CN105744130A - Camera shooting module, photosensitive assembly of the camera shooting module and production method of the photosensitive assembly of the camera shooting module - Google Patents

Camera shooting module, photosensitive assembly of the camera shooting module and production method of the photosensitive assembly of the camera shooting module Download PDF

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Publication number
CN105744130A
CN105744130A CN201610143457.7A CN201610143457A CN105744130A CN 105744130 A CN105744130 A CN 105744130A CN 201610143457 A CN201610143457 A CN 201610143457A CN 105744130 A CN105744130 A CN 105744130A
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CN
China
Prior art keywords
encapsulation part
photosensory assembly
wiring board
main body
camera module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610143457.7A
Other languages
Chinese (zh)
Other versions
CN105744130B (en
Inventor
田中武彦
赵波杰
王明珠
梅其敏
丁亮
蒋恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201910061809.8A priority Critical patent/CN110022423B/en
Priority to CN201910061810.0A priority patent/CN110022424B/en
Priority to CN201610143457.7A priority patent/CN105744130B/en
Priority to US15/075,192 priority patent/US10750071B2/en
Publication of CN105744130A publication Critical patent/CN105744130A/en
Priority to KR1020187029337A priority patent/KR102193819B1/en
Priority to KR1020207036129A priority patent/KR102335306B1/en
Priority to PCT/CN2016/103736 priority patent/WO2017157015A1/en
Priority to JP2018547880A priority patent/JP2019519087A/en
Priority to EP16894174.8A priority patent/EP3429181B1/en
Priority to US15/317,117 priority patent/US10908324B2/en
Priority to PCT/CN2017/076041 priority patent/WO2017157211A1/en
Priority to KR1020187029304A priority patent/KR20180132684A/en
Priority to KR1020217005352A priority patent/KR102360319B1/en
Priority to KR1020217005344A priority patent/KR102294537B1/en
Priority to EP17765753.3A priority patent/EP3429183A4/en
Priority to US16/082,533 priority patent/US20190148429A1/en
Priority to JP2018548099A priority patent/JP7071926B2/en
Priority to TW108135670D priority patent/TWI758644B/en
Priority to TW108135670A priority patent/TW202017356A/en
Priority to TW108135674D priority patent/TWI758645B/en
Priority to TW106108217A priority patent/TWI754632B/en
Priority to TW108135671A priority patent/TWI769403B/en
Priority to TW106108124A priority patent/TWI703715B/en
Priority to TW108135674A priority patent/TW202019155A/en
Priority to TW106203473U priority patent/TWM565451U/en
Priority to TW106108225A priority patent/TWI685255B/en
Priority to TW106203511U priority patent/TWM552720U/en
Priority to TW108135672A priority patent/TWI742441B/en
Priority to TW106203507U priority patent/TWM559558U/en
Priority to US15/460,231 priority patent/US9876948B2/en
Priority to US15/461,413 priority patent/US9876949B2/en
Priority to US15/460,236 priority patent/US10084949B2/en
Priority to US15/460,235 priority patent/US10277792B2/en
Priority to US15/473,573 priority patent/US9781325B1/en
Priority to US15/473,607 priority patent/US9826132B2/en
Priority to US15/473,609 priority patent/US9906700B2/en
Priority to US15/473,605 priority patent/US10033913B2/en
Priority to US15/679,146 priority patent/US10274694B2/en
Priority to US15/705,232 priority patent/US10126519B2/en
Priority to US15/705,225 priority patent/US10175447B2/en
Priority to US15/784,171 priority patent/US10237460B2/en
Priority to US15/784,167 priority patent/US10578837B2/en
Priority to US16/101,509 priority patent/US10367983B2/en
Priority to US16/436,934 priority patent/US10735637B2/en
Application granted granted Critical
Publication of CN105744130B publication Critical patent/CN105744130B/en
Priority to US16/737,863 priority patent/US20200218034A1/en
Priority to US16/908,723 priority patent/US11303789B2/en
Priority to US16/919,065 priority patent/US11706516B2/en
Priority to US17/114,466 priority patent/US11822099B2/en
Priority to US17/685,587 priority patent/US11743569B2/en
Priority to US17/740,887 priority patent/US20220268968A1/en
Priority to US17/847,569 priority patent/US12021097B2/en
Priority to US18/203,252 priority patent/US20230300442A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/004—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having four lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/006—Filter holders
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Human Computer Interaction (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The invention discloses a camera shooting module, a photosensitive assembly of the camera shooting module and a production method of the photosensitive assembly of the camera shooting module; wherein the photosensitive assembly of the module comprises a packaging part and a photosensitive part. The photosensitive part comprises a circuit board body and a photosensitive chip. The packaging part is integrally packaged and moulded with the circuit board body and the photosensitive chip.

Description

Camera module and photosensory assembly thereof and manufacture method
Technical field
The present invention relates to camera module field, further, relate to a camera module and photosensory assembly thereof and manufacture method.
Background technology
COB (ChipOnBoard, chip package) technique is a technical process particularly important in camera module assembling manufacture process.The camera module that traditional COB technique is made for wiring board, sensitive chip, microscope base, motor drive and assemble through parts such as camera lenses.
As it is shown in figure 1, the camera module schematic diagram that the COB technique being traditional manufactures.Described camera module includes a wiring board 1P, a sensitive chip 2P, a support 3P, an optical filter 4P, a motor 5P and a camera lens 6P.Described sensitive chip 2P is installed in described wiring board 1P, described optical filter 4P is installed in described support 3P, described camera lens 6P is installed in described motor 5P, and described motor 5P is installed in described support 3P, in order to described camera lens 6P is positioned on the photosensitive path of described sensitive chip 2P.
It is worth mentioning that, described wiring board 1P has been usually installed some circuit devcies 11P, such as resistance, electric capacity etc., these circuit devcies 11P protrudes from described wiring board 1P surface, described support 3P then needs to be installed on the described wiring board 1P with described circuit devcie 11P, and the assembling matching relationship between wiring board 1P described in traditional COB technique, described circuit devcie 11P and described support 3P has some unfavorable factors, and limit camera module to a certain extent to lightening development.
It will also be appreciated that described sensitive chip is electrically connected to described wiring board typically by some gold threads 21P, in order to the information transmission between described sensitive chip 2P and described line plate plate 1P.And based on the characteristic of described gold thread 21P and structure, described gold thread 21P generally curvedly bends, and protrudes from the surface of described wiring board, therefore, the assembling process of described sensitive chip is also the same with described circuit devcie 11P, and camera module exists similar influence factor.
Specifically, first, described circuit devcie 11P and described gold thread 21P is directly exposed to the surface of described wiring board 1P, therefore in the process of follow-up assembling, such as paste described support 3P, weld the processes such as described motor 5P, inevitably it is affected, solder resist during welding, dusts etc. are easily attached to described circuit devcie 11P, and described circuit devcie 11P and described sensitive chip 2P is positioned at the space being interconnected, therefore contamination by dust thing is easy to affect sensitive chip 2P, such impact is likely to result in the camera module after assembling and there is the bad phenomenon such as dirty stain, reduce product yield.
Secondly, described support 3P is positioned at the outside of described circuit devcie 11P, therefore when installing described support 3P and described wiring board 1P, need reserved certain safe distance between described support 3P and described circuit devcie 11P, and in the horizontal direction and upwardly direction be required for reserved safe distance, this increases the demand of camera module thickness to a certain extent so that it is thickness is difficult to reduce.
null3rd，In the COB process assembled，Described support 3P or described motor 5P is glued to described wiring board 1P by paste such as glue，It is typically conducted AA (ActiveArrangement calibrates automatically) technique when pasting，It it is exactly the central axis adjusting described sensitive chip 2P and described camera lens 6P，Reach horizontal direction consistent with vertical direction，Therefore to meet AA technique，Need to be required for presetting more glue between described support 3P and described wiring board 1P and described microscope base and described motor 5P，Make to leave adjustment space each other，And this demand adds the thickness requirements to camera module on the one hand to a certain extent，Its thickness is made to be difficult to reduce，On the other hand，Repeatedly pasting assembling process, to easily cause the inclination of assembling inconsistent，And to described microscope base 3P、The planarization of described wiring board 1P and described motor 5P requires higher.
In addition, in traditional COB technique, described wiring board 1P provides most basic fixing, support carrier, therefore, described wiring board 1P itself is required possess certain structural strength, this requirement makes described wiring board 1P have bigger thickness, thus the pre-add thickness requirements of camera module again from another point of view.
Along with various electronic products, the development of smart machine, camera module is also increasingly to high-performance, lightening direction is developed, and in the face of high pixel, the various high performance demand for development such as high imaging quality, electronic devices and components in circuit get more and more, the area of chip is increasing, drive resistance, the Passive components such as electric capacity increase accordingly, this makes the specification of electronic device increasing, assemble difficulty constantly to increase, the overall dimensions of camera module is increasing, and from above-mentioned, microscope base, traditional assembling mode of wiring board and component etc. is also the very big restriction of the lightening development of camera module to a certain extent.
Summary of the invention
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said photosensory assembly includes an encapsulation part and a photographic department, and described encapsulation part encapsulated moulding is in described photographic department.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said photographic department includes a sensitive chip and a wiring board main body, described sensitive chip is electrically connected to described wiring board main body by least one connecting line, described encapsulation part is coated with described connecting line so that it is will not be directly exposed to outside.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said connecting line is coated on inside described encapsulation part integratedly by the manufacture passing through to mold.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said photosensory assembly includes at least one component, and described component is coated in described encapsulation part, so as not to be directly exposed to outside.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said component is coated on inside described encapsulation part integratedly by the manufacture passing through to mold.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said sensitive chip has a photosensitive area and a non-photo-sensing district, described encapsulation part is molded into the non-photo-sensing district of described sensitive chip, reduces described photosensory assembly and by the length and width size of the camera module of its assembling.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said wiring board main body has an inner groovy, and described sensitive chip is arranged in described inner groovy, thus reducing the requirement for height to described encapsulation part.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said encapsulation part includes a cladding section and an optical filter construction section, described optical filter construction section one molding is connected to described cladding section, described optical filter construction section is suitable to a mounted optical filter, from the optical filter mounting bracket extra without offer.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method; wherein said photosensory assembly includes an optical filter; it is arranged at the top of described sensitive chip described optical filter molding; described sensitive chip is protected thereby through described optical filter; and can reduce by the back focal length of the camera module of its assembling so that the height of camera module is less.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said photosensory assembly includes a back-up coat, it is connected to the bottom side of described wiring board main body described back-up coat lamination, thus increasing the structural strength of described wiring board main body, so that adopting the described wiring board main body that thickness is less, and the heat-sinking capability of described wiring board main body can be improved.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said circuit main body has at least one reinforced hole, described encapsulation part extends into described reinforced hole, thus the bonding force strengthened between described encapsulation part and described photosensory assembly, and increase the structural strength of described wiring board main body.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said encapsulation part is suitable to a mounted motor or a camera lens, can as traditional support, the support fixed position of described motor or described camera lens is provided, and by the molded advantage of described encapsulation part, there is good flatness, thus obtaining reducing shooting membrane module to assemble heeling error.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said camera module adopts the mode of molding to carry out assembly, thus changing traditional camera module COB technique.
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, it adopts the mode of molding to manufacture described photosensitive circuit pack, thus molded, integration described photosensory assembly.
For other purposes and the advantage of the object above and the present invention that realize the present invention, an aspect of of the present present invention provides the photosensory assembly of a camera module, comprising: an encapsulation part and a photographic department；Described photographic department includes a wiring board main body and a sensitive chip, and described encapsulation part encapsulated moulding is in described wiring board main body and described sensitive chip.
According to one embodiment of the invention, encapsulation part described in described photosensory assembly forms a through hole, and described through hole is relative with described sensitive chip, to provide described sensitive chip passage of light.
According to one embodiment of the invention, the bottom of the described through hole of encapsulation part described in described photosensory assembly is skewed in what be gradually increased from the bottom to top.
According to one embodiment of the invention, encapsulation part top described in described photosensory assembly is suitable to install the camera lens of described camera module, motor or optical filter.
According to one embodiment of the invention, described in described photosensory assembly, encapsulation part top is plane, for installing the camera lens of described camera module, motor or optical filter.
According to one embodiment of the invention, encapsulation part top described in described photosensory assembly has a mounting groove, and described mounting groove is communicated in described through hole, for installing the optical filter of described camera module, camera lens or motor.
According to one embodiment of the invention, encapsulation part described in described photosensory assembly includes a cladding section, an optical filter construction section and a camera lens construction section, described optical filter construction section and described camera lens construction section are upwards molded extension by described cladding section successively, and internal in step-like, in order to optical filter and the camera lens of described camera module are installed.According to one embodiment of the invention, camera lens construction section described in described photosensory assembly has a camera lens inwall, and described camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.
According to one embodiment of the invention, camera lens construction section described in described photosensory assembly has a camera lens inwall, and described camera lens inner wall surface has screw thread, is suitable for installing a threaded camera lens.
According to one embodiment of the invention, photographic department described in described photosensory assembly includes at least one connecting line, each described connecting line electrically connects described sensitive chip and described wiring board main body, and described encapsulation part is coated with described connecting line, so that described connecting line will not be directly exposed to outside.
According to one embodiment of the invention, connecting line described in described photosensory assembly is selected from combination: the one in gold thread, silver wire, copper cash or aluminum steel.
According to one embodiment of the invention, connecting line described in described photosensory assembly curvedly connects described wiring board main body and described sensitive chip.
According to one embodiment of the invention, sensitive chip described in described photosensory assembly includes a photosensitive area and a non-photo-sensing district, described non-photo-sensing district is peripheral around described photosensitive area, described encapsulation part molding extends to the described non-photo-sensing district of described sensitive chip, the mouldable scope inside to extend described encapsulation part, reduces the Outside Dimensions of described encapsulation part.
According to one embodiment of the invention, photographic department described in described photosensory assembly includes at least one component, described component protrudes from described wiring board main body, and described encapsulation part is coated with described component, so that described component will not be directly exposed to outside.
According to one embodiment of the invention, component described in described photosensory assembly selects combination: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay.
According to one embodiment of the invention, photographic department described in described photosensory assembly includes an optical filter, described optical filter is covered in described sensitive chip, described encapsulation part takes shape in described wiring board main body, described sensitive chip and described optical filter, so that protecting described sensitive chip by described optical filter, and reduce the back focal length of described camera module so that it is highly reduce.
According to one embodiment of the invention, photographic department described in described photosensory assembly includes a back-up coat, and described back-up coat lamination is arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body.
According to one embodiment of the invention, back-up coat described in described photosensory assembly is metallic plate, to strengthen the heat dispersion of described photographic department.
According to one embodiment of the invention, photographic department described in described photosensory assembly includes a screen layer, and described screen layer wraps up described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly.
According to one embodiment of the invention, screen layer described in described photosensory assembly is metallic plate or wire netting.
According to one embodiment of the invention, in described photosensory assembly, wiring board main body has at least one reinforced hole, and described encapsulation part extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body.
According to one embodiment of the invention, reinforced hole described in described photosensory assembly is groove-like.
According to one embodiment of the invention, reinforced hole described in described photosensory assembly is through hole, so that the moulding material of described encapsulation part and described wiring board main body are fully contacted, and easily fabricated.
According to one embodiment of the invention, the material of wiring board main body described in described photosensory assembly can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
According to one embodiment of the invention, the material of encapsulation part described in described photosensory assembly is selected from combination: one or more in nylon, LCP, PP or resin.
Another aspect of the present invention provides the manufacture method of the photosensory assembly of a camera module, and it includes step: encapsulated moulding one encapsulation part in a wiring board main body and a sensitive chip.
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: attaches described sensitive chip in a wiring board main body, and is electrically connected by least one connecting line.
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: be coated with described connecting line by described encapsulation part.
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: extend a described encapsulation part non-photo-sensing district to described sensitive chip.
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: form a mounting groove on described encapsulation part top, in order to install an optical filter, motor or camera lens.
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: upwardly extends described encapsulation part, and is internally formed two stage stepped structure, in order to install optical filter or camera lens.
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: be threaded structure at described encapsulation part inwall, in order to install threaded camera lens.
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: arranges at least one groove-like reinforced hole in described wiring board main body, and makes described encapsulation part extend into described reinforced hole.
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: arranges at least one through hole shape reinforced hole in described wiring board main body, and makes described encapsulation part extend into described reinforced hole.
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: attach a back-up coat at described wiring board main body bottom, to strengthen the structural strength of described wiring board main body.
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: be coated with a screen layer in described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly.
Another aspect of the present invention provides the photosensory assembly of a camera module, and it includes an encapsulation part and a photographic department；Institute's photographic department includes a wiring board main body, a sensitive chip and an optical filter, and described encapsulation part encapsulated moulding is in described wiring board main body, described sensitive chip and described optical filter.
Another aspect of the present invention provides encapsulation part described in the photosensory assembly of a camera module to have a camera lens mounting groove, and described camera lens mounting groove is communicated in described through hole, in order to camera lens or motor for described camera module provide installation site
Another aspect of the present invention provides the manufacture method of the photosensory assembly of a camera module, and it includes step: encapsulate an encapsulation part on a wiring board main body, a sensitive chip and an optical filter.
According to another embodiment of the present invention, the manufacture method of described photosensory assembly includes step: attaches described sensitive chip in a wiring board main body, and is electrically connected by least one connecting line.
According to another embodiment of the present invention, the manufacture method of described photosensory assembly includes step: cover described optical filter on described sensitive chip, to protect described sensitive chip.
According to another embodiment of the present invention, the manufacture method of described photosensory assembly includes step: be coated with described connecting line and described optical filter by described encapsulation part.
According to another embodiment of the present invention, the manufacture method of described photosensory assembly includes step: extend described encapsulation part to described optical filter edge.
Thering is provided a camera module according to a further aspect in the invention, it includes the photosensory assembly described in；With a camera lens；Described camera lens is positioned at the photosensitive path of the described sensitive chip of described photosensory assembly.
According to one embodiment of the invention, described camera module includes a support, and described support is installed in described photosensory assembly, and described camera lens is installed in described support.
According to one embodiment of the invention, described camera module includes a motor, and described camera lens is installed in described motor, and described motor is installed in described photosensory assembly.
According to one embodiment of the invention, described camera module includes an optical filter, and described optical filter is installed in described photosensory assembly.
According to one embodiment of the invention, described camera module includes an optical filter, and described optical filter is installed in described support.
Accompanying drawing explanation
Fig. 1 is the camera module cut-away view of tradition COB technique.
Fig. 2 is the axonometric chart of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 3 is the cut-away view of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 4 is the manufacture process schematic diagram of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 5 is the manufacture method schematic diagram of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 6 is the camera module cut-away view of first preferred embodiment according to the present invention.
Fig. 7 is the camera module exploded view of first preferred embodiment according to the present invention.
Fig. 8 is another camera module cut-away view of first preferred embodiment according to the present invention.
Fig. 9 is the exploded view of another camera module of first preferred embodiment according to the present invention.
Figure 10 is the cut-away view of the photosensory assembly of second preferred embodiment according to the present invention.
Figure 11 is the camera module cut-away view of second preferred embodiment according to the present invention.
Figure 12 is the sectional view of the photosensory assembly of the 3rd preferred embodiment according to the present invention.
Figure 13 is the camera module cut-away view of the 3rd preferred embodiment according to the present invention.
Figure 14 is another camera module cut-away view of the 3rd preferred embodiment according to the present invention.
Figure 15 is the cut-away view of the photosensory assembly of the 4th preferred embodiment according to the present invention.
Figure 16 is the photosensory assembly manufacture method schematic diagram of the 4th preferred embodiment according to the present invention.
Figure 17 is the camera module cut-away view of the 4th preferred embodiment according to the present invention.
Figure 18 is another camera module cut-away view of the 4th preferred embodiment according to the present invention.
Figure 19 is the photosensory assembly cut-away view of the 5th preferred embodiment according to the present invention.
Figure 20 is the camera module cut-away view of the 5th preferred embodiment according to the present invention.
Figure 21 is the photosensory assembly cut-away view of the 6th preferred embodiment according to the present invention.
Figure 22 is the camera module cut-away view of the 6th preferred embodiment according to the present invention.
Figure 23 is the photosensory assembly cut-away view of the 7th preferred embodiment according to the present invention.
Figure 24 is the photosensory assembly exploded view of the 7th preferred embodiment according to the present invention.
Figure 25 is the module photosensory assembly cut-away view of the 8th preferred embodiment according to the present invention.
Figure 26 is the camera module cut-away view of the 9th preferred embodiment according to the present invention.
Figure 27 is the camera module sectional view of the tenth preferred embodiment according to the present invention.
Figure 28 A and 28B is the beneficial effect comparison diagram of the camera module of the above preferred embodiment according to the present invention.
Detailed description of the invention
It is described below for disclosing the present invention so that those skilled in the art are capable of the present invention.Preferred embodiment in being described below is only used as citing, it may occur to persons skilled in the art that other apparent modification.The ultimate principle of the present invention defined in the following description can apply to other embodiments, deformation program, improvement project, equivalent and the other technologies scheme without departing from the spirit and scope of the present invention.
What it will be understood by those skilled in the art that is, in the exposure of the present invention, term " longitudinal direction ", " transverse direction ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than the device of instruction or hint indication or element must have specific orientation, with specific azimuth configuration and operation, therefore above-mentioned term is not considered as limiting the invention.
With reference to Fig. 2 to Fig. 7, it is illustrated according to the photosensory assembly of the first of the present invention preferred embodiment and camera module.Described photosensory assembly 10 camera module described in assembly.Described photosensory assembly 10 includes encapsulation part 11 and a photographic department 12, is connected to described photographic department 12 described encapsulation part 11 integral packaging, photographic department 12 as described in molded being connected to.
Described photographic department 12 includes wiring board main body 122 and a sensitive chip 121, and described sensitive chip 121 is arranged in described wiring board main body 122.According to this embodiment of the invention, it is connected to described wiring board main body 122 described sensitive chip 121 molding.Especially, described encapsulation part 11 (MoldingonChip, MOC) in the way of being molded into chip is molded into described photographic department 12.
According to this embodiment of the present invention, described photographic department 12 includes a connection line (not shown) and at least one component 123.Described connection line defaults in described wiring board main body 122, and described component 123 is electrically connected to described connection line and described sensitive chip 121, for the photosensitive work process of described sensitive chip 121.Described component 123 is arranged at described wiring board main body 122 projectedly.Described component 123 it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123 is coated on inside it by described encapsulation part 11, hence in so that described component 123 will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123, without affecting described sensitive chip 121, it is different from the existing way that in tradition camera module, circuit devcie exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123 surface, avoid polluting described sensitive chip 121 and make camera module that the bad phenomenon such as dirty stain occur.
It is worth mentioning that, in this embodiment in accordance with the invention, protrude wiring board main body 122 described in for described component 123 to illustrate, and in other embodiments of the invention, described component 123 can be embedded in described wiring board main body 123 and non-bulging in described wiring board main body, those skilled in the art is it should be appreciated that the shape of described component 123, type and arrange the restriction that position is not the present invention.
Described encapsulation part 11 forms a through hole 1100, in order to provide photosensitive path for described sensitive chip 121.
This preferred embodiment according to the present invention, described photographic department 12 includes at least one connecting line 124, is used for electrically connecting described sensitive chip 121 and described wiring board main body 122.Further, each described connecting line 124 may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..Low especially, described connecting line 124 curvedly connects described sensitive chip 121 and described wiring board main body 122.
It is worth mentioning that, it is internal that each described connecting line 124 is molded into described encapsulation part 11, such that it is able to each described connecting line 124 is coated with by described encapsulation part 11, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124 will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124 simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121 and described wiring board main body 122, this point is totally different from prior art.
Preferably, the bottom of the described through hole 1100 of described encapsulation part 11 in be gradually increased from the bottom to top skewed, but this shape and be not understood to restriction the present invention.
It is worth mentioning that; described encapsulation part 11 is coated with described component 123 and described connecting line 124; have and protect described component 123 and described connecting line 124 and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11 is not limited to be coated with described component 123 or described connecting line 124.It is to say, in other embodiments of the invention, described encapsulation part 11 can directly be molded into the described wiring board main body 122 of the described component 123 not protruded, it is also possible to be molded into outside described component 123, the diverse location such as surrounding.
Further, described sensitive chip 121 has photosensitive area 1211 and a non-photo-sensing district 1212, and it is peripheral that described non-photo-sensing district 1212 is surrounded on described photosensitive area 1211.Described photosensitive area 1211 is used for carrying out photosensitization, and described connecting line 124 is connected to described non-photo-sensing district 1212.
