CN109891870A - Camera module and array camera module based on integral packaging technique - Google Patents

Camera module and array camera module based on integral packaging technique Download PDF

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Publication number
CN109891870A
CN109891870A CN201780049556.1A CN201780049556A CN109891870A CN 109891870 A CN109891870 A CN 109891870A CN 201780049556 A CN201780049556 A CN 201780049556A CN 109891870 A CN109891870 A CN 109891870A
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CN
China
Prior art keywords
filter element
microscope base
camera module
base
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201780049556.1A
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Chinese (zh)
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CN109891870B (en
Inventor
王明珠
赵波杰
陈振宇
郭楠
田中武彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201610668807.1A external-priority patent/CN107734215B/en
Priority claimed from CN201621124404.2U external-priority patent/CN206725921U/en
Priority claimed from CN201621124509.8U external-priority patent/CN206725922U/en
Priority claimed from CN201621124964.8U external-priority patent/CN206696574U/en
Priority claimed from CN201610898430.9A external-priority patent/CN107957649A/en
Priority to CN202110534866.0A priority Critical patent/CN113992818A/en
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority claimed from PCT/CN2017/097425 external-priority patent/WO2018028718A1/en
Publication of CN109891870A publication Critical patent/CN109891870A/en
Publication of CN109891870B publication Critical patent/CN109891870B/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A kind of camera module and array camera module based on integral packaging technique, camera module includes: wiring board (212), integral base (211), photosensitive element (220), camera lens (230), filter element microscope base (240) and the filter element (250) for being installed on filter element microscope base；Filter element microscope base (240) is supported at least part top surface (2113) of integral base, and filter element microscope base (240) cooperates integral base (211) and forms an optical window (2111), provides passage of light for photosensitive element (220)；Wherein integral base (211) integral packaging in wiring board (212) and photosensitive element (220) and embeds photosensitive element connector (221), wiring board connector (222) and connecting line (223), and make the distance between the inward flange of the top surface (2113) of integral base (211) and the optical axis of camera module no more than the distance between the outer edge of wiring board connector (222) and optical axis of camera module, so that the top surface (2113) of integral base (211) provides greater area of mounting surface.

Description

Camera module and array camera module based on integral packaging technique Technical field
The present invention relates to camera module fields, further, are related to a camera module and array camera module based on integral packaging technique.
Background technique
Camera module is scarce one of the component that can not obtain of intelligent electronic device, citing ground but be not limited to the intelligent electronic devices such as smart phone, camera, computer equipment, wearable device.And with the continuous development of various smart machines and popularize, the requirement to camera module is also higher and higher.
In recent years, intelligent electronic device generates the development advanced by leaps and bounds, increasingly tend to lightening, and camera module will adapt to its development, also multifunction, lightening, miniaturization are increasingly required, so that intelligent electronic device can do more and more thinner, and meet equipment for the imaging requirements of camera module.Therefore camera module production firm is persistently dedicated to design, manufactures the camera module for meeting these requirements.
Molded packages technology is the emerging a kind of encapsulation technology to grow up on the basis of traditional COB encapsulation.It as shown in Figure 1A, is the circuit board encapsulated using existing molded packages technology.In this configuration, molded section 1 is packaged in by way of molded packages circuit board 2, chip 3 is then connected to circuit board 2, optical filter 4 is installed in the molded section 1.Wherein molded section 1 coats the electronic component 5 on circuit board, to reduce independent the space occupied of electronic component 5 of camera module, the size of camera module is reduced, and solves the problems, such as that the dust adhered on electronic component influences the image quality of camera module.
B is the circuit board of traditional COB encapsulation referring to Fig.1, and chip is affixed on circuit board 2, and microscope base 7 is mounted on circuit board 2.More specifically, 7 bottom of microscope base has support leg 701, microscope base 7 is pasted on circuit board 2 by support leg 701.However, because microscope base 7 needs to avoid electronic component 5,701 bottom side area of support leg is smaller, to which the contact area between support leg 701 and circuit board 2 is smaller, correspondingly, bond area between the two is also limited, the camera module obtained in this way based on traditional COB encapsulation technology, support leg 701 is easy to be detached from circuit board 2, so that being not connected firmly between microscope base 7 and circuit board 2 is leaned on.And, microscope base 7 will generally arrange in pairs or groups camera lens or the lens assembly with driver or fixed lens barrel, microscope base 7 can be all transferred to the lesser support leg 701 of size by the stress of top camera lens or lens assembly in this way, so that the excessively stress of support leg 701 is easy to cause to concentrate and damage.In addition, the part that the support leg 701 of traditional microscope base 7 and top are used to carry optical filter requires predetermined thickness, the thickness of microscope base 7 traditional in this way can be larger, will be typically higher than 0.7mm.
Relative to traditional COB encapsulation technology, molded packages technology has numerous advantages, for example substitutes microscope base 7 by the molded section 1, reduces the occupied space alone of electronic component 5, reduces camera module ruler；It avoids Adhesive dust influences the image quality etc. of camera module on electronic component 5, but this structure also brings some new problems simultaneously.
Optical filter is in modern camera shooting film group and its an important element, and optical filter filters the infrared light in light, so that light is more nearly the effect of eye-observation.It is more expensive since optical filter is easy that the specific gravity for being damaged and accounting in the cost of entire camera module is larger, and area is bigger, and the area of optical filter is bigger, the accuracy of manufacture is more difficult to control, therefore in molded packages technology, and optical filter becomes a practical difficulties.
First, relative to traditional COB packaged type, molded packages mode passes through molded section coated electric components 5, the spatial position of electronic component 5 is utilized, but microscope base of the molded section relative to COB, increase the installation space of top optical filter 4, that is to say, that the area for the optical filter 4 that molded packages need is larger.
Specifically, B referring to Fig.1, optical filter is installed in the microscope base 7 in traditional COB, since microscope base 7 is installed in the later period on circuit board 2, therefore different shape can be fabricated to, for example it extends internally, so as on the basis of guaranteeing that photosensitive region is not blocked, reduce the area of optical filter as much as possible, to on the basis of guaranteeing use demand, it is more convenient to install, and the optical filter price of small area is lower, so that the cost of whole camera module reduces, and in molded packages, molded section 1 is shaped in circuit board 2 by mold, molded section integrally extends from the bottom to top, therefore the area of optical filter 4 is determined by the opening of molded section 1, the area of the optical filter 4 needed is larger.
Secondly, in molded packages mode, A referring to Fig.1, optical filter 4 needs to be installed in the groove 6 of the molded section 1, and is based on molded packages technique, more difficult to control for the shape at turning mouthful, that is, form the position that the cell wall of the groove 6, especially cell wall connect, in fact it could happen that deformation, such as there is burr, it to which good mounting condition cannot be provided for the optical filter 4, not can guarantee smooth, and be easy to damage optical filter.And for traditional microscope base 7, there is inner groovy 8, that is to say, that the microscope base 7 can extend internally, and provide the position for carrying optical filter 4, and the mounting area of the optical filter 4 is reduced.And since molding is one-pass molding, there are problems that draft during manufacturing by mold, therefore traditional mirror-seat structure can not be manufactured by way of molding, therefore molded packages are limited to some specific structures, such as the molded section 1 without the inner groovy 8.Between traditional microscope base and molded packages microscope base and corresponding moulding process, some opposite advantage and disadvantage are individually present, it is therefore desirable to be combined both two advantage.
Third, even if the molded section 1 forms platform-like, without forming the groove 6, it is ensured that the preferable planarization in surface provides preferable mounting condition for the optical filter 4.But in this configuration, the needs of one side optical filter 4 and encapsulation part described in other component such as camera lenses or driver coordinated allocation, such case is more demanding to installation accuracy, and other component is easy to damage optical filter during installation；On the other hand, optical filter is closer apart from the distance of camera lens, and the eyeglass in camera lens is easy to touch optical filter, and increases the back focal length of camera lens.
In addition, needing to install the photosensitive element, the electronic component and molded section on the circuit board, the layout type of these components, which will affect, needs the area of circuit board, and the molding mode based on encapsulation part, usually wide Degree can be greater than the width of traditional microscope base, therefore increase footprint area on circuit boards.
Summary of the invention
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein the camera module includes a filter element microscope base, the integral base of the filter element microscope base and camera module matches, and the different components for the camera module provide support.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein the filter element microscope base provides suitable installation site for filter element, so that filter element does not need the integral base for being directly mounted to the camera module.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein the filter element microscope base has a support slot, the filter element is suitable for being installed in the support slot, so that the opposite sinking in the filter element position.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein the filter element microscope base has an engaging groove, the engaging groove is adapted to engage in the integral base, so that the relative altitude of the filter element microscope base and the integral base reduces, so that the filter element is more adjacent to the photosensitive element of camera module.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, it is described interior to prolong arm and extend inwardly to form the support slot from the lower body part wherein the filter element microscope base includes prolonging arm in a main body and at least one.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein filter element microscope base portion includes an at least sinking arm, the sinking arm longitudinally extends from the main body, prolong arm in described to be laterally extended from the sinking arm, is respectively formed the engaging groove and the support slot.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein the integral base has an at least notch, it is connected to outside, the filter element microscope base includes an at least extension edge, the extension edge and the notch are corresponding, adapt to the different transverse widths of the integral base.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein the filter element microscope base includes Yan Bi on one, the upper Yan Bi constraint limits the driver of the camera module or the position of camera lens, so that the optical axis of the camera module is consistent.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique; the stress being subject to when the filter element is directly mounted to the integral base is wherein alleviated by the filter element microscope base, protects filter element.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein the array camera module includes a disjunctor filter element microscope base, it is formed by least two filter element microscope base integrally connecteds, in order to support multiple filter elements simultaneously, to guarantee one between multiple camera module monomers Cause property.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein the integral base of the camera module is integrally packaged in the non-photo-sensing area of a wiring board and a photosensitive element, thus relative to the wiring board is only integrally packaged in, the top surface that the integral base has area bigger, to the optical device above the camera module, such as filter element microscope base, camera lens or lens assembly provide larger-sized smooth mounting surface.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein for convenience of moulding technology stripping operation and avoid stray light, the inner surface of the integral base usually extends inclinedly to form the gradually big optical window that is open from bottom to up, the area that will lead to the top surface of the integral base in this way, which can be intended to reduce, to be unable to provide enough mounting areas, photosensitive element and its connecting line are not encapsulated relative to the integral base and are only integrally packaged in the wiring board edge, this mode needs to reserve the space that routing connects between the wiring board and the photosensitive element, locational space above photosensitive element connector and wiring board connector and connecting line can make full use of using the integral base for being integrally packaged in the wiring board and the photosensitive element, make institute The outer edge that integral base is no more than the wiring board connector along the end of the inner surface that cannot provide mounting surface that the direction far from the photosensitive element obliquely extends from the photosensitive element is stated, so as to strive for greater area of mounting surface for the top side of the integral base.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein the integral base is integrally packaged in the wiring board and the photosensitive element and integrally embeds the connecting line, to prevent that stray light is reflexed to the photosensitive element because of the exposed connecting line.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein the sub-assembly of the filter element microscope base and the integral base substitutes traditional microscope base, to traditional microscope base relative to installation filter element, the thickness of the filter element microscope base is reduced, and filter element microscope base thickness of the present invention is in 0.7mm or less.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wiring board is wherein pasted on by support leg relative to microscope base in traditional camera module, the bottom surface of the filter element microscope base of the filter element of arranging in pairs or groups provides the bond area bigger with the integral base, to the filter element microscope base be able to can with it is more firm the integral base ins conjunction with, and the stress that is subject to of the filter element microscope base can be more effectively to the integral base and wiring board transmitting.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, in some embodiments, the inner surface of the filter element microscope base and the inner surface of the integral base form inner chamfer shape, so as to effectively prevent veiling glare, veiling glare is avoided to reach the photosensitive element.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein in some embodiments, the filter element is arranged at the filter element microscope base so as to reduce the area of the filter element, such as at least part outer edge of the filter element is made to be located at the one The inside of the inward flange of the top surface of pedestal so that the filter element is assembled in the filter element microscope base relative to the area for being assembled in the integral base and being reduced the filter element, and prevents filter element from damaging and fragmentation.
It is an object of the present invention to provide one camera module and array camera module based on integral packaging technique, wherein in some embodiments, the height of the electronic component is greater than the height of the connecting line between the photosensitive element and the wiring board, and the step surface of the formation mounting groove of the integral base top side can be not higher than on height but the height of the connecting line between the photosensitive element and the wiring board of the electronic component, to make the position of the filter element microscope base and the filter element further sink, to reduce the height of the camera module.
In order to realize that the above at least purpose of the invention, an aspect of of the present present invention provide a camera module, the camera module includes: at least one integrated base assembly；An at least photosensitive element；An at least camera lens；At least a filter element microscope base and at least a filter element；Wherein the integral base component includes an integral base and a circuit board, and the integral base integral packaging is in the circuit board；Wherein the photosensitive element is operatively connected to the circuit board, the filter element microscope base is installed in the integral base, the integral base is cooperated to form an optical window, passage of light is provided for the photosensitive element, the filter element is arranged at the filter element microscope base, so that the filter element is located at the photosensitive path of the photosensitive element；Wherein the camera lens is located at the photosensitive path of the photosensitive element.
According to some embodiments, filter element microscope base described in the camera module includes prolonging arm in a filter element microscope base main body and at least one, prolonging arm in described, from the filter element microscope base main part laterally one extends, and forms a support slot, is suitable for installing the filter element.
According to some embodiments, filter element microscope base described in the camera module is including prolonging arm in a filter element microscope base main body, at least a sinking arm and at least one, the sinking arm extends to form an engaging groove with turning to from the filter element microscope base main body, it is adapted to engage in the integral base, prolong arm in described and extend to form a support slot with turning to from the sinking arm, is suitable for that the filter element is installed.
According to some embodiments, the adjacent interior arm that prolongs forms a turning mouthful in the camera module, and the turning mouthful extends outwardly from the optical window, in order to increase the luminous flux in the turning mouthful position.
According to some embodiments, sinking arm described in the camera module extends from the direction that the filter element microscope base main body turns to the neighbouring photosensitive element, and the filter element sinks adjacent to the photosensitive element.
According to some embodiments, described in the camera module in prolong arm and laterally extend internally from the sinking arm, to reduce the filter element mounting area.
According to some embodiments, integral base described in the camera module has an at least mounting groove and an at least notch, the mounting groove is connected to the optical window, the notch is connected to the optical window and outside, the filter element microscope base main body of the filter element microscope base includes an at least jointing edge and an at least extension side, the jointing edge is adapted to engage in the mounting groove, and the extension side is suitable for filling the notch and forms an enclosed environment.
According to some embodiments, integral base described in the camera module includes three mounting grooves, the mounting groove forms a U-shaped structure, and the filter element microscope base main body of the filter element microscope base has three jointing edges, is adapted to engage with forming a U-shaped structure in the mounting groove.
According to some embodiments, integral base described in the camera module has two mounting grooves and two notches, the mounting groove is connected to the optical window, the notch is connected to the optical window and outside, the filter element microscope base main body of the filter element microscope base includes two jointing edges and two extension sides, two jointing edges are adapted to engage in two mounting grooves, and the two extension sides are suitable for extending two notches and form an enclosed environment.
According to some embodiments, the mounting groove of two of integral base described in the camera module is opposite, and two notches are opposite, and two jointing edges of the filter element microscope base are opposite, and the two extension sides are opposite.
According to some embodiments, the mounting groove of two of integral base described in the camera module is adjacent, and two notches are adjacent, and two jointing edges of the filter element microscope base are adjacent, and the two extension sides are adjacent.
According to some embodiments, integral base described in the camera module has a mounting groove and three notches, the mounting groove is connected to the optical window, the notch is connected to the optical window and outside, the filter element microscope base main body of the filter element microscope base includes a jointing edge and three extension sides, the jointing edge is adapted to engage in the mounting groove, and the three extension sides are suitable for extending three notches and form an enclosed environment.
According to some embodiments, filter element microscope base described in the camera module includes Yan Bi on one, and the upper Yan Bi upwardly extends to form a limited mouth with turning to from the filter element microscope base main body.
According to some embodiments, filter element microscope base described in the camera module includes the downward wall of Yan Bi and one on one, the upper Yan Bi upwardly extends to form a limited mouth with turning to from the filter element microscope base main body, and the downward wall is downwardly extending from the filter element microscope base main body and wraps mouth with turning to.
According to some embodiments, filter element microscope base described in the camera module has a utensil receiving opening, for accommodating the filter element, so that the filter element is located at the photosensitive path of the photosensitive element.
According to some embodiments, integral base described in the camera module includes a Base body, the Base body integral packaging is in the circuit board, the Base body is at least one opening, it is connected to the optical window and outside, the filter element microscope base is complemented at the opening, forms the optical window.
According to some embodiments, opening is in the inverted trapezoidal structure being gradually increased from the bottom to top described in the camera module.
According to some embodiments, filter element microscope base described in the camera module is at least partly connected to the circuit board.
According to some embodiments, filter element microscope base described in the camera module includes at least one extension leg, the extension leg integrally extends downward into the circuit board from the filter element microscope base main body, supplements the opening of the integral base, so that the optical window periphery seal.
According to some embodiments, opening described in the camera module is in the inverted trapezoidal structure being gradually increased from the bottom to top, and the leg that extends is matched in the shape of inverted trapezoidal and the opening, in order to be limited by the opening The position filter element microscope base.
According to some embodiments, the camera module includes an at least driver, and the driver is at least partly selectively mounted at the integral base and the filter element microscope base, and the camera lens is installed in the driver.
According to some embodiments, camera lens described in the camera module is at least partly selectively mounted at the integral base and the filter element microscope base.
According to some embodiments, camera lens described in the camera module is at least partly installed in the integral base.
According to some embodiments, filter element described in the camera module is selected from combination: cutoff filter, smalt optical filter, one of them in wafer scale cutoff filter.
According to some embodiments, integral packaging technique described in the camera module is the integral packaging by way of molding.
According to some embodiments, circuit board described in the camera module includes an at least electronic component and a substrate, and the electronic component is arranged at the substrate, and the integral base coats the electronic component, and integral packaging is in the substrate.
According to some embodiments, there is integral base described in the camera module lens barrel wall to form a camera lens room, be suitable for one camera lens of installation.
According to some embodiments, filter element microscope base described in the camera module is formed by way of injection molding.
According to some embodiments, integral base described in the camera module has a medial surface, and the medial surface has an inclination angle, and the engaging groove has an engagement angle, is adapted with the inclination angle.
According to some embodiments, the camera module includes multiple integral base components, multiple photosensitive elements, a plurality of lenses, multiple filter element microscope bases and multiple optical filters, form an array camera module, wherein each integral base component and the circuit board are integrally connected to form a disjunctor circuit board, each integral base is integrally connected to form a conjoined base, and each filter element microscope base integrally connected forms a disjunctor filter element microscope base.
According to some embodiments, filter element microscope base described in the camera module includes an at least retention bead, and the retention bead at least partly, raisedly is upwardly extended from the filter element microscope base body top.
According to some embodiments, the structure in a ring of retention bead described in the camera module.
According to some embodiments, the camera module includes a driver, and the camera lens is installed in the driver, and the retention bead is suitable for limiting the driver in outside.
Another aspect of the present invention provides an array camera module comprising multiple camera module monomers arrange that each camera module monomer includes: an integrated base assembly in array；One photosensitive element；One camera lens；One filter element microscope base and a filter element；Wherein the integral base component includes an integral base and a circuit board, and the integral base integral packaging forms an optical window in the circuit board, provides passage of light for the photosensitive element； Wherein each photosensitive element is operatively connected to the circuit board, the filter element microscope base is installed in the integral base, the filter element is arranged at the filter element microscope base, so that the filter element is located at the photosensitive path of the photosensitive element；Wherein the camera lens is located at the photosensitive path of the photosensitive element；The integral base of the plurality of camera module monomer is integrally connected to form a conjoined base.
According to some embodiments, multiple circuit boards are integrally connected to form a disjunctor circuit board, and multiple filter element microscope bases are integrally connected to form a disjunctor filter element microscope base.It is understood that in some embodiments, multiple circuit boards are also possible to circuit board independent, multiple filter element microscope bases are also possible to filter element microscope base independent.
According to some embodiments, conjoined base described in the array camera module includes multiple Base bodies, each Base body forms the optical window, the adjacent Base body integrally connected forms a disjunctor portion, the disjunctor filter element microscope base includes multiple support slots, it is connected to corresponding optical window, the support slot is suitable for installing the filter element, the adjacent filter element microscope base integrally connected forms a bridge, and the bridge is connected across the disjunctor portion of the conjoined base.
According to some embodiments, each filter element microscope base includes prolonging arm in a filter element microscope base main body and at least one in the array camera module, prolonging arm in described, from the filter element microscope base main part laterally one extends, and forms a support slot, is suitable for installing the filter element.
According to some embodiments, each filter element microscope base is including prolonging arm in a filter element microscope base main body, at least a sinking arm and at least one in the array camera module, the sinking arm extends to form an engaging groove with turning to from the filter element microscope base main body, it is adapted to engage in the integral base, prolong arm in described and extend to form a support slot with turning to from the sinking arm, is suitable for that the filter element is installed.
According to some embodiments, the adjacent interior arm that prolongs forms a turning mouthful in the array camera module, and the turning mouthful extends outwardly from the optical window, in order to increase the luminous flux in the turning mouthful position.
According to some embodiments, sinking arm described in the array camera module turns to the oppositely extending of the neighbouring photosensitive element from the filter element microscope base main body, and the filter element sinks adjacent to the photosensitive element.
According to some embodiments, described in the array camera module in prolong arm from it is described it is interior prolong arm and laterally extend internally, to reduce the filter element mounting area.
According to some embodiments, each integral base has an at least mounting groove and an at least notch in the array camera module, the mounting groove is connected to the optical window, the notch is connected to the optical window and outside, the filter element microscope base main body of the filter element microscope base includes an at least jointing edge and an at least extension side, the jointing edge is adapted to engage in the mounting groove, and the extension side is suitable for extending the notch and forms an enclosed environment.
According to some embodiments, each integral base includes three mounting grooves in the array camera module, the mounting groove forms a U-shaped structure, the filter element microscope base main body of the filter element microscope base includes three jointing edges, and the jointing edge forms a U-shaped structure and is adapted to engage in the mounting groove.
According to some embodiments, each integral base has two mounting grooves and two notches in the array camera module, the mounting groove is connected to the optical window, the notch is connected to the optical window and outside, the filter element microscope base main body of the filter element microscope base includes two jointing edges and two extension sides, two jointing edges are adapted to engage in two mounting grooves, and the two extension sides are suitable for extending two notches and form an enclosed environment.
According to some embodiments, two mounting grooves of each integral base are opposite in the array camera module, and two notches are opposite, and two jointing edges of the filter element microscope base are opposite, and the two extension sides are opposite.
According to some embodiments, two mounting grooves of each integral base are adjacent in the array camera module, and two notches are adjacent, and two jointing edges of the filter element microscope base are adjacent, and the two extension sides are adjacent.
According to some embodiments, each integral base has a mounting groove and three notches in the array camera module, the mounting groove is connected to the optical window, the notch is connected to the optical window and outside, the filter element microscope base main body of the filter element microscope base includes a jointing edge and three extension sides, the engagement is adapted to engage in the mounting groove, and the three extension sides are suitable for extending three notches and form an enclosed environment.
According to some embodiments, each filter element microscope base includes Yan Bi on one in the array camera module, and the upper Yan Bi upwardly extends to form a limited mouth with turning to from the filter element microscope base main body.
According to some embodiments, each filter element microscope base includes the downward wall of Yan Bi and one on one in the array camera module, the upper Yan Bi upwardly extends to form a limited mouth with turning to from the filter element microscope base main body, and the downward wall is downwardly extending from the filter element microscope base main body and wraps mouth with turning to.
According to some embodiments, conjoined base described in the array camera module extends to the circuit board at least one opening, and the disjunctor filter element microscope base includes at least one extension leg, it is complemented at the opening of the conjoined base, is connected to the circuit board.
According to some embodiments, extension leg described in the array camera module extends to the circuit board from the filter element microscope base main body, so that being closed around the corresponding optical window.
According to some embodiments, extension leg described in the array camera module is between the two adjacent optical windows, to separate two optical windows.
According to some embodiments, each filter element microscope base has an at least utensil receiving opening in the array camera module, for accommodating the filter element, so that the filter element is located at the photosensitive path of the photosensitive element.
According to some embodiments, the array camera module includes an at least driver, the driver is at least partly selectively installed in the integral base and the integrated filter element microscope base, and the camera lens is installed in the driver, forms a dynamic burnt camera module.
According to some embodiments, at least one camera lens is at least partly selectively installed on the integral base and the integrated filter element microscope base in the array camera module, forms a fixed-focus camera module.
According to some embodiments, an at least camera module monomer is dynamic burnt camera module in the array camera module, and at least one camera module monomer is fixed-focus camera module.
According to some embodiments, at least two camera module monomers are dynamic burnt camera module in the array camera module.
According to some embodiments, at least two camera module monomers are fixed-focus camera module in the array camera module.
According to some embodiments, the array camera module includes the two camera module monomers, forms a pair of and takes the photograph mould group.
According to a further aspect of the invention, the present invention provides an array camera module comprising:
At least two camera lenses；
At least two photosensitive elements；
An at least disjunctor circuit board；
An at least conjoined base is integrally packaged in the disjunctor circuit board, and forms at least two optical windows, is respectively that accordingly the camera lens and the photosensitive element provide passage of light；
At least two filter elements；With
At least two filter element microscope bases, each filter element microscope base are installed in the conjoined base, and each filter element is installed in the corresponding filter element microscope base respectively, and between the corresponding camera lens and the photosensitive element.
Another aspect of the present invention provides an electronic equipment comprising an electronic device body and one or more camera modules, each camera module are arranged at the electronic device body.
According to some embodiments, the electronic equipment includes but is not limited to: smart phone, wearable device, computer equipment, television set, the vehicles, camera, monitoring device.
Another aspect of the present invention provides an electronic equipment comprising an electronic device body and one or more array camera modules, each array camera module are arranged at the electronic device body.
Another aspect of the invention provides a camera module comprising:
At least one integrated base assembly；
An at least photosensitive element；
An at least camera lens, wherein the camera lens is located at the photosensitive path of the photosensitive element；
An at least filter element microscope base；With
An at least filter element, the filter element are installed on the filter element microscope base；Wherein the integral base component includes an at least integral base and an at least wiring board, wherein the photosensitive element has at least one set of photosensitive element connector, there is the wiring board at least one set of wiring board connector, the photosensitive element connector and the wiring board connector to be connected by least one set of connecting line so that the photosensitive element is operatively connected to the wiring board；Wherein the filter element microscope base is supported at least part top table of the integral base Face, and the filter element microscope base cooperates the integral base and forms an optical window, provides passage of light for the photosensitive element；Wherein the integral base integral packaging at least part non-photo-sensing area of the wiring board and the photosensitive element and embeds the photosensitive element connector, the wiring board connector and the connecting line, and make the distance between the inward flange of the top surface of the integral base and the optical axis of the camera module no more than the outer edge of the wiring board connector and the distance between the optical axis of the camera module, so that the top surface of the integral base provides greater area of mounting surface.
Detailed description of the invention
Figure 1A is the circuit board assemblies of existing molded packages.
Figure 1B is the circuit board assemblies of existing COB encapsulation.
Fig. 2 is the cut-away view of the camera module of first preferred embodiment according to the present invention.
Fig. 3 is the camera module exploded view of first preferred embodiment according to the present invention.
The part assembling flow path schematic diagram of the camera module of Fig. 4 first preferred embodiment according to the present invention.
Fig. 5 is a variant embodiment schematic diagram of the camera module of first preferred embodiment according to the present invention.
Fig. 6 is the another embodiment of the camera module of first preferred embodiment according to the present invention.
Fig. 7 is the integral base component of first preferred embodiment according to the present invention and first variant embodiment cross-sectional view of filter element microscope base.
Fig. 8 A is the integral base component of first preferred embodiment according to the present invention and second variant embodiment cut-away view of filter element microscope base.
Fig. 8 B is a variant embodiment of second variant embodiment of the filter element microscope base of first preferred embodiment of the invention.
Fig. 8 C is another variant embodiment of second variant embodiment of the filter element microscope base of first preferred embodiment according to the present invention.
Fig. 9 A is the third variant embodiment perspective view of the filter element microscope base of first preferred embodiment according to the present invention.
Fig. 9 B is the integral base component of the camera module of first preferred embodiment according to the present invention and the 4th variant embodiment of filter element microscope base.
Figure 10 A, 10B are the different directions cut-away views of second preferred embodiment camera module according to the present invention.
Figure 11 is the integral base component of second preferred embodiment according to the present invention and the stereogram exploded view of filter element microscope base.
One deformation implementation different directions mode cut-away view of integral base component and filter element microscope base of Figure 12 A, 12B second preferred embodiment according to the present invention.
Figure 13 A is the stereogram exploded view of one variant embodiment of integral base component and filter element microscope base of second preferred embodiment according to the present invention.
Figure 13 B is the integral base component of the camera module of second preferred embodiment according to the present invention and another variant embodiment solid of filter element microscope base.
Figure 13 C is the exploded view of Figure 13 B.
Figure 14 is the camera module cut-away view of third preferred embodiment according to the present invention.
Figure 15 A, 15B are the camera module different directions cut-away views of the 4th preferred embodiment according to the present invention.
Figure 16 A, 16B are the different directions cut-away views of the camera module of the 5th preferred embodiment according to the present invention.
Figure 17 A, 17B are the camera module different directions cut-away views of the 6th preferred embodiment according to the present invention.
Figure 18 A, 18B are the variant embodiment different directions cross-sectional views of the 6th preferred embodiment camera module according to the present invention.
Figure 19 A, 19B are the cut-away views of the different directions of the camera module of the 7th preferred embodiment according to the present invention.
Figure 20 A is the cut-away view of a camera module of the 8th preferred embodiment according to the present invention.
Figure 20 B is another camera module cross-sectional view of the 8th preferred embodiment according to the present invention.
Figure 21 is the stereogram exploded view according to the camera module of the 8th preferred embodiment of invention.
Figure 22 is the camera module cut-away view of the 9th preferred embodiment according to the present invention.
Figure 23 is the cross-sectional view of the according to the present invention ten preferred embodiment camera module.
Figure 24 is an application schematic diagram of preferred embodiment above according to the present invention.
Figure 25 A, 25B are the array camera module different directions cut-away views of the 11st preferred embodiment according to the present invention.
Figure 26 is the array camera module exploded view of the 11st preferred embodiment according to the present invention.
Figure 27 is the disjunctor filter element microscope base perspective view of the array camera module of the 11st preferred embodiment according to the present invention.
Figure 28 A, 28B are another array camera module cut-away views of the 11st preferred embodiment according to the present invention.
Figure 29 A, 29B are the another array camera module cut-away views of the 11st preferred embodiment according to the present invention.
Figure 30 A, 30B are a variant embodiment schematic diagrames of the array camera module of the 11st preferred embodiment according to the present invention.
Figure 31 is the conjoined base component of the 11st preferred embodiment according to the present invention and first variant embodiment cross-sectional view of disjunctor filter element microscope base.
Figure 32 A is second deformation of the array camera module of the 11st preferred embodiment according to the present invention Embodiment cut-away view.
Figure 32 B is a variant embodiment of second variant embodiment of the disjunctor filter element microscope base of the 11st preferred embodiment according to the present invention.
Figure 32 C is another variant embodiment of second variant embodiment of the disjunctor filter element microscope base of the 11st preferred embodiment according to the present invention.
Figure 33 A is the conjoined base component and disjunctor filter element microscope base third variant embodiment perspective view of the array camera module of the 11st preferred embodiment according to the present invention.
Figure 33 B is the conjoined base component of the array camera module of the 11st preferred embodiment according to the present invention and the 4th variant embodiment of disjunctor filter element microscope base.
Figure 34 A, 34B are the array camera module different directions cross-sectional views of the 12nd preferred embodiment according to the present invention.
Figure 35 is the seperated figure of solid of the conjoined base and disjunctor filter element microscope base of the array camera module of the 12nd preferred embodiment according to the present invention.
Figure 36 A, 36B are the conjoined base of the array camera module of the 12nd preferred embodiment according to the present invention and the variant embodiment different directions cross-sectional view of disjunctor filter element microscope base.
Figure 36 C is the conjoined base of the array camera module of the 12nd preferred embodiment according to the present invention and the variant embodiment exploded view of disjunctor filter element microscope base solid.
Figure 37 A is the conjoined base component of the 12nd preferred embodiment array camera module according to the present invention and another variant embodiment perspective view of disjunctor filter element microscope base.
Figure 37 B is the exploded view of Figure 37 A.
Figure 38 A, 38B are the array camera module different directions cut-away views of the 13rd preferred embodiment according to the present invention.
Figure 39 is the integral base component of the array camera module of the 13rd preferred embodiment according to the present invention and the stereogram exploded view of filter element microscope base.
Figure 40 A, 40B are the array camera module different directions cut-away views of the 14th preferred embodiment according to the present invention.
Figure 41 is the conjoined base component of the array camera module of the 14th preferred embodiment according to the present invention and the stereogram exploded view of disjunctor filter element microscope base.
Figure 42 A, 42B are the variant embodiment different directions cut-away views of the array camera module of the 14th preferred embodiment according to the present invention.
Figure 43 is the conjoined base component of the array camera module of the 14th preferred embodiment according to the present invention and the stereogram exploded view of disjunctor filter element microscope base.
Figure 44 A, 44B are the array camera module different directions cut-away views of the 15th preferred embodiment according to the present invention.
Figure 45 is the conjoined base component of the array camera module of the 15th preferred embodiment according to the present invention and the stereogram exploded view of disjunctor filter element microscope base.
Figure 46 A, 46B are the conjoined base component of the 15th preferred embodiment array camera module according to the present invention and the deformation implementation different directions cross-sectional view of disjunctor filter element microscope base.
Figure 47 is the conjoined base component of the 15th preferred embodiment array camera module according to the present invention and the variant embodiment exploded view of disjunctor filter element microscope base.
Figure 48 A, 48B are the cut-away views of the different directions of the array camera module of the 16th preferred embodiment according to the present invention.
Figure 49 is the conjoined base component of the array camera module of the 16th preferred embodiment according to the present invention and the stereogram exploded view of disjunctor filter element microscope base.
Figure 50 A, 50B are the different directions cut-away views of the array camera module of the 17th preferred embodiment according to the present invention.
Figure 51 is the exploded view according to the array camera module of the 17th preferred embodiment of invention.
Figure 52 is the array camera module cut-away view of the 18th preferred embodiment according to the present invention.
Figure 53 is the cross-sectional view of the array camera module of the 19th preferred embodiment according to the present invention.
Figure 54 A is the perspective exploded view of the array camera module of the 20th preferred embodiment according to the present invention.
Figure 54 B is the cross-sectional view of the array camera module of the 21st preferred embodiment according to the present invention.
Figure 55 is the application schematic diagram of the array camera module of above preferred embodiment according to the present invention.
Figure 56 is the schematic diagram of one of manufacturing step of a camera module of the 22nd preferred embodiment under this invention, wherein the photosensitive element of the camera module is mounted on wiring board, and the non-photo-sensing region of the photosensitive element is connected with the wiring board by one group of lead.
Figure 57 A and Figure 57 B are two schematic diagrames of the manufacturing step of the camera module of above preferred embodiment under this invention, wherein a supporting member of the camera module is arranged at the non-photo-sensing region of the photosensitive element.
Figure 58 A is three schematic diagram of the manufacturing step of the camera module of above preferred embodiment under this invention, wherein the wiring board, the photosensitive element and the supporting member are placed on a upper mold of a molding tool and once between molds, and the upper mold applies pressure to the supporting member.
Figure 58 B is the schematic diagram of three variant embodiment of the manufacturing step of the camera module of above preferred embodiment under this invention, wherein the wiring board, the photosensitive element and the supporting member are placed on a upper mold of a molding tool and once between molds, and a cover film is equipped between the stitching surface of the upper mold and the supporting member.
Figure 59 is four schematic diagram of the manufacturing step of the camera module of above preferred embodiment under this invention, wherein the moulding material for being used to form a molded base of the camera module is added into and is formed in the upper mold A molding space between tool and the lower mold.
Figure 60 is five schematic diagram of the manufacturing step of the camera module of above preferred embodiment under this invention, wherein forming the molded base after the mold material cures.
Figure 61 is six schematic diagram of the manufacturing step of the camera module of above preferred embodiment under this invention, wherein a filter element of the camera module is assembled into the molded base.
Figure 62 is seven schematic diagram of the manufacturing step of the camera module of above preferred embodiment under this invention, wherein an optical lens of the camera module is assembled in a driver, the driver is assembled in the molded base, the camera module is made.
Figure 63 is the schematic diagram of a variant embodiment of the camera module of above preferred embodiment under this invention.
Figure 64 A is the schematic diagram of first variant embodiment of a molding photosensory assembly of the camera module of above preferred embodiment under this invention.
Figure 64 B is the schematic diagram of second variant embodiment of the molding photosensory assembly of the camera module of above preferred embodiment under this invention.
Figure 64 C is the schematic diagram of the third variant embodiment of the molding photosensory assembly of the camera module of above preferred embodiment under this invention.
Figure 65 A is the schematic diagram of the 4th variant embodiment of the molding photosensory assembly of the camera module of above preferred embodiment under this invention.
Figure 65 B is the schematic diagram of the 5th variant embodiment of the molding photosensory assembly of the camera module of above preferred embodiment under this invention.
Figure 66 is the schematic diagram of the 6th variant embodiment of the mould group photosensory assembly of the camera module of above preferred embodiment under this invention.
Figure 67 is the schematic diagram of a variant embodiment of the camera module of above preferred embodiment under this invention.
Figure 68 is the schematic diagram of another variant embodiment of the camera module of above preferred embodiment under this invention.
Figure 69 is the exploded view of the camera module of the 23rd preferred embodiment according to the present invention.
Figure 70 be above preferred embodiment according to the present invention camera module along Figure 69 line B-B cross-sectional view.
The part assembling flow path schematic diagram of the camera module of Figure 71 above preferred embodiment according to the present invention.
Figure 72 A is the distance between inward flange and optical axis of the top surface of the integral base of the camera module of above preferred embodiment according to the present invention no more than the outer edge of wiring board connector and the structural schematic diagram of the distance between optical axis.
The schematic illustration of the reduction veiling glare of the camera module of Figure 72 B above preferred embodiment according to the present invention.
Figure 73 is the structural schematic diagram of first variant embodiment of the camera module of above preferred embodiment according to the present invention.
Figure 74 A is the structural schematic diagram of second variant embodiment of the camera module of above preferred embodiment according to the present invention.
Figure 74 B is the structural schematic diagram of the third variant embodiment of the camera module of above preferred embodiment according to the present invention.
Figure 75 A is the structural schematic diagram of the 4th variant embodiment of the camera module of above preferred embodiment according to the present invention.
Figure 75 B is the structural schematic diagram of the 5th variant embodiment of the camera module of above preferred embodiment according to the present invention.
Figure 75 C is the structural schematic diagram of the 6th variant embodiment of the camera module of above preferred embodiment according to the present invention.
Figure 76 is the structural schematic diagram of the 7th variant embodiment of the camera module of above preferred embodiment according to the present invention.
Figure 77 is the structural schematic diagram of the 8th variant embodiment of the camera module of above preferred embodiment according to the present invention.
Figure 78 is the exploded view of the camera module of the 24th preferred embodiment according to the present invention.
Figure 79 is the cross-sectional view of camera module line C-C along Figure 78 of above preferred embodiment according to the present invention.
Figure 80 is that the camera module of above preferred embodiment according to the present invention reduces the schematic illustration of veiling glare.
Figure 81 is the schematic diagram of first variant embodiment of the camera module of above preferred embodiment under this invention.
Figure 82 is the schematic diagram of second variant embodiment of the camera module of above preferred embodiment under this invention.
Figure 83 is the exploded view of the third variant embodiment of the camera module of above preferred embodiment under this invention.
Figure 84 A and 84B are the cross-sectional view of another variant embodiment line D-D and E-E line along Figure 83 of the camera module of above preferred embodiment under this invention respectively.
Figure 85 is the structural schematic diagram of the 4th variant embodiment of the camera module of above preferred embodiment under this invention.
Figure 86 is the structural schematic diagram of the 5th variant embodiment of the camera module of above preferred embodiment under this invention.
Figure 87 is the structural schematic diagram that the filter element microscope base of the 5th variant embodiment of the camera module of signal above preferred embodiment of the invention sinks.
Figure 88 is the exploded view of the array camera module of the 25th preferred embodiment under this invention.
Figure 89 is the cross-sectional view of array camera module F-F line along Figure 88 of above preferred embodiment under this invention.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.Preferred embodiment in being described below is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.The basic principle of the invention defined in the following description can be applied to other embodiments, deformation scheme, improvement project, equivalent program and the other technologies scheme without departing from the spirit and scope of the present invention.
It will be understood by those skilled in the art that, in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper", "lower", " preceding ", " rear ", " left side ", " right side ", "vertical", "horizontal", "top", "bottom" "inner", the orientation or positional relationship of the instructions such as "outside" is to be based on the orientation or positional relationship shown in the drawings, it is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have a particular orientation, it is constructed and operated in a specific orientation, therefore above-mentioned term is not considered as limiting the invention.
It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, the quantity of one element can be one, and in a further embodiment, the quantity of the element can be it is multiple, term " one " should not be understood as the limitation to quantity.
Molded packages technique is a kind of important application technique that camera module field grows up in the recent period, although being a kind of known technology in other field, but in camera module field, more eyeglasses, high-pixel camera mould group especially for recent prevalence, molded packages technique more shows its advantage and importance, and entering is suitable for the stage applied.The camera module that camera module based on molded packages technique is encapsulated relative to traditional COB, microscope base is formed by molded packages, instead of traditional independent microscope base, it can reduce the size of camera module, the advantages such as smooth mounting surface be provided, but the substitution microscope base that molded packages are formed needs to undertake the function of original microscope base, such as installation filter element.As previously mentioned, the microscope base that molded packages are formed but is unsuitable for being mounted directly filter element.On the other hand, the photosensitive element on circuit board, electronic component layout type will affect the size of camera module.And according to the present invention, one camera module and array camera module and its filter element microscope base based on integral packaging technique is provided, filter element microscope base is wherein introduced in the camera module of integral packaging technique and array camera module, so that the filter element microscope base and integral base match, undertake the function of traditional microscope base, so that on the basis of application integral packaging technique, such as molding ground integral forming process, it can be filter element, driver or camera lens provide good mounting condition, make up integral packaging technique bring installation question, more reasonably each component on layout circuit plate, so that the space of circuit board is fully utilized, further decrease the size of camera module.
It as shown in Figures 2 to 4, is the camera module of first preferred embodiment according to the present invention.The camera module 100 can be applied to various electronic equipments, citing ground but be not limited to smart phone, wearable device, Computer equipment, television set, the vehicles, camera, monitoring device etc., the camera module 100 cooperate the electronic equipment to realize Image Acquisition and reproduction to target object.
It as shown in Figures 2 to 4, is the camera module of first preferred embodiment according to the present invention.The camera module 100 includes an integrated base assembly 10, a photosensitive element 20, a camera lens 30, a filter element microscope base 40 and a filter element 50.
The integral base component 10 includes an integral base 11 and a circuit board 12,11 integral packaging of integral base is in the circuit board 12, citing ground but with being not limited to molding unitary packed are in the circuit board 12, the filter element microscope base 40 is installed in the integral base 11, the microscope base or bracket of traditional camera module can be replaced to which the integral base 11 and the filter element microscope base 40 cooperate, and does not need to need microscope base or bracket being attached at circuit board by glue in similar traditional packaging process.The photosensitive element 20 is operatively connected to the circuit board 12.The photosensitive element 20 is electrically connected to the circuit board 12 of the integral base component 10, and the filter element microscope base 40 is installed in the integral base component 10, and the camera lens 30 is located at the photosensitive path of the photosensitive element 20.
The integral base 11 has an optical window 111 and forms a Base body 112 of the optical window 111, and the optical window 111 is that the photosensitive element 20 provides passage of light, and the molding of Base body 112 ground integral packaging is in the circuit board 12.Particularly, in this embodiment, the optical window 111 is the ring structure of surrounding closure, in order to provide closed interior environment for the camera lens 30.The circuit board 12 includes a substrate 121, and is formed in the substrate 121 such as multiple electronic components 122 mounted by SMT technique, and the electronic component 122 includes but is not limited to resistance, capacitor, driving element etc..In this embodiment in accordance with the invention, 11 integral packaging of integral base is in the substrate 121, and it is integrally coated on the electronic component 122, so that dust, sundries in similar traditional camera module be prevented to be adhered on the electronic component 122 and pollute the photosensitive element 20 and influence imaging effect.It is understood that in other variant embodiment, it is also possible to be embedded in the substrate 121 in the electronic component 122, i.e., the described electronic component 122 can be not exposed to outer.The substrate 121 of the circuit board 12 can be PCB hardboard, PCB soft board, Rigid Flex, ceramic substrate etc..It is worth mentioning that, in this preferred embodiment of the invention, because the integral base 11 can coat these electronic components 122 completely, so electronic component 122 interior can not be embedded in the substrate 121, the substrate 121 is only used for forming conducting route, so as to be able to thickness smaller for the final obtained integral base component 10.
It is worth mentioning that, in some embodiments, the electronic component 122 is arranged at around the photosensitive element 20, and in various embodiments, the setting position of the electronic component 122, which can according to need, is designed layout, for example concentrate on side or two sides, the shape that position and the filter element microscope base 40 can be arranged with the setting position of the photosensitive element 20 and subsequent electrical connecting element 203 matches, to more reasonably utilize the spatial position on the substrate 122, reduce the size of the camera module as far as possible, those skilled in the art should be understood that, the setting position of the electronic component 122, Type is not limitation of the invention.It is worth mentioning that, in actual section view, due to the difference of the setting position of the electronic component 122, the electronic component is possible and invisible in section view or may only see side, but in attached drawing of the invention, in order to facilitate understanding with explanation, the electronic component 122 is in section view all as it can be seen that the present invention is not intended to limit in this respect.
More specifically, the substrate 121 has a upper surface 1211 and a lower surface 1212, the upper surface 1211 is opposite with the direction of the camera lens 30, and the direction of the lower surface 1212 and the camera lens 30 is opposite.The photosensitive element 20 includes a front 201 and a back side 202, and described positive 201 is opposite with 30 direction of camera lens, and for carrying out photosensitization, the back side 202 is opposite with 30 direction of camera lens, for fitting in the upper surface 1211 of the substrate 121.The photosensitive element 20 is electrically connected to the substrate 121 by an at least electrical connecting element 203.The electrical connecting element 203 citing ground but it is not limited to gold thread, silver wire, copper wire, aluminum steel.The side in the photosensitive element 20, two sides, three sides or four sides can be set in the electrical connecting element 203, in some attached drawings of the invention, to be illustrated for the embodiment of electrical connecting element 203 described in four sides is arranged, but in other embodiments, the electrical connecting element 203, which can according to need, is set as side, two sides or three sides, those skilled in the art is it should be understood that setting quantity, position, the type of the electrical connecting element 203 are not limitation of the invention.
The mode that the photosensitive element 20 is installed on the substrate 121 illustrate ground but be not limited to SMT technique (Surface Mount Technology, surface mount process), and the substrate 121 is electrically connected in such a way that COB (Chip On Board) beats gold thread.Certainly, in other embodiments of the invention, the mode that the photosensitive element 20 is installed in the substrate 121 is opened can be by other means, such as embedded, FC (Flip Chip, flip-chip) etc., those skilled in the art is it should be understood that the connection of the photosensitive element 20 and the circuit board 12, mounting means are not limitation of the invention.
More specifically, described positive the 201 of the photosensitive element 20 have a photosensitive area 1311 and a non-photo-sensing area 1312, particularly, the non-photo-sensing area 1312 is surrounded on 1311 periphery of photosensitive area.The photosensitive area 1311 converts light signals into electric signal, the non-photo-sensing area 1312 is electrically connected to the circuit board 12 by the electrical connecting element 203, by the electric signal transmission to the circuit board 12 for carrying out photosensitization.The camera lens 30 is arranged with 20 optical alignment of photosensitive element, optical axis is consistent, the light across the camera lens 30 is enabled to reach the photosensitive element 20 via the optical window 111, further across electric signal can be transferred to the circuit board 12 after the photoelectric conversion of the photosensitive element 20, so that the camera module 100 collects image information.
As shown in Figures 2 and 3, the camera module 100 includes a filter element 50, for being filtered through the light of the camera lens 30.The filter element 50 citing ground but it is not limited to cutoff filter, smalt optical filter, wafer scale cutoff filter, full impregnated piece, visible light filter.The filter element 50 is installed in the filter element microscope base 40, positioned at the passage of light of the photosensitive element 20.The camera module can also include a driver 60, such as voice coil motor, piezo-electric motor.The camera lens 30 is installed in described Driver 60, in order to form a dynamic burnt camera module, i.e. AF (Auto Focus) camera module.The driver 60 includes an at least pin 61, and the driver 60 is operatively connected to the circuit board 12 by the pin 61.The pin 61 can be one of single pin, double pins, single pin or double pin.In some attached drawings of the invention, illustrated by taking double pins as an example, but is not limitation.The pin 61 is generally located near the position at edge, section view is carried out from the corresponding position of line A-A in the position Fig. 3,2 cross-sectional view of corresponding diagram, and the pin 61 is practical and invisible in 2 cross-sectional view of corresponding diagram, but all illustrate the presence of pin 61 with dotted line in corresponding section view with explanation in order to facilitate understanding.Those skilled in the art is not limitation of the invention it should be understood that the type of the pin 61, shape and setting position.
As shown in Figures 2 to 4, the filter element 50 is installed in the filter element microscope base 40, and under be sunken in the optical window 111 of the integral base 11.The integral base 11 of the integral base component 10 has a top surface 113, and the filter element microscope base 40 is installed in the top surface 113 of the integral base 11, and the driver 60 is installed in the filter element microscope base 40.113 plane earth of the top surface of this embodiment according to the invention, the integral base 11 extends.In other words, the integral base 11 forms a platform structure, no step protrusion, and the filter element microscope base 40 is installed in the platform structure.It is worth mentioning that, in this fashion, 113 plane earth of the top surface of the integral base 11 extends, and without apparent bending angle, therefore during integral packaging, such as the process molded, can obtain more entirely, carrot-free mounting surface, provide smooth mounting condition for the filter element microscope base 40.
It is noted that the filter element 50, such as smalt optical filter, it is the fragile and relatively expensive element of comparison, is easily broken, therefore protecting the filter element 50 is also extremely important one aspect in camera module manufacturing process.In the present invention, the integral base 11 is obtained using molding such as injection molding or mould pressing process, and 40 material of filter element microscope base is unlimited, as long as having enough intensity to carry the filter element 50.Preferably, the filter element microscope base 40 and the integral base 11 can be manufactured using different manufacturing process, the filter element microscope base 40 as described in being made Shooting Technique, the integral base 11 is made with using transfer molding molding, therefore different materials can be used, so that the filter element microscope base 40 and the integral base 11 have different hardness, surface flexible is different, for example it can make the filter element microscope base 40 that there is preferably flexibility, to when the filter element 50 is installed in the filter element microscope base 40, relative to the situation for being installed in the integral base 11, the stress being subject to when being installed on the filter element microscope base 40 is smaller, to the installation filter element 50 preferably, so that filter element 50 is damaged or occurs fragmentation phenomenon.The stress being subject to when being acted on that is, the filter element microscope base 40 alleviates the external stress that the filter element 50 may be subject to, for example being directly adhered to the integral base 11.
Further, the filter element microscope base 40 has an at least support slot 41 and an at least engaging groove 42, and the support slot 41 is for installing the filter element 50, and the engaging groove 42 is for being installed on the one Pedestal 11.The support slot 41 is connected to the optical window 111, a utensil receiving opening 411 is formed, for accommodating the filter element 50.The engaging groove 42 is surrounded on 40 bottom periphery of filter element microscope base.In other words, the filter element microscope base 40 has the utensil receiving opening 411, for accommodating the filter element 50, so that the filter element 50 is located at the photosensitive path of the photosensitive element 20.
It is worth mentioning that, the filter element 50 is installed in the support slot 41, it is reduced with the relative altitude of the filter element microscope base 40, so that the filter element 50 will not or less protrude from the filter element microscope base 40, to which the height of the camera module 100 will not be increased, and it is not easy to touch the camera lens 50 or the driver 60.
In other words, the support slot 41 forms an inner ring road, in order to which the filter element 50 is installed on 40 inside of filter element microscope base, positioned at the passage of light of the photosensitive element 20.The engaging groove 42 forms an outer ring, is that the filter element microscope base 40 provides installation site by the integral base 11 in order to be engaged in the integral base 11 outward.
More specifically, the shape and 11 shape of the integral base of the engaging groove 42 match, in order to which the filter element microscope base 40 is stably installed at the integral base 11.
Further, referring to Figure 2 to Figure 4, the filter element microscope base 40 includes prolonging arm 44 and at least a sinking arm 45 in a filter element microscope base main body 43, at least one, the sinking arm 45 turns to ground, longitudinally one extension from the filter element microscope base main body 43, in order to which the installation site of the filter element 50 sinks to the optical window 111.Prolong arm 44 in described from the sinking arm 45 turns to ground, lateral one extends, in order to provide the installation site of horizontal direction for the filter element 50, so that the filter element 50 is consistent with the optical axis of the photosensitive element 20.In figure in example, the filter element microscope base 40 include four integrally connecteds it is described in prolong the sinking arm 45 of arm 44 and four integrally connecteds, it is each it is described in prolong arm 44 and each sinking arm 45 and extend to form the filter element microscope base 40 of annular one in different positions.
In other words, the longitudinal inside for integrally extending the filter element microscope base main body 43 of the sinking arm 45, the engaging groove 42 is formed in the bottom side of the filter element microscope base main body 43, in order to be engaged in the integral base 11, prolong arm 44 in described to extend transversely in the inside of the sinking arm 45, the support slot 41 is formed in the interior top side for prolonging arm 44, in order to support the filter element 50.
In one embodiment, the shape of the engaging groove 42 of the filter element microscope base 40 is consistent with the shape of the optical window 111 that the integral base 11 is formed, and the shape of the support slot 41 is consistent with the shape of the filter element 50.Particularly, the filter element 50 is square structure, and the top view of the support slot 41 is a ring structure, such as side's annular.
The filter element microscope base 40 has the utensil receiving opening 411, for accommodating the filter element 50, so that the filter element 50 is located at the photosensitive path of the photosensitive element 20.Specifically, the microscope base main body 43 and the interior arm 44 that prolongs form the utensil receiving opening 411, that is to say, that the development length for prolonging arm 44 in described determines the minimum area of 50 demand of filter element.It is noted that in molded packages technique, by Prolong arm 44 in that cannot be formed in described, therefore the area of the filter element needed is all larger, increase in other words relative to the filter element area of traditional microscope base demand, and in the present invention, prolong arm 44 in described to extend internally, so that the demand area of the filter element 50 reduces, so that the advantage of filter element microscope base 40 and the advantage of integral packaging combine.
Citing ground, referring to Fig. 2, described interior the distance between arm 44 that prolongs of opposite sides is labeled as L, then the diameter of the filter element 50 needs be only greater than L, it can be equipped in described and prolong arm 44, without going to be equipped on the Base body 112, so that the demand area of the filter element 50 reduces.
It is noted that the extended distance of the sinking arm 45 influences submergence depth of the filter element 50 in the optical window 111, and the interior extended distance for prolonging arm 44 influences the size of the filter element 50 of installation.For example, position of the filter element 50 in the optical window 111 is more to sinking, and the distance apart from the photosensitive element 20 is smaller, and the back focal length of the corresponding camera module 100 is smaller when 45 extended distance of sinking arm is bigger；When it is described it is interior prolong 44 extended distance of arm it is bigger when, the utensil receiving opening 411 of the filter element microscope base 40 is smaller, and the area of the filter element 50 needed is smaller, to be more easier to obtain the suitable filter element 50, and it is easy for installation, reduce the cost of the camera module 100.Certainly, the extended distance of the sinking arm 45 needs not make it dim spot occur on the basis of the imaging effect in conjunction with the camera module, such as reduction back focal length, such as the image of dust；And it is described in prolong the extended distance of arm 44 and need to consider the factors such as the photosensitive area 1311 of 100 passage of light of camera module and the photosensitive element 20 and the remaining width of the non-photo-sensing area 1312 and the circuit board 12, such as when prolonging arm 44 within make and extending internally, in the lesser situation of the filter element 50, the photosensitive area 1311 of the photosensitive element 20 will not be blocked by prolonging arm 44 in described, the light ray flux of entrance will not excessively be blocked, and it is more to encapsulate remaining wider position extension in the circuit board 12, and it is smaller to encapsulate the lesser position extension of remaining width in the circuit board 12, to in the case where guaranteeing image quality, reduce the area of the filter element 50 as far as possible.
The shape of shown filter element microscope base 40 and the shape of the integral base 11 match.In some embodiments, the integral base 11 is approximate regulation symmetrical structure, such as side's annular, correspondingly, the filter element microscope base 40 is symmetrical structure, and the filter element microscope base main body 43 is regular shape, it is each it is described in prolong that 44 shape of arm is consistent, and each 45 shape of sinking arm is consistent.And in further embodiments, since the position for the electronic component 122 for needing to coat is different, the inside of the integral base 11 has inwardly projecting position, width is different, and correspondingly, the position of corresponding groove or protrusion can be set in the filter element microscope base main body 43, or make the length for prolonging arm 44 in described different, to adapt to the shape of the integral base 11, the position where the photosensitive element 20 is adapted to, and be easily installed the filter element 50.
In some embodiments, the filter element microscope base 40 can be installed on the integral base 11 in such a way that glue is bonded, and the planarization of the filter element microscope base 40 can be adjusted by glue thickness.
It is noted that in this embodiment in accordance with the invention, the integral base 11 is packaged in the electricity The upper surface 1211 of road plate 12, and in other embodiments of the invention, the integral base 11 can extend to the side and/or bottom surface of the circuit board 12, and those skilled in the art is it should be understood that the integrated molding range of the integral base 11 is not limitation of the invention.
In one embodiment, in the integral base component 10 of the camera module 100 and the assembling process of the filter element microscope base 40, referring to Fig. 4, the integral base 11 is first formed on the substrate 121, the filter element 50 is then installed on the filter element microscope base 40, and then the filter element microscope base 40 with the filter element 50 is installed on the integral base 11, to relatively conveniently complete the installation process of the filter element 50.
It's also worth mentioning that in this embodiment in accordance with the invention, the substrate 121 is smooth plate, the photosensitive element 20 is attached at the upper surface 1211 of the substrate 121.In another embodiment, the substrate 121 can have an inner groovy, and the photosensitive element 20 is housed inside the inner groovy, to reduce the height that the photosensitive element 20 protrudes from the substrate 121.In another embodiment, the substrate 121 can have a through-hole, it is connected to the two sides of the substrate 121, the photosensitive element 20 is housed inside the through-hole, so that the relative position of the photosensitive element 20 and the substrate 121 is adjustable, for example the upper surface of the photosensitive element 20 and the upper surface 1211 of the substrate 121 are consistently arranged or the lower surface of the photosensitive element 20 and the lower surface 1212 of the substrate 121 are consistently arranged.In another embodiment, the substrate 121 can have an access, the stepped structure of access, and the photosensitive element 20 is installed in the access by way of flip-chip.In another embodiment, the substrate 121 can have a reinforced hole, and the integral base 11 extends into the reinforced hole, enhance the structural strength of 11 component 10 of integral base.In another embodiment, the circuit board 12 includes a backboard, and the backboard is set to the bottom of the substrate 121 with being stacked, and to enhance the structural strength and heat dissipation performance of the integral base component 10, backboard citing ground but is not limited to a metal plate.In another embodiment, the integral base component 10 includes an electro-magnetic screen layer, and the shielded layer is wrapped in 11 outside of integral base or is surrounded on inside, to enhance the anti-electromagnetic interference capability of the camera module 100.In other embodiments of the invention, the circuit board 12 can also have other various modifications, to increase or enhance the different performance of the integral base component 10, those skilled in the art is it should be understood that the malformation of circuit board 12 described above is not limitation of the invention.
In the above embodiment of the invention, the filter element microscope base 40 is installed in the integral base 11, the driver 60 is installed in the filter element microscope base 40, that is to say, that the filter element microscope base 40 is arranged between the driver 60 and the integral base 11.And in another variant embodiment of the invention, referring to Fig. 5, the filter element microscope base 40 and the driver 60 are all installed in the top surface 113 of the integral base 11.Further, the filter element microscope base 40 is installed in the adjacent medial side position of the integral base 11, the driver 60 is installed in the position of 11 adjacent lateral side of integral base, thus the top of integral base 11 described in the driver 60 and 40 coordinated allocation of filter element microscope base Surface 113.
It is worth mentioning that, the camera module 100 described in above preferred embodiment of the invention includes the driver 60, the camera lens 30 is installed in the driver 60, the dynamic burnt camera module AF of focal length can be automatically adjusted to form one, and in another embodiment of the present invention, referring to Fig. 6, the camera module 100 does not include the driver 60, form a fixed-focus camera module, i.e., FF (Fix Focus) camera module, the camera lens 30 are directly mounted to the filter element microscope base 40.Those skilled in the art is it should be understood that the type of the camera module 100 is not limitation of the invention.
Those skilled in the art is it should be understood that the filter element microscope base 40 in the present invention can be manufactured with the manufacture of traditional microscope base, according to the size of filter element microscope base 40 described in 11 size design of integral base.Citing ground, the filter element microscope base 40 can be manufactured by way of injection molding, can also be manufactured by way of combination, for example combined by way of bonding.
It is noted that each section of the filter element microscope base 40, i.e., the described filter element microscope base main body 43, interior arm 44, the sinking arm 45 of prolonging can be integrally formed for identical material, or different materials.In order to clearly illustrate in attached drawing, each section is indicated by different lines shades, but is not the limitation of material or structure.
It will also be appreciated that, the filter element microscope base 40 can be used for installing the filter element 50, it can be used for that the camera lens 30 or the driver 60 are installed, those skilled in the art is it should be understood that the installing component on the filter element microscope base 40 is not limitation of the invention.
As shown in fig. 7, being the integral base component of first preferred embodiment according to the present invention and first variant embodiment of filter element microscope base.In this embodiment, it upwardly extends to the integral base 11A inner inclination, forms the optical window 111A that opening is gradually increased.More specifically, the integral base 11A has a medial surface 114A, the central optical axis of the medial surface 114A and the camera module 100 forms an inclined angle alpha, so that the opening of the optical window 111A is gradually increased, in order to being manufactured for the integral base 11A.Wherein the magnitude range of α is 3 °~30 °, and in some embodiments, the numerical value of α is selected from 3 °~15 °, 15 °~20 ° or 20 °~30 °.Correspondingly, the engaging groove 42A of the filter element microscope base 40A has an engagement angle α 1, the engagement angle α 1 is corresponding with the inclined angle alpha, in order to which the shape of the engaging groove 42A and the tilted shape of the medial surface 114A are adapted, so that filter element microscope base 40A installation is more stable.
In other words, the sinking arm 45A extends from filter element microscope base main body 43A steering ground, inclined downward, to form the engagement angle α 1 being adapted with the inclined angle alpha.Further, in one embodiment, prolong arm 44A in described to turn to ground in the sinking arm 45A, horizontally extend, form a strut angle β, the strut angle β is greater than 90 °, convenient for the installation of the filter element 50.Certainly, the filter element microscope base 40 of no the engagement angle α 1 and the strut angle β can also be installed on the integral base 11 with the inclined angle alpha.
As shown in Figure 8 A, be first preferred embodiment according to the present invention integral base component and filter element microscope base second variant embodiment.There is the filter element microscope base 40B support slot 41B, the support slot 41B to be connected to the optical window 111 of the integral base 11B, provide installation site for the filter element 50.In other words, the filter element 50 is installed in the support slot 41B.
Further, the filter element microscope base 40B includes prolonging arm 44B in a filter element microscope base main body 43B and at least one, and the interior arm 44B that prolongs integrally extends internally from the lower filter element microscope base main body 43B transverse direction, forms the support slot 41B.The filter element microscope base main body 43B is engaged in the integral base 11.
That is, the filter element microscope base 40B does not include the sinking arm 45, and do not have the engaging groove 42, therefore relative to above-described embodiment, the installation site of the filter element 50 is not sunken to down in the optical window 111, but pass through the interior extended distance for prolonging arm 44B, it equally can reduce the area of the filter element 50 of needs, and the filter element 50 is housed inside the support slot 41B, so that the relative altitude of the filter element 50 and the filter element microscope base main body 43B reduce.
Fig. 8 B is a variant embodiment of second variant embodiment of the filter element microscope base of first preferred embodiment of the invention.The filter element microscope base 40B1 has the attachment slot 48B1 slot of a support slot 41B1 and one, and the respectively described camera lens 30 and the filter element 50 provide installation site.
Further, the filter element microscope base 40B1 includes prolonging arm 44B1 in a filter element microscope base main body 43B1 and at least one, prolong arm 44B1 in described and laterally integrally extend internally from the lower the filter element microscope base main body 43B1, forms the support slot 41B1 and the attachment slot 48B1.The filter element microscope base 40B1 further includes that camera lens part a 49B1, the camera lens part 49B1 is integrally upwardly extended from the filter element microscope base main body 43B1, in order to accommodate the camera lens 30.In the embodiment of the invention, the filter element 50, which is mounted in described in a manner of losing money instead of making money, prolongs arm 44B1.
Further, in the embodiment of the invention, smooth, non-threaded configurations inside the camera lens part 49B1, suitable for installing a non-threaded camera lens 30.
That is, the camera lens 30 can be directly mounted inside the filter element microscope base 40B1, to limit the camera lens 30 when the camera module 100 is fixed-focus camera module.Particularly, there is gap, in order to which the camera lens 30 is installed, adjusted before being secured in position between the camera lens part 49B1 and the camera lens 30.
Fig. 8 C is another variant embodiment of second variant embodiment of the filter element microscope base of first preferred embodiment according to the present invention.The filter element microscope base 40B2 has the attachment slot 48B2 of a support slot 41B2 and one, and the respectively described camera lens 30 and the filter element 50 provide installation site.
Further, the filter element microscope base 40B2 includes prolonging arm 44B2 in a filter element microscope base main body 43B2 and at least one, prolong arm 44B2 in described and laterally integrally extend internally from the lower the filter element microscope base main body 43B2, forms the support slot 41B2 and the attachment slot 48B2.The filter element microscope base 40B2 It further include that camera lens part a 49B2, the camera lens part 49B2 is integrally upwardly extended from the filter element microscope base main body 43B2, in order to accommodate the camera lens 30.In the embodiment of the invention, the filter element 50, which is mounted in described in a manner of losing money instead of making money, prolongs arm 44B2.
Further, in the embodiment of the invention, there is helicitic texture inside the camera lens part 49B1, is suitable for the one threaded camera lens 30 of installation.
That is, the camera lens 30 can be directly mounted inside the filter element microscope base 40B2, to limit the camera lens 30 when the camera module 100 is fixed-focus camera module.
It is noted that above-mentioned two embodiment, only illustrates the possibility mode of texturing of the filter element microscope base as an example, illustrate that the camera lens 30 can be directly mounted to inside described filter element microscope base 40B1,40B2, but is not limitation.
As shown in Figure 9 A, be first preferred embodiment according to the present invention filter element microscope base third variant embodiment.In this embodiment, the filter element microscope base 40 has an at least turning mouthful 441C, the turning mouthful 441C is arranged at the angular position of the filter element microscope base 40, in order to the installation of the filter element 50, reduce the sharp corners bring edge shadow in the camera module imaging.More specifically, prolonging arm 44C in adjacent two forms a turning mouthful 441C, the turning mouthful 441C extends outwardly, in order to increase the camera module in the luminous flux of the angular position of the filter element microscope base 40.In other words, the adjacent interior arm 44C that prolongs forms an outwardly extending turning mouthful 441C, in order to increase the filter element microscope base 40 in the luminous flux of the turning mouthful position 441C, reduction edge shadow.
Specifically, in one embodiment, the turning mouthful 441C can be the rectangular angle of extension, citing ground but be not limited to, and be arranged four in four angular positions of the filter element microscope base 40 and extend rectangular angle accordingly.In further embodiments, the turning mouthful 441C is also possible to arc chord angle, increases the luminous flux in the filter element microscope base 40 in corner.Certainly in some embodiments, it is also possible to be not provided with the turning mouthful 441C, those skilled in the art is it should be understood that the shape of the turning mouthful 441C, quantity, position are not limitation of the invention.
It as shown in Figure 9 B, is the variant embodiment of first preferred embodiment according to the present invention.The filter element microscope base 40 includes that at least retention bead a 46P, the retention bead 46P at least partly, raisedly is upwardly extended from 40 top of filter element microscope base.Further, the top surface of the retention bead 46P from the filter element microscope base main body 43 at least partly, raisedly upwardly extends, and enters inside camera module in order to limit mounted element, blocks dust or light.It retention bead 46P citing ground but is not limited to limit the driver 60 or the camera lens 30.Particularly, in one embodiment, the retention bead 46P is arranged at the intermediate position of the microscope base main body 43, the top of the microscope base main body 43 is divided into two parts, for installing the driver 60, the camera lens 30 is located inside in outside.In this fashion, the retention bead 46P can position the position of the driver 60, reduce the offset of the driver 60.And in an assembling process, it can prevent the glue for installing the driver 60 from overflowing to internal and being infected with camera lens or internal element. Particularly, the retention bead 46P can be an annular protrusion, to position the driver 60 on the whole, glue be stopped to overflow to inside.
It is noted that in other embodiments of the invention, screw thread can be set in the surface the retention bead 46P, in order to be mounted directly the camera lens 30.And on the outside of the retention bead 46P when setting screw thread, the camera lens 30 suitable for larger aperture.
It is the camera module and its integral base component and filter element microscope base of second preferred embodiment according to the present invention as shown in Figure 10 A to Figure 11.The integral base 11D includes that a Base body 112D forms an at least optical window 111D, provides passage of light for the photosensitive element 20.Further, the Base body 112D has at least one opening 1121D, and the opening 1121D is connected to the optical window 111D and outside, the filter element microscope base 40D are complemented at the opening 1121D, to form the optical window 111D of side-closed.
In other words, in such an embodiment, the Base body 112D is not closing structure, but open architecture, and by the supplement of the filter element microscope base 40D, so that the Base body 112D is closed.
The filter element microscope base 40D includes that at least one extension leg 433D, the extension leg 433D integrally extends downward into the substrate 121 from the filter element microscope base main body 43D, to close the opening 1121D.Citing ground but be not limited to, the extension leg 433D is connected to the substrate 121 and/or the Base body 112 by way of bonding.
Specifically, the Base body 112D forms a U-shaped structure, the filter element microscope base main body 43 is engaged in the U-shaped structure of the Base body 112D, and the extension leg 433D of the filter element microscope base 40D is complemented at the aperture position of the U-shaped structure, so that the integral base 11D closure, forms a closed interior environment.
In other words, in this embodiment, the function of the microscope base of the integral base 11D and the filter element microscope base 40D shared camera module, so that the advantage of integral packaging and the function of filter element microscope base 40D combine.
It is worth mentioning that, since the size requirement to camera module is higher and higher, therefore the arrangement of the electronic component 122 of the circuit board 12, the setting position of the electrical connecting element 203, the integral base 11 the needs such as package position reasonably arrange, while making full use of substrate 121, so that component placement footprint area is minimum, to further decrease the size of the camera module.And this embodiment according to the invention, integral packaging is carried out in the direction for arranging the electronic component 122, coat the electronic component 122, utilize the spatial position of the electronic component 122, the electromagnetic effect between the electronic component 122 and the electrical connecting element 203 is reduced simultaneously, and the extension leg 433D of the filter element microscope base 40D is set in the side of the not set electronic component 122, make full use of the rest position on the substrate 121.On the other hand, by the bonding process of the filter element microscope base 40D, adjustable, the supplement integral base 11D planarization provides good mounting condition for the camera module.
It's also worth mentioning that needing to be arranged the photosensitive element 20, electronics member on the substrate 121 Device 122, the electrical connecting element 203, the integral base 11D, the filter element microscope base 40D, and the electronic component 122, the electrical connecting element 203, the integral base 11D and the filter element microscope base 40D are arranged at the periphery of the photosensitive element 20.In other words, the substrate 121 has multiple installing zones 1213, and the installing zone 1213 is around 20 outside of the photosensitive element.In order to improve the space utilization rate on the substrate 121, in some embodiments, by 122 concentrated setting of electronic component in the installing zone 1213 of the side on the substrate 121 or the installing zone 1213 of two sides, and integral packaging is carried out by the integral base 11D in the installing zone 1213 that the electronic component 122 is arranged, and then the electronic component 122 is coated by the integral base 11D, and in the region of the not set electronic component 122 and/or the installing zone 1213 of the neighbouring electrical connecting element 203, connect the filter element microscope base 40D, to utilize position relatively narrow on the substrate 121 by the filter element microscope base 40D, the filter element microscope base 40D and the integral base 11D matches and forms the optical window 111D, provides passage of light for the photosensitive element 20.That is, the photosensitive element 20 can not be arranged in the center of the substrate 121, but it is partial to side, forms the installing zone 1213 of different in width, so that convenient is intensively arranged the electronic component 122.Further, the extension leg 433D of the filter element microscope base 40D is connected to the relatively narrow position of the not set electronic component 122 and the electrical connecting element 203, and the wider installing zone 1213 installs the electronic component 122 and the electrical connecting element 203, and it is integrally formed the integral base 11D, coats the electronic component 122.Such as, the width of the photosensitive element two sides is W1 and W2, W1 is less than W2, the extension leg 433D of the filter element microscope base 40D is connected in the relatively narrow side W1, and in the wider side W2, the electronic component 122 is set, so that 122 concentrated setting of the electronic component is in wider side.
Citing ground but be not limited to, in some embodiments, the assembling process of the integral base component 10, which can be, is first attached at the substrate 121 for the photosensitive element 20, and it is being set to the installation site for designing the photosensitive element 20, for example the installing zone 1213 to form different in width is installed adjacent to side, then in the installing zone 1213, for example the wider installing zone installs the electronic component 122, progress one forms the integral base 11D in 1213 integral packaging of the installing zone at least with the electronic component by integral packaging, the filter element microscope base 40D is then installed on the integral base 11D.In another embodiment, the electronic component 122 first can be attached at the scheduled position, then installing zone 1213 as described in scheduled form the integral base 11D, then install the photosensitive element 20.
It will also be appreciated that, the filter element microscope base 40D can be manufactured by way of injection molding, therefore the molding mode relative to the integral base 11D, lesser wall thickness can be obtained, that is, the thickness d 1 of the extension leg of the filter element microscope base 40D can be less than the thickness d 2 of the integral base, so as to more reasonably utilize each installing zone 1213 of the different in width of the substrate 121.
It is the integral base component of second preferred embodiment according to the present invention and the variant embodiment of filter element microscope base as shown in Figure 12 A to 13A.The integral base 11E includes a Base body 112E, institute It states Base body 112E and forms an at least optical window 111E, provide passage of light for the photosensitive element 20.Further, there are the integral base 11E two opening 1121E, each opening 1121E to be connected to the optical window 111E and outside, and the filter element microscope base 40E supplements the two opening 1121E, the side of the optical window 111E is closed.
The filter element microscope base 40E includes that two extension leg 433E, each extension leg 433E integrally extend downward into the substrate 121 from the filter element microscope base main body 43E, to close each opening 1121E.Citing ground but be not limited to, each extension leg 433E is connected to the substrate 121 and/or the Base body 112E by way of bonding.
More specifically, in one embodiment, the Base body 112E is parallel construction, the filter element microscope base main body 43E is engaged in the parallel construction of the Base body 112E, and the extension leg 433E of the filter element microscope base 40E is complemented at the both ends open position of the parallel construction, so that the Base body 112E is closed to form a closed interior environment.
It is the integral base component of second preferred embodiment according to the present invention and another variant embodiment of filter element microscope base as shown in Figure 13 B and Figure 13 C.In this embodiment, the integral base 11Q includes that Base body a 112Q, the Base body 112Q forms an at least optical window 111Q, provides passage of light for the photosensitive element 20.Further, there are the integral base 11Q two opening 1121Q, each opening 1121Q to be connected to the optical window 111Q and outside, and the filter element microscope base 40Q is complemented at the two opening 1121Q, will close around the optical window 111Q.Different from above embodiment, two positions opening 1121Q are opposite, and are in inverted trapezoidal structure, in order to position, install the filter element microscope base 40Q.In other words, the Base body 112Q is divided into opposite two parts by the two opening 1121Q, and when the filter element microscope base 40Q is installed in the Base body 112Q, two parts of the Base body 121Q are closed by the filter element microscope base 40Q.
Correspondingly, the filter element microscope base 40Q includes that two extension leg 433Q, each extension leg 433Q integrally extend downward into the substrate 121 from the filter element microscope base main body 43Q, in order to close the opening 1121Q.Specifically, the two extension leg 433Q are oppositely arranged, and are inverted trapezoidal structure, suitable for being complemented at the opening 1121Q.Citing ground, when installing the filter element microscope base 40Q, the extension leg 433Q is limited in the opening 1121Q.That is, each opening 1121Q is open is gradually increased from the bottom to top, the extension leg 433Q from the bottom to top, gradually broadens, and is complemented at the opening 1121Q, so that the opening 1121Q is closed.
Those skilled in the art is not limitation of the invention it should be understood that be open the shape of 1121Q described in the embodiment of the present invention and size only illustrates the mode that can be carried out as an example.
Particularly, in some embodiments, the electronic component 122 can be collectively arranged in side, and it is coated by at least partly described Base body 112Q, and coated by the wider Base body 112Q, and the side of the not set electronic component 122 corresponds to the relatively narrow Base body 112Q.The optical filtering Element microscope base 40Q is installed on the Base body 43Q, and the extension leg 433Q is complemented at the opening 1121Q between two parts.
Further, the Base body 112Q has at least one opening face 1122Q, and the opposite two opening face 1122Q form the opening 1121Q.The opening face 1122Q is obliquely integrally upwardly extended from the substrate 121, in order to form the opening 1121Q of inverted trapezoidal.Correspondingly, the extension leg 433Q has at least one supplement face 4331Q, and the supplement face 4331Q is corresponding with the opening face 1122Q, in order to which the extension leg 433Q shape is complementally complemented at the opening 1121Q, by the optical window 111Q periphery seal.It can be understood that, may exist gap between the supplement face 4331Q for extending leg 433Q and the opening face 1122Q of the opening 112Q, in order to apply cementing medium, such as glue, but the size in the gap or whether there is or not be not limitation of the invention.
Particularly, it can fix or seal in such a way that glue is bonded between the opening face 1122Q for extending the leg 433Q and supplement face 4331Q and Base body 112Q.
It as shown in figure 14, is the camera module and its base assembly and filter element microscope base of third preferred embodiment according to the present invention.There is the integral base 11F mounting groove 115F, the mounting groove 115F to be connected to the optical window 111F.This embodiment according to the invention, the mounting groove 115F are annular connectivity slot, and the filter element microscope base 40 is installed in the mounting groove 115F.
Specifically, the engaging groove 42 of the filter element microscope base 40 is engaged in the mounting groove 115F of the integral base 11F, so that the filter element microscope base main body 43 of the filter element microscope base 40 is supported and is contained in the 115F.
The predetermined thickness that the filter element microscope base main body 43 of the filter element microscope base 40 has, so that it be made to be not easy to touch the component being located above, such as driver 60 or camera lens 30.Preferably, when the filter element microscope base 40 is installed in the mounting groove 115F, the top surface of the filter element microscope base 40 is consistent with the top surface of the Base body 112F, so that the filter element microscope base 40 will not protrude from the Base body 112F, and it is not easy to touch the driver 60 or camera lens 30 being located above.Certainly, in other embodiments of the invention, the upper surface of the filter element microscope base 40 can protrude from the Base body 112F, so as to cooperate the various sizes of driver 60, limit the driver 60, and prevent the glue when installing the driver from overflowing to inside, the present invention is not intended to limit in this respect.
More specifically, the integral base 11F includes multiple raised step 116F, the Base body 112F is protruded from.The raised step 116F partly extends upwards from the Base body 112F, forms the mounting groove 115F.In other embodiments of the invention, an annular integrated step 116F can be used to form the mounting groove 115F.
This embodiment according to the invention, the integral base 11F include four raised step 116F, and each raised step 116F turns to ground one closure connection, form side's annular protrusion structure.The driver 60 is at least partly installed in the raised step 116F, to form a dynamic burnt camera module.It is described Driver 60 is operatively connected to the circuit board 12 by an at least pin 61.And in other embodiments, the camera lens 30 is installed at least partly the raised step 116F, forms a fixed-focus camera module.
In this embodiment of the invention, the transverse width of each raised step 116F is consistent, the equivalent width of the mounting groove 115F formed, correspondingly, the width of the filter element microscope base main body 43 of the filter element microscope base 40 can be according to the size design of the support slot 41, the equivalent width of 43 all directions of filter element microscope base main body.And in other embodiments of the invention, the width of the raised step 116F can change according to demand, and correspondingly, the width of the filter element microscope base main body 43 can be according to the width design of the mounting groove 115F.
It as shown in figs. 15a and 15b, is the camera module of the 4th preferred embodiment according to the present invention.The integral base 11G has an at least mounting groove 115G and at least notch a 117G, the mounting groove 115G is connected to the optical window 111G, and the notch 117G is connected to the optical window 111G and outside.In other words, the mounting groove 115G is open connectivity slot, is not closing structure.The filter element microscope base 40G is installed in the mounting groove 115G.More specifically, in this embodiment, the mounting groove 115G is U-type groove, and U-shaped opening corresponds to the notch 117G.
Specifically, the filter element microscope base 40G is engaged in the mounting groove 115G of the integral base 11G, so that the filter element microscope base main body 43G of the filter element microscope base 40G is supported in the mounting groove 115G.
The predetermined thickness that the filter element microscope base main body 43G of the filter element microscope base 40G has, so that it be made to be not easy to touch the component being located above, such as driver 60 or camera lens 30.Preferably, when the filter element microscope base 40G is installed in the mounting groove 115G, the top surface of the filter element microscope base 40G is consistent with the top surface of the Base body 112G, so that the filter element microscope base 40G will not protrude from the Base body 112G, and it is not easy to touch the driver 60 or camera lens 30 being located above.
More specifically, the integral base 11G includes multiple raised step 116G, the Base body 112G is protruded from.Each raised step 116G partly extends upwards from the Base body 112G, forms the mounting groove 115G.At least one side of the integral base 11G does not have the raised step 116G, forms the notch 117G.
This embodiment according to the invention, the integral base 11G include that three raised steps 116G, each raised step 116G turn to ground integrally connected, each mounting groove 115G of formation.I.e., it has no the side of the raised step 116G forms the notch 117G.More specifically, three raised step 116G, which turn to ground integrally connected, forms a U-shaped bulge-structure.
The filter element microscope base main body 43G of the filter element microscope base 40G includes an at least jointing edge 431G and an at least extension side 432G, the jointing edge 431G for being engaged in the mounting groove 115G, and the extension side 432G is for being filled in the notch 117G.In other words, the extension side 432G extends into the notch 117G, so that the notch 117G is filled, to form environment in closing.
This embodiment according to the invention, the filter element microscope base main body 43G of the filter element microscope base 40G includes a three jointing edge 431G and extension side 432G, each jointing edge 431G and extension side 432G turns to ground integrally connected, to adapt to the shape of the mounting groove 115G.
The sinking arm 45G turns to ground from the jointing edge 431G and extension side 432G respectively, integrally extends downwardly, to form the engaging groove 42G.Prolong arm 44G in described to be laterally extended from sinking arm 45G steering ground, integrally, to form the support slot 41G.
It is noted that the electronic component 122 is arranged in the different location of 12 main body of circuit board, and the integral base 11G coats the electronic component 122.In the position for arranging the electronic component 122, the thickness that the integral base 11G needs is larger, and facilitate the setting mounting groove 115G, lesser thickness can be set in position without the electronic component 122, to reduce to 12 size of circuit board, it is not suitable for forming the mounting groove 115G.This embodiment according to the invention, in three jointing edge 431G corresponding integral base 11G arrangement electronic components 122, the corresponding part transverse gage of the integral base 11G is larger, for forming the mounting groove 115G, and the transverse gage of the integral base 11G of the corresponding side the extension side 432G is smaller, it is not used to form the mounting groove 115G, and fills the notch 117G by the extension side 432G, undertake the effect of the raised step 116G.
The driver 60 is at least partly installed in the raised step 116G, to form a dynamic burnt camera module.The driver 60 is operatively connected to the circuit board 12 by an at least pin 61.And in other embodiments, the camera lens 30 is installed at least partly the raised step 116G, forms a fixed-focus camera module.
More specifically, three sides of the driver 60 are installed in the raised step 116G, and the remaining extension side 432G for being installed in the filter element microscope base 40G on one side.In some embodiments, there are gaps between the driver 60 and the extension side 432G, and the gap is sealed by glue, to form closed interior environment for the camera module.In other words, the extension side 432G apparent height is lower than the apparent height of the raised step 116G, and can supplement difference in height by glue.Particularly, the driver 60 can be installed on the raised step 116G by way of bonding, and make the camera lens 30 consistent with the optical axis of the photosensitive element 20.
It as shown in figure 16 a and 16b, is the camera module of the 5th preferred embodiment according to the present invention.There is the integral base 11H at least mounting groove a 115H, the mounting groove 115H to be connected to the optical window 111H.The filter element microscope base 40H is installed in the mounting groove 115H.More specifically, each mounting groove 115H forms U-shaped structure, and U-shaped imperforation.
Specifically, the engaging groove 42H of the filter element microscope base 40H is engaged in the mounting groove 115H of the integral base 11H, so that the filter element microscope base main body 43H of the filter element microscope base 40H is supported in the support slot 41H.
Further, the filter element microscope base 40H is U-shaped structure, and it is U-shaped have an opening, the shape of the U-shaped structure of the filter element microscope base 40H and each mounting groove 115H formation matches.
The predetermined thickness that the filter element microscope base main body 43H of the filter element microscope base 40H has, so that it be made to be not easy to touch the component being located above, such as driver 60 or camera lens 30.Preferably, when the filter element microscope base 40H is installed in the mounting groove 115H, the top surface of the filter element microscope base 40H is consistent with the top surface of the Base body 112H, so that the filter element microscope base 40H will not protrude from the Base body 112H, and it is not easy to touch the driver 60 or camera lens 30 being located above.
More specifically, the integral base 11H includes multiple raised step 116H, the Base body 112H is protruded from.Each raised step 116H partly extends upwards from the Base body 112H, forms the mounting groove 115H.At least one side of the integral base 11H does not have the raised step 116H, forms the notch 117H.
This embodiment according to the invention, the integral base 11H includes four raised step 116H, wherein three raised step 116H turn to ground integrally connected and form the mounting groove 115H, another raised step 116H is integrally upwardly extended from the Base body 112H, and does not form the mounting groove 115H.That is, the opening of the U-shaped structure of the mounting groove 115H is blocked by raised step 116H described in one of those, to form a closed structure.
The filter element microscope base main body 43H of the filter element microscope base 40H includes at least jointing edge a 431H, the jointing edge 431H for being engaged in the mounting groove 115H.
This embodiment according to the invention, the filter element microscope base main body 43H of the filter element microscope base 40H includes three jointing edge 431H, each jointing edge 431H turns to ground integrally connected and adapts to the shape of the mounting groove 115H to form the U-shaped structure with opening.
The sinking arm 45H turns to ground from the jointing edge 431H, is integrally downwardly extending an engaging groove 42H, in order to be engaged in the mounting groove 115H.It is described in prolong arm 44H from the sinking arm 45H turn to ground, be integrally laterally extended to form a support slot 41H, in order to provide installation site for the filter element 50.And it is different from above-described embodiment, it is not closing structure that the engaging groove 42H and the support slot 41H, which are the U-shaped structure that one side has opening,.That is, only three sides are fixed when the filter element 50 is installed in the filter element microscope base 40H, and the inner surface of the raised step 116H of the mounting groove 115H wherein is formed directly against being not used on one side.
It is noted that the electronic component 122 is arranged in the different location of 12 main body of circuit board, and the integral base 11H coats the electronic component 122.In the position for arranging the electronic component 122, the thickness that the integral base 11H needs is larger, and facilitate the setting mounting groove 115H, lesser thickness can be set in position without the electronic component 122H, to reduce 12 size of circuit board, it is not suitable for for forming the mounting groove 115H.This embodiment according to the invention, in three jointing edge 431H corresponding integral base 11H arrangement electronic components 122, the one base The transverse gage of seat 11H is larger, and the mounting groove 115H is arranged, and another transverse gage for being unused for being formed the integral base 11H of the corresponding side the raised step 116H of the mounting groove 115 is smaller.
The driver 60 is at least partly installed in the raised step 116, to form a dynamic burnt camera module.The driver 60 is operatively connected to the circuit board 12 by least one pin 61.And in other embodiments, the camera lens 30 is installed at least partly the raised step 116H, forms a fixed-focus camera module.
More specifically, the driver 60 is installed in the raised step 116H, wherein three sides are supported on the raised step 116H to form the mounting groove 115H, and remaining are installed in the raised step 116H for being unused for being formed the mounting groove 115H on one side.
In other words, what it is different from above preferred embodiment is, in this embodiment, the filter element microscope base 40H removes the extension side 432G, and form an open U-shaped structure, the raised step 116H of the integral base 11H is at least partly upwardly extended, and forms a closed U-shaped structure, without forming the notch 117G.
It is the cross-sectional view of two mutually perpendicular direction of camera module of the 6th preferred embodiment according to the present invention as shown in Figure 17 A, 17B.Different from above preferred embodiment, the integral base 11I includes two raised step 116I, and there are two notch 117I, each raised step 116I to turn to ground integrally connected, form the mounting groove 115I for tool.I.e., it has no the two sides of the raised step 116I form the notch 117I.
The filter element microscope base main body 43I of the filter element microscope base 40I includes an at least jointing edge 431I and an at least extension side 432I, the jointing edge 431I for being engaged in the mounting groove 115I, and the extension side 432I is for being filled in the notch 117I.In other words, the extension side 432I extends into the notch 117I, so that the notch 117I is filled, to form environment in closing.
This embodiment according to the invention, the filter element microscope base main body 43I of the filter element microscope base 40I includes two jointing edge 431I and two extension side 432I, each jointing edge 431I and extension side 432I turns to ground integrally connected, to adapt to the shape of the mounting groove 115I.
The sinking arm 45I turns to ground from the jointing edge 431I and extension side 432I respectively, integrally extends downwardly, to form the engaging groove 42I.Prolong arm 44I in described to turn to ground from the interior arm 44I that prolongs, be integrally laterally extended, to form the support slot 41I.
Further, the two of the integral base 11I raised step 116I and the two jointing edge 431I are adjacent, and the two notch 117I are adjacent.That is, the two raised step 116I constitute a L-type structure, to form the mounting groove 115I of L-type.The two notch 117I are adjacent, to form a L-type structure.Correspondingly, the two jointing edge 431I of the filter element microscope base 40I are adjacent, are adapted to engage with the mounting groove 115I in L-type, and the two extension side 432I are adjacent, suitable for filling the notch 117I of L-type, thus Form closed interior environment.
The driver 60 is at least partly installed in the raised step 116I, to form a dynamic burnt camera module.The driver 60 is operatively connected to the circuit board 12 by least one pin 61.And in other embodiments, the camera lens 30 is installed at least partly the raised step 116I or filter element microscope base main body 43I, forms a fixed-focus camera module.
More specifically, the both sides of the driver 60 are supported on the raised step 116I to form the mounting groove 115I, and remaining both sides are installed in the extension side 432I of the filter element microscope base 40I.
As shown in figures 18a and 18b, be the 6th preferred embodiment camera module according to the present invention integral base component and filter element microscope base variant embodiment.Figure 18 A and 18B are the cross-sectional views of two mutually perpendicular directions.Different from above-described embodiment, the two jointing edge 431J are opposite, and the two notch 117J are opposite.Correspondingly, the two jointing edge 431J of the filter element microscope base 40J are opposite, are suitable for two opposite mounting groove 115J, and the two extension side 432J are opposite, suitable for filling the two opposite notch 117J, to form closed interior environment.
It as illustrated in fig. 19 a and fig. 19b, is the camera module of the 7th preferred embodiment according to the present invention.Figure 19 A and 19B are the cross-sectional views of two mutually perpendicular directions.Different from above preferred embodiment, the integral base 11K includes a raised step 116K, and there are three notch 117K for tool.The raised step 116K partly, integrally upwardly extends to form the mounting groove 115K from the Base body 112K.I.e., it has no three sides of the raised step 116K form the notch 117K.
The filter element microscope base main body 43K of the filter element microscope base 40K includes an at least jointing edge 431K and an at least extension side 432K, the jointing edge 431K for being engaged in the mounting groove 115K, and the extension side 432K is for being filled in the notch 117K.In other words, the extension side 432K extends into the notch 117K, so that the notch 117K is filled, to form environment in closing.
This embodiment according to the invention, the filter element microscope base main body 43K of the filter element microscope base 40K includes a jointing edge 431K and three extension side 432K, each jointing edge 431K and extension side 432K turns to ground integrally connected, to adapt to the shape of the mounting groove 115K and the notch 117K.
The sinking arm 45K turns to ground from the jointing edge 431K and extension side 432K respectively, integrally extends downwardly, to form the engaging groove 42K.Prolong arm 44K in described to turn to ground from the interior arm 44K that prolongs, be integrally laterally extended, to form the support slot 41K.
The driver 60 is at least partly installed in the raised step 116K, to form a dynamic burnt camera module.The driver 60 is operatively connected to the circuit board 12 by least one pin 61.And in other embodiments, the camera lens 30 is installed at least partly the raised step 116K, forms a fixed-focus camera module.
More specifically, the side of the driver 60 is supported on the raised step 116K to form the mounting groove 115K, and remaining three side is installed in the extension side 432K of the filter element microscope base 40K.
It is the camera module of the 8th preferred embodiment according to the present invention as shown in Figure 20 A to 21.The camera module can be fixed-focus camera module, what it is different from above preferred embodiment is, the filter element microscope base 40L includes prolonging wall 46L on one, it is described on prolong wall 46L and from the filter element microscope base main body 43L turn to ground, upwardly extend, form a limited mouth 461L.The limited mouth 461L citing ground but is not limited to driver 60 or camera lens 30 for limiting mounted component.That is, when assembling the camera module, the driver 60 or the camera lens 30 are installed in the limited mouth 461L of the filter element microscope base 40L, limit the driver 60 or camera lens 30, so that driver 60 or the camera lens 30 are consistent with the optical axis of the photosensitive element 20.The size of the limited mouth 461L can be determined according to mounted part dimension.
In other words, excessive deviation will not be generated, guarantee the consistency of the optical system of the camera module with frame constraint effect when so that the components such as the driver 60 or the camera lens 30 being installed in the filter element microscope base 40L by prolonging wall 46L on described.Meanwhile it is described on prolong wall 46L and can protect mounted component, such as driver 60 or camera lens 30, prevent it is external it is unnecessary touch so that the driver 60 or the installation of the camera lens 30 are stablized.And external dust can be blocked and entered inside the camera module.
Further, when the camera module is a dynamic burnt camera module, there is an at least pin mouth 462L referring to Figure 20 B, the filter element microscope base 40L, for across the pin 61.That is, 60 pin of driver passes through the pin mouth 462L when the driver 60 is installed in the limited mouth 461L of the filter element microscope base 40L, it is electrically connected to the circuit board 12.Certainly, when the camera module is fixed-focus camera module, the filter element microscope base 40L can be not provided with the pin mouth 462L.It is worth mentioning that, the pin mouth 462L is possible and invisible in the cross-sectional view for actually crossing center line, but for ease illustration and understanding, illustrate the possible projected position of the pin mouth 462L with dotted line, the position needs of the pin mouth 462L determine that the present invention is not intended to limit in this respect according to the position of the pin 61.
It as shown in figure 22, is the camera module of the 9th preferred embodiment according to the present invention.What it is different from above preferred embodiment is, the filter element microscope base 40M includes prolonging the downward wall 47M of wall 46M and one on one, prolong on described wall 46M from the filter element microscope base main body 43M turn to ground, upwardly extend, formed limited mouth a 461M, the downward wall 47M from the filter element microscope base main body 43M turn to ground, be downwardly extending packet mouth 471M.Particularly, the downward wall 47M prolongs wall 46M on described and integrally extends, the integral outer retaining wall of shape.
The limited mouth 461M citing ground but is not limited to the driver 60 and the camera lens 30 for limiting mounted component.The lower packet mouth 471M is for accommodating the integral base 11, that is, when assembling the camera module 100, the driver 60 or the camera lens 30 are installed in the limited mouth 461M of the filter element microscope base 40M, the integral base 11 is housed inside in the lower packet mouth 471M, prolong wall 46M limit on described, block the camera lens 30, so that the camera lens 30 is consistent with the optical axis of the photosensitive element 20, the downward wall 47M blocks the integral base 11, so that camera module overall structure comparison rule, facilitate installation, and shape is relatively beautiful.The limited mouth 461M and lower packet mouth 471M Size can be determined according to mounted part dimension, citing ground but be not limited to the size of the driver 60, the camera lens 30 and the integral base 11.
In one embodiment, the downward wall 47M can extend to the circuit board 12, the citing ground but mode for being not limited by glue bonding is fixedly connected on the circuit board 12, so that the filter element microscope base 40M is more steadily mounted.
It as shown in figure 23, is the according to the present invention ten preferred embodiment camera module.
The integral base 11N includes that camera lens wall a 118N, the camera lens wall 118N at least partly upwardly extends to form a camera lens room 1181N from the raised step 116N, is suitable for installing the camera lens 30, to form a fixed-focus camera module.
Further, the raised step 116N and the Base body 112N form the mounting groove 115N, for installing the filter element microscope base 40.The camera lens wall 118N and the raised step 116N form another mounting groove 115N, for providing installation site for the camera lens 30.That is, in this embodiment, the integral base 11N tool is there are two the mounting groove 115N, one of them described mounting groove 115N is for installing the filter element microscope base 40, another described mounting groove 115N is for installing the camera lens 30.
Further, the engaging groove 42 of the filter element microscope base 40 is engaged in a mounting groove 115N, and the filter element 50 is installed in the support slot 41 of the filter element microscope base 40.The camera lens 30 is installed in another mounting groove 115N.
The camera lens wall 118N is that the camera lens 30 provides installation site, constrains the installation site of the camera lens 30, so that the camera lens 30 is consistent with the optical axis of the photosensitive element 20, improves the precision of installation.
Figure 24 is one application schematic diagram of camera module of preferred embodiment above according to the present invention.The camera module 100 can be applied to various electronic equipments 300, the electronic equipment 300 includes an electronic device body 200, the camera module 100 is arranged at the electronic device body 200, and the electronic device body 200 is cooperated to complete the acquisition and reproduction of image.The electronic equipment 300 citing ground but it is not limited to smart phone, wearable device, computer equipment, television set, the vehicles, camera, monitoring device etc., the camera module 100 cooperates the electronic equipment 300 to realize Image Acquisition and reproduction to target object.Camera module 100 described in figure is applied to smart phone, assists the smart phone acquisition, renders image information.
If Figure 25 A to 27 is the array camera module of the 11st preferred embodiment according to the present invention.The array camera module 1000 includes multiple camera module monomers 100, and each camera module monomer 100 cooperates with each other, and realizes the acquisition of image.The array camera module 1000 can be applied to various electronic equipments 300 citing ground but be not limited to smart phone, wearable device, computer equipment, television set, the vehicles, camera, monitoring device etc., and the array camera module 1000 cooperates the electronic equipment 300 to realize Image Acquisition and reproduction to target object.
It is noted that for ease of description, in following embodiments of the invention and attached drawing, the array camera module 1000 constituted with two camera module monomers 100, i.e. double take the photograph for array camera module are carried out Illustrate, and in the other embodiment of the present invention, the array camera module 1000 may include more monomers, and such as three or three or more, each camera module monomer 100 is arranged in array forms the array camera module 1000, for example arranges side by side.
It will also be appreciated that, the camera module 100 and the mutual camera module that is composed of feature and the camera module of equivalence enforcement of the above preferred embodiment one into preferred embodiment ten all can serve as the camera module monomer 100, for constituting the array camera module 1000.
Specifically, the camera module monomer 100 includes an integrated base assembly 10, a photosensitive element 20, a camera lens 30, a filter element microscope base 40 and a filter element 50.
The integral base component 10 includes an integral base 11 and a circuit board 12,11 integral packaging of integral base is in the circuit board 12, citing ground but with being not limited to molding unitary packed are in the circuit board 12, the filter element microscope base 40 is installed in the integral base 11, the microscope base or bracket of traditional camera module can be replaced to which the integral base 11 and the filter element microscope base 40 cooperate, and does not need to need microscope base or bracket being attached at circuit board by glue in similar traditional packaging process.The photosensitive element 20 is operatively connected to the circuit board 12.
The photosensitive element 20 is electrically connected to the integral base component 10, and the filter element microscope base 40 is installed in the integral base component 10, and the camera lens 30 is located at the photosensitive path of the photosensitive element 20.
The integral base 11 has an optical window 111 and forms a Base body 112 of the optical window 111, and the optical window 111 is that the photosensitive element 20 provides passage of light, and the molding of Base body 112 ground integral packaging is in the circuit board 12.Particularly, the optical window 111 is a closed annular structure, in order to provide closed interior environment for the camera lens 30.
The circuit board 12 includes a substrate 121, and is formed in the substrate 121 such as multiple electronic components 122 mounted by SMT technique, and the electronic component 122 includes but is not limited to resistance, capacitor, driving element etc..In this embodiment in accordance with the invention, 11 integral packaging of integral base is in the substrate 121, and integrally it is coated on the electronic component 122, to prevent dust, sundries in similar traditional camera module to be adhered on the electronic component 122, and the photosensitive element 20 is further polluted, to influence imaging effect.It is understood that in other variant embodiment, it is also possible to be embedded in the substrate 121 in the electronic component 122, i.e., the described electronic component 122 can be not exposed to outer.The substrate 121 of the circuit board 12 can be PCB hardboard, PCB soft board, Rigid Flex, ceramic substrate etc..It is worth mentioning that, in this preferred embodiment of the invention, because the integral base 11 can coat these electronic components 122 completely, so electronic component 122 interior can not be embedded in the substrate 121, the substrate 121 is only used for forming conducting route, so as to be able to thickness smaller for the final obtained integral base component 10.
More specifically, the substrate 121 has a upper surface 1211 and a lower surface 1212, the upper surface 1211 is opposite with the direction of the camera lens 30, and the direction of the lower surface 1212 and the camera lens 30 is opposite. The photosensitive element 20 includes a front 201 and a back side 202, and described positive 201 is opposite with 30 direction of camera lens, and for carrying out photosensitization, the back side 202 is opposite with 30 direction of camera lens, for being installed on the upper surface 1211 of the substrate 121.The photosensitive element 20 is electrically connected to the substrate 121 by an at least electrical connecting element 203.The electrical connecting element 203 citing ground but it is not limited to gold thread, silver wire, copper wire, aluminum steel.The mode that the photosensitive member is installed on the substrate 121 illustrate ground but be not limited to SMT technique (Surface Mount Technology, surface mount process), and the substrate 121 is electrically connected in such a way that COB (Chip On Board) beats gold thread.Certainly, in other embodiments of the invention, the mode that the photosensitive element 20 is installed in the substrate 121 is opened can be by other means, such as embedded, FC (Flip Chip, flip-chip) etc., those skilled in the art it should be understood that, the photosensitive element 20 and the connection of the circuit board 12, mounting means are not limitation of the invention.
More specifically, described positive the 201 of the photosensitive element 20 have a photosensitive area 1311 and a non-photo-sensing area 1312, particularly, the non-photo-sensing area 1312 is surrounded on 1311 periphery of photosensitive area.The photosensitive area 1311 converts light signals into electric signal, the non-photo-sensing area 1312 passes through the electrical connecting element 203 in the circuit board 12, by the electric signal transmission to the circuit board 12 for carrying out photosensitization.The camera lens 30 is arranged with 20 optical alignment of photosensitive element, optical axis is consistent, the light across the camera lens 30 is enabled to reach the photosensitive element 20 via the optical window 111, further across electric signal can be transferred to the circuit board 12 after the photoelectric conversion of the photosensitive element 20, so that the camera module collects image information.
As shown in Figure 25 A to Figure 26, the camera module monomer 100 includes a filter element 50, for being filtered through the light of the camera lens 30.The filter element 50 citing ground but it is not limited to IR cut filter element 50, smalt optical filter.The filter element 50 is installed in the filter element microscope base 40, positioned at the passage of light of the photosensitive element 20.The camera module monomer 100 can also include a driver 60, such as voice coil motor, piezo-electric motor.The camera lens 30 is installed in the driver 60, in order to form a dynamic burnt camera module.The driver 60 includes an at least pin 61, and the driver 60 is operatively connected to the circuit board 12 by the pin 61.The pin 61 can be one of single pin, double pins, single pin or double pin.In attached drawing of the invention, illustrated by taking double pins as an example, but is not limitation.The pin 61 is generally located near the position at edge, the corresponding position section view of center line is crossed from the position Figure 26, corresponding diagram 25A and 25B cross-sectional view, and the pin 61 is practical and invisible in corresponding diagram 25A and 25B cross-sectional view, but in order to facilitate understanding with explanation, the presence for all illustrating the pin 61 with dotted line in corresponding section view is not to illustrate the actual position of the pin 61, and subsequent drawings situation is similar.Those skilled in the art is not the limitation of invention it should be understood that the type of the pin 61, shape and setting position.
As shown in Figure 25 A to Figure 27, the filter element 50 is installed in the filter element microscope base 40, and under be sunken in the optical window 111 of the integral base 11.The one of the integral base component 10 Pedestal 11 has a top surface 113, and the filter element microscope base 40 is installed in the top surface 113 of the integral base 11, and the driver 60 is installed in the filter element microscope base 40.113 plane earth of the top surface of this embodiment according to the invention, the integral base 11 extends, and in other words, the integral base 11 forms a platform structure, no step protrusion, and the filter element microscope base 40 is installed in the platform structure.It is worth mentioning that, in this fashion, 113 plane earth of the top surface of the integral base 11 extends, and without apparent bending angle, therefore during integral packaging, such as the process molded, can obtain more entirely, carrot-free mounting surface, provide smooth mounting condition for the filter element microscope base 40.
Further, the filter element microscope base 40 has a support slot 41 and an engaging groove 42, and the support slot 41 is for installing the filter element 50, and the engaging groove 42 is for being installed on the integral base 11.The support slot 41 is connected to the optical window 111, a utensil receiving opening 411 is formed, for accommodating the filter element 50.The engaging groove 42 is surrounded on 40 periphery of filter element microscope base.
In other words, the support slot 41 forms an inner ring road, in order to which the filter element 50 is installed on 40 inside of filter element microscope base, positioned at the passage of light of the photosensitive element 20.The engaging groove 42 forms an outer ring, is that the filter element microscope base 40 provides installation site by the integral base 11 in order to be engaged in the integral base 11 outward.
More specifically, the shape and 11 shape of the integral base of the engaging groove 42 match, in order to which the filter element microscope base 40 is stably installed at the integral base 11.
Further, the filter element microscope base 40 includes prolonging arm 44 and at least a sinking arm 45 in a filter element microscope base main body 43, at least one, the sinking arm 45 is from the filter element microscope base main body 43 turning ground, longitudinally one extension, in order to which the installation site of the optical filter sinks to the optical window 111.Prolonging arm 44 in described, bendingly, laterally one extends from the sinking arm 45, in order to provide the installation site of horizontal direction for the filter element 50, so that the filter element 50 is consistent with the optical axis of the photosensitive element 20.Particularly, the filter element microscope base 40 include four integrally connecteds in prolong the sinking arm 45 of arm 44 and four integrally connecteds, it is each it is described in prolong arm 44 and each sinking arm 45 and extend to form the filter element microscope base 40 of annular one in different positions.
In one embodiment, the shape of the engaging groove 42 of the filter element microscope base 40 is consistent with the shape of the optical window 111 that the integral base 11 is formed, and the shape of the support slot 41 is consistent with the shape of the filter element 50.Particularly, the filter element 50 is square structure, and the top view of the support slot 41 is an annular, such as side's annular.
It is noted that the extended distance of the sinking arm 45 influences submergence depth of the optical filter in the optical window 111, and the interior extended distance for prolonging arm 44 influences the size of the optical filter of installation.For example, more to sinking, the distance apart from the photosensitive element 20 is smaller for position of the optical filter in the optical window 111 when 45 extended distance of sinking arm is bigger, and after the corresponding camera module monomer Focal length is smaller；When it is described it is interior prolong 44 extended distance of arm it is bigger when, the utensil receiving opening 411 of the filter element microscope base 40 is smaller, and the area of the filter element 50 needed is smaller, to be more easier to obtain the suitable filter element 50, and it is easy for installation, reduce the cost of the camera module monomer.Certainly, the extended distance of the sinking arm 45 needs not make it dim spot occur on the basis of the imaging effect in conjunction with the camera module, such as reduction back focal length, such as the image of dust；And it is described in prolong the extended distance of arm 44 and need to consider the factors such as the photosensitive area 1311 of the camera module monomer passage of light and the photosensitive element 20 and the remaining width of the non-photo-sensing area 1312 and the circuit board 12, such as when prolonging arm 44 within make and extending internally, in the lesser situation of the filter element 50, the photosensitive area 1311 of the photosensitive element 20 will not be blocked by prolonging arm 44 in described, the light ray flux of entrance will not excessively be blocked, and it is more to encapsulate remaining wider position extension in the circuit board 12, and it is smaller to encapsulate the lesser position extension of remaining width in the circuit board 12, to in the case where guaranteeing image quality, reduce the area of the filter element 50 as far as possible.
Citing ground, referring to Figure 25 B, described interior the distance between arm 44 that prolongs of opposite sides is labeled as L, then the diameter of the filter element 50 needs be only greater than L, it can be equipped in described and prolong arm 44, without going to be equipped on the Base body 112, so that the demand area of the filter element 50 reduces.
The shape of shown filter element microscope base 40 and the shape of the integral base 111A match.In some embodiments, the integral base 11 is approximate regulation symmetrical structure, such as side's annular, correspondingly, the filter element microscope base 40 is symmetrical structure, and the filter element microscope base main body 43 is regular shape, it is each it is described in prolong that 44 shape of arm is consistent, and each 45 shape of sinking arm is consistent.And in further embodiments, since the position for the electronic component 122 for needing to coat is different, the inside of the integral base 11 has inwardly projecting position, width is different, and correspondingly, the position of corresponding groove or protrusion can be set in the filter element microscope base main body 43, or make the length for prolonging arm 44 in described different, to adapt to the shape of the integral base 11, the position where the photosensitive element 20 is adapted to, and be easily installed the filter element 50.
In some embodiments, the filter element microscope base 40 can be installed on the integral base 11A in such a way that glue is bonded, and the planarization of the filter element microscope base 40 can be adjusted by glue thickness.
Further, the two camera module monomers, which successfully connect, forms array structure.Specifically, the two integral base components 10 of the two camera module monomers 100, which successfully connect, forms a conjoined base component 1100.Two circuit boards 12 are integrally connected to form a disjunctor circuit board 1120.Two integral bases 11, which successfully connect, forms a conjoined base 1110.The two filter element microscope bases 40, which successfully connect, forms a disjunctor filter element microscope base 1400.That is, the conjoined base 1110 formed in integral packaging technique forms two optical windows 111, to be respectively that two photosensitive elements 20 provide passage of light.Alternatively, two filter element microscope bases 40 can be independent microscope base, not integrally connected, and be respectively arranged in the conjoined base 1110.Described two integral bases 11 are also possible to two independent pedestals.
Specifically, the conjoined base 1110 is integrally packaged in the disjunctor circuit board 1120, and the conjoined base 1110 has two optical windows 111, and respectively two photosensitive elements 20 and the camera lens 30 provide light Line access.The disjunctor filter element microscope base 1400 has two support slots 41, is respectively used to install the filter element 50.
It is noted that the mode of two 100 disjunctor of the camera module monomer settings, helps to improve the mutual consistency of the two camera module monomers 100, and save space.Such as, the disjunctor filter element microscope base 1400 can provide installation site simultaneously for two filter elements 50, and during manufacture, the consistency of two support slots 41 can be controlled by area, to provide consistent installation environment for the filter element 50.
The conjoined base 1110 includes a disjunctor portion 1111, and the adjacent integral base 11 is integrally connected by the disjunctor portion 1111.The disjunctor filter element microscope base 1400 includes a bridge 1410, and the two filter element microscope bases 40 are integrally connected by the bridge 1410, suitable for being connected across the disjunctor portion 1111 of the conjoined base 1110.More specifically, two adjacent sides of the Base body 112 of two integral bases 11 are integrally connected to form the disjunctor portion 1111.Two adjacent sides of the filter element microscope base main body 43 of the two filter element microscope bases 40 are integrally connected to form the bridge 1410.
It is worth mentioning that, in this embodiment in accordance with the invention, referring to Figure 25 A, 25B, two camera module monomers 100 all include the driver 60, that is, the two camera module monomers 100 are all dynamic burnt camera module, two dynamic burnt camera modules cooperate and realize the acquisition of image.And in other embodiments of the invention, the array camera module 1000 can also be the combination of other kinds of camera module monomer.It in one embodiment, does not include the driver 60 referring to Figure 28 A, 28B, the two camera module monomers 100, that is to say, that the two camera module monomers 100 are all fixed-focus camera module, and the two fixed-focus camera modules, which cooperate, realizes the acquisition of image.In one embodiment, referring to Figure 29 A, 29B, the camera module monomer 100 of one of the array camera module 1000 includes a driver 60, constitute dynamic burnt camera module, another described camera module monomer 100 does not include the driver 60, constitutes fixed-focus camera module, and the dynamic burnt camera module and the fixed-focus camera module match the acquisition for realizing image.
In this embodiment, the disjunctor filter element microscope base 1400 is installed in the conjoined base 1110, each driver 60 is installed in the disjunctor filter element microscope base 1400, that is, the disjunctor filter element microscope base 1400 is arranged between the driver 60 and the conjoined base 1110.And in another variant embodiment, referring to Figure 30 A, conjoined base 1110 described in 30B and institute's driver 60 are all installed in the top surface 113 of the conjoined base 1110.Further, the disjunctor filter element microscope base 1400 is installed in the adjacent medial side position of the integral base 11, the driver 60 is installed in the position of 1110 adjacent lateral side of conjoined base, thus the top surface 113 of conjoined base 1110 described in the driver 60 and 1400 coordinated allocation of disjunctor filter element microscope base.
As shown in figure 31, be the 11st preferred embodiment according to the present invention conjoined base and disjunctor filter element microscope base first variant embodiment.In this embodiment, it upwardly extends to each integral base 11A inner inclination, forms the optical window 111A that opening is gradually increased.More specifically, each described one There is body pedestal 11A the central optical axis of medial surface a 114A, the medial surface 114A and the camera module to form an inclined angle alpha, so that the opening of the optical window 111A is gradually increased, in order to being manufactured for the integral base 11A.Wherein the magnitude range of α is 3 °~30 °, and in some embodiments, the numerical value of α is selected from 3 °~15 °, 15 °~20 ° or 20 °~30 °.Correspondingly, the engaging groove 42A of each filter element microscope base 40A has an engagement angle α 1, the engagement angle α 1 is corresponding with the inclined angle alpha, in order to which the shape of the engaging groove 42A and the tilted shape of the medial surface 114A are adapted, so that filter element microscope base 40A installation is more stable.
In other words, the sinking arm 45A extends from filter element microscope base main body 43A steering ground, inclined downward, to form the engagement angle α 1 being adapted with the inclined angle alpha.Further, in one embodiment, prolong arm 44A in described to turn to ground in the sinking arm 45A, horizontally extend, form a strut angle β, the strut angle β is greater than 90 °, convenient for the installation of the filter element 50.Certainly, the filter element microscope base 40A of no engagement angle α 1 and the strut angle β can also be installed on the integral base 11A with the inclined angle alpha.
As shown in fig. 32 a, be the 11st preferred embodiment according to the present invention conjoined base component and disjunctor filter element microscope base second variant embodiment.There is each filter element microscope base 40B support slot a 41B, the support slot 41B to be connected to the optical window 111B of the corresponding integral base 11B, provide installation site for the filter element 50.In other words, the filter element 50 is installed in the support slot 41B.
Further, the filter element microscope base 40B includes prolonging arm 44B in a filter element microscope base main body 43B and at least one, and the interior arm 44B that prolongs integrally extends internally from the lower filter element microscope base main body 43B transverse direction, forms the support slot 41B.The filter element microscope base main body 43B is engaged in the integral base 11B.
That is, the filter element microscope base 40B does not include the sinking arm 45, and does not have the engaging groove 42, therefore relative to above-described embodiment, the installation site of the filter element 50 is not sunken to down in the optical window 111B.But by the interior extended distance for prolonging arm 44B, it equally can reduce the area of the filter element 50 of needs.
Figure 32 B is a variant embodiment of second variant embodiment of the disjunctor filter element microscope base of the 11st preferred embodiment according to the present invention.Each filter element microscope base 40B1 has the attachment slot 48B1 of a support slot 41B1 and one, and the respectively described camera lens 30 and the filter element 50 provide installation site.
Further, each filter element microscope base 40B1 includes prolonging arm 44B1 in a filter element microscope base main body 43B1 and at least one, prolong arm 44B1 in described and laterally integrally extend internally from the lower the filter element microscope base main body 43B1, forms the support slot 41B1 and the attachment slot 48B1.The filter element microscope base 40B1 further includes that camera lens part a 49B1, the camera lens part 49B1 is integrally upwardly extended from the filter element microscope base main body 43B1, in order to accommodate the camera lens 30.It is described in the embodiment of the invention Filter element 50, which is mounted in described in a manner of losing money instead of making money, prolongs arm 44B1.
Further, in the embodiment of the invention, smooth, non-threaded configurations inside the camera lens part 49B1, suitable for installing a non-threaded camera lens 30.
That is, the camera lens 30 can be directly mounted inside the filter element microscope base 40B1, to limit the camera lens 30 when the camera module monomer 100B1 is fixed-focus camera module.Particularly, there is gap, in order to install, adjust the camera lens 30 between the camera lens part 49B1 and the camera lens 30.
Figure 32 C is another variant embodiment of second variant embodiment of the disjunctor filter element microscope base of the 11st preferred embodiment according to the present invention.Each filter element microscope base 40B2 has the attachment slot 48B2 slot of a support slot 41B2 and one, and the respectively described camera lens 30 and the filter element 50 provide installation site.
Further, each filter element microscope base 40B2 includes prolonging arm 44B2 in a filter element microscope base main body 43B2 and at least one, prolong arm 44B2 in described and laterally integrally extend internally from the lower the filter element microscope base main body 43B2, forms the support slot 41B2 and the attachment slot 48B2.The filter element microscope base 40B2 further includes that camera lens part a 49B2, the camera lens part 49B2 is integrally upwardly extended from the filter element microscope base main body 43B2, in order to accommodate the camera lens 30.In the embodiment of the invention, the filter element 50, which is mounted in described in a manner of losing money instead of making money, prolongs arm 44B2.
Further, in the embodiment of the invention, there is helicitic texture inside the camera lens part 49B1, is suitable for the one threaded camera lens 30 of installation.
That is, the camera lens 30 can be directly mounted inside the filter element microscope base 40B2, to limit the camera lens 30 when the camera module monomer 100B2 is fixed-focus camera module.
It is noted that above-mentioned two embodiment, only illustrates the possibility mode of texturing of the filter element microscope base 40 as an example, illustrate that the camera lens 30 can be directly mounted to inside described filter element microscope base 40B1,40B2, but is not limitation.
As shown in figure 33 a, be the 11st preferred embodiment according to the present invention array camera module third variant embodiment.In this embodiment, each filter element microscope base 40C has an at least turning mouthful 441C, the turning mouthful 441C is arranged at the angular position of the filter element microscope base 40, in order to the installation of the filter element 50, reduce the sharp corners bring edge shadow in the camera module imaging.More specifically, prolonging arm 44C in adjacent two forms a turning mouthful 441C, the turning mouthful 441C extends outwardly, in order to increase the camera module in the luminous flux of the angular position of the filter element microscope base 40C.
Specifically, in one embodiment, the turning mouthful 441C can be the rectangular angle of extension, citing ground but be not limited to, and be arranged four in four angular positions of the filter element microscope base 40C and extend rectangular angle accordingly.In further embodiments, the turning mouthful 441C can also increase the luminous flux in the filter element microscope base 40C in corner with arc chord angle.Certainly in some embodiments, it is also possible to be not provided with the turning mouthful 441C, those skilled in the art is not it should be understood that shape, position and the quantity of the turning mouthful 441C are Limitation of the invention.
It is a variant embodiment of the 11st preferred embodiment according to the present invention as shown in Figure 33 B.In this embodiment of the invention, each filter element microscope base 40P includes a retention bead 46P, the top surface of the retention bead 46P from the filter element microscope base main body 43P at least partly, raisedly upwardly extend, and enter inside camera module in order to limit mounted element, blocks dust or light.It retention bead 46P citing ground but is not limited to limit the driver 60 or camera lens 30.Particularly, in this embodiment of the invention, the disjunctor filter element microscope base 1400P includes the two retention bead 46P, and each one annular protrusion of self-forming limits the corresponding driver 60.In another embodiment, the intermediate position for the disjunctor filter element microscope base 1400P that the two filter element microscope base 40P are constituted, the i.e. described bridge 1410P can be not provided with the retention bead 46P, and the retention bead 46P only is arranged around the disjunctor filter element microscope base 1400P.
In the embodiment of the invention, the retention bead 46P can position the position of the driver 60, the offset of the driver 60 is reduced, and in an assembling process, can prevent the glue for installing the driver 60 from overflowing to internal and being infected with camera lens 50 or internal element.
It is noted that in other embodiments of the invention, screw thread can be set in the surface the retention bead 46P, in order to be mounted directly the camera lens 30.And on the outside of the retention bead 46P when setting screw thread, the camera lens 30 suitable for larger aperture.
It is the array camera module of the 12nd preferred embodiment according to the present invention as shown in Figure 34 A to Figure 35.Each integral base 11D includes that a Base body 112D forms an at least optical window 111D, provides passage of light for the photosensitive element 20.Further, the Base body 112D has at least one opening 1121D, and the opening 1121D is connected to the optical window 111D and outside, the filter element microscope base 40D are complemented at the opening, to form the optical window 111D of side-closed.
Each filter element microscope base 40D includes that at least one extension leg 433D, the extension leg 433D integrally extends downward into the substrate 121D from the filter element microscope base main body 43D, to close the opening 1121D.Citing ground but be not limited to, the extension leg 433D is connected to the substrate 121D and/or Base body 112D by way of bonding.
The Base body 112D forms a U-shaped structure, the filter element microscope base main body 43D is engaged in the U-shaped structure of the Base body 121D, and the extension leg 433D of the filter element microscope base 40D is complemented at the aperture position of the U-shaped structure, so that the integral base 11D closure, forms a closed interior environment.
In other words, in this embodiment, the function of the microscope base of the integral base 11D and the filter element microscope base 40D shared camera module, so that the advantage of integral packaging and the function of filter element microscope base 40D combine.
It is noted that since the size to camera module requires higher and higher, the circuit board 12D On the electronic component 122D arrangement, the setting position of the electrical connecting element 203, the needs such as the package position of the integral base 11D are reasonably arranged, while making full use of the substrate 121D, so that component placement footprint area is minimum, to further decrease the size of the camera module.And this embodiment according to the invention, integral packaging is carried out in the direction for arranging the electronic component 122D, coat the electronic component 122D, utilize the spatial position of electronic component, the electromagnetic effect between the electric components and the electrical connecting element 203 is reduced simultaneously, and the filter element microscope base 40D is set in the mode of the not set electric components, make full use of the rest position on the substrate 121D.On the other hand, by the bonding process of the filter element microscope base 40D, adjustable, the supplement integral base 11D planarization provides good mounting condition for the camera module.
It is the conjoined base and disjunctor filter element microscope base variant embodiment of the array camera module of the 12nd preferred embodiment according to the present invention as shown in Figure 36 A to 36C.The integral base 11E includes that Base body a 112E, the Base body 112E forms an at least optical window 111E, provides passage of light for the photosensitive element 20.Further, there are the integral base 11E two opening 1121E, each opening 1121E to be connected to the optical window 111E and outside, and the filter element microscope base 40E supplements the two opening 1121E, the side of the optical window 111E is closed.
The filter element microscope base 40E includes two extending leg 433E, and each extension leg 433E integrally extends downward into the substrate 121E from the filter element microscope base main body 43E, so as to by each closure of openings.Citing ground but be not limited to, each extension leg 433E is connected to the substrate 121E and/or Base body 112E by way of bonding.More specifically, in one embodiment, the Base body 112E is parallel construction, the filter element microscope base 40E main body is engaged in the parallel construction of the Base body 112E, and the extension leg 433E of the filter element microscope base 40E is complemented at the both ends open position of the parallel construction, so that the Base body 112E is closed to form a closed interior environment.In some embodiments, the adjacent two extension leg 433E integrally connected, and form a shared extension leg, that is, share leg.Particularly, the shared leg is interval in the two optical window 111E, and the passage of light of the two camera module units is isolated.That is, in this embodiment, the disjunctor filter element microscope base 1400E includes three extension leg 433E, it is arranged in parallel, it is wherein located in the middle the extension leg 433E and separates the two optical window 111E, and extension leg 433E described in other two is complemented at the opening 1121E of the conjoined base 1110E respectively, to form two closed, the mutually independent optical window 111E.In other words, in the array camera module 1000E, the two optical window 111E of the two camera module monomer 100E are interconnected, and supplement the conjoined base 1110E by the disjunctor filter element microscope base 1400E, form two separations, the closed optical window 111E.And the adjacent extension leg 433E of the filter element microscope base 40E forms public portion, substitutes the disjunctor portion 1111E of conjoined base 1110E.In one embodiment, the two adjacent extension leg 433E are integrally connected.
It is the integral base of the 12nd preferred embodiment according to the present invention as shown in Figure 37 A and Figure 37 B Another variant embodiment of component and filter element microscope base.In this embodiment, each integral base includes that Base body a 112Q, the Base body 112Q forms an at least optical window 111E, provides passage of light for the photosensitive element 20.Further, the integral base 11Q has at least one opening 1121Q, and each open communication is complemented at the opening 1121Q in the optical window 111Q and outside, the filter element microscope base 40Q, will close around the optical window 111Q.Different from above embodiment, in the conjoined base component 1100Q, two positions opening 1121Q of the two integral base main body 112Q are opposite, so that convenient limit the disjunctor filter element microscope base 1400Q from two sides respectively.
Further, each opening 1121Q is in inverted trapezoidal structure, in order to position, install the filter element microscope base 40Q.Correspondingly, the filter element microscope base includes that at least one extension leg 433Q, each extension leg 433Q integrally extends downward into the substrate 121 from the filter element microscope base main body 43Q, in order to close the opening 1121Q.Specifically, the two extension leg 433Q are oppositely arranged, and are inverted trapezoidal structure, suitable for being complemented at the corresponding opening 1121Q.Citing ground, when installing the filter element microscope base 40Q, the extension leg is limited in the opening 1121Q, respectively by the two optical window 111Q periphery seals.
Those skilled in the art is not limitation of the invention it should be understood that be open the shape of 1121Q described in the embodiment of the present invention and size only illustrates the mode that can be carried out as an example.
Particularly, in some embodiments, the electronic component 122Q can be collectively arranged in side, and it is coated by at least partly described Base body 112Q, and coated by the wider Base body 112Q, and the side of the not set electronic component 122Q corresponds to the relatively narrow Base body 112Q.The filter element microscope base is installed on the Base body 43Q by 40Q, and the extension leg 433Q is complemented at the opening 1121Q between two parts.
Further, the Base body 112Q has at least one opening face 1122Q, and the opposite two opening faces form the opening 1121Q.The opening face 1121Q is obliquely integrally upwardly extended from the substrate 121, in order to form the trapezoidal opening 1121Q.Correspondingly, the extension leg 433Q has at least one supplement face 4331Q, and the supplement face 4331Q is corresponding with the opening face 1122Q, in order to which the extension leg 433Q shape is complementally complemented at the opening 1121Q, by the optical window 111Q periphery seal.
Particularly, it can be fixed in such a way that glue is bonded between the opening face 1122Q for extending the leg 433Q and supplement face 4331Q and Base body 112Q.
It is the array camera module of the 13rd preferred embodiment according to the present invention as shown in Figure 38 A to Figure 39.Each integral base 11F has a mounting groove 115F and at least notch a 117F, the mounting groove 115F is connected to the optical window 111F.In this embodiment in accordance with the invention, the notch 117F is arranged at the adjacent position of two integral bases, i.e., the top the interconnecting piece 1111F of the described conjoined base 1110F, and is connected to two sides.That is, two mounting grooves 115 are connected to by the notch 117F, in order to accommodate the bridge 1410F of the disjunctor filter element microscope base 1400F.
Each filter element microscope base 40F is installed in the mounting groove 115F.More specifically, the installation Slot 115F is U-type groove, and U-shaped opening corresponds to the notch 117F.Particularly, the U-type groove of the two filter element microscope base 40F is connected to each other, and forms the closing structure that an inside is connected to.When the disjunctor filter element microscope base 1400 is installed in the conjoined base 1110, the bridge 1410 of the disjunctor filter element microscope base 1400, which is connected across, is located in the middle the notch 117F.
Specifically, the engaging groove 42F of the filter element microscope base 40F is engaged in the mounting groove 115F of the integral base 111F, so that the filter element microscope base main body 43F of the filter element microscope base 40F is supported in the support slot 41F.
The predetermined thickness that the filter element microscope base main body 43F of the filter element microscope base 40F has, so that it be made to be not easy to touch the component being located above, such as driver 60 or camera lens 30.Preferably, when the filter element microscope base 40F is installed in the mounting groove 115F, the top surface of the filter element microscope base 40F is consistent with the top surface of the Base body 112F, so that the filter element microscope base 40F will not or less protrude from the Base body 112F, and it is not easy to touch the driver 60 or camera lens 30 being located above.
More specifically, each integral base 11F includes multiple raised step 116F, the Base body 112F is protruded from.Each raised step 116F partly extends upwards from the Base body 112F, forms the mounting groove 115F.At least one side of the integral base 11F does not have the raised step 116F, forms the notch 117F.
This embodiment according to the invention, each integral base 11F include three raised step 116F, and each raised step 116F steering ground integrally connected forms the U-shaped mounting groove 115F.I.e., it has no the side of the raised step 116F forms the notch 117F.
The filter element microscope base main body 43F of the filter element microscope base 40F includes an at least jointing edge 431F and an at least extension side 432F, the jointing edge 431F for being engaged in the mounting groove 115F, and the extension side 432F is for being filled in the notch 117F.In other words, the extension side 432F extends into the notch 117F, so that the notch 117F is filled, to form environment in closing.In this embodiment, the extension side 432F forms the bridge 1410F.
This embodiment according to the invention, the filter element microscope base main body 43F of the filter element microscope base 40F includes a three jointing edge 431F and extension side 432F, each jointing edge 431F and extension side 432F turns to ground integrally connected, to adapt to the shape of the mounting groove 115F.
The sinking arm 45F turns to ground from the jointing edge 431F and extension side 432F respectively, integrally extends downwardly, to form the engaging groove 42F.Prolong arm 44F in described to turn to ground from the interior arm 44F that prolongs, be integrally laterally extended, to form the support slot 41F.
It is noted that the electronic component 122F is arranged in the different location of the circuit board 12F main body, and the integral base 11F coats the electronic component 122F.In the position for arranging the electronic component, the thickness that the integral base 11F needs is larger, and facilitates the setting mounting groove 115F, and lesser thickness can be set in the position without the electronic component 122F, to reduce to the circuit board 12F Size is not suitable for that the mounting groove 115F is arranged.This embodiment according to the invention, in three jointing edge 431F corresponding integral base 11F arrangement electronic component 122F, the transverse gage of the integral base 11F is larger, the mounting groove 115F is set, and the transverse gage of the integral base 11F of the corresponding side the extension side 432F is smaller, it is not provided with the mounting groove 115F, and fills the notch 117F by the extension side 432F, undertakes the effect of the raised step 116F.
The driver 60 is at least partly installed in the raised step 116F, to form a dynamic burnt camera module.The driver 60 is operatively connected to the circuit board 12 by an at least pin 61.And in other embodiments, the camera lens 30 is installed in the raised step 116F or filter element microscope base 40F, forms a fixed-focus camera module.
More specifically, three sides of the driver 60 are installed in the raised step 116F, and the remaining extension side 432F for being installed in the filter element microscope base 40F on one side.In some embodiments, there are gaps between the driver 60 and the extension side 432F, and the gap is sealed by glue, to form closed interior environment for the camera module.In other words, the extension side 432F apparent height is lower than the apparent height of the raised step 116F, and can supplement difference in height by glue.Particularly, the driver 60 can be installed on the raised step 116F by way of bonding, and make the camera lens 30 consistent with the optical axis of the photosensitive element 20.
It is the array camera module of the 14th preferred embodiment according to the present invention as shown in Figure 40 A to Figure 41.
Each integral base 11R includes that a Base body 112R forms an at least optical window 111R, provides passage of light for the photosensitive element 20.Further, the Base body 112R has at least one opening 1121R, and the opening 1121R is connected to the optical window 111R and outside, the filter element microscope base 40R are complemented at the opening, to form the optical window 111R of side-closed.In this embodiment, the two opening 1121R of the two of the conjoined base 1110R integral base 11R are interconnected.
Each filter element microscope base 40R includes that at least one extension leg 433R, the extension leg 433R integrally extends downward into the substrate 121R from the filter element microscope base main body 43R, to close the opening 1121R.Citing ground but be not limited to, the extension leg 433R is connected to the substrate 121R and/or Base body 112R by way of bonding.
In some embodiments, the adjacent two extension leg 433R integrally connected, and form a shared extension leg, that is, leg is shared, particularly, the shared leg is interval in the two optical window 111R, and the passage of light of two camera modules is isolated.That is, in this embodiment, the disjunctor filter element microscope base 1400R includes the extension leg 433R of two integrally connecteds, positioned at the centre of the two optical window 111R of centre, separate the two optical window 111R, to form two closed, the mutually independent optical window 111R.
There is the integral base 11R opening of an at least mounting groove 115R and one 117R, the mounting groove 115R to be connected to the optical window 111R, the optical window 111R of notch 117R connection two sides.The optical filtering member Part microscope base 40R is installed in the mounting groove 115R.
This embodiment according to the invention, the integral base 11R includes three raised step 116R, wherein each raised step 116R partly up extends to form the mounting groove 115R from the Base body 112R.
The filter element microscope base main body 43R of the filter element microscope base 40R includes at least jointing edge a 431R, the jointing edge 431R for being engaged in the mounting groove 115R.
This embodiment according to the invention, the filter element microscope base main body 43R of each filter element microscope base 40R includes a three jointing edge 431R and extension side 432R, the extension of the jointing edge 431R one of the adjacent integral base 11R, it is parallel to each other, the extension side 432R is set between the jointing edge 431R.That is, in this embodiment, the notch 117R of the conjoined base is arranged at the adjacent position two pedestal 11R, it is interconnected.The extension side 432R of the disjunctor filter element microscope base is arranged at corresponding adjacent position, is integrally connected to form the bridge 1410R.
The sinking arm 45R turns to ground from the jointing edge 431R, is integrally downwardly extending an engaging groove 42R, in order to be engaged in the mounting groove 115R.It is described in prolong arm 44R from the sinking arm 45R turn to ground, be integrally laterally extended to form a support slot 41R, in order to provide installation site for the filter element 50.It is noted that the electronic component 122R is arranged in the different location of the circuit board main body 121R, and the integral base 11R coats the electronic component 122R.In the position for arranging the electronic component, the thickness that the integral base 11R needs is larger, and it is conveniently used for forming the mounting groove 115R, lesser thickness can be set in position without the electronic component 122R, to reduce to the circuit board 12R size, it is not suitable for forming the mounting groove 115R.This embodiment according to the invention, in two jointing edge 431R corresponding integral base 11R arrangement electronic component 122R, the transverse gage of the integral base 11R is larger, the mounting groove 115R is set, and the transverse gage of the integral base 11R of the corresponding side the raised step 116R of another not formed mounting groove 115R is smaller.
The driver 60 is at least partly installed in the raised step 116R, to form a dynamic burnt camera module.The driver 60 is operatively connected to the circuit board 12R by least one pin 61.And in other embodiments, the camera lens 30 is installed in the raised step 116R or filter element microscope base 40R, forms a fixed-focus camera module.
More specifically, the driver 60 is installed in the raised step 116R, wherein both sides are supported on the raised step 116R to form the mounting groove 115R, and it is remaining be installed in raised step 116R described in the not formed mounting groove 115R on one side, remaining side is supported on the extension side 432R.
It is the variant embodiment of the array camera module of the 14th preferred embodiment according to the present invention as shown in Figure 42 A to 43.Each integral base 11H includes three raised step 116H, and three raised step 116H turn to ground integrally connected, wherein the two raised step 116H and the Base body 112H shape At a mounting groove 115H, another raised step 116H is integrally upwardly extended from the Base body 112H, and does not form the mounting groove 115H.Two adjacent positions the integral base 11H do not include the raised step 116H, form a notch 117H.That is, the mounting groove 115H that the formation two of the conjoined base 1110H is arranged side by side, the notch 117H is between the two mounting groove 115H.Correspondingly, each filter element microscope base 40H forms a U-shaped structure, and the opening of the U-shaped structure is opposite with the raised step 116H of the not formed mounting groove 115H.It is namely to say, it is an E type structure that the disjunctor filter element microscope base 1400H, which is integrally overlooked, and the intermediate position of E type intermediate structure is connected across the disjunctor portion 1111H of the conjoined base 1110H, and both ends open is blocked by the raised step 116H.
As Figure 44 A, 44B are and the array camera module that shown in Figure 45, is the 15th preferred embodiment according to the present invention.
Different from above preferred embodiment, the integral base 11I includes a raised step 116I, and there are three notch 117I, the raised step 116I partly integrally to upwardly extend to form the mounting groove 115I from the integral base 112I for tool.I.e., it has no three sides of the raised step 116I form each notch 117I.
The filter element microscope base main body 43I of the filter element microscope base 40I includes an at least jointing edge 431I and an at least extension side 432I, the jointing edge 431I for being engaged in the mounting groove 115I, and the extension side 432U1 is for being filled in the notch 117I.In other words, the extension side 432I extends into the notch 117I, so that the notch 117I is filled, to form environment in closing.
This embodiment according to the invention, the filter element microscope base main body 43I of the filter element microscope base 40I includes an extension side 432I of jointing edge 431I and three, the jointing edge 431I and each extension side 432I turn to ground integrally connected, to adapt to the shape of the mounting groove 115I.It is worth mentioning that, in this embodiment, in the array camera module, in the disjunctor filter element microscope base 1400I that two filter element microscope base 40I are formed, two mutually adjoined the extension side 432I one disjunctor, and form the common sparing of the two neighboring camera module monomer 100I, that is, form the bridge 1410I.
The sinking arm 45I turns to ground from the jointing edge 431I and extension side 432I respectively, integrally extends downwardly, to form the engaging groove 42I.Prolong arm 44I in described to turn to ground from the interior arm 44I that prolongs, be integrally laterally extended, to form the support slot 41I.
Further, in this embodiment, the two raised step 116I of the two of the conjoined base 1100I integral base 11I integrally extend connection, "-" type structure are constituted, to form the mounting groove of "-" type.The notch 117I is adjacent, forms an E type structure.Correspondingly, the extension side 432I of the filter element microscope base 40I is adjacent, forms a U-shaped structure, and the jointing edge 431I is arranged at the port of the U-shaped structure.In the disjunctor filter element microscope base 1400I, the adjacent two extension side 432I one disjunctor adapts to the disjunctor portion 1111I of the conjoined base 1110I to form the bridge 1410I.According to another variant embodiment, connect described in two raised step 116I two of the integral base 11I Conjunction side 431I is adjacent, and the two notch 117I are adjacent.That is, the two raised step 116I constitute a L-type structure, to form the mounting groove 115I of L-type.The notch 117I is adjacent, to form a L-type extension mouth.Correspondingly, the two jointing edge 431I of the filter element microscope base 40I are adjacent, are adapted to engage with the mounting groove 115I in L-type, and the two extension side 432I are adjacent, suitable for filling the notch 117I of L-type, to form closed interior environment.The driver 60 is at least partly installed in the raised step 116I, to form a dynamic burnt camera module.The driver 60 is operatively connected to the circuit board 12I by least one pin 61.And in other embodiments, the camera lens 30 is installed in the raised step 116I or filter element microscope base 40I, forms a fixed-focus camera module.More specifically, the both sides of the driver 60 are supported on the raised step 116I to form the mounting groove 115I, and remaining both sides are installed in the extension side 432I of the filter element microscope base 40I.
It is the variant embodiment of the 15th preferred embodiment array camera module according to the present invention as shown in Figure 46 A and Figure 47.In the embodiment of the invention, the setting position of the raised step 116J is different from above preferred embodiment.In the conjoined base 1110J of the array camera module, the raised step 116J of two integral base 11J is with respect to thirty years of age, a parallel structure is formed, each raised step 116J forms the mounting groove 115J with the corresponding Base body 111.That is, the two mounting groove 115J positioned at the conjoined base 1110J are arranged at mutually contradictory position.Relative to above-described embodiment 15, in this variant embodiment, the raised step 116J of two of the conjoined base 1110J becomes relatively arranged in parallel from word order.
It is the embodiment of the array camera module of the 16th preferred embodiment according to the present invention as shown in Figure 48 A, 48B and Figure 49.Different from above preferred embodiment, each integral base 11K includes a raised step 116K, and there are three notch 117K for tool.The raised step 116K partly, integrally upwardly extends to form the mounting groove 115K from the Base body 112K.I.e., it has no three sides of the raised step 116K form the notch 117K.
The filter element microscope base main body 43K of the filter element microscope base 40K includes an at least jointing edge 431K and an at least extension side 432K, the jointing edge 431K for being engaged in the mounting groove 115K, and the extension side 432K is for being filled in the notch 117K.In other words, the extension side 432K extends into the notch 117K, so that the notch 117K is filled, to form environment in closing.
This embodiment according to the invention, the filter element microscope base main body 43K of the filter element microscope base 40K includes a jointing edge 431K and three extension side 432K, each jointing edge 431K and extension side 432K turns to ground integrally connected, to adapt to the shape of the mounting groove 115K and the notch 117K.The extension side 432K of adjacent two is integrally connected the bridge 1410K to form the disjunctor filter element microscope base 1400, is connected across the disjunctor portion 1111K of conjoined base 1110K.
The sinking arm 45K turns to ground from the jointing edge 431K and extension side 432K respectively, integrally extends downwardly, to form the engaging groove 42K.Prolong arm 44K in described to turn from the interior arm 44K that prolongs Xiang Di, it is integrally laterally extended, to form the support slot 41K.
The driver 60 is at least partly installed in the raised step 116K, to form a dynamic burnt camera module.The driver 60 is operatively connected to the circuit board 12K by least one pin 61.And in other embodiments, the camera lens 30 is installed in the raised step 116K or filter element microscope base 40K, forms a fixed-focus camera module.
More specifically, the side of the driver 60 is supported on the raised step 116K to form the mounting groove 115K, and remaining three side is installed in the extension side 432K of the filter element microscope base 40K.
It is worth mentioning that, in this embodiment in accordance with the invention, the two raised step 116K of the two integral base 11K are offset horizontally by, to limit the installation site of the disjunctor filter element microscope base 1400, and in the other embodiments of invention, the relative position of the raised step 116K can be other layouts, for example, parallel or vertical direction etc..Those skilled in the art it should be understood that the two raised step 116K layout structure, be not limitation of the present invention.
It is the array camera module of the 17th preferred embodiment according to the present invention as shown in Figure 50 A to 51.Different from above preferred embodiment, each filter element microscope base 40L includes prolonging wall 46 on one, it is described on prolong wall 46 and from the filter element microscope base main body 43L turn to ground, upwardly extend, form a limited mouth 461L.The limited mouth 461L citing ground but is not limited to driver 60 and camera lens 30 for limiting mounted component.That is, described in assembly array when array camera module 1000L, each driver 60 or the camera lens 30 are installed in the limited mouth 461L of each filter element microscope base 40L, the driver 60 or camera lens 30 are limited, so that each driver 60 or each camera lens 30 are consistent with the optical axis of each photosensitive element 20.The size of the limited mouth 461L can be determined according to mounted part dimension.
In other words, excessive deviation will not be generated, guarantee the consistency of the optical system of the camera module with frame constraint effect when so that the components such as the driver 60 or the camera lens 30 being installed in the filter element microscope base 40L by prolonging wall 46L on described.Meanwhile it is described on prolong wall 46L and can protect mounted component, such as driver 60 or camera lens 30, prevent it is external it is unnecessary touch so that the driver 60 or the installation of the camera lens 30 are stablized.And external dust can be blocked and entered inside each camera module monomer 100L.
Further, when the camera module monomer 100L is a dynamic burnt camera module, the filter element microscope base 40L has an at least pin mouth 462L, for across the pin 61.That is, 60 pin of driver passes through the pin mouth 462L when the driver 60 is installed in the limited mouth 461L of the filter element microscope base 40L, it is electrically connected to the circuit board 12L.Certainly, when the camera module monomer 100L is fixed-focus camera module, the filter element microscope base 40L can be not provided with the pin mouth 462L.
It is noted that in practical cross-sectional view, the pin mouth 462L may not as it can be seen that but for ease illustration and understanding, the pin mouth 462L is illustrated with dotted line in figure, this position is not limited to corresponding actual setting position.
It is noted that the driver 60 or the camera lens 30 of the array camera module 1000L It is limited on described and prolongs wall 46L, facilitate the light axis consistency for constraining the camera module monomer 100L, while facilitating the consistency of two camera module monomer 100L of control.
It as shown in figure 52, is the array camera module of the 18th preferred embodiment according to the present invention.What it is different from above preferred embodiment is, each filter element microscope base 40M includes prolonging the downward wall 47M of wall 46M and one on one, prolong on described wall 46M from the filter element microscope base main body 43M turn to ground, upwardly extend, formed limited mouth a 461M, the downward wall 47M from the filter element microscope base main body 43M turn to ground, be downwardly extending packet mouth 471M.Particularly, the downward wall 47M prolongs wall 46M on described and integrally extends, the integral outer retaining wall of shape.
The limited mouth 461M citing ground but is not limited to camera lens 30 for limiting mounted component.The lower packet mouth 471M is for accommodating the integral base 11M, that is, when assembling the array camera module 1000M, the driver 60 or the camera lens 30 are installed in the limited mouth 461M of the filter element microscope base 40M, the integral base 11M is housed inside in the lower packet mouth 471M, prolong wall 46M limit on described, block the camera lens 30, so that the camera lens 30 is consistent with the optical axis of the photosensitive element 20, the downward wall 47M blocks the integral base 11M, so that the array camera module 1000M overall structure comparison rule, facilitate installation, and shape is relatively beautiful.The size of the limited mouth 461M and the lower packet mouth 471M can determine according to mounted part dimension, citing ground but the size for being not limited to the driver 60, the camera lens 30 and the integral base 11M.
In one embodiment, the downward wall 47M can extend to the circuit board 12M, the citing ground but mode for being not limited by glue bonding is fixedly connected on the circuit board 12M, so that the filter element microscope base 40M is more steadily mounted.
Figure 53 is the cross-sectional view of the array camera module of the 19th preferred embodiment according to the present invention.
Each integral base 11N includes that camera lens wall a 118N, the camera lens wall 118N at least partly upwardly extends to form a camera lens room 1181N from the raised step 116N, is suitable for installing the camera lens 30, to form a fixed-focus camera module.
Further, the raised step 116N and the Base body 112N form the mounting groove 115N, for installing the filter element microscope base 40N.The camera lens wall 118N and the raised step 116N form another mounting groove 115N, for providing installation site for the camera lens 30.
Further, the engaging groove 42N of the filter element microscope base 40N is engaged in the mounting groove 115N, and the filter element 50 is installed in the support slot 41N of the filter element microscope base 40N.The camera lens 30 is installed in another mounting groove 115N.
The camera lens wall 118N is that the camera lens 30 provides installation site, constrains the installation site of the camera lens 30, so that the camera lens 30 is consistent with the optical axis of the photosensitive element 20, improves the precision of installation.
It is the array camera module exploded view of the 20th preferred embodiment according to the present invention as shown in Figure 54 A.The array camera module 1000S includes two camera module monomer 100S, each camera module monomer 100S includes an integral base component 10S, wherein the integral base component 10S includes a circuit board 12S, what it is different from above preferred embodiment is, the two circuit board 12S of the two camera module monomer 100S are spliced to form mutually the disjunctor circuit board 1120S, and the integral base 11S integral packaging is in the two circuit board 12S.That is, the two circuit board 12S are not to be integrally connected.In another embodiment of the invention, the two circuit board 12S can be not the mode spliced, it is to be understood that the present invention is not intended to limit in this respect independently of each other and there are gap.
It is the cross-sectional view of the array camera module of the 20th preferred embodiment according to the present invention as shown in Figure 54 B.The array camera module 1000T includes the camera module monomer 100T of two integrally connecteds, it includes a disjunctor circuit board 1120T, it is integrally formed in the conjoined base 1110T of the disjunctor circuit board 1120T, there are two optical window 111T for the conjoined base 1110T tool, respectively two photosensitive elements 20 and two camera lenses 30 provide passage of light, and the conjoined base 1110T forms two mounting groove 115T in top side, two independent filter element microscope base 40T are respectively set at the two mounting groove 115T, for carrying two filter elements 50 respectively.It is understood that the conjoined base 1110T is formed in top side can not form the mounting groove 115T in other variant embodiment, but have flat surface for installing the two independent filter element microscope base 40T.It is noted that each independent filter element microscope base 40T also can be configured to the arbitrary structures in the above-mentioned first to the tenth embodiment.
It is worth mentioning that, in the above-described embodiments, it is illustrated by taking the bimirror head array camera module that two camera module monomers 100 are constituted as an example, and in other embodiments, the array camera module 1000 may also include more described camera module monomers 100.In the above-described embodiments, each feature of each camera module monomer 100 is arranged in the form of symmetrical and forms the array camera module 1000, and in other implementations, each feature of each camera module monomer 100 can be in any combination, the asymmetrical array camera module 1000 is constituted, the present invention is not restricted by this respect.
It as shown in figure 55, is an application schematic diagram of array camera module according to the abovementioned embodiments of the present invention.The array camera module 1000 is arranged at an electronic device body 200, forms an electronic equipment 300 for having the array camera module 1000.
As shown in figure 55, the array camera module 1000 is applied to a smart phone, and the acquisition and reproduction for realizing image are cooperated with the smart phone.In other embodiments, the array camera module 1000 can be arranged at other electronic device bodies 200, form the different electronic equipments 300,300 concrete example of electronic equipment but be not limited to, wearable device, tablet computer, laptop, camera, monitoring device etc..
It is worth mentioning that, in the present invention, the camera module of integral packaging technique is complemented at by the filter element microscope base, the integral base of cooperation camera module carrys out the function of the traditional microscope base of shared, therefore on the basis of using the advantage of integral packaging technique, to make up, improve the application shortcoming in integral packaging.On the other hand, the filter element microscope base can be integrally formed, for example be integrally formed by way of injection molding, therefore With preferable planarization, and it is highly preferred that can use material self character can reduce the reflectivity of incident ray.Furthermore, there is above-described embodiment can see, in conjunction with the shape of the integral base, the filter element microscope base can be there are many variant, molding structure is simple, it is easily worked, and it is highly preferred that when being selected as suitable plastic material, the techniques such as do not need to be etched, and melanism or roughening treatment are not needed, the reflectivity of incident ray can be reduced, stray light is avoided.
With reference to Figure 56 to Figure 62 of Figure of description of the invention, the camera module of a preferred embodiment under this invention is elucidated with, wherein the camera module includes an at least optical lens 310 and at least one molding photosensory assembly 320.Each molding photosensory assembly 320 further comprises a photosensitive element 321 respectively, one wiring board 322 is circuit board, one molded base 323 and one group of lead 324, the both ends of each lead 324 are each extended over to be connected to the non-photo-sensing region of each photosensitive element 321 and each wiring board 322, each molded base 323 is at least integrally formed in each wiring board 322 respectively, so that the molded base 323 and the wiring board 322 form integral structure, each optical lens 310 is arranged at the photosensitive path of the photosensitive element 321 of each molding photosensory assembly 320 respectively.The light being reflected by the object enters the inside of the camera module from each optical lens 310, to be received by each photosensitive element 321 subsequent and carry out photoelectric conversion, to obtain image associated with object.
It is worth mentioning that, the photosensitive element 321 has one group of chip contacts 3211, the wiring board 322 has one group of wiring board connector 3221, wherein the both ends of each lead 324 can be connected to each of each of the described photosensitive element 321 chip contacts 3211 and the wiring board 322 wiring board connector 3221 respectively, be connected the photosensitive element 321 and the wiring board 322 by above-mentioned such mode.In an example of the invention, each of each of the photosensitive element 321 chip contacts 3211 and the wiring board 322 the wiring board connector 3221 can be terminal pad, i.e., each of each of the photosensitive element 321 chip contacts 3211 and the wiring board 322 the wiring board connector 3221 can be disc-shaped respectively, for making the both ends of each lead 324 be connected to each of each of the described photosensitive element 321 chip contacts 3211 and the wiring board 322 wiring board connector 3221.In another example of the invention, each of each of the photosensitive element 321 chip contacts 3211 and the wiring board 322 the wiring board connector 3221 can be it is spherical, such as by tin cream or other welding material point in the photosensitive element 321 and the wiring board 322 to be respectively formed the chip contacts 3211 of the photosensitive element 321 and the wiring board connector 3221 of the wiring board 322.Nevertheless, the shape of the wiring board connector 3221 of the chip contacts 3211 and wiring board 322 of the photosensitive element 321 is not intended to limit the contents of the present invention and range.
The photosensitive element 321 includes a photosensitive region 3212 and a non-photo-sensing region 3213, wherein the photosensitive region 3212 of the photosensitive element 321 and the non-photo-sensing region 3213 are integrally formed, and the photosensitive region 3212 is located at the middle part of the photosensitive element 321, the non-photo-sensing region 3213 is located at the outside of the photosensitive element 321, and the non-photo-sensing region 3213 surrounds the photosensitive region 3,212 1 weeks.Quilt The light of object reflection can be received by the photosensitive region 3212 of the photosensitive element 321 from after the inside that the optical lens 310 enters the camera module and carry out photoelectric conversion, to obtain image associated with object.
It will be appreciated by those skilled in the art that each of described photosensitive element 321 chip contacts 3211 are arranged at the non-photo-sensing region 3213 of the photosensitive element 321.In addition, the non-photo-sensing region 3213 of the photosensitive element 321 has a chip inside portion 32131, a chip interconnecting piece 32132 and a chip outside portion 32133, wherein the chip inside portion 32131 surrounds the photosensitive region 3,212 1 weeks, and the two sides of the chip interconnecting piece 32132 each extend over and are connected to the chip inside portion 32131 and the chip outside portion 32132.That is, the non-photo-sensing region 3213 is defined as the chip inside portion 32131 from the region of position that the positions of the chip contacts 3211 is set to the edge of the photosensitive region 3212, the region that the chip contacts 3211 are set in the non-photo-sensing region 3213 is defined as the chip interconnecting piece 32132, the non-photo-sensing region 3213 is defined as the chip outside portion 32132 from the region of position of outer edge that the positions of the chip contacts 3211 is set to the photosensitive element 321.In other words, from the point of view of the vertical view visual angle of the photosensitive element 321, the photosensitive element 321 is successively the chip outside portion 32133, the chip interconnecting piece 32132, the chip inside portion 32131 and the photosensitive region 3212 from outside to inside.
In addition, the wiring board 322 includes a smooth chip attachment region 3222 and a fringe region 3223, wherein the fringe region 3223 is integrally formed with the chip attachment region 3222, and the fringe region 3223 is located at around the chip attachment region 3222.The chip attachment region 3222 be used to mount the photosensitive element 321, and the wiring board connector 3221 is arranged at the fringe region 3223.The fringe region 3223 of the wiring board 322 has a wiring board inside portion 32231, a wiring board interconnecting piece 32232 and a wiring board outside portion 32233, wherein the wiring board inside portion 32231 surrounds the chip attachment region 3,222 1 weeks, and the two sides of the wiring board interconnecting piece 32232 each extend over and are connected to the wiring board inside portion 32231 and the wiring board outside portion 32233.That is, the fringe region 3223 is defined as the wiring board inside portion 32231 from the region of position at edge that the position of the wiring board connector 3221 is set to the chip attachment region 3222, the region that the wiring board connector 3221 is set of the fringe region 3223 is defined as the wiring board interconnecting piece 32232, the fringe region 3223 is defined as the wiring board outside portion 32233 from the region of position of outer edge that the position of the wiring board connector 3221 is set to the fringe region 3223.In other words, from the point of view of the vertical view visual angle of the wiring board 322, the wiring board 322 is successively the wiring board outside portion 32233, the wiring board interconnecting piece 32232, the wiring board inside portion 32231 and the chip attachment region 3222A from inside to outside.The type of the lead 324 is unrestricted in the camera module of the invention, such as in a specific example, the lead 324 may be implemented as gold thread, i.e., the photosensitive element 321 and the wiring board 322 can be linked together by way of beating gold thread, to which the photosensitive element 321 is after converting optical signal into electric signal, institute The wiring board 322 can be further transmitted to by the lead 324 by stating electric signal.It will be appreciated by those skilled in the art that be, in other examples of the camera module, the lead 324 also may be implemented as that silver wire, copper wire etc. are any to be can be realized the material that the electric signal transmits between the photosensitive element 321 and the wiring board 322 and be made.
In addition, in one example, the camera module may be implemented as a fixed-focus camera module, wherein the photosensitive path that the camera module makes the optical lens 310 be maintained at the photosensitive element 321 by being assembled in a microscope base of the molded base 323.
In another example, the camera module may be implemented as a zoom camera mould group, wherein the camera module adjusts the focal length of the camera module by changing the distance of the optical lens 310 and the photosensitive element 321.Specifically, in this example shown in Figure 62, the camera module further comprises an at least driver 330, wherein each optical lens 310 is arranged in correspondence with respectively in each driver 330, each driver 330 is assembled in each molded base 323 respectively, and each driver 330 is electrically connected to each wiring board 322 respectively, after electric energy and control signal are transmitted to the driver 330 by the wiring board 322, the driver 330 can drive the optical lens 310 to move back and forth along the photosensitive path of the photosensitive element 321, so as to adjust the focal length of the camera module.That is, the optical lens 310 is driveably set to the driver 330.
It is worth mentioning that, the type of the driver 330 is unrestricted in the camera module of the invention, such as in a specific example, the driver 330 may be implemented as any driver that the optical lens 310 can be driven to generate displacement along the photosensitive path of the photosensitive element 321 such as voice coil motor, wherein the driver 330 can receive electric energy and control signal in running order.
Further, with reference to shown in Figure 62, the camera module further comprises an at least filter element 340, wherein each filter element 340 is assembled in each molded base 323 respectively, and each filter element 340 is located at the photosensitive path of each photosensitive element 321.The light being reflected by the object enters the inside of the camera module from the optical lens 310, and by the photosensitive element 321 reception and can carry out photoelectric conversion by after the filter element 340 filtering.That is, the filter element 340 can filter the veiling glare in the light being reflected by the object for entering the inside of the camera module from the optical lens 310, such as infrared part can change the image quality of the camera module in this way.
It will be appreciated by those skilled in the art that be, in the different examples of the camera module, the filter element 340 can be implemented as different types, such as the filter element 340 can be implemented as cutoff filter, the combination of full impregnated spectral filter and other optical filters or multiple optical filters, such as the filter element 340 can be implemented as the combination of cutoff filter and full impregnated spectral filter, the i.e. described cutoff filter and the full impregnated spectral filter can be switched to be optionally situated on the photosensitive path of the photosensitive element 321, such as when under the more sufficient environment of the light such as daytime using the camera module, the cutoff filter can be switched to the photosensitive path of the photosensitive element 321, by described red Outer edge filter filtering enters the infrared ray in the light of the camera module being reflected by the object, when using the camera module in the environment of the darks such as night, the full impregnated spectral filter can be switched to the photosensitive path of the photosensitive element 321, the infrared part in the light being reflected by the object to allow access into the camera module penetrates.
With reference to shown in Figure 62, the molding photosensory assembly 320 of the camera module further comprises a supporting member 325, wherein before the molded base 323 is formed, the supporting member 325 is arranged at the non-photo-sensing region 3213 of the photosensitive element 321, after the molded base 323 molding, the molded base 323 coats the wiring board 322, the a part in the non-photo-sensing region 3213 and the supporting member 325 of the photosensitive element 321, to form the molding photosensory assembly 320, wherein the supporting member 325 can effectively improve the product yield of the camera module, and improve the image quality of the camera module, in following description, will feature and advantage to the supporting member 325 furtherly Bright and exposure.
Further, the supporting member 325 has a top surface 32501, a medial surface 32502 and a lateral surface 32503, wherein the two sides of the top surface 32501 are connected to the medial surface 32502 and the lateral surface 32503.It is worth mentioning that, the side towards the photosensitive element 321 of the supporting member 325 is defined as the medial surface 32502 of the supporting member 325, and the side towards the wiring board 322 of the supporting member 325 is defined as the lateral surface 32503 of the supporting member 325.
With reference to shown in attached drawing 62, the molding photosensory assembly 320 of the camera module further comprises multiple electronic components 326, wherein each electronic component 326 can be mounted on the fringe region 3223 of the wiring board 322 by such as SMT (Surface Mount Technology) technique.Preferably, each electronic component 326 is mounted on the wiring board outside portion 32233 of the fringe region 3223.The photosensitive element 321 and each electronic component 326 can be mounted on the same side or the opposite side of the wiring board 322, such as in a specific example, the photosensitive element 321 and each electronic component 326 are mounted on the same side of the wiring board 322, and the photosensitive element 321 is mounted on the chip attachment region 3222 of the wiring board 322, and each electronic component 326 is mounted on the fringe region 3223 of the wiring board 322.It is integrally formed after the wiring board 322 in the molded base 323, the molded base 323 coats each electronic component 326, the adjacent electronic component 326 is isolated by the molded base 323 and the electronic component 326 and the photosensitive element 321 is isolated, to, in the camera module of the invention, when being closer of the even adjacent electronic component 326, the molded base 323 can also be contacted with each other or be interfered to avoid the adjacent electronic component 326, and the molded base 323 coat the electronic component 326 mode can also photosensitive element 321 described in the contaminants to avoid the surface for resulting from the electronic component 326 the photosensitive region 3212, and then reduce the camera shooting The volume of mould group and the image quality for improving the camera module.That is, the camera module of the invention is in such a way that the molded base 323 coats the electronic component 326, The wiring board 322 of small area is set to be mounted more electronic components 326.It is noted that the type of the electronic component 326 includes but is not limited to resistance, capacitor, driving element etc..
In addition, it will be appreciated by those skilled in the art that be, although being disclosed in the manufacturing step of manufacturing step and the molding photosensory assembly 320 of the Figure 56 into Figure 62 by taking monomer camera module as an example to the camera module, in this example shown in Fig. 8, the camera module also may be implemented as twin-lens camera module or array camera module, and the present invention is unrestricted in this regard.
The manufacturing step of the camera module and the manufacturing step of the molding photosensory assembly 320 are described in the example shown in Figure 56 to Figure 62.
With reference to shown in Figure 56, the photosensitive element 321 is mounted on to the chip attachment region 3222 of the wiring board 322, and each wiring board connector 3221 of the fringe region 3223 of each of described non-photo-sensing region 3213 of the photosensitive element 321 chip contacts 3211 and the wiring board 322 is connected by lead 324 described in one group.In addition, each electronic component 326 is mounted on the wiring board outside portion 32233 of the fringe region 3223 of the wiring board 322.That is, the both ends of lead 324 described in one group are connected to the photosensitive element 321 and the wiring board 322 respectively, wherein each lead 324 protrudes from the upper surface of the photosensitive element 321 with presenting arcuation.It can be understood that, it is limited to connect the routing technique of the photosensitive element 321 and the wiring board 322 and the characteristic of the lead 324 itself using the lead 324, respectively after each wiring board connector 3221 in the perimeter 223 of each of the non-photo-sensing region 3213 for being connected to the photosensitive element 321 chip contacts 3211 and the wiring board 322, the lead 324 protrudes from the upper surface of the photosensitive element 321 with needing to present arcuation at the both ends of the lead 324.In addition, the curved radian of each lead 324 is made to be maintained at round and smooth state, the ability that the lead 324 transmits the electric signal between the photosensitive element 321 and the wiring board 322 is advantageously ensured that.Wherein, each lead 324 is arranged between the photosensitive element 321 and the wiring board 322, such as each lead 324 can be at equal intervals.It will be appreciated by those skilled in the art that be, during the camera module is manufactured and during the camera module is by use, so that each lead 324 is maintained at original state and advantageously ensure that the ability that the lead 324 transmits the electric signal between the photosensitive element 321 and the wiring board 322, so that it is guaranteed that the image quality of the camera module.
It will be appreciated by those skilled in the art that be, although the manufacturing step of the manufacturing step of the camera module of the invention and the molding photosensory assembly 320 of the camera module is illustrated so that a photosensitive element 321 is mounted on the wiring board 322 as an example in attached drawing 56, in another example, multiple photosensitive elements 321 can also be mounted on the different location of a wiring board 322, in subsequent production twin-lens camera module or array camera module, in another example, multiple wiring boards 322 can also be stitched together to form a wiring board layout, then each photosensitive element 321 is mounted on to the wiring board 322 of the corresponding position of the wiring board layout respectively, the wiring board layout to be divided subsequent From.The present invention is unrestricted in this regard.
With reference to shown in Figure 57 A and Figure 57 B, the supporting member 325 is arranged on the non-photo-sensing region 3213 of the photosensitive element 321, to form a molding photosensory assembly semi-finished product by the photosensitive element 321, the wiring board 322 and the supporting member 325, wherein the chip inside portion 32131, the chip interconnecting piece 32132 and the chip outside portion 32133 for coating the non-photo-sensing region 3213 of the photosensitive element 321 is set in the supporting member 325.That is.The supporting member 325 can coat a part of each lead 324, during the subsequent production camera module and during the molding photosensory assembly 320, the supporting member 325 can coat the lead 324, to improve the image quality of the camera module.It will be appreciated by those skilled in the art that the supporting member 325 coats the chip contacts 3211 of the photosensitive element 321 in this embodiment of the camera module of the invention.Further; the bearing main body 3251 of the supporting member 325 including a frame shape and there is a through-hole 3252; wherein the bearing main body 3251 is arranged at the non-photo-sensing region 3213 of the photosensitive element 321; so that the photosensitive region 3212 of the photosensitive element 321 corresponds to the through-hole 3252 of the supporting member 325; to which when carrying out moulding technology, the bearing main body 3251 can protect the photosensitive region 3212 of the photosensitive element 321.The molded base 323 coats the lateral surface 32503 and at least part top surface 32501 of the bearing main body 3251 after shaping.It is noted that the medial surface 32502 of the supporting member 325 is used to form the through-hole 3252 of the supporting member 325.
Preferably, the bearing main body 3251 coats the chip inside portion 32131, the chip interconnecting piece 2131 and the chip outside portion 32133 of the photosensitive element 321, that is, the bearing main body 3251 can coat the chip contacts 3211, so that the bearing main body 3251 can be avoided the lead 324 and the link position of the chip contacts 3211 is contacted with the moulding material for being used to form the molded base 323, fall off from the chip contacts 3211 to avoid the lead 324.It can be understood that, when the bearing main body 3251 coats the link position of the lead 324 and the chip contacts 3211, the link position and the moulding material of the lead 324 and the chip contacts 3211 can be isolated in the bearing main body 3251, to when carrying out moulding technology, avoid the moulding material that the Leading Edge Deformation for connecting the chip contacts 3211 of the lead 324 or the lead 324 is caused to fall off from the chip contacts 3211.In one embodiment, the bearing main body 3251 can be formed by the way that glue to be arranged in the non-photo-sensing region 3213 of the photosensitive element 321 and after glue curing, so that the bearing main body 3251 has elasticity, wherein after the bearing main body 3251 formation, the medial surface 32502 of the bearing main body 3251 forms the through-hole 3252, and the photosensitive region 3212 of the photosensitive element 321 corresponds to the through-hole 3252.In addition, there can also be viscosity by the bearing main body 3251 that glue is formed, for in pollutants such as subsequent adhesion dusts, to prevent the photosensitive region 3212 of photosensitive element 321 described in these contaminants and the photosensitive region 3212 of the photosensitive element 321 is made dirty bad point occur, to further ensure that the image quality of the camera module.For example, the bearing main body 3251 be arranged in it is described photosensitive Between the photosensitive region 3212 and the electronic component 326 of element 321, the pollutants such as the welding powder to generate when mounting the electronic component 326 in the wiring board 322 can be adhered to by the bearing main body 3251, to prevent the photosensitive region 3212 of photosensitive element 321 described in the contaminants such as these welding powders.
Preferably, the bearing main body 3251 can be coated in the non-photo-sensing region 3213 of the photosensitive element 321 by the glue in deadlocked state and be formed after glue curing, occur the case where flowing and polluting the photosensitive region 3212 of the photosensitive element 321 appearance behind the non-photo-sensing region 3213 for being applied to the photosensitive element 321 to avoid glue.In other words, glue has good plasticity before being formed by curing the bearing main body 3251, is applied to the non-photo-sensing region 3213 of the photosensitive element 321 to avoid glue and is deformed during cured.It will be appreciated by those skilled in the art that be, the bearing main body 3251 that glue can be made to be formed by way of by the non-photo-sensing region 3213 of the glue coated in the photosensitive element 321 for being in deadlocked state coats the lead 324, and avoids damaging the lead 324 during glue to be coated in non-photo-sensing region 3213 of the photosensitive element 321.
With reference to shown in attached drawing 58A, when carrying out moulding technology, the moulding material is set to form at least integrally formed molded base 323 in the wiring board 322 after hardening by a molding tool 3100, in this way, the size of the camera module can be reduced and reduce the assembly error of the camera module, to keep the structure of the camera module more compact and improve the image quality of the camera module.
Specifically, the molding die 3100 mold 3102 including a upper mold 3101 and once, wherein at least one mold in the upper mold 3101 and the lower mold 3102 can be moved, so that the upper mold 3101 and the lower mold 3102 can be by carry out die closing operations, and an at least molding space 3103 is formed between the upper mold 3101 and the lower mold 3102, wherein the molded base 323 is added into the molding space 3103 by the moulding material and is formed after hardening.Such as in one embodiment, the lower mold 3102 is usually fixed, the upper mold 3101 can do moving relative to the lower mold 3102 along guide post, to be molded when the upper mold 3101 is moved towards the lower mold 3102, to form the molding space 3103, and the draft when the upper mold 3101 is mobile far from the lower mold 3102 between the upper mold 3101 and the lower mold 3102.Or in another example, the upper mold 3101 is fixed, the lower mold 3102 can do moving relative to the upper mold 3101 along guide post, to be molded when the lower mold 3102 is moved towards the upper mold 3101, to form the molding space 3103, and the draft when the lower mold 3102 is mobile far from the upper mold 3101 between the lower mold 3102 and the upper mold 3101.
It is connected in the photosensitive element 321 and the wiring board 322 by lead 324 described in one group and forms the molding photosensory assembly semi-finished product after the bearing main body 3251 is formed in a part of the non-photo-sensing region 3213 of the photosensitive element 321 to coat the lead 324, the molding photosensory assembly semi-finished product are placed in the lower mold 3102 of the molding die 3100, operate the upper mold 3101 and/or the lower mold 3102 of the molding die 3100, so that the upper mold 3101 and the lower mold 3102 molding To form the molding space 3103 between the upper mold 3101 and the lower mold 3102, and the molding space 3103 of the photosensitive element 321, the wiring board 322 and the supporting member 325 respectively partially molding die 3100, wherein the stitching surface 31011 of the upper mold 3101 contacts with the top surface 32501 of the bearing main body 3251 and supports the upper mold 3101 upwards by the bearing main body 3251, applies pressure to the lead 324 to avoid the stitching surface 31011 of the upper mold 3101.Such as in this specific example shown in such as attached drawing 62 of the invention, the non-photo-sensing region of external, the described photosensitive element 321 of the wiring board 322 and a part of the supporting member 325 are located at the molding space 3103 of the molding die 3100, to which when the molded base 323 is after the molding space 3103 forms, the molded base 323 coats the non-photo-sensing region of external, the described photosensitive element 321 of the wiring board 322 and a part of the supporting member 325.
Therefore, it will be appreciated by those skilled in the art that be, the molding space 3103 of the molding die 3100 can be a cricoid space, to form the cricoid molded base 323 after the moulding material is added into the molding space 3103 and solidification.
It is worth mentioning that, the bearing main body 3251 has elasticity, to when the molding die 3100 is by carry out die closing operation, the stitching surface 31011 of the upper mold 3101 of the molding die 3100 is absorbed by the bearing main body 3251 in the impact force of the top surface 32501 for contacting the bearing main body 3251 generated in a flash and the impact force is prevented to be further transferred to the photosensitive element 321, so that the photosensitive element 321 be avoided to be damaged or avoid the photosensitive element 321 to generate the displacement relative to the photosensitive element 321 because of stress.It will be appreciated by those skilled in the art that be, in such a way that the bearing main body 3251 absorption impact force prevents the impact force from being further transferred to the photosensitive element 321, it also can ensure that the flatness when photosensitive element 321 is mounted on the wiring board 322 is not affected, so that it is guaranteed that the image quality of the camera module.
It is noted that the range of the shore hardness of the bearing main body 3251 is A50-A80, elasticity modulus range is 0.1Gpa-1Gpa.
Preferably, in this example such as shown in Figure 62 of the invention, the height of the bearing main body 3251 may be implemented as the height upward greater than the lead 324, when the molding die 3100 is by carry out die closing operation, the stitching surface 31011 of the upper mold 3101 of the molding die 3100 and the top surface 32501 of the bearing main body 3251 be when contacting, and the bearing main body 3251 can support the upper mold 3101 upwards and the upper mold 3101 is prevented to apply pressure to the lead 324.Such as in one example, the height of the bearing main body 3251 is equal to the upward height of the lead 324, to when the upper mold 3101 of the molding die 3100 and the lower mold 3102 are by carry out die closing operation, the bearing main body 3251 supports the upper mold 3101 upwards, although so that the stitching surface 31011 of the upper mold 3101 can be contacted with the lead 324, the stitching surface 31011 of the upper mold 3101 can not apply pressure to the lead 324.In another example, the bearing main body 3251 Height be higher than the upward height of the lead 324, to when the upper mold 3101 of the molding die 3100 and the lower mold 3102 are by carry out die closing operation, the bearing main body 3251 supports the upper mold 3101 upwards, so that the stitching surface 31011 of the upper mold 3101 is not contacted with the lead 324, so that the stitching surface 31011 of the upper mold 3101 be avoided to apply pressure to the lead 324.That is, the bearing main body 3251 can support the upper mold 3101 upwards to reserve safe distance between the stitching surface 31011 and the lead 324 of the upper mold 3101.
In addition, the bearing main body 3251 has elasticity, after the upper mold 3101 of the molding die 3100 and the lower mold 3102 are by carry out die closing operation, the stitching surface 31011 of the upper mold 3101 with it is described bearing main body 3251 described in top surface 32501 contact and apply pressure to it is described support main body 3251 the top surface 32501, the pressure that wherein stitching surface 31011 of the upper mold 3101 is applied to the top surface 32501 of the bearing main body 3251 can cause the bearing main body 3251 to generate slight deformation, for preventing to generate gap in the stitching surface 31011 of the upper mold 3101 and the top surface 32501 of the bearing main body 3251.That is, the upper mold 3101 of the forming module 100 can be fitted closely with the bearing main body 3251, so that the photosensitive region for corresponding to the photosensitive element 321 of the through-hole 3252 of the supporting member 325 is in sealed environment, to avoid when carrying out moulding technology, the moulding material enters the sealed environment and pollutes the photosensitive region of the photosensitive element 321.
Figure 58 B shows the variant embodiment of the molding photosensory assembly 320 of the invention in this process, wherein the supporting member 325 can be made of hard material, that is, when the bearing main body 3251 of the supporting member 325 is formed in at least part in the non-photo-sensing region 3213 of the photosensitive element 321, and the stitching surface 31011 of the upper mold 3101 of the molding die 3100 apply pressure to it is described bearing main body 3251 the top surface 32501 when, the bearing main body 3251 will not be deformed, to guarantee the good electrical property of the lead 324, to guarantee the camera module in the yield of subsequent technique and be further ensured that the image quality of the camera module.
It is noted that the shore hardness of the bearing main body 3251 is greater than D70, elasticity modulus is greater than 1Fpa.
The molding die 3100 further comprises a cover film 3106, to when the upper mold 3101 and the lower mold 3102 are molded, the cover film 3106 is located between the stitching surface 31011 of the upper mold 3101 and the top surface 32501 of the bearing main body 3251, preferably, in the upper mold 3101 and the lower mold 3102 by between molding, the cover film 3106 can be first set to the stitching surface 31011 of the upper mold 3101.The cover film 3106 is set between the stitching surface 31011 and the bearing main body 3251 of the upper mold 3101, on the one hand it can prevent to generate gap between the stitching surface 31011 and the bearing main body 3251 of the upper mold 3101, on the other hand the cover film 3106 can absorb the impact force generated when the upper mold 3101 and the lower mold 3102 are molded, so that the upper mold 3101 and the lower mold 3102 be avoided to damage the photosensitive element 321, the wiring board 322 and the lead 324 when molding.
With reference to shown in attached drawing 59, after the moulding material of flow-like to be added to the molding space 3103 of the molding die 3100, the moulding material can fill the entire molding space 3103, wherein it is formed in the photosensitive region 3212 that the bearing main body 3251 in the non-photo-sensing region 3213 of the photosensitive element 321 can prevent the moulding material from entering the photosensitive element 321 in the contact position in the bearing main body 3251 and the non-photo-sensing region 3213 of the photosensitive element 321, in addition, the bearing main body 3251 is by way of generating deformation and preventing in the stitching surface 31011 of the upper mold 3101 and the generation of the top surface 32501 gap of the bearing main body 3251, it can prevent the molding Material enters the sealed environment in the contact position of the top surface 32501 of the bearing main body 3251 and the stitching surface 31011 of the upper mold 3101, and can be avoided the phenomenon that " overlap " is generated after the mold material cures.
It is worth mentioning that; the moulding material of flow-like of the present invention can be fluent material or solid particulate materials or liquid and solid particle mixing material; it can be understood that; no matter the moulding material, which is implemented as fluent material, is also implemented as solid particulate materials or is implemented as liquid and solid particle mixing material; it can solidify after the molding space 3103 for being added into the molding die 3100 to form the molded base 323.Such as in this specific example of the invention, the moulding material of flow-like is implemented as the thermoplastic material of such as liquid, wherein the moulding material solidifies after the molding space 3103 for being added into the molding die 3100 to form the molded base 323.It is noted that the curing mode of the moulding material of flow-like does not limit the contents of the present invention and range after the moulding material of flow-like is added into the molding space 3103 of the molding die 3100.
With reference to shown in attached drawing 60, the bearing main body 3251 is arranged along the non-photo-sensing region 3213 of the photosensitive element 321, after the molding space 3103 that the moulding material is added into the molding die 3100, the bearing main body 3251 can prevent the moulding material into the photosensitive region 3212 of the photosensitive element 321, to after the mold material cures are to form the molded base 323, the molded base 323 is set to be further formed an optical window 3231, to correspond to the photosensitive region 3212 of the photosensitive element 321, to subsequent, the optical window 3231 of the molded base 323 allows light to pass through to receive and carry out photoelectric conversion by the photosensitive region 3212 of the photosensitive element 321.That is, the moulding material for being added into the molding space 3103 of the molding die 3100 forms a molded body 3232 of the molded base 323 after hardening and forms the optical window 3231 at the middle part of the molded base 323.In other words, the molded base 323 is including the molded body 3232 and has the optical window 3231, the optical window 3231 provides a passage of light to the optical lens 310 and the photosensitive element 321, for light to be reflected by the object from after the inside that the optical lens 310 enters the camera module, light receives and carries out photoelectric conversion by the photosensitive region 3212 of the photosensitive element 321 by the optical window 3231 of the molded base 323.
It is noted that the molded base 323 coats each electronic component 326, so that each electronic component 326 be isolated by the molded base 323 after the molded base 323 formation The electronic component 326 and the photosensitive element 321 is isolated with by the molded base 323, in this way, the even adjacent electronic component 326 when being closer the molded base 323 can also prevent the adjacent electronic component 326 from contacting, and the photosensitive region of photosensitive element 321 described in the contaminants that the molded base 323 can also prevent the electronic component 326 from generating, to improve the image quality of the camera module.
With reference to shown in attached drawing 61, the filter element 340 is assembled in the top surface of the molded base 323, so that the filter element 340 closes the optical window 3231 of the molded base 323, so that the light in the subsequent inside for entering the camera module from the optical lens can be filtered further by the filter element 340 to improve the image quality of the camera module.
Further, the top surface of the molded base 323 forms an inner surface 3233 and an outer surface 3234, wherein in one example, the inner surface 3233 and the outer surface 3234 of the molded base 323 are in the same plane, so that the top surface of the molded base 323 forms a smooth plane, wherein the filter element 340 is assembled in the inner surface 3233 of the molded base 323, the driver 330 or the microscope base are assembled in the outer surface 3234 of the molded base 323, or the optical lens 310 by direct-assembling in the outer surface 3234 of the molded base 323.In another example, plane where the inner surface 3233 of the molded base 323 can be lower than the plane where the outer surface 3234, to make the top surface of the molded base 323 form a step-like surface, plane where the inner surface 3233 of the i.e. described molded base 323 forms a groove 3235 of the molded base 323 lower than the plane where the outer surface 3234, the filter element 340 for being wherein assembled in the inner surface 3233 of the molded base 323 is housed inside in the groove 3235 of the molded base 323, the driver 330 is assembled in the outer surface 3234 of the molded base 323, so as to be assembled in the optics of the driver 330 Camera lens 310 is further maintained at the photosensitive path of the photosensitive element 321, such as Figure 62, so that the camera module be made.
It is first variant embodiment of the camera module of the invention with reference to shown in attached drawing 64A, different from the above embodiment of the camera module of the invention, each of described molding photosensory assembly 320 of the camera module of the invention lead 324 is all covered by the inside of the bearing main body 3251.
Specifically, the bearing main body 3251 coats at least part of the chip inside portion 32131, the chip interconnecting piece 32132, the chip outside portion 32133, the wiring board inside portion 32231, at least part of the wiring board interconnecting piece 32232 and the wiring board outside portion 32233, to which the bearing main body 3251 not only coats the expression in the eyes part of the lead 324, and the bearing main body 3251 also coats the link position of the chip contacts 3211 of the lead 324 and the photosensitive element 321 and the link position for the wiring board connector 3221 for coating the lead 324 and the wiring board 322, the lead 324 to be pre-fixed by the bearing main body 3251.Thus when subsequent progress moulding technology forms the molded base 323, in the upper mold 3101 and the lower mold 3102 of the molding die 3100 During molding, the stitching surface 31011 of the upper mold 3101 contacts with the top surface 32501 of the bearing main body 3251 and the stitching surface 31011 of the upper mold 3101 is avoided directly to apply pressure to the lead 324, to prevent the lead 324 from deforming or damaging because of stress.
In addition, the lead 324 is all covered by the inside of the bearing main body 3251, enable the bearing main body 3251 that the moulding material for being added into the molding space 3103 being formed between the upper mold 3101 and the lower mold 3102 to be prevented directly to contact with the lead 324, to prevent the higher moulding material of temperature from damaging the lead 324.Preferably, the bearing main body 3251 has good thermal insulation, and the temperature of the moulding material is transferred to the lead 324 to avoid the bearing main body 3251.More preferably, the height of the bearing main body 3251 is higher than the height of the protrusion of the lead 324, to which when carrying out moulding technology, the bearing main body 3251 supports the upper mold 3101 upwards to reserve safe distance between the stitching surface 31011 of the upper mold 3101 and the protrusion of the lead 324.
And, the bearing main body 3251 coats the wiring board inside portion 32231 of the chip outside portion 32133 and the wiring board 322 of the photosensitive element 321, to coat the mounting position of the photosensitive element 321 and the wiring board 322 by the bearing main body 3251, in this way, the bearing main body 3251 can not only pre-fix the photosensitive element 321 and the wiring board 322, when carrying out moulding technology, the bearing main body 3251 can prevent each position of the photosensitive element 321 and the wiring board 322 from generating displacement because of unbalance stress, and, the mounting position for supporting main body 3251 and the moulding material can also being prevented to contact the photosensitive element 321 and the wiring board 322, to guarantee It states the flatness of photosensitive element 321 and improves the image quality of the camera module.
It will be appreciated by those skilled in the art that be, the bearing main body 3251 is by the mounting position setting along the photosensitive element 321 and the wiring board 322, so that the bearing main body 3251 is in square frame-shaped, to when carrying out moulding technology, the bearing main body 3251 can prevent the moulding material into the photosensitive region 3212 of the photosensitive element 321, to make the moulding material form the molded body 3232 of the fringe region 3223 for coating the wiring board 322 and the lateral surface 32503 for supporting main body 3251 after hardening, correspond to the molded base 323 with the photosensitive region 3212 for forming the optical window 3231. wherein photosensitive element 321 at the middle part of the molded body 3232 The optical window 3231, so that the optical window 3231 provides a passage of light to the optical lens 310 and the photosensitive element 321.He preferably, the molded body 3232 coat after shaping the wiring board 322 the fringe region 3223, it is described bearing main body 3251 the lateral surface 32503 and the top surface 32501 at least part.
In second variant embodiment of the camera module of the invention shown in attached drawing 64B, it is described bearing main body 3251 coat the chip outside portion 32133 of the photosensitive element 321, the wiring board inside portion 32231 of the wiring board 322, the wiring board interconnecting piece 32232 and the wiring board outside portion 32233 at least part.That is, the bearing main body 3251 can not coat the chip interconnecting piece 32132 of the photosensitive element 321 in this example of the camera module shown in attached drawing 64B.Attached In the third embodiment of the camera module of the invention shown in Figure 64 C, the bearing main body 3251 coats the wiring board inside portion 32231 and the wiring board interconnecting piece 32232 of the chip interconnecting piece 32132 and the chip outside portion 32133 and the wiring board 322 of the photosensitive element 321.That is, the bearing main body 3251 can not coat the wiring board outside portion 32233 of the chip inside portion 32131 and the wiring board 322 of the photosensitive element 321 in this embodiment of the camera module of the invention shown in attached drawing 64C.That is, in attached drawing 64A, in these variant embodiments of the camera module shown in Figure 64 B and Figure 64 C, the bearing main body 3251 can coat the mounting position of the photosensitive element 321 and the wiring board 322 simultaneously, to pre-fix the photosensitive element 321 and the wiring board 322 by the bearing main body 3251, and it prevents to generate gap in the mounting position of the photosensitive element 321 and the wiring board 322 by the bearing main body 3251, to when carrying out moulding technology, the bearing main body 3251 can prevent each position of the photosensitive element 321 and the wiring board 322 from generating displacement because of unbalance stress, and the bearing main body 3251 can prevent the moulding material from entering 321 He of photosensitive element Between the wiring board 322, to guarantee the flatness of the photosensitive element 321.
It is the 4th variant embodiment of the camera module of the invention with reference to shown in attached drawing 65A, wherein the bearing main body 3251 coats at least part of the wiring board inside portion 32231 of the fringe region 22 of the wiring board 322, at least part of the wiring board interconnecting piece 32232 and the wiring board outside portion 32233, i.e., the bearing main body 3251 coats the wiring board connector 3221 of the wiring board 322, when carrying out moulding technology, on the one hand the lead 324 is pre-fixed by the bearing main body 3251, on the other hand the lead 324 and the wiring board connector 3221 is prevented to contact with the moulding material by the bearing main body 3251, to avoid the lead 324 from connecting from the wiring board It falls off on part 3221.
It is the 5th variant embodiment of the camera module of the invention with reference to shown in attached drawing 65B, wherein the bearing main body 3251 only coats the chip inside portion 32131 of the photosensitive element 321, when carrying out moulding technology, the bearing main body 3251 prevents the moulding material into the photosensitive region 3212 of the photosensitive element 321, to the molded body 3232 of the fringe region 3223 of the formation cladding wiring board 322 and the chip outside portion 32133 of the photosensitive element 321 and the chip interconnecting piece 32132 after the mold material cures, the optical window 3231 is formed with the corresponding position of the photosensitive region 3212 in the photosensitive element 321.
It is the 6th variant embodiment of the camera module of the invention with reference to shown in attached drawing 66, unlike above embodiment of the invention, the molded body 3232 is after shaping without coating the top surface 32501 of the bearing main body 3251.Such as in this specific example shown in attached drawing 66, the molded body 3232 coats the fringe region 3223 of the wiring board 322 and the lateral surface 32503 of the bearing main body 3251 after shaping.
It is noted that although being higher than the scheme of the height of the protrusion of each lead 324 in the height that attached drawing 56 all illustrates the bearing main body 3251 into Figure 66, in the camera module of the invention In other examples, the height of the bearing main body 3251 can also be equal to the height of the protrusion of each lead 324, or in other some examples, the height of the bearing main body 3251 can also be lower than the height of the protrusion of each lead 324, as long as the stitching surface 31011 of the upper mold 3101 of the molding die 3100 is contacted with the top surface of the bearing main body 3251 and the stitching surface of the upper mold 3101 does not apply pressure to each lead 324 directly when carrying out moulding technology.
Attached drawing 67 shows a variant embodiment of the camera module, wherein the filter element 340 is not by direct-assembling in the molded body 3232, but an at least supporter 370 is provided by the camera module, the i.e. described molding photosensory assembly further includes an at least supporter 370, the filter element 340 is assembled in the supporter 370, then the supporter 370 is assembled in the top surface 3236 of the molded body 3232, so that the filter element 340 is maintained between the optical lens 310 and the photosensitive element 321, in this way, the molded body 3232 is directly mounted on relative to the filter element, there is provided buffering by the supporter 370 so that the filter element 340 be not to be easy to damage with it is broken It splits, and the size of the filter element 340 can be reduced, and reduce the height of the camera module.Further, the top surface 3236 of the molded body 3232 can be a plane, to after the molded base 323 molding, the supporter 370 is first assembled in the top surface 3236 of the molded body 3232, then camera lens load-bearing part such as driver 330 or lens barrel are assembled in the supporter 370 again, or the camera lens 10 is directly assembled in the supporter 370.That is, perhaps lens barrel or the camera lens 10 can be assembled on the supporter 370 driver 330 not by direct-assembling in the top surface 3236 of the molded body 3232.
The supporter 370 is ring structure, centre is formed with through-hole, and prolong arm 372 in the supporter main body 371 and one including ring structure, prolong arm 372 in described inwardly integrally to extend from the inner surface of the supporter main body 371 to form a support slot 373 in interior 372 top side of arm of prolonging, to install the filter element 340.The i.e. described supporter 370 is equivalent to the filter element microscope base 40 mentioned in above-described embodiment, and the supporter main body 371 is equivalent to the filter element microscope base main body 43, it is described in prolong arm 372 be equivalent to mentioned in above-described embodiment in prolong arm 44.
In the present invention, the supporter 370 is a filter element microscope base, its structure that may be embodied as the filter element microscope base in the embodiment that Fig. 2 illustrates into Figure 23, the molded base 323 may be embodied as the structure of the integral base in the embodiment that Fig. 2 illustrates into Figure 23, and the structure that the supporter 370 and the molded base 323 match also may be embodied as the structure that the filter element microscope base that Fig. 2 illustrates into Figure 23 and the integral base match.
In the present invention, the molded base 323 of the camera module is integrally packaged at least part non-photo-sensing area 3213 of the wiring board 322 and the photosensitive element 321, thus relative to the wiring board 322 is only integrally packaged in, the top surface that the molded base 323 has area bigger, to provide larger-sized mounting surface to the supporter 370.
More specifically, the photosensitive element 321 has photosensitive element connector 3211, the wiring board 322 has wiring board connector 3221, the photosensitive element connector 3211 is connected by one group of connecting line 324 so that the photosensitive element 321 is operatively connected to the wiring board 322 with the wiring board connector 3221, the molded base 323 further embeds the photosensitive element connector 3211, the wiring board connector 322 and the connecting line 324.The molded base 323 is integrally packaged in the wiring board 322 and the photosensitive element 321 and integrally embeds the connecting line 324, to prevent that stray light is reflexed to the photosensitive element 321 because of the exposed connecting line 324.
The supporter 370 is supported in 323 top surface 3236 of molded base, and the supporter 370 cooperates the molded base 323 to form optical window, passage of light is provided for the photosensitive element 321, wherein the inward flange 3237 of the top surface 3236 of the molded base 323 is relative to the outer edge 32211 of the wiring board connector 3221 more adjacent to the optical axis X of the camera module, the inward flange 3237 of the top surface 3236 of the i.e. described molded base 323 is smaller with a distance from the optical axis X from the camera module, to increase the area of the top surface 3236 of the molded base 323, to be used to support the supporter 370 as filter element microscope base.As shown in the figure, in the cross-section, the distance between the inward flange 3237 of the top surface 3236 of the molded base 323 and the optical axis X are illustrated as D1, and the distance between the outer edge 32211 of the wiring board connector 3221 and the optical axis X are illustrated as D2, wherein D1 is not more than D2, to make the inward flange 3237 of the top surface 3236 of the molded base 323 be located at the position of the camera module inside, to make the area for increasing the top surface 3236 of the molded base 323.
It can be understood that, as shown in figure 67, the top surface area S of the molded base 323 between the inward flange 3237 of the top surface 3236 of the outer edge 32211 and molded base 323 corresponding to the wiring board connector 3221, being comparable to 323 integral packagings of the molded base at least being capable of increased surface area without being packaged in the photosensitive element 321 and the connecting line 324 in the edge of the wiring board 322, so as to more securely support the supporter 370, and the mounting surface of more flat increase is provided for the supporter 370, and reduce assembling tolerance.
In addition, it can be understood that, for convenience of moulding technology stripping operation and avoid stray light, the inner surface of the molded base 323 usually extends inclinedly to form the gradually big optical window that is open from bottom to up, the area that will lead to the top surface of the molded base 323 in this way, which can be intended to reduce, to be unable to provide enough mounting areas, relative to Fig. 2 into Figure 23 integral packaging in the integral base at wiring board edge, the integral packaging of this embodiment of the invention in the wiring board 322 and the photosensitive element 321 and embeds the photosensitive element connector 3211, molded base 323 described in the wiring board connector 3221 and the connecting line 324 can make full use of photosensitive element connector 3211, the locational space of 324 top of wiring board connector 3221 and connecting line, The part for extending the inner surface for corresponding to the molded base 323 obliquely is concentrated mainly on 3221 top of the photosensitive element connector 3211, the connecting line 324 and the wiring board connector, it can make the molded base 323 along the end of the inner surface obliquely extended far from the photosensitive element 321 in this way, i.e., it is described The inward flange 3237 of the top surface 3236 of molded base 323, no more than the outer edge of the wiring board connector 3221, so as to strive for the top surface 3236 of bigger area for the top side of the molded base 323, so as to provide greater area of mounting surface.
In addition, relative to the traditional camera module illustrated in Figure 1B, microscope base 7 is pasted on circuit board 2 by support leg 701, the bottom surface of the supporter 370 of the filter element 340 of arranging in pairs or groups provides the bond area bigger with the molded base 323, as shown in Figure 12, the bond area that the supporter 370 is in contact with the molded base 323 is the top surface 3236 of the molded base 323, to the supporter 370 be able to be combined with the molded base 323 it is more firm, and bonding region increases, the inclination of the supporter 370 can more effectively be avoided, cause to influence image quality.
In addition, the assembly that the molded base 323 and the supporter 370 are combined into being capable of traditional microscope base 7 in alternate figures 1B, the molded base 323 is because be integrated in the wiring board 322 to have biggish bonding strength, and the supporter 370 is the structural member for carrying the filter element 340.To which this two-part assembly can give the camera lens 310 of top, or the lens assembly with driver 330 or lens barrel, provide stronger support relative to the microscope base 7 illustrated in Figure 1B.That is, the stress that the supporter 370 is subject to can be transmitted more effectively to the molded base 323 and the wiring board 322.It, being capable of more effectively dispersive stress so that is combined is more firm moreover, because the molded base 323 and the wiring board 322 integrally encapsulate.
And, traditional microscope base 7 in the sub-assembly alternate figures 1B of the supporter 370 and the molded base 323, to traditional microscope base 7 relative to installation filter element, the thickness of the supporter 370 is decreased considerably, and 370 thickness of supporter of the present invention is in 0.7mm or less.
Attached drawing 68 shows another variant embodiment of the camera module, wherein the top surface 3236 of the molded body 3232 has two-stage step face 32361 and 32362, a groove 3235 is formed in 32361 top side of First terrace, the supporter 370 for being assembled in the First terrace 32361 of the top surface 3236 of the molded body 3232 is housed inside in the groove 3235, to further decrease the height dimension of the camera module.The supporter 370 is ring structure, centre is formed with through-hole, and prolong arm 372 in the supporter main body 371 and one including ring structure, prolong arm 372 in described inwardly integrally to extend from the inner surface of the supporter main body 371 to form a support slot 373 in interior 372 top side of arm of prolonging, to install the filter element 340.At this point, perhaps lens barrel or the camera lens 10 can be by direct-assemblings in the second step face 32362 of the top surface 3236 of the molded body 3232 for the driver 330.It is understood that perhaps lens barrel or the camera lens 10 can also be assembled on the molded body 3232 and the supporter 370 driver 330 in other variant embodiment.
However, it will be appreciated by those skilled in the art that be, in other examples of the camera module of the invention, the optical lens 310 can also by direct-assembling in the top surface or the optical lens 310 of the molded body 3232 and also by direct-assembling in the top surface of the supporter 370.
The molded base 323 of the camera module is integrally packaged at least part non-photo-sensing area 3213 of the wiring board 322 and the photosensitive element 321, thus relative to the wiring board 322 is only integrally packaged in, the top surface 3236 that the molded base 323 has area bigger, to provide larger-sized mounting surface to the supporter 370.Such as in this embodiment in figure, mounting surface a part that the supporter 370 provides is the second step face 32362, for supporting the driver 330 of lens assembly, another part is the First terrace 32361, for supporting the supporter 370.
More specifically, the photosensitive element 321 has one group of photosensitive element connector 3211, the wiring board 322 has one group of wiring board connector 3221, the photosensitive element connector 3211 is connected by one group of connecting line 324 so that the photosensitive element 321 is operatively connected to the wiring board 322 with the wiring board connector 3221, the molded base 323 further embeds the photosensitive element connector 3211, the wiring board connector 322 and the connecting line 324；Wherein the supporter 370 is supported in 323 top surface 3236 of molded base, and the supporter 370 cooperates the molded base 323 to form optical window, passage of light is provided for the photosensitive element 321, wherein the inward flange 3237 of the top surface 3236 of the molded base 323 is relative to the outer edge 32211 of the wiring board connector 3221 more adjacent to the optical axis X of the camera module, to increase the area of the top surface 3236 of the molded base 323, it has been provided in particular in First terrace 32361, to be used to support the supporter 370 as filter element microscope base.As shown in the figure, in the cross-section, the inward flange 3237 of the top surface 3236 of the molded base 323 is the inward flange of the First terrace 32361, the distance between itself and the optical axis X are illustrated as D1, and the distance between the outer edge 32211 of the wiring board connector 3221 and the optical axis X are illustrated as D2, wherein D1 is not more than D2, to make the inward flange 3237 of the top surface 3236 of the molded base 323 be located at the position of the camera module inside, to make the area for increasing the top surface 3236 of the molded base 323.
As shown in Figure 68, the top surface area S of the molded base 323 between the inward flange 3237 of the top surface 3236 of the outer edge 32211 and molded base 323 corresponding to the wiring board connector 3221, being comparable to 323 integral packagings of the molded base at least being capable of increased surface area in the edge of the wiring board 322, so as to more securely support the supporter 370, and the mounting surface of more flat increase is provided for the supporter 370, and reduces assembling tolerance.
The molded base 323 is along the end of the inner surface obliquely extended far from the photosensitive element 321, the inward flange of the First terrace 32361 of the top surface 3236 of the i.e. described molded base 323, no more than the outer edge of the wiring board connector 3221, so as to strive for the top surface 3236 of bigger area for the top side of the molded base 323, so as to provide greater area of mounting surface.
In addition, relative to the traditional camera module illustrated in Figure 1B, microscope base 7 is pasted on the outside of 2 electronic component of circuit board by support leg 701, its space is limited, the bottom surface of the supporter 370 of the filter element 340 of arranging in pairs or groups provides the bond area bigger with the molded base 323, as shown in Figure 13, institute State the First terrace 32361 that the bond area that supporter 370 is in contact with the molded base 323 is the molded base 323, because being not only restricted to can be only positioned at the outside difference of the electronic component 326 of the wiring board 322, the molded base 323 does not need evacuation electronic component 326, so as to provide the bigger First terrace 32361, to support the supporter 370.To the supporter 370 be able to be combined with the molded base 323 it is more firm, and bonding region increase, can more effectively avoid the inclination of the supporter 370, cause influence image quality.And in this embodiment, the supporter 370 is only supported on the First terrace 32361, need to support the outside of electronic component 326 relative to traditional microscope base 7, traditional microscope base outer edge is farther from optical axis X, then the area that the traditional microscope base 7 of top surface in a ring needs is bigger.
In addition, similar Figure 67, the assembly that the molded base 323 and the supporter 370 are combined into being capable of traditional microscope base 7 in alternate figures 1B, the molded base 323 is because be integrated in the wiring board 322 to have biggish bonding strength, the camera lens 310 of top can be given, or the lens assembly with driver 330 or lens barrel, stronger support is provided.That is the stress that the camera lens 310 or driver 330 or lens barrel of top are applied to the molded base 323 can be transmitted directly by the molded base 323 to the wiring board 322.It, being capable of more effectively dispersive stress so that is combined is more firm moreover, because the molded base 323 and the wiring board 322 integrally encapsulate.
And, in the embodiment of Figure 68 signal, the second step face 32361 is used to support the driver 330, the top surface 3701 of the supporter 370 can provide excessive glue face for the bonding between the driver 330 and the second step face 32361, the glue of bonding between the i.e. described driver 330 and the second step face 32361 can extend to the top surface 3701 of the supporter 370, and more firm support effect can be provided together for the driver 330 by being equivalent to the molded base 323 and the supporter 370 in this way.
Similarly, in this embodiment, traditional microscope base 7 in the sub-assembly alternate figures 1B of the supporter 370 and the molded base 323, to traditional microscope base 7 relative to installation filter element, the thickness of the supporter 370 is decreased considerably, and 370 thickness of supporter of the present invention is in 0.7mm or less.
According to another aspect of the present invention, the present invention further provides the manufacturing methods of a molding photosensory assembly 320, wherein the manufacturing method includes the following steps:
(a) photosensitive element 321 and a wiring board 322 are connected by one group of lead 324；
(b) upper mold 3101 for the photosensitive element 321 and the wiring board 322 being placed in a molding tool 3100 or once mold 3102；
(c) during the upper mold 3101 and the lower mold 3102 mold, the upper mold 3101 is supported by a supporting member 325 upwards, to prevent the stitching surface 31011 of the upper mold 3101 from applying pressure to lead 324 described in every group；And
(d) moulding material of flow-like is added into the molding space 3103 being formed between the upper mold 3101 and the lower mold 3102, to form a molded base 323 after the mold material cures, wherein The molded base 323 includes a molding ontology 232 and has an optical window 3231, wherein the molded body 3232 coats at least part of the fringe region 3223 of the wiring board 322 and at least part of the supporting member 325.
According to another aspect of the present invention, the present invention further provides the manufacturing methods of a molding photosensory assembly 320, wherein the manufacturing method includes the following steps:
(A) photosensitive element 321 and a wiring board 322 are connected by one group of lead 324；
(B) lead 324 is at least partly coated by a supporting member 325, to form a molding photosensory assembly semi-finished product；
(C) upper mold 3101 for the molding photosensory assembly semi-finished product being placed in a molding tool 3100 or once mold 3102, wherein during the upper mold 3101 and the lower mold 3102 mold, the supporting member 325 supports the upper mold 3101 upwards to prevent the stitching surface 31011 of the upper mold 3101 from applying pressure to the lead 324；And
(D) moulding material of flow-like is added into the molding space 3103 being formed between the upper mold 3101 and the lower mold 3102, to form a molded base 323 after the mold material cures, wherein the molded base 323 including a molded body 3232 and has an optical window 3231, the molded body 3232 coats the fringe region 3223 of the wiring board 322 and at least part of the supporting member 325, and the photosensitive region 3212 of the photosensitive element 321 corresponds to the optical window 3231.
According to another aspect of the present invention, the present invention further provides the manufacturing methods of a molding photosensory assembly, wherein the manufacturing method includes the following steps:
(h) photosensitive element 321 is mounted on a wiring board 322；
(i) photosensitive element 321 and the wiring board 322 are pre-fixed by a supporting member 325, a molding photosensory assembly semi-finished product are made, and the prevention of the supporting member 325 generates gap between the photosensitive element 321 and the wiring board 322；
(j) upper mold 3101 for the molding photosensory assembly semi-finished product being placed in a molding tool 3100 or once mold 3102, to form a cricoid molding space 3103 between the upper mold 3101 and the lower mold 3102 in the upper mold 3101 and the lower mold 3102 molding；And
(k) moulding material of flow-like is added in Xiang Suoshu molding space 3103, to form the molded base 323 after the mold material cures, wherein the molded base 323 including a molded body 3232 and has an optical window 3231, the molded body 23 coats the fringe region 3223 of the wiring board 322 and at least part of the supporting member 325, and the photosensitive region 3212 of the photosensitive element 321 corresponds to the optical window 3231.
According to another aspect of the present invention, the present invention further provides the manufacturing methods of a molding photosensory assembly, wherein the manufacturing method includes the following steps:
(H) chip contacts 3211 and a line of a photosensitive element 321 are connected to by one group of lead 324 The wiring board connector 3221 of road plate 322；
(I) upper mold 3101 for the photosensitive element 321 and the wiring board 322 being placed in a molding tool 3100 or once mold 3102, to form a cricoid molding space 3103 between the upper mold 3101 and the lower mold 3102 when the upper mold 3101 and the lower mold 3102 mold；
(J) when the moulding material of flow-like is added to the molding space 3103, reduce the impact force of the moulding material generation by way of stopping the moulding material to influence caused by the lead 324 by the supporting member 325 for being located at the molding space 3103；And
(K) molded base 323 is formed after the mold material cures, wherein the molded base 323 includes a molded body 3232 and has an optical window 3231, wherein the molded body 3232 coats at least part in the non-photo-sensing region 3213 of the fringe region 3223 of the wiring board 322, the supporting member 325 and the photosensitive element 321.
It is the camera module of the 23rd preferred embodiment according to the present invention as shown in Figure 69 to Figure 71.The camera module includes integral base component 210, a photosensitive element 220, a camera lens 230, a filter element microscope base 240 and a filter element 250, wherein the integral base component 210, the photosensitive element 220, the filter element microscope base 240 and the filter element 250 form a photosensory assembly.
One or more eyeglasses 232 that the camera lens 230 load-bearing part 231 and be assembled in the load-bearing part 231 including one.The integral base component 210 includes an integral base 211 and a wiring board 212, 211 integral packaging of integral base is in the wiring board 212 and the photosensitive element 220, citing ground but with being not limited to molding unitary packed are in the wiring board 212 and the photosensitive element 220, the filter element microscope base 240 is installed in the integral base 211, to which the assembly that the integral base 211 and the filter element microscope base 240 complement each other to form can replace the microscope base or bracket of traditional camera module, and it does not need to need microscope base or bracket being attached at wiring board by glue in similar traditional packaging process.The photosensitive element 220 is operatively connected to the wiring board 212.The photosensitive element 220 is electrically connected to the wiring board 212 of the integral base component 210, and the filter element microscope base 240 is installed in the integral base component 210, and the camera lens 230 is located at the photosensitive path of the photosensitive element 220.
The integral base 211 has an optical window 2111 and forms a Base body 2112 of the optical window 2111, the optical window 111 is that the photosensitive element 220 provides passage of light, and the molding of Base body 2112 ground integral packaging is in the wiring board 212 and the photosensitive element 220.In this embodiment, the optical window 2111 is the ring structure of surrounding closure, in order to provide closed interior environment for the camera lens 230.The wiring board 212 includes a substrate 2121, and is formed in the substrate 2121 such as multiple electronic components 2122 mounted by SMT technique, and the electronic component 2122 includes but is not limited to resistance, capacitor, driving element etc..In this embodiment in accordance with the invention, 211 integral packaging of integral base is in the substrate 2121, and it is integrally coated on the electronic component 2122, so that dust, sundries in similar traditional camera module be prevented to be adhered on the electronic component 2122 and pollute the photosensitive element 220 and influence imaging effect.It can With understanding, in other variant embodiment, it is also possible to be embedded in the substrate 2121 in the electronic component 2122.The wiring board 212 is circuit board, can be PCB hardboard, PCB soft board, Rigid Flex, ceramic substrate etc..
It is worth mentioning that, in some embodiments, the electronic component 2122 is arranged at around the photosensitive element 220, and in various embodiments, the setting position of the electronic component 2122, which can according to need, is designed layout, for example it is set to side or two sides or more, the setting position of structure and the shape of the filter element microscope base 240 that can be connected with the setting position of the photosensitive element 220 and the photosensitive element 220 with the wiring board 212 match, to more reasonably utilize the spatial position on the substrate 2122, reduce the size of the camera module as far as possible.
Preferably, these electronic components 2122 are disposed in a pair of opposite two sides of the photosensitive element 220, it is arranged in two flank 2121a of the substrate 2121, two end side 2121b of the substrate 2121 do not arrange the electronic component 2122, to make two flank 2121a of the corresponding substrate 2121 of the integral base 211 have wider part, and two end side 2121b of the corresponding substrate 2121 have relatively narrow part.When the especially described circuit board 212 is Rigid Flex, it includes hardboard part 21211 and soft board part 21212, the electronic component 2122 is not arranged in that side far from the soft board part 21212, makes the substrate 2121 that there is reduced size at the edge of that side far from the soft board part 21212.
The mode that the photosensitive element 220 is installed on the substrate 2121, which is illustrated, ground but to be not limited to SMT technique (surface mount process), and is electrically connected to the substrate 2121 by way of COB (Chip On Board) routing.Certainly, in other embodiments of the invention, the mode that the photosensitive element 220 is installed in the substrate 2121 can be by other means, such as embedded, FC (flip-chip) etc., those skilled in the art is it should be understood that the connection of the photosensitive element 220 and the wiring board 212, mounting means are not limitation of the invention.
More specifically, the photosensitive element 220 has a photosensitive area 2201 and a non-photo-sensing area 2202, the non-photo-sensing area 2202 is surrounded on 2201 periphery of photosensitive area, and the integral base is integrally incorporated at least part non-photo-sensing area 2202 of the wiring board 212 and the photosensitive element 220.The photosensitive area 2201 converts light signals into electric signal, the non-photo-sensing area 2202 is electrically connected to the wiring board 212 by the connecting line 2203, by the electric signal transmission to the wiring board 212 for carrying out photosensitization.The camera lens 230 is arranged with 220 optical alignment of photosensitive element, optical axis is consistent, the light across the camera lens 230 is enabled to reach the photosensitive element 220 via the optical window 2111, further across electric signal can be transferred to the wiring board 212 after the photoelectric conversion of the photosensitive element 220, so that the camera module collects image information.
As shown in Figure 69 and Figure 70, the filter element 250 of the camera module is used to be filtered through the light of the camera lens 230.The filter element 250 citing ground but it is not limited to cutoff filter, smalt filter Mating plate, wafer scale cutoff filter, full impregnated piece, visible light filter etc..The filter element 250 is installed in the filter element microscope base 240, positioned at the passage of light of the photosensitive element 220.The camera module can also include a driver 260, such as voice coil motor, piezo-electric motor.The camera lens 230 is installed in the driver 260 to form a lens assembly 2300, to form a dynamic burnt camera module, i.e. AF (Auto Focus) camera module.The driver 260 includes an at least pin 261, and the driver 260 is operatively connected to the wiring board 212 by the pin 261.The pin 261 can be one of single pin, double pins, single pin or double pin.In some attached drawings of the invention, illustrated by taking double pins as an example, but is not limitation.The pin 261 is generally located near the position at edge, from the corresponding position of line B-B carry out section view, 70 cross-sectional view of corresponding diagram, and the pin 261 is practical and invisible in corresponding cross-sectional view, but all illustrate the presence of pin 261 with dotted line in corresponding section view with explanation in order to facilitate understanding.Those skilled in the art is not limitation of the invention it should be understood that the type of the pin 261, shape and setting position.It can be understood that the camera module with can be the fixed-focus camera module of no above-mentioned driver 260, i.e., be camera lens 230 or the lens assembly 2300 with lens barrel fixed lens above the described integral base 211 and the filter element microscope base 240.
As shown in Figure 69 to Figure 71, in this preferred implementation, the filter element 250 is installed in the filter element microscope base 240, and under be sunken in the optical window 2111 of the integral base 211.The integral base 211 of the integral base component 210 has a top surface 2113, and the filter element microscope base 240 is installed in the top surface 2113 of the integral base 211, and the driver 260 is installed in the filter element microscope base 240.2113 plane earth of the top surface of this embodiment according to the invention, the integral base 211 extends.In other words, 211 top surface of integral base forms a flat surface, no step protrusion, and the filter element microscope base 240 is installed in the flat surface.It is worth mentioning that, in this fashion, 2113 plane earth of the top surface of the integral base 211 extends, and without apparent bending angle, therefore during integral packaging, such as the process molded, can obtain more entirely, carrot-free mounting surface, provide smooth mounting condition for the filter element microscope base 240.
It is noted that the filter element 250, such as smalt optical filter, it is the fragile and relatively expensive element of comparison, is easily broken, therefore protecting the filter element 250 is also extremely important one aspect in camera module manufacturing process.In the present invention, the integral base 211 is obtained using molding such as injection molding or mould pressing process, and 240 material of filter element microscope base is unlimited, as long as having enough intensity to carry the filter element 250.Preferably, the filter element microscope base 240 and the integral base 211 can be manufactured using different manufacturing process, the filter element microscope base 240 as described in being made Shooting Technique, the integral base 211 is made with using transfer molding molding, therefore different materials can be used, so that the filter element microscope base 240 and the integral base 211 have different hardness, surface flexible is different, for example it can make the filter element microscope base 240 that there is preferably flexibility, to when the filter element 250 is installed in the filter element microscope base 240, relative to the situation for being installed in the integral base 211, it is installed on described The stress being subject to when filter element microscope base 240 is smaller, so that the installation filter element 250 preferably, avoids filter element 250 from being damaged or occur fragmentation phenomenon.That is, the filter element microscope base 240 alleviates the stress that the filter element 250 may be subject to, such as the stress that while being directly adhered to the integral base 211 is subject to.
Further, with reference to Figure 69 to Figure 71, there is a support slot 241 on the inside of the filter element microscope base 240 and form an engaging groove 242 in bottom outside, the support slot 241 is for installing the filter element 250, and the engaging groove 242 is for being installed on the integral base 211.The support slot 241 is connected to the optical window 2111.The engaging groove 242 is surrounded on 240 bottom periphery of filter element microscope base.
It is worth mentioning that, the filter element 250 is installed in the support slot 241, it is reduced with the relative altitude of the filter element microscope base 240, so that the filter element 250 will not or less protrude from the filter element microscope base 240, to which the height of the camera module will not be increased, and it is not easy to touch the camera lens 250 or the driver 260.
In other words, the support slot 241 is embodied as an inner groove, in order to which the filter element 250 is installed on 240 inside of filter element microscope base, positioned at the passage of light of the photosensitive element 220.The engaging groove 242 forms an outer groove in the outside of the bottom of the filter element microscope base 240, is that the filter element microscope base 240 provides installation site by the integral base 211 in order to be engaged in the integral base 211.
More specifically, the shape and 211 shape of the integral base of the engaging groove 242 match, in order to which the filter element microscope base 240 is stably installed at the integral base 211.
Further, referring to Figure 69 to Figure 71, the filter element microscope base 240 is preferably ring structure, it include structure in a ring a filter element microscope base main body 243, one in prolong arm 244 and a sinking arm 245, the sinking arm 245 integrally extends downwards from 243 bottom side of filter element microscope base main body, in order to which the installation site of the filter element 250 sinks to the optical window 2111.Prolonging arm 244 in described, laterally one extends from the sinking arm 245, in order to provide the installation site of horizontal direction for the filter element 250.It is understood that the structure not in a closed ring shape of filter element microscope base 240, be such as in U-shape structure in possible deformation, enclosed environment then is provided by cooperating with the integral base 211.
In other words, the longitudinal inside for integrally extending the filter element microscope base main body 243 of the sinking arm 245, the engaging groove 242 is formed in the bottom side of the filter element microscope base main body 243, in order to be engaged in the integral base 211, prolong arm 244 in described to extend transversely in the inside of the sinking arm 245, the support slot 241 is formed in the interior top side for prolonging arm 244, in order to support the filter element 250.
In the present invention, the integral base 211 of the camera module is integrally packaged at least part non-photo-sensing area 2202 of the wiring board 212 and the photosensitive element 220, thus relative to the wiring board 212 is only integrally packaged in, the top surface that the integral base 211 has area bigger, to provide larger-sized mounting surface to the filter element microscope base 240.
In addition, the photosensitive element 220 has one group of photosensitive element connector 221 as shown in Figure 70, The wiring board 212 has one group of wiring board connector 222, it is connected between the photosensitive element connector 221 and the wiring board connector 222 by one group of connecting line 223, the integral base 211 further embeds the photosensitive element connector 221, the wiring board connector 222 and the connecting line 223.It is understood that the photosensitive element connector 221, the wiring board connector 222 can be embodied as the terminal pad being arranged respectively in this specific example of signal of the invention raisedly.The integral base 211 is integrally packaged in the wiring board 212 and the photosensitive element 220 and integrally embeds the connecting line 223, to prevent that stray light is reflexed to the photosensitive element 220 because of the exposed connecting line 223.
The filter element microscope base 240 is supported in 211 top surface 2113 of integral base, and the filter element microscope base 240 cooperates the integral base 211, passage of light is provided for the photosensitive element 220, wherein the inward flange 21131 of the top surface 2113 of the integral base 211 be located at the outer edge 2221 of the wiring board connector 222 inside and be no more than the wiring board connector 222 the edge 2221, make the inward flange 21131 of the top surface 2113 of the integral base 211 relative to the outer edge 2221 of the wiring board connector 222 more adjacent to the optical axis X of the camera module, to increase the area of the top surface 2113 of the integral base 211, to be provided for the optical device above the camera module Greater area of smooth mounting surface.As shown in Figure 72 A, the integral base 211 can be in substantially side's annular, the inward flange 21131 of the top surface 2113 of the integral base 211 includes four part edges, the distance between straight line and the optical axis X where a part of edge illustrated in figure extends along direction are illustrated as D1, and the distance between the outer edge 2221 of the wiring board connector 222 and the optical axis X are illustrated as D2, wherein D1 is not more than D2, to make at least part of the top surface 2113 of the integral base 211 inward flange 21131 be located at the position of the camera module inside, to increase the area of the top surface 2113 of the integral base 211.In Figure 72 A, the part of all inward flanges 21131 of the top surface 2113 of the integral base 211 is all located at the position of the camera module inside, so that the top surface 2113 for increasing the integral base 211 can be used to provide the area of mounting surface.
The optical device that the smooth mounting surface can be used to install for example can be the filter element microscope base 240, the camera lens 230, lens assembly 2300.In the example of Figure 70, the smooth mounting surface that the area of the top surface 2113 of the integral base 211 provides is used to support the filter element microscope base 240, the driver 260 and the camera lens 230 form the lens assembly 2300 and are supported on the filter element microscope base 240, and the driver 260 is assembled in the filter element microscope base 240.
In other words, the direction of the inward flange 21131 of the top surface 2113 of the integral base 211 towards the optical axis X of the camera module extend and cross the position of the outer edge 2221 of the wiring board connector 222.It can be understood that, as shown in Figure 70, the top surface area S of the integral base 211 between the inward flange 21131 of the top surface 2113 of the outer edge 22021 and integral base 211 corresponding to the wiring board connector 222, be comparable to 211 integral packagings of the integral base in the wiring board 212 without be packaged in the photosensitive element 220 and the connecting line 223 at least can increased surface area, so as to more It is fixedly supported the filter element microscope base 240.And, with reference to 11 integral packagings of the integral base shown in fig. 7 in the wiring board 12 without being packaged in the photosensitive element 220 and the connecting line 223, this mode needs to reserve the situation in the space that the wiring board 12 is connected with 20 routing of photosensitive element, the integral base 11 obliquely extends upwards from the wiring board 12, the convenient stripping operation in moulding technology of such structure, however the area of the top surface of the integral base 11 is reduced.Therefore, the integral base 11 of the integral base 211 of this embodiment of the invention relative to Fig. 7, the top surface area for the increase being actually capable of providing want significantly larger in above-mentioned top surface area S.In this embodiment that the present invention illustrates, the top surface 2113 of the integral base 211 can all be used as mounting surface, the as described filter element microscope base 240 provides the mounting surface of more flat increase, and the filter element microscope base 240 is enable more entirely to be assembled in the integral base 211 and the bonding strength of enhancing between the two.
Relative to the traditional camera module illustrated in Figure 1B, microscope base 7 is pasted on circuit board 2 by support leg 701, the bottom surface of the filter element microscope base 240 of the filter element 340 of arranging in pairs or groups provides the bond area bigger with the integral base 211, as shown in Figure 70, the bond area that the filter element microscope base 240 is in contact with the integral base 211 is the top surface 2113 of the integral base 211, to the filter element microscope base 240 be able to be combined with the integral base 211 it is more firm, and bonding region increases, the inclination of the filter element microscope base 240 can more effectively be avoided, to improve image quality.
The filter element microscope base 240 can be installed on the integral base 211 in such a way that glue is bonded, and bond area is larger, and the planarization of the filter element microscope base 240 can be adjusted by glue thickness.It is noted that the filter element 250 can first be mounted on the filter element microscope base 240, then the filter element microscope base 240 is mounted on the integral base 211 again.The filter element microscope base 240 can be formed by Shooting Technique, itself and the integral base 211 have different hardness, and the size of the filter element 250 is smaller, in this way, when the filter element 250 for carrying the filter element microscope base 240 being mounted on the integral base 211 again, the filter element microscope base 240 can provide the effect of stress buffer, and the filter element 250 described in this way is not allowed frangible.Relative to the filter element 250 is directly mounted on the integral base 211, the size of the filter element 250 is larger, there is no stress buffer again, so filter element 250 is fragile in attachment process, so this assembling mode is also higher to attachment process requirement.
In addition, the assembly that the integral base 211 and the filter element microscope base 240 are combined into being capable of traditional microscope base 7 in alternate figures 1B, the integral base 211 is because be integrated in the wiring board 212 to have biggish bonding strength, and the filter element microscope base 240 is the structural member for carrying the filter element 340.To which this two-part assembly can provide stronger support to the driver 260 illustrated in the optical module such as figure of top relative to the microscope base 7 illustrated in Figure 1B.That is, the stress that the filter element microscope base 240 is subject to can be transmitted more effectively to the integral base 211 and the wiring board 212.It, being capable of more effectively dispersive stress so that is combined is more firm moreover, because the integral base 211 and the wiring board 212 integrally encapsulate.
And, traditional microscope base 7 in the sub-assembly alternate figures 1B of the filter element microscope base 240 and the integral base 211, to traditional microscope base 7 relative to installation filter element, the thickness of the filter element microscope base 240 is decreased considerably, and 240 thickness of filter element microscope base of the present invention is in 0.7mm or less.
In addition, in preferred scheme, the integral base 211 has the medial surface 2114 extended from the photosensitive element 220 inclination, has gradually big internal diameter to form the direction for being directed away from the photosensitive element 220, and form the optical window 2111 that opening is gradually increased.And in the bottom side of the filter element 250, the interior inner surface 2441 for prolonging arm 244 of the filter element microscope base 240 obliquely extends, and there is the internal diameter increased towards the direction of the neighbouring photosensitive element 220, in this way, the inner surface 2441 that the interior inclination for prolonging arm 244 of the filter element microscope base 240 extends can prevent stray light relative to the inner surface extended vertically.And, as shown in Figure 72 B, in the lower section of the filter element 250, the filter element microscope base 240 and the integral base 211 form inner chamfer structure, in this way when stray light L1 reaches the medial surface 2114 of the integral base 214, its further reached by reflection the filter element microscope base 240 it is described in prolong the inclined inner surface 2441 of arm 244, and further reflected and reach the photosensitive element 220 to avoid light L1 and influence image quality.
It is noted that in the present invention, the surface reflectivity of the integral base 211 is 5% hereinafter, and the wave-length coverage of reflection light is 435~660nm.That is, the light on most of surface for being incident to the integral base 211 cannot be formed the interference veiling glare for reaching the photosensitive element 220 by reflection, to further reduce the influence of reflection veiling glare.
It is worth mentioning that, in molded packages technique, prolong arm 244 due to that cannot be formed in described, therefore the area of the filter element needed is all larger, increase in other words relative to the filter element area of traditional microscope base demand, and in the present invention, it is described in prolong arm 244 and extend internally, so that the demand area of the filter element 250 reduces, so that the advantage of filter element microscope base 240 and the advantage of integral packaging combine.
Citing ground, referring to Figure 70, described interior the distance between arm 244 that prolongs of opposite sides is labeled as L, then the diameter of the filter element 250 needs be only greater than L, and it is equipped in described and prolongs arm 244, without going to be equipped on the Base body 2112, so that the demand area of the filter element 250 reduces.In this embodiment in accordance with the invention, the filter element 250 be arranged at the filter element microscope base 240 and make the outer edge 2501 of the filter element 250 be located at the integral base 211 the top surface 2113 inward flange 21131 inside, so that the filter element 250 is assembled in the filter element microscope base 240 relative to the area for being assembled in the integral base 211 and being reduced the filter element 250
In this embodiment in accordance with the invention, the extended distance of the sinking arm 245 influences submergence depth of the filter element 250 in the optical window 2111, and the interior extended distance for prolonging arm 244 influences the size of the filter element 250 of installation.For example, position of the filter element 250 in the optical window 2111 is more to sinking, and the distance apart from the photosensitive element 220 is smaller, and the back focal length of the corresponding camera module is smaller when 245 extended distance of sinking arm is bigger；Interior to prolong 244 extended distance of arm bigger when described When, the area of the filter element 250 needed is smaller, to be more easier to obtain the suitable filter element 250, and easy for installation, reduces the cost of the camera module.Certainly, the extended distance of the sinking arm 245 needs not make it dim spot occur on the basis of the imaging effect in conjunction with the camera module, such as reduction back focal length, such as the image of dust；And it is described in prolong the extended distance of arm 244 and need to consider the factors such as the photosensitive area 2201 of the camera module passage of light and the photosensitive element 220 and the remaining width of the non-photo-sensing area 2202 and the wiring board 212, such as when prolonging arm 244 within make and extending internally, in the lesser situation of the filter element 250, the photosensitive area 2201 of the photosensitive element 220 will not be blocked by prolonging arm 244 in described, will not excessively block the light ray flux of entrance.
It is worth mentioning that, in this embodiment in accordance with the invention, the integral base 211 is packaged in the upper surface of the wiring board 212, and in other embodiments of the invention, the integral base 211 can extend to the side and/or bottom surface of the wiring board 212, those skilled in the art is it should be understood that the integrated molding range of the integral base 211 is not limitation of the invention.
In the above embodiment of the invention, the filter element microscope base 240 is installed in the integral base 211, the driver 260 is installed in the filter element microscope base 240, that is, the filter element microscope base 240 is arranged between the driver 260 and the integral base 211, the camera module formed is burnt camera module, and the integral base 211 and the filter element microscope base 240 for being integrated in the wiring board 212 and the photosensitive element 220 are able to that strong support can be provided for the lens assembly 2300 with the driver 260 and the camera lens 230 of top.And it is as shown in Figure 74, the camera module does not include the driver 260, it forms a fixed-focus camera module, the lens assembly 2300 that the camera lens 230 and a fixed lens barrel 270 are formed is directly mounted to the filter element microscope base 240, and the integral base 211 and the filter element microscope base 240 for being integrated in the wiring board 212 and the photosensitive element 220 are able to that strong support can be provided for the lens assembly 2300 with the fixed lens barrel 270 and the camera lens 230 of top.As shown in Figure 74 A, the camera lens 230 is directly mounted to the filter element microscope base 240, and the integral base 211 and the filter element microscope base 240 for being integrated in the wiring board 212 and the photosensitive element 220 are able to that strong support can be provided for the camera lens 230 of top.
As shown in Figure 74 B, in this variant embodiment, 240 top side of filter element microscope base can have multiple step surfaces, in structure shown in the figure, there are three step surfaces 2401 for the tool of filter element microscope base 240, 2402 and 2403, and has and be located at a support slot 241 and an assembling grove 248, the support slot 241 makes the filter element 250 be supported on first order step surface 2401 for installing the filter element 250, the assembling grove 248 is located at the outside of the support slot 241, for assembling the camera lens 230, it is assembled in the camera lens 230 on second level step surface 2402, to make the position of the camera lens 230 further sink, to reduce the whole height of the camera module, outermost step surface 2403 is corresponding Raised step part be located on the outside of the camera lens 230 and position-limiting action can be played to the camera lens 230.It is understood that the assembling grove 248 in other variant embodiment, can be used to assemble with the driver 260 or the fixation The lens assembly 2300 of lens barrel 270.
As shown in Figure 75 A, in other variant embodiment of the invention, the filter element microscope base 240 and the driver 260 are all installed in the top surface 2113 of the integral base 211.Further, the filter element microscope base 240 is installed in the inner side of the top surface 2113 of the integral base 211, the driver 260 is installed in the outer fix of the top surface 2113 of the integral base 211, thus the top surface 2113 of integral base 211 described in the driver 260 and 240 coordinated allocation of filter element microscope base.As shown in Figure 75 B, in other variant embodiment of the invention, the filter element microscope base 240 and the fixed lens barrel 270 are all installed in the top surface 2113 of the integral base 211.Further, the filter element microscope base 240 is installed in the inner side of the top surface 2113 of the integral base 211, the fixed lens barrel 270 is installed in the outer fix of the top surface 2113 of the integral base 211, thus the top surface 2113 of integral base 211 described in the fixed lens barrel 270 and 240 coordinated allocation of filter element microscope base.As shown in Figure 75 C, in other variant embodiment of the invention, the filter element microscope base 240 and the camera lens 230 are all installed in the top surface 2113 of the integral base 211.Further, the filter element microscope base 240 is installed in the inner side of the top surface 2113 of the integral base 211, the camera lens 230 is installed in the outer fix of the top surface 2113 of the integral base 211, thus the top surface 2113 of integral base 211 described in the camera lens 230 and 240 coordinated allocation of filter element microscope base.That is, the mounting surface that the top surface 2113 of the integral base 211 provides is fully utilized, and its area is able to that two optical devices can be supported.
More specifically, in Figure 75 A to Figure 75 C, the inward flange 21131 of the top surface 2113 of the integral base 211 relative to the wiring board connector 222 outer edge 2221 more adjacent to the optical axis X of the camera module, the inward flange 21131 of the top surface 2113 of the i.e. described integral base 211 is located at the position of inside, and in the horizontal direction of the vertical optical axis X illustrated in figure, there is preset distance between the inward flange 21131 of the top surface 2113 of the integral base 211 and the outer edge 2221 of the wiring board connector 222, to increase the area of the top surface 2113 of the integral base 211, to provide greater area of smooth mounting surface for the optical device above the camera module.In this embodiment, the area of the top surface 2113 is all utilized so that as mounting surface, the optical device that the smooth mounting surface can be used to install for example can be the filter element microscope base 240 and the driver 260 or the fixed lens barrel 260 or the camera lens 230.
In the example of Figure 69, the smooth mounting surface that the area of the top surface 2113 of the integral base 211 provides is used to support the filter element microscope base 240, the driver 260 and the camera lens 230 form lens assembly 2300, and the driver 260 is assembled in the filter element microscope base 240.And in example shown in Figure 75 A to Figure 75 C, the top surface 2113 of the integral base 211 provides a part of mounting surface 21131 for being located inside, for installing the filter element microscope base 240, and the integral base 211 provides a part of mounting surface 21132 for being located at outside, for installing the driver 260 or described Fixed lens barrel 260 or the camera lens 230.The top surface 2113 of the integral base 211 described in this way is able to provide sufficiently large attachment face simultaneously for the filter element microscope base 240 and the driver 260 or the fixed lens barrel 260 or the camera lens 230.
That is, the wiring board 212 and the photosensitive element 220 are integrated in by the integral base 211 of the invention, and the integral base 211 is made integrally to embed the photosensitive element connector 221, the wiring board connector 222 and the connecting line 223.In the embodiment that Fig. 2 illustrates into Figure 56, the integral base 11 does not embed the corresponding photosensitive element connector, the wiring board connector and the connecting line, to which the photosensitive element connector cannot be utilized, spatial position above the wiring board connector and the connecting line and form biggish mounting surface in 11 top side of integral base.And, it can be understood that, the moulding technology that the integral base 11 generallys use upper/lower die is made, in the embodiment that Fig. 2 illustrates into Figure 56, not only to reserve the space that the wiring board 12 is connected with 20 routing of photosensitive element, further deformation is for it, in order to facilitate demoulding, the inner surface of the integral base 11 usually extends inclinedly to form the gradually big optical window that is open from bottom to up, as shown in Figure 7, the area that will lead to the top surface of the integral base 11 in this way, which is further reduced, is unable to provide enough mounting areas.And in this embodiment of the invention, 211 inner surface 2114 of integral base extends the stripping operation to facilitate moulding technology also inclinedly and avoids stray light, and the top area that the inner surface 2114 for tilting the integral base 211 extended will lead to the integral base 211 is intended to reduce.And relative to embodiment shown in Fig. 7, the integral base 211 embeds the photosensitive element connector 221, the wiring board connector 222 and the connecting line 223, to make full use of the photosensitive element connector 221, the locational space of 223 top of the wiring board connector 222 and the connecting line, the part for the inner surface 2114 that inclination extends since the photosensitive element 220 for corresponding to the integral base 211 is set to be concentrated mainly on the photosensitive element connector 221, 222 top of the connecting line 223 and the wiring board connector, the integral base 211 can be made along the end of the inner surface 2114 obliquely extended far from the photosensitive element 220 in this way, correspond to the position of the inward flange 21131 of the top surface 2113, In the horizontal direction perpendicular to the optical axis X illustrated in figure, the outer edge 2221 of the wiring board connector 222 is not exceeded, so as to strive for the top surface 2113 of bigger area for the top side of the integral base 211, to provide greater area of smooth mounting surface, to install the filter element microscope base 240 or the installation filter element microscope base 240 and the camera lens 230 or the lens assembly 2300.
In addition, in the structure of this embodiment, the camera lens 230 or the lens assembly 2300 can directly be mounted on the smooth top surface 2113 of the integral base 211, it can be reduced assembling tolerance relative to the filter element microscope base 240 is assembled in this way, reduce the offset of the camera lens 230 or the lens assembly 2300.
It is another variant embodiment of above preferred embodiment according to the present invention as shown in Figure 76, optical element microscope base 240 includes an at least retention bead 246, and the retention bead 246 is from the filter element microscope base The top of 240 main body at least partly, raisedly upwardly extends.Further, the top surface of the retention bead 246 from the filter element microscope base main body 243 at least partly, raisedly upwardly extends, and enters inside camera module in order to limit mounted element, blocks dust or light.It the retention bead 246 citing ground but is not limited to limit the driver 260 or the camera lens 230.More specifically, in one embodiment, the retention bead 246 is arranged at the intermediate position of the microscope base main body 243, the top of the microscope base main body 243 is divided into two parts, for installing the driver 260, the camera lens 230 is located inside in outside.In this fashion, the retention bead 246 can position the position of the driver 260, reduce the offset of the driver 260.And in an assembling process, it can prevent the glue for installing the driver 260 from overflowing to internal and being infected with camera lens or internal element.Preferably, the retention bead 426 can be an annular protrusion, to position the driver 260 on the whole, glue be stopped to overflow to inside.
As shown in Figure 77, another variant embodiment of above preferred embodiment according to the present invention, the integral base 211 form a mounting groove 2115 in top side, and the filter element microscope base 240 is installed on the mounting groove 2115.More specifically, the integral base 211 can have multiple step surfaces in top side, as shown in Figure 77, the top surface 2113 of the integral base 211 has the First terrace 2113a of inside and the second step face 2113b positioned at outside, forms the mounting groove 2115 in the top side of the First terrace 2113a and the inside in the second step face 21132.A part of smooth mounting surface that the First terrace 2113a and the second step face 2113b of the integral base 211 are formed respectively as the integral base 211 by moulding technology, to support the filter element microscope base 240 and the driver 260 respectively.
More specifically, the First terrace 2113a of the integral base 211 is engaged in engaging groove 242 described in the bottom outside of the filter element microscope base 240, so that the filter element microscope base main body 243 of the filter element microscope base 240 is supported and is contained in the mounting groove 2115.In this embodiment, when the filter element microscope base 240 is installed in the mounting groove 2115, the top surface of the filter element microscope base 240 is consistent with the top surface of the Base body integral base 211, so that the filter element microscope base 240 will not protrude from the Base body 2112F, and it is not easy to touch the camera lens 230 and the driver 260 being located above.In other variant embodiment, the upper surface of the filter element microscope base 240 can slightly protrude from the top surface 2113 of the integral base 211, so as to cooperate to limit the driver 260, and prevent the glue when installing the driver 260 from overflowing to inside.
In this embodiment, the integral base 211 includes the raised step 2116 of an annular, protrudes from the Base body 2112.The raised step 2116 partly extends upwards from the Base body 2112, to form the mounting groove 2115 on the inside of it.The top side of the raised step 2116 forms the second step face 2113b.The driver 260 is at least partly installed in the raised step 2116, to form a dynamic burnt camera module.It is understood that in other embodiments, the camera lens 230 or the fixed lens barrel 270 are installed at least partly the raised step 2116, a fixed-focus camera module is formed.
In this embodiment in accordance with the invention, the photosensitive element 220 and the wiring board 212 pass through the sense Optical element connector 221, the wiring board connector 222 are connected with the connecting line 223, and the photosensitive element connector 221, and the wiring board connector 222 is connected with the connecting line 223 to be embedded by the integral base 211.Wherein the inward flange of the first step face 2113a is the inward flange of the top surface 2113 of the integral base 211.
The inward flange 21131 of the innermost First terrace 2113a of the top surface 2113 of the integral base 211 relative to the wiring board connector 222 outer edge 2221 more adjacent to the optical axis X of the camera module, the inward flange 21131 of the innermost First terrace 2113a of the top surface 2113 of the i.e. described integral base 211 is located at the position of inside, and in the horizontal direction of the vertical optical axis X illustrated in figure, there is preset distance between the inward flange 21131 of the innermost First terrace 2113a and the outer edge 2221 of the wiring board connector 222 of the top surface 2113 of the integral base 211, to increase the area of the top surface 2113 of the integral base 211, think the camera shooting Optical device above mould group provides greater area of smooth mounting surface.In this implementation, the area of the top surface 2113 is all utilized so that as mounting surface, the optical device that the smooth mounting surface can be used to install for example can be the filter element microscope base 240 and the driver 260.More specifically, the top surface 2113 of the integral base 211, which provides, is located at First terrace 2113a that the position of inside moves down using as first part's mounting surface, for installing the filter element microscope base 240, and the integral base 211, which provides, is located at the second step face 2113b positioned at 2116 top side of raised step in outside using as second part mounting surface, to be used to install the driver 260.The First terrace 2113a and the second step face 2113b of the top surface 2113 of the integral base 211 described in this way are able to provide sufficiently large attachment face simultaneously for the filter element microscope base 240 and the driver 260.Positioned at the photosensitive element connector 221, the First terrace 2113a of the integral base 211 of 223 top of the wiring board connector 222 and the connecting line is fully utilized, to provide the mounting surface for installing the filter element microscope base 240.In addition, the glue of bonding between the driver 330 and the second step face 32361 can extend to the top surface of the filter element microscope base 240, and more firm support effect can be provided together for the driver 260 by being equivalent to the integral base 211 and the filter element microscope base 240 in this way.It can be understood that, as the other deformation that can be readily apparent that, the lens barrel 270 or the camera lens 230 are directly mounted on the second step face 2113b of the top surface 2113 of the integral base 211, and the top surface 2113 of the integral base 211 can provide sufficiently large attachment area simultaneously for the filter element microscope base 240 and the lens barrel 270 or the camera lens 230.
It is the camera module of the 24th preferred embodiment according to the present invention as shown in Figure 78 to Figure 80, wherein the camera module includes integral base component 210, a photosensitive element 220, a camera lens 230, a filter element microscope base 240 and a filter element 250, wherein the integral base component 210, the photosensitive element 220, the filter element microscope base 240 and the filter element 250 form a photosensory assembly.The integral base component 210 include an integral base 211 and a wiring board 212,211 integral packaging of integral base in The wiring board 212 and the photosensitive element 220, the filter element microscope base 240 is installed in the integral base 211, the microscope base or bracket of traditional camera module can be replaced to which the integral base 211 and the filter element microscope base 240 cooperate, and does not need to need microscope base or bracket being attached at wiring board by glue in similar traditional packaging process.The photosensitive element 220 is operatively connected to the wiring board 212.The photosensitive element 220 is electrically connected to the wiring board 212 of the integral base component 210, and the filter element microscope base 240 is installed in the integral base component 210, and the camera lens 230 is located at the photosensitive path of the photosensitive element 220.The integral base 211 has an optical window 2111 and forms a Base body 2112 of the optical window 2111, the optical window 111 is that the photosensitive element 220 provides passage of light, and the molding of Base body 2112 ground integral packaging is in the wiring board 212 and the photosensitive element 220.
The wiring board 212 includes a substrate 2121, and is formed in multiple electronic components 2122 of the substrate 2121, and the electronic component 2122 includes but is not limited to resistance, capacitor, driving element etc..In this embodiment in accordance with the invention, 211 integral packaging of integral base is in the substrate 2121, and is integrally coated on the electronic component 2122.And, in some embodiments, the electronic component 2122 is arranged at around the photosensitive element 220, and in various embodiments, the setting position of the electronic component 2122, which can according to need, is designed layout, for example it is set to side or two sides or more, the setting position of structure and the shape of the filter element microscope base 240 that can be connected with the setting position of the photosensitive element 220 and the photosensitive element 220 with the wiring board 212 match, to more reasonably utilize the spatial position on the substrate 2122, reduce the size of the camera module as far as possible.
The photosensitive element 220 has a photosensitive area 2201 and a non-photo-sensing area 2202, the non-photo-sensing area 2202 is surrounded on 2201 periphery of photosensitive area, and the integral base is integrally incorporated at least part non-photo-sensing area 2202 of the wiring board 212 and the photosensitive element 220.
The filter element microscope base 240 has a support slot 241, and the filter element 250 is installed in the support slot 241, so that 250 position of the filter element moves down.It can be understood that the filter element microscope base 240 is the intermediate cyclic structure for having through-hole, it can make the light through the camera lens 230 pass through the filter element 250 and reach the photosensitive element 220 after assembling the filter element 250.
Further, prolong arm 244 in the one of a filter element microscope base main body 243 and annular of the filter element microscope base 240 including annular, the interior arm 244 that prolongs integrally extends internally from 243 lower of the filter element microscope base main body transverse direction, forms the support slot 241.The filter element microscope base main body 243 is supported on the integral base 211.The filter element microscope base 240 does not include the sinking arm 245 in above-described embodiment, and does not have the engaging groove 242, and 240 bottom side of filter element microscope base is a plane.
As shown in Figure 78 to Figure 80, in this preferred implementation, the filter element 250 is installed in the filter element microscope base 240.The integral base 211 of the integral base component 210 has a top surface 2113, and the filter element microscope base 240 is installed in the top surface 2113 of the integral base 211, and the camera lens 230 is installed in the filter element microscope base 240.This embodiment according to the invention, it is described 2113 plane earth of the top surface of integral base 211 extends.In other words, 211 top surface of integral base forms a flat surface, no step protrusion, and the filter element microscope base 240 is installed in the flat surface.It is worth mentioning that, in this fashion, 2113 plane earth of the top surface of the integral base 211 extends, and without apparent bending angle, therefore during integral packaging, such as the process molded, can obtain more entirely, carrot-free mounting surface, provide smooth mounting condition for the filter element microscope base 240.
It is noted that the filter element 250, such as smalt optical filter, it is the fragile and relatively expensive element of comparison, is easily broken, therefore protecting the filter element 250 is also extremely important one aspect in camera module manufacturing process.In the present invention, the integral base 211 is obtained using molding such as injection molding or mould pressing process, and 240 material of filter element microscope base is unlimited, as long as having enough intensity to carry the filter element 250.Preferably, the filter element microscope base 240 and the integral base 211 can be manufactured using different manufacturing process, the filter element microscope base 240 as described in being made Shooting Technique, the integral base 211 is made with using transfer molding molding, therefore different materials can be used, so that the filter element microscope base 240 and the integral base 211 have different hardness, surface flexible is different, for example it can make the filter element microscope base 240 that there is preferably flexibility, to when the filter element 250 is installed in the filter element microscope base 240, relative to the situation for being installed in the integral base 211, the stress being subject to when being installed on the filter element microscope base 240 is smaller, to the installation filter element 250 preferably, avoid filter element 2 50 are damaged or occur fragmentation phenomenon.That is, the filter element microscope base 240 alleviates the stress that the filter element 250 may be subject to, such as the stress that while being directly adhered to the integral base 211 is subject to.
In the present invention, the integral base 211 of the camera module is integrally packaged at least part non-photo-sensing area 2202 of the wiring board 212 and the photosensitive element 220, thus relative to the wiring board 212 is only integrally packaged in, the top surface that the integral base 211 has area bigger, to provide larger-sized mounting surface to the filter element microscope base 240.
In addition, as shown in Figure 78 to Figure 80, the photosensitive element 220 has photosensitive element connector 221, the wiring board 212 has wiring board connector 222, it is connected between the photosensitive element connector 221 and the wiring board connector 222 by one group of connecting line 223, the integral base 211 further embeds the photosensitive element connector 221, the wiring board connector 222 and the connecting line 223.It is understood that the photosensitive element connector 221, the wiring board connector 222 can be embodied as the terminal pad being arranged respectively in this specific example of signal of the invention raisedly.
The filter element microscope base 240 is supported in 211 top surface 2113 of integral base, and the filter element microscope base 240 cooperates the integral base 211, passage of light is provided for the photosensitive element 220, wherein the inward flange 21131 of the top surface 2113 of the integral base 211 is relative to the outer edge 2221 of the wiring board connector 222 more adjacent to the optical axis X of the camera module, it is greater area of smooth to be provided for the optical device above the camera module to increase the area of the top surface 2113 of the integral base 211 Mounting surface.For example in this embodiment, the smooth mounting surface that the area of the top surface 2113 of the integral base 211 provides is used to support the filter element microscope base 240 to the optical device that the smooth mounting surface can be used to install.
In other words, the direction of the inward flange 21131 of the top surface 2113 of the integral base 211 towards the optical axis X of the camera module extend and can cross the position of the outer edge 2221 of the wiring board connector 222.It can be understood that, as shown in Figure 78 to Figure 80, the top surface area S of the integral base 211 between the inward flange 21131 of the top surface 2113 of the outer edge 22021 and integral base 211 corresponding to the wiring board connector 222, be comparable to 211 integral packagings of the integral base in the edge of the wiring board 212 without be packaged in the structure of the photosensitive element 220 and the connecting line 223 at least can increased surface area, so as to more securely support the filter element microscope base 240.And, 11 integral packagings of the integral base are in the situation at the edge of the wiring board 12 with reference to shown in Fig. 8 A, the integral base 11 of the integral base 211 of this embodiment of the invention relative to Fig. 8 A, the top surface area for the increase being actually capable of providing will be significantly greater than above-mentioned top surface area S.In this embodiment that the present invention illustrates, the top surface 2113 of the integral base 211 is all used as mounting surface, the as described filter element microscope base 240 provides the mounting surface of more flat increase, and the filter element microscope base 240 is enable more entirely to be assembled in the integral base 211 and the bonding strength of enhancing between the two.
Relative to the traditional camera module illustrated in Figure 1B, microscope base 7 is pasted on circuit board 2 by support leg 701, the bottom surface of the filter element microscope base 240 of the filter element 340 of arranging in pairs or groups provides the bond area bigger with the integral base 211, as shown in Figure 78 to Figure 80, the bond area that the filter element microscope base 240 is in contact with the integral base 211 is the top surface 2113 of the integral base 211, to the filter element microscope base 240 be able to be combined with the integral base 211 it is more firm, and bonding region increases, the inclination of the filter element microscope base 240 can more effectively be avoided and improve image quality.
The filter element microscope base 240 can be installed on the integral base 211 in such a way that glue is bonded, and bond area is larger, and the planarization of the filter element microscope base 240 can be adjusted by glue thickness.It is noted that the filter element 250 can first be mounted on the filter element microscope base 240, then the filter element microscope base 240 is mounted on the integral base 211 again.The filter element microscope base 240 can be formed by Shooting Technique, itself and the integral base 211 have different hardness, and the size of the filter element 250 is smaller, in this way, when the filter element 250 for carrying the filter element microscope base 240 being mounted on the integral base 211 again, the filter element microscope base 240 can provide the effect of stress buffer, and the filter element 250 described in this way is not allowed frangible.Relative to the filter element 250 is directly mounted on the integral base 211, the size of the filter element 250 is larger, there is no stress buffer again, so filter element 250 is fragile in attachment process, so this assembling mode is also higher to attachment process requirement.
In addition, the assembly that is combined into of the integral base 211 and the filter element microscope base 240 can traditional microscope base 7 in alternate figures 1B, the integral base 211 because be integrated in the wiring board 212 to With biggish bonding strength, and the filter element microscope base 240 is the structural member for carrying the filter element 340.To which this two-part assembly can provide stronger support to the camera lens 230 illustrated in the optical module such as figure of top relative to the microscope base 7 illustrated in Figure 1B.That is, the stress that the filter element microscope base 240 is subject to can be transmitted more effectively to the integral base 211 and the wiring board 212.It, being capable of more effectively dispersive stress so that is combined is more firm moreover, because the integral base 211 and the wiring board 212 integrally encapsulate.
And, traditional microscope base 7 in the sub-assembly alternate figures 1B of the filter element microscope base 240 and the integral base 211, to traditional microscope base 7 relative to installation filter element, the thickness of the filter element microscope base 240 is decreased considerably, and 240 thickness of filter element microscope base of the present invention is in 0.7mm or less.
In addition, in preferred scheme, the integral base 211 has the medial surface 2114 extended from the photosensitive element 220 inclination, has gradually big internal diameter to form the direction for being directed away from the photosensitive element 220, and form the optical window 2111 that opening is gradually increased.And in the bottom side of the filter element 250, the interior inner surface 2441 for prolonging arm 244 of the filter element microscope base 240 obliquely extends, and there is the internal diameter increased towards the direction of the neighbouring photosensitive element 220, in this way, as shown in Figure 80, in the lower section of the filter element 250, the filter element microscope base 240 and the integral base 211 form inner chamfer structure, in this way when stray light L2 reaches the medial surface 2114 of the integral base 214, its described interior inclined inner surface 2441 for prolonging arm 244 that the filter element microscope base 240 is further reached by reflection, and it is further reflected to avoid light L2 reaches the photosensitive element 220 and influences image quality.
As shown in Figure 81, another variant embodiment according to the abovementioned embodiments of the present invention, the integral base 211 forms a mounting groove 2115 in top side, and the filter element microscope base 240 is installed on the mounting groove 2115.More specifically, the integral base 211 can have multiple step surfaces in top side, as shown in Figure 81, the top surface 2113 of the integral base 211 has the First terrace 2113a of inside and the second step face 2113b positioned at outside, forms the mounting groove 2115 in the top side of the First terrace 2113a and the inside in the second step face 21132.A part of smooth mounting surface that the First terrace 2113a and the second step face 2113b of the integral base 211 are formed respectively as the integral base 211 by moulding technology, to support the filter element microscope base 240 and the camera lens 230 respectively.
More specifically, the First terrace 2113a of the integral base 211 supports the flat bottom surface of the filter element microscope base 240, so that the filter element microscope base 240 is housed inside in the mounting groove 2115.In this embodiment, when the filter element microscope base 240 is installed in the mounting groove 2115, the top surface of the filter element microscope base 240 and the top surface of the Base body 2112C are almost the same, so that the filter element microscope base 240 will not protrude from the top surface 2113 of the integral base 211, and it is not easy to touch the camera lens 230 being located above.Certainly, in the variant embodiment illustrated in Figure 82, the upper surface of the filter element microscope base 240 can slightly protrude from the top surface 2113 of the integral base 211, so as to cooperate to limit the camera lens 230, and prevent the glue when installing the camera lens 230 from overflowing to Inside.
In this embodiment, the integral base 211 includes the raised step 2116 of an annular, protrudes from the Base body 2112.The raised step 2116 partly extends upwards from the Base body 2112, to form the mounting groove 2115 on the inside of it.The top side of the raised step 2116 forms the second step face 2113b.The camera lens 230 is at least partly installed in the raised step 2116, to form a fixed-focus camera module.
In this embodiment in accordance with the invention, the photosensitive element 220 and the wiring board 212 pass through the photosensitive element connector 221, the wiring board connector 222 is connected with the connecting line 223, and the photosensitive element connector 221, the wiring board connector 222 is connected with the connecting line 223 to be embedded by the integral base 211.Wherein the inward flange of the first step face 2113a is the inward flange 21131 of the top surface 2113 of the integral base 211.
The inward flange 21131 of the innermost First terrace 2113a of the top surface 2113 of the integral base 211 relative to the wiring board connector 222 outer edge 2221 more adjacent to the optical axis X of the camera module, the inward flange 21131 of the innermost First terrace 2113a of the top surface 2113 of the i.e. described integral base 211 is located at the position of inside, and in the horizontal direction of the vertical optical axis X illustrated in figure, there is preset distance between the inward flange 21131 of the innermost First terrace 2113a and the outer edge 2221 of the wiring board connector 222 of the top surface 2113 of the integral base 211, to increase the area of the top surface 2113 of the integral base 211, think the camera shooting Optical device above mould group provides greater area of smooth mounting surface.
It can be understood that, the integral base 211 is directed away from the end for this portion inner surface that the inclination of photosensitive element 220 extends from the photosensitive element 220, the inward flange of the i.e. described First terrace 2113a, it is not extended past the outer edge 2221 of the wiring board connector 222, to increase the area of the top surface 2113 of the integral base 211.
In this embodiment, the area of the top surface 2113 is all utilized so that as mounting surface, the optical device that the smooth mounting surface can be used to install for example can be the filter element microscope base 240 and the camera lens 230.More specifically, the top surface 2113 of the integral base 211, which provides, is located at First terrace 2113a that the position of inside moves down using as first part's mounting surface, for installing the filter element microscope base 240, and the integral base 211, which provides, is located at the second step face 2113b positioned at 2116 top side of raised step in outside using as second part mounting surface, to be used to install the camera lens 230.The First terrace 2113a and the second step face 2113b of the top surface 2113 of the integral base 211 described in this way are able to provide sufficiently large attachment face simultaneously for the filter element microscope base 240 and the camera lens 30.Positioned at the photosensitive element connector 221, the First terrace 2113a of the integral base 211 of 223 top of the wiring board connector 222 and the connecting line is fully utilized, to provide the mounting surface for installing the filter element microscope base 240.In addition, the driver 330 and the second step face The glue of bonding between 32361 can extend to the top surface of the filter element microscope base 240, and more firm support effect can be provided together for the camera lens by being equivalent to the integral base 211 and the filter element microscope base 240 in this way.
It is another variant embodiment of above preferred embodiment according to the present invention as shown in Figure 83 to Figure 84, wherein the integral base 211 has a mounting groove 2115 in top side and forms multisection type raised step 2116, and forms one or more notches 2117 along its circular direction.That is, the mounting groove 2115 is open connectivity slot, it is not closing structure.The filter element microscope base 240 is installed in the mounting groove 2115.More specifically, in this embodiment, a pair of of opposite side of the mounting groove 2115 is respectively provided with above-mentioned notch 2117, i.e., the described multisection type raised step 2116 includes the step positioned at a pair of of opposite side.It is understood that can have the notch 2117 in other variant embodiment, making the multisection type raised step 2116 includes three Duan Taijie, and is generally u-shaped structure.In other variant embodiment, two notches 2117 can be disposed adjacently, and the multisection type raised step 2116 includes two sections of steps, and generally L-shaped structure.
In this embodiment, the filter element microscope base 240 is mounted on the mounting groove 2115 of the integral base, the filter element microscope base main body 243 of the filter element microscope base 240 includes being located in the middle joint portion 2431 and two extensions 2432, the joint portion 2431 is located at the mounting groove 2115, and the extension 2432 is for being filled in the notch 2117.In other words, the extension 2432 extends into the notch 2117, so that the notch 2117 is filled, to form environment in closing, enables the optical window 2111 in sealing state.
As shown in Figure 85, be above preferred embodiment according to the present invention another variant embodiment camera module.Different from above preferred embodiment, the filter element microscope base 240 includes prolonging wall 247 on one, it is described on prolong wall 247 and upwardly extended raisedly from the filter element microscope base main body 243, one limit chamber 2471 of formation.The limit chamber 2471 citing ground but is not limited to lens assembly 2300 or camera lens 230 for limiting mounted component, is the lens assembly 2300 that limit has the driver 260 and the camera lens 230 as shown in the figure.
That is, when assembling the camera module, the lens assembly 2300 is installed in the limit chamber 2471 of the filter element microscope base 240, limits the lens assembly 2300, so that the lens assembly 2300 is consistent with the optical axis of the photosensitive element 220.The size of the limit chamber 2471 can be determined according to mounted part dimension.
In other words, excessive deviation will not be generated, guarantee the consistency of the optical system of the camera module with frame constraint effect when so that the components such as the driver 260 or the camera lens 230 being installed in the filter element microscope base 240 by prolonging wall 247 on described.Meanwhile it is described on prolong wall 247 and can protect mounted component, such as the lens assembly 2300 or the camera lens 230, prevent it is external it is unnecessary touch so that the driver 260 or the installation of the camera lens 230 are stablized.And external dust can be blocked and entered inside the camera module.
Further, when the camera module is a dynamic burnt camera module, the filter element microscope base 40 has an at least pin mouth, for the pin 261 across the driver 260.That is, 260 pin 261 of driver passes through the pin mouth when the driver 260 is installed in the limit chamber 461 of the filter element microscope base 40, it is electrically connected to the wiring board 12.
It is another variant embodiment of above preferred embodiment according to the present invention as shown in Figure 86 and Figure 87, wherein the top side of the integral base 211 has the raised step 2116 of an annular and the mounting groove 2115 positioned at 2116 inside of raised step, and making its top surface 2113 includes multi-stage stairs face.It in this embodiment, by taking two-stage step face as an example, that is, include First terrace 2113a and second step face 2113b.More specifically, the top surface 2113 of the integral base 211, which provides, is located at First terrace 2113a that the position of inside moves down using as first part's mounting surface, for installing the filter element microscope base 240, and the integral base 211, which provides, is located at the second step face 2113b positioned at 2116 top side of raised step in outside using as second part mounting surface, to be used to install the camera lens 230 or the lens assembly.In this embodiment, the second step face 2113b of 2116 top side of raised step is for installing the camera lens 230.
In this preferred embodiment of the invention, the further electronic component 2122 described in connecting line 223 described in one group of embedding and one group of the integral base 211, wherein the height H1 of these electronic components 2122 can be greater than the height H2 of these connecting lines 223, wherein the integral base 211 forms the mounting groove 2115 in top side and 1115 bottom side of the mounting groove is the First terrace 2113b, and the position First terrace 2113b can be where the height H2 of plane where the height H1 in the electronic component and the connecting line between plane.In other words, the position of the First terrace 2113b can be no more than the plane where the height H1 of the electronic component, not less than the plane where the height H2 of the connecting line, wherein the first step face 2113b supports the filter element microscope base 240 to make 240 position of filter element microscope base further sink, to which the position of the filter element 250 also correspondingly further sinks, and make the filter element microscope base 240 that the integral base 211 be cooperated to form the optical window 2111, passage of light is provided for the photosensitive element 220.
As shown in Figure 87, the connecting line 223 can be using just beating or back-hand craft, its height is generally between 0.27-0.32mm, the suitable height of the electronic component 2122 is generally in 0.38mm, described in this way electronic component 2122 space corresponding with the difference in height that the connecting line 223 is at least capable of providing 0.06mm, it is moved down for the innermost position the step surface 2113a of the top surface 2113 of the integral base 211, to make 240 position of filter element microscope base equipped with the filter element 250 further sink, to make the thickness of whole photosensory assembly further decrease, so that the thickness of the camera module is further reduced.
It can be understood that, the feature of the camera module in preferred embodiment shown in above-mentioned Figure 69 to Figure 87 is not limited in being applied to corresponding each embodiment, the mutual feature of the camera module i.e. in these embodiments can combine, and the present invention is not so limited in this respect.
It is the 25th preferred embodiment according to the present invention as shown in Figure 88 to 89, signal an array is taken the photograph As mould group.The array camera module includes multiple camera module monomers 2000, and each camera module monomer 2000 cooperates with each other, and realizes the acquisition of image.The array camera module can also be applied to various electronic equipments citing ground but be not limited to smart phone, wearable device, computer equipment, television set, the vehicles, camera, monitoring device etc., and the array camera module cooperates the electronic equipment to realize Image Acquisition and reproduction to target object.
It is worth mentioning that, for ease of description, in following embodiments of the invention and attached drawing, the array camera module constituted with two camera module monomers 2000, i.e. double take the photograph for array camera module is illustrated, and in the other embodiment of the present invention, the array camera module 2000 may include more monomers, such as three or three or more, each camera module monomer 2000 is arranged in array forms the array camera module.
It will also be appreciated that, the camera module of the camera module and mutual feature being composed and the camera module of equivalence enforcement in preferred embodiment shown in above-mentioned Figure 69 to Figure 87 all can serve as the camera module monomer 2100, for constituting the array camera module.
Specifically, the camera module monomer 2000 includes an integrated base assembly 210, a photosensitive element 220, a camera lens 230, a filter element microscope base 240 and a filter element 250, wherein the integral base component 210, the photosensitive element 220, the filter element microscope base 240 and the filter element 250 form a photosensory assembly.The integral base component 210 includes an integral base 211 and a wiring board 212,211 integral packaging of integral base is in the wiring board 212 and the photosensitive element 220, the filter element microscope base 240 is installed in the integral base 211, the microscope base or bracket of traditional camera module can be replaced to which the integral base 211 and the filter element microscope base 240 cooperate, and does not need to need microscope base or bracket being attached at wiring board by glue in similar traditional packaging process.The photosensitive element 220 is operatively connected to the wiring board 212.The photosensitive element 220 is electrically connected to the wiring board 212 of the integral base component 210, and the filter element microscope base 240 is installed in the integral base component 210, and the camera lens 230 is located at the photosensitive path of the photosensitive element 220.The integral base 211 has an optical window 2111 and forms a Base body 2112 of the optical window 2111, the optical window 111 is that the photosensitive element 220 provides passage of light, and the molding of Base body 2112 ground integral packaging is in the wiring board 212 and the photosensitive element 220.
The wiring board 212 includes a substrate 2121, and is formed in multiple electronic components 2122 of the substrate 2121, and the electronic component 2122 includes but is not limited to resistance, capacitor, driving element etc..In this embodiment in accordance with the invention, 211 integral packaging of integral base is in the substrate 2121, and is integrally coated on the electronic component 2122.And, in some embodiments, the electronic component 2122 is arranged at around the photosensitive element 220, and in various embodiments, the setting position of the electronic component 2122, which can according to need, is designed layout, for example it is set to side or two sides or more, the setting position of structure and the shape of the filter element microscope base 240 that can be connected with the setting position of the photosensitive element 220 and the photosensitive element 220 with the wiring board 212 match, thus more Adduction reason ground reduces the size of the camera module using the spatial position on the substrate 2122 as far as possible.The photosensitive element 220 has a photosensitive area 2201 and a non-photo-sensing area 2202, the non-photo-sensing area 2202 is surrounded on 2201 periphery of photosensitive area, and the integral base is integrally incorporated at least part non-photo-sensing area 2202 of the wiring board 212 and the photosensitive element 220.The filter element microscope base 240 has a support slot 241, and the filter element 250 is installed in the support slot 241, so that 250 position of the filter element moves down.
And, the photosensitive element 220 has one group of photosensitive element connector 221, the wiring board 212 has one group of wiring board connector 222, it is connected between the photosensitive element connector 221 and the wiring board connector 222 by one group of connecting line 223, the integral base 211 further embeds the photosensitive element connector 221, the wiring board connector 222 and the connecting line 223.
Each filter element microscope base 240 is supported in 211 top surface 2113 of integral base, and the filter element microscope base 240 cooperates the integral base 211, passage of light is provided for the photosensitive element 220, wherein the inward flange 21131 of the top surface 2113 of the integral base 211 is relative to the outer edge 2221 of the wiring board connector 222 more adjacent to the optical axis X of the camera module, to increase the area of the top surface 2113 of the integral base 211, to provide greater area of smooth mounting surface for the optical device above the camera module.The optical device that the smooth mounting surface can be used to install for example can be the filter element microscope base 240, the camera lens 230, lens assembly 2300.In the example of Figure 88, the smooth mounting surface that the area of the top surface 2113 of the integral base 211 provides is used to support the filter element microscope base 240, the driver 260 and the camera lens 230 form the lens assembly 2300 and are supported on the filter element microscope base 240, and the driver 260 is assembled in the filter element microscope base 240.
Further it will be understood that two camera module monomers 2000 can be camera module independent, i.e., its wiring board 212, integral base 211, filter element microscope base 240 are all separation.Two camera module monomers 2000 can also form the array camera module of integral structure.In the array camera module of integral structure, integral structure is formed by way of following one or more combinations: the wiring board 212 of two camera module monomers 2000 may be integrally formed and form disjunctor wiring board；Or the integral base 211 of two camera module monomers 2000 may be integrally formed and form conjoined base；Or the filter element microscope base 240 of two camera module monomers 2000 may be integrally formed and form disjunctor filter element microscope base.As shown in Figure 88 to Figure 89, in this embodiment of signal of the invention, two camera module monomers 2000 have disjunctor wiring board, conjoined base and disjunctor filter element microscope base.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating and being not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention has been shown in embodiment and explanation, and under without departing from the principle, embodiments of the present invention can have any deformation or modification.

Claims (60)

  1. One camera module characterized by comprising
    At least one integrated base assembly；
    An at least photosensitive element；
    An at least camera lens, wherein the camera lens is located at the photosensitive path of the photosensitive element；
    An at least filter element microscope base；With
    An at least filter element, the filter element are installed on the filter element microscope base；Wherein the integral base component includes an at least integral base and an at least wiring board, wherein the photosensitive element has at least one set of photosensitive element connector, there is the wiring board at least one set of wiring board connector, the photosensitive element connector and the wiring board connector to be connected by least one set of connecting line so that the photosensitive element is operatively connected to the wiring board；Wherein the filter element microscope base is supported at least part top surface of the integral base, and the filter element microscope base cooperates the integral base and forms an optical window, provides passage of light for the photosensitive element；Wherein the integral base integral packaging at least part non-photo-sensing area of the wiring board and the photosensitive element and embeds the photosensitive element connector, the wiring board connector and the connecting line, and make the distance between the inward flange of the top surface of the integral base and the optical axis of the camera module no more than the outer edge of the wiring board connector and the distance between the optical axis of the camera module, so that the top surface of the integral base provides greater area of mounting surface.
  2. Camera module according to claim 1, wherein the mounting surface that the top surface of the integral base provides is for installing the filter element microscope base.
  3. Camera module according to claim 1, wherein the mounting surface that the top surface of the integral base provides is for installing the filter element microscope base and the camera lens.
  4. Camera module according to claim 1, wherein the mounting surface that the top surface of the integral base provides is for installing the filter element microscope base and an at least driver, the lens assembling is in the driver.
  5. Camera module according to claim 1, wherein the mounting surface that the top surface of the integral base provides is for installing the filter element microscope base and an at least fixed lens barrel, the lens assembling is in the fixed lens barrel.
  6. Camera module according to claim 2, wherein the camera lens is supported on the filter element microscope base.
  7. Camera module according to claim 2, wherein the camera module further includes an at least driver, For the lens assembling in the driver, the driver is supported on the filter element microscope base；Or the camera module further includes an at least fixed lens barrel, for the lens assembling in the fixed lens barrel, the fixed lens barrel is supported on the filter element microscope base.
  8. Camera module according to claim 2, wherein the filter element microscope base has an at least support slot and at least one set of tankage in top side, the support slot is located at the inside of the assembling grove and for installing the filter element；Wherein the assembling grove is for installing the camera lens；Or the camera module further includes an at least driver, the lens assembling is in the driver, and the assembling grove is for installing the driver；Or the camera module further includes an at least fixed lens barrel, the lens assembling is in the fixed lens barrel, and the assembling grove is for installing the fixed lens barrel.
  9. According to claim 1 to any camera module in 8, wherein the top surface of the integral base is a plane, and the distance between the inward flange of the plane and the optical axis of the camera module are not more than the outer edge of the wiring board connector and the distance between the optical axis of the camera module.
  10. According to claim 1 to any camera module in 8, wherein the top surface of the integral base includes multiple step surfaces, wherein being located at the distance between the inward flange of the innermost step surface and the optical axis of the camera module no more than the outer edge of the wiring board connector and the distance between the optical axis of the camera module.
  11. Camera module according to claim 10, wherein the top surface of the integral base includes two step surfaces, First terrace positioned inside and the second step face positioned at outside, First terrace top side forms a mounting groove, to install the filter element microscope base, the distance between inward flange and the optical axis of the camera module of the First terrace are not more than the outer edge of the wiring board connector and the distance between the optical axis of the camera module.
  12. According to claim 1 to any camera module in 8, wherein the filter element be arranged at the filter element microscope base and make the outer edge of the filter element be located at the integral base the top surface the inward flange inside, to reduce the area of the filter element.
  13. According to claim 1 to any camera module in 8, wherein the inner surface of the filter element microscope base being located at below the filter element obliquely extends and has gradually big internal diameter towards the direction of photosensitive element described in adjacent part, the inner surface of the integral base, which obliquely extends and is directed away from the photosensitive direction, has gradually big internal diameter, so that the inner surface of the filter element microscope base and the inner surface of the integral base below the filter element match to form the veiling glare that inner chamfer structure reduces the arrival photosensitive element.
  14. According to claim 1, to any camera module in 8, wherein the wiring board includes a substrate and the multiple electronic components for being set to the substrate, the height of the multiple electronic component is greater than the connecting line Height, and wherein the integral base forms a mounting groove in top side and the mounting groove bottom side is a step surface, the step surface position is where plane where the height of the multiple electronic component and the height of the connecting line between plane, wherein the step surface supports the filter element microscope base to make filter element microscope base position sink.
  15. Camera module according to claim 14, wherein the top surface of the integral base includes two step surfaces, First terrace positioned inside and the second step face positioned at outside, the step surface of the mounting groove bottom side is the First terrace, and the filter element microscope base is installed, the distance between inward flange and the optical axis of the camera module of the First terrace are not more than the outer edge of the wiring board connector and the distance between the optical axis of the camera module
  16. According to claim 1 to any camera module in 8, wherein the filter element microscope base includes prolonging arm in a filter element microscope base main body and one, prolong arm in described inwardly integrally to extend from the inner surface of the filter element microscope base main body and form a support slot in the interior arm top side of prolonging, to install the filter element.
  17. Camera module according to claim 9, wherein the filter element microscope base includes prolonging arm in a filter element microscope base main body and one, prolong arm in described inwardly integrally to extend from the inner surface of the filter element microscope base main body and form a support slot in the interior arm top side of prolonging, to install the filter element.
  18. Camera module according to claim 10, wherein the filter element microscope base includes prolonging arm in a filter element microscope base main body and one, prolong arm in described inwardly integrally to extend from the inner surface of the filter element microscope base main body and form a support slot in the interior arm top side of prolonging, to install the filter element.
  19. Camera module according to claim 11, wherein the filter element microscope base includes prolonging arm in a filter element microscope base main body and one, prolong arm in described inwardly integrally to extend from the inner surface of the filter element microscope base main body and form a support slot in the interior arm top side of prolonging, to install the filter element
  20. According to claim 1 to any camera module in 8, wherein the filter element microscope base is including prolonging arm in a filter element microscope base main body, a sinking arm and one, direction of the sinking arm from the filter element microscope base main body towards the photosensitive element extends and forms the engaging groove for being engaged in the integral base on the outside of the sinking arm, prolong arm in described integrally to extend internally from the sinking arm and form a support slot in the interior arm top side of prolonging, to install the filter element.
  21. Camera module according to claim 9, wherein the filter element microscope base is including prolonging arm in a filter element microscope base main body, a sinking arm and one, direction of the sinking arm from the filter element microscope base main body towards the photosensitive element extends and forms the engaging groove for being engaged in the integral base on the outside of the sinking arm, prolong arm in described integrally to extend internally from the sinking arm and form a support slot in the interior arm top side of prolonging, with peace Fill the filter element.
  22. Camera module according to claim 10, wherein the filter element microscope base is including prolonging arm in a filter element microscope base main body, a sinking arm and one, direction of the sinking arm from the filter element microscope base main body towards the photosensitive element extends and forms the engaging groove for being engaged in the integral base on the outside of the sinking arm, prolong arm in described integrally to extend internally from the sinking arm and form a support slot in the interior arm top side of prolonging, to install the filter element.
  23. Camera module according to claim 11, wherein the filter element microscope base is including prolonging arm in a filter element microscope base main body, a sinking arm and one, direction of the sinking arm from the filter element microscope base main body towards the photosensitive element extends and forms the engaging groove for being engaged in the integral base on the outside of the sinking arm, prolong arm in described integrally to extend internally from the sinking arm and form a support slot in the interior arm top side of prolonging, to install the filter element.
  24. Camera module according to claim 16, wherein the interior inner surface for prolonging arm obliquely extends and has gradually big internal diameter towards the direction of photosensitive element described in adjacent part, the inner surface of the integral base, which obliquely extends and is directed away from the photosensitive direction, has gradually big internal diameter, so that the inner surface for the inner surface and the integral base for prolonging arm in described matches to form inner chamfer structure to reduce the veiling glare for reaching the photosensitive element.
  25. Camera module according to claim 20, wherein the interior inner surface for prolonging arm obliquely extends and has gradually big internal diameter towards the direction of photosensitive element described in adjacent part, the inner surface of the integral base, which obliquely extends and is directed away from the photosensitive direction, has gradually big internal diameter, so that the inner surface for the inner surface and the integral base for prolonging arm in described matches to form inner chamfer structure to reduce the veiling glare for reaching the photosensitive element.
  26. Camera module according to claim 1, wherein the filter element microscope base includes an at least retention bead, the retention bead upwardly extends raisedly in the top side of the filter element microscope base, a driver or a fixed lens barrel for the camera lens or a lens assembly is limited in the outside of the retention bead and is supported by the integral base, wherein in the lens assembly, the lens assembling is in the driver or the fixed lens barrel.
  27. Camera module according to claim 1, wherein the filter element microscope base includes Yan Bi on one, the upper Yan Bi forms a limit chamber, a driver of the camera lens or a lens assembly or a fixed lens barrel to be limited to the inside in the upper Yan Bi and supported by the filter element microscope base, wherein in the lens assembly, the lens assembling is in the driver or the fixed lens barrel.
  28. Camera module according to claim 1, wherein the top side of the integral base is along its circular direction With one or more notches, the filter element microscope base main body of the filter element microscope base includes one or more extensions, and the extension extends to the corresponding notch so that the filter element microscope base and the integral base form enclosed environment.
  29. According to claim 1 to any camera module in 8, it wherein further include an at least supporting member, the supporting member includes the bearing main body of a frame shape, the bearing main body coats at least part in the non-photo-sensing region of the photosensitive element, and the integral base is further integrally packaged in the supporting member.
  30. One electronic equipment characterized by comprising
    One electronic device body；With
    One according to claim 1 to any one or more camera modules in 29, and each camera module is arranged at the electronic device body.
  31. Electronic equipment according to claim 30, wherein the electronic equipment is combination: smart phone, wearable device, computer equipment, television set, the vehicles, camera, one of them in monitoring device.
  32. The photosensory assembly of one camera module characterized by comprising
    At least one integrated base assembly；
    An at least photosensitive element；
    An at least filter element microscope base；With
    An at least filter element, the filter element are installed on the filter element microscope base；Wherein the integral base component includes an at least integral base and an at least wiring board, wherein the photosensitive element has at least one set of photosensitive element connector, there is the wiring board at least one set of wiring board connector, the photosensitive element connector and the wiring board connector to be connected by least one set of connecting line so that the photosensitive element is operatively connected to the wiring board；Wherein the filter element microscope base is supported at least part top surface of the integral base, and the filter element microscope base cooperates the integral base and forms an optical window, provides passage of light for the photosensitive element；Wherein the integral base integral packaging at least part non-photo-sensing area of the wiring board and the photosensitive element and embeds the photosensitive element connector, the wiring board connector and the connecting line, and make the distance between the inward flange of the top surface of the integral base and the optical axis of the photosensory assembly no more than the outer edge of the wiring board connector and the distance between the optical axis of the photosensory assembly, so that the top surface of the integral base provides greater area of mounting surface.
  33. Photosensory assembly according to claim 32, wherein the mounting surface that the top surface of the integral base provides is for installing the filter element microscope base.
  34. Photosensory assembly according to claim 32, wherein what the top surface of the integral base provided The mounting surface is used to install an at least camera lens for the filter element microscope base He the camera module.
  35. Photosensory assembly according to claim 32, wherein the mounting surface that the top surface of the integral base provides is used to install an at least driver for the filter element microscope base He the camera module, the lens assembling is in the driver.
  36. Photosensory assembly according to claim 32, wherein the mounting surface that the top surface of the integral base provides is used to install an at least fixed lens barrel for the filter element microscope base He the camera module, the lens assembling is in the fixed lens barrel.
  37. Photosensory assembly according to claim 33, wherein a camera lens of the camera module is suitable for being supported on the filter element microscope base.
  38. Photosensory assembly according to claim 33, wherein the camera module further includes an at least driver, and for a lens assembling in the driver, which is supported on the filter element microscope base；Or the camera module further includes an at least fixed lens barrel, for the lens assembling in the fixed lens barrel, which is supported on the filter element microscope base.
  39. Photosensory assembly according to claim 33, wherein the filter element microscope base has an at least support slot and at least one set of tankage in top side, the support slot is located at the inside of the assembling grove and for installing the filter element；Wherein the assembling grove is for installing a camera lens；Or the camera module further includes an at least driver, a lens assembling is in the driver, and the assembling grove is for installing the driver；Or the camera module further includes an at least fixed lens barrel, a lens assembling is in the fixed lens barrel, and the assembling grove is for installing the fixed lens barrel.
  40. According to the photosensory assembly any in claim 32 to 39, wherein the top surface of the integral base is a plane, and the distance between the inward flange of the plane and the optical axis of the photosensory assembly are not more than the outer edge of the wiring board connector and the distance between the optical axis of the photosensory assembly.
  41. According to the photosensory assembly any in claim 32 to 39, wherein the top surface of the integral base includes multiple step surfaces, wherein being located at the distance between the inward flange of the innermost step surface and the optical axis of the photosensory assembly no more than the outer edge of the wiring board connector and the distance between the optical axis of the photosensory assembly.
  42. Photosensory assembly according to claim 41, wherein the top surface of the integral base includes two step surfaces, First terrace positioned inside and the second step face positioned at outside, First terrace top side forms a mounting groove, to install the filter element microscope base, the distance between inward flange and the optical axis of the photosensory assembly of the First terrace are not more than the outer edge of the wiring board connector and the distance between the optical axis of the photosensory assembly.
  43. According to the photosensory assembly any in claim 32 to 39, wherein the filter element be arranged at the filter element microscope base and make the outer edge of the filter element be located at the integral base the top surface the inward flange inside, to reduce the area of the filter element.
  44. According to the photosensory assembly any in claim 32 to 39, wherein the inner surface of the filter element microscope base being located at below the filter element obliquely extends and has gradually big internal diameter towards the direction of photosensitive element described in adjacent part, the inner surface of the integral base, which obliquely extends and is directed away from the photosensitive direction, has gradually big internal diameter, so that the inner surface of the filter element microscope base and the inner surface of the integral base below the filter element match to form inner chamfer structure to reduce the veiling glare for reaching the photosensitive element.
  45. According to the photosensory assembly any in claim 32 to 39, wherein the wiring board includes a substrate and the multiple electronic components for being set to the substrate, the height of the multiple electronic component is greater than the height of the connecting line, and wherein the integral base forms a mounting groove in top side and the mounting groove bottom side is a step surface, the step surface position is where plane where the height of the multiple electronic component and the height of the connecting line between plane, wherein the step surface supports the filter element microscope base to make filter element microscope base position sink.
  46. Photosensory assembly according to claim 45, wherein the top surface of the integral base includes two step surfaces, First terrace positioned inside and the second step face positioned at outside, the step surface of the mounting groove bottom side is the First terrace, and the filter element microscope base is installed, the distance between inward flange and the optical axis of the photosensory assembly of the First terrace are not more than the outer edge of the wiring board connector and the distance between the optical axis of the photosensory assembly
  47. According to the photosensory assembly any in claim 32 to 39, wherein the filter element microscope base includes prolonging arm in a filter element microscope base main body and one, prolong arm in described inwardly integrally to extend from the inner surface of the filter element microscope base main body and form a support slot in the interior arm top side of prolonging, to install the filter element.
  48. Photosensory assembly according to claim 40, wherein the filter element microscope base includes prolonging arm in a filter element microscope base main body and one, prolong arm in described inwardly integrally to extend from the inner surface of the filter element microscope base main body and form a support slot in the interior arm top side of prolonging, to install the filter element.
  49. Photosensory assembly according to claim 41, wherein the filter element microscope base includes prolonging arm in a filter element microscope base main body and one, prolong arm in described inwardly integrally to extend from the inner surface of the filter element microscope base main body and form a support slot in the interior arm top side of prolonging, to install the filter element.
  50. Photosensory assembly according to claim 42, wherein the filter element microscope base includes prolonging arm in a filter element microscope base main body and one, it is described in prolong arm and inwardly integrally prolong from the inner surface of the filter element microscope base main body It stretches and forms a support slot in the interior arm top side of prolonging, to install the filter element
  51. According to the photosensory assembly any in claim 32 to 39, wherein the filter element microscope base is including prolonging arm in a filter element microscope base main body, a sinking arm and one, direction of the sinking arm from the filter element microscope base main body towards the photosensitive element extends and forms the engaging groove for being engaged in the integral base on the outside of the sinking arm, prolong arm in described integrally to extend internally from the sinking arm and form a support slot in the interior arm top side of prolonging, to install the filter element.
  52. Photosensory assembly according to claim 40, wherein the filter element microscope base is including prolonging arm in a filter element microscope base main body, a sinking arm and one, direction of the sinking arm from the filter element microscope base main body towards the photosensitive element extends and forms the engaging groove for being engaged in the integral base on the outside of the sinking arm, prolong arm in described integrally to extend internally from the sinking arm and form a support slot in the interior arm top side of prolonging, to install the filter element.
  53. Photosensory assembly according to claim 41, wherein the filter element microscope base is including prolonging arm in a filter element microscope base main body, a sinking arm and one, direction of the sinking arm from the filter element microscope base main body towards the photosensitive element extends and forms the engaging groove for being engaged in the integral base on the outside of the sinking arm, prolong arm in described integrally to extend internally from the sinking arm and form a support slot in the interior arm top side of prolonging, to install the filter element.
  54. Photosensory assembly according to claim 42, wherein the filter element microscope base is including prolonging arm in a filter element microscope base main body, a sinking arm and one, direction of the sinking arm from the filter element microscope base main body towards the photosensitive element extends and forms the engaging groove for being engaged in the integral base on the outside of the sinking arm, prolong arm in described integrally to extend internally from the sinking arm and form a support slot in the interior arm top side of prolonging, to install the filter element.
  55. Photosensory assembly according to claim 47, wherein the interior inner surface for prolonging arm obliquely extends and has gradually big internal diameter towards the direction of photosensitive element described in adjacent part, the inner surface of the integral base, which obliquely extends and is directed away from the photosensitive direction, has gradually big internal diameter, so that the inner surface for the inner surface and the integral base for prolonging arm in described matches to form inner chamfer structure to reduce the veiling glare for reaching the photosensitive element.
  56. Photosensory assembly according to claim 51, wherein the interior inner surface for prolonging arm obliquely extends and has gradually big internal diameter towards the direction of photosensitive element described in adjacent part, the inner surface of the integral base, which obliquely extends and is directed away from the photosensitive direction, has gradually big internal diameter, so that the inner surface for the inner surface and the integral base for prolonging arm in described matches to form inner chamfer structure to reduce and reach the photosensitive element Veiling glare.
  57. Photosensory assembly according to claim 32, wherein the filter element microscope base includes an at least retention bead, the retention bead upwardly extends raisedly in the top side of the filter element microscope base, a driver or a fixed lens barrel for one camera lens or a lens assembly is limited in the outside of the retention bead and is supported by the integral base, wherein in the lens assembly, the lens assembling is in the driver or the fixed lens barrel.
  58. Photosensory assembly according to claim 32, wherein the filter element microscope base includes Yan Bi on one, the upper Yan Bi forms a limit chamber, a driver of a camera lens or a lens assembly or a fixed lens barrel to be limited to the inside in the upper Yan Bi and supported by the filter element microscope base, wherein in the lens assembly, the lens assembling is in the driver or the fixed lens barrel.
  59. Photosensory assembly according to claim 32, wherein the top side of the integral base has one or more notches along its circular direction, the filter element microscope base main body of the filter element microscope base includes one or more extensions, and the extension extends to the corresponding notch so that the filter element microscope base and the integral base form enclosed environment.
  60. According to the photosensory assembly any in claim 32 to 39, it wherein further include an at least supporting member, the supporting member includes the bearing main body of a frame shape, the bearing main body coats at least part in the non-photo-sensing region of the photosensitive element, and the integral base is further integrally packaged in the supporting member.
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CN201610668807.1A CN107734215B (en) 2016-08-12 2016-08-12 Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment
CN2016106688071 2016-08-12
CN2016211245098 2016-10-14
CN201621124509.8U CN206725922U (en) 2016-10-14 2016-10-14 Camera module based on integral packaging technique
CN2016211249648 2016-10-14
CN201621124964.8U CN206696574U (en) 2016-10-14 2016-10-14 Camera module based on integral packaging technique
CN2016211244042 2016-10-14
CN201610898430.9A CN107957649A (en) 2016-10-14 2016-10-14 Camera module and array camera module based on integral packaging technique
CN2016108984309 2016-10-14
CN201621124404.2U CN206725921U (en) 2016-10-14 2016-10-14 Array camera module based on integral packaging technique
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