present invention, such as can divide institute by way of cutting The semi-finished product of molded circuit board component 2000 are stated, overetched mode can also be led to and divide the molded circuit board component 2000 Semi-finished product.

In addition, dividing the camera module of the mode in the present invention of the semi-finished product of the molded circuit board component 2000 It can not also be restricted in 100, such as in the example shown in attached drawing 27L, divide the molded circuit board component 2000 When semi-finished product, segmentation direction can be from the direction at 311 place of the substrate front side of the substrate 31 to the substrate back Direction where 312.And in the example shown in attached drawing 27M, when dividing the semi-finished product of the molded circuit board component 2000, Segmentation direction can be the direction to 311 place of the substrate front side where the substrate back 312 from the substrate 31 Direction.

In the stage shown in attached drawing 27N, the protection element 9000 is gone from the substrate front side 311 of the substrate 31 It removes, to obtain the molded circuit board component 2000.

It is noted that stage shown in attached drawing 27N can also before the stage shown in attached drawing 27L and Figure 27 M, from And first remove the protection element 9000 from the substrate front side 311 of the substrate 31, then divide the molding again The semi-finished product of circuit board assemblies 2000, to obtain the molded circuit board component 2000.The camera module 100 of the present invention exists This respect is unrestricted.

In subsequent steps, the connecting plate 33 and the substrate 31 can conductively be connected, by the optical frames First 10 are maintained on the photosensitive path of the photosensitive element 20, and the filter element 50 is made to be maintained at the optical lens 10 Between the photosensitive element 20, to obtain the camera module 100 shown in attached drawing 27A.

With reference to the utility model Figure of description attached drawing 28 to Figure 39, according to another preferred embodiment of the utility model A camera module 100 be set forth in following description, wherein the camera module 100 include an at least optical lens 10 ', an at least photosensitive element 20 ' and a circuit board 30 ', wherein the photosensitive element 20 ' is connected to the electricity switched only Road plate 30 ', the optical lens 10 ' are maintained at the photosensitive path of the photosensitive element 20 '.

The light being reflected by the object enters the inside of the camera module 100 from the optical lens 10 ', then described Photosensitive element 20 ' receives and carries out photoelectric conversion and be imaged, the photosensitive element 20 ' carry out that photoelectric conversion obtains with object The relevant electric signal of image can be transmitted by the circuit board 30 ', for example, the circuit board 30 ' can be by the image with object The relevant electric signal transmission is to the apparatus body 200 for being connected to the circuit board 30 '.That is, the electricity Road plate 30 ' can be connected to the apparatus body 200 switched only, and the camera module 100 is assemblied in the equipment sheet Body 200 and form the electronic equipment.

Further, refer to the attached drawing 38, the circuit board 30 ' include at least a substrate 31 ' and an at least electronic component 32 ', wherein each electronic component 32 ' is connected to the substrate 31 ' respectively switched only.

Specifically, the substrate 31 ' has a substrate front side 311 ', a substrate back 312 ' and an at least substrate logical Road 310 ', wherein the substrate front side 311 ' and the substrate back 312 ' correspond, the substrate channel 310 ' is described in The substrate front side 311 ' of substrate 31 ' extends to the substrate back 312 '.That is, the substrate channel 310 ' can It is connected to the substrate front side 311 ' and the substrate back 312 ' of the substrate 31 '.In other words, the substrate channel 310 ' can To be implemented as a perforation, so that the substrate channel 310 ' can be connected to the substrate front side 311 ' of the substrate 31 ' With the substrate back 312 ', such as the substrate channel 310 ' can be a central hole.

Under normal conditions, the substrate 31 ' is plate-like, and the substrate front side 311 ' of the substrate 31 ' and described Substrate back 312 ' is mutually parallel, between the substrate front side 311 ' and the substrate back 312 ' of the substrate 31 ' Distance can be used for the thickness for defining the substrate 31 '.Nevertheless, it will be appreciated by those skilled in the art that, In other examples of the camera module 100 of the utility model, the substrate front side 311 ' of the substrate 31 ' and described At least one of substrate back 312 ' can be equipped with bulge-structure or groove, the camera module 100 of the utility model It is unrestricted in this regard.

In addition, the substrate channel 310 ' of the substrate 31 ' is typically to be square, such as square or rectangular Shape, it will be understood by those skilled in the art that in other examples of the camera module 100, the substrate 31 ' The substrate channel 310 ' can also have other any possible shapes, it is such as, but not limited to round.Nevertheless, in order to subtract The shape and size of the length and width dimensions of the small camera module 100, the substrate channel 310 ' of the substrate 31 ' are arranged to It is corresponded with the shape and size of the photosensitive element 20 '.

It is noted that the type of the substrate 31 ' can not also in the camera module 100 of the utility model It is restricted, such as the substrate 31 ' can be selected but be not limited to hardboard, soft board, Rigid Flex, ceramic wafer etc..

In this example of the camera module 100 shown in attached drawing 38, at least one electronic component 32 ' exists The substrate front side 311 ' of the substrate 31 ' is connected to the substrate 31 ' switched only, the electronic component in addition 32 ' the substrate 31 ' the substrate back 312 ' it is switched on be connected to the substrate 31 ', in this way, institute The layout for stating electronic component 32 ' can be more flexible.

Nevertheless, it will be appreciated by those skilled in the art that, in the other example of the camera module 100 In, whole electronic components 32 ' can also be conductively connected in the substrate front side 311 ' of the substrate 31 ' The substrate 31 ', and in the other example of the camera module 100, it can also be by whole electronic components 32 ' are conductively connected to the substrate 31 ' in the substrate back 312 ' of the substrate 31 '.The described of the utility model is taken the photograph As module 100 is unrestricted in this regard.

It is noted that the type of the electronic component 32 ' in the camera module 100 of the utility model not Be restricted, for example, the electronic component 32 ' may be implemented as but be not limited to processor, relay, memory, driver, Inductor, resistance, capacitance etc..

Further, in a specific example of the camera module 100 of the utility model, the electronic component 32 ' can by way of the substrate front side 311 ' and/or the substrate back 312 ' that are mounted on the substrate 31 ', The electronic component 32 ' is set to be switched in the substrate front side 311 ' of the substrate 31 ' and/or the substrate back 312 ' Ground is connected to the substrate 31 '.It is understood that when the electronic component 32 ' is mounted on the described of the substrate 31 ' After substrate front side 311 ' and/or the substrate back 312 ', the electronic component 32 ' protrudes from the described of the substrate 31 ' Substrate front side 311 ' and/or the substrate back 312 '.

In another specific example of the camera module 100 of the utility model, the electronic component 32 ' also may be used To be partly embedded to the substrate 31 ' in the substrate front side 311 ' of the substrate 31 ' and/or the substrate back 312 ', and And the electronic component 32 ' is connected to the substrate 31 ' switched only, that is, the part protrusion of the electronic component 32 ' The substrate front side 311 ' in the substrate 31 ' and/or the substrate back 312 ' in this way can be into one Step reduces the height dimension of the camera module 100.Optionally, the electronic component 32 ' can also be wholly embedded into described The inside of substrate 31 '.

With continued reference to attached drawing 38, the circuit board 30 ' further comprises a connecting plate 33 ', wherein the connecting plate 33 ' has There are a module connecting side 331 ' and an equipment connecting side 332 ', wherein the 331 ' quilt of module connecting side of the connecting plate 33 ' It is connected to the substrate back 312 ' of the substrate 31 ', such as the module connecting side 331 ' of the connecting plate 33 ' can be with By an interconnecting piece 34 ' it is switched on be connected to the substrate back 312 ' of the substrate 31 ', wherein the interconnecting piece 34 ' It can be but not limited to anisotropy conductiving glue water or anisotropy conductiving glue band.

Nevertheless, it will be appreciated by those skilled in the art that, in the other example of the camera module 100 In, the module connecting side 331 ' of the connecting plate 33 ' is conductively connected in the substrate front side 311 ' of the substrate 31 ' The substrate 31 ' is connected to be also possible that.In some other examples of the camera module 100, by the connecting plate 33 ' the module connecting side 331 ' is connected to the side of the substrate 31 ', or makes the module of the connecting plate 33 ' Connecting side 331 ' and the substrate 31 ', which are integrally formed, to be possible to.

In addition, the equipment connecting side 332 ' of the connecting plate 33 ' can be connected to the apparatus body 200, example As the equipment connecting side 332 ' of the connecting plate 33 ' can be provided with or be formed a connector of the connecting plate 33 ' 333 ', for being connected to the apparatus body 200.

It is noted that the connecting plate 33 ' is deformable, to which the connecting plate 33 ' can be by way of deformation Buffer the electronic equipment during by use due to vibrations and caused by the camera module 100 displacement, to protect Demonstrate,prove the reliability of the electronic equipment when in use.

Further, the substrate 31 ' has at least one set of substrate connection part 315 ', wherein the substrate 31 ' is described Substrate connection part 315 ' is located at and protrudes from the substrate back 312 ' of the substrate 31 '.Preferably, the substrate 31 ' The substrate connection part 315 ' be looped around the edge of the substrate channel 310 '.

The photosensitive element 20 ' has at least one set of chip contacts 21 ' and a photosensitive region 22 ' and is looped around described One non-photo-sensing region 23 ' of 22 ' surrounding of photosensitive region, wherein the chip contacts 21 ' are located at and are protruded from described photosensitive The non-photo-sensing region 23 ' of element 20 '.

The photosensitive element 20 ' is mounted on the substrate back 312 ' of the substrate 31 ', so that the photosensitive element 20 ' the chip contacts 21 ' are connected to the substrate connection part 315 ' of the substrate 31 ' switched only, and make described The photosensitive region 22 ' of photosensitive element 20 ' corresponds to the substrate channel 310 ' of the substrate 31 '.Preferably, the sense The part in the non-photo-sensing region 23 ' of optical element 20 ' also corresponds to the substrate channel 310 ' of the substrate 31 '.Example Such as, in this specific example of the camera module 100 of the utility model, the non-photo-sensing of the photosensitive element 20 ' The part in region 23 ' is mounted on the substrate back 312 ' of the substrate 31 ', the sense of the photosensitive element 20 ' The another part in light region 22 ' and the non-photo-sensing region 23 ' corresponds to the substrate channel 310 ' of the substrate 31 '.

It is noted that in the camera module 100 of the utility model, mounted by the photosensitive element 20 ' While the substrate back 312 ' of the substrate 31 ', the chip contacts 21 ' of the photosensitive element 20 ' are led The camera module can be reduced in this way by being connected to the substrate connection part 315 ' of the substrate 31 ' logically 100 manufacturing step, to advantageously reduce the manufacturing cost of the camera module 100 and improve the camera module 100 Production efficiency.

It's also worth mentioning that the shape and arrangement of the chip contacts 21 ' of the photosensitive element 20 ' and institute State the substrate connection part 315 ' of substrate 31 ' shape and arrangement in the camera module 100 of the utility model It is unrestricted.For example, the chip contacts 21 ' of the photosensitive element 20 ' can be disc-shaped, spherical etc., it is correspondingly, described The substrate connection part 315 ' of substrate 31 ' can also be disc-shaped, spherical etc..

Preferably, in the thickness direction of the substrate 31 ', it is located at the substrate front side 311 ' of the substrate 31 ' extremely At least part of a few electronic component 32 ' can correspond to the non-photo-sensing region of the photosensitive element 20 ' A 23 ' part.That is, from the point of view of overlooking visual angle, it is located at least the one of the substrate front side 311 ' of the substrate 31 ' A part of energy of at least part of a electronic component 32 ' and the non-photo-sensing region 23 ' of the photosensitive element 20 ' It is enough overlapped, in this way, the length and width dimensions of the camera module 100 can be reduced, so that the camera shooting Module 100 is especially suitable for pursuing the lightening electronic equipment.

It will be appreciated by those skilled in the art that the substrate connection part 315 ' of the substrate 31 ' protrudes from institute State the substrate back 312 ' of substrate 31 ', the chip contacts 21 ' of the photosensitive element 20 ' protrude from described photosensitive The non-photo-sensing region 23 ' of element 20 ', to be mounted on the substrate of the substrate 31 ' when the photosensitive element 20 ' The back side 312 ', and the chip contacts 21 ' of the photosensitive element 20 ' is made conductively to be connected to the described of the substrate 31 ' After substrate connection part 315 ', the substrate in the non-photo-sensing region 23 ' and the substrate 31 ' of the photosensitive element 20 ' An at least gap 24 ' is formed between the back side 312 '.In the camera module 100 of the utility model, by the photosensitive member Part 20 ' is mounted on the substrate back 312 ' of the substrate 31 ', and makes the chip contacts of the photosensitive element 20 ' After 21 ' are conductively connected to the substrate connection part 315 ' of the substrate 31 ', in the institute for being formed in the photosensitive element 20 ' It states and fills a filler in the gap 24 ' of the substrate back 312 ' of non-photo-sensing region 23 ' and the substrate 31 ' 5000 ', to fill the gap 24 '.

It is understood that in other examples of the camera module 100, it can also be first by the filler 5000 ' It is arranged in the non-photo-sensing region 23 ' of the substrate back 312 ' and/or the photosensitive element 20 ' of the substrate 31 ' At least partially, the part in the non-photo-sensing region 23 ' of the photosensitive element 20 ' is then mounted on the substrate again After the 31 ' substrate back 312 ', it is arranged on the substrate back 312 ' of the substrate 31 ' and/or the photosensitive member The filler 5000 ' in the non-photo-sensing region 23 ' of part 20 ' can be maintained at the substrate back of the body of the substrate 31 ' Between face 312 ' and the non-photo-sensing region 23 ' of the photosensitive element 20 ', formed with being filled by the filler 5000 ' It is described between the substrate back 312 ' of the substrate 31 ' and the non-photo-sensing region 23 ' of the photosensitive element 20 ' Gap 24 '.For example, can by apply the filler 5000 ' in the substrate back 312 ' of the substrate 31 ' and/or The mode in the non-photo-sensing region 23 ' of the photosensitive element 20 ', makes the filler 5000 ' be arranged on the substrate 31 ' The substrate back 312 ' and/or the photosensitive element 20 ' the non-photo-sensing region 23 '.

Preferably, the filler 5000 ' is being filled in the non-photo-sensing region for being formed in the photosensitive element 20 ' 23 ' and the substrate 31 ' the substrate back 312 ' the gap 24 ' before and be filled in be formed in it is described photosensitive 24 ' the Shi Chengliu of the gap in the non-photo-sensing region 23 ' of element 20 ' and the substrate back 312 ' of the substrate 31 ' Figure, and the filler 500 is being filled in the non-photo-sensing region 23 ' for being formed in the photosensitive element 20 ' and institute The gap 24 ' for stating the substrate back 312 ' of substrate 31 ' cures later, to seal the gap 24 '.

The camera module 100 includes a molding unit 40 ', wherein the molding unit 40 ' includes a back side molded section 41 ' and a molded base 42 ', wherein the back side molded section 41 ' is integrally incorporated into the substrate back of the substrate 31 ' 312 ' at least part region, the molded base 42 ' are integrally incorporated into the substrate front side 311 ' of the substrate 31 ' At least part region.For example, in this preferable examples of the camera module 100 shown in attached drawing 38 and Figure 39, institute State the substrate back 312 ' that back side molded section 41 ' is integrally incorporated into the substrate 31 ', and the back side molded section 41 ' embed the whole region of the chip back 25 ' of the photosensitive element 20 ', wherein the molded base 42 ' has an at least light Window 420 ', the molded base 42 ' are integrally incorporated into a part of region of the substrate front side 311 ' of the substrate 31 ', And the molded base 42 ' is looped around the surrounding of the photosensitive region 22 ' of the photosensitive element 20 ', so that described photosensitive The part in the photosensitive region 22 ' of element 20 ' and the non-photo-sensing region 23 ' corresponds to the institute of the molded base 42 ' Optical window 420 ' is stated, wherein the light that the optical window 420 ' is formed between the optical lens 10 ' and the photosensitive element 20 ' leads to Road.The back side molded section 41 ', the molded base 42 ', the photosensitive element 20 ', the substrate 31 ' and electronics member Device 32 ' integrally combines, to form a molded circuit board component 2000 '.

That is, according to the other side of the utility model, the utility model further provides for the molded circuit board Component 2000 ', wherein the molded circuit board component 2000 ' includes the substrate 31 ', the electronic component 32 ', the sense Optical element 20 ', the back side molded section 41 ' and the molded base 42 ', wherein the electronic component 32 ' connects switched only It is connected to the substrate front side 311 ' of the substrate 31 ' and/or the substrate back 312 ', the photosensitive element 20 ' is switched on Ground is connected to the substrate back 312 ' of the substrate 31 ', and the photosensitive region 22 ' of the photosensitive element 20 ' and The part in the non-photo-sensing region 23 ' corresponds to the substrate channel 310 ' of the substrate 31 ', wherein the back side molds Portion 41 ' is integrally incorporated at least part region of the substrate back 312 ' of the substrate 31 ' and embeds described photosensitive At least part region of the chip back 25 ' of element 20 ', wherein the molded base 42 ' be integrally incorporated into it is described At least part region of the substrate front side 311 ' of substrate 31 ', and the molded base 42 ' is looped around the photosensitive member The surrounding of the photosensitive region 22 ' of part 20 ', so that the photosensitive region 22 ' of the photosensitive element 20 ' and the non-photo-sensing The part in region 23 ' corresponds to the optical window 420 ' of the molded base 42 '.

In other words, the back side molded section 41 ' can embed the attachment position of the photosensitive element 20 ' and the substrate 31 ' At least part set, to prevent the photosensitive element 20 ' from falling off from the substrate 31 ', to ensure the camera module 100 reliability.Also, the back side molded section 41 ' passes through the attachment of the embedding photosensitive element 20 ' and the substrate 31 ' At least part of mode of position, additionally it is possible to the chip contacts 21 ' and external environment of the photosensitive element 20 ' be isolated And the isolation substrate 31 ' the substrate connection part 315 ' and external environment and the isolation chip contacts 21 ' and The link position and external environment of the substrate connection part 315 ', to avoid the chip contacts 21 ', the substrate connection part 315 ' and the chip contacts 21 ' and the substrate connection part 315 ' the mode that is aoxidized of link position, described in guarantee The reliability of the conduction position of photosensitive element 20 ' and the substrate 31 '.

It is understood that the chip contacts of the photosensitive element 20 ' can be also isolated in the filler 5000 ' 21 ' and external environment and the isolation substrate 31 ' the substrate connection part 315 ' and external environment and the isolation core The link position and external environment of piece connector 21 ' and the substrate connection part 315 '.

In addition, the back side molded section 41 ' embeds the mounting position of the photosensitive element 20 ' and the substrate 31 ' extremely A few part, additionally it is possible to by the intensity of substrate 31 ' described in the 41 ' reinforcement of back side molded section and ensure the substrate 31 ' Flatness.Preferably, by making the back side molded section 41 ' embed the chip back 25 ' of the photosensitive element 20 ' extremely At least part of mode, additionally it is possible to the flatness for ensureing the photosensitive element 20 ' by the back side molded section 41 ', to make The flatness for obtaining the photosensitive element 20 ' is limited to the back side molded section 41 ', in this way, on the one hand can ensure described photosensitive The flatness of element 20 ', on the other hand, the substrate 31 ' can select thinner plank, to advantageously reduce the camera shooting mould The height dimension of group 100.

The back side molded section 41 ' will not be deformed when heated, to when the camera module 100 is by for a long time In use, when the heat that the photosensitive element 20 ' generates acts on back side molded section 41 ', the back side molded section 41 ' is not Deformation is will produce, to advantageously ensure that the flatness of the photosensitive element 20 '.Preferably, the back side molded section 41 ' has good Good heat-sinking capability, wherein the heat that the photosensitive element 20 ' generates can be rapidly radiated by the back side molded section 41 ' The external environment of the camera module 100, to ensure reliability of the camera module 100 when being used for a long time.

In addition, the back side molded section 41 ' is by being integrally incorporated into the substrate back 312 ' of the substrate 31 ' Mode can avoid the substrate back 312 ' of the substrate 31 ' exposed, to be assemblied in by the camera module 100 The apparatus body 200 and when forming the electronic equipment, other build-up members of the apparatus body 200 will not be because touching It states the substrate back 312 ' of substrate 31 ' and scratches the substrate 31 ', to advantageously ensure that the good of the substrate 31 ' Electrically.

With continued reference to attached drawing 38, the back side molded section 41 ' can embed the substrate back of the body for protruding from the substrate 31 ' At least part of at least one electronic component 32 ' in face 312 ', in this way, on the one hand, the back side Surface and the external environment of the electronic component 32 ' can be isolated in molded section 41 ', with by avoiding the electronic component The mode that 32 ' surface is aoxidized ensures the good electrical of the electronic component 32 ', on the other hand, the back side molded section 41 ' can prevent the adjacent electronic component 32 ' from occurring mutually doing by way of the adjacent electronic component 32 ' is isolated The bad phenomenons such as disturb, to can be by attachment greater number and the larger sized electronics member device on limited attachment area Part 32 ', to be conducive to improve the performance and image quality of the camera module 100, in another aspect, the back side molded section 41 ' Avoid the electronic component 32 ' exposed by way of embedding the electronic component 32 ', to by the camera module During 100 are assemblied in the apparatus body 200, need not worry about the electronic component 32 ' because with the apparatus body 200 other build-up members touch and scratch the electronic component 32 ', or cause the electronic component 32 ' from described It falls off on substrate 31 ', to ensure reliability of the camera module 100 when being assembled and being used, and electronics member Device 32 ' can also prevent the back side molded section 41 from falling off from the substrate back 312 ' of the substrate 31 ', to ensure It states back side molded section 41 and is securely joined with the substrate back 312 ' in the substrate 31 '.

With further reference to attached drawing 38, in this preferable examples of the camera module 100 of the utility model, the back of the body The height that face molded section 41 ' protrudes from the substrate back 312 ' of the substrate 31 ' is more than or equal to the electronics member device Part 32 ' protrudes from the height of the substrate back 312 ' of the substrate 31 '.Specifically, the back side molded section 41 ' has One free side 4111 ' and one combines side 4112 ', wherein the free side 4111 ' of the back side molded section 41 ' and institute It states and is corresponded in conjunction with side 4112 ', and the combination side 4112 ' of the back side molded section 41 ' is integrally incorporated into At least part region of the substrate back 312 ' of the substrate 31 ' and the chip back of the photosensitive element 20 ' 25 ' at least part.

If the back side molded section 41 ' protrudes from the height dimension parameter of the substrate back 312 ' of the substrate 31 ' For H, that is, the distance between the free side 4111 ' of the back side molded section 41 ' and the combination side 4112 ' parameter For H, if the height dimension parameter that the electronic component 32 ' protrudes from the substrate back 312 ' of the substrate 31 ' is h, Wherein the numerical value of parameter H is more than or equal to the numerical value of parameter h, in this way, assembling the camera module 100 to the equipment sheet When body 200, it can prevent other build-up members of the apparatus body 200 from touching the electronic component 32 ', to ensure State the reliability of camera module 100.

With continued reference to attached drawing 38, the embedding of molded base 42 ' is located at the substrate front side 311 ' of the substrate 31 ' At least part of at least one electronic component 32 '.Preferably, the embedding of molded base 42 ' is located at the substrate Whole electronic components 32 ' of the 31 ' substrate front side 311 '.

The electronic component can be isolated by way of embedding the electronic component 32 ' in the molded base 42 ' 32 ' surface and external environment ensure the electricity in a manner of by avoiding the surface of the electronic component 32 ' from being aoxidized Sub- component 32 ' it is good electrically.Also, the molded base 42 ' can prevent the surface of the electronic component 32 ' from occurring There is cast in the surface of the substrate front side 311 ' of cast and the prevention electronic component 32 ' and the substrate 31 ', The photosensitive region 22 ' that the photosensitive element 20 ' is polluted to avoid these casts, to ensure the camera module 100 Product yield and reliability.

In addition, the molded base 42 ' makes the adjacent electronics member device by way of embedding the electronic component 32 ' It is mutually isolated between part 32 ', to avoid the adjacent electronic component 32 ' from the bad phenomenon interfered with each other occur.Also, On the limited area of the substrate front side 311 ' of the substrate 31 ', greater number and bigger can also be connected switched only The electronic component 32 ' of size, to be conducive to improve the performance of the camera module 100.

In addition, safe distance to be reserved is not required in the molded base 42 ' and the electronic component 32 ', to have Conducive to the length and width dimensions and the height dimension for reducing the camera module 100 for reducing the camera module 100.

With further reference to attached drawing 38, the camera module 100 includes an at least filter element 50 ', wherein the optical filtering is first Part 50 ' is mounted on the top surface of the molded base 42 ', to make 50 ' quilt of the filter element by the molded base 42 ' It is maintained between the optical lens 10 ' and the photosensitive element 20 ', so as to enter the camera shooting from the optical lens 10 ' The light of the inside of module 100 after the filter element 50 ' again by the photosensitive region of the photosensitive element 20 ' 22 ' receive, and in this way, can ensure the image quality of the camera module 100.

Specifically, the filter element 50 ', which can be filtered from the optical lens 10 ', enters the camera module 100 Inside light in veiling glare can improve the image quality of the camera module 100 in this way.It is worth one It is mentioned that, the type of the filter element 50 ' is unrestricted in the camera module 100 of the utility model, such as described Filter element 50 ' can be but not limited to IR cut filter element, visible spectrum filter element etc..

With further reference to attached drawing 38, the camera module 100 includes an at least driver 60 ', wherein the optical lens 10 ' are driveably set to the driver 60 ', and the driver 60 ' is mounted on the top table of the molded base 42 ' Face, to make the optical lens 10 be maintained at the photosensitive path of the photosensitive element 20 ' by the driver 60 '.Also, The driver 60 ' can drive the optical lens 10 ' to be done relative to described along the photosensitive path of the photosensitive element 20 ' The movement of photosensitive element 20 ', to which the camera module 100 is by adjusting the optical lens 10 ' and the photosensitive element 20 ' Relative position mode, realize auto-focusing and the autozoom of the camera module 100.

It is noted that the type of the driver 60 ' is unrestricted in the camera module 100 of the utility model System, as long as the optical lens 10 ' can be driven to be done relative to described photosensitive along the photosensitive path of the photosensitive element 20 ' The relative motion of element 20 ', for example, the driver 60 ' may be implemented as in the specific example of the utility model but It is not limited to voice coil motor.

Further, the driver 60 ' has at least one driving pin 61 ', wherein the driving pin 61 ' is electrically connected It is connected to the substrate 31 '.Preferably, the molded base 42 ' has an at least pin slot 421 ', wherein the molded base 42 ' the pin slot 421 ' extends to the substrate front side of the substrate 31 ' from the top surface of the molded base 42 ' 311 ', in this way, after the driver 60 ' is mounted on the top surface of the molded base 42 ', the institute of the driver 60 ' The substrate 31 ' can be extended in the pin slot 421 ' from the top surface of the molded base 42 ' by stating driving pin 61 ' The substrate front side 311 ', and the driving pin 61 ' of the driver 60 ' can be electrically connected to the substrate 31’。

Preferably, the pin slot 421 ' along the outer surface of the molded base 42 ' from the table of the molded base 42 ' Face extends to the substrate front side 311 ' of the substrate 31 ', consequently facilitating the driver 60 ' is mounted on the molding After the top surface of pedestal 42 ', then the driving pin 61 ' of the driver 60 ' and the substrate 31 ' be electrically connected.It can be with Understand, is housed inside the driving pin of the driver 60 ' of the pin slot 421 ' of the molded base 42 ' 61 ' do not protrude from the outer surface of the molded base 42 ', in this way, can not only ensure the beauty of the camera module 100 Property, but also can prevent from occurring touching the driver when assembling the camera module 100 in the apparatus body 200 The bad phenomenon of 60 ' the driving pin 61 ', to ensure the reliability and product yield of the camera module 100.

Further, the top surface of the molded base 42 ' has at least an inner surface 422 ' and an at least outside table Face 423 ', wherein the driver 60 ' is mounted on the outer surface 423 ' of the molded base 42 ', so that the light The photosensitive path that camera lens 10 ' is maintained at the photosensitive element 20 ' is learned, wherein the filter element 50 ' is mounted on the mould The inner surface 422 ' of pedestal 42 ' is moulded, so that the filter element 50 ' is maintained at the optical lens 10 ' and described Between photosensitive element 20 '.

In some examples of the camera module 100 of the utility model, the inside table of the molded base 42 ' Plane where face 422 ' is concordant with the plane where the outer surface 423 '.In the camera module of the utility model It is flat where the inner surface 422 ' and the outer surface 423 ' where the molded base 42 ' in 100 other examples Face has difference in height, such as in this specific example of the camera module 100 shown in attached drawing 38, the molded base Plane where the 42 ' inner surface 422 ' is less than the plane where the outer surface 423 ', to make the molding Pedestal 42 ' forms at least one attachment slot 424 ', and the attachment slot 424 ' of the molded base 42 ' is communicated in the optical window 420 ', wherein the filter element 50 ' for being mounted on the inner surface 422 ' of the molded base 42 ' is housed inside institute Attachment slot 424 ' is stated, to further decrease the height dimension of the camera module 100.

It is understood that the molded base 42 ' can be a holding seat 6000 ', wherein the holding seat 6000 ' has There are maintaining part 6100 ' and maintaining part 6200 ' once on one, wherein the filter element 50 ' and the driver 60 ' are protected respectively It holds in the upper maintaining part 6100 ' for keeping seat 6000 ', the substrate 31 ' is maintained at the institute for keeping seat 6000 ' Lower maintaining part 6200 ' is stated, so that the optical lens 10 ' is maintained at the photosensitive path of the photosensitive element 20 ' and makes described Filter element 50 ' is maintained between the optical lens 10 ' and the photosensitive element 20 '.It is understood that the molding The optical window 420 ' of pedestal 42 ' extends to the lower maintaining part from the upper maintaining part 6100 ' for keeping seat 6000 ' 6200 ', so that the optical window 420 ' forms the passage of light between the optical lens 10 ' and the photosensitive element 20 '.

It is described to keep the lower maintaining part 6200 ' of seat 6000 ' by being integrally incorporated into the base of the substrate 31 ' The mode in plate front 311 ' makes the substrate 31 ' be maintained at the lower maintaining part 6200 ' for keeping seat 6000 '.It is described Filter element 50 ' and the driver 60 ' are respectively by being mounted on the upper maintaining part 6100 ' for keeping seat 6000 ' Mode is maintained at the upper maintaining part 6100 ' for keeping seat 6000 '.

With reference to the utility model Figure of description attached drawing 28 to Figure 37, the manufacturing process of the camera module 100 exists It is set forth in following description.

In the stage shown in attached drawing 28, by least one electronic component 32 ' the substrate 31 ' the substrate Front 311 ' is conductively connected to the substrate 31 ', and by the other electronic component 32 ' the substrate 31 ' institute It states substrate back 312 ' and is conductively connected to the substrate 31 ', two of which or more than two substrates 31 ' are arranged Form a layout unit 3000 '.It is noted that forming the arrangement of multiple substrates 31 ' of the layout unit 3000 ' Mode is unrestricted in the camera module 100 of the utility model, is selected as needed.

For example, in this specific example of the camera module 100 of the utility model, carried in the substrate 31 ' For or after being made into, at least one electronic component 32 ' can be mounted on the substrate by way of attachment 31 ' the substrate front side 311 ' so that these described electronic components 32 ' the substrate 31 ' the substrate just Face 311 ' is connected to the substrate 31 ' switched only, and the other electronic component 32 ' is mounted by way of attachment In the substrate back 312 ' of the substrate 31 ', so that these described electronic components 32 ' are in the substrate 31 ' The substrate back 312 ' is connected to the substrate 31 ' switched only.

In addition, the electronic component 32 ' is mounted on the substrate front side 311 ' of the substrate 31 ' and the substrate The position at the back side 312 ' can not also be restricted, and be adjusted according to the concrete application of the camera module 100, such as in this reality In other example with the novel camera module 100, multiple electronic components 32 ' can be disposed in described The substrate front side 311 ' of substrate 31 ' and/or the whole region of the substrate back 312 ', and described in the utility model In the other example of camera module 100, multiple electronic components 32 ' can also be disposed in the substrate 31 ' The specific region of the substrate front side 311 ' and/or the substrate back 312 ', such as corner either certain side or certain both sides Deng.The camera module 100 of the utility model is unrestricted in this regard.

It is noted that in the other example of the camera module 100 of the utility model, can also only by The electronic component 32 ' is conductively connected to the substrate 31 ' in the substrate front side 311 ' of the substrate 31 ', or The substrate back 312 ' only by the electronic component 32 ' in the substrate 31 ' is conductively connected to the substrate 31 '.

In addition, with continued reference to attached drawing 28, by the photosensitive element 20 ' the substrate 31 ' the substrate back 312 ' It is mounted on the substrate 31 ', so that the chip contacts positioned at the non-photo-sensing region 23 ' of the photosensitive element 20 ' 21 ' and the substrate connection part 315 ' of the substrate back 312 ' positioned at the substrate 31 ' be switched on, and make described photosensitive The photosensitive region 22 ' of element 20 ' and a part of non-photo-sensing region 23 ' correspond to the substrate of the substrate 31 ' Channel 310 ', so that the photosensitive element 20 ' is connected to the substrate 31 ' switched only.

It will be appreciated by those skilled in the art that being mounted on the substrate 31 ' in the photosensitive element 20 ' The substrate back 312 ', and make the chip contacts 21 ' of the photosensitive element 20 ' and the base of the substrate 31 ' After plate connector 315 ' is switched on, in the described of the non-photo-sensing region 23 ' of the photosensitive element 20 ' and the substrate 31 ' The gap 24 ' is formed between substrate back 312 '.Then, it is filled in the gap 24 ' using the filler 5000 ', It is described to prevent the photosensitive region 22 ' of the photosensitive element 20 ' and the substrate back 312 ' of the substrate 31 ' from passing through Gap 24 ' is connected, to which in subsequent molding process, the filler 5000 ' can prevent a fluid media (medium) 400 ' certainly The substrate back 312 ' of the substrate 31 ' enters the photosensitive region of the photosensitive element 20 ' by the gap 24 ' 22 ', it is contaminated to avoid the photosensitive region 22 ' of the photosensitive element 20 '.

It is understood that at least one electronic component 32 ' and the photosensitive member can be isolated in the substrate 31 ' The photosensitive region 22 ' of part 20 ', the cast to avoid the surface of the electronic component 32 ' and the electronic component 32 ' pollute the photosensitive region 22 ' of the photosensitive element 20 ' with the cast of the link position of the substrate 31 '.For example, It is all arranged in the example of the substrate back 312 ' of the substrate 31 ' in the electronic component 32 ', the substrate 31 ' can be isolated the photosensitive region 22 ' of whole electronic components 32 ' and the photosensitive element 20 ', to make During making the camera module 100, the cast and electronics member on the surface of the electronic component 32 ' can be avoided The cast of the link position of device 32 ' and the substrate 31 ' pollutes the photosensitive region 22 ' of the photosensitive element 20 '.

It is noted that in some examples of the camera module 100 of the utility model, it can be first by the electricity Sub- component 32 ' is conductively connected to the substrate 31 ', and the photosensitive element 20 ' is conductively then connected to the base again Plate 31 '.In other examples of the camera module 100 of the utility model, first the photosensitive element 20 ' can also be led It is connected to the substrate 31 ' logically, the electronic component 32 ' is conductively then connected to the substrate 31 ' again.Although such as This, it will be appreciated by those skilled in the art that, in the other example of the camera module 100 of the utility model In, first the electronic component 32 ' for the substrate back 312 ' for being located at the substrate 31 ' conductively can also be connected to The substrate 31 ', and the photosensitive element 20 ' is conductively connected to the substrate 31 ', it then will be located at the substrate again The electronic component 32 ' of the 31 ' substrate front side 311 ' is conductively connected to the substrate 31 ', or will first be located at The electronic component 32 ' of the substrate front side 311 ' of the substrate 31 ' is conductively connected to the substrate 31 ', then The electronic component 32 ' for the substrate back 312 ' for being located at the substrate 31 ' is conductively connected to the substrate again 31 ', and the photosensitive element 20 ' is conductively connected to the substrate 31 '.The camera module 100 of the utility model exists This respect is unrestricted.

In the stage shown in attached drawing 29A and Figure 29 B, the layout unit 3000 ' is put into a molding tool 300 ', To execute moulding technology by the molding die 300 '.

Specifically, the molding die 300 ' includes a upper mold 301 ' and mold 302 ' once, wherein the upper mold Tool at least one of 301 ' and the lower mold 302 ' mold can be operated, so that the molding die 300 ' can be held Row molding and draft operation.For example, in one example, by the layout unit 3000 ' be positioned over the lower mold 302 ' and After executing die closing operation to the molding die 300 ', in the substrate front side of the upper mold 301 ' and the substrate 31 ' At least one first molding space 303a ', and the substrate in the lower mold 302 ' and the substrate 31 ' are formed between 311 ' At least one second molding space 303b ' is formed between the back side 312 '.

