CN108156354A - Chip assembly, camera and the electronic equipment of camera - Google Patents
Chip assembly, camera and the electronic equipment of camera Download PDFInfo
- Publication number
- CN108156354A CN108156354A CN201711378212.3A CN201711378212A CN108156354A CN 108156354 A CN108156354 A CN 108156354A CN 201711378212 A CN201711378212 A CN 201711378212A CN 108156354 A CN108156354 A CN 108156354A
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- China
- Prior art keywords
- chip
- filter disc
- camera
- assembly
- chip assembly
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a kind of chip assembly of camera, camera and electronic equipment, the chip assembly of wherein camera includes：Filter disc；Chip；Substrate, substrate, chip and filter disc are stacked, and substrate is located at the side of chip, and filter disc is located at the opposite side of chip, and filter disc is spaced apart with chip；For by filter disc and chip package, to the encapsulation part of substrate, at least part edge portion of being packaged of filter disc to be wrapped up.The chip assembly of camera according to the present invention, by using encapsulation part by filter disc, chip and the integrated structure of substrate package, filter disc can be effectively prevent to be fallen off under external impacts, enhance the stability of filter disc work, the attached process of filter disc is omitted, the assembly precision of chip assembly is improved, reduces the rigging error of encapsulation process generation.In addition, eliminating structure filter disc being fixed to using stent on chip assembly in the relevant technologies, reduce the volume and size of chip assembly.
Description
Technical field
The present invention relates to a kind of technical field of electronic equipment more particularly to chip assembly of camera, camera and electronics
Equipment.
Background technology
In the relevant technologies, chip is encapsulated in substrate by CCD camera assembly by way of mold injection first in encapsulation
On, picture glue is then carried out on moulding, finally filter disc is bonded on substrate, this process chip, substrate and filter disc use
It is individually encapsulated.Rear camera component is encapsulated under external impacts, layering is susceptible to and comes off, and the error of encapsulation process is larger,
CCD camera assembly take pictures imaging when, be susceptible to reflective or light leakage situation.
Invention content
The present invention is directed at least solve one of technical problem in the prior art.For this purpose, the present invention proposes that one kind is taken the photograph
As the chip assembly of head, the chip assembly overall dimensions of the camera are smaller, can effectively prevent coming off for filter disc.
The present invention also proposes a kind of camera, and the camera includes the chip assembly of above-mentioned camera.
The present invention also proposes a kind of electronic equipment, and the electronic equipment includes above-mentioned camera.
The chip assembly of camera according to embodiments of the present invention, including：Filter disc；Chip；Substrate, it is the substrate, described
Chip and the filter disc are stacked, and the substrate is located at the side of the chip, and the filter disc is located at the another of the chip
Side, the filter disc are spaced apart with the chip；For by the filter disc and the chip package to the encapsulation part of the substrate, institute
It is wrapped up by the encapsulation part at least part edge for stating filter disc.
The chip assembly of camera according to embodiments of the present invention, by using encapsulation part by filter disc, chip and substrate
Integral structure is packaged into, can fix and protect filter disc using encapsulation part, filter disc can be effectively prevent to occur under external impacts
It comes off, enhances the stability of filter disc work, effectively prevent chip assembly that layering occurs under external force and come off.Meanwhile it takes
In the relevant technologies that disappeared using stent by filter disc be fixed to chip assembly on structure, so as to reduce the component of camera
Number reduces the volume and size of chip assembly.In addition, filter disc, chip and base plate structure are gone back into an overall structure
The attached process of filter disc is omitted, is conducive to be promoted the assembly precision of chip assembly, the assembling for reducing encapsulation process generation misses
Difference.
Camera according to embodiments of the present invention, including：Lens assembly；With the chip assembly of above-mentioned camera, the core
Piece component is located at the lower section of the Lens assembly, and the chip assembly is connect with the lens assembly.
Camera according to embodiments of the present invention, it is by using encapsulation part that filter disc, chip and substrate package is integral
Formula structure can be fixed and be protected filter disc using encapsulation part, filter disc can be effectively prevent to be fallen off under external impacts, enhanced
The stability of filter disc work effectively prevent chip assembly that layering occurs under external force and comes off.Meanwhile eliminate the relevant technologies
In using stent by filter disc be fixed to chip assembly on structure, so as to reduce the components number of camera, reduce
The volume and size of chip assembly.In addition, filter disc, chip and base plate structure are omitted filter disc into an overall structure
Attached process, be conducive to promoted chip assembly assembly precision, reduce encapsulation process generation rigging error.
Electronic equipment according to the present invention, including above-mentioned camera.
Electronic equipment according to the present invention, by using encapsulation part by filter disc, chip and the integrated knot of substrate package
Structure can be fixed and be protected filter disc using encapsulation part, filter disc can be effectively prevent to be fallen off under external impacts, enhance filter disc
The stability of work effectively prevent chip assembly that layering occurs under external force and comes off.Meanwhile it eliminates in the relevant technologies
Filter disc, so as to reduce the components number of camera, is reduced into chip fixed to the structure on chip assembly using stent
The volume and size of component.In addition, filter disc, chip and base plate structure are omitted the patch of filter disc into an overall structure
Attached process is conducive to be promoted the assembly precision of chip assembly, reduces the rigging error of encapsulation process generation.
Description of the drawings
Fig. 1 is the chip assembly of camera according to embodiments of the present invention；
Fig. 2 is camera according to embodiments of the present invention；
Fig. 3 is the rearview of electronic equipment according to embodiments of the present invention.
Reference numeral：
Electronic equipment 1000,
Camera 100, chip assembly 1,
Filter disc 11, chip 12, substrate 13, encapsulation part 14, side wall surface 141,
Electric elements 15,
Lens assembly 2.
Specific embodiment
The embodiment of the present invention is described below in detail, the example of the embodiment is shown in the drawings.Below with reference to
The embodiment of attached drawing description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that the orientation or position of the instructions such as term " on ", " under ", "left", "right"
Put relationship be based on orientation shown in the drawings or position relationship, be for only for ease of the description present invention and simplify description rather than
Indicate or imply that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore cannot
It is interpreted as limitation of the present invention.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, " multiple " are meant that at least two, such as two, three
It is a etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integral；Can be that machinery connects
It connects or is electrically connected or can communicate each other；It can be directly connected, can also be indirectly connected by intermediary, it can be with
It is the interaction relationship of connection inside two elements or two elements, unless otherwise restricted clearly.For this field
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
The chip assembly 1 of camera 100 according to embodiments of the present invention is described below with reference to Fig. 1-Fig. 3.
As shown in Figure 1-Figure 3, the chip assembly 1 of camera 100 according to embodiments of the present invention, including：Filter disc 11, chip
12nd, substrate 13 and encapsulation part 14.
As depicted in figs. 1 and 2, substrate 13, chip 12 and filter disc 11 are stacked, and substrate 13 is located at the side of chip 12
(downside as shown in Figure 1), filter disc 11 is located at the opposite side (upside as shown in Figure 1) of chip 12, between filter disc 11 and chip 12
It separates.Filter disc 11 may filter that variegated and polarisation, and then obtain preferable imaging effect.In addition, chip 12 can be image procossing
Device, such as CMOS type or CCD type, extraneous light are transmitted to across filter disc 11 on chip 12, and chip 12 can change light
Into charge, digital signal is converted by analog-digital converter chip 12, last digital signal is after overcompression is handled by memory
It preserves.
As depicted in figs. 1 and 2, encapsulation part 14 can be used for encapsulating filter disc 11 and chip 12 to substrate 13, filter disc 11
At least part edge be packaged portion 14 and wrap up.As a result, by using encapsulation part 14 by 13 envelope of filter disc 11, chip 12 and substrate
Integral structure is dressed up, can fix and protect filter disc 11 using encapsulation part 14, filter disc 11 can be effectively prevent under external impacts
It falls off, enhances the stability of the work of filter disc 11.Meanwhile eliminate filter disc is fixed to using stent in the relevant technologies
Structure on chip assembly so as to reduce the components number of camera 100, reduces the volume and size of chip assembly 1.
In addition, filter disc 11, chip 12 and substrate 13 are configured to an overall structure, it is also convenient for assembling chip assembly 1, has
Conducive to the assembly precision for promoting chip assembly 1.
The chip assembly 1 of camera 100 according to embodiments of the present invention, by using encapsulation part 14 by filter disc 11, chip
12 and substrate 13 be packaged into integral structure, can fix and protect filter disc 11 using encapsulation part 14, filter disc can be effectively prevent
11 fall off under external impacts, enhance the stability of the work of filter disc 11, effectively prevent chip assembly 1 under external force
Layering occurs to come off.Meanwhile eliminate in the relevant technologies using stent by filter disc be fixed to chip assembly on structure, so as to
The components number of camera 100 can be reduced, reduces the volume and size of chip assembly 1.In addition, by filter disc 11, chip 12
And substrate 13 is configured to an overall structure, is omitted the attached process of filter disc 11, is conducive to be promoted the dress of chip assembly 1
With precision, reduce the rigging error of encapsulation process generation.
According to some embodiments of the present invention, as depicted in figs. 1 and 2, electric elements 15, electric appliance can be equipped on substrate 13
Element 15 is packaged in encapsulation part 14.Electric elements 15 can be that chip 12 provides electric current and voltage, and chip 12 is assisted to believe light
Number, electric signal and digital signal handled.Electric elements 15 are encapsulated in encapsulation part 14, encapsulation part 14 is to electric elements
15 have protective effect, and electric elements 15 is avoided to be influenced the normal work of chip assembly 1 by external force collision.In addition, pass through by
Electric elements 15, substrate 13, chip 12 and filter disc 11 are packaged together, and can not only reduce the volume and size of camera 100,
The assembly process of camera 100 can also be reduced, promotes the assembly precision of chip assembly 1.
Further, as depicted in figs. 1 and 2, at least part at the edge of filter disc 11 exceeds the edge of chip 12.With one
Determine the light of incident angle, after the broader filter disc 11 in edge, each section of chip 12 can be received by filter disc 11
Light improves the luminous flux of chip assembly 1 so that imaging effect more, reduces the noise in light, improves imaging
Clarity and resolution ratio.
Further, as depicted in figs. 1 and 2, electric elements 15 are between substrate 13 and filter disc 11.In order to obtain preferably
Imaging effect, need substrate 13 and filter disc 11 being spaced apart, by being arranged between substrate 13 and filter disc 11 electric elements 15
Every space in, place electric elements 15 into without distributing additional space, reduce the size of chip assembly 1, realize
The Miniaturization Design of chip assembly 1.
According to some embodiments of the present invention, as depicted in figs. 1 and 2, encapsulation part 14 is between chip 12 and filter disc 11
Surface be side wall surface 141, at least partially inclined surface of side wall surface 141.As a result, in the clearance space of chip 12 and filter disc 11,
Partly mixed and disorderly reflection light or light leakage light is when being irradiated to inclined surface, inclined surface can by the reflection light received or
Light leakage light is reflected to one end (top as shown in Figure 1) far from chip 12, and then avoids reflection light or light leakage light
Into chip 12, and then the noise of imaging is reduced, improve the effect of imaging.
Here the inclined direction of side wall surface 141 is not specifically limited, in some embodiments of the invention, from such as Fig. 1
Shown upper side direction is upward to lower side as shown in Figure 1, and side wall surface 141 is gradually tilted to the radially inner side of chip 12, i.e.,
Upward from upper side direction as shown in Figure 1 to lower side as shown in Figure 1, side wall surface 141 is gradually to the radially inner side of chip 12
Offset.In other words, in the space limited by side wall surface 141, in the section in upper and lower directions as shown in Figure 1
On, the sectional area in the space is gradually reduced from top to bottom.In other embodiments of the present invention, side wall surface 141 is gradually to core
The radial outside of piece 12 tilts, i.e., upward from upper side direction as shown in Figure 1 to lower side as shown in Figure 1, side wall surface 141 by
Gradually deviated to the radial outside of chip 12.In other words, in the space limited by side wall surface 141, perpendicular to as shown in Figure 1
Upper and lower directions on section on, the sectional area in the space gradually increases from top to bottom.
According to some embodiments of the present invention, as depicted in figs. 1 and 2, encapsulation part 14 is between chip 12 and filter disc 11
Surface is side wall surface 141, and at least part of side wall surface 141 is coated with the first viscous layer.Chip assembly 1 is partly dropped into as a result,
Internal dust or little particle, can be adsorbed, and then dust or little particle is avoided to fall on chip 12 by the first viscous layer,
Influence imaging effect.In addition, by the first viscous layer, chip 12 and filter disc 11 can preferably be fitted in the side wall of encapsulation part 14
On face 141, in order to avoid being subjected to displacement or shaking under external force, and then ensure preferable imaging effect.
According to some embodiments of the present invention, as depicted in figs. 1 and 2, encapsulation part 14 is made of having sticking material
Adhesive encapsulation portion 14.To increase the viscous power of being stained between chip 12 or filter disc 11 and encapsulation part 14, mostly smeared using in contact position
Dispensing.The dust or little particle inside chip assembly 1 are partly dropped into as a result, can be adsorbed by the encapsulation part 14 of viscosity, into
And dust or little particle is avoided to fall on chip 12, influence imaging effect.The encapsulation part 14 of viscosity reduces use for dispensing glue,
And then reduce the whole height of chip assembly 1.In addition, adhesive encapsulation portion 14 enables chip 12 and filter disc 11 preferably to paste
It closes in encapsulation part 14, in order to avoid chip 12 or filter disc 11 are subjected to displacement or shake under external force, and then ensures preferable
Imaging effect.
According to some embodiments of the present invention, as depicted in figs. 1 and 2, the thang-kng region of filter disc 11 be workspace, remaining part
It is divided into nonclient area, the surface being located in nonclient area of filter disc 11 is coated with the second viscous layer.Chip is partly dropped into as a result,
Dust or little particle inside component 1 can be adsorbed, and then dust or little particle is avoided to fall in chip by the second viscous layer
On 12, imaging effect is influenced.In addition, by the second viscous layer, filter disc 11 can preferably be fitted in the side wall surface of encapsulation part 14
On 141, in order to avoid being subjected to displacement or shaking under external force, and then imaging effect is promoted.
Camera 100 according to embodiments of the present invention is described below with reference to Fig. 1-Fig. 3.
Camera 100 according to embodiments of the present invention, including：The chip assembly 1 of Lens assembly and above-mentioned camera 100.
As shown in Fig. 2, chip assembly 1 is located at the lower section (lower section as shown in Figure 2) of Lens assembly, chip assembly 1 and mirror
Head assembly 2 connects.Incident ray can be concentrated on same plane by lens assembly 2, further be handled convenient for next stage.This
Outside, the adjusting of focal length can also can be achieved in lens assembly 2, and then obtains and be more clearly imaged.
Camera 100 according to embodiments of the present invention, by using encapsulation part 14 by filter disc 11, chip 12 and substrate 13
Integral structure is packaged into, can fix and protect filter disc 11 using encapsulation part 14, filter disc 11 can be effectively prevent in external impacts
Under fall off, enhance filter disc 11 work stability, effectively prevent chip assembly 1 occurs under external force layering take off
It falls.Meanwhile eliminate in the relevant technologies using stent by filter disc be fixed to chip assembly on structure, taken the photograph so as to reduce
As first 100 components number, the volume and size of chip assembly 1 are reduced.In addition, by filter disc 11, chip 12 and substrate 13
An overall structure is configured to, is omitted the attached process of filter disc 11, is conducive to be promoted the assembly precision of chip assembly 1, subtracts
The rigging error of encapsulation process generation is lacked.
Electronic equipment 1000 according to embodiments of the present invention is described below with reference to Fig. 1-Fig. 3.
Electronic equipment 1000 according to embodiments of the present invention, including above-mentioned camera 100.It should be noted that as
This " electronic equipment 1000 " for using includes, but are not limited to be configured to connect (such as via public exchange electricity via Wireline
Telephone network (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection and/or another data connection/net
Network) and/or via (for example, for cellular network, WLAN (WLAN), such as digital TV network of DVB-H networks,
Satellite network, AM-FM broadcasting transmitter and/or another communication electronic equipment 1000) wireless interface reception/transmission communication
The device of signal.It is configured to be referred to as " wirelessly communicating eventually by the communication electronic equipment 1000 of radio interface communication
End ", " wireless terminal " and/or " mobile terminal ".The example of mobile terminal includes, but are not limited to satellite or cellular phone；It can
With combination cellular radio telephone and PCS Personal Communications System (PCS) terminal of data processing, fax and communication ability；It can
It is fixed to include radio telephone, pager, the Internet/intranet access, Web browser, memo pad, calendar and/or the whole world
The PDA of position system (GPS) receiver；And conventional laptop and/or palmtop receiver or including radiotelephone transceiver
Other electronic equipments 1000.
Filter disc 11 and chip 12 are encapsulated in substrate by electronic equipment 1000 according to embodiments of the present invention by encapsulation part 14
On 13 so that filter disc 11, chip 12 and substrate 13 are integrally formed formula structure, effectively prevent chip assembly 1 under external force
Layering occurs to come off, reduces the volume and size of chip assembly 1, the attached process of filter disc 11 is omitted, reduces and encapsulated
The error that journey generates.
In embodiments of the present invention, which can various can obtain data and to the data from outside
The equipment handled, alternatively, the electronic equipment 1000 can various be built-in with battery, and can obtain electric current pair from outside
The equipment that the battery charges, for example, mobile phone, tablet computer, computing device or device for display of message etc..
Below with reference to Fig. 1-Fig. 3 descriptions according to the electronic equipment 1000 of a specific embodiment of the invention.It is worth what is understood
It is, it is described below to be merely illustrative rather than to concrete restriction of the invention.
The electronic equipment 1000 being applicable in by taking mobile phone as an example the present invention is introduced.In embodiments of the present invention, electronics
Equipment 1000 can include camera 100, radio circuit, memory, input unit, Wireless Fidelity (WiFi,
Wirelessfidelity) the portions such as module, sensor, display unit, voicefrequency circuit, processor, fingerprint recognition component, battery
Part.
As shown in Figure 1-Figure 3, the camera 100 of the embodiment of the present invention, including：The chip of Lens assembly and camera 100
Component 1.Wherein, chip assembly 1 is located at the lower section (lower section as shown in Figure 2) of Lens assembly, chip assembly 1 and lens assembly 2
Connection.
As shown in Figure 1, chip assembly 1 includes filter disc 11, chip 12, substrate 13 and encapsulation part 14.Wherein, filter disc 11
Edge at least partly exceeds the edge of chip 12.
As depicted in figs. 1 and 2, substrate 13, chip 12 and filter disc 11 are stacked, and substrate 13 is located at the downside of chip 12
(downside as shown in Figure 1), filter disc 11 are located at the upside (upside as shown in Figure 1) of chip 12, and filter disc 11 is spaced with chip 12
There is certain space.The thang-kng region of filter disc 11 is workspace, and rest part is nonclient area, and filter disc 11 is located in nonclient area
Surface be coated with the second viscous layer.
As depicted in figs. 1 and 2, substrate 13 is equipped with electric elements 15, electric elements 15 be located at substrate 13 and filter disc 11 it
Between, electric elements 15 are connected with chip 12, and electric elements 15 are provided with two groups altogether, and are respectively distributed to the left side of chip 12
(left side as shown in Figure 1) and right side (right side as shown in Figure 1).
As depicted in figs. 1 and 2, encapsulation part 14 is with cohesive material by being made, and encapsulation part 14 is by 12 envelope of filter disc 11 and chip
On the substrate 13, the part edge of filter disc 11 is packaged portion 14 and wraps up, and electric elements 15 are encapsulated in encapsulation part 14 dress.Envelope
Surface of the dress portion 14 between chip 12 and filter disc 11 is side wall surface 141, and the part of side wall surface 141 is inclined surface.Specifically,
Inclined surface is formed by connecting by vertical plane and with plane of the vertical plane there are certain angle, and the part surface of inclined surface is coated with the
One viscous layer.
As depicted in figs. 1 and 2, filter disc 11 and chip 12 are encapsulated in by the camera 100 of the present embodiment by encapsulation part 14
On substrate 13 so that filter disc 11, chip 12 and substrate 13 are integrally formed formula structure, effectively prevent chip assembly 1 in outer masterpiece
It is come off with layer estranged is issued, reduces the volume and size of chip assembly 1, wherein saved in the short transverse of chip assembly 1
The attached process of filter disc 11 is omitted in the space of 0.15-0.2mm, reduces the error of encapsulation process generation.
Radio circuit can be used for receive and send messages or communication process in, signal sends and receivees, particularly, by base station
After downlink information receives, processor processing is given；In addition, the data of 1000 uplink of electronic equipment are sent to base station.In general, radio frequency
Circuit includes but not limited to antenna, at least one amplifier, transceiver, coupler, low-noise amplifier, duplexer etc..This
Outside, radio circuit can also communicate with network and other equipment by radio communication.
Memory can be used for storage software program and module, and processor is stored in the software program of memory by operation
And module, so as to perform the various function application of electronic equipment 1000 and data processing.Memory can mainly include storage
Program area and storage data field, wherein, storing program area can storage program area, the application program needed at least one function
(such as sound-playing function, image player function) etc.；Storage data field can be stored to be created according to using for electronic equipment 1000
Data (such as audio data, phone directory) built etc..In addition, memory can include high-speed random access memory, it can be with
Including nonvolatile memory, for example, at least a disk memory, flush memory device or other volatile solid-states
Part.
Input unit can be used for receiving the number inputted or character information and the user of generation and electronic equipment 1000 sets
It puts and key signals that function control is related.Specifically, input unit may include touch panel and other input equipments.Touch-control
Panel, also referred to as touch screen, collect user on it or neighbouring touch operation (for example user is appointed using finger, stylus etc.
What operation of suitable object or attachment on touch panel or near touch panel), and driven according to preset formula
Move corresponding attachment device.
