CN107483792A - A kind of camera module and preparation method thereof - Google Patents
A kind of camera module and preparation method thereof Download PDFInfo
- Publication number
- CN107483792A CN107483792A CN201710854575.3A CN201710854575A CN107483792A CN 107483792 A CN107483792 A CN 107483792A CN 201710854575 A CN201710854575 A CN 201710854575A CN 107483792 A CN107483792 A CN 107483792A
- Authority
- CN
- China
- Prior art keywords
- camera module
- circuit board
- sealant
- electric connection
- connection line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The embodiment of the invention discloses a kind of camera module and preparation method thereof, the camera module includes：Circuit board；Positioned at the sensitive chip of the circuit board first surface；Electrically connect the electric connection line of the circuit board and the photosensitive core；Seal the sealant of the electric connection line；Support positioned at the sealant upper surface；Carry camera lens on the bracket.Compared to securing the stand to the technical scheme on circuit board in prior art camera module, the support is arranged on the sealant upper surface by the camera module that the embodiment of the present invention is provided, reduce parallel in the circuit board surface, the area of the camera module, so as to reduce the size of the camera module, it is adapted to the lightening development of electronic product.
Description
Technical field
The present invention relates to camera technology field, more particularly to a kind of camera module and preparation method thereof.
Background technology
As the consumer electronics products such as the development of electronic technology, cell phone type are light increasingly towards functional diversities, structure
The direction of thinning is developed, and this component allowed in electronic product is more and more, and the installing space of each component is less and less, accordingly
, the space for leaving camera module in the electronic product for is also less and less.Therefore, the size of camera module how is reduced, from
And the lightening development of electronic product is adapted to, have become those skilled in the art's base band and solve the problems, such as.
The content of the invention
In order to solve the above technical problems, the embodiments of the invention provide a kind of camera module and preparation method thereof, to reduce
The size of the camera module, it is adapted to the lightening development of electronic product.
Specifically, the embodiments of the invention provide following technical scheme：
A kind of camera module, including：Circuit board；Positioned at the sensitive chip of the circuit board first surface；Described in electrical connection
The electric connection line of circuit board and the photosensitive core；Seal the sealant of the electric connection line；Positioned at the sealant upper surface
Support；Carry camera lens on the bracket.
Optionally, the sensitive chip is boss shape, including the first part and positioned at the first part table
Second part in face, the upper surface of second part are less than the upper surface of first part, the electricity
Connecting line electrically connects the upper surface of the first part in the sensitive chip.
Optionally, the upper surface of second part is less than at the peak of the electric connection line.
Optionally, the upper surface of the sealant is concordant with the upper surface of second part.
Optionally, the upper surface of the sealant is higher than the upper surface of second part.
Optionally, the camera module also includes：Fixed optical filter on the bracket, the optical filter is positioned at described
Camera lens forms a cavity towards the sensitive chip side between the optical filter and the sensitive chip.
Optionally, the camera module also includes：
The passage being arranged in the support, the passage are connected with the cavity.
A kind of preparation method of camera module, including：
Sensitive chip is bonded on circuit boards；
Form the electric connection line for electrically connecting the circuit board and the sensitive chip；
Sealant is formed on the circuit board, forms the first assembly element, wherein the sealant is described for sealing
Electric connection line；
In sealant upper surface fixed support；
Camera lens is carried on the bracket.
Optionally, also include before the upper surface fixed support of the sealant：
Optical filter is attached on the bracket, forms the second assembly element.
Optionally, forming the electrical connection circuit board and the electric connection line of the sensitive chip includes：
Using the anti-mode for beating gold thread, the electric connection line for electrically connecting the circuit board and the sensitive chip is formed.
Optionally, also include before forming sealant on the circuit board：
The semi-finished product module formed to the circuit board and the sensitive chip cleans.
Compared with prior art, above-mentioned technical proposal has advantages below：
Compared to securing the stand to the technical scheme on circuit board, institute of the embodiment of the present invention in prior art camera module
The support is arranged on the sealant upper surface by the camera module of offer, is reduced parallel to the circuit board surface
It is interior, the area of the camera module, so as to reduce the size of the camera module, it is adapted to the lightening hair of electronic product
Exhibition.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
The structural representation for the camera module that Fig. 1 is provided by one embodiment of the invention；
The preparation method flow chart for the camera module that Fig. 2 is provided by one embodiment of the invention；
In the camera module manufacturing process that Fig. 3-Fig. 7 is provided by one embodiment of the invention, each step forms structure
Structural representation.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still the present invention can be with
It is different from other manner described here using other to implement, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by following public specific embodiment.
Secondly, combination schematic diagram of the present invention is described in detail, when the embodiment of the present invention is described in detail, for purposes of illustration only, table
Show that the profile of device architecture can disobey general proportion and make partial enlargement, and the schematic diagram is example, and it should not herein
Limit the scope of protection of the invention.In addition, the three-dimensional space of length, width and depth should be included in actual fabrication.
Just as described in the background section, the size of camera module how is reduced, it is lightening so as to adapt to electronic product
Development, has become those skilled in the art's base band and solves the problems, such as.
In view of this, the embodiments of the invention provide a kind of camera module, as shown in figure 1, the camera module includes：Circuit
Plate 10；Positioned at the sensitive chip 20 of the first surface of circuit board 10；Electrically connect the circuit board 10 and the sensitive chip 20
Electric connection line 30；Seal the sealant 40 of the electric connection line 30；Support 50 positioned at the upper surface of sealant 40；Carry
Camera lens 80 on the support 50.
It should be noted that individual in embodiments of the present invention, the upper surface of each element each means that each element deviates from the electricity
The surface of the side of road plate 10, the table of the side of circuit board 10 as described in of sealant 40 as described in the upper surface of sealant 40 is
Face.
It should also be noted that, the camera module that the embodiment of the present invention is provided can be to focus camera module, can also
For automatic focusing camera module, the present invention is not limited this, specifically depended on the circumstances.
On the basis of above-described embodiment, in one embodiment of the invention, the circuit board 10 is pcb board, described
Sealant 40 is plastic layer, but the present invention is not limited this, is specifically depended on the circumstances.
Compared to securing the stand to the technical scheme on circuit board, institute of the embodiment of the present invention in prior art camera module
The support 50 is arranged on the upper surface of sealant 40 by the camera module of offer, is reduced parallel to the circuit board 10
In surface, the area of the camera module, so as to reduce the size of the camera module, it is lightening to be adapted to electronic product
Development.
On the basis of any of the above-described embodiment, in one embodiment of the invention, the sensitive chip 20 is boss
Shape, including the first part and the second part positioned at the first part surface, second part
Upper surface be less than the upper surface of first part, the electric connection line 30 electrically connected first in the sensitive chip 20
The upper surface of part.In embodiments of the present invention, the sensitive chip 20 is boss shape, has a boss face, so as to
So that the electric connection line 30 is arranged in the boss face with one end that the sensitive chip 20 electrically connects, i.e., described electrical connection
One end that line 30 electrically connects with the sensitive chip 20 electrically connects the upper surface of the first part in the sensitive chip 20, drop
The technology difficulty of the low follow-up sealant 40, while reduce in the surface direction of circuit board 10, the shooting mould
The thickness of group, further reduces the size of the camera module, is adapted to the lightening development of electronic product.
On the basis of above-described embodiment, in one embodiment of the invention, at the peak of the electric connection line 30
Less than the upper surface of second part, to reduce the thickness for the sealant 40 being subsequently formed.Specifically, in the present embodiment
One embodiment in, the upper surface of the sealant 40 is concordant with the upper surface of second part, the present invention
In another embodiment, the upper surface of the sealant 40 is slightly above the upper surface of second part, and the present invention is to this
Do not limit, specifically depend on the circumstances.
On the basis of any of the above-described embodiment, in one embodiment of the invention, the camera module also includes：Gu
The optical filter 60 being scheduled on the support 50, the optical filter 60 are located at the camera lens 80 towards the side of sensitive chip 20,
Light for being gathered to the camera lens 80 filters, and is formed between the optical filter 60 and the sensitive chip 20
Chamber.
It should be noted that due to the camera module when making and/or follow-up assembling, it is necessary to heat, therefore, upper
On the basis of stating embodiment, in one embodiment of the invention, the camera module also includes：It is arranged in the support 50
Passage 70, the passage 70 is connected with the cavity, to keep the cavity and the external world by the passage 70
The air pressure balance of environment, avoid expanding with heat and contract with cold caused by heating and cause the optical filter 60 to deform.
To sum up, compared to the technical scheme on circuit board is secured the stand in prior art camera module, the present invention is in fact
While applying the camera module that example provided and be used to protect the electrical connection by the sealant 40, the sealant 40 is also utilized
As the supporting surface of the support 50, reduce parallel in the surface of circuit board 10, the area of the camera module, so as to
The size of the camera module is reduced, is adapted to the lightening development of electronic product.
Accordingly, the embodiment of the present invention additionally provides a kind of preparation method of camera module, as shown in Fig. 2 the making side
Method includes：
S1：As shown in figure 3, sensitive chip 20 is bonded on the first surface of circuit board 10.Optionally, at one of the present invention
In embodiment, the circuit board 10 is pcb board, but the present invention is not limited this, is specifically depended on the circumstances.
S2：Continue as shown in figure 3, forming the electric connection line 30 for electrically connecting the circuit board 10 and the sensitive chip 20.
In one embodiment of the invention, the sensitive chip 20 is boss shape, including the first part and is located at
Second part on the first part surface, the upper surface of second part are less than the first composition portion
The upper surface divided, the electric connection line 30 electrically connect the upper surface of the first part in the sensitive chip 20 so that described
Sensitive chip 20 has a boss face, so as to which the electric connection line 30 is set with one end that the sensitive chip 20 electrically connects
Put in the boss face, i.e., one end that described electric connection line 30 electrically connects with the sensitive chip 20 electrically connects the photosensitive core
The upper surface of first part in piece 20, reduces the technology difficulty of the follow-up sealant 40, while reduces perpendicular to described
In the surface direction of circuit board 10, the thickness of the camera module, further reduce the size of the camera module, be adapted to electronics
The lightening development of product.
Specifically, in one embodiment of the invention, formed and electrically connect the circuit board 10 and the sensitive chip 20
Electric connection line 30 include：Using the anti-mode for beating gold thread, formed and electrically connect the circuit board 10 and the sensitive chip 20
Electric connection line 30.
It should be noted that when forming the electric connection line 30, if first electrically connecting the electric connection line 30 and the sense
Optical chip 20, the electric connection line 30 and the circuit board 10 are electrically connected afterwards, then just to beat gold thread；If first electrically connect the electricity
Connecting line 30 and the circuit board 10, electrically connect the electric connection line 30 and the sensitive chip 20 afterwards, then instead to beat gold thread.
On the basis of any of the above-described embodiment, in one embodiment of the invention, the camber of electric connection line 30
Peak is not higher than the surface of second part, and optionally, the peak of the camber of electric connection line 30 is less than described
The surface of second part, to reduce the thickness for the sealant 40 being subsequently formed, but the present invention is not limited this, specifically
Depend on the circumstances.
S3：As shown in figure 4, forming sealant 40 on the circuit board 10, the first assembly element is formed, wherein described close
Sealing 40 is used to seal the electric connection line 30.
In one embodiment of the present embodiment, the upper surface of the sealant 40 and the upper table of second part
Face is concordant, and in another embodiment of the present invention, the upper surface of the sealant 40 is slightly above second part
Upper surface, the present invention are not limited this, specifically depended on the circumstances.
Specifically, on the basis of any of the above-described embodiment, in one embodiment of the invention, the sealant 40 is
Plastic layer, its formation process are Plastic Package, but the present invention is not limited this, is specifically depended on the circumstances.
On the basis of any of the above-described embodiment, in one embodiment of the invention, formed on the circuit board 10
Also include before sealant 40：The semi-finished product module formed to the circuit board 10 and the sensitive chip 20 cleans, with
Prevent dust, particle etc. from polluting.
S4：As shown in fig. 7, in the upper surface fixed support 50 of sealant 40.
In one embodiment of the invention, as shown in figure 5, before the upper surface fixed support 50 of the sealant 40
Also include：Optical filter 60 is attached on the support 50, forms the second assembly element, to utilize the optical filter 60 to the mirror
The light of first 80 collection is filtered.Then, as shown in fig. 6, the support 50 to be fixed on to the upper table of the sealant 40 again
Face.
It should be noted that after the support 50 is fixed on the sealant 40, the optical filter 60 and the sense
A cavity can be formed between optical chip 20.
It should be noted that due to the camera module when making and/or follow-up assembling, it is necessary to heat, therefore, upper
On the basis of stating embodiment, in one embodiment of the invention, the preparation method also includes：Formed in the support 50 logical
Stomata 70, the passage 70 are connected with the cavity, to keep the cavity and external environment by the passage 70
Air pressure balance, avoid expanding with heat and contract with cold caused by heating and causing the optical filter 60 to deform.
S5：Camera lens 80 is carried on the support 50.
Support 50 is fixed into technical scheme on the circuit board 10 compared in prior art camera module, utilizes the present invention
The camera module that the camera module preparation method that embodiment is provided makes, the sealant 40 is used to protect the electrical connection
While, the supporting surface also by the use of the sealant 40 as the support 50, reduce parallel to the surface of circuit board 10
It is interior, the area of the camera module, so as to reduce the size of the camera module, it is adapted to the lightening hair of electronic product
Exhibition.Moreover, the preparation method for the camera module that the embodiment of the present invention is provided, simple and easy, be advantageous to be widely popularized.
Various pieces are described by the way of progressive in this specification, and what each some importance illustrated is and other parts
Difference, between various pieces identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
Embodiment illustrated herein is not intended to be limited to, and is to fit to consistent with principles disclosed herein and features of novelty
Most wide scope.
Claims (11)
- A kind of 1. camera module, it is characterised in that including：Circuit board；Positioned at the sensitive chip of the circuit board first surface；Electrically connect the electric connection line of the circuit board and the photosensitive core；Seal the sealant of the electric connection line；Support positioned at the sealant upper surface；Carry camera lens on the bracket.
- 2. camera module according to claim 1, it is characterised in that the sensitive chip is boss shape, including first group The second part into part and positioned at the first part surface, the upper surface of second part is less than institute The upper surface of the first part is stated, the electric connection line electrically connects the upper surface of the first part in the sensitive chip.
- 3. camera module according to claim 2, it is characterised in that less than described the at the peak of the electric connection line The upper surface of two parts.
- 4. camera module according to claim 3, it is characterised in that the upper surface of the sealant and the described second composition Partial upper surface is concordant.
- 5. camera module according to claim 3, it is characterised in that the upper surface of the sealant is higher than described second group Into the upper surface of part.
- 6. camera module according to claim 1, it is characterised in that the camera module also includes：It is fixed on the branch Optical filter on frame, the optical filter are located at the camera lens towards the sensitive chip side, and the optical filter and the sense A cavity is formed between optical chip.
- 7. camera module according to claim 6, it is characterised in that the camera module also includes：The passage being arranged in the support, the passage are connected with the cavity.
- A kind of 8. preparation method of camera module, it is characterised in that including：Sensitive chip is bonded on circuit boards；Form the electric connection line for electrically connecting the circuit board and the sensitive chip；Sealant is formed on the circuit board, forms the first assembly element, wherein the sealant is used to seal described be electrically connected Wiring；In sealant upper surface fixed support；Camera lens is carried on the bracket.
- 9. described preparation method according to claim 8, it is characterised in that in the upper surface fixed support of the sealant Also include before：Optical filter is attached on the bracket, forms the second assembly element.
- 10. preparation method according to claim 8, it is characterised in that formed and electrically connect the circuit board and described photosensitive The electric connection line of chip includes：Using the anti-mode for beating gold thread, the electric connection line for electrically connecting the circuit board and the sensitive chip is formed.
- 11. preparation method according to claim 8, it is characterised in that formed on the circuit board before sealant also Including：The semi-finished product module formed to the circuit board and the sensitive chip cleans.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710854575.3A CN107483792B (en) | 2017-09-20 | 2017-09-20 | Camera module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710854575.3A CN107483792B (en) | 2017-09-20 | 2017-09-20 | Camera module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107483792A true CN107483792A (en) | 2017-12-15 |
| CN107483792B CN107483792B (en) | 2020-11-06 |
Family
ID=60585481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710854575.3A Active CN107483792B (en) | 2017-09-20 | 2017-09-20 | Camera module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107483792B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864327A (en) * | 2017-12-19 | 2018-03-30 | 广东欧珀移动通信有限公司 | Chip assembly, camera and electronic equipment |
| CN107888817A (en) * | 2017-12-19 | 2018-04-06 | 广东欧珀移动通信有限公司 | Chip assembly, camera and electronic equipment |
| CN107995401A (en) * | 2017-12-19 | 2018-05-04 | 广东欧珀移动通信有限公司 | Chip assembly, camera, the assembly technology of electronic equipment and camera |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1534999A (en) * | 2003-03-31 | 2004-10-06 | ������������ʽ���� | Small camera assembly |
| CN105704354A (en) * | 2016-03-12 | 2016-06-22 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof and manufacturing method |
| CN206040618U (en) * | 2016-06-16 | 2017-03-22 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and module of making a video recording |
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2017
- 2017-09-20 CN CN201710854575.3A patent/CN107483792B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1534999A (en) * | 2003-03-31 | 2004-10-06 | ������������ʽ���� | Small camera assembly |
| CN105704354A (en) * | 2016-03-12 | 2016-06-22 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof and manufacturing method |
| CN206040618U (en) * | 2016-06-16 | 2017-03-22 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and module of making a video recording |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864327A (en) * | 2017-12-19 | 2018-03-30 | 广东欧珀移动通信有限公司 | Chip assembly, camera and electronic equipment |
| CN107888817A (en) * | 2017-12-19 | 2018-04-06 | 广东欧珀移动通信有限公司 | Chip assembly, camera and electronic equipment |
| CN107995401A (en) * | 2017-12-19 | 2018-05-04 | 广东欧珀移动通信有限公司 | Chip assembly, camera, the assembly technology of electronic equipment and camera |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107483792B (en) | 2020-11-06 |
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