CN206136070U - Module of making a video recording with adhering structure - Google Patents
Module of making a video recording with adhering structure Download PDFInfo
- Publication number
- CN206136070U CN206136070U CN201620422623.2U CN201620422623U CN206136070U CN 206136070 U CN206136070 U CN 206136070U CN 201620422623 U CN201620422623 U CN 201620422623U CN 206136070 U CN206136070 U CN 206136070U
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- Prior art keywords
- tack coat
- medial surface
- top surface
- camera module
- colour filter
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Abstract
A module of making a video recording with adhering structure includes an optical lens, sense optical chip, a filter and a set of bonding component. This optical lens is set up in this sense optical chip's sensitization route. This bonding component is in solidification and near the dirty dirt this senses optical chip and this filter of still can boning after the module manufacturing finishes of making a video recording to keep the cleanness of this sense optical chip and this filter, prevent that dirty stain is bad.
Description
Technical field
The utility model is related to camera module field, is in more detail related to a camera module with adhesive structure.
Background technology
The making of camera module is a very fine process, and it has very strict to surrounding environment, operating procedure
Requirement.But even if its various condition meets and requires, also can Jing often there are some camera modules with dirty bad point.Due to taking the photograph
As module is high for the cleannes requirement of its sensitive chip and colour filter, these camera modules with dirty bad point will be difficult to
To application, process of doing over again can only be carried out, or even directly be scrapped.This is unfavorable for the rational utilization of resource, not only waste of resource, and
And reduce production efficiency, increase production cost.
The dirty bad point of camera module is a very important factor for causing camera module quality bad.Camera module
A big chunk stain is caused because some removable or irremovable particles are attached on colour filter.Camera module
Bad point to have be greatly because some are removable or irremovable particles are attached on chip and cause.
These removable or immovable particles are the dust in camera module manufacturing process, in external environment condition
What grain, equipment chip, glue chip, module material chips, human body chip etc. were internally formed into camera module.For routine
Adjustable focus camera module, even finished product, is also possible to have dust granules in use and falls into shooting mould by motor
Group is internal.During long-time use, the material chips that module internal structural friction is produced are likely to cause the generation of dirty bad point.
At present the dustproof construction of routine camera module is generally placed in inside motor, for camera module is in running
The removable particle of middle generation has certain prevention effect, but cannot thoroughly prevent.Meanwhile, to making in module
Particle in journey into module does not have effect.These moveable either immovable particles can fall in colour filter or photosensitive
Chip surface, causes camera module to produce dirty bad point, and then causes camera module quality bad.
In addition, the electronic component of PCB surface is arranged in camera module being typically where the easy aggregation of dirty dirt.
And the connection that often can be powered to it of dirty dirt is impacted, so as to affect the circuit of camera module, and and then whole shooting is affected
The service life of module.
Applicant of the present utility model is studied camera module, makes every effort to provide superior in quality camera module, to push away
The development of dynamic camera module, and and then promote associated electronic device industry development.
Dirty bad point preventing and treating of the applicant of the present utility model to camera module is studied, and makes every effort to allow consumer to enjoy quality
More excellent camera module and associated electronic device.
Utility model content
Main purpose of the present utility model is to provide a kind of camera module, and the wherein camera module has adhesive structure.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, to ensure the shooting mould
The cleannes of the colour filter of group.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, to ensure the shooting mould
The cleannes of the sensitive chip of group.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, to protect the shooting mould
The electronic component of group, and then protect the circuit of the camera module.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, to reduce encapsulation after should
Removable impact of the foreign matter to product quality in camera module inside.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, so as to improve shooting mould
Bad dirty bad point problem in group manufacturing process.
Another object of the present utility model is to reduce the bad of camera module to scrap, Improve Efficiency.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, the wherein camera module
Product structure design difficulty is low.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, the wherein camera module
Adhesive structure arrange convenient.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, the wherein camera module
Dustproof construction part is less in product design structure, and so as to product size reduction, the cost of material is low.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, to reduce prior art
Material inspection, cleaning in camera module manufacturing process, simplifies production procedure.
Another object of the present utility model is to be prevented effectively from using terminal product process, and the particulate matter in environment is entered
Pollution camera module, so as to improve the stability that terminal client uses corresponding terminal product, reduces terminal client complaint, is lifted and is produced
Quality and the whole passenger family market image.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, the behaviour of its manufacturing process
Make that scheme is various, efficiency high, can be realized by modes such as dispensing, gluing, glue spraying, printings, import low cost.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, the wherein camera module
It is superior in quality with good bonding dirt dirt effect.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, the wherein camera module
The grit attachment of its colour filter can be reduced.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, the wherein camera module
The grit attachment of its colour filter can be reduced, so as to reduce stain.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, the wherein camera module
The grit attachment of its chip can be reduced, so as to reduce bad point.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, the wherein camera module
Adhesive structure have and help the effect that connects.
Another object of the present utility model is to provide a kind of camera module with adhesive structure, the wherein camera module
Adhesive structure there is protective effect.
By explained below, other advantages of the present utility model and feature will become apparent, it is possible to pass through
The means and combination particularly pointed out in claims are accomplished.
According to the utility model, aforementioned and other purposes and advantage can be by a camera module realities with adhesive structure
Existing, it includes an optical lens, a sensitive chip and one group of binding element.The optical lens is arranged at the sense of the sensitive chip
Light path.The binding element can bond the dirty dirt in the camera module.
According to one embodiment of the present utility model, it further includes a colour filter and a support.The colour filter is set
It is placed in the support.The binding element further includes at least one first tack coat.First tack coat can bond the colour filter
Neighbouring dirty dirt.
According to one embodiment of the present utility model, the support has an inner face and has a receiving space.The colour filter
It is arranged in the receiving space with the sensitive chip.
According to one embodiment of the present utility model, the binding element includes at least one second tack coat.Second bonding
Layer is arranged near the sensitive chip.
According to one embodiment of the present utility model, it further includes a wiring board and a series of electronic components.The electricity
Subcomponent is arranged at the wiring board.Second tack coat is arranged at the electronic component, to cover the electronic component.
According to one embodiment of the present utility model, it further includes a wiring board and at least a gold thread.The gold thread quilt
The sensitive chip and the wiring board are turned on for being powered.Second tack coat is set, to cover the gold thread.
According to one embodiment of the present utility model, it further includes a wiring board and at least a gold thread.The gold thread quilt
The sensitive chip and the wiring board are turned on for being powered.The gold thread has a wiring board connection end for being connected to the wiring board.
Second tack coat is set, to cover the wiring board connection end of the gold thread.
According to one embodiment of the present utility model, second tack coat is arranged at the non-photo-sensing area of the sensitive chip
Domain.
According to one embodiment of the present utility model, the support includes one first supporter and one second supporter.This
One supporter is supported on second supporter.The optical lens is supported on first supporter.The colour filter this second
Support body.The inner face and the receiving space are formed on second supporter.
According to one embodiment of the present utility model, it further includes a motor for being arranged at the support.The optics
Camera lens is arranged at the motor.
According to one embodiment of the present utility model, first tack coat is arranged at the inner face of the support.
According to one embodiment of the present utility model, the inner face includes one first medial surface.First tack coat is set
In first medial surface.
According to one embodiment of the present utility model, the inner face includes one first medial surface and an inner top surface.This is in first
Side and the inner top surface are connected with each other.First tack coat is continuously arranged at first medial surface and the inner top surface.
According to one embodiment of the present utility model, the inner face is included in one first medial surface, one second medial surface and
Top surface.First medial surface, the inner top surface and second medial surface are connected with each other.First tack coat be continuously arranged at this
One medial surface, the inner top surface and second medial surface.
According to one embodiment of the present utility model, the inner face includes an inner bottom surface.First tack coat is arranged at this
Inner bottom surface.
According to one embodiment of the present utility model, the inner face includes one the 3rd medial surface and an inner bottom surface.In 3rd
Side and the inner bottom surface are connected with each other.First tack coat is continuously arranged at the 3rd medial surface and the inner bottom surface.
According to one embodiment of the present utility model, the inner face include one first medial surface, one second medial surface, one the 3rd
Medial surface, an inner top surface and an inner bottom surface.First tack coat is arranged at first medial surface, second medial surface, this is interior
Bottom surface and the 3rd medial surface.
According to one embodiment of the present utility model, the inner face is included in one first medial surface, one second medial surface and
Top surface.First medial surface, the inner top surface and second medial surface are connected with each other.The colour filter has an edge top surface.This
One tack coat is continuously arranged at the edge top surface, first medial surface, the inner top surface and second medial surface.
According to one embodiment of the present utility model, the inner face includes one first medial surface.The colour filter has an edge
Top surface.First tack coat is continuously arranged at the edge top surface and first medial surface.
According to one embodiment of the present utility model, the inner face includes one first medial surface.The colour filter has an edge
Bottom surface.First tack coat is continuously arranged at the edge bottom surface and first medial surface.
According to one embodiment of the present utility model, the colour filter has an edge top surface.First tack coat is set
In the edge top surface.
According to one embodiment of the present utility model, the colour filter has an edge bottom surface.First tack coat is set
In the edge bottom surface.
By the understanding to subsequent description and accompanying drawing, the further purpose of the utility model and advantage will be able to abundant body
It is existing.
These and other objects of the present utility model, feature and advantage, by following detailed descriptions, accompanying drawing and right will
Try to achieve to fully demonstrate.
Description of the drawings
Fig. 1 is the schematic diagram of the camera module according to first preferred embodiment of the present utility model.
Fig. 2 illustrates first of the camera module according to above-mentioned first preferred embodiment of the present utility model and can replace
Change embodiment.
Fig. 3 illustrates second of the camera module according to above-mentioned first preferred embodiment of the present utility model and can replace
Change embodiment.
Fig. 4 is the schematic diagram of the camera module according to second preferred embodiment of the present utility model.
Fig. 5 illustrates first of the camera module according to above-mentioned second preferred embodiment of the present utility model and can replace
Change embodiment.
Fig. 6 illustrates second of the camera module according to above-mentioned second preferred embodiment of the present utility model and can replace
Change embodiment.
Fig. 7 is the schematic diagram of the camera module according to the 3rd preferred embodiment of the present utility model.
Fig. 8 illustrates one of the camera module according to above-mentioned 3rd preferred embodiment of the present utility model alternatively
Embodiment.
Fig. 9 is the schematic diagram of the camera module according to the 4th preferred embodiment of the present utility model.
Figure 10 illustrates of the camera module according to above-mentioned 4th preferred embodiment of the present utility model and can replace
Change embodiment.
Specific embodiment
Hereinafter describe for disclosing the utility model so that those skilled in the art can realize the utility model.Hereinafter retouch
Preferred embodiment in stating is only used as citing, it may occur to persons skilled in the art that other obvious modifications.Retouch following
The general principle of the present utility model defined in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang
Case and the other technologies scheme without departing from spirit and scope of the present utility model.
It will be understood by those skilled in the art that in exposure of the present utility model, term " longitudinal direction ", " horizontal ", " on ",
The orientation of the instruction such as D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outward " or position are closed
System is that, based on orientation shown in the drawings or position relationship, it is for only for ease of description the utility model and simplifies description, and not
Be indicate or imply indication device or element must have specific orientation, with specific azimuth configuration and operation, therefore on
Term is stated it is not intended that to restriction of the present utility model.
It is understood that term " " is interpreted as " at least one " or " one or more ", i.e., in one embodiment,
The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " " is no
It is understood that to be the restriction to quantity.
Fig. 1 of accompanying drawing is the schematic diagram of the camera module according to first preferred embodiment of the present utility model.Such as Fig. 1
It is shown, the camera module include an optical lens 10, a sensitive chip 20, a colour filter 30, a support 40, a wiring board 50,
A series of electronic components 60 and one group of binding element 70.
The optical lens 10 is arranged at the photosensitive path of the sensitive chip 20, so as to be used for collection in the camera module
During the image of object, the light being reflected by the object can be after the process by the optical lens 10 further by the photosensitive core
Piece 20 receives to be suitable for carrying out photoelectric conversion.
According to first preferred embodiment of the present utility model, the support 40 is set, to be used for the optical frames
10 and the colour filter 30 support is provided so that the optical lens 10 and the colour filter 30 can be stably held in default position
Put.More specifically, the support 40 includes one first supporter 41 and one second supporter 42.The optical lens 10 is arranged at this
First supporter 41, to be supported by first supporter 41.The colour filter 30 is supported by second supporter 42.
The electronic component 60 carries out the conducting that can be powered with the wiring board 50, so that the camera module has preset function.
The sensitive chip 20 carries out the conducting that can be powered with the wiring board 50, so that the sensitive chip 20 can play photoelectricity and turn
Change is acted on.
As shown in figure 1, the camera module further includes an at least gold thread 80, it be used to be powered and turns on the photosensitive core
Piece 20 and the wiring board 50.
As shown in figure 1, the binding element 70 includes at least one first tack coat 71 and at least one second tack coat 72.This
One tack coat 71 is arranged at the vicinity of the colour filter 30 such that it is able to prevent dirty dirt, for example, may move particle and be attached to the filter
The surface of color chips 30.That is, first tack coat 71 has the effect of the dirty dirt of bonding, when dirty dirt is passed through from it, this
One tack coat 71 can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to the surface of the colour filter 30, so as to anti-
Only dirty dirt produces impact to the colour filter 30, and then prevents occurring stain imaging inside the camera module.
Specifically, first tack coat 71 has viscosity, and it can adhere to dirty dirt, so as to bond to dirty dirt.More
Body ground, the material of first tack coat 71 is selected from hot-setting adhesive and from dry glue.
Thermosetting glue forms hot-setting adhesive by Baking out solidify afterwards, and it still has viscosity after being cured, and can adhere to dirt
Dirt, for example, may move particle.It is noted that hot-setting adhesive also has the effect for stopping veiling glare, so as to improve the camera module
Performance.
The glue formed after natural drying (solidification) type glue curing is referred to from dry glue.Spontaneously dry (solidification) type glue to be applied
Spontaneous curing is placed after cloth during Jing, surface still has viscosity after solidification, can adhere to dirty dirt, for example, may move particle.It is natural
What is formed after dry (solidification) type glue curing is opaque from dry glue, and it has the effect for stopping veiling glare, so as to improve the shooting
The performance of module.
As shown in figure 1, second supporter 42 of the support 40 has one first medial surface 4211, one second medial surface
4212nd, one the 3rd medial surface 4213, an inner top surface 4214 and an inner bottom surface 4215.First medial surface 4211, second inner side
Face 4212, the 3rd medial surface 4213, the inner top surface 4214 and the inner bottom surface 4215 are interconnected to form second supporter 42
Inner face 421.Second supporter 42 has a receiving space 420.First medial surface 4211, second medial surface 4212,
3rd medial surface 4213, the inner top surface 4214 and the inner bottom surface 4215 are arranged at around the receiving space 420.The colour filter
Piece 30 and the sensitive chip 20 are arranged in the receiving space 420.First tack coat 71 is arranged at second support
The inner face 421 of body 42, to be conducive to keeping the cleaning of the environment in second supporter 42, and then ensures the He of colour filter 30
The cleaning of the sensitive chip 20.
More specifically, according to first preferred embodiment of the present utility model, first tack coat 71 is uniformly arranged
In first medial surface 4211 of second supporter 42.The colour filter 30 is arranged at first tack coat 71.That is,
First tack coat 71 is arranged between second supporter 42 and the colour filter 30.It is noted that due to this first
Tack coat 71 has viscosity, and first tack coat 71 not only can play a part of the dirty dirt of bonding, and may also operate as fixing
With the effect for connecting second supporter 42 and the colour filter 30.More specifically, due to hot-setting adhesive and can be from liquid from dry glue
State is converted into solid-state, Gu the shape of first tack coat 71 can be sent out according to the shape of second supporter 42 and the colour filter 30
Raw to change, so first tack coat 71 is effectively filled with the gap between second supporter 42 and the colour filter 30, so as to
Prevent dirt from entering between second supporter 42 and the colour filter 30, and then avoid the performance that these dirts bring bad hidden
Suffer from.It is noted that first tack coat 71 is arranged at the outside of the colour filter 30, when dirty dirt, from the camera module
In the way that outside simultaneously and then to the colour filter 30 is spread into the inside of the camera module, acted on by first tack coat 71
And bondd by first tack coat 71 before it reaches the colour filter 30, so as to ensure the cleannes of the colour filter 30.
More specifically, the colour filter 30 has a top surface 31 and a basal surface 32.First tack coat 71 includes one the
One exposed surface 711.First exposed surface 711 is exposed in surrounding environment in the vicinity of the top surface 31 of the colour filter 30, from
And the dirt of its surrounding environment that can bond, so as to keep the cleaning of the top surface 31 of the colour filter 30.It is noted that
First exposed surface 711 has the effect of bonding.In other words, first exposed surface 711 has viscosity such that it is able to is bonded to and reaches
Its dirt.
As shown in figure 1, second tack coat 72 is arranged at the sensitive chip 20 and the basal surface of the colour filter 30
32 vicinity such that it is able to prevent dirty dirt, for example, may move surface and the colour filter that particle is attached to the sensitive chip 20
30 basal surface 32.That is, second tack coat 72 has the effect of the dirty dirt of bonding, and when dirty dirt is passed through from it, should
Second tack coat 72 can by the dirty dirt bonding passed through from it, so as to prevent dirty dirt move to the sensitive chip 20 surface and
The basal surface 32 of the colour filter 30, so as to prevent dirty dirt from producing impact to the sensitive chip 20 and the colour filter 30, and then
Prevent the camera module from stain and bad point occur.
Specifically, second tack coat 72 has viscosity, and it can adhere to dirty dirt, so as to bond to dirty dirt.More
Body ground, second tack coat 72 is embodied as jelly or glued membrane.
According to first preferred embodiment of the present utility model, the sensitive chip 20 is arranged at the wiring board 50.Should
Electronic component 60 is arranged at the wiring board 50 and in the vicinity of the sensitive chip 20.Second tack coat 72 is capped on this
Electronic component 60 to the electronic component 60 so as to protecting.It is noted that being arranged at the electronics unit of PCB surface
Part is typically where the easy aggregation of dirty dirt.And the connection that often can be powered to it of dirty dirt is impacted, so as to affect the shooting
The circuit of module, and and then affect the service life of whole camera module.Second tack coat 72 is capped on the electronic component
60 and the electronic component 60 is fixed on into the wiring board 50.The surrounding environment of 72 pairs of electronic components 60 of the second tack coat is carried out
Sealing, so as to prevent dirty dirt from entering the gap between the electronic component 60 and the wiring board 50, and then prevents it from affecting the shooting
The service life of the circuit of module and the camera module.
In addition, second tack coat 72 is arranged at the attached of the sensitive chip 20 and the basal surface 32 of the colour filter 30
Closely such that it is able to the dirty dirt near the basal surface 32 of the bond sensitive chip 20 and the colour filter 30, so as to contributing to protecting
The cleannes of the sensitive chip 20 and the basal surface 32 of the colour filter 30 are held, and then ensures the normal work of the camera module
Make.More specifically, second tack coat 72 is arranged at the periphery of the sensitive chip 20.Glue because second tack coat 72 has
Property, second glue through this when dirty dirt is entered in the camera module from the outside of the camera module and moved to the sensitive chip 20
Knot layer 72 is simultaneously bondd by second tack coat 72, so as to prevent it from reaching the sensitive chip 20, so as to ensure the photosensitive core
The cleannes of piece 20, so that the sensitive chip 20 can preferably work, and then improve the quality of the camera module.
According to first preferred embodiment of the present utility model, the top surface 31 includes an edge top surface 311.The colour filter
Piece 30 is supported on the inner top surface 4214 of second supporter 42.As shown in figure 1, the edge top surface 311 is in this second
The top of the inner top surface 4214 of support body 42.
Fig. 2 illustrates first of the camera module according to above-mentioned first preferred embodiment of the present utility model and can replace
Change embodiment.One optical lens 10, a sensitive chip 20, are included according to a camera module of first alternative embodiment
Colour filter 30, a support 40, a wiring board 50, a series of electronic components 60 and one group of binding element 70A.This group of binding element
70A includes one first tack coat 71A and at least one second tack coat 72.The support 40 includes one first supporter 41 and one second
Supporter 42 second supporter 42 have one first medial surface 4211, one second medial surface 4212, one the 3rd medial surface 4213,
One inner top surface 4214 and an inner bottom surface 4215.From unlike above-mentioned first preferred embodiment, 71A is equal for first tack coat
It is even to be arranged at first medial surface 4211 and the inner top surface 4214.More specifically, the first tack coat 71A is by uniformly, continuously
First medial surface 4211 and the inner top surface 4214 are arranged at, so as to be more firmly fixed to the colour filter 30.The filter
Color chips 30 has a top surface 31 and a basal surface 32.
As shown in Fig. 2 first tack coat 71A has one first exposed surface 711 and one second exposed surface 712A.More specifically
Ground, first tack coat 71A for being arranged at first medial surface 4211 has first exposed surface 711.It is arranged at this interior
First tack coat 71A of top surface 4214 has second exposed surface 712A.It is noted that the He of the first exposed surface 711
Second exposed surface 712A is respectively provided with the effect of bonding.In other words, first exposed surface 711 and second exposed surface 712A have
Toughness such that it is able to be bonded to the dirt up to it.
First exposed surface 711 is exposed in surrounding environment in the vicinity of the top surface 31 of the colour filter 30, so as to
The dirt of its surrounding environment that can bond, so as to keep the cleaning of the top surface 31 of the colour filter 30.
The second exposed surface 712A is exposed in surrounding environment in the vicinity of the basal surface 32 of the colour filter 30, so as to
The dirt of its surrounding environment that can bond, so as to keep the cleaning of the basal surface 32 of the colour filter 30.It is noted that should
Second exposed surface 712A is also exposed to the vicinity of the sensitive chip 20, so the setting of second exposed surface 712A is simultaneously favourable
In the cleaning for keeping the sensitive chip 20.
Fig. 3 illustrates second of the camera module according to above-mentioned first preferred embodiment of the present utility model and can replace
Change embodiment.One optical lens 10, a sensitive chip 20, are included according to a camera module of second alternative embodiment
Colour filter 30, a support 40, a wiring board 50, a series of electronic components 60 and one group of binding element 70B.This group of binding element
70B includes one first tack coat 71B and at least one second tack coat 72.The support 40 includes one first supporter 41 and one second
Supporter 42 second supporter 42 have one first medial surface 4211, one second medial surface 4212, one the 3rd medial surface 4213,
One inner top surface 4214 and an inner bottom surface 4215.The colour filter 30 has a top surface 31 and a basal surface 32.
Light Jing needs not move through the edge top surface 311 when the colour filter 30 is filtered.
According to the alternative embodiment of first preferred embodiment of the present utility model, the colour filter 30 is supported on
The inner top surface 4214 of second supporter 42.From unlike above-mentioned first preferred embodiment, the first tack coat 71B quilts
It is uniformly arranged on the edge top surface 311, first medial surface 4211 of the second supporter 42, second support of the colour filter 30
The inner top surface 4214 of body 42 and second medial surface 4212 of second supporter 42.More specifically, first tack coat 71B
By it is uniform, be continuously provided the edge top surface 311 in the colour filter 30, first medial surface 4211 of the second supporter 42,
The inner top surface 4214 of second supporter 42 and second medial surface 4212 of second supporter 42.
As shown in figure 3, first tack coat 71B has one first exposed surface 711B and one second exposed surface 712B.More
Body ground, first tack coat 71B for being arranged at first medial surface 4211 has first exposed surface 711B.It is arranged at this
First tack coat 71B of inner top surface 4214 has second exposed surface 712B.It is noted that first exposed surface 711B
With the effect that second exposed surface 712B is respectively provided with bonding.In other words, the first exposed surface 711B and second exposed surface 712B
It is respectively provided with viscosity such that it is able to be bonded to the dirt up to it.
The first exposed surface 711B is exposed in surrounding environment in the vicinity of the top surface 31 of the colour filter 30, so as to
The dirt of its surrounding environment that can bond, so as to keep the cleaning of the top surface 31 of the colour filter 30.
The second exposed surface 712B is exposed in surrounding environment in the vicinity of the basal surface 32 of the colour filter 30, so as to
The dirt of its surrounding environment that can bond, so as to keep the cleaning of the basal surface 32 of the colour filter 30.It is noted that should
Second exposed surface 712B is also exposed to the vicinity of the sensitive chip 20, so the setting of second exposed surface 712B is simultaneously favourable
In the cleaning for keeping the sensitive chip 20.
It is noted that the first exposed surface 711B is replaceable relative to first preferred embodiment and its first
First exposed surface 711 of embodiment has bigger surface area and the colour filter 30 is more firmly connected, its company
Connect effect and cementation is higher.Second exposed surfaces 712 of the second exposed surface 712B relative to first preferred embodiment
And bigger surface area is had according to the second exposed surface 712A of its first alternative embodiment, it is higher that it connects cementation.
Fig. 4 of accompanying drawing is the schematic diagram of the camera module according to second preferred embodiment of the present utility model.Such as Fig. 4
Shown, the camera module includes an optical lens 10C, a sensitive chip 20C, a colour filter 30C, a support 40C, a wiring board
50C, a series of electronic component 60C, an an one group of binding element 70C, at least gold thread 80C and motor 90C.Gold thread 80C is set
Put, to be used for the conducting sensitive chip 20C and wiring board 50C that can be powered.
Optical lens 10C is arranged at the photosensitive path of sensitive chip 20C, so as to be used to adopt in the camera module
During the image of collection object, the light being reflected by the object further can be felt by this after the process by optical lens 10C
Optical chip 20C receives to be suitable for carrying out photoelectric conversion.
According to second preferred embodiment of the present utility model, support 40C is set, to be used for the colour filter
30C provides support, so that colour filter 30C can be stably held in predeterminated position.Optical lens 10C is arranged at this
Motor 90C, to be supported and can be adjusted to optical lens 10C by motor 90C by motor 90C.The electronics unit
Part 60C and wiring board 50C carries out the conducting that can be powered, so that the camera module has preset function.Sensitive chip 20C with should
Wiring board 50C carries out the conducting that can be powered, so that sensitive chip 20C can play photoelectric conversion effect.
As shown in figure 4, binding element 70C includes one first tack coat 71C and at least one second tack coat 72C.This
One tack coat 71C is arranged at the vicinity of colour filter 30C such that it is able to prevent dirty dirt, for example, may move particle and be attached to this
The surface of colour filter 30C.That is, first tack coat 71C has the effect of the dirty dirt of bonding, when dirty dirt is passed through from it,
First tack coat 71C can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to the surface of colour filter 30C,
So as to prevent dirty dirt from producing impact to colour filter 30C, and then prevent occurring stain imaging inside the camera module.
Specifically, first tack coat 71C has sticking gluey coating, and it can adhere to dirty dirt, so as to enter to dirty dirt
Row bonding.More specifically, the material of first tack coat 71C is UV type glue.
UV types glue forms solid-state glue by uv-exposure solidify afterwards, and it still has viscosity after being cured, and can adhere to dirt
Dirt, for example, may move particle.It is noted that UV types glue also has the effect for stopping veiling glare, so as to improve the camera module
Performance.
As shown in figure 4, the support 40C of support 40C has one first medial surface 4211C, one second medial surface
4212C, one the 3rd medial surface 4213C, an an inner top surface 4214C and inner bottom surface 4215C.First medial surface 4211C, this second
Medial surface 4212C, the 3rd medial surface 4213C, inner top surface 4214C and inner bottom surface 4215C are interconnected to form the support
The inner face 421C of 40C.Support 40C has receiving space 420C.First medial surface 4211C, second medial surface
4212C, the 3rd medial surface 4213C, inner top surface 4214C and inner bottom surface 4215C are arranged at receiving space 420C
Around.Colour filter 30C and sensitive chip 20C are arranged in receiving space 420C.The first tack coat 71C is set
The inner face 421C of support 40C is placed in, to be conducive to keeping the cleaning of the environment in support 40C, and then the colour filter is ensured
The cleaning of piece 30C and sensitive chip 20C.
More specifically, according to second preferred embodiment of the present utility model, the first tack coat 71C is uniformly arranged
In the inner bottom surface 4215C of support 40C.Colour filter 30C is arranged at first tack coat 71C.That is, this first
Tack coat 71C is arranged between support 40C and colour filter 30C.It is noted that due to first tack coat 71C
With viscosity, first tack coat 71C not only can play a part of the dirty dirt of bonding, and may also operate as fixing and connecting being somebody's turn to do
The effect of support 40C and colour filter 30C.According to second preferred embodiment of the present utility model, colour filter 30C is fallen
Loaded on support 40C.
More specifically, because UV types glue can be converted into solid-state from liquid, therefore the shape of first tack coat 71C can be with root
Change according to the shape of support 40C and colour filter 30C, so first tack coat 71C is effectively filled with support 40C
And the gap between colour filter 30C, so as to prevent dirt from entering between support 40C and colour filter 30C, and then avoid this
The performance bad hidden danger that a little dirts bring.It is noted that first tack coat 71C is arranged at the outer of colour filter 30C
Side.In the way that dirty dirt enters the inside of the camera module and further spread to colour filter 30C from the outside of the camera module, receive
Bondd by first tack coat 71C before it reaches colour filter 30C to the effect of first tack coat 71C, so as to
The cleannes of colour filter 30C are ensured.
More specifically, colour filter 30C has an a top surface 31C and basal surface 32C.First tack coat 71C includes
One first exposed surface 711C.First exposed surface 711C rings around the vicinity of the top surface 31C of colour filter 30C is exposed to
In border such that it is able to the dirt of its surrounding environment that bonds, so as to keep the cleaning of the top surface 31C of colour filter 30C.It is worth
One is mentioned that, first exposed surface 711C has the effect of bonding.In other words, first exposed surface 711C has viscosity, so as to
The dirt up to it can be bonded to.
As shown in figure 4, second tack coat 72C is arranged at the bottom table of sensitive chip 20C and colour filter 30C
The vicinity of face 32C such that it is able to prevent dirty dirt, for example, may move surface and the filter that particle is attached to sensitive chip 20C
The basal surface 32C of color chips 30C.That is, second tack coat 72C has the effect of the dirty dirt of bonding, when dirty dirt is from its Jing
Out-of-date, second tack coat 72C can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to sensitive chip 20C
Surface and colour filter 30C basal surface 32C, so as to prevent dirty dirt to sensitive chip 20C and colour filter 30C
Impact is produced, and then prevents the camera module from stain and bad point occur.
Specifically, second tack coat 72C has viscosity, and it can adhere to dirty dirt, so as to bond to dirty dirt.More
Body ground, second tack coat 72C is embodied as jelly or glued membrane.
According to second preferred embodiment of the present utility model, sensitive chip 20C is arranged at wiring board 50C.
Electronic component 60C is arranged at wiring board 50C and in the vicinity of sensitive chip 20C.It is noted that the gold thread
Easily assemble dirty dirt in the junction of 80C and wiring board 50C.And the connection that often can be powered to it of dirty dirt is impacted, so as to
Affect be powered to the conducting of sensitive chip 20C and the circuit connection of the camera module, and and then the whole camera module of impact
Service life.As shown in figure 4, gold thread 80C has a wiring board connection end 81C.Second tack coat 72C is capped on this
Gold thread 80C is simultaneously fixed on wiring board 50C by the wiring board connection end 81C of gold thread 80C.Second tack coat 72C is to this
The surrounding environment of the wiring board connection end 81C of gold thread 80C is sealed, so as to prevent dirty dirt from entering the line of gold thread 80C
Gap between road plate connection end 81C and wiring board 50C, and then prevent it from affecting the circuit of the camera module and the shooting
The service life of module.
In addition, second tack coat 72C is arranged at the basal surface 32C of sensitive chip 20C and colour filter 30C
Vicinity such that it is able to the dirty dirt near the basal surface 32C of sensitive chip 20C and colour filter 30C that bonds, so as to have
Help the cleannes of the basal surface 32C of holding sensitive chip 20C and colour filter 30C, and then ensure the camera module
Normal work.More specifically, second tack coat 72C is arranged at the periphery of sensitive chip 20C.Due to second bonding
Layer 72C has viscosity, when dirty dirt is entered in the camera module from the outside of the camera module and moved to sensitive chip 20C
Bond through the second tack coat 72C and by second tack coat 72C, so as to prevent it from reaching sensitive chip 20C, so as to
The cleannes of sensitive chip 20C have been ensured, so that sensitive chip 20C can preferably work, and then the shooting has been improved
The quality of module.
According to second preferred embodiment of the present utility model, top surface 31C includes an edge top surface 311C.The filter
Color chips 30C is arranged at the inner bottom surface 4215C of support 40C.As shown in figure 4, edge top surface 311C is in support 40C
Inner bottom surface 4215C lower section.It is noted that the marginal portion of the colour filter 30C residing for edge top surface 311C
Setting colour filter 30C is stably connected with and is supported, its need not have filter effect.The first tack coat 71C quilts
It is arranged at the filter effect that edge top surface 311C does not interfere with colour filter 30C yet.Conversely, first tack coat 71C has
Stop the effect of veiling glare, so as to improve the performance of the camera module.
Fig. 5 of accompanying drawing is first of the camera module according to second preferred embodiment of the present utility model replaceable
Embodiment schematic diagram.As shown in figure 5, the camera module include an optical lens 10C, a sensitive chip 20C, a colour filter 30C,
One support 40C, a wiring board 50C, a series of electronic component 60C, at least one group of binding element 70D, a gold thread 80C and a motor
90C.Gold thread 80C is set, to be used for the conducting sensitive chip 20C and wiring board 50C that can be powered.
Optical lens 10C is arranged at the photosensitive path of sensitive chip 20C, so as to be used to adopt in the camera module
During the image of collection object, the light being reflected by the object further can be felt by this after the process by optical lens 10C
Optical chip 20C receives to be suitable for carrying out photoelectric conversion.
Support 40C is set, be used to provide support to colour filter 30C, so that colour filter 30C can be by
Stably it is held in predeterminated position.Optical lens 10C is arranged at motor 90C, to be supported and can be passed through by motor 90C
Motor 90C is adjusted to optical lens 10C.Electronic component 60C and wiring board 50C carries out the conducting that can be powered, with
Make the camera module that there is preset function.Sensitive chip 20C and wiring board 50C carries out the conducting that can be powered, so that this is photosensitive
Chip 20C can play photoelectric conversion effect.
As shown in figure 5, binding element 70D includes one first tack coat 71D and at least one second tack coat 72C.This
One tack coat 71D is arranged at the vicinity of colour filter 30C such that it is able to prevent dirty dirt, for example, may move particle and be attached to this
The surface of colour filter 30C.That is, first tack coat 71D has the effect of the dirty dirt of bonding, when dirty dirt is passed through from it,
First tack coat 71D can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to the surface of colour filter 30C,
So as to prevent dirty dirt from producing impact to colour filter 30C, and then prevent occurring stain imaging inside the camera module.
As shown in figure 5, the support 40C of support 40C have one first medial surface 421C, one second medial surface 422C,
One the 3rd medial surface 423C, an inner top surface 424C and an inner bottom surface 425C.First medial surface 421C, second medial surface
422C, the 3rd medial surface 423C, inner top surface 424C and inner bottom surface 425C are interconnected to form the inner face of support 40C
421C.Support 40C has receiving space 420C.First medial surface 421C, second medial surface 422C, the 3rd inner side
Face 423C, inner top surface 424C and inner bottom surface 425C are arranged at around receiving space 420C.Colour filter 30C and should
Sensitive chip 20C is arranged in receiving space 420C.First tack coat 71D be arranged at support 40C this is interior
Face 421C, to be conducive to keeping the cleaning of the environment in support 40C, and then ensures colour filter 30C and sensitive chip 20C
Cleaning.
From unlike second preferred embodiment of the present utility model, according to second preferred embodiment this
One alternative embodiments, the first tack coat 71D is uniformly arranged on the inner bottom surface 425C and the 3rd of support 40C
Medial surface 423C.Colour filter 30C is arranged at first tack coat 71D.It is noted that due to first tack coat
71D has viscosity, and first tack coat 71D not only can play a part of the dirty dirt of bonding, and may also operate as fixed and connect
Connect the effect of support 40C and colour filter 30C.Can according to this first of second preferred embodiment of the present utility model
Embodiment is replaced, colour filter 30C is by upside-down mounting in support 40C.
More specifically, colour filter 30C has an a top surface 31C and basal surface 32C.First tack coat 71D includes
One first exposed surface 711D and one second exposed surface 712D.Top surface 31Cs of the first exposed surface 711D in colour filter 30C
Vicinity be exposed in surrounding environment such that it is able to the dirt of its surrounding environment that bonds, so as to keep the top of colour filter 30C
The cleaning of surface 31C.The second exposed surface 712D is exposed to surrounding environment in the vicinity of the basal surface 32C of colour filter 30C
In such that it is able to the dirt of its surrounding environment that bonds, so as to keep the cleaning of the basal surface 32C of colour filter 30C.It is worth one
It is mentioned that, the first exposed surface 711D and second exposed surface 712D have viscosity such that it is able to be bonded to the dirt up to it.
It is noted that second exposed surface 712D is also exposed to sensitive chip 20C's and electronic component 60C
Near, so arranging for second exposed surface 712D is conducive to keeping that sensitive chip 20C's and electronic component 60C is clear simultaneously
It is clean.
Fig. 6 of accompanying drawing is second of the camera module according to second preferred embodiment of the present utility model replaceable
Embodiment schematic diagram.As shown in fig. 6, the camera module include an optical lens 10C, a sensitive chip 20C, a colour filter 30C,
One support 40C, a wiring board 50C, a series of electronic component 60C, at least one group of binding element 70E, a gold thread 80C and a motor
90C.Gold thread 80C is set, to be used for the conducting sensitive chip 20C and wiring board 50C that can be powered.
Optical lens 10C is arranged at the photosensitive path of sensitive chip 20C, so as to be used to adopt in the camera module
During the image of collection object, the light being reflected by the object further can be felt by this after the process by optical lens 10C
Optical chip 20C receives to be suitable for carrying out photoelectric conversion.
Support 40C is set, be used to provide support to colour filter 30C, so that colour filter 30C can be by
Stably it is held in predeterminated position.Optical lens 10C is arranged at motor 90C, to be supported and can be passed through by motor 90C
Motor 90C is adjusted to optical lens 10C.Electronic component 60C and wiring board 50C carries out the conducting that can be powered, with
Make the camera module that there is preset function.Sensitive chip 20C and wiring board 50C carries out the conducting that can be powered, so that this is photosensitive
Chip 20C can play photoelectric conversion effect.
As shown in fig. 6, binding element 70E includes one first tack coat 71E and at least one second tack coat 72C.This
One tack coat 71E is arranged at the vicinity of colour filter 30C such that it is able to prevent dirty dirt, for example, may move particle and be attached to this
The surface of colour filter 30C.That is, first tack coat 71E has the effect of the dirty dirt of bonding, when dirty dirt is passed through from it,
First tack coat 71E can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to the surface of colour filter 30C,
So as to prevent dirty dirt from producing impact to colour filter 30C, and then prevent occurring stain imaging inside the camera module.
As shown in fig. 6, the support 40C of support 40C have one first medial surface 421C, one second medial surface 422C,
One the 3rd medial surface 423C, an inner top surface 424C and an inner bottom surface 425C.First medial surface 421C, second medial surface
422C, the 3rd medial surface 423C, inner top surface 424C and inner bottom surface 425C are interconnected to form the inner face of support 40C
421C.Support 40C has receiving space 420C.First medial surface 421C, second medial surface 422C, the 3rd inner side
Face 423C, inner top surface 424C and inner bottom surface 425C are arranged at around receiving space 420C.Colour filter 30C and should
Sensitive chip 20C is arranged in receiving space 420C.First tack coat 71E be arranged at support 40C this is interior
Face 421C, to be conducive to keeping the cleaning of the environment in support 40C, and then ensures colour filter 30C and sensitive chip 20C
Cleaning.
From unlike second preferred embodiment of the present utility model, according to second preferred embodiment this
Two alternative embodiments, the first tack coat 71E is uniformly arranged on first medial surface 421C of support 40C, is somebody's turn to do
Second medial surface 422C, inner bottom surface 425C and the 3rd medial surface 423C.Colour filter 30C is arranged at support 40C's
Inner top surface 424C.It is noted that because first tack coat 71E has viscosity, first tack coat 71E not only can
Play a part of the dirty dirt of bonding, and may also operate as fixing and connecting the effect of support 40C and colour filter 30C.
More specifically, colour filter 30C has an a top surface 31C and basal surface 32C.First tack coat 71E includes
One first exposed surface 711E and one second exposed surface 712E.Top surface 31Cs of the first exposed surface 711E in colour filter 30C
Vicinity be exposed in surrounding environment such that it is able to the dirt of its surrounding environment that bonds, so as to keep the top of colour filter 30C
The cleaning of surface 31C.The second exposed surface 712E is exposed to surrounding environment in the vicinity of the basal surface 32C of colour filter 30C
In such that it is able to the dirt of its surrounding environment that bonds, so as to keep the cleaning of the basal surface 32C of colour filter 30C.It is worth one
It is mentioned that, the first exposed surface 711E and second exposed surface 712E have viscosity such that it is able to be bonded to the dirt up to it.
It is noted that second exposed surface 712E is also exposed to sensitive chip 20C's and electronic component 60C
Near, so arranging for second exposed surface 712E is conducive to keeping that sensitive chip 20C's and electronic component 60C is clear simultaneously
It is clean.
Fig. 7 of accompanying drawing is the schematic diagram of the camera module according to the 3rd preferred embodiment of the present utility model.Such as Fig. 7
Shown, the camera module includes an optical lens 10F, a sensitive chip 20F, a colour filter 30F, a support 40F, a wiring board
50F, a series of electronic component 60F, an an one group of binding element 70F, at least gold thread 80F and motor 90F.Gold thread 80F is set
Put, to be used for the conducting sensitive chip 20F and wiring board 50F that can be powered.
Optical lens 10F is arranged at the photosensitive path of sensitive chip 20F, so as to be used to adopt in the camera module
During the image of collection object, the light being reflected by the object further can be felt by this after the process by optical lens 10F
Optical chip 20F receives to be suitable for carrying out photoelectric conversion.
According to the 3rd preferred embodiment of the present utility model, support 40F is set, to be used for the colour filter
30F provides support, so that colour filter 30F can be stably held in predeterminated position.Optical lens 10F is arranged at this
Motor 90F, to be supported and can be adjusted to optical lens 10F by motor 90F by motor 90F.The electronics unit
Part 60F and wiring board 50F carries out the conducting that can be powered, so that the camera module has preset function.Sensitive chip 20F with should
Wiring board 50F carries out the conducting that can be powered, so that sensitive chip 20F can play photoelectric conversion effect.
As shown in fig. 7, binding element 70F includes one first tack coat 71F and at least one second tack coat 72F.This
One tack coat 71F is arranged at the vicinity of colour filter 30F such that it is able to prevent dirty dirt, for example, may move particle and be attached to this
The surface of colour filter 30F.That is, first tack coat 71F has the effect of the dirty dirt of bonding, when dirty dirt is passed through from it,
First tack coat 71F can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to the surface of colour filter 30F,
So as to prevent dirty dirt from producing impact to colour filter 30F, and then prevent occurring stain imaging inside the camera module.
Specifically, first tack coat 71F has sticking gluey coating, and it can adhere to dirty dirt, so as to enter to dirty dirt
Row bonding.More specifically, the material of first tack coat 71F is selected from hot-setting adhesive and from dry glue and UV type glue.
Thermosetting glue forms hot-setting adhesive by Baking out solidify afterwards, and it still has viscosity after being cured, and can adhere to dirt
Dirt, for example, may move particle.It is noted that hot-setting adhesive also has the effect for stopping veiling glare, so as to improve the camera module
Performance.
The glue formed after natural drying (solidification) type glue curing is referred to from dry glue.Spontaneously dry (solidification) type glue to be applied
Spontaneous curing is placed after cloth during Jing, surface still has viscosity after solidification, can adhere to dirty dirt, for example, may move particle.It is natural
What is formed after dry (solidification) type glue curing is opaque from dry glue, and it has the effect for stopping veiling glare, so as to improve the shooting
The performance of module.
UV types glue forms solid-state glue by uv-exposure solidify afterwards, and it still has viscosity after being cured, and can adhere to dirt
Dirt, for example, may move particle.It is noted that UV types glue also has the effect for stopping veiling glare, so as to improve the camera module
Performance.
As shown in fig. 7, the support 40F of support 40F has one first medial surface 4211F, one second medial surface
4212F, one the 3rd medial surface 4213F, an an inner top surface 4214F and inner bottom surface 4215F.First medial surface 4211F, this second
Medial surface 4212F, the 3rd medial surface 4213F, inner top surface 4214F and inner bottom surface 4215F are interconnected to form the support
The inner face 421F of 40F.Support 40F has receiving space 420F.First medial surface 4211F, second medial surface
4212F, the 3rd medial surface 4213F, inner top surface 4214F and inner bottom surface 4215F are arranged at receiving space 420F
Around.Colour filter 30F and sensitive chip 20F are arranged in receiving space 420F.
More specifically, colour filter 30F has an a top surface 31F and basal surface 32F.According to it is of the present utility model this
Three preferred embodiments, top surface 31F includes an edge top surface 311F.Colour filter 30F is supported on being somebody's turn to do for support 40F
Inner top surface 4214F.As shown in fig. 7, tops of the edge top surface 311F in the inner top surface 4214F of support 40F.This first
Tack coat 71F by it is uniform, be continuously arranged at the edge top surface 311F of colour filter 30F and support 40F this in first
Side 4211F.It is noted that first tack coat 71F is arranged at the outside of colour filter 30F, when dirty dirt, take the photograph from this
As in the way that the outside of module enters the inside of the camera module and further spreads to colour filter 30F, by first bonding
Layer 71F effect and bondd by first tack coat 71F before it reaches colour filter 30F, so as to ensure the colour filter
The cleannes of piece 30F.
First tack coat 71F includes one first exposed surface 711F.The first exposed surface 711F being somebody's turn to do in colour filter 30F
The vicinity of top surface 31F is exposed in surrounding environment such that it is able to the dirt of its surrounding environment that bonds, so as to keep the colour filter
The cleaning of the top surface 31F of 30F.It is noted that first exposed surface 711F has the effect of bonding.In other words, should
First exposed surface 711F has viscosity such that it is able to be bonded to the dirt up to it.
As shown in fig. 7, second tack coat 72F is arranged at the bottom table of sensitive chip 20F and colour filter 30F
The vicinity of face 32F such that it is able to prevent dirty dirt, for example, may move surface and the filter that particle is attached to sensitive chip 20F
The basal surface 32F of color chips 30F.That is, second tack coat 72F has the effect of the dirty dirt of bonding, when dirty dirt is from its Jing
Out-of-date, second tack coat 72F can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to sensitive chip 20F
Surface and colour filter 30F basal surface 32F, so as to prevent dirty dirt to sensitive chip 20F and colour filter 30F
Impact is produced, and then prevents the camera module from stain and bad point occur.
Specifically, second tack coat 72F has viscosity, and it can adhere to dirty dirt, so as to bond to dirty dirt.More
Body ground, second tack coat 72F is embodied as jelly or glued membrane.
According to the 3rd preferred embodiment of the present utility model, sensitive chip 20F is arranged at wiring board 50F.
Electronic component 60F is arranged at wiring board 50F.Second tack coat 72F is arranged at the non-photo-sensing of sensitive chip 20F
Region (chip logic region).The cleaning of sensitive chip 20F can not only be kept, and its photoelectric conversion will not be produced not
Good impact.
In addition, second tack coat 72F is arranged at the basal surface 32F of sensitive chip 20F and colour filter 30F
Vicinity such that it is able to the dirty dirt near the basal surface 32F of sensitive chip 20F and colour filter 30F that bonds, so as to have
Help the cleannes of the basal surface 32F of holding sensitive chip 20F and colour filter 30F, and then ensure the camera module
Normal work.More specifically, second tack coat 72F is arranged at the periphery of sensitive chip 20F.Due to second bonding
Layer 72F has viscosity, when dirty dirt is entered in the camera module from the outside of the camera module and moved to sensitive chip 20F
Bond through the second tack coat 72F and by second tack coat 72F, so as to prevent it from reaching sensitive chip 20F, so as to
The cleannes of sensitive chip 20F have been ensured, so that sensitive chip 20F can preferably work, and then the shooting has been improved
The quality of module.
Fig. 8 of accompanying drawing is a replaceable enforcement of the camera module according to the 3rd preferred embodiment of the present utility model
Illustrate and be intended to.As shown in figure 8, the camera module include an optical lens 10F, a sensitive chip 20F, a colour filter 30F, one
Frame 40F, a wiring board 50F, a series of electronic component 60F, an an one group of binding element 70G, at least gold thread 80F and motor 90F.
Gold thread 80F is set, to be used for the conducting sensitive chip 20F and wiring board 50F that can be powered.
Optical lens 10F is arranged at the photosensitive path of sensitive chip 20F, so as to be used to adopt in the camera module
During the image of collection object, the light being reflected by the object further can be felt by this after the process by optical lens 10F
Optical chip 20F receives to be suitable for carrying out photoelectric conversion.
Support 40F is set, be used to provide support to colour filter 30F, so that colour filter 30F can be by
Stably it is held in predeterminated position.Optical lens 10F is arranged at motor 90F, to be supported and can be passed through by motor 90F
Motor 90F is adjusted to optical lens 10F.Electronic component 60F and wiring board 50F carries out the conducting that can be powered, with
Make the camera module that there is preset function.Sensitive chip 20F and wiring board 50F carries out the conducting that can be powered, so that this is photosensitive
Chip 20F can play photoelectric conversion effect.
As shown in figure 8, binding element 70G includes one first tack coat 71G and at least one second tack coat 72F.This
One tack coat 71G is arranged at the vicinity of colour filter 30F such that it is able to prevent dirty dirt, for example, may move particle and be attached to this
The surface of colour filter 30F.That is, first tack coat 71G has the effect of the dirty dirt of bonding, when dirty dirt is passed through from it,
First tack coat 71G can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to the surface of colour filter 30F,
So as to prevent dirty dirt from producing impact to colour filter 30F, and then prevent occurring stain imaging inside the camera module.
As shown in figure 8, the support 40F of support 40F have one first medial surface 421F, one second medial surface 422F,
One the 3rd medial surface 423F, an inner top surface 424F and an inner bottom surface 425F.First medial surface 421F, second medial surface
422F, the 3rd medial surface 423F, inner top surface 424F and inner bottom surface 425F are interconnected to form the inner face of support 40F
421F.Support 40F has receiving space 420F.First medial surface 421F, second medial surface 422F, the 3rd inner side
Face 423F, inner top surface 424F and inner bottom surface 425F are arranged at around receiving space 420F.Colour filter 30F and should
Sensitive chip 20F is arranged in receiving space 420F.Colour filter 30F is arranged at the inner top surface of support 40F
424F.Colour filter 30F has an a top surface 31F and basal surface 32F.Top surface 31F includes an edge top surface 311F.Should
Tops of the edge top surface 311F in the inner top surface 4214F of support 40F.
From unlike the 3rd preferred embodiment of the present utility model, this according to the 3rd preferred embodiment can
Embodiment is replaced, the first tack coat 71G is uniformly arranged on the edge top surface of the colour filter 30F of support 40F
311F.It is noted that because first tack coat 71G has viscosity, first tack coat 71G not only can play bonding
The effect of dirty dirt, and may also operate as fixing and connecting the effect of support 40F and colour filter 30F.It is noted that
The setting of the marginal portion of the colour filter 30F residing for edge top surface 311F enable colour filter 30F be stably connected with and
Support, its need not have filter effect.First tack coat 71F is arranged at edge top surface 311F and does not also interfere with the colour filter
The filter effect of piece 30F.
First tack coat 71G includes one first exposed surface 711G and one second exposed surface 712G.First exposed surface
711G is exposed in surrounding environment in the vicinity of the top surface 31F of colour filter 30F such that it is able to which bond its surrounding environment
Dirt, so as to keep the cleaning of the top surface 31F of colour filter 30F.The second exposed surface 712G being somebody's turn to do in colour filter 30F
The vicinity of basal surface 32F is exposed in surrounding environment such that it is able to the dirt of its surrounding environment that bonds, so as to keep the colour filter
The cleaning of the basal surface 32F of 30F.It is noted that the first exposed surface 711G and second exposed surface 712G has gluing
Property such that it is able to it is bonded to the dirt up to it.
It is noted that second exposed surface 712G is also exposed to sensitive chip 20F's and electronic component 60F
Near, so arranging for second exposed surface 712G is conducive to keeping that sensitive chip 20F's and electronic component 60F is clear simultaneously
It is clean.
Fig. 9 of accompanying drawing is the schematic diagram of the camera module according to the 4th preferred embodiment of the present utility model.Such as Fig. 9
Shown, the camera module includes an optical lens 10H, a sensitive chip 20H, a colour filter 30H, a support 40H, a wiring board
50H, a series of electronic component 60H, an an one group of binding element 70H, at least gold thread 80H and motor 90H.Gold thread 80H is set
Put, to be used for the conducting sensitive chip 20H and wiring board 50H that can be powered.
Optical lens 10H is arranged at the photosensitive path of sensitive chip 20H, so as to be used to adopt in the camera module
During the image of collection object, the light being reflected by the object further can be felt by this after the process by optical lens 10H
Optical chip 20H receives to be suitable for carrying out photoelectric conversion.
According to the 4th preferred embodiment of the present utility model, support 40H is set, to be used for the colour filter
30H provides support, so that colour filter 30H can be stably held in predeterminated position.Optical lens 10H is arranged at this
Motor 90H, to be supported and can be adjusted to optical lens 10H by motor 90H by motor 90H.The electronics unit
Part 60H and wiring board 50H carries out the conducting that can be powered, so that the camera module has preset function.Sensitive chip 20H with should
Wiring board 50H carries out the conducting that can be powered, so that sensitive chip 20H can play photoelectric conversion effect.
As shown in figure 9, binding element 70H includes one first tack coat 71H and at least one second tack coat 72H.This
One tack coat 71H is arranged at the vicinity of colour filter 30H such that it is able to prevent dirty dirt, for example, may move particle and be attached to this
The surface of colour filter 30H.That is, first tack coat 71H has the effect of the dirty dirt of bonding, when dirty dirt is passed through from it,
First tack coat 71H can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to the surface of colour filter 30H,
So as to prevent dirty dirt from producing impact to colour filter 30H, and then prevent occurring stain imaging inside the camera module.
Specifically, first tack coat 71H has sticking gluey coating, and it can adhere to dirty dirt, so as to enter to dirty dirt
Row bonding.More specifically, the material of first tack coat 71H is UV type glue.
UV types glue forms solid-state glue by uv-exposure solidify afterwards, and it still has viscosity after being cured, and can adhere to dirt
Dirt, for example, may move particle.It is noted that UV types glue also has the effect for stopping veiling glare, so as to improve the camera module
Performance.
As shown in figure 9, the support 40H of support 40H has one first medial surface 4211H, one second medial surface
4212H, one the 3rd medial surface 4213H, an an inner top surface 4214H and inner bottom surface 4215H.First medial surface 4211H, this second
Medial surface 4212H, the 3rd medial surface 4213H, inner top surface 4214H and inner bottom surface 4215H are interconnected to form the support
The inner face 421H of 40H.Support 40H has receiving space 420H.First medial surface 4211H, second medial surface
4212H, the 3rd medial surface 4213H, inner top surface 4214H and inner bottom surface 4215H are arranged at receiving space 420H
Around.Colour filter 30H and sensitive chip 20H are arranged in receiving space 420H.The first tack coat 71H is set
The inner face 421H of support 40H is placed in, to be conducive to keeping the cleaning of the environment in support 40H, and then the colour filter is ensured
The cleaning of piece 30H and sensitive chip 20H.
More specifically, colour filter 30H has an a top surface 31H and basal surface 32H.According to it is of the present utility model this
Four preferred embodiments, basal surface 32H includes an edge bottom surface 321H.Colour filter 30H is arranged at being somebody's turn to do for support 40H
Inner bottom surface 4215H.As shown in figure 9, lower sections of the edge bottom surface 321H in the inner bottom surface 4215H of support 40H.
According to the 4th preferred embodiment of the present utility model, the first tack coat 71H is uniformly arranged on the support
The edge bottom surface 321H of the 3rd medial surface 4213H and colour filter 30H of 40H.It is noted that due to this first glue
Knot layer 71H has viscosity, and first tack coat 71H not only can play a part of the dirty dirt of bonding, and may also operate as connection
The effect of support 40H and colour filter 30H.According to the 4th preferred embodiment of the present utility model, colour filter 30H quilts
Upside-down mounting is in support 40H.
More specifically, because UV types glue can be converted into solid-state from liquid, therefore the shape of first tack coat 71H can be with root
Change according to the shape of support 40H and colour filter 30H, so first tack coat 71H is effectively filled with support 40H
And the gap between colour filter 30H, so as to prevent dirt from entering between support 40H and colour filter 30H, and then avoid this
The performance bad hidden danger that a little dirts bring.It is noted that first tack coat 71H is arranged at the outer of colour filter 30H
Side, when dirty dirt, the inside of the camera module is entered and and then to the way of colour filter 30H diffusions from the outside of the camera module
In, bondd by first tack coat 71H before it reaches colour filter 30H by the effect of first tack coat 71H,
So as to ensure the cleannes of colour filter 30H.
First tack coat 71H includes one second exposed surface 712H.The second exposed surface 712H is attached colour filter 30H's
Closely it is exposed in surrounding environment such that it is able to the dirt of its surrounding environment that bonds, so as to keep the cleaning of colour filter 30H.Value
Obtain one to be mentioned that, second exposed surface 712H has the effect of bonding.In other words, second exposed surface 712H has viscosity, from
And the dirt up to it can be bonded to.
As shown in figure 9, second tack coat 72H is arranged at the bottom table of sensitive chip 20H and colour filter 30H
The vicinity of face 32H such that it is able to prevent dirty dirt, for example, may move surface and the filter that particle is attached to sensitive chip 20H
The basal surface 32H of color chips 30H.That is, second tack coat 72H has the effect of the dirty dirt of bonding, when dirty dirt is from its Jing
Out-of-date, second tack coat 72H can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to sensitive chip 20H
Surface and colour filter 30H basal surface 32H, so as to prevent dirty dirt to sensitive chip 20H and colour filter 30H
Impact is produced, and then prevents the camera module from stain and bad point occur.
Specifically, second tack coat 72H has viscosity, and it can adhere to dirty dirt, so as to bond to dirty dirt.More
Body ground, second tack coat 72H is embodied as jelly or glued membrane.
According to the 4th preferred embodiment of the present utility model, sensitive chip 20H is arranged at wiring board 50H.
Second tack coat 72H is covered in gold thread 80H so as to protect to gold thread 80H.It is noted that gold thread 80H
And its dirty dirt is easily assembled in junction.And the connection that often can be powered to it of dirty dirt is impacted, so as to affect the sensitive chip
The circuit connection of be powered to the conducting of 20H and the camera module, and and then affect the service life of whole camera module.As schemed
Shown in 9, second tack coat 72H is set, to cover gold thread 80H and gold thread 80H is fixed.Second tack coat
72H is protected to the surrounding environment of gold thread 80H, so as to prevent dirty dirt from reaching gold thread 80H, and then prevents it from affecting this to take the photograph
As the circuit and the service life of the camera module of module.
In addition, second tack coat 72H is arranged at sensitive chip 20H, electronic component 60H and the colour filter
The vicinity of the basal surface 32H of 30H such that it is able to which bond sensitive chip 20H, electronic component 60H and colour filter 30H
Basal surface 32H near dirty dirt, so as to help to maintain sensitive chip 20H, electronic component 60H and the colour filter
The cleannes of the basal surface 32H of 30H, and then ensure the normal work of the camera module.More specifically, second tack coat
72H is arranged at the periphery of sensitive chip 20H.Because second tack coat 72H has viscosity, when dirty dirt is from the camera module
Outside enter the camera module in and to sensitive chip 20H and the electronic component 60H move when pass through second tack coat
72H is simultaneously bondd by second tack coat 72H, so as to prevent it from reaching sensitive chip 20H and electronic component 60H, so as to
The cleannes of sensitive chip 20H and electronic component 60H have been ensured, so that sensitive chip 20H can preferably work,
Further improve the quality of the camera module.
Figure 10 of accompanying drawing is a replaceable reality of the camera module according to the 4th preferred embodiment of the present utility model
Apply illustration to be intended to.As shown in Figure 10, the camera module include an optical lens 10H, a sensitive chip 20H, a colour filter 30H,
One support 40H, a wiring board 50H, a series of electronic component 60H, at least one group of binding element 70K, a gold thread 80H and a motor
90H.Gold thread 80H is set, to be used for the conducting sensitive chip 20H and wiring board 50H that can be powered.
Optical lens 10H is arranged at the photosensitive path of sensitive chip 20H, so as to be used to adopt in the camera module
During the image of collection object, the light being reflected by the object further can be felt by this after the process by optical lens 10H
Optical chip 20H receives to be suitable for carrying out photoelectric conversion.
Support 40H is set, be used to provide support to colour filter 30H, so that colour filter 30H can be by
Stably it is held in predeterminated position.Optical lens 10H is arranged at motor 90H, to be supported and can be passed through by motor 90H
Motor 90H is adjusted to optical lens 10H.Electronic component 60H and wiring board 50H carries out the conducting that can be powered, with
Make the camera module that there is preset function.Sensitive chip 20H and wiring board 50H carries out the conducting that can be powered, so that this is photosensitive
Chip 20H can play photoelectric conversion effect.
As shown in Figure 10, binding element 70K includes one first tack coat 71K and at least one second tack coat 72H.This
One tack coat 71K is arranged at the vicinity of colour filter 30H such that it is able to prevent dirty dirt, for example, may move particle and be attached to this
The surface of colour filter 30H.That is, first tack coat 71K has the effect of the dirty dirt of bonding, when dirty dirt is passed through from it,
First tack coat 71K can bond the dirty dirt passed through from it, so as to prevent dirty dirt from moving to the surface of colour filter 30H,
So as to prevent dirty dirt from producing impact to colour filter 30H, and then prevent occurring stain imaging inside the camera module.
As shown in Figure 10, the support 40H of support 40H have one first medial surface 421H, one second medial surface 422H,
One the 3rd medial surface 423H, an inner top surface 424H and an inner bottom surface 425H.First medial surface 421H, second medial surface
422H, the 3rd medial surface 423H, inner top surface 424H and inner bottom surface 425H are interconnected to form the inner face of support 40H
421H.Support 40H has receiving space 420H.First medial surface 421H, second medial surface 422H, the 3rd inner side
Face 423H, inner top surface 424H and inner bottom surface 425H are arranged at around receiving space 420H.Colour filter 30H and should
Sensitive chip 20H is arranged in receiving space 420H.First tack coat 71K be arranged at support 40H this is interior
Face 421H, to be conducive to keeping the cleaning of the environment in support 40H, and then ensures colour filter 30H and sensitive chip 20H
Cleaning.
Colour filter 30H is arranged at the inner top surface 424H of support 40H.Colour filter 30H has a top surface 31H
With a basal surface 32H.Basal surface 32H includes an edge bottom surface 321H.Colour filter 30H is arranged at being somebody's turn to do for support 40H
Inner bottom surface 4215H.As shown in figure 9, lower sections of the edge bottom surface 321H in the inner bottom surface 4215H of support 40H.
From unlike the 4th preferred embodiment of the present utility model, this according to the 4th preferred embodiment can
Embodiment is replaced, the first tack coat 71K is uniformly arranged on the edge bottom surface of the colour filter 30H of support 40H
321H.It is noted that because first tack coat 71K has viscosity, first tack coat 71K not only can play bonding
The effect of dirty dirt, and may also operate as fixing and connecting the effect of support 40H and colour filter 30H.It is noted that
The setting of the marginal portion of the colour filter 30H residing for the 321H of the edge bottom surface enable colour filter 30H be stably connected with and
Support, its need not have filter effect.First tack coat 71H is arranged at edge bottom surface 321H and does not also interfere with the colour filter
The filter effect of piece 30H.
First tack coat 71K includes one second exposed surface 712K.The second exposed surface 712K being somebody's turn to do in colour filter 30H
The vicinity of basal surface 32H is exposed in surrounding environment such that it is able to the dirt of its surrounding environment that bonds, so as to keep the colour filter
The cleaning of the basal surface 32H of 30H.It is noted that second exposed surface 712K has viscosity such that it is able to be bonded to and reach
Its dirt.
It is noted that second exposed surface 712K is also exposed to sensitive chip 20H's and electronic component 60H
Near, so arranging for second exposed surface 712K is conducive to keeping that sensitive chip 20H's and electronic component 60H is clear simultaneously
It is clean.
It is noted that the binding element 70,70A, 70B, 70C, 70D, 70E according to preferred embodiment above,
The set location of 70F, 70G, 70H, 70K is only unrestricted to the example of the present invention.According to other realities of the present utility model
Applying the binding element of example can also be arranged at the other positions of its camera module, the inner side of such as its motor, with its motor
Internal layer provides the exposed surface with adhesive property.As long as the goal of the invention of the present invention can be reached, the present invention does not do in this respect
Limit.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as
Illustrate and be not intended to limit the utility model.The purpose of this utility model completely and is effectively realized.Work(of the present utility model
Energy and structural principle show in embodiment and illustrate, under without departing from the principle, embodiment of the present utility model
Can there are any deformation or modification.
Claims (24)
1. one has the camera module of adhesive structure, it is characterised in that include:
One optical lens;
One sensitive chip, wherein the optical lens is arranged at the photosensitive path of the sensitive chip;With
One group of binding element, the dirty dirt in the camera module wherein the binding element can bond.
2. camera module according to claim 1, it further includes an optical filter and a support, wherein the optical filter
The support is arranged at, wherein the binding element further includes at least one first tack coat, wherein first bonding
The dirty dirt that layer can bond near the optical filter.
3. camera module according to claim 2, wherein the support has an inner face and with a receiving space, wherein
The optical filter and the sensitive chip are arranged in the receiving space.
4. camera module according to claim 1, wherein the binding element includes at least one second tack coat, wherein institute
State the second tack coat to be arranged near the sensitive chip.
5. camera module according to claim 4, it further includes a wiring board and a series of electronic components, wherein institute
State electronic component and be arranged at the wiring board, wherein second tack coat to be arranged at the electronic component described to cover
Electronic component.
6. camera module according to claim 4, it further includes a wiring board and at least a gold thread, wherein the gold
Line be used to being powered the conducting sensitive chip and the wiring board, wherein second tack coat be provided to cover it is described
Gold thread.
7. camera module according to claim 5, it further includes a wiring board and at least a gold thread, wherein the gold
Line is used for can be powered the conducting sensitive chip and the wiring board, wherein the gold thread has one to be connected to the wiring board
Wiring board connection end, wherein second tack coat is provided to cover the wiring board connection end of the gold thread.
8. camera module according to claim 4, wherein second tack coat is arranged at the non-of the sensitive chip
Photosensitive region.
9. camera module according to claim 3, wherein the support includes one first supporter and one second supporter,
Wherein described first supporter is supported on second supporter, wherein the optical lens is supported on described first supporting
Body, wherein the optical filter is arranged at second supporter, wherein the inner face and the receiving space be formed on it is described
Second supporter.
10. camera module according to claim 2, it further includes a motor for being arranged at the support, wherein
The optical lens is arranged at the motor.
11. camera modules according to any one in claim 2~3 and 10, wherein first tack coat is set
In the inner face of the support.
12. camera modules according to claim 11, wherein the inner face includes one first medial surface, wherein described first
Tack coat is arranged at first medial surface.
13. camera modules according to claim 11, wherein the inner face includes one first medial surface and an inner top surface, its
Described in the first medial surface and the inner top surface be connected with each other, wherein first tack coat is continuously arranged in described first
Side and the inner top surface.
14. camera modules according to claim 11, wherein the inner face includes one first medial surface, one second medial surface
With an inner top surface, wherein first medial surface, the inner top surface and second medial surface are connected with each other, wherein described first
Tack coat is continuously arranged at first medial surface, the inner top surface and second medial surface.
15. camera modules according to claim 11, wherein the inner face includes an inner bottom surface, wherein first bonding
Layer is arranged at the inner bottom surface.
16. camera modules according to claim 11, wherein the inner face includes one the 3rd medial surface and an inner bottom surface, its
Described in the 3rd medial surface and the inner bottom surface be connected with each other, wherein first tack coat is continuously arranged in the described 3rd
Side and the inner bottom surface.
17. camera modules according to claim 11, wherein the inner face includes one first medial surface, one second inner side
Face, one the 3rd medial surface, an inner top surface and an inner bottom surface, wherein first tack coat be arranged at first medial surface,
Second medial surface, the inner bottom surface and the 3rd medial surface.
18. camera modules according to claim 11, wherein the inner face includes one first medial surface, one second medial surface
With an inner top surface, wherein first medial surface, the inner top surface and second medial surface are connected with each other, wherein the optical filtering
Piece has an edge top surface, wherein first tack coat is continuously arranged at the edge top surface, first medial surface, institute
State inner top surface and second medial surface.
19. camera modules according to claim 11, wherein the inner face includes one first medial surface, wherein the optical filtering
Piece has an edge top surface, wherein first tack coat is continuously arranged at the edge top surface and first medial surface.
20. camera modules according to claim 11, wherein the inner face includes one first medial surface, wherein the optical filtering
Piece has an edge bottom surface, wherein first tack coat is continuously arranged at the edge bottom surface and first medial surface.
21. camera modules according to any one in claim 2~3 and 10, wherein the optical filter has an edge
Top surface, wherein first tack coat is arranged at the edge top surface.
22. camera modules according to any one in claim 2~3 and 10, wherein the optical filter has an edge
Bottom surface, wherein first tack coat is arranged at the edge bottom surface.
23. camera modules according to any one in claim 4-8, it further includes an optical filter and a support,
Wherein described optical filter is arranged at the support, wherein the binding element further includes at least one first tack coat, its
Described in the dirty dirt that can bond near the optical filter of the first tack coat;And the position of first tack coat is located at described
The inner face of support, and at least one of its position in following structure:
The inner face includes one first medial surface, wherein first tack coat is arranged at first medial surface;
The inner face includes one first medial surface and an inner top surface, wherein first medial surface is mutually interconnected with the inner top surface
Connect, wherein first tack coat is continuously arranged at first medial surface and the inner top surface;
The inner face include one first medial surface, one second medial surface and an inner top surface, wherein first medial surface, it is described in
Top surface and second medial surface are connected with each other, wherein first tack coat is continuously arranged at first medial surface, institute
State inner top surface and second medial surface;
The inner face includes an inner bottom surface, wherein first tack coat is arranged at the inner bottom surface;
The inner face includes one the 3rd medial surface and an inner bottom surface, wherein the 3rd medial surface is mutually interconnected with the inner bottom surface
Connect, wherein first tack coat is continuously arranged at the 3rd medial surface and the inner bottom surface;
The inner face includes one first medial surface, one second medial surface, one the 3rd medial surface, an inner top surface and an inner bottom surface, its
Described in the first tack coat be arranged in first medial surface, second medial surface, the inner bottom surface and the described 3rd
Side;
The inner face include one first medial surface, one second medial surface and an inner top surface, wherein first medial surface, it is described in
Top surface and second medial surface are connected with each other, wherein the optical filter has an edge top surface, wherein first tack coat
Continuously it is arranged at the edge top surface, first medial surface, the inner top surface and second medial surface;
The inner face includes one first medial surface, wherein the optical filter has an edge top surface, wherein first tack coat
Continuously it is arranged at the edge top surface and first medial surface;
The inner face includes one first medial surface, wherein the optical filter has an edge bottom surface, wherein first tack coat
Continuously it is arranged at the edge bottom surface and first medial surface;
The optical filter has an edge top surface, wherein first tack coat is arranged at the edge top surface;With
The optical filter has an edge bottom surface, wherein first tack coat is arranged at the edge bottom surface.
24. camera modules according to claim 10, wherein first tack coat is arranged at the inner side of the motor,
With in the inner adhesion of motor dirt dirt.
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CN201620422623.2U CN206136070U (en) | 2016-05-11 | 2016-05-11 | Module of making a video recording with adhering structure |
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CN201620422623.2U CN206136070U (en) | 2016-05-11 | 2016-05-11 | Module of making a video recording with adhering structure |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108111720A (en) * | 2017-12-19 | 2018-06-01 | 广东欧珀移动通信有限公司 | The camera of electronic equipment and with its electronic equipment |
WO2019120061A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Chip component of camera, camera and electronic device |
WO2020062146A1 (en) * | 2018-09-29 | 2020-04-02 | 华为技术有限公司 | Bearing structure in camera module and manufacturing method therefor, and camera module and terminal device |
WO2020134469A1 (en) * | 2018-12-28 | 2020-07-02 | 宁波舜宇光电信息有限公司 | Lens assembly, photosensitive assembly, photographing module, and assembling method therefor |
CN111385442A (en) * | 2018-12-28 | 2020-07-07 | 宁波舜宇光电信息有限公司 | Lens assembly, photosensitive assembly, camera module and assembling method thereof |
CN114338969A (en) * | 2020-10-10 | 2022-04-12 | 宁波舜宇光电信息有限公司 | Camera module, dust removal system and dust removal method thereof |
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2016
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108111720A (en) * | 2017-12-19 | 2018-06-01 | 广东欧珀移动通信有限公司 | The camera of electronic equipment and with its electronic equipment |
WO2019120061A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Chip component of camera, camera and electronic device |
WO2020062146A1 (en) * | 2018-09-29 | 2020-04-02 | 华为技术有限公司 | Bearing structure in camera module and manufacturing method therefor, and camera module and terminal device |
WO2020134469A1 (en) * | 2018-12-28 | 2020-07-02 | 宁波舜宇光电信息有限公司 | Lens assembly, photosensitive assembly, photographing module, and assembling method therefor |
CN111385442A (en) * | 2018-12-28 | 2020-07-07 | 宁波舜宇光电信息有限公司 | Lens assembly, photosensitive assembly, camera module and assembling method thereof |
CN114338969A (en) * | 2020-10-10 | 2022-04-12 | 宁波舜宇光电信息有限公司 | Camera module, dust removal system and dust removal method thereof |
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