CN111935384A - Photosensitive assembly, camera module, terminal equipment and preparation method - Google Patents
Photosensitive assembly, camera module, terminal equipment and preparation method Download PDFInfo
- Publication number
- CN111935384A CN111935384A CN202010883441.6A CN202010883441A CN111935384A CN 111935384 A CN111935384 A CN 111935384A CN 202010883441 A CN202010883441 A CN 202010883441A CN 111935384 A CN111935384 A CN 111935384A
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- photosensitive
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- circuit board
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 53
- 238000000034 method Methods 0.000 claims description 28
- 230000008569 process Effects 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000009966 trimming Methods 0.000 claims description 3
- 239000003351 stiffener Substances 0.000 claims 2
- 206010070834 Sensitisation Diseases 0.000 abstract description 16
- 230000008313 sensitization Effects 0.000 abstract description 16
- 238000003384 imaging method Methods 0.000 abstract description 7
- 230000001154 acute effect Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 64
- 230000008901 benefit Effects 0.000 description 6
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The application discloses photosensitive assembly, module of making a video recording, terminal equipment and preparation method, this photosensitive assembly includes: the circuit board is provided with a containing hole, and the containing hole penetrates through the upper surface and the lower surface of the circuit board; the reinforcing plate is fixedly overlapped with the circuit board, and the exposed area of the surface of the reinforcing plate is overlapped with the accommodating hole; the edge position of the exposed area is provided with a soft film; the photosensitive chip is attached to the exposed area of the reinforcing plate and is accommodated in the accommodating hole; the edge area of the photosensitive chip is supported by the soft film. The application provides a sensitization subassembly, module and terminal equipment make a video recording appear phenomenons such as distortion, corner light loss and acute angle fall easily in the marginal position that is used for solving the sensitization chip that exists among the prior art, influence the technical problem of imaging quality. The technical effect of improving the imaging quality is achieved.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a photosensitive assembly, a camera module, a terminal device and a preparation method.
Background
With the popularization of mobile terminals, people can not leave various mobile terminals in life and work. The camera shooting function of the mobile terminal is more widely applied, and the requirement of users on the quality of the shot images of the camera shooting module of the mobile terminal is higher and higher.
The sensitization chip of the module of making a video recording now is directly pasted on stiffening plate or circuit board, and the light that gets into the module of making a video recording appears phenomenons such as distortion, corner light loss and acute angle fall easily in the border position of sensitization chip to reduced the pixel of the module formation of image of making a video recording, influenced the imaging quality.
Content of application
In view of the above, the present application is made to provide a photosensitive assembly, an image pickup module, a terminal device, and a manufacturing method that overcome or at least partially solve the above problems.
In a first aspect, the present application provides a photosensitive assembly, comprising:
the circuit board is provided with a containing hole, and the containing hole penetrates through the upper surface and the lower surface of the circuit board;
the reinforcing plate is fixedly overlapped with the circuit board, and the exposed area of the surface of the reinforcing plate is overlapped with the accommodating hole; the edge position of the exposed area is provided with a soft film;
the photosensitive chip is attached to the exposed area of the reinforcing plate and is accommodated in the accommodating hole; the edge area of the photosensitive chip is supported by the soft film.
Optionally, the accommodating hole is a polygonal cavity, the exposure region is a polygonal region, and the flexible membrane is disposed at a corner of the exposure region.
Optionally, the accommodating hole is a square cavity, the exposed area is a square area, and the flexible films are arranged at the positions of the four corners of the exposed area.
Optionally, the flexible film is a polyimide film.
Optionally, the middle of the photosensitive chip is bonded and fixed with the middle of the exposed area.
Optionally, the reinforcing plate is a steel plate.
Optionally, the edge area of the photosensitive chip is supported by the soft film until the middle of the photosensitive surface of the photosensitive chip is lower than the edge area of the photosensitive surface.
Optionally, the flexible film is pressed by the edge area of the photosensitive chip to deform to support and protect the photosensitive chip.
Optionally, the photosensitive assembly includes more than two circular flexible films, and the distance between the center of each flexible film and the inner edge of the accommodating hole is the same.
In a second aspect, a camera module is provided, which includes: the photosensitive assembly of the first aspect.
In a third aspect, a terminal device is provided, including: the camera module of the second aspect.
In a fourth aspect, there is provided a method for producing a photosensitive member, the method being for producing the photosensitive member according to any one of claims 1 to 9, the method comprising:
attaching the soft film to the reinforcing plate;
attaching the circuit board provided with the accommodating hole to the reinforcing plate to enable the soft film to be located at the edge position of the exposed area on the surface of the reinforcing plate;
attaching the photosensitive chip to the exposed area on the surface of the reinforcing plate, wherein the photosensitive chip is accommodated in the accommodating hole; the edge area of the photosensitive chip is supported by the soft film;
optionally, the attaching the soft film to the reinforcing plate includes: attaching a whole piece of soft film to the fixed reinforcing plate; prepressing and fixing the whole piece of soft film and the reinforcing plate; firing the whole film by laser to form a patterned film for supporting the photosensitive chip at the edge position of the preset exposure area; and removing the rest soft films except the patterned soft film, and trimming the edge of the patterned soft film.
Optionally, the stiffening plate is attached to the circuit board with the accommodating hole, including: carrying out a forming process and a pressing plate flattening process on the circuit board and the reinforcing plate; and the circuit board and the reinforcing plate are attached and fixed.
The technical scheme provided in the embodiment of the application at least has the following technical effects or advantages:
the embodiment of the application provides a photosensitive assembly, the module of making a video recording, terminal equipment and preparation method, set up the holding hole on the circuit board and come the holding to paste the sensitization chip on the stiffening plate, and be located the marginal position of the downthehole circuit area of holding at the stiffening plate and set up the mantle, support the marginal area of attached sensitization chip in exposing the region with the mantle as the strong point, the control is bent and raised the degree, with effectively avoid marginal area to be higher than the phenomenon at edge to the photosurface central authorities that the sensitization chip that leads to is close to on the stiffening plate surface, the marginal position that reduces the sensitization chip appears the distortion, the probability of phenomena such as corner light loss and acute angle fall, effectively improved imaging quality.
The foregoing description is only an overview of the technical solutions of the present application, and the present application can be implemented according to the content of the description in order to make the technical means of the present application more clearly understood, and the following detailed description of the present application is given in order to make the above and other objects, features, and advantages of the present application more clearly understandable.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a schematic perspective view of a photosensitive assembly according to an embodiment of the present disclosure;
FIG. 2 is a schematic side view of a photosensitive assembly according to an embodiment of the present disclosure;
FIG. 3 is a schematic front view of a photosensitive assembly according to an embodiment of the present disclosure;
fig. 4 is a structural diagram of a camera module in the embodiment of the present application;
fig. 5 is a structural diagram of a mobile terminal in an embodiment of the present application;
FIG. 6 is a flow chart of the fabrication of a photosensitive assembly according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In an alternative embodiment, there is provided a photosensitive assembly, as shown in fig. 1-3, comprising:
the circuit board comprises a circuit board 1, wherein a containing hole 11 is formed in the circuit board 1, and the containing hole 11 penetrates through the upper surface and the lower surface of the circuit board 1;
the reinforcing plate 2 is fixedly overlapped with the circuit board 1, and an exposed area 21 on the surface of the reinforcing plate 2 is overlapped with the accommodating hole 11; the edge position of the exposed area 21 is provided with a soft film 22;
the photosensitive chip 3 is attached to the exposed area 21 of the reinforcing plate 2 and is accommodated in the accommodating hole 11; the edge area of the photosensitive chip 3 is supported by the flexible film 22.
Particularly, the photosensitive assembly in the module of making a video recording often directly coats glue in bottom surface middle part, and the rethread glue is pasted on the stiffening plate, and in order to avoid glue to spill over, there is the glue support of solidification in the photosensitive assembly middle part, but marginal area often does not have. Therefore, the photosensitive chip is usually in a shape with a high middle part and a low periphery or close to a plane, so that the problems of light distortion, light loss, acute angle reduction and the like are easily caused at the edge.
This application sets up holding hole 11 on circuit board 1 and comes the holding sensitization chip, plays the guard action to sensitization chip 3 edge on the one hand, and on the other hand has further fixed sensitization chip 3's position, makes things convenient for circuit board 1 and sensitization chip 3's bonded connection on the one hand again.
And, this application sets up at the stiffening plate 2 and sets up the mantle 22 by the marginal position that the holding hole 11 encloses shows the regional 21 that exposes, on the one hand, support the marginal area of pasting the photosensitive chip 3 who exposes regional 21 through the mantle 22 as the strong point for marginal area can not be less than the middle part, guarantee imaging quality, on the other hand, paste the in-process that photosensitive chip 3 pushed down, mantle 22 is because its compliance is highly adjustable, photosensitive chip 3 and soft material contact are protected the chip to avoid damaging deliberately, and because the high accessible extrusion of mantle 22 is adjusted and can also be played the effect of absorbing assembly tolerance.
The following describes the specific structure of the photosensitive assembly:
the circuit board 1 may be electrically connected to an external control and computation module via a flexible circuit board. The circuit board 1 has a through-hole 11 formed in the middle or side thereof, and the cross-sectional shape of the through-hole 11 is not limited and may be circular or polygonal.
The upper surface of the reinforcing plate 2 and the lower surface of the circuit board 1 may be fixed by adhesion or by engagement, which is not limited herein. The reinforcing plate is preferably a steel plate, but may be other hard plates.
After the reinforcing plate 2 is overlapped and fixed with the circuit board 1, the upper region of the reinforcing plate 1 corresponding to the position of the accommodating hole 11 on the circuit board is exposed through the accommodating hole 11, i.e. the exposed region 21. Therefore, the exposed area 21 corresponds to the position, shape and size of the accommodating hole 11, the cross section of the accommodating hole 11 is circular, the exposed area 21 is also circular with the same size, the cross section of the accommodating hole 11 is polygonal, and the exposed area 21 is also polygonal with the same size.
The flexible film 22 is disposed at the edge of the exposed region 21, and the specific arrangement may be various, for example: the soft film 22 may be a plurality of independent point-like soft films as shown in fig. 1, distributed at the edge of the exposed region 21 to serve as a supporting point for supporting the edge of the photosensitive chip 3; the flexible film 22 can be a plurality of strip-shaped flexible films which are distributed along the inner side of the edge of the exposed area 21 in an isolated manner and used as a supporting strip for supporting the edge of the photosensitive chip 3; the flexible film 22 may be a closed ring-shaped flexible film, and is continuously distributed along the inner side of the edge of the exposed area 21 to fully support the edge of the photosensitive chip 3, which is not limited herein and is not listed.
Preferably, the thickness of the soft film can be set to 65 + -5 um, 75 + -5 um or 85 + -5 um.
In the specific implementation process, the arrangement positions of the corresponding flexible films 22 may be different according to the shape of the exposed area 21. Take the soft film 22 as a plurality of independent point-like soft films as an example: if the containing hole 11 is a polygonal cavity, the corresponding exposed area 21 is a polygonal area, and the soft film 22 is arranged at the position of the corner of the exposed area 21 so as to support the corner where the chip is more prone to sag, thereby ensuring the degree of warpage. Further, if the containing hole 11 is a square cavity, the exposed area is a square area 21, and the flexible films are arranged at the positions of the four corners of the exposed area 21. Preferably, as shown in fig. 2, the center of each of the flexible films 22 is at the same distance from the inner edge of the containing hole, and a is set to be 0.65 ± 0.10 mm. Preferably, the diameter of the dot-shaped soft membrane can be 0.6 +/-0.05 mm.
Further, if the shape of the accommodating hole 11 does not match the shape of the photosensitive chip 3, the position of the flexible film 22 is preferentially set according to the shape of the photosensitive chip 3, so that the flexible film 22 can be aligned to the corner supporting the photosensitive chip 3, and the warping degree of the flexible film is ensured.
Preferably, the flexible film 22 may be a polyimide film to obtain sufficient supporting force and flexibility. The flexible film 22 may be a flexible material such as a cover film that can be adjusted in height by compression.
In particular embodiments, the flexible film 22 is applied to the exposed area 21 by pressing or gluing. The photosensitive chip 3 is attached to the exposed area 21. Preferably, the middle of the bottom surface of the photosensitive chip 3 and the middle of the exposed area 21 are fixed by gluing.
The edge area of the photosensitive chip 3 is supported by the soft film 22 to prevent the edge area of the photosensitive chip 3 from being lower than the middle part, and the soft film 22 is deformed due to its flexibility after being stressed, and also protects the photosensitive chip 3 when supporting it. Preferably, the soft film 22 is arranged to support the photosensitive chip 3 until the middle part of the photosensitive surface is lower than the edge area of the photosensitive surface, so that the probability of phenomena such as distortion, corner light loss, acute angle reduction and the like at the edge position of the photosensitive chip is better reduced, and the imaging quality is effectively improved.
The photosensitive chip 3 is electrically connected to the circuit board, and may be specifically a bonding or wire connection, which is not limited herein.
Based on the same application concept, the application further provides a camera module, as shown in fig. 4, the camera module comprises the photosensitive component 401 provided by the application and further comprises a lens component 402, and the lens component 402 is arranged on a photosensitive path of the photosensitive component 401.
Based on the same application concept, the application further provides a terminal device, as shown in fig. 5, the terminal device comprises the camera module 501 provided by the application, and the camera module is installed on a terminal body of the terminal device. The terminal device may be a smart phone, a notebook, a tablet, or a smart watch, and the like, which is not limited herein.
Based on the same application concept, the present application further provides a method for manufacturing a photosensitive assembly, the method is used for manufacturing the photosensitive assembly, as shown in fig. 6, and the method includes:
step S601, attaching the soft membrane to the reinforcing plate;
step S602, attaching the circuit board provided with the accommodating hole to the reinforcing plate, so that the flexible film is located at an edge position of the exposed area on the surface of the reinforcing plate;
step S603, adhering the photosensitive chip to the exposed area on the surface of the reinforcing plate, wherein the photosensitive chip is accommodated in the accommodating hole; the edge area of the photosensitive chip is supported by the soft film.
Specifically, the process of attaching the flexible film to the reinforcing plate may include steps S6011 to S6014:
step S6011, adhering a whole piece of flexible film on the fixed reinforcing plate. That is, in this step, the film is a single sheet, and no pattern is formed, and the single sheet of film is first laminated to the surface of the reinforcing plate in a full-page manner.
And S6012, prepressing and fixing the whole piece of soft film and the reinforcing plate. In order to better fix mantle and stiffening plate, prevent the useless board of dislocation, can adopt twice prepressing to fix: the first prepressing is to initially align and fix the soft membrane and the reinforcing plate to prevent the soft membrane from falling off, and the position can be adjusted at the moment; and the soft film is firmly pressed and fixed on the reinforcing plate by the second pre-pressing.
Step S6013, firing the whole film by laser to form a patterned film for supporting the photosensitive chip at the edge position of the preset exposure area. By this step, the whole piece of the flexible film can be fired to a desired shape at a predetermined position, for example, a round flexible film is formed at a corner of a predetermined exposed region. Furthermore, after the patterned soft film is formed by firing, pressing can be carried out again to prevent the soft film from falling off caused by the firing process.
And step S6014, removing the rest soft films except the patterned soft film, and trimming the edge of the patterned soft film. Namely, unnecessary soft film waste is fished out, and burrs and the like on the periphery of the required graphical soft film are trimmed off.
After the patterned flexible film is fixed on the reinforcing plate, the circuit board provided with the accommodating hole is attached to the reinforcing plate, and the process can include steps S6021-S6022:
step S6021, the circuit board and the reinforcing plate are both subjected to a molding process and a pressing plate flattening process. In the specific implementation process, the plate identification characters can be printed on the circuit board, and then the circuit board and the reinforcing plate are molded. The circuit board can be formed by forming the accommodating hole of the circuit board by adopting a UV forming process and punching to form the circuit board with a preset size. The forming of the reinforcing plate can adopt a CNC forming process or a laser cutting process. And after the reshaping, pressing the circuit board and the reinforcing plate to flatten the plate.
And step S6022, attaching and fixing the circuit board and the reinforcing plate. Namely, the circuit board and the reinforcing plate which are molded and pressed are pressed together.
And finally, gluing and bonding the photosensitive chip and other post processes.
Since the method for manufacturing the photosensitive assembly provided by this embodiment is a method for manufacturing the photosensitive assembly provided by this application, the structure, the process parameters, and the like of the photosensitive assembly have been described in detail in the description of the photosensitive assembly, and for the sake of brevity of the description, the description will not be repeated here.
The technical scheme provided in the embodiment of the application at least has the following technical effects or advantages:
the embodiment of the application provides a photosensitive assembly, the module of making a video recording, terminal equipment and preparation method, set up the holding hole on the circuit board and come the holding to paste the sensitization chip on the stiffening plate, and be located the marginal position of the downthehole circuit area of holding at the stiffening plate and set up the mantle, support the marginal area of attached sensitization chip in exposing the region with the mantle as the strong point, the control is bent and raised the degree, with effectively avoid marginal area to be higher than the phenomenon at edge to the photosurface central authorities that the sensitization chip that leads to is close to on the stiffening plate surface, the marginal position that reduces the sensitization chip appears the distortion, the probability of phenomena such as corner light loss and acute angle fall, effectively improved imaging quality.
Moreover, those skilled in the art will appreciate that while some embodiments herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments.
It should be noted that the above-mentioned embodiments illustrate rather than limit the application, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if such modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to encompass such modifications and variations.
Claims (14)
1. A photosensitive assembly, comprising:
the circuit board is provided with a containing hole, and the containing hole penetrates through the upper surface and the lower surface of the circuit board;
the reinforcing plate is fixedly overlapped with the circuit board, and the exposed area of the surface of the reinforcing plate is overlapped with the accommodating hole; the edge position of the exposed area is provided with a soft film;
the photosensitive chip is attached to the exposed area of the reinforcing plate and is accommodated in the accommodating hole; the edge area of the photosensitive chip is supported by the soft film.
2. A photosensitive assembly according to claim 1, wherein said receiving hole is a polygonal cavity, said exposure region is a polygonal region, and said flexible film is disposed at a corner of said exposure region.
3. The photosensitive assembly of claim 1, wherein the receiving hole is a square cavity, the exposed area is a square area, and the flexible film is disposed at the four corners of the exposed area.
4. A photosensitive assembly according to claim 1, wherein said flexible film is a polyimide film.
5. A photosensitive assembly according to claim 1, wherein a central portion of said photosensitive chip is adhesively fixed to a central portion of said exposed region.
6. A photosensitive assembly according to claim 1, wherein said reinforcing plate is a steel plate.
7. The photosensitive assembly of claim 1, wherein the edge region of the photosensitive chip is supported by the soft film until a middle portion of the photosensitive surface of the photosensitive chip is lower than the edge region of the photosensitive surface.
8. A photosensitive assembly according to claim 1, wherein said flexible film is pressed by an edge region of said photosensitive chip to be deformed to support and protect said photosensitive chip.
9. A photosensitive assembly according to claim 1, comprising two or more of said flexible films having a circular shape, each of said flexible films having a center at the same distance from an inner edge of said accommodating hole.
10. The utility model provides a module of making a video recording which characterized in that includes:
a photosensitive assembly according to any one of claims 1 to 9.
11. A terminal device, comprising:
the camera module of claim 10.
12. A method for producing a photosensitive assembly, said method being for producing the photosensitive assembly according to any one of claims 1 to 9, said method comprising:
attaching the soft film to the reinforcing plate;
attaching the circuit board provided with the accommodating hole to the reinforcing plate to enable the soft film to be located at the edge position of the exposed area on the surface of the reinforcing plate;
attaching the photosensitive chip to the exposed area on the surface of the reinforcing plate, wherein the photosensitive chip is accommodated in the accommodating hole; the edge area of the photosensitive chip is supported by the soft film.
13. The method of claim 12, wherein said applying said flexible membrane over said stiffener comprises:
attaching a whole piece of soft film to the fixed reinforcing plate;
prepressing and fixing the whole piece of soft film and the reinforcing plate;
firing the whole film by laser to form a patterned film for supporting the photosensitive chip at the edge position of the preset exposure area;
and removing the rest soft films except the patterned soft film, and trimming the edge of the patterned soft film.
14. The method of claim 12, wherein attaching the circuit board with the receiving hole to the stiffener comprises:
carrying out a forming process and a pressing plate flattening process on the circuit board and the reinforcing plate;
and the circuit board and the reinforcing plate are attached and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010883441.6A CN111935384A (en) | 2020-08-28 | 2020-08-28 | Photosensitive assembly, camera module, terminal equipment and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010883441.6A CN111935384A (en) | 2020-08-28 | 2020-08-28 | Photosensitive assembly, camera module, terminal equipment and preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111935384A true CN111935384A (en) | 2020-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010883441.6A Pending CN111935384A (en) | 2020-08-28 | 2020-08-28 | Photosensitive assembly, camera module, terminal equipment and preparation method |
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| CN (1) | CN111935384A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2658949Y (en) * | 2003-11-07 | 2004-11-24 | 飞信半导体股份有限公司 | Film covering chip packaging structure of image sensor |
| CN108769495A (en) * | 2018-08-07 | 2018-11-06 | 宁波舜宇光电信息有限公司 | A kind of camera module and assemble method and electronic equipment |
| CN208836254U (en) * | 2018-09-27 | 2019-05-07 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN209930375U (en) * | 2019-08-15 | 2020-01-10 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and camera module |
| CN212343915U (en) * | 2020-08-28 | 2021-01-12 | 昆山丘钛微电子科技有限公司 | Photosensitive assembly, camera module and terminal equipment |
-
2020
- 2020-08-28 CN CN202010883441.6A patent/CN111935384A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2658949Y (en) * | 2003-11-07 | 2004-11-24 | 飞信半导体股份有限公司 | Film covering chip packaging structure of image sensor |
| CN108769495A (en) * | 2018-08-07 | 2018-11-06 | 宁波舜宇光电信息有限公司 | A kind of camera module and assemble method and electronic equipment |
| CN208836254U (en) * | 2018-09-27 | 2019-05-07 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN209930375U (en) * | 2019-08-15 | 2020-01-10 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and camera module |
| CN212343915U (en) * | 2020-08-28 | 2021-01-12 | 昆山丘钛微电子科技有限公司 | Photosensitive assembly, camera module and terminal equipment |
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