CN207782943U - Chip assembly, camera and the electronic equipment of camera - Google Patents
Chip assembly, camera and the electronic equipment of camera Download PDFInfo
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- CN207782943U CN207782943U CN201721803057.0U CN201721803057U CN207782943U CN 207782943 U CN207782943 U CN 207782943U CN 201721803057 U CN201721803057 U CN 201721803057U CN 207782943 U CN207782943 U CN 207782943U
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Abstract
The utility model discloses a kind of chip assembly of camera, camera and electronic equipment, the chip assembly of wherein camera includes：Filter disc；Chip；Substrate, substrate, chip and filter disc are stacked, and substrate is located at the side of chip, and filter disc is located at the other side of chip, have gap between filter disc and chip；For by filter disc and chip package, to the encapsulation part of substrate, the packed portion's package at least partly edge of filter disc, the surface of encapsulation part being located in gap to be the plane of reference, at least partially rough surface of the plane of reference.The chip assembly of camera according to the present utility model, by the way that encapsulation part is arranged, and the plane of reference at least partially rough surface of encapsulation part being located in gap, and then the light for being incident on the coarse plane of reference is changed into diffusing reflection by mirror-reflection, so that the veiling glare inside chip assembly is broken up, weaken the veiling glare energy being incident on chip, improves treatment effect of the chip assembly to image.
Description
Technical field
The utility model is related to technical field of electronic equipment more particularly to a kind of chip assembly of camera, camera and
Electronic equipment.
Background technology
In the related technology, chip when packaged, is encapsulated in substrate by CCD camera assembly by way of mold injection first
On, picture glue is then carried out on moulding, finally filter disc is bonded on substrate, this process chip, substrate and filter disc use
It is individually encapsulated.Rear camera component is encapsulated under external impacts, layering is susceptible to and falls off, and the error of encapsulation process is larger.
In addition, the inner surface of injection mold pedestal is relatively smooth so that when being taken pictures using CCD camera assembly, light can mirror-reflection to core
On piece, and then the veiling glare energy being incident on chip is more, is susceptible to dazzle ghost, influences effect of taking pictures.
Utility model content
The utility model aims to solve at least one of the technical problems existing in the prior art.For this purpose, the utility model carries
Go out a kind of chip assembly of camera, the chip assembly overall dimensions of the camera are smaller, can effectively reduce veiling glare energy.
The utility model also proposes that a kind of camera, the camera include the chip assembly of above-mentioned camera.
The utility model also proposes that a kind of electronic equipment, the electronic equipment include above-mentioned camera.
According to the chip assembly of the camera of the utility model embodiment, including：Filter disc；Chip；Substrate, the substrate,
The chip and the filter disc are stacked, and the substrate is located at the side of the chip, and the filter disc is located at the chip
The other side has gap between the filter disc and the chip；For by the filter disc and the chip package to the substrate
Encapsulation part, at least partly edge of the filter disc wrapped up by the encapsulation part, the surface of the encapsulation part being located in gap
For the plane of reference, at least partially rough surface of the plane of reference.
According to the chip assembly of the camera of the utility model embodiment, by being arranged encapsulation part, and encapsulation part is located at
The plane of reference at least partially rough surface in gap, so be incident on the light of the coarse plane of reference be changed by mirror-reflection it is unrestrained anti-
It penetrates so that the veiling glare inside chip assembly is broken up, and the veiling glare energy being incident on chip is weakened, and improves chip assembly to image
Treatment effect.
Some embodiments according to the present utility model, the substrate are equipped with electric elements, and the electric elements are packaged in
In the encapsulation part.
Further, the edge at least partly exceeding the chip at the edge of the filter disc.
Further, the electric elements are between the substrate and the filter disc.
Some embodiments according to the present utility model, surface of the encapsulation part between the chip and the filter disc
For the plane of reference, at least partially inclined surface of the plane of reference.
Some embodiments according to the present utility model, surface of the encapsulation part between the chip and the filter disc are
The plane of reference, the plane of reference are at least partly coated with the first viscous layer.
Some embodiments according to the present utility model, the encapsulation part is having adhesive encapsulation made of sticking material
Portion.
The thang-kng region of some embodiments according to the present utility model, the filter disc is workspace, and rest part is non-work
Make area, the surface of the filter disc being located in the nonclient area is coated with the second viscous layer.
According to the camera of the utility model embodiment, including：Lens assembly；With the chip assembly of above-mentioned camera, institute
The lower section that chip assembly is located at the Lens assembly is stated, the chip assembly is connect with the Lens assembly.
According to the camera of the utility model embodiment, by the way that encapsulation part, and the ginseng of encapsulation part being located in gap is arranged
Face at least partially rough surface is examined, and then the light for being incident on the coarse plane of reference is changed into diffusing reflection by mirror-reflection so that core
The veiling glare of piece component internal is broken up, and the veiling glare energy being incident on chip is weakened, and improves chip assembly and is imitated to the processing of image
Fruit.
Electronic equipment according to the present utility model, including above-mentioned camera.
Electronic equipment according to the present utility model, by the way that encapsulation part, and the plane of reference of encapsulation part being located in gap is arranged
At least partially rough surface, and then the light for being incident on the coarse plane of reference is changed into diffusing reflection by mirror-reflection so that chipset
Veiling glare inside part is broken up, and the veiling glare energy being incident on chip is weakened, and improves treatment effect of the chip assembly to image.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the utility model will in the description from combination following accompanying drawings to embodiment
Become apparent and is readily appreciated that, wherein：
Fig. 1 is the chip assembly according to the camera of the utility model embodiment；
Fig. 2 is the camera according to the utility model one embodiment；
Fig. 3 is the camera according to another embodiment of the utility model；
Fig. 4 is the rearview according to the electronic equipment of the utility model embodiment.
Reference numeral：
Electronic equipment 1000,
Camera 100, chip assembly 1,
Filter disc 11, chip 12, substrate 13, encapsulation part 14, the plane of reference 141,
Electric elements 15,
Lens assembly 2.
Specific implementation mode
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings.Below by
The embodiment being described with reference to the drawings is exemplary, it is intended to for explaining the utility model, and should not be understood as new to this practicality
The limitation of type.
In the description of the present invention, it should be understood that the orientation of the instructions such as term "upper", "lower", "left", "right"
Or position relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model and simplification is retouched
It states, does not indicate or imply the indicated device or element must have a particular orientation, with specific azimuth configuration and operation,
Therefore it should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.The meaning of " plurality " is at least two, such as two in the description of the present invention,
It is a, three etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；Can be
Mechanical connection can also be electrical connection or can communicate each other；It can be directly connected, the indirect phase of intermediary can also be passed through
Even, can be the interaction relationship of the connection or two elements inside two elements, unless otherwise restricted clearly.For this
For the those of ordinary skill in field, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Below with reference to Fig. 1-Fig. 4 descriptions according to the chip assembly 1 of the camera 100 of the utility model embodiment.
As shown in Figure 1, according to the chip assembly 1 of the camera 100 of the utility model embodiment, including：Filter disc 11, chip
12, substrate 13 and encapsulation part 14.
As shown in Figure 1, substrate 13, chip 12 and filter disc 11 are stacked, substrate 13 is located at side (such as Fig. 1 of chip 12
Shown in downside), filter disc 11 is located at the other side (upside as shown in Figure 1) of chip 12, has between filter disc 11 and chip 12
Gap.Filter disc 11 may filter that variegated and polarisation, and then obtain preferable imaging effect.In addition, chip 12 can be image procossing
Device, such as CMOS type or CCD type, extraneous light are transmitted to across filter disc 11 on chip 12, and chip 12 can change light
At charge, digital signal is converted by analog-digital converter chip 12, last digital signal is after compression processing by memory
It preserves.
As shown in Fig. 2, encapsulation part 14 can be used on filter disc 11 and the encapsulation to substrate 13 of chip 12, filter disc 11 is extremely
Small part edge is packaged portion 14 and wraps up, and the surface of encapsulation part 14 being located in gap is the plane of reference 141, and the plane of reference 141 is extremely
Small part is rough surface.The light for being incident on the coarse plane of reference 141 as a result, is changed into diffusing reflection by mirror-reflection so that chip
Veiling glare inside component 1 is broken up, and then weakens the veiling glare energy being incident on chip 12, improves chip assembly 1 to image
Treatment effect.It, can be in addition, filter disc 11, chip 12 and substrate 13 are packaged into integral structure by using encapsulation part 14
Filter disc 11 is fixed and protected using encapsulation part 14, and filter disc 11 can be effectively prevent to be fallen off under external impacts, enhance filter disc
The stability of 11 work.
According to the chip assembly 1 of the camera 100 of the utility model embodiment, by using encapsulation part 14 by filter disc 11,
Chip 12 and substrate 13 are packaged into integral structure, eliminate and utilize holder that filter disc 11 is fixed to chipset in the related technology
Structure on part 1 reduces the volume and size of chip assembly 1.In addition, the surface of encapsulation part 14 being located in gap is reference
Face 141, at least partially rough surface of the plane of reference 141 so that be incident on the veiling glare inside chip assembly 1 and broken up, and then enter
The light for being mapped to chip assembly 1 is changed into diffusing reflection from mirror-reflection, to weaken the veiling glare energy being incident on chip 12, carries
Treatment effect of the high chip assembly 1 to image.
Some embodiments according to the present utility model can be equipped with electric elements as shown in figures 1 and 3 on substrate 13
15, electric elements 15 are packaged in encapsulation part 14.Electric elements 15 can be that chip 12 provides electric current and voltage, assist chip 12
Optical signal, electric signal and digital signal are handled.Electric elements 15 are encapsulated in encapsulation part 14, encapsulation part 14 is right
Electric elements 15 have protective effect, and electric elements 15 is avoided to be influenced the normal work of chip assembly 1 by external force collision.This
Outside, by the way that electric elements 15, substrate 13, chip 12 and filter disc 11 are packaged together, the body of camera 100 can not only be reduced
Product and size can also reduce the assembly process of camera 100, promote the assembly precision of chip assembly 1.
Further, as shown in Fig. 2, the edge at least partly exceeding chip 12 at the edge of filter disc 11.It is incorporated into one
The light of firing angle degree, after the broader filter disc in edge 11, each section of chip 12 can receive the light through filter 11
Line improves the luminous flux of chip assembly 1 so that imaging effect more, reduces the noise in light, improves the clear of imaging
Clear degree and resolution ratio.
Further, as shown in figure 3, electric elements 15 are between substrate 13 and filter disc 11.In order to obtain preferably at
It as effect, needs substrate 13 and filter disc 11 being spaced apart, be spaced in substrate 13 and filter disc 11 by the way that electric elements 15 are arranged
In space, electric elements 15 are placed into without distributing additional space, reduces the size of chip assembly 1, realizes chip
The Miniaturization Design of component 1.
Some embodiments according to the present utility model, as shown in Figure 1, table of the encapsulation part 14 between chip 12 and filter disc 11
Face is the plane of reference 141, at least partially inclined surface of the plane of reference 141.As a result, in the clearance space of chip 12 and filter disc 11, portion
Divide mixed and disorderly reflection light or light leakage light when being irradiated to inclined surface, inclined surface can be by the reflection light received or leakage
Light light is reflected to one end (top as shown in Figure 1) far from chip 12, so avoid reflection light or light leakage light into
Enter chip 12, and then reduce the noise of imaging, improves the effect of imaging.
Here the inclined direction of the plane of reference 141 is not specifically limited, in some embodiments of the utility model, from such as
Upper side direction shown in FIG. 1 is upward to lower side as shown in Figure 1, and the plane of reference 141 is gradually tilted to the radially inner side of chip 12,
I.e. upward from upper side direction as shown in Figure 1 to lower side as shown in Figure 1, the plane of reference 141 is gradually inside to the diameter of chip 12
Side deviates.In other words, in the space limited by the plane of reference 141, in the section in upper and lower directions as shown in Figure 1
On, the sectional area in the space is gradually reduced from top to bottom.In other embodiments of the utility model, the plane of reference 141 is gradual
It is tilted to the radial outside of chip 12, i.e. upward, the plane of reference from upper side direction as shown in Figure 1 to lower side as shown in Figure 1
141 gradually deviate to the radial outside of chip 12.In other words, in the space limited by the plane of reference 141, perpendicular to such as figure
On section in upper and lower directions shown in 1, the sectional area in the space gradually increases from top to bottom.
Some embodiments according to the present utility model, as shown in Fig. 2, table of the encapsulation part 14 between chip 12 and filter disc 11
Face is the plane of reference 141, and the plane of reference 141 is at least partly coated with the first viscous layer.It partly drops into chip assembly 1 as a result,
The dust or little particle in portion can be adsorbed by the first viscous layer, and then dust or little particle avoided to fall on chip 12, shadow
Ring imaging effect.In addition, by the first viscous layer, chip 12 and filter disc 11 can preferably be fitted in the plane of reference of encapsulation part 14
On 141, in order to avoid being subjected to displacement or shaking under external force, and then ensure preferable imaging effect.
Some embodiments according to the present utility model, as shown in Fig. 2, encapsulation part 14 is glued having made of sticking material
Property encapsulation part 14.For the viscous power of being stained with for increasing between chip 12 or filter disc 11 and encapsulation part 14, mostly uses and smear point in contact position
Glue.The dust or little particle inside chip assembly 1 are partly dropped into as a result, can be adsorbed by the encapsulation part 14 of viscosity, into
And dust or little particle is avoided to fall on chip 12, influence imaging effect.The encapsulation part 14 of viscosity reduces for dispensing glue make
With, and then reduce the whole height of chip assembly 1.In addition, adhesive encapsulation portion 14 enables chip 12 and filter disc 11 preferable
Be fitted in encapsulation part 14, in order to avoid chip 12 or filter disc 11 are subjected to displacement or shake under external force, so ensure compared with
Good imaging effect.
Some embodiments according to the present utility model, as shown in figure 3, the thang-kng region of filter disc 11 is workspace, remaining part
It is divided into nonclient area, the surface of filter disc 11 being located in nonclient area is coated with the second viscous layer.Chip is partly dropped into as a result,
Dust inside component 1 or little particle can be adsorbed by the second viscous layer, and then dust or little particle avoided to fall in chip
On 12, imaging effect is influenced.In addition, by the second viscous layer, filter disc 11 can preferably be fitted in the plane of reference of encapsulation part 14
On 141, in order to avoid being subjected to displacement or shaking under external force, and then imaging effect is promoted.
Below with reference to Fig. 1-Fig. 4 descriptions according to the camera 100 of the utility model embodiment.
According to the camera 100 of the utility model embodiment, including：The chipset of Lens assembly 2 and above-mentioned camera 100
Part 1.
As shown in Figure 3 and Figure 4, chip assembly 1 is located at the lower section (lower section as shown in Figure 3) of Lens assembly 2, chip assembly
1 connect with Lens assembly 2.Incident ray can be concentrated on same plane by Lens assembly 2, further be located convenient for next stage
Reason.In addition, the adjusting of focal length can also can be achieved in Lens assembly 2, and then obtains and be more clearly imaged.
According to the camera 100 of the utility model embodiment, by using encapsulation part 14 by filter disc 11, chip 12 and base
Plate 13 is packaged into integral structure, eliminates and utilizes holder that filter disc 11 is fixed to the structure on chip assembly 1 in the related technology,
Reduce the volume and size of chip assembly 1.In addition, the surface of encapsulation part 14 being located in gap is the plane of reference 141, the plane of reference
141 at least partially rough surface so that be incident on the veiling glare inside chip assembly 1 and broken up, and then be incident on chip assembly 1
Light be changed into diffusing reflection from mirror-reflection, be incident on veiling glare energy on chip 12 to weaken, it is right to improve chip assembly 1
The treatment effect of image.
Below with reference to Fig. 1-Fig. 4 descriptions according to the electronic equipment 1000 of the utility model embodiment.
According to the electronic equipment 1000 of the utility model embodiment, including above-mentioned camera 100.It should be noted that making
Include, but are not limited to be configured to connect (such as via public friendship via Wireline for " electronic equipment 1000 " as used herein
Change telephone network (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection and/or another data connection/
Network) and/or via (for example, for cellular network, the digital tv network of WLAN (WLAN), such as DVB-H networks
Network, satellite network, AM-FM broadcasting transmitter and/or another communication electronic equipment 1000) wireless interface reception/transmission
The device of signal of communication.It is configured to that " wireless communication can be referred to as by the communication electronic equipment 1000 of radio interface communication
Terminal ", " wireless terminal " and/or " mobile terminal ".The example of mobile terminal includes, but are not limited to satellite or cellular phone；
It can be with PCS Personal Communications System (PCS) terminal of combination cellular radio telephone and data processing, fax and communication ability；
May include radio telephone, pager, the Internet/intranet access, Web browser, memo pad, calendar and/or the whole world
The PDA of positioning system (GPS) receiver；And it conventional laptop and/or palmtop receiver or is received and dispatched including radio telephone
Other electronic devices of device.
According to the electronic equipment 1000 of the utility model embodiment, by using encapsulation part 14 by filter disc 11, chip 12 with
And substrate 13 is packaged into integral structure, eliminates and utilizes holder that filter disc 11 is fixed on chip assembly 1 in the related technology
Structure reduces the volume and size of chip assembly 1.In addition, the surface of encapsulation part 14 being located in gap is the plane of reference 141,
At least partially rough surface of the plane of reference 141 so that be incident on the veiling glare inside chip assembly 1 and broken up, and then be incident on core
The light of piece component 1 is changed into diffusing reflection from mirror-reflection, to weaken the veiling glare energy being incident on chip 12, improves core
Treatment effect of the piece component 1 to image.
In the utility model embodiment, which can various can obtain data and to this from outside
The equipment that data are handled, alternatively, the electronic equipment 1000 can be it is various be built-in with battery, and electricity can be obtained from outside
The equipment to charge to the battery is flowed, for example, mobile phone, tablet computer, computing device or device for display of message etc..
Below with reference to Fig. 1-Fig. 4 descriptions according to the electronic equipment 1000 of one specific embodiment of the utility model.It is worth reason
Solution, it is described below to be merely illustrative rather than to the concrete restriction of the utility model.
The electronic equipment 1000 that the utility model is applicable in is introduced by taking mobile phone as an example.In the utility model embodiment
In, electronic equipment 1000 may include camera 100, radio circuit, memory, input unit, Wireless Fidelity (WiFi,
Wireless fidelity) portions such as module, sensor, display unit, voicefrequency circuit, processor, fingerprint recognition component, battery
Part.
As Figure 1-Figure 4, the camera 100 of the utility model embodiment, including：Lens assembly 2 and camera 100
Chip assembly 1.Wherein, chip assembly 1 is located at the lower section (lower section as shown in Figure 2) of Lens assembly 2, chip assembly 1 and mirror
Piece component 2 connects.
As shown in Figure 1, chip assembly 1 includes filter disc 11, chip 12, substrate 13 and encapsulation part 14.Wherein, filter disc 11
Edge at least partly exceeds the edge of chip 12.
As depicted in figs. 1 and 2, substrate 13, chip 12 and filter disc 11 are stacked, and substrate 13 is located at the downside of chip 12
(downside as shown in Figure 1), filter disc 11 is located at the upside (upside as shown in Figure 1) of chip 12, between filter disc 11 and chip 12
With gap.The thang-kng region of filter disc 11 is workspace, and rest part is nonclient area, and filter disc 11 is located in nonclient area
Surface is coated with the second viscous layer.
As depicted in figs. 1 and 2, substrate 13 is equipped with electric elements 15, electric elements 15 be located at substrate 13 and filter disc 11 it
Between, electric elements 15 are connected with chip 12, and electric elements 15 are provided with two groups altogether, and are respectively distributed to the left side of chip 12
(left side as shown in Figure 1) and right side (right side as shown in Figure 1).
As shown in figures 1 and 3, encapsulation part 14 is with cohesive material by being made, and encapsulation part 14 is by 12 envelope of filter disc 11 and chip
On the substrate 13, the surface of encapsulation part 14 being located in gap is the plane of reference 141 to dress, and the part of the plane of reference 141 is rough surface, filter
The part edge of piece 11 is packaged portion 14 and wraps up, and electric elements 15 are encapsulated in encapsulation part 14.Encapsulation part 14 is in chip 12
Surface between filter disc 11 is the plane of reference 141, and the part of the plane of reference 141 is inclined surface.Specifically, inclined surface is by vertical
The part surface in face and there are the planes of certain angle to be formed by connecting with vertical plane, inclined surface is coated with the first viscous layer.
As shown in figures 1 and 3, filter disc 11 and chip 12 are encapsulated in by the camera 100 of the present embodiment by encapsulation part 14
On substrate 13 so that filter disc 11, chip 12 and substrate 13 are integrally formed formula structure, effectively prevent chip assembly 1 in outer masterpiece
It is fallen off with layer estranged is issued, reduces the volume and size of chip assembly 1, wherein saved in the short transverse of chip assembly 1
The attached process of filter disc 11 is omitted in the space of 0.15-0.2mm, reduces the error of encapsulation process generation.
Radio circuit can be used for receive and send messages or communication process in, signal sends and receivees, particularly, by base station
After downlink information receives, processor processing is given；In addition, the data of 1000 uplink of electronic equipment are sent to base station.In general, radio frequency
Circuit includes but not limited to antenna, at least one amplifier, transceiver, coupler, low-noise amplifier, duplexer etc..This
Outside, radio circuit can also be communicated with network and other equipment by radio communication.
Memory can be used for storing software program and module, and processor is stored in the software program of memory by operation
And module, to execute various function application and the data processing of electronic equipment 1000.Memory can include mainly storage
Program area and storage data field, wherein storing program area can storage program area, the application program needed at least one function
(such as sound-playing function, image player function) etc.；Storage data field can be stored to be created according to using for electronic equipment 1000
Data (such as audio data, phone directory) built etc..It, can be in addition, memory may include high-speed random access memory
Including nonvolatile memory, for example, at least a disk memory, flush memory device or other volatile solid-states
Part.
Input unit can be used for receiving the number or character information of input, and generates and set with the user of electronic equipment 1000
It sets and the related key signals of function control.Specifically, input unit may include touch panel and other input equipments.Touch-control
Panel, also referred to as touch screen, collect user on it or neighbouring touch operation (for example user is appointed using finger, stylus etc.
What operation of suitable object or attachment on touch panel or near touch panel), and driven according to preset formula
Move corresponding attachment device.
Optionally, touch panel may include both touch detecting apparatus and touch controller.Wherein, touch detection fills
The touch orientation of detection user is set, and detects the signal that touch operation is brought, transmits a signal to touch controller；Touch control
Device receives touch information from touch detecting apparatus, and is converted into contact coordinate, then gives processor, and can reception processing
Order that device is sent simultaneously is executed.Furthermore, it is possible to using multiple types such as resistance-type, condenser type, infrared ray and surface acoustic waves
Type realizes touch panel.In addition to touch panel, input unit can also include other input equipments.Specifically, other inputs are set
It is standby to can include but is not limited to physical keyboard, function key (such as volume control button, switch key etc.), trace ball, mouse, behaviour
Make one or more in bar etc..
