TWI382505B - - Google Patents
Info
- Publication number
- TWI382505B TWI382505B TW97149319A TW97149319A TWI382505B TW I382505 B TWI382505 B TW I382505B TW 97149319 A TW97149319 A TW 97149319A TW 97149319 A TW97149319 A TW 97149319A TW I382505 B TWI382505 B TW I382505B
- Authority
- TW
- Taiwan
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97149319A TW201025522A (en) | 2008-12-18 | 2008-12-18 | MEMS packaging structure and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97149319A TW201025522A (en) | 2008-12-18 | 2008-12-18 | MEMS packaging structure and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201025522A TW201025522A (en) | 2010-07-01 |
TWI382505B true TWI382505B (en) | 2013-01-11 |
Family
ID=44852637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97149319A TW201025522A (en) | 2008-12-18 | 2008-12-18 | MEMS packaging structure and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201025522A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5753537A (en) * | 1994-07-26 | 1998-05-19 | U.S. Philips Corporation | Method of manufacturing a semiconductor device for surface mounting |
US6419405B1 (en) * | 2000-10-25 | 2002-07-16 | Bogie Boscha | Optical fiber/optical component assembly |
US6873480B2 (en) * | 2001-11-08 | 2005-03-29 | Lightmaster Systems, Inc. | Method and apparatus for packaging optical elements |
TW200744220A (en) * | 2006-05-30 | 2007-12-01 | Optronics Technology Inc A | A structure of ultra thin CCM package and a method for fabricating the same |
US7306903B1 (en) * | 1995-07-26 | 2007-12-11 | Curis, Inc. | Methods and compositions for identifying morphogen analogs |
-
2008
- 2008-12-18 TW TW97149319A patent/TW201025522A/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5753537A (en) * | 1994-07-26 | 1998-05-19 | U.S. Philips Corporation | Method of manufacturing a semiconductor device for surface mounting |
US7306903B1 (en) * | 1995-07-26 | 2007-12-11 | Curis, Inc. | Methods and compositions for identifying morphogen analogs |
US6419405B1 (en) * | 2000-10-25 | 2002-07-16 | Bogie Boscha | Optical fiber/optical component assembly |
US6873480B2 (en) * | 2001-11-08 | 2005-03-29 | Lightmaster Systems, Inc. | Method and apparatus for packaging optical elements |
TW200744220A (en) * | 2006-05-30 | 2007-12-01 | Optronics Technology Inc A | A structure of ultra thin CCM package and a method for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
TW201025522A (en) | 2010-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |