CN208836250U - Mobile terminal, camera module and photosensory assembly - Google Patents
Mobile terminal, camera module and photosensory assembly Download PDFInfo
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- CN208836250U CN208836250U CN201821557244.XU CN201821557244U CN208836250U CN 208836250 U CN208836250 U CN 208836250U CN 201821557244 U CN201821557244 U CN 201821557244U CN 208836250 U CN208836250 U CN 208836250U
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- curved surface
- photosensory assembly
- circuit board
- accommodation groove
- slot
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Abstract
The utility model relates to a kind of mobile terminal, camera module and photosensory assemblies, the photosensory assembly includes circuit board, including upper surface and the lower surface opposite with the upper surface, the center of the circuit board offers the through-hole for being connected to the upper surface and the lower surface；Stiffening plate, on the lower surface of the circuit board, the center of the stiffening plate is equipped with the accommodation groove being connected to the through-hole；And curved surface chip, with the circuit board electrical connection, the curved surface chip is set in the accommodation groove.The photosensory assembly of the utility model is arranged on stiffening plate and the matched accommodation groove of curved surface chip, overcomes the defect that the fastness that directly curved surface chip is set on circuit board is poor and flatness is low, effectively increases the image quality of curved surface chip.
Description
Technical field
The utility model relates to camera technical fields, more particularly to a kind of mobile terminal, camera module and photosensitive group
Part.
Background technique
With the mobile device with camera function in life using more more and more universal, user wants camera module
Ask higher and higher.Sensitive chip in traditional camera module is planar chip, due to the optical path difference of the marginal portion of planar chip
Difference, cause light phenomena such as the marginal position of planar chip is easy to appear distortion, corner loss of gloss and acute angle decline (namely
Airy is formed in planar chip, light intensity is decayed around by center), to reduce the pixel of camera module imaging.And
Curved surface chip is since its photosurface is curved surface, and closer to the retina for being all curved surface, therefore imaging effect is closer to human eye,
It is considered as the development trend of the following field of photography.However, the curved surface chip of camera module after mounting, is pacified in the prior art
Dress fastness and flatness are still difficult to be effectively ensured, and the imaging effect of curved surface chip is unsatisfactory.
Utility model content
Based on this, it is necessary to which for curved surface chip in imaging, installation fastness and the not high problem of flatness are mentioned
For a kind of mobile terminal, camera module and photosensory assembly.
A kind of photosensory assembly, comprising:
Circuit board, including opposite upper surface and lower surface, the center of the circuit board offers the connection upper surface
With the through-hole of lower surface；
Stiffening plate, is laminated in the lower surface of the circuit board, and the center of the stiffening plate is equipped with to be connected to the through-hole
Accommodation groove；And
Curved surface chip, with the circuit board electrical connection, the curved surface chip is set in the accommodation groove.
In above-mentioned photosensory assembly, due to being integrated with accurate circuit on circuit board, and the intensity of circuit board is insufficient, in circuit
Setting is difficult to control with the matched accommodation groove of curved surface chip on plate, and processing technology difficulty is larger.The photosensory assembly of the utility model
Setting and the matched accommodation groove of curved surface chip on stiffening plate overcome the fastness being directly set to curved surface chip on circuit board
Poor and low flatness defect, effectively increases the image quality of curved surface chip.
The photosensory assembly further includes the first adhesive layer in one of the embodiments, and first adhesive layer is set to institute
It states in accommodation groove, the curved surface chip is Nian Jie with the inner wall of the accommodation groove by first adhesive layer.In this way, can be into one
Step increases curved surface chip and is fixed on the fastness on stiffening plate.
The accommodation groove is more piece stepped groove in one of the embodiments,.In this way, can be consolidated meeting curved surface chip
Under the premise of in accommodation groove, the first adhesive layer is set on the slot bottom of stepped groove, can be bonded to avoid first on stepped groove
Layer side flowing downwards causes to accumulate.
The accommodation groove is arch groove in one of the embodiments, and the accommodation groove and the through-hole are coaxial.In this way,
The fastness that curved surface chip is fixed on stiffening plate can be further increased.
The opening diameter of the accommodation groove is less than the diameter of the through-hole, the curved surface core in one of the embodiments,
Piece includes bending section and flat part, and the bending section is set in the accommodation groove, and the flat part is set to the stiffening plate and leans on
The side of the nearly circuit board, and the flat part is close and surround the accommodation groove.
In this way, the flat part of curved surface chip and stiffening plate are connected close to a side plane of circuit board, song not only can be improved
Face chip is mounted on the flatness after accommodation groove, and plays positioning action of the curved surface chip when installing on stiffening plate.
The accommodation groove includes the second slot and is opened in the first of the second slot slot bottom in one of the embodiments,
Slot, the slot bottom of second slot are plane, and the curved surface chip includes bending section and flat part, and the bending section is set to described
In first slot, the flat part is set on the slot bottom of second slot.
In this way, the flat part of curved surface chip is set on the slot bottom of the second slot, curved surface chip not only can be improved and be mounted on appearance
Flatness after setting slot, and play positioning action of the curved surface chip when installing on stiffening plate.
The photosensory assembly further includes the second adhesive layer in one of the embodiments, and second adhesive layer is set to institute
Stiffening plate is stated close to the side of the circuit board, second adhesive layer is close and around the accommodation groove, and the flat part is set
In on second adhesive layer.In this way, further increasing the fastness that curved surface chip is fixed on stiffening plate.
The photosensory assembly further includes conducting wire in one of the embodiments, and the both ends of the conducting wire are put down with described respectively
Smooth portion and the circuit board are electrically connected.So, it is ensured that the welding disking area on flat part is smooth, and then guarantees flat part
When carrying out conducting wire connection with circuit board, routing technique can normally be implemented, to the camber of conducting wire, wire length and angle in bonding process
Degree etc. is accurately managed.
The curved surface chip includes photosensitive area and the non-photo-sensing around the photosensitive area in one of the embodiments,
Area, the photosensitive area is symmetrical about the sensitivity centre of the photosensitive area, and the sensitivity centre is the geometric center of the photosensitive area.
In this way, using the sensitivity centre of the photosensitive area of chip as the curved central point of curved surface, so that the picture centre after imaging be effectively relieved
The excessive problem with the luminance difference of image border, further increases the image quality of curved surface chip.
Meanwhile the utility model additionally provides a kind of camera module, comprising:
Above-mentioned photosensory assembly；And
Lens assembly, on the photosensitive path of the photosensory assembly.
In this way, above-mentioned camera module overcomes fastness difference and the flatness being directly set to curved surface chip on circuit board
Low defect effectively increases the image quality of curved surface chip.
Meanwhile the utility model also provides a kind of mobile terminal, comprising:
Terminal body；And
Above-mentioned camera module, the camera module are set on the terminal body.
In this way, above-mentioned mobile terminal overcomes fastness difference and the flatness being directly set to curved surface chip on circuit board
Low defect effectively increases the image quality of curved surface chip.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the camera module of one embodiment of the utility model；
Fig. 2 is the structural schematic diagram of photosensory assembly in Fig. 1；
Fig. 3 is another structural schematic diagram of photosensory assembly in Fig. 1；
Fig. 4 is the structural schematic diagram of the planar chip before the curved surface chip molding in Fig. 2 and Fig. 3.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.Many details are explained in the following description in order to abundant
Understand the utility model.But the utility model can be implemented with being much different from other way described herein, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific implementation opened.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specifically embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
As shown in Figure 1, the camera module 10 of one embodiment of the utility model, is applied on mobile terminal.Specifically, exist
In present embodiment, mobile terminal includes terminal body and the camera module 10 on terminal body.More specifically, in this reality
It applies in mode, mobile terminal is the portable mobile termianls such as smart phone, laptop, tablet computer.
In the present embodiment, camera module 10 includes photosensory assembly 10a and lens assembly 10b.Lens assembly 10b is set
In on the photosensitive path of photosensory assembly 10a.The light of image side reaches photosensory assembly 10a after lens assembly 10b, thus real
Ready-made picture.
As shown in Fig. 2, photosensory assembly 10a includes circuit board 100, stiffening plate 200, the first adhesive layer 300 and curved surface
Chip 400.
Circuit board 100 can be PCB (Printed Circuit Board, printed circuit board), or soft or hard combination
Plate, or the FPC (Flexible Printed Circuit, flexible circuit board) after reinforcement.Wherein, Rigid Flex packet
The PCB and FPC being stacked are included, the flexible circuit board after reinforcement includes the FPC and reinforcing chip being stacked, and reinforcing chip can be
The good sheet material of the heat dissipation performances such as steel disc.
Stiffening plate 200 can be the good sheet materials of heat dissipation performances such as steel disc.It should be noted that when foregoing circuit plate is to mend
When FPC (Flexible Printed Circuit, flexible circuit board) after strong, the reinforcing chip on FPC can be regarded as this reality
The stiffening plate 200 in mode is applied, stiffening plate 200 can be omitted at this time.
Curved surface chip 400 is a kind of device for converting optical signals to electric signal, and curved surface chip 400 can be CCD
(Charge-coupled Device, charge coupled cell) sensitive chip or CMOS (Complementary Metal-Oxide-
Semiconductor, complementary metal oxide semiconductor) sensitive chip.
Specifically, with reference to Fig. 4, in the present embodiment, curved surface chip 400 is bent by planar chip 400a and is made, this is flat
Face chip 400a includes the photosensitive area 410a and non-photo-sensing area 420a around photosensitive area 410a, and photosensitive area 410a is about photosensitive
The sensitivity centre 411a of area 410a is symmetrical, and sensitivity centre 411a is the geometric center of photosensitive area 410a.In this way, with the sense of chip
The sensitivity centre 411a of light area 410a is the curved central point of curved surface, thus the picture centre being effectively relieved after imaging and image side
The excessive problem of the luminance difference of edge, improves the image quality of curved surface chip 400.Wherein, curved surface chip obtained above
The numerical value of the radius of curvature R of 400 curved surface can need any selection according to actual design, be not construed as limiting.The curved surface chip 400
Curve form can with but be not limited to spherical surface, Gaussian curve face, hyperbola face, parabola face, cylindroid, oval face etc..
With continued reference to FIG. 2, circuit board 100 includes upper surface 110 and the lower surface 120 opposite with upper surface 110, electricity
The center of road plate 100 offers the through-hole 101 of connection upper surface 110 and lower surface 120.Stiffening plate 200 is set to circuit board 100
On lower surface 120, the center of stiffening plate 200 is equipped with the accommodation groove 201 being connected to through-hole 101.Curved surface chip 400 and circuit board
100 electrical connections, curved surface chip 400 are set in accommodation groove 201.Specifically, in the present embodiment, accommodation groove 201 is arch groove,
Accommodation groove 201 and through-hole 101 are coaxial.
In other embodiments, the first adhesive layer 300 is set in accommodation groove 201, curved surface chip 400 and circuit board 100
Electrical connection, curved surface chip 400 are set in accommodation groove 201, and curved surface chip 400 is interior by the first adhesive layer 300 and accommodation groove 201
Wall bonding.
Curved surface chip in the prior art directly passes through adhesive glue and is fixed on circuit board, not lacking there is only stability difference
It falls into, and there is a problem that glue dosage is excessive.And in the photosensory assembly 10a of the utility model, due to collecting on circuit board 100
At having accurate circuit and electronic component, and the intensity deficiency of circuit board 100, it is arranged and curved surface chip on circuit board 100
400 matched accommodation grooves 201 are difficult to control, and processing technology difficulty is larger.The photosensory assembly 10a of the utility model is in stiffening plate
Setting and the matched accommodation groove 201 of curved surface chip 400, overcome and directly curved surface chip 400 are set on circuit board 100 on 200
Fastness is poor, flatness is low and the excessive defect of glue dosage, and effectively increase the image quality of curved surface chip 400.
Further, with continued reference to FIG. 2, in the present embodiment, the opening diameter D1 of accommodation groove 201 is less than through-hole 101
Diameter D2, curved surface chip 400 includes bending section 410 and flat part 420, and bending section 410 is set in accommodation groove 201, and leads to
It is Nian Jie with the cell wall of accommodation groove 201 to cross the first adhesive layer 300.Flat part 420 is set to stiffening plate 200 close to the one of circuit board 100
Side, and close and circular accommodation groove 201.In this way, the flat part 420 of curved surface chip 400 and stiffening plate 200 are close to circuit board 100
A side plane connection, the flatness that curved surface chip 400 is mounted on after accommodation groove 201 not only can be improved, but also play song
Positioning action of the face chip 400 when being installed on stiffening plate 200.It is appreciated that in other embodiments, in accommodation groove 201
The first adhesive layer 300 can be omitted.
Further, in the present embodiment, photosensory assembly 10a further includes the second adhesive layer 500, and the second adhesive layer 500 is set
In stiffening plate 200 close to the side of circuit board 100, and the second adhesive layer 500 is close and surround accommodation groove 201, and flat part 420 is set
In on the second adhesive layer 500.In this way, further increasing the fastness that curved surface chip 400 is fixed on stiffening plate 200.
Further, in the present embodiment, the second adhesive layer 500 extends towards the inside of accommodation groove 201 and glues with first
Layer 300 is tied to connect.In this way, the bond area of the second adhesive layer 500 and curved surface chip 400 is increased, to further enhance
Curved surface chip 400 is fixed on the fastness on stiffening plate 200.
Further, as shown in figure 3, in the present embodiment, accommodation groove 201 includes the second slot 201b and is opened in second
The the first slot 201a namely the second slot 201b of slot 201b slot bottom compare the first slot 201a closer to circuit board 100.First adhesive layer
300 on the cell wall of the first slot 201a, and the slot bottom of the second slot 201b is plane, and bending section 410 is set in the first slot 201a, and
Nian Jie with the inner wall of the first slot 201a by the first adhesive layer 300, flat part 420 is on the slot bottom of the second slot 201b.In this way,
The flat part 420 of curved surface chip 400 not only can be improved curved surface chip 400 and be mounted on appearance on the slot bottom of the second slot 201b
Flatness after setting slot 201, and play positioning action of the curved surface chip 400 when installing on stiffening plate 200.It can manage
Solution, in other embodiments, the first adhesive layer 300 on the first slot 201a can be omitted.
Specifically, in the present embodiment, the first slot 201a is stepped groove.It is appreciated that in other embodiments, the
One slot 201a can also be arch groove.
Further, in the present embodiment, the first adhesive layer 300 is on the slot bottom of the second slot 201b, and the first bonding
Layer 300 is close and around the first slot 201a, and flat part 420 is set on the first adhesive layer 300.In this way, further increasing curved surface core
Piece 400 is fixed on the fastness on stiffening plate 200.
Further, with continued reference to FIG. 3, accommodation groove 201 is more piece stepped groove, above-mentioned first slot 201a and the second slot
The combination of 201b also can be regarded as stepped groove, and the first adhesive layer 300 is set in stepped groove.Wherein, the first adhesive layer 300 can be with
The slot bottom of the stepped groove of the bottom is filled, the first adhesive layer 300 can also fill the slot bottom of each stepped groove.In this way, meeting
Under the premise of curved surface chip 400 can be stabilized in accommodation groove 201, the first adhesive layer 300 is set on the slot bottom of stepped groove, it can
The first adhesive layer 300 is caused to accumulate to avoid the downward side flowing of the first adhesive layer 300 occurred on similar arch groove or surface groove
The case where, so as to avoid curved surface chip 400 bonding loosely.
Specifically, in the present embodiment, the first adhesive layer 300 is filled in each stepped groove, is meeting stepped groove
Under the premise of quantity is enough, it can not only be flowed to avoid the first adhesive layer 300 towards downside, but also it is viscous to reduce first
Tie layer 300 glue dosage.
Further, in the present embodiment, the conllinear section 2011 of two neighboring stepped groove is connect with curved surface chip 400.Such as
This, can increase stepped groove by conllinear section 2011 and give the supporting point of curved surface chip 400, to further increase curved surface chip
400 are fixed on the fastness on stiffening plate 200.
Further, as shown in Figure 2 or Figure 3, in the present embodiment, photosensory assembly 10a further includes conducting wire 600, conducting wire 600
Both ends be electrically connected respectively with flat part 420 and circuit board 100.So, it is ensured that the welding disking area on flat part 420
421a smooth (referring to Fig. 4, welding disking area 421a is located at the non-photo-sensing area 420a of chip), and then guarantee flat part 420 and electricity
When road plate 100 is connected by conducting wire 600, routing technique can normally be implemented, to the camber of conducting wire 600, wire length in bonding process
And angle etc. is accurately managed.
Specifically, in the present embodiment, conducting wire 600 is electrically connected the upper end of flat part 420 and the upper surface of circuit board 100
110.The material of above-mentioned conducting wire 600 can be it is conductive can metal, alloy, the materials such as nonmetallic.Specifically, in this reality
It applies in mode, conducting wire 600 is gold thread.
Referring to FIG. 1, photosensory assembly 10a further includes bracket 700, bracket 700 is set on the upper surface 110 of circuit board 100.
Lens assembly 10b includes camera lens 910 and microscope base 920, and camera lens 910 is set in microscope base 920, and it is remote that microscope base 920 is set to bracket 700
One end from circuit board 100.Specifically, in the present embodiment, lens assembly 10b is auto-focusing structure namely the microscope base
920 be voice coil motor.
Further, in the present embodiment, photosensory assembly 10a further includes optical filter 800, and optical filter 800 is set to bracket 700
On, and be located on the photosensitive path of curved surface chip 400.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of photosensory assembly characterized by comprising
Circuit board, including opposite upper surface and lower surface, the center of the circuit board offers the connection upper surface under
The through-hole on surface；
Stiffening plate, is laminated in the lower surface of the circuit board, and the center of the stiffening plate is equipped with the accommodating being connected to the through-hole
Slot；And
Curved surface chip, with the circuit board electrical connection, the curved surface chip is set in the accommodation groove.
