CN109672806A

CN109672806A - Camera module and photosensory assembly and its packaging method

Info

Publication number: CN109672806A
Application number: CN201710955836.0A
Authority: CN
Inventors: 梅哲文; 赵波杰; 田中武彦; 郭楠
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-10-13
Filing date: 2017-10-13
Publication date: 2019-04-23
Anticipated expiration: 2037-10-13
Also published as: CN109672806B

Abstract

Camera module and its photosensory assembly and packaging method, the photosensory assembly includes: wiring board, photosensitive element, molded base, step glue and filter element, wherein the photosensitive element is electrically connected to the wiring board, the photosensitive element has photosensitive region and non-photo-sensing region, the step glue is circumferentially set to the non-photo-sensing region of the photosensitive element, wherein the molded base is integrated in the wiring board, the photosensitive element and the step glue and the molded base has the extensional surface integrally extended from the step glue；The filter element is supported at the step glue to buffer buffering stress when filter element installation, and the extensional surface of the filter element and the molded base is separately, wherein being formed as the photosensitive element between the filter element, the step glue and the photosensitive element provides the optical window of passage of light.

Description

Camera module and photosensory assembly and its packaging method

Technical field

Camera module the present invention relates to a camera module field more particularly to one based on integral packaging technique and its photosensitive Component and packaging method.

Background technique

Camera module is one of an indispensable part of intelligent electronic device, citing ground but be not limited to smart phone, phase The intelligent electronic devices such as mechanical, electrical brain equipment, wearable device.And set in lightening, integrated trend intelligently, for The requirement of camera module is also higher and higher.

Particularly, in recent years, with the universal and development of smart machine, increasingly tend to lightening, correspondingly image mould Group will adapt to develop, and also increasingly require multifunctional integrated, lightening, miniaturization, so that camera module is assembled in intelligence The volume energy occupied needed for electronic equipment accordingly reduces, and meets equipment for the imaging requirements of camera module.Therefore camera shooting mould Group production firm is persistently dedicated to design, manufactures the camera module for meeting these requirements.

Molded packages technique is emerging on the basis of traditional COB (Chip on Board) packaging technology grow up A kind of encapsulation technology.It as shown in Figure 1A, is the circuit board assemblies being prepared using existing molded packages technique.In this knot In structure, a molded section 1 is packaged in a circuit board 2 by way of molded packages, integrally to coat at least the one of the circuit board Part and the electronic component for being assembled in the circuit board, such as sensitive chip 3, passive electronic component etc., and one filters Piece 4 is mounted on the top side of the molded section 1, to the space that independently occupies of the electronic component for reducing camera module and assemble The cooperation safe space reserved in journey.As shown in Figure 1B, according to other deformation, which can be mounted on the photosensitive core Piece 3, then 1 integral packaging of molded section is in the circuit board 2, the sensitive chip 3 and the optical filter 4.Correspondingly, the camera shooting mould The size of group can be reduced, and be able to satisfy image quality requirement of the electronic equipment to camera module.

However, for camera module comprising the relatively fragile but highly sensitive electronic component of many electricity, especially It is sensitive chip 3.During executing moulding technology, which is electrically connected at the respective area of the circuit board 2 Domain, and the circuit board for being assembled with the sensitive chip 3 is placed in the shaping mold cavity of molded mold in turn, to utilize molding The shaping characteristic of moulding material forms the molded section in the corresponding region of the circuit board 2.It is pointed out that the sensitive chip 3 With a photosensitive region, in moulding technology, a sealed environment need to be formed for the photosensitive region of the sensitive chip 3, to prevent from having Having the molded material of mobility to penetrate into the photosensitive region makes the sensitive chip 3 fail.Therefore, existing moulding technology In, a molded face of the shaping mould group closely fits in the sensitive chip 3, by means of stopping molded molding as a result, Material enters the sensitive chip 3.Correspondingly, at least its photosensitive region of the sensitive chip 3 need to be sealed at the mould as much as possible It moulds forming surface and profile is molded as to be effectively prevented with the gap being reduced as far as between the sensitive chip 3 and the forming surface Material pollutes the sensitive chip 3 through the gap, however when the forming surface of the mold applies relatively large pressure to the sensitive chip 3 When, it may cause the damage of the sensitive chip.

Further, which is another extremely important element in camera module, is crossed and is filtered by optical filter 4 Infrared light in line, so that imaging effect is more nearly the effect of eye-observation.Meanwhile the optical filter 4 is also fragile and high The delicate electrical device of susceptibility.In existing camera module, the optical filter 4 is by direct-assembling in the top of the molded section 1 Surface, the optical filter 4 to be held in the upper area of the photosensitive region of the sensitive chip 3 by the envelope molded section 1.In addition, The molded section 1 is solid states after forming, and with certain hardness, and the optical filter 4 is made of friable material, to work as When the optical filter 4 is assembled in the molded section 1, can inevitably cause the optical filter 4 broken due to mutual stress etc. Situation.And if being directly mounted on the sensitive chip 3, when then re-forming the molded section 1, the mould surface of molding needs to press It closes in the optical filter 4, may cause the damage of the optical filter.And the molded section 1 is usually thermosetting material, is needed in phase To higher temperature thermoset forming, it will lead in this way and connect the glue of the optical filter 4 and the sensitive chip 3 after solidifying and can shrink, So that 4 unbalance stress of optical filter and crack or even rupture.

Summary of the invention

It is an object of the present invention to provide a camera module and its photosensory assembly and packaging methods, wherein the camera shooting Mould group has a step glue, and the step glue is arranged in correspondence in sensitive chip, wherein the step glue is suitable for optical filtering member Part provides support platform, to improve the installation environment of the filter element.

It is another object of the present invention to provide a camera module and its photosensory assembly and packaging methods, wherein described Rank glue can provide stress buffer for the filter element, so that being mounted on a molded base relative to the filter element can Reduce the probability of the filter element damage.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein the optical filtering The installation process of element is performed after molded base molding, so as to be effectively prevented from filter element described in moulding technology It is damaged by pressure by mold, and the molded base is avoided to be shaped in the filter element and cause the filter in the curing process The damage of optical element.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein the step Glue may include extinction light-proof material, black colloid in this way, thus the step glue can play reduction reach it is described photosensitive The effect of the stray light of element.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein the step Glue replaces molded base to provide support for the optical filter, so that the moulding technology quality of the molded base will not be to described The mounting process of filter element has an impact, so that not only the moulding technology of the molded base designs relatively independent, Er Qiesuo The mounting design for stating optical filter is also relatively more independent and controllable.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein the step Glue is set to the non-photo-sensing region of the photosensitive element, to be directly mounted at the technical solution of molded section in compared with the prior art, Area needed for opposite can reducing the filter element.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein the camera shooting Filter element needed for mould group has relatively small size, so as to efficiently reduce the technique in camera module assembling Broken probability occurs for optical filter described in engineering.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein the camera shooting Filter element needed for mould group has relatively small size, with cost needed for reducing the optical filter.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein the optical filtering Element is set to the step glue by a connection glue, so as to further finely tune the position of the filter element, so that The relatively described photosensitive element of the optical filter has relatively high flatness.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein the step Glue has the height for being higher than and raising upward at least one set of lead of the photosensitive element and the circuit board to be connected, to prevent The lead described in molding process planning such as is extruded or even falls off at the failures.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein the step Glue is that the photosensitive element forms relatively good sealed environment, and can prevent simultaneously by the step glue in moulding technology The photosensitive element is damaged.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein the step Glue is arranged in correspondence in the non-photo-sensing region of the photosensitive element, and in molding process planning, is isolated by the step glue Molded material enters the photosensitive region of the photosensitive element, to prevent the photosensitive element to be contaminated in moulding technology.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein in molding work In skill, the step glue is arranged in correspondence between the photosensitive element and a forming surface of the molding die, to pass through It states step glue and absorbs the active force from the molding die, prevent the photosensitive element from breaking because bearing relatively large load Damage.

Another object of the present invention is to provide a camera module and its photosensory assembly and packaging methods, wherein by described Step glue can reduce the technology difficulty of the molding process planning, not only easy to operate, but also the camera module can be improved Product yield.

By following description, other advantages of the invention and feature will be become apparent, and can pass through right The means and combination particularly pointed out in claim are accomplished.

To reach an at least goal of the invention of the invention, the present invention provides a photosensory assembly comprising:

One wiring board,

One photosensitive element,

One molded base,

One step glue, wherein the photosensitive element is electrically connected to the wiring board, the photosensitive element has a photosensitive area Domain and the non-photo-sensing region around the photosensitive region, the step glue are circumferentially set to the institute of the photosensitive element Non-photo-sensing region is stated, wherein the molded base is integrated in the wiring board, the photosensitive element and the step glue simultaneously And the molded base has the extensional surface integrally extended from the step glue；With

One filter element, the filter element are supported at the step glue and the extension with the molded base Spaced apart from surfaces mentions wherein being formed as the photosensitive element between the filter element, the step glue and the photosensitive element For an optical window of passage of light.

According to a further aspect of the invention, the present invention also provides a photosensory assemblies comprising:

One wiring board,

One photosensitive element, wherein the photosensitive element is electrically connected to the wiring board, and the photosensitive element has one Photosensitive region and the non-photo-sensing region around the photosensitive region,

One molded base,

One step glue, the step glue are circumferentially set to the non-photo-sensing region of the photosensitive element；With

One filter element, wherein the molded base is integrated in the wiring board, the sense in a moulding technology Optical element and the step glue, then it is slow to provide by the step glue to be supported at the step glue for the filter element Punching, and an optical window is formed between the filter element, the step glue and the photosensitive element.

One wiring board；

One photosensitive element, wherein the photosensitive element is electrically connected to the wiring board, the photosensitive element is photosensitive with one Region and the non-photo-sensing region around the photosensitive region；

One step glue, wherein the step glue is circumferentially set to the non-photo-sensing region of the photosensitive element；And

One molded base, wherein the molded base is integrated in the wiring board, the photosensitive element and described Rank glue, wherein the molded base has the extension table integrally extended from an outer surface in the circular direction of the step glue Face, wherein forming a glue groove in the outside of the step glue and the extensional surface top side of the molded base.

According to a further aspect of the invention, the present invention also provides a camera modules comprising above-mentioned photosensory assembly and one Optical lens.

According to a further aspect of the invention, the present invention also provides an electronic equipments comprising one or more above-mentioned Camera module.

According to a further aspect of the invention, the present invention provides a camera module molded packages method, wherein the method Comprising steps of

A photosensitive element and a wiring board is connected；

A step glue is formed in a non-photo-sensing region of the photosensitive element, with described photosensitive by step glue encirclement One photosensitive region of element；

A molded base is formed in the wiring board, the photosensitive element and the step glue；

Support a filter element in the step glue；And

An optical lens is assembled in the photosensitive path of the photosensitive element.

By the understanding to subsequent description and attached drawing, further aim of the present invention and advantage will be fully demonstrated.

These and other objects of the invention, feature and advantage, by following detailed descriptions, drawings and claims are obtained To fully demonstrate.

Detailed description of the invention

Figure 1A is the schematic cross-sectional view according to an a kind of circuit board assemblies of a camera module of prior art.

Figure 1B is the schematic cross-sectional view according to a circuit board assemblies of a camera module of another prior art.

Fig. 2A is the schematic cross-sectional view according to a camera module of a preferred embodiment.

Fig. 2 B is a camera module schematic cross-sectional view of a variant embodiment of above-mentioned preferred embodiment according to the present invention.

Fig. 3 A is the schematic cross-sectional view of another variant embodiment of the camera module of above-mentioned preferred embodiment according to the present invention.

Fig. 3 B is the schematic cross-sectional view of another variant embodiment of the camera module of above-mentioned preferred embodiment according to the present invention.

Fig. 3 C is the schematic cross-sectional view of another variant embodiment of the camera module of above-mentioned preferred embodiment according to the present invention.

Fig. 4 A is the schematic cross-sectional view of another variant embodiment of the camera module of above-mentioned preferred embodiment according to the present invention.

Fig. 4 B is the schematic cross-sectional view of another variant embodiment of the camera module of above-mentioned preferred embodiment according to the present invention.

Fig. 5 is according to the preparation process of the camera module of the preferred embodiment of aforementioned present invention by a photosensitive element and one Wiring board can place of working connection schematic diagram.

Fig. 6 A, Fig. 6 B and Fig. 6 C are the formation according to the preparation process of the camera module of the preferred embodiment of aforementioned present invention The schematic diagram of one step glue.

Fig. 7 A is the molding according to the moulding technology of the preparation process of the camera module of the preferred embodiment of aforementioned present invention Schematic diagram.

Fig. 7 B is the filling according to the moulding technology of the preparation process of the camera module of the preferred embodiment of aforementioned present invention Molded material schematic diagram.

Fig. 7 C is the die sinking according to the moulding technology of the preparation process of the camera module of the preferred embodiment of aforementioned present invention Schematic diagram.

Fig. 8 is the installation filter element according to the preparation process of the camera module of the preferred embodiment of aforementioned present invention Schematic diagram.

Fig. 9 is the installation filter element according to the preparation process of the camera module of the preferred embodiment of aforementioned present invention Another embodiment schematic diagram.

Figure 10 is the installation optical filtering member according to the preparation process of the camera module of the preferred embodiment of aforementioned present invention The schematic diagram of the another embodiment of part.

Figure 11 is the assembling optical frames according to the preparation process of the camera module of the preferred embodiment of aforementioned present invention The schematic diagram of head.

Specific embodiment

It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description Basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back Other technologies scheme from the spirit and scope of the present invention.

