CN105744131A - Array photographing module, circuit board assembly of the array photographing module and manufacturing method of the circuit board assembly of the array photographing module - Google Patents

Array photographing module, circuit board assembly of the array photographing module and manufacturing method of the circuit board assembly of the array photographing module Download PDF

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Publication number
CN105744131A
CN105744131A CN201610148338.0A CN201610148338A CN105744131A CN 105744131 A CN105744131 A CN 105744131A CN 201610148338 A CN201610148338 A CN 201610148338A CN 105744131 A CN105744131 A CN 105744131A
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CN
China
Prior art keywords
circuit board
wiring board
encapsulation part
main body
board module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610148338.0A
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Chinese (zh)
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CN105744131B (en
Inventor
王明珠
赵波杰
田中武彦
陈飞帆
丁亮
蒋恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201610148338.0A priority Critical patent/CN105744131B/en
Priority to US15/075,192 priority patent/US10750071B2/en
Publication of CN105744131A publication Critical patent/CN105744131A/en
Priority to KR1020187026153A priority patent/KR102134529B1/en
Priority to KR1020207019624A priority patent/KR102195988B1/en
Priority to EP16890345.8A priority patent/EP3419276A4/en
Priority to KR1020207036744A priority patent/KR102320911B1/en
Priority to JP2018542703A priority patent/JP7005505B2/en
Priority to CN201680082094.9A priority patent/CN108702431A/en
Priority to PCT/CN2016/103250 priority patent/WO2017140118A1/en
Priority to US15/317,118 priority patent/US10197890B2/en
Priority to TW106203625U priority patent/TWM556869U/en
Priority to TW106108561A priority patent/TWI648586B/en
Priority to US15/460,216 priority patent/US9781324B2/en
Priority to US15/460,221 priority patent/US9894772B2/en
Priority to TW107147598A priority patent/TWI701493B/en
Priority to TW106203628U priority patent/TWM559422U/en
Priority to US15/460,207 priority patent/US9955055B2/en
Priority to TW106108564A priority patent/TWI657306B/en
Priority to US15/460,213 priority patent/US10630876B2/en
Priority to US15/460,236 priority patent/US10084949B2/en
Priority to US15/461,413 priority patent/US9876949B2/en
Priority to US15/460,231 priority patent/US9876948B2/en
Priority to US15/460,235 priority patent/US10277792B2/en
Priority to US15/784,171 priority patent/US10237460B2/en
Priority to US16/101,509 priority patent/US10367983B2/en
Priority to US16/157,082 priority patent/US10670946B2/en
Priority to US16/436,934 priority patent/US10735637B2/en
Application granted granted Critical
Publication of CN105744131B publication Critical patent/CN105744131B/en
Priority to US16/855,988 priority patent/US11163216B2/en
Priority to US16/908,723 priority patent/US11303789B2/en
Priority to US16/919,065 priority patent/US11706516B2/en
Priority to US17/685,587 priority patent/US11743569B2/en
Priority to US18/203,252 priority patent/US20230300442A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

The invention discloses an array photographing module, a circuit board assembly of the array photographing module and a manufacturing method of the circuit board assembly of the array photographing module; and wherein the circuit board assembly of the array photographing module comprises a circuit board part and a connected packaging part. The circuit board part is used for electrically connecting at least two photosensitive chips of the array photographing module. The connected packaging part is integrally packaged with the circuit board part.

Description

Array camera module and circuit board module thereof and manufacture method
Technical field
The present invention relates to camera module field, further, relate to an array camera module and circuit board module thereof and manufacture method.
Background technology
At present, the all increasingly integrated more function of most electronic product, this trend makes product transboundary emerge in an endless stream, for instance mobile phone forms one and integrates variation, the three-dimensional function arrival mobile electronic devices such as communication, shooting, online, navigation after being highly integrated by initial communication equipment.
But, the camera module being configured in mobile electronic device at present is single-lens camera module mostly, and this single-lens camera module is to be all cannot meet user in the quality of image or effect for the multi-functional application demand of mobile electronic device in shooting.
Occurred and ever more popular be the camera module having more than a camera lens, such as twin-lens camera module, twin-lens camera module provides the style of shooting of apish eyes structure, and all many-sides such as this twin-lens camera module shoots with scanning, hand gesture location identification, color fidelity, rapid focus, panorama deeply in 3D shooting, background blurring shooting suffer from the performance more more excellent than single-lens camera module, therefore, the camera module having more than a camera lens is the important directions of the development of camera module industry from now on.In the process utilizing twin-lens camera module filmed image, twin-lens camera module utilizes two imaging modules with differences in spatial location to obtain image from two positions respectively, then, after the Image compounding two imaging modules shot respectively according to image combining method, the final image of many camera lenses camera module is obtained.It is understandable that, in this process, the concordance of the image effects such as the resolution of each imaging modules of many camera lenses camera module, shading, color, and the deviation value in level, vertically, longitudinally three direction, be the important indicator of the image quality weighing twin-lens camera module.
But, current stage manufacture, the technique of assembling twin-lens camera module and the structure of twin-lens camera module cannot ensure all far away the image quality of twin-lens camera module.Fig. 1 illustrates the twin-lens camera module of prior art, and it includes a wiring board 10P, two microscope base 20P and two image-forming module 30P, and each described image-forming module 30P includes a motor lens assembly 31P respectively.Each described microscope base 20P is individually located in the homonymy of described wiring board 10P, and each described microscope base 20P is linked together by described wiring board 10P, each described motor lens assembly 31P is separately positioned on each described microscope base 20P, to be supported by each described microscope base 20P.It is understandable that, packaging technology from the described twin-lens camera module of prior art, each described microscope base 20P is mounted on described wiring board 10P individually, thus the more difficult to govern controls such as the size between each described microscope base 20P, position can be caused, to such an extent as to make the size between each described twin-lens camera module support, the isoparametric concordance in position poor.nullStructure from the described twin-lens camera module of prior art，Each described microscope base 20P is independently，And each described microscope base 20P is only attached by described wiring board 10P，Owing to described wiring board 10P generally selects PCB，So that of wiring board 10P itself is comparatively soft and easily deformable，At this moment，The overall rigidity of described twin-lens camera module is difficult to ensure that，When described twin-lens camera module is assembled complete after use procedure in，Such structure is easily caused each element of described image-forming module 30P，Such as the relative size between described motor lens assembly 31P is unstable、Position of related features is big，And the optical axis of each described image-forming module 30P easily deviates the generation of the problems such as default position，Once any one in these situations occurs，The image quality of described twin-lens camera module is given in capital，The final imaging effect of such as Image compounding etc. brings uncontrollable factor or bigger adverse effect.
In addition, the assembling of many camera lenses camera module is based on traditional COB (ChipOnBoard chip package) technique, described wiring board 10P is generally of the circuit devcie 11P of protrusion, and described wiring board is installed a sensitive chip 12P, described sensitive chip 12P is connected to described wiring board 10P usually by gold thread 121P, and described protrusion generally curved for gold thread 121P and described wiring board main body, therefore, the described circuit devcie 11P and described gold thread 121P of these protrusions serves unfavorable factor for the assembling also band of camera module.
Described circuit devcie 11P and described gold thread 121P is directly exposed to the surface of described wiring board 10P, therefore in the process of follow-up assembling, such as paste described microscope base 20P, weld the processes such as described motor lens assembly 31P, inevitably it is affected, solder resist during welding, dusts etc. are easily attached to described circuit devcie 11P, and described circuit devcie 11P and described sensitive chip 12P is positioned at the space being interconnected, therefore contamination by dust thing is easy to affect described sensitive chip 12P, such impact be likely to result in assembling after camera module there is the bad phenomenon such as pitch-black point, reduce product yield.
Secondly, described microscope base 20P is positioned at the outside of described circuit devcie 11P, therefore when installing described microscope base 20P and described wiring board 10P, need reserved certain safe distance between described microscope base 20P and described circuit devcie 11P, and in the horizontal direction and upwardly direction be required for reserved safe distance, this increases the demand of camera module thickness to a certain extent so that it is thickness is difficult to reduce.
Additionally, for the molding molding relative single camera of multi-cam, relate to the coordination problem between multiple camera module, require between multiple camera lenses that optical axis is consistent, and the concordance based on multiple camera lens optical axis of traditional COB technique is more difficult to get guarantee.And multi-cam module overall volume is relatively big, intensity and flatness to wiring board are more sensitive, and therefore the thickness of wiring board is bigger.
Summary of the invention
It is an object of the present invention to provide an array camera module and circuit board module thereof and manufacture method, wherein said circuit board module includes a disjunctor encapsulation part and a wiring board portion, described disjunctor encapsulation part encapsulated moulding is in described wiring board portion, and described disjunctor encapsulation part is suitable to corresponding multiple camera lens.
It is an object of the present invention to provide an array camera module and circuit board module thereof and manufacture method, wherein said circuit board module includes a wiring board main body and at least one component, described component protrudes from described wiring board main body, described component is coated with by described disjunctor encapsulation part, from without being directly exposed to outside.
It is an object of the present invention to provide an array camera module and circuit board module thereof and manufacture method, wherein said array camera module includes multiple sensitive chip, and described disjunctor encapsulation part is around the outside of each described sensitive chip.
It is an object of the present invention to provide an array camera module and circuit board module thereof and manufacture method, wherein said disjunctor encapsulation part includes an optical filter construction section, is suitable to install multiple optical filter, from without additionally independent support parts.
It is an object of the present invention to provide an array camera module and circuit board module thereof and manufacture method, wherein said wiring board main body has multiple inner groovy, each described sensitive chip is arranged in described inner groovy, so that reducing the relative altitude of described sensitive chip and described wiring board main body, thus reducing the requirement for height to described disjunctor encapsulation part.
It is an object of the present invention to provide an array camera module and circuit board module thereof and manufacture method, wherein said wiring board main body has multiple path and multiple outer groove, described outer groove is communicated in described path, and described outer groove installs described sensitive chip with being suitable to upside-down mounting.
It is an object of the present invention to provide an array camera module and circuit board module thereof and manufacture method, wherein said wiring board portion includes a back-up coat, it is arranged at described wiring board bottom part body, to strengthen structural strength and the heat dispersion of described wiring board main body lamination.
It is an object of the present invention to provide an array camera module and circuit board module thereof and manufacture method, wherein said wiring board main body of stating has at least one reinforced hole, described disjunctor encapsulation part extends into described reinforced hole, thus strengthening the structural strength of described line plate main body.
It is an object of the present invention to provide an array camera module and circuit board module thereof and manufacture method, wherein said disjunctor encapsulation part includes a camera lens construction section, is suitable to install multiple camera lens, thus providing installation site for described camera lens.
In order to realize above goal of the invention, an aspect of of the present present invention provides the circuit board module of an array camera module, comprising: a wiring board portion, it is for being electrically connected at least two sensitive chips of described array camera module；With a disjunctor encapsulation part；Described disjunctor encapsulation part integral packaging is in described wiring board portion.
According to one embodiment of the invention, disjunctor encapsulation part described in described circuit board module forms at least two through hole, and each described through hole is relative with each described sensitive chip, to provide described sensitive chip passage of light.
According to one embodiment of the invention, disjunctor encapsulation part top described in described circuit board module is plane, for installing the support of described array camera module, camera lens, motor or optical filter.
According to one embodiment of the invention, disjunctor encapsulation part top described in described circuit board module has at least two mounting grooves, each described mounting groove is communicated in the described through hole of correspondence, to be respectively used to install the support of described array camera module, optical filter, camera lens or motor.
According to one embodiment of the invention, disjunctor encapsulation part described in described circuit board module includes a cladding section, an optical filter construction section and a camera lens construction section, described optical filter construction section and described camera lens construction section are upwards molded extension by described cladding section successively, and internal in step-like, in order to optical filter and the camera lens of described array camera module are installed.
According to one embodiment of the invention, described in described circuit board module, optical filter construction section has at least two mounting grooves, each described mounting groove is communicated in the described through hole of correspondence, form described the first step-like rank, so that installing described optical filter, described camera lens construction section has at least two camera lens mounting grooves, and each described camera lens mounting groove is communicated in the described through hole of correspondence, form described step-like second-order, in order to the camera lens of described array camera module is installed.
According to one embodiment of the invention, camera lens construction section described in described circuit board module has at least two camera lens inwalls, and each described camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.
According to one embodiment of the invention, described in described circuit board module, wiring board portion includes at least one component, described component protrudes from described wiring board main body, and described disjunctor encapsulation part is coated with described component, so that described component will not be directly exposed to outside.
According to one embodiment of the invention, component described in described circuit board module selects combination: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay.
According to one embodiment of the invention, wiring board portion described in described circuit board module includes a back-up coat, and described back-up coat lamination is arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body.
According to one embodiment of the invention, back-up coat described in described circuit board module is metallic plate, to strengthen the heat dispersion in described wiring board portion.
According to one embodiment of the invention, wiring board portion described in described circuit board module includes a screen layer, and described screen layer wraps up described wiring board main body and described disjunctor encapsulation part, to strengthen the electromagnetism interference performance of described circuit board module.
According to one embodiment of the invention, screen layer described in described circuit board module is metallic plate or wire netting.
According to one embodiment of the invention, in described circuit board module, wiring board main body has at least one reinforced hole, and described disjunctor encapsulation part extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body.
According to one embodiment of the invention, reinforced hole described in described circuit board module is groove-like.
According to one embodiment of the invention, reinforced hole described in described circuit board module is through hole, so that the moulding material of described disjunctor encapsulation part and described wiring board main body are fully contacted, and easily fabricated.
According to one embodiment of the invention, in described circuit board module, wiring board main body has at least two paths, is suitable to each described sensitive chip and is installed on described wiring board main body from direction, the described wiring board main body back side.
According to one embodiment of the invention, path described in described circuit board module is step-like, in order to provide stable installation site for described sensitive chip.
According to one embodiment of the invention, the material of wiring board main body described in described circuit board module can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
According to one embodiment of the invention, the material of disjunctor encapsulation part described in described circuit board module is selected from combination: one or more in epoxy resin, nylon, LCP or PP.
According to one embodiment of the invention, circuit board module described in described circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one lead-in wire, described lead-in wire is arranged at described disjunctor encapsulation part, and it is electrically connected to described wiring board main body, described lead-in wire includes a motor link, is revealed in described disjunctor encapsulation part, in order to connect a motor pin.
According to one embodiment of the invention, circuit board module described in described circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one lead-in wire and at least one pin groove, described lead-in wire is arranged at described disjunctor encapsulation part, and it is electrically connected to described wiring board main body, described pin groove is arranged at described disjunctor encapsulation part upper end, described lead-in wire includes a motor link, described motor link circuit is in described groove bottom wall, in order to a motor pin is electrically connected to described motor link when being plugged in described pin groove.
According to one embodiment of the invention, circuit board module described in described circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one pin groove and at least one circuit junction, described circuit junction is electrically connected to described wiring board main body, described pin groove is arranged at described disjunctor encapsulation part, the top of described disjunctor encapsulation part is extended to by described wiring board main body, and described circuit junction is revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when being plugged in described pin groove.
According to one embodiment of the invention, circuit board module described in described circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one engraving circuit, described engraving circuit is arranged at described disjunctor encapsulation part, it is electrically connected to described wiring board main body, in order to electrically connect a motor pin.
According to one embodiment of the invention, carve circuit described in described circuit board module in the way of laser formation, be arranged at described disjunctor encapsulation part.
Another aspect of the present invention provides the manufacture method of the circuit board module of an array camera module, and it includes step: unitary packed one disjunctor encapsulation part in a wiring board main body.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: arrange at least two through hole extremely described disjunctor encapsulation part.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: protruded from the component of described wiring board main body by described disjunctor encapsulation part cladding.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: form at least two mounting grooves on described disjunctor encapsulation part top, in order to mounting bracket, optical filter, motor or camera lens.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: upwardly extends described disjunctor encapsulation part, and makes each institute through hole be internally formed two stage stepped structure, in order to install optical filter or camera lens.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: arranges at least one groove-like reinforced hole in described wiring board main body, and makes described disjunctor encapsulation part extend into described reinforced hole.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: arranges at least one through hole shape reinforced hole in described wiring board main body, and makes described disjunctor encapsulation part extend into described reinforced hole.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: attach a back-up coat at described wiring board main body bottom, to strengthen the structural strength of described wiring board main body.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: be coated with a screen layer in described wiring board main body and described disjunctor encapsulation part, to strengthen the electromagnetism interference performance of described circuit board module.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: bury multiple lead-in wire underground to described disjunctor encapsulation part, and makes described lead-in wire electrically connect described wiring board main body, in order to connect a motor respectively.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: arranges multiple pin groove to described disjunctor encapsulation part upper end, and makes the motor link of described lead-in wire be revealed in described pin groove.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: arrange at least one circuit junction extremely described wiring board main body, and corresponding at least one pin groove extremely described disjunctor encapsulation part is set, described circuit junction is made to be revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when inserting described pin groove.
According to another embodiment of the present invention, the manufacture method of described circuit board module includes step: arranging multiple engraving circuit to described disjunctor encapsulation part, described engraving circuit is electrically connected to described wiring board main body, in order to be electrically connected a motor.
According to another embodiment of the present invention, carve circuit described in the manufacture method of described circuit board module in the way of laser formation, be arranged at described disjunctor encapsulation part.
Another aspect of the present invention provides an array camera module, and it includes the circuit board module described in, at least camera lens and at least sensitive chip；Each described camera lens is positioned at the photosensitive path of the described sensitive chip of correspondence, and each described sensitive chip is electrically connected to described circuit board module.
According to another embodiment of the present invention, described camera module includes a support, and described support is installed in described molding circuit pack, and described camera module includes at least two optical filters, and each described optical filter is installed in described support.
According to another embodiment of the present invention, described camera module includes at least two motors, and each described camera lens is installed in the described motor of correspondence, and each described motor is installed on described circuit board module.
According to another embodiment of the present invention, described camera module includes at least two optical filters, and each described optical filter is installed in described circuit board module.
Accompanying drawing explanation
Fig. 1 is that cuing open of prior art twin-lens camera module shows schematic diagram.
Fig. 2 A is the cut-away view of the array camera module of first preferred embodiment according to the present invention and circuit board module thereof.
Fig. 2 B is another array camera module and the wiring board cut-away view thereof of first preferred embodiment according to the present invention.
Fig. 3 is the manufacture process schematic diagram of the circuit board module of first preferred embodiment according to the present invention.
Fig. 4 is the circuit board module manufacture method schematic diagram of first preferred embodiment according to the present invention.
Fig. 5 A, 5B and 5C are the different embodiments of the motor attachment structure of the molding circuit pack of first preferred embodiment according to the present invention.
Fig. 6 is another array camera module schematic diagram of first preferred embodiment according to the present invention.
Fig. 7 is the cut-away view of the array camera module of second preferred embodiment according to the present invention and circuit board module thereof.
Fig. 8 is the cut-away view of the array camera module of the 3rd preferred embodiment according to the present invention and circuit board module thereof.
Fig. 9 is the cut-away view of the array camera module of the 4th preferred embodiment according to the present invention and circuit board module thereof.
Figure 10 is the cut-away view of the array camera module of the 5th preferred embodiment according to the present invention and circuit board module thereof.
Figure 11 is the cut-away view of the array camera module of the 6th preferred embodiment according to the present invention and circuit board module thereof.
Figure 12 is the cut-away view of the array camera module of the 7th preferred embodiment according to the present invention and circuit board module thereof.
Figure 13 is the cut-away view of the array camera module of the 8th preferred embodiment according to the present invention and circuit board module thereof.
Figure 14 is the sectional view of the array camera module of the 9th preferred embodiment according to the present invention and circuit board module thereof.
Detailed description of the invention
It is described below for disclosing the present invention so that those skilled in the art are capable of the present invention.Preferred embodiment in being described below is only used as citing, it may occur to persons skilled in the art that other apparent modification.The ultimate principle of the present invention defined in the following description can apply to other embodiments, deformation program, improvement project, equivalent and the other technologies scheme without departing from the spirit and scope of the present invention.
What it will be understood by those skilled in the art that is, in the exposure of the present invention, term " longitudinal direction ", " transverse direction ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than the device of instruction or hint indication or element must have specific orientation, with specific azimuth configuration and operation, therefore above-mentioned term is not considered as limiting the invention.
If Fig. 2 A to Fig. 4 is array camera module and the circuit board module thereof of first preferred embodiment according to the present invention.Described array camera module can be applied to various electronic equipment, to assist user can pass through the image of described array camera module shooting object or personage, for instance described array camera module can be used to the image datas such as image or the video of shooting object or personage.Preferably, described array camera module can be applied to a mobile electronic device, for instance described mobile electronic device can be but not limited to mobile phone or panel computer equipment.
As shown in Fig. 2 B to Fig. 4, the described array camera module of the present invention sets forth present disclosure and advantage in following description for its array camera module being implemented as a twin-lens.Described array camera module includes circuit board module 10, two camera lens 50 and two sensitive chips 30.
It is worth mentioning that, in order to conveniently disclose the present invention, in this embodiment in accordance with the invention, illustrate for the described array camera module that two described camera lenses 50 are constituted, and in other embodiments of the invention, the quantity of involved camera lens 50 and described sensitive chip 30 can be more, such as more than three, those skilled in the art is it should be appreciated that its quantity is not the restriction of the array camera module of the present invention.
Further, each described sensitive chip 30 is installed in described module circuit board module respectively, each described camera lens 50 is installed on described circuit board module 10, and each described camera lens 50 is positioned at the photosensitive path of each described sensitive chip 30 of correspondence position, described circuit board module 10 can be coupled to described electronic equipment.Those skilled in the art is it should be appreciated that a described camera lens 50 and a described sensitive chip 30 can cooperate for filmed image.Specifically, subject, the reflection of object or person thing light by as described in understand after camera lens 50 by as described in sensitive chip 30 receive to carry out photoelectric conversion, in other words, described sensitive chip 30 can convert optical signal into the signal of telecommunication, and the described signal of telecommunication can pass through described circuit board module 10 and be transferred into described electronic equipment, thus on described electronic equipment, generate the image relevant to reference object.
Described circuit board module 10 includes disjunctor encapsulation part 11 and a wiring board portion 12, is connected to described wiring board portion 12 described disjunctor encapsulation part 11 integral packaging, wiring board portion 12 as described in molded being connected to.More specifically, described disjunctor encapsulation part 11 is connected to described wiring board portion 12 by being molded into mode (MoldingOnBoard, the MOB) molding of wiring board.
Described wiring board portion 12 includes a wiring board main body 121, described disjunctor encapsulation part 11 forms two through hole 1100, so that described disjunctor encapsulation part 11 is respectively outside each described sensitive chip 30, and provide the passage of light of each described camera lens 50 and corresponding described sensitive chip 30.Each described sensitive chip 30 is arranged at the wiring board main body 121 of position corresponding to each described through hole 1100.
Described disjunctor encapsulation part 11 includes connector 114 and two outer ring bodies 115, described connector 114 molding is connected integrally between described two outer ring bodies 115, and outer ring body described in two 115 is divided into adjacent two parts, form two through hole 1100, sensitive chip 30 described in two is positioned at the both sides of described connector 114, thus being suitable to be used to assemble described array camera module.It is noted that described connector 114 is the common portion of camera lens 50 described in two, namely when installing described camera lens 50, each described camera lens 50 each accounts for the part by described connector 114 correspondence.
Described wiring board portion 12 includes a connection line (not shown) and at least one component 122.Described connection line defaults in described wiring board main body 121, and described component 122 is electrically connected to described connection line and described sensitive chip 30, for the photosensitive work process of described sensitive chip 30.Described component 122 it may be that citing ground but be not limited to, resistance, electric capacity, diode, triode, potentiometer, relay, driver etc..
In this embodiment in accordance with the invention, the corresponding each described sensitive chip 30 of each described component 122, in order to coordinate the work of each described sensitive chip 30.
It is worth mentioning that, described component 122 can be coated on inside by described disjunctor encapsulation part 11, hence in so that described component 122 will not be directly exposed in space, more specifically, it is not exposed in the enclosed environment communicated with described sensitive chip 30, is different from traditional camera module the existing way of component 122, such as capacitance resistance ware, thus preventing dust, foreign material from staying in component 122, pollute sensitive chip 30.In this embodiment, protrude described wiring board main body 121 for described component 122 to illustrate, in other embodiments of invention, it is internal that described component 122 is embedded in described wiring board main body 121, and it is non-bulging in described wiring board main body 121, those skilled in the art is it should be appreciated that the structure of described component 121, type and arrange the restriction that position is not the present invention.It is understandable that, the described component 122 of projection can be had between two described sensitive chips 30, it can be coated with by described connector 114, so do not need the extra installing space needing microscope base in traditional array module, so that the size of the described array camera module of the present invention reduces.
It is worth mentioning that; described disjunctor encapsulation part 11 is coated with described component 122 and has the advantage protecting described component 122 and the advantage of corresponding camera module aspect; it will be understood by those skilled in the art that described disjunctor encapsulation part 11 is not limited to be coated with described component 122.It is to say, in other embodiments of the invention, described disjunctor encapsulation part 11 can directly be molded into the wiring board of the described component 122 not protruded, it is also possible to is be molded into the diverse locations such as the outside of described component 122, surrounding.
It is worth mentioning that, in one embodiment of this invention, the protruding ground of described disjunctor encapsulation part 11 is outside described sensitive chip 30, especially, described disjunctor encapsulation part 11 closes connection integratedly so that it is have good sealing, thus when each described camera lens 50 is installed in described disjunctor encapsulation part 11, each described sensitive chip 30 is sealed in inside respectively, forms space in each self-corresponding closing.
With reference to Fig. 3 and Fig. 4, specifically, when manufacturing described circuit board module 10, it is possible at a traditional wiring board as described wiring board main body 121, mold on described wiring board main body 121 surface.Such as, in one embodiment, injection machine can be used, by insert molding (insertmolding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out integral packaging, such as molded packages, form described disjunctor encapsulation part 11, or form described disjunctor encapsulation part 11 by mould pressing process conventional in semiconductor packages.Further, each described sensitive chip 30 is mounted on described wiring board main body 121, then each described sensitive chip 30 is electrically connected with described wiring board main body 121, such as plays gold thread electrical connection.Described wiring board main body 121 can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described disjunctor encapsulation part 11 formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described disjunctor encapsulation part 11 can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt epoxy resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention.
In other embodiments of the invention, the process manufacturing described circuit board module 10 can also is that, first described wiring board 121 is carried out SMT technique, and then each described sensitive chip 30 is mounted on described wiring board main body 121, and each described sensitive chip 30 is electrically connected with described wiring board main body 121, such as play gold thread electrical connection, then described wiring board main body 121 will be carried out integral packaging, such as molded packages, described disjunctor encapsulation part 11 is formed by the mode of insert molding, or form described disjunctor encapsulation part 11 by mould pressing process conventional in semiconductor packages.Those skilled in the art is it should be appreciated that the manufacturing sequence of described circuit board module 10 is not the restriction of the present invention.
It will also be appreciated that, each described camera lens 50 is installed in the described disjunctor encapsulation part 11 of described circuit board module 10, thus described disjunctor encapsulation part 11 is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 50, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described disjunctor encapsulation part 11 is by being molded into the mode (MoldingOnBoard of wiring board, MOB) it is fixed on described wiring board main body 121, fixation procedure need not be pasted, molding mode is relative to pasting the fixing controllability with better connective stability and technical process, and the AA glue space adjusted need not be reserved between described disjunctor encapsulation part 11 and described wiring board main body 121, therefore the tradition camera module AA headspace adjusted is reduced, the thickness making array camera module is reduced；On the other hand, described disjunctor encapsulation part 11 is coated on described component 122, traditional cradling function and component 122 can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described disjunctor encapsulation part 11 of cradling function can be arranged on less scope, thus further providing the space that camera module thickness can reduce.Additionally, described disjunctor encapsulation part 11 replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that described array camera module assembles.
It will also be appreciated that, the shape of described disjunctor encapsulation part 11 can more it needs to be determined that, such as extend internally in described component 122 position, form a protuberance, thus increasing the width of described disjunctor encapsulation part 11 correspondence, and not having the position of described component 122, described disjunctor molded section 11 as one man extends, form the shape of comparison rule, and width is less.Those skilled in the art is it should be appreciated that the concrete shape of described disjunctor encapsulation part 11 is not the restriction of the present invention.
Further, described disjunctor encapsulation part 11 includes cladding section 111 and an optical filter construction section 112, being integrally connected to described cladding section 111, described cladding section 111 molding is connected to described wiring board main body 121, is used for being coated with described component 122 described optical filter construction section 112 molding.Described optical filter construction section 112 is used for installing two optical filters 40, and described optical filter 40 may be implemented as but is not limited to cutoff filter (IRCF).
That is, when described circuit board module 10 is used to assemble described array camera module, the each described optical filter 40 of described array camera module is installed in described optical filter construction section 112, described optical filter 40 is positioned on the photosensitive path of described sensitive chip 30 of correspondence, and extra optical filter 40 mounting bracket need not be provided.That is, described disjunctor encapsulation part 11 has the function of conventional stent herein, but it is based on the advantage of moulding technology, described optical filter construction section 112 top can by the technology mode of mold, make it have good planarization, so that described optical filter 40 is entirely mounted, this point is also an advantage over traditional camera module.
Further, described optical filter construction section 112 forms two mounting grooves 1121, each described mounting groove 1121 is respectively communicated with in corresponding described through hole 1100, provides sufficient installing space for described optical filter 40 so that described optical filter 40 will not protrude from the top surface of optical filter construction section 112.It is to say, described disjunctor encapsulation part 11 upper end arranges mounting groove 1121 described in two, thus each by the described disjunctor encapsulation part 11 that is installed on stable for described optical filter 40, and the top of described disjunctor encapsulation part 11 will not be protruded from.
It is worth mentioning that, in this embodiment in accordance with the invention, described mounting groove 1121 may be used for installing described optical filter 40, and in other enforcements of the present invention, described mounting groove 1121 can be used to the parts such as motor or the camera lens of installing described array camera module, those skilled in the art is it should be appreciated that the purposes of described mounting groove 1211 is not the restriction of the present invention.
According to this embodiment of the invention, described sensitive chip 30 is connected to described wiring board main body 121 by least one connecting line 31, and is electrically connected to described connection line.Described lead-in wire may be implemented as, citing ground but be not limited to, gold thread, copper cash, aluminum steel, silver wire.Especially, the described connecting line 31 of described sensitive chip 30 can be connected to described wiring board main body 121 by traditional COB mode, citing ground but be not limited to, the mode of welding.It is to say, described sensitive chip 30 and the connection of described wiring board main body 121 can make full use of existing ripe interconnection technique, to reduce the cost of improvement opportunity, traditional technique and equipment are made full use of, it is to avoid the wasting of resources.Certainly, those skilled in the art is it is to be understood that the connection of described sensitive chip 30 and described wiring board main body 121 can also pass through the connected mode realization of the goal of the invention of other any present invention being capable of, and the present invention is unrestricted in this regard.
It is worth mentioning that, in this embodiment of the present invention, each described sensitive chip 30 is arranged at the upper surface of described wiring board main body 121, described disjunctor encapsulation part 11 is around the outside of described sensitive chip 30, when manufacturing described circuit board module 10, different manufacturing sequence can be selected, citing ground but be not limited to, in one embodiment, sensitive chip 30 described in two can be first installed in described wiring board main body 121, then outside each described sensitive chip 30, in described wiring board main body 121, molding forms described disjunctor encapsulation part 11, and will protrude above the described component 122 of described wiring board main body 121 to be coated on inside it.And in another embodiment of the invention, first can mold in described wiring board main body 121 and form described disjunctor encapsulation part 11, and will protrude above the described component 122 of described wiring board main body 121 and be coated on inside it, then described sensitive chip 30 is installed on described wiring board main body 121 so that it is be positioned at the inner side of described disjunctor encapsulation part 11.
In this embodiment in accordance with the invention, illustrate for the array camera module of the composition of two camera lenses 50, described array camera module can effective a kind of mode, and by the advantage of moulding technology, consistent installation environment is provided with camera lens described in two 50, so that described array camera module obtains more excellent optical property for optical filter described in two 40.In other embodiments of the invention, described array camera module can also include two or more camera module, and correspondingly, described circuit board module 10 forms plural through hole 1100, those skilled in the art is not it should be appreciated that the quantity of described camera lens 50 is the restriction of the present invention.
With reference to Fig. 6, in one of the present invention preferably embodiment, each described camera lens 50 can include an optical lens 50 respectively, and each described optical lens 50 can be directly connected in the described disjunctor encapsulation part 11 of described circuit board module 10.That is, in this embodiment, described camera lens 50 is tight shot assembly, namely the focal length of described camera lens 50 cannot freely be adjusted, what it will be appreciated by those skilled in the art that is, described optical lens 50 described in the invention can be directly connected in described disjunctor encapsulation part 11, is connected to the situation of described disjunctor by a housing including described optical lens 50.And in the preferably embodiment of the present invention, with reference to Fig. 2 B, described array camera module includes a motor 60, each described motor 60 is installed in described disjunctor encapsulation part 11, described camera lens 50 can be drivingly coupled to described motor 60, thus described motor 60 can drive described optics along the photosensitive path movement of described sensitive chip 30, to adjust the focal length of described camera lens 50.That is, in this embodiment, described camera lens 50 is zoom lens 50 assembly, and namely the focal length of described camera lens 50 can be adjusted, such as user is when using described twin-lens 50 camera module filmed image, it is possible to adjust shooting effect by adjusting the focal length of described camera lens 50.
It is worth mentioning that, this preferred embodiment according to the present invention, described disjunctor encapsulation part 11 can be used to support installs each described optical filter 40, each described camera lens 50 or each described motor 60, there is the function of conventional stent, and based on the advantage of molding, described disjunctor encapsulation part 11 can control planarization and the concordance of described disjunctor encapsulation part by mould, thus being each described colour filter of described array camera module, 40, each described camera lens 50 provides smooth and consistent installation environment with each described motor 60, thus being easier to ensure that the concordance of each camera lens optical axis, the array camera module that this point is traditional is not readily reachable by.
It will also be appreciated that, described disjunctor encapsulation part 11 disjunctor integratedly is molded to wiring board main body 121, enhance the structural strength of described wiring board main body, the array camera module of therefore relatively conventional COB mode, the described wiring board main body 121 of the array camera module of the present invention can reach less thickness, and disclosure satisfy that each camera lens and each motor strength requirement.On the other hand, described disjunctor encapsulation part 11 so that the distance between each described camera lens 50 reduces, therefore can reduce the horizontal length and width size of described array camera module further.
Further, this preferred embodiment according to the present invention, described circuit board module 10 includes at least two motor attachment structures 13, is respectively used to connect two motors 60 of described array camera module.Each described motor 60 has at least one motor pin 61.Each described motor attachment structure 13 includes at least one lead-in wire 131, and each described lead-in wire 131 is used for electrically connecting described motor 60 and described wiring board main body 121.Each described lead-in wire 131 is electrically connected to wiring board main body 121.Further, each described lead-in wire 131 is electrically connected to the connection circuit of described wiring board main body 121.Described lead-in wire 131 is arranged at described disjunctor encapsulation part 11, and extends to the top of described disjunctor encapsulation part 11.Described lead-in wire 131 includes a motor link 1311, is revealed in the top of described disjunctor encapsulation part 11, for electrically connecting the described pin 61 of described motor 60.It is noted that described lead-in wire 131 can be arranged by embedding manner when forming described disjunctor encapsulation part 11.In traditional connected mode, such as driving the parts such as motor is all be connected to wiring board by arranging independent wire, manufacturing process relative complex, and the mode burying described lead-in wire 131 when this molding of the present invention underground can replace the technical processs such as traditional motor welding, and it is more stable that circuit is connected.Especially, in the one of the present invention implements, described lead-in wire 131 is a wire, is embedded in described disjunctor encapsulation part 11 internal.Citing ground, described motor pin 61 can be connected to described motor link 1311 by anisotropic conductive film, it is also possible to is connected to described motor link 1311 by the mode welded.
It is worth mentioning that, the position that the burial place of described lead-in wire 131 and the described motor link 1311 of described lead-in wire 131 show in described disjunctor encapsulation part 11 can be arranged as required to, such as, in one embodiment of this invention, the described motor link 1311 of described lead-in wire 131 can be arranged at the periphery of described disjunctor encapsulation part 11, the i.e. top surface of described disjunctor encapsulation part 11, the top surface of described optical filter construction section 112, and in another embodiment of the invention, described motor link 1311 can be arranged in described disjunctor encapsulation part 11 and enclose, i.e. described mounting groove 1121 bottom surface of described disjunctor encapsulation part 11, such that it is able to provide described motor 60 different installation site.In other words, when described motor 60 needs to be mounted to described disjunctor encapsulation part top, described motor link 1311 is arranged at described disjunctor encapsulation part periphery top surface, when described motor 60 needs to be mounted to described mounting groove 1121, described motor link 1311 is arranged in described disjunctor encapsulation part 11 and encloses, i.e. described mounting groove 1121 bottom surface.
That is, when manufacturing described circuit board module 10, can first mount each described sensitive chip 30 to described wiring board main body 121, in described wiring board main body 121, in the way of MOB, then mold described disjunctor encapsulation part 11, and described lead-in wire 131 can be set inside described disjunctor encapsulation part 11 with embedding manner when molding, and make described lead-in wire 131 be electrically connected to described wiring board main body 121, and make the described motor link 1311 of described lead-in wire 131 be shown in the top of described disjunctor encapsulation part, so that being connected to the described motor pin 61 of described motor 60.Citing ground, when described circuit board module 10 is used to assemble described shooting molding, the each described pin 41 of described motor 60 is connected to the described motor link 1311 of described lead-in wire 131 by the mode welded, so that described motor 60 is electrically connected to described wiring board main body 121, and needing, independent wire is set described motor 60 and described wiring board main body 121 are connected, and the length of the described motor pin 61 of described motor 60 can be reduced.
It it is an Equivalent embodiments of the described motor attachment structure of the above preferred embodiment according to the present invention with reference to Fig. 5 A.Each described motor attachment structure 13 includes a pin groove 133, and described pin groove 133 is for holding the described motor pin 61 of the described motor 60 of described array camera module.Described pin groove 133 is arranged at described disjunctor encapsulation part 11 upper end.Described motor attachment structure 13 includes each described lead-in wire 134 of at least one lead-in wire 134 for electrically connecting described motor 60 and described wiring board main body 121.Described lead-in wire 134 is arranged at described disjunctor encapsulation part 11, and extends upwardly to the groove bottom wall of the described pin groove 133 of described disjunctor encapsulation part 11.Described lead-in wire 134 includes a motor link 1341, is revealed in the groove bottom wall of the described pin groove 133 of described disjunctor encapsulation part 11, for electrically connecting the described motor pin 61 of described motor 60.Especially, in one embodiment, described motor link 1341 may be implemented as a pad.Described lead-in wire 134 may be implemented as a wire, is embedded in described disjunctor encapsulation part 11 internal.
That is, when manufacturing described circuit board module 10, first mount described sensitive chip 30, then in described wiring board main body 122, described disjunctor encapsulation part 11 is molded in the way of MOB, and the described pin groove 133 of default predetermined length, and described lead-in wire 134 can be set embedding manner when molding, and make described lead-in wire 134 be electrically connected to described wiring board main body 122, and make the described motor link 1341 of described lead-in wire 134 be shown in the groove bottom wall of described pin groove 133 of described disjunctor encapsulation part 11, so that being connected to the described pin 41 of described motor 60.Citing ground, when described circuit board module 10 is used to assemble described shooting molding, the each described motor pin 61 of described motor 60 inserts described pin groove 133, and the described motor link 1341 of described lead-in wire 134 it is connected to by the mode welded, so that described motor 60 is electrically connected to described wiring board main body 122, and needing, independent wire is set described motor 60 and described wiring board main body 122 are connected, and make can stably the connecting of described motor pin 61 of described motor 60, it is prevented that outside unwanted touches described motor pin 61.Especially, described lead-in wire 134 may be implemented as a wire, is embedded in described disjunctor encapsulation part 11 internal.
With reference to Fig. 5 B, it it is another Equivalent embodiments of the motor attachment structure of the above preferred embodiment according to the present invention.Each described motor attachment structure 13 includes a pin groove 135, and described pin groove 135 is for holding the described motor pin 61 of the described motor 60 of described array camera module.Described pin groove 135 is arranged at described disjunctor encapsulation part 11.Described motor attachment structure 13 includes at least one circuit junction 132, and described circuit junction 132 defaults in described wiring board main body 122, and is electrically connected in described wiring board main body the described connection line of 122.Further, each described pin groove 135 is extended to described wiring board main body 122 by the top of described disjunctor encapsulation part 11, and described circuit junction 132 is shown.In a kind of way of example, described motor pin 61 is adapted for insertion into described pin groove 135, and can be welded to connect with described circuit junction 132.
That is, when manufacturing described circuit board module 10, described wiring board main body 122 is preset each described circuit junction 132, and then mount 121, described photosensitive core, then in described wiring board main body 122, in the way of MOB, mold described disjunctor encapsulation part 11 and the described pin groove 135 of default predetermined length, and described circuit junction 132 is shown by described pin groove 135, in order to it is connected to the described motor pin 61 of described motor 60.Citing ground, when described circuit board module 10 is used to assemble described shooting molding, the each described motor pin 61 of described motor 60 inserts described pin groove 135, and it is connected to the described circuit junction 132 in wiring board main body 122 by the mode welded, so that described motor 60 is electrically connected to described wiring board main body 122, and the described motor pin 61 of described motor 60 can stably be connected, it is prevented that outside is unwanted touches described motor pin 61.