Optionally, touch panel may include both touch detecting apparatus and touch controller.Wherein, touch detection fills
The touch orientation of detection user is put, and detects the signal that touch operation is brought, transmits a signal to touch controller；Touch control
Device receives touch information from touch detecting apparatus, and is converted into contact coordinate, then gives processor, and can reception processing
Order that device is sent simultaneously is performed.Furthermore, it is possible to using multiple types such as resistance-type, condenser type, infrared ray and surface acoustic waves
Type realizes touch panel.In addition to touch panel, input unit can also include other input equipments.Specifically, other inputs are set
It is standby to can include but is not limited to physical keyboard, function key (such as volume control button, switch key etc.), trace ball, mouse, behaviour
Make one or more in bar etc..
WiFi belongs to short range wireless transmission technology, and electronic equipment 1000 can help user to receive and dispatch electricity by WiFi module
Sub- mail, browsing webpage and access streaming video etc., it has provided wireless broadband internet to the user and has accessed.But it can manage
Solution, WiFi module are simultaneously not belonging to must be configured into for electronic equipment 1000, can not change invention as needed completely
It is omitted in the range of essence.
In addition, mobile phone may also include at least one sensor, such as attitude transducer, optical sensor and other sensings
Device.
Specifically, attitude transducer is referred to as motion sensor, also, as one kind of the motion sensor, can
To enumerate gravity sensor, cantilevered shifter is made using elastic sensing element, and using the sensitive member of elasticity in gravity sensor
Energy-stored spring made of part drives electric contact, so as to fulfill Gravity changer to be converted into the variation of electric signal.
As the another kind of motion sensor, accelerometer sensor can be enumerated, accelerometer sensor can detect all directions
Upper (generally three axis) acceleration magnitude, can detect that size and the direction of gravity, can be used to identify mobile phone posture when static
It (for example pedometer, is struck using (such as horizontal/vertical screen switching, dependent game, magnetometer pose calibrating), Vibration identification correlation function
Hit) etc..
In embodiments of the present invention, it is first as aftermentioned " attitude parameter " is obtained that motion sensor listed above may be used
Part, but it's not limited to that, and other sensors that can obtain " attitude parameter " are each fallen in protection scope of the present invention, example
Such as, gyroscope etc., also, the operation principle of the gyroscope and data handling procedure can be similar to the prior art, here, in order to
It avoids repeating, description is omitted.
In addition, in embodiments of the present invention, as sensor, it can also configure barometer, hygrometer, thermometer and infrared ray
The other sensors such as sensor, details are not described herein.
Optical sensor may include ambient light sensor and proximity sensor, wherein, ambient light sensor can be according to ambient light
The light and shade of line adjusts the brightness of display panel, proximity sensor can when mobile phone is moved in one's ear, close display panel and/or
Backlight.
Display unit can be used for display by information input by user or be supplied to the information of user and respectively planting vegetables for mobile phone
It is single.Display unit may include display panel, optionally, liquid crystal display (LCD, Liquid Crystal may be used
Display), display surface is configured in the forms such as Organic Light Emitting Diode (OLED, Organic Light-Emitting Diode)
Plate.Further, touch panel can cover display panel, when touch panel is detected on it or after neighbouring touch operation,
Processor is sent to determine the type of touch event, device is followed by subsequent processing and is provided on a display panel according to the type of touch event
Corresponding visual output.
Voicefrequency circuit, loud speaker and microphone can provide the audio interface between user and electronic equipment 1000.Audio-frequency electric
The transformed electric signal of the audio data received can be transferred to loud speaker by road, and voice signal output is converted to by loud speaker；
On the other hand, the voice signal of collection is converted to electric signal by microphone, and audio data is converted to after being received by voicefrequency circuit, then
After the processing of audio data output processor, through radio circuit to be sent to such as another electronic equipment 1000 or by audio
Data export to memory to be further processed.
Processor is the control centre of electronic equipment 1000, and processor is mounted on circuit board assemblies, utilizes various interfaces
The various pieces of electronic equipment 1000 entire with connection, by running or performing the software program being stored in memory
And/or module and calling are stored in the data in memory, perform the various functions of electronic equipment 1000 and processing data,
So as to carry out integral monitoring to electronic equipment 1000.Optionally, processor may include one or more processing units；Preferably,
Processor can integrate application processor and modem processor, wherein, the main processing operation system of application processor, Yong Hujie
Face and application program etc., modem processor mainly handle wireless communication.
Power supply can be logically contiguous with processor by power-supply management system, is managed so as to be realized by power-supply management system
The functions such as charging, electric discharge and power managed.Although being not shown, electronic equipment 1000 can also include bluetooth module, sensor
(such as attitude transducer, optical sensor, can also configure barometer, hygrometer, thermometer and infrared ray sensor etc. other sensing
Device) etc., details are not described herein.
It should be noted that mobile phone is only the citing of a kind of electronic equipment 1000, the present invention is simultaneously not particularly limited, the present invention
The electronic equipments such as mobile phone, tablet computer 1000 are can be applied to, the present invention does not limit this.
In the description of this specification, reference term " one embodiment ", " example ", " is specifically shown " some embodiments "
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment of the present invention or example.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It is combined in an appropriate manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the different embodiments or examples described in this specification and the feature of different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
Claims (10)
1. a kind of chip assembly of camera, which is characterized in that including：
Filter disc；
Chip；
Substrate, the substrate, the chip and the filter disc are stacked, and the substrate is located at the side of the chip, described
Filter disc is located at the opposite side of the chip, and the filter disc is spaced apart with the chip；
For by the filter disc and the chip package, to the encapsulation part of the substrate, at least part edge of the filter disc to be by institute
State encapsulation part package.
2. the chip assembly of camera according to claim 1, which is characterized in that the substrate is equipped with electric elements,
The electric elements are packaged in the encapsulation part.
3. the chip assembly of camera according to claim 2, which is characterized in that at least part at the edge of the filter disc
Beyond the edge of the chip.
4. the chip assembly of camera according to claim 3, which is characterized in that the electric elements are located at the substrate
Between the filter disc.
5. the chip assembly of camera according to claim 1, which is characterized in that the encapsulation part is in the chip and institute
Surface between filter disc is stated as side wall surface, at least partially inclined surface of the side wall surface.
6. the chip assembly of camera according to claim 1, which is characterized in that the encapsulation part is in the chip and institute
It is side wall surface to state the surface between filter disc, and at least part of the side wall surface is coated with the first viscous layer.
7. the chip assembly of camera according to claim 1, which is characterized in that the encapsulation part is by having sticking material
Adhesive encapsulation portion made of material.
8. the chip assembly of camera according to claim 1, which is characterized in that the thang-kng region of the filter disc is work
Area, rest part are nonclient area, and the surface being located in the nonclient area of the filter disc is coated with the second viscous layer.
9. a kind of camera, which is characterized in that including：
Lens assembly；With
Chip assembly, chip assembly of the chip assembly for the camera according to any one of claim 1-8 are described
Chip assembly is located at the lower section of the Lens assembly, and the chip assembly is connect with the lens assembly.
10. a kind of electronic equipment, which is characterized in that including：
Camera, the camera are the camera according to claim 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711378212.3A CN108156354A (en) | 2017-12-19 | 2017-12-19 | Chip assembly, camera and the electronic equipment of camera |
| PCT/CN2018/118556 WO2019120061A1 (en) | 2017-12-19 | 2018-11-30 | Chip component of camera, camera and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711378212.3A CN108156354A (en) | 2017-12-19 | 2017-12-19 | Chip assembly, camera and the electronic equipment of camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108156354A true CN108156354A (en) | 2018-06-12 |
Family
ID=62464016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711378212.3A Pending CN108156354A (en) | 2017-12-19 | 2017-12-19 | Chip assembly, camera and the electronic equipment of camera |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108156354A (en) |
| WO (1) | WO2019120061A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019120061A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Chip component of camera, camera and electronic device |
| CN111131684A (en) * | 2020-01-15 | 2020-05-08 | 昆山丘钛微电子科技有限公司 | Lens, camera module and manufacturing method of camera module |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050034473A (en) * | 2003-10-09 | 2005-04-14 | 한성엘컴텍 주식회사 | A compact camera module |
| CN1624905A (en) * | 2003-12-02 | 2005-06-08 | 三星电子株式会社 | Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same |