This preferred embodiment according to the present invention, described encapsulation part 11 extends the described non-photo-sensing district 1212 of described sensitive chip 121, thus described sensitive chip 121 is fixed on described wiring board main body 122 by the mode lamination molded.By such mode, as being molded into the mode (MoldingonChip of chip, MOC) the inside mouldable scope of described encapsulation part 11 is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122 and described encapsulation part 11, reduce the length and width size of described photosensory assembly 10 further, reduce by the length and width size of the described camera module of its assembling.
In this embodiment in accordance with the invention, the protruding ground of described encapsulation part 11 is outside the described photosensitive area 1211 of described sensitive chip 121, especially, described encapsulation part 11 closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10 is used to assemble described camera module, described sensitive chip 121 is sealed in inside, form space in a closing.
nullSpecifically，When manufacturing described photosensory assembly 10，A traditional wiring board can be chosen as described wiring board main body 122，Described wiring board main body 122 arranges sensitive chip 121 described in，Described sensitive chip 121 is electrically connected by described connecting line 124，And then described molding wiring board main body 122 after preliminary assembling and molding on sensitive chip 121 parts，Such as form described encapsulation part 11 with mould pressing process (Molding) conventional in semiconductor packages，Or described wiring board main body 122 can be chosen as and use injection machine，By insert molding (InsertMolding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11，Described wiring board main body 122 can be chosen as，Citing ground but be not limited to，Rigid Flex、Ceramic substrate (without soft board)、PCB hardboard (without soft board) etc..Described encapsulation part 11 formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11 can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention.
It is worth mentioning that, based on the molded mode of the described photosensory assembly 10 of the present invention, described photosensory assembly 10 is more suitable for layout operation, once completes the manufacture of the described photosensory assembly 10 of more amount, such as can reach 90, and traditional wiring board once can only produce at most 8.
Further, described encapsulation part 11 includes cladding section 111 and an optical filter construction section 112, it is integrally connected to described cladding section 111 described optical filter construction section 112 molding, described cladding section 111 molding is connected to described wiring board main body 122, is used for being coated with described component 123 and described connecting line 124.Described optical filter construction section 112 is used for installing an optical filter 20, that is, when described photosensory assembly 10 is used to assemble described camera module, the described optical filter 20 of described camera module is installed in described optical filter construction section 112, described optical filter 20 is positioned on the photosensitive path of described sensitive chip 121, and extra optical filter mounting bracket need not be provided.That is, described encapsulation part 11 has the function of conventional stent herein, but it is based on the advantage of moulding technology, described optical filter construction section 112 top can by the technology mode of mold, make it have good planarization, so that described optical filter 20 is entirely mounted, this point is also an advantage over traditional camera module.Especially, described optical filter 20 is a cutoff filter IRCF.
Further, described optical filter construction section 112 has a mounting groove 1121, described mounting groove 1211 is communicated in described through hole 1100, provides sufficient installing space for described optical filter 20 so that described optical filter 20 will not protrude from the top surface of described camera lens construction section 112.It is to say, described encapsulation part 11 upper end arranges described mounting groove, such that it is able to described optical filter 20 is installed on wherein.
It is worth mentioning that, in this embodiment in accordance with the invention, described mounting groove 1121 may be used for installing optical filter, and in other enforcements of the present invention, described mounting groove 1121 can be used to the parts such as motor or the camera lens of installing described camera module, those skilled in the art is it should be appreciated that the purposes of described mounting groove is not the restriction of the present invention.
It is noted that the inwall of described encapsulation part 11 can according to the shape of described connection and arrange, be such as set to skewed, thus making described sensitive chip 121 can receive more light being coated with while described connecting line 124.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11 is not the restriction of the present invention.
With reference to Fig. 2 to Fig. 7, the camera module according to the first of the present invention preferred embodiment.Described camera module can be one focus module (FixFocusModel, FFM).Described camera module includes optical filter 20 and a camera lens 30 described in photosensory assembly 10, described in.
Described optical filter 20 is installed in described photosensory assembly 10, and described camera lens 30 is installed on described photosensory assembly 10.
More specifically, described optical filter 20 is installed in the described mounting groove 1121 of the described optical filter construction section 112 of the described encapsulation part 11 of described photosensory assembly 10.Described camera lens 30 is by the top of the described optical filter construction section 112 by the described encapsulation part 11 being installed on described photosensory assembly 10.It is to say, described optical filter is installed in described mounting groove, described camera lens 30 is installed in described encapsulation part 11 top.
It will also be appreciated that, described camera lens 30 is installed in described optical filter construction section 112 top of the described encapsulation part 11 of described photosensory assembly 10, thus described encapsulation part 11 is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 30, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11 is fixed on described wiring board main body 122 by moulding technology, fixation procedure need not be pasted, molding mode is relative to pasting the fixing controllability with better connective stability and technical process, and the AA glue space adjusted need not be reserved between described encapsulation part 11 and described wiring board main body 122, therefore the tradition camera module AA headspace adjusted is reduced, and when the structural strength such as reaching, the thickness of the described wiring board main body 122 in the molding scheme of the present invention can be less, when optical filter is directly affixed on molded side, rear lens focus can be shorter, the thickness making camera module is reduced,；On the other hand, described encapsulation part 11 is coated with described component 123 and described connecting line 124, traditional cradling function and component 123 and described connecting line 124 can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described encapsulation part 11 of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11 replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles.And described encapsulation part 11 is coated with described connecting line 124, and described encapsulation part 11 extends to the non-photo-sensing district 1212 of described sensitive chip 121 so that described encapsulation part 11 can to contract, thus reducing the horizontal length and width size of described camera module further.
With reference to Fig. 2 to Fig. 5 and Fig. 8 and Fig. 9, being another camera module of first preferred embodiment according to the present invention, described camera module can be a dynamic burnt camera module (AutomaticFocusModel, AFM).Described camera module includes motor 40 and a camera lens 30 described in optical filter 20, described in photosensory assembly 10, described in.
Described optical filter 20 is installed in described photosensory assembly 10, and described camera lens 30 is installed in described motor 40, and described motor 40 is installed on described molding circuit pack 10.
Further, described optical filter 20 is installed in the described mounting groove 1121 of the described optical filter construction section 112 of the described encapsulation part 11 of described photosensory assembly 10.Described motor 40 is installed in described optical filter construction section 112 top of the described encapsulation part 11 of described photosensory assembly 10.It is to say, described optical filter 20 is installed in the described mounting groove of described encapsulation part 11, described camera lens 30 is installed in described motor 40, and described motor 40 is installed in the top of described encapsulation part 11.
Especially, when described pin is adhered to described circuit junction by conducting resinl attaching mode, it may not be necessary to welding lead connects the described wiring board main body 122 of described horse 40 and described photographic department 12, thus reducing the technical process of motor welding.
It will be apparent to a skilled person that the structure of above-mentioned camera module and type are only used as citing, illustrate described camera module can effective mode, be not the restriction of the present invention.
With reference to Figure 10 and Figure 11, according to the camera module photosensory assembly of the second of the present invention preferred embodiment and camera module.Described photosensory assembly 10A is camera module described in assembly, thus obtaining the camera module of moulding type.Described photosensory assembly 10A is connected to described photographic department 12A with including an encapsulation part 11A and a photographic department 12A, described encapsulation part 11A molding.
Described photographic department 12A includes an a wiring board main body 122A and sensitive chip 121A, and described sensitive chip 121A is arranged on described wiring board main body 122A.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121A molding.
According to this embodiment of the present invention, described photographic department 12A includes a connection line (not shown) and at least one component 123A.Described connection line defaults in described wiring board main body 122A, described component 123A and is electrically connected to described connection line and described sensitive chip 121A, for the photosensitive work process of described sensitive chip 121A.Described component 123A is arranged at described wiring board main body 122A projectedly.Described component 123A it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123A is coated on inside it by described encapsulation part 11A, hence in so that described component 123A will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121A environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123A, without affecting described sensitive chip 121A, it is different from the existing way that in tradition camera module, component 123A exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123A surface, avoid polluting described sensitive chip 121A and make camera module that the bad phenomenon such as dirty stain occur.
Described encapsulation part 11A forms a through hole 1100A, in order to provide photosensitive path for described sensitive chip 121A.
This preferred embodiment according to the present invention, described photographic department 12A includes at least one connecting line 124A, is used for electrically connecting described sensitive chip 121A and described wiring board main body 122A.Further, each described connecting line 124A may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..Low especially, described connecting line 124A curvedly connects described sensitive chip 121A and described wiring board main body 122A.It is worth mentioning that, each described connecting line 124A is molded into inside described encapsulation part 11A, such that it is able to each described connecting line 124A is coated with by described encapsulation part 11A, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124A will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124A simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121A and described wiring board main body 122A, this point is totally different from prior art.
It is worth mentioning that; described encapsulation part 11A is coated with described component 123A and described connecting line 124A; there is protection described component 123A and described connecting line 124A and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11A is not limited to be coated with described component 123A or described connecting line 124A.It is to say, in other embodiments of the invention, described encapsulation part 11A can directly be molded into the described wiring board main body 122A of the described component 123A not protruded, it is also possible to be molded into outside described component 123A, the diverse location such as surrounding.
What be different from above preferred embodiment is, described wiring board main body 122A has an inner groovy 1222A, described sensitive chip 121A is arranged in described inner groovy 1222A, so that the relative altitude of described sensitive chip 121A and described wiring board main body 122A reduces, thus when described encapsulation part 11A is coated with described sensitive chip 121A, reduce the requirement for height to described encapsulation part 11A, thus reducing the height of the described photosensory assembly 10A camera module assembled.
Further, described sensitive chip 121A has an a photosensitive area 1211A and non-photo-sensing district 1212A, described non-photo-sensing district 1212A to be surrounded on described photosensitive area 1211A peripheral.Described photosensitive area 1211A is used for carrying out photosensitization, and described connecting line 124A is connected to described non-photo-sensing district 1212A.
This preferred embodiment according to the present invention, described encapsulation part 11A extends the described non-photo-sensing district 1212A of described sensitive chip 121A, thus described sensitive chip 121A is fixed on described wiring board main body 122A by the mode lamination molded.By such mode, as being molded into the mode (Moldingonchip of chip, MOC) the inside mouldable scope of described encapsulation part 11A is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122A and described encapsulation part 11A, reduce the length and width size of described photosensory assembly 12A further, reduce by the length and width size of the described camera module of its assembling.
In this embodiment in accordance with the invention, described encapsulation part 11A projection ground is outside the described photosensitive area 1211A of described sensitive chip 121A, especially, described encapsulation part 11A closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10A is used to assemble described camera module, described sensitive chip 121A is sealed in inside, form space in a closing.
Further, described encapsulation part 11A includes an a cladding section 111A and optical filter construction section 112A, it is integrally connected to described cladding section 111A described optical filter construction section 112A molding, described cladding section 111A molding is connected to described wiring board main body 122A, is used for being coated with described component 123A and described connecting line 124A.Described optical filter construction section 112A is used for installing an optical filter 20A, that is, when described photosensory assembly 10A is used to assemble described camera module, the optical filter 20A of described camera module is installed in described optical filter construction section 112A, described optical filter 20A is positioned on the photosensitive path of described sensitive chip 121A, and extra optical filter 20A mounting bracket need not be provided.That is, described encapsulation part 11A has the function of conventional stent herein, but it is based on the advantage of moulding technology, described optical filter construction section 112A top can by the technology mode of mold, make it have good planarization, so that described optical filter 20A is entirely mounted, this point is also an advantage over traditional camera module.
Further, described optical filter construction section 112A has a mounting groove 1121A, described support slot is communicated in described through hole 1100A, provides sufficient installing space for described optical filter 20A so that described optical filter 20A will not protrude from the top surface of optical filter construction section 112A.It is to say, described encapsulation part 11A upper end arranges described mounting groove, thus by the described encapsulation part 11A that is installed on stable for described optical filter 20A, and the top of described encapsulation part 11A will not be protruded from.
It is noted that the inwall of described molding can according to the shape of described connection and arrange, be such as set to skewed, thus making described sensitive chip 121A can receive more light being coated with while described connecting line 124A.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11A is not the restriction of the present invention.
With reference to Figure 11 and Figure 12, the camera module according to the second of the present invention preferred embodiment.Described camera module can be one focus module.Described camera module includes photosensory assembly 10A described in, an optical filter 20A and camera lens 30A described in.
Described optical filter 20A is installed in described photosensory assembly 10A, and described camera lens 30A is installed on described photosensory assembly 10A.
More specifically, described optical filter 20A is installed in the described mounting groove 1111A of the described optical filter construction section 111A of the described encapsulation part 11A of described photosensory assembly 10A.Described camera lens 30A is by the top of the described optical filter construction section 111A by the described encapsulation part 11A being installed on described photosensory assembly 10A.In other words, described optical filter 20A is installed in the described IR of described encapsulation part 11A and supports grain 1111A, and described camera lens 30A is installed in the top of described encapsulation part 11A.
In other embodiments of the invention, described photosensory assembly 10A can also be assembled as a dynamic burnt camera module.Those skilled in the art it should be appreciated that described in focus camera module and be only used as for example bright present invention, be not the restriction of the present invention.
With reference to Figure 12 and Figure 13, according to the photosensory assembly of the 3rd of the present invention the preferred embodiment and camera module.Described photosensory assembly 10B is camera module described in assembly, thus obtaining the camera module of moulding type.Described photosensory assembly 10B is connected to described photographic department 12B with including an encapsulation part 11B and a photographic department 12B, described encapsulation part 11B molding.
Described photographic department 12B includes an a wiring board main body 122B and sensitive chip 121B, and described sensitive chip 121B is arranged on described wiring board main body 122B.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121B molding.
According to this embodiment of the present invention, described photographic department 12B includes a connection line (not shown) and at least one component 123B.Described connection line defaults in described wiring board main body 122B, described component 123B and is electrically connected to described connection line and described sensitive chip 121B, for the photosensitive work process of described sensitive chip 121B.Described component 123B is arranged at described wiring board main body 122B projectedly.Described component 123B it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123B is coated on inside it by described encapsulation part 11B, hence in so that described component 123B will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121B environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123B, without affecting described sensitive chip 121B, it is different from the existing way that in tradition camera module, component 123B exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123B surface, avoid polluting described sensitive chip 121B and make camera module that the bad phenomenon such as dirty stain occur.
Described encapsulation part 11B forms a through hole 1100B, in order to provide photosensitive path for described sensitive chip 121B.
This preferred embodiment according to the present invention, described photographic department 12B includes at least one connecting line 124B, is used for electrically connecting described sensitive chip 121B and described wiring board main body 122B.Further, each described connecting line 124B may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..Low especially, described connecting line 124B curvedly connects described sensitive chip 121B and described wiring board main body 122B.
It is worth mentioning that, each described connecting line 124B is molded into inside described encapsulation part 11B, such that it is able to each described connecting line 124B is coated with by described encapsulation part 11B, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124B will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124B simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121B and described wiring board main body 122B, this point is not to be provided in prior art completely.
It is worth mentioning that; described encapsulation part 11B is coated with described component 123B and described connecting line 124B; there is protection described component 123B and described connecting line 124B and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11B is not limited to be coated with described component 123B or described connecting line 124B.It is to say, in other embodiments of the invention, described encapsulation part 11B can directly be molded into the described wiring board main body 122B of the described component 123B not protruded, it is also possible to be molded into outside described component 123B, the diverse location such as surrounding.
Further, described sensitive chip 121B has an a photosensitive area 1211B and non-photo-sensing district 1212B, described non-photo-sensing district 1212B to be surrounded on described photosensitive area 1211B peripheral.Described photosensitive area 1211B is used for carrying out photosensitization, and described connecting line 124B is connected to described non-photo-sensing district 1212B.
This preferred embodiment according to the present invention, described encapsulation part 11B extends the described non-photo-sensing district 1212B of described sensitive chip 121B, thus described sensitive chip 121B is fixed on described wiring board main body 122B by the mode lamination molded.By such mode, as being molded into the mode (MoldingonChip of chip, MOC) the inside mouldable scope of described encapsulation part 11B is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122B and described encapsulation part 11B, reduce the length and width size of described molding photographic department 12B part further, reduce by the length and width size of the described camera module of its assembling.
In this embodiment in accordance with the invention, described encapsulation part 11B projection ground is outside the described photosensitive area 1211B of described sensitive chip 121B, especially, described encapsulation part 11B closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10B is used to assemble described camera module, described sensitive chip 121B is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10B, a traditional wiring board can be chosen as described wiring board main body 122B, described wiring board main body 122B arranges sensitive chip 121B described in, by described sensitive chip 121B by described connecting line 124B electrical connection, and then described molding wiring board main body 122B after preliminary assembling and molding on sensitive chip 121B parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11B, or form described encapsulation part 11B with mould pressing process conventional in semiconductor packages.Described wiring board main body 122B can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11B formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11B can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention.
Further, described encapsulation part 11B top end surface is smooth, be suitable to an optical filter 20B is installed, that is, when described photosensory assembly 10B is used to assemble described camera module, the optical filter 20B of described camera module is installed in the top end surface of described encapsulation part 11B so that described optical filter 20B is positioned on the photosensitive path of described sensitive chip 121B, and need not provide extra optical filter 20B mounting bracket.That is, described encapsulation part 11B has the function of conventional stent herein, but it is based on the advantage of moulding technology, described mould top 11B can by the technology mode of mold, make it have good planarization, so that described optical filter 20B is entirely mounted, this point is also an advantage over traditional camera module.
What be different from above preferred embodiment is, in this embodiment in accordance with the invention, the described photographic department 12B of described photosensory assembly 10B includes a back-up coat 125B, it is connected to described wiring board main body 122B bottom, in order to strengthen the structural strength of described wiring board main body 122B described back-up coat 125B lamination.That is, on described wiring board main body 122B, the region bottom at described encapsulation part 11B and described sensitive chip 121B place mounts described back-up coat 125B, so that described wiring board main body 122B reliablely and stablely supports described encapsulation part 11B and described sensitive chip 121B.
Further, described back-up coat 125B is a metallic plate, described metallic plate is attached at the bottom of described wiring board main body 122B, increase the structural strength of described wiring board main body 122B, on the other hand, increasing the heat dispersion of described photosensory assembly 10B, can effectively scatter and disappear the described sensitive chip 121B heat sent.
It is worth mentioning that, described wiring board main body 122B can adopt FPC (FlexPrintCircuit, flexible printed-circuit board), and the rigidity of described FPC is strengthened by described back-up coat 125B so that the FPC with excellent bending performance disclosure satisfy that the bearing requirements of described photosensory assembly 10B.It is to say, the selectable range of described wiring board main body 122B is more extensive, for instance PCB (PrintedCircuitBoard, rigid printed circuit boards), FPC, RF (RigidFlex, Rigid Flex).Increase the structural strength of described wiring board main body 122B by described back-up coat 125B and improve heat dispersion, such that it is able to reduce the thickness of described wiring board main body 122B, the height making described photosensory assembly 10B reduces further, and the height being assembled the camera module obtained by it reduces.
It is worth mentioning that, in this embodiment in accordance with the invention, described back-up coat 125 is plate-shaped is overlapped in described wiring board main body 122B, and in other embodiments of the invention, described back-up coat 125B can extend to the described encapsulation part 11B sidewall of parcel, thus while strengthening the structural strength of described photosensory assembly 10B, strengthening its anti-electromagnetic interference capability.
It is noted that the inwall of described encapsulation part can according to the shape of described connection and arrange, be such as set to skewed, thus making described sensitive chip 121B can receive more light being coated with while described connecting line 124B.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11B is not the restriction of the present invention.
With reference to Figure 12 and Figure 13, the camera module according to the 3rd of the present invention the preferred embodiment.Described camera module can be one focus module (FixFocusModel, FFM).Described camera module includes photosensory assembly 10B described in, an optical filter 20B and camera lens 30B described in.
Described optical filter 20B is installed in described photosensory assembly 10B, and described camera lens 30B is installed on described photosensory assembly 10B.
More specifically, described optical filter 20B is installed in the described encapsulation part 11B top of described photosensory assembly 10B.Described camera lens 30B is by the top by the described encapsulation part 11B being installed on described photosensory assembly 10B.Especially, described optical filter 20B and described camera lens 30B can coordinate configuration according to specific needs in the concrete installation site of described encapsulation part 11B.
It will also be appreciated that, described camera lens 30B is installed in the top of the described encapsulation part 11B of described photosensory assembly 10B, thus described encapsulation part 11B is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 30B, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11B is fixed on described wiring board main body 122B by moulding technology, fixation procedure need not be pasted, molding mode is relative to pasting the fixing controllability with better connective stability and technical process, and the AA glue space adjusted need not be reserved between described encapsulation part 11B and described wiring board main body 122B, therefore the tradition camera module AA headspace adjusted is reduced so that the thickness of camera module is reduced；On the other hand, described encapsulation part 11B is coated with described component 123B and described connecting line 124B, traditional cradling function and component 123B and described connecting line 124B can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described encapsulation part 11B of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11B replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles.And described encapsulation part 11B is coated with described connecting line 124B, and described encapsulation part 11B extends to the non-photo-sensing district 1212B of described sensitive chip 121B so that described encapsulation part 11B can to contract, thus reducing the horizontal length and width size of described camera module further.
With reference to Figure 12 and Figure 14, will be illustrated according to another camera module of the 3rd of the present invention the preferred embodiment.Described camera module can be a dynamic burnt camera module.Described camera module includes photosensory assembly 10B described in, optical filter 20B, a motor 40B and a camera lens 30B described in one.
Described optical filter 20B is installed in described photosensory assembly 10B, described camera lens 30B and is installed in described motor 40B, and described motor 40B is installed on described molding circuit pack.
Further, described optical filter 20B is installed in the top of the described encapsulation part 11B of described photosensory assembly 10B.Described motor 40B is installed on the top of the described encapsulation part 11B of described photosensory assembly 10B.Especially, described optical filter 20B and described motor 40B can coordinate configuration according to specific needs in the concrete installation site of described encapsulation part 11B.
Especially, described engraving circuit 114B electrically connects the described wiring board main body 122B of described motor 40B and described photographic department 12B, such that it is able to do not need the described wiring board main body 122B that welding lead connects described horse 40B and described photographic department 12B, reduce the technical process of motor welding.
It will be apparent to a skilled person that the structure of above-mentioned camera module and type are only used as citing, illustrate described camera module can effective mode, be not the restriction of the present invention.
With reference to Figure 15 and Figure 17, will be illustrated according to the photosensory assembly of the 4th of the present invention the preferred embodiment and camera module.Described photosensory assembly 10C is camera module described in assembly, thus obtaining the camera module of moulding type.Described photosensory assembly 10C is connected to described photographic department 12C with including an encapsulation part 11C and photographic department 12C, described encapsulation part 11C molding.
Described photographic department 12C includes an a wiring board main body 122C and sensitive chip 121C, and described sensitive chip 121C is arranged on described wiring board main body 122C.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121C molding.
According to this embodiment of the present invention, described photographic department 12C includes a connection line (not shown) and at least one component 123C.Described connection line defaults in described wiring board main body 122C, described component 123C and is electrically connected to described connection line and described sensitive chip 121C, for the photosensitive work process of described sensitive chip 121C.Described component 123C is arranged at described wiring board main body 122C projectedly.Described component 123C it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123C is coated on inside it by described encapsulation part 11C, hence in so that described component 123C will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121C environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123C, without affecting described sensitive chip 121C, it is different from the existing way that in tradition camera module, component 123C exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123C surface, avoid polluting described sensitive chip 121C and make camera module that the bad phenomenon such as dirty stain occur.
Described encapsulation part 11C forms a through hole 1100C, in order to provide photosensitive path for described sensitive chip 121C.
This preferred embodiment according to the present invention, described photographic department 12C includes at least one connecting line 124C, is used for electrically connecting described sensitive chip 121C and described wiring board main body 122C.Further, each described connecting line 124C may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..Low especially, described connecting line 124C curvedly connects described sensitive chip 121C and described wiring board main body 122C.
It is worth mentioning that, each described connecting line 124C is molded into inside described encapsulation part 11C, such that it is able to each described connecting line 124C is coated with by described encapsulation part 11C, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124C will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124C simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121C and described wiring board main body 122C, this point is not to be provided in prior art completely.
It is worth mentioning that; described encapsulation part 11C is coated with described component 123C and described connecting line 124C; there is protection described component 123C and described connecting line 124C and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11C is not limited to be coated with described component 123C or described connecting line 124C.It is to say, in other embodiments of the invention, described encapsulation part 11C can directly be molded into the described wiring board main body 122C of the described component 123C not protruded, it is also possible to be molded into outside described component 123C, the diverse location such as surrounding.
Further, described sensitive chip 121C has an a photosensitive area 1211C and non-photo-sensing district 1212C, described non-photo-sensing district 1212C to be surrounded on described photosensitive area 1211C peripheral.Described photosensitive area 1211C is used for carrying out photosensitization, and described connecting line 124C is connected to described non-photo-sensing district 1212C.
This preferred embodiment according to the present invention, described encapsulation part 11C extends the described non-photo-sensing district 1212C of described sensitive chip 121C, thus described sensitive chip 121C is fixed on described wiring board main body 122C by the mode lamination molded.By such mode, mode (Moldingonthechip) being molded into chip expand as described in the inside mouldable scope of encapsulation part 11C, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122C and described encapsulation part 11C, reduce the length and width size of described photosensory assembly further, reduce by the length and width size of the described camera module of its assembling.
In this embodiment in accordance with the invention, described encapsulation part 11C projection ground is outside the described photosensitive area 1211C of described sensitive chip 121C, especially, described encapsulation part 11C closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10C is used to assemble described camera module, described sensitive chip 121C is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10C, a traditional wiring board can be chosen as described wiring board main body 122C, described wiring board main body 122C arranges sensitive chip 121C described in, by described sensitive chip 121C by described connecting line 124C electrical connection, and then described molding wiring board main body 122C after preliminary assembling and molding on sensitive chip 121C parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11C, or form described encapsulation part 11C with mould pressing process conventional in semiconductor packages.Described wiring board main body 122C can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11C formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11C can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention.
Described photosensory assembly 10C with farther including an optical filter 20C, described optical filter 20C molding lamination is arranged on described sensitive chip 121C.The edge of described optical filter 20C is molded into described encapsulation part 11C, thus fixing described optical filter 20C.It is noted that described optical filter 20C is covered in above described sensitive chip 121C, by described sensitive chip 121C and external environment condition isolation, described sensitive chip 121C is protected to sustain damage and prevent the entrance of dust.
When manufacturing described photosensory assembly 10C, first described sensitive chip 121C is attached at described wiring board main body 122C, and it is connected to described sensitive chip 121C and described wiring board main body 122C by described, and then described optical filter 20C is attached on described sensitive chip 121C, further, described wiring board main body 122C and described sensitive chip 121C and described optical filter 20C is molded, forms described encapsulation part 11C.When molding, owing to described optical filter 20C is covered on described sensitive chip 121C, therefore, it is possible to prevent the mould injury for described sensitive chip 121C of molding, and owing to the distance of described optical filter 20C and described sensitive chip 121C reduces, therefore can so that being reduced by the back focal length of the camera module of its assembling, thus reducing the height of described camera module, on the other hand, owing to being not necessary for the described optical filter 20C support parts providing extra, the thickness of described camera module is therefore also made to be further reduced to a certain extent.
It is noted that the inwall of described encapsulation part 10C can according to the shape of described connection and arrange, be such as set to skewed, thus many light such as can receive being coated with while described connecting line 124C to make described sensitive chip 121C.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11C is not the restriction of the present invention.
With reference to Figure 15 to Figure 17, the camera module according to the 4th of the present invention the preferred embodiment.Described camera module can be one focus module.Described camera module includes photosensory assembly 10C described in an one and camera lens 30C.Described camera lens 30C is installed on described photosensory assembly 10C, assembles and forms described camera module.
Especially, described camera lens 30C can be fixed on the top of the described encapsulation part 11C of described photosensory assembly 10C by bonding mode, and by the feature of Making mold in moulding technology, the top making described encapsulation part 11C has good planarization, good mounting condition is provided, thus obtaining the camera module of high-quality for described camera lens 30C.
It is worth mentioning that, described camera lens 30C is installed in the top of the described encapsulation part 11C of described photosensory assembly 10C, thus described encapsulation part 11C is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 30C, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11C is fixed on described wiring board main body 122C by moulding technology, fixation procedure need not be pasted, molding mode is relative to pasting the fixing controllability with better connective stability and technical process, and the AA glue space adjusted need not be reserved between described encapsulation part 11C and described wiring board main body 122C, therefore the tradition camera module AA headspace adjusted is reduced so that the thickness of camera module is reduced；On the other hand, described encapsulation part 11C is coated with described component 123C and described connecting line 124C, traditional cradling function and component 123C and described connecting line 124C can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described encapsulation part 11C of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11C replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles.And described encapsulation part 11C is coated with described connecting line 124C, and described encapsulation part 11C extends to the non-photo-sensing district 1212C of described sensitive chip 121C so that described encapsulation part 11C can to contract, thus reducing the horizontal length and width size of described camera module further.And, described optical filter 20C is molded inside it by described photosensory assembly 10C, therefore when assembling described camera module, need not again carry out the stickup installation process of optical filter, thus reducing camera module packaging technology process, improving work efficiency, these are all an advantage over prior art.
With reference to Figure 15, Figure 16 and Figure 18, it is that another camera module of the 4th preferred embodiment according to the present invention will be illustrated.Described camera module can be a dynamic burnt camera module (AutomaticFocusModel, AFM).Described camera module includes photosensory assembly 10C described in, a motor 40C and a camera lens 30C.
Described camera lens 30C is installed in described motor 40C, described motor 40C and is installed on described photosensory assembly 10C, in order to regulate described camera module focal length by described motor 40C.Described motor 40C is installed on the top of the described encapsulation part 11C of described photosensory assembly 10C.
Especially, described engraving circuit 114C electrically connects the described wiring board main body 122C of described motor 40C and described photographic department 12C, such that it is able to do not need the described wiring board main body 122C that welding lead connects described motor 40C and described photographic department 12C, reduce the technical process of motor welding.
It will be apparent to a skilled person that the structure of above-mentioned camera module and type are only used as citing, illustrate described camera module can effective mode, be not the restriction of the present invention.
With reference to Figure 19 and 20, will be illustrated according to the photosensory assembly of the 5th of the present invention the preferred embodiment and camera module.Described photosensory assembly 10D is camera module described in assembly, thus obtaining the described camera module of moulding type.Described photosensory assembly 10D is connected to described photographic department 12D with including an encapsulation part 11D and a photographic department 12D, described encapsulation part 11D molding.
Especially, described encapsulation part is molded into described photographic department 12D in the way of MOC.
Described photographic department 12D includes an a wiring board main body 122D and sensitive chip 121D, and described sensitive chip 121D is arranged on described wiring board main body 122D.According to this embodiment of the invention, it is connected to described wiring board main body 122D described sensitive chip 121D molding.
According to this embodiment of the present invention, described photographic department 12D includes a connection line (not shown) and at least one component 123D.Described connection line defaults in described wiring board main body 122D, described component 123D and is electrically connected to described connection line and described sensitive chip 121D, for the photosensitive work process of described sensitive chip 121D.Described component 123D is arranged at described wiring board main body 122D projectedly.Described component 123D it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..It is worth mentioning that, described component 123D is coated on inside it by described encapsulation part 11D, hence in so that described component 123D will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121D environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123D, without affecting described sensitive chip 121D, it is different from the existing way that in tradition camera module, component 123D exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123D surface, avoid polluting described sensitive chip 121D and make camera module that the bad phenomenon such as dirty stain occur.
Described encapsulation part 11D forms a through hole 1100D, in order to provide photosensitive path for described sensitive chip 121D.
This preferred embodiment according to the present invention, described photographic department 12D includes at least one connecting line 124D, is used for electrically connecting described sensitive chip 121D and described wiring board main body 122D.Further, each described connecting line 124D may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..Low especially, described connecting line 124D curvedly connects described sensitive chip 121D and described wiring board main body 122D.
It is worth mentioning that, each described connecting line 124D is molded into inside described encapsulation part 11D, such that it is able to each described connecting line 124D is coated with by described encapsulation part 11D, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124D will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124D simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121D and described wiring board main body 122D, this point is not to be provided in prior art completely.
It is worth mentioning that; described encapsulation part 11D is coated with described component 123D and described connecting line 124D; there is protection described component 123D and described connecting line 124D and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11D is not limited to be coated with described component 123D or described connecting line 124D.It is to say, in other embodiments of the invention, described encapsulation part 11D can directly be molded into the described wiring board main body 122D of the described component 123D not protruded, it is also possible to be molded into outside described component 123D, the diverse location such as surrounding.
Described photosensory assembly 10D with farther including an optical filter 20D, described optical filter 20D molding lamination is arranged on described sensitive chip 121D.The edge of described optical filter 20D is molded into described encapsulation part 11D, thus fixing described optical filter 20D.It is noted that described optical filter 20D is covered in above described sensitive chip 121D, by described sensitive chip 121D and external environment condition isolation, described sensitive chip 121D is protected to sustain damage and prevent the entrance of dust.
Further, described sensitive chip 121D has an a photosensitive area 1211D and non-photo-sensing district 1212D, described non-photo-sensing district 1212D to be surrounded on described photosensitive area 1211D peripheral.Described photosensitive area 1211D is used for carrying out photosensitization, and described connecting line 124D is connected to described non-photo-sensing district 1212D.
This preferred embodiment according to the present invention, described encapsulation part 11D extends the described non-photo-sensing district 1212D of described sensitive chip 121D, thus described sensitive chip 121D is fixed on described wiring board main body 122D by the mode lamination molded.By such mode, as being molded into the mode (MoldingontheChip of chip, MOC) the inside mouldable scope of described encapsulation part 11D is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122D and described encapsulation part 11D, reduce the length and width size of described molding photographic department 12D part further, reduce by the length and width size of the described camera module of its assembling.
In this embodiment in accordance with the invention, described encapsulation part 11D projection ground is outside the described photosensitive area 1211D of described sensitive chip 121D, especially, described encapsulation part 11D closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10D is used to assemble described camera module, described sensitive chip 121D is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10D, a traditional wiring board can be chosen as described wiring board main body 122D, described wiring board main body 122D arranges sensitive chip 121D described in, by described sensitive chip 121D by described connecting line 124D electrical connection, and then described molding wiring board main body 122D after preliminary assembling and molding on sensitive chip 121D parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11D, or form described encapsulation part 11D with mould pressing process conventional in semiconductor packages.Described wiring board main body 122D can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11D formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11D can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention.
Further, described encapsulation part 11D includes a cladding section 111D, an optical filter construction section 112D and a camera lens construction section 113D, described optical filter construction section 112D and described camera lens construction section 113D molds integratedly successively and is connected to described cladding section 111D, described cladding section 111D molding is connected to described wiring board main body 122D, is used for being coated with described component 123D and described connecting line 124D.Described camera lens construction section 113D is used for installing a camera lens 30D, that is, when described photosensory assembly 10D is used to assemble described camera module, described camera lens 30D is installed in inside the described camera lens construction section 113D of described encapsulation part 11D, in order to provide stable installation site for described camera lens 30D.Described camera lens construction section 113D has a camera lens mounting groove 1131D, and described camera lens mounting groove 1131D is communicated in described through hole 1100D, provides sufficient installing space for described camera lens 30D.It is installed in described mounting groove 1121D, described camera lens 30D is installed in described camera lens mounting groove 1131D it is to say, described encapsulation part 11D has camera lens mounting groove 1131D described in mounting groove 1121D and one described in, described optical filter 20D.
Described camera lens construction section 113D upwardly extends integratedly, and is internally formed step-like structure, provides for described camera lens 30D and supports fixed position, from without providing extra parts to install described camera lens 30D.In other words, described encapsulation part 11D upwardly extends integratedly, and is internally formed step-like, to be respectively coated by described component and described connecting line and to support described camera lens.
Described camera lens construction section 113D has a camera lens inwall 1132D, and described camera lens inwall 1132D is closed annular, is suitable for described camera lens 30D and provides installing space.It is noted that the described camera lens inwall 1132D surfacing of described camera lens construction section 113D, thus being suitable to install threadless described camera lens 30D, being formed and focusing module.Especially, described camera lens 30D can be fixed on described camera lens construction section 113D by bonding mode.
It is worth mentioning that, the inwall of the described cladding section 111D of described encapsulation part 11D can according to the shape of described connection and arrange, such as it is set to skewed, thus making described sensitive chip 121D can receive more light while being coated with described connecting line 124D.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11D is not the restriction of the present invention.
With reference to Figure 20, the camera module according to the 5th of the present invention the preferred embodiment.Described camera module can be one focus module.Described camera module includes camera lens 30D described in photosensory assembly 10D and one described in.
More specifically, described camera lens 30D is installed in the described camera lens mounting groove 1131D of the described camera lens construction section 113D of the described encapsulation part 11D of described photosensory assembly 10D.Described optical filter 20D is molded into described photosensory assembly 11D, therefore need not provide extra optical filter, it is not required that when assembling described shooting molding, separately installed optical filter, therefore, reduce the process assembled, and the mode of molding optical filter makes the back focal length of described camera module to reduce.
It will also be appreciated that, described camera lens 30D is installed in the described camera lens construction section 113D of the described encapsulation part 11D of described photosensory assembly 10D, thus described encapsulation part 11D is equivalent to the function of the support in tradition camera module or lens barrel, there is provided support, fixed position for described camera lens 30D, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11D is fixed on described wiring board main body 122D by moulding technology, fixation procedure need not be pasted, molding mode is relative to pasting the fixing controllability with better connective stability and technical process, and the AA glue space adjusted need not be reserved between described encapsulation part 11D and described wiring board main body 122D, therefore the tradition camera module AA headspace adjusted is reduced, the thickness making camera module is reduced, and the described encapsulation part 11D according to the molding mode of the present invention has good flatness, therefore when assembling described camera module, AA adjustment can not be carried out；On the other hand, described encapsulation part 11D is coated with described component 123D and described connecting line 124D, traditional cradling function and component 123D and described connecting line 124D can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described encapsulation part 11D of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11D replaces traditional support, and provide installation site for described camera lens 30D, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles.And described encapsulation part 11D is coated with described connecting line 124D, and described encapsulation part 11D extends to the non-photo-sensing district 1212D of described sensitive chip 121D so that described encapsulation part 11D can to contract, thus reducing the horizontal length and width size of described camera module further.
With reference to Figure 21 and Figure 22, will be illustrated according to the photosensory assembly of the 6th preferred embodiment of the present invention and camera module.Described photosensory assembly 10E is camera module described in assembly, thus obtaining the described camera module of moulding type.Described photosensory assembly 10E is connected to described photographic department 12E with including an encapsulation part 11E and photographic department 12E, described encapsulation part 11E molding.
Described photographic department 12E includes an a wiring board main body 122E and sensitive chip 121E, and described sensitive chip 121E is arranged on described wiring board main body 122E.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121E molding.
According to this embodiment of the present invention, described photographic department 12E includes a connection line (not shown) and at least one component 123E.Described connection line defaults in described wiring board main body 122E, described component 123E and is electrically connected to described connection line and described sensitive chip 121E, for the photosensitive work process of described sensitive chip 121E.Described component 123E is arranged at described wiring board main body 122E projectedly.Described component 123E it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123E is coated on inside it by described encapsulation part 11E, hence in so that described component 123E will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121E environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123E, without affecting described sensitive chip 121E, it is different from the existing way that in tradition camera module, component 123E exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123E surface, avoid polluting described sensitive chip 121E and make camera module that the bad phenomenon such as dirty stain occur.
Described encapsulation part 11E forms a through hole 1100E, in order to provide photosensitive path for described sensitive chip 121E.
This preferred embodiment according to the present invention, described photographic department 12E includes at least one connecting line 124E, is used for electrically connecting described sensitive chip 121E and described wiring board main body 122E.Further, each described connecting line 124E may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..Low especially, described connecting line 124E curvedly connects described sensitive chip 121E and described wiring board main body 122E.
It is worth mentioning that, each described connecting line 124E is molded into inside described encapsulation part 11E, such that it is able to each described connecting line 124E is coated with by described encapsulation part 11E, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124E will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124E simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121E and described wiring board main body 122E, this point is not to be provided in prior art completely.
It is worth mentioning that; described encapsulation part 11E is coated with described component 123E and described connecting line 124E; there is protection described component 123E and described connecting line 124E and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11E is not limited to be coated with described component 123E or described connecting line 124E.It is to say, in other embodiments of the invention, described encapsulation part 11E can directly be molded into the described wiring board main body 122E of the described component 123E not protruded, it is also possible to be molded into outside described component 123E, the diverse location such as surrounding.
Described photosensory assembly 10E with farther including an optical filter 20E, described optical filter 20E molding lamination is arranged on described sensitive chip 121E.The edge of described optical filter 20E is molded into described encapsulation part 11E, thus fixing described optical filter 20E.It is noted that described optical filter 20E is covered in above described sensitive chip 121E, by described sensitive chip 121E and external environment condition isolation, described sensitive chip 121E is protected to sustain damage and prevent the entrance of dust.
Further, described sensitive chip 121E has an a photosensitive area 1211E and non-photo-sensing district 1212E, described non-photo-sensing district 1212E to be surrounded on described photosensitive area 1211E peripheral.Described photosensitive area 1211E is used for carrying out photosensitization, and described connecting line 124E is connected to described non-photo-sensing district 1212E.
This preferred embodiment according to the present invention, described encapsulation part 11E extends the described non-photo-sensing district 1212E of described sensitive chip 121E, thus described sensitive chip 121E is fixed on described wiring board main body 122E by the mode lamination molded.By such mode, mode (Moldingonchip) being molded into chip expand as described in the inside mouldable scope of encapsulation part 11E, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122E and described encapsulation part 11E, reduce the length and width size of described molding photographic department 12E further, reduce by the length and width size of the described camera module of its assembling.
In this embodiment in accordance with the invention, described encapsulation part 11E projection ground is outside the described photosensitive area 1211E of described sensitive chip 121E, especially, described encapsulation part 11E closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10E is used to assemble described camera module, described sensitive chip 121E is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10E, a traditional wiring board can be chosen as described wiring board main body 122E, described wiring board main body 122E arranges sensitive chip 121E described in, by described sensitive chip 121E by described connecting line 124E electrical connection, and then described molding wiring board main body 122E after preliminary assembling and molding on sensitive chip 121E parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11E, or form described encapsulation part 11E with mould pressing process conventional in semiconductor packages.Described wiring board main body 122E can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11E formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11E can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention.
Further, described encapsulation part 11E includes an a cladding section 111E and camera lens construction section 113E, described camera lens construction section 113E molds integratedly and is connected to described cladding section 111E, described cladding section 111E molding is connected to described wiring board main body 122E, is used for being coated with described component 123E and described connecting line 124E.Described camera lens construction section 113E is used for installing a camera lens 30E, that is, when described photosensory assembly 10E is used to assemble described camera module, described camera lens 30E is installed in inside the described camera lens construction section 113E of described encapsulation part 11E, in order to provide stable installation site for described camera lens 30E.
Further, described camera lens construction section 113E has a camera lens mounting groove 1131E, and described camera lens mounting groove 1131E is communicated in described through hole 1100E, provides sufficient installing space for described camera lens 30E.It is to say, described encapsulation part 11E has camera lens mounting groove 1131E described in, described camera lens 30E is installed in described camera lens mounting groove 1131E.
Described camera lens construction section 113E upwardly extends integratedly along described covering portion 111E, and is internally formed step-like structure, provides for described camera lens 30E and supports fixed position, from without providing extra parts to install described camera lens 30E.In other words, described encapsulation part 11E upwardly extends integratedly, and is internally formed step-like, to be respectively coated by described component and described connecting line 124E, and supports described camera lens 30E.
Described camera lens construction section 113E has a camera lens inwall 1132E, and described camera lens inwall 1132E is closed annular, and being suitable to camera lens 30E provides installing space.It is noted that the described camera lens inwall 1132E surface of described camera lens construction section 113E has helicitic texture, thus being suitable to install threaded described camera lens 30E, being formed and focusing module.Especially, the mode that described camera lens 30E can pass through to be spirally connected is fixed on described camera lens construction section 113E.
It is noted that the inwall of the described cladding section 111E of described molding can according to the shape of described connection and arrange, be such as set to skewed, thus many light such as can receive being coated with while described connecting line 124E to make described sensitive chip 121E.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11E is not the restriction of the present invention.
With reference to Figure 22, the camera module according to the 6th of the present invention the preferred embodiment.Described camera module can be one focus module.Described camera module includes camera lens 30E described in photosensory assembly 10E and one described in.
More specifically, described camera lens 30E is installed in the described camera lens mounting groove 1131E of the described camera lens construction section 113E of the described encapsulation part 11E of described photosensory assembly 10E.Described optical filter 20E is molded into described photosensory assembly 11E, therefore extra optical filter need not be provided, also without when assembling described shooting molding, separately installed optical filter, therefore, reduce the assembling process of described camera module, and the mode of molding optical filter makes the back focal length of described camera module to reduce.
It will also be appreciated that, described camera lens 30E is installed in the described camera lens construction section 113E of the described encapsulation part 11E of described photosensory assembly 10E, thus described encapsulation part 11E is equivalent to the function of the support in tradition camera module or lens barrel, there is provided support, fixed position for described camera lens 30E, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11E is fixed on described wiring board main body 122E by moulding technology, fixation procedure need not be pasted, molding mode is relative to pasting the fixing controllability with better connective stability and technical process, and the AA glue space adjusted need not be reserved between described encapsulation part 11E and described wiring board main body 122E, therefore the tradition camera module AA headspace adjusted is reduced so that the thickness of camera module is reduced；On the other hand, described encapsulation part 11E is coated with described component 123E and described connecting line 124E, traditional cradling function and component 123E and described connecting line 124E can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described encapsulation part 11E of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11E replaces traditional support, and provide installation site for described camera lens 30E, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles.And described encapsulation part 11E is coated with described connecting line 124E, and described encapsulation part 11E extends to the non-photo-sensing district 1212E of described sensitive chip 121E so that described encapsulation part 11E can to contract, thus reducing the horizontal length and width size of described camera module further.
With reference to Figure 23 and Figure 24, will be illustrated according to the photosensory assembly of the 7th of the present invention the preferred embodiment and camera module.Described photosensory assembly 10F is camera module described in assembly, thus obtaining the described camera module of moulding type.Described photosensory assembly 10F is connected to described photographic department 12F with including an encapsulation part 11F and a photographic department 12F, described encapsulation part 11F molding.
Described photographic department 12F includes an a wiring board main body 122F and sensitive chip 121F, and described sensitive chip 121F is arranged on described wiring board main body 122F.According to this embodiment of the invention, it is connected to described circuit main body 122F described sensitive chip 121F molding.
According to this embodiment of the present invention, described photographic department 12F includes a connection line (not shown) and at least one component 123F.Described connection line defaults in described wiring board main body 122F, described component 123F and is electrically connected to described connection line and described sensitive chip 121F, for the photosensitive work process of described sensitive chip 121F.Described component 123F is arranged at described wiring board main body 122F projectedly.Described component 123F it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123F is coated on inside it by described encapsulation part 11F, hence in so that described component 123F will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121F environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123F, without affecting described sensitive chip 121F, it is different from the existing way that in tradition camera module, component 123F exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123F surface, avoid polluting described sensitive chip 121F and make camera module that the bad phenomenon such as dirty stain occur.
Described encapsulation part 11F forms a through hole 1100F, in order to provide photosensitive path for described sensitive chip 121F.
This preferred embodiment according to the present invention, described photographic department 12F includes at least one connecting line 124F, is used for electrically connecting described sensitive chip 121F and described wiring board main body 122F.Further, each described connecting line 124F may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..Low especially, described connecting line 124F curvedly connects described sensitive chip 121F and described wiring board main body 122F.
It is worth mentioning that, each described connecting line 124F is molded into inside described encapsulation part 11F, such that it is able to each described connecting line 124F is coated with by described encapsulation part 11F, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124F will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124F simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121F and described wiring board main body 122F, this point is not to be provided in prior art completely.
It is worth mentioning that; described encapsulation part 11F is coated with described component 123F and described connecting line 124F; there is protection described component 123F and described connecting line 124F and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11F is not limited to be coated with described component 123F or described connecting line 124F.It is to say, in other embodiments of the invention, described encapsulation part 11F can directly be molded into the described wiring board main body 122F of the described component 123F not protruded, it is also possible to be molded into outside described component 123F, the diverse location such as surrounding.
Further, described sensitive chip 121F has an a photosensitive area 1211F and non-photo-sensing district 1212F, described non-photo-sensing district 1212F to be surrounded on described photosensitive area 1211F peripheral.Described photosensitive area 1211F is used for carrying out photosensitization, and described connecting line 124F is connected to described non-photo-sensing district 1212F.
This preferred embodiment according to the present invention, described encapsulation part 11F extends the described non-photo-sensing district 1212F of described sensitive chip 121F, thus described sensitive chip 121F is fixed on described wiring board main body 122F by the mode lamination molded.By such mode, mode (Moldingonchip) being molded into chip expand as described in the inside mouldable scope of encapsulation part 11F, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122F and described encapsulation part 11F, reduce the length and width size of described molding photographic department 12F part further, reduce by the length and width size of the described camera module of its assembling.
In this embodiment in accordance with the invention, described encapsulation part 11F projection ground is outside the described photosensitive area 1211F of described sensitive chip 121F, especially, described encapsulation part 11F closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10F is used to assemble described camera module, described sensitive chip 121F is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10F, a traditional wiring board can be chosen as described wiring board main body 122F, described wiring board main body 122F arranges sensitive chip 121F described in, by described sensitive chip 121F by described connecting line 124F electrical connection, and then described molding wiring board main body 122F after preliminary assembling and molding on sensitive chip 121F parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11F, or form described encapsulation part 11F with mould pressing process conventional in semiconductor packages.Described wiring board main body 122F can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11F formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11F can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention.
Further, described encapsulation part 11F includes an a cladding section 111F and optical filter construction section 112F, it is integrally connected to described cladding section 111F described optical filter construction section 112F molding, described cladding section 111F molding is connected to described wiring board main body 122F, is used for being coated with described component 123F and described connecting line 124F.Described optical filter construction section 112F is used for installing an optical filter 20F, that is, when described photosensory assembly 10F is used to assemble described camera module, the optical filter 20F of described camera module is installed in described optical filter construction section 112F, described optical filter 20F is positioned on the photosensitive path of described sensitive chip 121F, and extra optical filter 20F mounting bracket need not be provided.That is, described encapsulation part 11F has the function of conventional stent herein, but it is based on the advantage of moulding technology, described optical filter construction section 112F top can by the technology mode of mold, make it have good planarization, so that described optical filter 20F is entirely mounted, this point is also an advantage over traditional camera module.
Further, described optical filter construction section 112F has a mounting groove 1121F, described support slot is communicated in described through hole 1100F, provides sufficient installing space for described optical filter 20F so that described optical filter 20F will not protrude from the top surface of optical filter construction section 112F.It is to say, described encapsulation part 11F upper end arranges described mounting groove 1121F, in order to described optical filter 20F is installed on described encapsulation part 11F and the top of described encapsulation part 11F will not be protruded from.
It is noted that the inwall of described encapsulation part 11F can according to the shape of described connecting line 124F and arrange, be such as set to skewed, thus many light such as can receive being coated with while described connecting line 124F to make described sensitive chip 121F.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11F is not the restriction of the present invention.
Being different from above preferred embodiment, described wiring board main body 122F has at least one reinforced hole 1221F, described encapsulation part 11F and extends in described reinforced hole 1221F, thus strengthening the structural strength of described wiring board main body 122F.In other words, two kinds of different materials be combined with each other, thus forming composite structure so that the structural strength as the described wiring board main body 122F of matrix strengthens.
The position of described reinforced hole 1221F can select as required, and the structural strength demand according to described wiring board is arranged, such as structure symmetrically.Setting by described reinforced hole 1221F makes the structural strength of described wiring board main body 122F strengthen, such that it is able to reduce the thickness of described wiring board main body 122F, reduces by the thickness of the camera module of its assembling, and improves the heat dispersion of described photosensory assembly 10F.
It is noted that in this embodiment in accordance with the invention, described reinforced hole 1221F is groove-like, thus when manufacturing described photosensory assembly 10F, the moulding material of described encapsulation part 11F will not be spilt by described reinforced hole 1221F.
Similar with above preferred embodiment, described photosensory assembly 10F can be assembled as and focus module or dynamic burnt module, and those skilled in the art is not it should be appreciated that the assembling application mode of described photosensory assembly 10F is the restriction of the present invention.
With reference to Figure 25, will be illustrated according to the photosensory assembly of the 8th of the present invention the preferred embodiment.Described photosensory assembly 10G is camera module described in assembly, thus obtaining the described camera module of moulding type.Described photosensory assembly 10G is connected to described photographic department 12G with including an encapsulation part 11G and photographic department 12G, described encapsulation part 11G molding.
Described photographic department 12G includes an a wiring board main body 122G and sensitive chip 121G, and described sensitive chip 121G is arranged on described wiring board main body 122G.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121G molding.
According to this embodiment of the present invention, described photographic department 12G includes a connection line (not shown) and at least one component 123G.Described connection line defaults in described wiring board main body 122G, described component 123G and is electrically connected to described connection line and described sensitive chip 121G, for the photosensitive work process of described sensitive chip 121G.Described component 123G is arranged at described wiring board main body 122G projectedly.Described component 123G it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123G is coated on inside it by described encapsulation part 11G, hence in so that described component 123G will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121G environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123G, without affecting described sensitive chip 121G, it is different from the existing way that in tradition camera module, component 123G exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123G surface, avoid polluting described sensitive chip 121G and make camera module that the bad phenomenon such as dirty stain occur.
Described encapsulation part 11G forms a through hole 1100G, in order to provide photosensitive path for described sensitive chip 121G.
This preferred embodiment according to the present invention, described photographic department 12G includes at least one connecting line 124G, is used for electrically connecting described sensitive chip 121G and described wiring board main body 122G.Further, each described connecting line 124G may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..Low especially, described connecting line 124G curvedly connects described sensitive chip 121G and described wiring board main body 122G.
It is worth mentioning that, each described connecting line 124G is molded into inside described encapsulation part 11G, such that it is able to each described connecting line 124G is coated with by described encapsulation part 11G, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124G will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124G simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121G and described wiring board main body 122G, this point is not to be provided in prior art completely.
It is worth mentioning that; described encapsulation part 11G is coated with described component 123G and described connecting line 124G; there is protection described component 123G and described connecting line 124G and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11G is not limited to be coated with described component 123G or described connecting line 124G.It is to say, in other embodiments of the invention, described encapsulation part 11G can directly be molded into the described wiring board main body 122G of the described component 123G not protruded, it is also possible to be molded into outside described component 123G, the diverse location such as surrounding.
Further, described sensitive chip 121G has an a photosensitive area 1211G and non-photo-sensing district 1212G, described non-photo-sensing district 1212G to be surrounded on described photosensitive area 1211G peripheral.Described photosensitive area 1211G is used for carrying out photosensitization, and described connecting line 124G is connected to described non-photo-sensing district 1212G.
This preferred embodiment according to the present invention, described encapsulation part 11G extends the described non-photo-sensing district 1212G of described sensitive chip 121G, thus described sensitive chip 121G is fixed on described wiring board main body 122G by the mode lamination molded.By such mode, mode (Moldingonchip) being molded into chip expand as described in the inside mouldable scope of encapsulation part 11G, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122G and described encapsulation part 11G, reduce the length and width size of described molding photographic department 12G further, reduce by the length and width size of the described camera module of its assembling.
In this embodiment in accordance with the invention, described encapsulation part 11G projection ground is outside the described photosensitive area 1211G of described sensitive chip 121G, especially, described encapsulation part 11G closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10G is used to assemble described camera module, described sensitive chip 121G is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10G, a traditional wiring board can be chosen as described wiring board main body 122G, described wiring board main body 122G arranges sensitive chip 121G described in, by described sensitive chip 121G by described connecting line 124G electrical connection, and then described molding wiring board main body 122G after preliminary assembling and molding on sensitive chip 121G parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11G, or form described encapsulation part 11G with mould pressing process conventional in semiconductor packages.Described wiring board main body 122G can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11G formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11G can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention.
Further, described encapsulation part 11G includes an a cladding section 111G and optical filter construction section 112G, it is integrally connected to described cladding section 111G described optical filter construction section 112G molding, described cladding section 111G molding is connected to described wiring board main body 122G, is used for being coated with described component 123G and described connecting line 124G.Described optical filter construction section 112G is used for installing an optical filter 20G, that is, when described photosensory assembly 10G is used to assemble described camera module, the optical filter 20G of described camera module is installed in described optical filter construction section 112G, described optical filter 20G is positioned on the photosensitive path of described sensitive chip 121G, and extra optical filter 20G mounting bracket need not be provided.That is, described encapsulation part 11G has the function of conventional stent herein, but it is based on the advantage of moulding technology, described optical filter construction section 112G top can by the technology mode of mold, make it have good planarization, so that described optical filter 20G is entirely mounted, this point is also an advantage over traditional camera module.
Further, described optical filter construction section 112G has a mounting groove 1121G, described support slot is communicated in described through hole 1100G, provides sufficient installing space for described optical filter 20G so that described optical filter 20G will not protrude from the top surface of optical filter construction section 112G.It is to say, described encapsulation part 11F upper end arranges described mounting groove 1121F, in order to described optical filter 20F is installed on described encapsulation part 11F and the top of described encapsulation part 11F will not be protruded from.
It is noted that the inwall of described encapsulation part 11G can according to the shape of described connection and arrange, be such as set to skewed, thus making described sensitive chip 121G can receive more light being coated with while described connecting line 124G.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11G is not the restriction of the present invention.
Being different from above preferred embodiment, described wiring board main body 122G has at least one reinforced hole 1221G, described encapsulation part 11G and extends in described reinforced hole 1221G, thus strengthening the structural strength of described wiring board main body 122G.In other words, two kinds of different materials be combined with each other, thus forming composite structure so that the structural strength as the described wiring board main body 122G of matrix strengthens.
The position of described reinforced hole 1221G can select as required, and the structural strength demand according to described wiring board is arranged, such as structure symmetrically.Setting by described reinforced hole 1221G makes the structural strength of described wiring board main body 122G strengthen, such that it is able to reduce the thickness of described wiring board main body 122G, reduces by the thickness of the camera module of its assembling, and improves the heat dispersion of described photosensory assembly 10G.
It is worth mentioning that, this preferred embodiment according to the present invention, described reinforced hole 1221G is perforation, say, that through described wiring board main body 122G, the both sides making described wiring board main body 122G connect, thus when manufacturing described photosensory assembly 10G, the moulding material of described encapsulation part 11G is combined with described wiring board main body 122G fully, form more firmly composite structure, and the structure of relatively described groove, described perforation is easier to processing and manufacturing.
Similar with above preferred embodiment, described photosensory assembly 10G can be assembled as and focus module or dynamic burnt module, and those skilled in the art is not it should be appreciated that the assembling application mode of described photosensory assembly 10G is the restriction of the present invention.
With reference to Figure 26, will be illustrated according to the camera module of the 9th of the present invention the preferred embodiment.Described camera module can be one focus module (FixFocusModel, FFM).Described camera module includes a photosensory assembly 10H, a support 50H, an optical filter 20H and a camera lens 30H.
Described support 50H is installed on described photosensory assembly 10H, and described optical filter 20H is installed in described support 50H, and described camera lens 30H is installed on described support 50H.
Described photosensory assembly 10H is connected to described photographic department 12H with including an encapsulation part 11H and a photographic department 12H, described encapsulation part 11H molding.
Described photographic department 12H includes an a wiring board main body 122H and sensitive chip 121H, and described sensitive chip 121H is arranged on described wiring board main body 122H.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121H molding.
According to this embodiment of the present invention, described photographic department 12H includes a connection line (not shown) and at least one component 123H.Described connection line defaults in described wiring board main body 122H, described component 123H and is electrically connected to described connection line and described sensitive chip 121H, for the photosensitive work process of described sensitive chip 121H.Described component 123H is arranged at described wiring board main body 122H projectedly.Described component 123H it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123H is coated on inside it by described encapsulation part 11H, hence in so that described component 123H will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121H environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123H, without affecting described sensitive chip 121H, it is different from the existing way that in tradition camera module, component 123H exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123H surface, avoid polluting described sensitive chip 121H and make camera module that the bad phenomenon such as dirty stain occur.
Described encapsulation part 11H forms a through hole 1100H, in order to provide photosensitive path for described sensitive chip 121H.
This preferred embodiment according to the present invention, described photographic department 12H includes at least one connecting line 124H, is used for electrically connecting described sensitive chip 121H and described wiring board main body 122H.Further, each described connecting line 124H may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..Low especially, described connecting line 124H curvedly connects described sensitive chip 121H and described wiring board main body 122H.
It is worth mentioning that, each described connecting line 124H is molded into inside described encapsulation part 11H, such that it is able to each described connecting line 124H is coated with by described encapsulation part 11H, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124H will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124H simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121H and described wiring board main body 122H, this point is not to be provided in prior art completely.
It is worth mentioning that; described encapsulation part 11H is coated with described component 123H and described connecting line 124H; there is protection described component 123H and described connecting line 124H and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11H is not limited to be coated with described component 123H or described connecting line 124H.It is to say, in other embodiments of the invention, described encapsulation part 11H can directly be molded into the described wiring board main body 122H of the described component 123H not protruded, it is also possible to be molded into outside described component 123H, the diverse location such as surrounding.
Further, described sensitive chip 121H has an a photosensitive area 1211H and non-photo-sensing district 1212H, described non-photo-sensing district 1212H to be surrounded on described photosensitive area 1211H peripheral.Described photosensitive area 1211H is used for carrying out photosensitization, and described connecting line 124H is connected to described non-photo-sensing district 1212H.
This preferred embodiment according to the present invention, described encapsulation part 11H extends the described non-photo-sensing district 1212H of described sensitive chip 121H, thus described sensitive chip 121H is fixed on described wiring board main body 122H by the mode lamination molded.By such mode, as being molded into the mode (Moldingonthechip of chip, MOC) the inside mouldable scope of described encapsulation part 11H is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122H and described encapsulation part 11H, reduce the length and width size of described molding photographic department 12H part further, reduce by the length and width size of the described camera module of its assembling.
In this embodiment in accordance with the invention, described encapsulation part 11H projection ground is outside the described photosensitive area 1211H of described sensitive chip 121H, especially, described encapsulation part 11H closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10H is used to assemble described camera module, described sensitive chip 121H is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10H, a traditional wiring board can be chosen as described wiring board main body 122H, described wiring board main body 122H arranges sensitive chip 121H described in, by described sensitive chip 121H by described connecting line 124H electrical connection, and then described molding wiring board main body 122H after preliminary assembling and molding on sensitive chip 121H parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11H, or form described encapsulation part 11H with mould pressing process conventional in semiconductor packages.Described wiring board main body 122H can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11H formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11H can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention.
Described encapsulation part 11H is providing installation site here for described support 50H, and based on the advantage of moulding technology, described encapsulation part 11H can by the technology mode of mold so that it is have good planarization, so that described support 50H is entirely mounted.
It is noted that the inwall of described encapsulation part 11H can according to the shape of described connection and arrange, be such as set to skewed, thus making described sensitive chip 121H can receive more light being coated with while described connecting line 124H.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11H is not the restriction of the present invention.
Described molding circuit pack is in other embodiments of the invention, dynamic burnt camera module can also be assembled into, such that it is able to change the focal length of described camera module, those skilled in the art is it should be appreciated that the type of described camera module is not the restriction of the present invention.
With reference to photosensory assembly and camera module that Figure 27 is the tenth preferred embodiment according to the present invention.What be different from above preferred embodiment is, described photosensory assembly 10 includes a screen layer 126I, described screen layer 126I wraps up described wiring board main body 122 and described encapsulation part 11, thus while strengthening the structural strength of described wiring board main body 122, strengthening the anti-electromagnetic interference capability of described photosensory assembly 10.
Further, described screen layer 126I is a metal level, it is possible to for platy structure or network structure.
With reference to Figure 28 A and 28B, the comparison schematic diagram according to the camera module of above preferred embodiment of the present invention and tradition camera module.In Figure 28 A, left side represents traditional camera module, and right side represents the camera module in the present invention.In Figure 28 B, left side represents traditional wiring board manufacture process, and right side represents the photosensory assembly manufacture process of the present invention.
Summary content, it is possible to seeing clearly, photosensory assembly and the camera module of the present invention have the advantage that
1, the length and width size of camera module, packed part and component can be reduced, as can be overlapping on capacitance resistance ware segment space；Traditional scheme support outside electric capacity, and need to need reserved certain safe distance, and the solution of the present invention can directly utilize electric capacity space, directly filling plastic cement around electric capacity.
2, reduce module to tilt, the alternative existing plastic stent design of packed part, reduce accumulated tolerance；
3, molding promotes circuit board structure intensity, under equivalent constructions intensity, because packed part can be played a supporting role, it is possible to increasing intensity, it is thinner that wiring board can do, and reduces module height；
4, in height space, traditional scheme electric capacity and base need reserved assembling safe space, and moulding technology can not be reserved, and reduces module height；Traditional scheme electric capacity top distance bracket needs reserved safety clearance, it is prevented that interfere, and new departure can direct filling plastic cement around electric capacity.
5, resistance capacitor device can be wrapped up by molding, it is possible to avoids the module dirt stain that capacitance resistance ware region solder resist, dust etc. are put bad, improving product yield；
6, being suitable for high efficiency scale of mass production, the photosensory assembly of the present invention is more suitable for a large amount of layout operation.Based on the molded mode of the described photosensory assembly of the present invention, described photosensory assembly is more suitable for layout operation, once completes the manufacture of the photosensory assembly of more amount, such as can reach 80 to 90, and traditional wiring board once can only produce at most 8.
It should be understood by those skilled in the art that the embodiments of the invention shown in foregoing description and accompanying drawing are only used as citing and are not limiting as the present invention.The purpose of the present invention is completely and be effectively realized.The function of the present invention and structural principle are shown in an embodiment and illustrate, without departing under described principle, embodiments of the present invention can have any deformation or amendment.

Claims (38)

1. the photosensory assembly of a camera module, it is characterised in that including:
One encapsulation part；With
One photographic department；Described photographic department includes a wiring board main body and a sensitive chip, and described encapsulation part encapsulated moulding is in described wiring board main body and described sensitive chip.
2. photosensory assembly according to claim 1, wherein said encapsulation part forms a through hole, and described through hole is relative with described sensitive chip, to provide described sensitive chip passage of light.
3. photosensory assembly according to claim 2, the bottom of the described through hole of wherein said encapsulation part is skewed in what be gradually increased from the bottom to top.
4. photosensory assembly according to claim 2, wherein said encapsulation part top is suitable to install the camera lens of described camera module, motor or optical filter.
5. photosensory assembly according to claim 2, wherein said encapsulation part top is plane, for installing the camera lens of described camera module, motor or optical filter.
6. photosensory assembly according to claim 2, wherein said encapsulation part top has a mounting groove, and described mounting groove is communicated in described through hole, for installing the optical filter of described camera module, camera lens or motor.
7. photosensory assembly according to claim 6, wherein said optical filter construction section has a mounting groove, it is communicated in described through hole, form described the first step-like rank, so that installing described optical filter, described camera lens construction section has a camera lens mounting groove, forms described step-like second-order, in order to install the camera lens of described camera module.
8. according to the arbitrary described photosensory assembly of claim 1 to 7, wherein said photographic department includes at least one connecting line, each described connecting line electrically connects described sensitive chip and described wiring board main body, and described encapsulation part is coated with described connecting line, so that described connecting line will not be directly exposed to outside.
9. photosensory assembly according to claim 8, wherein said connecting line is selected from combination: the one in gold thread, silver wire, copper cash or aluminum steel.
10. photosensory assembly according to claim 8, wherein said connecting line curvedly connects described wiring board main body and described sensitive chip.
11. photosensory assembly according to claim 8, wherein said sensitive chip includes a photosensitive area and a non-photo-sensing district, described non-photo-sensing district is peripheral around described photosensitive area, described encapsulation part molding extends to the described non-photo-sensing district of described sensitive chip, the mouldable scope inside to extend described encapsulation part, reduces the Outside Dimensions of described encapsulation part.
12. photosensory assembly according to claim 8, wherein said photographic department includes at least one component, described component protrudes from described wiring board main body, and described encapsulation part is coated with described component, so that described component will not be directly exposed to outside.
13. photosensory assembly according to claim 12, wherein said component selects combination: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay.
14. photosensory assembly according to claim 8, wherein said photographic department includes an optical filter, described optical filter is covered in described sensitive chip, described encapsulation part takes shape in described wiring board main body, described sensitive chip and described optical filter, so that protecting described sensitive chip by described optical filter, and reduce the back focal length of described camera module so that it is highly reduce.
15. photosensory assembly according to claim 8, wherein said photographic department includes a back-up coat, and described back-up coat lamination is arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body.
16. photosensory assembly according to claim 15, wherein said back-up coat is metallic plate, to strengthen the heat dispersion of described photographic department.
17. photosensory assembly according to claim 8, wherein said photographic department includes a screen layer, and described screen layer wraps up described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly.
18. photosensory assembly according to claim 17, wherein said screen layer is metallic plate or wire netting.
19. photosensory assembly according to claim 8, wherein wiring board main body has at least one reinforced hole, and described encapsulation part extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body.
20. photosensory assembly according to claim 19, wherein said reinforced hole is groove-like.
21. photosensory assembly according to claim 19, wherein said reinforced hole is through hole, so that the moulding material of described encapsulation part and described wiring board main body are fully contacted, and easily fabricated.
22. photosensory assembly according to claim 8, the material of wherein said wiring board main body can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
23. photosensory assembly according to claim 8, the material of wherein said encapsulation part is selected from combination: one or more in epoxy resin, nylon, LCP or PP.
24. the manufacture method of the photosensory assembly of a camera module, it is characterised in that include step: encapsulated moulding one encapsulation part in a wiring board main body and a sensitive chip.
25. the manufacture method of photosensory assembly according to claim 24, including step: attach described sensitive chip in a wiring board main body, and electrically connected by least one connecting line.
26. the manufacture method of photosensory assembly according to claim 25, including step: be coated with described connecting line by described encapsulation part.
27. the manufacture method of photosensory assembly according to claim 25, including step: extend a described encapsulation part non-photo-sensing district to described sensitive chip.
28. the manufacture method of photosensory assembly according to claim 24, including step: form a mounting groove on described encapsulation part top, in order to install an optical filter, motor or camera lens.
29. the manufacture method according to the arbitrary described photosensory assembly of claim 24 to 28, including step: arrange at least one groove-like reinforced hole in described wiring board main body, and make described encapsulation part extend into described reinforced hole.
30. the manufacture method according to the arbitrary described photosensory assembly of claim 24 to 28, including step: arrange at least one through hole shape reinforced hole in described wiring board main body, and make described encapsulation part extend into described reinforced hole.
31. the manufacture method according to the arbitrary described photosensory assembly of claim 24 to 28, including step: attach a back-up coat at described wiring board main body bottom, to strengthen the structural strength of described wiring board main body.
32. the manufacture method according to the arbitrary described photosensory assembly of claim 24 to 28, including step: be coated with a screen layer in described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly.
33. the manufacture method according to the arbitrary described photosensory assembly of claim 24 to 28, further comprise the steps of: and encapsulate an encapsulation part on described wiring board main body, described sensitive chip and an optical filter.
34. a camera module, it is characterised in that including:
One according to the arbitrary described photosensory assembly of claim 1 to 23；With
One camera lens；Described camera lens is positioned at the photosensitive path of the described sensitive chip of described photosensory assembly.
35. camera module according to claim 34, wherein said camera module includes a support, and described support is installed in described photosensory assembly, and described camera lens is installed in described support.
36. camera module according to claim 34, wherein said camera module includes a motor, and described camera lens is installed in described motor, and described motor is installed in described photosensory assembly part.
37. camera module according to claim 34, wherein said camera module includes an optical filter, and described optical filter is installed in described photosensory assembly.
38. camera module according to claim 35, wherein said camera module includes an optical filter, and described optical filter is installed in described support.
CN201610143457.7A 2016-03-12 2016-03-12 Camera module and its photosensory assembly and manufacturing method Active CN105744130B (en)

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CN201910061809.8A CN110022423B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof
CN201910061810.0A CN110022424B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof
CN201610143457.7A CN105744130B (en) 2016-03-12 2016-03-12 Camera module and its photosensory assembly and manufacturing method
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KR1020207036129A KR102335306B1 (en) 2016-03-12 2016-10-28 Array Imaging Module and Molded Photensitive Assembly and Manufacturing Method Thereof for Electronic Device
PCT/CN2016/103736 WO2017157015A1 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
JP2018547880A JP2019519087A (en) 2016-03-12 2016-10-28 Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices
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US17/685,587 US11743569B2 (en) 2016-03-12 2022-03-03 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US17/740,887 US20220268968A1 (en) 2016-03-12 2022-05-10 Molded photosensitive assembly for array imaging module for electronic device and manufacturing method thereof
US17/847,569 US12021097B2 (en) 2016-03-12 2022-06-23 Camera module, and photosensitive component thereof and manufacturing method therefor
US18/203,252 US20230300442A1 (en) 2016-03-12 2023-05-30 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

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