WO2019062610A1 - Camera module for reducing stray light and photosensitive assembly thereof, and electronic device - Google Patents

Camera module for reducing stray light and photosensitive assembly thereof, and electronic device Download PDF

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Publication number
WO2019062610A1
WO2019062610A1 PCT/CN2018/106352 CN2018106352W WO2019062610A1 WO 2019062610 A1 WO2019062610 A1 WO 2019062610A1 CN 2018106352 W CN2018106352 W CN 2018106352W WO 2019062610 A1 WO2019062610 A1 WO 2019062610A1
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WO
WIPO (PCT)
Prior art keywords
light
photosensitive member
filter element
photosensitive
shielding layer
Prior art date
Application number
PCT/CN2018/106352
Other languages
French (fr)
Chinese (zh)
Inventor
赵波杰
郭楠
梅哲文
田中武彦
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201710895733.XA external-priority patent/CN109581785B/en
Priority claimed from CN201721257032.5U external-priority patent/CN207764526U/en
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2019062610A1 publication Critical patent/WO2019062610A1/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B11/00Filters or other obturators specially adapted for photographic purposes
    • G03B11/04Hoods or caps for eliminating unwanted light from lenses, viewfinders or focusing aids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the invention relates to the field of camera modules, and further relates to a photosensitive component manufactured by a molding process and a camera module having the photosensitive component capable of reducing stray light.
  • the camera module is one of the indispensable components of the smart electronic device, such as but not limited to a smart phone, a camera, a computer device, a wearable device, and the like. With the continuous development and popularization of various smart devices, the requirements for camera modules are getting higher and higher.
  • the camera module of the conventional COB process package includes a circuit board 101, a sensor chip 102, a bracket 103, a filter 104, and a lens assembly 105.
  • a series of electronic components 106 are mounted on the circuit board 101.
  • the brackets 103 are mounted on the circuit board 101 and are placed on the outer side of the electronic components 106 so as to avoid the electronic components on the bottom side of the bracket 103.
  • the avoidance space 107 of 105 As shown in FIG. 1A, it has a predetermined effect of removing stray light, for example, when the stray light M1 reaches the wiring board 101, it is reflected into the escape space 107 so as not to be reflected to the filter 104, and is filtered.
  • the bottom surface of the light sheet 104 is reflected to reach the photosensitive chip 102 to form stray light.
  • the molding and packaging technology of the camera module is a packaging technology that has been developed on the basis of the traditional COB package.
  • the camera module is packaged by using an existing integrated package technology, and includes a circuit board 201 , a light sensor chip 202 , a package portion 203 , a filter 204 , and a lens assembly 205 .
  • the package portion 203 is packaged on the circuit board 201 and the photosensitive chip 202 in an integrated package to form an integrated package assembly, and the package portion 203 covers a series of electronic components of the circuit board 201.
  • the lens assembly 205 above the integrated package assembly can It is installed flat and solves the problem that the dust attached to the electronic component 206 affects the image quality of the camera module.
  • the package portion 203 integrally extends from the photosensitive chip 202 and embeds the electronic component 206 and the lead 207, the escaping space 107 in the conventional COB is not required, but the integration
  • the packaging technology still has a certain degree of stray light, that is, the inner surface 2031 of the package portion 203 has a predetermined reflection effect on the light, which may cause the light to be reflected to reach the photosensitive chip 202 to generate stray light. More specifically, as shown in the figure, a portion of the light ray M2 reaches the inner surface 2031 of the package portion 203 and is reflected to reach the bottom surface 2042 of the filter 204, thereby being further reflected to reach the photosensitive chip 202.
  • a common method is to provide a light shielding film 2041 on the top side of the filter 204, that is, the light shielding film 2041 is formed on the side of the filter 204 facing the lens assembly 205.
  • a light transmitting region is formed in the middle of the filter 204, and part of the stray light M3 can be blocked by the light shielding layer 2041 to prevent it from entering the package portion 201.
  • the light shielding film 2041 cannot solve the stray light generated by the light M2.
  • the inner surface 2031 of the package portion 203 is generally formed to extend obliquely from the photosensitive chip 202, which causes the area of the top surface of the package portion 203 to be reduced, and the package portion 203
  • the top side requires the upper optics for mounting the camera module, such as the lens assembly 205 described above, or an additional mirror mount.
  • the smaller surface top surface of the encapsulation portion 203 may not provide sufficient mounting surface for the upper optics of the camera module, such that the upper optics may not be securely mounted.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein a light shielding layer is disposed on a bottom side of a filter element body of a filter element of the photosensitive module of the camera module Thereby, the central region of the filter element body forms an effective light transmitting region to reduce stray light reaching the inside of a molded base.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein at least a part of light generated by reflection after being incident on an inner surface of the molded base can be absorbed by the light shielding layer Avoid being reflected by the filter element to reach a photosensitive element to form stray light.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein the light shielding layer is located between a filter element body of the filter element and the molding base, thereby reducing Light rays are directed toward the inner surface of the molded base to effectively avoid stray light.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof.
  • the photosensitive member further includes a filter element holder, and the filter element is assembled in a filter. a top side groove of the component holder, the filter element holder being assembled to the molding base, wherein the light shielding layer, the filter element holder is at an outer peripheral portion of the light window of the molding base Forming a light suppression groove between the inner surface and the inner surface of the molding base, at least a portion of the stray light entering the light suppression groove being reflected by the inner surface of the molding base and being subjected to The light shielding layer absorbs, thereby effectively suppressing stray light from being emitted from the light suppression groove.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof.
  • the photosensitive member further includes a filter element holder, and the filter element is assembled in a filter. a bottom side groove of the component holder, the filter element holder being assembled to the molding base, wherein the light shielding layer and the molding base are at an outer peripheral portion of the light window of the molding base Forming a light suppression groove between the inner surfaces, at least a portion of the stray light entering the light suppression groove is reflected by the inner surface of the molding base and absorbed by the light shielding layer, thereby effectively suppressing impurities Astigmatism is emitted from the light-suppressing groove.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein in some embodiments, the filter element further includes a top side shading disposed on a top surface of the filter element body.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein the light shielding layer is a black absorbing material capable of absorbing most of the light energy, and a very small portion of the light can be reflected. So that it can effectively absorb stray light.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein in some embodiments, the filter element is assembled in the bottom side groove of the filter element holder The position of a bottom side lens of the lens can be moved downward, thereby reducing the back focus of the camera module, and further reducing the height of the camera module.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive assembly thereof, wherein in some embodiments, the molded base includes a photosensitive element joint and a top side extension integrally extending.
  • the inner surface has different extending angles, wherein the top side extending portion and the optical axis have a smaller angle, thereby increasing the area of the top surface of the top side extending portion, thereby being above the camera module
  • the lens or filter element holder or lens assembly provides a larger area of mounting surface for securely mounting the lens, the filter element holder or the lens assembly.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein in some embodiments, wherein the top side extension has a small angle with the optical axis, thereby being capable of reducing The area of the filter element.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein in some embodiments, the light shielding layer reduces light incident on an inner surface of the top side extension, thereby preventing The inner surface incident on the top side extension is reflected to reach the photosensitive element to form stray light and affect the imaging quality of the camera module.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive assembly thereof, wherein in some embodiments, an angle between the top side extension and the optical axis is smaller than the photosensitive element joint portion and An angle between the optical axes to prevent a window forming portion of a molding die from being pressed against the connecting line connecting the photosensitive member and the circuit board in the molding process, causing damage to the connecting wire.
  • An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein in some embodiments, the photosensitive element joint portion and the top side extension portion cooperate with each other, and the photosensitive element joint portion
  • the structure facilitates demolding and reduces stray light
  • the top side extension is used to increase the area of the top surface of the molded base and the top side extension such a structure to avoid the molding process
  • the cable is crushed by the indenter.
  • the present invention provides a photosensitive assembly of a camera module, comprising:
  • the filter element comprising a filter element body and a light shielding layer disposed on a bottom side of the filter element body, the light shielding layer forming a light path for allowing light to enter the light window And the stray light reaching the photosensitive element is reduced.
  • the present invention further provides a camera module, including:
  • a filter element disposed between the lens and the photosensitive element, and the filter element includes a filter element body and a light shielding layer disposed on a bottom side of the filter element body, the light shielding layer forming A light path for directing light into the light window and reducing stray light reaching the photosensitive element.
  • the present invention also provides an electronic device comprising one or more of the camera modules described above.
  • the electronic devices include, but are not limited to, cell phones, computers, televisions, smart loadable devices, vehicles, cameras, and monitoring devices.
  • FIG. 1A is a schematic structural view of a camera module of a conventional COB process.
  • FIG. 1B is a schematic structural view of a camera module formed by a conventional integrated packaging process.
  • FIG. 2 is a perspective exploded view of a camera module in accordance with a first preferred embodiment of the present invention.
  • Figure 3A is a cross-sectional view of the camera module of the first preferred embodiment of the present invention taken along line A-A of Figure 2;
  • 3B is a schematic view showing the principle of reducing stray light of the photosensitive member of the camera module according to the first preferred embodiment of the present invention.
  • FIG. 4A is a cross-sectional view of a camera module in accordance with a modified embodiment of the first preferred embodiment of the present invention.
  • 4B is a schematic view showing the principle of reducing stray light of the photosensitive member of the camera module according to a modified embodiment of the first preferred embodiment of the present invention.
  • FIG. 5A is a schematic structural view of a camera module according to a second preferred embodiment of the present invention.
  • Fig. 5B is a schematic enlarged view of the structure at B in Fig. 5A.
  • FIG. 6A is a schematic view showing that the light-shielding layer on the bottom side of the photosensitive member of the camera module according to the second preferred embodiment of the present invention can more effectively reduce the stray light reflected to the photosensitive member with respect to the light-shielding layer on the top side of FIG. 6B. .
  • Fig. 6B is a schematic view showing the optical path of the light shielding layer on the top side of the filter element of the photosensitive member.
  • Fig. 7A is a cross-sectional view showing a state in which a molten molding material is pushed into a base forming guide groove in a molding die in a molding process according to the above second preferred embodiment of the present invention.
  • Fig. 7B is a cross-sectional view showing the state in which the molten molding material is filled in the base molding guide groove in the above second preferred embodiment of the present invention.
  • Figure 7C is a cross-sectional view showing the formation of a molded base by performing a demolding step in accordance with the above second preferred embodiment of the present invention.
  • Fig. 8A is a schematic view showing that a light-shielding layer is attached to both sides of a photosensitive member according to a modified embodiment of the second preferred embodiment of the present invention to effectively reduce stray light.
  • Figure 8B is a cross-sectional view showing a camera module according to another modified embodiment of the above second preferred embodiment of the present invention.
  • Figure 9 is a cross-sectional view showing a camera module according to another modified embodiment of the above second preferred embodiment of the present invention.
  • Figure 10 is a cross-sectional view showing a camera module according to another modified embodiment of the second preferred embodiment of the present invention.
  • Figure 11 is a perspective exploded view showing a camera module in accordance with a third preferred embodiment of the present invention.
  • Figure 12A is a cross-sectional view of the camera module in accordance with the above-described third preferred embodiment of the present invention taken along line C-C of Figure 11;
  • Figure 12B is an enlarged schematic view of the portion D in Figure 12A.
  • FIG. 13A is a schematic view showing that the light-shielding layer on the bottom side of the photosensitive member of the camera module according to the above-described third preferred embodiment of the present invention can more effectively reduce the stray light reflected to the photosensitive member with respect to the light-shielding layer on the top side of FIG. 13B. .
  • Fig. 13B is a schematic view showing the optical path of the light shielding layer on the top side of the filter element of the photosensitive member.
  • Figure 14A is a cross-sectional view of a camera module in accordance with a variant embodiment of the above third preferred embodiment of the present invention.
  • Figure 14B is a cross-sectional view of a camera module in accordance with another modified embodiment of the above third preferred embodiment of the present invention.
  • Figure 15 is a perspective exploded view of a camera module in accordance with a fourth preferred embodiment of the present invention.
  • Figure 16 is a cross-sectional view of the image pickup module according to the above-described fourth preferred embodiment of the present invention taken along the line E-E in Figure 15 .
  • FIG. 17A is a schematic view showing that the light-shielding layer on the bottom side of the photosensitive member of the camera module according to the fourth preferred embodiment of the present invention can more effectively reduce the stray light reflected to the photosensitive member with respect to the light-shielding layer on the top side of FIG. 17B. .
  • Fig. 17B is a schematic view showing the optical path of the light shielding layer on the top side of the filter element of the photosensitive member.
  • Figure 18 is a cross-sectional view showing a camera module according to a modified embodiment of the fourth preferred embodiment of the present invention.
  • Figure 19 is a cross-sectional view showing a camera module according to another modified embodiment of the fourth preferred embodiment of the present invention.
  • 20 is a schematic structural diagram of the above camera module applied to an intelligent electronic device according to the present invention.
  • the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
  • the 2 to 3B are a camera module 100 and a photosensitive member 10 thereof according to a first preferred embodiment of the present invention.
  • the camera module 100 can be applied to various electronic devices 300.
  • the electronic device 300 includes a device body 301 and one or more of the camera modules mounted on the device body 301. 100.
  • the electronic device 300 is exemplified by, but not limited to, a smart phone, a wearable device, a computer device, a television, a vehicle, a camera, a monitoring device, etc., and the camera module cooperates with the electronic device to implement an image of a target object. Acquisition and reproduction.
  • the camera module 100 illustrated in the drawings includes the photosensitive member 10 and a lens 30.
  • the photosensitive assembly 10 includes a circuit board 11, a molding base 12, a photosensitive element 13 and a filter element 14.
  • the molding base 12 includes a base body 121 integrally formed on the The circuit board 11 and the photosensitive member 13 form a light window 122 which is a closed space and provides a light path to the photosensitive member 13.
  • the molded base 12 of the present invention is integrally molded on the circuit board 11 and the photosensitive member 13 via a molding process, such as a transfer molding process, so that the molded base 12 can be replaced.
  • the lens holder or the bracket of the conventional camera module does not need to be attached to the circuit board 11 by glue to the lens holder or the bracket in a similar conventional packaging process.
  • the circuit board 11 may be a hard board, a soft soft, a soft and hard bonded board, a ceramic substrate, or the like.
  • the circuit board 11 is a soft and hard bonding board, and includes a substrate 111 and a plurality of electronic components 112 formed on the substrate 111, such as by an SMT process.
  • the electronic component 112 includes It is not limited to resistors, capacitors, drive devices, and the like.
  • the molded base 12 is integrally wrapped around the electronic component 112, thereby preventing dust and debris from adhering to the electronic component 112 in a similar conventional camera module. And the photosensitive member 13 is further contaminated, thereby affecting the imaging effect.
  • the circuit board 11 may not have the electronic component 112.
  • the electronic component 112 may be mounted on the top surface of the substrate 111 or may be mounted on the bottom surface of the substrate 111. Or may be buried in the substrate 111. When disposed on the top surface of the substrate 111, the electronic component 112 may be disposed around the photosensitive element 13 and located on a plurality of sides of the photosensitive element 13, for example, the electronic component 112 may be disposed at The opposite sides of the pair of photosensitive elements 13 may be on the opposite side of the electronic component 112.
  • the circuit board 11 and the photosensitive element 13 are operatively connected, as shown in the figure, the surface of the circuit board 11 and the photosensitive element 13 each have an electrical connection element, such as a pad, and the two pass through a group Or a plurality of sets of connecting wires 15 are connected, and the molded base 12 integrally encloses the connecting wires 15.
  • the top side of the molded base 12 forms a flat surface for mounting the filter element 14.
  • the filter element 14 includes a filter element body 141 and a light shielding layer 142, which may be an infrared filter element, located on the top side of the molded base 12, and located at the Between the photosensitive element 13 and the lens 30, infrared light passing through the lens 30 is filtered.
  • the material of the filter element main body 141 may include an IR film (infrared cut film), an AR film (anti-reflection coating film), white glass, blue glass, a resin material, a coated composite material, crystal, or the like.
  • the light shielding layer 142 is located on the bottom side of the filter element body 141 and is located between the filter element body 141 and the molding base 12, and the light shielding layer 142 is a light absorbing material that makes the filter
  • the light element body 141 forms an intermediate effective light-transmissive region 1411 and a peripheral region 1412 through which light rays passing through the lens 30 can pass only to reach the inside of the molded base 12.
  • the light shielding layer 142 is an annular structure, and a window is formed in the middle, that is, the light shielding layer 142 forms a light path 1420 for allowing effective light to enter the light window 122 and then reach the photosensitive element 13 and is reduced. The stray light reaching the photosensitive element 13 is reached.
  • the photosensitive element 13 has a photosensitive area 131 in the middle and a non-sensitive area 132 around the photosensitive area 131.
  • the light shielding layer 142 has an inner edge 1421 and an outer edge 1422.
  • the distance between the inner edge 1421 of the light shielding layer 142 and the optical axis X is greater than or equal to, or slightly smaller than the distance between the outer edge 1311 of the photosensitive region 131 and the optical axis X. That is, the area of the light path 1420 is greater than or equal to, or slightly smaller than, the area of the photosensitive area 131.
  • the outer edge 1422 of the light shielding layer 142 is located outside of the inner edge 1241 of the top surface 124 of the molded base 12, i.e., the inner edge 1241 of the top surface 124 of the molded base 12 and A light transmissive region is not formed between the outer edges 1422 of the light shielding layer 142.
  • the light shielding layer 142 of the present invention is disposed on the side of the filter element main body 141 adjacent to the photosensitive element 13, unlike in FIG. 1B.
  • the light shielding film 2041 is disposed on the side of the filter 204 facing the lens assembly 205 thereof. That is, the light shielding layer 142 of the present invention is formed at the outer edge of the bottom surface of the filter element main body 141 for blocking stray light from reaching the photosensitive member 13.
  • a part of the stray light L11 reaching the upper surface of the filter element main body 141 of the filter element 14 is reflected by the upper surface of the filter element main body 141 without entering the place.
  • the light window 122 of the susceptor 12 is molded and refracted into the surrounding area 1412 outside the light-transmitting region 1411 above the light-shielding layer 142, it is absorbed by the light-shielding layer 142 and cannot enter the mold.
  • the light window 122 inside the base 12 is molded to serve the purpose of blocking a portion of stray light.
  • the inner surface of the molded base 12 preferably has a central symmetrical structure having an inclined inner surface 123 extending obliquely upward from the photosensitive member 13 integrally, when another portion of the stray light L12 is worn.
  • the effective transparent region 1411 of the filter element body 141 is incident on the inner surface 123, it is reflected by the inclined inner surface 123 of the molded base 12 to the light shielding layer 142. It is absorbed by the light shielding layer 142 so as not to be further reflected and reaches the photosensitive element 13, which affects the imaging quality of the imaging module 100.
  • the light shielding layer 142 is adjacent to the inclined inner surface 123 of the molding base 12, and between the two, the outer portion of the light window 122 forms a light suppression groove 1221.
  • the light suppression groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG. 3B, the stray light L12 enters the light suppression groove 1221, thereby being suppressed from being emitted from the light suppression groove 1221. More specifically, the stray light L12 can only be reflected by the inclined inner surface 123 and absorbed by the light shielding layer 142, so that the optical path of the stray light L12 is held in the light suppression groove 1221, thereby effectively reducing the arrival point.
  • the stray light of the photosensitive element 13 is described.
  • the inclined inner surface 123 extends downward from the light shielding layer 142, the light shielding layer 142 extends horizontally from the inclined inner surface 123, the light shielding layer 142 and the inclined inner surface.
  • An angle ⁇ is formed between 123, and the angle ⁇ is an acute angle or a right angle, so that light incident on the inclined inner surface 123 is prevented from being reflected toward the photosensitive member 13 to form stray light.
  • the light shielding layer 142 is disposed on the bottom surface of the filter element main body 141, and is disposed on the top surface of the filter element main body 141 with respect to the top surface of the filter element main body 141, and can also be directly directed to the molding base 12 The stray light of the inner surface 123.
  • the lens 30 is assembled to the top surface 124 of the molded base 12 to form a fixed focus camera module.
  • the lens 30 can be assembled to a lens barrel that is mounted to the top surface 124 of the molded base 12.
  • the lens 30 can be assembled to a driver that is mounted to the top surface 124 of the molded base 12 such that an autofocus camera module is formed.
  • the filter element 141 can be attached to the top surface 124 of the molded base 12, such as by glue to the top surface 124 of the molded base 12.
  • the light shielding layer 142 may be formed on the bottom surface of the filter element body 141 in various manners, such as being attached to the bottom surface of the filter element body 141, or the light shielding layer may be formed by a yellow light process or a silk screen process. 142 is formed on a bottom surface of the filter element main body 141.
  • the light shielding layer 142 may be applied to the bottom surface of the filter element body 141 by photolithography, that is, a conventional yellow light process. Applying the light shielding layer 142 to the bottom surface of the filter element body 141 by a yellow light process, specifically comprising the steps of: cleaning and drying the filter element body 141; on the filter element body 141 Coating the substrate, then spin-coating the photoresist on the filter element main body 141; soft-drying the filter element main body 141; performing alignment exposure on the filter element main body 141; and post-drying the filter element main body 141 Developing the filter element main body 141; hard-drying the filter element main body 141; and etching the filter element main body 141 to form the filter element 14.
  • the photoresist is a black absorbing material, which can absorb most of the light energy incident on the light shielding layer 142, and can absorb more than 95% of the light energy, and can only allow a very small portion of the light to be incident on the light.
  • the light shielding layer 142 can be reflected.
  • the photoresist used in the yellow light process is a photosensitive material.
  • the photoresist has unique characteristics. Under the action of UV light, it undergoes chemical changes and becomes a substance that is easily soluble in acid or alkali. Applying a photoresist to the substrate, providing a corresponding mask according to the shape required by the product, masking the mask on the photoresist, and then exposing the photoresist so that the photoresist is not covered by the mask A chemical change occurs in the region, and then the portion of the photoresist is dissolved or retained with an acid or a base to form a pattern that is identical or complementary to the shape of the mask.
  • the photoresist used in the present invention is an opaque coating which, in addition to having the photosensitive characteristics of a conventional photoresist, has an opaque property to form the light-shielding layer 142 which absorbs stray light.
  • the photomask of the present invention may have an annular mask of the same shape as the light shielding layer 142.
  • the photoresist is applied to the bottom surface of the filter element main body 141 during fabrication, and the photomask is covered. Exposure is performed on the photoresist, and after the exposure, a photoresist that undergoes chemical change in the middle is removed, and the light-shielding layer 142 is formed in a region covered by the photomask, and the outer frame edge of the photomask is determined. The position of the outer edge 1422 of the light shielding layer 142 determines the position of the inner edge 1421 of the light shielding layer 142.
  • the thickness of the light shielding layer 142 is relatively small, for example, 2 ⁇ m to 3 ⁇ m.
  • the screen layer 142 is applied to the bottom surface of the filter element body 141 by a screen printing process, specifically comprising the steps of: applying a light absorbing ink to the filter element body 141 through a screen printing plate;
  • the filter element 14 is obtained by baking the filter element main body 141 coated with the above-described light absorbing ink.
  • the ink is a black absorbing opaque material, and can absorb most of the light energy incident on the light shielding layer 142, such as absorbing more than 95% of the light energy, and only allowing a very small portion. Light can be reflected after being incident on the light shielding layer 142.
  • the thickness of the light shielding layer may be 7 ⁇ m to 12 ⁇ m by the above silk screen process.
  • the photosensitive module 10 of the camera module 100 includes the circuit board 11, the molding base. a seat 12, the photosensitive element 13 and the filter element 14.
  • the molded base 12 has a top side recess 125 on its top side for assembling the filter element 14.
  • the top surface 124 of the molded base 12 may be a multi-stepped surface, such as illustrated in Figures 4A and 4B, the top surface 124 being divided into a multi-part top surface of the face, such as a first partial top surface 124a and a second partial top surface 124b, the first partial top surface 124a being recessed toward the photosensitive element 13 relative to the second partial top surface 124b,
  • the top side groove 125 on the top side of the first portion top surface 124a, the filter element 14 being assembled to the top side groove 125, thereby reducing the filter element 14 and the photosensitive element
  • the distance between the 13 is reduced, and the overall size of the camera module 100 is reduced.
  • the outer edge 1422 of the light shielding layer 142 is located outside the inner edge 1241 of the first portion top surface 124a of the molded base 12, ie, the first portion top surface 124a of the molded base 12.
  • a light transmissive region is not formed between the inner edge 1241 and the outer edge 1422 of the light shielding layer 142.
  • a part of the stray light L21 incident on the upper surface of the filter element main body 141 of the filter element 14 is reflected by the upper surface of the filter element main body 141 without entering the molding.
  • the light window 122 of the susceptor 12 when refracted into the surrounding area 1412 outside the light-transmitting region 1411 above the light-shielding layer 142, is absorbed by the light-shielding layer 142 and cannot enter the molded base.
  • the light window 122 inside 12 serves to block a part of stray light.
  • the molded base 12 has an inner surface 123 extending obliquely upward from the photosensitive element 13 integrally, which includes a multi-part inner surface as shown in the bottom side portion as shown in the drawing The surface 123a and the top side portion inner surface 123b.
  • the bottom side portion inner surface 123a integrally extends obliquely from the photosensitive member 13, the top side portion inner surface 123b integrally extending from the first portion top surface 124a, the top side groove 125 being formed in the The inner side of the second portion inner surface 123b and the top side of the first portion top surface 124a.
  • the bottom side of the molded base 12 is A portion of the inner surface 123a is reflected to the light shielding layer 142 to be absorbed by the light shielding layer 142 so as not to be further reflected to reach the photosensitive element 13, affecting the image quality of the image sensor module 100.
  • the light shielding layer 142 between the molded base 12 and the filter element main body 141, it is possible to effectively face the bottom side portion of the molded base 12
  • the stray light of the inner surface 123a is absorbed, and correspondingly, the light shielding layer 142 is adjacent to the bottom side inner surface 123a of the molded base 12, and the bottom side portion of the molded base 12
  • the inner surface 123a extends downward from the light shielding layer 142, and between the two, the outer portion of the light window 122 forms a space for suppressing the emission of stray light, and a light suppression groove 1221, so that the stray light L22 enters the In the light-sinking groove 1221, it is not possible to emit in the light-sinking groove 1221.
  • the stray light L12 can be reflected only by the bottom side inner surface 123a and absorbed by the light shielding layer 142, so that the optical path of the stray light L12 is held in the light suppression groove 1221, thereby effectively reducing The stray light reaching the photosensitive element 13 is reached.
  • the camera module 100 includes the photosensitive module 10, the lens 30 and a lens Lens carrier element 40.
  • the lens 30 is assembled to the lens carrying member 40 to form a lens assembly.
  • the lens carrying member 40 can be a driver or a fixed lens barrel.
  • the lens carrying component is a driver, and the driver can be implemented as a voice coil motor, a piezoelectric motor, a thermodynamic driver, a microelectromechanical driver, etc. to implement an autofocus function, thereby forming an autofocus camera mode. group.
  • the photosensitive member 10 includes a circuit board 11, a molding base 12, a photosensitive element 13 and a filter element 14.
  • the molding base 12 includes a base body 121 which is integrally formed.
  • a light window 122 is formed on the circuit board 11 and the photosensitive element 13, and the light window 122 is a closed space, and provides light passage to the photosensitive element 13.
  • the filter element 14 includes a filter element body 141 and a light shielding layer 142, the light shielding layer 142 is located on the bottom side of the filter element body 141 and is located at the filter element body 141 and the molding base. Between the seats 12, the light shielding layer 142 is a light absorbing material, which causes the filter element main body 141 to form an intermediate effective transparent region 1411 and a surrounding region 1412, and the light passing through the lens 30 can only pass through the light.
  • the effective light transmitting region 1411 can reach the inside of the molded base 12.
  • the light shielding layer 142 is an annular structure, and a window is formed in the middle, that is, the light shielding layer 142 forms a light path 1420 for allowing light to enter the light window 122 and then reach the photosensitive element 13 and is reduced in arrival.
  • the photosensitive element 13 has a photosensitive area 131 in the middle and a non-sensitive area 132 around the photosensitive area 131.
  • the light shielding layer 142 has an inner edge 1421 and an outer edge 1422. The distance between the inner edge 1421 of the light shielding layer 142 and the optical axis X is greater than or equal to, or slightly smaller than the distance between the outer edge 1311 of the photosensitive region 131 and the optical axis X.
  • the outer edge 1422 of the light shielding layer 142 is located outside of the inner edge 1241 of the top surface 124 of the molded base 12, i.e., the inner edge 1241 of the top surface 124 of the molded base 12 and A light transmissive region is not formed between the outer edges 1422 of the light shielding layer 142.
  • the inner surface of the base body 121 of the molded base 12 preferably has a central symmetrical structure including a plurality of portions of the inner surface extending in different directions, such as the molding base.
  • the base body 121 of the seat 12 includes three portions, that is, a photosensitive element joint portion 1211 and a top side extension portion 1212 located around the light window 122 shown in FIG. 5A, and is located around the photosensitive member 13.
  • the integrated body is integrated with a peripheral portion of the photosensitive member 13 and a circuit board joint portion 1213 of the top surface of the circuit board 11, and the three portions integrally extend to form an integral structure.
  • the photosensitive element coupling portion 1211 and the photosensitive element coupling portion 1211 have an inner surface integrally extending from the photosensitive member 13, which is defined as a first partial inner surface 1231 of the molded base 12, the top side extending
  • the portion 1212 has an inner surface extending integrally from the photosensitive element joint portion 1211, which is defined as a second portion inner surface 1232 of the molded base 12, the second portion inner surface 1232 integrally extending from the The first portion of the inner surface 1231.
  • the inner surfaces 1231 and 1232 of the photosensitive element joint 1211 and the top side extension 1212 respectively extend with different slopes, and the second partial inner surface 1232 of the top side extension 1212 is opposite to the photosensitive element
  • the first partial inner surface 1231 of the joint portion 1211 extends upward with a greater slope, or the second portion inner surface 1232 of the top side extension 1212 extends upward without a slope, ie, the top side extension
  • the second portion inner surface 1232 of the 1212 extends substantially perpendicular to the top surface of the photosensitive element 13, and the top side extension 1212 becomes a vertical extension such that the area of the top surface of the top side extension 1212 Can be relatively large, that is, the top surface of the top side extension 1212 determines the area of the top surface 124 of the molded base 12, and the extension of the photosensitive element joint 1211 and the top side extension 1212
  • the structure can increase the area of the top surface 124 of the molded base 12, thereby providing a larger mounting area for the lens or lens assembly above the photosensitive
  • the photosensitive member joint portion 1211 is formed by a structure in which the first portion inner surface 1231 defined by its inner surface is inclined at a relatively small slope from the The photosensitive element 13 extends upwardly, and the second partial inner surface 1232 defined by the inner surface of the top side extension 1212 integrally extends in a meandering manner from the first partial inner surface 1231 and has a relatively large slope or no slope Extending upwardly, that is, an angle formed between the second partial inner surface 1232 of the molded base 12 and the first partial inner surface 1231, so as to be inclined upwardly with respect to a fixed slope, can effectively increase The area size of the top surface 124 of the molded susceptor 12 is described.
  • an angle between the first portion inner surface 1231 defined by the inner surface of the photosensitive element joint portion 1211 and the optical axis X of the camera module 100 is ⁇
  • the top side extension portion The angle between the second portion inner surface 1232 defined by the inner surface of 1212 and the optical axis X of the camera module 100 is ⁇ , wherein the value of ⁇ ranges from 3° to 80°, and the value range of ⁇ is 0° to 10°, and ⁇ > ⁇ .
  • the value of a is 3° and the value of ⁇ is 0°; in one embodiment, the value of ⁇ is 30° and the value of ⁇ is 0°; in a specific embodiment, The value of ⁇ is 60° and the value of ⁇ is 0°; in one embodiment, the value of ⁇ is 45° and the value of ⁇ is 5°; in one embodiment, the value of ⁇ is 80°, ⁇ The value is 10°.
  • the angle ⁇ between the second partial inner surface 1232 defined by the inner surface of the top side extension 1212 and the optical axis X of the camera module 100 is opposite to the photosensitive element coupling portion 1211.
  • the angle ⁇ between the first partial inner surface 1231 defined by the inner surface and the optical axis X of the camera module 100 has a smaller angle, such that the second portion of the top side extension 1212
  • the inner surface 1232 extends upward with a greater slope or in a direction perpendicular to the photosensitive element 13, thereby increasing the area of the top surface 124 of the molded base 12.
  • the thickness H1 of the photosensitive element joint portion 1211 ranges from 0.05 mm to 0.7 mm, and the thickness H2 of the top side extension portion 1212 ranges. It is 0.02mm to 0.6mm.
  • the thickness H1 of the photosensitive element joint portion 1211 ranges from 0.08 mm, and the thickness H2 of the top side extension portion 1212 ranges from 0.5 mm; in one embodiment, the photosensitive portion
  • the thickness H1 of the element joint portion 1211 ranges from 0.4 mm, and the thickness H2 of the top side extension portion 1212 ranges from 0.3 mm.
  • the thickness H1 of the photosensitive element joint portion 1211 ranges from 0.5. In mm, the thickness H2 of the top side extension 1212 ranges from 0.1 mm.
  • the second partial inner surface 1232 of the top side extension 1212 is deflected from the first partial inner surface 1231 to extend in a direction smaller than the optical axis X, thereby allowing molding.
  • the nip which is pressed against the photosensitive member 13 can be prevented from avoiding the connecting line 15 between the circuit board 11 and the photosensitive member 13, thereby preventing the connecting line 15 from being crushed. That is, in some cases, if the molded base 12 to be formed is extended with a relatively small fixed slope, such as an angle between the inner surface and the optical axis X of 45 to 80, in the mold The embossing of the photosensitive member 13 in the plastic process may hit the connecting wire 15 to cause damage to the connecting wire 15.
  • the angle ⁇ between the first partial inner surface 1231 defined by the inner surface of the photosensitive element coupling portion 1211 and the optical axis X of the camera module 100 may be relatively large, so that incident The light ray L32 to the inner surface 1231 of the first portion is not directly reflected to the photosensitive member 13 to form stray light. That is, the photosensitive element joint portion 1211 and the top side extension portion 1212 are fitted to each other, the structure of the photosensitive element joint portion 1211 facilitates demolding and reduces stray light, and the top side extension portion 1212 is used to increase The area of the top surface 124 of the molded base 12 and the structure of the top side extension 1212 avoid the molding process from being crushed by the ram by the molding process.
  • the position 1230 where the first partial inner surface 1231 and the second partial inner surface 1232 are connected is located inside the connecting line 15.
  • the turning point between the photosensitive element coupling portion 1211 and the top side extending portion 1212 does not exceed the position where the connecting line 15 is located, that is, the photosensitive element coupling portion 1211 is not extended to the connecting line 15
  • the transition to the top side extension 1212 is completed immediately before the connection line 15 is prevented from being crushed by the ram during the molding process.
  • the distance between the position of the inner edge 1241 of the top surface 124 of the molded base 12 and the optical axis X of the camera module is not less than
  • the distance between the connecting line 15 and the optical axis X of the camera module is such that the top side extension 1212 increases the area of the top surface 124 of the molded base 12.
  • the filter element 14 when the filter element 14 is disposed only on the top side of the top side light shielding layer 143, it is capable of absorbing a portion of the light N31, but the light N32 is subjected to the molded base and the filter.
  • the bottom surface of the light element reflects to form stray light.
  • the filter element 14 When the filter element 14 is provided with the light shielding layer 142 on the bottom side, as shown in FIG. 6A, a part of the stray light L31 incident on the upper surface of the filter element main body 141 of the filter element 14 is formed. Reflected by the upper surface of the filter element body 141 without entering the light window 122 of the molding base 12, and refracting into the surrounding area outside the light-transmitting region 1411 above the light shielding layer 142 At 1412, the light window 122 is absorbed by the light shielding layer 142 and cannot enter the light window 122 inside the molded base 12, thereby blocking a part of stray light.
  • the first portion of the tilt of the molded base 12 may be A portion of the inner surface 1231 is reflected upward to the light shielding layer 142 or further reflected by the second partial inner surface 1232 to the light shielding layer 142 to be absorbed by the light shielding layer 142 so as not to be further reflected.
  • the photosensitive element 13 affects the imaging quality of the camera module 100.
  • the light shielding layer 142 is adjacent to the second partial inner surface 1232 of the molding base 12, and the second partial inner surface 1232 of the molding base 12 is from the light shielding layer 142 extending downward, and between the first portion inner surface 1231 and the second portion inner surface 1232 of the light shielding layer 142, an outer portion of the light window 122 forms a light suppression groove 1221, the light suppression groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG. 6A, the stray light L32 enters the light suppression groove 1221 so as not to be ejected in the light suppression groove 1221.
  • the light shielding layer 142 and the second partial inner surface 1232 of the molding base 12 are adjacent, the light shielding layer 142 is effectively reduced through the filter element body. 141 and light reaching the inner surface 1232 of the second portion, thereby preventing light incident on the inner surface 1232 of the second portion from being reflected by the inner surface 1232 of the second portion to reach the photosensitive element 13 to form stray light and affecting The imaging quality of the camera module 100.
  • the second portion inner surface 1232 extends downward from the light shielding layer 142, and the light shielding layer 142 extends horizontally from the second portion inner surface 1232, the light shielding layer 142 and An angle ⁇ is formed between the inner surface 1232 of the second portion, and the angle ⁇ is an acute angle or a right angle, so that the light-proof groove 1221 of such a structure is formed to prevent the light incident on the inner surface 123 from being reflected toward the The photosensitive element 13 forms stray light.
  • FIG. 7A to 7C are schematic views showing a manufacturing process of the integrally formed circuit board 11 of the photosensitive member 10 according to the present invention, the molded base 12 and the integral assembly of the photosensitive member 13.
  • the manufacturing apparatus 200 includes a molding die 210 including a first mold 211 and a second mold 212 capable of opening and clamping, that is, a mold fixing device capable of the first mold 211 and the The second mold 212 is separated and closely formed to form a molding cavity 213.
  • the circuit board 11 connected to the photosensitive member 13 is fixed in the molding cavity 213, and the fluid-like mold
  • the plastic material 16 enters the molding cavity 213 to be integrally formed on the circuit board 11 and the photosensitive member 13, and after curing, forms the integrally formed on the circuit board 11 and the photosensitive member 13.
  • the susceptor 12 is molded. It will be appreciated that in the production process, the integral assembly described above is typically produced in a panel manner, i.e., a continuous molded base is formed on a circuit board panel, but is cut to form the integral assembly of the present invention. In FIGS. 7A to 7C, a process of forming one of the integral components will be described as an example.
  • the molding die 210 further has a base molding guide groove 215 and a light window molding portion 214 included in the base molding guide groove 215.
  • the light window molding portion 214 and the base molding guide groove 215 extend in the molding cavity 213, and the molding material in a fluid state 16 is filled into the base molding guide groove 215, and the position corresponding to the light window molding portion 214 cannot be filled with the fluid molding material 16, so that the position corresponding to the base molding guide groove 215 is
  • the molded material 16 in fluid form may be cured to form the molded base 12, which includes an annular molded body 121 corresponding to the molded base 12 of each of the photosensitive members 10, in correspondence
  • the position of the light window forming portion 214 may form the light window 122 of the molded base 12.
  • the molding material 16 may be selected from, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, and the like.
  • the light window forming portion 214 is superposed on the top surface of the photosensitive member 13 and closely fits, thereby fluid
  • the molding material 16 is prevented from entering the photosensitive region 131 of the photosensitive member 13 on the circuit board 11, so that the molding base can be finally formed at a position corresponding to the light window molding portion 214.
  • the light window forming portion 214 may be a solid structure or a structure having a groove shape inside as shown in the drawing. It can be understood that, in another variation, an elastic film may be disposed on the bottom side of the first mold 211 to provide cushioning and demolding after the molding process.
  • the light window forming portion 214 is press-fitted to the photosensitive member 13 to extend correspondingly to the photosensitive member joint portion 1211 and the top side of the molded base 12.
  • the light window forming portion 214 has a bottom side molding portion 2141 and a top side molding portion 2142, and the bottom side molding portion 2141 is a frustum-shaped structure having an enlarged inner diameter from the bottom side toward the top side direction. .
  • the outer surface 21411 of the bottom side molding portion 2141 forms an angle ⁇ with the optical axis X perpendicular to the photosensitive member 13, the outer surface 21421 of the top side molding portion 2142 and the light perpendicular to the photosensitive member 13
  • An angle ⁇ is formed between the axes X. Accordingly, the value of ⁇ ranges from 3° to 80°, the value of ⁇ ranges from 0° to 10°, and ⁇ > ⁇ .
  • the top side molding portion 2142 is steered from the bottom side molding portion 2141, and is not pressed against the connecting wire 15 in the molding process to cause damage of the connecting wire 15.
  • the light window forming portion 214 has a first partial outer surface 21411 and a second partial outer surface 21421 from the bottom side toward the top side direction, which form an angle ⁇ and ⁇ with an optical axis X perpendicular to the photosensitive member 13, respectively.
  • the value of ⁇ ranges from 3° to 80°, and the value of ⁇ ranges from 0° to 10°, and ⁇ > ⁇ .
  • the first partial inner surface 1231 extends obliquely from the photosensitive element 13 with a relatively small slope
  • the second partial inner surface 1232 defined by the inner surface of the top side extension 1212 is from the inner surface of the first portion
  • the 1231 extends integrally in a folded manner and extends upward with a relatively large slope or without a slope. That is, the angle between the first portion inner surface 1231 defined by the inner surface of the photosensitive element coupling portion 1211 and the optical axis X of the camera module 100 is ⁇ , and the inner surface of the top side extension 1212 is defined.
  • the angle between the second portion inner surface 1232 and the optical axis X of the camera module 100 is ⁇ , wherein the value of ⁇ ranges from 3° to 80°, and the value of ⁇ ranges from 0° to 10°. And ⁇ > ⁇ .
  • ranges from 3° to 80°
  • ranges from 0° to 10°.
  • ⁇ > ⁇ It can be understood that the structure in which the light window molding portion 214 is extended in the manner of folding can be reduced in the molding process by the non-photosensitive region 132 and the light window molding portion 214 entering the photosensitive member 13.
  • the top surface of the filter element body 141 is further provided with a top side light shielding layer 143.
  • the top side light shielding layer 143 and the light shielding layer 142 cooperate to enhance the effect of reducing stray light. More specifically, the light ray L41 incident on the top side light shielding layer 143 is absorbed by the top side light shielding layer 143, and the light ray L42 is absorbed by the light shielding layer 142. It is to be understood that the second preferred embodiment described above may also be provided with the top side light shielding layer 143.
  • the camera module 100 includes the photosensitive member 10, the lens 30 and a lens carrying member 40.
  • the lens 30 is assembled to the lens carrying member 40 to form a lens assembly.
  • the lens carrying component 40 can be a fixed lens barrel to form a fixed focus camera module.
  • the photosensitive member 10 includes a circuit board 11, a molding base 12, a photosensitive element 13 and a filter element 14.
  • the molding base 12 includes a base body 121 which is integrally formed.
  • a light window 122 is formed on the circuit board 11 and the photosensitive element 13, and the light window 122 is a closed space, and provides light passage to the photosensitive element 13.
  • the filter element 14 includes a filter element body 141 and a light shielding layer 142.
  • the light shielding layer 142 is a light absorbing opaque material located on a bottom side of the filter element body 141 and located at the filter element. Between the body 141 and the molded base 12.
  • the molded base 12 has a top side recess 125 on its top side for assembling the filter element 14. That is, in this embodiment of the invention, the top surface 124 of the molded base 12 may be a multi-stepped surface, the top surface 124 being divided into a multi-part top surface that is not coplanar, such as a first partial top a surface 124a and a second partial top surface 124b, the first partial top surface 124a being recessed relative to the second partial top surface 124b toward the photosensitive element 13, such that the top side of the first partial top surface 124a
  • the top side groove 125 is formed, and the filter element 14 is assembled to the top side groove 125.
  • the top side extension 1212 of the molded base 12 is correspondingly in two stages, and the top side groove 125 is formed on the top side thereof.
  • the inner surface 123 of the molded base 12 correspondingly includes the first partial inner surface 1231 of the photosensitive element joint 1211 and the second partial inner surface 1232 and the third partial inner surface formed by the top side extension 1212. 1233, the light shielding layer 142 is adjacent to the second partial inner surface 1232 of the molding base 12, and forms the above between the first partial inner surface 1231 and the second partial inner surface 1232
  • the light groove 1221 is formed to form a space for suppressing the emission of stray light.
  • the light incident on the first partial inner surface 1231 is directly reflected to the light shielding layer 142 or further reflected by the second partial inner surface 1232 to the light shielding layer 142 to be absorbed by the light shielding layer 142, thereby reducing Stray light.
  • the top side light shielding layer 143 is also disposed on the top side of the filter element 14 to enhance the effect of eliminating stray light.
  • the wiring direction of the connecting line 15 is from the photosensitive element 13 to the circuit board 11, that is, by being disposed on the photosensitive element 13.
  • the photosensitive element is connected to the disk, and the wire jig is first wired at the top end of the photosensitive element lands to form a first end of the connecting line 15 connected to the photosensitive element lands, and then the preset position is raised And then moving toward the board lands on the board and then lowering to form a second end of the connecting line 15 connected to the board lands at the top end of the board lands.
  • the electronic component 112 of the circuit board 11 of the photosensitive module 10 of the camera module 100 is mounted.
  • the photosensitive assembly 10 accordingly also includes one or more bottom side moldings 19 that integrally enclose the electronic component 112. That is, the electronic component 112 is not mounted on the top side of the circuit board 11, and the electronic components 112 are disposed on the bottom side of the circuit board 11 and pass through the bottom side molding portion 19, which may be many A separate portion may also form an integral molded base that embeds the electronic component 112 and forms a bottom side flat support surface.
  • the bottom side molding portion 19 and the molding base 12 may be separately formed, or may be formed in a single molding process, such as the circuit board 11 may have perforations, and the molding material 16 is Both sides of the circuit board 11 can be reached in the molding process.
  • the space on the bottom side of the circuit board 11 under the photosensitive element 13 can also be used to arrange the electronic component 112, so that the electronic component 112 does not need to be arranged as in the above embodiment.
  • the area size of the circuit board 11 is significantly reduced.
  • the molded base 12 includes the photosensitive element joint portion 1211 and the top side extension portion 1212, such that the top side extension portion 1212 passes through the first side extension portion 1212 in the case where the size of the photosensitive member 10 is further reduced.
  • the area of the top surface 124 of the molded base 12 is increased to provide a larger mounting surface for the lens carrier element 40 and the filter element 14.
  • the filter element 14 includes a bottom side light shielding layer 142 and a top side light shielding layer 143 disposed on both sides of the filter element body 141, thereby enhancing the effect of eliminating stray light.
  • the wire bonding connection between the photosensitive member 13 and the circuit board 11 is from the circuit board 11 to the photosensitive member 13. That is, by providing the circuit board lands on the circuit board 11, the wire rig is first wired at the top end of the circuit board lands to form the connection line 15 connected to the circuit board lands. The second end, then raises the preset position, then translates toward the board lands and forms an opposite first end of the connecting line 15 connected to the photosensitive element lands at the top end of the illuminating element lands Thus, the connecting line 15 extends in a curved shape, and causes the top end height h2 of the connecting line 15 to be lower than the height h1 of the top end of the connecting line in the embodiment of FIGS.
  • the light window forming portion 214 of the molding die 210 needs to avoid a reduction in the space of the connecting line 15, so that the height of the top side extending portion 1212 can be higher.
  • a camera module 100 includes a photosensitive module 10 and a lens 30.
  • the lens 30 is assembled to the photosensitive component to form a fixed focus camera module. It can be understood that, in another modified embodiment, the lens may also be disposed on a driver or a fixed lens barrel to form a lens assembly, and the lens assembly is assembled to the photosensitive assembly.
  • the photosensitive member 10 includes a circuit board 11, a molding base 12, a photosensitive element 13, a filter element 14 and a filter element holder 17, and the molding base 12 includes a base.
  • the main body 121 is integrally formed on the circuit board 11 and the photosensitive member 13 and forms a light window 122.
  • the light window 122 is a closed space and provides a light path to the photosensitive member 13.
  • the filter element holder 17 is assembled to the molded base 12 and has a bottom side opening window 171 and a top side mounting groove 172, and the filter element 14 is assembled to the top side mounting groove 172.
  • the assembly of the filter element 14 to the filter element holder 17 is less susceptible to damage than the direct assembly to the mold base 12.
  • the filter element 14 includes a filter element body 141, a bottom side light shielding layer 142 and a top side light shielding layer 143.
  • the light shielding layer 142 is located on the bottom side of the filter element body 141 and is located at the filter. Between the light element body 141 and the inner top surface of the filter element holder 17, the light shielding layer 142 is a light absorbing material that causes the filter element body 141 to form an intermediate effective light transmissive area 1411 and a surrounding area 1412, Light passing through the lens 30 can only pass through the effective light transmitting region 1411 to reach the inside of the molded base 12.
  • the light shielding layer 142 is an annular structure, and a window is formed in the middle, that is, the light shielding layer 142 forms a light path 1420 for allowing light to enter the light window 122 and reduces the amount of impurities reaching the photosensitive element 13.
  • the astigmatism, the top side light shielding layer 143 can enhance the effect of reducing stray light.
  • the photosensitive element 13 has a photosensitive area 131 in the middle and a non-sensitive area 132 around the photosensitive area 131.
  • the light shielding layer 142 has an inner edge 1421 and an outer edge 1422. The distance between the inner edge 1421 of the light shielding layer 142 and the optical axis X is greater than or equal to, or slightly smaller than the distance between the outer edge 1311 of the photosensitive region 131 and the optical axis X.
  • An outer edge 1422 of the light shielding layer 142 is located outside the inner edge 1701 of the top surface of the filter element holder 17, that is, the inner edge of the top surface of the filter element holder 17 and the light shielding layer A light transmissive region is not formed between the outer edges 1422 of 142.
  • the base body 121 of the molded base 12 includes a plurality of portions of the inner surface extending in different directions, such as the base body 121 of the molded base 12.
  • a three-part that is, a photosensitive element joint 1211 and a top side extension 1212 located around the light window 122 shown in FIGS. 12A and 12B, and a circuit board on the bottom side of the photosensitive element joint 1211 Bonding portion 1213.
  • the photosensitive element coupling portion 1211 has an inner surface integrally extending from the photosensitive member 13, which is defined as a first partial inner surface 1231 of the molded base 12, and the top side extending portion 1212 has a photosensitive member from the photosensitive member
  • An integrally extended inner surface of the joint 1211 is defined as a second partial inner surface 1232 of the molded base 12, the second partial inner surface 1232 extending integrally from the first partial inner surface 1231.
  • the inner surfaces 1231 and 1232 of the photosensitive element joint 1211 and the top side extension 1212 respectively extend with different slopes, and the second partial inner surface 1232 of the top side extension 1212 is opposite to the photosensitive element
  • the first partial inner surface 1231 of the joint portion 1211 extends upward with a greater slope, or the second portion inner surface 1232 of the top side extension 1212 extends upward without a slope, ie, the top side extension
  • the second portion inner surface 1232 of the 1212 extends substantially perpendicular to the top surface of the photosensitive element 13 such that the area of the top surface of the top side extension 1212 can be relatively large, ie, the top side extension 1212
  • the top surface determines the area of the top surface 124 of the molded base 12, and the elongated structure of the photosensitive element joint 1211 and the top side extension 1212 can increase the molding base 12
  • the area of the top surface 124 is such that a larger mounting area can be provided for the lens or lens assembly or the filter element holder 17 above the photosensitive
  • the photosensitive member joint portion 1211 is formed by a structure in which the first portion inner surface 1231 defined by its inner surface is inclined at a relatively small slope from the The photosensitive element 13 extends upwardly, and the second partial inner surface 1232 defined by the inner surface of the top side extension 1212 integrally extends in a meandering manner from the first partial inner surface 1231 and has a relatively large slope or no slope Extending upwardly, that is, an angle formed between the second partial inner surface 1232 of the molded base 12 and the first partial inner surface 1231, so as to be inclined upwardly with respect to a fixed slope, can effectively increase The area size of the top surface 124 of the molded susceptor 12 is described.
  • an angle between the first portion inner surface 1231 defined by the inner surface of the photosensitive element coupling portion 1211 and the optical axis X of the camera module 100 is ⁇
  • the top side extension portion The angle between the second portion inner surface 1232 defined by the inner surface of 1212 and the optical axis X of the camera module 100 is ⁇ , wherein the value of ⁇ ranges from 3° to 80°, and the value range of ⁇ is 0° to 10°, and ⁇ > ⁇ .
  • the angle ⁇ between the second partial inner surface 1232 defined by the inner surface of the top side extension 1212 and the optical axis X of the camera module 100 is opposite to the photosensitive element coupling portion 1211.
  • the angle ⁇ between the first partial inner surface 1231 defined by the inner surface and the optical axis X of the camera module 100 has a smaller angle, such that the second portion of the top side extension 1212
  • the inner surface 1232 extends upward with a greater slope or in a direction perpendicular to the photosensitive element 13, thereby increasing the area of the top surface 124 of the molded base 12.
  • the thickness H1 of the photosensitive element joint portion 1211 ranges from 0.05 mm to 0.7 mm, and the thickness H2 of the top side extension portion 1212 ranges. It is 0.02mm to 0.6mm.
  • the filter element 14 when the filter element 14 is disposed only on the top side of the top side light shielding layer 143, it is capable of absorbing a portion of the light N51, but the light N52 is subjected to the molded base and the filter.
  • the bottom surface of the light element reflects to form stray light.
  • the filter element 14 When the filter element 14 is provided with the light shielding layer 142 and the top side light shielding layer 143, as shown in FIG. 13A, the upper surface of the filter element body 141 is incident on the filter element 14. Part of the stray light L51 is absorbed by the top side light shielding layer 143, thereby serving to block a part of stray light.
  • the first portion of the tilt of the molded base 12 is reflected upward to the light shielding layer 142 or further reflected by the second partial inner surface 1232 to the light shielding layer 142 to be absorbed by the light shielding layer 142 so as not to be further reflected.
  • the photosensitive element 13 affects the imaging quality of the camera module 100.
  • the light shielding layer 142 and the filter element holder 17 are adjacent to an inner surface 1702 below the filter element, and the filter element holder 17 is located at an inner surface 1702 below the filter element.
  • the light shielding layer 142 extends downward, and in the light shielding layer 142, the inner surface 1702 of the filter element holder 17 under the filter element, the first partial inner surface 1231 and the second partial inner surface Between 1232, the outer portion of the light window 122 forms a light-sinking groove 1221.
  • the light-sinking groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG. 13A, the stray light L52 enters the light suppression groove 1221 so as not to be ejected in the light suppression groove 1221.
  • the light shielding layer 142 and the filter element holder 17 are located adjacent to the inner surface 1702 below the filter element, the light shielding layer 142 is effectively reduced through the Filtering the element body 141 to reach the inner surface 1702 under the filter element and the light of the second portion inner surface 1232, thereby avoiding incidence into the inner surface 1702 and the second portion below the filter element
  • the light of the surface 1232 is reflected to reach the photosensitive element 13 to form stray light and affect the imaging quality of the camera module 100.
  • the filter element 14 may be provided only on the bottom side of the filter element body 141.
  • the light shielding layer 142 may be absent from the top side light shielding layer 143.
  • the top side of the molded base 12 is formed with a top side groove 125, and the filter element holder 17 is assembled.
  • the top side groove 125 is moved downward so that the lens 30 can be assembled on the top side of the molded base 12. That is, the top surface 124 of the molded base 12 which is enlarged by the multi-stage extension is used to assemble the filter element holder 17 and the lens 30.
  • the 15 to FIG. 17A is a camera module 100 according to a fourth preferred embodiment of the present invention, the structure of which is similar to the third preferred embodiment described above.
  • the camera module 100 includes a photosensitive component 10 and A shot of 30.
  • the lens 30 is assembled to the photosensitive component to form a fixed focus camera module. It can be understood that, in another modified embodiment, the lens may also be disposed on a driver or a fixed lens barrel to form a lens assembly, and the lens assembly is assembled to the photosensitive assembly.
  • the photosensitive member 10 includes a circuit board 11, a molding base 12, a photosensitive element 13, a filter element 14 and a filter element holder 17, and the molding base 12 includes a base.
  • the main body 121 is integrally formed on the circuit board 11 and the photosensitive member 13 and forms a light window 122.
  • the light window 122 is a closed space and provides a light path to the photosensitive member 13.
  • the molded base 12 includes a photosensitive element joint 1211 and a top side extension 1212 extending in multiple stages, and the inner surfaces 1231 and 1232 extend in different directions, respectively, for reducing stray light and increasing The area of the top surface 124 of the molded susceptor 12 is described.
  • the filter element holder 17 is assembled to the molding base 12 and has a top side opening window 171 and a bottom side mounting groove 173, and the filter element 14 is assembled in the bottom side mounting groove in a reversed manner. 173.
  • the filter element 14 includes a filter element body 141 and a light shielding layer 142 disposed on a bottom side of the filter element body 141.
  • the light shielding layer 142 can function to reduce stray light reaching the photosensitive element 13.
  • the lens 30 includes a carrier 31 and one or more lenses 32 assembled to the carrier 31, wherein the filter is caused by the filter element 14 being flipped over the filter element holder 17
  • the element 14 does not protrude from the upper surface of the filter element holder 17, and the bottommost side lens of the one or more lenses 32 of the lens 30 can be positioned relatively downward, thereby reducing the photosensitive element
  • the distance between the 13 is such that the back focus of the camera module 100 can be reduced.
  • the filter element 14 when the filter element 14 is disposed only on the top side of the top side light shielding layer 143, it is capable of absorbing a portion of the light N61, but the light N62 is subjected to the molded base and the filter.
  • the bottom surface of the light element reflects to form stray light.
  • the filter element 14 When the filter element 14 is provided with the light shielding layer 142 on the bottom side, as shown in FIG. 17A, part of the stray light L61 incident on the upper surface of the filter element holder 17 is reflected without being entered.
  • the light window 122 of the susceptor 12 is molded to serve the purpose of blocking a portion of stray light.
  • the first portion of the tilt of the molded base 12 may be A portion of the inner surface 1231 is reflected upward to the light shielding layer 142 or further reflected by the second partial inner surface 1232 to the light shielding layer 142 to be absorbed by the light shielding layer 142 so as not to be further reflected.
  • the photosensitive element 13 affects the imaging quality of the camera module 100.
  • the filter element 14 may further include a top side light shielding layer 143 on the top side of the filter element body 141 to enhance the effect of reducing stray light.
  • the light shielding layer 142 is adjacent to the second partial inner surface 1232 of the molding base 12, and the second partial inner surface 1232 of the molding base 12 is from the light shielding layer 142 extending downward, and between the first portion inner surface 1231 and the second portion inner surface 1232 of the light shielding layer 142, an outer portion of the light window 122 forms a light suppression groove 1221, the light suppression groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG. 17A, the stray light L62 enters the light-sinking groove 1221 so as not to be ejected in the light-sinking groove 1221.
  • the light shielding layer 142 is effectively reduced through the filter element body 141 because of the light shielding layer 142 and the second portion inner surface 1232 of the molding base 12. And reaching the light of the inner surface 1232 of the second portion, thereby preventing the light incident on the inner surface 1232 of the second portion from being reflected to reach the photosensitive element 13 to form stray light and affect the imaging quality of the camera module 100. .
  • the connecting line 15 is wired from the circuit board 11 to the photosensitive member 13, thereby molding the molding process.
  • the light window forming portion 214 does not require the escape space provided to the connecting line 15 as much as possible, and the top side extending portion 1212 has a large height to increase the top of the molded base 12.
  • the area of surface 124 is not required to increase the top of the molded base 12.
  • a top window 171 is formed on the top side of the filter element holder 17.
  • the length of the top side portion 174 of the filter element holder 17 extending inward may be greater than or equal to the length of the light shielding layer 142 extending inwardly.
  • the area of the window 171 may be no larger than the area of the light path 1420, such that the top surface of the filter element holder 17 has the effect of blocking a part of the stray light L71, so that the top side of the filter element 14 is not required.
  • the top side light shielding layer 143 is provided.
  • the stray light L72 can be absorbed by the light shielding layer 142.
  • the photosensitive member 10 includes a circuit board 11, a molding base 12, a photosensitive element 13, and a filter element. 14.
  • the molded base 12 is integrally coupled with the circuit board, the photosensitive element 13 and the stop frame 18, and the filter element 14 is assembled to the filter element holder 17, and the filter element holder 17 It is assembled to the top side of the molded base 12.
  • the light shielding layer 142 of the filter element 14 is disposed on the bottom side of the filter element body 142 similarly to the fourth preferred embodiment described above, and functions to reduce stray light.
  • the annular frame 18 is disposed on the photosensitive member 13 for pressing the light window forming portion 214 to the frame 18 in a molding process to prevent the molding material 16 of fluid.
  • Flowing into the photosensitive region 131 of the photosensitive member 13, wherein the molding base 12 is integrally formed on the circuit board, the photosensitive member 13 and the frame 18, and the frame 18 is preferably implemented
  • An example may be glue, which may have a predetermined elasticity, such as a modulus of elasticity ranging from 0.1 GPa to 1 Gpa.
  • a base body 121 of the molded base 12 includes a photosensitive element joint portion 1211 and a top side extension portion 1212 around the light window 122, and the photosensitive element on the bottom side of the photosensitive element joint portion 1211.
  • the photosensitive element coupling portion 1211 is integrally coupled to the circuit board 11, the photosensitive member 13 and the stop frame 18, and has a first partial inner surface 1231 extending obliquely from the frame 18, the top side
  • the extension portion 1212 has a second partial inner surface 1232 that is steered from the first partial inner surface 1231 so that the structure enables the reflective action of the inclined first partial inner surface 1231 to reduce stray light, and to extend the steering
  • the two-part inner surface 1232 has a top mounting surface of the top side extension 1212 having a larger mounting area, and the angle between the inner surface of the two portions and the optical axis X is similar to the previous embodiment. It will be appreciated that the block 18 of this embodiment can also be applied to other embodiments of the invention.

Abstract

A camera module (100) for reducing stray light, a photosensitive assembly (10) thereof, and an electronic device (300). The photosensitive assembly (10) comprising: a circuit board (11), a photosensitive element (13), a molded base (12), and a filter element (14). The photosensitive element (13) is operatively connected to the circuit board (11). The molded base (12) is integrally combined with the circuit board (11) and the photosensitive element (13) and is provided with a light window (122). The filter element (14) comprises a filter element body (141), and a light shielding layer (142) disposed on a bottom side of the filter element body (141). The light shielding layer (142) forms a light path (1420) for guiding light to enter the light window (122) and then to reach the photosensitive element (13) and reduces the amount of stray light reaching the photosensitive element (13).

Description

减少杂散光的摄像模组及其感光组件和电子设备Camera module for reducing stray light, photosensitive member and electronic device thereof 技术领域Technical field
本发明涉及摄像模组领域,更进一步,涉及模塑工艺制作的感光组件以及具有所述感光组件能够减小杂散光的摄像模组。The invention relates to the field of camera modules, and further relates to a photosensitive component manufactured by a molding process and a camera module having the photosensitive component capable of reducing stray light.
背景技术Background technique
摄像模组是智能电子设备的不可获缺的部件之一,举例地但不限于智能手机、相机、电脑设备、可穿戴设备等。而随着各种智能设备的不断发展与普及,对摄像模组的要求也越来越高。The camera module is one of the indispensable components of the smart electronic device, such as but not limited to a smart phone, a camera, a computer device, a wearable device, and the like. With the continuous development and popularization of various smart devices, the requirements for camera modules are getting higher and higher.
传统COB工艺封装的摄像模组,如图1A中所示,其包括一线路板101,一感光芯片102,一支架103,一滤光片104,一镜头组件105。该线路板101上贴装有一系列电子元器件106,该支架103贴装于该线路板101并且贴装位置位于这些电子元器件106的外侧,从而在该支架103底侧形成避让这些电子元器件105的避让空间107。如图1A中所示,其有预定的去除杂散光的效果,例如当杂散光M1到达该线路板101时,会反射进入避让空间107,从而不会被反射至滤光片104,并且被滤光片104底表面反射而到达该感光芯片102形成杂散光。The camera module of the conventional COB process package, as shown in FIG. 1A, includes a circuit board 101, a sensor chip 102, a bracket 103, a filter 104, and a lens assembly 105. A series of electronic components 106 are mounted on the circuit board 101. The brackets 103 are mounted on the circuit board 101 and are placed on the outer side of the electronic components 106 so as to avoid the electronic components on the bottom side of the bracket 103. The avoidance space 107 of 105. As shown in FIG. 1A, it has a predetermined effect of removing stray light, for example, when the stray light M1 reaches the wiring board 101, it is reflected into the escape space 107 so as not to be reflected to the filter 104, and is filtered. The bottom surface of the light sheet 104 is reflected to reach the photosensitive chip 102 to form stray light.
摄像模组的模塑封装技术是在传统COB封装基础上新兴发展起来的一种封装技术。如图1B所示,是利用现有一体封装技术封装的摄像模组,其包括一线路板201,一感光芯片202,一封装部203,一滤光片204,一镜头组件205。在这种结构中,该封装部203通过一体封装的方式封装于该线路板201和该感光芯片202,从而形成一体封装组件,并且该封装部203包覆该线路板201的一系列电子元器件206以及电连接该感光芯片202和该线路板201的一系列引线207,使得摄像模组的长宽尺寸和厚度尺寸能够减小,组装公差得以减小,一体封装组件上方的该镜头组件205能够平整地被安装,并且解决该电子元器件206上附着的灰尘影响摄像模组的成像质量的问题。The molding and packaging technology of the camera module is a packaging technology that has been developed on the basis of the traditional COB package. As shown in FIG. 1B , the camera module is packaged by using an existing integrated package technology, and includes a circuit board 201 , a light sensor chip 202 , a package portion 203 , a filter 204 , and a lens assembly 205 . In this configuration, the package portion 203 is packaged on the circuit board 201 and the photosensitive chip 202 in an integrated package to form an integrated package assembly, and the package portion 203 covers a series of electronic components of the circuit board 201. 206 and a series of leads 207 electrically connecting the photosensitive chip 202 and the circuit board 201, so that the length and width dimensions and thickness dimensions of the camera module can be reduced, assembly tolerances can be reduced, and the lens assembly 205 above the integrated package assembly can It is installed flat and solves the problem that the dust attached to the electronic component 206 affects the image quality of the camera module.
然而,如图1B中所示,因为该封装部203从该感光芯片202一体地延伸并且包埋该电子元器件206和该引线207,从而不需要传统COB中的该避让空间 107,但是该一体封装技术还是会有一定程度的杂散光的问题,即该封装部203的内表面2031对光线会有预定的反射作用,可能会导致光线被反射到达该感光芯片202而产生杂散光。更具体地,如图中所示,有部分光线M2到达该封装部203的该内表面2031后会被反射而到达该滤光片204的底表面2042,从而进一步被反射而到达该感光芯片202形成杂散光。另外,为了减少杂散光,常见的作法是,在该滤光片204顶侧设置一层遮光膜2041,即该滤光片204面向该镜头组件205的那一侧形成有该遮光膜2041,使该滤光片204中间形成透光区,部分杂散光M3可以被该遮光层2041阻挡而防止其进入所述封装部201内,但是该遮光膜2041也不能解决上述光线M2产生的杂散光。However, as shown in FIG. 1B, since the package portion 203 integrally extends from the photosensitive chip 202 and embeds the electronic component 206 and the lead 207, the escaping space 107 in the conventional COB is not required, but the integration The packaging technology still has a certain degree of stray light, that is, the inner surface 2031 of the package portion 203 has a predetermined reflection effect on the light, which may cause the light to be reflected to reach the photosensitive chip 202 to generate stray light. More specifically, as shown in the figure, a portion of the light ray M2 reaches the inner surface 2031 of the package portion 203 and is reflected to reach the bottom surface 2042 of the filter 204, thereby being further reflected to reach the photosensitive chip 202. Forming stray light. In addition, in order to reduce the stray light, a common method is to provide a light shielding film 2041 on the top side of the filter 204, that is, the light shielding film 2041 is formed on the side of the filter 204 facing the lens assembly 205. A light transmitting region is formed in the middle of the filter 204, and part of the stray light M3 can be blocked by the light shielding layer 2041 to prevent it from entering the package portion 201. However, the light shielding film 2041 cannot solve the stray light generated by the light M2.
另外,为方便脱膜,通常形成的该封装部203的该内表面2031从该感光芯片202一体地倾斜地延伸,这样会导致该封装部203的顶表面的面积减小,而该封装部203顶侧需要用来安装该摄像模组的上方光学器件如上述镜头组件205,或者额外的镜座等部件。然而,该封装部203的较小面积的顶表面可能不能提供足够的安装面给该摄像模组的上方光学器件,使这些上方光学器件不能够稳固地安装。In addition, in order to facilitate the release of the film, the inner surface 2031 of the package portion 203 is generally formed to extend obliquely from the photosensitive chip 202, which causes the area of the top surface of the package portion 203 to be reduced, and the package portion 203 The top side requires the upper optics for mounting the camera module, such as the lens assembly 205 described above, or an additional mirror mount. However, the smaller surface top surface of the encapsulation portion 203 may not provide sufficient mounting surface for the upper optics of the camera module, such that the upper optics may not be securely mounted.
发明内容Summary of the invention
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中所述摄像模组的所述感光组件的一滤光元件的一滤光元件主体的底侧设置有一遮光层,从而使所述滤光元件主体的中央区域形成一有效的透光区域,以减少到达一模塑基座内部的杂散光。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein a light shielding layer is disposed on a bottom side of a filter element body of a filter element of the photosensitive module of the camera module Thereby, the central region of the filter element body forms an effective light transmitting region to reduce stray light reaching the inside of a molded base.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中入射至所述模塑基座的一内表面后经其反射产生的至少一部分光线能够被所述遮光层吸收,避免被所述滤光元件反射而到达一感光元件而形成杂散光。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein at least a part of light generated by reflection after being incident on an inner surface of the molded base can be absorbed by the light shielding layer Avoid being reflected by the filter element to reach a photosensitive element to form stray light.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中所述遮光层位于所述滤光元件的一滤光元件主体和所述模塑基座之间,从而减少射向所述模塑基座的所述内表面的光线,从而有效避免杂散光。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein the light shielding layer is located between a filter element body of the filter element and the molding base, thereby reducing Light rays are directed toward the inner surface of the molded base to effectively avoid stray light.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中在一些实施例中,所述滤光元件贴装于所述模塑基座,其中在所述模塑基座的光窗的外周部分,所述遮光层和所述模塑基座的所述内表面之间形成一抑光槽,进入 所述抑光槽的至少一部分杂散光被所述模塑基座的所述内表面反射并被所述遮光层吸收,从而有效抑止杂散光从所述抑光槽射出。It is an object of the present invention to provide a camera module for reducing stray light and a photosensitive assembly thereof, wherein in some embodiments, the filter element is mounted to the molded base, wherein the molding base a peripheral portion of the light window of the seat, a light blocking groove formed between the light shielding layer and the inner surface of the molding base, and at least a portion of stray light entering the light suppression groove is used by the molding base The inner surface is reflected and absorbed by the light shielding layer, thereby effectively suppressing stray light from being emitted from the light suppression groove.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中在一些实施例中,所述感光组件还包括一滤光元件支架,所述滤光元件组装于一滤光元件支架的一顶侧凹槽,所述滤光元件支架组装于所述模塑基座,其中在所述模塑基座的光窗的外周部分,所述遮光层、所述滤光元件支架的内表面和所述模塑基座的所述内表面之间形成一抑光槽,进入所述抑光槽的至少一部分杂散光被所述模塑基座的所述内表面反射并被所述遮光层吸收,从而有效抑止杂散光从所述抑光槽射出。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof. In some embodiments, the photosensitive member further includes a filter element holder, and the filter element is assembled in a filter. a top side groove of the component holder, the filter element holder being assembled to the molding base, wherein the light shielding layer, the filter element holder is at an outer peripheral portion of the light window of the molding base Forming a light suppression groove between the inner surface and the inner surface of the molding base, at least a portion of the stray light entering the light suppression groove being reflected by the inner surface of the molding base and being subjected to The light shielding layer absorbs, thereby effectively suppressing stray light from being emitted from the light suppression groove.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中在一些实施例中,所述感光组件还包括一滤光元件支架,所述滤光元件组装于一滤光元件支架的一底侧凹槽,所述滤光元件支架组装于所述模塑基座,其中在所述模塑基座的光窗的外周部分,所述遮光层和所述模塑基座的所述内表面之间形成一抑光槽,进入所述抑光槽的至少一部分杂散光被所述模塑基座的所述内表面反射并被所述遮光层吸收从而,从而有效抑止杂散光从所述抑光槽射出。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof. In some embodiments, the photosensitive member further includes a filter element holder, and the filter element is assembled in a filter. a bottom side groove of the component holder, the filter element holder being assembled to the molding base, wherein the light shielding layer and the molding base are at an outer peripheral portion of the light window of the molding base Forming a light suppression groove between the inner surfaces, at least a portion of the stray light entering the light suppression groove is reflected by the inner surface of the molding base and absorbed by the light shielding layer, thereby effectively suppressing impurities Astigmatism is emitted from the light-suppressing groove.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中在一些实施例中,所述滤光元件还包括设置在所述滤光元件主体顶表面的一顶侧遮光层,从而所述滤光元件主体的两侧都具有挡光吸光结构,从而进一步地加强减小到达所述感光元件的杂散光的作用。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein in some embodiments, the filter element further includes a top side shading disposed on a top surface of the filter element body. The layers, such that both sides of the filter element body have a light blocking and light absorbing structure, thereby further enhancing the effect of reducing stray light reaching the photosensitive element.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中所述遮光层为一种黑色吸收性材料,可吸收绝大部分光能,极小部分的光线能被反射,从而能够有效吸收杂散光。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein the light shielding layer is a black absorbing material capable of absorbing most of the light energy, and a very small portion of the light can be reflected. So that it can effectively absorb stray light.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中在一些实施例中,所述滤光元件组装于所述滤光元件支架的所述底侧凹槽中时,能够使所述镜头的一底侧镜片的位置下移,从而减小所述摄像模组的后焦距,并且进一步减小所述摄像模组的高度。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein in some embodiments, the filter element is assembled in the bottom side groove of the filter element holder The position of a bottom side lens of the lens can be moved downward, thereby reducing the back focus of the camera module, and further reducing the height of the camera module.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中在一些实施例中,所述模塑基座包括一体延伸的一感光元件结合部和一顶侧延伸部,其内表面具有不同的延伸角度,其中所述顶侧延伸部与光轴之间具有较小夹角,从而增大所述顶侧延伸部的顶表面的面积,从而为所述摄像模组上方的镜头或滤 光元件支架或镜头组件提供更大面积的安装面,以用于稳固地安装所述镜头,所述滤光元件支架或所述镜头组件。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive assembly thereof, wherein in some embodiments, the molded base includes a photosensitive element joint and a top side extension integrally extending. The inner surface has different extending angles, wherein the top side extending portion and the optical axis have a smaller angle, thereby increasing the area of the top surface of the top side extending portion, thereby being above the camera module The lens or filter element holder or lens assembly provides a larger area of mounting surface for securely mounting the lens, the filter element holder or the lens assembly.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中在一些实施例中,其中所述顶侧延伸部与光轴之间具有较小夹角,从而能够减小所述滤光元件的面积。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein in some embodiments, wherein the top side extension has a small angle with the optical axis, thereby being capable of reducing The area of the filter element.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中在一些实施例中,所述遮光层减小入射至所述顶侧延伸部的内表面的光线,从而防止入射至所述顶侧延伸部的内表面被反射而到达所述感光元件而形成杂散光而影响所述摄像模组的成像质量。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein in some embodiments, the light shielding layer reduces light incident on an inner surface of the top side extension, thereby preventing The inner surface incident on the top side extension is reflected to reach the photosensitive element to form stray light and affect the imaging quality of the camera module.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中在一些实施例中,所述顶侧延伸部与光轴之间的夹角小于所述感光元件结合部与光轴之间的夹角,以避免在模塑工艺中一成型模具的一光窗成型部压在所述感光元件和所述电路板相连接的连接线上,造成所述连接线的损坏。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive assembly thereof, wherein in some embodiments, an angle between the top side extension and the optical axis is smaller than the photosensitive element joint portion and An angle between the optical axes to prevent a window forming portion of a molding die from being pressed against the connecting line connecting the photosensitive member and the circuit board in the molding process, causing damage to the connecting wire.
本发明的一个目的在于提供一减小杂散光的摄像模组及其感光组件,其中在一些实施例中,所述感光元件结合部和所述顶侧延伸部互相配合,所述感光元件结合部的结构方便脱模和减小杂散光,所述顶侧延伸部用来增大所述模塑基座的所述顶表面的面积和所述顶侧延伸部这样的结构避免模塑工艺所述连接线被压头压坏。An object of the present invention is to provide a camera module for reducing stray light and a photosensitive member thereof, wherein in some embodiments, the photosensitive element joint portion and the top side extension portion cooperate with each other, and the photosensitive element joint portion The structure facilitates demolding and reduces stray light, the top side extension is used to increase the area of the top surface of the molded base and the top side extension such a structure to avoid the molding process The cable is crushed by the indenter.
为达到以上至少一发明目的,本发明提供一摄像模组的感光组件,其包括:In order to achieve the above at least one object of the invention, the present invention provides a photosensitive assembly of a camera module, comprising:
一电路板;a circuit board;
一感光元件,所述感光元件可工作地连接于所述电路板;a photosensitive element operatively coupled to the circuit board;
一模塑基座,所述模塑基座一体地结合于所述电路板和所述感光元件并形成一光窗;和a molding base integrally bonded to the circuit board and the photosensitive member and forming a light window; and
一滤光元件,所述滤光元件包括一滤光元件主体和设置于所述滤光元件主体底侧的一遮光层,所述遮光层形成用于使光线进入所述光窗的一光线通路并且减少到达所述感光元件的杂散光。a filter element, the filter element comprising a filter element body and a light shielding layer disposed on a bottom side of the filter element body, the light shielding layer forming a light path for allowing light to enter the light window And the stray light reaching the photosensitive element is reduced.
根据本发明的另外一方面,本发明还提供一摄像模组,其包括:According to another aspect of the present invention, the present invention further provides a camera module, including:
一镜头;a shot
一电路板;a circuit board;
一感光元件,所述感光元件可工作地连接于所述电路板;a photosensitive element operatively coupled to the circuit board;
一模塑基座,所述模塑基座一体地结合于所述电路板和所述感光元件并形成一光窗;和a molding base integrally bonded to the circuit board and the photosensitive member and forming a light window; and
一滤光元件,位于所述镜头和所述感光元件之间,并且所述滤光元件包括一滤光元件主体和设置于所述滤光元件主体底侧的一遮光层,所述遮光层形成用于使光线进入所述光窗一光线通路并且减少到达所述感光元件的杂散光。a filter element disposed between the lens and the photosensitive element, and the filter element includes a filter element body and a light shielding layer disposed on a bottom side of the filter element body, the light shielding layer forming A light path for directing light into the light window and reducing stray light reaching the photosensitive element.
根据本发明的另外一方面,本发明还提供一电子设备,其包括上述的一个或多个所述摄像模组。所述电子设备包括但不限于手机、电脑、电视机、智能可穿载设备、交通工具、照相机和监控装置。According to another aspect of the present invention, the present invention also provides an electronic device comprising one or more of the camera modules described above. The electronic devices include, but are not limited to, cell phones, computers, televisions, smart loadable devices, vehicles, cameras, and monitoring devices.
附图说明DRAWINGS
图1A是现有COB工艺的摄像模组的结构示意图。FIG. 1A is a schematic structural view of a camera module of a conventional COB process.
图1B是现有一体封装工艺形成的摄像模组的结构示意图。FIG. 1B is a schematic structural view of a camera module formed by a conventional integrated packaging process.
图2是根据本发明的第一个优选实施例的摄像模组的立体分解示意图。2 is a perspective exploded view of a camera module in accordance with a first preferred embodiment of the present invention.
图3A是根据本发明的上述第一个优选实施例的摄像模组沿图2中A-A线方向的剖视图。Figure 3A is a cross-sectional view of the camera module of the first preferred embodiment of the present invention taken along line A-A of Figure 2;
图3B是根据本发明的上述第一个优选实施例的摄像模组的感光组件减少杂散光的原理的示意图。3B is a schematic view showing the principle of reducing stray light of the photosensitive member of the camera module according to the first preferred embodiment of the present invention.
图4A是根据本发明的上述第一个优选实施例的一个变形实施方式的摄像模组的剖视图。4A is a cross-sectional view of a camera module in accordance with a modified embodiment of the first preferred embodiment of the present invention.
图4B是根据本发明的上述第一个优选实施例的一个变形实施方式的摄像模组的感光组件减少杂散光的原理的示意。4B is a schematic view showing the principle of reducing stray light of the photosensitive member of the camera module according to a modified embodiment of the first preferred embodiment of the present invention.
图5A是根据本发明的第二个优选实施例的摄像模组的结构示意图。FIG. 5A is a schematic structural view of a camera module according to a second preferred embodiment of the present invention.
图5B是图5A中B处的放大结构示意图。Fig. 5B is a schematic enlarged view of the structure at B in Fig. 5A.
图6A是示意根据本发明的上述第二个优选实施例的摄像模组的感光组件底侧贴遮光层相对于图6B中顶侧贴遮光层能够更有效减少反射至感光元件的杂散光的示意图。6A is a schematic view showing that the light-shielding layer on the bottom side of the photosensitive member of the camera module according to the second preferred embodiment of the present invention can more effectively reduce the stray light reflected to the photosensitive member with respect to the light-shielding layer on the top side of FIG. 6B. .
图6B是示意感光组件的滤光元件顶侧贴遮光层的光路示意图。Fig. 6B is a schematic view showing the optical path of the light shielding layer on the top side of the filter element of the photosensitive member.
图7A是示意根据本发明的上述第二个优选实施例的模塑工艺中成型模具中将熔化的模塑材料推进基座成型导槽时的剖视图。Fig. 7A is a cross-sectional view showing a state in which a molten molding material is pushed into a base forming guide groove in a molding die in a molding process according to the above second preferred embodiment of the present invention.
图7B示意根据本发明的上述第二个优选实施例中将熔化的模塑材料充满基 座成型导槽时的剖视图。Fig. 7B is a cross-sectional view showing the state in which the molten molding material is filled in the base molding guide groove in the above second preferred embodiment of the present invention.
图7C示意根据本发明的上述第二个优选实施例的执行脱模步骤而形成模塑基座的剖视图。Figure 7C is a cross-sectional view showing the formation of a molded base by performing a demolding step in accordance with the above second preferred embodiment of the present invention.
图8A是示意根据本发明的上述第二个优选实施例的一个变形实施例的感光组件两侧贴遮光层从而有效减少杂散光的示意图。Fig. 8A is a schematic view showing that a light-shielding layer is attached to both sides of a photosensitive member according to a modified embodiment of the second preferred embodiment of the present invention to effectively reduce stray light.
图8B示意根据本发明的上述第二个优选实施例的另一个变形实施方式的摄像模组的剖视图。Figure 8B is a cross-sectional view showing a camera module according to another modified embodiment of the above second preferred embodiment of the present invention.
图9是示意根据本发明的上述第二个优选实施例的另一个变形实施例的摄像模组的剖视图。Figure 9 is a cross-sectional view showing a camera module according to another modified embodiment of the above second preferred embodiment of the present invention.
图10示意根据本发明的上述第二个优选实施例的另一个变形实施方式的摄像模组的剖视图。Figure 10 is a cross-sectional view showing a camera module according to another modified embodiment of the second preferred embodiment of the present invention.
图11是示意根据本发明的第三个优选实施例的摄像模组的立体分解示意图。Figure 11 is a perspective exploded view showing a camera module in accordance with a third preferred embodiment of the present invention.
图12A是根据本发明的上述第三个优选实施例的摄像模组沿图11中C-C线方向的剖视图。Figure 12A is a cross-sectional view of the camera module in accordance with the above-described third preferred embodiment of the present invention taken along line C-C of Figure 11;
图12B是图12A中D处的放大示意图。Figure 12B is an enlarged schematic view of the portion D in Figure 12A.
图13A是示意根据本发明的上述第三个优选实施例的摄像模组的感光组件底侧贴遮光层相对于图13B中顶侧贴遮光层能够更有效减少反射至感光元件的杂散光的示意图。FIG. 13A is a schematic view showing that the light-shielding layer on the bottom side of the photosensitive member of the camera module according to the above-described third preferred embodiment of the present invention can more effectively reduce the stray light reflected to the photosensitive member with respect to the light-shielding layer on the top side of FIG. 13B. .
图13B是示意感光组件的滤光元件顶侧贴遮光层的光路示意图。Fig. 13B is a schematic view showing the optical path of the light shielding layer on the top side of the filter element of the photosensitive member.
图14A是根据本发明的上述第三个优选实施例的一个变形实施方式的摄像模组的剖视图。Figure 14A is a cross-sectional view of a camera module in accordance with a variant embodiment of the above third preferred embodiment of the present invention.
图14B是根据本发明的上述第三个优选实施例的另一个变形实施方式的摄像模组的剖视图。Figure 14B is a cross-sectional view of a camera module in accordance with another modified embodiment of the above third preferred embodiment of the present invention.
图15是根据本发明的第四个优选实施例的摄像模组的立体分解示意图。Figure 15 is a perspective exploded view of a camera module in accordance with a fourth preferred embodiment of the present invention.
图16是根据本发明的上述第四个优选实施例的摄像模组的沿图15中E-E线方向的剖视图。Figure 16 is a cross-sectional view of the image pickup module according to the above-described fourth preferred embodiment of the present invention taken along the line E-E in Figure 15 .
图17A是示意根据本发明的上述第四个优选实施例的摄像模组的感光组件底侧贴遮光层相对于图17B中顶侧贴遮光层能够更有效减少反射至感光元件的杂散光的示意图。FIG. 17A is a schematic view showing that the light-shielding layer on the bottom side of the photosensitive member of the camera module according to the fourth preferred embodiment of the present invention can more effectively reduce the stray light reflected to the photosensitive member with respect to the light-shielding layer on the top side of FIG. 17B. .
图17B是示意感光组件的滤光元件顶侧贴遮光层的光路示意图。Fig. 17B is a schematic view showing the optical path of the light shielding layer on the top side of the filter element of the photosensitive member.
图18是示意根据本发明的上述第四个优选实施例的一个变形实施方式摄像模组的剖视图。Figure 18 is a cross-sectional view showing a camera module according to a modified embodiment of the fourth preferred embodiment of the present invention.
图19是示意根据本发明的上述第四个优选实施例的另一个变形实施方式摄像模组的剖视图。Figure 19 is a cross-sectional view showing a camera module according to another modified embodiment of the fourth preferred embodiment of the present invention.
图20是根据本发明的上述摄像模组应用于智能电子设备的结构示意图。20 is a schematic structural diagram of the above camera module applied to an intelligent electronic device according to the present invention.
具体实施方式Detailed ways
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。The following description is presented to disclose the invention to enable those skilled in the art to practice the invention. The preferred embodiments in the following description are by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention as defined in the following description may be applied to other embodiments, modifications, improvements, equivalents, and other embodiments without departing from the spirit and scope of the invention.
本领域技术人员应理解的是,在本发明的揭露中,术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系,其仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此上述术语不能理解为对本发明的限制。It should be understood by those skilled in the art that in the disclosure of the present invention, the terms "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", " The orientation or positional relationship of the indications of "upright", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is merely for convenience of description of the present invention and The above description of the invention is not to be construed as a limitation of the invention.
可以理解的是,术语“一”应理解为“至少一”或“一个或多个”,即在一个实施例中,一个元件的数量可以为一个,而在另外的实施例中,该元件的数量可以为多个,术语“一”不能理解为对数量的限制。It will be understood that the term "a" is understood to mean "at least one" or "one or more", that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term "a" cannot be construed as limiting the quantity.
如图2至图3B所示是根据本发明的第一个优选实施例的摄像模组100及其感光组件10。所述摄像模组100可以被应用于各种电子设备300,如图20中所示,所述电子设备300包括设备主体301和安装于所述设备主体301的一个或多个所述摄像模组100,所述电子设备300举例地但不限于智能手机、可穿戴设备、电脑设备、电视机、交通工具、照相机、监控装置等,所述摄像模组配合所述电子设备实现对目标对象的图像采集和再现。2 to 3B are a camera module 100 and a photosensitive member 10 thereof according to a first preferred embodiment of the present invention. The camera module 100 can be applied to various electronic devices 300. As shown in FIG. 20, the electronic device 300 includes a device body 301 and one or more of the camera modules mounted on the device body 301. 100. The electronic device 300 is exemplified by, but not limited to, a smart phone, a wearable device, a computer device, a television, a vehicle, a camera, a monitoring device, etc., and the camera module cooperates with the electronic device to implement an image of a target object. Acquisition and reproduction.
更具体地,图中示意的所述摄像模组100包括所述感光组件10和一镜头30。所述感光组件10包括一电路板11,一模塑基座12,一感光元件13和一滤光元件14,所述模塑基座12包括一基座主体121,其一体地成型于所述电路板11和所述感光元件13并形成一光窗122,所述光窗122是一封闭空间,并且给所述 感光元件13提供光线通路。其中本发明的所述模塑基座12经由模塑工艺,例如是传递模塑工艺,一体模塑成型于所述电路板11和所述感光元件13,从而所述模塑基座12能够替换传统摄像模组的镜座或支架,并且不需要类似传统封装工艺中需要将镜座或支架通过胶水贴附于所述电路板11。More specifically, the camera module 100 illustrated in the drawings includes the photosensitive member 10 and a lens 30. The photosensitive assembly 10 includes a circuit board 11, a molding base 12, a photosensitive element 13 and a filter element 14. The molding base 12 includes a base body 121 integrally formed on the The circuit board 11 and the photosensitive member 13 form a light window 122 which is a closed space and provides a light path to the photosensitive member 13. The molded base 12 of the present invention is integrally molded on the circuit board 11 and the photosensitive member 13 via a molding process, such as a transfer molding process, so that the molded base 12 can be replaced. The lens holder or the bracket of the conventional camera module does not need to be attached to the circuit board 11 by glue to the lens holder or the bracket in a similar conventional packaging process.
所述电路板11可以是硬板、软软、软硬结合板、陶瓷基板等。在这个实施例中,所述电路板11是软硬结合板,其包括基板111和形成于所述基板111如通过SMT工艺贴装的多个电子元器件112,所述电子元器件112包括但不限于电阻、电容、驱动器件等。在本发明的这个实施例中,所述模塑基座12一体地包覆于所述电子元器件112,从而防止类似传统摄像模组中灰尘、杂物粘附在所述电子元器件112上并且进一步地污染所述感光元件13,从而影响成像效果。可以理解的是,所述电路板11也可能没有所述电子元器件112,所述电子元器件112可以贴装于所述基板111顶表面,也可能是贴装于所述基板111的底表面,或者可能内埋所述基板111中。当设置在所述基板111顶表面时,所述电子元器件112可以设置在所述感光元件13的周围,并且位于所述感光元件13的多个侧面,例如所述电子元器件112可以设置在所述感光元件13的两对相反侧,也可以在所述电子元器件112一对相反侧。The circuit board 11 may be a hard board, a soft soft, a soft and hard bonded board, a ceramic substrate, or the like. In this embodiment, the circuit board 11 is a soft and hard bonding board, and includes a substrate 111 and a plurality of electronic components 112 formed on the substrate 111, such as by an SMT process. The electronic component 112 includes It is not limited to resistors, capacitors, drive devices, and the like. In this embodiment of the invention, the molded base 12 is integrally wrapped around the electronic component 112, thereby preventing dust and debris from adhering to the electronic component 112 in a similar conventional camera module. And the photosensitive member 13 is further contaminated, thereby affecting the imaging effect. It is to be understood that the circuit board 11 may not have the electronic component 112. The electronic component 112 may be mounted on the top surface of the substrate 111 or may be mounted on the bottom surface of the substrate 111. Or may be buried in the substrate 111. When disposed on the top surface of the substrate 111, the electronic component 112 may be disposed around the photosensitive element 13 and located on a plurality of sides of the photosensitive element 13, for example, the electronic component 112 may be disposed at The opposite sides of the pair of photosensitive elements 13 may be on the opposite side of the electronic component 112.
所述电路板11和所述感光元件13可工作地连接,如图中所示,所述电路板11和所述感光元件13表面各自具有电连接元件,如焊盘,并且两者通过一组或多组连接线15相连接,所述模塑基座12一体地包埋所述连接线15。The circuit board 11 and the photosensitive element 13 are operatively connected, as shown in the figure, the surface of the circuit board 11 and the photosensitive element 13 each have an electrical connection element, such as a pad, and the two pass through a group Or a plurality of sets of connecting wires 15 are connected, and the molded base 12 integrally encloses the connecting wires 15.
在本发明的这个实施例中,所述模塑基座12顶侧形成平整的表面,用于贴装所述滤光元件14。所述滤光元件14包括一滤光元件主体141和一遮光层142,所述滤光元件主体141,如可以是红外滤光元件,位于所述模塑基座12的顶侧,并且位于所述感光元件13和所述镜头30之间,以将穿过所述镜头30的红外光线过滤。所述滤光元件主体141材料可以包括IR膜(红外截止膜)、AR膜(减反射镀膜)、白玻璃、蓝玻璃、树脂材料、涂布复合式材料、水晶等。所述遮光层142位于所述滤光元件主体141的底侧并且位于所述滤光元件主体141和所述模塑基座12之间,所述遮光层142是吸光材料,其使所述滤光元件主体141形成中间的有效透光区域1411和周围区域1412,穿过所述镜头30的光线只能透过所述有效透光区域1411才能到达所述模塑基座12的内部。所述遮光层142,其为环形结构,中间形成开窗,也就是说,所述遮光层142形成用于使有效光线进 入所述光窗122继而到达所述感光元件13的光线通路1420并且减少到达所述感光元件13的杂散光。In this embodiment of the invention, the top side of the molded base 12 forms a flat surface for mounting the filter element 14. The filter element 14 includes a filter element body 141 and a light shielding layer 142, which may be an infrared filter element, located on the top side of the molded base 12, and located at the Between the photosensitive element 13 and the lens 30, infrared light passing through the lens 30 is filtered. The material of the filter element main body 141 may include an IR film (infrared cut film), an AR film (anti-reflection coating film), white glass, blue glass, a resin material, a coated composite material, crystal, or the like. The light shielding layer 142 is located on the bottom side of the filter element body 141 and is located between the filter element body 141 and the molding base 12, and the light shielding layer 142 is a light absorbing material that makes the filter The light element body 141 forms an intermediate effective light-transmissive region 1411 and a peripheral region 1412 through which light rays passing through the lens 30 can pass only to reach the inside of the molded base 12. The light shielding layer 142 is an annular structure, and a window is formed in the middle, that is, the light shielding layer 142 forms a light path 1420 for allowing effective light to enter the light window 122 and then reach the photosensitive element 13 and is reduced. The stray light reaching the photosensitive element 13 is reached.
所述感光元件13具有中间的一感光区131和位于所述感光区131周围的一非感光区132,所述遮光层142具有一内边缘1421和一外边缘1422。所述遮光层142的所述内边缘1421与光轴X之间的距离大于等于,或略小于所述感光区131的外边缘1311与光轴X之间的距离。即所述光线通路1420的面积大于等于,或略小于所述感光区131的面积。The photosensitive element 13 has a photosensitive area 131 in the middle and a non-sensitive area 132 around the photosensitive area 131. The light shielding layer 142 has an inner edge 1421 and an outer edge 1422. The distance between the inner edge 1421 of the light shielding layer 142 and the optical axis X is greater than or equal to, or slightly smaller than the distance between the outer edge 1311 of the photosensitive region 131 and the optical axis X. That is, the area of the light path 1420 is greater than or equal to, or slightly smaller than, the area of the photosensitive area 131.
所述遮光层142的外边缘1422位于所述模塑基座12的顶表面124的内边缘1241的外侧,即所述模塑基座12的所述顶表面124的所述内边缘1241和所述遮光层142的所述外边缘1422之间不会形成透光区。The outer edge 1422 of the light shielding layer 142 is located outside of the inner edge 1241 of the top surface 124 of the molded base 12, i.e., the inner edge 1241 of the top surface 124 of the molded base 12 and A light transmissive region is not formed between the outer edges 1422 of the light shielding layer 142.
也就是说,相对于图1B所示的现有技术,本发明的所述遮光层142被设置于所述滤光元件主体141的邻近所述感光元件13的一侧,而不像图1B中,遮光膜2041设置在滤光片204的面向其镜头组件205的那一侧。也就是说,本发明的所述遮光层142形成在所述滤光元件主体141的底表面的外边缘,用来阻挡杂散光到达所述感光元件13。That is, with respect to the prior art shown in FIG. 1B, the light shielding layer 142 of the present invention is disposed on the side of the filter element main body 141 adjacent to the photosensitive element 13, unlike in FIG. 1B. The light shielding film 2041 is disposed on the side of the filter 204 facing the lens assembly 205 thereof. That is, the light shielding layer 142 of the present invention is formed at the outer edge of the bottom surface of the filter element main body 141 for blocking stray light from reaching the photosensitive member 13.
更具体地,如图3B所示,到达所述滤光元件14的所述滤光元件主体141上表面的部分杂散光线L11被所述滤光元件主体141的上表面反射而不会进入所述模塑基座12的所述光窗122,并且折射进入所述遮光层142上方的所述透光区域1411外侧的周围区域1412时,会被所述遮光层142吸收而不能进入所述模塑基座12内部的所述光窗122,从而起到阻挡一部分杂散光的目的。More specifically, as shown in FIG. 3B, a part of the stray light L11 reaching the upper surface of the filter element main body 141 of the filter element 14 is reflected by the upper surface of the filter element main body 141 without entering the place. When the light window 122 of the susceptor 12 is molded and refracted into the surrounding area 1412 outside the light-transmitting region 1411 above the light-shielding layer 142, it is absorbed by the light-shielding layer 142 and cannot enter the mold. The light window 122 inside the base 12 is molded to serve the purpose of blocking a portion of stray light.
在本发明的这个实施例中,所述模塑基座12内表面优选呈中心对称结构,其具有从所述感光元件13一体地倾斜向上延伸的倾斜内表面123,当另一部分杂散光L12穿过所述滤光元件主体141的所述有效透光区域1411而入射至所述内表面123时,会被所述模塑基座12的所述倾斜内表面123反射至所述遮光层142从而被所述遮光层142吸收,从而不会进一步被反射而到达所述感光元件13,影响所述摄像模组100的成像质量。In this embodiment of the invention, the inner surface of the molded base 12 preferably has a central symmetrical structure having an inclined inner surface 123 extending obliquely upward from the photosensitive member 13 integrally, when another portion of the stray light L12 is worn. When the effective transparent region 1411 of the filter element body 141 is incident on the inner surface 123, it is reflected by the inclined inner surface 123 of the molded base 12 to the light shielding layer 142. It is absorbed by the light shielding layer 142 so as not to be further reflected and reaches the photosensitive element 13, which affects the imaging quality of the imaging module 100.
也就是说,通过将所述遮光层142设置在所述模塑基座12和所述滤光元件主体141之间,能够有效地将射向所述模塑基座12的所述倾斜内表面123的杂散光吸收,而图1B中,该遮光膜2041形成在该滤光片204的顶表面,从而到达该滤光片204底表面的杂散光M2会被反射至该感光芯片202而影响模组的成 像质量。That is, by arranging the light shielding layer 142 between the molded base 12 and the filter element main body 141, it is possible to effectively face the inclined inner surface of the molded base 12 The stray light absorption of 123 is formed, and in FIG. 1B, the light shielding film 2041 is formed on the top surface of the filter 204, so that the stray light M2 reaching the bottom surface of the filter 204 is reflected to the photosensitive chip 202 to affect the mode. The imaging quality of the group.
相应地,所述遮光层142和所述模塑基座12的所述倾斜内表面123相邻近,并且在两者之间,所述光窗122的外侧部分形成一抑光槽1221,所述抑光槽1221是一个用来抑止杂散光射出的空间。更具体地,如图3B所示,杂散光L12进入所述抑光槽1221之中,从而被抑止从所述抑光槽1221中射出。更具体地,杂散光L12只能在所述倾斜内表面123被反射而被所述遮光层142吸收,从而杂散光L12的光路路径被保持在所述抑光槽1221中,从而有效减少到达所述感光元件13的杂散光。Correspondingly, the light shielding layer 142 is adjacent to the inclined inner surface 123 of the molding base 12, and between the two, the outer portion of the light window 122 forms a light suppression groove 1221. The light suppression groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG. 3B, the stray light L12 enters the light suppression groove 1221, thereby being suppressed from being emitted from the light suppression groove 1221. More specifically, the stray light L12 can only be reflected by the inclined inner surface 123 and absorbed by the light shielding layer 142, so that the optical path of the stray light L12 is held in the light suppression groove 1221, thereby effectively reducing the arrival point. The stray light of the photosensitive element 13 is described.
如图3B中所示,所述倾斜内表面123自所述遮光层142向下延伸,所述遮光层142自所述倾斜内表面123水平方向延伸,所述遮光层142和所述倾斜内表面123之间形成夹角γ,夹角γ是锐角或直角,从而避免入射至所述倾斜内表面123的光线被反射向所述感光元件13而形成杂散光。As shown in FIG. 3B, the inclined inner surface 123 extends downward from the light shielding layer 142, the light shielding layer 142 extends horizontally from the inclined inner surface 123, the light shielding layer 142 and the inclined inner surface. An angle γ is formed between 123, and the angle γ is an acute angle or a right angle, so that light incident on the inclined inner surface 123 is prevented from being reflected toward the photosensitive member 13 to form stray light.
另外,所述遮光层142设置在所述滤光元件主体141的底表面,相对于其被设置于所述滤光元件主体141的顶表面,也能够减少直接射向所述模塑基座12的所述内表面123的杂散光。In addition, the light shielding layer 142 is disposed on the bottom surface of the filter element main body 141, and is disposed on the top surface of the filter element main body 141 with respect to the top surface of the filter element main body 141, and can also be directly directed to the molding base 12 The stray light of the inner surface 123.
可以理解的是,本发明的这个实施例中,所述镜头30组装于所述模塑基座12的所述顶表面124,从而形成一定焦摄像模组。在另外的实施例中,所述镜头30可以组装于一镜筒,所述镜筒安装于所述模塑基座12的所述顶表面124。或者在另外的实施例中,所述镜头30可以组装于一驱动器,所述驱动器安装于所述模塑基座12的所述顶表面124,这样形成一自动对焦的摄像模组。It can be understood that, in this embodiment of the invention, the lens 30 is assembled to the top surface 124 of the molded base 12 to form a fixed focus camera module. In other embodiments, the lens 30 can be assembled to a lens barrel that is mounted to the top surface 124 of the molded base 12. Alternatively, in other embodiments, the lens 30 can be assembled to a driver that is mounted to the top surface 124 of the molded base 12 such that an autofocus camera module is formed.
所述滤光元件141可以贴装于所述模塑基座12的所述顶表面124,如通过胶水粘合于所述模塑基座12的所述顶表面124。所述遮光层142可以各种方式形成在所述滤光元件主体141的底表面,如贴合于所述滤光元件主体141的底表面,或者采用黄光制程或丝印工艺将所述遮光层142形成在所述滤光元件主体141的底表面。The filter element 141 can be attached to the top surface 124 of the molded base 12, such as by glue to the top surface 124 of the molded base 12. The light shielding layer 142 may be formed on the bottom surface of the filter element body 141 in various manners, such as being attached to the bottom surface of the filter element body 141, or the light shielding layer may be formed by a yellow light process or a silk screen process. 142 is formed on a bottom surface of the filter element main body 141.
所述遮光层142可以通过光刻的方法涂覆于所述滤光元件主体141的底表面,光刻方法也就是传统的黄光制程工艺。采用黄光制程工艺将所述遮光层142涂覆于所述滤光元件主体141的底表面,具体包括以下步骤:清洁并烘干所述滤光元件主体141;在前述滤光元件主体141上涂底,然后在前述滤光元件主体141上旋涂光刻胶;对前述滤光元件主体141软烘;对前述滤光元件主体141进行对准 曝光;对前述滤光元件主体141进行后烘;对前述滤光元件主体141进行显影;对前述滤光元件主体141进行硬烘;对前述滤光元件主体141进行蚀刻最终形成所述滤光元件14。所述光刻胶为黑色吸收性材料,可吸收绝大部分的入射至所述遮光层142的光能,如能吸收95%以上的光能,而只能允许极小部分的光入射至所述遮光层142后能被反射。The light shielding layer 142 may be applied to the bottom surface of the filter element body 141 by photolithography, that is, a conventional yellow light process. Applying the light shielding layer 142 to the bottom surface of the filter element body 141 by a yellow light process, specifically comprising the steps of: cleaning and drying the filter element body 141; on the filter element body 141 Coating the substrate, then spin-coating the photoresist on the filter element main body 141; soft-drying the filter element main body 141; performing alignment exposure on the filter element main body 141; and post-drying the filter element main body 141 Developing the filter element main body 141; hard-drying the filter element main body 141; and etching the filter element main body 141 to form the filter element 14. The photoresist is a black absorbing material, which can absorb most of the light energy incident on the light shielding layer 142, and can absorb more than 95% of the light energy, and can only allow a very small portion of the light to be incident on the light. The light shielding layer 142 can be reflected.
黄光制程工艺使用的光刻胶为感光材料,光刻胶具有独特的特性,在UV光的作用下,会发生化学变化,变成易溶于酸或碱的物质。将光刻胶涂于基材上,根据产品需要的形状提供相应的光罩,将光罩罩于光刻胶上,然后对光刻胶进行曝光,使得没有被光罩罩着的光刻胶区域发生化学变化,然后将这部分光刻胶用酸或碱加以溶解或保留,形成与光罩形状相同或互补的图形。本发明使用的光刻胶为不透光涂料,除了具有传统的光刻胶的感光特性,还具有不透光的特性,从而形成吸收杂散光的所述遮光层142。The photoresist used in the yellow light process is a photosensitive material. The photoresist has unique characteristics. Under the action of UV light, it undergoes chemical changes and becomes a substance that is easily soluble in acid or alkali. Applying a photoresist to the substrate, providing a corresponding mask according to the shape required by the product, masking the mask on the photoresist, and then exposing the photoresist so that the photoresist is not covered by the mask A chemical change occurs in the region, and then the portion of the photoresist is dissolved or retained with an acid or a base to form a pattern that is identical or complementary to the shape of the mask. The photoresist used in the present invention is an opaque coating which, in addition to having the photosensitive characteristics of a conventional photoresist, has an opaque property to form the light-shielding layer 142 which absorbs stray light.
本发明的光罩可以采用与所述遮光层142形状相同的环状光罩,例如在制作时所述光刻胶涂于所述滤光元件主体141的底表面,将所述光罩罩于所述光刻胶上进行曝光,在曝光后需要将中间发生化学变化的光刻胶去除,被所述光罩罩着的区域即形成所述遮光层142,所述光罩的外框边缘决定所述遮光层142的所述外边缘1422的位置,所述光罩的内框边缘决定所述遮光层142的所述内边缘1421的位置。The photomask of the present invention may have an annular mask of the same shape as the light shielding layer 142. For example, the photoresist is applied to the bottom surface of the filter element main body 141 during fabrication, and the photomask is covered. Exposure is performed on the photoresist, and after the exposure, a photoresist that undergoes chemical change in the middle is removed, and the light-shielding layer 142 is formed in a region covered by the photomask, and the outer frame edge of the photomask is determined. The position of the outer edge 1422 of the light shielding layer 142 determines the position of the inner edge 1421 of the light shielding layer 142.
另外,值得一提的是,采用所述黄光工艺时,所述遮光层142的厚度相对较小,例如可做到2μm~3μm。In addition, it is worth mentioning that when the yellow light process is employed, the thickness of the light shielding layer 142 is relatively small, for example, 2 μm to 3 μm.
在丝印工艺中,采用丝印工艺将所述遮光层142涂覆于所述滤光元件主体141的底表面,具体包括以下步骤:通过丝网印版将吸光油墨涂覆于滤光元件主体141;烘烤前述涂有上述吸光油墨的滤光元件主体141得到所述滤光元件14。相应地,所述油墨为黑色吸收性不透光材料,可吸收绝大部分的入射至所述遮光层142的光能,如能吸收95%以上的光能,而只能允许极小部分的光入射至所述遮光层142后能被反射。通过上述丝印工艺,所述遮光层的厚度可以是7μm~12μm。In the screen printing process, the screen layer 142 is applied to the bottom surface of the filter element body 141 by a screen printing process, specifically comprising the steps of: applying a light absorbing ink to the filter element body 141 through a screen printing plate; The filter element 14 is obtained by baking the filter element main body 141 coated with the above-described light absorbing ink. Correspondingly, the ink is a black absorbing opaque material, and can absorb most of the light energy incident on the light shielding layer 142, such as absorbing more than 95% of the light energy, and only allowing a very small portion. Light can be reflected after being incident on the light shielding layer 142. The thickness of the light shielding layer may be 7 μm to 12 μm by the above silk screen process.
如图4A和图4B中所示,根据本发明的上述第一个实施例的一个变形实施方式,所述摄像模组100的所述感光组件10包括所述电路板11,所述模塑基座12,所述感光元件13和所述滤光元件14。其中所述模塑基座12在其顶侧具有 一顶侧凹槽125,所述顶侧凹槽125用于组装所述滤光元件14。也就是说,在本发明的这个实施例中,所述模塑基座12的顶表面124可以是多级台阶面,例如如图4A和图4B中示意的,所述顶表面124分成不共面的多部分顶表面,如一第一部分顶表面124a和一第二部分顶表面124b,所述第一部分顶表面124a相对于所述第二部分顶表面124b朝向所述感光元件13的方向凹进,这样在所述第一部分顶表面124a顶侧形成所述顶侧凹槽125,所述滤光元件14组装于所述顶侧凹槽125,从而减小所述滤光元件14与所述感光元件13之间距离,并且减小所述摄像模组100的整体尺寸。As shown in FIG. 4A and FIG. 4B, according to a variant embodiment of the first embodiment of the present invention, the photosensitive module 10 of the camera module 100 includes the circuit board 11, the molding base. a seat 12, the photosensitive element 13 and the filter element 14. Wherein the molded base 12 has a top side recess 125 on its top side for assembling the filter element 14. That is, in this embodiment of the invention, the top surface 124 of the molded base 12 may be a multi-stepped surface, such as illustrated in Figures 4A and 4B, the top surface 124 being divided into a multi-part top surface of the face, such as a first partial top surface 124a and a second partial top surface 124b, the first partial top surface 124a being recessed toward the photosensitive element 13 relative to the second partial top surface 124b, Thus forming the top side groove 125 on the top side of the first portion top surface 124a, the filter element 14 being assembled to the top side groove 125, thereby reducing the filter element 14 and the photosensitive element The distance between the 13 is reduced, and the overall size of the camera module 100 is reduced.
相应地,所述遮光层142的外边缘1422位于所述模塑基座12的第一部分顶表面124a的内边缘1241的外侧,即所述模塑基座12的所述第一部分顶表面124a的所述内边缘1241和所述遮光层142的所述外边缘1422之间不会形成透光区。Correspondingly, the outer edge 1422 of the light shielding layer 142 is located outside the inner edge 1241 of the first portion top surface 124a of the molded base 12, ie, the first portion top surface 124a of the molded base 12. A light transmissive region is not formed between the inner edge 1241 and the outer edge 1422 of the light shielding layer 142.
如图4B所示,入射至所述滤光元件14的所述滤光元件主体141上表面的部分杂散光线L21被所述滤光元件主体141的上表面反射而不会进入所述模塑基座12的所述光窗122,并且折射进入所述遮光层142上方的所述透光区域1411外侧的周围区域1412时,会被所述遮光层142吸收而不能进入所述模塑基座12内部的所述光窗122,从而起到阻挡一部分杂散光的目的。As shown in FIG. 4B, a part of the stray light L21 incident on the upper surface of the filter element main body 141 of the filter element 14 is reflected by the upper surface of the filter element main body 141 without entering the molding. The light window 122 of the susceptor 12, when refracted into the surrounding area 1412 outside the light-transmitting region 1411 above the light-shielding layer 142, is absorbed by the light-shielding layer 142 and cannot enter the molded base. The light window 122 inside 12 serves to block a part of stray light.
在本发明的这个实施例中,所述模塑基座12具有从所述感光元件13一体地倾斜向上延伸的内表面123,其包括多部分内表面,如图中所示为底侧部分内表面123a和顶侧部分内表面123b。所述底侧部分内表面123a从所述感光元件13一体地倾斜延伸,所述顶侧部分内表面123b一体地延伸于所述第一部分顶表面124a,所述顶侧凹槽125形成在所述第二部分内表面123b的内侧和所述第一部分顶表面124a的顶侧。当另一部分杂散光L22穿过所述滤光元件主体141的所述有效透光区域1411而入射至所述底侧部分内表面123a时,会被所述模塑基座12的所述底侧部分内表面123a反射至所述遮光层142从而被所述遮光层142吸收,从而不会进一步被反射而到达所述感光元件13,影响所述摄像模组100的成像质量。In this embodiment of the invention, the molded base 12 has an inner surface 123 extending obliquely upward from the photosensitive element 13 integrally, which includes a multi-part inner surface as shown in the bottom side portion as shown in the drawing The surface 123a and the top side portion inner surface 123b. The bottom side portion inner surface 123a integrally extends obliquely from the photosensitive member 13, the top side portion inner surface 123b integrally extending from the first portion top surface 124a, the top side groove 125 being formed in the The inner side of the second portion inner surface 123b and the top side of the first portion top surface 124a. When another portion of the stray light L22 is incident to the bottom side portion inner surface 123a through the effective light transmitting region 1411 of the filter element body 141, the bottom side of the molded base 12 is A portion of the inner surface 123a is reflected to the light shielding layer 142 to be absorbed by the light shielding layer 142 so as not to be further reflected to reach the photosensitive element 13, affecting the image quality of the image sensor module 100.
也就是说,通过将所述遮光层142设置在所述模塑基座12和所述滤光元件主体141之间,能够有效地将射向所述模塑基座12的所述底侧部分内表面123a的杂散光吸收,相应地,所述遮光层142和所述模塑基座12的所述底侧部分内表面123a相邻近,所述模塑基座12的所述底侧部分内表面123a自所述遮光层 142向下延伸,并且在两者之间,所述光窗122的外侧部分形成用来抑止杂散光射出的空间有一抑光槽1221,这样杂散光L22进入所述抑光槽1221之中,从而不能在所述抑光槽1221中射出。更具体地,杂散光L12只能在所述底侧部分内表面123a被反射而被所述遮光层142吸收,从而杂散光L12的光路路径被保持在所述抑光槽1221中,从而有效减少到达所述感光元件13的杂散光。That is, by arranging the light shielding layer 142 between the molded base 12 and the filter element main body 141, it is possible to effectively face the bottom side portion of the molded base 12 The stray light of the inner surface 123a is absorbed, and correspondingly, the light shielding layer 142 is adjacent to the bottom side inner surface 123a of the molded base 12, and the bottom side portion of the molded base 12 The inner surface 123a extends downward from the light shielding layer 142, and between the two, the outer portion of the light window 122 forms a space for suppressing the emission of stray light, and a light suppression groove 1221, so that the stray light L22 enters the In the light-sinking groove 1221, it is not possible to emit in the light-sinking groove 1221. More specifically, the stray light L12 can be reflected only by the bottom side inner surface 123a and absorbed by the light shielding layer 142, so that the optical path of the stray light L12 is held in the light suppression groove 1221, thereby effectively reducing The stray light reaching the photosensitive element 13 is reached.
如图5A至图7C是根据本发明的第二个优选实施例的摄像模组100及其感光组件10,类似地,所述摄像模组100包括所述感光组件10,所述镜头30和一镜头承载元件40。所述镜头30组装于所述镜头承载元件40,以形成一镜头组件。所述镜头承载元件40可以是一驱动器或一固定镜筒。在这个实施例中,所述镜头承载元件是一驱动器,所述驱动器可以实施为音圈马达、压电马达、热力学驱动器、微机电驱动器等,以实现自动对焦功能,从而形成一自动对焦摄像模组。5A to 7C are a camera module 100 and a photosensitive assembly 10 thereof according to a second preferred embodiment of the present invention. Similarly, the camera module 100 includes the photosensitive module 10, the lens 30 and a lens Lens carrier element 40. The lens 30 is assembled to the lens carrying member 40 to form a lens assembly. The lens carrying member 40 can be a driver or a fixed lens barrel. In this embodiment, the lens carrying component is a driver, and the driver can be implemented as a voice coil motor, a piezoelectric motor, a thermodynamic driver, a microelectromechanical driver, etc. to implement an autofocus function, thereby forming an autofocus camera mode. group.
对应地,所述感光组件10包括一电路板11,一模塑基座12,一感光元件13和一滤光元件14,所述模塑基座12包括一基座主体121,其一体地成型于所述电路板11和所述感光元件13并形成一光窗122,所述光窗122是一封闭空间,并且给所述感光元件13提供光线通路。Correspondingly, the photosensitive member 10 includes a circuit board 11, a molding base 12, a photosensitive element 13 and a filter element 14. The molding base 12 includes a base body 121 which is integrally formed. A light window 122 is formed on the circuit board 11 and the photosensitive element 13, and the light window 122 is a closed space, and provides light passage to the photosensitive element 13.
所述滤光元件14包括一滤光元件主体141和一遮光层142,所述遮光层142位于所述滤光元件主体141的底侧并且位于所述滤光元件主体141和所述模塑基座12之间,所述遮光层142是吸光材料,其使所述滤光元件主体141形成中间的有效透光区域1411和周围区域1412,穿过所述镜头30的光线只能透过所述有效透光区域1411才能到达所述模塑基座12的内部。所述遮光层142,其为环形结构,中间形成开窗,也就是说,所述遮光层142形成用于使光线进入所述光窗122继而到达所述感光元件13的光线通路1420并且减少到达所述感光元件13的杂散光。The filter element 14 includes a filter element body 141 and a light shielding layer 142, the light shielding layer 142 is located on the bottom side of the filter element body 141 and is located at the filter element body 141 and the molding base. Between the seats 12, the light shielding layer 142 is a light absorbing material, which causes the filter element main body 141 to form an intermediate effective transparent region 1411 and a surrounding region 1412, and the light passing through the lens 30 can only pass through the light. The effective light transmitting region 1411 can reach the inside of the molded base 12. The light shielding layer 142 is an annular structure, and a window is formed in the middle, that is, the light shielding layer 142 forms a light path 1420 for allowing light to enter the light window 122 and then reach the photosensitive element 13 and is reduced in arrival. The stray light of the photosensitive element 13.
所述感光元件13具有中间的一感光区131和位于所述感光区131周围的一非感光区132,所述遮光层142具有一内边缘1421和一外边缘1422。所述遮光层142的所述内边缘1421与光轴X之间的距离大于等于,或略小于所述感光区131的外边缘1311与光轴X之间的距离。The photosensitive element 13 has a photosensitive area 131 in the middle and a non-sensitive area 132 around the photosensitive area 131. The light shielding layer 142 has an inner edge 1421 and an outer edge 1422. The distance between the inner edge 1421 of the light shielding layer 142 and the optical axis X is greater than or equal to, or slightly smaller than the distance between the outer edge 1311 of the photosensitive region 131 and the optical axis X.
所述遮光层142的外边缘1422位于所述模塑基座12的顶表面124的内边缘1241的外侧,即所述模塑基座12的所述顶表面124的所述内边缘1241和所述遮光层142的所述外边缘1422之间不会形成透光区。The outer edge 1422 of the light shielding layer 142 is located outside of the inner edge 1241 of the top surface 124 of the molded base 12, i.e., the inner edge 1241 of the top surface 124 of the molded base 12 and A light transmissive region is not formed between the outer edges 1422 of the light shielding layer 142.
在本发明的这个实施例中,所述模塑基座12的所述基座主体121内表面优选呈中心对称结构,其包括内表面沿不同方向延伸的多个部分,例如所述模塑基座12的所述基座主体121包括三部分,即图5A中所示的位于所述光窗122周围的一感光元件结合部1211和一顶侧延伸部1212,以及位于所述感光元件13周围的一体结合于所述感光元件13外周面和所述电路板11的顶表面的一电路板结合部1213,这三部分一体地延伸而形成整体的结构。所述感光元件结合部1211和所述感光元件结合部1211具有从所述感光元件13一体延伸的内表面,其定义为所述模塑基座12的第一部分内表面1231,所述顶侧延伸部1212具有从所述感光元件结合部1211一体的延伸的内表面,其定义为所述模塑基座12的第二部分内表面1232,所述第二部分内表面1232一体地延伸于所述第一部分内表面1231。In this embodiment of the invention, the inner surface of the base body 121 of the molded base 12 preferably has a central symmetrical structure including a plurality of portions of the inner surface extending in different directions, such as the molding base. The base body 121 of the seat 12 includes three portions, that is, a photosensitive element joint portion 1211 and a top side extension portion 1212 located around the light window 122 shown in FIG. 5A, and is located around the photosensitive member 13. The integrated body is integrated with a peripheral portion of the photosensitive member 13 and a circuit board joint portion 1213 of the top surface of the circuit board 11, and the three portions integrally extend to form an integral structure. The photosensitive element coupling portion 1211 and the photosensitive element coupling portion 1211 have an inner surface integrally extending from the photosensitive member 13, which is defined as a first partial inner surface 1231 of the molded base 12, the top side extending The portion 1212 has an inner surface extending integrally from the photosensitive element joint portion 1211, which is defined as a second portion inner surface 1232 of the molded base 12, the second portion inner surface 1232 integrally extending from the The first portion of the inner surface 1231.
所述感光元件结合部1211和所述顶侧延伸部1212各自的内表面1231和1232分别以不同斜率延伸,所述顶侧延伸部1212的所述第二部分内表面1232相对于所述感光元件结合部1211的所述第一部分内表面1231以更大的斜率向上延伸,或者所述顶侧延伸部1212的所述第二部分内表面1232接近没有斜率地向上延伸,即所述顶侧延伸部1212的所述第二部分内表面1232基本垂直于所述感光元件13的顶表面地延伸,所述顶侧延伸部1212成为一垂直延伸部,从而使所述顶侧延伸部1212顶表面的面积能够相对较大,即所述顶侧延伸部1212顶表面决定所述模塑基座12的所述顶表面124的面积,所述感光元件结合部1211和所述顶侧延伸部1212这样的延伸结构,能够增大所述模塑基座12的所述顶表面124的面积,从而能够为所述感光组件10上方的镜头或镜头组件提供更大的安装面积,以更稳固地安装上方的镜头或镜头组件,并且能够减小所述滤光元件14的面积。The inner surfaces 1231 and 1232 of the photosensitive element joint 1211 and the top side extension 1212 respectively extend with different slopes, and the second partial inner surface 1232 of the top side extension 1212 is opposite to the photosensitive element The first partial inner surface 1231 of the joint portion 1211 extends upward with a greater slope, or the second portion inner surface 1232 of the top side extension 1212 extends upward without a slope, ie, the top side extension The second portion inner surface 1232 of the 1212 extends substantially perpendicular to the top surface of the photosensitive element 13, and the top side extension 1212 becomes a vertical extension such that the area of the top surface of the top side extension 1212 Can be relatively large, that is, the top surface of the top side extension 1212 determines the area of the top surface 124 of the molded base 12, and the extension of the photosensitive element joint 1211 and the top side extension 1212 The structure can increase the area of the top surface 124 of the molded base 12, thereby providing a larger mounting area for the lens or lens assembly above the photosensitive assembly 10 for more secure mounting above. A lens or lens assembly and capable of reducing the area of the filter element 14.
也就是说,为方便模塑工艺的脱模以及防止杂散光,所述感光元件结合部1211形成的结构为其内表面定义的所述第一部分内表面1231以相对较小斜率倾斜地从所述感光元件13向上延伸,所述顶侧延伸部1212的内表面定义的所述第二部分内表面1232从所述第一部分内表面1231转折地一体地延伸,并且以相对较大斜率或没有斜率地向上延伸,即所述模塑基座12的所述第二部分内表面1232和所述第一部分内表面1231之间形成了夹角,从而相对于以固定斜率倾斜向上延伸,能够有效地增加所述模塑基座12的所述顶表面124的面积尺寸。That is, in order to facilitate demolding of the molding process and to prevent stray light, the photosensitive member joint portion 1211 is formed by a structure in which the first portion inner surface 1231 defined by its inner surface is inclined at a relatively small slope from the The photosensitive element 13 extends upwardly, and the second partial inner surface 1232 defined by the inner surface of the top side extension 1212 integrally extends in a meandering manner from the first partial inner surface 1231 and has a relatively large slope or no slope Extending upwardly, that is, an angle formed between the second partial inner surface 1232 of the molded base 12 and the first partial inner surface 1231, so as to be inclined upwardly with respect to a fixed slope, can effectively increase The area size of the top surface 124 of the molded susceptor 12 is described.
如图5B所示,所述感光元件结合部1211的内表面定义的所述第一部分内表面1231与所述摄像模组100的光轴X之间的夹角为α,所述顶侧延伸部1212的内表面定义的所述第二部分内表面1232与所述摄像模组100的光轴X之间的夹角为β,其中α的数值范围为3°~80°,β的数值范围为0°~10°,并且α>β。例如在一个具体实施例中,α的数值为3°,β的数值为0°;在一个具体实施例中,α的数值为30°,β的数值为0°;在一个具体实施例中,α的数值为60°,β的数值为0°;在一个具体实施例中,α的数值为45°,β的数值为5°;在一个具体实施例中,α的数值为80°,β的数值为10°。As shown in FIG. 5B, an angle between the first portion inner surface 1231 defined by the inner surface of the photosensitive element joint portion 1211 and the optical axis X of the camera module 100 is α, and the top side extension portion The angle between the second portion inner surface 1232 defined by the inner surface of 1212 and the optical axis X of the camera module 100 is β, wherein the value of α ranges from 3° to 80°, and the value range of β is 0° to 10°, and α>β. For example, in one embodiment, the value of a is 3° and the value of β is 0°; in one embodiment, the value of α is 30° and the value of β is 0°; in a specific embodiment, The value of α is 60° and the value of β is 0°; in one embodiment, the value of α is 45° and the value of β is 5°; in one embodiment, the value of α is 80°, β The value is 10°.
也就是说,所述顶侧延伸部1212的内表面定义的所述第二部分内表面1232与所述摄像模组100的光轴X之间的夹角β相对于所述感光元件结合部1211的内表面定义的所述第一部分内表面1231与所述摄像模组100的光轴X之间的夹角α具有更小的角度,从而使得所述顶侧延伸部1212的所述第二部分内表面1232以更大的斜率或沿垂直于所述感光元件13的方向地向上延伸,从而增大所述模塑基座12的所述顶表面124的面积。That is, the angle β between the second partial inner surface 1232 defined by the inner surface of the top side extension 1212 and the optical axis X of the camera module 100 is opposite to the photosensitive element coupling portion 1211. The angle α between the first partial inner surface 1231 defined by the inner surface and the optical axis X of the camera module 100 has a smaller angle, such that the second portion of the top side extension 1212 The inner surface 1232 extends upward with a greater slope or in a direction perpendicular to the photosensitive element 13, thereby increasing the area of the top surface 124 of the molded base 12.
如图5B所示,在本发明的这个优选实施例中,优选地,所述感光元件结合部1211的厚度H1数值范围为0.05mm~0.7mm,所述顶侧延伸部1212的厚度H2数值范围为0.02mm~0.6mm。例如在一个具体实施例中,所述感光元件结合部1211的厚度H1数值范围为0.08mm,所述顶侧延伸部1212的厚度H2数值范围为0.5mm;在一个具体实施例中,所述感光元件结合部1211的厚度H1数值范围为0.4mm,所述顶侧延伸部1212的厚度H2数值范围为0.3mm;在一个具体实施例中,所述感光元件结合部1211的厚度H1数值范围为0.5mm,所述顶侧延伸部1212的厚度H2数值范围为0.1mm。As shown in FIG. 5B, in this preferred embodiment of the present invention, preferably, the thickness H1 of the photosensitive element joint portion 1211 ranges from 0.05 mm to 0.7 mm, and the thickness H2 of the top side extension portion 1212 ranges. It is 0.02mm to 0.6mm. For example, in one embodiment, the thickness H1 of the photosensitive element joint portion 1211 ranges from 0.08 mm, and the thickness H2 of the top side extension portion 1212 ranges from 0.5 mm; in one embodiment, the photosensitive portion The thickness H1 of the element joint portion 1211 ranges from 0.4 mm, and the thickness H2 of the top side extension portion 1212 ranges from 0.3 mm. In one embodiment, the thickness H1 of the photosensitive element joint portion 1211 ranges from 0.5. In mm, the thickness H2 of the top side extension 1212 ranges from 0.1 mm.
可以理解的是,所述顶侧延伸部1212的所述第二部分内表面1232从所述第一部分内表面1231转折而以与光轴X之间更小角度的方向延伸,从而使得在模塑工艺中能够使压合于所述感光元件13的压头能够避开所述电路板11和所述感光元件13之间的所述连接线15,从而防止将所述连接线15压坏。也就是说,在一些情况中,如果要形成的所述模塑基座12以相对较小的固定斜率延伸时,如内表面与光轴X之间夹角为45°~80°,在模塑工艺中压合于所述感光元件13的压头可能会碰到所述连接线15而导致所述连接线15的损坏。It can be understood that the second partial inner surface 1232 of the top side extension 1212 is deflected from the first partial inner surface 1231 to extend in a direction smaller than the optical axis X, thereby allowing molding. In the process, the nip which is pressed against the photosensitive member 13 can be prevented from avoiding the connecting line 15 between the circuit board 11 and the photosensitive member 13, thereby preventing the connecting line 15 from being crushed. That is, in some cases, if the molded base 12 to be formed is extended with a relatively small fixed slope, such as an angle between the inner surface and the optical axis X of 45 to 80, in the mold The embossing of the photosensitive member 13 in the plastic process may hit the connecting wire 15 to cause damage to the connecting wire 15.
如图6A中所示,所述感光元件结合部1211的内表面定义的所述第一部分 内表面1231与所述摄像模组100的光轴X之间的夹角α可以相对较大,这样入射至所述第一部分内表面1231的光线L32便不会被直接反射至所述感光元件13而形成杂散光。也就是说,所述感光元件结合部1211和所述顶侧延伸部1212互相配合,所述感光元件结合部1211的结构方便脱模和减小杂散光,所述顶侧延伸部1212用来增大所述模塑基座12的所述顶表面124的面积和所述顶侧延伸部1212这样的结构避免模塑工艺所述连接线15被压头压坏。即优选地,所述第一部分内表面1231和所述第二部分内表面1232相连接的位置1230位于所述连接线15的内侧。所述感光元件结合部1211和所述顶侧延伸部1212之间的转折点不超过所述连接线15所在的位置,即所述感光元件结合部1211在还没延伸至所述连接线15的位置前即完成向所述顶侧延伸部1212的过渡,从而避免在模塑工艺中所述连接线15被压头压坏。例如所述顶侧延伸部1212是一垂直延伸部时,所述模塑基座12的所述顶表面124的内边缘1241的位置与所述摄像模组的光轴X之间的距离不小于所述连接线15与所述摄像模组的光轴X之间的距离,从而使所述顶侧延伸部1212增大所述模塑基座12的所述顶表面124的面积。As shown in FIG. 6A, the angle α between the first partial inner surface 1231 defined by the inner surface of the photosensitive element coupling portion 1211 and the optical axis X of the camera module 100 may be relatively large, so that incident The light ray L32 to the inner surface 1231 of the first portion is not directly reflected to the photosensitive member 13 to form stray light. That is, the photosensitive element joint portion 1211 and the top side extension portion 1212 are fitted to each other, the structure of the photosensitive element joint portion 1211 facilitates demolding and reduces stray light, and the top side extension portion 1212 is used to increase The area of the top surface 124 of the molded base 12 and the structure of the top side extension 1212 avoid the molding process from being crushed by the ram by the molding process. That is, preferably, the position 1230 where the first partial inner surface 1231 and the second partial inner surface 1232 are connected is located inside the connecting line 15. The turning point between the photosensitive element coupling portion 1211 and the top side extending portion 1212 does not exceed the position where the connecting line 15 is located, that is, the photosensitive element coupling portion 1211 is not extended to the connecting line 15 The transition to the top side extension 1212 is completed immediately before the connection line 15 is prevented from being crushed by the ram during the molding process. For example, when the top side extension 1212 is a vertical extension, the distance between the position of the inner edge 1241 of the top surface 124 of the molded base 12 and the optical axis X of the camera module is not less than The distance between the connecting line 15 and the optical axis X of the camera module is such that the top side extension 1212 increases the area of the top surface 124 of the molded base 12.
如图6B中所示,当所述滤光元件14只在顶侧设置所述顶侧遮光层143时,其能够吸收一部分光线N31,但光线N32会被所述模塑基座和所述滤光元件的底表面反射而形成杂散光。As shown in FIG. 6B, when the filter element 14 is disposed only on the top side of the top side light shielding layer 143, it is capable of absorbing a portion of the light N31, but the light N32 is subjected to the molded base and the filter. The bottom surface of the light element reflects to form stray light.
当所述滤光元件14在底侧设置有所述遮光层142时,如图6A中所示,入射至所述滤光元件14的所述滤光元件主体141上表面的部分杂散光线L31被所述滤光元件主体141的上表面反射而不会进入所述模塑基座12的所述光窗122,并且折射进入所述遮光层142上方的所述透光区域1411外侧的周围区域1412时,会被所述遮光层142吸收而不能进入所述模塑基座12内部的所述光窗122,从而起到阻挡一部分杂散光的目的。When the filter element 14 is provided with the light shielding layer 142 on the bottom side, as shown in FIG. 6A, a part of the stray light L31 incident on the upper surface of the filter element main body 141 of the filter element 14 is formed. Reflected by the upper surface of the filter element body 141 without entering the light window 122 of the molding base 12, and refracting into the surrounding area outside the light-transmitting region 1411 above the light shielding layer 142 At 1412, the light window 122 is absorbed by the light shielding layer 142 and cannot enter the light window 122 inside the molded base 12, thereby blocking a part of stray light.
当另一部分杂散光L32穿过所述滤光元件主体141的所述有效透光区域1411而入射至所述第一部分内表面1231时,会被所述模塑基座12的倾斜的所述第一部分内表面1231向上反射至所述遮光层142或经进一步被所述第二部分内表面1232进一步反射至所述遮光层142,从而被所述遮光层142吸收,从而不会进一步被反射而到达所述感光元件13,影响所述摄像模组100的成像质量。When another portion of the stray light L32 is incident on the first partial inner surface 1231 through the effective light-transmitting region 1411 of the filter element body 141, the first portion of the tilt of the molded base 12 may be A portion of the inner surface 1231 is reflected upward to the light shielding layer 142 or further reflected by the second partial inner surface 1232 to the light shielding layer 142 to be absorbed by the light shielding layer 142 so as not to be further reflected. The photosensitive element 13 affects the imaging quality of the camera module 100.
相应地,所述遮光层142和所述模塑基座12的所述第二部分内表面1232相邻近,所述模塑基座12的所述第二部分内表面1232自所述遮光层142向下延伸, 并且在所述遮光层142,所述第一部分内表面1231和第二部分内表面1232之间,所述光窗122的外侧部分形成一抑光槽1221,所述抑光槽1221是一个用来抑止杂散光射出的空间。更具体地,如图6A所示,杂散光L32进入所述抑光槽1221之中,从而不能在所述抑光槽1221中射出。Correspondingly, the light shielding layer 142 is adjacent to the second partial inner surface 1232 of the molding base 12, and the second partial inner surface 1232 of the molding base 12 is from the light shielding layer 142 extending downward, and between the first portion inner surface 1231 and the second portion inner surface 1232 of the light shielding layer 142, an outer portion of the light window 122 forms a light suppression groove 1221, the light suppression groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG. 6A, the stray light L32 enters the light suppression groove 1221 so as not to be ejected in the light suppression groove 1221.
可以理解的是,因为所述遮光层142和所述模塑基座12的所述第二部分内表面1232相邻近,从而所述遮光层142有效地减小穿过所述滤光元件主体141而到达所述第二部分内表面1232的光线,从而避免入射至所述第二部分内表面1232的光线被所述第二部分内表面1232反射而到达所述感光元件13形成杂散光并影响所述摄像模组100的成像质量。It can be understood that since the light shielding layer 142 and the second partial inner surface 1232 of the molding base 12 are adjacent, the light shielding layer 142 is effectively reduced through the filter element body. 141 and light reaching the inner surface 1232 of the second portion, thereby preventing light incident on the inner surface 1232 of the second portion from being reflected by the inner surface 1232 of the second portion to reach the photosensitive element 13 to form stray light and affecting The imaging quality of the camera module 100.
如图6A中所示,所述第二部分内表面1232自所述遮光层142延伸向下延伸,所述遮光层142自所述第二部分内表面1232水平方向延伸,所述遮光层142和所述第二部分内表面1232之间形成夹角γ,夹角γ是锐角或直角,从而形成的这样结构的所述抑光槽1221避免入射至所述内表面123的光线被反射向所述感光元件13而形成杂散光。As shown in FIG. 6A, the second portion inner surface 1232 extends downward from the light shielding layer 142, and the light shielding layer 142 extends horizontally from the second portion inner surface 1232, the light shielding layer 142 and An angle γ is formed between the inner surface 1232 of the second portion, and the angle γ is an acute angle or a right angle, so that the light-proof groove 1221 of such a structure is formed to prevent the light incident on the inner surface 123 from being reflected toward the The photosensitive element 13 forms stray light.
如图7A至图7C是根据本发明的所述感光组件10的一体成型的所述电路板11,所述模塑基座12和所述感光元件13的一体组件的制造过程示意图。其制造设备200包括一成型模具210,所述成型模具210包括能够开模和合模的一第一模具211和一第二模具212,即一模具固定装置能够将所述第一模具211和所述第二模具212相分开和相密合形成一成型腔213,在合模时,连接在所述感光元件13的所述电路板11固定于所述成型腔213内,并且流体状的所述模塑材料16进入所述成型腔213,从而一体成型于所述电路板11和所述感光元件13上,并且经固化以后形成一体成型于所述电路板11和所述感光元件13上的所述模塑基座12。可以理解的是,在生产工艺中,通常以拼板的方式生成上述一体组件,即在电路板拼板上形成连体模塑基座,然而经切割而形成本发明的所述一体组件。在图7A至图7C中,以示意一个所述一体组件的形成过程为例说明。7A to 7C are schematic views showing a manufacturing process of the integrally formed circuit board 11 of the photosensitive member 10 according to the present invention, the molded base 12 and the integral assembly of the photosensitive member 13. The manufacturing apparatus 200 includes a molding die 210 including a first mold 211 and a second mold 212 capable of opening and clamping, that is, a mold fixing device capable of the first mold 211 and the The second mold 212 is separated and closely formed to form a molding cavity 213. When the mold is closed, the circuit board 11 connected to the photosensitive member 13 is fixed in the molding cavity 213, and the fluid-like mold The plastic material 16 enters the molding cavity 213 to be integrally formed on the circuit board 11 and the photosensitive member 13, and after curing, forms the integrally formed on the circuit board 11 and the photosensitive member 13. The susceptor 12 is molded. It will be appreciated that in the production process, the integral assembly described above is typically produced in a panel manner, i.e., a continuous molded base is formed on a circuit board panel, but is cut to form the integral assembly of the present invention. In FIGS. 7A to 7C, a process of forming one of the integral components will be described as an example.
更具体地,所述成型模具210进一步具有一基座成型导槽215以及包括位于所述基座成型导槽215内的一光窗成型部214。在所述第一和第二模具211和212合模时,所述光窗成型部214和所述基座成型导槽215延伸在所述成型腔213内,并且流体状的所述模塑材料16被填充进入所述基座成型导槽215,而对应所述光窗成型部214的位置不能填充流体状的所述模塑材料16,从而在对应所述基 座成型导槽215的位置,流体状的所述模塑材料16经固化以后可以形成所述模塑基座12,其包括对应各个所述感光组件10的所述模塑基座12的环形的模塑主体121,而在对应所述光窗成型部214的位置会形成所述模塑基座12的所述光窗122。所述模塑材料16可以选择但不限于尼龙、LCP(Liquid Crystal Polymer,液晶高分子聚合物)、PP(Polypropylene,聚丙烯)、环氧树脂等。More specifically, the molding die 210 further has a base molding guide groove 215 and a light window molding portion 214 included in the base molding guide groove 215. When the first and second molds 211 and 212 are clamped, the light window molding portion 214 and the base molding guide groove 215 extend in the molding cavity 213, and the molding material in a fluid state 16 is filled into the base molding guide groove 215, and the position corresponding to the light window molding portion 214 cannot be filled with the fluid molding material 16, so that the position corresponding to the base molding guide groove 215 is The molded material 16 in fluid form may be cured to form the molded base 12, which includes an annular molded body 121 corresponding to the molded base 12 of each of the photosensitive members 10, in correspondence The position of the light window forming portion 214 may form the light window 122 of the molded base 12. The molding material 16 may be selected from, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, and the like.
更具体地,在所述第一和第二模具211和212合模并执行模塑步骤时,所述光窗成型部214叠合于所述感光元件13的顶表面并紧密贴合,从而流体状的所述模塑材料16被阻止进入所述电路板11上的所述感光元件13的所述感光区131,从而在对应所述光窗成型部214的位置能够最终形成所述模塑基座12的所述光窗122。可以理解的是所述光窗成型部214可以是实心结构,也可以是如图中所示的内部具有凹槽形状的结构。可以理解的是,在另外的变形中,所述第一模具211底侧还可设置一弹性膜,提供缓冲和方便模塑工艺之后脱模。More specifically, when the first and second molds 211 and 212 are closed and the molding step is performed, the light window forming portion 214 is superposed on the top surface of the photosensitive member 13 and closely fits, thereby fluid The molding material 16 is prevented from entering the photosensitive region 131 of the photosensitive member 13 on the circuit board 11, so that the molding base can be finally formed at a position corresponding to the light window molding portion 214. The light window 122 of the seat 12. It can be understood that the light window forming portion 214 may be a solid structure or a structure having a groove shape inside as shown in the drawing. It can be understood that, in another variation, an elastic film may be disposed on the bottom side of the first mold 211 to provide cushioning and demolding after the molding process.
如图7A至图7C中所示,所述光窗成型部214压合于所述感光元件13,为对应形成所述模塑基座12的所述感光元件结合部1211和所述顶侧延伸部1212,所述光窗成型部214具有一底侧成型部2141和一顶侧成型部2142,所述底侧成型部2141是锥台形结构,其从底侧朝向顶侧方向具有渐大的内径。其中所述底侧成型部2141的外表面21411与垂直于所述感光元件13的光轴X之间形成夹角α,顶侧成型部2142的外表面21421与垂直于所述感光元件13的光轴X之间形成夹角β。相应地,α的数值范围为3°~80°,β的数值范围为0°~10°,并且α>β。所述顶侧成型部2142从所述底侧成型部2141转向地延伸,在模塑工艺中不会压到所述连接线15而造成所述连接线15的损坏。As shown in FIGS. 7A to 7C, the light window forming portion 214 is press-fitted to the photosensitive member 13 to extend correspondingly to the photosensitive member joint portion 1211 and the top side of the molded base 12. The light window forming portion 214 has a bottom side molding portion 2141 and a top side molding portion 2142, and the bottom side molding portion 2141 is a frustum-shaped structure having an enlarged inner diameter from the bottom side toward the top side direction. . Wherein the outer surface 21411 of the bottom side molding portion 2141 forms an angle α with the optical axis X perpendicular to the photosensitive member 13, the outer surface 21421 of the top side molding portion 2142 and the light perpendicular to the photosensitive member 13 An angle β is formed between the axes X. Accordingly, the value of α ranges from 3° to 80°, the value of β ranges from 0° to 10°, and α>β. The top side molding portion 2142 is steered from the bottom side molding portion 2141, and is not pressed against the connecting wire 15 in the molding process to cause damage of the connecting wire 15.
所述光窗成型部214从底侧朝向顶侧方向具有第一部分外表面21411和第二部分外表面21421,其分别与垂直于所述感光元件13的光轴X之间形成夹角α和β,α的数值范围为3°~80°,β的数值范围为0°~10°,并且α>β。从而在模塑工艺之后,使所述模塑基座12形成所述感光元件结合部1211和所述顶侧延伸部1212,并且使所述感光元件结合部1211形成的结构为其内表面定义的所述第一部分内表面1231以相对较小斜率倾斜地从所述感光元件13向上延伸,所述顶侧延伸部1212的内表面定义的所述第二部分内表面1232从所述第一部分内表面1231转折地一体地延伸,并且以相对较大斜率或没有斜率地向上延伸。即所述感光元件结合部1211的内表面定义的所述第一部分内表面1231与所述摄像模 组100的光轴X之间的夹角为α,所述顶侧延伸部1212的内表面定义的所述第二部分内表面1232与所述摄像模组100的光轴X之间的夹角为β,其中α的数值范围为3°~80°,β的数值范围为0°~10°,并且α>β。可以理解的是,所述光窗成型部214这样转折延伸的结构,在模塑工艺中可以减小进入所述感光元件13的所述非感光区132和所述光窗成型部214的所述第一部分外表面21411的所述基座成型槽215的底侧部分的空间的所述模塑材料16,从而该空间内所述模塑材料16的体积较小,产生的压力和压强较小,从而不容易进入所述感光元件13的所述感光区131,即避免“飞边”的产生。The light window forming portion 214 has a first partial outer surface 21411 and a second partial outer surface 21421 from the bottom side toward the top side direction, which form an angle α and β with an optical axis X perpendicular to the photosensitive member 13, respectively. The value of α ranges from 3° to 80°, and the value of β ranges from 0° to 10°, and α>β. Thereby, after the molding process, the molded base 12 is formed into the photosensitive element joint portion 1211 and the top side extension portion 1212, and the structure formed by the photosensitive element joint portion 1211 is defined for its inner surface. The first partial inner surface 1231 extends obliquely from the photosensitive element 13 with a relatively small slope, and the second partial inner surface 1232 defined by the inner surface of the top side extension 1212 is from the inner surface of the first portion The 1231 extends integrally in a folded manner and extends upward with a relatively large slope or without a slope. That is, the angle between the first portion inner surface 1231 defined by the inner surface of the photosensitive element coupling portion 1211 and the optical axis X of the camera module 100 is α, and the inner surface of the top side extension 1212 is defined. The angle between the second portion inner surface 1232 and the optical axis X of the camera module 100 is β, wherein the value of α ranges from 3° to 80°, and the value of β ranges from 0° to 10°. And α>β. It can be understood that the structure in which the light window molding portion 214 is extended in the manner of folding can be reduced in the molding process by the non-photosensitive region 132 and the light window molding portion 214 entering the photosensitive member 13. The molding material 16 of the space of the bottom side portion of the base forming groove 215 of the first portion of the outer surface 21411, so that the molding material 16 in the space is small in volume, and generates a small pressure and pressure. It is never easy to enter the photosensitive region 131 of the photosensitive member 13, i.e., the occurrence of "flash" is avoided.
如图8A所示,根据本发明的上述第二个优选实施例的一个变形实施方式,在这个实施例中,所述滤光元件主体141的顶表面还设置有一顶侧遮光层143,从而所述顶侧遮光层143和所述遮光层142配合增强减小杂散光的效果。更具体地,入射至所述顶侧遮光层143的光线L41被所述顶侧遮光层143吸收,光线L42会被所述遮光层142吸收。可以理解的的是,上述第二个优选实施例也可以设置有所述顶侧遮光层143。As shown in FIG. 8A, in accordance with a modified embodiment of the second preferred embodiment of the present invention, in this embodiment, the top surface of the filter element body 141 is further provided with a top side light shielding layer 143. The top side light shielding layer 143 and the light shielding layer 142 cooperate to enhance the effect of reducing stray light. More specifically, the light ray L41 incident on the top side light shielding layer 143 is absorbed by the top side light shielding layer 143, and the light ray L42 is absorbed by the light shielding layer 142. It is to be understood that the second preferred embodiment described above may also be provided with the top side light shielding layer 143.
如图8B所示,根据本发明的上述第二个优选例的一个变形实施方式,所述摄像模组100包括所述感光组件10,所述镜头30和一镜头承载元件40。所述镜头30组装于所述镜头承载元件40,以形成一镜头组件。所述镜头承载元件40可以是一固定镜筒,从而形成一定焦摄像模组。As shown in FIG. 8B, according to a variant embodiment of the second preferred embodiment of the present invention, the camera module 100 includes the photosensitive member 10, the lens 30 and a lens carrying member 40. The lens 30 is assembled to the lens carrying member 40 to form a lens assembly. The lens carrying component 40 can be a fixed lens barrel to form a fixed focus camera module.
对应地,所述感光组件10包括一电路板11,一模塑基座12,一感光元件13和一滤光元件14,所述模塑基座12包括一基座主体121,其一体地成型于所述电路板11和所述感光元件13并形成一光窗122,所述光窗122是一封闭空间,并且给所述感光元件13提供光线通路。所述滤光元件14包括一滤光元件主体141和一遮光层142,所述遮光层142是吸光不透光材料,其位于所述滤光元件主体141的底侧并且位于所述滤光元件主体141和所述模塑基座12之间。Correspondingly, the photosensitive member 10 includes a circuit board 11, a molding base 12, a photosensitive element 13 and a filter element 14. The molding base 12 includes a base body 121 which is integrally formed. A light window 122 is formed on the circuit board 11 and the photosensitive element 13, and the light window 122 is a closed space, and provides light passage to the photosensitive element 13. The filter element 14 includes a filter element body 141 and a light shielding layer 142. The light shielding layer 142 is a light absorbing opaque material located on a bottom side of the filter element body 141 and located at the filter element. Between the body 141 and the molded base 12.
其中所述模塑基座12在其顶侧具有一顶侧凹槽125,所述顶侧凹槽125用于组装所述滤光元件14。也就是说,在本发明的这个实施例中,所述模塑基座12的顶表面124可以是多级台阶面,所述顶表面124分成不共面的多部分顶表面,如一第一部分顶表面124a和一第二部分顶表面124b,所述第一部分顶表面124a相对于所述第二部分顶表面124b朝向所述感光元件13的方向凹进,这样在所述第一部分顶表面124a顶侧形成所述顶侧凹槽125,所述滤光元件14组装 于所述顶侧凹槽125。The molded base 12 has a top side recess 125 on its top side for assembling the filter element 14. That is, in this embodiment of the invention, the top surface 124 of the molded base 12 may be a multi-stepped surface, the top surface 124 being divided into a multi-part top surface that is not coplanar, such as a first partial top a surface 124a and a second partial top surface 124b, the first partial top surface 124a being recessed relative to the second partial top surface 124b toward the photosensitive element 13, such that the top side of the first partial top surface 124a The top side groove 125 is formed, and the filter element 14 is assembled to the top side groove 125.
所述模塑基座12的所述顶侧延伸部1212相应地呈两段式,并且在其顶侧形成所述顶侧凹槽125。所述模塑基座12的内表面123相应包括所述感光元件结合部1211的所述第一部分内表面1231以及所述顶侧延伸部1212形成的第二部分内表面1232和第三部分内表面1233,所述遮光层142和所述模塑基座12的所述第二部分内表面1232相邻近,并且与所述第一部分内表面1231以及所述第二部分内表面1232之间形成上述抑光槽1221,从而形成一个抑止杂散光射出的空间。即入射至所述第一部分内表面1231的光线被直接反射至所述遮光层142或进一步被所述第二部分内表面1232反射至所述遮光层142从而被所述遮光层142吸收,从而减少杂散光。所述滤光元件14顶侧也设置有所述顶侧遮光层143,增强消除杂散光的效果。The top side extension 1212 of the molded base 12 is correspondingly in two stages, and the top side groove 125 is formed on the top side thereof. The inner surface 123 of the molded base 12 correspondingly includes the first partial inner surface 1231 of the photosensitive element joint 1211 and the second partial inner surface 1232 and the third partial inner surface formed by the top side extension 1212. 1233, the light shielding layer 142 is adjacent to the second partial inner surface 1232 of the molding base 12, and forms the above between the first partial inner surface 1231 and the second partial inner surface 1232 The light groove 1221 is formed to form a space for suppressing the emission of stray light. That is, the light incident on the first partial inner surface 1231 is directly reflected to the light shielding layer 142 or further reflected by the second partial inner surface 1232 to the light shielding layer 142 to be absorbed by the light shielding layer 142, thereby reducing Stray light. The top side light shielding layer 143 is also disposed on the top side of the filter element 14 to enhance the effect of eliminating stray light.
可以理解的是,上述图2至图9的实施例中,所述连接线15的打线方向是从所述感光元件13至所述电路板11,即即通过在所述感光元件13上设置所述感光元件连接盘,打线治具先在所述感光元件连接盘的顶端打线形成连接至所述感光元件连接盘的所述连接线15的第一端,然后会抬高预设位置,然后朝向电路板上的电路板连接盘方向移动并再下降以在所述电路板连接盘的顶端形成连接至所述电路板连接盘的所述连接线15的第二端。It can be understood that, in the embodiment of FIG. 2 to FIG. 9 described above, the wiring direction of the connecting line 15 is from the photosensitive element 13 to the circuit board 11, that is, by being disposed on the photosensitive element 13. The photosensitive element is connected to the disk, and the wire jig is first wired at the top end of the photosensitive element lands to form a first end of the connecting line 15 connected to the photosensitive element lands, and then the preset position is raised And then moving toward the board lands on the board and then lowering to form a second end of the connecting line 15 connected to the board lands at the top end of the board lands.
如图9所示,根据本发明的上述第二个优选例的另一个变形实施方式,所述摄像模组100的所述感光组件10的所述电路板11的所述电子元器件112贴装在其底侧,相应地所述感光组件10还包括一个或多个底侧模塑部19,其一体地包埋所述电子元器件112。即所述电路板11顶侧没有贴装所述电子元器件112,这些电子元器件112被设置在所述电路板11的底侧,并通过所述底侧模塑部19,其可以是多个独立部分,也可以形成一个整体模塑底座,将所述电子元器件112包埋并形成底侧平整支撑面。所述底侧模塑部19和所述模塑基座12可以分别独立地形成,也可能是在一次模塑工艺中形成,如所述电路板11可以具有穿孔,所述模塑材料16在模塑工艺中可以到达所述电路板11的两侧。As shown in FIG. 9, according to another modified embodiment of the second preferred embodiment of the present invention, the electronic component 112 of the circuit board 11 of the photosensitive module 10 of the camera module 100 is mounted. On its bottom side, the photosensitive assembly 10 accordingly also includes one or more bottom side moldings 19 that integrally enclose the electronic component 112. That is, the electronic component 112 is not mounted on the top side of the circuit board 11, and the electronic components 112 are disposed on the bottom side of the circuit board 11 and pass through the bottom side molding portion 19, which may be many A separate portion may also form an integral molded base that embeds the electronic component 112 and forms a bottom side flat support surface. The bottom side molding portion 19 and the molding base 12 may be separately formed, or may be formed in a single molding process, such as the circuit board 11 may have perforations, and the molding material 16 is Both sides of the circuit board 11 can be reached in the molding process.
可以理解的是,所述感光元件13下方的所述电路板11底侧的空间也能被用来布置所述电子元器件112,从而不像上述实施例中将所述电子元器件112需要布置在所述感光元件13的四周,这个实施例中,所述电路板11的面积尺寸得以显著减小。It can be understood that the space on the bottom side of the circuit board 11 under the photosensitive element 13 can also be used to arrange the electronic component 112, so that the electronic component 112 does not need to be arranged as in the above embodiment. Around this photosensitive member 13, in this embodiment, the area size of the circuit board 11 is significantly reduced.
相应地,所述模塑基座12包括所述感光元件结合部1211以及所述顶侧延伸部1212,这样在所述感光组件10的尺寸进一步减小情况下,通过所述顶侧延伸部1212转折地延伸,增大所述模塑基座12所述顶表面124的面积,以提供更大的安装面给所述镜头承载元件40和所述滤光元件14。并且所述滤光元件14包括设置在所述滤光元件主体141两侧的底侧遮光层142和顶侧遮光层143,从而增强消除杂散光的效果。Accordingly, the molded base 12 includes the photosensitive element joint portion 1211 and the top side extension portion 1212, such that the top side extension portion 1212 passes through the first side extension portion 1212 in the case where the size of the photosensitive member 10 is further reduced. Extendingly, the area of the top surface 124 of the molded base 12 is increased to provide a larger mounting surface for the lens carrier element 40 and the filter element 14. And the filter element 14 includes a bottom side light shielding layer 142 and a top side light shielding layer 143 disposed on both sides of the filter element body 141, thereby enhancing the effect of eliminating stray light.
如图10中所示,所述感光元件13和所述电路板11之间的打线连接方式是从所述电路板11至所述感光元件13。即通过在所述电路板11的上设置所述电路板连接盘,打线治具先在所述电路板连接盘的顶端打线形成连接至所述电路板连接盘的所述连接线15的第二端,然后会抬高预设位置,然后朝向电路板连接盘方向平移并在所述电感光元件连接盘的顶端形成连接至感光元件连接盘的所述连接线15的相反的第一端,这样所述连接线15呈弯曲状地延伸,并且导致所述连接线15的顶端高度h2比图2至图9的实施例中,以图9中为例,连接线顶端的高度h1低,从而在模塑工艺中,所述成型模具210的所述光窗成型部214需要避让所述连接线15的空间减小,从而所述所述顶侧延伸部1212的高度可以更高。As shown in FIG. 10, the wire bonding connection between the photosensitive member 13 and the circuit board 11 is from the circuit board 11 to the photosensitive member 13. That is, by providing the circuit board lands on the circuit board 11, the wire rig is first wired at the top end of the circuit board lands to form the connection line 15 connected to the circuit board lands. The second end, then raises the preset position, then translates toward the board lands and forms an opposite first end of the connecting line 15 connected to the photosensitive element lands at the top end of the illuminating element lands Thus, the connecting line 15 extends in a curved shape, and causes the top end height h2 of the connecting line 15 to be lower than the height h1 of the top end of the connecting line in the embodiment of FIGS. 2 to 9, as exemplified in FIG. Thus, in the molding process, the light window forming portion 214 of the molding die 210 needs to avoid a reduction in the space of the connecting line 15, so that the height of the top side extending portion 1212 can be higher.
如图11至图13A所示是根据本发明的第三个优选实施例的摄像模组100,其中所述摄像模组100包括一感光组件10和一镜头30。所述镜头30组装于所述感光组件形成一定焦摄像模组。可以理解的是,在另外的变形实施方式中,所述镜头也可以设置于一驱动器或一固定镜筒而形成一镜头组件,所述镜头组件组装于所述感光组件。As shown in FIG. 11 to FIG. 13A, a camera module 100 according to a third preferred embodiment of the present invention includes a photosensitive module 10 and a lens 30. The lens 30 is assembled to the photosensitive component to form a fixed focus camera module. It can be understood that, in another modified embodiment, the lens may also be disposed on a driver or a fixed lens barrel to form a lens assembly, and the lens assembly is assembled to the photosensitive assembly.
对应地,所述感光组件10包括一电路板11,一模塑基座12,一感光元件13,一滤光元件14和一滤光元件支架17,所述模塑基座12包括一基座主体121,其一体地成型于所述电路板11和所述感光元件13并形成一光窗122,所述光窗122是一封闭空间,并且给所述感光元件13提供光线通路。Correspondingly, the photosensitive member 10 includes a circuit board 11, a molding base 12, a photosensitive element 13, a filter element 14 and a filter element holder 17, and the molding base 12 includes a base. The main body 121 is integrally formed on the circuit board 11 and the photosensitive member 13 and forms a light window 122. The light window 122 is a closed space and provides a light path to the photosensitive member 13.
所述滤光元件支架17组装于所述模塑基座12,并且具有底侧的开窗171和顶侧安装槽172,所述滤光元件14组装于所述顶侧安装槽172,从而所述滤光元件14组装于所述滤光元件支架17相对于直接组装于所述模塑基座12更不容易损坏。The filter element holder 17 is assembled to the molded base 12 and has a bottom side opening window 171 and a top side mounting groove 172, and the filter element 14 is assembled to the top side mounting groove 172. The assembly of the filter element 14 to the filter element holder 17 is less susceptible to damage than the direct assembly to the mold base 12.
所述滤光元件14包括一滤光元件主体141,一底侧的遮光层142和一顶侧 遮光层143,所述遮光层142位于所述滤光元件主体141的底侧并且位于所述滤光元件主体141和所述滤光元件支架17的内侧顶表面之间,所述遮光层142是吸光材料,其使所述滤光元件主体141形成中间的有效透光区域1411和周围区域1412,穿过所述镜头30的光线只能透过所述有效透光区域1411才能到达所述模塑基座12的内部。所述遮光层142,其为环形结构,中间形成开窗,也就是说,所述遮光层142形成用于使光线进入所述光窗122的光线通路1420并且减少到达所述感光元件13的杂散光,所述顶侧遮光层143能增强减小杂散光的效果。The filter element 14 includes a filter element body 141, a bottom side light shielding layer 142 and a top side light shielding layer 143. The light shielding layer 142 is located on the bottom side of the filter element body 141 and is located at the filter. Between the light element body 141 and the inner top surface of the filter element holder 17, the light shielding layer 142 is a light absorbing material that causes the filter element body 141 to form an intermediate effective light transmissive area 1411 and a surrounding area 1412, Light passing through the lens 30 can only pass through the effective light transmitting region 1411 to reach the inside of the molded base 12. The light shielding layer 142 is an annular structure, and a window is formed in the middle, that is, the light shielding layer 142 forms a light path 1420 for allowing light to enter the light window 122 and reduces the amount of impurities reaching the photosensitive element 13. The astigmatism, the top side light shielding layer 143 can enhance the effect of reducing stray light.
所述感光元件13具有中间的一感光区131和位于所述感光区131周围的一非感光区132,所述遮光层142具有一内边缘1421和一外边缘1422。所述遮光层142的所述内边缘1421与光轴X之间的距离大于等于,或略小于所述感光区131的外边缘1311与光轴X之间的距离。The photosensitive element 13 has a photosensitive area 131 in the middle and a non-sensitive area 132 around the photosensitive area 131. The light shielding layer 142 has an inner edge 1421 and an outer edge 1422. The distance between the inner edge 1421 of the light shielding layer 142 and the optical axis X is greater than or equal to, or slightly smaller than the distance between the outer edge 1311 of the photosensitive region 131 and the optical axis X.
所述遮光层142的外边缘1422位于所述滤光元件支架17的顶表面的内边缘1701的外侧,即所述滤光元件支架17的所述顶表面的所述内边缘和所述遮光层142的所述外边缘1422之间不会形成透光区。An outer edge 1422 of the light shielding layer 142 is located outside the inner edge 1701 of the top surface of the filter element holder 17, that is, the inner edge of the top surface of the filter element holder 17 and the light shielding layer A light transmissive region is not formed between the outer edges 1422 of 142.
在本发明的这个实施例中,所述模塑基座12的所述基座主体121包括内表面沿不同方向延伸的多个部分,例如所述模塑基座12的所述基座主体121包括三部分,即图12A和图12B中所示的位于所述光窗122周围的一感光元件结合部1211和一顶侧延伸部1212,以及所述感光元件结合部1211底侧的一电路板结合部1213。所述感光元件结合部1211具有从所述感光元件13一体延伸的内表面,其定义为所述模塑基座12的第一部分内表面1231,所述顶侧延伸部1212具有从所述感光元件结合部1211一体的延伸的内表面,其定义为所述模塑基座12的第二部分内表面1232,所述第二部分内表面1232一体地延伸于所述第一部分内表面1231。In this embodiment of the invention, the base body 121 of the molded base 12 includes a plurality of portions of the inner surface extending in different directions, such as the base body 121 of the molded base 12. A three-part, that is, a photosensitive element joint 1211 and a top side extension 1212 located around the light window 122 shown in FIGS. 12A and 12B, and a circuit board on the bottom side of the photosensitive element joint 1211 Bonding portion 1213. The photosensitive element coupling portion 1211 has an inner surface integrally extending from the photosensitive member 13, which is defined as a first partial inner surface 1231 of the molded base 12, and the top side extending portion 1212 has a photosensitive member from the photosensitive member An integrally extended inner surface of the joint 1211 is defined as a second partial inner surface 1232 of the molded base 12, the second partial inner surface 1232 extending integrally from the first partial inner surface 1231.
所述感光元件结合部1211和所述顶侧延伸部1212各自的内表面1231和1232分别以不同斜率延伸,所述顶侧延伸部1212的所述第二部分内表面1232相对于所述感光元件结合部1211的所述第一部分内表面1231以更大的斜率向上延伸,或者所述顶侧延伸部1212的所述第二部分内表面1232接近没有斜率地向上延伸,即所述顶侧延伸部1212的所述第二部分内表面1232基本垂直于所述感光元件13的顶表面地延伸,从而使所述顶侧延伸部1212顶表面的面积能够相对 较大,即所述顶侧延伸部1212顶表面决定所述模塑基座12的所述顶表面124的面积,所述感光元件结合部1211和所述顶侧延伸部1212这样的延伸结构,能够增大所述模塑基座12的所述顶表面124的面积,从而能够为所述感光组件10上方的镜头或镜头组件或所述滤光元件支架17提供更大的安装面积,例如在这个实施例中,所述模塑基座12的所述顶表面124得以更稳固地安装上方的所述滤光元件支架17。并且这样的结构能够减小所述滤光元件14的面积。The inner surfaces 1231 and 1232 of the photosensitive element joint 1211 and the top side extension 1212 respectively extend with different slopes, and the second partial inner surface 1232 of the top side extension 1212 is opposite to the photosensitive element The first partial inner surface 1231 of the joint portion 1211 extends upward with a greater slope, or the second portion inner surface 1232 of the top side extension 1212 extends upward without a slope, ie, the top side extension The second portion inner surface 1232 of the 1212 extends substantially perpendicular to the top surface of the photosensitive element 13 such that the area of the top surface of the top side extension 1212 can be relatively large, ie, the top side extension 1212 The top surface determines the area of the top surface 124 of the molded base 12, and the elongated structure of the photosensitive element joint 1211 and the top side extension 1212 can increase the molding base 12 The area of the top surface 124 is such that a larger mounting area can be provided for the lens or lens assembly or the filter element holder 17 above the photosensitive assembly 10, such as in this embodiment, the molded base 12 The top surface 124 is more firmly mounted above the brackets 17 of the filter element. And such a structure can reduce the area of the filter element 14.
也就是说,为方便模塑工艺的脱模以及防止杂散光,所述感光元件结合部1211形成的结构为其内表面定义的所述第一部分内表面1231以相对较小斜率倾斜地从所述感光元件13向上延伸,所述顶侧延伸部1212的内表面定义的所述第二部分内表面1232从所述第一部分内表面1231转折地一体地延伸,并且以相对较大斜率或没有斜率地向上延伸,即所述模塑基座12的所述第二部分内表面1232和所述第一部分内表面1231之间形成了夹角,从而相对于以固定斜率倾斜向上延伸,能够有效地增加所述模塑基座12的所述顶表面124的面积尺寸。That is, in order to facilitate demolding of the molding process and to prevent stray light, the photosensitive member joint portion 1211 is formed by a structure in which the first portion inner surface 1231 defined by its inner surface is inclined at a relatively small slope from the The photosensitive element 13 extends upwardly, and the second partial inner surface 1232 defined by the inner surface of the top side extension 1212 integrally extends in a meandering manner from the first partial inner surface 1231 and has a relatively large slope or no slope Extending upwardly, that is, an angle formed between the second partial inner surface 1232 of the molded base 12 and the first partial inner surface 1231, so as to be inclined upwardly with respect to a fixed slope, can effectively increase The area size of the top surface 124 of the molded susceptor 12 is described.
如图12B所示,所述感光元件结合部1211的内表面定义的所述第一部分内表面1231与所述摄像模组100的光轴X之间的夹角为α,所述顶侧延伸部1212的内表面定义的所述第二部分内表面1232与所述摄像模组100的光轴X之间的夹角为β,其中α的数值范围为3°~80°,β的数值范围为0°~10°,并且α>β。As shown in FIG. 12B, an angle between the first portion inner surface 1231 defined by the inner surface of the photosensitive element coupling portion 1211 and the optical axis X of the camera module 100 is α, and the top side extension portion The angle between the second portion inner surface 1232 defined by the inner surface of 1212 and the optical axis X of the camera module 100 is β, wherein the value of α ranges from 3° to 80°, and the value range of β is 0° to 10°, and α>β.
也就是说,所述顶侧延伸部1212的内表面定义的所述第二部分内表面1232与所述摄像模组100的光轴X之间的夹角β相对于所述感光元件结合部1211的内表面定义的所述第一部分内表面1231与所述摄像模组100的光轴X之间的夹角α具有更小的角度,从而使得所述顶侧延伸部1212的所述第二部分内表面1232以更大的斜率或沿垂直于所述感光元件13的方向地向上延伸,从而增大所述模塑基座12的所述顶表面124的面积。That is, the angle β between the second partial inner surface 1232 defined by the inner surface of the top side extension 1212 and the optical axis X of the camera module 100 is opposite to the photosensitive element coupling portion 1211. The angle α between the first partial inner surface 1231 defined by the inner surface and the optical axis X of the camera module 100 has a smaller angle, such that the second portion of the top side extension 1212 The inner surface 1232 extends upward with a greater slope or in a direction perpendicular to the photosensitive element 13, thereby increasing the area of the top surface 124 of the molded base 12.
如图12B所示,在本发明的这个优选实施例中,优选地,所述感光元件结合部1211的厚度H1数值范围为0.05mm~0.7mm,所述顶侧延伸部1212的厚度H2数值范围为0.02mm~0.6mm。As shown in Fig. 12B, in this preferred embodiment of the invention, preferably, the thickness H1 of the photosensitive element joint portion 1211 ranges from 0.05 mm to 0.7 mm, and the thickness H2 of the top side extension portion 1212 ranges. It is 0.02mm to 0.6mm.
如图13B中所示,当所述滤光元件14只在顶侧设置所述顶侧遮光层143时,其能够吸收一部分光线N51,但光线N52会被所述模塑基座和所述滤光元件的底表面反射而形成杂散光。As shown in FIG. 13B, when the filter element 14 is disposed only on the top side of the top side light shielding layer 143, it is capable of absorbing a portion of the light N51, but the light N52 is subjected to the molded base and the filter. The bottom surface of the light element reflects to form stray light.
当所述滤光元件14在设置有所述遮光层142和所述顶侧遮光层143时,如 图13A中所示,入射至所述滤光元件14的所述滤光元件主体141上表面的部分杂散光线L51被所述顶侧遮光层143吸收,从而起到阻挡一部分杂散光的目的。When the filter element 14 is provided with the light shielding layer 142 and the top side light shielding layer 143, as shown in FIG. 13A, the upper surface of the filter element body 141 is incident on the filter element 14. Part of the stray light L51 is absorbed by the top side light shielding layer 143, thereby serving to block a part of stray light.
当另一部分杂散光L52穿过所述滤光元件主体141的所述有效透光区域1411而入射至所述第一部分内表面1231时,会被所述模塑基座12的倾斜的所述第一部分内表面1231向上反射至所述遮光层142或经进一步被所述第二部分内表面1232进一步反射至所述遮光层142,从而被所述遮光层142吸收,从而不会进一步被反射而到达所述感光元件13,影响所述摄像模组100的成像质量。When another portion of the stray light L52 is incident on the first partial inner surface 1231 through the effective light transmitting region 1411 of the filter element body 141, the first portion of the tilt of the molded base 12 A portion of the inner surface 1231 is reflected upward to the light shielding layer 142 or further reflected by the second partial inner surface 1232 to the light shielding layer 142 to be absorbed by the light shielding layer 142 so as not to be further reflected. The photosensitive element 13 affects the imaging quality of the camera module 100.
相应地,所述遮光层142和所述滤光元件支架17位于所述滤光元件下方的内表面1702相邻近,所述滤光元件支架17位于所述滤光元件下方的内表面1702自所述遮光层142向下延伸,并且在所述遮光层142,所述滤光元件支架17的位于所述滤光元件下方的内表面1702,所述第一部分内表面1231和第二部分内表面1232之间,所述光窗122的外侧部分形成一抑光槽1221,所述抑光槽1221是一个用来抑止杂散光射出的空间。更具体地,如图13A所示,杂散光L52进入所述抑光槽1221之中,从而不能在所述抑光槽1221中射出。Correspondingly, the light shielding layer 142 and the filter element holder 17 are adjacent to an inner surface 1702 below the filter element, and the filter element holder 17 is located at an inner surface 1702 below the filter element. The light shielding layer 142 extends downward, and in the light shielding layer 142, the inner surface 1702 of the filter element holder 17 under the filter element, the first partial inner surface 1231 and the second partial inner surface Between 1232, the outer portion of the light window 122 forms a light-sinking groove 1221. The light-sinking groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG. 13A, the stray light L52 enters the light suppression groove 1221 so as not to be ejected in the light suppression groove 1221.
并且,可以理解的是,因为所述遮光层142和所述滤光元件支架17位于所述滤光元件下方的内表面1702相邻近,从而所述遮光层142有效地减小穿过所述滤光元件主体141而到达所述滤光元件下方的内表面1702和所述第二部分内表面1232的光线,从而避免入射至所述滤光元件下方的内表面1702和所述第二部分内表面1232的光线被反射而到达所述感光元件13形成杂散光并影响所述摄像模组100的成像质量。Moreover, it can be understood that because the light shielding layer 142 and the filter element holder 17 are located adjacent to the inner surface 1702 below the filter element, the light shielding layer 142 is effectively reduced through the Filtering the element body 141 to reach the inner surface 1702 under the filter element and the light of the second portion inner surface 1232, thereby avoiding incidence into the inner surface 1702 and the second portion below the filter element The light of the surface 1232 is reflected to reach the photosensitive element 13 to form stray light and affect the imaging quality of the camera module 100.
如图14A中所示,根据本发明的上述第三个优选实施例的一个变形实施方式,在这个实施例中,所述滤光元件14可以只在所述滤光元件主体141底侧设置有所述遮光层142,而顶侧可以没有上述顶侧遮光层143。As shown in FIG. 14A, according to a variant embodiment of the above third preferred embodiment of the present invention, in this embodiment, the filter element 14 may be provided only on the bottom side of the filter element body 141. The light shielding layer 142 may be absent from the top side light shielding layer 143.
如图14B中所示,根据本发明的上述第三个优选实施例的另一个变形实施方式,所述模塑基座12顶侧形成有顶侧凹槽125,所述滤光元件支架17组装于所述顶侧凹槽125,以使其位置下移,并且所述镜头30可以组装于所述模塑基座12顶侧。即所述模塑基座12通过多段式延伸而增大的所述顶表面124用于组装所述滤光元件支架17和所述镜头30。As shown in FIG. 14B, according to another modified embodiment of the above third preferred embodiment of the present invention, the top side of the molded base 12 is formed with a top side groove 125, and the filter element holder 17 is assembled. The top side groove 125 is moved downward so that the lens 30 can be assembled on the top side of the molded base 12. That is, the top surface 124 of the molded base 12 which is enlarged by the multi-stage extension is used to assemble the filter element holder 17 and the lens 30.
如图15至图17A所示是是根据本发明的第四个优选实施例的摄像模组100,其结构与上述第三个优选实施例类似,所述摄像模组100包括一感光组件10和 一镜头30。所述镜头30组装于所述感光组件形成一定焦摄像模组。可以理解的是,在另外的变形实施方式中,所述镜头也可以设置于一驱动器或一固定镜筒而形成一镜头组件,所述镜头组件组装于所述感光组件。15 to FIG. 17A is a camera module 100 according to a fourth preferred embodiment of the present invention, the structure of which is similar to the third preferred embodiment described above. The camera module 100 includes a photosensitive component 10 and A shot of 30. The lens 30 is assembled to the photosensitive component to form a fixed focus camera module. It can be understood that, in another modified embodiment, the lens may also be disposed on a driver or a fixed lens barrel to form a lens assembly, and the lens assembly is assembled to the photosensitive assembly.
对应地,所述感光组件10包括一电路板11,一模塑基座12,一感光元件13,一滤光元件14和一滤光元件支架17,所述模塑基座12包括一基座主体121,其一体地成型于所述电路板11和所述感光元件13并形成一光窗122,所述光窗122是一封闭空间,并且给所述感光元件13提供光线通路。所述模塑基座12包括一感光元件结合部1211和一顶侧延伸部1212,其呈多段式延伸,并且内表面1231和1232分别沿不同方向延伸,用来减小杂散光和增大所述模塑基座12的顶表面124的面积。Correspondingly, the photosensitive member 10 includes a circuit board 11, a molding base 12, a photosensitive element 13, a filter element 14 and a filter element holder 17, and the molding base 12 includes a base. The main body 121 is integrally formed on the circuit board 11 and the photosensitive member 13 and forms a light window 122. The light window 122 is a closed space and provides a light path to the photosensitive member 13. The molded base 12 includes a photosensitive element joint 1211 and a top side extension 1212 extending in multiple stages, and the inner surfaces 1231 and 1232 extend in different directions, respectively, for reducing stray light and increasing The area of the top surface 124 of the molded susceptor 12 is described.
所述滤光元件支架17组装于所述模塑基座12,并且具有顶侧的开窗171和一底侧安装槽173,所述滤光元件14以倒贴方式组装于所述底侧安装槽173。所述滤光元件14包括一滤光元件主体141和一遮光层142,所述遮光层142设置于所述滤光元件主体141的底侧。从而类似地,所述遮光层142能够起到减小到达所述感光元件13的杂散光的作用。The filter element holder 17 is assembled to the molding base 12 and has a top side opening window 171 and a bottom side mounting groove 173, and the filter element 14 is assembled in the bottom side mounting groove in a reversed manner. 173. The filter element 14 includes a filter element body 141 and a light shielding layer 142 disposed on a bottom side of the filter element body 141. Thus, similarly, the light shielding layer 142 can function to reduce stray light reaching the photosensitive element 13.
另外,所述镜头30包括承载件31和组装于所述承载件31的一个或多个镜片32,其中因为所述滤光元件14倒装于所述滤光元件支架17,使得所述滤光元件14不会凸起于所述滤光元件支架17上表面,所述镜头30的所述一个或多个镜片32中最底侧的镜片可以位置相对下移,从而减小与所述感光元件13之间的距离,从而能够减小所述摄像模组100的后焦距。In addition, the lens 30 includes a carrier 31 and one or more lenses 32 assembled to the carrier 31, wherein the filter is caused by the filter element 14 being flipped over the filter element holder 17 The element 14 does not protrude from the upper surface of the filter element holder 17, and the bottommost side lens of the one or more lenses 32 of the lens 30 can be positioned relatively downward, thereby reducing the photosensitive element The distance between the 13 is such that the back focus of the camera module 100 can be reduced.
如图17B中所示,当所述滤光元件14只在顶侧设置所述顶侧遮光层143时,其能够吸收一部分光线N61,但光线N62会被所述模塑基座和所述滤光元件的底表面反射而形成杂散光。As shown in FIG. 17B, when the filter element 14 is disposed only on the top side of the top side light shielding layer 143, it is capable of absorbing a portion of the light N61, but the light N62 is subjected to the molded base and the filter. The bottom surface of the light element reflects to form stray light.
当所述滤光元件14在底侧设置有所述遮光层142时,如图17A中所示,入射至所述滤光元件支架17上表面的部分杂散光线L61被反射而不会进入所述模塑基座12的所述光窗122,从而起到阻挡一部分杂散光的目的。When the filter element 14 is provided with the light shielding layer 142 on the bottom side, as shown in FIG. 17A, part of the stray light L61 incident on the upper surface of the filter element holder 17 is reflected without being entered. The light window 122 of the susceptor 12 is molded to serve the purpose of blocking a portion of stray light.
当另一部分杂散光L62穿过所述滤光元件主体141的所述有效透光区域1411而入射至所述第一部分内表面1231时,会被所述模塑基座12的倾斜的所述第一部分内表面1231向上反射至所述遮光层142或经进一步被所述第二部分内表面1232进一步反射至所述遮光层142,从而被所述遮光层142吸收,从而 不会进一步被反射而到达所述感光元件13,影响所述摄像模组100的成像质量。值得一提的是,所述滤光元件14还可包括所述滤光元件主体141顶侧的一顶侧遮光层143,从而增强减小杂散光的效果。When another portion of the stray light L62 is incident on the first partial inner surface 1231 through the effective light-transmitting region 1411 of the filter element body 141, the first portion of the tilt of the molded base 12 may be A portion of the inner surface 1231 is reflected upward to the light shielding layer 142 or further reflected by the second partial inner surface 1232 to the light shielding layer 142 to be absorbed by the light shielding layer 142 so as not to be further reflected. The photosensitive element 13 affects the imaging quality of the camera module 100. It is worth mentioning that the filter element 14 may further include a top side light shielding layer 143 on the top side of the filter element body 141 to enhance the effect of reducing stray light.
相应地,所述遮光层142和所述模塑基座12的所述第二部分内表面1232相邻近,所述模塑基座12的所述第二部分内表面1232自所述遮光层142向下延伸,并且在所述遮光层142,所述第一部分内表面1231和第二部分内表面1232之间,所述光窗122的外侧部分形成一抑光槽1221,所述抑光槽1221是一个用来抑止杂散光射出的空间。更具体地,如图17A所示,杂散光L62进入所述抑光槽1221之中,从而不能在所述抑光槽1221中射出。Correspondingly, the light shielding layer 142 is adjacent to the second partial inner surface 1232 of the molding base 12, and the second partial inner surface 1232 of the molding base 12 is from the light shielding layer 142 extending downward, and between the first portion inner surface 1231 and the second portion inner surface 1232 of the light shielding layer 142, an outer portion of the light window 122 forms a light suppression groove 1221, the light suppression groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG. 17A, the stray light L62 enters the light-sinking groove 1221 so as not to be ejected in the light-sinking groove 1221.
并且,可以理解的是,因为所述遮光层142和所述模塑基座12的所述第二部分内表面1232,从而所述遮光层142有效地减小穿过所述滤光元件主体141而到达所述第二部分内表面1232的光线,从而避免入射至所述第二部分内表面1232的光线被反射而到达所述感光元件13形成杂散光并影响所述摄像模组100的成像质量。Also, it can be understood that the light shielding layer 142 is effectively reduced through the filter element body 141 because of the light shielding layer 142 and the second portion inner surface 1232 of the molding base 12. And reaching the light of the inner surface 1232 of the second portion, thereby preventing the light incident on the inner surface 1232 of the second portion from being reflected to reach the photosensitive element 13 to form stray light and affect the imaging quality of the camera module 100. .
如图18所示,根据本发明的上述第四个实施例的另外一个变形实施方式,所述连接线15打线方向是从所述电路板11至所述感光元件13,从而使模塑工艺中所述光窗成型部214尽量不需要给所述连接线15提供的避让空间,并且使所述顶侧延伸部1212具有较大高度,以增大所述模塑基座12的所述顶表面124的面积。As shown in FIG. 18, according to another modified embodiment of the fourth embodiment of the present invention, the connecting line 15 is wired from the circuit board 11 to the photosensitive member 13, thereby molding the molding process. The light window forming portion 214 does not require the escape space provided to the connecting line 15 as much as possible, and the top side extending portion 1212 has a large height to increase the top of the molded base 12. The area of surface 124.
另外,所述滤光元件支架17顶侧形成一开窗171,所述滤光元件支架17顶侧部分174向内延伸的长度可以大于或等于所述遮光层142向内延伸的长度,这样,所述开窗171的面积可以不大于所述光线通路1420的面积,这样所述滤光元件支架17顶表面起到阻挡一部分杂散光L71的效果,从而不需要在所述滤光元件14顶侧设置所述顶侧遮光层143。杂散光L72可以通过所述遮光层142吸收。In addition, a top window 171 is formed on the top side of the filter element holder 17. The length of the top side portion 174 of the filter element holder 17 extending inward may be greater than or equal to the length of the light shielding layer 142 extending inwardly. The area of the window 171 may be no larger than the area of the light path 1420, such that the top surface of the filter element holder 17 has the effect of blocking a part of the stray light L71, so that the top side of the filter element 14 is not required. The top side light shielding layer 143 is provided. The stray light L72 can be absorbed by the light shielding layer 142.
如图19所示,根据本发明的上述第四个实施例的另外一个变形实施方式,所述感光组件10包括一电路板11,一模塑基座12,一感光元件13,一滤光元件14,一滤光元件支架17和一挡框18。所述模塑基座12与所述电路板,所述感光元件13和所述挡框18一体结合,所述滤光元件14组装于所述滤光元件支架17,所述滤光元件支架17组装于所述模塑基座12的顶侧。所述滤光元件14 的所述遮光层142,与上述第四个优选实施例类似,设置于其滤光元件主体142的底侧,能起到减小杂散光的作用。As shown in FIG. 19, according to another modified embodiment of the fourth embodiment of the present invention, the photosensitive member 10 includes a circuit board 11, a molding base 12, a photosensitive element 13, and a filter element. 14. A filter element holder 17 and a stop frame 18. The molded base 12 is integrally coupled with the circuit board, the photosensitive element 13 and the stop frame 18, and the filter element 14 is assembled to the filter element holder 17, and the filter element holder 17 It is assembled to the top side of the molded base 12. The light shielding layer 142 of the filter element 14 is disposed on the bottom side of the filter element body 142 similarly to the fourth preferred embodiment described above, and functions to reduce stray light.
环形的所述挡框18被设置于所述感光元件13上,用于在模塑工艺中使所述光窗成型部214压合于所述挡框18,防止流体的所述模塑材料16流入至所述感光元件13的所述感光区131,其中所述模塑基座12一体成型于所述电路板,所述感光元件13和所述挡框18,所述挡框18在优选实施例可以是胶水,其可以具有预定弹性,如弹性模量范围为0.1Gpa-1Gpa。The annular frame 18 is disposed on the photosensitive member 13 for pressing the light window forming portion 214 to the frame 18 in a molding process to prevent the molding material 16 of fluid. Flowing into the photosensitive region 131 of the photosensitive member 13, wherein the molding base 12 is integrally formed on the circuit board, the photosensitive member 13 and the frame 18, and the frame 18 is preferably implemented An example may be glue, which may have a predetermined elasticity, such as a modulus of elasticity ranging from 0.1 GPa to 1 Gpa.
所述模塑基座12的一基座主体121包括位于所述光窗122周围的一感光元件结合部1211和一顶侧延伸部1212,以及所述感光元件结合部1211底侧所述感光元件13周围和所述电路板11顶侧的一电路板结合部1213。所述感光元件结合部1211一体地结合于所述电路板11,所述感光元件13和所述挡框18,并且具有从所述挡框18倾斜延伸的第一部分内表面1231,所述顶侧延伸部1212具有从所述第一部分内表面1231转向地延伸的第二部分内表面1232,从而这样的结构使倾斜的所述第一部分内表面1231的反光作用能够减少杂散光,转向地延伸的第二部分内表面1232使得所述顶侧延伸部1212的顶表面具有更大安装面积,并且两部分内表面与光轴X之间的夹角与前述实施例类似。可以理解的是,这个实施例的所述挡框18也可以应用至本发明的其他实施例中。A base body 121 of the molded base 12 includes a photosensitive element joint portion 1211 and a top side extension portion 1212 around the light window 122, and the photosensitive element on the bottom side of the photosensitive element joint portion 1211. A circuit board joint portion 1213 around the top side of the circuit board 11. The photosensitive element coupling portion 1211 is integrally coupled to the circuit board 11, the photosensitive member 13 and the stop frame 18, and has a first partial inner surface 1231 extending obliquely from the frame 18, the top side The extension portion 1212 has a second partial inner surface 1232 that is steered from the first partial inner surface 1231 so that the structure enables the reflective action of the inclined first partial inner surface 1231 to reduce stray light, and to extend the steering The two-part inner surface 1232 has a top mounting surface of the top side extension 1212 having a larger mounting area, and the angle between the inner surface of the two portions and the optical axis X is similar to the previous embodiment. It will be appreciated that the block 18 of this embodiment can also be applied to other embodiments of the invention.
本领域的技术人员应理解,上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本发明的实施方式可以有任何变形或修改。Those skilled in the art should understand that the embodiments of the present invention described in the above description and the accompanying drawings are only by way of illustration and not limitation. The object of the invention has been achieved completely and efficiently. The present invention has been shown and described with respect to the embodiments of the present invention, and the embodiments of the present invention may be modified or modified without departing from the principles.

Claims (23)

  1. 一感光组件,其特征在于,包括:A photosensitive component, comprising:
    一电路板;a circuit board;
    一感光元件,所述感光元件可工作地连接于所述电路板;a photosensitive element operatively coupled to the circuit board;
    一模塑基座,所述模塑基座一体地结合于所述电路板和所述感光元件并形成一光窗;和a molding base integrally bonded to the circuit board and the photosensitive member and forming a light window; and
    一滤光元件,所述滤光元件包括一滤光元件主体和设置于所述滤光元件主体底侧的一遮光层,所述遮光层形成用于使光线进入所述光窗的一光线通路并且减少到达所述感光元件的杂散光。a filter element, the filter element comprising a filter element body and a light shielding layer disposed on a bottom side of the filter element body, the light shielding layer forming a light path for allowing light to enter the light window And the stray light reaching the photosensitive element is reduced.
  2. 根据权利要求1所述的感光组件,其中所述滤光元件组装于所述模塑基座的顶侧,其中所述模塑基座具有从所述感光元件一体地延伸的一倾斜内表面,所述倾斜内表面和所述遮光层之间形成一抑光槽。The photosensitive member according to claim 1, wherein said filter member is assembled to a top side of said molded base, wherein said molded base has an inclined inner surface integrally extending from said photosensitive member, A light suppression groove is formed between the inclined inner surface and the light shielding layer.
  3. 根据权利要求1所述的感光组件,其中所述模塑基座具有一顶侧凹槽,所述滤光元件组装于所述模塑基座的所述顶侧凹槽,其中所述模塑基座具有从所述感光元件一体地倾斜地延伸的位于所述滤光元件底侧的一底侧内表面,其中所述底侧内表面和所述遮光层之间形成一抑光槽。The photosensitive member according to claim 1, wherein said molded base has a top side groove, and said filter element is assembled to said top side groove of said molded base, wherein said molding The susceptor has a bottom side inner surface on the bottom side of the filter element extending obliquely integrally from the photosensitive element, wherein a light suppression groove is formed between the bottom side inner surface and the light shielding layer.
  4. 根据权利要求1所述的感光组件,其中所述滤光元件组装于所述模塑基座的顶侧,其中所述模塑基座具有邻近所述感光元件的第一部分内表面和远离所述感光元件的连接于所述第一部分内表面的第二部分内表面,其中所述第一部分内表面和所述感光组件的光轴之间具有夹角α,所述第二部分内表面和所述感光组件的光轴之间具有夹角β,其中β<α。The photosensitive member according to claim 1, wherein said filter element is assembled to a top side of said molded base, wherein said molded base has a first portion inner surface adjacent said photosensitive member and away from said a second portion of the inner surface of the photosensitive member connected to the inner surface of the first portion, wherein the first portion inner surface and the optical axis of the photosensitive member have an angle α, the second portion inner surface and the The optical axes of the photosensitive members have an angle β between them, where β < α.
  5. 根据权利要求4所述的感光组件,其中α的数值范围是3°~80°,β的数值范围是0°~20°。The photosensitive member according to claim 4, wherein a value of α ranges from 3 to 80, and a value of β ranges from 0 to 20 .
  6. 根据权利要求4所述的感光组件,其中模塑基座包括一感光元件结合部和一顶侧延伸部,所述感光元件结合部从所述感光元件一体延伸的内表面定义 所述第一部分内表面,所述顶侧延伸部一体地延伸于所述感光元件结合部并且其表面定义所述第二部分内表面,所述第二部分内表面一体地延伸于所述第一部分内表面。The photosensitive member according to claim 4, wherein the molded base includes a photosensitive member joint portion and a top side extending portion, and the photosensitive member joint portion defines an inner surface integrally extending from the photosensitive member to define the first portion a surface, the top side extension integrally extending over the photosensitive element joint and a surface defining the second portion inner surface, the second portion inner surface integrally extending from the first portion inner surface.
  7. 根据权利要求6所述的感光组件,其中所述顶侧延伸部厚度范围为0.02mm~0.6mm,所述感光元件结合部厚度范围为0.05~0.7mm。The photosensitive member according to claim 6, wherein said top side extending portion has a thickness ranging from 0.02 mm to 0.6 mm, and said photosensitive member joint portion has a thickness ranging from 0.05 to 0.7 mm.
  8. 根据权利要求6所述的感光组件,其中所述第一部分内表面,所述第二部分内表面与所述遮光层之间形成一抑光槽。The photosensitive member according to claim 6, wherein said first portion inner surface, said second portion inner surface and said light shielding layer form a light suppression groove.
  9. 根据权利要求1所述的感光组件,其中还包括一滤光元件支架,所述滤光元件组装于所述滤光元件支架,其中所述滤光元件支架贴装于所述模塑基座的顶侧。The photosensitive member according to claim 1, further comprising a filter element holder, said filter element being assembled to said filter element holder, wherein said filter element holder is attached to said molded base Top side.
  10. 根据权利要求9所述的感光组件,其中所述模塑基座具有邻近所述感光元件的第一部分内表面和远离所述感光元件的连接于所述第一部分内表面的第二部分内表面,其中所述第一部分内表面和所述感光组件的光轴之间具有夹角α,所述第二部分内表面和所述感光组件的光轴之间具有夹角β,其中β<α。The photosensitive member according to claim 9, wherein said molded base has a first portion inner surface adjacent said photosensitive member and a second portion inner surface connected to said photosensitive portion from an inner surface of said first portion, Wherein the inner surface of the first portion and the optical axis of the photosensitive member have an angle α, and an angle β between the inner surface of the second portion and the optical axis of the photosensitive member, wherein β < α.
  11. 根据权利要求10所述的感光组件,其中α的数值范围是3°~80°,β的数值范围是0°~20°。The photosensitive member according to claim 10, wherein a value of α ranges from 3 to 80, and a value of β ranges from 0 to 20 .
  12. 根据权利要求10所述的感光组件,其中模塑基座包括一感光元件结合部和一顶侧延伸部,所述感光元件结合部从所述感光元件一体延伸的内表面定义所述第一部分内表面,所述顶侧延伸部一体地延伸于所述感光元件结合部并且其表面定义所述第二部分内表面,所述第二部分内表面一体地延伸于所述第一部分内表面。The photosensitive member according to claim 10, wherein the molded base comprises a photosensitive member joint portion and a top side extending portion, and the photosensitive member joint portion defines an inner surface integrally extending from the photosensitive member to define the first portion a surface, the top side extension integrally extending over the photosensitive element joint and a surface defining the second portion inner surface, the second portion inner surface integrally extending from the first portion inner surface.
  13. 根据权利要求12所述的感光组件,其中所述顶侧延伸部厚度范围为0.02 mm~0.6mm,所述感光元件结合部厚度范围为0.05~0.7mm。The photosensitive member according to claim 12, wherein said top side extension has a thickness ranging from 0.02 mm to 0.6 mm, and said photosensitive member joint portion has a thickness ranging from 0.05 to 0.7 mm.
  14. 根据权利要求10至13中任一所述的感光组件,其中所述滤光元件支 架具有一顶侧安装槽,所述滤光元件组装于所述顶侧安装槽。The photosensitive member according to any one of claims 10 to 13, wherein said filter element holder has a top side mounting groove, and said filter element is assembled to said top side mounting groove.
  15. 根据权利要求10至13中任一所述的感光组件,其中所述滤光元件支架具有一底侧安装槽,所述滤光元件组装于所述底侧安装槽。The photosensitive member according to any one of claims 10 to 13, wherein said filter element holder has a bottom side mounting groove, and said filter element is assembled to said bottom side mounting groove.
  16. 根据权利要求14所述的感光组件,其中所述滤光元件支架的位于所述滤光元件下方的内表面,所述第一部分内表面,所述第二部分内表面与所述遮光层之间形成一抑光槽。The photosensitive member according to claim 14, wherein an inner surface of said filter element holder below said filter element, said first partial inner surface, said second partial inner surface and said light shielding layer A light suppression groove is formed.
  17. 其根据权利要求15所述的感光组件,其中所述第一部分内表面,所述第二部分内表面与所述遮光层之间形成的一抑光槽。The photosensitive member according to claim 15, wherein said first portion inner surface, a light suppressing groove formed between said second portion inner surface and said light shielding layer.
  18. 根据权利要求1至13中任一所述的感光组件,其中还包括一顶侧的遮光层,其设置在所述滤光元件主体的顶表面。The photosensitive member according to any one of claims 1 to 13, further comprising a top side light shielding layer disposed on a top surface of said filter element body.
  19. 根据权利要求18所述的感光组件,其中所述遮光层和所述模塑基座的内表面之间夹角γ是锐角或直角。The photosensitive member according to claim 18, wherein an angle γ between said light shielding layer and an inner surface of said molded base is an acute angle or a right angle.
  20. 根据权利要求1至13中任一所述的感光组件,其中所述电路板还包括位于其底侧的多个电子元器件,所述感光组件包括位于所述电路板底侧的一底侧模塑部,其包埋所述电子元器件。The photosensitive member according to any one of claims 1 to 13, wherein said circuit board further comprises a plurality of electronic components on a bottom side thereof, said photosensitive member comprising a bottom side mold on a bottom side of said circuit board a plastic part that embeds the electronic component.
  21. 一摄像模组,其特征在于,包括:一镜头和根据权利要求1至20中任一所述的感光组件,其中所述镜头位于所述感光组件的所述感光元件的感光路径。A camera module, comprising: a lens and a photosensitive member according to any one of claims 1 to 20, wherein the lens is located in a photosensitive path of the photosensitive member of the photosensitive member.
  22. 一电子设备,其特征在于,包括一设备主体和安装于所述设备主体的根据权利要求21所述的一个或多个所述摄像模组。An electronic device comprising: a device body and one or more of the camera modules according to claim 21 mounted to the device body.
  23. 根据权利要求22所述的电子设备,其中所述电子设备选自手机、电脑、电视机、智能可穿载设备、交通工具、照相机和监控装置中的一种。The electronic device of claim 22, wherein the electronic device is one selected from the group consisting of a cell phone, a computer, a television, an intelligent loadable device, a vehicle, a camera, and a monitoring device.
PCT/CN2018/106352 2017-09-28 2018-09-19 Camera module for reducing stray light and photosensitive assembly thereof, and electronic device WO2019062610A1 (en)

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CN112399036B (en) * 2019-08-15 2022-07-26 宁波舜宇光电信息有限公司 Method for manufacturing optical filter, optical filter and camera module
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