TWI804052B - Non-soldering type sensor lens - Google Patents
Non-soldering type sensor lens Download PDFInfo
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Abstract
Description
本發明涉及一種感測鏡頭,尤其涉及一種無焊接式感測鏡頭。The invention relates to a sensing lens, in particular to a welding-free sensing lens.
現有的感測鏡頭都是將一感測器封裝結構通過焊接方式固定於一電路載板上,而後再將光學模組安裝於所述電路載板所製成。然而,現有感測器頭的架構將受到所述感測器封裝結構的侷限,而難以進一步被改良。舉例來說,由於現有感測鏡頭中的所述感測器封裝結構需要通過焊接方式來固定於所述電路載板,因而使得所述感測器封裝結構之中的元件連接還需要能夠符合耐高溫的要求。The existing sensing lens is made by fixing a sensor packaging structure on a circuit carrier by welding, and then installing the optical module on the circuit carrier. However, the structure of the existing sensor head is limited by the sensor packaging structure, and it is difficult to be further improved. For example, since the sensor package structure in the existing sensing lens needs to be fixed on the circuit carrier by welding, the component connection in the sensor package structure also needs to be able to meet the requirements of durability. high temperature requirements.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventor believes that the above-mentioned defects can be improved, Naite devoted himself to research and combined with the application of scientific principles, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned defects.
本發明實施例在於提供一種無焊接式感測鏡頭,其能有效地改善現有感測鏡頭所可能產生的缺陷。An embodiment of the present invention is to provide a solderless sensing lens, which can effectively improve the possible defects of the existing sensing lens.
本發明實施例公開一種無焊接式感測鏡頭,其包括:一電路載板,包含有一第一板面與位於所述第一板面相反側的一第二板面;其中,所述電路載板於所述第一板面上包含有一固晶區、及位於所述固晶區外側的多個焊接墊;一光學模組,包含:一框架,固定於所述電路載板的所述第一板面;至少一個透鏡,安裝於所述框架內,並且至少一個所述透鏡的中心軸線沿經所述固晶區;及一濾波片,安裝於所述框架內且位於所述中心軸線上;其中,所述框架與所述濾波片共同包圍形成有一配置空間,而所述固晶區與多個所述焊接墊位於所述配置空間內;一感測晶片,包含有位於其頂面的一感測區域及位於所述感測區域外側的多個連接墊;其中,所述感測晶片設置於所述固晶區上,所述感測區域位於所述中心軸線上;一延展牆體,設置於所述第一板面且圍繞於所述感測晶片的外側;其中,所述延展牆體具有一延展頂面,並且所述延展頂面與所述感測晶片的所述頂面具有不大於50微米的一段差;多條導線,分別電性耦接多個所述連接墊至多個所述焊接墊;一支撐膠層,呈環狀且設置於所述延展頂面與所述感測晶片的所述頂面上,並且所述支撐膠層位於所述感測區域的外側;以及一透光片,其於相反兩個表面上各鍍設有一抗反射膜並定義有一內表面與一外表面;所述透光片的所述內表面設置於所述支撐膠層上,以使所述透光片、所述支撐膠層、及所述感測晶片的所述頂面共同包圍形成有一封閉空間;其中,所述感測區域位於所述封閉空間內。The embodiment of the present invention discloses a solderless sensing lens, which includes: a circuit carrier board, including a first board surface and a second board surface located on the opposite side of the first board surface; wherein, the circuit carrier The board includes a crystal-bonding area on the first board surface, and a plurality of welding pads located outside the crystal-bonding area; an optical module includes: a frame, fixed on the first board of the circuit carrier A plate surface; at least one lens installed in the frame, and the central axis of at least one lens passes through the crystal bonding area; and a filter installed in the frame and located on the central axis ; Wherein, the frame and the filter are jointly surrounded to form a configuration space, and the crystal-bonding area and a plurality of the welding pads are located in the configuration space; a sensing chip includes a sensor chip located on its top surface A sensing area and a plurality of connection pads located outside the sensing area; wherein, the sensing chip is disposed on the die-bonding area, and the sensing area is located on the central axis; an extended wall , arranged on the first board surface and surrounding the outer side of the sensing chip; wherein, the extended wall has an extended top surface, and the extended top surface and the top surface of the sensing chip There is a step difference not greater than 50 microns; a plurality of wires are respectively electrically coupled to a plurality of the connection pads to a plurality of the welding pads; a supporting adhesive layer is ring-shaped and arranged on the extended top surface and the said welding pads Sensing the top surface of the chip, and the supporting adhesive layer is located outside the sensing area; and a light-transmitting sheet, which is coated with an anti-reflection film on the opposite two surfaces and defines an inner surface and an outer surface; the inner surface of the light-transmissive sheet is disposed on the support adhesive layer, so that the light-transmissive sheet, the support adhesive layer, and the top surface of the sensing chip are in common The enclosure forms a closed space; wherein, the sensing area is located in the closed space.
本發明實施例也公開一種無焊接式感測鏡頭,其包括:一電路載板,包含有一第一板面與位於所述第一板面相反側的一第二板面;其中,所述電路載板於所述第一板面上包含有一固晶區、及位於所述固晶區外側的多個焊接墊;一感測晶片,包含有位於其頂面的一感測區域及位於所述感測區域外側的多個連接墊;其中,所述感測晶片設置於所述固晶區上,所述感測區域位於所述中心軸線上;一低折射率透明層,形成於所述感測晶片的所述頂面,以使所述感測區域埋置於所述低折射率透明層內;多條導線,分別電性耦接多個所述連接墊至多個所述焊接墊;一模製膠體,形成於所述第一板面上,並且多條所述導線與所述感測晶片埋置於所述模製膠體內,而所述低折射率透明層裸露於所述模製膠體的上表面之外;一支撐膠層,呈環狀且設置於所述模製膠體的所述上表面並且圍繞在所述低折射率透明層的外側;一透光片,其於相反兩個表面上各鍍設有一抗反射膜並定義有一內表面與一外表面;所述透光片的所述內表面設置於所述支撐膠層上,以使所述透光片、所述支撐膠層、及所述低折射率透明層共同包圍形成有一封閉空間;以及一光學模組,對應於所述感測區域設置。The embodiment of the present invention also discloses a solderless sensing lens, which includes: a circuit carrier board, including a first board surface and a second board surface located on the opposite side of the first board surface; wherein the circuit The carrier board includes a crystal-bonding area on the first board surface and a plurality of welding pads located outside the crystal-bonding area; a sensing chip includes a sensing area on its top surface and a sensing area located on the A plurality of connection pads outside the sensing area; wherein, the sensing chip is disposed on the die-bonding area, and the sensing area is located on the central axis; a low-refractive-index transparent layer is formed on the sensing area Measuring the top surface of the wafer, so that the sensing area is buried in the low-refractive index transparent layer; a plurality of wires are respectively electrically coupled to a plurality of the connection pads to a plurality of the welding pads; a molding colloid, formed on the first board surface, and a plurality of the wires and the sensing chip are embedded in the molding colloid, and the low refractive index transparent layer is exposed on the molding colloid Outside the upper surface of the colloid; a supporting adhesive layer, which is ring-shaped and arranged on the upper surface of the molded colloid and surrounds the outside of the low-refractive index transparent layer; a light-transmitting sheet, which is on the opposite side Each surface is coated with an anti-reflection film and defines an inner surface and an outer surface; the inner surface of the transparent sheet is arranged on the support glue layer, so that the transparent sheet, the support The adhesive layer and the low-refractive-index transparent layer jointly surround and form a closed space; and an optical module is arranged corresponding to the sensing area.
綜上所述,本發明實施例所公開的無焊接式感測鏡頭,其通過上述多個元件之間的搭配,以使其整體架構實現無須焊接的效果,據以降低位於所述配置空間內的元件(如:所述感測晶片、所述延展牆體、多條所述導線、所述支撐膠層、所述透光片、及所述密封膠體之間的連接)所需的耐高溫要求,進而降低所述無焊接式感測鏡頭的材料成本、並提升產品的良率。進一步地說,所述無焊接式感測鏡頭因為不用經過迴焊流程,所以也就不用經過相對應的測試流程,進而有效地簡化了整個生產流程,以能提升所述無焊接式感測鏡頭的生產效率。To sum up, the non-welded sensing lens disclosed in the embodiment of the present invention, through the collocation of the above-mentioned multiple components, makes its overall structure realize the effect of no welding, thereby reducing the need for welding in the configuration space. The high temperature resistance required by the components (such as: the sensing chip, the extended wall, the multiple wires, the supporting adhesive layer, the light-transmitting sheet, and the connection between the sealing adhesive) Requirements, thereby reducing the material cost of the solderless sensing lens, and improving the yield of products. Furthermore, since the solderless sensing lens does not need to go through the reflow process, it does not need to go through the corresponding testing process, thereby effectively simplifying the entire production process, so as to improve the performance of the solderless sensing lens. production efficiency.
再者,所述無焊接式感測鏡頭於本實施例中通過所述延展牆體搭配於所述感測晶片與所述支撐膠層(或者,通過所述感測晶片將所述感測區域埋置於所述低折射率透明層內,以使其能夠搭配所述模製膠體),據以使得較小尺寸的所述感測晶片能夠被採用且配置於內,進而符合所述感測晶片微小化的業界趨勢。Furthermore, in this embodiment, the solderless sensing lens is matched with the sensing chip and the supporting adhesive layer through the extension wall (or, the sensing region is connected to the sensor through the sensing chip). Embedded in the low-refractive-index transparent layer, so that it can match the molding colloid), so that the sensing chip with a smaller size can be used and configured inside, and then conform to the sensing The industry trend of chip miniaturization.
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than to make any statement on the scope of protection of the present invention. limit.
以下是通過特定的具體實施例來說明本發明所公開有關“無焊接式感測鏡頭”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is an illustration of the implementation of the "non-soldering sensor lens" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.
[實施例一][Example 1]
請參閱圖1至圖5所示,其為本發明的實施例一。如圖1和圖2所示,本實施例公開一種無焊接式感測鏡頭100,其內未包含有任何封裝結構;也就是說,具有封裝結構的任何感測鏡頭或是需要焊接製成的任何感測鏡頭,其都不同於本實施例所指的所述無焊接式感測鏡頭100。Please refer to FIG. 1 to FIG. 5 , which are the first embodiment of the present invention. As shown in Figures 1 and 2, this embodiment discloses a
如圖3和圖4所示,所述無焊接式感測鏡頭100包含有一電路載板1、固定於所述電路載板1的一光學模組2、安裝於所述電路載板1的至少一個被動電子元件3、安裝於所述電路載板1的一感測晶片4、形成於所述電路載板1且圍繞在所述感測晶片4外側的一延展牆體5、電性耦接所述感測晶片4與所述電路載板1的多條導線W、設置於所述感測晶片4上的一支撐膠層6、設置於所述支撐膠層6上的一透光片7、形成於所述透光片7的一遮光層8、及一密封膠體9a。As shown in FIGS. 3 and 4 , the
其中,所述無焊接式感測鏡頭100於本實施例中雖是以包含有上述元件來做一說明,但所述無焊接式感測鏡頭100也可以依據設計需求而加以調整變化。舉例來說,在本發明未繪示的其他實施例中,所述無焊接式感測鏡頭100也可以省略所述被動電子元件3、所述遮光層8、及所述密封膠體9a的至少其中之一。Wherein, although the
所述電路載板1於本實施例中可以是印刷電路板(printed circuit board,PCB)或軟式電路板(flexible printed circuit,FPC),但本發明不受限於此。其中,所述電路載板1具有一第一板面11與位於所述第一板面11相反側的一第二板面12,所述電路載板1未於所述第一板面11形成有任何凹槽,並且所述電路載板1於所述第一板面11上包含有一固晶區13、及位於所述固晶區13外側的多個焊接墊14。In this embodiment, the circuit carrier 1 may be a printed circuit board (printed circuit board, PCB) or a flexible printed circuit board (flexible printed circuit, FPC), but the invention is not limited thereto. Wherein, the circuit carrier 1 has a
此外,如圖1和圖2所示,所述電路載板1也可進一步設置有一電連接器15,並且所述電路載板1能通過多個所述電連接器15而可分離地連接於一電子裝置(圖中未示出)上,據以使所述無焊接式感測鏡頭100能被安裝且電性連接於所述電子裝置。In addition, as shown in FIG. 1 and FIG. 2, the circuit carrier 1 may be further provided with an
如圖3至圖5所示,所述光學模組2包含一框架21、安裝於所述框架21內的至少一個透鏡22、及安裝於所述框架21內的一濾波片23。其中,所述框架21(的底緣)固定於所述電路載板1的所述第一板面11,至少一個所述透鏡22的中心軸線L沿經所述固晶區13,並且所述濾波片23位於所述中心軸線L上。至少一個所述被動電子元件3安裝於所述電路載板1的所述第一板面11、並鄰近於所述框架21。再者,至少一個所述被動電子元件3的數量可以依據設計需求而加以調整變化,而所述電路載板1的外側緣於本實施例中則是可以局部(如:三個邊緣)切齊於所述框架21,但本發明不以此為限。As shown in FIGS. 3 to 5 , the
更詳細地說,至少一個所述透鏡22的數量於本實施例中為多個,並且多個所述透鏡22的所述中心軸線L大致彼此重疊,而所述濾波片23的位置位於多個所述透鏡22與所述固晶區13之間。其中,所述框架21與所述濾波片23共同包圍形成有一配置空間24,並且所述固晶區13、多個所述焊接墊14、至少一個所述被動電子元件3、所述感測晶片4、所述延展牆體5、多條所述導線W、所述支撐膠層6、所述透光片7、所述遮光層8、及所述密封膠體9a皆位於所述配置空間24內。More specifically, the number of at least one
所述感測晶片4於本實施例中是以一影像感測晶片來說明,但本發明不以此為限。其中,所述感測晶片4設置於所述電路載板1的所述固晶區13內(如:所述感測晶片4的底面42是面向所述固晶區13)並位於所述中心軸線L上。The
需額外說明的是,所述無焊接式感測鏡頭100於本實施例中是包含有一固晶膠A1,並且所述感測晶片4通過所述固晶膠A1而固定於所述固晶區13上(如:所述感測晶片4的所述底面42與所述固晶區13通過所述固晶膠A1而彼此黏接固定),但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述固晶膠A1也可以被省略或是以其他元件取代。It should be noted that the
再者,所述感測晶片4的頂面41包含有位於所述中心軸線L上的一感測區域411及位於所述感測區域411外側的多個連接墊412。其中,所述感測區域411至所述感測晶片4的外側面43之間於本實施例中是相隔有小於300微米的一距離D43。再者,所述濾波片23的選用是必須對應於所述感測晶片4的所述感測區域411。舉例來說,當一光線穿過至少一個所述透鏡22時,所述濾波片23用以供對應於所述感測區域411的所述光線的波段能夠穿過。Furthermore, the
於本實施例中,多個所述焊接墊14呈環狀排列,多個所述連接墊412也是呈環狀排列地配置於所述頂面41並圍繞所述感測區域411,並且多個所述連接墊412的位置較佳是分別對應於多個所述焊接墊14的位置,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,多個所述連接墊412排成兩列且分佈於所述感測區域411的相反兩側,而多個所述焊接墊14也可以是排成兩列且分佈於所述固晶區13的相反兩側,並且多個所述連接墊412的位置分別對應於多個所述焊接墊14的位置。In this embodiment, a plurality of the
多條所述導線W分別電性耦接多個所述焊接墊14至多個所述連接墊412;也就是說,每條所述導線W是以打線方式形成,以使其兩端分別連接於一個所述焊接墊14與其所對應的所述連接墊412。A plurality of the wires W are respectively electrically coupled to the plurality of the
所述延展牆體5設置於所述電路載板1的所述第一板面11且圍繞於所述感測晶片4的外側,並且所述延展牆體5與所述感測晶片4(如:所述外側面43)之間形成有一間隙G。其中,所述間隙G內充填空氣,並且所述間隙G的寬度於本實施例中是以介於50微米~100微米來說明,但本發明不受限於此。The extension wall 5 is arranged on the
更詳細地說,所述延展牆體5於本實施例中呈環狀且可以是一阻焊層(solder mask)、一光阻層、或一環氧樹脂層。此外,所述延展牆體5的材質也可以是一膠體 (adhesive)、聚醯亞胺(polymide)、苯環丁烯 (butylcyclobutene,BCB)、聚對二甲苯(parylene)、萘聚合物(polynaphthalenes)、碳化氟(fluorocarbons)、丙烯酸酯(acrylates)、光阻材料 (photoresist)、陶瓷 (ceramic)、無機材料 (如:氧化矽、氮化矽、氮氧化矽、金屬氧化物或前述之組合)、或是其他合適的絕緣材料。In more detail, the extension wall 5 is ring-shaped in this embodiment and may be a solder mask, a photoresist layer, or an epoxy resin layer. In addition, the material of the extended wall 5 can also be an adhesive, polymide, butylcyclobutene (BCB), parylene, polynaphthalenes ), fluorocarbons, acrylates, photoresists, ceramics, inorganic materials (such as silicon oxide, silicon nitride, silicon oxynitride, metal oxides, or a combination of the foregoing) , or other suitable insulating materials.
再者,所述延展牆體5具有一延展頂面51,所述延展頂面51與所述感測晶片4的所述頂面41具有不大於50微米(μm)的一段差D52。換個角度來說,在本發明未繪示的其他實施例中,所述延展頂面51可以是大致切齊於所述感測晶片4的所述頂面41(也就是,所述段差D52大致為0)。Furthermore, the extended wall body 5 has an extended
所述支撐膠層6呈環狀且設置於所述延展頂面51與所述感測晶片4的所述頂面41;其中,所述支撐膠層6圍繞於(或位於)所述感測區域411的外側,並且所述支撐膠層6跨過所述間隙G且其局部位於所述間隙G內,而任一個所述連接墊412及其所相連的局部所述導線W皆埋置於所述支撐膠層6內,但本發明不受限於此。The supporting
所述透光片7於相反兩個表面上各鍍設有一抗反射膜7a並定義有一內表面71與一外表面72。所述透光片7的所述內表面71設置於所述支撐膠層6上,以使所述透光片7、所述支撐膠層6、及所述感測晶片4的所述頂面41共同包圍形成有一封閉空間S。其中,所述感測區域411位於所述封閉空間S內且面向所述透光片7。The light-transmitting
所述遮光層8形成於所述透光片7的所述外表面72,並且所述頂遮光層8呈環狀且形成有一開口81,而所述開口81位於所述感測區域411的上方。其中,所述遮光層8於所述外表面72上的分佈方式可以視設計需求而加以調整變化。據此,所述遮光層8用來有效地降低因為外部光線穿過所述透光片7而對所述感測晶片4所造成的眩光現象。The light-
所述密封膠體9a形成於所述電路載板1的所述第一板面11,並且所述密封膠體9a圍繞於所述延展牆體5、所述支撐膠層6、及所述透光片7。其中,所述密封膠體9a於本實施例中呈不透光狀且為液態膠體(liquid compound),並且至少一個所述被動電子元件3的至少部分、多個所述焊接墊14、及每條所述導線W的部分皆埋置於所述密封膠體9a內,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述密封膠體9a可以是呈透光狀。The
依上所述,所述無焊接式感測鏡頭100於本實施例中通過上述多個元件之間的搭配,以使其整體架構實現無須焊接的效果,據以降低位於所述配置空間24內的元件(如:所述感測晶片4、所述延展牆體5、多條所述導線W、所述支撐膠層6、所述透光片7、及所述密封膠體9a之間的連接)所需的耐高溫要求,進而降低所述無焊接式感測鏡頭100的材料成本、並提升產品的良率。進一步地說,所述無焊接式感測鏡頭100因為不用經過迴焊流程,所以也就不用經過相對應的測試流程,進而有效地簡化了整個生產流程,以能提升所述無焊接式感測鏡頭100的生產效率。According to the above, in this embodiment, the
再者,所述無焊接式感測鏡頭100於本實施例中通過所述延展牆體5搭配於所述感測晶片4與所述支撐膠層6,據以使得較小尺寸的所述感測晶片4(如:所述距離D43小於300微米)能夠被採用且配置於內,進而符合所述感測晶片4微小化的業界趨勢。Moreover, the
[實施例二][Example 2]
請參閱圖6和圖7所示,其為本發明的實施例二。由於本實施例類似於上述實施例一,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例一的差異大致說明如下:Please refer to FIG. 6 and FIG. 7 , which is the second embodiment of the present invention. Since this embodiment is similar to the first embodiment above, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the first embodiment above are roughly described as follows:
於本實施例中,所述延展頂面51是大致切齊於所述感測晶片4的所述頂面41。再者,所述無焊接式感測鏡頭100包含有位於所述配置空間24內的一環形擋牆10,並且所述環形擋牆10設置於所述第一板面11且圍繞於多條所述導線W的外側,所述密封膠體9a位於所述環形擋牆10的內側。也就是說,所述環形擋牆10形成了所述密封膠體9a的流動邊界,並且所述環形擋牆10對應於所述第一板面11的一高度位置,其高於所述透光片7的所述內表面71、並低於所述透光片7的所述外表面72。In this embodiment, the extended
據此,所述無焊接式感測鏡頭100通過設置有所述環形擋牆10,以能夠有效地控制所述密封膠體9a的分佈位置,進而使所述密封膠體9a實現較佳的密封效果且避免影響其他元件(如:所述被動電子元件3)。Accordingly, the
[實施例三][Embodiment three]
請參閱圖8至圖10所示,其為本發明的實施例三。由於本實施例類似於上述實施例二,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例二的差異大致說明如下:Please refer to FIG. 8 to FIG. 10 , which are the third embodiment of the present invention. Since this embodiment is similar to the above-mentioned embodiment two, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned embodiment two are roughly described as follows:
於本實施例的圖8和圖9中,所述無焊接式感測鏡頭100進一步包含有一填充膠A2,並且所述填充膠A2填滿所述間隙且附著於所述延展牆體5與所述感測晶片4,以使所述填充膠A2相連於位在所述間隙G內的所述支撐膠層6的所述局部。其中,所述固晶膠A1與所述填充膠A2於本實施例中是分別由不同材料所構成,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述固晶膠A1與所述填充膠A2可以是由相同材料所構成。In FIG. 8 and FIG. 9 of this embodiment, the
據此,所述無焊接式感測鏡頭100於本實施例中通過所述填充膠A2來排除所述間隙G內的空氣,據以有效地降低因上述空氣受熱膨脹而導致周圍元件分離的可能性。此外,如圖10所示,所述無焊接式感測鏡頭100也可以是以所述延展牆體5覆蓋(或連接)於所述感測晶片4的所述外側面43,因而無須形成有所述間隙G、也不用設有所述填充膠A2。Accordingly, in this embodiment, the
[實施例四][embodiment four]
請參閱圖11所示,其為本發明的實施例四。由於本實施例類似於上述實施例一,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例一的差異大致說明如下:Please refer to FIG. 11 , which is the fourth embodiment of the present invention. Since this embodiment is similar to the first embodiment above, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the first embodiment above are roughly described as follows:
於本實施例中,所述無焊接式感測鏡頭100包含有一電路載板1、固定於所述電路載板1的一光學模組2、安裝於所述電路載板1的至少一個被動電子元件3、安裝於所述電路載板1的一感測晶片4、電性耦接所述感測晶片4與所述電路載板1的多條導線W、形成於所述感測晶片4上的一低折射率透明層4a、形成於所述第一板面11上的一模製膠體9b(molding compound)、設置於所述模製膠體9b上的一支撐膠層6、設置於所述支撐膠層6上的一透光片7、形成於所述透光片7的一遮光層8。In this embodiment, the
需先說明的是,所述電路載板1、所述光學模組2、至少一個所述被動電子元件3、所述感測晶片4、多條所述導線W、所述支撐膠層6、所述透光片7、及所述遮光層8於本實施例中的各自構造及彼此之間的部分連接關係是如同上述實施例一所記載,因而在此不再加以贅述。It should be explained first that the circuit carrier 1, the
於本實施例中,所述低折射率透明層4a與所述模製膠體9b皆位於所述配置空間24內,並且所述低折射率透明層4a形成於所述感測晶片4的所述頂面41,以使所述感測區域411埋置於所述低折射率透明層4a內;其中,所述低折射率透明層4a較佳是具有介於0.95~1.05的折射率,但本發明不以此為限。In this embodiment, the low-refractive index
再者,所述模製膠體9b形成於所述電路載板1的所述第一板面11上,並且多個所述焊接墊14、多條所述導線W、及所述感測晶片4皆埋置於所述模製膠體9b內,而所述低折射率透明層4a則是裸露於所述模製膠體9b的上表面9b1之外。其中,所述模製膠體9b的所述上表面9b1呈平面狀,所述支撐膠層6呈環狀且設置於所述模製膠體9b的所述上表面9b1、並圍繞在所述低折射率透明層4a的外側。所述透光片7的所述內表面71設置於所述支撐膠層6上,以使所述透光片7、所述支撐膠層6、及所述低折射率透明層4a共同包圍形成有一封閉空間S。Moreover, the
據此,所述無焊接式感測鏡頭100於本實施例中通過所述感測晶片4將所述感測區域411埋置於所述低折射率透明層4a內,以使其能夠搭配所述模製膠體9b,據以使得較小尺寸的所述感測晶片4能夠被採用且配置於內,進而符合所述感測晶片4微小化的業界趨勢。Accordingly, in this embodiment, the
[實施例五][embodiment five]
請參閱圖12至圖14所示,其為本發明的實施例四。由於本實施例類似於上述實施例四,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例四的差異大致說明如下:Please refer to FIG. 12 to FIG. 14 , which are the fourth embodiment of the present invention. Since this embodiment is similar to the above-mentioned fourth embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned fourth embodiment are roughly described as follows:
於本實施例中,所述模製膠體9b位在所述配置空間24之外,並且至少一個所述被動電子元件3也埋置於所述模製膠體9b之內。所述框架21固定(如:黏接或鎖固)於所述模製膠體9b的所述上表面9b1;也就是說,所述無焊接式感測鏡頭100於本實施例中僅有所述支撐膠層6與所述透光片7位於所述配置空間24之內。據此,所述無焊接式感測鏡頭100於本實施例中公開了一種有別於以外的架構,進而利於朝向不同應用需求發展、並適於自動化生產流程。In this embodiment, the
[本發明實施例的技術效果][Technical effects of the embodiments of the present invention]
綜上所述,本發明實施例所公開的無焊接式感測鏡頭,其通過上述多個元件之間的搭配,以使其整體架構實現無須焊接的效果,據以降低位於所述配置空間內的元件(如:所述感測晶片、所述延展牆體、多條所述導線、所述支撐膠層、所述透光片、及所述密封膠體之間的連接)所需的耐高溫要求,進而降低所述無焊接式感測鏡頭的材料成本、並提升產品的良率。進一步地說,所述無焊接式感測鏡頭因為不用經過迴焊流程,所以也就不用經過相對應的測試流程,進而有效地簡化了整個生產流程,以能提升所述無焊接式感測鏡頭的生產效率。To sum up, the non-welded sensing lens disclosed in the embodiment of the present invention, through the collocation of the above-mentioned multiple components, makes its overall structure realize the effect of no welding, thereby reducing the need for welding in the configuration space. The high temperature resistance required by the components (such as: the sensing chip, the extended wall, the multiple wires, the supporting adhesive layer, the light-transmitting sheet, and the connection between the sealing adhesive) Requirements, thereby reducing the material cost of the solderless sensing lens, and improving the yield of products. Furthermore, since the solderless sensing lens does not need to go through the reflow process, it does not need to go through the corresponding testing process, thereby effectively simplifying the entire production process, so as to improve the performance of the solderless sensing lens. production efficiency.
再者,所述無焊接式感測鏡頭於本實施例中通過所述延展牆體搭配於所述感測晶片與所述支撐膠層(或者,通過所述感測晶片將所述感測區域埋置於所述低折射率透明層內,以使其能夠搭配所述模製膠體),據以使得較小尺寸的所述感測晶片能夠被採用且配置於內,進而符合所述感測晶片微小化的業界趨勢。Furthermore, in this embodiment, the solderless sensing lens is matched with the sensing chip and the supporting adhesive layer through the extension wall (or, the sensing region is connected to the sensor through the sensing chip). Embedded in the low-refractive-index transparent layer, so that it can match the molding colloid), so that the sensing chip with a smaller size can be used and configured inside, and then conform to the sensing The industry trend of chip miniaturization.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的專利範圍內。The content disclosed above is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention, so all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention Inside.
100:無焊接式感測鏡頭
1:電路載板
11:第一板面
12:第二板面
13:固晶區
14:焊接墊
15:電連接器
2:光學模組
21:框架
22:透鏡
23:濾波片
24:配置空間
3:被動電子元件
4:感測晶片
41:頂面
411:感測區域
412:連接墊
42:底面
43:外側面
4a:低折射率透明層
5:延展牆體
51:延展頂面
6:支撐膠層
7:透光片
7a:抗反射膜
71:內表面
72:外表面
8:遮光層
81:開口
9a:密封膠體
9b:模製膠體
9b1:上表面
10:環形擋牆
W:導線
A1:固晶膠
A2:填充膠
G:間隙
D43:距離
D52:段差
L:中心軸線
S:封閉空間
100: Solderless sensor lens
1: Circuit carrier board
11: The first board
12: Second board
13: Die bonding area
14: Welding pad
15: Electrical connector
2: Optical module
21: frame
22: lens
23: filter
24: Configuration space
3: Passive electronic components
4: Sensing chip
41: top surface
411: Sensing area
412: connection pad
42: Bottom
43:
圖1為本發明實施例一的無焊接式感測鏡頭的立體示意圖。FIG. 1 is a schematic perspective view of a solderless sensing lens according to Embodiment 1 of the present invention.
圖2為圖1的分解示意圖。FIG. 2 is an exploded schematic diagram of FIG. 1 .
圖3為圖2的局部俯視示意圖(省略光學模組)。FIG. 3 is a schematic partial top view of FIG. 2 (the optical module is omitted).
圖4為圖1沿剖線IV-IV的剖視示意圖。FIG. 4 is a schematic cross-sectional view of FIG. 1 along section line IV-IV.
圖5為圖4中的區域V的放大示意圖。FIG. 5 is an enlarged schematic view of a region V in FIG. 4 .
圖6為本發明實施例二的無焊接式感測鏡頭的分解示意圖。FIG. 6 is an exploded schematic diagram of a solderless sensing lens according to
圖7為本發明實施例二的無焊接式感測鏡頭的剖視示意圖。7 is a schematic cross-sectional view of a solderless sensing lens according to
圖8為本發明實施例三的無焊接式感測鏡頭的剖視示意圖(一)。FIG. 8 is a schematic cross-sectional view (1) of a solderless sensing lens according to
圖9為圖8中的區域IX的放大示意圖。FIG. 9 is an enlarged schematic view of area IX in FIG. 8 .
圖10為本發明實施例三的無焊接式感測鏡頭的剖視示意圖(二)。FIG. 10 is a schematic cross-sectional view (2) of a solderless sensing lens according to
圖11為本發明實施例四的無焊接式感測鏡頭的剖視示意圖(一)。FIG. 11 is a schematic cross-sectional view (1) of a solderless sensing lens according to
圖12為本發明實施例五的無焊接式感測鏡頭的立體示意圖。FIG. 12 is a perspective view of a solderless sensing lens according to Embodiment 5 of the present invention.
