CN102116918B - Method for preparing lens module - Google Patents
Method for preparing lens module Download PDFInfo
- Publication number
- CN102116918B CN102116918B CN200910312646.2A CN200910312646A CN102116918B CN 102116918 B CN102116918 B CN 102116918B CN 200910312646 A CN200910312646 A CN 200910312646A CN 102116918 B CN102116918 B CN 102116918B
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- Prior art keywords
- layer
- photoresist layer
- transparency carrier
- lens barrel
- lens module
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Abstract
The invention relates to a method for preparing a lens module, which comprises the following steps of: providing a transparent substrate; forming a first photo-resist layer which comprises a main body and a hogged part on the transparent substrate; forming hardened layers on the transparent substrate and the first photo-resist layer; forming second photo-resist layers on the hardened layers; grinding the hardened layers to ensure the hogged part is exposed outside; removing the first photo-resist layer and the second photo-resist layers to ensure that the hardened layers form a lens barrel part; forming infrared cut-off filter layers on the transparent substrate and the lens barrel part; forming third photo-resist layers on the infrared cut-off filter layers; removing the parts of the infrared cut-off filter layers, which are not covered by the third photo-resist layers; removing the third photo-resist layers to form an optical element which comprises an infrared cut-off optical filter part and the lens barrel part; arranging a lens set in the lens barrel part and at one side of the infrared cut-off optical filter part; and packaging the lens barrel part with the lens set on a circuit board. The lens module product prepared by the method has high yield.
Description
Technical field
The present invention relates to a kind of preparation method of camera lens module.
Background technology
Along with development of science and technology, portable set, the application of electronic product such as mobile phone, digital camera that for example has the camera function of taking pictures is increasingly extensive, and more and more tends to compactization.The portability of portable set and miniaturization have proposed the requirement of miniaturization to the camera lens module of combination with it.According to this area present situation, the various piece of camera lens module prepares respectively in the chain in preparation, for example, assembles after lens barrel, lens set, cutoff filter prepared respectively.Yet, along with the miniaturization of each parts, assemble these parts and become difficult, and make the product yield reduce.
Summary of the invention
In view of this, be necessary to provide a kind of assembling difficulty lower, the preparation method of the camera lens module that the product yield is higher.
A kind of preparation method of camera lens module may further comprise the steps: transparency carrier is provided; Form first photoresist layer at transparency carrier, first photoresist layer comprises main body and is positioned at the portion that arches upward at main body middle part; Form hardened layer at transparency carrier and first photoresist layer, hardened layer comprise around the main body of transparency carrier and photoresist layer around portion, be positioned at the teat in the portion of arching upward and be positioned at supporting part around the portion of arching upward; Supporting part at hardened layer forms second photoresist layer, and the height of second photoresist layer is less than the height of teat; Teat to hardened layer carries out milled processed, so that outside the portion of arching upward of first photoresist layer is exposed to; First photoresist layer and second photoresist layer are removed, so that the common lens barrel portion that forms of the portion that centers on of hardened layer and supporting part, lens barrel portion comprises an opening; Form the IR-cut filter layer at transparency carrier and lens barrel portion; The position of the opening of corresponding lens barrel portion forms the 3rd photoresist layer on the IR-cut filter layer; The part except being covered by the 3rd photoresist layer of IR-cut filter layer is removed; The 3rd photoresist layer is removed, and to form optical element, optical element comprises by IR-cut filter layer formed cutoff filter portion and lens barrel portion; Be installed in a lens set in the lens barrel portion and be positioned at a side of cutoff filter portion; And the lens barrel portion that lens set will be installed is encapsulated on the circuit board, thereby makes the camera lens module.
Above-mentioned camera lens module comprises integrated cutoff filter portion and lens barrel portion, and operation is less when therefore assembling, and the assembling difficulty is lower.In addition, lens barrel portion and cutoff filter portion form by the coating mode on transparency carrier, and its thickness and formation position can comparatively accurately be controlled, so the yield of products obtained therefrom is higher.
Description of drawings
Fig. 1 is the diagrammatic cross-section by the camera lens module of preparation method's preparation of the camera lens module of the embodiment of the invention.
Fig. 2 is preparation method's process flow diagram of the camera lens module of the embodiment of the invention.
Fig. 3 to Figure 13 is the schematic cross-section of each step in the camera lens module preparation process of the embodiment of the invention.
The main element symbol description
| The |
100 |
| |
10 |
| |
11 |
| |
12 |
| First |
13 |
| |
131 |
| Portion arches upward | 133 |
| Hardened |
14 |
| Around |
141 |
| |
142 |
| |
143 |
| Electro- |
144 |
| Supporting |
145 |
| |
146 |
| |
15 |
| The IR- |
16 |
| The 3rd |
17 |
| |
20 |
| |
21 |
| Lens set | 30 |
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40 |
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50 |
Embodiment
Preparation method to camera lens module of the present invention is described in further detail below in conjunction with accompanying drawing.
See also Fig. 1, a kind of prepared camera lens module 100 of preparation method of the camera lens module by the embodiment of the invention comprises optical element 10, lens set 30 and circuit board 50.Optical element 10 comprises a cutoff filter portion 11 and a lens barrel portion 20.Cutoff filter portion 11 and lens barrel portion 20 are structure as a whole.Lens set 30 is located in the lens barrel portion 20 and is positioned at a side of cutoff filter portion 11.Circuit board 50 is fixed in away from an end of cutoff filter portion 11 in lens barrel portion 20.
See also Fig. 2, the preparation method of camera lens module 100 comprises the steps:
Step S1 provides a transparency carrier 12.In the present embodiment, transparency carrier 12 is penetrance greater than 95% optical glass.
Step S2 sees also Fig. 3, forms one first photoresist layer 13 on a surface of transparency carrier 12.First photoresist layer 13 comprises main body 131 and the portion that arches upward 133 that is stretched out and formed by main body 131 1 middle side parts.Arch upward the xsect of portion 133 for circular, and its diameter is roughly 1 millimeter.The arch upward top of portion 133 is H to the distance of transparency carrier 12.The method that forms first photoresist layer 13 is at first at the surface-coated layer of even photoresist of transparency carrier 12; use the light shield of predetermined pattern that first photoresist layer 13 is protected back irradiation exposure under the light of certain wavelength then; make the zone dissolving that is not exposed by solvent again, to form first photoresist layer 13.
Step S3 sees also Fig. 4 to Fig. 6, forms a hardened layer 14 at transparency carrier 12 and first photoresist layer 13.Hardened layer 14 comprise around transparency carrier 12 and the main body 131 around portion 141, be positioned at the teat 143 in the portion of arching upward 133 and be positioned at supporting part 145 on the main body 131.
Step at transparency carrier 12 and first photoresist layer, 13 formation hardened layers 14 is to form a light blocking layer 142 at transparency carrier 12 and first photoresist layer 13, form an electro-magnetic screen layer 144 at light blocking layer 142 then, form an anti oxidation layer 146 at electro-magnetic screen layer 144 again.Hardened layer 14 is made of light blocking layer 142, electro-magnetic screen layer 144 and anti oxidation layer 146.
Please refer again to Fig. 4, the step that forms light blocking layer 142 is sputter one deck chromium nitride film on first photoresist layer 13, to form light blocking layer 142.The effect of light blocking layer 142 is for avoiding useless light to enter camera lens module 100.
Please refer again to Fig. 5, the step that forms electro-magnetic screen layer 144 is sputter layer of metal copper film on light blocking layer 142, to form electro-magnetic screen layer 144.The effect of electro-magnetic screen layer 144 is can shield the external electromagnetic ripple to the interference of image sensor 40, thereby promotes image quality.
Please refer again to Fig. 6, the step that forms anti oxidation layer 146 is sputter one deck stainless steel film on electro-magnetic screen layer 144, to form anti oxidation layer 146.The effect of anti oxidation layer 146 is to prevent that electro-magnetic screen layer 144 from directly with the air contact oxidation taking place.
Step S4 sees also Fig. 7, at supporting part 145 formation second photoresist layer 15 of hardened layer 14.Second photoresist layer 15 is identical with the composition of first photoresist layer 13.The height of second photoresist layer 15 is less than the height of the teat 143 of hardened layer 14, and the top of second photoresist layer 15 equals the top of the portion that arches upward 133 of first photoresist layer 13 to the distance H of transparency carrier 12 to the distance B of transparency carrier 12.
Step S5 sees also Fig. 8, and the teat 143 of hardened layer 14 is carried out milled processed, so that outside the portion that arches upward 133 of first photoresist layer 13 is exposed to.In the present embodiment, use high-precision cmp (Chemical MechanicalPolishing, CMP) method is carried out milled processed to the teat 143 of hardened layer 14, removes anti oxidation layer 146, electro-magnetic screen layer 144 and the light blocking layer 142 of the portion that arches upward 133 tops that are positioned at first photoresist layer 13 successively.Because the distance H of transparency carrier 12 is arrived at the top of second photoresist layer 15 to the top that the distance B of transparency carrier 12 equals the portion that arches upward 133 of first photoresist layer 13, therefore when the surface that is ground to teat 143 and second photoresist layer 15 surperficial concordant, stop to grind, outside the upper surface of the portion that arches upward 133 of first photoresist layer 13 just is exposed at this moment.In the process of grinding, the hardened layer 14 between first photoresist layer 13 and second photoresist layer 15 has obtained good support and has fixed, and is difficult for deforming.The top that is appreciated that second photoresist layer 15 also can be greater than or less than the top of the portion that arches upward 133 of first photoresist layer 13 to the distance H of transparency carrier 12 to the distance B of transparency carrier 12.
Step S6 sees also Fig. 9, first photoresist layer 13 and second photoresist layer 15 is removed, so that the portion 141 that centers on of hardened layer 14 and the supporting part 145 common lens barrel portions 20 that form.In the present embodiment, utilize solvent that first photoresist layer 13 and second photoresist layer 15 are directly removed the dissolving back, to expose transparency carrier 12.Lens barrel portion 20 comprises an opening 21.
Step S7 sees also Figure 10, forms an IR-cut filter layer 16 at transparency carrier 12 and lens barrel portion 20.In the present embodiment, on the supporting part 145 of the surface of transparency carrier 12 and lens barrel portion 20, help plating method (Ion AssistedDeposition by ion, IAD) plate seven layers and replace overlapping film by silicon dioxide and tantalum pentoxide, to form IR-cut filter layer 16.
Step S8 sees also Figure 11, and the position of the opening 21 of corresponding lens barrel portion 20 forms the 3rd photoresist layer 17 on IR-cut filter layer 16.The 3rd photoresist layer 17 is identical with the composition of first photoresist layer 13.
Step S9, see also Figure 12, the part except being covered by the 3rd photoresist layer 17 of IR-cut filter layer 16 is removed, the a part of IR-cut filter layer 16 that is about to do not covered by the 3rd photoresist layer 17 is removed, and only stays to be positioned at the part IR-cut filter layer 16 that the 3rd photoresist layer 17 belows are positioned at opening 21.The method of removing part IR-cut filter layer 16 can be photoetching method or chemical method for etching.
Step S10 sees also Figure 13, the 3rd photoresist layer 17 is removed, to form optical element 10.Optical element 10 comprises by IR-cut filter layer 16 formed cutoff filter portion 11 and lens barrel portions 20.In the present embodiment, utilize solvent that the 3rd photoresist layer 17 dissolving backs are removed.
Step S11 please refer again to Fig. 1, lens set 30 is installed in the lens barrel portion 20 of optical element 10, and is positioned at a side of cutoff filter portion 11.
Step S12 is contained in lens barrel portion 20 that lens set 30 is installed on the circuit board 50 away from an end fixed sealing of cutoff filter portion 11, and the image sensor 40 that is positioned on the circuit board 50 is alignd with lens set 30.100 preparations of camera lens module finish.
The camera lens module 100 of the embodiment of the invention comprises integrated cutoff filter portion 11 and lens barrel portion 20, and operation is less when therefore assembling, and use mould that can be the least possible, thereby can save assembly cost greatly, reduces the assembling difficulty.In addition, lens barrel portion 20 and cutoff filter portion 11 form by plated film on transparency carrier 12, so it forms the position and thickness can comparatively accurately be controlled, and has dwindled the volume of camera lens module 100, under the prerequisite of the high yield that guarantees camera lens module 100, satisfy the miniaturization requirement preferably.
In addition, those skilled in the art can also do other variation in spirit of the present invention, and certainly, these are included within the scope of protection of present invention according to the variation that spirit of the present invention is done.
Claims (9)
1. the preparation method of a camera lens module may further comprise the steps:
Transparency carrier is provided;
Form first photoresist layer at this transparency carrier, this first photoresist layer comprises main body and is positioned at the portion that arches upward at this main body middle part;
Form hardened layer at this transparency carrier and this first photoresist layer, this hardened layer comprise around the main body of this transparency carrier and this first photoresist layer around portion, be positioned at the teat in this portion that arches upward and be positioned at supporting part around this portion of arching upward;
Supporting part at this hardened layer forms second photoresist layer, and the height of this second photoresist layer is less than the height of this teat;
This teat to this hardened layer carries out milled processed, so that outside the portion of arching upward of this first photoresist layer is exposed to;
This first photoresist layer and second photoresist layer are removed, so that the common lens barrel portion that forms of the portion that centers on of this hardened layer and supporting part, this lens barrel portion comprises an opening;
Form the IR-cut filter layer at this transparency carrier and lens barrel portion;
Position to opening that should lens barrel portion on this IR-cut filter layer forms the 3rd photoresist layer;
The part of this IR-cut filter layer except being covered by the 3rd photoresist layer removed;
The 3rd photoresist layer is removed, and to form optical element, this optical element comprises by this IR-cut filter layer formed cutoff filter portion and this lens barrel portion;
Be installed in a lens set in this lens barrel portion and be positioned at a side of this cutoff filter portion; And
The lens barrel portion that lens set is installed is encapsulated on the circuit board, thereby makes the camera lens module.
2. the preparation method of camera lens module as claimed in claim 1, it is characterized in that: form the step of a hardened layer for forming a light blocking layer at transparency carrier and this first photoresist layer at transparency carrier and this first photoresist layer, form an electro-magnetic screen layer at this light blocking layer then, form an anti oxidation layer at this electro-magnetic screen layer again, this hardened layer is made of this light blocking layer, this electro-magnetic screen layer and this anti oxidation layer.
3. the preparation method of camera lens module as claimed in claim 2 is characterized in that: form the step of a light blocking layer at this first photoresist layer for sputter one chromium nitride film on this first photoresist layer, to form this light blocking layer.
4. the preparation method of camera lens module as claimed in claim 2 is characterized in that: form the step of an electro-magnetic screen layer at this light blocking layer for sputter one metallic copper film on this light blocking layer, to form this electro-magnetic screen layer.
5. the preparation method of camera lens module as claimed in claim 2 is characterized in that: form the step of an anti oxidation layer at this electro-magnetic screen layer for sputter one stainless steel film on this electro-magnetic screen layer, to form this anti oxidation layer.
6. the preparation method of camera lens module as claimed in claim 1 is characterized in that: this second photoresist layer top equals this portion of arching upward to the distance of this transparency carrier to the distance of this transparency carrier.
7. the preparation method of camera lens module as claimed in claim 1, it is characterized in that: the step that forms an IR-cut filter layer in this transparency carrier and lens barrel portion replaces overlapping film for plating multilayer in this transparency carrier and lens barrel portion by silicon dioxide and tantalum pentoxide, to form this IR-cut filter layer.
8. the preparation method of camera lens module as claimed in claim 7, it is characterized in that: the step that forms an IR-cut filter layer in this transparency carrier and lens barrel portion replaces overlapping film for helping the plating method to plate seven layers by ion by silicon dioxide and tantalum pentoxide in this transparency carrier and lens barrel portion, to form this IR-cut filter layer.
9. the preparation method of camera lens module as claimed in claim 1 is characterized in that: the step that the part of this IR-cut filter layer except being covered by the 3rd photoresist layer removed is removed the part of this IR-cut filter layer except being covered by the 3rd photoresist layer for using photoetching method or chemical method for etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910312646.2A CN102116918B (en) | 2009-12-30 | 2009-12-30 | Method for preparing lens module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910312646.2A CN102116918B (en) | 2009-12-30 | 2009-12-30 | Method for preparing lens module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102116918A CN102116918A (en) | 2011-07-06 |
| CN102116918B true CN102116918B (en) | 2013-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910312646.2A Expired - Fee Related CN102116918B (en) | 2009-12-30 | 2009-12-30 | Method for preparing lens module |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014235291A (en) * | 2013-05-31 | 2014-12-15 | アルプス電気株式会社 | Optical element with lens tube and method of manufacturing the same |
| CN110271211A (en) * | 2019-06-10 | 2019-09-24 | Oppo广东移动通信有限公司 | Manufacturing method, eyeglass, camera lens, camera mould group and the electronic device of eyeglass |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614450A (en) * | 2003-11-08 | 2005-05-11 | 鸿富锦精密工业（深圳）有限公司 | Infrared-ray cut-off filter and its preparation |
| CN1828354A (en) * | 2005-03-04 | 2006-09-06 | 普立尔科技股份有限公司 | Camera module and its preparation method |
| CN1996084A (en) * | 2006-01-06 | 2007-07-11 | 鸿富锦精密工业（深圳）有限公司 | Lens barrel and lens module using same |
-
2009
- 2009-12-30 CN CN200910312646.2A patent/CN102116918B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614450A (en) * | 2003-11-08 | 2005-05-11 | 鸿富锦精密工业（深圳）有限公司 | Infrared-ray cut-off filter and its preparation |
| CN1828354A (en) * | 2005-03-04 | 2006-09-06 | 普立尔科技股份有限公司 | Camera module and its preparation method |
| CN1996084A (en) * | 2006-01-06 | 2007-07-11 | 鸿富锦精密工业（深圳）有限公司 | Lens barrel and lens module using same |
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| Publication number | Publication date |
|---|---|
| CN102116918A (en) | 2011-07-06 |
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