CN208836254U - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
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- CN208836254U CN208836254U CN201821580212.1U CN201821580212U CN208836254U CN 208836254 U CN208836254 U CN 208836254U CN 201821580212 U CN201821580212 U CN 201821580212U CN 208836254 U CN208836254 U CN 208836254U
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- photosensory assembly
- groove
- circuit board
- mounting groove
- photosensitive
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Abstract
The utility model relates to a kind of camera module and its photosensory assemblies.The photosensory assembly, comprising: wiring board, including opposite first surface and second surface, first surface offers mounting groove；Imaging sensor is set in mounting groove, and and circuit board electrical connection, imaging sensor include photosensitive surface, photosensitive surface is the curved surface towards the curving where second surface.In above-mentioned photosensory assembly, imaging sensor is set in mounting groove, namely imaging sensor is set in wiring board, it is stacked relative to imaging sensor and wiring board, imaging sensor is set in wiring board the height that can reduce photosensory assembly, and then reduce the height of entire camera module, the camera module minimized of being more convenient for.Curved surface photosensitive surface can improve the quadrangle light intensity of imaging, avoid the occurrence of the darker phenomenon of the bright surrounding in center relative to plane photosensitive surface, so as to improve imaging resolution and reduce image deformation degree, achieve the purpose that improve image quality.
Description
Technical field
The utility model relates to field of camera technology, more particularly to a kind of camera module and its photosensory assembly.
Background technique
Imaging sensor used by traditional camera module is planar structure (calling in the following text are as follows: area image sensor), position
In on the imaging plane position of camera lens.But because of the diffraction effect of light source, camera lens is caused to form Airy in imaging plane,
Light intensity is decayed around by center, also just forms the darker phenomenon of the bright surrounding in center.And because being influenced by above-mentioned diffraction effect,
The imaging sensor of planar structure is caused to have the disadvantage that:
1. the imaging sensor picture centre brightness of planar structure is maximum, decayed around by center, four corners compared with
Secretly；
2. the dark current of area image sensor is generally larger；
3. the imaging surface of camera lens is generally curved surface because being limited by the reasons such as design and the manufacturing process of camera lens.It adopts
With area image sensor Image Acquisition image information, leads to image fault, cause image quality decrease.
4. imaging sensor used by overwhelming majority mobile phone camera module is all planar structure at present, cause general in the market
All over the imaging sensor for lacking curved-surface structure.
5. investigation discovery, curved surface image sensor application are majority in the larger product of size, the product for lacking microminiaturization is answered
With temporarily without such curved surface image sensor application especially in mobile phone camera module.
Utility model content
Based on the above background, it is necessary to there is a problem of image quality difference for traditional camera module, one kind is provided and is taken the photograph
As mould group and its photosensory assembly.
A kind of photosensory assembly, comprising:
Wiring board, including opposite first surface and second surface, the first surface offers mounting groove；And
Imaging sensor, be set to the mounting groove in, and with the circuit board electrical connection, described image sensor include sense
Optical surface, the photosensitive surface are the curved surface towards the curving where the second surface.
In above-mentioned photosensory assembly, imaging sensor is set in mounting groove namely imaging sensor is set in wiring board, phase
Imaging sensor and wiring board are stacked, imaging sensor is set in wiring board the height that can reduce photosensory assembly,
And then reduce the height of entire camera module, the camera module minimized of being more convenient for.Curved surface photosensitive surface is relative to plane
Photosensitive surface can improve the quadrangle light intensity of imaging, avoid the occurrence of the darker phenomenon of the bright surrounding in center, so as to improve imaging
Resolution ratio and reduction image deformation degree, achieve the purpose that improve image quality.
The photosensitive surface includes photosensitive area and the non-photo-sensing positioned at the photosensitive area periphery in one of the embodiments,
Area, the first surface are equipped with the first weld pad, and the non-photo-sensing area is equipped with the second weld pad；
The photosensory assembly further includes conductor wire, the both ends of the conductor wire respectively with first weld pad and described second
Weld pad connection.In this way, imaging sensor of being more convenient for is connect with circuit board.
Described image sensor further includes the connection surface opposite with the photosensitive surface in one of the embodiments,
The connection surface is connect with the slot bottom of the mounting groove.The connection of the slot bottom of connection surface and mounting groove, can be in photosensitive surface
Back side dispensing, when can be to avoid glue excessive glue, glue flows to photosensitive surface.
The photosensory assembly further includes adhesive layer in one of the embodiments, and the adhesive layer is set to the connection table
Between face and the slot bottom of the mounting groove.In this way, imaging sensor can be made securely to connect with wiring board.
Described image sensor further includes the connection surface opposite with the photosensitive surface in one of the embodiments,
The connection surface is the curved surface towards the curving where the second surface, and the mounting groove is stepped groove, the peace
Tankage carries the marginal zone of the connection surface close to the step surface of the first surface, and the mounting groove is close to second table
The step surface in face carries the center of the connection surface.Stepped groove can make hyperbolic chart secured with wiring board as sensor
Connection.
The photosensory assembly further includes adhesive layer in one of the embodiments, and the mounting groove is close to first table
The adhesive layer is provided between the step surface in face and the marginal zone of the connection surface, the mounting groove is close to second table
The center of the step surface in face and the connection surface is provided with the adhesive layer.In this way, imaging sensor and line can be made
Road plate securely connects.
The first surface offers the first groove in one of the embodiments, and the slot bottom of first groove opens up
There is the second groove, first groove and second groove constitute the mounting groove.Namely mounting groove is second level stepped groove, phase
For three-level or more than stepped groove, second level stepped groove meet carry hyperboloid imaging sensor under the premise of, moreover it is possible to simplify
The step of making stepped groove.
The wiring board includes the stiffening plate and circuit board being stacked, the circuit board in one of the embodiments,
Surface far from the stiffening plate is first surface, and surface of the stiffening plate far from the circuit board is second surface, described
The slot bottom of mounting groove is located at the second surface and the stiffening plate between the surface of the circuit board.Wiring board is using benefit
Strong mode of the plate in conjunction with circuit board, can not only make wiring board have preferable intensity, moreover it is possible to convenient for production with installation
Slot wiring board.And when stiffening plate is electrically conductive, stiffening plate is also used as ground connection plate earthing.
The stiffening plate opens up fluted, the circuit close to the surface of the circuit board in one of the embodiments,
The through-hole through the two opposite surfaces of the circuit board is offered on plate, the through-hole and the groove constitute the installation
Slot, the groove are stepped groove.In this way, having reeded stiffening plate and loop circuit using customization when making wiring board
Plate.Have again in stiffening plate and adhesive layer is set between reeded surface and annular circuit board, so that stiffening plate and circuit board
It links together.Stepped groove can make hyperbolic chart as sensor is securely connect with wiring board.
A kind of camera module, comprising:
Above-mentioned photosensory assembly；And
Lens assembly, on the photosensitive path of the photosensory assembly.
The characteristics of above-mentioned camera module has height small, good imaging quality.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure for the camera module that an embodiment of the present invention provides；
Fig. 2 is the schematic diagram of the section structure of the photosensory assembly of the camera module in Fig. 1；
Fig. 3 is the schematic diagram of the section structure of the wiring board and imaging sensor in photosensory assembly shown in Fig. 2；
Fig. 4 is the section knot of the wiring board and imaging sensor in the photosensory assembly that another embodiment of the utility model provides
Structure schematic diagram.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.Many details are explained in the following description in order to abundant
Understand the utility model.But the utility model can be implemented with being much different from other way described herein, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific implementation opened.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specifically embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
As shown in Figure 1, an embodiment of the present invention provide camera module 10, including photosensory assembly 10a and be set to sense
Lens assembly 10b on optical assembly 10a.Lens assembly 10b is on the photosensitive path of photosensory assembly 10a.The light of image side
Photosensory assembly 10a is reached after lens assembly 10b, to realize imaging.
In the present embodiment, camera module 10 is applied on mobile terminal.Specifically, in the present embodiment, mobile terminal
Camera module 10 including terminal body (not shown) and on terminal body.More specifically, in the present embodiment, it is mobile whole
End is the portable mobile termianls such as smart phone, tablet computer.
As shown in Fig. 2, photosensory assembly 10a includes wiring board 100, imaging sensor 200, bracket 300 and optical filter
400。
Wiring board 100 is for carrying the elements such as imaging sensor 200.In the present embodiment, wiring board 100 includes opposite
First surface 102 and second surface 104, first surface 102 offer mounting groove 106.Imaging sensor 200 is set to mounting groove
In 106, and it is electrically connected with wiring board 100.Imaging sensor 200 includes photosensitive surface 202, and photosensitive surface 202 is towards second
The curved surface of curving where surface 104.
Wherein, imaging sensor 200 is set in mounting groove 106 namely imaging sensor 200 is set in wiring board 100, phase
Imaging sensor 200 and wiring board 100 are stacked, imaging sensor 200 can reduce photosensitive in wiring board 100
The height of component 10a, and then reduce the height of entire camera module 10, the camera module 10 minimized of being more convenient for.Curved surface
Photosensitive surface 202 can improve that the quadrangle light intensity of imaging, to avoid the occurrence of the bright surrounding in center darker relative to plane photosensitive surface
Phenomenon achievees the purpose that improve image quality so as to improve imaging resolution and reduce image deformation degree.
In the present embodiment, wiring board 100 includes the stiffening plate 110 and circuit board 120 being stacked, and circuit board 120 is remote
Surface from stiffening plate 110 is first surface 102, and surface of the stiffening plate 110 far from circuit board 120 is second surface 104.Installation
The slot bottom of slot 106 be located at second surface 104 and stiffening plate 110 between the surface of circuit board 120 namely mounting groove 106 from
First surface 102 extends through stiffening plate 110 close to the surface of circuit board 120, and protrudes into stiffening plate 110.Wiring board 100 is adopted
The mode combined with stiffening plate 110 with circuit board 120 can not only make wiring board 100 have preferable intensity, moreover it is possible to be convenient for
Production has 106 wiring board 100 of mounting groove.And when stiffening plate 110 is electrically conductive, stiffening plate 110 is also used as being grounded
Plate earthing.
Specifically, in the present embodiment, circuit board 120 can be flexible circuit board, printed circuit board, or soft or hard
Board.It is appreciated that in other embodiments, when the support strength of circuit board 120 is able to satisfy the requirement of camera module 10,
Stiffening plate 110 can be omitted.
Specifically, as shown in figure 3, in the present embodiment, stiffening plate 110 opens up fluted close to the surface of circuit board 120
112.Circuit board 120 is to be offered in the ring structure on the surface of stiffening plate 110 namely circuit board 120 through its two table
The through-hole 122 in face, through-hole 122 and groove 112 collectively form mounting groove 106.In this way, when making wiring board 100, using customization
Stiffening plate 110 and annular circuit board 120 with groove 112, then there is surface and the ring of groove 112 in stiffening plate 110
Adhesive layer 130 is set between shape circuit board 120, so that stiffening plate 110 links together with circuit board 120.
More specifically, in the present embodiment, stiffening plate 110 is stainless steel plate, and is grounded.122 ruler of through-hole of circuit board 120
It is very little identical as the opening size of groove 112, and the opening of through-hole 122 and groove 112 is square.
In the present embodiment, photosensitive surface 202 includes photosensitive area 202a and the non-photo-sensing for being surrounded on the periphery photosensitive area 202a
Area 202b.In visual angle shown in Fig. 3, the region between two curves is photosensitive area 202a.Circuit board 120 is far from stiffening plate
110 surface (first surface 102) is equipped with the first weld pad (not shown), and non-photo-sensing area 202b is equipped with the second weld pad (not shown).
Photosensory assembly 10a further includes conductor wire 500, and the both ends of conductor wire 500 are connect with the first weld pad and the second weld pad respectively.In this reality
It applies in example, imaging sensor 200 is located in the groove 112 of stiffening plate 110, and non-photo-sensing area 202b and circuit board 120 are far from reinforcement
The surface of plate 110 is connect with circuit board 120 there are difference in height using the imaging sensor 200 of being more convenient for of conductor wire 500.It can manage
Solution, in other embodiments, when stiffening plate 110 is circuit board, conductor wire 500 be can be omitted, at this point, imaging sensor 200
The contact that is electrically connected can directly be connect with the contact that is electrically connected on circuit board 120.
In the present embodiment, imaging sensor 200 includes the connection surface 204 opposite with photosensitive surface 202, and connection table
Face 204 is the curved surface towards the curving where second surface 104.Further, in the present embodiment, groove 112 is ladder
Slot.In this way, groove 112 can be with the marginal zone on bearer connection surface 204, groove 112 close to the step surface 112a of first surface 102
Step surface 112b close to second surface 104 can be with the center on bearer connection surface 204, so as to effectively image be avoided to pass
Sensor 200 is hanging, so that imaging sensor 200 is opposite with 100 position of wiring board secured.
In the present embodiment, groove 112 is close to the step surface 112a of first surface 102 and the marginal zone of connection surface 204
Between be provided with adhesive layer 600, groove 112 is set close to the step surface 112b of second surface 104 and the center of connection surface 204
It is equipped with adhesive layer 600.In this way, two sides can be made to be that the imaging sensor 200 of curved surface is firmly fixed in groove 112.
Specifically, in the present embodiment, stiffening plate 110 offers the first groove 1122 close to the surface of circuit board 120, the
The slot bottom of one groove 1122 offers the second groove 1124, and the second groove 1124 and the first groove 1122 collectively form groove 112,
Groove 112 is second level stepped groove.The marginal zone on the slot bottom bearer connection surface 204 of the first groove 1122, the second groove 1124
The center on slot bottom bearer connection surface 204.It is appreciated that in other embodiments, groove 112 can be rank more than three-level
Terraced slot.
In the present embodiment, the two sides of imaging sensor 200 is all curved surface, in this way, can make imaging sensor 200
Thickness is consistent everywhere, to reduce the dosage of the material of imaging sensor 200, and then reduces the weight of imaging sensor 200.?
In other embodiments, imaging sensor 200 can also be curved surface on one side, and another side is plane.Specifically, as shown in figure 4, image
Sensor 200a includes opposite photosensitive curved surface 202a and connect plane 204a, and the slot bottom of mounting groove 106a is plane, at this point, can
With the slot bottom of mounting groove 106a with connect plane 204a setting adhesive layer 600a, can also mounting groove 106a inner sidewall with
Adhesive layer 600a is set between the lateral wall of imaging sensor 200a.
As shown in Fig. 2, in the present embodiment, bracket 300 is set on the first surface 102 of wiring board 100.Bracket 300 is
The hollow structure of both ends open, and the central axis of bracket 300 is overlapped with the central axis of imaging sensor 200.
Optical filter 400 is set in bracket 300.Specifically, in the present embodiment, the inner wall of bracket 300 is equipped with flange
310, optical filter 400 is set on flange 310.More specifically, in the present embodiment, optical filter 400 is set to flange 310 and leans near line
On side where road plate 100.
As shown in Figure 1, lens assembly 10b is set on the one end of bracket 300 far from wiring board 100.In the present embodiment, on
Stating camera module 10 is zoom mould group, and lens assembly 10b includes voice coil motor 710 and the lens barrel in voice coil motor 710
720, lens barrel 720 is equipped with eyeglass.Voice coil motor 710 can drive lens barrel 720 to move back and forth along the optical axis of camera module 10, thus real
Existing zoom.In other embodiments, when camera module 10 be fixed-focus mould group when, lens assembly 10b include microscope base and be set to microscope base
Interior eyeglass.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of photosensory assembly characterized by comprising
Wiring board, including opposite first surface and second surface, the first surface offers mounting groove；And
Imaging sensor, be set to the mounting groove in, and with the circuit board electrical connection, described image sensor includes photosensitive table
Face, the photosensitive surface are the curved surface towards the curving where the second surface.
2. photosensory assembly according to claim 1, which is characterized in that the photosensitive surface includes photosensitive area and is located at described
The non-photo-sensing area of photosensitive area periphery, the first surface are equipped with the first weld pad, and the non-photo-sensing area is equipped with the second weld pad；
The photosensory assembly further includes conductor wire, the both ends of the conductor wire respectively with first weld pad and second weld pad
Connection.
3. photosensory assembly according to claim 1, which is characterized in that described image sensor further includes and the photosensitive table
The opposite connection surface in face, the connection surface are connect with the slot bottom of the mounting groove.
4. photosensory assembly according to claim 3, which is characterized in that the photosensory assembly further includes adhesive layer, the glue
Adhesion coating is set between the connection surface and the slot bottom of the mounting groove.
5. photosensory assembly according to claim 1, which is characterized in that described image sensor further includes and the photosensitive table
The opposite connection surface in face, the connection surface are the curved surface towards the curving where the second surface, the installation
Slot is stepped groove, and the mounting groove carries the marginal zone of the connection surface, the peace close to the step surface of the first surface
Tankage carries the center of the connection surface close to the step surface of the second surface.
6. photosensory assembly according to claim 5, which is characterized in that the photosensory assembly further includes adhesive layer, the peace
Tankage is provided with the adhesive layer, the peace between the step surface of the first surface and the marginal zone of the connection surface
Tankage is provided with the adhesive layer close to the step surface of the second surface and the center of the connection surface.
7. photosensory assembly according to claim 5 or 6, which is characterized in that the first surface offers the first groove, institute
The slot bottom for stating the first groove offers the second groove, and first groove and second groove constitute the mounting groove.
8. photosensory assembly according to claim 1, which is characterized in that the wiring board include the stiffening plate being stacked and
Circuit board, surface of the circuit board far from the stiffening plate is first surface, table of the stiffening plate far from the circuit board
Face is second surface, and the slot bottom of the mounting groove is located at the second surface and the stiffening plate close to the surface of the circuit board
Between.
9. photosensory assembly according to claim 8, which is characterized in that the stiffening plate is opened close to the surface of the circuit board
Equipped with groove, offer the through-hole through the two opposite surfaces of the circuit board on the circuit board, the through-hole with it is described
Groove constitutes the mounting groove, and the groove is stepped groove.
10. a kind of camera module characterized by comprising
Photosensory assembly as claimed in any one of claims 1-9 wherein；And
Lens assembly, on the photosensitive path of the photosensory assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821580212.1U CN208836254U (en) | 2018-09-27 | 2018-09-27 | Camera module and its photosensory assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821580212.1U CN208836254U (en) | 2018-09-27 | 2018-09-27 | Camera module and its photosensory assembly |
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| Publication Number | Publication Date |
|---|---|
| CN208836254U true CN208836254U (en) | 2019-05-07 |
Family
ID=66316966
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821580212.1U Active CN208836254U (en) | 2018-09-27 | 2018-09-27 | Camera module and its photosensory assembly |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111405156A (en) * | 2020-03-20 | 2020-07-10 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN111935384A (en) * | 2020-08-28 | 2020-11-13 | 昆山丘钛微电子科技有限公司 | Photosensitive assembly, camera module, terminal equipment and preparation method |
| WO2021018230A1 (en) * | 2019-08-01 | 2021-02-04 | 宁波舜宇光电信息有限公司 | Camera module, and photosensitive assembly and manufacturing method therefor |
| CN112887518A (en) * | 2019-11-29 | 2021-06-01 | 南昌欧菲光电技术有限公司 | Camera module, preparation method thereof and intelligent terminal |
| WO2021239030A1 (en) * | 2020-05-28 | 2021-12-02 | 维沃移动通信有限公司 | Camera module and electronic device |
-
2018
- 2018-09-27 CN CN201821580212.1U patent/CN208836254U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021018230A1 (en) * | 2019-08-01 | 2021-02-04 | 宁波舜宇光电信息有限公司 | Camera module, and photosensitive assembly and manufacturing method therefor |
| CN112887518A (en) * | 2019-11-29 | 2021-06-01 | 南昌欧菲光电技术有限公司 | Camera module, preparation method thereof and intelligent terminal |
| CN111405156A (en) * | 2020-03-20 | 2020-07-10 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| WO2021239030A1 (en) * | 2020-05-28 | 2021-12-02 | 维沃移动通信有限公司 | Camera module and electronic device |
| EP4161053A4 (en) * | 2020-05-28 | 2023-10-25 | Vivo Mobile Communication Co., Ltd. | Camera module and electronic device |
| CN111935384A (en) * | 2020-08-28 | 2020-11-13 | 昆山丘钛微电子科技有限公司 | Photosensitive assembly, camera module, terminal equipment and preparation method |
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