| US20060091515A1 (en) * | 2004-11-03 | 2006-05-04 | Gwo-Liang Weng | Sensor chip packaging structure |
| CN101335284A (en) * | 2007-06-28 | 2008-12-31 | 索尼株式会社 | Solid-state imaging device and camera module |
| TW201307983A (en) * | 2011-08-11 | 2013-02-16 | Hon Hai Prec Ind Co Ltd | Camera module |
| CN103700634A (en) * | 2013-11-06 | 2014-04-02 | 南昌欧菲光电技术有限公司 | Camera module, and encapsulating structure and encapsulating method thereof |
| US20150373239A1 (en) * | 2014-06-24 | 2015-12-24 | Samsung Electro-Mechanics Co., Ltd. | Image sensor module and camera module including the same |
| CN105573020A (en) * | 2016-02-22 | 2016-05-11 | 宁波舜宇光电信息有限公司 | Camera module with dust catching structure |
| CN105681640A (en) * | 2016-03-28 | 2016-06-15 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
| CN205792874U (en) * | 2016-03-12 | 2016-12-07 | 宁波舜宇光电信息有限公司 | Camera module and photosensory assembly thereof |
| CN106303169A (en) * | 2015-05-28 | 2017-01-04 | 宁波舜宇光电信息有限公司 | Ultra-thin photographic head module and manufacture method thereof |
| CN106449680A (en) * | 2016-09-21 | 2017-02-22 | 苏州科阳光电科技有限公司 | Image sensor module and manufacturing method thereof |
| CN206023924U (en) * | 2016-08-16 | 2017-03-15 | 歌尔股份有限公司 | Camera module and mobile terminal |
| CN206725921U (en) * | 2016-10-14 | 2017-12-08 | 宁波舜宇光电信息有限公司 | Array camera module based on integral packaging technique |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101187899B1 (en) * | 2007-04-19 | 2012-10-05 | 삼성테크윈 주식회사 | Image sensor module and camera module comprising the same and manufacturing method for the same |
| TW201210327A (en) * | 2010-08-19 | 2012-03-01 | Hon Hai Prec Ind Co Ltd | Camera module and manufacturing method of the same |
| CN110233955B (en) * | 2014-09-26 | 2022-09-23 | 宁波舜宇光电信息有限公司 | Image module and photosensitive chip packaging structure thereof |
| CN206210795U (en) * | 2016-08-12 | 2017-05-31 | 宁波舜宇光电信息有限公司 | Camera module and its molding photosensory assembly and electronic equipment |
| CN205883378U (en) * | 2016-03-28 | 2017-01-11 | 宁波舜宇光电信息有限公司 | Photosensitive assembly of module makes a video recording |
| CN206136070U (en) * | 2016-05-11 | 2017-04-26 | 宁波舜宇光电信息有限公司 | Module of making a video recording with adhering structure |
| CN108156354A (en) * | 2017-12-19 | 2018-06-12 | 广东欧珀移动通信有限公司 | Chip assembly, camera and the electronic equipment of camera |
-
2017
- 2017-12-19 CN CN201711378212.3A patent/CN108156354A/en active Pending
-
2018
- 2018-11-30 WO PCT/CN2018/118556 patent/WO2019120061A1/en active Application Filing
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050034473A (en) * | 2003-10-09 | 2005-04-14 | 한성엘컴텍 주식회사 | A compact camera module |
| CN1624905A (en) * | 2003-12-02 | 2005-06-08 | 三星电子株式会社 | Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same |
| US20060091515A1 (en) * | 2004-11-03 | 2006-05-04 | Gwo-Liang Weng | Sensor chip packaging structure |
| CN101335284A (en) * | 2007-06-28 | 2008-12-31 | 索尼株式会社 | Solid-state imaging device and camera module |
| TW201307983A (en) * | 2011-08-11 | 2013-02-16 | Hon Hai Prec Ind Co Ltd | Camera module |
| CN103700634A (en) * | 2013-11-06 | 2014-04-02 | 南昌欧菲光电技术有限公司 | Camera module, and encapsulating structure and encapsulating method thereof |
| US20150373239A1 (en) * | 2014-06-24 | 2015-12-24 | Samsung Electro-Mechanics Co., Ltd. | Image sensor module and camera module including the same |
| CN106303169A (en) * | 2015-05-28 | 2017-01-04 | 宁波舜宇光电信息有限公司 | Ultra-thin photographic head module and manufacture method thereof |
| CN105573020A (en) * | 2016-02-22 | 2016-05-11 | 宁波舜宇光电信息有限公司 | Camera module with dust catching structure |
| CN205792874U (en) * | 2016-03-12 | 2016-12-07 | 宁波舜宇光电信息有限公司 | Camera module and photosensory assembly thereof |
| CN105681640A (en) * | 2016-03-28 | 2016-06-15 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
| CN206023924U (en) * | 2016-08-16 | 2017-03-15 | 歌尔股份有限公司 | Camera module and mobile terminal |
| CN106449680A (en) * | 2016-09-21 | 2017-02-22 | 苏州科阳光电科技有限公司 | Image sensor module and manufacturing method thereof |
| CN206725921U (en) * | 2016-10-14 | 2017-12-08 | 宁波舜宇光电信息有限公司 | Array camera module based on integral packaging technique |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019120061A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Chip component of camera, camera and electronic device |
| CN111131684A (en) * | 2020-01-15 | 2020-05-08 | 昆山丘钛微电子科技有限公司 | Lens, camera module and manufacturing method of camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019120061A1 (en) | 2019-06-27 |
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