TW200744220A - A structure of ultra thin CCM package and a method for fabricating the same - Google Patents

A structure of ultra thin CCM package and a method for fabricating the same

Info

Publication number
TW200744220A
TW200744220A TW095119099A TW95119099A TW200744220A TW 200744220 A TW200744220 A TW 200744220A TW 095119099 A TW095119099 A TW 095119099A TW 95119099 A TW95119099 A TW 95119099A TW 200744220 A TW200744220 A TW 200744220A
Authority
TW
Taiwan
Prior art keywords
image sensor
ccm
ultra thin
package
fabricating
Prior art date
Application number
TW095119099A
Other languages
Chinese (zh)
Inventor
Yu-Te Hsieh
Kuo-Tung Tiao
Chang-Shen Lin
Original Assignee
Optronics Technology Inc A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optronics Technology Inc A filed Critical Optronics Technology Inc A
Priority to TW095119099A priority Critical patent/TW200744220A/en
Publication of TW200744220A publication Critical patent/TW200744220A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

The present invention discloses a structure of ultra thin Compact Camera Module (CCM) package and a method for fabricating the same, that can have the advantages of: less particle contamination on image sensor, thinner in structure, simpler in fabrication, and easier in manufacturing process. The ultra thin CCM package comprises: a substrate formed with at least one electric circuit, an image sensor furnished on the substrate, at least one supporting member formed on the image sensor, a transparent cover covering a sensing area of the image sensor and being supported by the supporting member, a lens seat surrounding the image sensor, a lens set furnished on the lens seat and corresponding to the cover, and a connecting means for electric connecting the image sensor and the substrate.
TW095119099A 2006-05-30 2006-05-30 A structure of ultra thin CCM package and a method for fabricating the same TW200744220A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095119099A TW200744220A (en) 2006-05-30 2006-05-30 A structure of ultra thin CCM package and a method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095119099A TW200744220A (en) 2006-05-30 2006-05-30 A structure of ultra thin CCM package and a method for fabricating the same

Publications (1)

Publication Number Publication Date
TW200744220A true TW200744220A (en) 2007-12-01

Family

ID=57914456

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119099A TW200744220A (en) 2006-05-30 2006-05-30 A structure of ultra thin CCM package and a method for fabricating the same

Country Status (1)

Country Link
TW (1) TW200744220A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382505B (en) * 2008-12-18 2013-01-11
TWI456751B (en) * 2010-10-28 2014-10-11 Sony Corp Imaging device package, method of manufacturing the imaging device package, and electronic apparatus
TWI469332B (en) * 2011-12-07 2015-01-11 Pixart Imaging Inc Wafer scale image sensor package and optical mechanism
CN107359150A (en) * 2016-05-09 2017-11-17 艾马克科技公司 Semiconductor packages and its manufacture method
TWI804052B (en) * 2021-06-04 2023-06-01 同欣電子工業股份有限公司 Non-soldering type sensor lens

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382505B (en) * 2008-12-18 2013-01-11
TWI456751B (en) * 2010-10-28 2014-10-11 Sony Corp Imaging device package, method of manufacturing the imaging device package, and electronic apparatus
TWI469332B (en) * 2011-12-07 2015-01-11 Pixart Imaging Inc Wafer scale image sensor package and optical mechanism
CN107359150A (en) * 2016-05-09 2017-11-17 艾马克科技公司 Semiconductor packages and its manufacture method
CN107359150B (en) * 2016-05-09 2023-09-01 艾马克科技公司 Semiconductor package and method of manufacturing the same
TWI804052B (en) * 2021-06-04 2023-06-01 同欣電子工業股份有限公司 Non-soldering type sensor lens

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