It will be understood by those skilled in the art that in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper", The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without referring to Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore above-mentioned art Language is not considered as limiting the invention.

It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, unitary The quantity of part can be one, and in a further embodiment, the quantity of the element can be it is multiple, term " one " cannot understand For the limitation to quantity.

If a camera module of Fig. 2A, first preferred embodiment under this invention are elucidated with, wherein the camera module can To be applied to various electronic equipments, illustrates but be not limited to smart phone, wearable device, computer equipment, television set, traffic work Tool, camera, monitoring device etc., the camera module cooperate the electronic equipment to realize acquisition and reproduction etc. to target image Function.

The camera module includes a photosensory assembly 10 and an optical lens 20, wherein the optical lens 20 is located at institute The photosensitive path of photosensory assembly 10 is stated, to acquire the image information of measured target by the optical lens 20.Particularly, at this In the preferred implementation of invention, the camera module is fixed-focus camera module, i.e., the described optical lens 20 and the photosensory assembly Focal length between 10 is unadjustable, and the optical lens 20 is assembled in the camera lens load-carrying unit 30 for being embodied as a lens barrel, described Lens barrel is assembled in the top side of the photosensory assembly 10, it is to be understood that in other deformation, the optical lens 20 can be with Direct-assembling is in the top side of the photosensory assembly 10.Those skilled in the art will be appreciated that, in other embodiment of the invention In, as shown in Figure 2 B, the camera module can also be implemented as dynamic burnt camera module, that is, in this embodiment, the camera shooting mould Group further includes a camera lens load-carrying unit 30, can be a driving element 30, wherein the driving element be assembled in it is described photosensitive The top side of component 10, the optical lens 20 are assembled in the driving element, to change the optics by the driving element A distance between photosensitive element 12 for camera lens 20 and the photosensory assembly 10, to realize the function of optical focusing.It is worth mentioning , the driving element 30 includes but is not limited to voice coil motor, stepper motor, MEMS etc..

More specifically, as described in Fig. 2A, the photosensory assembly 10 includes a wiring board 11, a photosensitive element 12 and a mould Mould pedestal 13.The photosensitive element 12 can conductively be connected to the wiring board 11, wherein the light from measured target passes through The photosensory assembly 10 simultaneously reaches the photosensitive element 12, will be by be further advanced by the photoresponse of the photosensitive element 12 The optical signal for surveying target is converted into the electric signal that electronic equipment can recognize and operate, to realize measured target Image Acquisition and reproduction Etc. functions.The molded base 13 is shaped in the wiring board 11 and the photosensitive element 12, and coats the wiring board 11 and the photosensitive element 12 at least part so that the photosensory assembly 10 and the camera module have it is compact and small The structure of type.It is noted that the integral forming process includes but is not limited to molding process planning, die press technology for forming Deng.

It is noted that during executing moulding technology to form molded base 13, the photosensitive element 12 be fragile and sensitive electronic component.Therefore, it on the one hand needs to guarantee, in moulding technology, molded material will not flow Enter the photosensitive region 121 of the photosensitive element 12, to avoid the contaminated failure of the photosensitive element 12；On the other hand, it is molding In technique, the photosensitive element 12 can not bear excessive pressure, generated and split due to extruding to avoid the photosensitive element 12 Line is even broken and fails.That is, before executing moulding technology to form the photosensitive pedestal of molding, on the one hand, need Relatively good sealed environment is provided for the photosensitive element 12 to protect at least photosensitive region 121 of the photosensitive element 12 not It is not disturbed by the molded material；On the other hand, corresponding buffer protection mechanism need to be set for the photosensitive element 12, with It prevents the photosensitive element 12 because bearing excessive pressure, and occurs damaged.

Correspondingly, in presently preferred embodiment of the invention, the photosensory assembly 10 further includes a step glue 14, the mould Modeling pedestal 13 is further shaped in the step glue 14.Wherein the step glue 14 is arranged in correspondence in the photosensitive member The corresponding region of part 12, by, with the photosensitive element 12 is combined into, being molded between the step glue 14 and molding die In technique, good sealed environment is created.More specifically, the step glue 14 is set to the preset areas of the photosensitive element 12 Domain to intercept in moulding technology there is the molded material of mobility to enter the photosensitive element 12, that is to say, that institute Step glue 14 is stated in molding process planning, serves as the effect of " dam ".In addition, the step glue 14 is set to the photosensitive member Between part 12 and the molding die, with by the step glue 14 avoid the photosensitive element 12 directly with the molding die It is in contact.To be applied to the active force of the photosensitive element 12, be absorbed by the step glue 14, described in opposite weakening Because bearing excessive pressure breakage etc. occurs for the load that photosensitive element 12 is born to be effectively prevented the photosensitive element 12 Failure.

More specifically, in presently preferred embodiment of the invention, the wiring board 11 is equipped with a chip attachment region 111 and a neighboring area 112, the neighboring area 112 integrally extend the outer peripheral edge in the chip attachment region 111, Described in chip attachment region 111 there is the size that matches with the photosensitive element 12, be suitable for mounting the photosensitive element 12.The wiring board 11 further includes one group of wiring board, 11 connector 113, wherein the wiring board connector 113 be set to it is described The neighboring area 112 of wiring board 11, and the wiring board 11 and the photosensitive element 12 is connected.It is worth mentioning It is that in the present invention, the wiring board 11 can be PCB hardboard, PCB soft board, Rigid Flex, ceramic substrate etc..

The photosensitive element 12 has a photosensitive region 121 and a non-photo-sensing region 122, the non-photo-sensing region 122 1 Extend to body the outer peripheral edge of the photosensitive region 121.Particularly, the photosensitive element 12 further includes one group of chip contacts 123, wherein the chip contacts 123 are set to the described non-of the photosensitive element 12 in the preferred implementation of the invention Photosensitive region 122, and to be electrically connected to the wiring board connector 113, the photosensitive element 12 and the route is connected Plate 11.

Correspondingly, the photosensory assembly 10 further includes at least one set of lead 15, wherein each lead 15 has a core Piece connecting pin 151 and an opposite wiring board connecting pin 152.It is right the photosensitive element 12 is mounted on the photosensitive element 12 After the chip attachment region 111 answered, the chip connecting pin 151 of the lead 15 is connected to the photosensitive element 12 The chip contacts 123, and the opposite wiring board connecting pin 152 of the lead 15 is connected to the wiring board 11 The wiring board connector 113, the photosensitive element 12 can be conductively connected to the wiring board 11.That is, by beating The photosensitive element 12 is electrically connected to the wiring board 11 by the mode of lead., it will be appreciated that in the technique for playing lead, The wiring board connecting pin 152 of the lead 15 can be first connected to the wiring board connector 113 of the wiring board 11, Then, the lead 15 is upwardly extended so that the relatively described photosensitive element 12 of the lead 15 is protrusively provided, further, It extends internally and the lead 15 and the opposite chip connecting pin 151 of the lead 15 is connected to the photosensitive element 12 The corresponding chip contacts 123.In the present invention, by the extension mode of such lead is defined as: lead back-hand craft, As shown in Figure 3 C.