圖13為圖12的分解示意圖。FIG. 13 is an exploded schematic diagram of FIG. 12 .
圖14為圖12沿剖線XIV-XIV的剖視示意圖。FIG. 14 is a schematic cross-sectional view of FIG. 12 along the section line XIV-XIV.
100:無焊接式感測鏡頭 100: Solderless sensor lens
1:電路載板 1: Circuit carrier board
11:第一板面 11: The first board
12:第二板面 12: Second board
13:固晶區 13: Die bonding area
14:焊接墊 14: Welding pad
2:光學模組 2: Optical module
21:框架 21: frame
22:透鏡 22: lens
23:濾波片 23: filter
24:配置空間 24: Configuration space
3:被動電子元件 3: Passive electronic components
4:感測晶片 4: Sensing chip
41:頂面 41: top surface
411:感測區域 411: Sensing area
412:連接墊 412: connection pad
42:底面 42: Bottom
43:外側面 43: Outer side
5:延展牆體 5: Extend the wall
51:延展頂面 51:Extended top surface
6:支撐膠層 6: Support glue layer
7:透光片 7: Translucent film
7a:抗反射膜 7a: Anti-reflection film
71:內表面 71: inner surface
72:外表面 72: Outer surface
8:遮光層 8: Shading layer
81:開口 81: opening
9a:密封膠體 9a: Sealant
W:導線 W: Wire
A1:固晶膠 A1: Die Bonding Adhesive
G:間隙 G: Gap
L:中心軸線 L: central axis
S:封閉空間 S: closed space
Claims (16)
Priority Applications (2)
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CN202111388838.9A CN115514863B (en) | 2021-06-04 | 2021-11-22 | Non-welding type sensing lens |
US17/580,577 US12108517B2 (en) | 2021-06-04 | 2022-01-20 | Sensor lens assembly having non-soldering configuration |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US202163196685P | 2021-06-04 | 2021-06-04 | |
US63/196,685 | 2021-06-04 |
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TW202248699A TW202248699A (en) | 2022-12-16 |
TWI804052B true TWI804052B (en) | 2023-06-01 |
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TW110142470A TWI804052B (en) | 2021-06-04 | 2021-11-16 | Non-soldering type sensor lens |
TW110145384A TWI810734B (en) | 2021-06-04 | 2021-12-06 | Non-soldering type sensor lens |
Family Applications After (1)
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TW110145384A TWI810734B (en) | 2021-06-04 | 2021-12-06 | Non-soldering type sensor lens |
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TW (2) | TWI804052B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200744220A (en) * | 2006-05-30 | 2007-12-01 | Optronics Technology Inc A | A structure of ultra thin CCM package and a method for fabricating the same |
TWI321846B (en) * | 2006-11-24 | 2010-03-11 | Taiwan Electronic Packaging Co Ltd | |
US20140042578A1 (en) * | 1996-05-17 | 2014-02-13 | Sony Corporation | Solid-state imaging apparatus and camera using the same |
TW202111366A (en) * | 2020-05-13 | 2021-03-16 | 香港商立景創新有限公司 | Imaging apparatus and method for assembling the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
US9980372B2 (en) * | 2014-08-26 | 2018-05-22 | Sharp Kabushiki Kaisha | Camera module |
TWM556869U (en) * | 2016-03-15 | 2018-03-11 | Sunny Optical Tech Group Company Limited | Photographing module and array photographing module based upon integrally packaging technique |
TWI706180B (en) * | 2017-09-28 | 2020-10-01 | 大陸商寧波舜宇光電信息有限公司 | Camera module for reducing stray light, photosensitive component thereof and electronic device |
-
2021
- 2021-11-16 TW TW110142470A patent/TWI804052B/en active
- 2021-12-06 TW TW110145384A patent/TWI810734B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140042578A1 (en) * | 1996-05-17 | 2014-02-13 | Sony Corporation | Solid-state imaging apparatus and camera using the same |
TW200744220A (en) * | 2006-05-30 | 2007-12-01 | Optronics Technology Inc A | A structure of ultra thin CCM package and a method for fabricating the same |
TWI321846B (en) * | 2006-11-24 | 2010-03-11 | Taiwan Electronic Packaging Co Ltd | |
TW202111366A (en) * | 2020-05-13 | 2021-03-16 | 香港商立景創新有限公司 | Imaging apparatus and method for assembling the same |
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TW202248699A (en) | 2022-12-16 |
TWI810734B (en) | 2023-08-01 |
TW202248736A (en) | 2022-12-16 |
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