CN108995144B

CN108995144B - Forming die for manufacturing molded circuit board

Info

Publication number: CN108995144B
Application number: CN201710419334.6A
Authority: CN
Inventors: 请求不公布姓名
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-06-06
Filing date: 2017-06-06
Publication date: 2024-06-14
Anticipated expiration: 2037-06-06
Also published as: CN108995144A

Abstract

A molding die for preparing a molded circuit board comprises an upper die and a lower die, wherein a molding space is formed when the upper die and the lower die are in close fit, at least one isolation block is arranged in the molding space, each isolation block is correspondingly arranged on the upper part of each photosensitive element respectively when a circuit board assembled with at least one photosensitive element is arranged in the molding space so as to seal the photosensitive element respectively, and thus after molding materials are filled into the molding space and cured and molded, a molding base is formed on the outer side of each photosensitive element respectively, and an optical window of the molding base is formed at a position corresponding to each isolation block.

Description

Forming die for manufacturing molded circuit board

Technical Field

The present invention relates to a molding die, and more particularly, to a molding die for manufacturing a molded circuit board of an image capturing module.

Background

With the progress and development of technology, electronic products and intelligent devices are increasingly moving toward high performance and light and thin, and camera modules, which are one of core configurations of the electronic products and the intelligent devices, are necessarily required to be adaptively adjusted in terms of performance, size and the like. In the face of the development requirements of various high performances such as high pixels, high imaging quality and the like, the number of electronic components on a camera molding circuit board is increased, the area of a photosensitive chip is increased, the integral size of a camera module is necessarily increased, and the assembly requirement on the electronic camera module is increased. It should be appreciated by those skilled in the art that the conventional assembly methods of the lens base, the circuit board and the electronic components greatly limit the trend of the camera module towards light and thin.

The conventional camera module generally comprises a circuit board, a photosensitive chip, a lens holder, a lens and other core components, wherein the photosensitive element is generally attached to the circuit board by adopting COB (Chip On Board) technology in the packaging process, and the lens is arranged and kept on the photosensitive path of the photosensitive chip after the lens holder is attached to a circuit by glue. However, in the existing packaging process, there are many defects for the high-performance camera module.

Firstly, when the lens holder is correspondingly mounted on the circuit board, a safety distance needs to be reserved between the lens holder and each electronic component to avoid any contact between the lens holder and each electronic component, that is, a safety distance needs to be reserved between the lens holder and each electronic component in the horizontal direction or in the height direction, which inevitably leads to an increase in the size of the camera module.

And the lens base is attached to the circuit board through glue so as to position and keep the optical lens on the photosensitive path of the chip. Therefore, the flatness of the lens base is influenced by the flatness of the circuit board and also depends on the uniformity of glue coating on the circuit board. However, since the glue has fluidity naturally, it is difficult to ensure that the lens mount attached to the circuit board has stable flatness, so that there is a tolerance between the lens and the chip, and the imaging quality of the camera module is affected. Accordingly, in order to meet the requirement of the subsequent calibration process, more glue needs to be preset between the lens base and the circuit board, so that the inclination degree between the lens base and the circuit board can be conveniently adjusted during the calibration process, and the height dimension of the camera module is increased.

In addition, in the process of attaching the lens holder to the circuit board, the photosensitive area of the photosensitive chip is always exposed in the external environment, and in addition, although a safe distance is reserved between the lens holder and each electronic component, as the distance between the lens holder and each electronic component is relatively close, and the glue used for connecting the lens holder and the circuit board has fluidity, the glue can easily flow to the position of each electronic component and even flow to the photosensitive area of the chip, so that pollution is caused to each electronic component, and even the photosensitive area of the chip is polluted, so that bad lighting phenomenon is caused, and the product yield of the camera module is reduced.

In addition, in order to reduce the size of the camera module assembly in the horizontal direction and to increase the distribution density of electronic components on the circuit board, the electronic components mounted on the circuit board are generally closely arranged. However, because there is no isolation device, the closely arranged electronic components may cause electromagnetic interference during operation, and the heat dissipation medium is air, which may cause poor heat dissipation.

In terms of technical theory, the lens base is integrally formed on the circuit board through a molding process, so that the problems can be effectively solved, and a plurality of technical problems need to be overcome in the process of theoretical and practical production.

Firstly, when the lens seat is integrally formed on the circuit board through a molding process, on one hand, consideration is given to how to avoid that a photosensitive area of a photosensitive chip on the circuit board is polluted by molding materials in the molding process; on the other hand, a light window is preset in the middle of the lens base, so that the photosensitive element and the lens are optically aligned, and a complete light path is established for the photosensitive element through the light window. In the specific process of molding the lens base into an integral molding, it is further considered how to establish a stable isolation environment for the photosensitive area of the photosensitive element, so as to ensure that molding materials cannot enter the photosensitive element during the molding process of the lens base, and further process defects such as flash and the like are avoided.

In addition, the photoreceptor chip is generally thin and brittle, so that it is not crushed by excessive pressure during the process of designing isolation means for the photoreceptor chip. In yet another aspect, a lead is typically disposed between the photo-sensing chip and the circuit board, wherein the lead extends curvedly between the photo-sensing chip and the circuit board to conduct between the circuit board and the photo-sensing chip. Accordingly, in the process of designing isolation measures for the photosensitive chip, a space needs to be reserved for the lead wire, so that the phenomenon that the lead wire is pressed and deformed and even separated from the photosensitive element and the circuit board in the process of establishing isolation environments for the photosensitive chip is prevented.

Disclosure of Invention

An object of the present invention is to provide a molding die for manufacturing a molded circuit board, the molding die including an upper die and a lower die, the upper die and the lower die forming a molding space when they are closed, a spacer being provided in the molding space, wherein when a circuit board provided with a photosensitive element is mounted to the molding space, the spacer is correspondingly provided on an upper portion of the photosensitive element to seal the photosensitive element, so that after the molding space is filled with the molding material and cured and molded, a molding base is formed outside the photosensitive element, and a light window of the molding base is formed at a position corresponding to the spacer.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein the spacer has a relief space formed at a bottom of the spacer, and the relief space is located between the photosensitive element and the spacer to prevent the spacer from directly contacting a photosensitive region of the photosensitive element when the spacer is attached to the photosensitive element, thereby effectively protecting the photosensitive region of the photosensitive element from being crushed.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein the spacer has a relief space formed at a bottom of the spacer, and the relief space is located between the photosensitive element and the spacer and seals at least a photosensitive region of the photosensitive element more tightly when the spacer is attached to the photosensitive element, so that at least the photosensitive region of the photosensitive element is always safely isolated within the relief space during molding of the molding base.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein the spacer has a spacer body, an extension portion, and a side-tilting portion, the extension portion and the side-tilting portion being integrally formed with the spacer body, the extension portion extending downward along the spacer body, the side-tilting portion being formed at a side portion of the spacer body, wherein the side-tilting portion and the side-tilting portion cooperate with each other to provide a sufficient row line space for a lead wire connecting the circuit board and the photosensitive element, thereby effectively ensuring that no touch occurs between the lead wire and the spacer when the spacer is stacked on the photosensitive element.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, in which the extension portion of the spacer extends vertically downward along the spacer so that when the spacer is disposed on the upper portion of the photosensitive element, the extension portion of the spacer is disposed approximately vertically on the photosensitive element to enhance the sealing effect between the photosensitive element and the spacer, thereby more effectively ensuring that molding material does not penetrate into the photosensitive element during the subsequent molding process to cause process errors such as flash.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein a relative positional relationship between the extension portion of the spacer and the side-inclined portion of the spacer is freely adjustable according to practical situations, so that the wiring space not only allows the wire to be freely wired, but also is adapted to the degree of bending of the wire, thereby ensuring that the molded base formed in the subsequent molding is more fitted to the wire bow of the wire, so as to achieve a more excellent molding effect.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein the extension portion of the spacer is folded down and outwardly along the main body of the spacer main body, so that when the spacer is correspondingly disposed on the photosensitive element, the sealing effect between the extension portion and the photosensitive element is further optimized, thereby effectively preventing molding material from flowing into the photosensitive element through a gap between the extension portion and the photosensitive element during molding, and causing process errors such as burrs.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein a buffer film is further provided between the spacer and the photosensitive element, so that when the spacer is attached to the photosensitive element, the buffer film can effectively absorb the load applied to the photosensitive element by the spacer, thereby effectively avoiding the occurrence of process defects such as crushing of the photosensitive element during the molding process.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein a buffer film is further provided between the spacer and the photosensitive element, the buffer film having a certain flexibility, so that when the spacer is attached to the photosensitive element, the buffer film is pressed to deform, thereby more effectively sealing and isolating the photosensitive element to prevent the photosensitive element from being contaminated during molding.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein the spacer is further provided with a gas channel, and a negative pressure space is effectively formed between the spacer and the buffer film through the gas channel, so that the buffer film is more tightly attached to the bottom of the spacer, and the buffer film can more uniformly and effectively absorb the load of the photosensitive element during the molding process of the molding base, so as to avoid the photosensitive element from being damaged during the molding process.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein the spacer is further provided with a gas channel through which air remaining between the spacer and the buffer film is sucked to make the buffer film more closely adhere to the bottom of the spacer under the action of negative pressure, thereby ensuring that when the spacer is aligned and attached to the photosensitive element, the relative position between the buffer film and the spacer is not dislocated to cause the spacer to directly contact the photosensitive element, thereby causing damage to the photosensitive element.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein the spacer is further provided with a gas passage through which residual gas between the spacer and the buffer film can be effectively removed, so that the buffer film is firmly attached to the spacer, thereby effectively preventing the buffer film from moving during molding of the molding base, and carrying dirt in the environment outside the photosensitive element into the photosensitive element during the movement.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein the spacer includes a flexible section and a rigid section, the rigid section being coupled to the flexible section such that when the spacer is disposed to be attached to the photosensitive element, the flexible section of the spacer contacts the photosensitive element to effectively prevent the photosensitive element from being crushed by the soft characteristic of the flexible section itself.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein the spacer includes a flexible section and a rigid section, the rigid section being coupled to the flexible section, so that when the spacer is disposed to be attached to the photosensitive element, the flexible section of the spacer contacts the photosensitive element to sufficiently replace the role of the buffer film by the soft characteristic of the flexible section itself.

Another object of the present invention is to provide a molding die for manufacturing a molded circuit board, wherein the spacer includes a flexible section and a rigid section, wherein the flexible section is interchangeably coupled to the rigid section, so that when the flexible section malfunctions or loses its working effect, a new flexible section can be selected to replace the original flexible section, in such a way that the cost of the molding die can be reduced.

In order to achieve at least one of the above objects, the present invention provides a molding die for manufacturing a molded circuit board, wherein the molding die comprises:

An upper mold; and

And a lower mold, wherein a molding space is formed when the upper mold and the lower mold are closely adhered, a spacer is provided in the molding space, wherein the spacer is correspondingly provided at an upper portion of a photosensitive element to seal the photosensitive element when a circuit board assembled with the photosensitive element is mounted in the molding space, so that a molding base is formed at an outer side of the photosensitive element after a molding material is filled into the molding space and cured and molded, and at least one optical window of the molding base is formed at a position of the corresponding spacer.

According to an embodiment of the present invention, the spacer further includes a spacer body and a side tilting part integrally formed with the spacer body, and the side tilting part is formed at a side of the spacer body such that when the spacer is attached to an inner side of a chip connection member of the photosensitive element, the spacer body is overlapped with a photosensitive area of the photosensitive element, and the side tilting part extends over a lead wire that conducts the photosensitive element and the wiring board to provide a wiring space to prevent the spacer from touching the lead wire.