Similarly, first the chip connecting pin 151 of the lead 15 can be connected to described in the photosensitive element 12 Chip contacts 123 then outwardly and downwardly extend the lead 15, and by the opposite wiring board of the lead 15 Connecting pin 152 is connected to the wiring board connector 113 of the wiring board 11, to be electrically connected the photosensitive element 12 and described Wiring board 11.In the present invention, by the extension mode of such lead is defined as: just manual labour skill, as shown in Fig. 2A to Fig. 3 B.

It is noted that in the present invention, the photosensitive element 12 can be electrically connected to the line by " just beating " technique Road plate 11, can also be by " lead is counter to be beaten " technique the photosensitive element 12 and the wiring board 11 to be electrically connected.However, The arrangement of the lead will affect the relative altitude variation of 15 protrusion of lead, to influence the subsequent step glue 14 setting.More specifically, when the lead 15 uses " instead beating " technique to be configured, the lead 15 is from the route Plate 11 starts to extend, and after the height that the lead 15 upwardly extends is more than the thickness of the photosensitive element 12, can be by institute Lead 15 is stated to extend backward and be connected to the photosensitive element 12.In addition, when the lead 15 use " lead is just beaten " technique into When row setting, the lead 15 extends since the photosensitive element 12, extends starting point and is set to the photosensitive element 12, phase Compared with " lead is counter to be beaten " technique, extend high starting point, so that the height that the lead 15 finally raises upward is higher than by " drawing Line is counter to be beaten " height to raise upward of the lead 15 set by technique.Those skilled in the art will be appreciated that, in design institute It states in the molding procedure of camera module, should prevent from touching between the lead 15 and molding die, gently then to make The lead 15 is deformed, and weight then makes the lead 15 fall off from the photosensitive element 12 and the wiring board 11. That is, in the present invention, the set-up mode of the lead will affect the layout designs of the step glue 14, about this portion Divide content that can more specifically describe in subsequent description.

Further, in presently preferred embodiment of the invention, the step glue 14 is arranged at the photosensitive element 12 Correspondence non-photo-sensing region 122, with closed integral structure, in form optical window 141, by the photosensitive element 12 121 protecting field of at least photosensitive region be set to the interior zone that the step glue 14 is surrounded.More specifically, in shaping mould Tool molding after, a forming surface of the molding die closely fits in the step glue 14, with by the forming surface with The photosensitive region 121 of the photosensitive element 12 is closely set to the inside of its forming region by the step glue 14, to prevent Only the molded material with mobility flows into the photosensitive element 12, to avoid the described photosensitive of the photosensitive element 12 Region 121 is contaminated.

As shown in Figure 2 A, further, the step glue 14 is arranged at the chip connection of the photosensitive element 12 Between part 123 and the photosensitive region 121, in order to the setting of the step glue 14., it will be appreciated that the photosensitive element 12 The chip contacts 123 and it is described it is photosensitive between region be flattened region, without other electronic components, to be described Step glue 14 provides a relatively smooth basal plane, in order to parameters such as the geomeries that controls the step glue 14.It is special Not it should be pointed out that in the present invention, it is preferred to, the height of the step glue 14 is slightly above what the lead 15 raised upward Highly, to be limited by the step glue 14 to the forming surface of the molding die, so that described draw can be effectively prevented In moulding technology unnecessary touching occurs between the molding die for line 15.

It is a deformation implementation of presently preferred embodiment of the invention shown in attached drawing 3B, wherein the step glue 14 is set The chip contacts 123 in the non-photo-sensing region 122 of the photosensitive element 12, so that the step glue 14 coats At least part of the chip contacts 123 and the lead 15.Logical such mode, can intuitively observe the step glue Relative positional relationship between 14 and the lead 15 in order to control the height of the step glue 14, and finally makes described The height of step glue 14 is higher than, the height that the lead 15 as described in slightly above raises upward.It is noted that the step glue 14 The chip contacts 123 of the photosensitive element 12 are arranged in, and coat at least part of the lead 15, that is, It says, the step glue 14 can further reinforce the connective stability between the lead 15 and the photosensitive element 12, thus In executing molding procedure, the lead 15 can effectively keep out the impact flow of molded material, prevent described draw The relatively described sensitive chip of line 15 is waved or even is fallen off from 12 junction of photosensitive element.

In addition it is noted that in the variant embodiment of the invention, it is preferable that the lead 15 passes through " just beating " Technique is set between the photosensitive element 12 and the wiring board 11, so that the part outstanding of the lead 15 is directly set It is placed in the chip junction of the photosensitive element 12, so that the person of being more convenient to operate observes and controls the step glue 14 upwards The height of protrusion.

In addition, the step glue 14 is set at the chip contacts 123 of the photosensitive element 12, wherein the core The location of piece connector 123, the photosensitive region 121 of the relatively described photosensitive element 12 farther out, thus described in the setting In the technical process of step glue 14, without having to worry about the photosensitive region of the step glue 14 meeting overflow to the photosensitive element 12 121, it is polluted to avoid the photosensitive element 12 by the step glue 14.

It is another variant embodiment of presently preferred embodiment of the invention shown in attached drawing 3B, wherein 14 quilt of step glue Be set to the photosensitive element 12 the chip contacts 123 and the wiring board 11 the wiring board connector 113 it Between, so that the cladding completely of the step glue 14 extends between the chip contacts 123 and the wiring board connector 113 Lead 15.In this way, the relative position between the step glue 14 and the lead 15 can be intuitively observed to close System, in order to control the height of the step glue 14, and finally makes the height of the step glue 14 be slightly above the lead 15 The height to raise upward.It is noted that the step glue 14 is arranged in the chip contacts of the photosensitive element 12 123, and coat the lead 15 completely, that is to say, that the step glue 14 can further reinforce the lead 15 with it is described Connective stability between photosensitive element 12, so that the lead 15 can effectively keep out mould in executing molding procedure The impact flow for moulding moulding material, prevents the relatively described sensitive chip of the lead 15 and the wiring board 11 from waving even It falls off from the photosensitive element 12 and 11 junction of the wiring board.

It is noted that the step glue 14 is set to the chip contacts 123 and the institute of the photosensitive element 12 It states between the wiring board connector 113 of wiring board 11, wherein position set by the step glue 14, relatively described photosensitive The photosensitive region 121 of element 12 farther out, thus in the technical process that the step glue 14 is arranged, without having to worry about described Rank glue 14 understands the photosensitive region 121 of overflow to the photosensitive element 12, to avoid the photosensitive element 12 by the step The material of glue 14 is polluted.

Further, it is worth mentioning at this point that, in presently preferred embodiment of the invention, the step glue 14 is by deformable Material is made, with by the step glue 14 can deformation nature, increase the photosensitive element 12 by sealing effect, meanwhile, By the deformation nature of the step glue 14, enhance the step glue 14 lets out power effect, more effectively to protect the sense Optical element 12., it will be appreciated that during molding molding die, the forming surface of the molding die and the step It is interconnected between glue 14, however, each section height due to the step glue 14 can not guarantee in the provisioning process uniformly, To which during engagement, each section of the step glue 14 is further squeezed by the forming surface of the molding die And deformation occurs, to homogenize the height of described 14 each section of step glue, thus between the forming surface and the step glue 14 Fitting more closely is formed, to improve the sealing effect of the photosensitive element 12.Further, since the step glue 14 has shape Denaturation energy is applied to the external force of the step glue 14, with effective absorption so as to opposite reduction 12 institute of photosensitive element By external force size, in this way, it is effectively prevented the photosensitive element 12 and breakage occurs in moulding technology.

It, can also can shape by others it is noted that in the present invention, the step glue 14 can be coated by glue to be formed Becoming, there is predetermined elasticity material to be made., it will be appreciated that in the present invention, the material of the step glue 14 is not of the invention Limitation.

As shown in Figure 3 C, in presently preferred embodiment of the invention, the photosensory assembly 10 further includes a filter element 16, Wherein light of the filter element 16 to be filtered through the optical lens 20, so that the camera module is collected The image of measured target is closer to effect observed by human eye.

More specifically, in presently preferred embodiment of the invention, the optical filter is arranged in correspondence in the step glue 14, to keep the filter element 16 in the correspondence upper area of the photosensitive region 121 of the photosensitive element 12, and in institute It states and forms sealing space between filter element 16 and the photosensitive element 12.In other words, the filter element 16 is held in institute It states between photosensitive element 12 and the optical lens 20, to pass through the camera lens and be incident to the light of the filter element 16 In veiling glare such as infrared light can effectively be filtered by the filter element 16 into the optical window 141, and further reach The photosensitive region 121 of the photosensitive element 12, to promote the imaging performance of the camera module.In particular, In presently preferred embodiment of the invention, the installation process of the filter element 16 is performed after the molding of molded base 13. That is, the molded base 13 is not shaped in the filter element 16, the molded base 13, which has, integrally to be prolonged An extensional surface 133 in the outside of the step glue 14 is extended to, the extensional surface 133 is the molded base 13 in molding work Exposed surface after skill is integrally formed, the extensional surface 133 of the filter element 16 and the molded base 13 separately, The i.e. described molded base 13 is not shaped in the filter element 16 directly, but has distance between the two, thus in this way Structure prevented in moulding technology the molded material of flow-like enter the step glue 14 inside then pollute it is described photosensitive The photosensitive region 121 of element 12, and phase is filled by following connection glue 17 at least part space separately It is mutually fixed.

And in fig. ib, the assembling process of the optical filter 4 is operated before moulding technology execution.Firstly, in molding work In skill, the optical filter 4 is formed mold and mutually presses so that inevitably, the optical filter 4 because bearing larger pressure, and It cracks and even occurs to be crushed；Secondly, the molded section 1 is prepared according to the chemical characteristic of molded material, such as Pass through the thermosetting property of molded material.However, since the solidification temperature of molded material is higher, usually 150-250 degree Left and right causes the glue for connecting the optical filter 4 and the sensitive chip 3 after solidifying that can shrink, so that 4 stress of optical filter is not It cracks and even occurs to be crushed.

In the present invention, the molded base 13 is integrally incorporated into the outside of the step glue 14, i.e., integrally combines The outer surface 142 extended in the circular direction of the filter element 14, and it is not extend to the top side of the filter element 14 Apex 143, i.e., the 142 phase knot of the outer surface of the extensional surface 133 and the filter element of the described molded base Position 1331 at conjunction is lower than the position of the apex 143 of the filter element 14, described when mounting the filter element 16 Step glue 14 is used to directly provide support to the filter element 16, and provides stress in the filter element 16 installation and delay Punching.Preferably, the shore hardness range of the step glue 14 is A50-A80, and the range of elasticity modulus is 0.001Gpa- 0.1Gpa。

Further, in presently preferred embodiment of the invention, the photosensory assembly 10 further includes a connection glue 17, described Connection glue 17 is for being bonded filter element 16 described in solid space in the top of the step glue 14, thus excellent by the connection glue 17 Change the installation process of the filter element 16, improves installation yield.The molded base 14 forms an appearance of indent in its top side Glue groove 142, be located at the step glue 14 outside and the extensional surface 133 top side, be used to accommodate it is uncured before The connection glue 17, the connection glue 17 are bonded the filter element 16, and then solidification is to be able to be firmly installed the filter Optical element 16.

More specifically, the connection glue 17 can be applied in the glue groove 132 and then install the filter element 16, it can also be applied to the bottom edge of the filter element 16, be then installed on the top side of the step glue 14, or The bottom edge of the glue groove 132 and the filter element 16 is all applied with part adhesive glue, then executes the filter The installation of optical element 16.

It is understood that when the filter element 16 is assembled in the top of the step glue 14 and applies pressure to described When filter element 16, the filter element 16 can contact the step glue 14 first, provide support by the step glue 14, without The molded base 13 can be directly contacted, i.e., the described step glue 14 can provide elastic buffer to the filter element 16, avoid Stress is transferred directly to the molded base 13, so that the rigid molded base 13 can apply reaction force to described relatively Filter element 16 and the damage for leading to the filter element 16.

In addition, the connection glue 17 can be located at the bottom side of the filter element 16 and the periphery of the filter element 16, Positioned at the top side of the extensional surface 133 and it is incorporated at least part feather edge 161 and at least of the filter element 16 A part of outer peripheral surface 162.Certainly, in variant embodiment, it is also possible to which the connection glue 17 is only incorporated into the optical filtering member At least part feather edge 161 of part 16 is only incorporated at least part outer peripheral surface 162.In presently preferred embodiment of the invention In, the molded base 13 is equipped with the glue groove 132, and the glue groove 132 is hollowly formed in the molded base 13 Top surface, and it is located at the outside of the step glue 14.The glue groove 132 is circumferentially formed in the periphery of the step glue 14 Side, and the step glue 14 is raised up to extension relative to the extensional surface 133, so that applying the glue-line In the process, glue is guided to flow to the glue groove 132, and the step glue 14 further prevents glue to enter the step glue 14 The optical window 141, the photosensitive region 121 to avoid the photosensitive element 12 polluted by glue.

In presently preferred embodiment of the invention, the filter element 16 includes citing ground but is not limited to IR cut filter Piece, smalt optical filter, wafer scale cutoff filter.In the present invention, the type of the filter element 16 selects not For limitation of the invention.

In addition, the step glue 14 includes extinction light-proof material, it is such as embodied as black glue material, to be incident to described The stray light of rank glue 14 is absorbed by the step glue 14, to prevent stray light from reaching the photosensitive element 12.It is understood that It is that the step glue 14 plays the role of stopping veiling glare, so that the filter element 16 may be selected not having to pass through photoresist or silk India side formula is additionally formed light shield layer.

It as shown in Figure 4 A and 4 B shown in FIG., can also be without above-mentioned glue groove 132 in both variant embodiments.Such as Fig. 4 A Shown in, 14 apex 143 of step glue is a smooth top surface, the extensional surface 133 of the molded base 13 It can substantially be flushed with 14 apex 143 of step glue, the connection glue 17 is arranged in the step glue 14 and the optical filtering Between element 16, to be incorporated at least part feather edge 161 of the filter element 16.

As shown in Figure 4 B, the extensional surface 133 of the molded base 13 can be incorporated into the step Jiao14Ding 143 place planes at point, and extend upwardly to higher than the plane where 14 apex of step glue 143.Correspondingly, described Separately, and the filter element 16 passes through the connection that its bottom side is arranged in for filter element 16 and the extensional surface 133 Glue 17 is adhesively fixed with 14 phase of step glue.

, it will be appreciated that in compared to the prior art, by the optical filter 4 be directly mounted at 1 top surface of molded section or by The technical solution that the molded section 1 integrally coats has the filter element 16 by the technical solution that the step glue 14 supports There is following advantage:

First, the step glue 14 has cushion performance, thus when the filter element 16 is set to the step glue 14 When, the step glue 14 can effectively absorb the external force for being applied to the filter element 16, to prevent the filter element 16, During the installation process, chipping due to by biggish stress.

Second, the step glue 14 replaces molded base 13 to be that the filter element 16 provides support level.That is, institute The moulding technology quality for stating molded base 13 will not have an impact the mounting process of the filter element 16, thus not only described The moulding technology design of molded base 13 can be relatively independent, and the mounting arrangement of the optical filter is also relatively more independent and can Control.

Third, the technical solution of molded section is directly mounted in compared with the prior art, area needed for the filter element 16 It is opposite to reduce, so as to reduce the cost of the filter element 16.

Fourth, the required size due to the filter element 16 is reduced, thus the optical filter have it is relatively high strong Degree, so that can efficiently reduce, in the process engineering of camera module assembling, the optical filter cracks or occurs It is crushed.

Fifth, the filter element 16 is by being assembled in 14 top of step glue and by the step glue to connect glue 17 14 supports, further can safely adjust the relative positional relationship of the filter element 16 and the step glue 14, so that institute Filter element 16 is stated with relatively high flatness.Particularly, the connection glue 17 has deformable performance, so that working as The filter element 16 can be facilitated and safely be adjusted described when the initial position of the step glue 14 does not meet design requirement Filter element 16 is in the relative position of the step glue 14., it will be appreciated that being applied during adjusting filter element 16 The external force for being added on the filter element 16 is effectively absorbed by the step glue 14, so that the position tune of the filter element 16 It is comparatively safe and convenient to have suffered journey.

Further, such as Fig. 5 to the system for the camera module for being as shown in figure 11 the preferred implementation according to the present invention Process schematic is made, wherein such as Fig. 5 to the manufacture schematic diagram for being as shown in Fig. 11 only single camera module.This field Technical staff will be appreciated that the camera module can also be obtained by layout preparation process, that is, molded one photosensitive group disposable 10 layout of part, and further 10 layout of photosensory assembly is cut, disposably to obtain multiple photosensory assemblies 10 monomers.

In attached manufacturing step shown in fig. 5, the photosensitive element 12 can be conductively connected to the wiring board 11.? In presently preferred embodiment of the invention, the photosensitive element 12 is accordingly mounted on the chip attachment region of the wiring board 11 111, and further, the both ends of the lead 15 are connected to by the photosensitive element 12 and described by " routing " technique Wiring board 11, to be electrically connected the photosensitive element 12 and the wiring board 11 by the lead 15.It is noted that it is preferred that Ground, in the conducting step, the lead 15 extends the photosensitive element 12 and the wiring board 11 by " instead beating " technique Between, the height that is raised upward with the opposite reduction lead 15.Certainly, those skilled in the art is it is to be appreciated that the lead 15 can also be extended between the photosensitive element 12 and the wiring board 11 by " lead is just being beaten " technique, described photosensitive to realize Electrical connection between element 12 and the wiring board 11.

It is specifically intended that in another embodiment of the invention, the chip attachment region of the wiring board 11 111 and the peripheral region can be arranged with misplacing, to form a groove in the corresponding region in the chip attachment area, wherein described Groove, which is suitable for accommodating the photosensitive element 12, can be further electrically connected to the photosensitive element 12 by " routing " technique The wiring board 11.In this way, the whole height of the photosensory assembly 10 can be not only reduced, meanwhile, it can also reduce The height that the lead 15 raises upward, in favor of the arrangement of the subsequent step glue 14.

In the manufacturing step as shown in Fig. 6 A to 6C, the step glue 14 is formed in the preset areas of the photosensitive element 12 Domain.Particularly, in presently preferred embodiment of the invention, the step glue 14 has integrated enclosed construction, equably applies It is overlying on the correspondence non-photo-sensing region 122 of the photosensitive element 12, to realize that sealing is described photosensitive by the step glue 14 At least described photosensitive region 121 of element 12 and the photosensitive element 12 is prevented, because bearing relatively large load, and it is existing breakage to occur etc. As.It is noted that the height of the step glue 14 is slightly above the height that the lead 15 raises upward, to prevent subsequent Moulding technology in, unnecessary touching occurs between the lead 15 and the molding die.

More specifically, in this clearly demarcated the preferred embodiment, the step glue 14 is implemented as a glue-line, uniformly Ground and be circumferentially set to the photosensitive element 12 the photosensitive region 121 outside, after hardening, be suitable for making it is described at A forming surface 104 pressing of pattern tool is thereon.In this embodiment, the step glue 14 is set to the photosensitive element 12 The chip contacts 123 and the photosensitive region 121 between, also, the step glue 14 is provided having one and is slightly above The height that the lead 15 raises upward.

In another embodiment of the invention, the step glue 14 is implemented as a glue-line, sets equably and circumferentially It is placed in the outside of the photosensitive region 121 of the photosensitive element 12, particularly, is set to the core of the photosensitive element 12 Piece connector 123, and coat at least part of the lead 15.Similarly, the step glue 14 is slightly above described with one The height that lead 15 raises upward.

In another implementation of the invention, the step glue 14 is implemented as a glue-line, is arranged equably and circumferentially In the outside of the photosensitive region 121 of the photosensitive element 12, particularly, it is set to the chip of the photosensitive element 12 Between connector 123 and the wiring board connector 113 of the wiring board 11, to coat the lead 15 completely.Similarly, The step glue 14 has one to be slightly above the height that the lead 15 raises upward.

