TW201518840A - Optical image-capturing module and method of manufacturing the same, and optical auxiliary unit - Google Patents

Abstract

An optical image-capturing module and a method of manufacturing the same, and an optical auxiliary unit are disclosed in the instant disclosure. The optical auxiliary unit includes a housing frame, an optical filter and an actuator structure. The housing frame is temporarily placed on a temporary auxiliary carrying substrate, and the housing frame has a bottom opening enclosed by the temporary auxiliary carrying substrate and a top opening opposite to the bottom opening. The optical filter is fixed on the housing frame, and the top opening of the housing frame is enclosed by the optical filter. The actuator structure is fixed on the housing frame to cover the optical filter, and the actuator structure includes a lens holder fixed on the housing frame and a movable lens assembly movably disposed inside the lens holder and above the optical filter.

Description

Optical image capturing module, manufacturing method thereof, and optical auxiliary unit

The invention relates to an image capturing module, a manufacturing method thereof and an auxiliary unit, in particular to an optical image capturing module, a manufacturing method thereof and an optical auxiliary unit.

In recent years, the trend of handheld devices such as mobile phones and PDAs has become increasingly popular, and with the market demand for better handheld devices and smaller size, The group has faced the dual requirements of higher image quality and miniaturization. In view of the improvement of the image quality of the image capture module, on the one hand, the pixel is improved. The market trend is from the original VGA level of 30 pixels, which has progressed to the current two million pixels and five million pixels commonly available on the market. One thousand is a million pixels, and even more has been introduced to a higher level of more than 41 million pixels. In addition to the improvement of pixels, on the other hand, the resolution of the image is taken care of. Therefore, the image capturing module of the handheld device is also developed by the fixed focus image capturing function toward the camera-like optical autofocus function or even the optical zoom function. The optical autofocus function is operated according to different distances and close distances of the target object to appropriately move the lens in the image capturing module, so that the optical image of the image capturing object can be accurately focused on the image sensor. To produce a clear image. At present, the actuation mode that drives the lens movement in the image capturing module is generally common, including stepping motor actuation, piezoelectric actuation, and voice coil motor (VCM) actuation.

An embodiment of the invention provides an optical image capturing module, a manufacturing method thereof, and an optical auxiliary unit.

A method for fabricating an optical image capturing module according to an embodiment of the present invention includes the following steps: First, temporarily placing a plurality of frame housings on a temporary auxiliary carrier substrate, wherein each of the The frame housing has a bottom opening closed by the temporary auxiliary carrier substrate and a top opening opposite to the bottom opening; then, a plurality of filter elements are respectively fixed to the plurality of frame housings Upper end opening of each of the frame housings is closed by the corresponding filter element; then, a plurality of actuator structures are respectively fixed on the plurality of the frame housings, respectively Covering a plurality of the filter elements, wherein each of the actuator structures includes a lens carrier fixed to the corresponding frame housing and a movable movable in the lens carrier and located Corresponding movable lens assembly above the filter element; finally, removing the temporary auxiliary carrier substrate to fix a plurality of the frame housings to the plurality of image sensing units respectively, Each of the image sensing units includes a circuit substrate and an image sensing chip disposed on the circuit substrate and electrically connected to the circuit substrate, and the plurality of frame housings are respectively fixed in the plurality of On the circuit substrate, a plurality of the image sensing wafers are respectively covered.

Preferably, the step of separately fixing the plurality of filter elements on the plurality of frame housings further comprises: placing each of the filter elements by a plurality of first adhesive bodies Corresponding to the frame housing, wherein a top end of each of the frame housings has a recessed space, and each of the filter elements is accommodated in a corresponding one by a plurality of the first adhesive bodies a plurality of the first adhesive colloids are cured by ultraviolet light or an oven such that each of the filter elements is fixed by a plurality of the first adhesive colloids Corresponding to the recessed space of the frame housing.

Preferably, a plurality of said actuator structures are respectively fixed to a plurality of said frame shells The step of the body further comprising: passing the plurality of second adhesive bodies to place the lens carrier of each of the actuator structures on the corresponding frame housing; and Light or oven to cure a plurality of said second adhesive bodies such that said lens carrier of each of said actuator structures is secured to said corresponding frame housing by a plurality of said second adhesive bodies on.

Preferably, the step of fixing a plurality of the frame housings to the plurality of image sensing units respectively further comprises: placing each of the frame housings through a plurality of third adhesive bodies On the corresponding circuit substrate; and curing a plurality of the third adhesive bodies by ultraviolet light or an oven such that each of the frame housings is fixed to the phase by a plurality of the third adhesive bodies Corresponding to the circuit substrate.

Preferably, before the step of separately fixing the plurality of frame housings on the plurality of image sensing units, the method further comprises: passing each of the image sensing wafers through at least one fourth adhesive colloid Placed on the corresponding circuit substrate; curing at least one of the fourth adhesive bodies by ultraviolet light or an oven, so that each of the image sensing wafers is fixed to the phase by at least one of the fourth adhesive bodies Corresponding to the circuit substrate; and, by a plurality of conductive lines, electrically connecting each of the image sensing chips to the corresponding circuit substrate.

An optical image capturing module produced by using the optical image capturing module manufacturing method according to another embodiment of the present invention, and the optical image capturing module includes an optical auxiliary unit And an image sensing unit that cooperates with the optical auxiliary unit. Wherein the optical auxiliary unit comprises the frame housing, the filter element and the actuator structure, the filter element is fixed to a recess of the frame housing by a plurality of first adhesive bodies Within the space, the lens carrier of the actuator structure is secured to the frame housing by a plurality of second adhesive bodies. The image sensing unit includes the circuit substrate and the image sensing wafer, the image sensing wafer is fixed on the circuit substrate by at least a fourth adhesive, and the frame housing passes a plurality of said third adhesives The body is fixed to the circuit substrate.

According to still another embodiment of the present invention, an optical auxiliary unit includes: a frame housing, a filter element, and an actuator structure. The frame housing is temporarily placed on a temporary auxiliary carrier substrate, wherein the frame housing has a bottom opening closed by the temporary auxiliary carrier substrate and a top opening opposite to the bottom opening . The filter element is fixed to the frame housing, wherein the top end opening of the frame housing is closed by the filter element. The actuator structure is fixed to the frame housing to cover the filter element, wherein the actuator structure includes a lens carrier fixed to the frame housing and a movable arrangement a movable lens assembly within the lens holder and above the filter element.

The beneficial effects of the present invention may be that a plurality of frame housings are temporarily placed on a temporary auxiliary carrier substrate, and then a plurality of filter elements are respectively fixed on the plurality of the frame housings, and then multiple The actuator structures are respectively fixed on the plurality of frame housings, and finally the temporary auxiliary carrier substrate is removed to fix the plurality of the frame housings to the plurality of image sensing units, wherein each of the images The sensing unit includes a circuit substrate and an image sensing chip disposed on the circuit substrate and electrically connected to the circuit substrate.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

M‧‧‧Optical image capture module

M1‧‧‧ Optical Auxiliary Unit

M2‧‧‧ image sensing unit

S‧‧‧Temporary auxiliary carrier substrate

S1‧‧‧Adhesive layer

1‧‧‧Frame housing

10‧‧‧ recessed space

101‧‧‧Bottom opening

102‧‧‧Top opening

2‧‧‧Filter elements

3‧‧‧Activity structure

30‧‧‧Lens carrier

31‧‧‧Removable lens assembly

4‧‧‧ circuit board

5‧‧‧Image sensing wafer

H1‧‧‧First Adhesive Colloid

H2‧‧‧Second Adhesive

H3‧‧‧ Third Adhesive Colloid

H4‧‧‧Four Adhesive Colloid

W‧‧‧Flexible wire

1 is a flow chart of a method for fabricating an optical image capturing module of the present invention.

2 is a cross-sectional view showing the frame housing temporarily placed on a temporary auxiliary carrier substrate according to the present invention.

Figure 3 is a cross-sectional view showing the filter element fixed to the frame housing of the present invention.

Figure 4 is a cross-sectional view showing the actuator structure fixed to the frame housing of the present invention.

FIG. 5 is a cross-sectional view of the optical image capturing module of the present invention.

Referring to FIG. 1 to FIG. 5, the present invention provides a method for fabricating an optical image capturing module M, which includes the following steps: First, a plurality of frame housings are shown in conjunction with FIG. 1 and FIG. 1 (only one frame housing 1 is shown by way of example in FIG. 2) is temporarily placed on a temporary auxiliary carrier substrate S, wherein each frame housing 1 has a bottom opening 101 closed by a temporary auxiliary carrier substrate S. And a top opening 102 opposite to the bottom opening 101 (step S100). For example, the upper surface of the temporary auxiliary carrier substrate S has an adhesive layer S1, and the plurality of frame housings 1 pass through the adhesive layer S1 to be temporarily placed on the temporary auxiliary carrier substrate S. Thereby, the bottom end opening 101 of each frame housing 1 is closed by the temporary auxiliary carrier substrate S, so that the foreign particles in the air do not enter the frame shell from the bottom end opening 101 of the frame housing 1. Within body 1.

Furthermore, as shown in FIG. 1 and FIG. 3, a plurality of filter elements 2 (only one filter element 2 is shown by way of example in FIG. 3) are respectively fixed to a plurality of frame housings 1, each of which is framed. The top opening 102 of 1 is closed by the corresponding filter element 2 (step S102), so that the fine particles in the outside air do not enter the frame housing 1 from the top end opening 102 of the frame housing 1. For example, in the step of respectively fixing the plurality of filter elements 2 on the plurality of frame housings 1, the present invention may further comprise: first, through a plurality of first adhesive colloids H1 (for example, UV adhesive, heat hardening) Glue, or in-furnace hardening glue, etc.) to place each of the filter elements 2 on the corresponding frame housing 1, wherein the top end of each of the frame housings 1 has a recessed space 10, and each filter The component 2 passes through the plurality of first adhesive colloids H1 to be accommodated in the recessed space 10 of the corresponding frame housing 1 (step S102(a)); then, through ultraviolet light (not shown) or an oven (not shown) The plurality of first adhesive colloids H1 are cured so that each of the filter elements 2 can pass through the plurality of first adhesive colloids H1 to be fixed in the recessed space 10 of the corresponding frame housing 1 (step S102 (b) )).

In addition, as shown in FIG. 1 and FIG. 4, a plurality of actuator structures 3 (only one actuator structure 3 is shown by way of example in FIG. 4) are respectively fixed on the plurality of frame housings 1 to A plurality of filter elements 2 are respectively covered, wherein each of the actuator structures 3 includes a lens carrier 30 fixed to the corresponding frame housing 1 and a movablely disposed in the lens carrier 30 and correspondingly located The movable lens assembly 31 above the filter element 2 (step S104). For example, in the step of respectively fixing the plurality of actuator structures 3 on the plurality of frame housings 1, the present invention may further comprise: first, through a plurality of second adhesive colloids H2 (for example, UV adhesive, heat) a hardening glue, or an in-furnace hardening glue, etc.) to place the lens carrier 30 of each actuator structure 3 on the corresponding frame housing 1 (step S104(a)); then, by ultraviolet light or The oven is used to cure the plurality of second adhesive bodies H2 such that the lens carrier 30 of each of the actuator structures 3 can pass through the plurality of second adhesive bodies H2 to be fixed on the corresponding frame housing 1 (step S104 ( b)).

In addition, as shown in FIG. 1 , FIG. 4 and FIG. 5 , the temporary auxiliary carrier substrate S is removed to fix the plurality of frame housings 1 to the plurality of image sensing units M2 (only one example is shown in FIG. 5 ). On the image sensing unit M2, each of the image sensing units M2 includes a circuit substrate 4 and an image sensing chip 5 (such as a CMOS image sensing chip) disposed on the circuit substrate 4 and electrically connected to the circuit substrate 4. And a plurality of frame housings 1 are respectively fixed to the plurality of circuit substrates 4 to cover the plurality of image sensing wafers 5, respectively (step S106). For example, in the step of respectively fixing the plurality of frame housings 1 on the plurality of image sensing units M2, the present invention may further comprise: first, through a plurality of third adhesive bodies H3 (eg, UV adhesive, heat) a hardening glue, or an in-furnace hardening glue or the like) to place each frame housing 1 on the corresponding circuit substrate 4 (step S106 (a)); then, curing a plurality of third by ultraviolet light or an oven The colloid H3 is adhered so that each of the frame housings 1 can pass through the plurality of third adhesive bodies H3 to be fixed to the corresponding circuit substrate 4 (step S106 (b)).

Furthermore, as shown in FIG. 1 and FIG. 5, before the step of fixing the plurality of frame housings 1 to the plurality of image sensing units M2 (before step S106), the present invention may further include: first, at least a fourth adhesive colloid H4 to place each image sensing wafer 5 on the corresponding circuit substrate 4 (step S105 (a)); Thereafter, at least a fourth adhesive colloid H4 (for example, a UV adhesive, a heat hardening adhesive, or an in-furnace hardening adhesive, etc.) is cured by ultraviolet light or an oven, so that each image sensing wafer 5 can pass at least a fourth The adhesive H4 is adhered to the corresponding circuit substrate 4 (step S105 (b)); then, the plurality of conductive wires W are electrically connected to each of the image sensing wafers 5 to the corresponding circuit substrate 4 (Step S105 (c)). Furthermore, the upper surface of the circuit substrate 4 has a plurality of conductive pads (not labeled), the upper surface of the image sensing wafer 5 has a plurality of conductive pads (not labeled), and each of the image sensing wafers 5 The conductive pads can be electrically connected to the conductive pads of the circuit substrate 4 through the conductive wires W to achieve electrical conduction between the image sensing wafer 5 and the circuit substrate 4.

As described above, with reference to FIG. 1 , FIG. 2 and FIG. 5 , the present invention further provides an optical image capturing module M, which is fabricated by using the above-described optical image capturing module M, in which optical The image capturing module M includes an optical auxiliary unit M1 and an image sensing unit M2 that cooperates with the optical auxiliary unit M1. Furthermore, the optical auxiliary unit M1 comprises a frame housing 1, a filter element 2 and an actuator structure 3, wherein the filter element 2 can be fixed to the recessed space of the frame housing 1 by a plurality of first adhesive bodies H1. Within 10, and the lens carrier 30 of the actuator structure 3 can be secured to the frame housing by a plurality of second adhesive bodies H2. In addition, the image sensing unit M2 includes a circuit substrate 4 and an image sensing wafer 5, wherein the image sensing wafer 5 can be fixed on the circuit substrate 4 through at least a fourth adhesive body H4, and the frame housing 1 can pass through multiple The third adhesive colloid H3 is fixed to the circuit substrate 4.

It is to be noted that, as shown in FIG. 1 and FIG. 4, the present invention provides an optical auxiliary unit M1. The optical auxiliary unit M1 belongs to a semi-finished product of the optical image capturing module M, and the optical auxiliary unit M1 includes: a frame shell. Body 1, filter element 2 and actuator structure 3.

Furthermore, the frame housing 1 is temporarily placed on a temporary auxiliary carrier substrate S, and the frame housing 1 has a bottom opening 101 closed by the temporary auxiliary carrier substrate S and a bottom opening 101 opposite thereto. The top opening 102. With this, The bottom end opening 101 of the frame housing 1 is closed by the temporary auxiliary carrier substrate S, so that fine particles in the outside air do not enter the frame housing 1 from the bottom end opening 101 of the frame housing 1. For example, the upper surface of the temporary auxiliary carrier substrate S has an adhesive layer S1, and the frame housing 1 can be temporarily placed on the temporary auxiliary carrier substrate S through the adhesive layer S1.

Furthermore, the filter element 2 is fixed to the frame housing 1, and the top end opening 102 of the frame housing 1 is closed by the filter element 2, so that the foreign particles in the air do not get from the frame housing 1. The top opening 102 enters the frame housing 1. For example, the filter element 2 can be a flat glass plate coated with an anti-infrared (IR) layer and/or an anti-reflection (AR) layer, and the filter element 2 can pass through the plurality of first adhesive colloids H1, It is fixed in a recessed space 10 of the frame housing 1.

Further, the actuator structure 3 is fixed on the frame housing 1 to cover the filter element 2, and the actuator structure 3 includes a lens carrier 30 fixed to the frame housing 1 and a movable arrangement A movable lens assembly 31 within the lens holder 30 and above the filter element 2. For example, the actuator structure 3 can be a Voice Coil Motor (VCM) actuator, and the movable lens assembly 31 can be composed of a plurality of optical lenses (not labeled), but the present invention does not Limited. In addition, the lens carrier 30 of the actuator structure 3 can be fixed to the frame housing 1 through a plurality of second adhesive bodies H2.

[Possible effects of the examples]

In summary, the beneficial effects of the present invention may be that the plurality of frame housings 1 are temporarily placed on a temporary auxiliary carrier substrate S, and then the plurality of filter elements 2 are respectively fixed to the plurality of frame housings 1 And then, the plurality of actuator structures 3 are respectively fixed on the plurality of frame housings 1, and finally the temporary auxiliary carrier substrate S is removed to fix the plurality of frame housings 1 to the plurality of image sensing bodies respectively. On the unit M2, each of the image sensing units M2 includes a circuit substrate 4 and an image sensing wafer 5 disposed on the circuit substrate 4 and electrically connected to the circuit substrate 4.

The above description is only a preferred possible embodiment of the present invention, and thus is not limited to the present invention. The equivalent technical changes made by using the specification and the contents of the drawings of the present invention are included in the scope of the present invention.

M1‧‧‧ Optical Auxiliary Unit

S‧‧‧Temporary auxiliary carrier substrate

S1‧‧‧Adhesive layer

1‧‧‧Frame housing

10‧‧‧ recessed space

101‧‧‧Bottom opening

102‧‧‧Top opening

2‧‧‧Filter elements

3‧‧‧Activity structure

30‧‧‧Lens carrier

31‧‧‧Removable lens assembly

H1‧‧‧First Adhesive Colloid

H2‧‧‧Second Adhesive

Claims (10)

A manufacturing method of an optical image capturing module, comprising the steps of temporarily placing a plurality of frame housings on a temporary auxiliary carrier substrate, wherein each of the frame housings has a temporary assist a bottom end opening closed by the carrier substrate and a top end opening opposite to the bottom end opening; a plurality of filter elements respectively fixed to the plurality of frame housings, wherein each of the frame housings is a top opening is closed by the corresponding filter element; a plurality of actuator structures are respectively fixed on the plurality of frame housings to respectively cover a plurality of the filter elements, wherein each of the The actuator structure includes a lens carrier fixed to the corresponding frame housing and a movable lens assembly movably disposed in the lens carrier and located above the corresponding filter element; And removing the temporary auxiliary carrier substrate to fix the plurality of the frame housings to the plurality of image sensing units, wherein each of the image sensing units comprises a circuit substrate and a setting The circuit substrate is electrically connected to the image sensing wafer of the circuit substrate, and the plurality of frame housings are respectively fixed on the plurality of circuit substrates to cover a plurality of the image sensing wafers respectively . The manufacturing method of the optical image capturing module of claim 1, wherein the upper surface of the temporary auxiliary carrier substrate has an adhesive layer, and the plurality of the frame housings are temporarily placed through the adhesive layer. The temporary auxiliary carrier substrate. The method of fabricating the optical image capturing module of claim 1, wherein the step of fixing the plurality of filter elements to the plurality of frame housings respectively further comprises: passing the plurality of first adhesives a colloid to place each of the filter elements on the corresponding frame housing, wherein the top end of each of the frame housings has a recessed space, and each of the filter elements is received by the plurality of the first adhesive bodies in the recessed space of the corresponding frame housing; and cured by ultraviolet light or an oven The first adhesive colloids such that each of the filter elements passes through the plurality of the first adhesive bodies to be fixed in the recessed spaces of the corresponding frame housings. The manufacturing method of the optical image capturing module of claim 1, wherein the step of fixing the plurality of the actuator structures to the plurality of the frame housings respectively further comprises: passing through the plurality of second Adhering the colloid to place the lens carrier of each of the actuator structures on the corresponding frame housing; and curing a plurality of the second adhesive bodies by ultraviolet light or an oven to make The lens carrier of each of the actuator structures is fixed to the corresponding frame housing by a plurality of the second adhesive bodies. The method of manufacturing the optical image capturing module of claim 1, wherein the step of fixing the plurality of the frame housings to the plurality of image sensing units respectively further comprises: passing a plurality of third Adhering a colloid to place each of the frame housings on the corresponding circuit substrate; and curing a plurality of the third adhesive bodies by ultraviolet light or an oven such that each of the frame housings passes A plurality of the third adhesive bodies are fixed on the corresponding circuit substrate. The method of manufacturing the optical image capturing module of claim 1, wherein before the step of fixing the plurality of the frame housings to the plurality of image sensing units, the method further comprises: passing at least a fourth Adhering the colloid to place each of the image sensing wafers on the corresponding circuit substrate; curing at least one of the fourth adhesive colloids by ultraviolet light or an oven so that each One of the image sensing wafers is fixed to the corresponding circuit substrate by at least one of the fourth adhesive bodies; and a plurality of conductive lines are used to electrically connect each of the image sensing wafers to the phase Corresponding to the circuit substrate. An optical image capturing module produced by the method for fabricating an optical image capturing module of claim 1, wherein the optical image capturing module includes an optical auxiliary unit, and the optical auxiliary unit The frame housing, the filter element, and the actuator structure are included, the filter element is fixed in a recessed space of the frame housing by a plurality of first adhesive bodies, and the The lens carrier of the actuator structure is secured to the frame housing by a plurality of second adhesive bodies. The optical image capturing module of claim 7, further comprising: an image sensing unit, wherein the optical auxiliary unit and the image sensing unit cooperate with each other, and the image sensing unit comprises the circuit substrate And the image sensing wafer, the image sensing wafer is fixed on the circuit substrate by at least a fourth adhesive body, and the frame housing is fixed by the plurality of the third adhesive bodies On the circuit board. An optical auxiliary unit comprising: a frame housing temporarily placed on a temporary auxiliary carrier substrate, wherein the frame housing has a bottom end closed by the temporary auxiliary carrier substrate An opening and a top opening opposite to the bottom opening; a filter element, the filter element being fixed to the frame housing, wherein the top opening of the frame housing is the filter element Enclosed; and an actuator structure fixed to the frame housing to cover the filter element, wherein the actuator structure includes a lens fixed to the frame housing A carrier and a movable lens assembly movably disposed within the lens carrier and above the filter element. The optical auxiliary unit of claim 9, wherein the temporary auxiliary carrier substrate The upper surface has an adhesive layer, and the frame housing is temporarily placed on the temporary auxiliary carrier substrate through the adhesive layer, wherein the filter element is fixed to the frame by a plurality of first adhesive bodies The lens carrier of the actuator structure is secured to the frame housing by a plurality of second adhesive bodies.