CN109218568A - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
- Publication number
- CN109218568A CN109218568A CN201710525696.3A CN201710525696A CN109218568A CN 109218568 A CN109218568 A CN 109218568A CN 201710525696 A CN201710525696 A CN 201710525696A CN 109218568 A CN109218568 A CN 109218568A
- Authority
- CN
- China
- Prior art keywords
- light hole
- packaging body
- photosensory assembly
- side wall
- photosensitive element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 230000003287 optical effect Effects 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- -1 Polypropylene Polymers 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000003319 supportive effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The present invention relates to a kind of camera module and its photosensory assembly, photosensory assembly includes: substrate；Photosensitive element is set on substrate and is electrically connected with the substrate, and the photosensitive element includes the photosurface equipped with photosensitive area；Packaging body is packaged on the substrate and is equipped with perforative light hole, light hole face photosensitive area, and packaging body includes the upper surface far from photosensitive element, and the lateral wall being oppositely arranged with the side wall of light hole；Light hole includes the first light hole and the second light hole, and the side wall of the first light hole is to form convex surface to the first light hole convex, and the side wall of the second light hole extends to upper surface from the apical margin inclination of the first light hole, and internal diameter is gradually increased in this direction.Above-mentioned photosensory assembly, sidewall slope extension and diameter due to the second light hole are gradually increased on the direction far from photosensitive element, and the light quantity being radiated on photosensitive element increases.The side wall of second light hole is oblique, convenient for being used to form the molding mold release of packaging body.
Description
Technical field
The present invention relates to camera module fields, more particularly to a kind of camera module and its photosensory assembly.
Background technique
With the fast development of various smart machines, the smart machine for being integrated with camera module is improving the same of image quality
When, also increasingly as lightening direction is developed.And improve image quality mean the specification of electronic component constantly increase, quantity
It is increasing, largely influences also constantly increasing for the area of the photosensitive element of image quality, therefore cause camera module
Assembling difficulty constantly increase, overall dimensions also constantly increase, cause the lightening of camera module to receive very big limitation, into
And limit the volume of the smart machine equipped with the camera module.
The camera module packaging technology generallyd use now is COB (Chip On Board) packaging technology, that is, camera shooting mould
Wiring board, photosensitive element, the bracket etc. of group are made into respectively, then successively by passive electronic component, photosensitive element and bracket
Encapsulation is in the circuit board.
However use above-mentioned molded method, it usually needs light hole is formed by supporting structure, is on wiring board
Sensitive chip provide passage of light.But currently, since light is the camera module that decision is equipped with the photosensory assembly into image quality
An important factor for amount, and current bracket shape limits the size of light passing amount, and is unfavorable for demoulding, and affects camera module
Image quality.
Summary of the invention
Based on this, it is necessary to lead to because of fault of construction that light passing amount is smaller, not easy mold release for the light hole of photosensory assembly
The problem of, the camera module and its photosensory assembly of a kind of larger, the easy demoulding of light passing amount are provided.
A kind of photosensory assembly, comprising:
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensitive element includes photosurface, institute
Stating photosurface includes photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body offers light hole, the light passing
Through photosensitive area described in the packaging body and face, the packaging body includes the upper surface far from the photosensitive element in hole, and with
The lateral wall that the side wall of the light hole is oppositely arranged；
Wherein, the light hole includes the first light hole and the second light hole of connection, the bottom end of first light hole
To the photosurface for pasting the photosensitive element, the side wall of first light hole is to be formed convex to the first light hole convex
Face, the side wall of second light hole extend to the upper surface of the packaging body from the apical margin inclination of first light hole, and
The internal diameter of second light hole is gradually increased in this direction.
Above-mentioned photosensory assembly, the sidewall slope extension and internal diameter due to the second light hole of packaging body are far from photosensitive element
Direction on be gradually increased, therefore be radiated at the light quantity on photosensitive element increase, to improve the light passing amount of photosensory assembly.And
And second light hole side wall it is oblique, can avoid convenient for being used to form the molding mold release of packaging body to packaging body
It causes to damage, finally improves the image quality of the camera module equipped with the photosensory assembly.
Further, since the side wall evagination of the first light hole forms convex surface, the envelope can be enhanced while being convenient for mold releasability
Fill the structural strength of body.
The side wall of second light hole is equipped with serration in one of the embodiments,.Second light hole
Sidewall surfaces roughening, forms multiple reflectings surface with reflection light, makes the light being radiated on the side wall of the second light hole can quilt
Reflective surface without reaching photosensitive element, thus reduce reflection veiling glare to be equipped with the photosensitive element camera module at
The influence of image quality amount.
The convex surface is arc in one of the embodiments,.
The convex surface is arc surface, radius 0.02-0.40mm in one of the embodiments,.
The radius of the arc surface is 0.07-0.30mm in one of the embodiments,.Above-mentioned radius setting can guarantee should
While the structural strength of packaging body is to play support and protective effect, make to be formed between the first light hole and the second light hole flat
It slips over and crosses.
The width of the upper surface of the packaging body is 0.3-3mm, length 2.7-8.7mm in one of the embodiments,.
The above-mentioned size design of upper surface not only can satisfy the demand of stable lens module, but also combine the miniaturization of camera module
Design.
The height of the packaging body is 0.2-2.5mm in one of the embodiments,.Above-mentioned height design can expire simultaneously
Foot encapsulation requires and Miniaturization Design.
In one of the embodiments, the side wall of first light hole between the lateral wall of the packaging body at a distance from be
0.5-5.5mm。
In one of the embodiments, the side wall of first light hole between the lateral wall of the packaging body at a distance from
For 0.93-2.14mm.The design of above-mentioned distance has taken into account structural strength and Miniaturization Design.
The packaging body further includes the lower surface being oppositely arranged with the upper surface in one of the embodiments, described
The lateral wall of packaging body, which is tilted from the following table towards the upper surface, to be extended, and the outer diameter of the packaging body is from bottom to top gradually
Reduce.The inclined design of lateral wall is conducive to the molding mold release of packaging body and avoids damage to packaging body.
The side wall of second light hole and the angle of optical axis are 3 ° -85 ° in one of the embodiments,.
The side wall of second light hole and the angle of optical axis are 20 ° -40 ° in one of the embodiments,.In this way,
Reach the light that extension is tilted to the optical axis direction of photosensitive element can along the second light hole
On photosensitive element, increase the light passing amount of the light hole, so improve the camera module equipped with the photosensory assembly at image quality
Amount.
A kind of camera module, including lens module and above-mentioned photosensory assembly, the lens module is located at the packaging body
Upper surface.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the photosensory assembly of one embodiment of the invention.
Specific embodiment
As shown in Figure 1, a kind of photosensory assembly 100 of an embodiment of the present invention, including substrate 120, photosensitive element 140 and
Packaging body 160.
Wherein, photosensitive element 140 is set on substrate 120 and is electrically connected with substrate 120, and the photosensitive element 140 includes
Photosurface 142, the photosurface 142 include photosensitive area 1421.Packaging body 160 is packaged in substrate 120 and the photosensitive element 140
On, the substrate 120 includes the lower surface 164 for the close photosensitive element 140 being oppositely arranged and the upper table far from photosensitive element 140
Face 162, packaging body 160 are equipped with the light hole 168 through upper surface 162 and lower surface 164, and the light hole 168 is right against institute
State the photosensitive area 1421 of photosensitive element 140.Lateral wall 161 of the packaging body 160 far from photosensitive element 140 is upward from lower surface 164
Surface 162 extends vertically.
Specifically, light hole 168 includes the first light hole 1682 and the second light hole 1684 of connection, first light passing
The photosurface 142 for pasting the photosensitive element 140 is supported in the bottom end in hole 1682, and the side wall of first light hole 1682 is to described first
1682 convex of light hole and form arc convex, the side wall 1683 of the second light hole 1684 is from the top of first light hole 1682
Edge tilts the upper surface 162 for extending to the packaging body 160, and the internal diameter of the second light hole 1684 gradually increases in this direction
Greatly.
Above-mentioned photosensory assembly 100, the inclination of side wall 1683 extension and internal diameter due to the second light hole 1684 of packaging body 160
The light quantity for being gradually increased, therefore being radiated on photosensitive element 140 on the direction far from photosensitive element 140 increases, to improve
The light passing amount of photosensory assembly 100.Moreover, the side wall 1683 of the second light hole 1684 is oblique, can be convenient for being used to form envelope
The molding mold release of body 160 is filled, and avoids that packaging body 160 is caused to damage, is finally improved equipped with the photosensory assembly 100
The image quality of camera module.
In the present embodiment, the side wall 1683 of the second light hole 1684 and optical axis included angle α are 3 ° -85 °, further preferably
It is 20 ° -40 °.Section of second light hole 1684 on the plane perpendicular to photosensitive element 140 is at isosceles trapezoid.In this way, in benefit
Make the light for tilting extension to the optical axis direction of photosensitive element 140 can be along the second light hole 1684 while molding mold release
It reaches on photosensitive element 140, increases the light passing amount of the light hole 168, and then improve the camera shooting equipped with the photosensory assembly 100
The image quality of mould group.
Further, since the side wall 1681 of the first light hole 1682 is in convex surface, the structural strength of the packaging body can be enhanced.
In one embodiment, the convex surface is arc surface, and radius R is 0.02-0.40mm, further preferably 0.07-
0.3mm.While the setting of above-mentioned radius can guarantee the structural strength of the packaging body 160 to play support and protective effect, make the
Smooth transition is formed between one light hole 1682 and the second light hole 1684.
In one embodiment, the side wall 1683 of the second light hole 1684 is equipped with serration 1684a.In this way, second is logical
1683 surface roughening of side wall of unthreaded hole 1684, forms multiple reflectings surface with reflection light, makes to be radiated at the second light hole 1684
Side wall 1683 on light can be by reflective surface without reaching photosensitive element 140, to reduce reflection veiling glare to setting
There is the influence of the image quality of the camera module of the photosensitive element 140.
In one embodiment, the width W of the upper surface 162 of packaging body 160 is 0.3-3mm, and length is (perpendicular to drawing in Fig. 1
Dimension) be 2.7-8.7mm.The upper surface 162 can be used for carrying lens module, although the area of upper surface 162 increases energy
Enough increase the contact surface for carrying lens module, so that the installation stable degree of lens module is promoted, but area crosses senior general's increase
The overall volume of camera module, cannot achieve Miniaturization Design.The size design of above-mentioned upper surface 162 both can satisfy stable mirror
The demand of head mould group, and combined the Miniaturization Design of camera module.
In one embodiment, the height H of packaging body 160 is 0.2-2.5mm.The height H of the packaging body 160 should consider can
To form encapsulation to other electronic components on photosensitive element 140 or substrate 120, consider to take the photograph in short transverse increase again
As the volume of mould group.Above-mentioned height H design can meet encapsulation requirement and Miniaturization Design simultaneously.
In one embodiment, the side wall 1681 of the first light hole 1682 distance T between the lateral wall 161 of packaging body 160 is
0.5-5.5mm, further preferably 0.93-2.14mm.The structural strength and camera module of distance T size influence packaging body 160
Volume, if distance T is excessive, though structural strength meets the requirements, volume is excessive, is not able to satisfy Miniaturization Design；If distance T
Too small, although can satisfy Miniaturization Design, structural strength is inadequate.The design of above-mentioned distance T taken into account structural strength and
Miniaturization Design.
Further, packaging body 160 is formed in substrate 120 by molded mode.For example, being led to using injection molding machine
Cross insert molding technique by substrate 120 carry out molding form packaging body 160.Packaging body 160 after molding and the secured phase of substrate 120
Even, compared with conventional stent is bonded by glue-line, the bonding force between packaging body 160 and substrate 120 is much greater.Specifically,
Using Shooting Technique to form the material of packaging body 160 can be nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer
Polymer) or PP (Polypropylene, polypropylene) etc..It can choose it will be apparent to a skilled person that aforementioned
Manufacture and the material that can choose are illustrative only the mode that can be implemented of the invention, are not the present invention
Limitation.
In above-described embodiment, lateral wall 161 of the packaging body 160 far from photosensitive element 140 is from lower surface 164 to upper surface
162 extend vertically.In addition in some embodiments, lateral wall 161 of the packaging body 160 far from photosensitive element 140 can be from following table
Face 164 is tilted to upper surface 162 to be extended, and the outer diameter edge of packaging body 160 gradually subtracts from lower surface 164 to 162 direction of upper surface
It is small, that is, the outer diameter of packaging body 160 is gradually reduced from bottom to top.The lateral wall 161 of packaging body 160 is oblique, is also convenient for being used for
The molding mold release of packaging body 160 is formed, and avoids that packaging body 160 is caused to damage, is finally improved equipped with this photosensitive group
The image quality of the camera module of part 100.
In the present embodiment, substrate 120 is wiring board, may be, for example, hard circuit board, ceramic substrate (without soft board),
It may be Rigid Flex, soft board.When substrate 120 is soft board, can be set in substrate 120 far from the side of photosensitive element 140
Stiffening plate (not shown) is set, to improve the intensity of substrate 120, to improve the overall structural strength of the photosensory assembly 100.
Photosensitive element 140 includes photosurface 142 and the non-photo-sensing face being arranged back on photosurface 142, first light passing
The bottom end in hole 1682, which is supported, pastes the photosurface 142.The photosurface 142 includes photosensitive area 1421 and non-photo-sensing area 1422, and is felt
Light area 1421 is located at 142 middle part of photosurface, and non-photo-sensing area 1422 is arranged around photosensitive area 1421.
In one embodiment, the photosensory assembly 100 further includes conducting wire 180, and the conducting wire 180 is electrically connected the photosensitive member
Part 140 and the substrate 120.Described 180 one end of conducting wire is located at the non-photo-sensing area 1422, and the other end is located at the substrate 120,
The 160 packed part non-photo-sensing area 1422 of packaging body simultaneously coats the conducting wire 180.In this way, 160 part of packaging body takes shape in institute
The overall volume for reducing the photosensory assembly 100 on photosensitive element 140 is stated, and can avoid conducting wire 180 and be exposed to outside packaging body 160
And it is damaged.Wherein, conducting wire 180 can be gold thread, copper wire, aluminum steel or silver wire etc..
One embodiment of the invention also provides a kind of camera module (not shown), including above-mentioned photosensory assembly 100, further includes
Lens module, the lens module are located at the upper surface 162 of the packaging body 160.
Specifically, the lens module includes camera lens when that need to use tight shot, the camera lens is located at the upper surface
162；When that need to use zoom lens, the lens module includes camera lens and the voice coil motor for being arranged the camera lens, the voice coil
Motor is located at the upper surface 162 of the packaging body 160.Light is incident from camera lens and reaches the photosurface 142 of photosensitive element 140,
Photosensitive element 140 converts optical signals into electric signal.
Above-mentioned camera module, since its photosensory assembly for including has biggish light passing while with lesser volume
Amount, therefore the camera module has preferable image quality and lesser volume, is conducive to the intelligence for being equipped with the camera module
Equipment develops while guaranteeing image quality to lightening direction.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (13)
1. a kind of photosensory assembly characterized by comprising
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensitive element includes photosurface, the sense
Smooth surface includes photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body offers light hole, and the light hole passes through
Wear photosensitive area described in the packaging body and face, the packaging body includes the upper surface far from the photosensitive element, and with it is described
The lateral wall that the side wall of light hole is oppositely arranged；
Wherein, the light hole includes the first light hole and the second light hole of connection, and patch is supported in the bottom end of first light hole
The photosurface of the photosensitive element, the side wall of first light hole are to form convex surface to the first light hole convex, institute
State the upper surface that the side wall of the second light hole extends to the packaging body from the apical margin inclination of first light hole, and described the
The internal diameter of two light holes is gradually increased in this direction.
2. photosensory assembly according to claim 1, which is characterized in that the side wall of second light hole is equipped with zigzag
Protrusion.
3. photosensory assembly according to claim 1, which is characterized in that the convex surface is arc.
4. photosensory assembly according to claim 1, which is characterized in that the convex surface is arc surface, radius 0.02-
0.40mm。
5. photosensory assembly according to claim 4, which is characterized in that the radius of the arc surface is 0.07-0.30mm.
6. photosensory assembly according to claim 1, which is characterized in that the width of the upper surface of the packaging body is 0.3-
3mm, length 2.7-8.7mm.
7. photosensory assembly according to claim 1, which is characterized in that the height of the packaging body is 0.2-2.5mm.
8. photosensory assembly according to claim 1, which is characterized in that the side wall and the packaging body of first light hole
Lateral wall between distance be 0.5-5.5mm.
9. photosensory assembly according to claim 8, which is characterized in that the side wall and the packaging body of first through hole
Lateral wall between distance be 0.93-2.14mm.
10. photosensory assembly according to claim 1, which is characterized in that the packaging body further includes and the upper surface phase
To the lower surface of setting, the lateral wall of the packaging body, which is tilted from the following table towards the upper surface, to be extended, and the encapsulation
The outer diameter of body is gradually reduced from bottom to top.
11. photosensory assembly according to claim 1, which is characterized in that the side wall of second light hole and the folder of optical axis
Angle is 3 ° -85 °.
12. photosensory assembly according to claim 11, which is characterized in that the side wall of second light hole and the folder of optical axis
Angle is 20 ° -40 °.
13. a kind of camera module, which is characterized in that the sense including lens module and as described in claim 1~12 any one
Optical assembly, the lens module are located at the upper surface of the packaging body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710525696.3A CN109218568A (en) | 2017-06-30 | 2017-06-30 | Camera module and its photosensory assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710525696.3A CN109218568A (en) | 2017-06-30 | 2017-06-30 | Camera module and its photosensory assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109218568A true CN109218568A (en) | 2019-01-15 |
Family
ID=64977055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710525696.3A Pending CN109218568A (en) | 2017-06-30 | 2017-06-30 | Camera module and its photosensory assembly |
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| CN205961279U (en) * | 2016-08-01 | 2017-02-15 | 宁波舜宇光电信息有限公司 | Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof |
| CN206922908U (en) * | 2017-06-30 | 2018-01-23 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
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2017
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|---|---|---|---|---|
| CN102809795A (en) * | 2011-04-08 | 2012-12-05 | 株式会社尼康 | Lens barrel, photographic device and lens hood |
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