2. photosensory assembly according to claim 1, which is characterized in that the photosensory assembly further includes the first adhesive layer, institute
The first adhesive layer is stated in the accommodation groove, the curved surface chip passes through the inner wall of first adhesive layer and the accommodation groove
Bonding.
3. photosensory assembly according to claim 1, which is characterized in that the accommodation groove is more piece stepped groove.
4. photosensory assembly according to claim 1, which is characterized in that the accommodation groove be arch groove, the accommodation groove with
The through-hole is coaxial.
5. photosensory assembly according to claim 1, which is characterized in that the opening diameter of the accommodation groove is less than the through-hole
Diameter, the curved surface chip includes bending section and flat part, and the bending section is set in the accommodation groove, the flat part
Set on the stiffening plate close to the side of the circuit board, and the flat part is close and surround the accommodation groove.
6. photosensory assembly according to claim 3, which is characterized in that the accommodation groove is including the second slot and is opened in institute
State the first slot of the second slot slot bottom, the slot bottom of second slot is plane, and the curved surface chip includes bending section and flat part,
The bending section is set in first slot, and the flat part is set on the slot bottom of second slot.
7. photosensory assembly according to claim 5, which is characterized in that the photosensory assembly further includes the second adhesive layer, institute
The second adhesive layer is stated set on the stiffening plate close to the side of the circuit board, second adhesive layer is close and around the appearance
Slot is set, the flat part is set on second adhesive layer；And/or
The photosensory assembly further includes conducting wire, and the both ends of the conducting wire electrically connect with the flat part and the circuit board respectively
It connects.
8. photosensory assembly according to claim 1, which is characterized in that the curved surface chip includes photosensitive area and circular institute
The non-photo-sensing area of photosensitive area is stated, the photosensitive area is symmetrical about the sensitivity centre of the photosensitive area, and the sensitivity centre is described
The geometric center of photosensitive area.
9. a kind of camera module characterized by comprising
Photosensory assembly as claimed in any of claims 1 to 8 in one of claims；And
Lens assembly, on the photosensitive path of the photosensory assembly.
10. a kind of mobile terminal characterized by comprising
Terminal body；And
Camera module as claimed in claim 9, the camera module are set on the terminal body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821557244.XU CN208836250U (en) | 2018-09-21 | 2018-09-21 | Mobile terminal, camera module and photosensory assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821557244.XU CN208836250U (en) | 2018-09-21 | 2018-09-21 | Mobile terminal, camera module and photosensory assembly |
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| Publication Number | Publication Date |
|---|---|
| CN208836250U true CN208836250U (en) | 2019-05-07 |
Family
ID=66316949
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821557244.XU Active CN208836250U (en) | 2018-09-21 | 2018-09-21 | Mobile terminal, camera module and photosensory assembly |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110579858A (en) * | 2019-08-12 | 2019-12-17 | 西北大学 | Mobile phone lens and preparation method thereof |
| WO2021018230A1 (en) * | 2019-08-01 | 2021-02-04 | 宁波舜宇光电信息有限公司 | Camera module, and photosensitive assembly and manufacturing method therefor |
| CN112532942A (en) * | 2020-11-30 | 2021-03-19 | 黑龙江合师惠教育科技有限公司 | Camera-based educational behavior analysis monitoring equipment and manufacturing method thereof |
-
2018
- 2018-09-21 CN CN201821557244.XU patent/CN208836250U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021018230A1 (en) * | 2019-08-01 | 2021-02-04 | 宁波舜宇光电信息有限公司 | Camera module, and photosensitive assembly and manufacturing method therefor |
| CN110579858A (en) * | 2019-08-12 | 2019-12-17 | 西北大学 | Mobile phone lens and preparation method thereof |
| CN112532942A (en) * | 2020-11-30 | 2021-03-19 | 黑龙江合师惠教育科技有限公司 | Camera-based educational behavior analysis monitoring equipment and manufacturing method thereof |
| CN112532942B (en) * | 2020-11-30 | 2021-08-10 | 黑龙江合师惠教育科技有限公司 | Image sensor device, manufacturing method thereof, camera and educational behavior analysis monitoring equipment |
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Effective date of registration: 20210615 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang, Jiangxi economic and Technological Development Zone, east of lilac Road, north of Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |