CN205792874U - Camera module and photosensory assembly thereof - Google Patents

Camera module and photosensory assembly thereof Download PDF

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Publication number
CN205792874U
CN205792874U CN201620191631.0U CN201620191631U CN205792874U CN 205792874 U CN205792874 U CN 205792874U CN 201620191631 U CN201620191631 U CN 201620191631U CN 205792874 U CN205792874 U CN 205792874U
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CN
China
Prior art keywords
encapsulation part
wiring board
main body
sensitive chip
camera module
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Active
Application number
CN201620191631.0U
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Chinese (zh)
Inventor
田中武彦
赵波杰
王明珠
梅其敏
丁亮
蒋恒
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Priority to CN201620191631.0U priority Critical patent/CN205792874U/en
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to EP16894174.8A priority patent/EP3429181A4/en
Priority to KR1020187029337A priority patent/KR102193819B1/en
Priority to PCT/CN2016/103736 priority patent/WO2017157015A1/en
Priority to JP2018547880A priority patent/JP2019519087A/en
Priority to KR1020207036129A priority patent/KR102335306B1/en
Priority to US15/317,117 priority patent/US10908324B2/en
Publication of CN205792874U publication Critical patent/CN205792874U/en
Application granted granted Critical
Priority to KR1020187029304A priority patent/KR20180132684A/en
Priority to JP2018548099A priority patent/JP7071926B2/en
Priority to KR1020217005344A priority patent/KR102294537B1/en
Priority to US16/082,533 priority patent/US20190148429A1/en
Priority to EP17765753.3A priority patent/EP3429183A4/en
Priority to PCT/CN2017/076041 priority patent/WO2017157211A1/en
Priority to KR1020217005352A priority patent/KR102360319B1/en
Priority to TW106203507U priority patent/TWM559558U/en
Priority to TW106203511U priority patent/TWM552720U/en
Priority to TW108135674D priority patent/TWI758645B/en
Priority to TW108135671A priority patent/TWI769403B/en
Priority to TW106203473U priority patent/TWM565451U/en
Priority to TW106108225A priority patent/TWI685255B/en
Priority to TW108135672A priority patent/TWI742441B/en
Priority to TW108135670D priority patent/TWI758644B/en
Priority to TW108135670A priority patent/TW202017356A/en
Priority to TW108135674A priority patent/TW202019155A/en
Priority to TW106108124A priority patent/TWI703715B/en
Priority to TW106108217A priority patent/TWI754632B/en
Priority to US15/473,573 priority patent/US9781325B1/en
Priority to US15/473,609 priority patent/US9906700B2/en
Priority to US15/473,605 priority patent/US10033913B2/en
Priority to US15/473,607 priority patent/US9826132B2/en
Priority to US15/679,146 priority patent/US10274694B2/en
Priority to US15/705,225 priority patent/US10175447B2/en
Priority to US15/705,232 priority patent/US10126519B2/en
Priority to US15/784,167 priority patent/US10578837B2/en
Priority to US16/737,863 priority patent/US20200218034A1/en
Priority to US17/114,466 priority patent/US11822099B2/en
Priority to US17/740,887 priority patent/US20220268968A1/en
Priority to US17/847,569 priority patent/US20230019091A1/en
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Abstract

One camera module and photosensory assembly thereof, wherein said module photosensory assembly includes an encapsulation part and a photographic department；Institute's photographic department includes a wiring board main body and a sensitive chip, and described encapsulation part unitary packed is in described wiring board main body and described sensitive chip.

Description

Camera module and photosensory assembly thereof
Technical field
The present invention relates to camera module field, further, relate to a camera module and photosensory assembly thereof.
Background technology
COB (Chip On Board, chip package) technique is a technical process particularly important in camera module assembling manufacture process.For wiring board, sensitive chip, microscope base, motor driving and assembling through parts such as camera lenses of the camera module that traditional COB technique is made.
As it is shown in figure 1, be a camera module schematic diagram of traditional COB technique manufacture.Described camera module includes a wiring board 1P, a sensitive chip 2P, a support 3P, an optical filter 4P, a motor 5P and a camera lens 6P.Described sensitive chip 2P is installed in described wiring board 1P, described optical filter 4P is installed in described support 3P, described camera lens 6P is installed in described motor 5P, described motor 5P and is installed in described support 3P, in order to described camera lens 6P is positioned on the photosensitive path of described sensitive chip 2P.
It is worth mentioning that, described wiring board 1P has been usually installed some circuit devcies 11P, such as resistance, electric capacity etc., these circuit devcies 11P protrudes from described wiring board 1P surface, described support 3P then needs to be installed on the described wiring board 1P with described circuit devcie 11P, and the assembling matching relationship between wiring board 1P described in traditional COB technique, described circuit devcie 11P and described support 3P has some unfavorable factors, and limit camera module to a certain extent to lightening development.
It will also be appreciated that described sensitive chip is electrically connected to described wiring board typically by some gold threads 21P, in order to the information transmission between described sensitive chip 2P and described line plate plate 1P.And characteristic of based on described gold thread 21P is in structure, in order to prevent damaging described gold thread 21P, described gold thread 21P the most curvedly bends, protrude from the surface of described wiring board, therefore, the assembling process of described sensitive chip is also the same with described circuit devcie 11P, and camera module is existed similar influence factor.
Specifically, first, described circuit devcie 11P and described gold thread 21P is directly exposed to the surface of described wiring board 1P, therefore during follow-up assembling, such as paste described support 3P, weld the processes such as described motor 5P, inevitably it is affected, solder resist during welding, dusts etc. are easily attached to described circuit devcie 11P, and described circuit devcie 11P and described sensitive chip 2P is positioned at the space being interconnected, therefore dust pollutant are easy to affect sensitive chip 2P, there is the bad phenomenon such as pitch-black point in the camera module after such impact is likely to result in assembling, reduce product yield.
Secondly, described support 3P is positioned at the outside of described circuit devcie 11P, therefore when installing described support 3P and described wiring board 1P, need reserved certain safe distance between described support 3P and described circuit devcie 11P, and in the horizontal direction and upwardly direction is required for reserved safe distance, this increases the demand of camera module thickness to a certain extent so that it is thickness is difficult to reduce.
null3rd，During COB assembles，Described support 3P or described motor 5P is glued to described wiring board 1P by paste such as glue，AA to be carried out (Active Arrangement the calibrates automatically) technique when pasting，It is exactly to adjust described sensitive chip 2P and the central axis of described camera lens 6P，Reach horizontal direction consistent with vertical direction，Therefore to meet AA technique，Need to be required for presetting more glue between described support 3P and described wiring board 1P and described microscope base and described motor 5P，Make to leave adjustment space each other，And on the one hand this demand adds the thickness requirements to camera module to a certain extent，Its thickness is made to be difficult to reduce，On the other hand，Repeatedly pasting assembling process, to easily cause the inclination of assembling inconsistent，And to described microscope base 3P、The planarization of described wiring board 1P and described motor 5P requires higher.
In addition, in traditional COB technique, described wiring board 1P provides most basic fixing, support carrier, therefore, described wiring board 1P itself is required possess certain structural strength, this requires to make described wiring board 1P have bigger thickness, thus the pre-add thickness requirements of camera module the most again.
Along with various electronic products, the development of smart machine, camera module is the most increasingly to high-performance, lightening direction is developed, and in the face of high pixel, the various high performance demand for development such as high imaging quality, electronic devices and components in circuit get more and more, the area of chip is increasing, drive resistance, the Passive components such as electric capacity increase accordingly, this makes the specification of electronic device increasing, assemble difficulty constantly to increase, the overall dimensions of camera module is increasing, and from the point of view of above-mentioned, microscope base, traditional assembling mode of wiring board and component etc. is the most also the very big restriction of the lightening development of camera module.
Summary of the invention
It is an object of the present invention to provide a camera module and photosensory assembly thereof, wherein said photosensory assembly includes an encapsulation part and a photographic department, and described encapsulation part is molded to described photographic department.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, wherein said photographic department includes a sensitive chip and a wiring board main body, described sensitive chip is electrically connected to described wiring board main body by least one connecting line, described encapsulation part is coated with described connecting line so that it is will not be directly exposed to outside.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, wherein said connecting line is coated on inside described encapsulation part integratedly by the manufacture of molding.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, wherein said photosensory assembly includes that at least one component, described component are coated in described encapsulation part, so as not to be directly exposed to outside.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, wherein said component is coated on inside described encapsulation part integratedly by the manufacture of molding.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, wherein said sensitive chip has a photosensitive area and a non-photo-sensing district, described encapsulation part is molded into the non-photo-sensing district of described sensitive chip, reduces described photosensory assembly and the length and width size of camera module assembled by it.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, wherein said wiring board main body has an inner groovy, and described sensitive chip is arranged in described inner groovy, thus reduces the requirement for height to described encapsulation part.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, wherein said encapsulation part includes a cladding section and an optical filter construction section, described optical filter construction section one molding is connected to described cladding section, described optical filter construction section is suitable to a mounted optical filter, from the optical filter mounting bracket extra without offer.
It is an object of the present invention to provide a camera module and photosensory assembly thereof; wherein said photosensory assembly includes an optical filter; it is arranged at the top of described sensitive chip described optical filter molding; thus protect described sensitive chip by described optical filter; and the back focal length of the camera module assembled by it can be reduced so that the height of camera module is less.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, wherein said photosensory assembly includes a back-up coat, it is connected to the bottom side of described wiring board main body described back-up coat lamination, thus increase the structural strength of described wiring board main body, so that using the described wiring board main body that thickness is less, and the heat-sinking capability of described wiring board main body can be improved.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, in wherein said circuit main body, there is at least one reinforced hole, described encapsulation part extends into described reinforced hole, thus strengthen the bonding force between described encapsulation part and described photosensory assembly, and increase the structural strength of described wiring board main body.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, a mounted motor or a camera lens is suitable in wherein said encapsulation part, can be as traditional support, the support fixed position of described motor or described camera lens is provided, and by the molded advantage of described encapsulation part, there is preferable flatness, thus obtain reducing shooting membrane module and assemble heeling error.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, wherein said camera module uses the mode of molding to carry out assembly, thus changes traditional camera module COB technique.
It is an object of the present invention to provide a camera module and photosensory assembly thereof, it uses the mode of molding to manufacture described photosensitive circuit pack, thus molded, the described photosensory assembly of integration.
In order to realize the object above of the present invention and other objects of the present invention and advantage, an aspect of of the present present invention provides the photosensory assembly of a camera module, comprising: an encapsulation part and a photographic department；Institute's photographic department includes a wiring board main body and a sensitive chip, and described encapsulation part encapsulated moulding is in described wiring board main body and described sensitive chip.
According to one embodiment of the invention, encapsulation part described in described photosensory assembly forms a through hole, and described through hole is relative with described sensitive chip, to provide described sensitive chip passage of light.
According to one embodiment of the invention, the bottom of the described through hole of encapsulation part described in described photosensory assembly is skewed in be gradually increased from the bottom to top.
According to one embodiment of the invention, encapsulation part top described in described photosensory assembly is suitable to install the camera lens of described camera module, motor or optical filter.
According to one embodiment of the invention, described in described photosensory assembly, encapsulation part top is plane, for installing the camera lens of described camera module, motor or optical filter.
According to one embodiment of the invention, encapsulation part top described in described photosensory assembly has a mounting groove, and described mounting groove is communicated in described through hole, for installing the optical filter of described camera module, camera lens or motor.
According to one embodiment of the invention, encapsulation part described in described photosensory assembly includes a cladding section, an optical filter construction section and a camera lens construction section, described optical filter construction section and described camera lens construction section are upwards molded extension by described cladding section successively, and inside is step-like, in order to install optical filter and the camera lens of described camera module.
According to one embodiment of the invention, camera lens construction section described in described photosensory assembly has a camera lens inwall, and described camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.
According to one embodiment of the invention, camera lens construction section described in described photosensory assembly has a camera lens inwall, and described camera lens inner wall surface has screw thread, is suitable for installing a threaded camera lens.
According to one embodiment of the invention, described in described photosensory assembly, photographic department includes at least one connecting line, each described connecting line electrically connects described sensitive chip and described wiring board main body, and described encapsulation part is coated with described connecting line, so that described connecting line will not be directly exposed to outside.
According to one embodiment of the invention, connecting line described in described photosensory assembly is selected from combination: the one in gold thread, silver wire, copper cash or aluminum steel.
According to one embodiment of the invention, connecting line described in described photosensory assembly curvedly connects described wiring board main body and described sensitive chip, to reduce the damage to described connecting line.
According to one embodiment of the invention, sensitive chip described in described photosensory assembly includes a photosensitive area and a non-photo-sensing district, described non-photo-sensing district is peripheral around described photosensitive area, described encapsulation part molding extends to the described non-photo-sensing district of described sensitive chip, the mouldable scope inside to extend described encapsulation part, reduces the Outside Dimensions of described encapsulation part.
According to one embodiment of the invention, described in described photosensory assembly, photographic department includes at least one component, described component protrudes from described wiring board main body, and described encapsulation part is coated with described component, so that described component will not be directly exposed to outside.
According to one embodiment of the invention, component described in described photosensory assembly selects to combine: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay.
According to one embodiment of the invention, described in described photosensory assembly, photographic department includes an optical filter, described optical filter is covered in described sensitive chip, described encapsulation part takes shape in described wiring board main body, described sensitive chip and described optical filter, so that protecting described sensitive chip by described optical filter, and reducing the back focal length of described camera module so that it is height reduces.
According to one embodiment of the invention, photographic department described in described photosensory assembly includes that a back-up coat, described back-up coat lamination are arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body.
According to one embodiment of the invention, back-up coat described in described photosensory assembly is metallic plate, to strengthen the heat dispersion of described photographic department.
According to one embodiment of the invention, photographic department described in described photosensory assembly includes a screen layer, and described screen layer wraps up described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly.
According to one embodiment of the invention, screen layer described in described photosensory assembly is metallic plate or wire netting.
According to one embodiment of the invention, in described photosensory assembly, wiring board main body has at least one reinforced hole, and described encapsulation part extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body.
According to one embodiment of the invention, reinforced hole described in described photosensory assembly is groove-like.
According to one embodiment of the invention, reinforced hole described in described photosensory assembly is through hole, so that the moulding material of described encapsulation part is fully contacted with described wiring board main body and easily fabricated.
According to one embodiment of the invention, the material of wiring board main body described in described photosensory assembly can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
According to one embodiment of the invention, the material of encapsulation part described in described photosensory assembly is selected from combination: one or more in nylon, LCP, PP or resin.
Another aspect of the present invention provides the photosensory assembly of a camera module, and it includes an encapsulation part and a photographic department；Described photographic department includes a wiring board main body, a sensitive chip and an optical filter, and described encapsulation part encapsulated moulding is in described wiring board main body, described sensitive chip and described optical filter.
Another aspect of the present invention provides encapsulation part described in the photosensory assembly of a camera module to have a camera lens mounting groove, and described camera lens mounting groove is communicated in described through hole, in order to camera lens or motor for described camera module provide installation site
According to one embodiment of the invention, described camera module includes that a support, described support are installed in described photosensory assembly, and described camera lens is installed in described support.
According to one embodiment of the invention, described camera module includes that a motor, described camera lens are installed in described motor, and described motor is installed in described photosensory assembly.
According to one embodiment of the invention, described camera module includes that an optical filter, described optical filter are installed in described photosensory assembly.
According to one embodiment of the invention, described camera module includes that an optical filter, described optical filter are installed in described support.
Accompanying drawing explanation
Fig. 1 is the camera module cut-away view of tradition COB technique.
Fig. 2 is the axonometric chart of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 3 is the cut-away view of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 4 is the manufacture process schematic diagram of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 5 is the manufacture method schematic diagram of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 6 is the camera module cut-away view of first preferred embodiment according to the present invention.
Fig. 7 is the camera module exploded view of first preferred embodiment according to the present invention.
Fig. 8 is another camera module cut-away view of first preferred embodiment according to the present invention.
Fig. 9 is the exploded view of another camera module of first preferred embodiment according to the present invention.
Figure 10 is the cut-away view of the photosensory assembly of second preferred embodiment according to the present invention.
Figure 11 is the camera module cut-away view of second preferred embodiment according to the present invention.
Figure 12 is the sectional view of the photosensory assembly of the 3rd preferred embodiment according to the present invention.
Figure 13 is the camera module cut-away view of the 3rd preferred embodiment according to the present invention.
Figure 14 is another camera module cut-away view of the 3rd preferred embodiment according to the present invention.
Figure 15 is the cut-away view of the photosensory assembly of the 4th preferred embodiment according to the present invention.
Figure 16 is the photosensory assembly manufacture method schematic diagram of the 4th preferred embodiment according to the present invention.
Figure 17 is the camera module cut-away view of the 4th preferred embodiment according to the present invention.
Figure 18 is another camera module cut-away view of the 4th preferred embodiment according to the present invention.
Figure 19 is the photosensory assembly cut-away view of the 5th preferred embodiment according to the present invention.
Figure 20 is the camera module cut-away view of the 5th preferred embodiment according to the present invention.
Figure 21 is the photosensory assembly cut-away view of the 6th preferred embodiment according to the present invention.
Figure 22 is the camera module cut-away view of the 6th preferred embodiment according to the present invention.
Figure 23 is the photosensory assembly cut-away view of the 7th preferred embodiment according to the present invention.
Figure 24 is the photosensory assembly exploded view of the 7th preferred embodiment according to the present invention.
Figure 25 is the module photosensory assembly cut-away view of the 8th preferred embodiment according to the present invention.
Figure 26 is the camera module cut-away view of the 9th preferred embodiment according to the present invention.
Figure 27 is the camera module sectional view of the tenth preferred embodiment according to the present invention.
Figure 28 A and 28B is the beneficial effect comparison diagram of the camera module of the above preferred embodiment according to the present invention.
Detailed description of the invention
Hereinafter describe and be used for disclosing the present invention so that those skilled in the art are capable of the present invention.Preferred embodiment in below describing is only used as citing, it may occur to persons skilled in the art that other obvious modification.The ultimate principle of the present invention defined in the following description can apply to other embodiments, deformation program, improvement project, equivalent and the other technologies scheme without departing from the spirit and scope of the present invention.
It will be understood by those skilled in the art that is, in the exposure of the present invention, term " longitudinally ", " laterally ", on " ", D score, " front ", " afterwards ", " left ", " right ", " vertically ", " level ", " push up ", " end " " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, the most above-mentioned term is not considered as limiting the invention.
With reference to Fig. 2 to Fig. 7, photosensory assembly and camera module according to first preferred embodiment of the present invention are illustrated.Described photosensory assembly 10 is for camera module described in assembly.Described photosensory assembly 10 includes encapsulation part 11 and a photographic department 12, is connected to described photographic department 12 described encapsulation part 11 integral packaging.
Described photographic department 12 includes wiring board main body 122 and a sensitive chip 121, and described sensitive chip 121 is arranged in described wiring board main body 122.According to this embodiment of the invention, it is connected to described wiring board main body 122 described sensitive chip 121 molding.Especially, described encapsulation part 11 (Molding on Chip, MOC) in the way of being molded into chip is molded into described photographic department 12.
According to this embodiment of the present invention, described photographic department 12 includes a connection line (not shown) and at least one component 123.Described connection line defaults in described wiring board main body 122, and described component 123 is electrically connected to described connection line and described sensitive chip 121, for the photosensitive work process of described sensitive chip 121.Described component 123 is arranged at described wiring board main body 122 projectedly.Described component 123 it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123 is coated on inside it by described encapsulation part 11, hence in so that described component 123 will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123, described sensitive chip 121 is not interfered with yet, it is different from the existing way that in tradition camera module, circuit devcie exposes, such as capacitance resistance ware, thus by the way of molding is coated with, prevent dust, foreign material stay in described component 123 surface, avoid polluting described sensitive chip 121 and make camera module that the bad phenomenon such as pitch-black point occur.
It is worth mentioning that, in this embodiment in accordance with the invention, illustrate as a example by described component 123 protrudes wiring board main body 122 described in, and in other embodiments of the invention, described component 123 can be embedded in described wiring board main body 123 and non-bulging in described wiring board main body, those skilled in the art is it should be appreciated that the shape of described component 123, type and arrange the restriction that position is not the present invention.
Described encapsulation part 11 forms a through hole 1100, in order to provide photosensitive path for described sensitive chip 121.
According to this preferred embodiment of the present invention, described photographic department 12 includes at least one connecting line 124, is used for electrically connecting described sensitive chip 121 and described wiring board main body 122.Further, each described connecting line 124 may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..The lowest, described connecting line 124 curvedly connects described sensitive chip 121 and described wiring board main body 122, thus avoids described connecting line 124 bending damage occur.
It is worth mentioning that, it is internal that each described connecting line 124 is molded into described encapsulation part 11, such that it is able to each described connecting line 124 is coated with by described encapsulation part 11, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124 will not be touched damage by any, reduce the environmental factors impact on individual described connecting line 124 simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121 and described wiring board main body 122, this point is totally different from prior art.
The bottom of the described through hole 1100 of described encapsulation part 11 is skewed in be gradually increased from the bottom to top, adapts to the shape of described connecting line 124, to increase the light ray flux of described sensitive chip 121.
It is worth mentioning that; described encapsulation part 11 is coated with described component 123 and described connecting line 124; have and protect described component 123 and described connecting line 124 and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11 is not limited to be coated with described component 123 or described connecting line 124.It is to say, in other embodiments of the invention, described encapsulation part 11 can directly be molded into the described wiring board main body 122 of the described component 123 not protruded, it is also possible to be molded into outside described component 123, the diverse location such as surrounding.
Further, described sensitive chip 121 has photosensitive area 1211 and a non-photo-sensing district 1212, and it is peripheral that described non-photo-sensing district 1212 is surrounded on described photosensitive area 1211.Described photosensitive area 1211 is used for carrying out photosensitization, and described connecting line 124 is connected to described non-photo-sensing district 1212.
According to this preferred embodiment of the present invention, described encapsulation part 11 extends the described non-photo-sensing district 1212 of described sensitive chip 121, thus described sensitive chip 121 lamination by the way of molding is fixed on described wiring board main body 122.By such mode, as being molded into mode (the Molding on Chip of chip, MOC) the inside mouldable scope of described encapsulation part 11 is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122 and described encapsulation part 11, reduce the length and width size of described photosensory assembly 10 further, reduce the length and width size of the described camera module assembled by it.
In this embodiment in accordance with the invention, described encapsulation part 11 is protrudingly around outside the described photosensitive area 1211 of described sensitive chip 121, especially, described encapsulation part 11 closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10 is used for assembling described camera module, described sensitive chip 121 is sealed in inside, form space in a closing.
nullSpecifically，When manufacturing described photosensory assembly 10，A traditional wiring board can be chosen as described wiring board main body 122，Described wiring board main body 122 arranges sensitive chip 121 described in，Described sensitive chip 121 is electrically connected by described connecting line 124，And then mold on described molding wiring board main body 122 after preliminary assembling and sensitive chip 121 parts，Such as form described encapsulation part 11 with mould pressing process (Molding) conventional in semiconductor packages，Or described wiring board main body 122 can be chosen as using injection machine，Wiring board after carrying out SMT technique (Surface Mount Technology surface mount process) by insert molding (Insert Molding) technique carries out molding and forms described encapsulation part 11，Described wiring board main body 122 can be chosen as，Citing ground but be not limited to，Rigid Flex、Ceramic substrate (without soft board)、PCB hardboard (without soft board) etc..Described encapsulation part 11 formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11 can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the present invention can be not the restriction of the present invention in the way of enforcement.
It is worth mentioning that, the molded mode of described photosensory assembly 10 based on the present invention, described photosensory assembly 10 is more suitable for layout operation, once completes the manufacture of the described photosensory assembly 10 of more amount, such as can reach 90, and traditional wiring board the most at most can only produce 8.
Further, described encapsulation part 11 includes cladding section 111 and an optical filter construction section 112, it is integrally connected to described cladding section 111 described optical filter construction section 112 molding, described cladding section 111 molding is connected to described wiring board main body 122, is used for being coated with described component 123 and described connecting line 124.Described optical filter construction section 112 is for installing an optical filter 20, that is, when described photosensory assembly 10 is used for assembling described camera module, the described optical filter 20 of described camera module is installed in described optical filter construction section 112, described optical filter 20 is positioned on the photosensitive path of described sensitive chip 121, and need not provide extra optical filter mounting bracket.That is, described encapsulation part 11 has the function of conventional stent herein, but advantage based on moulding technology, described optical filter construction section 112 top can be by the technology mode of mold, make it have good planarization, so that described optical filter 20 is entirely mounted, this point is also an advantage over traditional camera module.Especially, described optical filter 20 is a cutoff filter IRCF.
Further, described optical filter construction section 112 has a mounting groove 1121, described mounting groove 1211 is communicated in described through hole 1100, provides sufficient installing space for described optical filter 20 so that described optical filter 20 will not protrude from the top surface of described camera lens construction section 112.It is to say, described encapsulation part 11 upper end arranges described mounting groove, such that it is able to described optical filter 20 is installed on wherein.
It is worth mentioning that, in this embodiment in accordance with the invention, described mounting groove 1121 may be used for installing optical filter, and in other enforcements of the present invention, described mounting groove 1121 can be used to the parts such as motor or the camera lens of installing described camera module, those skilled in the art is it should be appreciated that the purposes of described mounting groove is not the restriction of the present invention.
It is noted that the inwall of described encapsulation part 11 can according to the shape of described connection and arrange, be such as set to skewed, thus make described sensitive chip 121 can receive more light being coated with while described connecting line 124.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11 is not the restriction of the present invention.
With reference to Fig. 2 to Fig. 7, according to the camera module of first preferred embodiment of the present invention.Described camera module can be one to focus module (Fix Focus Model, FFM).Described camera module includes optical filter 20 and a camera lens 30 described in photosensory assembly 10, described in.
Described optical filter 20 is installed in described photosensory assembly 10, and described camera lens 30 is installed on described photosensory assembly 10.
More specifically, described optical filter 20 is installed in the described mounting groove 1121 of the described optical filter construction section 112 of the described encapsulation part 11 of described photosensory assembly 10.Described camera lens 30 is by the top of the described optical filter construction section 112 by the described encapsulation part 11 being installed on described photosensory assembly 10.It is to say, described optical filter is installed in described mounting groove, described camera lens 30 is installed in described encapsulation part 11 top.
It will also be appreciated that, described camera lens 30 is installed in described optical filter construction section 112 top of the described encapsulation part 11 of described photosensory assembly 10, thus described encapsulation part 11 is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 30, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11 is fixed on described wiring board main body 122 by moulding technology, need not paste fixation procedure, molding mode is relative to pasting the fixing controllability with more preferable connective stability and technical process, and between described encapsulation part 11 and described wiring board main body 122, need not the glue space that reserved AA adjusts, therefore the headspace that tradition camera module AA adjusts is reduced, the thickness making camera module is reduced, and under conditions of with the structural strength such as reaching, the thickness of the described wiring board main body 122 in the molding scheme of the present invention can be less；On the other hand, described encapsulation part 11 is coated with described component 123 and described connecting line 124, traditional cradling function and component 123 and described connecting line 124 can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described encapsulation part 11 of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11 replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles.And described encapsulation part 11 is coated with described connecting line 124, and described encapsulation part 11 extends to the non-photo-sensing district 1212 of described sensitive chip 121 so that described encapsulation part 11 to contract, thus can reduce the horizontal length and width size of described camera module further.
With reference to Fig. 2 to Fig. 5 and Fig. 8 and Fig. 9, being another camera module of first preferred embodiment according to the present invention, described camera module can be a dynamic burnt camera module (Automatic Focus Model, AFM).Described camera module includes motor 40 and a camera lens 30 described in optical filter 20, described in photosensory assembly 10, described in.
Described optical filter 20 is installed in described photosensory assembly 10, and described camera lens 30 is installed in described motor 40, and described motor 40 is installed on described molding circuit pack 10.
Further, described optical filter 20 is installed in the described mounting groove 1121 of described optical filter construction section 112 of described encapsulation part 11 of described photosensory assembly 10.Described motor 40 is installed in described optical filter construction section 112 top of the described encapsulation part 11 of described photosensory assembly 10.It is to say, described optical filter 20 is installed in the described mounting groove of described encapsulation part 11, described camera lens 30 is installed in described motor 40, and described motor 40 is installed in the top of described encapsulation part 11.
Especially, when described pin is adhered to described circuit junction by conducting resinl attaching mode, it may not be necessary to welding lead connects the described wiring board main body 122 of described horse 40 and described photographic department 12, thus reduces the technical process of motor welding.
It will be apparent to a skilled person that structure and the type of above-mentioned camera module are only used as citing, illustrate that described camera module can be not the restriction of the present invention in the way of being carried out.
With reference to Figure 10 and Figure 11, according to camera module photosensory assembly and the camera module of second preferred embodiment of the present invention.Described photosensory assembly 10A is for camera module described in assembly, thus obtains the camera module of moulding type.Described photosensory assembly 10A includes encapsulation part 11A and a photographic department 12A, is connected to described photographic department 12A described encapsulation part 11A molding.
Described photographic department 12A includes wiring board main body 122A and a sensitive chip 121A, and described sensitive chip 121A is arranged in described wiring board main body 122A.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121A molding.
According to this embodiment of the present invention, described photographic department 12A includes a connection line (not shown) and at least one component 123A.Described connection line defaults in described wiring board main body 122A, and described component 123A is electrically connected to described connection line and described sensitive chip 121A, for the photosensitive work process of described sensitive chip 121A.Described component 123A is arranged at described wiring board main body 122A projectedly.Described component 123A it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123A is coated on inside it by described encapsulation part 11A, hence in so that described component 123A will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121A, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123A, described sensitive chip 121A is not interfered with yet, it is different from the existing way that in tradition camera module, component 123A exposes, such as capacitance resistance ware, thus by the way of molding is coated with, prevent dust, foreign material stay in described component 123A surface, avoid polluting described sensitive chip 121A and make camera module that the bad phenomenon such as pitch-black point occur.
Described encapsulation part 11A forms a through hole 1100A, in order to provide photosensitive path for described sensitive chip 121A.
According to this preferred embodiment of the present invention, described photographic department 12A includes at least one connecting line 124A, is used for electrically connecting described sensitive chip 121A and described wiring board main body 122A.Further, each described connecting line 124A may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..The lowest, described connecting line 124A curvedly connects described sensitive chip 121A and described wiring board main body 122A, thus avoids described connecting line 124A bending damage occur.It is worth mentioning that, each described connecting line 124A is molded into inside described encapsulation part 11A, such that it is able to each described connecting line 124A is coated with by described encapsulation part 11A, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124A will not be touched damage by any, reduce the environmental factors impact on individual described connecting line 124A simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121A and described wiring board main body 122A, this point is totally different from prior art.
It is worth mentioning that; described encapsulation part 11A cladding described component 123A and described connecting line 124A; there is protection described component 123A and described connecting line 124A and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11A is not limited to be coated with described component 123A or described connecting line 124A.It is to say, in other embodiments of the invention, described encapsulation part 11A can directly be molded into described wiring board main body 122A of the described component 123A not protruded, it is also possible to be molded into outside described component 123A, the diverse location such as surrounding.
Be different from above preferred embodiment is, described wiring board main body 122A has an inner groovy 1222A, described sensitive chip 121A is arranged in described inner groovy 1222A, so that the relative altitude of described sensitive chip 121A and described wiring board main body 122A reduces, thus when described encapsulation part 11A is coated with described sensitive chip 121A, reduce the requirement for height to described encapsulation part 11A, thus reduce the height of the camera module that described photosensory assembly 10A assembles.
Further, described sensitive chip 121A has an a photosensitive area 1211A and non-photo-sensing district 1212A, and it is peripheral that described non-photo-sensing district 1212A is surrounded on described photosensitive area 1211A.Described photosensitive area 1211A is used for carrying out photosensitization, and described connecting line 124A is connected to described non-photo-sensing district 1212A.
According to this preferred embodiment of the present invention, described encapsulation part 11A extends the described non-photo-sensing district 1212A of described sensitive chip 121A, thus described sensitive chip 121A lamination by the way of molding is fixed on described wiring board main body 122A.By such mode, as being molded into mode (the Molding on chip of chip, MOC) the inside mouldable scope of described encapsulation part 11A is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122A and described encapsulation part 11A, reduce the length and width size of described photosensory assembly 12A further, reduce the length and width size of the described camera module assembled by it.
In this embodiment in accordance with the invention, described encapsulation part 11A projection ground is around outside the described photosensitive area 1211A of described sensitive chip 121A, especially, described encapsulation part 11A closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10A is used for assembling described camera module, described sensitive chip 121A is sealed in inside, form space in a closing.
Further, described encapsulation part 11A includes cladding section 111A and an optical filter construction section 112A, it is integrally connected to described cladding section 111A described optical filter construction section 112A molding, described cladding section 111A molding is connected to described wiring board main body 122A, is used for being coated with described component 123A and described connecting line 124A.Described optical filter construction section 112A is for installing an optical filter 20A, that is, when described photosensory assembly 10A is used for assembling described camera module, the optical filter 20A of described camera module is installed in described optical filter construction section 112A, described optical filter 20A is positioned on the photosensitive path of described sensitive chip 121A, and need not provide extra optical filter 20A mounting bracket.That is, described encapsulation part 11A has the function of conventional stent herein, but advantage based on moulding technology, described optical filter construction section 112A top can be by the technology mode of mold, make it have good planarization, so that described optical filter 20A is entirely mounted, this point is also an advantage over traditional camera module.
Further, described optical filter construction section 112A has a mounting groove 1121A, described support slot is communicated in described through hole 1100A, provides sufficient installing space for described optical filter 20A so that described optical filter 20A will not protrude from the top surface of optical filter construction section 112A.It is to say, described encapsulation part 11A upper end arranges described mounting groove, thus by described encapsulation part 11A that is installed on stable for described optical filter 20A, and the top of described encapsulation part 11A will not be protruded from.
It is noted that the inwall of described molding can according to the shape of described connection and arrange, be such as set to skewed, thus make described sensitive chip 121A can receive more light being coated with while described connecting line 124A.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11A is not the restriction of the present invention.
With reference to Figure 11 and Figure 12, according to the camera module of second preferred embodiment of the present invention.Described camera module can be one to focus module.Described camera module includes photosensory assembly 10A described in, an optical filter 20A and camera lens 30A described in.
Described optical filter 20A is installed in described photosensory assembly 10A, described camera lens 30A and is installed on described photosensory assembly 10A.
More specifically, described optical filter 20A is installed in the described mounting groove 1111A of the described optical filter construction section 111A of described encapsulation part 11A of described photosensory assembly 10A.Described camera lens 30A is by the top of the described optical filter construction section 111A by described encapsulation part 11A being installed on described photosensory assembly 10A.In other words, described optical filter 20A be installed in described encapsulation part 11A described IR support grain 1111A, described camera lens 30A be installed in the top of described encapsulation part 11A.
In other embodiments of the invention, described photosensory assembly 10A can also be assembled as a dynamic burnt camera module.Those skilled in the art it should be appreciated that described in focus camera module and be only used as the brightest present invention, be not the restriction of the present invention.
With reference to Figure 12 and Figure 13, according to photosensory assembly and the camera module of the 3rd preferred embodiment of the present invention.Described photosensory assembly 10B is for camera module described in assembly, thus obtains the camera module of moulding type.Described photosensory assembly 10B includes encapsulation part 11B and a photographic department 12B, is connected to described photographic department 12B described encapsulation part 11B molding.
Described photographic department 12B includes wiring board main body 122B and a sensitive chip 121B, and described sensitive chip 121B is arranged in described wiring board main body 122B.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121B molding.
According to this embodiment of the present invention, described photographic department 12B includes a connection line (not shown) and at least one component 123B.Described connection line defaults in described wiring board main body 122B, and described component 123B is electrically connected to described connection line and described sensitive chip 121B, for the photosensitive work process of described sensitive chip 121B.Described component 123B is arranged at described wiring board main body 122B projectedly.Described component 123B it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123B is coated on inside it by described encapsulation part 11B, hence in so that described component 123B will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121B, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123B, described sensitive chip 121B is not interfered with yet, it is different from the existing way that in tradition camera module, component 123B exposes, such as capacitance resistance ware, thus by the way of molding is coated with, prevent dust, foreign material stay in described component 123B surface, avoid polluting described sensitive chip 121B and make camera module that the bad phenomenon such as pitch-black point occur.
Described encapsulation part 11B forms a through hole 1100B, in order to provide photosensitive path for described sensitive chip 121B.
According to this preferred embodiment of the present invention, described photographic department 12B includes at least one connecting line 124B, is used for electrically connecting described sensitive chip 121B and described wiring board main body 122B.Further, each described connecting line 124B may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..The lowest, described connecting line 124B curvedly connects described sensitive chip 121B and described wiring board main body 122B, thus avoids described connecting line 124B bending damage occur.
It is worth mentioning that, each described connecting line 124B is molded into inside described encapsulation part 11B, such that it is able to each described connecting line 124B is coated with by described encapsulation part 11B, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124B will not be touched damage by any, reduce the environmental factors impact on individual described connecting line 124B simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121B and described wiring board main body 122B, this point is not to be provided in prior art.
It is worth mentioning that; described encapsulation part 11B cladding described component 123B and described connecting line 124B; there is protection described component 123B and described connecting line 124B and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11B is not limited to be coated with described component 123B or described connecting line 124B.It is to say, in other embodiments of the invention, described encapsulation part 11B can directly be molded into described wiring board main body 122B of the described component 123B not protruded, it is also possible to be molded into outside described component 123B, the diverse location such as surrounding.
Further, described sensitive chip 121B has an a photosensitive area 1211B and non-photo-sensing district 1212B, and it is peripheral that described non-photo-sensing district 1212B is surrounded on described photosensitive area 1211B.Described photosensitive area 1211B is used for carrying out photosensitization, and described connecting line 124B is connected to described non-photo-sensing district 1212B.
According to this preferred embodiment of the present invention, described encapsulation part 11B extends the described non-photo-sensing district 1212B of described sensitive chip 121B, thus described sensitive chip 121B lamination by the way of molding is fixed on described wiring board main body 122B.By such mode, as being molded into mode (the Molding on Chip of chip, MOC) the inside mouldable scope of described encapsulation part 11B is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122B and described encapsulation part 11B, reduce the length and width size of described molding photographic department 12B part further, reduce the length and width size of the described camera module assembled by it.
In this embodiment in accordance with the invention, described encapsulation part 11B projection ground is around outside the described photosensitive area 1211B of described sensitive chip 121B, especially, described encapsulation part 11B closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10B is used for assembling described camera module, described sensitive chip 121B is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10B, a traditional wiring board can be chosen as described wiring board main body 122B, described wiring board main body 122B arranges sensitive chip 121B described in, described sensitive chip 121B is electrically connected by described connecting line 124B, and then mold on described molding wiring board main body 122B after preliminary assembling and sensitive chip 121B parts, as with injection machine, wiring board after carrying out SMT technique (Surface Mount Technology surface mount process) by insert molding (molding) technique carries out molding and forms described encapsulation part 11B, or form described encapsulation part 11B with mould pressing process conventional in semiconductor packages.Described wiring board main body 122B can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11B formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11B can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the present invention can be not the restriction of the present invention in the way of enforcement.
Further, described encapsulation part 11B top end surface is smooth, be suitable to an optical filter 20B is installed, that is, when described photosensory assembly 10B is used for assembling described camera module, the optical filter 20B of described camera module is installed in the top end surface of described encapsulation part 11B so that described optical filter 20B is positioned on the photosensitive path of described sensitive chip 121B, and need not provide extra optical filter 20B mounting bracket.That is, described encapsulation part 11B has the function of conventional stent herein, but advantage based on moulding technology, described mould top 11B can be by the technology mode of mold, make it have good planarization, so that described optical filter 20B is entirely mounted, this point is also an advantage over traditional camera module.
Be different from above preferred embodiment is, in this embodiment in accordance with the invention, the described photographic department 12B of described photosensory assembly 10B includes a back-up coat 125B, it is connected to described wiring board main body 122B bottom, in order to strengthen the structural strength of described wiring board main body 122B described back-up coat 125B lamination.That is, in described wiring board main body 122B, the region bottom at described encapsulation part 11B and described sensitive chip 121B place mounts described back-up coat 125B, so that described wiring board main body 122B reliablely and stablely supports described encapsulation part 11B and described sensitive chip 121B.
Further, described back-up coat 125B is a metallic plate, described metallic plate is attached at the bottom of described wiring board main body 122B, increase the structural strength of described wiring board main body 122B, on the other hand, increase the heat dispersion of described photosensory assembly 10B, the heat that the described sensitive chip 121B that can effectively scatter and disappear sends.
It is worth mentioning that, described wiring board main body 122B can use FPC (Flex Print Circuit, flexible printed-circuit board), and the rigidity of described FPC is strengthened by described back-up coat 125B so that the FPC with excellent bending performance disclosure satisfy that the bearing requirements of described photosensory assembly 10B.It is to say, the selectable range of described wiring board main body 122B is more extensive, such as PCB (Printed Circuit Board, rigid printed circuit boards), FPC, RF (Rigid Flex, Rigid Flex).Increase the structural strength of described wiring board main body 122B by described back-up coat 125B and improve heat dispersion, such that it is able to reduce the thickness of described wiring board main body 122B, the height making described photosensory assembly 10B reduces further, and the height being assembled the camera module obtained by it reduces.
It is worth mentioning that, in this embodiment in accordance with the invention, described back-up coat 125 is plate-shaped is overlapped in described wiring board main body 122B, and in other embodiments of the invention, described back-up coat 125B can extend to wrap up described encapsulation part 11B sidewall, thus while strengthening the structural strength of described photosensory assembly 10B, strengthen its anti-electromagnetic interference capability.
It is noted that the inwall of described encapsulation part can according to the shape of described connection and arrange, be such as set to skewed, thus make described sensitive chip 121B can receive more light being coated with while described connecting line 124B.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11B is not the restriction of the present invention.
With reference to Figure 12 and Figure 13, according to the camera module of the 3rd preferred embodiment of the present invention.Described camera module can be one to focus module (Fix Focus Model, FFM).Described camera module includes photosensory assembly 10B described in, an optical filter 20B and camera lens 30B described in.
Described optical filter 20B is installed in described photosensory assembly 10B, described camera lens 30B and is installed on described photosensory assembly 10B.
More specifically, described optical filter 20B is installed in the described encapsulation part 11B top of described photosensory assembly 10B.Described camera lens 30B is by the top by described encapsulation part 11B being installed on described photosensory assembly 10B.Especially, described optical filter 20B and described camera lens 30B can coordinate configuration according to specific needs in the concrete installation site of described encapsulation part 11B.
It will also be appreciated that, described camera lens 30B is installed in the top of described encapsulation part 11B of described photosensory assembly 10B, thus described encapsulation part 11B is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 30B, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11B is fixed on described wiring board main body 122B by moulding technology, need not paste fixation procedure, molding mode is relative to pasting the fixing controllability with more preferable connective stability and technical process, and between described encapsulation part 11B and described wiring board main body 122B, need not the glue space that reserved AA adjusts, therefore the headspace that tradition camera module AA adjusts is reduced so that the thickness of camera module is reduced；On the other hand, described encapsulation part 11B cladding described component 123B and described connecting line 124B, traditional cradling function and component 123B and described connecting line 124B can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with described encapsulation part 11B of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11B replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles.And described encapsulation part 11B is coated with described connecting line 124B, and described encapsulation part 11B extends to the non-photo-sensing district 1212B of described sensitive chip 121B so that described encapsulation part 11B to contract, thus can reduce the horizontal length and width size of described camera module further.
With reference to Figure 12 and Figure 14, will be illustrated according to another camera module of the 3rd preferred embodiment of the present invention.Described camera module can be a dynamic burnt camera module.Described camera module includes photosensory assembly 10B described in, optical filter 20B, a motor 40B and a camera lens 30B described in one.
Described optical filter 20B is installed in described photosensory assembly 10B, described camera lens 30B and is installed in described motor 40B, described motor 40B and is installed on described molding circuit pack.
Further, described optical filter 20B is installed in the top of described encapsulation part 11B of described photosensory assembly 10B.Described motor 40B is installed on the top of described encapsulation part 11B of described photosensory assembly 10B.Especially, described optical filter 20B and described motor 40B can coordinate configuration according to specific needs in the concrete installation site of described encapsulation part 11B.
Especially, described wiring board main body 122B of described engraving circuit 114B electrical connection described motor 40B and described photographic department 12B, such that it is able to need not welding lead to connect described wiring board main body 122B of described horse 40B and described photographic department 12B, reduce the technical process of motor welding.
It will be apparent to a skilled person that structure and the type of above-mentioned camera module are only used as citing, illustrate that described camera module can be not the restriction of the present invention in the way of being carried out.
With reference to Figure 15 and Figure 17, photosensory assembly and camera module according to the 4th preferred embodiment of the present invention will be illustrated.Described photosensory assembly 10C is for camera module described in assembly, thus obtains the camera module of moulding type.Described photosensory assembly 10C includes encapsulation part 11C and photographic department 12C, is connected to described photographic department 12C described encapsulation part 11C molding.
Described photographic department 12C includes wiring board main body 122C and a sensitive chip 121C, and described sensitive chip 121C is arranged in described wiring board main body 122C.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121C molding.
According to this embodiment of the present invention, described photographic department 12C includes a connection line (not shown) and at least one component 123C.Described connection line defaults in described wiring board main body 122C, and described component 123C is electrically connected to described connection line and described sensitive chip 121C, for the photosensitive work process of described sensitive chip 121C.Described component 123C is arranged at described wiring board main body 122C projectedly.Described component 123C it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123C is coated on inside it by described encapsulation part 11C, hence in so that described component 123C will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121C, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123C, described sensitive chip 121C is not interfered with yet, it is different from the existing way that in tradition camera module, component 123C exposes, such as capacitance resistance ware, thus by the way of molding is coated with, prevent dust, foreign material stay in described component 123C surface, avoid polluting described sensitive chip 121C and make camera module that the bad phenomenon such as pitch-black point occur.
Described encapsulation part 11C forms a through hole 1100C, in order to provide photosensitive path for described sensitive chip 121C.
According to this preferred embodiment of the present invention, described photographic department 12C includes at least one connecting line 124C, is used for electrically connecting described sensitive chip 121C and described wiring board main body 122C.Further, each described connecting line 124C may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..The lowest, described connecting line 124C curvedly connects described sensitive chip 121C and described wiring board main body 122C, thus avoids described connecting line 124C bending damage occur.
It is worth mentioning that, each described connecting line 124C is molded into inside described encapsulation part 11C, such that it is able to each described connecting line 124C is coated with by described encapsulation part 11C, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124C will not be touched damage by any, reduce the environmental factors impact on individual described connecting line 124C simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121C and described wiring board main body 122C, this point is not to be provided in prior art.
It is worth mentioning that; described encapsulation part 11C cladding described component 123C and described connecting line 124C; there is protection described component 123C and described connecting line 124C and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11C is not limited to be coated with described component 123C or described connecting line 124C.It is to say, in other embodiments of the invention, described encapsulation part 11C can directly be molded into described wiring board main body 122C of the described component 123C not protruded, it is also possible to be molded into outside described component 123C, the diverse location such as surrounding.
Further, described sensitive chip 121C has an a photosensitive area 1211C and non-photo-sensing district 1212C, and it is peripheral that described non-photo-sensing district 1212C is surrounded on described photosensitive area 1211C.Described photosensitive area 1211C is used for carrying out photosensitization, and described connecting line 124C is connected to described non-photo-sensing district 1212C.
According to this preferred embodiment of the present invention, described encapsulation part 11C extends the described non-photo-sensing district 1212C of described sensitive chip 121C, thus described sensitive chip 121C lamination by the way of molding is fixed on described wiring board main body 122C.By such mode, the inside mouldable scope of encapsulation part 11C as described in be molded into the mode (Molding on the chip) of chip and expand, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122C and described encapsulation part 11C, reduce the length and width size of described photosensory assembly further, reduce the length and width size of the described camera module assembled by it.
In this embodiment in accordance with the invention, described encapsulation part 11C projection ground is around outside the described photosensitive area 1211C of described sensitive chip 121C, especially, described encapsulation part 11C closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10C is used for assembling described camera module, described sensitive chip 121C is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10C, a traditional wiring board can be chosen as described wiring board main body 122C, described wiring board main body 122C arranges sensitive chip 121C described in, described sensitive chip 121C is electrically connected by described connecting line 124C, and then mold on described molding wiring board main body 122C after preliminary assembling and sensitive chip 121C parts, as with injection machine, wiring board after carrying out SMT technique (Surface Mount Technology surface mount process) by insert molding (molding) technique carries out molding and forms described encapsulation part 11C, or form described encapsulation part 11C with mould pressing process conventional in semiconductor packages.Described wiring board main body 122C can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11C formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11C can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the present invention can be not the restriction of the present invention in the way of enforcement.
Described photosensory assembly 10C with farther including an optical filter 20C, described optical filter 20C molding lamination is arranged on described sensitive chip 121C.The edge of described optical filter 20C is molded into described encapsulation part 11C, thus fixes described optical filter 20C.It is noted that described optical filter 20C is covered in above described sensitive chip 121C, described sensitive chip 121C is isolated with external environment condition, protects described sensitive chip 121C sustain damage and prevent the entrance of dust.
When manufacturing described photosensory assembly 10C, first described sensitive chip 121C is attached at described wiring board main body 122C, and it is connected to described sensitive chip 121C and described wiring board main body 122C by described, and then described optical filter 20C is attached on described sensitive chip 121C, further, described wiring board main body 122C and described sensitive chip 121C and described optical filter 20C are molded, forms described encapsulation part 11C.When molding, owing to described optical filter 20C is covered on described sensitive chip 121C, therefore, it is possible to prevent the mould injury for described sensitive chip 121C of molding, and owing to the distance of described optical filter 20C and described sensitive chip 121C reduces, therefore so that the back focal length of the camera module assembled by it reduces, thus reduce the height of described camera module, on the other hand, owing to being not necessary for the support member that described optical filter 20C provides extra, the thickness of described camera module is made to be further reduced the most to a certain extent.
It is noted that the inwall of described encapsulation part 10C can according to the shape of described connection and arrange, be such as set to skewed, thus make described sensitive chip 121C many light such as can receive being coated with while described connecting line 124C.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11C is not the restriction of the present invention.
With reference to Figure 15 to Figure 17, according to the camera module of the 4th preferred embodiment of the present invention.Described camera module can be one to focus module.Described camera module includes photosensory assembly 10C described in an one and camera lens 30C.Described camera lens 30C is installed on described photosensory assembly 10C, assembles and forms described camera module.
Especially, described camera lens 30C can be fixed on the top of described encapsulation part 11C of described photosensory assembly 10C by the way of bonding, and by the feature of Making mold in moulding technology, the top making described encapsulation part 11C has preferable planarization, there is provided good mounting condition for described camera lens 30C, thus obtain the camera module of high-quality.
It is worth mentioning that, described camera lens 30C is installed in the top of described encapsulation part 11C of described photosensory assembly 10C, thus described encapsulation part 11C is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 30C, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11C is fixed on described wiring board main body 122C by moulding technology, need not paste fixation procedure, molding mode is relative to pasting the fixing controllability with more preferable connective stability and technical process, and between described encapsulation part 11C and described wiring board main body 122C, need not the glue space that reserved AA adjusts, therefore the headspace that tradition camera module AA adjusts is reduced so that the thickness of camera module is reduced；On the other hand, described encapsulation part 11C cladding described component 123C and described connecting line 124C, traditional cradling function and component 123C and described connecting line 124C can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with described encapsulation part 11C of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11C replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles.And described encapsulation part 11C is coated with described connecting line 124C, and described encapsulation part 11C extends to the non-photo-sensing district 1212C of described sensitive chip 121C so that described encapsulation part 11C to contract, thus can reduce the horizontal length and width size of described camera module further.And, described optical filter 20C is molded inside it by described photosensory assembly 10C, therefore when assembling described camera module, need not again carry out the stickup installation process of optical filter, thus reduce camera module packaging technology process, and improving work efficiency, these are all an advantage over prior art.
With reference to Figure 15, Figure 16 and Figure 18, it is that another camera module of the 4th preferred embodiment according to the present invention will be illustrated.Described camera module can be a dynamic burnt camera module (Automatic Focus Model, AFM).Described camera module includes photosensory assembly 10C described in, a motor 40C and a camera lens 30C.
Described camera lens 30C is installed in described motor 40C, described motor 40C and is installed on described photosensory assembly 10C, in order to regulate described camera module focal length by described motor 40C.Described motor 40C is installed on the top of described encapsulation part 11C of described photosensory assembly 10C.
Especially, described wiring board main body 122C of described engraving circuit 114C electrical connection described motor 40C and described photographic department 12C, such that it is able to need not welding lead to connect described wiring board main body 122C of described motor 40C and described photographic department 12C, reduce the technical process of motor welding.
It will be apparent to a skilled person that structure and the type of above-mentioned camera module are only used as citing, illustrate that described camera module can be not the restriction of the present invention in the way of being carried out.
With reference to Figure 19 and 20, photosensory assembly and camera module according to the 5th preferred embodiment of the present invention will be illustrated.Described photosensory assembly 10D is for camera module described in assembly, thus obtains the described camera module of moulding type.Described photosensory assembly 10D includes encapsulation part 11D and a photographic department 12D, is connected to described photographic department 12D described encapsulation part 11D molding.
Especially, described encapsulation part is molded into described photographic department 12D in the way of MOC.
Described photographic department 12D includes wiring board main body 122D and a sensitive chip 121D, and described sensitive chip 121D is arranged in described wiring board main body 122D.According to this embodiment of the invention, it is connected to described wiring board main body 122D described sensitive chip 121D molding.
According to this embodiment of the present invention, described photographic department 12D includes a connection line (not shown) and at least one component 123D.Described connection line defaults in described wiring board main body 122D, and described component 123D is electrically connected to described connection line and described sensitive chip 121D, for the photosensitive work process of described sensitive chip 121D.Described component 123D is arranged at described wiring board main body 122D projectedly.Described component 123D it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..It is worth mentioning that, described component 123D is coated on inside it by described encapsulation part 11D, hence in so that described component 123D will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121D, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123D, described sensitive chip 121D is not interfered with yet, it is different from the existing way that in tradition camera module, component 123D exposes, such as capacitance resistance ware, thus by the way of molding is coated with, prevent dust, foreign material stay in described component 123D surface, avoid polluting described sensitive chip 121D and make camera module that the bad phenomenon such as pitch-black point occur.
Described encapsulation part 11D forms a through hole 1100D, in order to provide photosensitive path for described sensitive chip 121D.
According to this preferred embodiment of the present invention, described photographic department 12D includes at least one connecting line 124D, is used for electrically connecting described sensitive chip 121D and described wiring board main body 122D.Further, each described connecting line 124D may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..The lowest, described connecting line 124D curvedly connects described sensitive chip 121D and described wiring board main body 122D, thus avoids described connecting line 124D bending damage occur.
It is worth mentioning that, each described connecting line 124D is molded into inside described encapsulation part 11D, such that it is able to each described connecting line 124D is coated with by described encapsulation part 11D, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124D will not be touched damage by any, reduce the environmental factors impact on individual described connecting line 124D simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121D and described wiring board main body 122D, this point is not to be provided in prior art.
It is worth mentioning that; described encapsulation part 11D cladding described component 123D and described connecting line 124D; there is protection described component 123D and described connecting line 124D and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11D is not limited to be coated with described component 123D or described connecting line 124D.It is to say, in other embodiments of the invention, described encapsulation part 11D can directly be molded into described wiring board main body 122D of the described component 123D not protruded, it is also possible to be molded into outside described component 123D, the diverse location such as surrounding.
Described photosensory assembly 10D with farther including an optical filter 20D, described optical filter 20D molding lamination is arranged on described sensitive chip 121D.The edge of described optical filter 20D is molded into described encapsulation part 11D, thus fixes described optical filter 20D.It is noted that described optical filter 20D is covered in above described sensitive chip 121D, described sensitive chip 121D is isolated with external environment condition, protects described sensitive chip 121D sustain damage and prevent the entrance of dust.
Further, described sensitive chip 121D has an a photosensitive area 1211D and non-photo-sensing district 1212D, and it is peripheral that described non-photo-sensing district 1212D is surrounded on described photosensitive area 1211D.Described photosensitive area 1211D is used for carrying out photosensitization, and described connecting line 124D is connected to described non-photo-sensing district 1212D.
According to this preferred embodiment of the present invention, described encapsulation part 11D extends the described non-photo-sensing district 1212D of described sensitive chip 121D, thus described sensitive chip 121D lamination by the way of molding is fixed on described wiring board main body 122D.By such mode, as being molded into mode (the Molding on the Chip of chip, MOC) the inside mouldable scope of described encapsulation part 11D is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122D and described encapsulation part 11D, reduce the length and width size of described molding photographic department 12D part further, reduce the length and width size of the described camera module assembled by it.
In this embodiment in accordance with the invention, described encapsulation part 11D projection ground is around outside the described photosensitive area 1211D of described sensitive chip 121D, especially, described encapsulation part 11D closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10D is used for assembling described camera module, described sensitive chip 121D is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10D, a traditional wiring board can be chosen as described wiring board main body 122D, described wiring board main body 122D arranges sensitive chip 121D described in, described sensitive chip 121D is electrically connected by described connecting line 124D, and then mold on described molding wiring board main body 122D after preliminary assembling and sensitive chip 121D parts, as with injection machine, wiring board after carrying out SMT technique (Surface Mount Technology surface mount process) by insert molding (molding) technique carries out molding and forms described encapsulation part 11D, or form described encapsulation part 11D with mould pressing process conventional in semiconductor packages.Described wiring board main body 122D can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11D formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11D can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the present invention can be not the restriction of the present invention in the way of enforcement.
Further, described encapsulation part 11D includes cladding section 111D, an optical filter construction section 112D and a camera lens construction section 113D, described optical filter construction section 112D and described camera lens construction section 113D molds the most integratedly and is connected to described cladding section 111D, described cladding section 111D molding is connected to described wiring board main body 122D, is used for being coated with described component 123D and described connecting line 124D.Described camera lens construction section 113D is for installing a camera lens 30D, that is, when described photosensory assembly 10D is used for assembling described camera module, described camera lens 30D is installed in inside the described camera lens construction section 113D of described encapsulation part 11D, in order to provide stable installation site for described camera lens 30D.Described camera lens construction section 113D has a camera lens mounting groove 1131D, described camera lens mounting groove 1131D and is communicated in described through hole 1100D, provides sufficient installing space for described camera lens 30D.It is installed in described mounting groove 1121D, described camera lens 30D is installed in described camera lens mounting groove 1131D it is to say, described encapsulation part 11D has camera lens mounting groove 1131D described in mounting groove 1121D and described in, described optical filter 20D.
Described camera lens construction section 113D upwardly extends integratedly, and is internally formed step-like structure, provides for described camera lens 30D and supports fixed position, from without providing extra parts to install described camera lens 30D.In other words, described encapsulation part 11D upwardly extends integratedly, and is internally formed step-like, to be respectively coated by described component and described connecting line and to support described camera lens.
Described camera lens construction section 113D has a camera lens inwall 1132D, and described camera lens inwall 1132D is closed annular, is suitable for described camera lens 30D and provides installing space.It is noted that the described camera lens inwall 1132D surfacing of described camera lens construction section 113D, thus be suitable to install threadless described camera lens 30D, formed and focus module.Especially, described camera lens 30D can be fixed on described camera lens construction section 113D by the way of bonding.
It is worth mentioning that, the inwall of described cladding section 111D of described encapsulation part 11D can according to the shape of described connection and arrange, such as it is set to skewed, thus makes described sensitive chip 121D can receive more light while being coated with described connecting line 124D.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11D is not the restriction of the present invention.
With reference to Figure 20, according to the camera module of the 5th preferred embodiment of the present invention.Described camera module can be one to focus module.Described camera module includes camera lens 30D described in photosensory assembly 10D and described in.
More specifically, described camera lens 30D is installed in the described camera lens mounting groove 1131D of the described camera lens construction section 113D of described encapsulation part 11D of described photosensory assembly 10D.Described optical filter 20D is molded into described photosensory assembly 11D, therefore need not provide extra optical filter, it is not required that when assembling described shooting molding, separately installed optical filter, therefore, reduce the process assembled, and the mode of molding optical filter makes the back focal length of described camera module to reduce.
It will also be appreciated that, described camera lens 30D is installed in the described camera lens construction section 113D of described encapsulation part 11D of described photosensory assembly 10D, thus described encapsulation part 11D is equivalent to the support in tradition camera module or the function of lens barrel, there is provided support, fixed position for described camera lens 30D, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11D is fixed on described wiring board main body 122D by moulding technology, need not paste fixation procedure, molding mode is relative to pasting the fixing controllability with more preferable connective stability and technical process, and between described encapsulation part 11D and described wiring board main body 122D, need not the glue space that reserved AA adjusts, therefore the headspace that tradition camera module AA adjusts is reduced, the thickness making camera module is reduced, and according to described encapsulation part 11D of the molding mode of the present invention, there is preferable flatness, therefore when assembling described camera module, AA adjustment can not be carried out；On the other hand, described encapsulation part 11D cladding described component 123D and described connecting line 124D, traditional cradling function and component 123D and described connecting line 124D can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with described encapsulation part 11D of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11D replaces traditional support, and provide installation site for described camera lens 30D, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles.And described encapsulation part 11D is coated with described connecting line 124D, and described encapsulation part 11D extends to the non-photo-sensing district 1212D of described sensitive chip 121D so that described encapsulation part 11D to contract, thus can reduce the horizontal length and width size of described camera module further.
With reference to Figure 21 and Figure 22, photosensory assembly and camera module according to the 6th preferred embodiment of the present invention will be illustrated.Described photosensory assembly 10E is for camera module described in assembly, thus obtains the described camera module of moulding type.Described photosensory assembly 10E includes encapsulation part 11E and photographic department 12E, is connected to described photographic department 12E described encapsulation part 11E molding.
Described photographic department 12E includes wiring board main body 122E and a sensitive chip 121E, and described sensitive chip 121E is arranged in described wiring board main body 122E.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121E molding.
According to this embodiment of the present invention, described photographic department 12E includes a connection line (not shown) and at least one component 123E.Described connection line defaults in described wiring board main body 122E, and described component 123E is electrically connected to described connection line and described sensitive chip 121E, for the photosensitive work process of described sensitive chip 121E.Described component 123E is arranged at described wiring board main body 122E projectedly.Described component 123E it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123E is coated on inside it by described encapsulation part 11E, hence in so that described component 123E will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121E, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123E, described sensitive chip 121E is not interfered with yet, it is different from the existing way that in tradition camera module, component 123E exposes, such as capacitance resistance ware, thus by the way of molding is coated with, prevent dust, foreign material stay in described component 123E surface, avoid polluting described sensitive chip 121E and make camera module that the bad phenomenon such as pitch-black point occur.
Described encapsulation part 11E forms a through hole 1100E, in order to provide photosensitive path for described sensitive chip 121E.
According to this preferred embodiment of the present invention, described photographic department 12E includes at least one connecting line 124E, is used for electrically connecting described sensitive chip 121E and described wiring board main body 122E.Further, each described connecting line 124E may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..The lowest, described connecting line 124E curvedly connects described sensitive chip 121E and described wiring board main body 122E, thus avoids described connecting line 124E bending damage occur.
It is worth mentioning that, each described connecting line 124E is molded into inside described encapsulation part 11E, such that it is able to each described connecting line 124E is coated with by described encapsulation part 11E, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124E will not be touched damage by any, reduce the environmental factors impact on individual described connecting line 124E simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121E and described wiring board main body 122E, this point is not to be provided in prior art.
It is worth mentioning that; described encapsulation part 11E cladding described component 123E and described connecting line 124E; there is protection described component 123E and described connecting line 124E and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11E is not limited to be coated with described component 123E or described connecting line 124E.It is to say, in other embodiments of the invention, described encapsulation part 11E can directly be molded into described wiring board main body 122E of the described component 123E not protruded, it is also possible to be molded into outside described component 123E, the diverse location such as surrounding.
Described photosensory assembly 10E with farther including an optical filter 20E, described optical filter 20E molding lamination is arranged on described sensitive chip 121E.The edge of described optical filter 20E is molded into described encapsulation part 11E, thus fixes described optical filter 20E.It is noted that described optical filter 20E is covered in above described sensitive chip 121E, described sensitive chip 121E is isolated with external environment condition, protects described sensitive chip 121E sustain damage and prevent the entrance of dust.
Further, described sensitive chip 121E has an a photosensitive area 1211E and non-photo-sensing district 1212E, and it is peripheral that described non-photo-sensing district 1212E is surrounded on described photosensitive area 1211E.Described photosensitive area 1211E is used for carrying out photosensitization, and described connecting line 124E is connected to described non-photo-sensing district 1212E.
According to this preferred embodiment of the present invention, described encapsulation part 11E extends the described non-photo-sensing district 1212E of described sensitive chip 121E, thus described sensitive chip 121E lamination by the way of molding is fixed on described wiring board main body 122E.By such mode, the inside mouldable scope of encapsulation part 11E as described in be molded into the mode (Molding on chip) of chip and expand, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122E and described encapsulation part 11E, reduce the length and width size of described molding photographic department 12E further, reduce the length and width size of the described camera module assembled by it.
In this embodiment in accordance with the invention, described encapsulation part 11E projection ground is around outside the described photosensitive area 1211E of described sensitive chip 121E, especially, described encapsulation part 11E closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10E is used for assembling described camera module, described sensitive chip 121E is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10E, a traditional wiring board can be chosen as described wiring board main body 122E, described wiring board main body 122E arranges sensitive chip 121E described in, described sensitive chip 121E is electrically connected by described connecting line 124E, and then mold on described molding wiring board main body 122E after preliminary assembling and sensitive chip 121E parts, as with injection machine, wiring board after carrying out SMT technique (Surface Mount Technology surface mount process) by insert molding (molding) technique carries out molding and forms described encapsulation part 11E, or form described encapsulation part 11E with mould pressing process conventional in semiconductor packages.Described wiring board main body 122E can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11E formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11E can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the present invention can be not the restriction of the present invention in the way of enforcement.
Further, described encapsulation part 11E includes cladding section 111E and a camera lens construction section 113E, described camera lens construction section 113E molds integratedly and is connected to described cladding section 111E, described cladding section 111E molding is connected to described wiring board main body 122E, is used for being coated with described component 123E and described connecting line 124E.Described camera lens construction section 113E is for installing a camera lens 30E, that is, when described photosensory assembly 10E is used for assembling described camera module, described camera lens 30E is installed in inside the described camera lens construction section 113E of described encapsulation part 11E, in order to provide stable installation site for described camera lens 30E.
Further, described camera lens construction section 113E has a camera lens mounting groove 1131E, described camera lens mounting groove 1131E and is communicated in described through hole 1100E, provides sufficient installing space for described camera lens 30E.It is to say, described encapsulation part 11E has camera lens mounting groove 1131E described in, described camera lens 30E is installed in described camera lens mounting groove 1131E.
Described camera lens construction section 113E upwardly extends integratedly along described covering portion 111E, and is internally formed step-like structure, provides for described camera lens 30E and supports fixed position, from without providing extra parts to install described camera lens 30E.In other words, described encapsulation part 11E upwardly extends integratedly, and is internally formed step-like, to be respectively coated by described component and described connecting line 124E, and supports described camera lens 30E.
Described camera lens construction section 113E has a camera lens inwall 1132E, and described camera lens inwall 1132E is closed annular, and being suitable to camera lens 30E provides installing space.It is noted that the described camera lens inwall 1132E surface of described camera lens construction section 113E has helicitic texture, thus be suitable to install threaded described camera lens 30E, formed and focus module.Especially, described camera lens 30E can be fixed on described camera lens construction section 113E by the way of being spirally connected.
It is noted that the inwall of described cladding section 111E of described molding can according to the shape of described connection and arrange, be such as set to skewed, thus make described sensitive chip 121E many light such as can receive being coated with while described connecting line 124E.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11E is not the restriction of the present invention.
With reference to Figure 22, according to the camera module of the 6th preferred embodiment of the present invention.Described camera module can be one to focus module.Described camera module includes camera lens 30E described in photosensory assembly 10E and described in.
More specifically, described camera lens 30E is installed in the described camera lens mounting groove 1131E of the described camera lens construction section 113E of described encapsulation part 11E of described photosensory assembly 10E.Described optical filter 20E is molded into described photosensory assembly 11E, therefore need not provide extra optical filter, also without when assembling described shooting molding, separately installed optical filter, therefore, reduce the assembling process of described camera module, and the mode of molding optical filter makes the back focal length of described camera module to reduce.
It will also be appreciated that, described camera lens 30E is installed in the described camera lens construction section 113E of described encapsulation part 11E of described photosensory assembly 10E, thus described encapsulation part 11E is equivalent to the support in tradition camera module or the function of lens barrel, there is provided support, fixed position for described camera lens 30E, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11E is fixed on described wiring board main body 122E by moulding technology, need not paste fixation procedure, molding mode is relative to pasting the fixing controllability with more preferable connective stability and technical process, and between described encapsulation part 11E and described wiring board main body 122E, need not the glue space that reserved AA adjusts, therefore the headspace that tradition camera module AA adjusts is reduced so that the thickness of camera module is reduced；On the other hand, described encapsulation part 11E cladding described component 123E and described connecting line 124E, traditional cradling function and component 123E and described connecting line 124E can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with described encapsulation part 11E of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11E replaces traditional support, and provide installation site for described camera lens 30E, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles.And described encapsulation part 11E is coated with described connecting line 124E, and described encapsulation part 11E extends to the non-photo-sensing district 1212E of described sensitive chip 121E so that described encapsulation part 11E to contract, thus can reduce the horizontal length and width size of described camera module further.
With reference to Figure 23 and Figure 24, photosensory assembly and camera module according to the 7th preferred embodiment of the present invention will be illustrated.Described photosensory assembly 10F is for camera module described in assembly, thus obtains the described camera module of moulding type.Described photosensory assembly 10F includes encapsulation part 11F and a photographic department 12F, is connected to described photographic department 12F described encapsulation part 11F molding.
Described photographic department 12F includes wiring board main body 122F and a sensitive chip 121F, and described sensitive chip 121F is arranged in described wiring board main body 122F.According to this embodiment of the invention, it is connected to described circuit main body 122F described sensitive chip 121F molding.
According to this embodiment of the present invention, described photographic department 12F includes a connection line (not shown) and at least one component 123F.Described connection line defaults in described wiring board main body 122F, and described component 123F is electrically connected to described connection line and described sensitive chip 121F, for the photosensitive work process of described sensitive chip 121F.Described component 123F is arranged at described wiring board main body 122F projectedly.Described component 123F it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123F is coated on inside it by described encapsulation part 11F, hence in so that described component 123F will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121F, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123F, described sensitive chip 121F is not interfered with yet, it is different from the existing way that in tradition camera module, component 123F exposes, such as capacitance resistance ware, thus by the way of molding is coated with, prevent dust, foreign material stay in described component 123F surface, avoid polluting described sensitive chip 121F and make camera module that the bad phenomenon such as pitch-black point occur.
Described encapsulation part 11F forms a through hole 1100F, in order to provide photosensitive path for described sensitive chip 121F.
According to this preferred embodiment of the present invention, described photographic department 12F includes at least one connecting line 124F, is used for electrically connecting described sensitive chip 121F and described wiring board main body 122F.Further, each described connecting line 124F may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..The lowest, described connecting line 124F curvedly connects described sensitive chip 121F and described wiring board main body 122F, thus avoids described connecting line 124F bending damage occur.
It is worth mentioning that, each described connecting line 124F is molded into inside described encapsulation part 11F, such that it is able to each described connecting line 124F is coated with by described encapsulation part 11F, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124F will not be touched damage by any, reduce the environmental factors impact on individual described connecting line 124F simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121F and described wiring board main body 122F, this point is not to be provided in prior art.
It is worth mentioning that; described encapsulation part 11F cladding described component 123F and described connecting line 124F; there is protection described component 123F and described connecting line 124F and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11F is not limited to be coated with described component 123F or described connecting line 124F.It is to say, in other embodiments of the invention, described encapsulation part 11F can directly be molded into described wiring board main body 122F of the described component 123F not protruded, it is also possible to be molded into outside described component 123F, the diverse location such as surrounding.
Further, described sensitive chip 121F has an a photosensitive area 1211F and non-photo-sensing district 1212F, and it is peripheral that described non-photo-sensing district 1212F is surrounded on described photosensitive area 1211F.Described photosensitive area 1211F is used for carrying out photosensitization, and described connecting line 124F is connected to described non-photo-sensing district 1212F.
According to this preferred embodiment of the present invention, described encapsulation part 11F extends the described non-photo-sensing district 1212F of described sensitive chip 121F, thus described sensitive chip 121F lamination by the way of molding is fixed on described wiring board main body 122F.By such mode, the inside mouldable scope of encapsulation part 11F as described in be molded into the mode (Molding on chip) of chip and expand, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122F and described encapsulation part 11F, reduce the length and width size of described molding photographic department 12F part further, reduce the length and width size of the described camera module assembled by it.
In this embodiment in accordance with the invention, described encapsulation part 11F projection ground is around outside the described photosensitive area 1211F of described sensitive chip 121F, especially, described encapsulation part 11F closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10F is used for assembling described camera module, described sensitive chip 121F is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10F, a traditional wiring board can be chosen as described wiring board main body 122F, described wiring board main body 122F arranges sensitive chip 121F described in, described sensitive chip 121F is electrically connected by described connecting line 124F, and then mold on described molding wiring board main body 122F after preliminary assembling and sensitive chip 121F parts, as with injection machine, wiring board after carrying out SMT technique (Surface Mount Technology surface mount process) by insert molding (molding) technique carries out molding and forms described encapsulation part 11F, or form described encapsulation part 11F with mould pressing process conventional in semiconductor packages.Described wiring board main body 122F can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11F formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11F can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the present invention can be not the restriction of the present invention in the way of enforcement.
Further, described encapsulation part 11F includes cladding section 111F and an optical filter construction section 112F, it is integrally connected to described cladding section 111F described optical filter construction section 112F molding, described cladding section 111F molding is connected to described wiring board main body 122F, is used for being coated with described component 123F and described connecting line 124F.Described optical filter construction section 112F is for installing an optical filter 20F, that is, when described photosensory assembly 10F is used for assembling described camera module, the optical filter 20F of described camera module is installed in described optical filter construction section 112F, described optical filter 20F is positioned on the photosensitive path of described sensitive chip 121F, and need not provide extra optical filter 20F mounting bracket.That is, described encapsulation part 11F has the function of conventional stent herein, but advantage based on moulding technology, described optical filter construction section 112F top can be by the technology mode of mold, make it have good planarization, so that described optical filter 20F is entirely mounted, this point is also an advantage over traditional camera module.
Further, described optical filter construction section 112F has a mounting groove 1121F, described support slot is communicated in described through hole 1100F, provides sufficient installing space for described optical filter 20F so that described optical filter 20F will not protrude from the top surface of optical filter construction section 112F.It is to say, described encapsulation part 11F upper end arranges described mounting groove 1121F, in order to described optical filter 20F is installed on described encapsulation part 11F and the top of described encapsulation part 11F will not be protruded from.
It is noted that the inwall of described encapsulation part 11F can according to the shape of described connecting line 124F and arrange, be such as set to skewed, thus make described sensitive chip 121F many light such as can receive being coated with while described connecting line 124F.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11F is not the restriction of the present invention.
Being different from above preferred embodiment, described wiring board main body 122F has at least one reinforced hole 1221F, and described encapsulation part 11F extends in described reinforced hole 1221F, thus strengthens the structural strength of described wiring board main body 122F.In other words, two kinds of different materials be combined with each other, thus form composite structure so that the structural strength as described wiring board main body 122F of matrix strengthens.
The position of described reinforced hole 1221F can select as required, and arranges according to the structural strength demand of described wiring board, structure the most symmetrically.Setting by described reinforced hole 1221F makes the structural strength of described wiring board main body 122F strengthen, such that it is able to reduce the thickness of described wiring board main body 122F, reduces the thickness of the camera module assembled by it, and improves the heat dispersion of described photosensory assembly 10F.
It is noted that in this embodiment in accordance with the invention, described reinforced hole 1221F is groove-like, thus when manufacturing described photosensory assembly 10F, the moulding material of described encapsulation part 11F will not be spilt by described reinforced hole 1221F.
Similar with above preferred embodiment, described photosensory assembly 10F can be assembled as focusing module or dynamic burnt module, and those skilled in the art is not it should be appreciated that the assembling application mode of described photosensory assembly 10F is the restriction of the present invention.
With reference to Figure 25, will be illustrated according to the photosensory assembly of the 8th preferred embodiment of the present invention.Described photosensory assembly 10G is for camera module described in assembly, thus obtains the described camera module of moulding type.Described photosensory assembly 10G includes encapsulation part 11G and photographic department 12G, is connected to described photographic department 12G described encapsulation part 11G molding.
Described photographic department 12G includes wiring board main body 122G and a sensitive chip 121G, and described sensitive chip 121G is arranged in described wiring board main body 122G.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121G molding.
According to this embodiment of the present invention, described photographic department 12G includes a connection line (not shown) and at least one component 123G.Described connection line defaults in described wiring board main body 122G, and described component 123G is electrically connected to described connection line and described sensitive chip 121G, for the photosensitive work process of described sensitive chip 121G.Described component 123G is arranged at described wiring board main body 122G projectedly.Described component 123G it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123G is coated on inside it by described encapsulation part 11G, hence in so that described component 123G will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121G, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123G, described sensitive chip 121G is not interfered with yet, it is different from the existing way that in tradition camera module, component 123G exposes, such as capacitance resistance ware, thus by the way of molding is coated with, prevent dust, foreign material stay in described component 123G surface, avoid polluting described sensitive chip 121G and make camera module that the bad phenomenon such as pitch-black point occur.
Described encapsulation part 11G forms a through hole 1100G, in order to provide photosensitive path for described sensitive chip 121G.
According to this preferred embodiment of the present invention, described photographic department 12G includes at least one connecting line 124G, is used for electrically connecting described sensitive chip 121G and described wiring board main body 122G.Further, each described connecting line 124G may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..The lowest, described connecting line 124G curvedly connects described sensitive chip 121G and described wiring board main body 122G, thus avoids described connecting line 124G bending damage occur.
It is worth mentioning that, each described connecting line 124G is molded into inside described encapsulation part 11G, such that it is able to each described connecting line 124G is coated with by described encapsulation part 11G, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124G will not be touched damage by any, reduce the environmental factors impact on individual described connecting line 124G simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121G and described wiring board main body 122G, this point is not to be provided in prior art.
It is worth mentioning that; described encapsulation part 11G cladding described component 123G and described connecting line 124G; there is protection described component 123G and described connecting line 124G and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11G is not limited to be coated with described component 123G or described connecting line 124G.It is to say, in other embodiments of the invention, described encapsulation part 11G can directly be molded into described wiring board main body 122G of the described component 123G not protruded, it is also possible to be molded into outside described component 123G, the diverse location such as surrounding.
Further, described sensitive chip 121G has an a photosensitive area 1211G and non-photo-sensing district 1212G, and it is peripheral that described non-photo-sensing district 1212G is surrounded on described photosensitive area 1211G.Described photosensitive area 1211G is used for carrying out photosensitization, and described connecting line 124G is connected to described non-photo-sensing district 1212G.
According to this preferred embodiment of the present invention, described encapsulation part 11G extends the described non-photo-sensing district 1212G of described sensitive chip 121G, thus described sensitive chip 121G lamination by the way of molding is fixed on described wiring board main body 122G.By such mode, the inside mouldable scope of encapsulation part 11G as described in be molded into the mode (Molding on chip) of chip and expand, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122G and described encapsulation part 11G, reduce the length and width size of described molding photographic department 12G further, reduce the length and width size of the described camera module assembled by it.
In this embodiment in accordance with the invention, described encapsulation part 11G projection ground is around outside the described photosensitive area 1211G of described sensitive chip 121G, especially, described encapsulation part 11G closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10G is used for assembling described camera module, described sensitive chip 121G is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10G, a traditional wiring board can be chosen as described wiring board main body 122G, described wiring board main body 122G arranges sensitive chip 121G described in, described sensitive chip 121G is electrically connected by described connecting line 124G, and then mold on described molding wiring board main body 122G after preliminary assembling and sensitive chip 121G parts, as with injection machine, wiring board after carrying out SMT technique (Surface Mount Technology surface mount process) by insert molding (molding) technique carries out molding and forms described encapsulation part 11G, or form described encapsulation part 11G with mould pressing process conventional in semiconductor packages.Described wiring board main body 122G can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11G formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11G can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the present invention can be not the restriction of the present invention in the way of enforcement.
Further, described encapsulation part 11G includes cladding section 111G and an optical filter construction section 112G, it is integrally connected to described cladding section 111G described optical filter construction section 112G molding, described cladding section 111G molding is connected to described wiring board main body 122G, is used for being coated with described component 123G and described connecting line 124G.Described optical filter construction section 112G is for installing an optical filter 20G, that is, when described photosensory assembly 10G is used for assembling described camera module, the optical filter 20G of described camera module is installed in described optical filter construction section 112G, described optical filter 20G is positioned on the photosensitive path of described sensitive chip 121G, and need not provide extra optical filter 20G mounting bracket.That is, described encapsulation part 11G has the function of conventional stent herein, but advantage based on moulding technology, described optical filter construction section 112G top can be by the technology mode of mold, make it have good planarization, so that described optical filter 20G is entirely mounted, this point is also an advantage over traditional camera module.
Further, described optical filter construction section 112G has a mounting groove 1121G, described support slot is communicated in described through hole 1100G, provides sufficient installing space for described optical filter 20G so that described optical filter 20G will not protrude from the top surface of optical filter construction section 112G.It is to say, described encapsulation part 11F upper end arranges described mounting groove 1121F, in order to described optical filter 20F is installed on described encapsulation part 11F and the top of described encapsulation part 11F will not be protruded from.
It is noted that the inwall of described encapsulation part 11G can according to the shape of described connection and arrange, be such as set to skewed, thus make described sensitive chip 121G can receive more light being coated with while described connecting line 124G.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11G is not the restriction of the present invention.
Being different from above preferred embodiment, described wiring board main body 122G has at least one reinforced hole 1221G, and described encapsulation part 11G extends in described reinforced hole 1221G, thus strengthens the structural strength of described wiring board main body 122G.In other words, two kinds of different materials be combined with each other, thus form composite structure so that the structural strength as described wiring board main body 122G of matrix strengthens.
The position of described reinforced hole 1221G can select as required, and arranges according to the structural strength demand of described wiring board, structure the most symmetrically.Setting by described reinforced hole 1221G makes the structural strength of described wiring board main body 122G strengthen, such that it is able to reduce the thickness of described wiring board main body 122G, reduces the thickness of the camera module assembled by it, and improves the heat dispersion of described photosensory assembly 10G.
It is worth mentioning that, this preferred embodiment according to the present invention, described reinforced hole 1221G is perforation, say, that through described wiring board main body 122G, the both sides making described wiring board main body 122G connect, thus when manufacturing described photosensory assembly 10G, the moulding material of described encapsulation part 11G is sufficiently combined with described wiring board main body 122G, form more firm composite structure, and the structure of the most described groove, described perforation is easier to processing and manufacturing.
Similar with above preferred embodiment, described photosensory assembly 10G can be assembled as focusing module or dynamic burnt module, and those skilled in the art is not it should be appreciated that the assembling application mode of described photosensory assembly 10G is the restriction of the present invention.
With reference to Figure 26, will be illustrated according to the camera module of the 9th preferred embodiment of the present invention.Described camera module can be one to focus module (Fix Focus Model, FFM).Described camera module includes a photosensory assembly 10H, a support 50H, an optical filter 20H and a camera lens 30H.
Described support 50H is installed on described photosensory assembly 10H, and described optical filter 20H is installed in described support 50H, described camera lens 30H and is installed on described support 50H.
Described photosensory assembly 10H includes encapsulation part 11H and a photographic department 12H, is connected to described photographic department 12H described encapsulation part 11H molding.
Described photographic department 12H includes wiring board main body 122H and a sensitive chip 121H, and described sensitive chip 121H is arranged in described wiring board main body 122H.According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121H molding.
According to this embodiment of the present invention, described photographic department 12H includes a connection line (not shown) and at least one component 123H.Described connection line defaults in described wiring board main body 122H, and described component 123H is electrically connected to described connection line and described sensitive chip 121H, for the photosensitive work process of described sensitive chip 121H.Described component 123H is arranged at described wiring board main body 122H projectedly.Described component 123H it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc..
It is worth mentioning that, described component 123H is coated on inside it by described encapsulation part 11H, hence in so that described component 123H will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121H, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123H, described sensitive chip 121H is not interfered with yet, it is different from the existing way that in tradition camera module, component 123H exposes, such as capacitance resistance ware, thus by the way of molding is coated with, prevent dust, foreign material stay in described component 123H surface, avoid polluting described sensitive chip 121H and make camera module that the bad phenomenon such as pitch-black point occur.
Described encapsulation part 11H forms a through hole 1100H, in order to provide photosensitive path for described sensitive chip 121H.
According to this preferred embodiment of the present invention, described photographic department 12H includes at least one connecting line 124H, is used for electrically connecting described sensitive chip 121H and described wiring board main body 122H.Further, each described connecting line 124H may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..The lowest, described connecting line 124H curvedly connects described sensitive chip 121H and described wiring board main body 122H, thus avoids described connecting line 124H bending damage occur.
It is worth mentioning that, each described connecting line 124H is molded into inside described encapsulation part 11H, such that it is able to each described connecting line 124H is coated with by described encapsulation part 11H, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124H will not be touched damage by any, reduce the environmental factors impact on individual described connecting line 124H simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121H and described wiring board main body 122H, this point is not to be provided in prior art.
It is worth mentioning that; described encapsulation part 11H cladding described component 123H and described connecting line 124H; there is protection described component 123H and described connecting line 124H and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11H is not limited to be coated with described component 123H or described connecting line 124H.It is to say, in other embodiments of the invention, described encapsulation part 11H can directly be molded into described wiring board main body 122H of the described component 123H not protruded, it is also possible to be molded into outside described component 123H, the diverse location such as surrounding.
Further, described sensitive chip 121H has an a photosensitive area 1211H and non-photo-sensing district 1212H, and it is peripheral that described non-photo-sensing district 1212H is surrounded on described photosensitive area 1211H.Described photosensitive area 1211H is used for carrying out photosensitization, and described connecting line 124H is connected to described non-photo-sensing district 1212H.
According to this preferred embodiment of the present invention, described encapsulation part 11H extends the described non-photo-sensing district 1212H of described sensitive chip 121H, thus described sensitive chip 121H lamination by the way of molding is fixed on described wiring board main body 122H.By such mode, as being molded into mode (the Molding on the chip of chip, MOC) the inside mouldable scope of described encapsulation part 11H is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122H and described encapsulation part 11H, reduce the length and width size of described molding photographic department 12H part further, reduce the length and width size of the described camera module assembled by it.
In this embodiment in accordance with the invention, described encapsulation part 11H projection ground is around outside the described photosensitive area 1211H of described sensitive chip 121H, especially, described encapsulation part 11H closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10H is used for assembling described camera module, described sensitive chip 121H is sealed in inside, form space in a closing.
Specifically, when manufacturing described photosensory assembly 10H, a traditional wiring board can be chosen as described wiring board main body 122H, described wiring board main body 122H arranges sensitive chip 121H described in, described sensitive chip 121H is electrically connected by described connecting line 124H, and then mold on described molding wiring board main body 122H after preliminary assembling and sensitive chip 121H parts, as with injection machine, wiring board after carrying out SMT technique (Surface Mount Technology surface mount process) by insert molding (molding) technique carries out molding and forms described encapsulation part 11H, or form described encapsulation part 11H with mould pressing process conventional in semiconductor packages.Described wiring board main body 122H can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described encapsulation part 11H formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described encapsulation part 11H can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the present invention can be not the restriction of the present invention in the way of enforcement.
Described encapsulation part 11H provides installation site herein for described support 50H, and advantage based on moulding technology, described encapsulation part 11H can be by the technology mode of mold so that it is have good planarization, so that described support 50H is entirely mounted.
It is noted that the inwall of described encapsulation part 11H can according to the shape of described connection and arrange, be such as set to skewed, thus make described sensitive chip 121H can receive more light being coated with while described connecting line 124H.Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11H is not the restriction of the present invention.
Described molding circuit pack is in other embodiments of the invention, dynamic burnt camera module can also be assembled into, such that it is able to change the focal length of described camera module, those skilled in the art is it should be appreciated that the type of described camera module is not the restriction of the present invention.
It is photosensory assembly and the camera module of the tenth preferred embodiment according to the present invention with reference to Figure 27.Be different from above preferred embodiment is, described photosensory assembly 10 includes a screen layer 126I, described screen layer 126I wraps up described wiring board main body 122 and described encapsulation part 11, thus while strengthening the structural strength of described wiring board main body 122, strengthen the anti-electromagnetic interference capability of described photosensory assembly 10.
Further, described screen layer 126I is a metal level, can be platy structure or network structure.
With reference to Figure 28 A and 28B, according to camera module and the comparison schematic diagram of tradition camera module of above preferred embodiment of the present invention.In Figure 28 A, left side represents traditional camera module, and right side represents the camera module in the present invention.In Figure 28 B, left side represents traditional wiring board manufacture process, and right side represents the photosensory assembly manufacture process of the present invention.
Summary content, can clearly see, photosensory assembly and the camera module of the present invention have the advantage that
1, can reduce the length and width size of camera module, packed part and component, as can be overlapping on capacitance resistance ware segment space；Traditional scheme support outside electric capacity, and need to need reserved certain safe distance, and the solution of the present invention can directly utilize electric capacity space, directly filling plastic cement around electric capacity.
2, reducing module to tilt, the alternative existing plastic stent of packed part designs, and reduces accumulated tolerance；
3, molding promotes circuit board structure intensity, under equivalent constructions intensity, because packed part can be played a supporting role, can increase intensity, and it is thinner that wiring board can do, and reduces module height；
4, in height space, traditional scheme electric capacity and base need reserved assembling safe space, and moulding technology can not be reserved, and reduces module height；Traditional scheme electric capacity top distance bracket needs reserved safety clearance, prevents from interfering, and new departure can direct filling plastic cement around electric capacity.
5, resistance capacitor device can be wrapped up by molding, and the module dirt stain that capacitance resistance ware region solder resist, dust etc. can be avoided to be put is bad, improving product yield；
6, being suitable for high efficiency scale of mass production, the photosensory assembly of the present invention is more suitable for a large amount of layout operation.The molded mode of described photosensory assembly based on the present invention, described photosensory assembly is more suitable for layout operation, once completes the manufacture of the photosensory assembly of more amount, such as can reach 80 to 90, and traditional wiring board the most at most can only produce 8.
It should be understood by those skilled in the art that the embodiments of the invention shown in foregoing description and accompanying drawing are only used as citing and are not limiting as the present invention.The purpose of the present invention is completely and be effectively realized.The function of the present invention and structural principle are shown the most in an embodiment and illustrate, without departing under described principle, embodiments of the present invention can have any deformation or amendment.

Claims (50)

1. the photosensory assembly of a camera module, it is characterised in that including:
One encapsulation part；With
One photographic department；Described photographic department includes a wiring board main body and a sensitive chip, and described encapsulation part encapsulated moulding is in described wiring board main body and described sensitive chip.
Photosensory assembly the most according to claim 1, wherein said encapsulation part forms a through hole, and described through hole is relative with described sensitive chip, to provide described sensitive chip passage of light.
Photosensory assembly the most according to claim 2, the bottom of the described through hole of wherein said encapsulation part is skewed in be gradually increased from the bottom to top.
Photosensory assembly the most according to claim 2, wherein said encapsulation part top is suitable to install the camera lens of described camera module, motor or optical filter.
Photosensory assembly the most according to claim 2, wherein said encapsulation part top is plane, for installing the camera lens of described camera module, motor or optical filter.
Photosensory assembly the most according to claim 2, wherein said encapsulation part top has a mounting groove, and described mounting groove is communicated in described through hole, for installing the optical filter of described camera module, camera lens or motor.
Photosensory assembly the most according to claim 2, wherein said encapsulation part includes a cladding section, an optical filter construction section and a camera lens construction section, described optical filter construction section and described camera lens construction section are upwards molded extension by described cladding section successively, and inside is step-like, in order to be respectively mounted optical filter and the camera lens of described camera module.
8. according to the arbitrary described photosensory assembly of claim 1 to 7, wherein said photographic department includes at least one connecting line, each described connecting line electrically connects described sensitive chip and described wiring board main body, and described encapsulation part is coated with described connecting line, so that described connecting line will not be directly exposed to outside.
Photosensory assembly the most according to claim 8, wherein said connecting line is selected from combination: the one in gold thread, silver wire, copper cash or aluminum steel.
Photosensory assembly the most according to claim 8, wherein said connecting line curvedly connects described wiring board main body and described sensitive chip, to reduce the damage to described connecting line.
11. photosensory assemblies according to claim 8, wherein said sensitive chip includes a photosensitive area and a non-photo-sensing district, described non-photo-sensing district is peripheral around described photosensitive area, described encapsulation part molding extends to the described non-photo-sensing district of described sensitive chip, the mouldable scope inside to extend described encapsulation part, reduces the Outside Dimensions of described encapsulation part.
12. photosensory assemblies according to claim 8, wherein said photographic department includes at least one component, described component protrudes from described wiring board main body, and described encapsulation part is coated with described component, so that described component will not be directly exposed to outside.
13. photosensory assemblies according to claim 12, wherein said component selects to combine: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay.
14. photosensory assemblies according to claim 8, wherein said photographic department includes an optical filter, described optical filter is covered in described sensitive chip, described encapsulation part takes shape in described wiring board main body, described sensitive chip and described optical filter, so that protecting described sensitive chip by described optical filter, and reducing the back focal length of described camera module so that it is height reduces.
15. photosensory assemblies according to claim 8, wherein said photographic department includes that a back-up coat, described back-up coat lamination are arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body.
16. photosensory assemblies according to claim 15, wherein said back-up coat is metallic plate, to strengthen the heat dispersion of described photographic department.
17. photosensory assemblies according to claim 8, wherein said photographic department includes a screen layer, and described screen layer wraps up described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly.
18. photosensory assemblies according to claim 17, wherein said screen layer is metallic plate or wire netting.
19. photosensory assemblies according to claim 8, wherein wiring board main body has at least one reinforced hole, and described encapsulation part extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body.
20. photosensory assemblies according to claim 19, wherein said reinforced hole is groove-like, in order to when molding described encapsulation part, moulding material will not be spilt by described reinforced hole.
21. photosensory assemblies according to claim 19, wherein said reinforced hole is through hole, so that the moulding material of described encapsulation part is fully contacted with described wiring board main body and easily fabricated.
22. photosensory assemblies according to claim 8, the material of wherein said wiring board main body can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
23. photosensory assemblies according to claim 8, the material of wherein said encapsulation part is selected from combination: one or more in epoxy resin, nylon, LCP or PP.
24. 1 camera modules, it is characterised in that include
One photosensory assembly；With
One camera lens；Wherein said photosensory assembly includes:
One encapsulation part；With
One photographic department；Described photographic department includes a wiring board main body and a sensitive chip, and described encapsulation part encapsulated moulding is in described wiring board main body and described sensitive chip；Described camera lens is positioned at the photosensitive path of the sensitive chip of described photosensory assembly.
25. camera modules according to claim 24, wherein said encapsulation part forms a through hole, and described through hole is relative with described sensitive chip, to provide described sensitive chip passage of light.
26. camera modules according to claim 25, the bottom of the described through hole of wherein said encapsulation part is skewed in be gradually increased from the bottom to top.
27. camera modules according to claim 25, wherein said encapsulation part top is suitable to install the camera lens of described camera module, motor or optical filter.
28. camera modules according to claim 25, wherein said encapsulation part top is plane, for installing the camera lens of described camera module, motor or optical filter.
29. camera modules according to claim 25, wherein said encapsulation part top has a mounting groove, and described mounting groove is communicated in described through hole, for installing the optical filter of described camera module, camera lens or motor.
30. camera modules according to claim 25, wherein said encapsulation part includes a cladding section, an optical filter construction section and a camera lens construction section, described optical filter construction section and described camera lens construction section are upwards molded extension by described cladding section successively, and inside is step-like, in order to be respectively mounted the optical filter of described camera module and described camera lens.
31. according to the arbitrary described camera module of claim 24 to 30, wherein said photographic department includes at least one connecting line, each described connecting line electrically connects described sensitive chip and described wiring board main body, and described encapsulation part is coated with described connecting line, so that described connecting line will not be directly exposed to outside.
32. camera modules according to claim 31, wherein said connecting line is selected from combination: the one in gold thread, silver wire, copper cash or aluminum steel.
33. camera modules according to claim 31, wherein said connecting line curvedly connects described wiring board main body and described sensitive chip, to reduce the damage to described connecting line.
34. camera modules according to claim 31, wherein said sensitive chip includes a photosensitive area and a non-photo-sensing district, described non-photo-sensing district is peripheral around described photosensitive area, described encapsulation part molding extends to the described non-photo-sensing district of described sensitive chip, the mouldable scope inside to extend described encapsulation part, reduces the Outside Dimensions of described encapsulation part.
35. camera modules according to claim 31, wherein said photographic department includes at least one component, described component protrudes from described wiring board main body, and described encapsulation part is coated with described component, so that described component will not be directly exposed to outside.
36. camera modules according to claim 35, wherein said component selects to combine: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay.
37. camera modules according to claim 31, wherein said photographic department includes an optical filter, described optical filter is covered in described sensitive chip, described encapsulation part takes shape in described wiring board main body, described sensitive chip and described optical filter, so that protecting described sensitive chip by described optical filter, and reducing the back focal length of described camera module so that it is height reduces.
38. camera modules according to claim 31, wherein said photographic department includes that a back-up coat, described back-up coat lamination are arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body.
39. according to the camera module described in claim 38, and wherein said back-up coat is metallic plate, to strengthen the heat dispersion of described photographic department.
40. camera modules according to claim 31, wherein said photographic department includes a screen layer, and described screen layer wraps up described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly.
41. camera modules according to claim 40, wherein said screen layer is metallic plate or wire netting.
42. camera modules according to claim 31, wherein wiring board main body has at least one reinforced hole, and described encapsulation part extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body.
43. camera modules according to claim 42, wherein said reinforced hole is groove-like, in order to when molding described encapsulation part, moulding material will not be spilt by described reinforced hole.
44. camera modules according to claim 42, wherein said reinforced hole is through hole, so that the moulding material of described encapsulation part is fully contacted with described wiring board main body and easily fabricated.
45. camera modules according to claim 31, the material of wherein said wiring board main body can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
46. camera modules according to claim 31, the material of wherein said encapsulation part is selected from combination: one or more in epoxy resin, nylon, LCP or PP.
47. camera modules according to claim 31, wherein said camera module includes that a support, described support are installed in described photosensory assembly, and described camera lens is installed in described support.
48. camera modules according to claim 31, wherein said camera module includes that a motor, described camera lens are installed in described motor, and described motor is installed in described photosensory assembly.
49. camera modules according to claim 31, wherein said camera module includes that an optical filter, described optical filter are installed in described photosensory assembly.
50. camera modules according to claim 47, wherein said camera module includes that an optical filter, described optical filter are installed in described support.
CN201620191631.0U 2016-03-12 2016-03-12 Camera module and photosensory assembly thereof Active CN205792874U (en)

Priority Applications (38)

Application Number Priority Date Filing Date Title
CN201620191631.0U CN205792874U (en) 2016-03-12 2016-03-12 Camera module and photosensory assembly thereof
US15/317,117 US10908324B2 (en) 2016-03-12 2016-10-28 Molded photosensitive assembly of array imaging module
KR1020187029337A KR102193819B1 (en) 2016-03-12 2016-10-28 Array imaging module, molded photosensitive assembly and manufacturing method thereof, and electronic device
PCT/CN2016/103736 WO2017157015A1 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
JP2018547880A JP2019519087A (en) 2016-03-12 2016-10-28 Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices
KR1020207036129A KR102335306B1 (en) 2016-03-12 2016-10-28 Array Imaging Module and Molded Photensitive Assembly and Manufacturing Method Thereof for Electronic Device
EP16894174.8A EP3429181A4 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
KR1020187029304A KR20180132684A (en) 2016-03-12 2017-03-09 Camera module, its photosensitive part and method of manufacturing the same
KR1020217005352A KR102360319B1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
JP2018548099A JP7071926B2 (en) 2016-03-12 2017-03-09 Camera module and its photosensitive parts and their manufacturing method
KR1020217005344A KR102294537B1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
US16/082,533 US20190148429A1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
EP17765753.3A EP3429183A4 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
PCT/CN2017/076041 WO2017157211A1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
TW106108217A TWI754632B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW108135671A TWI769403B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW106203511U TWM552720U (en) 2016-03-12 2017-03-13 Split array camera module
TW108135674D TWI758645B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW106203507U TWM559558U (en) 2016-03-12 2017-03-13 Camera module and light-sensing component
TW106203473U TWM565451U (en) 2016-03-12 2017-03-13 Array camera module and its molded photosensitive element and electronic device
TW106108225A TWI685255B (en) 2016-03-12 2017-03-13 Split array camera module and manufacturing method thereof
TW108135672A TWI742441B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW108135670D TWI758644B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW108135670A TW202017356A (en) 2016-03-12 2017-03-13 Camera module, and photosensitive component thereof and manufacturing method therefor
TW108135674A TW202019155A (en) 2016-03-12 2017-03-13 Camera module, and photosensitive component thereof and manufacturing method therefor
TW106108124A TWI703715B (en) 2016-03-12 2017-03-13 Array camera module, molded photosensitive element and manufacturing method thereof, and electronic equipment
US15/473,573 US9781325B1 (en) 2016-03-12 2017-03-29 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,607 US9826132B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,609 US9906700B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,605 US10033913B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/679,146 US10274694B2 (en) 2016-03-12 2017-08-16 Manufacturing method of a molded photosensitive assembly of an array imaging module
US15/705,225 US10175447B2 (en) 2016-03-12 2017-09-14 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/705,232 US10126519B2 (en) 2016-03-12 2017-09-14 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/784,167 US10578837B2 (en) 2016-03-12 2017-10-15 Molded photosensitive assembly for array imaging module for electronic device
US16/737,863 US20200218034A1 (en) 2016-03-12 2020-01-08 Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method Thereof
US17/114,466 US11822099B2 (en) 2016-03-12 2020-12-07 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US17/740,887 US20220268968A1 (en) 2016-03-12 2022-05-10 Molded photosensitive assembly for array imaging module for electronic device and manufacturing method thereof
US17/847,569 US20230019091A1 (en) 2016-03-12 2022-06-23 Camera module, and photosensitive component thereof and manufacturing method therefor

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CN105744130A (en) * 2016-03-12 2016-07-06 宁波舜宇光电信息有限公司 Camera shooting module, photosensitive assembly of the camera shooting module and production method of the photosensitive assembly of the camera shooting module
WO2017157211A1 (en) * 2016-03-12 2017-09-21 宁波舜宇光电信息有限公司 Camera module, and photosensitive component thereof and manufacturing method therefor
CN105744130B (en) * 2016-03-12 2019-10-18 宁波舜宇光电信息有限公司 Camera module and its photosensory assembly and manufacturing method
CN105704354B (en) * 2016-03-12 2019-07-05 宁波舜宇光电信息有限公司 Camera module and its photosensory assembly and manufacturing method
US11743569B2 (en) 2016-03-12 2023-08-29 Ningbo Sunny Opotech Co., Ltd. Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US11706516B2 (en) 2016-03-12 2023-07-18 Ningbo Sunny Opotech Co., Ltd. Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
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US11785325B2 (en) 2017-08-05 2023-10-10 Ningbo Sunny Opotech Co., Ltd. Camera module having circuit board, molded base, and optical lens, electronic device having same and method for manufacturing camera module
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