WiFi belongs to short range wireless transmission technology, and electronic equipment 1000 can help user to receive and dispatch electricity by WiFi module
Sub- mail, browsing webpage and access streaming video etc., it has provided wireless broadband internet to the user and has accessed.But it can manage
Solution, WiFi module are simultaneously not belonging to must be configured into for electronic equipment 1000, can not change practicality newly as needed completely
It is omitted in the range of the essence of type.
In addition, mobile phone may also include at least one sensor, such as attitude transducer, optical sensor and other sensings
Device.
Specifically, attitude transducer is referred to as motion sensor, also, as one kind of the motion sensor, can
To enumerate gravity sensor, cantilevered shifter is made using elastic sensing element in gravity sensor, and using the sensitive member of elasticity
Energy-stored spring made of part drives electric contact, to realize the variation that Gravity changer is converted into electric signal.
As the another kind of motion sensor, accelerometer sensor can be enumerated, accelerometer sensor can detect all directions
Upper (generally three axis) acceleration magnitude, can detect that size and the direction of gravity, can be used to identify mobile phone posture when static
It (for example pedometer, is struck using (such as horizontal/vertical screen switching, dependent game, magnetometer pose calibrating), Vibration identification correlation function
Hit) etc..
In the utility model embodiment, motion sensor listed above may be used as aftermentioned " the posture ginseng of acquisition
Number " element, but not limited to this, other sensors that can obtain " attitude parameter " each fall within the protection model of the utility model
In enclosing, for example, gyroscope etc., also, the operation principle of the gyroscope and data handling procedure can be similar to the prior art, this
In, in order to avoid repeating, description is omitted.
In addition, in the utility model embodiment, as sensor, barometer, hygrometer, thermometer and red can also configure
The other sensors such as outside line sensor, details are not described herein.
Optical sensor may include ambient light sensor and proximity sensor, wherein ambient light sensor can be according to ambient light
The light and shade of line adjusts the brightness of display panel, proximity sensor can when mobile phone is moved in one's ear, close display panel and/
Or backlight.
Display unit can be used for showing information input by user or be supplied to the information of user and respectively planting vegetables for mobile phone
It is single.Display unit may include display panel, optionally, liquid crystal display (LCD, Liquid Crystal Di may be used
Splay), the forms such as Organic Light Emitting Diode (OLED, Organic Light-Emitting Diode) configure display panel.
Further, touch panel can cover display panel, when touch panel detects on it or after neighbouring touch operation, transmission
To processor to determine the type of touch event, it is followed by subsequent processing device and is provided on a display panel accordingly according to the type of touch event
Visual output.
Voicefrequency circuit, loud speaker and microphone can provide the audio interface between user and electronic equipment 1000.Audio-frequency electric
The transformed electric signal of the audio data received can be transferred to loud speaker by road, and voice signal output is converted to by loud speaker；
On the other hand, the voice signal of collection is converted to electric signal by microphone, and audio data is converted to after being received by voicefrequency circuit, then
After the processing of audio data output processor, through radio circuit to be sent to such as another electronic equipment 1000, or by audio
Data export to memory to be further processed.
Processor is the control centre of electronic equipment 1000, and processor is mounted on circuit board assemblies, utilizes various interfaces
With the various pieces of the entire electronic equipment of connection 1000, by running or executing the software program being stored in memory
And/or module, and the data being stored in memory are called, the various functions and processing data of electronic equipment 1000 are executed,
To carry out integral monitoring to electronic equipment 1000.Optionally, processor may include one or more processing units；Preferably,
Processor can integrate application processor and modem processor, wherein the main processing operation system of application processor, Yong Hujie
Face and application program etc., modem processor mainly handle wireless communication.