In an optional example of the utility model, at least one first molding space 303a ' and at least one A second molding space 303b ' is interconnected, subsequently to allow a fluid media (medium) 400 ' to fill full first molding Space 303a ' and the second molding space 303b ', the described of the substrate 31 ' is integrally incorporated into be formed simultaneously respectively The molded base 42 ' at least part region of substrate front side 311 ' and integrally it is incorporated into the described of the substrate 31 ' The back side molded section 41 ' at least part region of substrate back 312 '.Preferably, the back side molded section 41 ' into one Step embeds at least part region of the chip back 25 ' of the photosensitive element 20 '.Optionally, first molding is empty Between 303a ' and the second molding space 303b ' can also be without being interconnected, in subsequent moulding technology, individually The fluid media (medium) 400 ' is added to the first molding space 303a ' and the second molding space 303b ' in ground, with by institute State the full first molding space 303a ' and the second molding space 303b ' of the filling of fluid media (medium) 400 '.

Preferably, when the quantity of the first molding space 303a ' is two or when more than two, in the upper mold At least one first communicating passage 304a ' can also be formed between 301 ' and the substrate front side 311 ' of the substrate 31 ', for It is connected to the adjacent first molding space 303a '.Correspondingly, when the quantity of the second molding space 303b ' be two or When more than two, it can also be formed at least between the lower mold 302 ' and the substrate back 312 ' of the substrate 31 ' One second communicating passage 304b ', for being connected to the adjacent second molding space 303b '.

With continued reference to attached drawing 29A and Figure 29 B, the upper mold 301 ' further comprise on one be molded guide portion 3011 ' and An at least optical window forming part 3012 ' and with guiding groove 3013 ' is molded at least one, wherein the optical window forming part 3012 ' The upper molding guide portion 3011 ' is integrally extended, in the optical window forming part 3012 ' and the upper molding guide portion The upper molding guiding groove 3013 ' is formed between 3011 ', or between the adjacent optical window forming part 3012 ' described in formation Upper molding guiding groove 3013 '.

Further, the upper molding guide portion 3011 ' has pressure unit 30111 ' on one first, the optical window forming part 3012 ' have one second on pressure unit 30121 ', with the molding die 300 ' be performed molding technique after, the upper molding Pressure unit in pressure unit 30111 ' and described the second of the optical window forming part 3012 ' on described the first of guide portion 3011 ' 30121 ' apply pressure to respectively the substrate 31 ' the substrate front side 311 ' different location, and guided in the upper molding The corresponding position of slot 3013 ' forms the first molding space 303a '.It is preferably located at the substrate of the substrate 31 ' just The electronic component 32 ' in face 311 ' is housed inside the first molding space 303a ', to be completed in follow-up moulding technology Afterwards, the molded base 42 ' of the substrate front side 311 ' for being integrally incorporated into the substrate 31 ' of formation can embed institute State electronic component 32 '.It is highly preferred that the height dimension of the first molding space 303a ' is more than the electronic component 32 ' The height dimension for protruding from the substrate front side 311 ' of the substrate 31 ', when the molding die 300 ' is molded, to keep away The inner surface for exempting from the upper mold 301 ' is contacted with the electronic component 32 ', and then avoids the table of the electronic component 32 ' Face scratches and avoids the electronic component 32 ' to be pressurized by the inner surface of the upper mold 301 '.

In addition, the molding die 300 ' further comprises an at least film layer 305 ', wherein the film layer 305 ' is overlappingly It is set to the inner surface of the upper mold 301 ', such as the film layer 305 ' can be by being attached at the interior of the upper mold 301 ' The mode on surface is overlappingly set to the inner surface of the upper mold 301 '.After the molding die 300 ' is molded, institute It states film layer 305 ' and is being located at the substrate of pressure unit 30111 ' and the substrate 31 ' on described the first of the upper mold 301 ' just Between face 311 ' and positioned at the upper mold 301 ' described second on pressure unit 30121 ' and the substrate 31 ' the substrate Between front 311 ', in this way, on the one hand, the film layer 305 ' can absorb the molding by way of deformation The impact force that mold 300 ' is generated when being molded directly acts on the substrate 31 ' to avoid the impact force, on the other hand, The described of pressure unit 30111 ' and the substrate 31 ' on described the first of the upper mold 301 ' can be isolated in the film layer 305 ' The substrate front side 311 ' of pressure unit 30121 ' and the substrate 31 ' in substrate front side 311 ' and isolation described second, to keep away Exempt from described the first of the upper mold 301 ' pressure unit 30121 ' in pressure unit 30111 ' and described second and scratches the substrate 31 ' the substrate front side 311 ', on the other hand, the film layer 305 ' can be prevented by way of deformation in the upper mold On described the first of 301 ' between pressure unit 30111 ' and the substrate front side 311 ' of the substrate 31 ' and prevent described second Gap is generated between upper pressure unit 30121 ' and the substrate front side 311 ' of the substrate 31 ', can especially be prevented in institute It states and generates gap between pressure unit 30121 ' and the substrate front side 311 ' of the substrate 31 ' on second, in subsequent mould It moulds in technique, the fluid media (medium) 400 ' can not only be prevented to flow to the substrate 31 ' from the first molding space 303a ' The substrate channel 310 ' in and the photosensitive region 22 ' of the photosensitive element 20 ' is polluted, but also can prevent Only there are bad phenomenons such as " overlaps ".

With continued reference to attached drawing 29A and Figure 29 B, the lower mold 302 ' further comprise being molded guide portion 3021 ' and An at least support portion 3022 ' and at least once be molded guiding groove 3023 ', wherein the support portion 3022 ' integrally prolongs The lower molding guide portion 3021 ' is stretched in, to be formed between the support portion 3022 ' and the lower molding guide portion 3021 ' The lower molding guiding groove 3023 ', or the lower molding guiding groove 3023 ' is formed between the adjacent support portion 3022 '.

When executing die closing operation to the molding die 300 ', in the lower molding guiding groove of the lower mold 302 ' 3023 ' corresponding positions form the second molding space 303b '.Also, the lower molding of the lower mold 302 ' is drawn Lead portion 3021 ' can apply pressure to the substrate 31 ' the substrate back 312 ' and the lower mold 302 ' the support portion 3022 ' the substrate backs 312 ' that can apply pressure to the substrate 31 '.Preferably, the base of the substrate 31 ' is protruded from The electronic component 32 ' of back 312 ' is housed inside the second molding space 303b '.It is understood that described At least part of the link position of the substrate back 312 ' of photosensitive element 20 ' and the substrate 31 ' can also be received In the second molding space 303b '.

Preferably, the height dimension of the second molding space 303b ' of the lower mold 302 ' is more than electronics member Device 32 ' protrudes from the height dimension of the substrate back 312 ' of the substrate 31 ', in this way, when described Lower mold 302 ' apply pressure to the substrate 31 ' the substrate back 312 ' when, protrude from the substrate 31 ' the substrate back of the body There is safe distance, with by avoiding between the electronic component 32 ' in face 312 ' and the inner surface of the lower mold 302 ' The surface of the electronic component 32 ' contacts the mode of the inner surface of the lower mold 302 ', protects the electronic component 32 ' Surface be not scraped off and avoid the electronic component 32 ' to be pressurized.In addition, by the surface of the electronic component 32 ' The mode with safe distance between the inner surface of the lower mold 302 ', additionally it is possible to it is follow-up make integrally to be incorporated into it is described The back side molded section 41 ' of the substrate back 312 ' of substrate 31 ' embeds the electronic component 32 '.

It is highly preferred that the film layer 305 ' can also overlappingly be set to the inner surface of the lower mold 302 ', such as institute The lower mold can be overlappingly set to by way of being attached at the inner surface of the lower mold 302 ' by stating film layer 305 ' 302 ' inner surface.After the molding die 300 ' is molded, the film layer 305 ' be located at the lower mold 301 it is described under It is molded between guide portion 3021 ' and the substrate back 312 ' of the substrate 31 ' and the support portion 3022 ' and the substrate Between the 31 ' substrate back 312 ', in this way, on the one hand, the film layer 305 ' can pass through the side of deformation Formula absorbs the impact force that the molding die 300 ' is generated when being molded, and the substrate is directly acted on to avoid the impact force 31 ', on the other hand, the film layer 305 ' can be isolated the lower molding guide portion 3021 ' of the lower mold 302 ' with it is described The substrate back 312 ' of substrate 31 ' and the substrate back that the support portion 3022 ' and the substrate 31 ' is isolated 312 ', scratch the substrate to avoid the lower molding guide portion 3021 ' of the lower mold 302 ' and the support portion 3022 ' 31 ' the substrate back 312 '.

Further it will be understood that the film layer 305 ' can also facilitate the upper mold of the molding die 300 ' 301 ' demould with the lower mold 302 ', and in this process, avoid the molded base 42 ' and the back side molded section 41 ' are damaged, and the optical window 420 ' of the molded base 42 ' is especially avoided to be damaged, to ensure the camera module 100 reliability.

In the stage shown in attached drawing 30 and Figure 31, the fluid media (medium) 400 ' is added at least one first molding The fluid media (medium) 400 ' is either added at least one second molding space 303b ' or by institute by space 303a ' It states fluid media (medium) 400 ' and is added separately to the first molding space 303a ' and the second molding space 303b ', due to adjacent It is connected by the first communicating passage 304a ' between the first molding space 303a ' and adjacent second molding is empty Between be connected by the second communicating passage 304b ' between 303b ', therefore, the fluid media (medium) 400 ' can fill completely all The first molding space 303a ' and all the second molding space 303b '.

It is noted that the fluid media (medium) 400 ' can be the mixture etc. of liquid, solid or liquid and solid, So that the fluid media (medium) 400 ' can flow.In addition, the fluid media (medium) 400 ' may be implemented as but be not limited to thermosetting property Material.Certainly, it will be appreciated by those skilled in the art that, in other possible examples, 400 ' quilt of the fluid media (medium) It is embodied as light thermoset material or is also possible that from thermoset material.

The full first molding space 303a ' and the second molding space 303b ' is filled in the fluid media (medium) 400 ' Afterwards, the fluid media (medium) 400 ' can be made in the first molding space 303a ' and second molding by way of heating Solidification in the 303b ' of space, and draft operation, the rank shown in refer to the attached drawing 32 can be subsequently being executed to the molding die 300 ' Section, wherein the cured formation of fluid media (medium) 400 ' is integrally incorporated into the base in the first molding space 303a ' The molded base 42 ' of the substrate front side 311 ' of plate 31 ', and in the optical window forming part of the upper mold 301 ' 3012 ' corresponding positions form the optical window 420 ' of the molded base 42 ', the photosensitive area of the photosensitive element 20 ' The part in domain 22 ' and the non-photo-sensing region 23 ' corresponds to the optical window 420 ' of the molded base 42 ', wherein in institute It states the cured fluid media (medium) 400 ' in the second molding space 303b ' and can be formed and be integrally incorporated into the substrate 31 ' The back side molded section 41 ' of the substrate back 312 '.Preferably, the embedding of back side molded section 41 ' protrudes from the base The electronic component 32 ' of the substrate back 312 ' of plate 31 '.It is highly preferred that described in the embedding of back side molded section 41 ' The chip back 25 ' of photosensitive element 20 '.Optionally, in 3022 ' the corresponding position of the support portion of the lower mold 302 ' Set at least assembly space 410 ' for being formed simultaneously the back side molded section 41 '.

The mould can be formed after executing draft operation to the molding die 300 ' in the stage shown in attached drawing 33 Mould the semi-finished product of circuit board assemblies 2000 '.Then it can divide the molded circuit board component 2000 ' in attached drawing 34A and Figure 34 B Semi-finished product, to form the molded circuit board component 2000 '.Divide the semi-finished product of the molded circuit board component 2000 ' Mode is unrestricted in the camera module 100 of the utility model, such as can divide the mould by way of cutting The semi-finished product of circuit board assemblies 2000 ' are moulded to form the molded circuit board component 2000 ', overetched mode point can also be led to The semi-finished product of the molded circuit board component 2000 ' are cut to form the molded circuit board component 2000 '.

In addition, in some examples of the camera module 100 of the utility model, such as attached drawing 34A, dividing the mould When moulding the semi-finished product of circuit board assemblies 2000 ', segmentation direction can be where the substrate front side 311 ' of institute's substrate 31 ' Direction where direction to the substrate back 312 '.In other examples of the camera module 100 of the utility model, Such as attached drawing 34B, when dividing the semi-finished product of the molded circuit board component 2000 ', segmentation direction can also be from the substrate The direction where direction to the substrate front side 311 ' where the 31 ' substrate back 312 '.

In this stage shown in attached drawing 35, the module of the connecting plate 33 ' is connected by the interconnecting piece 34 ' Side 331 ' is mounted on the substrate back 312 ' of the substrate 31 ', conductively to connect the connecting plate 33 ' and the substrate 31’.Preferably, the module connecting side 331 ' of the connecting plate 33 ' is housed inside the dress of the back side molded section 41 ' With in space 410 ', protruded to avoid the module connecting side 331 ' of the connecting plate 33 '.It is understood that described In other examples of camera module 100, the module of the connecting plate 33 ' can also be connected by the interconnecting piece 34 ' Connect the substrate front side 311 ' that side 331 ' is mounted on the substrate 31 '.

Optionally, the stage shown in attached drawing 35 can also be before the stage shown in attached drawing 34A and Figure 34 B, to first The module connecting side 331 ' of the connecting plate 33 ' is mounted on to the base of the substrate 31 ' by the interconnecting piece 34 ' Back 312 ' then divides the semi-finished product of the molded circuit board component 2000 ' to form the molded circuit board component again 2000’。

In the stage shown in attached drawing 36, the filter element 50 ' is mounted on to the inside table of the molded base 42 ' Face 422 ', and in the stage shown in attached drawing 37, the driver 60 ' for being assembled with the optical lens 10 ' is mounted on institute State the outer surface 423 ' of molded base 42 ', and conductively connect the driver 60 ' the driving pin 61 ' and The substrate 31 ' so that the optical lens 10 ' is maintained at the photosensitive path of the photosensitive element 20 ', and makes the optical filtering Element 50 ' is maintained between the optical lens 10 ' and the photosensitive element 20 ', to which the institute as shown in attached drawing 38 be made State camera module 100.

It is noted that although the utility model shows the back side molded section 41 ' and the molding base above-mentioned Seat 42 ' and meanwhile be integrally incorporated into the substrate 31 ' the substrate back 312 ' and the substrate front side 311 ' example, In other examples of the camera module 100, the back side molded section 41 ' can also first be made integrally to be incorporated into the substrate 31 ' the substrate back 312 ', then the molded base 42 ' is made integrally to be incorporated into the substrate of the substrate 31 ' just Face 311 ', or the substrate front side 311 ' that first makes the molded base 42 ' integrally be incorporated into the substrate 31 ', then make The back side molded section 41 ' is integrally incorporated into the substrate front side 311 ' of the substrate 31 ', that is, the back side molded section 41 ' are formed by different moulding technologies respectively with the molded base 42 ', and the camera module 100 of the utility model is in side Face is unrestricted.

According to the other side of the utility model, the utility model further provides for the manufacturing method of a camera module 100, The wherein described manufacturing method includes the following steps：

An at least photosensitive element 20 ' is mounted on to a substrate back 312 ' of a substrate 31 ', and makes the photosensitive element A 20 ' photosensitive region 22 ' and the part in the non-photo-sensing region 23 ' for being looped around 22 ' surrounding of the photosensitive region correspond to One substrate channel 310 ' of the substrate 31 '；

Conductively connect at least an electronic component 32 ' and the substrate 31 '；

A back side molded section 41 ' is set integrally to be incorporated into the substrate back of the substrate 31 ' by moulding technology 312 ' at least part region；And

One optical lens 10 ' is maintained to the photosensitive path of the photosensitive element 20 ', the camera module 100 is made.

It is noted that the step (b) can also be before the step (a), described in first conductively connecting The photosensitive element 20 ', is then mounted on the substrate of the substrate 31 ' by electronic component 32 ' and the substrate 31 ' again The back side 312 '.

In addition, in the step (b), make the electronic component 32 ' in the substrate front side of the substrate 31 ' 311 ' are connected to the substrate 31 ' switched only, or make the electronic component 32 ' in the substrate of the substrate 31 ' The back side 312 ' is connected to the substrate 31 ' switched only, or makes at least one electronic component 32 ' in the substrate 31 ' the substrate front side 311 ' is connected to the substrate 31 ' and makes the other electronic component 32 ' in institute switched only The substrate front side 311 ' for stating substrate 31 ' is connected to the substrate 31 ' switched only.

Further, can also include step after the step (c)：(e) molded base is made by moulding technology 42 ' are integrally incorporated at least part region of the substrate front side 311 ' of the substrate 31 ', so that the molded base 42 ' are looped around the surrounding of the photosensitive region 22 ' of the photosensitive element 20 ' and make the described photosensitive of the photosensitive element 20 ' The part in region 22 ' and the non-photo-sensing region 23 ' corresponds to the optical window 420 ' of the molded base 42 '.

Optionally, the step (e) can also be before the step (c), to first make the one of the molded base 42 ' Ground is incorporated at least part region of the substrate front side 311 ' of the substrate 31 ', then makes the back side molded section again 41 ' are integrally incorporated at least part region of the substrate back 312 ' of the substrate 31 '.

Also optionally, the step (c) and the step (e) are completed together, that is, while making the molded base 42 ' one It is incorporated into body at least part region of the substrate front side 311 ' of the substrate 31 ' and makes the back side molded section 41 ' Integrally it is incorporated at least part region of the substrate back 312 ' of the substrate 31 '.

Attached drawing 40 shows that a variant embodiment of the camera module 100, the substrate 31 ' further have extremely A few shaping channel 319 ', wherein the shaping channel 319 ' extends to institute from the substrate front side 311 ' of the substrate 31 ' State substrate back 312 ', that is, the shaping channel 319 ' is communicated in the substrate front side 311 ' of the substrate 31 ' and the base Back 312 '.In moulding technology, the shaping channel 319 ' can be connected to the first molding space 303a ' and described Two molding space 303b ', to be added into the first molding space 303a ' and/or described when the fluid media (medium) 400 ' When the second molding space 303b ', the fluid media (medium) 400 ' can equally be filled in the shaping channel 319 ', and solid in rear extended meeting Change in the shaping channel 319 '.It is appreciated that yes, the molded base 42 ' and the back side molded section 41 ' can pass through The shaping channel 319 ' of the substrate 31 ' is integrally formed, to avoid the molded base 42 ' and/or the back side mould Modeling portion 41 ' falls off from the substrate 31 ', to ensure the reliability of the molded circuit board component 2000 '.

Attached drawing 41 shows that another variant embodiment of the camera module 100, the molded base 42 ' can wrap Bury the part in the non-photo-sensing region 23 ' of the photosensitive element 20 ', that is, the molded base 42 ' can be from the substrate 31 ' the substrate front side 311 ' and the part in the non-photo-sensing region 23 ' of the photosensitive element 20 ' are integrally prolonged upwards It stretches, the inner surface 422 ' and the outer surface 423 ' is formed with the top surface in the molded base 42 ', and in institute A part of corresponding position of the photosensitive region 23 and the non-photo-sensing region 23 ' of stating photosensitive element 20 ' forms the mould Mould the optical window 420 ' of pedestal 42 '.

Attached drawing 42 shows that another variant embodiment of the camera module 100, the camera module 100 are further The supporting member 70 ' for including an at least frame shape, wherein the supporting member 70 ' is arranged at the described of the photosensitive element 20 ' Non-photo-sensing region 23 ' or the supporting member 70 ' can be formed in the non-photo-sensing region of the photosensitive element 20 ' 23 ', the molded base 42 ' embeds a part for the supporting member 70 ', so that the molded base 42 ', bearing member Part 70 ', the photosensitive element 20 ', the substrate 31 ' and the back side molded section 41 ' integrally combine.

Preferably, the supporting member 70 ' protrudes from the substrate front side 311 ' of the substrate 31 ', in this way, molding In technique, the upper mold 301 ' described second on pressure unit 30121 ' can directly apply pressure to the supporting member 70 ', with Avoid pressure unit 30121 ' and the substrate front side 311 ' of the substrate 31 ' on described the second of the upper mold 301 ' direct Contact.

It is highly preferred that the supporting member 70 ' has elasticity, such as the supporting member 70 ' can be by glue or tree It is formed after the media cures such as fat, is being closed thus it is possible, on the one hand, the supporting member 70 ' can absorb the molding die 300 ' The impact force generated when mould, on the other hand, the supporting member 70 ' can be prevented by way of being deformed in the upper mold Gap is generated between pressure unit 30121 ' and the supporting member 70 ' on described the second of tool 301 ', thus by the fluid When medium 400 ' is added to the first molding space 303a ', the fluid media (medium) 400 ' can be prevented from first molding Space 303a ' enters the substrate channel 310 ' of the substrate 31 ', to avoid the described photosensitive of the photosensitive element 20 ' Region 22 ' is contaminated, and can prevent the appearance of bad phenomenons such as " overlaps ".

Attached drawing 43 shows that another variant embodiment of the camera module 100, the camera module 100 are further Include the holder 80 ' of an at least frame shape, wherein the filter element 50 ' is mounted on the holder 80 ', 80 ' quilt of the holder It is mounted on the inner surface 422 ' of the molded base 42 ', so that the filter element 50 ' is maintained at the optical frames Between first 10 ' and the photosensitive element 20 '.Preferably, the holder 80 ' is maintained at the patch of the molded base 42 ' In tankage 424 '.

The filter element 50 ' is maintained at the optical lens 10 ' and the photosensitive element by the holder 80 ' Mode between 20 ' can reduce the area of the filter element 50 ', to advantageously reduce the manufacture of the camera module 100 Cost.

Another variant embodiment of the camera module 100 shown in attached drawing 44A, the filter element 50 ' can be with It is directly mounted on the optical lens 10 ', so that the filter element 50 ' is maintained at the optical lens 10 ' and described Between photosensitive element 20 '.

Attached drawing 44B shows that another variant embodiment of the camera module 100, the substrate 31 ' have at least One accommodation space 316 ', wherein the accommodation space 316 ' and the substrate channel 310 ' are interconnected, wherein the receiving is empty Between 316 ' from the substrate back 312 ' of the substrate 31 ' to 311 ' direction of the substrate front side extend.It is mounted on described The receiving that the photosensitive element 20 ' of the substrate back 312 ' of substrate 31 ' can be housed inside the substrate 31 ' is empty Between 316 ', in this way, the height dimension of the camera module 100 can be further decreased.

Attached drawing 45 shows that another variant embodiment of the camera module 100, the back side molded section 41 ' may be used also Further to embed the module connecting side 331 ' of the connecting plate 33 ', that is, the back side molded section 41 ' can embed institute The mounting position for stating the module connecting side 331 ' of connecting plate 33 ' and the substrate back 312 ' of the substrate 31 ', to keep away The module connecting side 331 ' for exempting from the connecting plate 33 ' falls off from the substrate back 312 ' of the substrate 31 ', to protect Demonstrate,prove the reliability of the camera module 100.

Attached drawing 46 shows another variant embodiment of the camera module 100, the mould of the connecting plate 33 ' Group connecting side 331 ' can also be connected to the substrate front side 311 ' of the substrate 31 ' by the interconnecting piece 34 '.

Attached drawing 47 shows another variant embodiment of the camera module 100, and the molded base 42 ' can be with Further comprise the module connecting side 331 ' of the connecting plate 33 ', that is, the molded base 42 ' can embed the company The mounting position of the module connecting side 331 ' of fishplate bar 33 ' and the substrate front side 311 ' of the substrate 31 ', to avoid institute The module connecting side 331 ' for stating connecting plate 33 ' falls off from the substrate front side 311 ' of the substrate 31 '.

Attached drawing 48 shows that another variant embodiment of the camera module 100, the camera module 100 are further Including an at least protective element 7000 ', wherein the protective element 7000 ' can be overlappingly set to the photosensitive element 20 ' the chip back 25 ', wherein the protective element 7000 ' has an exposed region 7100 ' and is looped around described exposed One embedding region 7200 ' of 7100 ' surrounding of region, wherein the back side molded section 41 ' embeds the substrate of the substrate 31 ' At least part region at the back side 312 ' and the embedding region 7200 ' of the protective element 7000 ', so that the back side mould Modeling portion 41 ', the substrate 31 ', the photosensitive element 20 ' and the protective element 7000 ' integrally combine.That is, institute It can be in surround to state back side molded section 41 ', to form the assembly space 410 ' at the middle part of the back side molded section 41 ', Described in protective element 7000 ' the exposed region 7100 ' correspond to the back side molded section 41 ' the assembly space 410’。

In an example of the camera module 100 of the utility model, the protective element 7000 ' can be but not It is limited to one layer of ink or layer protecting film, for protecting the chip back 25 ' of the photosensitive element 20 '.In this reality In another example with the novel camera module 100, the protective element 7000 ' can also be implemented as heat dissipation member Part, such as the protective element 7000 ' may be implemented as but are not limited to aluminium flake, copper sheet etc., are overlappingly set to described The chip back 25 ' of photosensitive element 20 ', in this way, the heat that the photosensitive element 20 ' generates can be rapidly transferred to The protective element 7000 ' and radiated by the protective element 7000 ', with ensure the camera module 100 by it is long when Between use when reliability.

Attached drawing 49 shows that another variant embodiment of the camera module 100, the camera module 100 are further Including an at least lens barrel 90 ', wherein the optical lens 10 ' is assembled in the lens barrel 90 ', the lens barrel 90 ' is mounted on The outer surface 423 ' of the molded base 42 ', to make the optical lens 10 ' be maintained at by the lens barrel 90 ' The photosensitive path of the photosensitive element 20 '.

Attached drawing 50 shows another variant embodiment of the camera module 100, and the lens barrel 90 ' can be integrally Extend the top surface of the molded base 42 ', that is, the lens barrel 90 ' and the molded base 42 ' by moulding technology integrally It is formed.

Attached drawing 51 shows another variant embodiment of the camera module 100, and the optical lens 10 ' can also It is directly mounted on the top surface of the molded base 42 ', so that the optical lens 10 ' is maintained at the photosensitive element 20 ' photosensitive path.

Attached drawing 52 shows another variant embodiment of the camera module 100, is pasted by the optical lens 10 ' After top surface loaded on the molded base 42 ', the lens barrel 90 ' can also be mounted on to the top of the molded base 42 ' Surface, so that the lens barrel 90 ' is looped around the surrounding of the optical lens 10 ', to by avoiding the optical lens 10 ' naked The mode of dew protects the optical lens 10 '.Nevertheless, it will be appreciated by those skilled in the art that, the lens barrel 90 ' The top surface of the molded base 42 ' can also integrally be extended.

Attached drawing 53 shows another variant embodiment of the camera module 100, before moulding technology, the filter Optical element 50 ' can also be directly mounted on the substrate front side 311 ' of the substrate 31 ', in the institute of the substrate 31 ' The corresponding position of substrate channel 310 ' is stated, the shape between the substrate 31 ', the photosensitive element 20 ' and the filter element 50 ' At a sealing space 8000 ', wherein the photosensitive region 22 ' of the photosensitive element 20 ' and the one of the non-photo-sensing region 23 ' Part is maintained at the sealing space 8000 ', in this way, in subsequent moulding technology, can avoid described Fluid media (medium) 400 ' pollutes the photosensitive region 22 ' of the photosensitive element 20 ', to improve the product of the camera module 100 Yield.Preferably, the molded base 42 ' embeds the outer edge of the filter element 50 ', so that the molded base 42 ', institute Filter element 50 ', the substrate 31 ', the photosensitive element 20 ' and the back side molded section 41 ' is stated integrally to combine.

Further, the buffer part 1 ' of 100 further frame shape of the camera module, wherein the buffer part 1 ' is set Between the filter element 50 ' and the substrate front side 311 ' of the substrate 31 ', the buffer part 1 ' is used for the filter Optical element 50 ' is mounted on the substrate front side 311 ' of the substrate 31 ', and for the filter element 50 ' and described to be isolated The substrate front side 311 ' of substrate 31 '.Preferably, the buffer part 1 ' has elasticity.It is noted that the buffer part 1 ' generation type is unrestricted in the camera module 100 of the utility model, such as can be first in the substrate 31 ' The substrate front side 311 ' applies such as, but not limited to substances such as resin or glue, then again by the filter element 50 ' weight It is set to the substrate front side 311 ' of the substrate 31 ' foldedly, is applied over the substrate front side 311 ' of the substrate 31 ' Resin or glue can be formed and be maintained between the filter element 50 ' and the substrate front side 311 ' of substrate 31 ' The buffer part 1 '.It will be appreciated by those skilled in the art that first forming the buffer part on the filter element 50 ' 1 ', the filter element 50 ' is then mounted on to the substrate front side 311 ' of the substrate 31 ' again, so that the buffer part 1 ' is maintained between the filter element 50 ' and the substrate front side 311 ' of the substrate 31 ' and is also possible that.

Attached drawing 54 shows that another variant embodiment of the camera module 100, the buffer part 1 ' can also weigh At least part region for covering the substrate front side 311 ' of the substrate 31 ' foldedly, to be formed in the molded base 42 ' Later, the buffer part 1 ' can be maintained at the molded base 42 ' and the substrate 31 ' the substrate front side 311 ' it Between.For example, in one embodiment of the utility model, can the substances such as resin or glue be first applied over the substrate At least part region of the 31 ' substrate front side 311 ', to form the substrate front side for being overlapped in the substrate 31 ' The buffer part 1 ' in 311 ' at least part region, then mounts the filter element 50 ' again, so that the buffer part 1 ' A part be maintained between the filter element 50 ' and the substrate front side 311 ' of the substrate 31 ', wherein described slow Portion 1 ' is rushed to prevent to generate gap between the filter element 50 ' and the substrate front side 311 ' of the substrate 31 ', thus The sealing space 8000 ' is formed between the substrate 31 ', the photosensitive element 20 ' and the filter element 50 '.Overlappingly The substrate can be protected in moulding technology by being formed in the buffer part 1 ' of the substrate front side 311 ' of the substrate 31 ' 31 ' the substrate front side 311 ', and in subsequent baking process, the buffer part 1 ' can also be by generating deformation Mode compensates the difference of the amplitude of deformation of the molded base 42 ' and the amplitude of deformation of the substrate 31 ', to ensure the camera shooting The reliability of module 100.

Attached drawing 55 shows another variant embodiment of the camera module 100, and the supporting member 70 ' can also It is formed in the outer edge of the filter element 50 ', to which after the completion of moulding technology, the molded base 42 ' embeds the branch Hold at least part of element 70 '.

Attached drawing 56 shows that another variant embodiment of the camera module 100, the camera module 100 are further Including a transparent protection element 9000 ', before moulding technology, the protection element 9000 ' is overlappingly set to described The substrate front side 311 ' of substrate 31 ', it is exposed to avoid the substrate front side 311 ' of the substrate 31 '.For example, described After substrate 31 ' is provided or is made into, overlappingly it is arranged in the substrate front side 311 ' of the substrate 31 ' transparent described Protection element 9000 ', such as the protection element 9000 ' can be but not limited to hyaline membrane.

When the photosensitive element 20 ' is mounted on the substrate back 312 ' of the substrate 31 ', in the substrate 31 ' 310 ' corresponding position of the substrate channel, in the substrate 31 ', the photosensitive element 20 ' and the protection element The sealing space 8000 ', and the photosensitive region 20 of the photosensitive element 20 ' and the non-sense are formed before 9000 ' The part in light region 23 ' is located at the sealing space 8000 ', in subsequent moulding technology, to avoid the photosensitive element 20 ' the photosensitive region 22 ' is contaminated.

In addition, the protection element 9000 ' can also protect the substrate front side 311 ' of the substrate 31 ' to be scraped off, To ensure the good electrical of the substrate 31 ', to be conducive to improve the product yield of the camera module 100.

Attached drawing 57 shows the vertical view state of an embodiment of the optical lens 10 ' of the camera module 100, The plan view shape of the wherein optical lens 10 ' is rounded.Specifically, the optical lens 10 ' has one first camera lens side Face 11 ', one second camera lens side 12 ', a third camera lens side 13 ', one the 4th camera lens side 14 ', one the 5th camera lens side 15 ', one the 6th camera lens side 16 ', one the 7th camera lens side 17 ' and one the 8th camera lens side 18 ', wherein being shown in attached drawing 57 The optical lens 10 ' this example in, first camera lens side 11 ', second camera lens side 12 ', described Three-lens side 13 ', the 4th camera lens side 14 ', the 5th camera lens side 15 ', the 6th camera lens side 16 ', institute It is cambered surface respectively to state the 7th camera lens side 17 ' and the 8th camera lens side 18 ', and end to end respectively, and forms circle Shape.Also, the optical lens 10 ' is respectively in first camera lens side 11 ' and second camera lens side 12 ', described the Three-lens side 13 ' and the 4th camera lens side 14 ', the 5th camera lens side 15 ' and the 6th camera lens side 16 ' with And the 7th camera lens side 17 ' and 18 ' corresponding position of the 8th camera lens side form a cambered surface side 102 '.Namely It says, there are four the cambered surface sides 102 ' for the tool of optical lens 10 '.

Attached drawing 58 shows the vertical view of a variant embodiment of the optical lens 10 ' of the camera module 100 State, wherein first camera lens side 11 ', second camera lens side 12 ', third camera lens side the 13 ', the described 4th Camera lens side 14 ', the 5th camera lens side 15 ', the 6th camera lens side 16 ', the 7th camera lens side 17 ' and institute It is cambered surface respectively to state the 8th camera lens side 18 ', and end to end respectively, and forms ellipse.Also, the optical lens 10 ' respectively in first camera lens side 11 ' and second camera lens side 12 ', third camera lens side 13 ' and described the Four camera lens sides 14 ', the 5th camera lens side 15 ' and the 6th camera lens side 16 ' and the 7th camera lens side 17 ' The cambered surface side 102 ' is formed with 18 ' the corresponding position of the 8th camera lens side.That is, the optical lens 10 ' has There are four the cambered surface sides 102 '.

Attached drawing 59 shows the vertical view of a variant embodiment of the optical lens 10 ' of the camera module 100 State, wherein first camera lens side 11 ' and second camera lens side 12 ' they are plane respectively, and first camera lens The plane where plane and second camera lens side 12 ' where side 11 ' is approximately the same plane, so that the optical lens 10 ' form a planar side 101 ' in first camera lens side 11 ' and second camera lens side, 12 ' corresponding position, wherein Third camera lens side 13 ', the 4th camera lens side 14 ', the 5th camera lens side 15 ', the 6th camera lens side 16 ', the 7th camera lens side 17 ' and the 8th camera lens side 18 ' are cambered surface respectively, so that the optical lens 10 ' In third camera lens side 13 ' and 14 ' the corresponding position of the 4th camera lens side, the 5th camera lens side 15 ' and institute It states 16 ' corresponding position of the 6th camera lens side and the 7th camera lens side 17 ' and the 8th camera lens side 18 ' is corresponding Position is respectively formed the cambered surface side 102 '.That is, there are one the planar side 101 ' and three for the tool of optical lens 10 ' A cambered surface side 102 '.

Attached drawing 60 shows bowing for another variant embodiment of the optical lens 10 ' of the camera module 100 Depending on state, wherein first camera lens side 11 ' and second camera lens side 12 ' they are plane respectively, and first mirror The plane where plane and second camera lens side 12 ' where rostral face 11 ' is approximately the same plane, so that the optical frames First 10 ' form the planar side 101 ' in first camera lens side 11 ' and second camera lens side, 12 ' corresponding position, The wherein described 5th camera lens side 15 ' and the 6th camera lens side 16 ' are plane respectively, and the 5th camera lens side The plane where plane and the 6th camera lens side 16 ' where 15 ' is approximately the same plane, so that the optical lens 10 ' The planar side 101 ' is formed in the 5th camera lens side 15 ' and 16 ' the corresponding position of the 6th camera lens side, wherein institute State third camera lens side 13 ' and the 4th camera lens side 14 ' and the 7th camera lens side 17 ' and the 8th camera lens side Face 18 ' is cambered surface respectively, so that the optical lens 10 ' is in third camera lens side 13 ' and the 4th camera lens side 14 ' Corresponding position forms the cambered surface side 102 ' and is corresponded in the 7th camera lens side 17 ' and the 8th camera lens side 18 ' Position form the cambered surface side 102 '.That is, there are two the planar side 101 ' and two for the tool of optical lens 10 ' The cambered surface side 102 ', and two planar sides 101 ' of the optical lens 10 ' are symmetrically, two cambered surface sides 102 ' symmetrically.

Attached drawing 61 shows bowing for another variant embodiment of the optical lens 10 ' of the camera module 100 Depending on state, wherein first camera lens side 11 ', second camera lens side 12 ', third camera lens side 13 ' and described 4th camera lens side 14 ' is plane respectively, and the plane where first camera lens side 11 ' and second camera lens side Plane where 12 ' is approximately the same plane, the plane where third camera lens side 13 ' and the 4th camera lens side 14 ' The plane at place is approximately the same plane, so that the optical lens 10 ' is in first camera lens side 11 ' and second camera lens It side 12 ' and is respectively formed in third camera lens side 13 ' and 14 ' the corresponding position of the 4th camera lens side described flat Surface side 101 ', and second camera lens side 12 ' and third camera lens side 13 ' are mutually perpendicular to, wherein the 5th mirror Rostral face 15 ' and the 6th camera lens side 16 ' and the 7th camera lens side 17 ' and the 8th camera lens side 18 ' point It is not cambered surface, so that the optical lens 10 ' is corresponding in third camera lens side 13 ' and the 4th camera lens side 14 ' Position forms the cambered surface side 102 ' and in the 7th camera lens side 17 ' and 18 ' the corresponding position of the 8th camera lens side Form the cambered surface side 102 '.That is, there are two the planar side 101 ' and two arcs for the tool of optical lens 10 ' Surface side 102 ', and two planar sides 101 ' are adjacent and two cambered surface sides 102 ' are adjacent.

Attached drawing 62 shows bowing for another variant embodiment of the optical lens 10 ' of the camera module 100 Depending on state, wherein first camera lens side 11 ', second camera lens side 12 ', third camera lens side 13 ', described Four camera lens sides 14 ', the 5th camera lens side 15 ' and the 6th camera lens side 16 ' are plane respectively, and described The plane where plane and second camera lens side 12 ' where one camera lens side 11 ' is approximately the same plane, the third mirror The plane where plane and the 4th camera lens side 14 ' where rostral face 13 ' is approximately the same plane, the 5th camera lens side The plane where plane and the 6th camera lens side 16 ' where face 15 ' is approximately the same plane, wherein second camera lens side Face 12 ' perpendicular to third camera lens side 13 ', the 4th camera lens side 14 ' perpendicular to the 5th camera lens side 15 ', To which the optical lens 10 ' is in first camera lens side 11 ' and second camera lens side, 12 ' corresponding position, described Third camera lens side 13 ' and 14 ' the corresponding position of the 4th camera lens side and the 5th camera lens side 15 ' and described the Six camera lens sides, 16 ' corresponding position is respectively formed the planar side 101 ', wherein the 7th camera lens side 17 ' and described the Eight camera lens sides 18 ' are cambered surface respectively, to which the optical lens 10 ' is in the 7th camera lens side 17 ' and the 8th mirror 18 ' corresponding position of rostral face forms the cambered surface side 102 '.That is, there are three described flat for the tool of optical lens 10 ' Surface side 101 ' and a cambered surface side 102 '.

Attached drawing 63 shows bowing for another variant embodiment of the optical lens 10 ' of the camera module 100 Depending on state, wherein first camera lens side 11 ', second camera lens side 12 ', third camera lens side 13 ', described Four camera lens sides 14 ', the 5th camera lens side 15 ', the 6th camera lens side 16 ', the 7th camera lens side 17 ' and institute It is plane respectively to state the 8th camera lens side 18 ', and the plane where first camera lens side 11 ' and second camera lens side Plane where face 12 ' is approximately the same plane, the plane where third camera lens side 13 ' and the 4th camera lens side Plane where 14 ' is approximately the same plane, the plane where the 5th camera lens side 15 ' and the 6th camera lens side 16 ' The plane at place is approximately the same plane, where the plane and the 8th camera lens side 18 ' where the 7th camera lens side 17 ' Plane be approximately the same plane, wherein second camera lens side 12 ' is perpendicular to third camera lens side 13 ', the described 4th Camera lens side 14 ' is perpendicular to the 5th camera lens side 15 ', and the 6th camera lens side 16 ' is perpendicular to the 7th camera lens side Face 17 ', the 8th camera lens side 18 ' is perpendicular to first camera lens side 11 ', to which the optical lens 10 ' is described First camera lens side 11 ' and second camera lens side, 12 ' corresponding position, third camera lens side 13 ' and the described 4th 14 ' corresponding position of camera lens side, the 5th camera lens side 15 ' and the 6th camera lens side 16 ' and the 7th mirror Rostral face 17 ' and 18 ' the corresponding position of the 8th camera lens side are respectively formed the planar side 101 '.That is, described There are four the planar sides 101 ' for the tool of optical lens 10 '.

Attached drawing 64 shows bowing for another variant embodiment of the optical lens 10 ' of the camera module 100 Depending on state, wherein first camera lens side 11 ', third camera lens side 13 ', the 5th camera lens side 15 ' and described 7th camera lens side 17 ' is plane respectively, so that the optical lens 10 ' is respectively in first camera lens side 11 ', institute It states third camera lens side 13 ', the 5th camera lens side 15 ' and 17 ' corresponding position of the 7th camera lens side and forms institute Planar side 101 ' is stated, and first camera lens side 11 ' and the 5th camera lens side 15 ' are symmetrically, the third mirror Rostral face 13 ' and the 7th camera lens side 17 ' symmetrically, wherein second camera lens side 12 ', the 4th camera lens side Face 14 ', the 6th camera lens side 16 ' and the 8th camera lens side 18 ' are cambered surface respectively, so that the optical frames First 10 ' respectively in second camera lens side 12 ', the 4th camera lens side 14 ', the 6th camera lens side 16 ' and institute It states 18 ' corresponding position of the 8th camera lens side and forms the cambered surface side 102 ', and second camera lens side 12 ' and described the Symmetrically, the 4th camera lens side 14 ' and the 8th camera lens side 18 ' are symmetrical for six camera lens sides 16 '.Namely It says, there are four the planar side 101 ' and four cambered surface sides 102 ' for the tool of optical lens 10 ', and each plane Side 101 ' and each cambered surface side 102 ' are spaced.In other words, there are one described for tool between the adjacent planar side 101 ' Cambered surface side 102 ', there are one the planar sides 101 ' for tool between the adjacent cambered surface side 102 '.

It will be appreciated by those skilled in the art that above example is only for example, wherein the feature of different embodiments It can be combined with each other, do not explicitly pointed out in the accompanying drawings with obtaining being readily conceivable that according to the content that the utility model discloses Embodiment.

It should be understood by those skilled in the art that the embodiments of the present invention shown in foregoing description and attached drawing are only used as It illustrates and is not intended to limit the utility model.The purpose of this utility model completely and effectively realizes.The work(of the utility model Energy and structural principle show and illustrate in embodiment, under without departing from the principle, the embodiment of the utility model Can there are any deformation or modification.

Claims (80)

1. a camera module, which is characterized in that including：

An at least optical lens；

An at least molding unit, wherein the molding unit includes an at least back side molded section；

An at least photosensitive element, wherein the photosensitive element has a photosensitive region and is looped around the one of the photosensitive region surrounding Non-photo-sensing region；And

One circuit board, wherein the circuit board includes an at least substrate and an at least electronic component, the substrate has a base Plate front, a substrate back and an at least substrate channel, the substrate front side and the substrate back correspond, the base Board channel extends to the substrate back from the substrate front side, wherein the electronic component is connected to the base switched only Plate, wherein the part in the non-photo-sensing region of the photosensitive element is mounted on the substrate back of the substrate, and And the photosensitive element is connected to the substrate, the photosensitive region of the photosensitive element and the non-photo-sensing area switched only The another part in domain corresponds to the substrate channel of the substrate, and the optical lens is maintained at the sense of the photosensitive element Light path, wherein the back side molded section is integrally incorporated at least part region of the substrate back of the substrate.

2. camera module according to claim 1 further comprises a filler, wherein the filler is maintained at institute It states between the substrate back of substrate and the non-photo-sensing region of the photosensitive element, the substrate is formed in filling Gap between the substrate back and the non-photo-sensing region of the photosensitive element.

3. camera module according to claim 1, wherein the photosensitive element has a chip back, the back side molding Portion further embeds at least part region of the chip back of the photosensitive element.

4. camera module according to claim 1, electronic component is described in the substrate described in wherein at least one Substrate back is connected to the substrate switched only, and the substrate back of the substrate it is switched on be connected to it is described The electronic component of substrate protrudes from the substrate back of the substrate.

5. camera module according to claim 4, wherein back side molded section embedding protrudes from the described of the substrate At least part of at least one electronic component of substrate back.

6. according to any camera module in claim 1 to 5, wherein the molding unit further comprises an at least mould Pedestal is moulded, the molded base has an at least optical window, wherein the molded base is integrally incorporated into the described of the substrate At least part region of substrate front side, so that the molded base is looped around the four of the photosensitive region of the photosensitive element Week, and the part in the photosensitive region of the photosensitive element and the non-photo-sensing region corresponds to the molded base The optical window.

7. camera module according to claim 6, wherein the molded base further embeds the institute of the photosensitive element State the part in non-photo-sensing region.

8. camera module according to claim 7 further comprises the supporting member of an at least frame shape, wherein the bearing Element is arranged at the non-photo-sensing region of the photosensitive element or the supporting member is formed in the photosensitive element The non-photo-sensing region, the molded base embed at least part of the supporting member.

9. camera module according to claim 6 further comprises the holder of a filter element and a frame shape, wherein described Filter element is mounted on the holder, and the holder is mounted on the top surface of the molded base, so that the optical filtering is first Part is maintained between the optical lens and the photosensitive element.

10. camera module according to claim 6 further comprises a filter element, wherein the filter element is weighed It is set to the substrate front side of the substrate foldedly, between the filter element, the substrate and the photosensitive element A sealing space is formed in the corresponding position of the substrate channel of the substrate, wherein the photosensitive area of the photosensitive element The part in domain and the non-photo-sensing region is located at the sealing space.

11. camera module according to claim 10, wherein the molded base embeds the outer edge of the filter element.

12. camera module according to claim 11 further comprises the supporting member of an at least frame shape, wherein the branch Hold that element is arranged at the outer edge of the filter element or the supporting member is formed in the outside of the filter element Edge, the molded base embed at least part of the supporting member.

13. camera module according to claim 11 further comprises the buffer part of an at least frame shape, wherein the buffering At least part in portion is maintained between the filter element and the substrate front side of the substrate.

14. camera module according to claim 13 a, wherein part for the buffer part is maintained at the molding base Between seat and the substrate front side of the substrate.

15. camera module according to claim 6 further comprises a transparent protection element, wherein the protection is first Part is overlappingly set to the substrate front side of the substrate, in the protection element, the substrate and the photosensitive member A sealing space is formed in the corresponding position of the substrate channel of the substrate between part, wherein the photosensitive element is described The part in photosensitive region and the non-photo-sensing region is located at the sealing space.

16. camera module according to claim 6, electronic component is described in the substrate described in wherein at least one Substrate front side is connected to the substrate switched only, and the substrate front side of the substrate it is switched on be connected to it is described The electronic component of substrate protrudes from the substrate front side of the substrate.

17. camera module according to claim 16, wherein molded base embedding protrudes from the described of the substrate At least part of at least one electronic component of substrate front side.

18. according to any camera module in claim 1 to 5, further comprise an at least bearing, wherein the bearing With a light hole, wherein the bearing is mounted on the substrate front side of the substrate, so that the bearing is looped around institute State the surrounding of the photosensitive region of photosensitive element, and the photosensitive region of the photosensitive element and the non-photo-sensing region A part correspond to the bearing the light hole.

19. camera module according to claim 18 further comprises an at least driver, wherein the optical lens quilt It is driveably set to the driver, the driver is mounted on the top surface of the bearing；Or further comprise to A few lens barrel, wherein the optical lens is assembled in the lens barrel, the lens barrel is mounted on the top surface of the bearing；Or Person further comprises an at least lens barrel, wherein the optical lens is assembled in the lens barrel, the lens barrel integrally extends The bearing；Or further comprise a lens barrel, wherein the lens barrel and the optical lens are mounted on the bearing respectively Top surface, and the lens barrel is looped around the surrounding of the optical lens；Or further comprise an at least lens barrel, wherein institute It states lens barrel and integrally extends the bearing, the optical lens is mounted on the top surface of the bearing, and the lens barrel It is looped around the surrounding of the optical lens；Or the optical lens is mounted on the surrounding of the bearing.

20. camera module according to claim 6 further comprises an at least driver, wherein the optical lens quilt It is driveably set to the driver, the driver is mounted on the top surface of the molded base；Or it further wraps An at least lens barrel is included, wherein the optical lens is assembled in the lens barrel, the lens barrel is mounted on the molded base Top surface；Or further comprise an at least lens barrel, wherein the optical lens is assembled in the lens barrel, the lens barrel one Ground extends the molded base；Or further comprise a lens barrel, wherein the lens barrel and the optical lens are pasted respectively Top surface loaded on the molded base, and the lens barrel is looped around the surrounding of the optical lens；Or further comprise An at least lens barrel, wherein the lens barrel integrally extends the molded base, the optical lens is mounted on the molding The top surface of pedestal, and the lens barrel is looped around the surrounding of the optical lens；Or the optical lens is mounted on institute State the surrounding of molded base.

21. according to any camera module in claim 7 to 17, further comprise an at least driver, wherein described Optical lens is driveably set to the driver, and the driver is mounted on the top surface of the molded base；Or Person further comprises an at least lens barrel, wherein the optical lens is assembled in the lens barrel, the lens barrel is mounted on described The top surface of molded base；Or further comprise an at least lens barrel, wherein the optical lens is assembled in the lens barrel, institute It states lens barrel and integrally extends the molded base；Or further comprise a lens barrel, wherein the lens barrel and the optical frames Head is mounted on the top surface of the molded base respectively, and the lens barrel is looped around the surrounding of the optical lens；Or Further comprise an at least lens barrel, wherein the lens barrel integrally extends the molded base, the optical lens is mounted In the top surface of the molded base, and the lens barrel is looped around the surrounding of the optical lens；Or the optical lens It is mounted on the surrounding of the molded base.

22. according to any camera module in claim 1 to 5,7 to 17, wherein the shape of the back side molded section is in " mouth " font；Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " word Shape；Or the shape of the back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or The shape of the back side molded section is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back of the body The shape of face molded section is L-shaped；Or the shape of the back side molded section is in " C " font；Or the back side molded section Shape is in " day " font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in Sphere of movements for the elephants shape；Or the shape of the back side molded section is in latticed；Or the shape of the back side molded section is square；Or The shape of back side molded section described in person is rectangle；Or the shape of the back side molded section is trapezoidal；Or the back side mould The shape in modeling portion is rounded；Or the shape of the back side molded section is oval.

23. camera module according to claim 6, wherein the shape of the back side molded section is in " mouth " font；Or institute The shape for stating back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or the back side The shape of molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side molded section Shape is in " III " font；Or the shape of the back side molded section is in " X " font；Or the shape of the back side molded section is in " L " shape；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " font；Or The shape of back side molded section described in person is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or it is described The shape of back side molded section is in latticed；Or the shape of the back side molded section is square；Or the back side molded section Shape be rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section is rounded； Or the shape of the back side molded section is oval.

24. camera module according to claim 18, wherein the shape of the back side molded section is in " mouth " font；Or institute The shape for stating back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or the back side The shape of molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side molded section Shape is in " III " font；Or the shape of the back side molded section is in " X " font；Or the shape of the back side molded section is in " L " shape；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " font；Or The shape of back side molded section described in person is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or it is described The shape of back side molded section is in latticed；Or the shape of the back side molded section is square；Or the back side molded section Shape be rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section is rounded； Or the shape of the back side molded section is oval.

25. camera module according to claim 19, wherein the shape of the back side molded section is in " mouth " font；Or institute The shape for stating back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or the back side The shape of molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side molded section Shape is in " III " font；Or the shape of the back side molded section is in " X " font；Or the shape of the back side molded section is in " L " shape；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " font；Or The shape of back side molded section described in person is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or it is described The shape of back side molded section is in latticed；Or the shape of the back side molded section is square；Or the back side molded section Shape be rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section is rounded； Or the shape of the back side molded section is oval.

26. according to any camera module in claim 1 to 5,7 to 17, wherein the circuit board includes a connecting plate, There is the wherein described connecting plate module connecting side, the module connecting side to be mounted on the substrate back of the substrate, Either the module connecting side of the connecting plate is mounted on the substrate front side of the substrate or the connecting plate The module connecting side integrally extends the substrate.

27. camera module according to claim 6, wherein the circuit board includes a connecting plate, wherein the connecting plate With a module connecting side, the module connecting side is mounted on the substrate back of the substrate or the connecting plate The module connecting side be mounted on the substrate front side of the substrate or the module connecting side of the connecting plate Integrally extend the substrate.

28. camera module according to claim 18, wherein the circuit board includes a connecting plate, wherein the connecting plate With a module connecting side, the module connecting side is mounted on the substrate back of the substrate or the connecting plate The module connecting side be mounted on the substrate front side of the substrate or the module connecting side of the connecting plate Integrally extend the substrate.

29. camera module according to claim 19, wherein the circuit board includes a connecting plate, wherein the connecting plate With a module connecting side, the module connecting side is mounted on the substrate back of the substrate or the connecting plate The module connecting side be mounted on the substrate front side of the substrate or the module connecting side of the connecting plate Integrally extend the substrate.

30. according to any camera module in claim 1 to 5,7 to 17, wherein the vertical view state of the optical lens It is rounded；Or the vertical view state of the optical lens is oval；Or the vertical view state of the optical lens is square.

31. according to any camera module in claim 1 to 5,7 to 17, wherein the optical lens has a plane Side and a cambered surface side, wherein the both sides of the planar side are connected with the both sides of the cambered surface side respectively；Or the light Learning camera lens has two planar sides and a cambered surface side, wherein the side of a side and the cambered surface side for any one of planar side Portion is connected, another side is connected with the side of planar side described in another；Or the optical lens has two planes Side and two cambered surface sides, planar side described in two of which is symmetrical, and two cambered surface sides are symmetrical, wherein any one institute The side for stating planar side is connected with the side of two cambered surface sides respectively；Or the optical lens have four planar sides and Four cambered surface sides, wherein planar side described in each two are symmetrical, and cambered surface side described in each two is symmetrical, and any one institute The side for stating planar side is connected with the side of two cambered surface sides respectively.

32. an electronic equipment, which is characterized in that including：

One apparatus body；With

According to any at least one camera module in claims 1 to 31, wherein the camera module is set In the apparatus body.

33. a molded circuit board component, which is characterized in that including：

An at least molding unit, wherein the molding unit includes a back side molded section；

An at least photosensitive element, wherein the photosensitive element has a photosensitive region and is looped around the one of the photosensitive region surrounding Non-photo-sensing region；And

One circuit board, wherein the circuit board includes an at least substrate and an at least electronic component, the substrate has a base Plate front, a substrate back and an at least substrate channel, the substrate front side and the substrate back correspond, the base Board channel extends to the substrate back from the substrate front side, wherein the electronic component is connected to the base switched only Plate, wherein the part in the non-photo-sensing region of the photosensitive element is mounted on the substrate back of the substrate, and And the photosensitive element is connected to the substrate, the photosensitive region of the photosensitive element and the non-photo-sensing area switched only The another part in domain corresponds to the substrate channel of the substrate, wherein the back side molded section is integrally incorporated into the base At least part region of the substrate back of plate.

34. molded circuit board component according to claim 33, further comprises a filler, wherein the filler quilt It is maintained between the substrate back of the substrate and the non-photo-sensing region of the photosensitive element, institute is formed in filling State the gap between the substrate back of substrate and the non-photo-sensing region of the photosensitive element.

35. molded circuit board component according to claim 33, wherein the photosensitive element has a chip back, it is described Back side molded section further embeds at least part region of the chip back of the photosensitive element.

36. molded circuit board component according to claim 33, electronic component is in the base described in wherein at least one The substrate back of plate is connected to the substrate switched only, and the substrate back of the substrate it is switched on even The electronic component for being connected to the substrate protrudes from the substrate back of the substrate.

37. molded circuit board component according to claim 36, wherein back side molded section embedding protrudes from the base At least part of at least one electronic component of the substrate back of plate.

38. according to any molded circuit board component in claim 33 to 37, wherein the molding unit further wraps Include an at least molded base, the molded base has an at least optical window, wherein the molded base be integrally incorporated into it is described At least part region of the substrate front side of substrate, so that the molded base is looped around the sense of the photosensitive element The surrounding in light region, and the part in the photosensitive region of the photosensitive element and the non-photo-sensing region is corresponding to described The optical window of molded base.

39. according to the molded circuit board component described in claim 38, further comprise the supporting member of an at least frame shape, wherein The supporting member is arranged at the non-photo-sensing region of the photosensitive element or the supporting member is formed in the sense The non-photo-sensing region of optical element, the molded base embed at least part of the supporting member.

40. according to the molded circuit board component described in claim 38, further comprise a filter element, wherein the optical filtering is first Part is overlappingly set to the substrate front side of the substrate, in the filter element, the substrate and the photosensitive member A sealing space is formed in the corresponding position of the substrate channel of the substrate between part, wherein the photosensitive element is described The part in photosensitive region and the non-photo-sensing region is located at the sealing space.

41. molded circuit board component according to claim 40, wherein the molded base embeds the filter element Outer edge.

42. molded circuit board component according to claim 41 further comprises the supporting member of an at least frame shape, wherein The supporting member is arranged at the outer edge of the filter element or the supporting member is formed in the filter element Outer edge, the molded base embed at least part of the supporting member.

43. molded circuit board component according to claim 41 further comprises the buffer part of an at least frame shape, wherein institute At least part for stating buffer part is maintained between the filter element and the substrate front side of the substrate.

44. molded circuit board component according to claim 43, wherein a part for the buffer part be maintained at it is described Between molded base and the substrate front side of the substrate.

45. according to the molded circuit board component described in claim 38, further comprise a transparent protection element, wherein described Protection element is overlappingly set to the substrate front side of the substrate, in the protection element, the substrate and described A sealing space is formed in the corresponding position of the substrate channel of the substrate between photosensitive element, wherein the photosensitive element The photosensitive region and the part in the non-photo-sensing region be located at the sealing space.

46. according to the molded circuit board component described in claim 38, electronic component is in the base described in wherein at least one The substrate front side of plate is connected to the substrate switched only, and the substrate front side of the substrate it is switched on even The electronic component for being connected to the substrate protrudes from the substrate front side of the substrate.

47. molded circuit board component according to claim 46, wherein molded base embedding protrudes from the substrate The substrate front side at least one electronic component at least part.

48. according to any molded circuit board component in claim 33 to 37,39 to 47, wherein the circuit board includes One connecting plate, wherein there is the connecting plate module connecting side, the module connecting side to be mounted on the described of the substrate The module connecting side of substrate back or the connecting plate is mounted on the substrate front side of the substrate, Huo Zhesuo The module connecting side for stating connecting plate integrally extends the substrate.

49. according to the molded circuit board component described in claim 38, wherein the circuit board includes a connecting plate, wherein described There is connecting plate a module connecting side, the module connecting side to be mounted on the substrate back or described of the substrate The module connecting side of connecting plate is mounted on the substrate front side of the substrate or the module of the connecting plate Connecting side integrally extends the substrate.

50. according to any molded circuit board component in claim 33 to 37,39 to 47, wherein the circuit board includes There is a module connecting side, the module connecting side to be mounted on the substrate of the substrate for one connecting plate, the connecting plate The back side, the back side molded section embed the module connecting side of the connecting plate.

51. according to the molded circuit board component described in claim 38, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate back of the substrate, the back side molding Portion embeds the module connecting side of the connecting plate.

52. according to the molded circuit board component described in claim 38, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

53. according to the molded circuit board component described in claim 37, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

54. according to the molded circuit board component described in claim 38, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

55. molded circuit board component according to claim 39, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

56. molded circuit board component according to claim 40, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

57. molded circuit board component according to claim 41, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

58. molded circuit board component according to claim 42, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

59. molded circuit board component according to claim 43, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

60. molded circuit board component according to claim 44, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

61. molded circuit board component according to claim 45, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

62. molded circuit board component according to claim 46, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

63. molded circuit board component according to claim 47, wherein the circuit board includes a connecting plate, the connection There is plate a module connecting side, the module connecting side to be mounted on the substrate front side of the substrate, the molded base Embed the module connecting side of the connecting plate.

64. according to any molded circuit board component in claim 33 to 37, wherein the shape of the back side molded section In " mouth " font；Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " Font；Or the shape of the back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or The shape of back side molded section described in person is in " III " font；Or the shape of the back side molded section is in " X " font；Or it is described The shape of back side molded section is L-shaped；Or the shape of the back side molded section is in " C " font；Or the back side molded section Shape be in " day " font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section In sphere of movements for the elephants shape；Or the shape of the back side molded section is in latticed；Or the shape of the back side molded section is square； Or the shape of the back side molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the back side The shape of molded section is rounded；Or the shape of the back side molded section is oval.

65. according to the molded circuit board component described in claim 38, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

66. molded circuit board component according to claim 39, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

67. molded circuit board component according to claim 40, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

68. molded circuit board component according to claim 41, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

69. molded circuit board component according to claim 42, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

70. molded circuit board component according to claim 43, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

71. molded circuit board component according to claim 44, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

72. molded circuit board component according to claim 45, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

73. molded circuit board component according to claim 46, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

74. molded circuit board component according to claim 47, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

75. molded circuit board component according to claim 48, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

76. molded circuit board component according to claim 49, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

77. molded circuit board component according to claim 50, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

78. molded circuit board component according to claim 51, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

79. molded circuit board component according to claim 52, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.

80. molded circuit board component according to claim 53, wherein the shape of the back side molded section is in " mouth " font； Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or institute The shape for stating back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side mould The shape in modeling portion is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " Font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or The shape of back side molded section described in person is in latticed；Or the shape of the back side molded section is square；Or the back side The shape of molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section It is rounded；Or the shape of the back side molded section is oval.