CN109819145A - Camera module semi-finished product and its method of assembling and recycling - Google Patents
Camera module semi-finished product and its method of assembling and recycling Download PDFInfo
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- CN109819145A CN109819145A CN201910048089.1A CN201910048089A CN109819145A CN 109819145 A CN109819145 A CN 109819145A CN 201910048089 A CN201910048089 A CN 201910048089A CN 109819145 A CN109819145 A CN 109819145A
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- sensitive chip
- protective layer
- camera module
- microscope base
- finished product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention discloses camera module semi-finished product and its methods of assembling and recycling.Wherein, camera module semi-finished product including wiring board and are arranged sensitive chip in the circuit board and with circuit board electrical connection, are provided with removable protective layer on the photosensitive region of sensitive chip.After sensitive chip is mounted in the circuit board, until being closed until sensitive chip; protective layer is all made of to protect the photosensitive region of sensitive chip; the impurity such as particle pollution photosensitive region during sensitive chip circulates can be reduced; be conducive to improve the yields of camera module; and protective layer setting and minimizing technology it is simple, be conducive to improve camera module packaging efficiency.
Description
Technical field
The present invention relates to the assembling of camera module more particularly to camera module semi-finished product and its methods of assembling and recycling.
Background technique
With the development of intelligent electronic device, camera function becomes one of essential functions of electric terminals such as mobile phone.
The assembling sequence of existing camera module is usually first to attach photosensitive element in the circuit board, then beats gold thread again or passes through it
He, which such as welds at the modes, makes sensitive chip and wiring board form turning circuit, then will be pasted with again colour filter microscope base attach it is online
(microscope base may also be formed in the circuit board by moulding technology) on the plate of road, make the photosensitive region of colour filter and sensitive chip just
It is right, module of optical system is then set on microscope base, to complete the overall package of camera module.Camera module will meet well
Image quality, it is desirable that sensitive chip surface is without dirty, to guarantee imaging clearly inviolateness.
But attach from sensitive chip in the circuit board until during the entire process of before microscope base attachment, sensitive chip is naked
In the environment, there is surfaces by the risk of Particulate Pollution, even if in the high environment of dustless grade for dew, it is also difficult to completely
It avoids.It by the analysis dirty to particle, finds there are many its sources, such as clast, human body that jig surface abrasion generates
Skin scrapings etc..In existing technique, the generation of these particles is avoided to be difficult to realize completely, is washed by plasma
It can not completely remove that be adhered to sensitive chip surface dirty.In the prior art, dirty machine is carried out before being typically employed in attachment
Visual inspection and artificial CCD reinspection, and manually remove dirty particle with glutinous dirt glue, and this inspection and remove dirty mode
The manpower of consuming is more, the time is long, low efficiency.
In addition, camera module in process of production, is influenced by various factors, yield can not be 100%, especially
Camera module group surveys section, because there is the Partical that is difficult to remove influential on imaging in assembly error or module internal,
Cause image quality that factory is not achieved to require, so that the camera module is defined as defective products.But the lens group in defective products
Part and the sensitive chip component of higher cost may be still it is intact, can recycle.But it is torn open to camera module
When solution is to recycle sensitive chip component, it can inevitably generate clast pollution and sensitive chip is polluted, such as is each for connecting
There may be clasts in dismantling for the glue of component.
Summary of the invention
For overcome the deficiencies in the prior art, it is an object of the present invention to provide a kind of camera module semi-finished product,
During circulation, sensitive chip is not easy to be contaminated.
It is another object of the present invention to provide a kind of assemble methods of camera module semi-finished product, it is possible to prevente effectively from or
Reduce microscope base component installation before, sensitive chip surface it is dirty.
It is another object of the present invention to provide a kind of recovery methods of camera module semi-finished product, it is possible to prevente effectively from taking the photograph
As the clast generated when mould assembly and disassembly pollutes sensitive chip.
An object of the present invention adopts the following technical scheme that realization:
A kind of camera module semi-finished product, including wiring board and setting are electrically connected on the wiring board and with the wiring board
The sensitive chip connect is provided with removable protective layer on the photosensitive region of the sensitive chip.
Further, the protective layer can be fallen by plasma cleaning or the protective layer can be from the sensitive chip
Remove to entire surface.
Further, the protective layer is formed by protection liquid through drying or the protective layer is cured by resin material
It is formed.
Further, the protective layer with a thickness of 0.1~1.5mm.
Further, the protective layer does not cover the photosensitive core and realizes the structure being electrically connected with the wiring board.
The second object of the present invention adopts the following technical scheme that realization:
A kind of assemble method of camera module semi-finished product, comprising the following steps:
S1 provides the wiring board for being pasted with sensitive chip；
Protective layer is arranged on the photosensitive region surface of the sensitive chip in S2；
S3 removes the protective layer before the sensitive chip is closed.
Further, the time interval between the step S1 and the step S2 is than the step S2 and the step S3
Between time interval it is short, alternatively, the step S2 be to be equipped with the sensitive chip wiring board circulation before carry out.
According to one embodiment, the step S2 the following steps are included:
S21a, the setting protection liquid on the photosensitive region of the sensitive chip；
S22a dries the sensitive chip, and the protection liquid is oven-dried to form the protective layer.
Further, it is described protection liquid ph value be 6~7, the protective layer with a thickness of 0.1~1mm.
According to another embodiment, the step S2 the following steps are included:
Curable resin material is arranged in S21b on the photosensitive region of the sensitive chip；
S22b solidifies the resin material, to form the protective layer on the surface of the photosensitive region.
Further, the protective layer with a thickness of 0.1~1.5mm.
According to yet another embodiment, the step S2 the following steps are included:
S21c carries out plasma cleaning to the sensitive chip；
The protective layer for having certain viscosity is adhered to the photosensitive region of the sensitive chip by S22c at least one times
On.
According to one embodiment, the step S3 is specifically: before the sensitive chip is closed, to the sense
Optical chip carries out plasma cleaning, so that the protective layer on the sensitive chip surface be removed.
According to another embodiment, the step S3 is specifically:, will be described before the sensitive chip is closed
Sur-face peeling of the protective layer from the sensitive chip.
According to yet another embodiment, the step S3 is specifically: before the sensitive chip is closed, first in institute
It states and adhesive is set on protective layer, then shell the protective layer and the adhesive from the surface of the sensitive chip simultaneously
From, wherein the bonding force between the adhesive and the protective layer is greater than between the protective layer and the sensitive chip
Bonding force.
According to yet another embodiment, the step S3 is specifically: before the sensitive chip is closed, heating institute
Stating protective layer makes its contraction distortion, so that the protective layer is from sensitive chip surface Automatic-falling.
According to another embodiment, the step S3 is specifically: before the sensitive chip is closed, the guarantor
Sheath uses solvent cleaning removal.
Further, further comprising the steps of between the step S2 and the step S3: to have the photosensitive core
It is molded on the wiring board of piece to form microscope base；It is further comprising the steps of after the step S3: on the microscope base
Colour filter is set, so that the colour filter is opposite with the sensitive chip；Alternatively, camera lens is arranged on the microscope base, make described
Camera lens is opposite with the sensitive chip.
The third object of the present invention adopts the following technical scheme that realization:
A kind of recovery method of camera module semi-finished product, for recycling sensitive chip, the camera module semi-finished product include
The sensitive chip and microscope base in the circuit board is set, which is characterized in that the recovery method the following steps are included:
Before the microscope base is removed from the wiring board, formed on the photosensitive region surface of the sensitive chip removable
Protective layer, then the microscope base is removed from the wiring board.
According to one embodiment, the recovery method includes:
A1, before microscope base dismounting, setting protection liquid, makes the protection liquid cover the sense on Yu Suoshu sensitive chip
The photosensitive region of optical chip；
A2 dries the camera module semi-finished product, and the protection liquid drying forms the protective layer, the microscope base
Glue between the wiring board is by thermal softening；
A3 removes the microscope base from the wiring board.
According to another embodiment, the recovery method includes:
Resin material is arranged on Yu Suoshu sensitive chip before microscope base dismounting in B1, makes resin material covering institute
State the photosensitive region of sensitive chip；
B2 makes the resin material be formed by curing cross-linked network, and the resin material after solidification forms the protective layer；
B3 removes the microscope base from the wiring board.
Compared with prior art, the beneficial effects of the present invention are camera module semi-finished product provided by the invention and camera shootings
Mould group semi-finished product assemble method, sensitive chip be mounted in the circuit board after, be closed until sensitive chip until,
It is protected using photosensitive region of the protective layer to sensitive chip, it is possible to reduce the impurity such as particle are dirty during sensitive chip circulation
Contaminate photosensitive region, be conducive to improve camera module yields, and protective layer setting and minimizing technology it is simple, be conducive to
Improve the packaging efficiency of camera module；Camera module recovery method provided by the invention, before microscope base is removed, first photosensitive
Protective layer is formed on chip protects photosensitive region, the clast generated when can remove to avoid microscope base pollutes photosensitive region, while
Particulate Pollution photosensitive region during can circulating to avoid sensitive chip is conducive to the yields for improving camera module.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of one embodiment of camera module semi-finished product of the invention；
Fig. 2 is the front schematic view of one embodiment of camera module semi-finished product of the invention；
Fig. 3 is the flow diagram of one embodiment of camera module semi-finished product assemble method of the invention；
Fig. 4 is the flow diagram of second embodiment of camera module semi-finished product assemble method of the invention；
Fig. 5 is the flow diagram of the third embodiment of camera module semi-finished product assemble method of the invention；
Fig. 6 is the flow diagram of the 4th embodiment of camera module semi-finished product assemble method of the invention；
Fig. 7 is the flow diagram of the 5th embodiment of camera module semi-finished product assemble method of the invention；
Fig. 8 is the flow diagram of one embodiment of camera module semi-finished product recovery method of the invention；
In figure: 1, wiring board；2, sensitive chip；21, photosensitive region；22, non-photo-sensing region；3, protective layer；4, microscope base；5,
Colour filter；6, camera lens；8, adhesive；9, gold thread.
Specific embodiment
In the following, being described further in conjunction with specific embodiment to the present invention, it should be noted that is do not collided
Under the premise of, new embodiment can be formed between various embodiments described below or between each technical characteristic in any combination.
In the description of the present invention, it should be noted that " transverse direction ", " vertical if any term " center " for the noun of locality
To ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top",
The indicating positions such as "bottom", "inner", "outside", " clockwise ", " counterclockwise " and positional relationship are orientation based on the figure or position
Relationship is set, the narration present invention is merely for convenience of and simplifies description, rather than the device or element of indication or suggestion meaning are necessary
It constructs and operates with specific orientation, with particular orientation, should not be understood as limiting specific protection scope of the invention.
It should be noted that term " includes " in the description and claims of this application and " having " and they
Any deformation, it is intended that cover it is non-exclusive include, for example, containing the process, method of a series of steps or units, being
System, product or equipment those of are not necessarily limited to be clearly listed step or unit, but may include be not clearly listed or
For the intrinsic other step or units of these process, methods, product or equipment.
As shown in Figure 1, 2, the present invention provides a kind of camera module semi-finished product, including wiring board 1 and setting assist side 1
Sensitive chip 2 that is upper and being electrically connected with wiring board 1 is provided with removable protective layer 3 on the photosensitive region 21 of sensitive chip 2.
Since camera module semi-finished product of the invention are provided with protective layer 3 on the photosensitive region 21 of sensitive chip 2,
During the circulation of camera module semi-finished product, clast etc. is dirty can not to pollute photosensitive region 21.In camera module semi-finished product stream
After the completion of turning, before the attaching that carries out microscope base, then protective layer 3 removed, the time of the exposure of photosensitive region 21 can be greatly decreased,
Reduce the contaminated possibility of photosensitive region 21.It is dirty that some particles may be adhered to during circulation, on protective layer 3, these
The dirty removal also with protective layer 3 of particle is cleaned out.In addition, microscope base is also likely to be to form assist side using moulding technology
On 1, in molding, protective layer 3 can also play the role of protecting sensitive chip 2, can be to avoid moulding material or mold
Interior impurity pollutes photosensitive region 21.In addition, 2 surface of sensitive chip may also before protective layer 3 is arranged on sensitive chip 2
There are particle etc. is dirty, after protective layer 3 is arranged on sensitive chip 2, these are dirty to be also adhered on protective layer 3, when going
When except protective layer 3, these are dirty to be removed with protective layer 3.
It will be understood to those skilled in the art that the surface of sensitive chip 2 includes photosensitive region 21 and non-photo-sensing region
22, wherein photosensitive region 21 is that the region of reception light will affect into image quality if particulate matter is adhered to photosensitive region 21
Amount, therefore protective layer 3 needs to cover photosensitive region 21, it is contaminated to avoid photosensitive region 21.Rather than photosensitive region 22 is then not
Light is received, and wiring board 1 realizes the structure setting being electrically connected with sensitive chip 2 in non-photo-sensing region 22, in order to avoid protecting
The formation process of sheath 3 or protective layer 3 has an impact wiring board 1 and the electric connection structure of sensitive chip 2, preferably protects
Layer 3 does not cover the electric connection structure.That is, protective layer 3 can not cover non-photo-sensing region 22；Alternatively, protective layer 3 can also cover
Cover non-photo-sensing region 22, but the electric connection structure in non-photo-sensing region 22 is not contacted.Area in Fig. 2 in dotted line frame
Domain is photosensitive region 21.
It is worth mentioning, wiring board 1 can be realized with being electrically connected for sensitive chip 2 by gold thread 9, can also pass through welding
Etc. other modes realize that the present invention is to wiring board 1 and the concrete mode of sensitive chip 2 being electrically connected without restriction.Therefore, line
The electric connection structure of road plate 1 and sensitive chip 2 can be but not limited to gold thread, pad.
Protective layer 3 is interim protection to the protection of sensitive chip 2, is mainly being flowed through with to avoid camera module semi-finished product
21 surface of photosensitive region is contaminated in journey or when molding, therefore before sensitive chip 2 is mounted on enclosure space, need by
Protective layer 3 removes, and not can be removed protective layer 3 to avoid the later period.The removal of protective layer 3 can use a variety of methods, several below
The method that protective layer 3 removes, it is exemplary only to enumerate, it is not exhausted to enumerate.
In one embodiment, the mode that plasma cleaning can be used in protective layer 3 removes.Plasma cleaning is existing group
One of the process handled in dress technique sensitive chip, to remove the dirty of sensitive chip surface, which is in mirror
Seat carries out before being attached at wiring board, namely needs the time removed to be consistent with protective layer 3, therefore can be by protective layer 3
Removal in conjunction with existing plasma cleaning step, no longer need to individually to increase the step of protective layer 3 removes, it is possible to reduce to original
There is the change of technique.Those skilled in the art may be selected that the object removed by plasma cleaning according to the prior art
Matter forms protective layer 3.
In another embodiment, protective layer 3 can be removed integrally.Protective layer 3 can be but not limited to polyester
The glue film of class, such as pellosil.Preferably, protective layer 3 forms whole cross-linked network, to be less likely to occur brokenly in removing
It splits.Protective layer 3 is preferably using the lower glue film of viscosity, and when so as to avoid removing, the material of protective layer 3 remains in photosensitive
On chip 2.Protective layer 3 can be removed directly, be also possible to for the higher adhesive of viscosity being adhered on protective layer 3 and carried out again
It removes.The higher adhesive of viscosity is adhered on protective layer 3 to remove again, can be further avoided in stripping process, on protective layer 3
Material remain on sensitive chip 2.When protective layer 3 is heated to shrink deformation, its hair can also be made by heating
It is raw to shrink deformation, to be detached from from sensitive chip 2 automatically.
In another embodiment, protective layer 3 can remove in such a way that solvent cleans.Namely it will be protected using solvent
Sheath 3 dissolves, and then achievees the purpose that remove protective layer 3.According to the difference of protective layer 3, for dissolving the solvent of protective layer 3
Difference, solvent can be water or organic solvent.Those skilled in the art can choose suitable according to the type of protective layer 3
Solvent removes protective layer 3.
According to the difference of 3 material of protective layer, protective layer 3 can be formed using a variety of methods.Several formation of protective layer 3 below
Method, it is exemplary only to enumerate, it is not exhausted to enumerate.
In some embodiments, protective layer 3 is formed by protection liquid through drying.It, first will protection liquid setting when preparing protective layer 3
It in the photosensitive region 21 of sensitive chip 2, is then toasted, to remove the solvent in protection liquid, protects the solute molecule in liquid
It is stacked to form protective layer 3.Protection liquid can be arranged on sensitive chip 2 using the modes such as coating or printing.For
Protection corrosion sensitive chip 2 is avoided, protecting the ph value of liquid is preferably 6~7.It, can if protection liquid is too thin when setting protection liquid
It is uncovered that part photosensitive region 21 can be will lead to, and protect liquid too thick, then be more troublesome when removing protective layer 3 in the later period, protected
The thickness of sheath 3 is preferably 0.1~1mm.The solvent of protection liquid can be water and be also possible to organic solvent, protect the solute in liquid
It can be organic matter and be also possible to inorganic matter.According to the property of 3 material of protective layer, those skilled in the art be can choose properly
Mode remove protective layer 3.
In further embodiments, protective layer 3 is by the cured formation of resin material.Cured mode includes but is not limited to dry
Dry, heat cure or photocuring, " drying " here refer to that chemical crosslink reaction does not occur for resin material, are only the volatilizations of solvent,
" heat cure " or " photocuring " refers to that chemistry occurs when reaching certain temperature or receiving the illumination of certain wavelength for resin material
Cross-linking reaction.When preparing protective layer 3, first resin material is coated on sensitive chip 2, is then formed by curing resin material
Protective layer 3, the resin material after solidification can be removed integrally.It, may if coating is too thin when coated with resins material
Cause part photosensitive region 21 uncovered, and coating is too thick, then when removing protective layer 3, is more troublesome, protective layer 3
Thickness is preferably 0.1~1.5mm.
The present invention also provides a kind of assemble methods of camera module semi-finished product, as shown in Fig. 3,4,5,6 or 7, including it is following
Step:
S1 provides the wiring board 1 for being pasted with sensitive chip 2；
Protective layer 3 is arranged on the photosensitive region surface of sensitive chip 2 in S2；
S3 removes protective layer 3 before sensitive chip 2 is closed.
" sensitive chip 2 is closed " described in the present invention refers to that sensitive chip 2 is fixedly installed in an enclosure space, because
This can not the surface again to sensitive chip 2 cleaned, the operation such as decontamination.It will be appreciated by persons skilled in the art that here
Described " enclosure space " does not mean that the space being fully sealed, only because the closure in space, leads to not to photosensitive core
The operations such as the surface of piece 2 cleaned, decontamination.Therefore the removal needs of protective layer 3 carry out before sensitive chip 2 is closed.
Several situations that sensitive chip 2 is closed are exemplified below, not exhausted enumerate is exemplified below.
In some embodiments, it after sensitive chip 2 is arranged in assist side 1, needs to be integrally arranged mirror in assist side 1
Holder assembly, microscope base component includes microscope base 4 and the colour filter being arranged on microscope base 45, once microscope base component integrally attaches online
After on road plate 1, sensitive chip 2 is to be closed in the cavity that microscope base 4, wiring board 1 and colour filter 5 are formed, therefore protect
The removal of layer 3 needs to carry out between the attaching of microscope base component, camera module assembling flow path as shown in Figure 3.
It in further embodiments, is 1 upper mold moulding of assist side into microscope base after sensitive chip 2 is arranged in assist side 1
4, it also will be first put into mold with the wiring board 1 of sensitive chip 2, the even part of the surface of sensitive chip 2 in assist side 1
Upper setting moulding material forms microscope base 4 after moulding material solidification, and due to having light hole on microscope base 4, molding forms microscope base
After 4, sensitive chip 2 is also not closed out, therefore when being molded, and does not need removal protective layer 3, in fact, protective layer 3 can be with
Play the role of protecting photosensitive region 20 in molding.After microscope base 4 is formed, colour filter 5 needs to be arranged in the light hole of microscope base 4
Place, after the installation of colour filter 5, sensitive chip 2 is closed, therefore protective layer 3 needs to be gone before the setting of colour filter 5
It removes, camera module assembling flow path as shown in Figure 4.
Have under some cases, after the molding of microscope base 4 is formed, no setting is required colour filter 5, but being mounted directly has the function of colour filter
Camera lens 6 remove protective layer 3 again before the installation of camera lens 6, camera module as shown in Figure 5 assembles stream in this case
Journey.
The step of progress before the assemble method of camera module semi-finished product of the invention is mainly closed sensitive chip 2
Improvement improve the yields of camera module its purpose is to reduce the contaminated possibility of sensitive chip 2.Sensitive chip 2
Assembling with wiring board 1 can refer to the prior art progress, to the closed method of sensitive chip 2 (such as attaching method of microscope base component,
The attaching method of colour filter or the installation method of camera lens) prior art can also be referred to, the present invention is no longer described in detail.
In some embodiments, step S2 be to sensitive chip 2 wiring board 1 circulate before carry out, thus
It can with amplitude peak reduce the contaminated possibility of sensitive chip 2.For example, electricity can be completed in sensitive chip 2 and wiring board 1
After connection, that is, protective layer 3 is set.
In further embodiments, the time interval between step S1 and step S2 than between step S2 and step S3 when
Between be spaced it is short, protective layer 3 it is more early be arranged on sensitive chip 2, sensitive chip 2 can be made to contact fewlyer with external environment, because
This can more effectively reduce the contaminated possibility of sensitive chip 2.It is noted that the time between step S1 and step S2
It is spaced after referring to step S1 completion, this period before step S2 progress；Similarly, the time between step S2 and step S3
This period after interval refers to that step S2 is completed, before step S3 progress.
In step S2, the setting of protective layer 3 can use accomplished in many ways, enumerate to following exemplary several embodiment party
Formula.
In one embodiment, step S2 the following steps are included:
S21a, the setting protection liquid on the photosensitive region of sensitive chip 2；
S22a dries sensitive chip 2, and protection liquid is oven-dried to form protective layer 3 on the surface of photosensitive region.
In the embodiment, protective layer 3 is formed by protection liquid by drying, and in the prior art, sensitive chip 2 is arranged in route
It itself is also to need to carry out baking step, therefore coating can protect liquid before baking step progress after on plate 1.
That is, the method for the embodiment can use the formation that the existing step of the prior art completes protective layer 3, be conducive to simplify assembling
Technique reduces the change to original technique.
Protection liquid can be arranged on sensitive chip 2 by the way of coating or printing, naturally it is also possible to use other
Protection liquid is arranged in mode.When setting protection liquid, if protection liquid is too thin, it is uncovered to may result in part photosensitive region, and
It protects liquid too thick, is then more troublesome when removing protective layer 3 in the later period, the thickness of protective layer 3 is preferably 0.1~1mm.
To avoid protection corrosion sensitive chip 2, protecting the ph value of liquid is preferably 6~7.The solvent of protection liquid can be water
It is also possible to organic solvent, protects the solute in liquid to can be organic matter and be also possible to inorganic matter.According to the property of 3 material of protective layer
Matter, those skilled in the art can choose suitable mode and remove protective layer 3.
In another embodiment, step S2 the following steps are included:
Curable resin material is arranged in S21b on the photosensitive region of sensitive chip 2；
S22b solidifies resin material, to form protective layer 3 on the surface of photosensitive region.
In step S22b, the solidification of resin material can be dry, heat cure or photocuring, " drying " here refer to
Chemical crosslink reaction does not occur for resin material, is only the volatilization of solvent, and " heat cure " or " photocuring " refers to that resin material is reaching
To certain temperature or receive that chemical crosslink reaction occurs when the illumination of certain wavelength.
Preferably, resin material forms whole cross-linked network, so that sur-face peeling of the protective layer 3 from sensitive chip 2
Shi Burong is tearable.
Protective layer 3 can be removed by the way of removing, can also be with when protective layer 3 is heated to shrink deformation
By the way of heating, so that protective layer 3 is shunk deformation and be detached from automatically from 2 surface of sensitive chip.
Resin material can be arranged on sensitive chip 2 by the way of coating or printing, naturally it is also possible to use it
Resin material is arranged for mode in he.Be arranged resin material when, if resin material is too thin, may result in part photosensitive region not by
Covering, and if too thick, when removing protective layer 3 in the later period, it is more troublesome, the thickness of protective layer 3 is preferably 0.1~1.5mm.
In a further embodiment, assemble method flow diagram as shown in FIG. 6, step S2 the following steps are included:
S21c carries out plasma cleaning to sensitive chip 2；
To there is S22c the protective layer 3 of certain viscosity be adhered on the photosensitive region of sensitive chip 2 at least one times.
In step S21c, to the purpose that sensitive chip 2 carries out plasma cleaning be to remove most pollutant or
Particle.In step S22c, there will be the protective layer 3 of certain viscosity to be adhered on sensitive chip 2 at least one times, for removal etc.
The particle or dirty not removed when Ion Cleaning.
It is noted that the protective layer 3 in the embodiment is protective glue, protective glue can integrally be adhered to photosensitive core
On piece 2, also can integrally be removed from sensitive chip 2, due to protective glue have high viscosity, when its be adhered to it is photosensitive
When on chip 2, can by sensitive chip 2 particle or dirty removal.
In step S3, the removal of protective layer 3 can use accomplished in many ways, enumerate to following exemplary several embodiment party
Formula.
In one embodiment, the removal of protective layer 3 is realized using plasma cleaning.In the prior art, sensitive chip 2
Before being closed, it is also desirable to carry out plasma cleaning, to remove surface impurity, therefore can use protective layer 3 in the step
Removal.That is, the method for the embodiment can use the removal that the existing step of the prior art completes protective layer 3, be conducive to letter
Change packaging technology, reduces the influence to original technique.In this embodiment, step S3 is specifically: being sealed in sensitive chip 2
Before closing, plasma cleaning is carried out to sensitive chip 2, the protective layer 3 on 2 surface of sensitive chip is removed.
In another embodiment, protective layer 3 is formed by curing by resin material, and the removal of protective layer 3 is using removing
Mode is realized.Step S3 is specifically: before sensitive chip 2 is closed, by protective layer 3 from the sur-face peeling of sensitive chip 2；
Alternatively, the adhesive 8 of high viscosity is first arranged on less viscous protective layer 3 before sensitive chip 2 is closed, then will protect
Sheath 3 and adhesive 8 are simultaneously from the sur-face peeling of sensitive chip 2, assembling flow path schematic diagram as shown in Figure 7.
Preferably, protective layer 3 selects the lower material of viscosity, and when can be to avoid removing, the material of protective layer 3 remains in sense
On optical chip 2.In addition, being made viscous between adhesive 8 and protective layer 3 by the adhesive 8 that high viscosity is arranged on protective layer 3
Relay is greater than the bonding force between protective layer 3 and sensitive chip 2, can further avoid in removing, the material of protective layer 3 is residual
It stays on sensitive chip 2.
In some cases, protective layer 3 is suitable for shrinking deformation when heated, so that protective layer 3 can be automatically from photosensitive core
It integrally falls off on piece 2.At this point, step S3 specifically: before sensitive chip 2 is closed, heated protective layer 3 makes it shrink shape
Become, so that protective layer 3 is from 2 surface Automatic-falling of sensitive chip.
In yet another embodiment, protective layer 3 be can dissolve in a solvent, to be removed protective layer 3 using solvent.Step
Rapid S3 is specifically: before sensitive chip 2 is closed, protective layer 3 utilizes solvent cleaning removal.In the embodiment, solvent
Protective layer 3 can be dissolved, so that it be removed from the surface of sensitive chip 2.
In some embodiments, assemble method of the invention is further comprising the steps of after step s 3:
S4a provides a microscope base component, and microscope base component includes microscope base 4 and colour filter 5, and colour filter 5 is attached to microscope base 4
At light hole, microscope base component is set, so that colour filter 5 and sensitive chip 2 are opposite in assist side 1.
In further embodiments, assemble method of the invention is further comprising the steps of between step S2 and step S3:
It is molded on the wiring board 1 with sensitive chip 2 to form microscope base 4.It is understood that when molding forms microscope base 4,
Photosensitive region 21 on sensitive chip 2 is not molded material covering.
Further, further comprising the steps of after step S3: colour filter 5 is arranged, so that colour filter in S4b on microscope base 4
5 is opposite with sensitive chip 2；Alternatively, camera lens 6 is arranged on microscope base 4, keep camera lens 6 and sensitive chip 2 opposite.
The present invention also provides a kind of recovery methods of camera module semi-finished product, for recycling sensitive chip 2, the camera module
Semi-finished product include be arranged assist side 1 on sensitive chip 2 and microscope base 4, as shown in figure 8, recovery method the following steps are included:
Before microscope base 4 is removed from wiring board 1, removable protective layer 3 is formed on the photosensitive region surface of sensitive chip 2, then will
Microscope base 4 is removed from wiring board 1.
Recovery method provided by the invention is mainly used for: sense is recycled from the camera module semi-finished product that microscope base 4 is not removed also
Optical chip 2.The beneficial effect is that: the surface of the clast pollution sensitive chip 2 generated when can be to avoid the removal of microscope base 4, and return
It receives obtained 2 surface of sensitive chip and is equipped with protective layer 3, therefore during circulation, sensitive chip 2 will not be contaminated, recycling
When sensitive chip 2 is assembled again, then protective layer 3 can be removed.
It is noted that need to guarantee that sensitive chip 2 is not closed out when protective layer 3 is arranged on sensitive chip 2, from
And the material for allowing to be formed protective layer 3 enters the surface of 2 photosensitive region of sensitive chip.Preferably, the light hole of microscope base 4 is to open
State is put, by the light hole of microscope base 4, the material for forming protective layer 3 can be arranged in the surface of sensitive chip 2.
In some embodiments, camera module semi-finished product recovery method specifically includes the following steps:
A1, in setting protection liquid on sensitive chip 2, makes to protect the photosensitive of liquid covering sensitive chip 2 before the dismounting of microscope base 4
Region；
A2 dries camera module semi-finished product, and protection liquid is dry to form protective layer 3, while microscope base 4 and wiring board 1
Between glue by thermal softening；
A3 removes microscope base 4 from wiring board 1.
In the embodiment, first the setting protection liquid on sensitive chip 2, then dries protection liquid, to form protective layer 3.
During liquid is protected in drying, be originally used for connection microscope base 4 and wiring board 1 glue it is heated soften so that microscope base 4 can
To be removed from wiring board 1.The protective layer 3 of formation is can be, but not limited to when sensitive chip 2 assembles again using plasma
The method of cleaning removes.The thickness of the type and setting of protecting liquid can refer in the assemble method of aforementioned camera module semi-finished product
Protection liquid setting.Protection liquid can be arranged on sensitive chip 2 using the modes such as coating or printing.
In further embodiments, camera module semi-finished product recovery method specifically includes the following steps:
B1, in resin material is arranged on sensitive chip 2, makes resin material covering sensitive chip 2 before the dismounting of microscope base 4
Photosensitive region；
B2 makes resin material be formed by curing cross-linked network, and the resin material after solidification forms protective layer 3；
B3 removes microscope base 4 from wiring board 1.
Wherein, step B3 can be such that glue softens by the way of heating, so that microscope base 4 be removed, can also use it
His mode removes microscope base 4.
Resin material can be arranged on sensitive chip 2 using the modes such as coating or printing.The solidification of resin material can
To be but not limited to dry, heat cure or photocuring.Sensitive chip 2 assembles again when needing to remove protective layer 3, can be using stripping
From mode remove.When protective layer 3 is heated to shrink deformation, protective layer 3 can also be made by heated protective layer 3
Contraction is detached from from sensitive chip 2 automatically.
In addition, before resin material is arranged on sensitive chip 2, there may be particle or dirty on sensitive chip 2,
The protective layer 3 that resin material is formed after solidifying have certain viscosity, when removing protective layer 3, these particles or it is dirty can
To be removed together with protective layer 3.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (21)
1. a kind of camera module semi-finished product, which is characterized in that including wiring board and be arranged on the wiring board and with it is described
The sensitive chip of circuit board electrical connection is provided with removable protective layer on the photosensitive region of the sensitive chip.
2. camera module semi-finished product according to claim 1, which is characterized in that the protective layer can be by plasma cleaning
Fall or the protective layer can be removed from the entire surface of the sensitive chip.
3. camera module semi-finished product according to claim 1, which is characterized in that the protective layer is by protection liquid through dry shape
At or the protective layer by the cured formation of resin material.
4. camera module semi-finished product according to claim 1, which is characterized in that the protective layer with a thickness of 0.1~
1.5mm。
5. camera module semi-finished product according to claim 1 to 4, which is characterized in that the protective layer does not cover described
Photosensitive core realizes the structure being electrically connected with the wiring board.
6. a kind of assemble method of camera module semi-finished product, which comprises the following steps:
S1 provides the wiring board for being pasted with sensitive chip；
Protective layer is arranged on the photosensitive region surface of the sensitive chip in S2；
S3 removes the protective layer before the sensitive chip is closed.
7. the assemble method of camera module semi-finished product according to claim 6, which is characterized in that the step S1 with it is described
Time interval between step S2 is shorter than the time interval between the step S2 and the step S3, alternatively, the step S2
It is to be carried out to before being equipped with the wiring board circulation of the sensitive chip.
8. assemble method according to claim 6, which is characterized in that the step S2 the following steps are included:
S21a, the setting protection liquid on the photosensitive region of the sensitive chip；
S22a dries the sensitive chip, and the protection liquid is oven-dried to form the protective layer.
9. assemble method according to claim 8, which is characterized in that the ph value of the protection liquid is 6~7, the protection
Layer with a thickness of 0.1~1mm.
10. assemble method according to claim 6, which is characterized in that the step S2 the following steps are included:
Curable resin material is arranged in S21b on the photosensitive region of the sensitive chip；
S22b solidifies the resin material, to form the protective layer on the surface of the photosensitive region.
11. assemble method according to claim 10, which is characterized in that the protective layer with a thickness of 0.1~1.5mm.
12. assemble method according to claim 6, which is characterized in that the step S2 the following steps are included:
S21c carries out plasma cleaning to the sensitive chip；
To there is S22c the protective layer of certain viscosity be adhered on the photosensitive region of the sensitive chip at least one times.
13. according to any assemble method of claim 6-9, which is characterized in that the step S3 is specifically: described
Before sensitive chip is closed, plasma cleaning is carried out to the sensitive chip, thus by described in the sensitive chip surface
Protective layer removal.
14. according to claim 6,7,10,11 or 12 any assemble methods, which is characterized in that the step S3 is specific
Ground are as follows: before the sensitive chip is closed, by the protective layer from the sur-face peeling of the sensitive chip.
15. according to claim 6,7,10 or 11 any assemble methods, which is characterized in that the step S3 is specifically
Are as follows: before the sensitive chip is closed, first adhesive is set on the protective layer, then by the protective layer and institute
Adhesive is stated simultaneously from the sur-face peeling of the sensitive chip, wherein the bonding force between the adhesive and the protective layer
Greater than the bonding force between the protective layer and the sensitive chip.
16. according to claim 6,7,10,11 or 12 any assemble methods, which is characterized in that the step S3 is specific
Ground are as follows: before the sensitive chip is closed, heating the protective layer makes its contraction distortion, so that the protective layer is from described
Sensitive chip surface Automatic-falling.
17. according to any assemble method of claim 6-11, which is characterized in that the step S3 is specifically: in institute
It states before sensitive chip is closed, the protective layer uses solvent cleaning removal.
18. assemble method according to claim 6, which is characterized in that between the step S2 and the step S3 also
The following steps are included: being molded on the wiring board with the sensitive chip to form microscope base；The step S3 it
It is further comprising the steps of afterwards: colour filter to be set on the microscope base, so that the colour filter is opposite with the sensitive chip；Or
Camera lens is arranged on the microscope base in person, keeps the camera lens opposite with the sensitive chip.
19. a kind of recovery method of camera module semi-finished product, for recycling sensitive chip, the camera module semi-finished product include setting
Set the sensitive chip and microscope base in the circuit board, which is characterized in that the recovery method the following steps are included:
Before the microscope base is removed from the wiring board, removable guarantor is formed on the photosensitive region surface of the sensitive chip
Then sheath removes the microscope base from the wiring board.
20. recovery method according to claim 19, which is characterized in that the recovery method includes:
A1, before microscope base dismounting, setting protection liquid, makes the protection liquid cover the photosensitive core on Yu Suoshu sensitive chip
The photosensitive region of piece；
A2 dries the camera module semi-finished product, and the protection liquid drying forms the protective layer, the microscope base and institute
The glue between wiring board is stated by thermal softening；
A3 removes the microscope base from the wiring board.
21. recovery method according to claim 19, which is characterized in that the recovery method includes:
Resin material is arranged on Yu Suoshu sensitive chip before microscope base dismounting in B1, and the resin material is made to cover the sense
The photosensitive region of optical chip；
B2 makes the resin material be formed by curing the protective layer；
B3 removes the microscope base from the wiring board.
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