Power supply can be logically contiguous with processor by power-supply management system, is managed to be realized by power-supply management system
The functions such as charging, electric discharge and power managed.Although being not shown, electronic equipment 1000 can also include bluetooth module, sensor
(such as attitude transducer, optical sensor, other sensings such as can also configure barometer, hygrometer, thermometer and infrared sensor
Device) etc., details are not described herein.
It should be noted that mobile phone is only the citing of a kind of electronic equipment 1000, the utility model is simultaneously not particularly limited, this
Utility model can be applied to the electronic equipments such as mobile phone, tablet computer 1000, and the utility model does not limit this.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
It states and is necessarily directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be with
It can be combined in any suitable manner in any one or more of the embodiments or examples.In addition, without conflicting with each other, this field
Technical staff can by the feature of different embodiments or examples described in this specification and different embodiments or examples into
Row combines and combination.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model
Inside it can make changes, modifications, alterations, and variations to the above described embodiments.
Claims (10)
1. a kind of chip assembly of camera, which is characterized in that including：
Filter disc；
Chip；
Substrate, the substrate, the chip and the filter disc are stacked, and the substrate is located at the side of the chip, described
Filter disc is located at the other side of the chip, has gap between the filter disc and the chip；
For by the filter disc and the chip package, to the encapsulation part of the substrate, at least partly edge of the filter disc to be by institute
State encapsulation part package, the encapsulation part be located at gap in surface be the plane of reference, the plane of reference it is at least partially coarse
Face.
2. the chip assembly of camera according to claim 1, which is characterized in that the substrate is equipped with electric elements,
The electric elements are packaged in the encapsulation part.
3. the chip assembly of camera according to claim 2, which is characterized in that the edge of the filter disc is at least partly
Edge beyond the chip.
4. the chip assembly of camera according to claim 3, which is characterized in that the electric elements are located at the substrate
Between the filter disc.
5. the chip assembly of camera according to claim 1, which is characterized in that the encapsulation part is in the chip and institute
It is the plane of reference, at least partially inclined surface of the plane of reference to state the surface between filter disc.
6. the chip assembly of camera according to claim 1, which is characterized in that the encapsulation part is in the chip and institute
It is the plane of reference to state the surface between filter disc, and the plane of reference is at least partly coated with the first viscous layer.
7. the chip assembly of camera according to claim 1, which is characterized in that the encapsulation part is by having sticking material
Adhesive encapsulation portion made of material.
8. the chip assembly of camera according to claim 1, which is characterized in that the thang-kng region of the filter disc is work
Area, rest part are nonclient area, and the surface of the filter disc being located in the nonclient area is coated with the second viscous layer.
9. a kind of camera, which is characterized in that including：
Lens assembly；With
Chip assembly, the chip assembly is the chip assembly of the camera according to any one of claim 1-8, described
Chip assembly is located at the lower section of the Lens assembly, and the chip assembly is connect with the Lens assembly.
10. a kind of electronic equipment, which is characterized in that including：
Camera, the camera are according to the camera described in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721803057.0U CN207782943U (en) | 2017-12-19 | 2017-12-19 | Chip assembly, camera and the electronic equipment of camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721803057.0U CN207782943U (en) | 2017-12-19 | 2017-12-19 | Chip assembly, camera and the electronic equipment of camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207782943U true CN207782943U (en) | 2018-08-28 |
Family
ID=63227219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721803057.0U Expired - Fee Related CN207782943U (en) | 2017-12-19 | 2017-12-19 | Chip assembly, camera and the electronic equipment of camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207782943U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024045223A1 (en) * | 2022-09-01 | 2024-03-07 | 诚瑞光学(南宁)有限公司 | Camera base and camera device |
-
2017
- 2017-12-19 CN CN201721803057.0U patent/CN207782943U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024045223A1 (en) * | 2022-09-01 | 2024-03-07 | 诚瑞光学(南宁)有限公司 | Camera base and camera device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 |