CN109819145B - Assembling method and recycling method of semi-finished product of camera module - Google Patents
Assembling method and recycling method of semi-finished product of camera module Download PDFInfo
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- CN109819145B CN109819145B CN201910048089.1A CN201910048089A CN109819145B CN 109819145 B CN109819145 B CN 109819145B CN 201910048089 A CN201910048089 A CN 201910048089A CN 109819145 B CN109819145 B CN 109819145B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention discloses a semi-finished product of a camera module and an assembling and recycling method thereof. The semi-finished product of the camera module comprises a circuit board and a photosensitive chip which is arranged on the circuit board and electrically connected with the circuit board, wherein a removable protective layer is arranged on a photosensitive area of the photosensitive chip. After the sensitization chip is installed on the circuit board, before until the sensitization chip is sealed, all adopt the protective layer to protect the sensitization region of sensitization chip, can reduce the sensitization chip circulation in-process impurity such as granule and pollute the sensitization region, be favorable to improving the yields of the module of making a video recording, the setting of protective layer and removal method are simple moreover, are favorable to improving the packaging efficiency of the module of making a video recording.
Description
Technical Field
The invention relates to assembly of a camera module, in particular to an assembly method and a recovery method of a semi-finished product of the camera module.
Background
With the development of intelligent electronic devices, the camera function becomes one of the indispensable functions of electronic terminals such as mobile phones. The conventional camera module is generally assembled by attaching a photosensitive element to a circuit board, then gold-plating or welding the photosensitive chip and the circuit board to form a conductive circuit, attaching a lens holder with a color filter to the circuit board (or forming the lens holder on the circuit board by a molding process), so that the color filter is opposite to a photosensitive area of the photosensitive chip, and then arranging an optical system assembly on the lens holder, thereby completing the overall assembly of the camera module. The camera module is required to meet good imaging quality and has no dirt on the surface of the photosensitive chip so as to ensure clear imaging without dirt.
However, in the whole process from the attachment of the photosensitive chip on the circuit board to the mounting of the lens holder, the photosensitive chip is exposed in the environment, so that the risk of surface contamination by particles exists, and the complete avoidance of the pollution is difficult even in an environment with an extremely high dust-free grade. Through the analysis of the particle dirt, the particle dirt is found to be sourced from various sources, such as scraps generated by abrasion of the surface of the jig, skin scraps of a human body and the like. In the existing process, it is difficult to completely avoid the generation of these particles, and it is impossible to completely remove the smudge adhered to the surface of the photosensitive chip by plasma water washing. In the prior art, the method usually adopts the steps of carrying out dirty machine vision inspection and manual CCD recheck before mounting, and manually removing dirty particles by using dust-sticking glue, and the method for inspecting and removing the dirty consumes much manpower, has long time and has low efficiency.
In addition, the module of making a video recording receives the influence of various factors in process of production, and its yield can not be 100%, especially makes a video recording module group survey section, because the equipment error or the inside partial that has the influence to the formation of image and is difficult to remove of module lead to the formation of image quality to reach the requirement of leaving the factory to define this module of making a video recording as the defective products. But the lens assembly in the defective product and the photosensitive chip assembly with higher cost can still be intact and can be reused. But when disassembling the module of making a video recording in order to retrieve the sensitization chip subassembly, can produce the piece pollution unavoidably and cause the pollution to the sensitization chip, glue for connecting each subassembly for example probably produces the piece when disassembling.
Disclosure of Invention
In order to overcome the defects of the prior art, an object of the present invention is to provide a method for assembling a semi-finished product of a camera module, which can effectively avoid or reduce the contamination of the surface of the photo-sensing chip before the lens holder assembly is mounted.
Another objective of the present invention is to provide a method for recycling a semi-finished product of a camera module, which can effectively prevent debris generated during the assembly and disassembly of the camera module from contaminating the photosensitive chip.
One of the purposes of the invention is realized by adopting the following technical scheme:
an assembling method of a semi-finished product of a camera module comprises the following steps:
s1, providing a circuit board attached with a photosensitive chip;
s2, arranging a protective layer on the surface of the photosensitive area of the photosensitive chip;
s3, removing the protective layer before the photosensitive chip is sealed;
the steps S2 and S3 include the steps of:
the step S2 specifically includes:
s21c, carrying out plasma cleaning on the photosensitive chip;
s22c, adhering the protective layer with certain viscosity on the photosensitive area of the photosensitive chip at least once;
the step S3 specifically includes:
before the photosensitive chip is sealed, carrying out plasma cleaning on the photosensitive chip so as to remove the protective layer on the surface of the photosensitive chip and remove dirt on the surface of the photosensitive chip;
alternatively, the steps S2 and S3 include the steps of:
the step S2 specifically includes:
s21c, carrying out plasma cleaning on the photosensitive chip;
s22c, adhering the protective layer with certain viscosity on the photosensitive area of the photosensitive chip at least once;
s21a, arranging a protective liquid on the photosensitive area of the photosensitive chip;
s22a, drying the photosensitive chip, wherein the protective solution is dried to form the protective layer;
the step S3 specifically includes:
before the photosensitive chip is sealed, the protective layer is cleaned and removed by using a solvent;
alternatively, the steps S2 and S3 include the steps of:
the step S2 specifically includes:
s21c, carrying out plasma cleaning on the photosensitive chip;
s22c, adhering the protective layer with certain viscosity on the photosensitive area of the photosensitive chip at least once;
s21b, setting a curable resin material on the photosensitive area of the photosensitive chip;
s22b, curing the resin material, thereby forming the protective layer on the surface of the photosensitive region;
the step S3 includes the steps of:
before the photosensitive chip is sealed, peeling the protective layer from the surface of the photosensitive chip;
alternatively, the steps S2 and S3 include the steps of:
the step S2 specifically includes:
s21c, carrying out plasma cleaning on the photosensitive chip;
s22c, adhering the protective layer with certain viscosity on the photosensitive area of the photosensitive chip at least once;
the step S3 specifically includes:
before the photosensitive chip is sealed, the protective layer is heated to shrink and deform, so that the protective layer automatically falls off from the surface of the photosensitive chip.
Further, the time interval between the step S1 and the step S2 is shorter than the time interval between the step S2 and the step S3, or the step S2 is performed before circulation of the wiring board provided with the photosensitive chip.
Further, the pH value of the protective solution is 6-7, and the thickness of the protective layer is 0.1-1 mm.
Further, the thickness of the protective layer is 0.1-1.5 mm.
Further, the step S3 is specifically: before the photosensitive chip is sealed, an adhesive is arranged on the protective layer, and then the protective layer and the adhesive are simultaneously peeled off from the surface of the photosensitive chip, wherein the adhesive force between the adhesive and the protective layer is greater than the adhesive force between the protective layer and the photosensitive chip.
Further, the step S3 is specifically: before the photosensitive chip is sealed, the protective layer is cleaned and removed by using a solvent.
Further, the following steps are also included between the step S2 and the step S3: molding the circuit board with the photosensitive chip to form a lens base; the step S3 is followed by the following steps: arranging a color filter on the lens base so that the color filter is opposite to the photosensitive chip; or, a lens is arranged on the lens base, so that the lens is opposite to the photosensitive chip.
Further, the protective layer does not cover the structure for electrically connecting the photosensitive core and the circuit board.
The second purpose of the invention is realized by adopting the following technical scheme:
a recovery method of a semi-finished product of a camera module is used for recovering a photosensitive chip, the semi-finished product of the camera module comprises the photosensitive chip and a lens base which are arranged on a circuit board, and the recovery method is characterized by comprising the following steps:
before the lens base is detached from the circuit board, a removable protective layer is formed on the surface of the light-sensitive area of the light-sensitive chip, and then the lens base is removed from the circuit board.
According to one embodiment, the recovery method comprises:
a1, before the microscope base is removed, arranging protective liquid on the photosensitive chip to make the protective liquid cover the photosensitive area of the photosensitive chip;
a2, drying the semi-finished product of the camera module, drying the protective solution to form the protective layer, and softening glue between the lens base and the circuit board by heating;
a3, removing the lens base from the circuit board.
According to another embodiment, the recovery method comprises:
b1, before the microscope base is removed, arranging a resin material on the photosensitive chip to enable the resin material to cover the photosensitive area of the photosensitive chip;
b2, curing the resin material to form a cross-linked network, the cured resin material forming the protective layer;
b3, removing the lens base from the circuit board.
Compared with the prior art, the invention has the beneficial effects that: according to the semi-finished product of the camera module and the assembling method of the semi-finished product of the camera module, after the photosensitive chip is installed on the circuit board and until the photosensitive chip is sealed, the photosensitive area of the photosensitive chip is protected by the protective layer, so that the photosensitive area is prevented from being polluted by particles and other impurities in the circulation process of the photosensitive chip, the yield of the camera module is improved, the protective layer is simple to arrange and remove, and the assembling efficiency of the camera module is improved; according to the camera module recovery method provided by the invention, the protective layer is formed on the photosensitive chip to protect the photosensitive area before the lens base is dismounted, so that the photosensitive area can be prevented from being polluted by debris generated during the dismounting of the lens base, meanwhile, the photosensitive area can be prevented from being polluted by particles in the circulation process of the photosensitive chip, and the yield of the camera module can be improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a semi-finished product of a camera module according to an embodiment of the present invention;
FIG. 2 is a schematic front view of a semi-finished product of a camera module according to an embodiment of the present invention;
FIG. 3 is a schematic flow chart illustrating a method for assembling a camera module according to a first embodiment of the present invention;
FIG. 4 is a schematic flow chart illustrating a second embodiment of a method for assembling a camera module according to the present invention;
FIG. 5 is a schematic flow chart illustrating a method for assembling a camera module according to a third embodiment of the present invention;
FIG. 6 is a schematic flow chart illustrating a fourth exemplary embodiment of a method for assembling a camera module according to the present invention;
FIG. 7 is a schematic flow chart illustrating a fifth exemplary embodiment of a method for assembling a camera module according to the present invention;
FIG. 8 is a schematic flow chart illustrating a method for recycling a semi-finished product of a camera module according to an embodiment of the present invention;
in the figure: 1. a circuit board; 2. a photosensitive chip; 21. a light-sensitive region; 22. a non-photosensitive region; 3. a protective layer; 4. a lens base; 5. a color filter; 6. a lens; 8. an adhesive; 9. and (4) gold wires.
Detailed Description
The present invention is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., it indicates that the orientation and positional relationship shown in the drawings are based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated without limiting the specific scope of protection of the present invention.
It should be noted that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of this application, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
As shown in fig. 1 and 2, the present invention provides a semi-finished product of a camera module, which includes a circuit board 1 and a photosensitive chip 2 disposed on the circuit board 1 and electrically connected to the circuit board 1, wherein a removable protective layer 3 is disposed on a photosensitive area 21 of the photosensitive chip 2.
Because the semi-finished product of the camera module of the invention is provided with the protective layer 3 on the photosensitive area 21 of the photosensitive chip 2, in the circulation process of the semi-finished product of the camera module, dirt such as scraps can not pollute the photosensitive area 21. After the semi-finished product of the camera module is circulated and completed and before the lens base is attached, the protective layer 3 is removed, so that the exposure time of the photosensitive area 21 can be greatly reduced, and the possibility of pollution of the photosensitive area 21 is reduced. During circulation, some particulate dirt may adhere to the protective layer 3 and be cleaned away with the removal of the protective layer 3. In addition, the lens seat may be formed on the circuit board 1 by a molding process, and the protective layer 3 may also protect the photosensitive chip 2 during molding, so as to prevent impurities in the molding material or the mold from contaminating the photosensitive region 21. In addition, before the protective layer 3 is disposed on the photosensitive chip 2, there may be dirt such as particles on the surface of the photosensitive chip 2, and after the protective layer 3 is disposed on the photosensitive chip 2, the dirt may adhere to the protective layer 3, and when the protective layer 3 is removed, the dirt may be removed along with the protective layer 3.
As will be understood by those skilled in the art, the surface of the photosensitive chip 2 includes a photosensitive area 21 and a non-photosensitive area 22, wherein the photosensitive area 21 is an area for receiving light, and if particles adhere to the photosensitive area 21, the image quality is affected, so the protective layer 3 needs to cover the photosensitive area 21 to prevent the photosensitive area 21 from being contaminated. The non-photosensitive region 22 does not receive light, and the structure for electrically connecting the circuit board 1 and the photosensitive chip 2 is disposed in the non-photosensitive region 22, so that the protective layer 3 preferably does not cover the electrical connection structure in order to avoid the influence of the formation process of the protective layer 3 or the protective layer 3 on the electrical connection structure of the circuit board 1 and the photosensitive chip 2. That is, the protective layer 3 may not cover the non-photosensitive region 22; alternatively, the protective layer 3 may cover part of the non-photosensitive region 22 but not contact the electrical connection structure located in the non-photosensitive region 22. The region within the dashed box in fig. 2 is the photosensitive region 21.
It should be noted that the electrical connection between the circuit board 1 and the photosensitive chip 2 can be realized by gold wires 9, or by other methods such as soldering, and the specific method of the electrical connection between the circuit board 1 and the photosensitive chip 2 is not limited in the present invention. Therefore, the electrical connection structure between the circuit board 1 and the photosensitive chip 2 can be, but is not limited to, gold wires and bonding pads.
The protection of protective layer 3 to sensitization chip 2 is interim protection, and the regional 21 surface of sensitization is polluted when mainly being used for avoiding making a video recording module semi-manufactured goods to flow the in-process or mould, consequently before installing sensitization chip 2 in the enclosure space, needs to get rid of protective layer 3 to avoid the unable protective layer 3 of getting rid of in later stage. The removal of the protective layer 3 can be performed by various methods, and the following methods for removing the protective layer 3 are only exemplary and not exhaustive.
In one embodiment, the protective layer 3 may be removed by plasma cleaning. The plasma cleaning is a flow for processing the photosensitive chip in the existing assembly process and is used for removing dirt on the surface of the photosensitive chip, the step is carried out before the lens holder is attached to the circuit board, namely, the time required for removing the protective layer 3 is the same as the time required for removing the protective layer 3, so that the removal of the protective layer 3 can be combined with the existing plasma cleaning step, the step of removing the protective layer 3 does not need to be added independently, and the change of the original process can be reduced. The protective layer 3 can be formed by selecting a substance capable of being removed by plasma cleaning by a person skilled in the art according to the prior art.
In another embodiment, the protective layer 3 may be peeled off integrally. The protective layer 3 may be, but is not limited to, a polyester-based adhesive film, such as a silicone film. Preferably, the protective layer 3 forms an integral crosslinked network so that cracking does not easily occur upon peeling. The protective layer 3 is preferably a low-viscosity adhesive film, so that the material of the protective layer 3 can be prevented from remaining on the photosensitive chip 2 during peeling. The protective layer 3 can be directly torn off, or an adhesive with higher viscosity can be adhered to the protective layer 3 and then torn off. The adhesive with higher adhesion is torn off from the protective layer 3, so that the material on the protective layer 3 is prevented from remaining on the photosensitive chip 2 in the stripping process. When the protective layer 3 is heated and can be shrunk and deformed, the protective layer can also be shrunk and deformed by heating, so that the protective layer can be automatically separated from the photosensitive chip 2.
In yet another embodiment, the protective layer 3 may be removed by means of solvent cleaning. Namely, the protective layer 3 is dissolved by the solvent, thereby achieving the purpose of removing the protective layer 3. The solvent used for dissolving the protective layer 3 differs depending on the protective layer 3, and may be water or an organic solvent. One skilled in the art can select a suitable solvent for removing the protective layer 3 according to the kind of the protective layer 3.
The protective layer 3 may be formed by various methods depending on the material of the protective layer 3. The following methods for forming the protective layer 3 are merely exemplary, but not exhaustive.
In some embodiments, the protective layer 3 is formed by drying a protective solution. When the protective layer 3 is prepared, the protective solution is first disposed in the photosensitive region 21 of the photosensitive chip 2, and then baked to remove the solvent in the protective solution, and solute molecules in the protective solution are stacked together to form the protective layer 3. The protective liquid may be disposed on the photosensitive chip 2 by coating or printing. In order to prevent the protective solution from corroding the photosensitive chip 2, the pH value of the protective solution is preferably 6-7. When the protective liquid is provided, if the protective liquid is too thin, it may cause a part of the photosensitive region 21 to be uncovered, and if the protective liquid is too thick, it is troublesome to remove the protective layer 3 at a later stage, and the thickness of the protective layer 3 is preferably 0.1 to 1 mm. The solvent of the protective solution can be water or an organic solvent, and the solute in the protective solution can be organic or inorganic. The person skilled in the art can select a suitable way to remove the protective layer 3, depending on the nature of the material of the protective layer 3.
In other embodiments, the protective layer 3 is formed of a resin material through curing. The curing method includes, but is not limited to, drying, thermal curing or photo-curing, where "drying" means that the resin material does not undergo a chemical crosslinking reaction, but only volatilization of the solvent, and "thermal curing" or "photo-curing" means that the resin material undergoes a chemical crosslinking reaction when reaching a certain temperature or receiving light of a certain wavelength. In preparing the protective layer 3, a resin material is first coated on the photosensitive chip 2, and then the resin material is cured to form the protective layer 3, and the cured resin material can be peeled off integrally. When the resin material is coated, if the coating is too thin, it may cause a part of the photosensitive region 21 to be uncovered, and if the coating is too thick, it is troublesome to remove the protective layer 3, and the thickness of the protective layer 3 is preferably 0.1 to 1.5 mm.
The invention also provides an assembly method of the semi-finished product of the camera module, as shown in fig. 3, 4, 5, 6 or 7, comprising the following steps:
s1, providing the circuit board 1 attached with the photosensitive chip 2;
s2, arranging a protective layer 3 on the surface of the light sensing area of the light sensing chip 2;
s3, before the photosensitive chip 2 is sealed, the protective layer 3 is removed.
The term "the photosensitive chip 2 is sealed" as used herein means that the photosensitive chip 2 is fixedly disposed in a sealed space, and thus the surface of the photosensitive chip 2 cannot be cleaned or decontaminated. It will be understood by those skilled in the art that the term "enclosed space" is not meant to be a completely sealed space, but rather, due to the enclosed nature of the space, the surface of the photosensitive chip 2 cannot be cleaned or decontaminated. The removal of the protective layer 3 therefore needs to be performed before the photosensitive chip 2 is sealed. The following list is a few cases where the photosensitive chip 2 is enclosed, and the following list is not an exhaustive list.
In some embodiments, after the photo sensor chip 2 is disposed on the circuit board 1, a lens holder assembly is integrally disposed on the circuit board 1, the lens holder assembly includes a lens holder 4 and a color filter 5 disposed on the lens holder 4, once the lens holder assembly is integrally attached to the circuit board 1, the photo sensor chip 2 is enclosed in a cavity formed by the lens holder 4, the circuit board 1 and the color filter 5, so that the removal of the protective layer 3 needs to be performed between the attachment of the lens holder assembly, as shown in the camera module assembly process of fig. 3.
In other embodiments, after the photosensitive chip 2 is disposed on the circuit board 1, the lens holder 4 is molded on the circuit board 1, that is, the circuit board 1 with the photosensitive chip 2 is first placed in a mold, a molding material is disposed on the circuit board 1 or even on a part of the surface of the photosensitive chip 2, the lens holder 4 is formed after the molding material is cured, and since the lens holder 4 has a light-passing hole, the photosensitive chip 2 is not yet sealed after the lens holder 4 is molded, so that the protective layer 3 does not need to be removed during molding, and actually, the protective layer 3 can play a role of protecting the photosensitive region 20 during molding. After the lens holder 4 is formed, the color filter 5 needs to be disposed at the light through hole of the lens holder 4, and once the color filter 5 is mounted, the photosensitive chip 2 is sealed, so that the protective layer 3 needs to be removed before the color filter 5 is disposed, as shown in the camera module assembly flow shown in fig. 4.
In some cases, the lens holder 4 is molded without providing the color filter 5, and the lens 6 having a color filtering function is directly mounted, in which case the protective layer 3 is removed before the lens 6 is mounted, as shown in the assembly process of the camera module in fig. 5.
The assembling method of the semi-finished product of the camera module mainly improves the steps before the photosensitive chip 2 is sealed, and aims to reduce the possibility of pollution of the photosensitive chip 2 and improve the yield of the camera module. The assembly of the photosensitive chip 2 and the circuit board 1 can be performed by referring to the prior art, and the method for sealing the photosensitive chip 2 (such as the attaching method of the lens holder assembly, the attaching method of the color filter, or the lens mounting method) can also be referred to the prior art, and the present invention is not described in detail.
In some embodiments, step S2 is performed before the circuit board 1 with the photosensitive chip 2 is circulated, so that the possibility of contamination of the photosensitive chip 2 can be reduced to the greatest extent. For example, the protective layer 3 may be provided after the photosensitive chip 2 and the wiring board 1 are electrically connected.
In other embodiments, the shorter the time interval between step S1 and step S2 is than the time interval between step S2 and step S3, the earlier the protective layer 3 is disposed on the photosensitive chip 2, the less the photosensitive chip 2 is in contact with the external environment, and thus the more effectively the possibility of contamination of the photosensitive chip 2 can be reduced. It should be noted that the time interval between the steps S1 and S2 is the time period after the step S1 is completed and before the step S2 is performed; similarly, the time interval between step S2 and step S3 refers to the time period after step S2 is completed and before step S3 is performed.
In step S2, the protective layer 3 may be provided by various methods, and several embodiments are exemplarily listed below.
In one embodiment, step S2 includes the steps of:
s21a, disposing a protective liquid on the photosensitive region of the photosensitive chip 2;
s22a, the photosensitive chip 2 is dried, and the protective liquid is dried to form the protective layer 3 on the surface of the photosensitive region.
In this embodiment, the protective layer 3 is formed by drying the protective solution, and in the prior art, after the photosensitive chip 2 is disposed on the wiring board 1, a drying step itself is required, so that the protective solution can be applied before the drying step. That is, the method of this embodiment can complete the formation of the protective layer 3 by using the existing steps in the prior art, which is beneficial to simplifying the assembly process and reducing the change to the original process.
The protective liquid may be disposed on the photosensitive chip 2 by coating or printing, but may be disposed in other manners. When the protective liquid is provided, if the protective liquid is too thin, a part of the photosensitive area may not be covered, and if the protective liquid is too thick, it is troublesome to remove the protective layer 3 at a later stage, and the thickness of the protective layer 3 is preferably 0.1-1 mm.
In order to prevent the protective solution from corroding the photosensitive chip 2, the pH value of the protective solution is preferably 6-7. The solvent of the protective solution can be water or an organic solvent, and the solute in the protective solution can be organic or inorganic. The person skilled in the art can select a suitable way to remove the protective layer 3, depending on the nature of the material of the protective layer 3.
In another embodiment, step S2 includes the steps of:
s21b, disposing a curable resin material on the photosensitive region of the photosensitive chip 2;
s22b, the resin material is cured, thereby forming the protective layer 3 on the surface of the photosensitive region.
In step S22b, the curing of the resin material may be drying, thermal curing or photo-curing, where "drying" refers to that the resin material does not undergo a chemical crosslinking reaction, but only volatilizes the solvent, and "thermal curing" or "photo-curing" refers to that the resin material undergoes a chemical crosslinking reaction when reaching a certain temperature or receiving light of a certain wavelength.
Preferably, the resin material forms an integral cross-linked network so that the protective layer 3 is not easily torn when peeled off from the surface of the photosensitive chip 2.
The protective layer 3 can be removed by adopting a stripping mode, and when the protective layer 3 is heated and can be subjected to shrinkage deformation, the protective layer 3 can also be subjected to heating so as to automatically separate from the surface of the photosensitive chip 2 by adopting the shrinkage deformation of the protective layer.
The resin material may be provided on the photosensitive chip 2 by coating or printing, but may be provided in other manners. When the resin material is provided, if the resin material is too thin, it may cause a part of the photosensitive region to be uncovered, and if it is too thick, it is troublesome to remove the protective layer 3 at a later stage, and the thickness of the protective layer 3 is preferably 0.1 to 1.5 mm.
In yet another embodiment, as shown in the flow chart of the assembling method shown in fig. 6, the step S2 includes the following steps:
s21c, performing plasma cleaning on the photosensitive chip 2;
s22c, the protective layer 3 with a certain viscosity is attached to the photosensitive area of the photosensitive chip 2 at least once.
In step S21c, the photosensitive chip 2 is plasma-cleaned for the purpose of removing most of the contaminants or particles. In step S22c, the protective layer 3 having a certain viscosity is attached to the photo chip 2 at least once for removing particles or stains that are not removed in the plasma cleaning.
It is worth mentioning that the protective layer 3 in this embodiment is a protective paste, which can be integrally adhered to the photosensitive chip 2 and also integrally removed from the photosensitive chip 2, and since the protective paste has high viscosity, particles or dirt on the photosensitive chip 2 can be removed when it is adhered to the photosensitive chip 2.
In step S3, the removal of the protective layer 3 can be achieved by various methods, and several embodiments are exemplarily listed below.
In one embodiment, the removal of the protective layer 3 is achieved using plasma cleaning. In the prior art, before the photosensitive chip 2 is sealed, plasma cleaning is also required to remove surface impurities, so that the protective layer 3 can be removed in the step. That is, the method of this embodiment can complete the removal of the protective layer 3 by using the existing steps in the prior art, which is beneficial to simplifying the assembly process and reducing the influence on the original process. In this embodiment, step S3 is specifically: before the photosensitive chip 2 is sealed, the photosensitive chip 2 is subjected to plasma cleaning, and the protective layer 3 on the surface of the photosensitive chip 2 is removed.
In another embodiment, the protective layer 3 is formed by curing a resin material, and the removal of the protective layer 3 is achieved by peeling. Step S3 specifically includes: before the photosensitive chip 2 is sealed, the protective layer 3 is peeled off from the surface of the photosensitive chip 2; alternatively, before the photosensitive chip 2 is sealed, a high-viscosity adhesive 8 is first disposed on the low-viscosity protective layer 3, and then the protective layer 3 and the adhesive 8 are simultaneously peeled off from the surface of the photosensitive chip 2, as shown in the assembly flow diagram of fig. 7.
Preferably, the protective layer 3 is made of a material having a low viscosity, so that the material of the protective layer 3 is prevented from remaining on the photosensitive chip 2 during peeling. In addition, by providing the highly adhesive 8 on the protective layer 3, the adhesive force between the adhesive 8 and the protective layer 3 is made larger than the adhesive force between the protective layer 3 and the photosensitive chip 2, and it can be further avoided that the material of the protective layer 3 remains on the photosensitive chip 2 when peeling off.
In some cases, the protective layer 3 is adapted to be shrunk and deformed when heated, so that the protective layer 3 can be automatically and integrally peeled off from the photosensitive chip 2. In this case, step S3 specifically includes: before the photosensitive chip 2 is sealed, the protective layer 3 is heated to be shrunk and deformed, so that the protective layer 3 automatically falls off from the surface of the photosensitive chip 2.
In still another embodiment, the protective layer 3 may be dissolved in a solvent, so that the protective layer 3 is removed using the solvent. Step S3 specifically includes: before the photosensitive chip 2 is sealed, the protective layer 3 is removed by solvent cleaning. In this embodiment, the solvent may dissolve the protective layer 3, thereby removing it from the surface of the photosensitive chip 2.
In some embodiments, the assembly method of the present invention further comprises, after step S3, the steps of:
s4a, providing a lens holder assembly, wherein the lens holder assembly comprises a lens holder 4 and a color filter 5, the color filter 5 is attached at the through hole of the lens holder 4, and the lens holder assembly is disposed on the circuit board 1 such that the color filter 5 is opposite to the photosensitive chip 2.
In other embodiments, the assembly method of the present invention further comprises, between steps S2 and S3, the steps of: the circuit board 1 with the photosensitive chip 2 is molded to form the mirror base 4. It will be appreciated that the photosensitive areas 21 on the photosensitive chip 2 are not covered by the molding material when the lens holder 4 is molded.
Further, step S3 is followed by the following steps: s4b, disposing the color filter 5 on the mirror base 4 such that the color filter 5 is opposed to the photosensitive chip 2; alternatively, the lens 6 is provided on the lens holder 4 such that the lens 6 faces the photosensitive chip 2.
The invention also provides a method for recovering the semi-finished product of the camera module, which is used for recovering the photosensitive chip 2, the semi-finished product of the camera module comprises the photosensitive chip 2 and the lens holder 4 which are arranged on the circuit board 1, and as shown in figure 8, the method for recovering the semi-finished product of the camera module comprises the following steps: before the lens holder 4 is detached from the circuit board 1, a removable protective layer 3 is formed on the surface of the photosensitive region of the photosensitive chip 2, and then the lens holder 4 is removed from the circuit board 1.
The recovery method provided by the invention is mainly used for: and recovering the photosensitive chip 2 from the semi-finished product of the camera module which is not detached from the lens base 4. The beneficial effects are as follows: the piece that produces when can avoiding microscope base 4 to remove pollutes the surface of sensitization chip 2, retrieves 2 surfaces of sensitization chip that obtain moreover and is equipped with protective layer 3, consequently at the circulation in-process, sensitization chip 2 can not be contaminated, and when the sensitization chip 2 of retrieving was assembled once more, then can get rid of protective layer 3.
It is worth mentioning that when the protection layer 3 is disposed on the photosensitive chip 2, it is necessary to ensure that the photosensitive chip 2 is not sealed, so as to allow the material forming the protection layer 3 to enter the surface of the photosensitive area of the photosensitive chip 2. Preferably, the light-passing hole of the lens holder 4 is in an open state, and the material forming the protective layer 3 may be disposed on the surface of the photosensitive chip 2 through the light-passing hole of the lens holder 4.
In some embodiments, the method for recovering the semi-finished product of the camera module specifically comprises the following steps:
a1, before the lens base 4 is removed, a protective liquid is arranged on the photosensitive chip 2, so that the protective liquid covers the photosensitive area of the photosensitive chip 2;
a2, drying the semi-finished product of the camera module, drying the protective liquid to form a protective layer 3, and softening the glue between the lens seat 4 and the circuit board 1 by heating;
and A3, removing the lens holder 4 from the circuit board 1.
In this embodiment, the protective liquid is first provided on the photosensitive chip 2, and then dried, thereby forming the protective layer 3. In the process of drying the protective liquid, the glue originally used for connecting the lens holder 4 and the circuit board 1 is heated and softened, so that the lens holder 4 can be removed from the circuit board 1. The formed protective layer 3 can be removed by, but not limited to, plasma cleaning when the photosensitive chip 2 is assembled again. The type and the set thickness of the protective liquid can refer to the setting of the protective liquid in the assembling method of the semi-finished product of the camera module. The protective liquid may be disposed on the photosensitive chip 2 by coating or printing.
In other embodiments, the method for recovering the semi-finished product of the camera module specifically comprises the following steps:
b1, before the lens holder 4 is removed, arranging a resin material on the photosensitive chip 2, so that the resin material covers the photosensitive area of the photosensitive chip 2;
b2, curing the resin material to form a crosslinked network, and forming the protective layer 3 from the cured resin material;
b3, removing the lens holder 4 from the circuit board 1.
Step B3 can be performed by heating to soften the glue, so as to remove the lens holder 4, or can be performed by other methods to remove the lens holder 4.
The resin material may be provided on the photosensitive chip 2 by coating or printing, or the like. The curing of the resin material may be, but is not limited to, drying, thermal curing, or photo-curing. When the photosensitive chip 2 is assembled again and the protective layer 3 needs to be removed, the photosensitive chip can be removed by peeling. When the protective layer 3 is heated and can be shrunk and deformed, the protective layer 3 can be shrunk and automatically separated from the photosensitive chip 2 by heating the protective layer 3.
Further, particles or stains may be present on the photosensitive chip 2 before the resin material is provided on the photosensitive chip 2, and the protective layer 3 formed after the resin material is cured has a certain viscosity, and when the protective layer 3 is peeled off, these particles or stains can be removed together with the protective layer 3.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (9)
1. The assembling method of the semi-finished product of the camera module is characterized by comprising the following steps:
s1, providing a circuit board attached with a photosensitive chip;
s2, arranging a protective layer on the surface of the photosensitive area of the photosensitive chip;
s3, removing the protective layer before the photosensitive chip is sealed;
the steps S2 and S3 include the steps of:
the step S2 specifically includes:
s21c, carrying out plasma cleaning on the photosensitive chip;
s22c, adhering the protective layer with certain viscosity on the photosensitive area of the photosensitive chip at least once;
the step S3 specifically includes:
before the photosensitive chip is sealed, carrying out plasma cleaning on the photosensitive chip so as to remove the protective layer on the surface of the photosensitive chip and remove dirt on the surface of the photosensitive chip;
alternatively, the steps S2 and S3 include the steps of:
the step S2 specifically includes:
s21c, carrying out plasma cleaning on the photosensitive chip;
s22c, adhering the protective layer with certain viscosity on the photosensitive area of the photosensitive chip at least once;
s21a, arranging a protective liquid on the photosensitive area of the photosensitive chip;
s22a, drying the photosensitive chip, wherein the protective solution is dried to form the protective layer;
the step S3 specifically includes:
before the photosensitive chip is sealed, the protective layer is cleaned and removed by using a solvent;
alternatively, the steps S2 and S3 include the steps of:
the step S2 specifically includes:
s21c, carrying out plasma cleaning on the photosensitive chip;
s22c, adhering the protective layer with certain viscosity on the photosensitive area of the photosensitive chip at least once;
s21b, setting a curable resin material on the photosensitive area of the photosensitive chip;
s22b, curing the resin material, thereby forming the protective layer on the surface of the photosensitive region;
the step S3 includes the steps of:
before the photosensitive chip is sealed, peeling the protective layer from the surface of the photosensitive chip;
alternatively, the steps S2 and S3 include the steps of:
the step S2 specifically includes:
s21c, carrying out plasma cleaning on the photosensitive chip;
s22c, adhering the protective layer with certain viscosity on the photosensitive area of the photosensitive chip at least once;
the step S3 specifically includes:
before the photosensitive chip is sealed, the protective layer is heated to shrink and deform, so that the protective layer automatically falls off from the surface of the photosensitive chip.
2. The method for assembling a camera module semi-finished product according to claim 1, wherein a time interval between the step S1 and the step S2 is shorter than a time interval between the step S2 and the step S3, or the step S2 is performed before circulation of the wiring board provided with the photosensitive chip.
3. The method for assembling the semi-finished product of the camera module according to claim 1, wherein the ph value of the protective liquid is 6-7, and the thickness of the protective layer is 0.1-1 mm.
4. The method for assembling a semi-finished product of a camera module according to claim 1, wherein the thickness of the protective layer is 0.1-1.5 mm.
5. The method for assembling a camera module semi-finished product according to any one of claims 1, 2 or 4, wherein the step S3 is specifically as follows: before the photosensitive chip is sealed, an adhesive is arranged on the protective layer, and then the protective layer and the adhesive are simultaneously peeled off from the surface of the photosensitive chip, wherein the adhesive force between the adhesive and the protective layer is greater than the adhesive force between the protective layer and the photosensitive chip.
6. The method for assembling a camera module semi-finished product according to any one of claims 1 to 4, wherein the step S3 is specifically as follows: before the photosensitive chip is sealed, the protective layer is cleaned and removed by using a solvent.
7. The method for assembling a camera module semi-finished product according to claim 1, further comprising the following steps between the step S2 and the step S3: molding the circuit board with the photosensitive chip to form a lens base; the step S3 is followed by the following steps: arranging a color filter on the lens base so that the color filter is opposite to the photosensitive chip; or, a lens is arranged on the lens base, so that the lens is opposite to the photosensitive chip.
8. The method for assembling a camera module semi-finished product according to claim 1, wherein the protective layer does not cover the structure for electrically connecting the photosensitive core and the circuit board.
9. A recovery method of a semi-finished product of a camera module is used for recovering a photosensitive chip, the semi-finished product of the camera module comprises the photosensitive chip and a lens base which are arranged on a circuit board, and the recovery method is characterized by comprising the following steps:
before the lens base is detached from the circuit board, a removable protective layer is formed on the surface of the light-sensitive area of the light-sensitive chip, and then the lens base is removed from the circuit board;
the recovery method comprises the following steps:
a1, before the microscope base is removed, arranging protective liquid on the photosensitive chip to make the protective liquid cover the photosensitive area of the photosensitive chip;
a2, drying the semi-finished product of the camera module, drying the protective solution to form the protective layer, and softening glue between the lens base and the circuit board by heating;
a3, removing the microscope base from the circuit board;
alternatively, the recovery method comprises:
b1, before the microscope base is removed, arranging a resin material on the photosensitive chip to enable the resin material to cover the photosensitive area of the photosensitive chip;
b2, curing the resin material to form the protective layer;
b3, removing the lens base from the circuit board.
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| CN110238540A (en) * | 2019-05-31 | 2019-09-17 | 苏州五方光电材料有限公司 | A kind of processing method of optical mirror slip |
| CN110286457A (en) * | 2019-05-31 | 2019-09-27 | 苏州五方光电材料有限公司 | A kind of eyeglass microscope base assembly technology |
| CN113132585B (en) * | 2020-01-10 | 2022-09-09 | 宁波舜宇光电信息有限公司 | Photosensitive chip assembly, mobile terminal, camera module and preparation method thereof |
| CN113132586B (en) * | 2020-01-10 | 2022-09-09 | 宁波舜宇光电信息有限公司 | Photosensitive chip assembly, camera module and electronic equipment |
| CN113334066A (en) * | 2021-05-17 | 2021-09-03 | 湖北三赢兴光电科技股份有限公司 | Assembling method and device for COB module |
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