CN112532942A - Camera-based educational behavior analysis monitoring equipment and manufacturing method thereof - Google Patents
Camera-based educational behavior analysis monitoring equipment and manufacturing method thereof Download PDFInfo
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/695—Control of camera direction for changing a field of view, e.g. pan, tilt or based on tracking of objects
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides camera-based educational behavior analysis monitoring equipment and a manufacturing method thereof. The semiconductor sensor device is provided with the flexible circuit board with the curved surface part, and the functional chip and the sensor chip are electrically connected by utilizing the flexible circuit board, so that the welding height of a plurality of welding balls can be ensured. The concave surface part of the flexible circuit board is formed conformally by adopting the resin material, the method is simple, and the resin material is used as a supporting material to ensure the influence on the functional chip during welding. The camera and the monitoring equipment obtained by the method have the advantages of strong reliability, wide monitoring view angle and convenience in control.
Description
Technical Field
The invention relates to the field of semiconductor chip packaging, in particular to an image sensor device, a camera based on the image sensor, educational behavior analysis monitoring equipment based on the camera and a manufacturing method thereof.
Background
In the present educational activity, a monitoring device is needed to supervise the learning behavior of a student, which is mainly performed based on the monitoring behavior of a camera. And the basic component of the camera is an image sensing assembly, namely, the image sensor device of the application, and the stability and the visual angle of the image sensor device directly influence the monitoring reliability. The image sensor device can be miniaturized, made multifunctional, and made low in cost, but its heat generation efficiency and light transmission quality are greatly limited as the degree of integration is increased. In the conventional image sensor device, the optoelectronic chip and the control chip, the memory chip, the conversion chip, etc. are often integrated on the same PCB, and then are electrically connected to a package substrate, such as a motherboard, in a unified manner. However, in order to sense light from a wide angle, the photosensor chip needs to be formed to have a concave light sensing surface, and when the photosensor chip is disposed on the control chip, the memory chip, the conversion chip, or the PCB, the solder balls to be soldered thereto need to be disposed at different heights, which is disadvantageous to the reliability of electrical connection.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method of manufacturing an image sensor device, including the steps of:
(1) providing a packaging substrate, and fixing a first chip on the packaging substrate;
(2) dot coating a resin material on the first chip;
(3) bonding a flexible circuit board on the first chip, wherein the flexible circuit board comprises a planar part, a first connecting end and a second connecting end which are opposite, and a first bending part and a second bending part which are opposite, the resin material, the first connecting end and the second connecting end are positioned below the planar part, and the first connecting end and the second connecting end are connected to the planar part through the first bending part and the second bending part respectively;
(4) pressing the planar part of the flexible circuit board by using the back surface of the die chip, wherein the back surface of the die chip is provided with a first curved surface protruding downwards, the first curved surface is conformal with the planar part, so that the planar part is changed into a concave part, and curing the resin material;
(5) and providing a sensor chip, wherein the lower surface of the sensor chip is a second curved surface with the same curvature radius as the first curved surface, and the sensor chip is welded on the concave part by utilizing a plurality of welding balls.
According to an embodiment of the present invention, in step (5), the method further includes electrically connecting the first chip to the package substrate by using a bonding wire.
According to the embodiment of the invention, the method further comprises the step (6): and forming a sealing body on the packaging substrate, wherein the sealing body wraps the first chip, the flexible circuit board and the sensor chip and exposes the upper surface of the sensor chip.
According to an embodiment of the present invention, the upper surface of the sensor chip is also a curved surface and has the same curvature radius as the first curved surface.
The present invention also provides an image sensor device formed by the method for manufacturing an image sensor device, which specifically includes:
a package substrate;
the first chip is fixed on the packaging substrate;
a resin material disposed over the first chip;
a flexible circuit board bonded to the first chip, the flexible circuit board including a concave portion, first and second opposite connection ends, and first and second opposite curved portions, wherein the resin material, the first and second connection ends are located below the concave portion, and the first and second connection ends are connected to the curved portion through the first and second curved portions, respectively;
and the sensor chip is welded on the concave part through a plurality of solder balls, the lower surface of the sensor chip is a second curved surface protruding downwards, and the curvature radius of the second curved surface is the same as that of the concave part.
According to an embodiment of the present invention, the package substrate further includes a bonding wire electrically connecting the first chip to the package substrate.
According to the embodiment of the invention, the packaging substrate further comprises a sealing body which is formed on the packaging substrate, wraps the first chip, the flexible circuit board and the sensor chip and exposes the upper surface of the sensor chip.
According to an embodiment of the present invention, the upper surface of the sensor chip is also a curved surface and has the same curvature radius as the first curved surface.
The invention also provides a camera which comprises the image sensor and the lens structure.
Further, the present invention provides an educational behavior analysis monitoring apparatus, comprising:
the camera head;
the camera control unit is used for controlling the angular swing of the camera;
the image data acquisition unit is used for acquiring image signals transmitted by the camera;
an image data processing unit for analyzing and processing the image signal;
and the display unit is used for displaying the image signal.
The invention has the following advantages:
the image sensor device is provided with the flexible circuit board with the curved surface part, and the functional chip and the sensor chip are electrically connected by utilizing the flexible circuit board, so that the welding height of a plurality of welding balls can be ensured. The concave surface part of the flexible circuit board is formed conformally by adopting the resin material, the method is simple, and the resin material is used as a supporting material to ensure the influence on the functional chip during welding.
The camera and the monitoring equipment obtained by the method have the advantages of strong reliability, wide monitoring view angle and convenience in control.
Drawings
Fig. 1-7 are schematic views of a manufacturing process of an image sensor device/camera head according to a first embodiment;
fig. 8-12 are schematic diagrams of a manufacturing process of the image sensor device/camera of the second embodiment.
Detailed Description
The present technology will be described with reference to the drawings in the embodiments, and relates to an image sensor device in which an aluminum substrate is selected as a mother substrate structure, a porous alumina layer is formed by anodic oxidation to absorb light and dissipate heat, and a metal reflective layer with poor thermal conductivity is plated on the side surface of a through hole to improve the accuracy of light transmission.
It will be understood that the present technology may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the technology to those skilled in the art. Indeed, the technology is intended to cover alternatives, modifications and equivalents of these embodiments, which are included within the scope and spirit of the technology as defined by the appended claims. Furthermore, in the following detailed description of the present technology, numerous specific details are set forth in order to provide a thorough understanding of the present technology. It will be apparent, however, to one skilled in the art that the present technology may be practiced without these specific details.
The terms "top" and "bottom," upper "and" lower, "and" vertical "and" horizontal, "and their various forms, as used herein, are for purposes of illustration and description only and are not intended to limit the description of the technology, as the referenced items may be interchanged in position and orientation. Also, as used herein, the terms "substantially" and/or "about" mean that the specified dimensions or parameters may vary within acceptable manufacturing tolerances for a given application.
First embodiment
A method of manufacturing an image sensor device of the first embodiment and a corresponding device structure thereof will be described in detail below with reference to fig. 1 to 7 of the present application.
Referring first to fig. 1, the image sensor device of the present embodiment needs to be integrated on a package substrate 10, and the package substrate 10 may be a PCB, a DBC board, or a co-fired ceramic substrate. The package substrate 10 has a wiring layer (not shown) thereon, which may be in the shape of a plate-like rectangle, polygon, circle, or the like. The package substrate 10 is a large-area substrate, and may integrate other chips in addition to the functional chip 11 and the sensor chip 19.
A first chip 11 is fixed on the package substrate 10 by an adhesive layer (not shown), and the first chip 11 is a functional chip, such as a control chip, a memory chip, a conversion chip, and the like. The upper surface of the first chip 11 has a plurality of pads.
A resin material 12 is dot-coated at an intermediate position of the first chip 11, the resin material 12 not covering any pad. The resin material 12 may be a heat curable epoxy material that is a liquid material when dispensed.
A flexible circuit board 13 is bonded to the first chip 11, the flexible circuit board 13 includes a planar portion 14, opposite first and second connection ends 17 and 18, and opposite first and second bent portions 16 and 15, and the first and second connection ends 17 and 18 are connected to the planar portion 14 through the first and second bent portions 16 and 15, respectively.
Wherein the first connection terminal 17 is electrically connected to one side of the center line of the first chip 11, and the second connection terminal 18 is electrically connected to the other side of the center line of the first chip 11. And, the resin material 12, the first connection end 17 and the second connection end 18 are located below the planar portion 14. Thereby, the planar portion 14 is brought into contact with the resin material 12.
Referring next to fig. 2, the planar portion 14 of the flexible circuit board 13 is pressed with the back surface of the die chip 19, the back surface of the die chip 19 has a first curved surface 21 protruding downward, the first curved surface 21 conforms to the planar portion 14, so that the planar portion 14 becomes a concave portion 22, and the resin material 12 is cured.
In order to make the structure of the die chip 19 completely consistent with that of the sensor chip, the material of the die chip 19 may be silicon, and it may also have a recessed top surface 20, and the top surface 20 is also a curved surface structure. After the pressing, the top surface of the resin material 12 directly engages the curved surface portion 22 and enables the resin material 12 to fully support the subsequent solder balls 25.
Referring to fig. 3, the die chip 19 is removed and the first chip 11 is electrically connected to the package substrate 10 by bonding wires 23. The bonding wire 23 may be a bonding wire such as a copper wire or an aluminum wire.
Then, referring to fig. 4, a sensor chip 24 is provided, a lower surface of the sensor chip 24 is a second curved surface having the same curvature radius as the first curved surface 21, and the sensor chip 24 is soldered to the concave portion 22 by a plurality of solder balls 25. The sensor chip 24 is a photoelectric sensor chip, and the upper surface thereof is also a curved surface and has the same curvature radius as the first curved surface.
At the time of soldering, the plurality of solder balls 25 may be reflowed through the resin material 12 to ensure that the first chip 11 is not affected by heat. At this time, the radius of curvature of the concave portion 22 is identical to the radius of curvature of the second curved surface of the sensor chip 24, so that the solder balls 25 can be secured at substantially the same height or even at exactly the same height, and the bonding can be performed simultaneously under the same pressure at the time of bonding.
Referring to fig. 5, a sealing body 26 is formed on the package substrate 10, and the sealing body 26 wraps the first chip 11, the flexible circuit board 13 and the sensor chip 24 and exposes an upper surface of the sensor chip 24. Thus, the image sensor device of the first embodiment is formed.
Further, in order to obtain a camera structure, referring to fig. 6, a lens structure is mounted on the package substrate 10, the lens structure includes a support 27, the support 27 has a clamping portion 28, the clamping portion 28 has a clamping opening therein, and the clamping opening has a lens 30 clamped therein and supported by a support base 29.
The image sensor device is provided with the flexible circuit board with the curved surface part, and the functional chip and the sensor chip are electrically connected by utilizing the flexible circuit board, so that the welding height of a plurality of welding balls can be ensured. The concave surface part of the flexible circuit board is formed conformally by adopting the resin material, the method is simple, and the resin material is used as a supporting material to ensure the influence on the functional chip during welding.
The present invention also provides an image sensor device formed by the method for manufacturing an image sensor device, which specifically includes: a package substrate 10; a first chip 11 fixed to the package substrate 10; a resin material 12 provided over the first chip 11; a flexible circuit board 13 bonded to the first chip 11, the flexible circuit board 13 including a concave portion 22, first and second opposite connection terminals 17 and 18, and first and second opposite bent portions 16 and 15, wherein the resin material 12, the first and second connection terminals 17 and 18 are located below the concave portion 22, and the first and second connection terminals 17 and 18 are connected to the curved portion 22 through the first and second bent portions 16 and 15, respectively;
and a sensor chip 24, wherein the sensor chip 24 is soldered to the concave portion 22 by a plurality of solder balls 25, the lower surface of the sensor chip 24 is a second curved surface protruding downward, and the second curved surface has the same radius of curvature as the concave portion 22.
A bonding wire 23 electrically connecting the first chip 11 to the package substrate 10; and a sealing body 26 formed on the package substrate 10, wherein the sealing body 26 wraps the first chip 11, the flexible circuit board 13 and the sensor chip 24 and exposes the upper surface of the sensor chip 24.
The camera also comprises the lens structure, and the details are not repeated.
Education behavior analysis supervisory equipment based on this camera, it includes:
the camera head;
the camera control unit is used for controlling the angular swing of the camera;
the image data acquisition unit is used for acquiring image signals transmitted by the camera;
an image data processing unit for analyzing and processing the image signal;
and the display unit is used for displaying the image signal.
Second embodiment
A method of manufacturing an image sensor device of the second embodiment and a device structure thereof will be described in detail below with reference to fig. 8 to 12 of the present application.
Referring first to fig. 8, a first chip 11 is fixed on a package substrate 10 by an adhesive layer (not shown), and the first chip 11 is a functional chip, such as a control chip, a memory chip, a conversion chip, and the like. The upper surface of the first chip 11 has a plurality of pads.
A flexible circuit board 40 is bonded on the package substrate 10, the flexible circuit board 40 including a planar portion 43, first and second opposite connection ends 41 and 42, and first and second opposite bent portions 44 and 45, the first and second connection ends 41 and 42 being connected to the planar portion 43 through the first and second bent portions 44 and 45, respectively.
The first connection terminal 41 is electrically connected to the first chip 11, and the second connection terminal 42 is electrically connected to the package substrate 10. And, the first connection end 41 and the second connection end 42 are located below the plane portion 43.
A resin material 46 is filled below the planar portion 43, whereby the planar portion 14 is brought into contact with the resin material 46. Referring to fig. 8, the resin material 46 also extends to the side surface of the first chip 11 and the upper surface of the package substrate 10.
Referring next to fig. 9, the planar portion 14 of the flexible circuit board 13 is pressed with the back surface of the die chip 19, the back surface of the die chip 19 has a first curved surface 21 protruding downward, the first curved surface 21 conforms to the planar portion 43, such that a portion of the planar portion 43 becomes a concave portion 47, and the resin material 46 is cured. The concave portion 43 is located directly above the first chip 11.
In order to make the structure of the die chip 19 completely consistent with that of the sensor chip, the material of the die chip 19 may be silicon, and it may also have a recessed top surface 20, and the top surface 20 is also a curved surface structure. After pressing, the top surface of the resin material 46 directly engages the curved surface portion 43 and enables the resin material 46 to fully support the subsequent plurality of solder balls 25.
Referring to fig. 10, the mold chip 19 is removed such that the concave portion 43 is exposed.
Then, referring to fig. 11, a sensor chip 24 is provided, a lower surface of the sensor chip 24 is a second curved surface having the same curvature radius as the first curved surface 21, and the sensor chip 24 is soldered to the concave portion 43 by a plurality of solder balls 25. The sensor chip 24 is a photoelectric sensor chip, and the upper surface thereof is also a curved surface and has the same curvature radius as the first curved surface.
At the time of soldering, the plurality of solder balls 25 may be reflowed through the resin material 12 to ensure that the first chip 11 is not affected by heat. At this time, the radius of curvature of the concave portion 43 is matched with the radius of curvature of the second curved surface of the sensor chip 24, so that the plurality of solder balls 25 can be secured at substantially the same or even exactly the same height, and the simultaneous bonding can be performed under the same pressure at the time of bonding.
Referring to fig. 12, a sealing body 48 is formed on the package substrate 10, and the sealing body 48 covers the first chip 11, the flexible circuit board 40 and the sensor chip 24 and exposes the upper surface of the sensor chip 24.
Finally, as in the first embodiment, a lens structure may be mounted on the package substrate 10 to obtain a camera structure, which is also the same as in the first embodiment.
In this embodiment, no wire bonding connections are used and electrical interconnections between the sensor chip 24, the first chip 11 and the package substrate 10 are made using the flexible circuit board 40, saving process steps.
The camera also comprises the lens structure, and the details are not repeated.
Education behavior analysis supervisory equipment based on this camera, it includes:
the camera head;
the camera control unit is used for controlling the angular swing of the camera;
the image data acquisition unit is used for acquiring image signals transmitted by the camera;
an image data processing unit for analyzing and processing the image signal;
and the display unit is used for displaying the image signal. A
The camera and the monitoring equipment obtained by the method have the advantages of strong reliability, wide monitoring view angle and convenience in control.
The foregoing detailed description of the technology has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the technology to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The described embodiments were chosen in order to best explain the principles of the technology and its practical application to thereby enable others skilled in the art to best utilize the technology in various embodiments and with various modifications as are suited to the particular use contemplated. The scope of the present technology is defined by the appended claims.
The expressions "exemplary embodiment," "example," and the like, as used herein, do not refer to the same embodiment, but are provided to emphasize different particular features. However, the above examples and exemplary embodiments do not preclude their implementation in combination with features of other examples. For example, even in a case where a description of a specific example is not provided in another example, unless otherwise stated or contrary to the description in the other example, the description may be understood as an explanation relating to the other example.
The terminology used in the present invention is for the purpose of illustrating examples only and is not intended to be limiting of the invention. Unless the context clearly dictates otherwise, singular expressions include plural expressions.
While example embodiments have been shown and described, it will be apparent to those skilled in the art that modifications and changes may be made without departing from the scope of the invention as defined by the claims.
Claims (10)
1. A method of manufacturing an image sensor device, comprising:
(1) providing a packaging substrate, and fixing a first chip on the packaging substrate;
(2) dot coating a resin material on the first chip;
(3) bonding a flexible circuit board on the first chip, wherein the flexible circuit board comprises a planar part, a first connecting end and a second connecting end which are opposite, and a first bending part and a second bending part which are opposite, the resin material, the first connecting end and the second connecting end are positioned below the planar part, and the first connecting end and the second connecting end are connected to the planar part through the first bending part and the second bending part respectively;
(4) pressing the planar part of the flexible circuit board by using the back surface of the die chip, wherein the back surface of the die chip is provided with a first curved surface protruding downwards, the first curved surface is conformal with the planar part, so that the planar part is changed into a concave part, and curing the resin material;
(5) and providing a sensor chip, wherein the lower surface of the sensor chip is a second curved surface with the same curvature radius as the first curved surface, and the sensor chip is welded on the concave part by utilizing a plurality of welding balls.
2. The method of manufacturing an image sensor device according to claim 1, wherein: in step (5), the method further includes electrically connecting the first chip to the package substrate by using a bonding wire.
3. The method of manufacturing an image sensor device according to claim 2, wherein: further comprising the step (6): and forming a sealing body on the packaging substrate, wherein the sealing body wraps the first chip, the flexible circuit board and the sensor chip and exposes the upper surface of the sensor chip.
4. The method of manufacturing an image sensor device according to claim 1, wherein: the upper surface of the sensor chip is also a curved surface and has the same curvature radius as the first curved surface.
5. An image sensor device formed by the method of manufacturing an image sensor device according to any one of claims 1 to 4, comprising:
a package substrate;
the first chip is fixed on the packaging substrate;
a resin material disposed over the first chip;
a flexible circuit board bonded to the first chip, the flexible circuit board including a concave portion, first and second opposite connection ends, and first and second opposite curved portions, wherein the resin material, the first and second connection ends are located below the concave portion, and the first and second connection ends are connected to the curved portion through the first and second curved portions, respectively;
and the sensor chip is welded on the concave part through a plurality of solder balls, the lower surface of the sensor chip is a second curved surface protruding downwards, and the curvature radius of the second curved surface is the same as that of the concave part.
6. The image sensor device of claim 5, wherein: also included is a wire bond electrically connecting the first chip to the package substrate.
7. The image sensor device of claim 5, wherein: the packaging substrate is provided with a first chip, a flexible circuit board and a sensor chip, and the first chip, the flexible circuit board and the sensor chip are packaged on the packaging substrate through the sealing body, and the upper surface of the sensor chip is exposed.
8. The image sensor device of claim 5, wherein: the upper surface of the sensor chip is also a curved surface and has the same curvature radius as the first curved surface.
9. A camera comprising the image sensor of any of claims 5-8 and a lens structure.
10. An educational behavior analysis monitoring apparatus, comprising:
the camera of claim 9;
the camera control unit is used for controlling the angular swing of the camera;
the image data acquisition unit is used for acquiring image signals transmitted by the camera;
an image data processing unit for analyzing and processing the image signal;
and the display unit is used for displaying the image signal.
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| CN202011379485.1A CN112532942B (en) | 2020-11-30 | 2020-11-30 | Image sensor device, manufacturing method thereof, camera and educational behavior analysis monitoring equipment |
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| CN202011379485.1A CN112532942B (en) | 2020-11-30 | 2020-11-30 | Image sensor device, manufacturing method thereof, camera and educational behavior analysis monitoring equipment |
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