It, will be with described in the photosensitive element 12 and the step glue 14 in the manufacturing step as shown in Fig. 7 A to 7C Wiring board 11 is placed in a molded mold 100, and carries out moulding technology to form the molded base 13 in the route Plate 11, wherein the molded base 13 integrally coats the wiring board 11, at least part of the photosensitive element 12 and institute At least part of step glue 14 is stated, so that the photosensory assembly 10 has more compact and small and exquisite integral structure.

More specifically, the molding die includes a upper mold 101 and once mold 102, wherein the upper mold with The lower mold can mutually closing to form a molding chamber 103, wherein have the photosensitive element 12 and the step glue 14 The wiring board 11 be placed in the corresponding region of the shaping mold cavity.At this point, a forming surface 104 of the upper mold is closely It fits with the step glue 14, to seal at least described photosensitive region 121 of the photosensitive element 12, thus when molded Material is filled to the shaping mold cavity 103, and it is molded that the step glue 14 cooperates the forming surface 104 to be effectively prevented Material flows into the photosensitive region 121 of the photosensitive element 12.The upper mold 101 can be further provided with to be prolonged around direction The protrusion 105 stretched, to form the glue groove 132 after the molding process, and the upper mold 101 correspondingly has shape At the container 106 in raised 105 inside, in moulding technology, 14 top end part of step glue is accommodated in the receipts In tank 106.The part that protrusion 105 is engaged with the step glue 14 has compatible with the top end part of the step glue 14 Shape prevents molded material in moulding technology from entering the step to be fitted close with 14 top end part of step glue The inside of glue 14.

More specifically, in manufacturing step as shown in Figure 8, the optical filter is arranged in correspondence in the step glue 14, to keep the filter element 16 in the correspondence upper area of the photosensitive region 121 of the photosensitive element 12.Change speech It, the filter element 16 is held between the photosensitive element 12 and the optical lens 20, to pass through the camera lens And the veiling glare being incident in the light of the filter element 16 can effectively be filtered by the filter element 16, to be taken the photograph described in promotion As the imaging performance of mould group.

Further, a connection glue 17 is additionally provided between the filter element 16 and the step glue 14 by described Connection glue 17 completes the installation process of the filter element 16.In manufacturing step as shown in Figure 8, the connection glue 17 is implemented For one first glue-line 171, first glue-line 171 is circumferentially coated on outside and the glue groove 132 of the step glue 14 In.Then the filter element 16 is installed on first glue-line 171.The step glue 14 preferably has a uniform thickness Degree, so that the filter element 16 has relatively high when the filter element 16 is supported at the step glue 14 Flatness.

In addition, it is illustrated in figure 9 the manufacturing step schematic diagram that the connection glue 17 is formed in another implementation of the present invention, it is described The connection glue 17 is embodied as one second glue-line 172, wherein second glue-line 172 is set to the filter element 16, so that When the proper filter element 16 is accordingly mounted on 14 top of step glue, the filter element 16 can be smoothly located It is supported in the step glue 14 by the step glue 14, and second glue-line 172 is accommodated in the glue groove 14, and And prevent second glue-line 172 into the optical window 141 of the step glue 14 at the top of the step glue 14.Particularly, institute It states the second glue-line 172 and is circumferentially set to 16 bottom side of filter element.

As shown in Figure 10, in the variant embodiment of the invention, first glue-line 171 can be coated on the mould It moulds the extensional surface 133 of pedestal 13 and is located at the outside of the step glue 14, and second glue-line 172 is accordingly applied It is overlying on the bottom side of the filter element 16, it all can gluing by the glue groove 132 and 16 bottom side of the filter element.It should be appreciated that It is that in other embodiment of the invention, first glue-line 171 is coated on the two opposite sides of the step glue 14, described Second glue-line 172 is coated on the other two opposite sides of the filter element 16.

It is understood that in the embodiment illustrated in fig. 8 to 10, when the filter element 16 is supported on described After rank glue 14, it according to circumstances can also further apply glue into the glue groove 132, to ensure the filter element 16 Bonding is secured.

In manufacturing step as shown in figure 11, the optical lens 20 is assembled in the top table of the molded base 13 Face, to form the camera module.More specifically, in presently preferred embodiment of the invention, the optical lens 20 is straight The top surface for being assembled in the molded base 13 is connect, and is in same optical axis with the filter element 16 and the photosensitive element 12 On line, to establish complete passage of light for the camera module.That is, the camera module is fixed-focus camera module.Certainly The top surface of the molded base 13 can also be installed on by being embodied as a camera lens load-carrying unit 30 of a lens barrel.Alternatively, In another implementation of the invention, the camera module is dynamic burnt camera module.At this point, the optical lens 20 is assembled in one in fact It applies as the camera lens load-carrying unit 30 of driving element, such as voice coil motor, the driving element is by direct-assembling in the molding base The top surface of seat 13, wherein the driving element can drive the optical lens 20 mobile, to change the coke of the camera module Away from.

It can thus be seen that the object of the invention can be efficiently accomplished sufficiently.It is used to explain the present invention function and structure principle The embodiment is absolutely proved and is described, and the present invention is not by the limit based on the change on these embodiment basis System.Therefore, the present invention includes all modifications covered within appended claims claimed range and spirit.

Claims

1. a photosensory assembly characterized by comprising

One wiring board,

One photosensitive element,

One molded base,

One step glue, wherein the photosensitive element is electrically connected to the wiring board, the photosensitive element have a photosensitive region and A non-photo-sensing region around the photosensitive region, the step glue are circumferentially set to the described non-of the photosensitive element Photosensitive region, wherein the molded base is integrated in the wiring board, the photosensitive element and the step glue and institute Stating molded base has the extensional surface integrally extended from the step glue；With

One filter element, the filter element are supported at the step glue and the extensional surface with the molded base Separately, wherein being formed as the photosensitive element between the filter element, the step glue and the photosensitive element provides light One optical window of line access.

2. photosensory assembly as described in claim 1, wherein molded base top side, which has, holds glue along one of the indent around direction Slot, the photosensory assembly further include a connection glue, are at least partially disposed in the glue groove to be bonded the optical filtering member Part.

3. photosensory assembly as claimed in claim 2, wherein the step glue has along the outer surface around direction, it is described to prolong The position for stretching the junction that surface is integrated in outer surface described in the circular direction of the step glue is lower than the step Jiao Ding Position at point, the glue groove are formed in the outside of the step glue.

4. photosensory assembly as claimed in claim 3, wherein the connection glue connection is connected at least part of the filter element Feather edge and/or at least part outer peripheral surface.

5. photosensory assembly as described in claim 1, wherein the extensional surface is integrated in step glue vertex place On surface, the photosensory assembly further includes a connection glue, between the filter element and the step glue.

6. the photosensory assembly as described in any in claim 1 to 5, wherein the photosensory assembly further includes at least one set of lead, Wherein one end of each lead is connected to a chip contacts of the photosensitive element, the opposite side connection of the lead In a wiring board connector of the wiring board, to be electrically connected the photosensitive element and the wiring board by the lead.

7. photosensory assembly as claimed in claim 6, wherein the chip contacts are set to the described non-of the photosensitive element Photosensitive region, the step glue are set between the chip contacts of the photosensitive element and the photosensitive region.

8. photosensory assembly as claimed in claim 6, wherein the chip contacts are set to the described non-of the photosensitive element Photosensitive region, wherein the step glue is set to the chip contacts of the photosensitive element, to coat the one of the lead Part.

9. photosensory assembly as claimed in claim 6, wherein the chip contacts are set to the described non-of the photosensitive element Photosensitive region, wherein the step glue is set to the chip contacts of the photosensitive element and the line of the wiring board Between the plate connector of road, to coat the lead completely.

10. photosensory assembly as claimed in claim 6, wherein the step glue, which has, is higher than the height that the lead raises upward Degree.

11. the photosensory assembly as described in any in claim 1 to 5, wherein the shore hardness range of the step glue is A50- A80, the range of elasticity modulus are 0.001Gpa-0.1Gpa.

12. the photosensory assembly as described in any in claim 1 to 5, wherein the step glue includes extinction light-proof material, with Reduce the stray light that the photosensitive element is reflexed to via the step glue.

13. a photosensory assembly characterized by comprising

One wiring board,

One photosensitive element, wherein the photosensitive element is electrically connected to the wiring board, and the photosensitive element is photosensitive with one Region and the non-photo-sensing region around the photosensitive region,

One molded base,

One filter element, wherein the molded base is integrated in the wiring board, the photosensitive member in a moulding technology Part and the step glue, then the filter element is supported at the step glue to provide buffering by the step glue, and An optical window is formed between the filter element, the step glue and the photosensitive element.

14. photosensory assembly as claimed in claim 13, wherein the molded base has from the step glue along around side To the extensional surface that extends of an outer surface, and form edge in the top side of the extensional surface and the outside of the step glue A glue groove around direction, the photosensory assembly further includes a connection glue, is at least partially disposed in the glue groove, To be bonded the filter element.

15. photosensory assembly as claimed in claim 14, wherein the connection glue extends in the filter element bottom side and/or institute State the peripheral side of filter element.

16. photosensory assembly as claimed in claim 13, wherein the extensional surface is integrated in the step glue apex Place surface, the photosensory assembly further includes a connection glue, between the filter element and the step glue.

17. the photosensory assembly as described in any in claim 13 to 16, wherein the photosensory assembly further includes that at least one set is drawn Line, wherein one end of each lead is connected to a chip contacts of the photosensitive element, the opposite side of the lead It is connected to a wiring board connector of the wiring board, to be electrically connected the photosensitive element and the route by the lead Plate.

18. photosensory assembly as claimed in claim 17, wherein the chip contacts are set to the described of the photosensitive element Non-photo-sensing region, the step glue are set between the chip contacts of the photosensitive element and the photosensitive region；Or Step glue described in person is set to the chip contacts of the photosensitive element, to coat a part of the lead；Described Rank glue is set between the chip contacts of the photosensitive element and the wiring board connector of the wiring board, with complete The lead is coated entirely.

19. the photosensory assembly as described in weighing and require 17, wherein the step glue, which has, is higher than the height that the lead raises upward.

20. the photosensory assembly as described in any in claim 13 to 16, wherein the shore hardness range of the step glue is A50-A80, the range of elasticity modulus are 0.001Gpa-0.1Gpa.

21. the photosensory assembly as described in any in claim 13 to 16, wherein the step glue includes extinction light-proof material, To reduce the stray light for reflexing to the photosensitive element via the step glue.

22. a photosensory assembly characterized by comprising

One wiring board；

One photosensitive element, wherein the photosensitive element is electrically connected to the wiring board, the photosensitive element has a photosensitive region The non-photo-sensing region being located at around the photosensitive region and；

One molded base, wherein the molded base is integrated in the wiring board, the photosensitive element and the step glue, Wherein the molded base has the extensional surface integrally extended from an outer surface in the circular direction of the step glue, wherein A glue groove is formed in the outside of the step glue and the extensional surface top side of the molded base.

23. photosensory assembly as claimed in claim 22, wherein the photosensory assembly further includes at least one set of lead, wherein each One end of the lead is connected to a chip contacts of the photosensitive element, and the opposite side of the lead is connected to the line One wiring board connector of road plate, to be electrically connected the photosensitive element and the wiring board by the lead.

24. photosensory assembly as claimed in claim 23, wherein the chip contacts are set to the described of the photosensitive element Non-photo-sensing region, the step glue are set between the chip contacts of the photosensitive element and the photosensitive region；Or Step glue described in person is set to the chip contacts of the photosensitive element, to coat a part of the lead；Described Rank glue is set between the chip contacts of the photosensitive element and the wiring board connector of the wiring board, with complete The lead is coated entirely.

25. the photosensory assembly as described in weighing and require 23, wherein the step glue, which has, is higher than the height that the lead raises upward.

26. the photosensory assembly as described in any in claim 22 to 25, wherein the extensional surface is integrated in described The position of the junction of one outer surface in the circular direction of rank glue is lower than the position of the step glue apex.

27. the photosensory assembly as described in any in claim 22 to 25, wherein the shore hardness range of the step glue is A50-A80, the range of elasticity modulus are 0.001Gpa-0.1Gpa.

28. the photosensory assembly as described in any in claim 22 to 25, wherein the step glue includes extinction light-proof material, To reduce the stray light for reflexing to the photosensitive element via the step glue.

29. a camera module, which is characterized in that including an optical lens and according to claim 1 any described photosensitive in -26 Component, wherein the optical lens is located at the photosensitive path of the photosensory assembly.

30. camera module as claimed in claim 29, wherein the optical lens is assembled in the mould of the photosensory assembly Mould pedestal；Or the optical lens is assembled in a camera lens load-carrying unit, the camera lens load-carrying unit is assembled in the molding base Seat, wherein the camera lens load-carrying unit is a lens barrel or a driving element.

31. an electronic equipment, which is characterized in that including one or more camera shooting moulds as described in any in claim 28-29 Group.

32. a camera module molded packages method, the method comprise the steps that

A photosensitive element and a wiring board is connected；

A step glue is formed in a non-photo-sensing region of the photosensitive element, to surround the photosensitive element by the step glue A photosensitive region；

Support a filter element in the step glue；And

33. packaging method as claimed in claim 32, wherein the step of forming the molded base further comprises the steps of:

The top end part of the step glue is accommodated in the corresponding container that a molding has；With

The glue groove for being located at the indent on the outside of the step glue at the top of the molded base is formed, wherein the glue groove is in institute It is formed after stating molding mold release.

34. packaging method as claimed in claim 33 further comprises the steps of: the connection glue by being contained in the glue groove Be adhesively fixed the filter element.

35. packaging method as claimed in claim 32, wherein by being applied between the filter element and the step glue A connection glue filter element is bonded and fixed to the step glue.