CN107968908A - Camera and there is its electronic equipment - Google Patents

Abstract

This application discloses a kind of camera and there is its electronic equipment.Wherein camera includes Lens assembly, and Lens assembly has thang-kng passage；Chip assembly, chip assembly includes circuit board, chip, gold thread, filter disc and encapsulation part, circuit board, chip and filter disc are stacked, there is gap between filter disc and chip, the surface in gap of encapsulation part is the plane of reference, the at least partially rough surface of the plane of reference, one end of gold thread is connected with chip, the other end of gold thread is connected with circuit board, chip, filter disc and gold thread are packaged in circuit board by encapsulation part, Lens assembly is connected with encapsulation part, and the light irradiated out of thang-kng passage is irradiated in filter disc, and encapsulation part, which is equipped with, escapes depressed structure with communication gap and the external world.According to the camera of the electronic equipment of the application, improve and be electrically connected stability between chip and circuit board, improve the assembly precision of chip assembly, reduce the size of camera, reduce the veiling glare incided on chip, enhance the treatment effect of image.

Description

Camera and there is its electronic equipment

Technical field

This application involves technical field of electronic equipment, more particularly to a kind of camera and there is its electronic equipment.

Background technology

In correlation technique, chip is encapsulated in circuit by CCD camera assembly by way of mold injection first in encapsulation On plate, picture glue is then carried out on moulding, this process chip and filter disc are using independent finally bonding filter disc on circuit boards Encapsulation.Rear camera component is encapsulated under external impacts, layering easily occurs and comes off, and the error of encapsulation process is larger, shooting Head assembly take pictures imaging when, easily there is reflective or light leak situation.

The content of the invention

The application is intended at least solve one of technical problem existing in the prior art.For this reason, the application proposes a kind of electricity The camera of sub- equipment, the camera overall dimensions of the electronic equipment are smaller, can effectively reduce veiling glare energy.

The application also proposes a kind of electronic equipment, and the electronic equipment includes above-mentioned camera.

According to the camera of the electronic equipment of the embodiment of the present application, including：Lens assembly, the Lens assembly have thang-kng Passage；Chip assembly, the chip assembly include circuit board, chip, gold thread, filter disc and encapsulation part, the circuit board, the core Piece and the filter disc are stacked, and the circuit board is located at the side of the chip, and the filter disc is located at the another of the chip Side, has a gap between the filter disc and the chip, the surface in gap of the encapsulation part is the plane of reference, the ginseng At least partially rough surface in face is examined, one end of the gold thread is connected with the chip, the other end of the gold thread and the electricity The chip, the filter disc and the gold thread are packaged in the circuit board, the Lens assembly by road plate connection, the encapsulation part It is connected with the encapsulation part, the light irradiated out of described thang-kng passage is irradiated in the filter disc, and the encapsulation part, which is equipped with, to be escaped Depressed structure is to connect the gap and the external world.

According to the camera of the electronic equipment of the embodiment of the present application, filter disc, chip and gold thread are encapsulated using encapsulation part Together, it can effectively prevent filter disc and gold thread from being fallen off under external impacts, enhance the stability of filter disc work, eliminate The attached process of filter disc, improves and is electrically connected stability between chip and circuit board, improve the assembly precision of chip assembly, Reduce the volume and size of camera.At least partially rough surface of the plane of reference between filter disc and chip of encapsulation part, And then the light for inciding the plane of reference is changed into diffusing reflection by mirror-reflection, so that weaken the veiling glare energy incided on chip, Strengthen treatment effect of the chip to image.In addition, encapsulation part, which is additionally provided with, escapes depressed structure, so to the chip assembly of camera into During luggage is matched somebody with somebody so that the gas in gap between optical filter and chip can be into or out with expanding with heat and contract with cold, so that Ensure the assembling quality and optical effect of camera.

According to the electronic equipment of the application, including above-mentioned camera.

According to the electronic equipment of the application, filter disc, chip and gold thread are packaged together using encapsulation part, can effectively be prevented Only filter disc and gold thread are fallen off under external impacts, enhance the stability of filter disc work, eliminate the attached process of filter disc, Improve and be electrically connected stability between chip and circuit board, improve the assembly precision of chip assembly, reduce camera Volume and size.At least partially rough surface of the plane of reference between filter disc and chip of encapsulation part, and then incide reference The light in face is changed into diffusing reflection by mirror-reflection, so as to weaken the veiling glare energy incided on chip, enhancing chip is to image Treatment effect.In addition, encapsulation part, which is additionally provided with, escapes depressed structure, and then in assembling process is carried out to the chip assembly of camera, Allow the gas in the gap between optical filter and chip into or out with expanding with heat and contract with cold, so as to ensure the dress of camera With quality and optical effect.

Brief description of the drawings

Fig. 1 is the structure diagram according to the camera of the embodiment of the present application；

Fig. 2 is the enlarged drawing at A in Fig. 1；

Fig. 3 is the rearview according to the electronic equipment of the embodiment of the present application.

Reference numeral：

Electronic equipment 1000,

Camera 100, chip assembly 1,

Filter disc 11, chip 12, circuit board 13, encapsulation part 14, the plane of reference 141,

Gold thread 15, electric elements 16, escape depressed structure 17, and escape hole 171, escapes gas passage 172,

Lens assembly 2.

Embodiment

Embodiments herein is described below in detail, the example of the embodiment is shown in the drawings.Below with reference to The embodiment of attached drawing description is exemplary, it is intended to for explaining the application, and it is not intended that limitation to the application.

In the description of the present application, it is to be understood that the orientation or position of the instruction such as term " on ", " under ", "left", "right" It is based on orientation shown in the drawings or position relationship to put relation, is for only for ease of description the application and simplifies description, rather than Indicate or imply that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore cannot It is interpreted as the limitation to the application.

In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include at least one this feature.In the description of the present application, " multiple " are meant that at least two, such as two, three It is a etc., unless otherwise specifically defined.

In this application, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc. Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects Connect or be electrically connected or can communicate each other；It can be directly connected, can also be indirectly connected by intermediary, can be with It is the interaction relationship of connection inside two elements or two elements, unless otherwise restricted clearly.For this area For those of ordinary skill, the concrete meaning of above-mentioned term in this application can be understood as the case may be.

As shown in Figure 1-Figure 3, according to the camera 100 of the electronic equipment 1000 of the embodiment of the present application, including chip assembly 1 With Lens assembly 2.

Specifically, as depicted in figs. 1 and 2, Lens assembly 2 has thang-kng passage, and chip assembly 1 includes circuit board 13, core Piece 12, gold thread 15, filter disc 11 and encapsulation part 14, circuit board 13, chip 12 and filter disc 11 are stacked, and circuit board 13 is located at chip 12 side (downside as shown in Figure 1), filter disc 11 are located at the opposite side (upside as shown in Figure 1) of chip 12, filter disc 11 with There is gap, the surface in gap of encapsulation part 14 is the plane of reference 141, at least part of the plane of reference 141 between chip 12 For rough surface, one end of gold thread 15 is connected with chip 12, and the other end of gold thread 15 is connected with circuit board 13, and encapsulation part 14 is by chip 12nd, filter disc 11 and gold thread 15 are packaged in circuit board 13, and Lens assembly 2 is connected with encapsulation part 14, is irradiated out of thang-kng passage Light is irradiated in filter disc 11.

It is understood that as depicted in figs. 1 and 2, Lens assembly 2 can be located at the top of chip assembly 1 (such as Fig. 1 institutes The top shown), light can be from the top of Lens assembly 2 by propagating to chip assembly 1 after Lens assembly 2.Chip assembly 1 wraps Circuit board 13, chip 12, gold thread 15, filter disc 11 and encapsulation part 14 are included, on the direction of propagation of incident ray, Lens assembly 2, filter Piece 11, chip 12 and circuit board 13 are arranged successively, for example, Lens assembly 2, filter disc 11, chip 12 and circuit board 13 can be successively Arrangement stacked on top of one another, and be spaced apart between filter disc 11 and chip 12.Chip 12 can realize electricity with circuit board 13 by gold thread 15 Connection, one end of gold thread 15 are electrically connected with chip 12, and the other end of gold thread 15 is electrically connected with circuit board 13.Lens assembly 2 can be with Incident ray is concentrated on into same plane, is further handled easy to next stage.In addition, Lens assembly 2 can also can be achieved The adjusting of focal length, and then obtain and be more clearly imaged.

Filter disc 11 may filter that variegated and polarisation, and then obtain preferable imaging effect.In addition, chip 12 can be at image Device is managed, such as CMOS type or CCD type, extraneous light are delivered on chip 12 through filter disc 11, chip 12 can turn light Become electric charge, digital signal is converted into by analog-digital converter chip 12, last digital signal is after overcompression is handled by storing Device preserves.Encapsulation part 14 can be used for filter disc 11, chip 12 and gold thread 15 being packaged together, at least part edge of filter disc 11 Packed portion 14 is wrapped up.

As depicted in figs. 1 and 2,141 at least part of the plane of reference between filter disc 11 and chip 12 of encapsulation part 14 is set Rough surface is set to, and then the light for inciding the plane of reference 141 is changed into diffusing reflection by mirror-reflection, and chip is incided so as to weaken Veiling glare energy on 12, treatment effect of the enhancing chip 12 to image.

As depicted in figs. 1 and 2, encapsulation part 14 escape depressed structure 17 can be with communication gap and the external world.Thus, to camera 100 chip assembly 1 is carried out in assembling process so that the gas in gap between optical filter and chip 12 can be cold with heat expansion Contract into or out, the external and internal pressure during assembling of camera 100 can be kept uniform, prevent optical filter and chip 12 by Power deforms and influences assembling quality and optical effect, improves the reliability of chip assembly 1.

According to the camera 100 of the electronic equipment 1000 of the embodiment of the present application, using encapsulation part 14 by filter disc 11, chip 12 And gold thread 15 is packaged together, it can effectively prevent filter disc 11 and gold thread 15 from being fallen off under external impacts, enhance filter disc The stability of 11 work, eliminates the attached process of filter disc 11, improves and be electrically connected stabilization between chip 12 and circuit board 13 Property, improves the assembly precision of chip assembly 1, reduces the volume and size of camera 100.Encapsulation part 14 is located at filter disc 11 At least partially rough surface of the plane of reference 141 between chip 12, and then the light for inciding the plane of reference 141 is turned by mirror-reflection It is changed into diffusing reflection, so that weaken the veiling glare energy incided on chip 12, treatment effect of the enhancing chip 12 to image.In addition, Encapsulation part 14, which is additionally provided with, escapes depressed structure 17, and then in assembling process is carried out to the chip assembly 1 of camera 100 so that filter The gas in gap between piece and chip 12 can be into or out with expanding with heat and contract with cold, so as to ensure the assembling of camera 100 Quality and optical effect.

According to some embodiments of the present application, as depicted in figs. 1 and 2, escaping depressed structure 17 includes：Escape hole 171 and escape gas Passage 172.Escape hole 171 runs through surface of the mounting bracket away from chip 12, thus the escape hole 171 when assembling chip assembly 1 It can easily be in communication with the outside, escape gas passage 172 and connect escape hole 171 and above-mentioned gap, so that by optical filter and chip 12 Between gap be in communication with the outside.Wherein, it is at an angle to each other to escape the central axis of the central axis and escape hole 171 of gas passage 172, Thus the setting of depressed structure 17 is conveniently escaped so that escaping depressed structure 17 can be by escaping gas passage 172 towards the direction in above-mentioned gap Extend to connect the gap and escape hole 171.

For example, in the embodiment shown in Figure 2, the central axis of the central axis and escape hole 171 of escaping gas passage 172 can With perpendicular to one another.Thus, the machine-shaping of depressed structure 17 is conveniently escaped.

Further, as shown in Fig. 2, the cross section of escape hole 171 is increased up in the side by chip 12 to optical filter. It is possible thereby to increase the velocity of liquid assets of gas so that the gas in gap between optical filter and chip 12 can quickly discharge or Quickly filled into from the external world, ensure that the gas in the gap may be at equilibrium state.For example, escape hole 171 can be in round table-like.

According to some embodiments of the present application, as shown in Figure 1, escape depressed structure 17 can be it is multiple, it is multiple to escape depressed structure 17 Can being provided at circumferentially spaced along encapsulation part 14.Thus, it is possible to significantly increase the velocity of liquid assets of gas, can further protect The gas demonstrate,proved in the gap may be at equilibrium state.

According to some embodiments of the present application, as depicted in figs. 1 and 2, rough surface is to utilize polishing, sandblasting or electrical fire worker employed in a plant nursery Skill is process.Polishing, the technics comparing of sandblasting or electrical discharge machining are simple, and processing efficiency is higher, and technological development relative into Ripe, manufacture cost is relatively low.Polishing or sandblasting be by the plane of reference 141 being pointed between filter disc 11 and chip 12 carry out impact and Machining so that the plane of reference 141 obtains certain roughness, and electrical fire flower process is to utilize corrosion caused by spark discharge Phenomenon causes the plane of reference 141 to obtain certain roughness.

According to some embodiments of the present application, as depicted in figs. 1 and 2, electric elements 16 can be equipped with circuit board 13, electricity Device element 16 is packaged in encapsulation part 14.Electric elements 16 can be that chip 12 provides electric current and voltage, assist chip 12 to light Signal, electric signal and digital signal are handled.Electric elements 16 are encapsulated in encapsulation part 14, encapsulation part 14 is to electric appliance member Part 16 has protective effect, avoids electric elements 16 from being influenced the normal work of chip assembly 1 be subject to external force collision.In addition, pass through Electric elements 16, chip 12 and filter disc 11 are packaged together, the volume and size of camera 100 can be not only reduced, may be used also To reduce the assembly process of camera 100, the assembly precision of chip assembly 1 is lifted.

Further, as depicted in figs. 1 and 2, at least part at the edge of filter disc 11 exceeds the edge of chip 12.With one Determine the light of incident angle, after the broader filter disc 11 in edge, each several part of chip 12 can be received by filter disc 11 Light, improves the luminous flux of chip assembly 1 so that imaging effect more, reduces the noise in light, improves imaging Clarity and resolution ratio.

Further, as depicted in figs. 1 and 2, electric elements 16 are between circuit board 13 and filter disc 11.In order to obtain compared with Good imaging effect is, it is necessary to circuit board 13 and filter disc 11 are spaced apart, by the way that electric elements 16 are arranged on circuit board 13 and filter In the spaces that piece 11 is spaced, electric elements 16 are placed into without distributing extra space, reduce the size of chip assembly 1, Realize the Miniaturization Design of chip assembly 1.

According to some embodiments of the present application, as shown in Figure 1, the plane of reference 141 is inclined plane.Thus, chip 12 and filter disc In 11 clearance space, when being irradiated to inclined plane, inclined plane will can connect for the mixed and disorderly reflection light in part or light leak light Received reflection light or light leak light are reflected to one end (top as shown in Figure 1) away from chip 12, and then avoid reflecting Light or light leak light enter chip 12, and then reduce the noise of imaging, improve the effect of imaging.

According to some embodiments of the present application, as shown in Figure 1, the plane of reference 141 is equipped with viscous layer.Thus, partly fall into Dust or little particle inside to chip assembly 1, can be adsorbed, and then avoid dust or little particle from falling in core by viscous layer On piece 12, imaging effect is influenced.In addition, by viscous layer, chip 12 and filter disc 11 can preferably be fitted in encapsulation part 14 In side wall, in order to avoid being subjected to displacement or rocking under external force, and then ensure preferable imaging effect.