According to an embodiment of the present invention, the spacer further includes an extension integrally formed with the spacer body, and the extension is formed at a bottom side of the spacer body such that when the spacer is disposed at an upper portion of the photosensitive element, the extension of the spacer is closely adhered to the photosensitive element to closely seal at least a photosensitive region of the photosensitive element through the extension.

According to an embodiment of the present invention, the extension portion extends downward in a vertical direction from the bottom side of the spacer body so that the extension portion is combined with the photosensitive element approximately vertically when the spacer is disposed to be overlapped with the photosensitive element.

According to an embodiment of the invention, the extension extends downwardly and outwardly from the bottom side of the spacer body, the angle at which the extension extends outwardly and downwardly being freely adjustable.

According to an embodiment of the present invention, the extension portion extends downward and inward from the bottom side of the spacer body, wherein an angle at which the extension portion extends inward and downward is freely adjustable so that the extension portion cooperates with the side-tipping portion to define a wiring space having a shape closer to a wire arc of the wire.

According to an embodiment of the present invention, the spacer further has a relief space concavely formed at the bottom of the spacer, so that when the spacer is attached to the photosensitive element, the relief space is disposed between the photosensitive element and the spacer to prevent the spacer from directly contacting the photosensitive region of the photosensitive element, thereby effectively protecting the photosensitive region of the photosensitive element from being crushed.

According to an embodiment of the present invention, the molding die further includes a buffer film disposed between the spacer and the photosensitive element to enhance sealability between the spacer and the photosensitive element by the buffer film.

According to an embodiment of the present invention, the spacer further has a gas channel formed inside the spacer and connecting the spacer with an external environment of the forming mold, so that a negative pressure space can be effectively formed between the bottom of the spacer and the buffer film through the gas channel, so that the buffer film is firmly attached to the bottom of the spacer all the time during the molding process.

According to an embodiment of the present invention, the spacer includes a rigid section and a flexible section coupled to the rigid section and extending downward in alignment along the rigid section, wherein the flexible section is in close contact with the photosensitive element when the spacer is correspondingly attached to the photosensitive element

According to an embodiment of the invention, the flexible segment is alternatively coupled to the rigid segment, so that when the flexible segment fails or loses its working effect, a new flexible segment can be selected to replace the original flexible segment.

According to an embodiment of the invention, the spacer is implemented as a flexible segment adapted to fit the photosensitive element.

Drawings

FIG. 1 is a schematic perspective view of an imaging assembly of a molded circuit board according to the present invention

Fig. 2 is a schematic perspective view of a molding die according to a preferred embodiment of the invention when the molding die is opened.

Fig. 3 is a schematic perspective view of the molding die according to the preferred embodiment.

Fig. 4 is a schematic perspective view of the forming mold according to the preferred embodiment.

Fig. 5 is a schematic perspective view of a molded circuit board prepared by the molding die provided by the invention.

Fig. 6A is a modified embodiment of the molding die according to the preferred embodiment.

Fig. 6B is another modified embodiment of the molding die according to the preferred embodiment.

Fig. 7 is a perspective view of a molding die according to the above preferred embodiment of the present invention.

Fig. 8 is another preferred embodiment of a molding die provided in accordance with the present invention.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.

It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.

Fig. 1 to 8 show a molding die and a molded circuit board 20 prepared by the molding die according to a preferred embodiment of the present invention. As shown in fig. 1 and 5, the molded circuit board 20 includes an imaging module 21 and a molded base 23, wherein the molded base 23 is manufactured by the molding die and integrally formed with the imaging module 21, so that the molded base 23 can effectively replace a lens holder or a bracket of a conventional camera module, and the lens holder or bracket is not required to be assembled to the circuit board 212 by glue in a similar conventional packaging process.

The imaging assembly 21 further includes a photosensitive element 211 and a circuit board 212, wherein the photosensitive element 211 is conductively coupled to the circuit board 212. The molding base 23 includes an annular molding body 231 and a light window 232, wherein when the molding base 23 is integrally formed with the imaging assembly 21, the light window 232 corresponds to a light sensing path of the light sensing element 211 of the imaging assembly 21, so as to allow the light sensing element 211 to receive light from the outside through the light window 232 of the molding base 23.

Further, the circuit board 212 includes a chip mounting area 2121 and a peripheral area 2122, the peripheral area 2122 is integrally formed with the chip mounting area 2121, and the chip mounting area 2121 is located in the middle of the circuit board 212 and is surrounded by the peripheral area 2122, where the photosensitive elements 211 are correspondingly mounted on the chip mounting area 2121 of the circuit board 212. The circuit board 212 further includes a set of circuit board connectors 2123, and the circuit board connectors 2123 are disposed between the die attach region 2121 and the peripheral region 2122 and are configured to communicate with the photosensitive elements 211.

Accordingly, the photosensitive element 211 includes a photosensitive region 2111 and a non-photosensitive region 2112, the photosensitive region 2111 is located in the photosensitive region 2111 and the non-photosensitive region 2112 are integrally formed on the top surface of the photosensitive element 211, and the photosensitive region 2111 is located in the middle of the photosensitive element 211 and is surrounded by the non-photosensitive region 2112. The photosensitive element 211 further includes a set of chip connectors 2113, and the chip connectors 2113 are located in the photosensitive area 2111 and are used to connect with the circuit board connectors 2123 of the circuit board 212 to conduct the circuit board 212 and the photosensitive element 211.

Further, the imaging assembly 21 further includes a set of leads 214, each of the leads 214 extending curvedly between the wiring board 212 and the photosensitive element 211 to conduct the photosensitive element 211 and the wiring board 212. Specifically, each of the leads 214 has a circuit board connection end 2141 and a chip connection end 2142, wherein the circuit board connection end 2141 is configured to be connected to the circuit board connection 2123 of the circuit board 212, and the chip connection end 2142 is configured to be connected to the chip connection 2113 of the chip in such a manner as to conduct the circuit board 212 and the photosensitive element 211. It should be noted that, when the molding die provided by the present invention is used to manufacture the molded circuit board 20, a certain wiring space 3021 needs to be provided for the leads 214, so that the leads 214 are prevented from being squeezed and even falling off from the circuit board 212 or the photosensitive element 211 during the molding process of the molding base 23.

In addition, the imaging assembly 21 further includes a series of electronic components 215, and the electronic components 215 are assembled on the circuit board 212 through a process such as SMT, and are covered by the molding base 23 after the molding base 23 is integrally formed, wherein the electronic components 214 include capacitance, resistance, inductance, and the like.

It should be understood by those skilled in the art that the circuit board 212 and the photosensitive element 211 may be further conducted in a manner other than the lead 214, for example, the photosensitive element 211 is disposed on the bottom side of the circuit board 212 by flip-chip method, and the chip connector 2113 of the photosensitive element 211 is directly pressed with the chip connector 2113 of the circuit board 212 by a conductive medium, in such a manner as to conduct the circuit board 212 and the photosensitive element 211. In the preferred embodiment of the present invention, the photosensitive element 211 and the circuit board 212 are connected to each other by the lead 214 only by way of example, so as to better illustrate the advantages of the molding die provided in the present invention in the process of manufacturing the molded circuit board 20. That is, in the present invention, the molded circuit board 20 is merely provided as a work piece to illustrate technical features of the molding die during the molding process, and does not affect the scope of the present invention.

Specifically, as shown in fig. 2 to 4, the molding die further includes an upper die 101 and a lower die 102, wherein a molding space 103 is formed between the upper die 101 and the lower die 102 when the upper die 101 and the lower die 102 are bonded, the imaging assembly 21 is installed in the molding cavity, and further, after a molding material for molding the molding base 23 is filled into the molding space 103 and cured, the molding base 23 is integrally molded on the circuit board, and the molding base 23 covers the circuit board 212 and at least a portion of the photosensitive element 211.

More specifically, the molding die further includes a spacer 30, the spacer 30 extending within the molding space 103 when the upper and lower dies 101 and 102 are clamped, wherein the spacer 30 is correspondingly disposed on an upper portion of the photosensitive element 211 of the imaging assembly 21 to seal the photosensitive element 211 when the imaging assembly 21 of the molded circuit board 20 is mounted to the molding space 103, so that when the molding space 103 is filled with a molding material, the molding material cannot flow into the spacer 30 and the photosensitive element 211 to form the annular molding base 23 of the molding base 23 outside the spacer 30, while the optical window 232 of the molding base 23 is formed at a position corresponding to the spacer 30.

The spacer 30 is disposed on the upper mold 101, the imaging assembly 21 is mounted on the lower mold 102, wherein the spacer 30 disposed on the upper mold 101 gradually approaches the photosensitive element 211 of the imaging assembly 21 disposed in the lower mold 102 during the process of approaching the upper mold 101 and the lower mold 102 to form the molding space 103, and is finally overlapped on the photosensitive element 211, so that the spacer 30 effectively prevents molding material from entering the photosensitive element 211 during the process of molding the molding base 23. It should be noted that the spacer 30 may also be disposed on the lower mold 102 of the molding mold, and accordingly, the imaging assembly 21 is mounted on the upper mold 101 upside down, so that when the upper mold 101 and the lower mold 102 are in a mold-closed state, the spacer 30 disposed on the lower mold 102 is disposed on the upper portion of the photosensitive element 211, so as to seal the photosensitive element 211 by the spacer 30. That is, in the molding die provided by the present invention, the position of the spacer 30 is not limited, for example, in the preferred embodiment of the present invention, the spacer 30 is provided to the upper die 101 of the molding die, and accordingly, a mounting groove 1021 is provided in the lower die 102, the mounting groove 1021 being used to receive the imaging member 21 of the molded circuit board 20.

More specifically, when the upper mold 101 and the lower mold 102 are clamped and a molding process is performed, the spacer 30 is overlapped with the photosensitive element 211 and shields at least the photosensitive region 2111 of the photosensitive element 211, in such a manner that a molding material is prevented from entering at least the photosensitive region 2111 of the photosensitive element 211, thereby molding the molding base 23 in an external environment of the photosensitive region 2111 of the photosensitive element 211 and forming the light window 232 of the molding base 23 at a position corresponding to the spacer 30. As will be appreciated by those skilled in the art, in this case, the spacer 30 is disposed inside the chip connector 2113 of the photosensitive element 211, and during the molding process, the spacer 30 is closely adhered to the region inside the chip connector 2113 of the photosensitive element 211 to seal at least the photosensitive region 2111 of the photosensitive element 211 by the spacer 30, and after the molding base 23 is integrally formed, the molding base 23 covers the wiring board 212 and the photosensitive element 211 to form the molded circuit board 20 having an integral structure.

As shown in fig. 3, the spacer 30 further includes a spacer body 301 and a side inclined portion 302, the side inclined portion 302 is integrally formed with the spacer body 301, and the side inclined portion 302 is formed at a side portion of the spacer body 301, so that when the spacer 30 is attached to an inner side of the chip connection 2113 of the photosensitive element 211, the spacer body 301 is overlapped with the photosensitive region 2111 of the photosensitive element 211, and the side inclined portion 302 extends above the lead 214 which connects the photosensitive element 211 and the wiring board 212, so as to prevent the spacer 30 from touching the lead 214. It should be readily understood by those skilled in the art that the leads 214 extend between the chip connectors 2113 of the photosensitive element 211 and the board connectors 2123 of the board 212 and protrude upward, so that sufficient line space must be provided for the leads 214 when the spacer 30 is overlapped on the photosensitive element 211 to avoid the spacer 30 pressing the leads 214 to deform the leads 214 or even fall off the photosensitive element 211. In other words, when the spacer body 301 is overlapped with the photosensitive element 211, the inclined portion 302 extends at the upper portion of the lead 214, thereby providing a wiring space 3021 for the lead 214, wherein the lead 214 freely extends from the photosensitive element 211 in the wiring space 3021 to effectively avoid touching of the spacer 30 with the lead 214 by the inclined portion 302.

It should be noted that, during the molding process of the molding base 23, molding material flows in the molding space 103 and fills the wiring space 3021, so that the molding base 23 can better adhere to the lead 214 after the molding material is cured and molded. In other words, in the design process of defining the wiring space 3021 by the spacer 30, not only a sufficient space is provided for the lead 214 to allow the lead 214 to freely shuttle and bulge within the wiring space 3021, but also the shape of the wiring space 3021 is further adjusted so that the shape of the wiring space 3021 is more closely adjacent to the curved shape of the lead 214, so that the lead 214 can be more conformably wrapped by the molding base 23 to form a more stable integrated structure in a subsequent molding process, which will be referred to in the following description.

Further, the spacer 30 further includes an extension 303, the extension 303 is integrally formed with the spacer body 301, and the extension 303 is formed at the bottom side of the spacer body 301, so that when the spacer 30 is disposed at the upper portion of the photosensitive element 211, the extension 303 of the spacer 30 is closely adhered to the photosensitive element 211 to seal at least the photosensitive region 2111 of the photosensitive element 211 by the extension 303. It will be appreciated by those skilled in the art that the extension 303 extends downwardly from the bottom side of the spacer body 301, which provides a number of advantages to the spacer 30.

Specifically, the transition angle between the side-rolling portion 302 of the separator 30 and the separator body 301 at the bottom of the separator 30 is large compared to that without the extension portion 303, so that molding material easily penetrates into the photosensitive element 211 through the side-rolling portion 302 and the separator body 301 at the transition region at the bottom during the subsequent molding process to cause "flash" or the like around the photosensitive element 211. When the spacer 30 is provided with the extension 303, the extension 303 integrally extends downward from the bottom of the spacer body 301 and is attached to the photosensitive element 211 during molding, in this way, the transition angle of the spacer 30 at the bottom is effectively reduced, so that the spacer 30 is more tightly attached to the photosensitive element 211 through the extension 303, so as to more effectively seal the photosensitive region 2111 of the photosensitive element 211 during the process, thereby effectively preventing molding materials from entering the photosensitive element 211 and producing process errors such as "flash".

Second, the extension portion 303 integrally extends downward from the spacer body 301 and has a certain height, so that when the spacer 30 is stacked on the photosensitive element 211, the extension portion 303 can effectively raise the relative position heights of the spacer body 301 and the side-tipping portion 302 to effectively expand the wiring space 3021, thereby more facilitating free meandering of the lead 214 in the wiring space 3021. In other words, when the spacer body 301 is provided with the extension portion 303, the wiring space 3021 is formed outside the extension portion 303 and the roll portion 302, in which case the area of the wiring space 3021 is greatly increased, particularly the space in the height direction, as compared with the manner in which the wiring space 3021 is defined only by the roll portion 302, so that unnecessary contact between the spacer 30 and the lead 214 can be more effectively avoided. For example, when the spacer 30 is attached to the photosensitive element 211 and the bottom of the spacer 30 is close to the chip connector 2113 of the photosensitive element 211, in this case, the convex portion of the lead 214 at the chip connector 2113 of the photosensitive element 211 is extremely likely to touch the spacer 30, and therefore, in the case where the extension 303 is not provided, the degree of inclination of the side-tipping portion 302 of the spacer 30 must be greatly reduced to barely avoid unnecessary touching between the spacer 30 and the lead 214. However, the wiring space 3021 defined by too small an inclination is disadvantageous for the subsequent molding process.

In other words, by the extension 303 of the spacer 30, unnecessary pressing between the spacer 30 and the lead 214 can be easily avoided without greatly changing the inclination of the side-inclined portion 302 of the spacer 30. It will be appreciated by those skilled in the art that, by means of the mutual cooperation of the extending portion 303 and the side-tilting portion 302 of the spacer 30 to define the wiring space 3021 together, the shape and size of the wiring space 3021 can be more conveniently adjusted, so that, on the one hand, the extrusion of the lead 214 by the spacer 30 can be more effectively avoided, and on the other hand, the relative positional relationship between the extending portion 303 and the side-tilting portion 302 is properly adjusted, so that the shape of the wiring space 3021 is more suitable for the bending condition of the lead 214, and thus the subsequently formed molded base 23 can be more suitable for the wire arc of the lead 214.

In the preferred embodiment of the present invention, the extension 303 extends downward from the bottom side of the spacer body 301 in the vertical direction, so that when the spacer 30 is disposed to be overlapped with the photosensitive element 211, the extension 303 is combined with the photosensitive element 211 approximately vertically, in such a manner that the excessive angle of the spacer 30 in the bottom transition area can be effectively reduced, thereby sealing the photosensitive element 211 more tightly, to facilitate preventing process errors such as flash during the subsequent molding process.

A variant of this preferred embodiment of the invention is shown in fig. 6A, wherein the extension 303 extends in a downward and inward direction from the bottom side of the spacer body 301, wherein the angle at which the extension 303 extends inward and downward is freely adjustable, so that the extension 303 cooperates with the slope to define a routing space 3021 having a shape closer to the wire arc of the wire 214, thereby enabling the subsequently formed molded base 23 to more tightly and snugly encase the wire 214. It should be noted that the inclination degree of the side-tilting portion 302 of the spacer 30 is also freely adjustable, so as to adjust the shape and size of the wiring space 3021 in cooperation with the extension portion 303, so that the wiring space 3021 is more adapted to the wire arc of the lead 214.

Another variation of this preferred embodiment of the present invention is shown in fig. 6B, wherein the extension 303 extends in a downward and outward direction from the bottom side of the spacer body 301, wherein the angle at which the extension 303 extends outward and downward is freely adjustable, so that when the spacer 30 is disposed to overlap the photosensitive element 211, the extension 303 can further reduce the excessive angle of the spacer 30 in the bottom transition region, thereby more tightly sealing the photosensitive element 211, so as to facilitate preventing process errors such as flash in the subsequent molding process. It is worth mentioning that this structure is particularly suitable for the case when the forming die further comprises a buffer film, as will be mentioned in the following description, because: the extending portion 303 extending downward and outward from the bottom of the spacer body has a larger pressure on the buffer film 104, so that the buffer film 104 is more closely attached to the photosensitive element 211, and thus, even if the buffer film 104 has a thicker thickness, the bad process such as flash caused by a larger gap between the bottom of the spacer 30 and the surface of the photosensitive element 211 due to an excessively large radius of curvature of the buffer film after bending during the molding process can be effectively avoided. Further, in the preferred embodiment of the present invention, the spacer 30 further has a relief space 300, and the relief space 300 is concavely formed at the bottom of the spacer 30, so that when the spacer 30 is attached to the photosensitive element 211, the relief space 300 is disposed between the photosensitive element 211 and the spacer 30 to prevent the spacer 30 from directly contacting the photosensitive region 2111 of the photosensitive element 211, thereby effectively protecting the photosensitive region 2111 of the photosensitive element 211 from being crushed. Preferably, the avoidance space 300 is provided to have a space range slightly larger than the photosensitive region 2111 of the photosensitive element 211, so that when the spacer 30 is bonded to the photosensitive element 211, the avoidance space 300 is correspondingly provided at the upper portion of the photosensitive region 2111 of the photosensitive element 211, so that the bottom of the spacer 30 is not in direct contact with the photosensitive region 2111 of the photosensitive element 211, thereby effectively reducing the accident that the photosensitive region 2111 of the photosensitive chip is crushed and the accident that the pixels of the photosensitive region are damaged during the process of clamping.

It should be understood by those skilled in the art that the avoidance space 300 is concavely formed at the bottom of the spacer 30, so that the sealing area between the photosensitive element 211 and the spacer 30 is greatly reduced, thereby effectively reducing the difficulty coefficient of matching between the photosensitive element 211 and the spacer 30. More specifically, when the avoiding space 300 is not provided at the bottom of the spacer 30, that is, the bottom of the spacer 30 has a complete molding surface, in this case, it is only sufficient to ensure both the flatness of the photosensitive element 211 and the flatness of the bottom molding surface of the spacer 30, so that precise adhesion between the photosensitive element 211 and the spacer 30 can be ensured. When the avoiding space 300 is provided on the molding surface of the spacer 30, at least a portion of the molding surface of the spacer 30 is recessed, and the contact area between the spacer 30 and the photosensitive element 211 is not only provided in the non-photosensitive area 2112 of the photosensitive element 211, but also the area of the contact area is greatly reduced compared with the area without the avoiding space 300, thereby reducing the difficulty of matching between the photosensitive element 211 and the spacer 30, and being beneficial to enhancing the sealing degree between the photosensitive element 211 and the spacer 30. In the preferred embodiment of the present invention, the escape space 300 is provided to be formed at the extension 303 of the spacer 30 to better seal the photosensitive element 211 in cooperation with the extension 303, thereby facilitating better molding.

As shown in fig. 3, the molding mold further includes a buffer film 104, where the buffer film 104 is disposed between the spacer 30 and the photosensitive element 211, so as to enhance the sealing property between the spacer 30 and the photosensitive element 211 by the buffer film 104, so that the buffer film 104 can further prevent molding materials from entering the photosensitive element 211 in the subsequent molding process, thereby improving the molding quality of the molding process. It should be noted that, in the preferred embodiment of the present invention, the buffer film 104 is attached to the bottom of the spacer 30 to form a buffer layer between the photosensitive element 211 and the spacer 30 through the buffer film 104, wherein the load applied to the photosensitive element 211 is effectively absorbed by the buffer film 104 when the spacer 30 is overlapped with the photosensitive element 211, thereby effectively avoiding the damage of the chip. It will be appreciated by those skilled in the art that after the molding process is completed, the upper mold 101 and the lower mold 102 of the molding die are separated from each other to separate the molded circuit board 20 from the molding die, and the pre-arranged buffer film 104 can now perform another layer of functions: facilitating release of the molded circuit board 20 from the molding die.

More specifically, in the preferred embodiment of the present invention, the buffer film 104 is provided on the molding surface of the upper mold to cover the entire extension 303 and the inclined portion 302, so that when the spacer 30 is provided on the upper portion of the photosensitive element 211, the buffer film 104 is closely adhered to the photosensitive element 211 to enhance the sealing effect of the spacer 30. The buffer film 104 has a certain elasticity and flexibility, when the buffer film 104 is closely adhered to the photosensitive element 211, the extension 303 of the spacer 30 presses the buffer film 104 and slightly deforms the buffer film, so that the buffer film 104 is forced to closely adhere to the photosensitive element 211, and the sealing effect of the photosensitive element 211 is further improved. Further, when the avoiding space 300 is provided at the bottom of the spacer 30, since the contact area between the photosensitive element 211 and the bottom of the spacer 30 is reduced accordingly, the pressure acting on the buffer film 104 is increased accordingly, thereby further forcing the buffer film 104 to move downward, further reducing the sealing gap between the photosensitive element 211 and the buffer film 104, and further improving the sealing effect between the photosensitive element 211 and the spacer 30. It is worth integrating that by changing the extending direction of the extending portion 303, the mechanical effect of the extending portion 303 on the buffer film 104 may be correspondingly changed, so that even if the thickness of the buffer film 104 is large, the problem that the gap between the photosensitive element 211 and the buffer film 104 in the transition area of the bottom of the spacer 30 is too large can be well solved by the extending portion 303, thereby effectively preventing process errors such as flash in the molding process.

To ensure that the buffer film 104 is firmly attached to the bottom of the spacer 30 at all times during the molding process without occurrence of process failures such as misalignment or offset. It will be appreciated by those skilled in the art that misalignment herein means that the buffer film 104 is released from the bottom of the spacer block 30 when the spacer block 30 is correspondingly attached to the photosensitive element 211, so that the photosensitive element 211 directly comes into contact with the spacer block 30, in which case the photosensitive element 211 is easily crushed or scratched by the spacer block 30. Here, the offset means that the buffer film 104 is movable between the spacer 30 and the photosensitive element 211 to generate debris by friction with the spacer 30 and the photosensitive element 211 or to trap dirt on the non-photosensitive region 2112 of the photosensitive element 211 into the photosensitive region 2111 of the photosensitive element 211, since it is not firmly fixed during the molding process.

Accordingly, as shown in fig. 7, in the preferred embodiment of the present invention, the spacer 30 further has a gas channel 105, and the gas channel 105 is formed inside the spacer 30 and connects the spacer 30 with the external environment of the forming mold, so that a negative pressure space can be effectively formed between the bottom of the spacer 30 and the buffer film 104 through the gas channel 105, so that the buffer film 104 is forced to be firmly attached to the bottom of the spacer 30 all the time during the molding process, and thus, process errors such as misalignment and offset can be effectively eliminated. More specifically, the gas passage 105 has at least a gas inlet 1051 and a gas outlet 1052, wherein the gas inlet 1051 is provided to be formed at the bottom of the separator 30, so that the air remaining between the buffer film 104 and the bottom of the separator 30 can be effectively sucked through the gas outlet 1052, whereby the buffer film 104 is firmly adsorbed at the bottom of the separator 30 by the difference in air pressure. It should be noted that the shape of the air outlet 1051 is not limited, and may be circular, triangular, porous, dense, etc., that is, only the air inlet 1051 is required to be capable of guiding out the residual air between the buffer film 104 and the upper mold 101.

Another equivalent embodiment of the present invention is shown in fig. 8, wherein the spacer 30 further comprises a rigid section 31 and a flexible section 32, said flexible section being coupled to the rigid section 31 and extending downward in alignment along the rigid section 31, wherein the flexible section 32 is in close contact with the photosensitive element 211 when the spacer 30 is correspondingly fitted to the photosensitive element 211. The flexible section 32 has a certain flexibility, and can effectively prevent the chip from being crushed or scratched, and simultaneously, due to the flexibility of the flexible section 32, the sealing effect between the photosensitive element 211 and the flexible section 32 is further enhanced in the process of being tightly adhered to the photosensitive element 211. Preferably, the flexible segment 32 is interchangeably coupled to the rigid segment 31, so that when the flexible segment 32 fails or loses its working effect, a new flexible segment 32 can be selected to replace the original flexible segment 32, in such a way that the cost of the forming mold can be reduced.

Further, the flexible segments 32 are made of a flexible material and the flexible material and molding material do not solidify with each other so that after the molding process, the flexible segments 32 can be reused to further reduce costs, such as in the preferred embodiment of the invention, the flexible material is an organic polymer and the rigid material is a metal, the flexible segments being interchangeably coupled to the metal segments to form the molded spacer 30.

It should be noted that, as will be apparent to those skilled in the art, the spacer 30 may be formed of only the flexible section, that is, the spacer 30 includes a flexible section 32, wherein the flexible section 32 is disposed to extend downward from the upper mold 101 of the molding die, and is disposed to be located at an upper portion of the photosensitive element 211 of the imaging assembly 21 to be in close contact with the photosensitive element 211 when the molding die is clamped. The flexible section 32 has a certain flexibility, and can effectively prevent the chip from being crushed or scratched, and simultaneously, due to the flexibility of the flexible section 32, the sealing effect between the photosensitive element 211 and the flexible section 32 is further enhanced in the process of being tightly adhered to the photosensitive element 211.

It should be noted that the flexible section 32 may also be detachably assembled to the upper mold 101 of the forming mold, so that when the flexible section 32 fails or loses working effect, a new flexible section 32 may be selected to replace the original flexible section 32, in this way, the cost of the forming mold may be reduced. It will be apparent to those skilled in the art that the molding tool may also be used to create a molded circuit board panel 200, wherein the molded circuit board panel 200 is formed from a plurality of molded circuit boards 20. In other words, the molding die provided by the preferred embodiment can be used to mass-produce the molded circuit board 20 to greatly improve the process productivity.

Specifically, the molding die further includes an upper die 101 and a lower die 102, wherein when the upper die 101 and the lower die 102 are closely combined, a molding space 103 is formed between the upper die 101 and the lower die 102, the imaging member 21 is panel-mounted in the molding cavity, and then a set of the molding bases 23 is integrally molded in batch on the circuit board after a molding material for molding the molding bases 23 is filled into the molding space 103 and cured, wherein each of the molding bases 23 covers the circuit board 212 and at least a portion of the photosensitive element 211.

More specifically, the molding die further includes a set of spacer blocks 30, each of the spacer blocks 30 extending within the molding space 103 when the upper and lower dies 101 and 102 are clamped, wherein the spacer blocks 30 are correspondingly disposed on an upper portion of the photosensitive element 211 of each of the imaging assemblies 21 to seal each of the photosensitive elements 211 when the imaging assemblies 21 of the molded circuit board 20 are mounted to the molding space 103, so that when the molding space 103 is filled with a molding material, the molding material cannot flow into the spacer blocks 30 and the photosensitive elements 211 to form the annular molded base 23 of the molded base 23 outside the spacer blocks 30, while the optical window 232 of the molded base 23 is formed at a position corresponding to the spacer blocks 30.

In addition, it should be noted that when the molding process is performed by using the molding die provided by the present invention, the photosensitive element 211 of the molded circuit board 20 may be electrically connected to the circuit board 212 of the molded circuit board 20 after the molding process is completed, however, the molding die provided by the present invention is preferably suitable for the molding packaging process of the circuit board 212 with the photosensitive element 211.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims

1. A molding die for producing a molded circuit board, comprising:

An upper mold; and

And a lower mold, wherein a molding space is formed when the upper mold and the lower mold are closely adhered, at least one spacer is provided in the molding space, each spacer is correspondingly provided at an upper portion of each photosensitive element to seal the photosensitive element when a circuit board assembled with at least one photosensitive element is mounted in the molding space, so that a molding base is formed at an outer side of each photosensitive element, respectively, after molding material is filled into the molding space and cured and molded, and an optical window of the molding base is formed at a position corresponding to each spacer, wherein the spacer includes a spacer body, a side tilting part integrally molded with the spacer body, and the side tilting part is formed at a side of the spacer body, and the extending part is formed at a bottom side of the spacer body and integrally extended downward from the spacer body, so that the extending part can effectively raise the spacer body and the side tilting part when the spacer is mounted in the photosensitive element, thereby allowing the wire to be more freely folded in the wiring space.

2. The molding die of claim 1, wherein the extension extends downward in a vertical direction from a bottom side of the spacer body such that the extension is approximately vertically coupled with the photosensitive element when the spacer is disposed to be laminated to the photosensitive element.

3. The molding die of claim 1, wherein the extension extends downwardly and outwardly from a bottom side of the spacer body, an angle at which the extension extends outwardly and downwardly being freely adjustable.

4. The molding die of claim 1, wherein the extension extends downwardly and inwardly from a bottom side of the spacer body, wherein an angle at which the extension extends inwardly and downwardly is freely adjustable so that the extension cooperates with the side-tipping portion to define a routing space having a shape that more closely approximates a wire arc of the wire.

5. The molding tool according to any one of claims 1-4, wherein the spacer includes a rigid section and a flexible section coupled to and extending downwardly along the rigid section in alignment, wherein the flexible section mates with the photosensitive element when the spacer is correspondingly attached to the photosensitive element.

6. The molding die of claim 5, said flexible segment being interchangeably coupled to said rigid segment such that when said flexible segment fails or fails, a new said flexible segment may be selected to replace the original said flexible segment.

7. The molding die of any one of claims 1-4, wherein the spacer is a flexible segment, wherein the flexible segment is configured to be positioned over the photosensitive element of the imaging assembly to mate with the photosensitive element when the molding die is closed.

8. The molding tool according to claim 7, wherein the flexible segment is interchangeably coupled to either the upper or lower mold of the molding tool, such that when the flexible segment fails or loses its operational effectiveness, a new flexible segment may be selected to replace the original flexible segment.

9. The molding die of claim 1, wherein the spacer further has a relief space concavely formed at a bottom of the spacer such that the relief space is disposed between the photosensitive element and the spacer when the spacer is attached to the photosensitive element to avoid the spacer from directly contacting at least a portion of the photosensitive region of the photosensitive element, thereby effectively protecting the photosensitive region of the photosensitive element from crush injury.

10. The molding die of claim 5, wherein the spacer further has a relief space concavely formed at a bottom of the spacer such that the relief space is disposed between the photosensitive element and the spacer when the spacer is attached to the photosensitive element to avoid the spacer from directly contacting at least a portion of the photosensitive region of the photosensitive element, thereby effectively protecting the photosensitive region of the photosensitive element from crush injury.

11. The molding die of claim 7, wherein the spacer further has a relief space concavely formed at a bottom of the spacer such that the relief space is disposed between the photosensitive element and the spacer when the spacer is attached to the photosensitive element to avoid the spacer from directly contacting at least a portion of the photosensitive region of the photosensitive element, thereby effectively protecting the photosensitive region of the photosensitive element from crush injury.

12. The molding die of claim 1, wherein the molding die further comprises a buffer film disposed between the spacer and the photosensitive element to enhance sealability between the spacer and the photosensitive element by the buffer film.

13. The molding die of claim 10, wherein the molding die further comprises a buffer film disposed between the spacer and the photosensitive element to enhance sealability between the spacer and the photosensitive element by the buffer film.

14. The molding die of claim 11, wherein the molding die further comprises a buffer film disposed between the spacer and the photosensitive element to enhance sealability between the spacer and the photosensitive element by the buffer film.

15. The molding die of claim 12, wherein the spacer further has a gas passage formed inside the spacer and communicating the spacer with an external environment of the molding die, so that a negative pressure space is effectively formed between the bottom of the spacer and the buffer film through the gas passage, so that the buffer film is firmly attached to the bottom of the spacer all the time during the molding process.

16. The molding die of claim 13, wherein the spacer further has a gas passage formed inside the spacer and communicating the spacer with an external environment of the molding die, so that a negative pressure space is effectively formed between the bottom of the spacer and the buffer film through the gas passage, so that the buffer film is firmly attached to the bottom of the spacer all the time during the molding process.

17. The molding die of claim 14, wherein the spacer further has a gas passage formed inside the spacer and communicating the spacer with an external environment of the molding die, so that a negative pressure space is effectively formed between the bottom of the spacer and the buffer film through the gas passage, so that the buffer film is firmly attached to the bottom of the spacer all the time during the molding process.