With reference to Fig. 5 C, it it is above-mentioned another Equivalent embodiments being preferable to carry out inner motor attachment structure according to the present invention.Described motor attachment structure 13 includes an engraving circuit 136, and described engraving circuit 136 is for electrically connecting the parts such as described connection line in described wiring board main body 122, described sensitive chip 30 and motor.Citing ground but be not limited to, described engraving circuit 136 can pass through the setting when forming described disjunctor encapsulation part 11 of the mode of laser formation (LDS).In traditional connected mode, such as driving the parts such as motor is all be connected to wiring board by arranging independent wire, manufacturing process relative complex, and the mode arranging described engraving circuit 136 when this molding of the present invention can replace the technical processs such as traditional motor welding, and it is more stable that circuit is connected.More specifically, the forming process of described engraving circuit 136 is it may be that presently described disjunctor encapsulation part 11 arranges engraving groove, then in described engraving groove, circuit is set in the way of plating.
In first embodiment of the present invention, the described motor 60 of described array camera module is connected to the mode of described disjunctor encapsulation and illustrates for the connected mode of described motor attachment structure 13, the mode of lead-in wire 131 as described in described employing, and in other embodiments of the invention, the connected mode of described motor 60 can also be corresponding with Fig. 5 A, 5B and 5C connected mode combine, pin groove 133 as described in adopting and lead-in wire 134, as described in pin groove 135 and as described in circuit junction 132.And in one embodiment of this invention, with reference to Fig. 2 A, described motor 60 can be connected to described circuit board module 10 by traditional mode, as by the mode of welding.Those skilled in the art is it should be appreciated that the connected mode of described motor 60 and described circuit board module 10 is not the present invention limits.
As it is shown in fig. 7, be array camera module and the circuit board module 10 thereof of second preferred embodiment according to the present invention.Not being both with above preferred embodiment, described circuit board module 10 includes a wiring board main body 121A.Described wiring board main body 121A includes two inner groovy 1211A, and each described sensitive chip 30 is arranged in the described inner groovy 1211A of correspondence.It is different from above-described embodiment circuit board module 10, described sensitive chip 30 arranges in described inner groovy 1211A, and described sensitive chip 30 is accommodated therein, described sensitive chip 30 is made will not substantially to protrude from the upper surface of described wiring board main body 121A, make the height reduction of the relatively described disjunctor encapsulation part 11 of described sensitive chip 30, thus reducing the described sensitive chip 30 limitation in height to described disjunctor encapsulation part 11, it is provided that reduce the probability of height further.
Further, described sensitive chip 30 is connected to described wiring board main body 121 by described connecting line 31, and is electrically connected to described connection line.Described lead-in wire may be implemented as, citing ground but be not limited to, gold thread, copper cash, aluminum steel, silver wire.It is to say, described sensitive chip 30 and described connecting line 31 are all located in the described inner groovy 1211A of described wiring board main body 121A.In one embodiment, when manufacturing described circuit board module 10, it is necessary to first described inner groovy 1211A is set on described wiring board main body 121A.It is to say, open described inner groovy 1211A on traditional wiring board so that it is be suitable to hold and install described sensitive chip 30.
Fig. 8 is the cut-away view of the array camera module of the 3rd preferred embodiment according to the present invention and circuit board module thereof.
Being different from above preferred embodiment, described circuit board module 10 includes a wiring board main body 121B, described wiring board main body 121B and has two path 1212B, and the bottom of each described path 1212B is suitable to install described sensitive chip 30.Each described path 1212B makes the described upper and lower both sides of wiring board main body 121B be connected, thus when described sensitive chip 30 is installed on described wiring board main body 121B upward by the back side of described wiring board main body 121B and photosensitive area, the photosensitive area of described sensitive chip 30 is able to receive that the light entered by described camera lens 50.
Further, described wiring board master have two outer groove 1213B, each described outer groove 1213B be communicated in correspondence described path 1212B, it is provided that the installation site of described sensitive chip 30.Especially, when described sensitive chip 30 is installed in described outer groove 1213B, the outer surface of described sensitive chip 30 is consistent with the surface of described wiring board main body 121B, is generally aligned in the same plane, thus ensureing the profile pattern of described circuit board module 10.
In this embodiment in accordance with the invention, described path 1212B is step-like, consequently facilitating install described sensitive chip 30, provides stable installation site for described sensitive chip 30, and makes its photosensitive area represent in interior space.
It is noted that in this embodiment in accordance with the invention, it is provided that a kind of be different from traditional chip mounting means, i.e. flip-chip mode (FlipChip, FC).Described sensitive chip 30 is installed on described wiring board main body 121B from the direction, the back side of described wiring board main body 121B, rather than as the front needed in above-described embodiment from described wiring board main body 121B, namely, from the top of described wiring board main body 121B, and the photosensitive area of described sensitive chip 30 is installed on described wiring board main body 121B upward.Such structure and mounting means, make described sensitive chip 30 and described disjunctor encapsulation part 11 relatively independent, the installation of described sensitive chip 30 will not be subject to the impact of described disjunctor encapsulation part 11, and the molded impact on described sensitive chip 30 of described disjunctor encapsulation part 11 is also less.In addition, described sensitive chip 30 is embedded in the lateral surface of described wiring board main body 121B, and the medial surface of described wiring board main body 121B will not be protruded from, so that reserve bigger space inside described wiring board main body 121B, the height making described disjunctor encapsulation part 11 will not be subject to the limitation in height of described sensitive chip 30 so that described disjunctor encapsulation part 11 can reach less height.
It is noted that in other embodiments of the invention, described optical filter 40 is installed in the upper end of described path 1212B, that is, described optical filter 40 need not being installed on described disjunctor encapsulation part 11, thus reducing the back focal length of described array camera module, reducing the height of described shooting.Especially, described optical filter 40 can be cutoff filter IRCF by embodiment.
Fig. 9 is the cut-away view of the array camera module of the 4th preferred embodiment according to the present invention and circuit board module 10 thereof.
Described circuit board module 10 includes a back-up coat 123C, is connected to described wiring board main body 121 bottom, in order to strengthen the structural strength of described wiring board main body 121 described back-up coat 123C lamination.That is, in described wiring board main body 121, the region bottom at described disjunctor encapsulation part 11 and described sensitive chip 30 place mounts described back-up coat 123C, so that described wiring board main body 121 reliablely and stablely supports described disjunctor encapsulation part 11 and described sensitive chip 30.
Further, described back-up coat 123C is a metallic plate, and described metallic plate is attached at the bottom of described wiring board main body 121, increase the structural strength of described wiring board main body 121, on the other hand, increase the heat dispersion of described circuit board module, the heat that the described sensitive chip 30 that can effectively scatter and disappear sends.
It is worth mentioning that, described wiring board main body 121 can adopt FPC (FlexPrintCircuit, flexible printed-circuit board), and by the rigidity of FPC described in described back-up coat 123C so that the FPC with excellent bending performance disclosure satisfy that the bearing requirements of described circuit board module.It is to say, the selectable range of described wiring board main body 121 is more extensive, for instance PCB (PrintedCircuitBoard, rigid printed circuit boards), FPC, RG (RigidFlex, Rigid Flex).Increase the structural strength of described wiring board main body 121 by described back-up coat 123B and improve heat dispersion, such that it is able to reduce the thickness of described wiring board main body 121, the height making described circuit board module reduces further, and the height being assembled the camera module obtained by it reduces.
Figure 10 is the cut-away view of the array camera module of the 5th preferred embodiment according to the present invention and circuit board module thereof.
Being different from above preferred embodiment, described wiring board main body 121D has at least one reinforced hole 1214D, and described disjunctor encapsulation part 11 extends in described reinforced hole 1214D, thus strengthening the structural strength of described wiring board main body 121D.
The position of described reinforced hole 1214D can select as required, and the structural strength demand according to described wiring board is arranged, such as structure symmetrically.Setting by described reinforced hole 1214D makes the structural strength of described wiring board main body 121D strengthen, such that it is able to reduce the thickness of described wiring board main body 121D, reduces by the thickness of the camera module of its assembling, and improves the heat dispersion of described circuit board module.
It is noted that described reinforced hole 1214D is groove-like, thus when manufacturing described circuit board module, the moulding material of described disjunctor encapsulation part 11 will not be spilt by described reinforced hole 1214D.
Figure 11 is the cut-away view of the array camera module of the 6th preferred embodiment according to the present invention and circuit board module 10 thereof.
Being different from above preferred embodiment, described wiring board main body 121E has at least one reinforced hole 1214E, and described disjunctor encapsulation part 11 extends in described reinforced hole 1214E, thus strengthening the structural strength of described wiring board main body 121E.
The position of described reinforced hole 1214E can select as required, and the structural strength demand according to described wiring board is arranged, such as structure symmetrically.Setting by described reinforced hole 1214E makes the structural strength of described wiring board main body 121E strengthen, such that it is able to reduce the thickness of described wiring board main body 121E, reduces by the thickness of the camera module of its assembling, and improves the heat dispersion of described circuit board module.
It is worth mentioning that, described reinforced hole 1214E is perforation, that is, through described wiring board main body 121E's so that the both sides connection of described wiring board main body 121E, thus when manufacturing described circuit board module, the moulding material of described disjunctor encapsulation part 11 is combined with described wiring board main body 121E fully, forming more firmly composite structure and the structure of relatively described groove-like, described perforation is easier to processing and manufacturing.
Figure 12 is the cut-away view of the array camera module of the 7th preferred embodiment according to the present invention and circuit board module thereof.
What be different from above preferred embodiment is, described disjunctor encapsulation part 11F includes a cladding section 111F, an optical filter construction section 112F and a camera lens construction section 113F, described optical filter construction section 112F and described camera lens construction section 113F molds integratedly successively and is connected to described cladding section 111F, described cladding section 111F molding is connected to described wiring board main body 121, is used for being coated with described component 122 and described connecting line 31.Described optical filter construction section 112F is used for installing described optical filter 40, that is, when described circuit board module is used to assemble described array camera module, the optical filter 40 of described array camera module is installed in described optical filter construction section 112F, described optical filter 40 is positioned on the photosensitive path of described sensitive chip 30, and extra optical filter 40 mounting bracket need not be provided.That is, described disjunctor encapsulation part 11F has the function of conventional stent herein, but it is based on the advantage of moulding technology, described optical filter construction section 112F top can by the technology mode of mold, make it have good planarization, so that described optical filter 40 is entirely mounted, this point is also an advantage over traditional camera module.Described camera lens construction section 113F is used for installing described camera lens 50, that is, when described circuit board module is used to assemble described array camera module, described camera lens 50 is installed in inside the described camera lens construction section 11F3 of described disjunctor encapsulation part 11F, in order to provide stable installation site for described camera lens 50.
Further, described optical filter construction section 112F has two mounting groove 1121F, described mounting groove 1121F and is communicated in the described through hole 1100F of correspondence, provides sufficient installing space for each described optical filter 40 so that each described optical filter 40 is stable to be installed.Described camera lens construction section 113F has two camera lens mounting groove 1131F, each described camera lens mounting groove 1131F and is communicated in the described through hole 1100F of correspondence, and respectively each described camera lens 50 provides sufficient installing space.
In other words, described optical filter construction section 112F and described camera lens construction section 113F upwardly extends integratedly, and it is internally formed step-like structure, respectively described optical filter 40 and described camera lens 50 provide and support fixed position, from without providing extra parts to install described optical filter 40 and described camera lens 50.
Described camera lens construction section 113F has two camera lens inwall 1132F, each described camera lens inwall 1132F respectively in closed annular, and being suitable to camera lens 50 provides installing space.It is noted that each described camera lens inwall 1132F surfacing of described camera lens construction section 1132F, thus being suitable to install threadless described camera lens 50, being formed and focusing module.Especially, described camera lens 50 can be fixed on described camera lens construction section 113F by bonding mode.
With reference to Figure 13, it is circuit board module and the camera module of the 9th preferred embodiment according to the present invention.What be different from above preferred embodiment is, described circuit board module 10 includes a screen layer 126, described screen layer 126 wraps up described wiring board main body 122 and described disjunctor encapsulation part 11, thus while strengthening the structural strength of described wiring board main body 122, strengthening the anti-electromagnetic interference capability of described circuit board module 10.
With reference to Figure 14, according to the camera module of the tenth of the present invention the preferred embodiment and circuit board module thereof.Being different from above preferred embodiment, described camera module includes at least one support 70, is used for installing each described optical filter 40, each described camera lens 50 or each described motor 60.According to this embodiment of the invention, described support 70 is installed in described disjunctor encapsulation part 11, and each described optical filter 40 is installed in described support 70, and each described motor 60 is installed in described support 70.The concrete shape of described support 70 can be arranged as required to, and such as arranges boss, in order to installs each described optical filter.Shown support 70 can be a disjunctor support, say, that, it is possible to the multiple described optical filter 40 of once mounting, it is also possible to be support unit, a described optical filter 40 is namely installed.In this embodiment in accordance with the invention, described support 70 is preferably disjunctor support.Those skilled in the art is it should be appreciated that the concrete shape of described support 70 is not the restriction of the present invention.
It should be understood by those skilled in the art that the embodiments of the invention shown in foregoing description and accompanying drawing are only used as citing and are not limiting as the present invention.The purpose of the present invention is completely and be effectively realized.The function of the present invention and structural principle are shown in an embodiment and illustrate, without departing under described principle, embodiments of the present invention can have any deformation or amendment.

Claims (45)

1. the circuit board module of an array camera module, it is characterised in that including:
One wiring board portion, it is for being electrically connected at least two sensitive chips of described array camera module；With
One disjunctor encapsulation part；Described disjunctor encapsulation part integral packaging is in described wiring board portion.
2. described circuit board module according to claim 1, wherein said disjunctor encapsulation part forms at least two through hole, and each described through hole is relative with each described sensitive chip, to provide described sensitive chip passage of light.
3. circuit board module according to claim 2, wherein said disjunctor encapsulation part top is plane, for installing the support of described array camera module, camera lens, motor or optical filter.
4. circuit board module according to claim 2, wherein said disjunctor encapsulation part top has at least two mounting grooves, each described mounting groove is communicated in the described through hole of correspondence, to be respectively used to install the support of described array camera module, optical filter, camera lens or motor.
5. circuit board module according to claim 2, wherein said disjunctor encapsulation part includes a cladding section, an optical filter construction section and a camera lens construction section, described optical filter construction section and described camera lens construction section are upwards molded extension by described cladding section successively, and internal in step-like, in order to optical filter and the camera lens of described array camera module are installed.
6. circuit board module according to claim 5, wherein said optical filter construction section has at least two mounting grooves, each described mounting groove is communicated in the described through hole of correspondence, form described the first step-like rank, so that installing described optical filter, described camera lens construction section has at least two camera lens mounting grooves, and each described camera lens mounting groove is communicated in the described through hole of correspondence, form described step-like second-order, in order to the camera lens of described array camera module is installed.
7. circuit board module according to claim 6, wherein said camera lens construction section has at least two camera lens inwalls, and each described camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.
8. according to the arbitrary described circuit board module of claim 1 to 7, wherein said wiring board portion includes at least one component, described component protrudes from described wiring board main body, and described disjunctor encapsulation part is coated with described component, so that described component will not be directly exposed to outside.
9. circuit board module according to claim 8, wherein said component selects combination: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay.
10. circuit board module according to claim 8, wherein said wiring board portion includes a back-up coat, and described back-up coat lamination is arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body.
11. circuit board module according to claim 10, wherein said back-up coat is metallic plate, to strengthen the heat dispersion in described wiring board portion.
12. circuit board module according to claim 8, wherein said wiring board portion includes a screen layer, and described screen layer wraps up described wiring board main body and described disjunctor encapsulation part, to strengthen the electromagnetism interference performance of described circuit board module.
13. circuit board module according to claim 12, wherein said screen layer is metallic plate or wire netting.
14. circuit board module according to claim 8, wherein wiring board main body has at least one reinforced hole, and described disjunctor encapsulation part extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body.
15. circuit board module according to claim 14, wherein said reinforced hole is groove-like.
16. circuit board module according to claim 14, wherein said reinforced hole is through hole, so that the moulding material of described disjunctor encapsulation part and described wiring board main body are fully contacted, and easily fabricated.
17. circuit board module according to claim 8, wherein wiring board main body has at least two paths, is suitable to each described sensitive chip and is installed on described wiring board main body from direction, the described wiring board main body back side.
18. circuit board module according to claim 17, wherein said path is step-like, in order to provide stable installation site for described sensitive chip.
19. circuit board module according to claim 8, the material of wherein said wiring board main body can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
20. circuit board module according to claim 8, the material of wherein said disjunctor encapsulation part is selected from combination: one or more in epoxy resin, nylon, LCP or PP.
21. circuit board module according to claim 8, wherein said circuit board module includes at least two motor attachment structures, it includes at least one lead-in wire, described lead-in wire is arranged at described disjunctor encapsulation part, and it is electrically connected to described wiring board main body, described lead-in wire includes a motor link, is revealed in described disjunctor encapsulation part, in order to connect a motor pin.
22. circuit board module according to claim 8, wherein said circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one lead-in wire and at least one pin groove, described lead-in wire is arranged at described disjunctor encapsulation part, and it is electrically connected to described wiring board main body, described pin groove is arranged at described disjunctor encapsulation part upper end, described lead-in wire includes a motor link, described motor link circuit is in described groove bottom wall, in order to a motor pin is electrically connected to described motor link when being plugged in described pin groove.
23. circuit board module according to claim 8, wherein said circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one pin groove and at least one circuit junction, described circuit junction is electrically connected to described wiring board main body, described pin groove is arranged at described disjunctor encapsulation part, the top of described disjunctor encapsulation part is extended to by described wiring board main body, and described circuit junction is revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when being plugged in described pin groove.
24. circuit board module according to claim 8, wherein said circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one engraving circuit, described engraving circuit is arranged at described disjunctor encapsulation part, it is electrically connected to described wiring board main body, in order to electrically connect a motor pin.
25. circuit board module according to claim 24, wherein said engraving circuit is arranged at described disjunctor encapsulation part in the way of laser formation.
26. the manufacture method of the circuit board module of an array camera module, it is characterised in that include step: unitary packed one disjunctor encapsulation part in a wiring board main body.
27. the manufacture method of circuit board module according to claim 26, including step: arrange at least two through hole extremely described disjunctor encapsulation part.
28. the manufacture method of circuit board module according to claim 26, including step: protruded from the component of described wiring board main body by described disjunctor encapsulation part cladding.
29. the manufacture method of circuit board module according to claim 27, including step: form at least two mounting grooves on described disjunctor encapsulation part top, in order to mounting bracket, optical filter, motor or camera lens.
30. the manufacture method of circuit board module according to claim 27, including step: upwardly extend described disjunctor encapsulation part, and make each institute through hole be internally formed two stage stepped structure, in order to install optical filter or camera lens.
31. the manufacture method of circuit board module according to claim 27, including step: the inwall at the described through hole of described disjunctor encapsulation part is threaded structure, in order to install threaded camera lens.
32. the manufacture method according to the arbitrary described circuit board module of claim 26 to 31, including step: arrange at least one groove-like reinforced hole in described wiring board main body, and make described disjunctor encapsulation part extend into described reinforced hole.
33. the manufacture method according to the arbitrary described circuit board module of claim 26 to 31, including step: arrange at least one through hole shape reinforced hole in described wiring board main body, and make described disjunctor encapsulation part extend into described reinforced hole.
34. the manufacture method according to the arbitrary described circuit board module of claim 26 to 31, including step: attach a back-up coat at described wiring board main body bottom, to strengthen the structural strength of described wiring board main body.
35. the manufacture method according to the arbitrary described circuit board module of claim 26 to 31, including step: be coated with a screen layer in described wiring board main body and described disjunctor encapsulation part, to strengthen the electromagnetism interference performance of described circuit board module.
36. the manufacture method according to the arbitrary described circuit board module of claim 26 to 31, including step: bury multiple lead-in wire underground to described disjunctor encapsulation part, and described lead-in wire is made to electrically connect described wiring board main body, in order to connect a motor respectively.
37. the manufacture method according to the arbitrary described circuit board module of claim 36, including step: arrange multiple pin groove to described disjunctor encapsulation part upper end, and make the motor link of described lead-in wire be revealed in described pin groove.
38. the manufacture method according to the arbitrary described circuit board module of claim 26 to 31, including step: arrange multiple circuit junction extremely described wiring board main body, and corresponding pin groove extremely described disjunctor encapsulation part is set, described circuit junction is made to be revealed in described pin groove, in order to motor pin is electrically connected to described circuit junction when inserting described pin groove.
39. the manufacture method according to the arbitrary described circuit board module of claim 26 to 31, including step: arranging multiple engraving circuit to described disjunctor encapsulation part, described engraving circuit is electrically connected to described wiring board main body, in order to be electrically connected a motor.
40. the manufacture method of the circuit board module according to claim 39, wherein said engraving circuit is arranged at described disjunctor encapsulation part in the way of laser formation.
41. the manufacture method according to the arbitrary described circuit board module of claim 26 to 31, wherein said disjunctor encapsulation part is integrally formed at described wiring board main body by injection moulding or mould pressing process.
42. an array camera module, it is characterised in that including:
One according to the arbitrary described circuit board module of claim 1 to 25；
At least two camera lenses；With
At least two sensitive chips；Each described camera lens is positioned at the photosensitive path of the described sensitive chip of correspondence, and each described sensitive chip is electrically connected to described circuit board module.
43. array camera module according to claim 42, wherein said array camera module includes at least one support, described support is installed in described circuit board module, and described array camera module includes at least two optical filters, and each described optical filter is installed in described support.
44. array camera module according to claim 42, wherein said array camera module includes at least two motors, and each described camera lens is installed in the described motor of correspondence, and each described motor is installed on described circuit board module.
45. array camera module according to claim 42, wherein said array camera module includes at least two optical filters, and each described optical filter is installed in described circuit board module.
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Priority Applications (32)

Application Number Priority Date Filing Date Title
CN201610148338.0A CN105744131B (en) 2016-03-15 2016-03-15 Array camera module and its circuit board module and manufacturing method
US15/075,192 US10750071B2 (en) 2016-03-12 2016-03-20 Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
KR1020187026153A KR102134529B1 (en) 2016-02-18 2016-10-25 Array imaging module and molded photosensitive assembly, circuit board assembly and method for manufacturing the same for electronic devices
KR1020207019624A KR102195988B1 (en) 2016-02-18 2016-10-25 Array imaging module and molded photosensitive assembly, cirduit board assembly and manufacturing method thereof for electronic device
EP16890345.8A EP3419276A4 (en) 2016-02-18 2016-10-25 Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device
KR1020207036744A KR102320911B1 (en) 2016-02-18 2016-10-25 Array imaging module and molded photosensitive assembly, cirduit board assembly and manufacturing method thereof for electronic device
JP2018542703A JP7005505B2 (en) 2016-02-18 2016-10-25 Manufacturing methods for array imaging modules and molded photosensitive assemblies, circuit board assemblies, and their electronic devices.
CN201680082094.9A CN108702431A (en) 2016-02-18 2016-10-25 Array camera module and its molding photosensory assembly, circuit board module and manufacturing method and electronic equipment
PCT/CN2016/103250 WO2017140118A1 (en) 2016-02-18 2016-10-25 Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device
US15/317,118 US10197890B2 (en) 2016-02-18 2016-10-25 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US15/460,207 US9955055B2 (en) 2016-02-18 2017-03-15 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
TW106108561A TWI648586B (en) 2016-03-15 2017-03-15 Camera module and array camera module based on integrated packaging process
US15/460,216 US9781324B2 (en) 2016-02-18 2017-03-15 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US15/460,221 US9894772B2 (en) 2016-02-18 2017-03-15 Manufacturing method of molded photosensitive assembly for electronic device
TW107147598A TWI701493B (en) 2016-03-15 2017-03-15 One-piece base assembly, camera module and array camera module based on integrated packaging process
TW106203628U TWM559422U (en) 2016-03-15 2017-03-15 Array camera module and its molded photosensitive assembly, circuit board assembly, and electronic device
TW106203625U TWM556869U (en) 2016-03-15 2017-03-15 Photographing module and array photographing module based upon integrally packaging technique
TW106108564A TWI657306B (en) 2016-03-15 2017-03-15 Array camera module and molded photosensitive component thereof, circuit board assembly and manufacturing method, and electronic device
US15/460,213 US10630876B2 (en) 2016-02-18 2017-03-15 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US15/460,236 US10084949B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/461,413 US9876949B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/460,231 US9876948B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/460,235 US10277792B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/784,171 US10237460B2 (en) 2016-03-12 2017-10-15 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/101,509 US10367983B2 (en) 2016-03-12 2018-08-12 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/157,082 US10670946B2 (en) 2016-02-18 2018-10-10 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US16/436,934 US10735637B2 (en) 2016-03-12 2019-06-11 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/855,988 US11163216B2 (en) 2016-02-18 2020-04-22 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US16/908,723 US11303789B2 (en) 2016-03-12 2020-06-22 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/919,065 US11706516B2 (en) 2016-03-12 2020-07-01 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US17/685,587 US11743569B2 (en) 2016-03-12 2022-03-03 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US18/203,252 US20230300442A1 (en) 2016-03-12 2023-05-30 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

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