CN107682591B

CN107682591B - Camera module, molded photosensitive assembly thereof and manufacturing method

Info

Publication number: CN107682591B
Application number: CN201610622330.3A
Authority: CN
Inventors: 王明珠; 陈振宇; 郭楠; 田中武彦; 赵波杰
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2016-08-01
Filing date: 2016-08-01
Publication date: 2020-07-24
Anticipated expiration: 2036-08-01
Also published as: CN107682596A; CN107682591A; CN110650273B; CN110650273A; CN107682596B

Abstract

The invention provides a camera module, a molding photosensitive assembly and a manufacturing method thereof, wherein the molding photosensitive assembly comprises a circuit board, a photosensitive element and a molding base, wherein the molding base is integrated with the circuit board and the photosensitive element through a molding process, the molding base forms an optical window, the optical window corresponds to the photosensitive element in position, and the section of the optical window is in a trapezoid or multi-step shape gradually enlarged from bottom to top, so that the demolding is facilitated, the damage to the molding base is prevented, the stray light is avoided, and the damage to a lead connecting the photosensitive element and the circuit board in the molding process is prevented.

Description

Camera module, molded photosensitive assembly thereof and manufacturing method

Technical Field

The invention relates to the field of camera modules, in particular to a camera module manufactured by a molding process, a forming die and a manufacturing method thereof.

Background

The camera module is one of the parts of the intelligent electronic device that cannot be obtained, such as but not limited to a smart phone, a camera, a computer device, a wearable device, and the like. And along with the continuous development and the popularization of various smart machines, the requirement to the module of making a video recording is also higher and higher.

In recent years, the development of intelligent electronic devices has been rapidly increased, and the smart electronic devices are increasingly light and thin, and the camera module is adapted to the development of the smart electronic devices, and is also increasingly required to be multifunctional, light, thin and small, so that the smart electronic devices can be thinner and thinner, and the imaging requirements of the smart electronic devices on the camera module can be met. Therefore, manufacturers of camera modules are continuously dedicated to designing and manufacturing camera modules satisfying these requirements.

The molding packaging technology is a packaging technology which is newly developed on the basis of the traditional COB packaging technology. As shown in fig. 1A, the circuit board is packaged by using the conventional integrated packaging technology. In the structure, the packaging part 1 is packaged in the circuit board 2 and the photosensitive chip 3 in an integrated packaging mode, and the electronic component on the circuit board and the lead of the electric connection chip and the circuit board are coated, so that the space occupied by the electronic component of the camera module is reduced, the size of the camera module can be reduced, and the problem that dust attached to the electronic component influences the imaging quality of the camera module is solved.

Compared with the traditional bracket type COB packaging technology, the packaging technology has more advantages theoretically, but the packaging technology only stays in a theoretical or manual experiment stage for a period of time, is not well implemented, is not put into practical production for quantitative production, and has the following aspects.

First, the one-piece packaging technology is a well-known technology in other large-scale industrial fields, but is a new application in the field of camera modules, and different industries need different objects to be produced by molding, and different problems are faced. Taking smart mobile phone as an example, the organism is more and more frivolous, so thickness is less and less, consequently requires the module of making a video recording to reach such thickness as well, just can not increase the whole thickness of cell-phone, and it can be imagined that the part in the module of making a video recording all processes at a less size grade, therefore the ideal structure of design but can not produce through conventional mode. In the above structure, it is usually necessary to form a through hole through the package portion 1 to provide a light path for the photosensitive chip 3 on the circuit board 2, and the through hole is usually designed to be a vertical square column shape. That is, this technique is only in the manual trial stage, but cannot be put into practical production. More specifically, the packaging process requires a forming mold, and referring to fig. 1B and 1C, when the forming block 4 of the upper mold of the forming mold is in a vertical square column shape, in the forming process, at the position where the upper mold contacts with the formed packaging part, when the mold is separated from the molding material, because the bottom of the upper mold is in a sharp edge shape, the mold will affect the shape of the molded packaging part 1 in the process of being pulled out, so that the molded packaging part 1 is deformed, such as a flash, and in addition, when the upper mold is pulled out and separated from the packaging part, the outer side surface of the upper mold forming block 4 always generates a large friction force with the packaging part 1, so that the packaging part 1 may be damaged, and this effect may be ignored in the large industrial field, but becomes a crucial influencing factor in the small-size fine-scale production field of camera modules, so the theoretical structure of the vertical square column shape of the through hole is feasible, but is not suitable for mass production.

Secondly, the camera module is an optical electronic device, and light is an important factor for determining the imaging quality. Referring to fig. 1D, in traditional support equipment mode, electronic components's installation space 6 need be reserved to support 5 of installing on the circuit board, consequently forms the indent space, and the existence in this space has improved the size of the module of making a video recording, but the light incidence back, and direct irradiation in the support inner wall is few very few, therefore the reflection light of support inner wall is less, can not influence the imaging quality of the module of making a video recording. When the support is replaced by the conventional square-column-shaped packaging part 1, referring to fig. 1E, compared to the support structure, after light rays with the same incident angle enter the lens, reflected light rays are not generated in the support structure, but act on the inner wall of the packaging part 1 in the integrally packaged structure, and the reflected light rays easily reach the photosensitive chip 3, so that the influence of stray light is increased, the imaging quality of the camera module is reduced, and therefore, the structure of the through hole formed in the packaging part 1 and having the square column shape is not suitable for being applied in terms of optical imaging quality.

Finally, when the camera module is assembled, the package portion 1 usually needs to be mounted with components such as a lens or a motor, and therefore the package portion 1 needs to satisfy a certain structural strength, and therefore, when the shape of the package portion 1 is set, the package portion 1 needs to be designed by considering a plurality of aspects such as luminous flux, structural strength, light reflectivity, convenience in mold release, and prevention of damage to the package portion 1 from mold release, and obviously, the conventional structure of the package portion 1 does not consider these factors in combination.

Disclosure of Invention

The invention aims to provide a camera module, a molding photosensitive component and a manufacturing method thereof, wherein the camera module comprises the molding photosensitive component formed by a molding process, and the molding photosensitive component can be subjected to large-scale mass production experiments through the molding process by a forming mold.

The invention aims to provide a camera module, a molding photosensitive assembly and a manufacturing method thereof, wherein the molding photosensitive assembly comprises a circuit board, a photosensitive element and a molding base integrally formed on the circuit board and the photosensitive element, and the molding base forms an optical window, wherein the optical window is not in a square column shape in the prior art, so that in the manufacturing process, the damage of an optical window molding block of a molding die to the molding base is reduced, and the optical window molding block is convenient to pull out.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof and a manufacturing method thereof, wherein a first inclined angle which is acute and facilitates mold release is formed between at least a portion of the molded base integrally extending from the photosensitive element and an optical axis direction, and after the molded base is formed by a molding process, the optical window forming block can be smoothly pulled out, and friction with the molded base is reduced, so that the molded base can be kept as it is as possible, and influence caused when the optical window forming block is pulled out is reduced.

An object of the present invention is to provide a camera module, a molded photosensitive component thereof and a manufacturing method thereof, wherein an included angle between at least a portion of an inner side surface of the molded base integrally extending from a top surface of the photosensitive element and an optical axis of the molded base is defined as the first inclination angle, so that light incident to the inner side surface is not easy to reach the photosensitive element, and influence of stray light on imaging quality is reduced.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof and a method for manufacturing the same, wherein an angle between at least one of outer sides of a mold base and a direction of an optical axis is an acute angle, i.e., a second inclination angle, which facilitates mold release, and when a partition block of the mold is pulled out of the mold base during manufacturing by the mold, friction between the partition block of the mold and the outer side of the mold base is reduced, so that the outer side of the mold base is kept as original as possible, and the partition block of the mold is easily pulled out.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof and a manufacturing method thereof, wherein the inner side of the molding base is sequentially provided with a first part inner side surface extending from the photosensitive element in an inclined manner, a second part inner side surface extending from the first part inner side surface, and a third part inner side surface extending from the second part inner side surface in an inclined manner, and an included angle between the third part inner side surface and the optical axis is defined as a third inclined angle which is convenient for demolding, so that when an optical window molding block of the molding die is pulled out, friction between the base of the optical window molding block and the inner side of the top end of the molding base is reduced, the second part inner side surface of the molding base is kept as original as possible, and the molding die of the molding die is easily pulled out.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof, and a method of manufacturing the same, in which the first inclination angle is within a predetermined range, pulling out is facilitated, and a lead connecting the photosensitive element and the circuit board is not damaged.

It is an object of the present invention to provide a camera module, a molded photosensitive assembly thereof and a method of manufacturing the same, wherein the bottom side of the molding die is generally provided with an elastic film layer, and the angles of inclination are not at right angles, so as to prevent the film layer from being punctured.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof and a method for manufacturing the same, wherein the molded base has a top side surface, and the first, second and third inclination angles are within a predetermined range, so as to facilitate the extraction of the optical window forming block and the separating block, and not to make the top side surface too small to provide a stable mounting area for a driver or a lens.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof and a manufacturing method thereof, wherein the angles of the first, second and third tilt angles are within a predetermined range, so as to facilitate the extraction of the optical window forming block, and provide a stable mounting area for the optical filter or the optical filter lens holder.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof, and a method of manufacturing the same, wherein the molded base forms an optical window with a slope, increasing the light flux, and meeting the requirements of the field of view and the range of angular incidence of the photosensitive element.

An object of the present invention is to provide a camera module, a molded photosensitive member thereof, and a method of manufacturing the same, in which each of the draft angles is set to a predetermined angle range, thereby ensuring structural strength and light reflectance of the molding and reducing mold release friction.

In order to achieve at least one of the above objects, an aspect of the present invention provides a molded photosensitive device, a molded photosensitive device applied to a camera module, including at least a circuit board, at least a photosensitive element, and at least a molded base, the molded base is integrally combined with the circuit board and the photosensitive element by a molding process, wherein the molded base forms at least a light window corresponding to the photosensitive element, and at least a portion of an inner side surface of the molded base integrally extending from the photosensitive element extends in an inclined manner.

In some embodiments, an included angle between the at least a portion of the inner side surface of the mold base and an optical axis line of the camera module is 10 ° to 80 °.

In some embodiments, the molding base has an inner side surface linearly extending integrally from a non-photosensitive region of a top surface of the photosensitive element, such that all inner side surfaces of the molding base extend in an inclined manner, and an inclined angle α is provided between the inner side surface of the molding base and an optical axis line of the camera module for facilitating mold release and avoiding stray light, wherein α is in a range of 10 ° to 80 °, such as selected from 10 ° to 30 °, 30 ° to 45 °, 45 ° to 55 °, or 55 ° to 80 °.

In some embodiments, the photosensitive element and the circuit board are electrically connected through a set of leads, wherein the leads are wire-bonded from the photosensitive element to the circuit board, and α has a value selected from 10 ° to 55 °.

In some embodiments, the photosensitive element and the circuit board are electrically connected through a set of leads, wherein the leads are wired in a manner that α has a value selected from 10 ° to 88 ° when the leads are directed from the circuit board to the photosensitive element.

In some embodiments, the mold base has an outer side surface linearly extending integrally from the circuit board, wherein an inclined angle γ facilitating mold release is provided between the outer side surface of the mold base and an optical axis line of the camera module, and γ ranges from 3 ° to 45 °. Such as from 3 to 15, from 15 to 30, or from 30 to 45.

In some embodiments, the molding base has a top groove at the top end, the molding base has an inner side surface extending in a bending way, and the molding base comprises a first part inner side surface, a second part inner side surface and a third part inner side surface which are sequentially and integrally extended, the first part inner side surface integrally and obliquely extends to a non-photosensitive area of a top surface of the photosensitive element, the third part inner side surface integrally and obliquely extends to the second part inner side surface, and the second part inner side surface and the third part inner side surface define and form the top groove.

In some embodiments, the first portion inner side surface and the optical axis line of the camera module have an inclination angle α for facilitating demolding and avoiding stray light, wherein α is in a range of 10 ° to 80 °, and the third portion inner side surface and the optical axis line of the camera module have an inclination angle β for facilitating demolding and avoiding stray light, wherein β is in a range of 3 ° to 30 °.

In some embodiments, the value of α is selected from the group consisting of 10 ° to 30 °, 30 ° to 45 °, 45 ° to 55 °, or 55 ° to 80 °, wherein the value of β is selected from the group consisting of 3 ° to 15 °, 15 ° to 20 °, or 20 ° to 30 °.

In some embodiments, the second portion inner side surface is based parallel to the top surface of the photosensitive element.

In some embodiments, the molded photosensitive component further comprises one or more driver pin grooves, wherein a pin groove wall surface defining each driver pin groove and an optical axis line of the camera module have a slant angle between them for facilitating demolding, and the size of the slant angle is in a range of 3 ° to 30 °.

In some embodiments, the molded photosensitive assembly further includes at least one optical filter, the optical filter is stacked with the photosensitive element, and the molding base is integrally formed on the optical filter, the photosensitive element and the circuit board.

In some embodiments, the substrate of the circuit board is left with a pressing distance W for facilitating pressing of at least one separation block of a forming mold in a molding process, which is in a range of 0.1 to 0.6mm, outside at least one outer peripheral surface of the outer side surface of the molding base.

In some embodiments, the material surface of the mold base has a reflectance of less than 5% at a light wavelength range of 435- & 660 nm.

The section of the light window is in a trapezoid or multi-step shape gradually enlarged from bottom to top, so that demolding is facilitated, damage to a molding base is prevented, stray light is avoided, and damage to the lead wire connecting the photosensitive element and the circuit board in a molding process is prevented.

The invention also provides a camera module which comprises at least one lens and the at least one molded photosensitive assembly, wherein the molded photosensitive assembly comprises at least one circuit board, at least one photosensitive element and at least one molded base, the molded base is integrally combined with the circuit board and the photosensitive element through a molding process, the molded base forms at least one optical window, the optical window provides a light path for the photosensitive element and the lens, and at least one part of the inner side surface of the molded base integrally extending from the photosensitive element extends in an inclined manner.

In some embodiments, the molded photosensitive assembly further includes at least one optical filter, the optical filter is stacked with the photosensitive element, and the molding base is integrally formed on the optical filter, the photosensitive element and the circuit in a packaging manner.

In some embodiments, the optical filter is mounted on the top end of the molding base.

In some embodiments, it further comprises at least one filter mounted to the top-side recess of the mold base.

In some embodiments, the optical filter module further comprises at least one filter base and at least one filter, wherein the filter is mounted on the filter base, and the filter base is mounted at the top end of the molding base.

In some embodiments, it further comprises at least one driver mounted to a top side of the mold base such that the mold base supports the driver, wherein the lens is mounted within the driver to achieve auto-focus.

In some embodiments, the molding device further comprises at least one blocking element in a ring shape to prevent molding material from reaching a photosensitive region of the photosensitive element during the molding process.

In some embodiments, a plurality of the camera modules are assembled into an array of camera modules.

In some embodiments, the molded photosensitive assembly includes a plurality of the photosensitive elements and has a plurality of the optical windows, thereby forming an array camera module with a plurality of the lenses.

The invention also provides electronic equipment which comprises one or more camera modules. Including, but not limited to, cell phones, computers, televisions, smart wearable devices, vehicles, cameras, and surveillance equipment.

The invention also provides a forming die, which is applied to manufacturing at least one molding photosensitive assembly of at least one camera module and comprises a first die and a second die which can be separated or closed, wherein the first die and the second die form at least one forming cavity when being closed, the forming die is provided with at least one optical window forming block and a base forming guide groove positioned around the optical window forming block in the forming cavity, when at least one circuit board connected with at least one photosensitive element is installed in the forming cavity, a molding material filled into the base forming guide groove undergoes a liquid-to-solid conversion process under the action of temperature control to be cured and formed, a molding base is formed at a position corresponding to the base forming guide groove, an optical window of the molding base is formed at a position corresponding to the optical window forming block, and the molding base is integrally formed on the circuit board and at least one part of non-photosensitive areas of the photosensitive element to form a molding base And forming the molding photosensitive assembly of the camera module.

In some embodiments, the light window shaping block has an obliquely extending base inner side shaping surface along its periphery for forming an integral linearly extending inner side of the molding base.

In some embodiments, the base inner side surface molding surface of the light window molding block has an inclination angle with the vertical line, which is convenient for demolding, wherein α is in the size range of 10-80 °.

In some embodiments, the light window shaping block includes a press head portion and a groove shaping portion integrally extending from the press head portion, the groove shaping portion having a larger inner diameter than the press head portion for forming a top side groove at a top side of the molding base.

In some embodiments, the pressing head portion has an inclination angle α between an outer side surface of the pressing head portion along the outer periphery thereof and the vertical line, which facilitates demolding and avoids stray light, wherein α ranges from 10 degrees to 80 degrees, the groove forming portion has an inclination angle β between the outer side surface of the groove forming portion along the outer periphery thereof and the vertical line, wherein β ranges from 3 degrees to 30 degrees, the photosensitive element and the circuit board are in conductive connection through a set of leads, wherein the leads are wire bonded in a manner that the leads face the circuit board from the photosensitive element, α is selected from 10 degrees to 55 degrees, and the leads are wire bonded in a manner that α is selected from 10 degrees to 88 degrees.

In some embodiments, the first mold further comprises at least one spacer block having a base outer surface forming surface with an inclination angle γ from the vertical to facilitate demolding, the value of γ being selected from 3 ° to 45 °.

Drawings

FIG. 1A is a schematic diagram of a prior art packaged photosensitive device.

Fig. 1B is a schematic diagram of a conventional photosensitive assembly forming process.

FIG. 1C is a schematic diagram of a demolding process of a photosensitive assembly in a conventional integrated packaging process

Fig. 1D is a schematic view of a light path of a camera module packaged in a conventional COB manner.

Fig. 1E is a schematic view of an optical path of a conventional camera module in an integrated package manner.

Fig. 2 is a block diagram schematically showing an apparatus for manufacturing a molded photosensitive member of a camera module according to a first preferred embodiment of the present invention.

Fig. 3A is a schematic exploded perspective view of a camera module according to a first preferred embodiment of the present invention.

Fig. 3B is a sectional view of the camera module according to the above first preferred embodiment of the present invention, taken along the length direction thereof.

Fig. 4 is a perspective view of a molded photosensitive member of the camera module according to the first preferred embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view of the molded photosensitive assembly of the camera module according to the first preferred embodiment of the present invention taken along the line a-a in fig. 4.

Fig. 6 is a partially enlarged schematic view illustrating the mold-release facilitating inclination angle of the molded photosensitive member of the camera module according to the above-described first preferred embodiment of the present invention.

Fig. 7 is a schematic view of the camera module according to the first preferred embodiment of the present invention for avoiding stray light.

Fig. 8A is a sectional view showing when a liquid molding material is pushed into the base molding guide groove in the molding die of the molded photosensitive member according to the above-described first preferred embodiment of the present invention, wherein the sectional view is a sectional view corresponding to the direction of line a-a shown in fig. 4.

Fig. 8B illustrates a cross-sectional view, corresponding to the direction of line a-a in fig. 4, of the molding base formed by performing a molding step in the molding die of the manufacturing apparatus of the molded photosensitive member according to the above-described first preferred embodiment of the present invention.

FIG. 8C is a schematic view of the process of releasing the molded photosensitive member according to the above-described first preferred embodiment of the present invention after molding.

FIG. 9 is a schematic structural diagram illustrating another modified embodiment of the molded photosensitive assembly according to the above first preferred embodiment of the present invention.

Fig. 10 is a perspective exploded view of a camera module according to a second preferred embodiment of the present invention.

Fig. 11 is a sectional view of the camera module according to the second preferred embodiment of the present invention taken along the length direction thereof.

Fig. 12 is a cross-sectional view of a modified embodiment of the camera module according to the second preferred embodiment of the present invention.

Fig. 13 is a perspective view of a molded photosensitive member of the camera module according to the second preferred embodiment of the present invention.

Fig. 14 is a schematic sectional view of the molded photosensitive member of the camera module according to the second preferred embodiment of the present invention taken along the line C-C in fig. 13.

Fig. 15 is a partially enlarged schematic view illustrating the mold-release facilitating inclination angle of the molded photosensitive member of the camera module according to the above-described second preferred embodiment of the present invention.

Fig. 16 is a sectional view showing a liquid molding material pushed into the base panel forming guide grooves in the molding die of the molded photosensitive element according to the second preferred embodiment of the present invention, wherein the sectional view is a sectional view corresponding to the direction of line C-C shown in fig. 13.

Fig. 17 is a sectional view showing a liquid molding material pushed into the base panel forming guide grooves in the molding die of the molded photosensitive element according to the second preferred embodiment of the present invention, wherein the sectional view is a sectional view corresponding to the direction of line C-C shown in fig. 13.

Fig. 18 is a sectional view corresponding to the direction of line E-E in fig. 13, illustrating a molding step performed in the molding mold of the molded photosensitive element according to the second preferred embodiment of the present invention to form a molded base panel.

FIG. 19 is a schematic view of the process of releasing the molded photosensitive member according to the above-described second preferred embodiment of the present invention after molding.

FIG. 20 is a perspective view of the molded panel of photosensitive elements made by the molding process according to the second embodiment of the present invention.

FIG. 21 is a schematic structural diagram of a single molded photosensitive element obtained by cutting the molded plate according to the second embodiment of the present invention.

Fig. 22 is a sectional view of the molded photosensitive member according to another modified embodiment of the above second embodiment of the present invention.

Fig. 23 is a schematic cross-sectional view of a camera module according to a further variant of the second preferred embodiment of the invention.

Fig. 24 is a schematic cross-sectional view of a camera module according to a further variant of the second preferred embodiment of the invention.

Fig. 25 is a schematic structural diagram of the camera module according to the present invention applied to a mobile phone.

FIG. 26 is a partially enlarged schematic view illustrating the draft angle for facilitating demolding of the first example of the molded photosensitive member made by the molding process according to the above-described second embodiment of the present invention.

FIG. 27 is an enlarged partial schematic view illustrating the draft angle for facilitating demolding of a second example of the molded photosensitive member made by the molding process according to the second embodiment of the present invention described above.

FIG. 28 is a partially enlarged schematic view illustrating the draft angle for facilitating demolding of a third example of the molded photosensitive member made by the molding process according to the above-described second embodiment of the present invention.

FIG. 29 is a partially enlarged schematic view illustrating the draft angle for facilitating demolding of a fourth example of the molded photosensitive member made by the molding process according to the above-described second embodiment of the present invention.

FIG. 30 is a partially enlarged schematic view illustrating the draft angle for facilitating demolding of a fifth example of the molded photosensitive member made by the molding process according to the above-described second embodiment of the present invention.

FIG. 31 is a partially enlarged schematic view illustrating a draft angle for facilitating demolding of a sixth example of the molded photosensitive member made by the molding process according to the above-described second embodiment of the present invention.

FIG. 32 is a partially enlarged schematic view illustrating a seventh exemplary draft-facilitating oblique angle of the molded photosensitive member made by the molding process according to the above-described second embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

As shown in fig. 1 to 8C, the present invention is a camera module according to a first preferred embodiment of the present invention. The camera module can be applied to various electronic devices, such as but not limited to smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring devices, and the like, and the camera module is matched with the electronic devices to acquire and reproduce images of target objects.

More specifically, a molded photosensitive element 10 of the camera module 100 and a manufacturing apparatus 200 thereof. The molded photosensitive assembly 10 includes a circuit board 11, a molded base 12 and a photosensitive element 13. The mold base 12 of the present invention is integrally encapsulated and formed on the circuit board 11 and the photosensitive element 13 by the manufacturing apparatus 200, so that the mold base 12 can replace a lens base or a bracket of a conventional camera module, and the lens base or the bracket does not need to be attached to the circuit board by glue like in the conventional encapsulation process.

The camera module 100 further includes a lens 30. Wherein the mold base 12 includes a ring-shaped mold body 121 with a light window 122 in the middle to provide a light path for the lens 30 and the photosensitive element 13. The photosensitive element 13 is operatively connected to the circuit board 11, such as by cob (chip On board) wire bonding, and the photosensitive element 13 is connected to the circuit board 11 and located On the top side of the circuit board 11. The photosensitive element 13 and the lens 30 are respectively assembled on two sides of the mold base 12 and are arranged in optical alignment, so that light passing through the lens 30 can reach the photosensitive element through the optical window 122, and the image pickup module 100 can provide an optical image after photoelectric conversion.

As shown in fig. 3A and 3B, the camera module 100 may be a moving focus camera module having a driver 40 such as a voice coil motor, a piezoelectric motor, etc., and the lens 30 is mounted to the driver 40. The molded base 12 may be used to support the driver 40. The top side of the molded base 12 may also be provided with a filter 50 for filtering light passing through the lens 30, such as an infrared cut filter. In this embodiment of the present invention and the accompanying drawings, a moving focus camera module is taken as an example to illustrate one way in which the present invention can be implemented, but is not limited thereto, and in other embodiments of the present invention, the lens 30 can be mounted to the molded photosensitive assembly 10 without the driver 40, that is, to form a fixed focus module, it should be understood by those skilled in the art that the type of camera module is not a limitation of the present invention, and the camera module 100 can be a fixed focus camera module or a moving focus camera module.

The circuit board 11 includes a substrate 111, and a plurality of electronic components 112 formed on the substrate 111, such as mounted by SMT, wherein the electronic components 112 include, but are not limited to, resistors, capacitors, driving devices, and the like. In this embodiment of the present invention, the mold base 12 integrally covers the electronic component 112, so as to prevent dust and impurities from adhering to the electronic component 112 and further contaminating the photosensitive element 13, which affects the imaging effect, like in a conventional camera module. It is understood that in another modified embodiment, it is also possible that the electronic component 112 is embedded in the substrate 111, i.e., the electronic component 112 may not be exposed. The substrate 111 of the circuit board 111 may be a hard PCB, a soft PCB, a rigid-flex board, a ceramic substrate, or the like. It should be noted that, in the preferred embodiment of the present invention, since the molding base 12 can completely cover the electronic components 112, the electronic components 112 may not be embedded in the substrate 111, and the substrate 111 is only used for forming the conductive traces, so that the finally manufactured molded photosensitive assembly 10 can have a smaller thickness.

In this preferred embodiment of the present invention, the photosensitive element 13 is laminated on a flat laminated region of the circuit board 11 inside the electronic component 112, and the mold base 12 is integrally formed on the circuit board 11 and the photosensitive element 13 through a molding process, that is, the mold base 11 and the circuit board 11 and the photosensitive element 13 are integrally bonded. The photosensitive element 13 has a top surface 131, and the top surface 131 has a central photosensitive region 1311 and a non-photosensitive region 1312 surrounding the photosensitive region 1311. The mold base 12 integrally encapsulates at least a portion of the non-photosensitive region 1312 and the circuit board 11.

Further, as shown in fig. 2, the apparatus 200 for manufacturing the molded photosensitive assembly 10 of the camera module 100 includes a molding die 210, a molding material supply mechanism 220, a die fixing device 230, a temperature control device 250 and a controller 260, wherein the molding material supply mechanism 220 is used for supplying the molding material 14 to the base molding guide 215. The mold fixing device 230 is used for controlling opening and closing of the molding mold 210, the temperature control device 250 is used for heating or cooling the molding material 14, and the controller 260 is used for automatically controlling the operation of the molding material supply mechanism 220, the mold fixing device 230, and the temperature control device 250 in a molding process.

The molding die 210 includes a first die 211 and a second die 212 which can be opened and closed by the die fixing device 230, that is, the die fixing device 230 can separate and closely fit the first die 211 and the second die 212 to form a molding cavity 213, when the dies are closed, the circuit board 11 is fixed in the molding cavity 213, and the liquid molding material 14 enters the molding cavity 213 to be integrally molded on the circuit board 11, and after being cured, the molding base 12 integrally molded on the circuit board 11 and the photosensitive element 13 is formed.

More specifically, the molding module 210 further includes a light window molding block 214 and a base molding guide groove 215 formed around the light window molding block 214, the light window molding block 214 and the base molding guide groove 215 are extended in the molding cavity 213 when the first and

second molds

211 and 212 are closed, and the molding material 14 in a liquid state is filled into the base molding guide groove 215, and the molding material 14 in a liquid state cannot be filled in a position corresponding to the light window molding block 214, so that the molding material 14 in a liquid state after being cured may form the annular molding body 121 of the molding base 12 in a position corresponding to the base molding guide groove 215, and the light window 122 of the molding base 12 may be formed in a position corresponding to the light window molding block 214. the molding material 14 may be selected from, but not limited to, nylon, L CP (L iquid Crystal Polymer), PP (Polypropylene), epoxy resin, and the like.

The first and

second molds

211 and 212 may be two molds capable of relative movement, e.g., one of the two molds may be fixed and the other movable; or both molds may be movable, the invention is not limited in this respect. In the example of this embodiment of the invention, the first mold 211 is embodied as a fixed upper mold, while the second mold 212 is embodied as a movable lower mold. The stationary upper mold and the movable lower mold are coaxially arranged, and as the movable lower mold is slidable in the upward direction along a plurality of positioning axes, the molding cavity 213 can be formed to be tightly closed when the upper mold is clamped.

The second mold 212, i.e., the lower mold, may have a circuit board positioning groove 2121, which may be recessed or formed with positioning posts, for mounting and fixing the circuit board 11, and the optical window forming block 214 and the base forming guide groove 215 may be formed at the first mold 211, i.e., the upper mold, to form the forming cavity 213 when the first and

second molds

211 and 212 are closed. And the molding material 14 in a liquid state is injected into the base forming guide groove 215 on the top side of the circuit board 11, thereby forming the molding base 12 on the top sides of the circuit board 11 and the photosensitive element 13.

It is understood that the circuit board positioning groove 2121 may be provided in the first mold 211, i.e., the upper mold, for mounting and fixing the circuit board 11, and the optical window molding block 214 and the base molding guide groove 215 may be formed in the second mold 211 to form the molding cavity 213 when the first and

second molds

211 and 212 are closed. The circuit board 11 may be arranged in the upper mold in a front-side orientation, and the molding material 14 in a liquid state is injected into the base forming guide groove 215 of the bottom side of the circuit board 11 which is inverted, thereby forming the molding base 12 on the bottom side of the circuit board 11 which is inverted.

More specifically, when the first and

second molds

211 and 212 are closed and the molding step is performed, the optical window molding block 214 is overlapped with and closely attached to the light sensing region 1311 of the top surface 131 of the light sensing element 13, so that the molding material 14 in a liquid state is prevented from entering the light sensing region 1311 of the top surface 131 of the light sensing element 13 on the circuit board 11, and the optical window 122 of the mold base 12 can be finally formed at a position corresponding to the optical window molding block 214.

It is understood that the molding surface of the first mold 211 forming the base molding guide 215 may be configured as a flat surface and be in the same plane, so that when the molding base 12 is cured, the top surface of the molding base 12 is flat, thereby providing a flat mounting condition for the driver 40, the lens 30 or other bearing components of the lens, and reducing the tilt error of the camera module 100 after assembly.

It should be noted that the base forming guide groove 215 and the light window forming block 214 may be integrally formed with the first mold 211. Alternatively, the first mold 211 further includes a detachable molding structure, and the molding structure is formed with the base molding guide groove 215 and the light window molding block 214. Thus, the base forming guide groove 215 and the light window forming block 214 can be designed in different shapes and sizes according to the requirements of different shapes and sizes of the molded photosensitive assembly 10, such as the diameter and thickness of the molded base, and the like. In this way, only different molding structures need to be replaced, and the manufacturing apparatus can be adapted to be applied to the molded photosensitive assembly 10 with different specifications. It will be appreciated that the second mold 212 may also include a removable retaining block to provide the recess 2121 with different shapes and sizes to facilitate replacement of the circuit board 11 for different shapes and sizes.

It is understood that the molding material 14 may be a hot melt material such as a thermoplastic material, and the hot melt material in a solid state is heated and melted by the temperature control device 250 to become the molding material 14 in a liquid state. During the molding process, the hot-melt molding material 14 is solidified and formed through a cooling process. The molding material 14 may also be a thermosetting material, and the molding material 14 is changed into a liquid state by heating and melting the thermosetting material in a solid state. During the molding process, the thermosetting molding material 14 is cured by a further heating process and is no longer melted after being cured, thereby forming the molding base 12.

It is understood that in the molding process of the present invention, the molding material 14 may be in the form of a block, a granule, or a powder, which is heated to become liquid in the molding die 210 and then solidified to form the molding base 12.

It is understood that in this embodiment, the molding process of one circuit board 11 is illustrated, and in application, a plurality of independent circuit boards 11 may be molded simultaneously. Alternatively, the panel splicing work described in the second embodiment below may be used.

Fig. 8A to 8C are schematic diagrams illustrating a manufacturing process of the molded photosensitive member 10 of the camera module 100 according to the preferred embodiment of the present invention, and fig. 8A shows that the molding die 210 is in a clamping state, the circuit board 11 to be molded and the molding material 14 in a solid state are fixed in position, and the molding material 14 in a solid state is heated, so that the molding material 14 is fed into the base molding guide groove 215 while being melted into a liquid state or a semi-solid state, and reaches the periphery of the light window molding block 214.

As shown in fig. 8B, when the base forming guide groove 215 is completely filled with the liquid molding material 14, the liquid molding material 14 is cured and formed into the molding base 12 integrally formed on the circuit board 11 and the photosensitive element 13 through a curing process. Taking the molding material 14 as a thermosetting material as an example, the molding material 14 that is heated and melted to be liquid is then subjected to a heating process, so as to be cured and formed.

As shown in fig. 8C, after the molding material 14 is cured to form the molding base 12, the demolding process of the present invention is performed, that is, the mold fixing device 230 moves the first and

second molds

211 and 212 away from each other, so that the optical window forming block 214 is moved away from the molding base 12, and the optical window 122 is formed in the molding base 12.

In the prior art, as shown in fig. 1B, the bottom of the square-column-shaped molding block 4 has a sharp edge, and during the die-drawing process, the sharp edge can generate a large friction with the inner side surface of the package portion 1, thereby damaging the inner side surface of the package portion 1. In the present invention, the structure of the light window forming block 214 of the present invention does not cause damage to the mold base 12.

More specifically, in this embodiment of the present invention, as shown in fig. 8A to 8C, the cross section of the light window forming block 214 is tapered, that is, the light window forming block 214 is tapered like a frustum, and the inside thereof is solid or hollow, that is, it may be like a hollow cover, which can cover the photosensitive element 13 to facilitate the subsequent molding process.

In this example of the invention, it is solid and the light window shaping block 214 has a press-fit face 2141 of the bottom side and a linearly extending peripheral shaping face extending around the direction as a base inner side shaping face 2142. the angle between the base inner side shaping face 2142 and the vertical line is a first inclination angle α, which is not the 0 degree angle of the prior art, but is an acute angle, more specifically, the first inclination angle α is preferably in the range of 10 ° to 80 °, more preferably 30 ° to 55 °.

It can be understood that, as shown in fig. 5 and 6, the molded body 121 of the molded base 12 of the molded photosensitive member 10 of the camera module 100 of the present invention has an inner side surface 124 extending linearly, and the first inclined angle α has the same size as the linear direction of the optical axis Y of the photosensitive element 13 of the molded photosensitive member 10 between the inner side surface 124 and the linear direction.

The greater the value of the first angle α, the better, the greater the value of the first angle α, the more specifically, the electrical connection structure includes a photosensitive element land 132 disposed on the non-photosensitive area 1312 of the photosensitive element 13, a circuit board land 113 disposed on the substrate 111 of the circuit board 11, and a lead 15 extending between the photosensitive element land 132 and the circuit board land 113, thereby achieving conductive connection of the photosensitive element 13 and the circuit board 11, the lead 15 is exemplified but not limited to gold, silver, copper, aluminum, etc. the shapes of the photosensitive element land 132 and the circuit board land 113 may be exemplified but not limited to a square, a sphere, etc. in order that the optical window molding block 214 does not crush the lead 15 to cause breakage of the lead 15 when the optical window molding block 214 is pressed against the photosensitive element in the molding process, the inner side surface 2142 of the base of the optical window molding block 214 must not exceed the highest point of the lead 15, and the maximum specific values of the wire bonding mode α are further exemplified below.

As shown in fig. 8A, the cross section of the light window forming block 214 is a trapezoid gradually increasing from bottom to top, and accordingly, the cross section of the light window 122 of the molding base 12 is formed to be a trapezoid gradually increasing from bottom to top, the inner side surface 124 of the molding base 12 does not contact and the first included angle α is preferably in the range of 10 ° to 80 °, and more preferably 30 ° to 55 °, so as to facilitate the mold release without damaging the lead 15, and the light window 122 of the molding base 12 having a trapezoid shape in cross section can save materials and ensure strength.

In the conventional imaging module with mold package, referring to fig. 1E, light is incident from the lens, part of the light reaches the photo sensor chip for performing a photo sensing action, and another part of the light, for example, the light L in fig. 1D, is projected to the vertical inner wall of the package portion 1, and is easily reflected by the inner wall of the package portion 1 to reach the photo sensor chip 3, so as to participate in the photoelectric conversion process of the photo sensor chip 3, thereby affecting the imaging quality of the imaging module, whereas according to the embodiment of the present invention, referring to fig. 7, light is incident from the lens, part of the light reaches the photo sensor 13, and another part of the light, for example, the light M in the same direction is projected to the inclined inner side 124 of the mold base 12, and is reflected by the inner side 124 of the mold base 12, so as to make the reflected light far away from the photo sensor 13, and not reach the photo sensor 13, thus reducing the influence of the reflected stray light on the imaging quality of the imaging module.

It is worth mentioning that, in the present invention, the reflectivity of the material surface of the mold base 12 in the light wavelength range of 435 and 660nm is less than 5%. That is, most of the light incident on the surface of the mold base 12 cannot be reflected to form disturbing stray light reaching the photosensitive element 13, thereby significantly reducing the influence of the reflected stray light.

In addition, as shown in the drawing, the mold base 12 has an inner side surface 124 in its inner circumferential direction, an outer side surface 125 in its outer circumferential direction, and an annular top side surface 126. The inner side 124 integrally extends to the top surface 131 of the photosensitive element 13, and the outer side 125 integrally extends to the top surface 1111 of the substrate 111 of the circuit board 11. The first mold 211 of the forming mold 210 is further provided with one or more spacer blocks 216 for forming the outer side 125 of the mold base 12 during the molding process. More specifically, the divider block 216 has a base outer side molding surface 2161 to determine the location and shape of the outer side 125 of the mold base 12 formed by curing the molding material 14 during the molding process. A top side molding surface 217 is provided between the spacer block 216 and the light window molding block 214 to determine the position and shape of the top side 126 of the mold base 12 formed by curing the molding material 14 during the molding process. In the prior art, the outer side surface of the packaging part 1 is also perpendicular to the circuit board, namely the outer side surface molding surface of the base of the separation block of the mold is along the vertical direction, so that in the demolding process, the outer side surface molding surface of the base of the mold always rubs with the outer side surface of the packaging part 1, the demolding operation is inconvenient, and the formed outer side surface of the packaging part 1 is easy to damage.

In the present invention, the base outer side molding surface 2161 has a second inclination angle γ with respect to the vertical direction, and the second inclination angle γ is the same between the outer side 125 of the mold base 12 and the optical axis Y direction, i.e. when the mold base 12 is horizontally arranged, the outer side 125 of the mold base 12 has the second inclination angle γ with respect to the vertical line. The angle is acute for facilitating the demolding, and the second inclination angle γ cannot be too large for the top side 126 of the mold base 12 to have a sufficient size for facilitating the subsequent completion of the lens 30 or the actuator 40. That is, if the second inclination angle γ is too large and both the inner side 124 and the outer side 125 of the mold base 12 are inclined, the length of the top side 126 thereof is too small to stably mount the lens 30 or the actuator 40. Also in this embodiment, the bottom of the actuator 40 has an abutting surface that abuts the top side 126 of the mold base 12, which may cause inconvenience in positioning the actuator 40 when the top side 126 of the mold base 12 is too small, such as smaller than the abutting surface, and may shake and be unstable when the actuator 40 is mounted on the top side 126 of the mold base 12, and thus cannot prevent falling and collision. Therefore, in the present invention, the maximum value of the angle of the second inclination angle γ is preferably not more than 45 °. In addition, the minimum value is to facilitate the demolding operation of the molding process and the processing of the forming mold 210, and therefore, in the present invention, the minimum value of the angle of the second inclination angle γ is preferably not less than 3 °. Therefore, in the present invention, the second inclination angle γ is preferably in the range of 3 ° to 45 °, more preferably 3 ° to 15 °. It should be noted that, as shown in fig. 5, in order to facilitate demolding and pressing the substrate 111 of the circuit board 11, a pressing distance W is formed between the outer side surface 125 of the molded base 12 and the outer edge of the substrate 111 of the circuit board 11 after molding, that is, in a molding process, a region where the separating block 216 is adapted to be pressed on the substrate 111 of the circuit board 11 is a distance between a position where the outer side surface 125 of the molded base 12 integrally extends from the substrate 111 of the circuit board 11 and the outer edge of the substrate 111 of the circuit board 11, for example, the pressing distance W may be 0.1 to 0.6mm, and in a specific example, the pressing distance W may be 0.2 mm.

It will be appreciated that, due to the first and second inclination angles α and γ in the above-mentioned ranges, that is, the inner side surface 124 and the outer side surface 125 of the mold base 12 have inclination, so that the friction force between the mold base 12 and the first mold 211 is reduced during demolding, and the mold base 12 is easily pulled out to obtain a better molding state, more specifically, as shown in fig. 8C, when the demolding operation is started after the molding process has formed the solidified mold base 12, the optical window molding block 214 and the separating block 216 start to move vertically upward, the base inner side surface 2142 of the optical window molding block 214 and the base outer side surface 2161 of the separating block 216 are separated from the inner side surface 124 and the outer side surface 125 of the mold base 12, respectively, so that the base inner side surface 2142 of the optical window molding block 214 and the base outer side surface 2161 of the separating block 216 do not come into frictional contact with the inner side surface 124 and the outer side surface 125 of the mold base 12 to damage the inner side surface 124 and the outer side surface 125 of the mold base 12, respectively, and the pulling out of the mold base 12 is facilitated, and the pulling out of the mold base 125 is also made to be smooth.

Meanwhile, the forming mold 210 forms the shape of the base forming guide groove 215 without a dead angle of a right angle and with a suitable slope, so that the molding material 14 in a fluid state can flow better when entering the base forming guide groove 215, and the first inclination angle α and the second inclination angle γ are acute angles, unlike a right angle in the prior art, so that the included angle between the top surface 131 of the photosensitive element 13 of the molding photosensitive assembly 10 and the inner side surface 124 of the molding base 12 becomes a more rounded obtuse angle, the optical window forming block 214 and the separating block 216 do not form a sharp corner angle to scratch the inner side surface 124 and the outer side surface 125 of the molding base 12, and the range of the first inclination angle α is set so that the molding base 12 can avoid stray light from affecting the imaging quality of the camera module 100.

As shown in fig. 9, according to another variant embodiment, the filter element 50 may be superimposed on the photosensitive element 13, and then integrally bonded to the filter element 50, the photosensitive element 13 and the mold base 12 of the circuit board 11 by the molding process of the present invention.

Fig. 10 to 21 show the molded photosensitive member 10 of the camera module 100 and the manufacturing process thereof according to the second embodiment of the present invention. In this embodiment, a molded photo sensor assembly panel 1000 is fabricated by panel assembly and then cut to obtain the molded photo sensor assembly 10.

Accordingly, and more particularly, the mold 210 forms a mold cavity 213 when closed, and provides a plurality of optical window molding blocks 214 and one or more base panel molding channels 2150, which correspond to the provision of a plurality of base molding channels 215 in communication, with the base molding channels 215 forming an integral channel.

Before the molding process, a circuit board assembly 1100 is fabricated, which includes a plurality of circuit boards 11 integrally connected to each other, and each of the circuit boards 11 can be connected to the photosensitive element 13 by wire bonding.

When the circuit board panel 1100 with the plurality of light sensing elements 13 attached thereto is placed in the molding cavity 213 and the molding die 210 is in a clamped state, the molding material 14 in a solid state is melted by heat and fed into the base panel molding guide 2150, thereby filling the periphery of each of the light window molding blocks 214. Finally, the liquid molding material 14 is subjected to a curing process to cure and harden the liquid molding material 14 located in the base panel forming guide 2150 to form the molding bases 12 integrally molded on the circuit boards 11 and the photosensitive elements 13 of the circuit board panel 1100, and the molding bases 12 form the integrated molding base panel 1200.

In order to make the molding surface of the first mold 211 closely attached to the circuit board 11 and the photosensitive element 13 and facilitate demolding, the molding surface of the first mold 211, the circuit board 11 and the photosensitive element 13 are further provided with an elastic film 219.

It should be noted that when each of the single molded photosensitive assemblies 10 cut from the molded photosensitive assembly panel 1000 is used to manufacture a focus-enabled camera module, i.e. an auto-focus camera module, the forming mold 210 is further provided with a plurality of driver pin slot forming blocks 218, each of the driver pin slot forming blocks 218 extends into the base panel forming guide groove 2150, so that the liquid molding material 14 does not fill the positions corresponding to the driver pin slot forming blocks 218 during the molding process, so that after the curing step, a plurality of the optical windows 122 and a plurality of driver pin slots 127 are formed in the molded base panel 1200 of the molded photosensitive assembly panel 1000, and the molded base 12 of each of the single molded photosensitive assemblies 10 cut from the molded photosensitive assembly panel 1000 is configured with the driver pin slots 127, therefore, when the moving focus camera module 100 is manufactured, the pins 41 of the driver 40 are connected to the circuit board 11 of the molded photosensitive component 10 by soldering, conductive adhesive bonding, or the like.

It will be appreciated that, in contrast to the above-described process for manufacturing the single molded photosensitive element 10 of the first embodiment, in the panel assembly operation, two adjacent base forming guide grooves 215 for forming two molded bases 12 are substantially integrated together, and a plurality of light window forming blocks 214 are disposed at intervals, so that the molding material 14 finally forms the molded base panel 1200 of a unitary structure.

In the step of fabricating the molded photosensitive member 10 of a single body: the molded photo sensor assembly panel 1000 may be cut to obtain a plurality of independent molded photo sensor assemblies 10 for making a single camera module. Or two or more integrally connected molded photosensitive assemblies 10 can be cut and separated from the molded photosensitive assembly jigsaw 1000 to manufacture a split type array camera module, that is, each camera module of the array camera module is provided with an independent molded photosensitive assembly 10, wherein the two or more molded photosensitive assemblies 10 can be connected to a control main board of the same electronic device, so that the images shot by the plurality of camera modules can be transmitted to the control main board for image information processing by the two or more molded photosensitive assemblies 10 manufactured by the array camera module.

As shown in fig. 22, the molding process of the panel assembly may also be used to fabricate a molded light sensing assembly 10 having two or more of the light windows 122, wherein such a molded light sensing assembly 10 may be used to fabricate an array camera module of a common substrate. That is, taking the molded photosensitive assembly 10 for manufacturing a dual camera module as an example, in a molding process of each circuit board 11 of the circuit board assembly 1100, one circuit board substrate 111 is correspondingly provided with two optical window forming blocks 214, and two base forming guide grooves 215 which are integrally communicated are formed around the two optical window forming blocks 214 which are spaced from each other, so that after the molding process is completed, each circuit board 11 forms a connected molded base which shares one circuit board substrate 111 and has two optical windows 122, and two photosensitive elements 13 and two lenses 30 are correspondingly mounted. And the substrate 111 of the circuit board 11 can be connected to a control motherboard of an electronic device, so that the array camera module manufactured in this embodiment can transmit images taken by a plurality of camera modules to the control motherboard for image information processing.

As shown in fig. 23, according to a variant embodiment, the mold base 12 of the molding process of the invention can be further extended integrally to form a lens mount 16 having a through hole 161 therein adapted to mount the lens 30. It should be noted that the light window forming block 214 and the separating block 216 have only arc-shaped chamfered transitions at the corners, and it is understood that in the above embodiment, the light window forming block 214 and the separating block 216 may be configured to have arc-shaped chamfered transitions at the corners so as to avoid damage to the formed molding base 12 during demolding.

As shown in fig. 24, according to another variant embodiment, before the molding process, the photosensitive element 13 may be provided with an annular blocking element 17, which is attached or coated on the non-photosensitive area 1312 of the top surface 131 of the photosensitive element 13 and has elasticity, so that during the molding process, the light window forming block 214 is pressed against the blocking element 17 to prevent the molding material 14 from entering the photosensitive area 1311 of the photosensitive element 13, and the pressing surface 2141 of the light window forming block 214 is spaced apart from the photosensitive element 13, so that the pressing surface 2141 of the light window forming block 214 does not damage the photosensitive area 1311 of the photosensitive element 13. In a specific example, the blocking element 17 is in the shape of a square ring and is implemented as a step glue, i.e. a glue is applied by coating or painting on the non-photosensitive area 1312 of the top surface 131 of the photosensitive element 13, and then the blocking element 17 is formed after the glue is cured.

Referring to fig. 11-15, to further illustrate the structure of the camera module 100 according to the second embodiment of the present invention, the camera module 100 includes a molded photosensitive component 10. The molded photosensitive assembly 10 includes a circuit board 11, a molded base 12 and a photosensitive element 13. The camera module 100 further includes a lens 30. Wherein the mold base 12 includes a ring-shaped mold body 121 with a light window 122 in the middle to provide a light path for the lens 30 and the photosensitive element 13. The photosensitive element 13 is operatively connected to the circuit board 11, such as by COB wire bonding, the photosensitive element 13 is connected to the circuit board 11 and is located on the top side of the circuit board 11. The photosensitive element 13 and the lens 30 are respectively assembled on two sides of the mold base 12 and are arranged in optical alignment, so that light passing through the mirror 30 can reach the photosensitive element through the optical window 122, and the image pickup module 100 can provide an optical image after photoelectric conversion. Fig. 25 shows an application of the camera module 100 in an intelligent electronic device 300, for example, the camera module 100 is applied to a mobile phone and is arranged along a thickness direction thereof, and one or more camera modules 100 can be respectively arranged in front and at the back.

The difference from the first embodiment is that the top side of the mold base 12 forms a top side groove 123 for mounting the filter 50. Or the topside recess 123 is used to facilitate the support of an additional filter holder 60, the filter holder 60 being used to mount the filter 50, as shown in fig. 12.

Accordingly, the circuit board 11 includes a substrate 111 and a plurality of electronic components 112 formed on the substrate 111, for example, mounted by an SMT process. The light sensing element 13 has a top surface 131, a central light sensing region 1311 and a non-light sensing region 1312 at the outer edge, and the molding base 12 is integrally formed on the circuit board 11 and at least a portion of the non-light sensing region 1312 of the light sensing element 13 and covers the electronic component 112.

The mold base 12 has an inner side 124, an outer side 125 and a top side 126, i.e. the inner side 124 along its inner circumferential direction, the outer side 125 along its outer circumferential direction and the top side 126 in the form of a ring defining the shape of the ring-shaped mold body 121.

In this embodiment, the inner side 124 of the mold base 12 is a flat inner surface extending non-linearly, but an inner surface extending in a bent shape, and more particularly, it further includes a first part inner side 1241, a second part inner side 1242 and a third part inner side 1243 extending integrally. As shown in the figure, the first partial inner side surface 1241 extends obliquely integrally with the non-photosensitive area 1312 of the photosensitive element 13, the second partial inner side surface 1242 extends substantially horizontally with respect to the first partial inner side surface 1241, and the third partial inner side surface 1243 extends obliquely integrally with respect to the second partial inner side surface 1242, which are vertically aligned with each other in the image capturing module 100. The annular mold body 121 of the mold base 12 is correspondingly formed with a base portion 121a at a bottom side, and a step portion 121b integrally extended from the base portion 121 a. The step portion 121b may form an integral annular step, or may be multi-step, such as three-step, and one side of the molding base has no protruding step. The stepped portion 121b has a larger inner diameter with respect to the abutment portion 121 a. An inner surface of the base portion 121a, i.e., the first partial inner side surface 1241 of the inner side surface 124 of the mold base 12, a top surface of the base portion 121a, i.e., the second partial inner side surface 1242 of the inner side surface 124 of the mold base 12, an inner surface of the step portion 121b, i.e., the third partial inner side surface 1243 of the inner side surface 124 of the mold base 12, and a top surface of the step portion 121b, i.e., the top side surface 126 of the mold base 12.

It is understood that the first portion inner side surface 1241 has a first inclination angle α with respect to a straight line direction of the optical axis Y of the camera module 100, i.e., the first inclination angle α is formed between the first portion inner side surface 1241 and a vertical line when the camera module 100 is vertically aligned, the second portion inner side surface 1242 extends in a direction substantially perpendicular to the straight line direction of the optical axis Y of the camera module 100, and the third portion inner side surface 1243 has a third inclination angle β with respect to the straight line direction of the optical axis Y of the camera module 100, i.e., the third portion inner side surface 1243 has the third inclination angle β with respect to the vertical line when the camera module 100 is vertically aligned.

The outer side surface 125 of the molding base 12 extending to the top surface 1111 of the substrate 111 of the circuit board 11 may include one or more outer peripheral surfaces 1251, wherein in the second embodiment of the present invention, since the integrally connected molding photosensitive assembly panels 1000 may be manufactured and finally cut to obtain a single molding photosensitive assembly 10, wherein some of the outer peripheral surfaces 1251 of the outer side surface 125 of the molding base 12 of the molding photosensitive assembly 10 in the peripheral direction are cut to be vertical flat surfaces, and at least one outer peripheral surface 1251 is defined by the base outer side surface molding surface 2161 of the partition block 216 of the molding die 210 in the molding process, as shown in fig. 21, the front outer peripheral surface 1251 of the cut molding photosensitive assembly 10 is formed by the base outer side surface molding surface 2161 of the partition block 216 corresponding to the molding die 210, the front outer peripheral surface 1251 has a second inclination angle γ with respect to a straight direction of the optical axis Y of the camera module 100, that is, when the camera modules 100 are arranged in a vertical direction, the front outer peripheral surface 1251 has the second inclination angle γ with respect to a vertical line. In addition, the mold base 12 is formed with one or more driver pin grooves 127 each having a pin groove wall surface 1271, and the pin groove wall surface 1271 has a fourth inclination angle with respect to a straight line direction of the optical axis Y of the camera module 100, that is, when the camera module 100 is aligned in a vertical direction, the pin groove peripheral surface 1271 has the fourth inclination angle with respect to a vertical line.

It should be noted that, similar to the above embodiment, as shown in fig. 14, in order to facilitate demolding and pressing the substrate 111 of the circuit board 11, a pressing distance W between a position where the outer side surface 125 of the mold base 12 integrally extends from the substrate 111 of the circuit board 11 and an outer edge of the substrate 111 of the circuit board 11 is set to be 0.1-0.6 mm, for example, the pressing distance W may be 0.2 mm.

In this embodiment of the invention, the first inclination angle α ranges from 10 ° to 80 °, in particular embodiments from 10 ° to 30 °, or from 30 ° to 45 °, or from 45 ° to 55 °, or from 55 ° to 80 °, the second inclination angle γ ranges from 3 ° to 45 °, in particular embodiments from 3 ° to 15 °, or from 15 ° to 30 °, or from 30 ° to 45 °, the third inclination angle β ranges from 3 ° to 30 °, in particular embodiments from 3 ° to 15 °, or from 15 ° to 20 °, or from 20 ° to 30 °, the fourth inclination angle ranges from 3 ° to 45 °, in particular embodiments from 3 ° to 15 °, or from 15 ° to 30 °, or from 30 ° to 45 °.

The light window forming block 214 and the separating block 216 are frustum-shaped, and the edges and corners thereof may be linearly transited or transited in an arc shape to be relatively rounded, but the extending angle range of each surface is approximately within the specific range.

Correspondingly, the first mold 211 of the forming mold 210 is configured with an integral forming surface for forming the mold base 12 of the above structure. More specifically, as shown in the drawing, the light window molding block 214 includes a bottom-side indenter section 214a and a top-side groove molding section 214 b. The swage portion 214a and the groove forming portion 214b are used together to form the light window 122 of the mold base 12, and the groove forming portion 214b is used to form the top side groove 123 on the top side of the mold base 12.

It is understood that the light window molding block 214 includes a pressing surface 2141 on the bottom side and a base inner side molding surface 2142 in the peripheral direction. Further, in this embodiment, the base inner side molding surface 2142 of the light window molding block 214 includes a first portion molding surface 21421, a second portion molding surface 21422 and a third portion molding surface 21423 which are integrally extended. Respectively for forming the first part inner side 1241, the second part inner side 1242 and the third part inner side 1243, which extend integrally inside the mold base 12.

In this embodiment of the present invention, as shown in the figure, the camera module 100 is vertically placed, and the straight direction of the optical axis Y of the photosensitive element 13 of the camera module 100 is parallel to the vertical line, correspondingly, the first portion molding surface 21421 has the first inclination angle α with the size range of 10 ° to 88 ° with respect to the vertical line, and the third portion molding surface 21423 has the third inclination angle β with the size range of 3 ° to 30 ° with respect to the vertical line.

Accordingly, the bottom side surface of the head pressing portion 214a forms the pressing surface 2141 of the optical window molding block 214, the outer side surface of the head pressing portion 214a forms the first portion molding surface 21421 of the optical window molding block 214, the bottom side surface of the groove molding portion 214b forms the second portion molding surface 21422 of the optical window molding block 214, the outer side surface of the groove molding portion 214b forms the third portion molding surface 21423 of the optical window molding block 214, and the head pressing portion 214a and the groove molding portion 214b are configured to be frustum-shaped. The presser head portion 214a and the groove forming portion 214b have a trapezoidal cross section, thereby preventing damage to the elastic film 219. More specifically, taking the groove forming portion 214b as an example, the forming block in the prior art has a sharp corner, and during the demolding process, the elastic film layer 219 is easily punctured at the position where the second part forming surface 21422 and the third part forming surface 21423 meet. And the groove forming part 214b has an obtuse angle between the second partial forming surface 21422 and the third partial forming surface 21423 at the bottom side and the outer circumferential side, respectively, thereby facilitating the mold release of the groove forming part 214 b.

The partition block 216 has a base outer surface molding surface 2161 corresponding to at least one of the outer surfaces 1251 of the molded photosensitive assembly 10, and the second inclination angle γ is preferably in the range of 3 ° to 45 ° with respect to the vertical line.

The plurality of driver lead groove forming blocks 218 further provided by the forming mold 210 have a lead groove side forming surface 2181 having the fourth inclination angle with the vertical line, which is preferably in the range of 3 ° to 30 °.

Accordingly, the above-described configuration of the first mold 211 of the molding mold 210 of the present invention and the mold base have the following advantages.

In the first aspect, the mold release operation of the optical window forming block 214 and the separating block 216 configured in the first mold 211 is facilitated, that is, the mold base 12 can be easily pulled out due to the provision of the first inclination angle α, the second inclination angle γ, the third inclination angle β and the fourth inclination angle which are acute angles for facilitating the mold release, and the optical window forming block 214 and the separating block 216 can be easily pulled out, as shown in fig. 19, as long as the optical window forming block 214 and the separating block 216 are moved away from the mold base 12 in the up-and-down relative displacement, the optical window forming block 214 and the separating block 216 are not rubbed with the mold base 12, that is, the inner base side surfaces 21421, 21422 and 21423 of the optical window forming block 214 are separated from the inner side surfaces 1241, 1242 and 1243 of the mold base 12, and the outer base side 2161 of the separating block 216 is separated from the outer side 125 of the mold base 12, so that the optical window forming block 216 is smoothly separated from the outer side 12412 and the separating block 214 can be more easily pulled out, thereby reducing the mold base 12 in the molding state.

In a second aspect, the forming mold 210 is shaped to form the base panel forming guide 2150 without dead corners, and has a suitable slope to make the molding material 14 in a fluid form more fluid when entering the base panel forming guide 215. That is, the molding material 14 is generally in a fluid state during the molding process, and needs to flow in the molding cavity 213, and the size of the flow area affects the filling effect. The configuration of the base panel forming guide 2150 of the present invention allows for increased flow rates and thus shorter molding times and better facilitates the molding of the molded base 12

In the third aspect, the first inclination angle α, the second inclination angle γ, the third inclination angle β and the fourth inclination angle are acute angles, unlike the right angles in the prior art, and the light window forming block 214 and the separating block 216 do not form sharp corners to scratch the inner side surface 124 and the outer side surface 125 of the mold base 12.

In a fourth aspect, the acute first tilt angle α, the second tilt angle γ, the third tilt angle β, and the fourth tilt angle are arranged such that the inner side surface 124, at least a portion of the outer side surface 125, and the pinslot wall surface 1271 of the mold base 12 are tilted such that the volume of the mold base 12 is relatively small and the overall amount of mold material 14 that needs to be filled is reduced.

In the fifth aspect, the ranges of the first and third inclination angles α, β are set to be acute angles so that the mold base 12 can prevent stray light from affecting the imaging quality of the image pickup module 100. more specifically, the possibility of stray light reaching the photosensitive element 13 is reduced, that is, when stray light in the image pickup module 100 is incident on the inner side surface 124 of the mold base 12 extending in a bent manner, the inclined

inner side surfaces

1241, 1243 of the first and third portions and the inner side surface 1242 of the second portion, which extends in the horizontal direction, reflect the incident stray light away from the photosensitive element 13, so that the stray light does not easily reach the photosensitive element 13 and affects the imaging quality of the image pickup module 100.

In addition, the first inclination angle α, the second inclination angle γ, and the third inclination angle β are also selected to ensure that the mold base 12 can preferably perform its supporting function, such as ensuring that the top side 126 has sufficient dimensions to facilitate the subsequent completion of the lens 30 or the driver 40, ensuring that the second portion inner side 1242 has sufficient dimensions to facilitate the installation of the filter 50 or the filter lens holder 60, i.e., the first inclination angle α, the second inclination angle γ, and the third inclination angle β are not too large to result in too small a length of the top side 126 to provide a stable installation position for the lens 30 or the driver 40, and the first inclination angle α also needs to consider that the light window shaping block 214 cannot press the lead 15, which results in the lead 15 breaking.

In the seven examples, the first inclined angle α, the second inclined angle γ, and the third inclined angle β are in the range of values of the first inclined angle α, the second inclined angle γ, and the third inclined angle β, the first portion inner side face 1241 of the mold base 12 has the first inclined angle α with respect to a vertical line, the second inclined angle γ is between at least one outer peripheral face 1251 of the outer side face 125 of the mold base 12 in the peripherally surrounding direction and a vertical line, the third portion inner side face 1243 of the inner side face 124 of the mold base 12 has the third inclined angle β with respect to a vertical line, a distance 124L between a position where the first portion inner side face 1241 of the mold base 12 is connected to the photosensitive element 13 and a position where the first portion inner side face 1241 is connected to the second portion inner side face 1242, a distance 124861 between a position where the first portion inner side face 1241 is connected to the second portion inner side face 2 and a position where the top side face 126 is connected to the third portion inner side face 1243 is a distance 124L, a distance 3611H 11 between the top surface 5636 of the mold base 12 and a top surface 3611H 11 of the top substrate 3511H 11.

As shown in fig. 26 to 28, in the three examples, the wire bonding between the photosensitive element 13 and the circuit board 11 is from the photosensitive element 13 to the circuit board 11, that is, by disposing the photosensitive element land 132 on the photosensitive element 13, a wire bonding jig first forms a first end 151 of the lead 15 connected to the photosensitive element land 132 by wire bonding at the top end of the photosensitive element land 132, then raises a predetermined position, then moves toward the circuit board land 113 and descends again to form a second end 152 of the lead 15 connected to the circuit board land 113 at the top end of the circuit board land 113, so that the lead 15 extends in a curved shape, and the top end of the lead 15 cannot be crushed by the first partial base inner side surface 21421 of the optical window molding block 214 during the molding process, and thus the size of the first inclined angle α has a maximum limit.

As shown in fig. 29 to 32, in the four examples, the wire bonding manner between the photosensitive element 13 and the circuit board 11 is from the circuit board 11 to the photosensitive element 13, that is, by disposing the circuit board land 113 on the circuit board 11, a wire bonding jig first forms the second end 152 of the lead 15 connected to the circuit board land 113 by wire bonding at the top end of the circuit board land 113, then raises a predetermined position, then translates toward the circuit board land 113 and forms the opposite first end 151 of the lead 15 connected to the photosensitive element land 132 at the top end of the inductance-light element land 132, so that the lead 15 extends in a curved shape, and the top end of the lead 15 cannot be crushed by the first portion base inner side surface 21421 of the light window molding block 214 during the molding process, so that the magnitude of the first inclination angle α has the maximum limit value, and further, in order to make the second portion inner side surface 382 and the top side surface 126 have a sufficient size, the second inclination angle β γ and the third inclination angle 1243, i.e., the third inclination angle 1243, the range of the inclination angle 673, the range of the aforementioned inclination angle 673H 3, the range of the aforementioned tilt angle 3875H 3, the range of the aforementioned parameter 363, the range of the second portion 863, the range of the second portion H3, the range of the second.

As shown in fig. 26, angle α is 10 °, angle β is 3 °, and angle γ is 3 °, wherein L1 is 0.23mm, angle L2 is 1.09mm, angle L3 is 0.99mm, H1 is 1.30mm, H2 is 0.93mm, and angle H3 is 0.17mm, the first inclination angle α, the second inclination angle γ, and the third inclination angle β take suitable minimum values.

As shown in fig. 27, angle α measures 30 °, angle β measures 20 °, angle γ measures 30 °, wherein L1 has a value of 0.38mm, angle L2 has a value of 1.25mm, angle L3 has a value of 0.21mm, H1 has a value of 1.34mm, angle H2 has a value of 0.93mm, and angle H3 has a value of 0.17 mm.

As shown in fig. 28, the angle α is 55 °, the angle β is 30 °, the angle γ is 45 °, wherein the L1 value is 0.54mm, the L2 value is 0.39mm, the L3 value is 0.42mm, the H1 value is 0.86mm, the H2 value is 0.38mm, and the H3 value is 0.17mm, wherein the first inclination angle α takes a maximum value of 55 ° when the wire bonding between the photosensitive element 13 and the circuit board 11 is from the photosensitive element 13 to the circuit board 11.

More specifically, as shown in fig. 29, angle α is 10 °, angle β is 30 °, angle γ is 45 °, wherein L1 is 0.23mm, angle L2 is 1.28mm, angle L3 is 0.82mm, angle H1 is 1.30mm, angle H2 is 0.93mm, angle H3 is 0.13mm, the magnitude of first inclination angle α is a suitable minimum, and the magnitudes of second inclination angle γ and third inclination angle β are suitable maximum.

As shown in fig. 30, angle α measures 30 °, angle β measures 20 °, angle γ measures 30 °, wherein L1 has a value of 0.38mm, angle L2 has a value of 1.24mm, angle L3 has a value of 0.21mm, H1 has a value of 1.34mm, angle H2 has a value of 0.93mm, and angle H3 has a value of 0.13 mm.

As shown in fig. 31, angle α measures 45 °, angle β measures 15 °, angle γ measures 15 °, wherein L1 has a value of 0.73mm, angle L2 has a value of 0.65mm, angle L3 has a value of 1.88mm, H1 has a value of 1.33mm, angle H2 has a value of 1.00mm, and angle H3 has a value of 0.13 mm.

As shown in fig. 32, angle α is 80 °, angle β is 3 °, and angle γ is 3 °, among which L1 is 1.57mm, L2 is 0.15mm, L3 is 2.19mm, H1 is 1.45mm, H2 is 0.54mm, and H3 is 0.13mm, where the wire bonding between the photosensitive element 13 and the circuit board 11 is from the circuit board 11 to the photosensitive element 13, since the wire does not need to be raised to the wire bonding in fig. 26-28, resulting in a decrease in the position of the highest point 51 of the wire, the first inclination angle α takes a maximum value of 80 °, and in this example, the magnitudes of the second inclination angle γ and the third inclination angle β are suitably minimum values.

It is understood that the specific values of the parameters L1, L2, L3, H1, H2 and H3 are only exemplary and not intended to limit the present invention, and in practical applications, the parameters may vary according to the specification requirements of the camera module 100 and the molded photosensitive assembly 10.

According to this embodiment of the present invention, as can be shown by the data exemplified above, the suitable range of the first inclination angle α is 10 ° to 80 °, the suitable range of the second inclination angle γ is 3 ° to 45 °, and the suitable range of the third inclination angle β is 3 ° to 30 °.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. The molding photosensitive assembly is applied to a camera module and is characterized by comprising at least one circuit board, at least one photosensitive element and at least one molding base, wherein the molding base is integrally combined with the circuit board and the photosensitive element through a molding process, the molding base forms at least one optical window, the optical window corresponds to the photosensitive element in position, and the molding base extends obliquely from at least one part of the inner side surface integrally extending from the photosensitive element;

wherein the molding base has an inner side surface linearly extending integrally from a non-photosensitive region of a top surface of the photosensitive element, so that all inner side surfaces of the molding base extend in an inclined shape, and an inclined angle α is provided between the inner side surface of the molding base and an optical axis line of the camera module for facilitating demolding and avoiding stray light;

the photosensitive element and the circuit board are in conductive connection through a group of leads, α values are selected from 10 degrees to 55 degrees when the leads are in a wire bonding connection mode from the photosensitive element to the circuit board, and α values are selected from 10 degrees to 88 degrees when the leads are in the wire bonding connection mode from the circuit board to the photosensitive element.

2. The molded photosensitive assembly of claim 1, wherein the mold base has an outer side surface linearly extending integrally from the circuit board, wherein an inclined angle γ for facilitating mold release is provided between the outer side surface of the mold base and an optical axis line of the camera module, wherein γ is in a range of 3 ° to 45 °.

3. The molded photosensitive assembly of claim 2, wherein the value of γ is selected from the group consisting of 3 ° to 15 °, 15 ° to 30 °, or 30 ° to 45 °.

4. The molding photosensitive assembly according to any one of claims 1 to 3, wherein the molding photosensitive assembly further has one or more driver pin grooves, wherein a pin groove wall surface defining each of the driver pin grooves has an inclination angle with respect to an optical axis line of the camera module, which is in a range of 3 ° to 30 °, for facilitating mold release.

5. The molded photosensitive assembly of any one of claims 1 to 3, wherein the molded photosensitive assembly further comprises at least one optical filter, the optical filter is stacked with the photosensitive element, and the molding base is integrally encapsulated and formed on the optical filter, the photosensitive element and the circuit board.

6. The molding photosensitive assembly according to any one of claims 2 or 3, wherein the substrate of the circuit board is left with a pressing distance W for facilitating pressing of at least one spacer of a molding die in a molding process, outside at least one outer peripheral surface of the outer side surface of the molding base, the value of which is in a range of 0.1 to 0.6 mm.

7. The molded photosensitive component of any of claims 1 to 3, wherein the material surface of the molding base has a reflectance of less than 5% at a wavelength of light of 435-660 nm.

8. The molding photosensitive assembly is applied to a camera module and is characterized by comprising at least one circuit board, at least one photosensitive element and at least one molding base, wherein the molding base is integrally combined with the circuit board and the photosensitive element through a molding process, the molding base forms at least one optical window, the optical window corresponds to the photosensitive element in position, and the molding base extends obliquely from at least one part of the inner side surface integrally extending from the photosensitive element;

the molding base is provided with a top side groove at the top end, the molding base is provided with an inner side face extending in a bending mode and comprises a first part inner side face, a second part inner side face and a third part inner side face which are sequentially and integrally extended, the first part inner side face integrally extends to a non-photosensitive area of a top surface of the photosensitive element in an inclined mode, the third part inner side face integrally extends to the second part inner side face in an inclined mode, and the second part inner side face and the third part inner side face define and form the top side groove;

an inclined angle α which is convenient for demoulding and avoids stray light is arranged between the inner side surface of the first part and the optical axis straight line of the camera module;

9. The molded photosensitive assembly of claim 8 wherein said third portion inner side surface has an inclination angle β with respect to a line of an optical axis of said camera module for facilitating mold release and avoiding stray light, wherein β is in the range of 3 ° to 30 °.

10. The molded photosensitive assembly of claim 8, wherein said second portion inner side surface is based parallel to said top surface of said photosensitive element.

11. The molded photosensitive assembly of claim 8, wherein the mold base has an outer side surface linearly extending integrally from the circuit board, wherein the outer side surface of the mold base comprises a plurality of peripheral surfaces arranged along a circumferential direction, wherein at least one of the peripheral surfaces has an inclination angle γ with respect to an optical axis line of the camera module for facilitating mold release, wherein γ is in a range of 3 ° to 45 °.

12. The molded photosensitive assembly of claim 11, wherein the value of γ is selected from the group consisting of 3 ° to 15 °, 15 ° to 30 °, or 30 ° to 45 °.

13. The molding photosensitive assembly according to any one of claims 8 to 12, wherein the molding photosensitive assembly further has one or more driver pin grooves, wherein a pin groove wall surface defining each of the driver pin grooves has an inclination angle with respect to an optical axis line of the camera module, which is in a range of 3 ° to 30 °, for facilitating mold release.

14. The molded photosensitive assembly of any one of claims 8 to 12, wherein the molded photosensitive assembly further comprises at least one optical filter, the optical filter is stacked with the photosensitive element, and the molding base is integrally formed on the optical filter, the photosensitive element and the circuit board.

15. The molding photosensitive assembly of claim 11 or 12, wherein the substrate of the circuit board is left with a pressing distance W for facilitating pressing of at least one spacer of a molding die in a molding process, outside at least one peripheral surface of the outer side surface of the molding base, the value of which is in a range of 0.1 to 0.6 mm.

16. The molded photosensitive component of any of claims 8 to 12, wherein the material surface of the molding base has a reflectance of less than 5% at a wavelength of light of 435-660 nm.

17. A camera module, characterized in that it comprises at least a lens and at least a molded photosensitive assembly, said molded photosensitive assembly comprises at least a circuit board, at least a photosensitive element, and at least a molded base, said molded base is integrated with said circuit board and said photosensitive element by molding process, wherein said molded base forms at least a light window, said light window provides a light path for said photosensitive element and said lens, and said molded base extends obliquely from at least a part of the inner side surface of said photosensitive element integrally extending;

wherein the molding base has an inner side surface linearly extending integrally from a non-photosensitive region of a top surface of the photosensitive element, so that the entire inner side surface of the molding base extends in an inclined shape, and an inclined angle α is provided between the inner side surface of the molding base and an optical axis line of the camera module for facilitating demolding and avoiding stray light;

18. The camera module of claim 17, wherein the mold base has an outer side surface linearly extending integrally from the circuit board, wherein the outer side surface of the mold base and a straight line of an optical axis of the camera module have an inclination angle γ for facilitating mold release, wherein γ ranges from 3 ° to 45 °.

19. The camera module of claim 18, wherein γ has a value selected from the group consisting of 3 ° to 15 °, 15 ° to 30 °, and 30 ° to 45 °.

20. The camera module of claim 17, wherein the mold base has an outer side surface linearly extending integrally from the circuit board, wherein the outer side surface of the mold base comprises a plurality of outer peripheral surfaces arranged along a circumferential direction, wherein at least one of the outer peripheral surfaces has an inclination angle γ with respect to an optical axis line of the camera module, which facilitates mold release, wherein γ ranges from 3 ° to 45 °.

21. The camera module of claim 20, wherein γ has a value selected from the group consisting of 3 ° to 15 °, 15 ° to 30 °, and 30 ° to 45 °.

22. The camera module of any of claims 17-21, wherein the molded photosensitive element further comprises one or more driver pin grooves, wherein pin groove walls defining each of the driver pin grooves have a tilt angle with respect to a line of an optical axis of the camera module that facilitates demolding, wherein the tilt angle is in a range of 3 ° to 30 °.

23. The camera module according to any one of claims 17-21, wherein the molded photosensitive assembly further comprises at least one filter, the filter is stacked with the photosensitive element, and the molded base is integrally formed with the filter, the photosensitive element and the circuit.

24. The camera module of any of claims 17-21, further comprising at least one filter mounted on a top end of the mold base.

25. The camera module of any of claims 17-21, further comprising at least one filter mount and at least one filter, the filter being mounted to the filter mount, the filter mount being mounted to a top end of the mold base.

26. The camera module of any of claims 17-21, further comprising at least one actuator mounted to a top side of the mold base such that the mold base supports the actuator, wherein the lens is mounted within the actuator to achieve auto-focus.

27. The camera module of claim 17, further comprising at least one blocking element in the shape of a ring to prevent molding material from reaching a photosensitive area of the photosensitive element during the molding process.

28. The camera module of any of claims 17-21, wherein a plurality of the camera modules are assembled into an array of camera modules.

29. The camera module of any of claims 17-21, wherein the molded photo-sensor assembly comprises a plurality of the photo-sensors and has a plurality of the optical windows to form an array camera module with a plurality of the lenses.

30. The camera module according to any of claims 18 to 21, wherein the substrate of the circuit board is provided with a pressing distance W for facilitating pressing of at least one spacer of a forming mold in a molding process, outside at least one outer peripheral surface of the outer side surface of the mold base, the value of which is in a range of 0.1 to 0.6 mm.

31. The camera module of any of claims 17-21, wherein the material surface of the mold base has a reflectivity of less than 5% at a wavelength of light of 435-660 nm.

32. A camera module, characterized in that it comprises at least a lens and at least a molded photosensitive assembly, said molded photosensitive assembly comprises at least a circuit board, at least a photosensitive element, and at least a molded base, said molded base is integrated with said circuit board and said photosensitive element by molding process, wherein said molded base forms at least a light window, said light window provides a light path for said photosensitive element and said lens, and said molded base extends obliquely from at least a part of the inner side surface of said photosensitive element integrally extending;

33. The camera module of claim 32, wherein the third portion inner side surface has an inclination angle β with respect to an optical axis line of the camera module to facilitate mold release and avoid stray light, wherein β is in the range of 3 ° to 30 °.

34. The camera module of claim 33, wherein β is selected from the group consisting of 3 ° -15 °, 15 ° -20 °, and 20 ° -30 °.

35. The camera module of claim 32, wherein the second portion inner side surface is substantially parallel to the top surface of the photo-sensing element.

36. The camera module of claim 32, wherein the mold base has an outer side surface linearly extending integrally from the circuit board, wherein the outer side surface of the mold base comprises a plurality of outer peripheral surfaces arranged along a circumferential direction, wherein at least one of the outer peripheral surfaces has an inclination angle γ with respect to an optical axis line of the camera module, which facilitates mold release, wherein γ ranges from 3 ° to 45 °.

37. The camera module of claim 36, wherein γ has a value selected from the group consisting of 3 ° to 15 °, 15 ° to 30 °, and 30 ° to 45 °.

38. The camera module of any of claims 32-37, wherein the molded photosensitive element further comprises one or more driver pin grooves, wherein pin groove walls defining each of the driver pin grooves have a tilt angle with respect to a line of an optical axis of the camera module that facilitates demolding, wherein the tilt angle is in a range of 3 ° to 30 °.

39. The camera module according to any of claims 32-37, wherein the molded photosensitive assembly further comprises at least one filter, the filter is stacked with the photosensitive element, and the molded base is integrally formed with the filter, the photosensitive element and the circuit.

40. The camera module of any of claims 32-37, further comprising at least one filter mounted on a top end of the mold base.

41. The camera module of any of claims 32-37, further comprising at least one filter mounted in the top recess of the mold base.

42. The camera module of any of claims 32-37, further comprising at least one filter mount and at least one filter, the filter being mounted to the filter mount, the filter mount being mounted to a top end of the mold base.

43. The camera module of any of claims 32-37, further comprising at least one actuator mounted to a top side of the mold base such that the mold base supports the actuator, wherein the lens is mounted within the actuator to achieve auto-focus.

44. The camera module of any of claims 32-37, wherein a plurality of the camera modules are assembled into an array of camera modules.

45. The camera module of any of claims 32-37, wherein the molded photo-sensitive member comprises a plurality of the photo-sensitive elements and has a plurality of the optical windows, thereby forming an array camera module with a plurality of the lenses.

46. The camera module according to claim 36 or 37, wherein the substrate of the circuit board has a pressing distance W for facilitating pressing of at least one spacer of a forming mold in a molding process, outside at least one peripheral surface of the outer side surface of the mold base, the value of which is in a range of 0.1 to 0.6 mm.

47. The camera module of any of claims 33-37, wherein the material surface of the mold base has a reflectance of less than 5% at a wavelength of light of 435-660 nm.

48. An electronic device, comprising one or more camera modules, wherein the camera modules comprise at least one lens and at least one molded photosensitive component, the molded photosensitive component comprises at least one circuit board, at least one photosensitive element, and at least one molded base, the molded base is integrated with the circuit board and the photosensitive element through a molding process, wherein the molded base forms at least one optical window, the optical window provides a light path for the photosensitive element and the lens, and at least one part of the inner side surface of the molded base integrally extending from the photosensitive element extends in an inclined manner;

49. The electronic device of claim 48, wherein the mold base has an outer side surface linearly extending integrally from the circuit board, wherein an inclined angle γ for facilitating mold release is provided between the outer side surface of the mold base and an optical axis line of the camera module, wherein γ is in a range of 3 ° to 45 °.

50. The electronic device of claim 49, wherein γ has a value selected from the group consisting of 3 ° -15 °, 15 ° -30 °, and 30 ° -45 °.

51. The electronic device of claim 48, wherein the mold base has an outer side surface linearly extending integrally from the circuit board, wherein the outer side surface of the mold base comprises a plurality of outer peripheral surfaces arranged along a circumferential direction, wherein at least one of the outer peripheral surfaces has an inclination angle γ with respect to an optical axis line of the camera module for facilitating mold release, wherein γ is in a range of 3 ° to 45 °.

52. The electronic device of claim 51, wherein γ has a value selected from 3 ° -15 °, 15 ° -30 °, or 30 ° -45 °.

53. The electronic device of any of claims 48-52, wherein the molded photosensitive assembly further comprises one or more driver pin slots, wherein a pin slot wall defining each of the driver pin slots has a tilt angle with respect to an optical axis line of the camera module that facilitates demolding, wherein the tilt angle is in a range of 3 ° to 30 °.

54. The electronic device according to any of claims 48-52, wherein the molded photosensitive assembly further comprises at least one optical filter, the optical filter is stacked with the photosensitive element, and the molded base integrally encapsulates the optical filter, the photosensitive element and the circuit.

55. The electronic device of any one of claims 48-52, further comprising at least one filter mounted on a top end of the molded base.

56. The electronic device of any of claims 48-52, further comprising at least one filter mount and at least one filter, the filter being mounted to the filter mount, the filter mount being mounted to a top end of the molded base.

57. The electronic device of any of claims 48-52, further comprising at least one actuator mounted to a top side of the mold base such that the mold base supports the actuator, wherein the lens is mounted within the actuator to achieve auto-focus.

58. The electronic device of claim 48, further comprising at least one blocking element in the shape of a ring to prevent molding material from reaching a photosensitive area of the photosensitive element during the molding process.

59. The electronic device of any of claims 48-52, wherein a plurality of the camera modules are assembled into an array of camera modules.

60. An electronic device according to any of claims 48 to 52 wherein the molded photosensitive assembly comprises a plurality of said photosensitive elements and has a plurality of said optical windows to form an array camera module with a plurality of said lenses.

61. The electronic device according to any one of claims 49 to 52, wherein the substrate of the circuit board is left with a pressing distance W for facilitating pressing of at least one spacer of a forming mold in a molding process, outside at least one outer peripheral surface of the outer side surface of the mold base, the value of which is in a range of 0.1 to 0.6 mm.

62. The electronic device of any of claims 48-52, wherein the material surface of the mold base has a reflectivity of less than 5% at a wavelength of light of 435-660 nm.

63. The electronic device of any of claims 48-52, wherein the electronic device is selected from a cell phone, a computer, a television, a smart wearable device, a vehicle, a camera, and a monitoring device.

64. An electronic device, comprising one or more camera modules, a camera module, comprising at least one lens and at least one molded photosensitive assembly, wherein the molded photosensitive assembly comprises at least one circuit board, at least one photosensitive element, and at least one molded base, the molded base is integrally combined with the circuit board and the photosensitive element through a molding process, wherein the molded base forms at least one optical window, the optical window provides a light path for the photosensitive element and the lens, and at least one part of the inner side surface of the molded base integrally extending from the photosensitive element extends in an inclined manner;

65. The electronic device of claim 64, wherein the third portion has an angle of inclination β between the inner side surface and the optical axis of the camera module for easy mold release and avoiding stray light, wherein β is in the range of 3 ° to 30 °.

66. The electronic device of claim 65, wherein the value of β is selected from 3 ° -15 °, 15 ° -20 °, or 20 ° -30 °.

67. The electronic device of claim 64, wherein the second portion interior side is based parallel to the top surface of the light-sensing element.

68. The electronic device of claim 64, wherein the mold base has an outer side surface linearly extending integrally from the circuit board, wherein the outer side surface of the mold base comprises a plurality of outer peripheral surfaces arranged along a circumferential direction, wherein at least one of the outer peripheral surfaces has an inclination angle γ with respect to an optical axis line of the camera module for facilitating mold release, wherein γ is in a range of 3 ° to 45 °.

69. The electronic device of claim 68, wherein γ has a value selected from the group consisting of 3 ° -15 °, 15 ° -30 °, and 30 ° -45 °.

70. The electronic device of any one of claims 64-69, wherein the molded photosensitive assembly further comprises one or more driver pin grooves, wherein pin groove walls defining each of the driver pin grooves have a tilt angle with respect to an optical axis line of the camera module that facilitates demolding, wherein the tilt angle is in a range of 3 ° to 30 °.

71. The electronic device of any one of claims 64-69, wherein the molded photosensitive assembly further comprises at least one filter, the filter is stacked with the photosensitive element, and the molded base integrally encapsulates the filter, the photosensitive element and the circuit.

72. The electronic device of any one of claims 64-69, wherein the camera module further comprises at least one filter mounted on a top end of the molded base.

73. The electronic device of any of claims 64-69, wherein the camera module further comprises at least one filter mounted to the top-side recess of the molded base.

74. The electronic device of any of claims 64-69, wherein the camera module further comprises at least one filter mount and at least one filter, the filter being mounted to the filter mount, the filter mount being mounted to a top end of the mold base.

75. The electronic device of any of claims 64-69, wherein the camera module further comprises at least one actuator mounted to a top side of the molded base such that the molded base supports the actuator, wherein the lens is mounted within the actuator to achieve auto-focus.

76. The electronic device of any of claims 64-69, wherein a plurality of the camera modules are assembled into an array of camera modules.

77. The electronic device of any one of claims 64-69, wherein the molded photosensitive component comprises a plurality of the photosensitive elements and has a plurality of the optical windows to form an array camera module with a plurality of the lenses.

78. The electronic device of claim 68 or 69, wherein the substrate of the circuit board is provided with a pressing distance W for facilitating pressing of at least one separation block of a forming mold in a molding process, the value of which is in a range of 0.1-0.6 mm, outside at least one peripheral surface of the outer side surfaces of the molding base.

79. The electronic device as claimed in any of claims 64-69, wherein the material surface of the mold base has a reflectivity of less than 5% at a wavelength of light of 435-660 nm.

80. The electronic device of any of claims 64-69, wherein the electronic device is selected from a cell phone, a computer, a television, a smart wearable device, a vehicle, a camera, and a monitoring device.

81. A forming mold, which is used for manufacturing at least one molding photosensitive assembly of at least one camera module, and is characterized in that the forming mold comprises a first mold and a second mold which can be separated or closely combined, wherein the first mold and the second mold form at least one forming cavity when being closely combined, the forming mold is provided with at least one optical window forming block and a base forming guide groove which is positioned around the optical window forming block in the forming cavity, when at least one circuit board which is connected with at least one photosensitive element is installed in the forming cavity, a molding material which is filled into the base forming guide groove undergoes a liquid-to-solid conversion process under the temperature control effect to be cured and formed, a molding base is formed at the position corresponding to the base forming guide groove, an optical window of the molding base is formed at the position corresponding to the optical window forming block, and the molding base is integrally formed on the circuit board and at least one part of non-photosensitive area of the photosensitive element So as to form the molding photosensitive component of the camera module;

wherein the optical window forming block includes a press head portion and a groove forming portion integrally extended from the press head portion, the groove forming portion having a larger inner diameter than the press head portion for forming a top side groove at a top side of the molding base;

wherein the pressing head part has an inclination angle α between the outer side surface along the periphery of the pressing head part and the vertical line, which is convenient for demoulding and avoids stray light;

the photosensitive element and the circuit board are in conductive connection through a group of leads, α values are selected from 10 degrees to 55 degrees when the leads are in a wire bonding connection mode from the photosensitive element to the circuit board, and α values are selected from 10 degrees to 88 when the leads are in the wire bonding connection mode from the circuit board to the photosensitive element.

82. The molding die of claim 81, wherein the light window molding block has a base inner side molding surface extending obliquely along its periphery for forming an integral linearly extending inner side of the molding base.

83. The molding die of claim 82, wherein the base inner side molding surface of the light window molding block has an inclination angle with respect to a vertical line for facilitating demolding, wherein α is in a range of 10 ° to 80 °.

84. The molding die of claim 81, wherein the groove molding section has an inclination angle β between an outer side surface along its outer periphery and a vertical line, wherein the size range of β is 3 ° to 30 °.

85. The forming die of any one of claims 81 to 84, wherein the first die further comprises at least one divider block having a base outer side forming surface with an angle γ to vertical that facilitates die release, the value of γ being selected from the range of 3 ° to 45 °.