According to some embodiments of the present application, as depicted in figs. 1 and 2, encapsulation part 14 is made of having sticking material Adhesive encapsulation portion 14.It is more to be smeared using in contact position for the viscous power of being stained between increase chip 12 or filter disc 11 and encapsulation part 14 Dispensing.Thus, the dust or little particle inside chip assembly 1 are partly dropped into, can be adsorbed by the encapsulation part 14 of viscosity, into And avoid dust or little particle from falling on chip 12, influence imaging effect.The encapsulation part 14 of viscosity reduces use for dispensing glue, And then reduce the whole height of chip assembly 1.In addition, adhesive encapsulation portion 14 enables chip 12 and filter disc 11 preferably to paste Close in encapsulation part 14, in order to avoid chip 12 or filter disc 11 are subjected to displacement or rock under external force, and then ensure preferable Imaging effect.

According to some embodiments of the present application, as depicted in figs. 1 and 2, filter disc 11 is glass workpiece.Glass filters 11 may filter that A part of infrared ray and visible red, so user using camera 100 shoot when, through glass filters 11 light through figure After processor processing, more preferable imaging effect can be obtained.

Electronic equipment 1000 below with reference to Fig. 1-Fig. 3 descriptions according to the embodiment of the present application.

According to the electronic equipment 1000 of the embodiment of the present application, including above-mentioned camera 100.It should be noted that as This use " electronic equipment 1000 " includes, but are not limited to be configured to connect (such as via public exchange electricity via Wireline Telephone network (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection, and/or another data connection/net Network) and/or via (for example, for cellular network, WLAN (WLAN), such as digital TV network of DVB-H networks, Satellite network, AM-FM broadcasting transmitter, and/or another communication electronic equipment 1000) wave point reception/transmission communication The device of signal.It is configured to that by the communication electronic equipment 1000 of radio interface communication " wireless communication end can be referred to as End ", " wireless terminal " and/or " mobile terminal ".The example of mobile terminal includes, but are not limited to satellite or cell phone；Can With combination cellular radio telephone and PCS Personal Communications System (PCS) terminal of data processing, fax and its communication ability；Can With fixed including radio telephone, pager, the Internet/intranet access, Web browser, memo pad, calendar and/or the whole world The PDA of position system (GPS) receiver；And conventional laptop and/or palmtop receiver or including radiotelephone transceiver Other electronic equipments 1000.

According to the electronic equipment 1000 of the embodiment of the present application, using encapsulation part 14 by filter disc 11, chip 12 and gold thread 15 It is packaged together, can effectively prevents filter disc 11 and gold thread 15 from being fallen off under external impacts, enhances the steady of the work of filter disc 11 It is qualitative, the attached process of filter disc 11 is eliminated, improves and is electrically connected stability between chip 12 and circuit board 13, improve core The assembly precision of piece component 1, reduces the volume and size of camera 100.Encapsulation part 14 positioned at filter disc 11 and chip 12 it Between at least partially rough surface of the plane of reference 141, and then incide the light of the plane of reference 141 be changed into by mirror-reflection it is unrestrained anti- Penetrate, so that weaken the veiling glare energy incided on chip 12, treatment effect of the enhancing chip 12 to image.In addition, encapsulation part 14 It is additionally provided with and escapes depressed structure 17, and then in assembling process is carried out to the chip assembly 1 of camera 100 so that optical filter and chip The gas in gap between 12 can be into or out with expanding with heat and contract with cold, so as to ensure the assembling quality and light of camera 100 Learn effect.

In the embodiment of the present application, which can various can obtain data and to the data from outside The equipment handled, alternatively, the electronic equipment 1000 can be it is various be built-in with battery, and electric current pair can be obtained from outside The equipment that the battery charges, for example, mobile phone, tablet computer, computing device or device for display of message etc..

Electronic equipment 1000 below with reference to Fig. 1-Fig. 3 descriptions according to one specific embodiment of the application.It is worth what is understood It is, it is described below to be merely illustrative rather than the concrete restriction to the application.

The electronic equipment 1000 being applicable in by taking mobile phone as an example the application is introduced.In the embodiment of the present application, electronics Equipment 1000 can include camera 100, radio circuit, memory, input unit, Wireless Fidelity (WiFi, wireless Fidelity) the component such as module, sensor, display unit, voicefrequency circuit, processor, fingerprint recognition component, battery.

As shown in Figure 1-Figure 3, the camera 100 of the embodiment of the present application, including：Lens assembly 2 and chip assembly 1.Wherein, Chip assembly 1 is located at the lower section (lower section as shown in Figure 1) of Lens assembly 2, and chip assembly 1 is connected with Lens assembly 2.

As shown in Figure 1, chip assembly 1 includes circuit board 13, chip 12, gold thread 15, filter disc 11 and encapsulation part 14.Wherein, Encapsulation part 14 is by the adhesive encapsulation portion 14 of the materials for support with stickiness, and encapsulation part 14 is by 15 envelope of chip 12, filter disc 11 and gold thread Loaded on circuit board 13, Lens assembly 2 is connected with encapsulation part 14, and the light irradiated out of thang-kng passage is irradiated in filter disc 11.

As depicted in figs. 1 and 2, gold thread 15 is provided with two groups altogether, and is respectively distributed to the left side of chip assembly 1 (such as Fig. 1 institutes The left side shown) and right side (right side as shown in Figure 1).One end of gold thread 15 is connected with chip 12, the other end and the electricity of gold thread 15 Road plate 13 connects,

As depicted in figs. 1 and 2, circuit board 13, chip 12 and filter disc 11 are stacked, and circuit board 13 is located under chip 12 Side (downside as shown in Figure 1), filter disc 11 are located at the upside (upside as shown in Figure 1) of chip 12, filter disc 11 and chip 12 it Between there is gap, the surface in gap of encapsulation part 14 be the plane of reference 141, and the plane of reference 141 is equipped with the coarse of viscous layer Face, and rough surface is process using blasting craft.In addition, the edge of filter disc 11 at least partly exceeds the edge of chip 12.

As depicted in figs. 1 and 2, circuit board 13 is equipped with electric elements 16, and electric elements 16 are located at circuit board 13 and filter disc Between 11, electric elements 16 are connected with chip 12, and electric elements 16 are provided with two groups altogether, and are respectively distributed to a left side for chip 12 Side (left side as shown in Figure 1) and right side (right side as shown in Figure 1).

As depicted in figs. 1 and 2, the left side (left side as shown in Figure 1) and right side (right side as shown in Figure 1) of encapsulation part 14 It is respectively provided with one and escapes depressed structure 17, the gap between filter disc 11 and chip 12 is in communication with the outside.Specifically, depressed structure is escaped 17 include：Escape hole 171 and escape gas passage 172, escape hole 171 runs through surface of the encapsulation part 14 away from chip 12, escapes gas passage 172 connection escape holes 171 and gap, it is orthogonal to escape the central axis of the central axis and escape hole 171 of gas passage 172, escapes The cross section of stomata 171 is increased up in the side by chip 12 to optical filter.

Radio circuit can be used for receive and send messages or communication process in, the reception and transmission of signal, especially, by base station After downlink information receives, processor processing is given；In addition, by the data sending of 1000 uplink of electronic equipment to base station.In general, radio frequency Circuit includes but not limited to antenna, at least one amplifier, transceiver, coupler, low-noise amplifier, duplexer etc..This Outside, radio circuit can also be communicated by wireless communication with network and other equipment.

Memory can be used for storage software program and module, and processor is stored in the software program of memory by operation And module, so as to perform various function application and the data processing of electronic equipment 1000.Memory can mainly include storage Program area and storage data field, wherein, storing program area can storage program area, the application program needed at least one function (such as sound-playing function, image player function) etc.；Storage data field can be stored to be created according to using for electronic equipment 1000 Data (such as voice data, phone directory) built etc.., can be with addition, memory can include high-speed random access memory Including nonvolatile memory, for example, at least a disk memory, flush memory device or other volatile solid-states Part.

Input unit can be used for the numeral or character information for receiving input, and produces and set with the user of electronic equipment 1000 Put and key signals that function control is related.Specifically, input unit may include contact panel and other input equipments.Touch-control Panel, also referred to as touch-screen, collect user on it or neighbouring touch operation (for example user is appointed using finger, stylus etc. What operation of suitable object or annex on contact panel or near contact panel), and driven according to formula set in advance Move corresponding attachment device.

Optionally, contact panel may include both touch detecting apparatus and touch controller.Wherein, touch detection fills The touch orientation of detection user is put, and detects the signal that touch operation is brought, transmits a signal to touch controller；Touch control Device receives touch information from touch detecting apparatus, and is converted into contact coordinate, then gives processor, and can reception processing Order that device is sent simultaneously is performed.Furthermore, it is possible to using multiple types such as resistance-type, condenser type, infrared ray and surface acoustic waves Type realizes contact panel.Except contact panel, input unit can also include other input equipments.Specifically, other inputs are set It is standby to can include but is not limited to physical keyboard, function key (such as volume control button, switch key etc.), trace ball, mouse, behaviour Make the one or more in bar etc..

WiFi belongs to short range wireless transmission technology, and electronic equipment 1000 can help user to receive and dispatch electricity by WiFi module Sub- mail, browse webpage and access streaming video etc., it has provided wireless broadband internet to the user and has accessed.But it can manage Solution, WiFi module are simultaneously not belonging to must be configured into for electronic equipment 1000, can not change application as needed completely Omitted in the scope of essence.

In addition, mobile phone may also include at least one sensor, such as attitude transducer, optical sensor and other sensings Device.

Specifically, attitude transducer is referred to as motion sensor, also, as one kind of the motion sensor, can To enumerate gravity sensor, cantilevered shifter is made using elastic sensing element in gravity sensor, and using the sensitive member of elasticity Energy-stored spring made of part drives electric contact, so as to fulfill Gravity changer to be converted into the change of electric signal.

As the another kind of motion sensor, accelerometer sensor can be enumerated, accelerometer sensor can detect all directions Upper (generally three axis) acceleration magnitude, can detect that size and the direction of gravity, available for identification mobile phone posture when static (for example pedometer, struck using (such as horizontal/vertical screen switching, dependent game, magnetometer pose calibrating), Vibration identification correlation function Hit) etc..

In the embodiment of the present application, motion sensor listed above can be used first as aftermentioned " attitude parameter " is obtained Part, but it's not limited to that, and other sensors that can obtain " attitude parameter " are each fallen within the protection domain of the application, example Such as, gyroscope etc., also, the operation principle of the gyroscope and data handling procedure can be similar to the prior art, here, in order to Avoid repeating, description is omitted.

In addition, in the embodiment of the present application, as sensor, it can also configure barometer, hygrometer, thermometer and infrared ray The other sensors such as sensor, details are not described herein.

Optical sensor may include ambient light sensor and proximity sensor, wherein, ambient light sensor can be according to ambient light The light and shade of line adjusts the brightness of display panel, proximity sensor can when mobile phone is moved in one's ear, close display panel and/or Backlight.

Display unit can be used for display by information input by user or be supplied to the information of user and respectively planting vegetables for mobile phone It is single.Display unit may include display panel, optionally, can use liquid crystal display (LCD, Liquid Crystal Display), the form such as Organic Light Emitting Diode (OLED, Organic Light-Emitting Diode) configures display surface Plate.Further, contact panel can cover display panel, when contact panel is detected on it or after neighbouring touch operation, Processor is sent to determine the type of touch event, device is followed by subsequent processing and is provided on a display panel according to the type of touch event Corresponding visual output.

Voicefrequency circuit, loudspeaker and microphone can provide the audio interface between user and electronic equipment 1000.Audio-frequency electric The transformed electric signal of the voice data received can be transferred to loudspeaker by road, and voice signal output is converted to by loudspeaker； On the other hand, the voice signal of collection is converted to electric signal by microphone, and voice data is converted to after being received by voicefrequency circuit, then After the processing of voice data output processor, through radio circuit to be sent to such as another electronic equipment 1000, or by audio Data are exported to memory further to handle.

Processor is the control centre of electronic equipment 1000, and processor is installed on 13 component of circuit board, is connect using various The various pieces of mouth and the whole electronic equipment 1000 of connection, by running or performing the software program being stored in memory And/or module, and the data being stored in memory are called, the various functions and processing data of electronic equipment 1000 are performed, So as to carry out integral monitoring to electronic equipment 1000.Optionally, processor may include one or more processing units；Preferably, Processor can integrate application processor and modem processor, wherein, application processor mainly handles operating system, Yong Hujie Face and application program etc., modem processor mainly handles wireless communication.

Power supply can be logically contiguous with processor by power-supply management system, is managed so as to be realized by power-supply management system The functions such as charging, electric discharge and power managed.Although being not shown, electronic equipment 1000 can also include bluetooth module, sensor (such as attitude transducer, optical sensor, can also configure barometer, hygrometer, thermometer and infrared ray sensor etc. other sensing Device) etc., details are not described herein.

It should be noted that mobile phone is only the citing of a kind of electronic equipment 1000, the application is simultaneously not particularly limited, the application The electronic equipments such as mobile phone, tablet computer 1000 are can be applied to, the application does not limit this.

In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description Point is contained at least one embodiment or example of the application.In the present specification, schematic expression of the above terms is not It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office Combined in an appropriate manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this area Art personnel can be tied the different embodiments or example described in this specification and different embodiments or exemplary feature Close and combine.

Although embodiments herein has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to the limitation to the application is interpreted as, those of ordinary skill in the art within the scope of application can be to above-mentioned Embodiment is changed, changes, replacing and modification.

Claims (10)

1. the camera (100) of a kind of electronic equipment (1000), it is characterised in that including：

Lens assembly (2), the Lens assembly (2) have thang-kng passage；

Chip assembly (1), the chip assembly (1) include circuit board (13), chip (12), gold thread (15), filter disc (11) and envelope Dress portion (14), the circuit board (13), the chip (12) and the filter disc (11) are stacked, and the circuit board (13) is located at The side of the chip (12), the filter disc (11) are located at the opposite side of the chip (12), the filter disc (11) and the core There is gap, the surface in gap of the encapsulation part (14) is the plane of reference (141), the plane of reference between piece (12) (141) at least partially rough surface, one end of the gold thread (15) are connected with the chip (12), the gold thread (15) it is another One end is connected with the circuit board (13), and the encapsulation part (14) is by the chip (12), the filter disc (11) and the gold thread (15) circuit board (13) is packaged in, the Lens assembly (2) is connected with the encapsulation part (14), out of described thang-kng passage The light irradiated is irradiated in the filter disc (11), the encapsulation part (14) be equipped with escape depressed structure (17) with connect the gap and It is extraneous.

2. the chip assembly (1) of camera (100) according to claim 1, it is characterised in that described to escape depressed structure (17) Including：

Escape hole (171), the escape hole (171) is through surface of the encapsulation part (14) away from the chip (12)；

Escape gas passage (172), the gas passage (172) of escaping connects the escape hole (171) and the gap, described to escape gas passage (172) central axis and the central axis of the escape hole (171) are at an angle to each other.

3. the chip assembly (1) of camera (100) according to claim 2, it is characterised in that the escape hole (171) Cross section be increased up by the chip (12) to the side of the optical filter.

4. the chip assembly (1) of camera (100) according to claim 1, it is characterised in that described to escape depressed structure (17) It is multiple described to escape depressed structure (17) being provided at circumferentially spaced along the encapsulation part (14) to be multiple.

5. the camera (100) of electronic equipment (1000) according to claim 1, it is characterised in that the circuit board (13) electric elements (16) are equipped with, the electric elements (16) are packaged in the encapsulation part (14).

6. the camera (100) of electronic equipment (1000) according to claim 5, it is characterised in that the filter disc (11) Edge at least part exceed the chip (12) edge.

7. the camera (100) of electronic equipment (1000) according to claim 6, it is characterised in that the electric elements (16) between the circuit board (13) and the filter disc (11).

8. the camera (100) of electronic equipment (1000) according to claim 1, it is characterised in that the encapsulation part (14) the adhesive encapsulation portion made of having sticking material.

9. the camera (100) of electronic equipment (1000) according to claim 1, it is characterised in that the filter disc (11) For glass workpiece.

10. a kind of electronic equipment (1000), it is characterised in that including：

Camera (100), the camera (100) are the camera (100) according to any one of claim 1-9.