TWI382505B - - Google Patents

Info

Publication number
TWI382505B
TWI382505B TW97149319A TW97149319A TWI382505B TW I382505 B TWI382505 B TW I382505B TW 97149319 A TW97149319 A TW 97149319A TW 97149319 A TW97149319 A TW 97149319A TW I382505 B TWI382505 B TW I382505B
Authority
TW
Taiwan
Application number
TW97149319A
Other languages
Chinese (zh)
Other versions
TW201025522A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW97149319A priority Critical patent/TW201025522A/en
Publication of TW201025522A publication Critical patent/TW201025522A/en
Application granted granted Critical
Publication of TWI382505B publication Critical patent/TWI382505B/zh

Links

TW97149319A 2008-12-18 2008-12-18 MEMS packaging structure and manufacturing method thereof TW201025522A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97149319A TW201025522A (en) 2008-12-18 2008-12-18 MEMS packaging structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97149319A TW201025522A (en) 2008-12-18 2008-12-18 MEMS packaging structure and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201025522A TW201025522A (en) 2010-07-01
TWI382505B true TWI382505B (en) 2013-01-11

Family

ID=44852637

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97149319A TW201025522A (en) 2008-12-18 2008-12-18 MEMS packaging structure and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TW201025522A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753537A (en) * 1994-07-26 1998-05-19 U.S. Philips Corporation Method of manufacturing a semiconductor device for surface mounting
US6419405B1 (en) * 2000-10-25 2002-07-16 Bogie Boscha Optical fiber/optical component assembly
US6873480B2 (en) * 2001-11-08 2005-03-29 Lightmaster Systems, Inc. Method and apparatus for packaging optical elements
TW200744220A (en) * 2006-05-30 2007-12-01 Optronics Technology Inc A A structure of ultra thin CCM package and a method for fabricating the same
US7306903B1 (en) * 1995-07-26 2007-12-11 Curis, Inc. Methods and compositions for identifying morphogen analogs

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753537A (en) * 1994-07-26 1998-05-19 U.S. Philips Corporation Method of manufacturing a semiconductor device for surface mounting
US7306903B1 (en) * 1995-07-26 2007-12-11 Curis, Inc. Methods and compositions for identifying morphogen analogs
US6419405B1 (en) * 2000-10-25 2002-07-16 Bogie Boscha Optical fiber/optical component assembly
US6873480B2 (en) * 2001-11-08 2005-03-29 Lightmaster Systems, Inc. Method and apparatus for packaging optical elements
TW200744220A (en) * 2006-05-30 2007-12-01 Optronics Technology Inc A A structure of ultra thin CCM package and a method for fabricating the same

Also Published As

Publication number Publication date
TW201025522A (en) 2010-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees